Engraving machine control method, engraving machine, computer equipment, storage medium and program product

Abstract

The invention discloses a carving machine control method, a carving machine, computer equipment, a storage medium and a program product. The method comprises the steps that a machine head assembly is controlled to move to the position above a probe device, and the probe device is clamped from a probe base; the machine head assembly is controlled to carry a probe device to detect a to-be-machined material so as to obtain material data, and the to-be-machined material is fixed to the workbench assembly; the machine head assembly is controlled to carry the probe device to move to the probe base, and the probe device is released; the machine head assembly is controlled to move to the position above the tool and clamp the tool from the tool base; and controlling the cutter to engrave the to-be-processed material at least according to the material data and the cutter path file. The probe device and the cutter are arranged on the working platform assembly in advance, automatic acquisition of material data, cutter length compensation and automatic replacement of the cutter are achieved through automatic control over the machine head assembly and the probe device, manual operation of a user is not needed in the whole process, and the engraving machining efficiency is improved.

Description

Technical Field

[0001] The present application relates to the technical field of engraving machines, and in particular to an engraving machine control method, an engraving machine, a computer device, a storage medium and a program product. Background Art

[0002] The engraving machine in the prior art requires a probe device to detect the material to be processed to obtain detection data before processing the material. Then the user needs to manually remove the probe device and install the required tool to engrave the material to be processed. This process requires manual operation, has a low degree of automation, and reduces engraving efficiency. Summary of the invention

[0003] The embodiments of the present application provide an engraving machine control method, an engraving machine, a computer device, a storage medium and a program product, which are used to solve at least one of the above-mentioned technical problems.

[0004] In a first aspect, an embodiment of the present application provides a method for controlling an engraving machine, wherein the engraving machine comprises a head assembly and a worktable assembly, wherein the head assembly can move in a vertical direction and a lateral direction, and the worktable assembly can move in a front-to-back direction, wherein the vertical direction, the lateral direction, and the front-to-back direction are perpendicular to each other, and a probe device and a tool are arranged on the worktable assembly; the method comprises: Control the head assembly to move above the probe device and clamp the probe device from the probe base; Controlling the head assembly to carry the probe device to detect the material to be processed to obtain material data, wherein the material to be processed is fixed on the workbench assembly; Controlling the head assembly to carry the probe device to move to the probe base, and placing the probe device therein; Control the head assembly to move above the tool and clamp the tool from the tool base; At least according to the material data and the tool path file, the tool is controlled to engrave the material to be processed.

[0005] In some embodiments, a tool setting device is further provided on the workbench assembly, and the method further comprises: Controlling the head assembly to carry the probe device to move vertically downward from a first preset height until the probe device triggers the tool setting device and recording a first vertical moving distance; Controlling the machine head assembly to carry the tool and move vertically downward from the first preset height until the tool triggers the tool setting device, and recording a second vertical movement distance; The material data is compensated according to the first vertical moving distance and the second vertical moving distance, so as to be used for controlling the tool to engrave the material to be processed in combination with the tool path file.

[0006] In some embodiments, the Z-axis coordinate transformation relationship is determined: Z m = Z L - Z w ;in, Z m For the current Z Axis mechanical coordinates; Z L When the probe device detects the highest point on the surface of the material to be processed and is triggered Z Mechanical coordinates of the axis; Z w For the current Z Axis working coordinates.

[0007] In some embodiments, the compensating process for the material data according to the first vertical moving distance and the second vertical moving distance includes using the following formula to perform tool length compensation: Z m = Z L - Z w - Z OFFSET ;in, Z OFFSET is the difference between the first vertical moving distance and the second vertical moving distance.

[0008] In some embodiments, the material to be processed is fixed on the workbench assembly by an L-shaped positioning substrate, and the method further includes: Determine the inner corner point of the L-shaped positioning substrate as the L-shaped positioning substrate zero point, and determine a first relative position relationship between the L-shaped positioning substrate zero point and a preset mechanical coordinate zero point of the workbench assembly; Acquire work coordinate zero point configuration data input by a user, wherein the work coordinate zero point configuration data includes a second relative position relationship between the work coordinate zero point and the L-shaped positioning substrate zero point; An XY plane coordinate conversion relationship between working coordinates and mechanical coordinates is determined according to the first relative position relationship and the second relative position relationship.

[0009] In some embodiments, controlling the tool to engrave the material to be processed in combination with the tool path file includes: Acquire the current working coordinates according to the tool path file; Determine the current mechanical coordinates according to the current working coordinates and the XY plane coordinate conversion relationship; The machine head assembly is controlled to carry the tool to move to the current mechanical coordinates to engrave the material to be processed.

[0010] In some embodiments, the first relative position relationship includes: the distance between the zero point of the L-shaped positioning substrate and the zero point of the mechanical coordinate in the X-axis direction, and the distance between the zero point of the L-shaped positioning substrate and the zero point of the mechanical coordinate in the Y-axis direction; The second relative position relationship includes: the distance between the working coordinate zero point and the L-shaped positioning substrate zero point in the X-axis direction, and the distance between the working coordinate zero point and the L-shaped positioning substrate zero point in the Y-axis direction.

[0011] In some embodiments, the XY plane coordinate conversion relationship is expressed as the following formula: X m = X L - X w - X offset ; Y m = Y L - Y w - Y offset ;in, X L is the distance between the zero point of the L-shaped positioning substrate and the zero point of the mechanical coordinate in the X-axis direction; Y L is the distance between the zero point of the L-shaped positioning substrate and the zero point of the mechanical coordinate in the Y-axis direction; X offset is the distance between the working coordinate zero point and the L-shaped positioning substrate zero point in the X-axis direction; Y offset is the distance between the working coordinate zero point and the L-shaped positioning substrate zero point in the Y-axis direction; ( X w , Y w ) is the current working coordinate; ( X m , Y m ) is the current mechanical coordinate.

[0012] In some embodiments, the method further includes pre-storing the mechanical coordinates of the probe device and the tool for controlling the head assembly to move to the probe device or the tool.

[0013] In a second aspect, an embodiment of the present application provides a computer device, comprising a memory, a processor, and a computer program stored in the memory, characterized in that the processor executes the computer program to implement the steps of the engraving machine control method described in any embodiment of the present application.

[0014] In a third aspect, an embodiment of the present application provides an engraving machine, characterized in that it includes: The computer device described in any embodiment of the present application; A head assembly, the head assembly being movable in vertical and lateral directions; A workbench assembly is movable in the front-rear direction; the vertical direction, the lateral direction and the front-rear direction are perpendicular to each other, and a probe device and a tool are arranged on the workbench assembly.

[0015] In some embodiments, a tool setting device is also provided on the workbench assembly.

[0016] In a fourth aspect, an embodiment of the present application provides a computer-readable storage medium having a computer program / instruction stored thereon, wherein the computer program / instruction, when executed by a processor, implements the steps of the engraving machine control method described in any embodiment of the present application.

[0017] In a fifth aspect, an embodiment of the present application provides a computer program product, including a computer program / instruction, characterized in that when the computer program / instruction is executed by a processor, the steps of the engraving machine control method described in any embodiment of the present application are implemented.

[0018] The engraving machine control method of the embodiment of the present application pre-sets a probe device and a tool on the work platform assembly, and realizes automatic replacement of the probe device and the tool through automatic control of the head assembly. The entire process does not require manual operation by the user, thereby improving the efficiency of the engraving process. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0020] Figure 1 A flowchart of an embodiment of the engraving machine control method of the present application; Figure 2 A flowchart of another embodiment of the engraving machine control method of the present application; Figure 3 This is a schematic diagram of using an L-shaped positioning substrate to fix the material to be processed in this application; Figure 4 Schematic diagram of the internal structure of the tool setting device in this application; Figure 5a This is a schematic diagram of the internal structure of the tool setting device in this application (the black part is a schematic diagram of the upper barrel); Figure 5b This is a schematic diagram of the internal structure of the tool setting device in this application (the black part is a schematic diagram of the upper barrel); Figure 5c Schematic diagram of the internal structure of the tool setting device in this application (the black part is a schematic diagram of the sliding probe); Figure 5d Schematic diagram of the internal structure of the tool setting device in this application (the black part is a schematic diagram of the fixed contact); Figure 6a is a schematic diagram of the structure of the probe device in this application; Figure 6b A schematic structural diagram of the probe device in the present application from another perspective; Figure 7a A schematic diagram of the structure of the probe assembly in the present application; Figure 7b A schematic structural diagram of the probe assembly in the present application from another perspective; Figure 8 is a cross-sectional view of the probe device in the present application; Figure 9 A schematic diagram of the structure of the CNC machining equipment in this application; Figure 10 A schematic diagram of the structure of a computer device according to an embodiment of the present application. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application. It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict.

[0022] It should also be noted that, in this article, the terms "include" and "comprise" include not only those elements, but also other elements not explicitly listed, or elements inherent to such processes, methods, articles or equipment. In the absence of further restrictions, the elements defined by the sentence "include..." do not exclude the existence of other identical elements in the process, method, article or equipment that includes the elements.

[0023] The present application provides an engraving machine control method for an engraving machine control device, which can be integrated inside the engraving machine or configured outside the engraving machine, and the present application does not limit this. Among them, the engraving machine includes an engraving machine housing, a head assembly and a workbench assembly, the head assembly can move in the vertical direction and the lateral direction, the workbench assembly can move in the front-to-back direction, the vertical direction, the lateral direction and the front-to-back direction are perpendicular to each other, and the workbench assembly is provided with a probe device and a tool. The head assembly is used to install a probe device to detect the material to be processed; the head assembly can also be used to install a tool to perform engraving processing on the material to be processed. Among them, the tool can be a flat-bottomed tool, a ball-end tool, a tapered flat-bottomed tool, a tapered ball-end tool, a large-head tool, a drilling tool, a laser tool, etc. It should be noted that the above tools are only examples, and the present application does not limit the specific type of the tool. The above tools can be placed on a tool holder, and the tool holder is arranged on the workbench assembly. In addition, the laser tool can also be pre-integrated on the head assembly. Exemplarily, the laser tool includes, for example, a 2.5W semiconductor laser module.

[0024] like Figure 1 As shown, an embodiment of the present application provides an engraving machine control method for an engraving machine control device, the method comprising: S10, controlling the head assembly to move above the probe device and clamping the probe device from the probe base.

[0025] Exemplarily, the position information of the probe device on the workbench is pre-stored in the engraving machine control device. For example, the coordinate information (e.g., mechanical coordinates) of the probe device on the workbench is pre-stored, so that under the control of the engraving machine control device, the head assembly moves to the probe device to automatically clamp the probe device. In some embodiments, the engraving machine control device can simultaneously control the movement of the head assembly and the workbench assembly, so that the head assembly quickly reaches the probe device to grasp the probe device.

[0026] S20, controlling the head assembly to carry the probe device to detect the material to be processed to obtain material data, wherein the material to be processed is fixed on the workbench assembly, wherein the material data includes the X, Y, Z work coordinate origin data of the material, and the outer contour data of the material.

[0027] Exemplarily, the material to be processed is detected by a probe device to obtain the X, Y, Z work origin data and outer contour data of the material, so as to be used for engraving the material to be processed.

[0028] S30, controlling the head assembly to carry the probe device to move to the probe base, and placing the probe device in the probe base.

[0029] Exemplarily, the position information of the probe device on the workbench is pre-stored in the engraving machine control device. For example, the coordinate information (e.g., mechanical coordinates) of the probe device on the workbench is pre-stored, so that under the control of the engraving machine control device, the head assembly moves to the probe base and releases the probe device.

[0030] S40, controlling the head assembly to move above the tool and clamping the tool from the tool base. Exemplarily, the position information of the tool on the workbench is pre-stored in the engraving machine control device. For example, the coordinate information of the tool on the workbench is pre-stored, so that under the control of the engraving machine control device, the head assembly moves to the tool to automatically clamp the tool. In some embodiments, the engraving machine control device can simultaneously control the movement of the head assembly and the workbench assembly, so that the head assembly quickly reaches the tool to grasp the tool.

[0031] S50, controlling the tool to engrave the material to be processed at least according to the material data and the tool path file. The tool path file is pre-stored in the engraving machine control device. And multiple tool path files can be stored for engraving different products.

[0032] The engraving machine control method of the embodiment of the present application pre-sets a probe device and a tool on the work platform assembly, and realizes automatic replacement of the probe device and the tool through automatic control of the head assembly. The entire process does not require manual operation by the user, thereby improving the efficiency of the engraving process.

[0033] In some embodiments, there may be multiple tools, and the tool base is a tool holder that can hold multiple tools, and each tool can be numbered T0, T1, T2...Tx in sequence. When the user performs engraving, the tool number of the tool used will be set in the tool path file, and the engraving machine control device selects the corresponding tool according to the number in the tool path file.

[0034] The tool holder is fixed on the workbench of the engraving machine, so each tool has a corresponding mechanical coordinate. The engraving machine control device finds the mechanical coordinate of the corresponding tool according to the tool number selected in the user's tool path file, and then controls the tool changing spindle (that is, the machine head assembly) to move to the corresponding mechanical coordinate to accurately clamp the target tool.

[0035] In some embodiments, due to the difference in length between the probe device and the tool, if the tool is replaced and the material to be processed is directly engraved after the probe device has completed the detection, engraving errors will occur. In addition, the same problem will occur when switching between tools of different lengths. For this reason, the inventor has tried to pre-store the length of the probe device and the tool in the engraving machine control device or directly store the length difference between the tool and the probe device, so as to compensate the tool path data in the Z-axis direction according to the length difference after switching the tool, so as to avoid processing errors caused by the length difference.

[0036] However, the inventor discovered in the process of implementing the present application that when automatically clamping a tool or a probe device, the clamping device at the lower end of the machine head assembly clamps the clamping handle at the upper end of the tool or the probe device. However, during the clamping process, the clamping handle may not be inserted into the clamping device properly, thereby introducing new errors. To solve this problem, the inventor proposed the following improvement plan based on the above-mentioned embodiment: like Figure 2 The figure shows a flow chart of another embodiment of the engraving machine control method of the present application. In this embodiment, a tool setting device is also provided on the workbench assembly. The engraving machine control method further includes: S60, controlling the head assembly carrying the probe device to move vertically downward from a first preset height to record a first vertical movement distance when the probe device triggers the tool setting device; wherein the first preset height may be the highest point of the head assembly on the Z axis.

[0037] S70, controlling the machine head assembly to carry the tool and move vertically downward from the first preset height until the tool triggers the tool setting device, and recording a second vertical movement distance.

[0038] S80, compensating the material data according to the first vertical moving distance and the second vertical moving distance, so as to control the tool to engrave the material to be processed in combination with the tool path file. Exemplarily, the difference between the first vertical moving distance and the second vertical moving distance is determined as a compensation value, and the compensation value is used to compensate the material data (for example, the compensation value is used to compensate the Z-axis coordinate origin data in the material data).

[0039] In this embodiment, a tool setter is provided on the workbench assembly. Each time the tool is changed (the probe device is changed to the tool or one tool is changed to another tool), the tool setter is used as a reference, and the vertical movement distance is recorded based on the triggering of the tool setter. A relative difference is calculated based on the two vertical movement distances before and after the tool change (for example, the first vertical movement distance and the second vertical movement distance) for compensating the material data, thereby avoiding engraving errors caused by improper installation of the tool head assembly when clamping the probe device or the tool.

[0040] like Figure 3 The schematic diagram of the L-shaped positioning substrate used in this application to fix the material to be processed is shown. The L-shaped positioning substrate is provided with a pin positioning hole, and the corresponding engraving machine workbench is also provided with a pin positioning hole, and the two are fixedly installed with screws. The anchor point coordinates of the L-shaped positioning substrate (that is, the coordinates of the inner corner points of the L-shaped positioning substrate) are preset in the engraving machine control device. During use, the material to be processed only needs to be clamped against the L-shaped positioning substrate, and the engraving machine control device automatically converts and determines the working coordinate zero point of the X-axis and Y-axis. The advantages of this method are easy use and precise positioning, and can meet the conventional industrial positioning accuracy requirements.

[0041] In some embodiments, the material to be processed is fixed on the workbench assembly by an L-shaped positioning substrate, and the method further includes: The inner corner point of the L-shaped positioning substrate is determined as the L-shaped positioning substrate zero point, and the first relative position relationship between the L-shaped positioning substrate zero point and the preset mechanical coordinate zero point of the workbench assembly is determined; the mechanical coordinate zero point is the mechanical coordinate zero point in the XY plane.

[0042] Acquire work coordinate zero point configuration data input by a user, wherein the work coordinate zero point configuration data includes a second relative position relationship between the work coordinate zero point and the L-shaped positioning substrate zero point; An XY plane coordinate conversion relationship between working coordinates and mechanical coordinates is determined according to the first relative position relationship and the second relative position relationship.

[0043] In some embodiments, controlling the tool to engrave the material to be processed in combination with the tool path file includes: Acquire the current working coordinates according to the tool path file; Determine the current mechanical coordinates according to the current working coordinates and the XY plane coordinate conversion relationship; The machine head assembly is controlled to carry the tool to move to the current mechanical coordinates to engrave the material to be processed.

[0044] In some embodiments, the first relative position relationship includes: the distance between the zero point of the L-shaped positioning substrate and the mechanical coordinate zero point in the X-axis direction, and the distance between the zero point of the L-shaped positioning substrate and the mechanical coordinate zero point in the Y-axis direction; The second relative position relationship includes: the distance between the working coordinate zero point and the zero point of the L-shaped positioning substrate in the X-axis direction, and the distance between the working coordinate zero point and the zero point of the L-shaped positioning substrate in the Y-axis direction.

[0045] In some embodiments, the XY plane coordinate conversion relationship is expressed by the following formula: X m = X L - X w - X offset ; Y m = Y L - Y w - Y offset ; where, X L is the distance between the zero point of the L-shaped positioning substrate and the mechanical coordinate zero point in the X-axis direction; Y L is the distance between the zero point of the L-shaped positioning substrate and the mechanical coordinate zero point in the Y-axis direction; X offset is the distance between the working coordinate zero point and the zero point of the L-shaped positioning substrate in the X-axis direction; Y offset is the distance between the working coordinate zero point and the zero point of the L-shaped positioning substrate in the Y-axis direction; ( X w , Y w ) is the current working coordinate; ( X m , Y m ) is the current mechanical coordinate.

[0046] As shown Figure 3 the L-shaped positioning substrate is connected to the engraving machine workbench through pins, X L is the distance between the zero point of the L-shaped positioning substrate and the mechanical coordinate zero point in the X-axis direction, Y Lis the distance between the zero point of the L-shaped positioning substrate and the zero point of the mechanical coordinate in the Y-axis direction, X L and Y L The data is measured and calibrated before the machine leaves the factory and saved in the engraving machine control device.

[0047] X offset The distance between the user-set work coordinate zero point and the L-shaped positioning substrate zero point in the X-axis direction. Y offset The distance between the user-set work coordinate zero point and the L-shaped positioning substrate zero point in the Y-axis direction. X offset and Y offset It can be set by the user on the interface of the engraving machine control device.

[0048] Assume Xm and Ym are the current mechanical coordinates (i.e., the coordinates of the current working coordinate point in the mechanical coordinate system), Xw and Yw are the current working coordinates (i.e., the coordinates of the current working coordinate point in the working coordinate system, relative to the working coordinate zero point), then the calculation formula for the working coordinates is: Formula 1 By performing an equivalent transformation on Formula 1, the calculation method of the current mechanical coordinates can be obtained, as shown in Formula 2.

[0049] Formula 2 X w is equal to 0 and Y w The position equal to 0 is the working coordinate origin on the XY plane. The engraving machine control device calculates the mechanical coordinate according to the working coordinate value in the tool path file and formula 2. X m , Y m , and then control the engraving machine spindle to move to the corresponding working coordinates to process the material.

[0050] In some embodiments, it is also necessary to determine Z Axis working coordinates and Z The conversion relationship between the axis mechanical coordinates is convenient for obtaining from the tool path file Z The axis working coordinates are converted into corresponding mechanical coordinates to control the tool head assembly Z Movement in the direction of the axis.

[0051] In determining Z Axis working coordinates and ZThe process of converting the relationship between the mechanical coordinates of the axes includes: raising the head assembly to the highest point of the Z axis, determining the detection point of the origin of the working coordinate in the Z axis direction, and the engraving machine control device detects the origin of the working coordinate in the Z axis direction of the engraving machine at the detection point. Among them, determining the detection point of the origin of the working coordinate in the Z axis direction includes determining the point in the XY plane that is offset by the preset values ​​in the X direction and the Y direction as the detection point (for example, for a material with a flat surface, the preset value is 5mm), or determining the detection point according to the highest point on the surface of the material (for example, the highest point is determined as the detection point). Exemplarily, the automatic tool change spindle (corresponding to the head assembly) moves to the detection point of the origin of the working coordinate in the Z axis, and slowly moves the Z axis downward until the coaxial probe (i.e., the probe device) contacts the surface of the material to be processed; if the coaxial probe is not triggered, an alarm message is generated; if the coaxial probe is triggered, the origin of the working coordinate in the Z axis is determined according to the current mechanical coordinate of the Z axis.

[0052] in, Z Axis mechanical coordinates refer to Z The distance between the axis mechanical coordinate origin and the front X , Y The meaning of the axis mechanical coordinates is the same as that of the axis mechanical coordinates. For example, the automatic tool change spindle (corresponding to the machine head assembly) can be Z The axis moves up and down, Z The axis mechanical coordinate origin is the automatic tool change spindle (corresponding to the head assembly) Z The highest point on the axis.

[0053] In some embodiments, the highest point on the surface of the material to be processed is determined Z For example, an automatic tool changer spindle carries a probe device (e.g., a coaxial probe) from Z Starting from the highest point on the axis, Z The axis moves downward to the highest point on the material surface and records the position of the automatic tool change spindle when the probe device is triggered. Z Distance of axis downward movement Z L ,Will Z Axis to Z The distance between the axis working coordinate origin is Z L The point as Z Axis working coordinate origin.

[0054] For example, suppose Z m For the current Z Axis mechanical coordinates, Z L When the coaxial probe detects the highest point on the surface of the material to be processed and is triggered Z The mechanical coordinates of the axis (when the engraving machine equipment is determined and the material to be processed is determined, ZL is a constant), Z w For the current Z Axis working coordinates, the calculation formula of working coordinates is: Z w = Z L - Z m Formula 3 By performing an equivalent transformation on Formula 3, we can obtain Z The calculation method of the mechanical coordinates is shown in Formula 4.

[0055] Z m = Z L - Z w Formula 4 Z w The position equal to 0 is Z The axis working coordinate origin, the engraving machine control device calculates the mechanical coordinates according to the working coordinate values ​​in the tool path file and according to Formula 4 Z m , and then control the automatic tool change spindle of the engraving machine to move to the corresponding working coordinates to process the material.

[0056] In some embodiments, by Z The axis sets the detection operation of the highest point of the surface of the material to be processed Z In addition, it is necessary to perform tool length compensation operation. The purpose of tool length compensation operation is to confirm the difference between tool length and coaxial probe length, so as to ensure that after replacing the machining tool Z The accuracy of the axis working position. Assume that the automatic tool change spindle is calibrated using a coaxial probe and the onboard detector (i.e., tool setting device) is triggered. Z The mechanical coordinates of the axis are Z REF , when the automatic tool change assembly is calibrated using the actual tool and the onboard detector is triggered Z The mechanical coordinates of the axis are Z TOOL , the length difference between the coaxial probe and the actual tool is Z OFFSET .

[0057] Z OFFSET = Z TOOL - Z REF Formula 5 Combining Formula 3 and Formula 5, after considering tool compensation Z The calculation formula of axis working coordinates is: Z w = Z L - Z m - Z OFFSET Formula 6 By performing an equivalent transformation on Formula 6, we can obtain the calculation method of the Z mechanical coordinate after considering the tool length compensation, as shown in Formula 7.

[0058] Z m = Z L - Z w - Z OFFSET Formula 7 The engraving machine control device calculates the mechanical coordinates according to the working coordinate values ​​in the tool path file and formula 7 Z m , and then control the automatic tool change spindle of the engraving machine to move to the corresponding working coordinates to process the material.

[0059] In some embodiments, the steps of engraving the material to be processed in the present application include: the engraving machine control device reads a line of instructions in the tool path file; turns on / off the spindle according to the instructions in the tool path file, and moves to the specified position in the X, Y, and Z axis directions; then reads the next line of instructions in the tool path file, and executes in a loop in sequence until all the instructions in the tool path file are read.

[0060] In some embodiments, the present application can also realize leveling of materials, including the following steps: The automatic tool change spindle moves to the first leveling point above the preset material; Slowly move downward along the Z axis until the coaxial probe triggers; Record the Z-axis height coordinate corresponding to the current X / Y coordinate; If all the points that need to be leveled have been detected, the process ends; otherwise, the automatic tool change spindle moves to the next leveling point above the material and continues the above steps to detect.

[0061] In some embodiments, an embodiment of the present application provides a computer device, including a memory, a processor, and a computer program stored in the memory, characterized in that the processor executes the computer program to implement the steps of the engraving machine control method described in any embodiment of the present application.

[0062] In some embodiments, the embodiments of the present application provide a computer-readable storage medium on which a computer program / instruction is stored, characterized in that when the computer program / instruction is executed by a processor, the steps of the engraving machine control method described in any embodiment of the present application are implemented.

[0063] In some embodiments, the embodiments of the present application provide a computer program product, including a computer program / instruction, characterized in that when the computer program / instruction is executed by a processor, the steps of the engraving machine control method described in any embodiment of the present application are implemented.

[0064] In some embodiments, the present application provides an engraving machine, characterized in that it includes: The computer device described in any embodiment of the present application; A head assembly, the head assembly being movable in vertical and lateral directions; A workbench assembly is movable in the front-rear direction; the vertical direction, the lateral direction and the front-rear direction are perpendicular to each other, and a probe device and a tool are arranged on the workbench assembly.

[0065] In some embodiments, a tool setting device is also provided on the workbench assembly.

[0066] like Figure 4 The figure shows the internal structure schematic diagram of the tool setting device of the present application. In this embodiment, it includes: a first barrel body (for example, an upper barrel 7), a second barrel body (for example, a lower barrel 8), a moving contact assembly, and a fixed contact assembly. Among them, a first space is defined between the upper barrel 7 and the lower barrel 8, and the moving contact assembly is installed in the first space; a second space is formed in the lower barrel 8, and the fixed contact assembly is installed in the second space; the first space and the second space are interconnected, and the moving contact assembly can be moved from the first position to the second position under the action of an external force. In the first position, the moving contact assembly is not in contact with the fixed contact assembly, and in the second position, the moving contact assembly and the fixed contact assembly are in contact to achieve electrical connection.

[0067] The present application integrates both the moving contact assembly and the stationary contact assembly into the tool setting device, thereby avoiding the problem of CNC machining equipment carrying useless circuits to work.

[0068] In some embodiments, the moving contact assembly includes a moving contact structure (e.g., a sliding probe 2) and a first elastic structure (e.g., a primary spring 3). When the sliding probe 2 is not acted upon by an external force, the primary spring 3 maintains the sliding probe 2 at the first position. When the sliding probe 2 is acted upon by an external force, the sliding probe 2 compresses the primary spring 3 and moves to the second position.

[0069] like Figure 5a As shown, it is a schematic diagram of the internal structure of the tool setting device of the present application (the black part is a schematic diagram of the upper barrel 7); Figure 5bAs shown, it is a schematic diagram of the internal structure of the tool setting device of the present application (the black part is a schematic diagram of the upper barrel 8). The lower end of the upper barrel 7 is installed in cooperation with the upper end of the lower barrel 8, the lower end of the primary spring 3 is in conflict with the upper end of the lower barrel 8, and the upper end of the primary spring 3 is in conflict with the sliding probe 2. Among them, a circumferential boss is provided on the main body of the sliding probe 2, and the primary spring 3 is sleeved on the main body of the sliding probe 2 located below the circumferential boss, and conflicts with the lower surface of the circumferential boss on the main body of the sliding probe 2. The main body of the sliding probe 2 located above the circumferential boss passes through the upper end opening of the upper barrel 7, and the upper end opening of the upper barrel 7 is smaller than the size of the circumferential boss, so that the upper barrel inner wall boss in the upper barrel 7 cooperates with the circumferential boss. Under the action of the primary spring 3, the upper surface of the circumferential boss conflicts with the barrel inner wall boss.

[0070] like Figure 5c As shown, it is a schematic diagram of the internal structure of the tool setting device of the present application (the black part is a schematic diagram of the sliding probe 2). A tool receiving platform 1 is also installed on the main part of the sliding probe 2 located above the circumferential boss, and the tool or probe device of the CNC machining equipment realizes tool setting through the tool receiving platform 1. The tool receiving platform 1 can be connected to the main part of the sliding probe 2 located above the circumferential boss by a threaded connection, and other connection methods can also be used, which is not limited by the present application.

[0071] The lower end of the upper barrel 7 and the upper end of the lower barrel 8 can be installed in a manner of threaded connection, welding, or riveting, etc., which is not limited in this application. Among them, the upper barrel 7, the lower barrel 8, the sliding probe 2, and the primary spring 3 are all made of conductive materials.

[0072] like Figure 5d , which is a schematic diagram of the internal structure of the tool setting device of the present application (the black part is a schematic diagram of the fixed contact). In some embodiments, the fixed contact assembly includes a fixed contact structure (e.g., the fixed contact 6) and a buffer structure in contact with the fixed contact structure. When the moving contact structure (e.g., the sliding probe 2) moves to the second position, the moving contact structure contacts the buffer structure, and the buffer structure realizes the electrical connection between the moving contact structure and the static contact structure.

[0073] The buffer structure includes a buffer contact 4 and a second elastic structure (for example, a secondary spring 5). The first end of the secondary spring 5 is in contact with the fixed contact 6, and the buffer contact 4 is installed at the second end of the secondary spring 5. The elastic coefficient of the primary spring 3 is smaller than the elastic coefficient of the secondary spring 5.

[0074] An insulating layer is provided between the fixed contact assembly and the second barrel body (lower barrel 8), and the insulating layer includes an insulating ring 9; the moving contact assembly is connected to the external circuit through the second barrel body (lower barrel 8), and the fixed contact assembly is connected to the external circuit through one end of the fixed contact structure away from the moving contact structure.

[0075] likeFigure 4 As shown, the tool setting device of the present application also includes a base wiring nut 11, which is installed at one end of the lower barrel away from the moving contact assembly. A circumferential protrusion structure is provided in the middle of the fixed contact 6. The base wiring nut 11 limits the fixed contact 6 through the circumferential protrusion structure to complete the installation of the fixed contact in the second space. A through hole is provided at the upper end of the lower barrel 8 for the main body of the sliding probe 2 to pass through. The diameter of the through hole is smaller than the diameter of the second space, the diameter of the secondary spring 5 is larger than the diameter of the through hole, or the diameter of the buffer contact 4 is larger than the diameter of the through hole, so that a lower barrel inner wall boss is formed inside the lower barrel 8, which is used to confine the buffer structure (buffer contact 4 and secondary spring 5) in the second space.

[0076] The secondary spring 5 is sleeved on the body of the fixed contact 6, the upper end of the secondary spring 5 is in contact with or connected to the buffer contact 4, and the lower end of the secondary spring 5 is in contact with the upper surface of the circumferential protrusion structure of the fixed contact 6. Further, an insulating sheet 10 (for example, an annular insulating gasket) is provided between the base wire nut 11 and the lower surface of the circumferential protrusion structure of the fixed contact 6.

[0077] The base wiring nut 11 is provided with a through hole, and one end of the fixed contact 6 away from the moving contact assembly passes through the through hole. There is a gap between the fixed contact 6 and the inner wall of the through hole, ensuring insulation between the fixed contact 6 and the base wiring nut 11.

[0078] Wiring holes are provided at the lower ends of the base wiring nut 11 and the fixed contact 6, which are used to realize the electrical connection between the moving contact assembly and the fixed contact assembly in the tool setting device and the external circuit. For example, when the tool receiving platform 1 is not subjected to force, the moving contact assembly is in the first position and remains separated from the fixed contact assembly. The sliding probe 2 in the moving contact assembly is conductively connected to the lower barrel 8 through the primary spring 3, and the base wiring nut 11 is conductively connected to the lower end of the lower barrel 8, and then connected to the external circuit through a wire; the fixed contact 6 is directly connected to the external circuit through a wire; when the tool receiving platform 1 is subjected to force, the sliding probe 2 moves downward and contacts the buffer contact 4, and the buffer contact is electrically connected to the fixed contact 6 through the secondary spring 5, thereby realizing a closed-loop connection between the moving contact assembly and the fixed contact assembly and the external circuit.

[0079] like Figure 4 As shown, in the present application, the upper barrel 7, the lower barrel 8 and the base wiring nut 11 constitute the overall housing of the tool setting device. The fixed contact 6, the buffer contact 4, the insulating ring 9 and the insulating sheet 10 are normally stationary under the tension of the secondary spring 5 and the restraint of the overall housing.

[0080] The fixed contact 6 and the buffer contact 4 are subjected to the tension of the secondary spring 5 in any working state, so the fixed contact 6 and the buffer contact 4 are electrically connected in any working state. The fixed contact 6, the buffer contact 4 and the secondary spring 5 are fully surrounded and insulated by the insulating ring 9 and the insulating sheet 10 in any working state, so the fixed contact 6, the buffer contact 4, the secondary spring 5 and the overall housing are electrically disconnected in any working state.

[0081] The knife connecting platform 1 and the sliding probe 2 are stably connected and are normally stationary under the restraint of the primary spring 3 and the overall shell. The knife connecting platform 1 and the overall shell are not insulated, so the knife connecting platform 1 and the overall shell are electrically connected. When the knife connecting platform 1 is squeezed by the external vertical downward force, the knife connecting platform 1 and the sliding probe 2 together compress the primary spring 3 to cause vertical downward displacement.

[0082] When the lower end surface of the sliding probe 2 touches the moving contact 4, the knife receiving platform 1 is electrically connected to the fixed contact 6. At this time, the circuits such as the wires connected to the wiring holes 12 outside the insulating layer and the wiring holes 13 inside the insulating layer are also electrically connected, and a feedback signal will be generated.

[0083] The secondary spring 5 has the following functions: Firstly, it has a buffering effect on the downwardly moving tool receiving platform 1 and the sliding probe 2, so as to avoid rigid contact which may damage the tool setting device components and the tool and affect the tool setting accuracy.

[0084] Secondly, after the sliding probe 2 contacts the moving contact 4, there is still a distance that can be moved downward, that is, between the upper end surface of the fixed contact 6 and the bottom surface of the moving contact 4. If the sliding probe 2 does not retreat after contacting the moving contact 4 due to some accident and continues to move downward, the secondary spring 5 can always support the moving contact 4 to keep it in contact with the lower end surface of the sliding probe 2, thereby ensuring the real feedback on the fact that the tool has contacted the tool receiving platform 1 in the mechanical mechanism.

[0085] A certain distance is provided between the upper end surface of the fixed contact 6 and the bottom surface of the movable contact 4. The advantage of this is that a buffer space is provided to avoid rigid contact.

[0086] When the external force on the tool receiving platform 1 disappears, the primary spring 3 and the secondary spring 5 resume their deformation, the movable parts inside the entire tool setting device return to normal, the circuits such as the wires connected to the wiring holes 12 and the wiring holes 13 are electrically disconnected, and the feedback signal disappears.

[0087] In some embodiments, the present application also provides a CNC machining device, which is equipped with a probe device and the tool setting device described in any of the aforementioned embodiments.

[0088] In the prior art, before an operator operates a CNC machining device (e.g., a 3D engraving machine) to process a part, the operator needs to detect the material to be processed, so as to determine information such as the boundary of the material to be processed, so as to facilitate automatic processing according to the processing target. In the process of realizing the present application, the inventor discovered that when the operator detects the material to be processed through a probe, it is necessary to manually control the movement of the probe in three-dimensional space to detect the target point on the material to be processed. For example, for a smaller groove on the processed material, the groove needs to be enlarged or deepened. The operator needs to manually adjust the movement of the probe in the front-to-back and left-to-right directions, and then tentatively adjust the height of the probe to align the probe with the groove. The whole process is time-consuming and labor-intensive, and requires a high level of operator proficiency. The present application provides a probe device that solves the above problems to a certain extent.

[0089] like Figure 6a , Figure 6b and Figure 8 As shown, an embodiment of the present invention provides a probe device for numerical control processing equipment, the probe device comprising: a housing 10', a light source assembly 20, a probe assembly 30 and a circuit board 40 assembled in the housing 10', wherein: The circuit board 40 is connected to the light source assembly 20 and the probe assembly 30; The light source assembly 20 is disposed at one end of the probe assembly 30 , and the light source assembly 20 is configured to indicate the probe point of the probe assembly 30 ; The probe assembly 30 is provided with an optical channel, and the optical channel is used for the light emitted by the light source assembly 20 to pass through so as to indicate the probe point of the probe assembly 30 .

[0090] Exemplarily, the light source assembly 20 is disposed at the upper end of the probe assembly 30, and the light emitted by the light source assembly 20 can be projected onto the surface of the material to be processed through the light channel disposed in the probe assembly 30 to indicate the probe point of the probe assembly 30 on the material to be processed.

[0091] The embodiment of the present application indicates the detection point of the probe assembly 30 through the light source assembly 20 in the probe device, which facilitates the operator to quickly locate the landing point of the probe assembly 30 on the object to be processed, simplifies the operation steps, and improves the detection efficiency.

[0092] In some embodiments, the light source assembly 20 includes a light source 21 and a light source mounting seat 22 for mounting the light source 21, the light source 21 is at least partially embedded in the light source mounting seat 22, and is electrically connected to the circuit board 40. Exemplarily, the light source 21 may be an infrared light source, and two electrodes are provided on the light source 21, the two electrodes are used to connect to the circuit board 40, and the power on and off control of the light source 21 is realized through the circuit board 40, thereby realizing the switch of the light source 21. Exemplarily, a controller is provided on the circuit board 40 for controlling the switch of the light source 21.

[0093] In some embodiments, the light source assembly 20 further includes a convex lens 23 and a lens mounting seat 24. The convex lens 23 is disposed between the light source 21 and the probe assembly 30 through the lens mounting seat 24 to guide the light of the light source 21 to the light channel. Exemplarily, the convex lens 23 is embedded in the lens mounting seat 24. The convex lens is circular. The lens mounting seat 24 is correspondingly a circular mounting seat. The lens mounting seat 24 is provided with a through hole to allow the light of the convex lens to pass through. The setting of the convex lens 23 in the light source assembly 20 can realize the convergence of the light emitted by the light source 21, so that the light can be better directed to the probe assembly 30, and the probe point of the probe assembly 30 on the material to be processed can be indicated more stably and clearly.

[0094] In some embodiments, the light source assembly 20 further includes a focus stopper 25, which is disposed between the light source 21 and the convex lens 23. Exemplarily, the focus stopper 25 is cylindrical, for example, the focus stopper 25 is a lens focal length cylinder. The length of the focus stopper 25 can be set according to the focal length of the convex lens, so that the light emitted by the light source 21 can be accurately projected to the light channel in the probe assembly 30 after passing through the convex lens 23.

[0095] Exemplarily, the shape of the light source mounting seat 24 matches the light source 21. For example, the light source 21 is at least partially cylindrical, and the outer contour of the corresponding light source mounting seat 24 is cylindrical, and a through hole is provided inside, and the through hole is used to install the light source 21. Further, in order to facilitate the installation of the electrodes on the light source 21, a notch is provided on the side wall of the light source mounting seat 24, and the notch is used for the two electrodes of the light source 21 to be connected to the outside (for example, to be connected to the circuit board 40 through a wire).

[0096] In some embodiments, the lower half of the light source 21 is embedded in the focus limiting component 25, and the upper half of the light source 21 is embedded in the light source mounting seat 24. The focus limiting component 25 is tubular, and the axis of the focus limiting component 25 is colinear with the axis of the light source mounting seat 24.

[0097] Exemplarily, the light source 21, the focus stop component 25, the convex lens 23 and the convex lens mounting seat 24 are assembled together from top to bottom in sequence, and are assembled with each other by means of embedded connection, threaded connection or bonding, etc., which is not limited in this application. The axes of the light source 21, the focus stop component 25, the convex lens 23 and the convex lens mounting seat 24 are collinear.

[0098] like Figure 7a , Figure 7b and Figure 8 As shown, in the probe device provided by the present application, the probe assembly 30 includes a static contact assembly 31 and a movable contact assembly 32 , and the static contact assembly 31 and the movable contact assembly 32 are connected to a circuit board 40 .

[0099] In the present application, the static contact assembly 31 and the moving contact assembly 32 are connected to the circuit board 40 to detect the detection action of the probe assembly. For example, when the moving contact assembly 32 contacts the material to be processed, it is displaced, so that the moving contact assembly 32 contacts the static contact assembly 31, thereby forming a closed loop, and a detection signal is generated in the circuit board 40, indicating that the detection is in place.

[0100] In some embodiments, the stationary contact assembly 31 includes a stationary contact portion 311 and a stationary contact insulating portion 312, the stationary contact portion 311 is embedded in the stationary contact insulating portion 312, and the stationary contact portion 311 is connected to the circuit board 40. Exemplarily, the centers of the stationary contact assembly 31 and the movable contact assembly 32 are both provided with through holes to form an optical channel. Figure 7b As shown, in the embodiment of the present application, the stationary contact assembly 31 further includes a first probe electrode 3111 , wherein one end of the first probe electrode 3111 contacts the stationary contact portion 311 , and the other end of the first probe electrode 3111 is connected to the circuit board 40 .

[0101] In some embodiments, the moving contact assembly 32 includes a probe 321, a probe mounting seat 322 and a probe reset spring 323. The main body of the probe 321 is provided with a probe clamping portion 3211. The probe mounting seat 322 is provided with a through hole for assembling the probe 321. The through hole is provided with a probe limiting portion that matches the probe clamping portion 3211 (for example, the probe limiting portion can be a boss provided in the through hole, or it can be implemented as a gradually decreasing diameter of the lower end of the probe mounting seat to achieve clamping of the probe). The first side surface of the probe clamping portion 3211 cooperates with the probe limiting portion, and the second side surface of the probe clamping portion 3211 cooperates with the probe reset spring 323, and the first side surface and the second side surface are opposite. When the probe 321 is subjected to an external force within a preset range, the probe reset spring 323 will be triggered to deform. Exemplarily, the preset range can be 0.1N-0.2N. Since the probe reset spring 323 only needs the above small external force to trigger deformation, when the tip of the probe 321 touches the material to be detected, even if the material is relatively soft, its contact surface will hardly deform to affect the detection accuracy. Therefore, the material does not have to be limited to relatively hard materials such as metal, plastic, wood, etc.

[0102] Exemplarily, the probe clamping portion 3211 is disposed near the middle of the probe 321 . The probe clamping portion 3211 may be an integral component surrounding the probe 321 circumferentially, or may be a plurality of subcomponents spaced apart around the probe 321 circumferentially, which is not limited in the present application.

[0103] The movable contact assembly 32 further includes a second probe electrode 3112 , wherein one end of the second probe electrode 3112 contacts the probe 321 , and the other end of the second probe electrode 3112 is connected to the circuit board 40 .

[0104] In some embodiments, a general assembly tube 50 for assembling the light source assembly 20 and the probe assembly 30 is also included. The general assembly tube 50 is provided with a general assembly through hole along the light channel direction, and the probe mounting seat 322 is at least partially embedded in the general assembly tube 50 .

[0105] In this embodiment, the light source assembly 20 and the probe assembly 30 are coaxially assembled through the general assembly tube 50, thereby ensuring the reliability of the assembly and avoiding the problem that the light cannot pass smoothly due to the mutual misalignment between the components.

[0106] In some embodiments, the static contact insulating part 312 is provided with an insulating through hole for installing the static contact part 311 and the probe 321, and an isolation part is provided in the insulating through hole. The static contact part 311 abuts against one side of the isolation part, and the probe reset spring 323 abuts against the other side of the isolation part. A contact through hole is formed on the isolation part for the probe 321 to pass through and contact the static contact part 311.

[0107] In this embodiment, an isolation portion is provided on the static contact insulating portion 312 to achieve insulation isolation and matching installation of the static contact portion 311 and the probe 321. When the probe 321 contacts an object, the spring is compressed, so that the upper end of the probe 321 contacts the static contact portion 311 located above through the contact through hole formed on the isolation portion, thereby forming a closed loop and generating a signal in the circuit board.

[0108] In some embodiments, the probe 321 includes a probe through hole arranged along the extension direction of the optical channel, the static contact portion 311 includes a static contact through hole arranged along the extension direction of the optical channel, and the optical channel includes the probe through hole and the static contact through hole.

[0109] In some embodiments, the probe device further comprises a clamping portion 60, for example, the clamping portion 60 is a clamping handle for mounting the probe device on a numerical control processing device. In some embodiments, the clamping portion 60 is connected to the housing 10' via a threaded connection.

[0110] In some embodiments, the probe device further includes a power supply disposed in the housing 10', which is used to power at least the circuit board 40. The housing 10' encloses the light source assembly 20, the probe assembly 30, the circuit board 40 and the power supply in a space. To charge the power supply, a wireless charging circuit is also disposed on the circuit board 40.

[0111] like Figure 9 and Figure 8As shown, an embodiment of the present invention provides a numerical control processing device, for example, the numerical control processing device is a 3D engraving machine, and the numerical control processing device is configured with the probe device of any embodiment of the present application.

[0112] In some embodiments, the probe 321 is in real-time contact and electrically connected with the touch feedback signal conducting metal sheet (3112-second probe electrode); the static contact portion 311 is in real-time contact and electrically connected with the touch feedback signal conducting metal sheet (3111-first probe electrode); the probe 321 and the static contact portion 311 are electrically insulated under normal conditions; the top of the probe 321 and the bottom of the static contact portion 311 maintain a certain insulation distance under the action of spring tension; the probe 321 can move upward in the vertical direction under the action of an external force from the bottom that can overcome the spring tension.

[0113] As the probe moves upward, the top of the probe 321 is electrically connected to the bottom of the static contact portion 311 at the moment of contact, and the feedback signal is transmitted in the external circuit connected to the first probe electrode 3111 and the second probe electrode 3112 of the touch feedback signal conductive metal sheet. When the external force at the bottom of the probe 321 is removed, the top of the probe 321 is separated and electrically insulated from the bottom of the static contact portion 311 under the tension of the probe reset spring 323, the circuit loop for transmitting the touch feedback signal is cut off, and the signal transmission stops.

[0114] The external force that causes the touch feedback signal is downward pressure. In addition, the spring elastic coefficient of the tool setting device is larger than that of the probe device. When the two move towards each other and touch each other, the probe will be squeezed first to trigger the signal transmission. If the movement continues, the spring of the lower tool setting device will be squeezed because the probe has reached the limit position, thus triggering the signal transmission.

[0115] Because the transmission circuit of the touch trigger signal is an independent structure inside the probe and has nothing to do with external objects, the triggering and transmission of the signal does not need to pass through the material being detected, so the material does not have to be limited to a conductive metal material.

[0116] The following is an introduction to the logic of the probe device and the tool setting device in the CNC machining equipment of this application to automatically calculate the height of the upper surface of the material: 1. The CNC machining equipment spindle clamping probe device is moved as a whole to the top of the tool setter, so that the probe tip is aligned with the center of the top platform of the tool setter and then slowly moves down.

[0117] 2. As the ends of the two contact, the probe is squeezed and contracted, triggering the contact signal first, but the parameters corresponding to this signal do not participate in the logical calculation of this function. Then the tool setting device will trigger the contact signal, and the parameters corresponding to this signal can calculate the Z-axis coordinate of the tip of the probe in the machine tool coordinate system when the touch signal in itself has been triggered. From this moment on, no matter how the spindle moves with the probe in the coordinate system, this coordinate value can be accurately calculated and becomes a known quantity.

[0118] 3. Next, the spindle carries the probe as a whole to the top of any point on the upper surface of the material that you want to detect, and then slowly moves down until the probe triggers a touch signal. At this time, the Z-axis coordinate of the probe tip corresponding to this signal is the Z-axis coordinate of the detected point. This coordinate can also be used to calculate the height from the machine tool table.

[0119] 4. The above process is the logical principle for realizing the "upper probe + lower tool setting device combination" method for measuring the upper surface of the material blank and any other application scenario that requires measuring the Z-axis coordinate of a vertically detectable point of an object.

[0120] It should be noted that, for the aforementioned method embodiments, for the sake of simplicity of description, they are all expressed as a series of actions combined, but those skilled in the art should be aware that the present application is not limited by the described order of actions, because according to the present application, certain steps can be performed in other orders or simultaneously. Secondly, those skilled in the art should also be aware that the embodiments described in the specification are all preferred embodiments, and the actions and modules involved are not necessarily required by the present application. In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, please refer to the relevant description of other embodiments.

[0121] Figure 10 FIG. 1 is a schematic diagram of the hardware structure of a computer device for executing an engraving machine control method provided by another embodiment of the present application. Figure 10 As shown, the device includes: One or more processors 1010 and memory 1020, Figure 10 A processor 1010 is taken as an example.

[0122] The device for executing the engraving machine control method may further include: an input device 1030 and an output device 1040 .

[0123] The processor 1010, the memory 1020, the input device 1030 and the output device 1040 may be connected via a bus or other means. Figure 10 The example of connecting through bus is taken in the following.

[0124] The memory 1020 is a non-volatile computer-readable storage medium that can be used to store non-volatile software programs, non-volatile computer executable programs and modules, such as program instructions / modules corresponding to the engraving machine control method in the embodiment of the present application. The processor 1010 executes various functional applications and data processing of the server by running the non-volatile software programs, instructions and modules stored in the memory 1020, that is, the engraving machine control method in the above method embodiment is implemented.

[0125] The memory 1020 may include a program storage area and a data storage area, wherein the program storage area may store an operating system, an application required for at least one function; the data storage area may store data created according to the use of the engraving machine control device, etc. In addition, the memory 1020 may include a high-speed random access memory, and may also include a non-volatile memory, such as at least one disk storage device, a flash memory device, or other non-volatile solid-state storage device. In some embodiments, the memory 1020 may optionally include a memory remotely arranged relative to the processor 1010, and these remote memories may be connected to the engraving machine control device via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0126] The input device 1030 can receive input digital or character information and generate signals related to user settings and function control of the engraving machine control device. The output device 1040 can include display devices such as display screens.

[0127] The one or more modules are stored in the memory 1020, and when executed by the one or more processors 1010, the engraving machine control method in any of the above method embodiments is executed.

[0128] The above-mentioned product can execute the method provided in the embodiment of the present application, and has the functional modules and beneficial effects corresponding to the execution method. For technical details not fully described in this embodiment, please refer to the method provided in the embodiment of the present application.

[0129] The computer device of the embodiment of the present application exists in various forms, including but not limited to: (1) Mobile communication devices: These devices are characterized by their mobile communication functions and their main purpose is to provide voice and data communications. These terminals include: smart phones (such as iPhone), multimedia phones, functional phones, and low-end phones.

[0130] (2) Ultra-mobile personal computer devices: These devices fall into the category of personal computers, have computing and processing capabilities, and generally also have mobile Internet access features. These terminals include: PDA, MID and UMPC devices, such as iPad.

[0131] (3) Portable entertainment devices: These devices can display and play multimedia content. They include audio and video players (such as iPods), handheld game consoles, e-books, as well as smart toys and portable car navigation devices.

[0132] (4) Server: A device that provides computing services. The server consists of a processor, hard disk, memory, system bus, etc. The server is similar to a general computer architecture, but because it needs to provide highly reliable services, it has higher requirements in terms of processing power, stability, reliability, security, scalability, and manageability.

[0133] (5) Other electronic devices with data interaction functions.

[0134] The device embodiments described above are merely illustrative, wherein the units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0135] Through the description of the above implementation methods, those skilled in the art can clearly understand that each implementation method can be implemented by means of software plus a general hardware platform, and of course, by hardware. Based on this understanding, the above technical solution, in essence, or the part that contributes to the relevant technology, can be embodied in the form of a software product, which can be stored in a computer-readable storage medium, such as ROM / RAM, a disk, an optical disk, etc., including a number of instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to execute the methods described in each embodiment or some parts of the embodiment.

[0136] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A method for controlling an engraving machine, used for an engraving machine control device, wherein the engraving machine comprises a head assembly and a table assembly, wherein the head assembly can move in a vertical direction and a lateral direction, and the table assembly can move in a front-to-back direction, wherein the vertical direction, the lateral direction and the front-to-back direction are perpendicular to each other, and a probe device and a tool are arranged on the table assembly; the method comprises: Control the head assembly to move above the probe device and clamp the probe device from the probe base; Controlling the head assembly to carry the probe device to detect the material to be processed to obtain material data, wherein the material to be processed is fixed on the workbench assembly; Controlling the head assembly to carry the probe device to move to the probe base, and placing the probe device therein; Control the head assembly to move above the tool and clamp the tool from the tool base; At least according to the material data and the tool path file, the tool is controlled to engrave the material to be processed.

2. The method according to claim 1, characterized in that The workbench assembly is also provided with a tool setting device, and the method further comprises: Controlling the head assembly to carry the probe device to move vertically downward from a first preset height until the probe device triggers the tool setting device and recording a first vertical moving distance; Controlling the machine head assembly to carry the tool and move vertically downward from the first preset height until the tool triggers the tool setting device, and recording a second vertical movement distance; The material data is compensated according to the first vertical moving distance and the second vertical moving distance, so as to be used for controlling the tool to engrave the material to be processed in combination with the tool path file.

3. The method according to claim 2, characterized in that It also includes determining the Z-axis coordinate transformation relationship: Z m = Z L - Z w ; in, Z m For the current Z Axis mechanical coordinates; Z L When the probe device detects the highest point on the surface of the material to be processed and is triggered Z Mechanical coordinates of the axis; Z w For the current Z Axis working coordinates.

4. The method according to claim 3, characterized in that: The compensating the material data according to the first vertical moving distance and the second vertical moving distance includes using the following formula to perform tool length compensation: Z m = Z L - Z w - Z OFFSET ;in, Z OFFSET is the difference between the first vertical moving distance and the second vertical moving distance.

5. The method according to claim 2, characterized in that: The material to be processed is fixed on the workbench assembly through an L-shaped positioning substrate, and the method further includes: Determine the inner corner point of the L-shaped positioning substrate as the L-shaped positioning substrate zero point, and determine a first relative position relationship between the L-shaped positioning substrate zero point and a preset mechanical coordinate zero point of the workbench assembly; Acquire work coordinate zero point configuration data input by a user, wherein the work coordinate zero point configuration data includes a second relative position relationship between the work coordinate zero point and the L-shaped positioning substrate zero point; An XY plane coordinate conversion relationship between working coordinates and mechanical coordinates is determined according to the first relative position relationship and the second relative position relationship.

6. The method according to claim 5, characterized in that The step of controlling the tool to engrave the material to be processed in combination with the tool path file includes: Acquire the current working coordinates according to the tool path file; Determine the current mechanical coordinates according to the current working coordinates and the XY plane coordinate conversion relationship; The machine head assembly is controlled to carry the tool to move to the current mechanical coordinates to engrave the material to be processed.

7. The method according to claim 5, characterized in that The first relative position relationship includes: the distance between the zero point of the L-shaped positioning substrate and the zero point of the mechanical coordinate in the X-axis direction, and the distance between the zero point of the L-shaped positioning substrate and the zero point of the mechanical coordinate in the Y-axis direction; The second relative position relationship includes: the distance between the working coordinate zero point and the L-shaped positioning substrate zero point in the X-axis direction, and the distance between the working coordinate zero point and the L-shaped positioning substrate zero point in the Y-axis direction.

8. The method according to claim 7, characterized in that The XY plane coordinate transformation relationship is expressed as the following formula: X m = X L - X w - X offset ; Y m = Y L - Y w - Y offset ； in, X L is the distance between the zero point of the L-shaped positioning substrate and the zero point of the mechanical coordinate in the X-axis direction; Y L is the distance between the zero point of the L-shaped positioning substrate and the zero point of the mechanical coordinate in the Y-axis direction; X offset is the distance between the working coordinate zero point and the L-shaped positioning substrate zero point in the X-axis direction; Y offset is the distance between the working coordinate zero point and the L-shaped positioning substrate zero point in the Y-axis direction; ( X w , Y w ) is the current working coordinate; ( X m , Y m ) is the current mechanical coordinate.

9. The method according to claim 5, characterized in that The method also includes pre-storing the mechanical coordinates of the probe device and the tool for controlling the head assembly to move to the probe device or the tool.

10. A computer device comprising a memory, a processor and a computer program stored in the memory, characterized in that: The processor executes the computer program to implement the steps of the method according to any one of claims 1 to 9.

11. An engraving machine, characterized in that: include: The computer device as claimed in claim 10; A head assembly, the head assembly being movable in vertical and lateral directions; A workbench assembly is movable in the front-rear direction; the vertical direction, the lateral direction and the front-rear direction are perpendicular to each other, and a probe device and a tool are arranged on the workbench assembly.

12. The engraving machine according to claim 11, characterized in that: The workbench assembly is also provided with a tool setting device.

13. A computer-readable storage medium having a computer program / instruction stored thereon, characterized in that: When the computer program / instructions are executed by a processor, the steps of the method according to any one of claims 1 to 9 are implemented.

14. A computer program product comprising a computer program / instructions, characterized in that When the computer program / instructions are executed by a processor, the steps of the method according to any one of claims 1 to 9 are implemented.

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