High-power IGBT (Insulated Gate Bipolar Translator) integrated liquid cooling heat dissipation device and system

Abstract

The invention relates to the technical field of power semiconductors, solves the technical problems of low heat dissipation efficiency and non-uniform heat dissipation in the prior art, and particularly relates to a high-power IGBT (Insulated Gate Bipolar Translator) integrated liquid cooling heat dissipation device which comprises a shell, an inner protective shell arranged in the shell and a plurality of IGBT chips arranged on the side wall of the inner protective shell, and a liquid cooling mechanism for carrying out liquid cooling heat dissipation on the IGBT chip and an air cooling mechanism for assisting the liquid cooling mechanism in carrying out air cooling heat dissipation are further arranged in the shell. Through cooperation of the liquid cooling system and the air cooling system, heat dissipation can be carried out on the IGBT independently through the liquid cooling system, and air cooling heat dissipation can also be carried out on the IGBT independently through air cooling; meanwhile, efficient dual heat dissipation can be conducted on the IGBT through a liquid cooling system and an air cooling system, heat dissipation energy can be saved through cooperation of the micro-processing module and the temperature sensing module, the heat dissipation task can be efficiently completed, and the energy consumption cost can also be saved.

Description

Technical Field

[0001] The present invention relates to the field of power semiconductor technology, and in particular to a high-power IGBT integrated liquid cooling device and system. Background Art

[0002] Insulated gate bipolar transistor (IGBT) power semiconductor modules are key components in new energy conversion systems and high-voltage power switch devices. The heat flux density of IGBTs tends to be high-power and high-integrated. Most of the failures of IGBT power semiconductor modules are related to heat. The heat dissipation effect seriously affects the working performance, safety and reliability of IGBTs. An efficient, stable, convenient and compact cooling system is of great significance to the design of IGBT devices.

[0003] At present, automotive-grade IGBT modules generally use liquid cooling, and liquid cooling is divided into indirect liquid cooling and direct liquid cooling. Indirect liquid cooling uses a flat-bottom heat dissipation substrate, that is, the chip is the heat source, and the heat is mainly transferred to the liquid cooling plate through the DBC substrate, the flat-bottom heat dissipation substrate, and the thermal grease. The liquid cooling plate then discharges the heat through liquid cooling convection. Direct liquid cooling uses a needle-type heat dissipation substrate. This method makes the IGBT power module in direct contact with the coolant, and the heat dissipation efficiency is greatly improved. However, the direct liquid cooling method of the prior art is inefficient in heat dissipation by liquid cooling alone during the liquid cooling process, and cannot meet the high-power heat dissipation standards of the IGBT. At the same time, the cooling temperature of the existing liquid cooling is uneven, and the cooling effect of IGBTs at different positions is different, resulting in insufficient heat dissipation of the top IGBT, which can easily cause the IGBT to be damaged due to insufficient heat dissipation for a long time. Summary of the invention

[0004] In view of the shortcomings of the prior art, the present invention provides a high-power IGBT integrated liquid cooling device, which solves the technical problems of low heat dissipation efficiency and uneven heat dissipation in the prior art, and achieves the purpose of greatly improving the heat dissipation efficiency and uniformly dissipating the IGBT.

[0005] In order to solve the above technical problems, the present invention provides the following technical solutions: a high-power IGBT integrated liquid-cooling heat dissipation device, which includes an outer shell, an inner protective shell installed inside the outer shell, and an IGBT chip installed on the side wall of the inner protective shell. The outer shell is also provided with a liquid cooling mechanism for liquid-cooling the IGBT chip and an air cooling mechanism for assisting the liquid cooling mechanism in air-cooling heat dissipation.

[0006] Furthermore, the liquid cooling mechanism includes a liquid cooling box, a plurality of water pipes are fixedly connected to the side end of the liquid cooling box, a heat exchanger with a water inlet and a water outlet is fixedly connected to the bottom end of the water pipe, a hydraulic pump is fixedly connected to the water outlet of the heat exchanger, a liquid cooling plate for providing a flow space for the coolant is fixedly connected to the side end of the hydraulic pump, and the water outlet end of the liquid cooling plate is fixedly connected to the water inlet of the heat exchanger.

[0007] Furthermore, the liquid cooling plate is provided with air cooling holes for providing air flow space, and the side end of the liquid cooling box is fixedly connected with an exhaust pipe for exhausting air.

[0008] Furthermore, a plurality of grid plates are arranged inside the heat exchanger to facilitate heat dissipation, and a control valve is provided on the side wall of the exhaust pipe.

[0009] Furthermore, the air cooling mechanism comprises an air cooling power bracket, a plurality of motors are fixedly connected inside the air cooling power bracket, and the rotating end of the motor is fixedly connected to an air cooling fan blade.

[0010] Furthermore, the side end of the air-cooled power bracket is fixedly connected to the side end of the heat exchanger.

[0011] The technical solution also provides a liquid cooling system for a high-power IGBT integrated liquid cooling device, including a microprocessor module. The liquid cooling system also includes a temperature sensing module, a control module and a power module.

[0012] Furthermore, the temperature sensing module is composed of a temperature sensing chip, a voltage divider resistor R3 and a 3.3V external power supply. The temperature sensing chip transmits a temperature sensing signal to 6 through a DATA port, and the 3.3V external power supply is connected to the DATA port through a voltage divider resistor R3.

[0013] Furthermore, the control module is composed of a first control circuit, a second control circuit, a hydraulic pump and an electric motor, the first control circuit is connected to the hydraulic pump, and the second control circuit is connected to the electric motor.

[0014] Furthermore, the first control circuit is composed of a current limiting resistor R4, a transistor Q1, a unidirectional diode D1, a relay switch and a control power supply, the current limiting resistor R4 is connected to the base of the transistor Q1, the collector of the transistor Q1 is connected to the hydraulic pump through the relay switch, the unidirectional diode D1 and the relay switch are connected in parallel, the control power supply is connected to the hydraulic pump through the relay switch, and the first control circuit and the second control circuit have the same structure.

[0015] Furthermore, the microprocessing module is composed of a processing chip, a current limiting resistor R1 and a current limiting resistor R2. The temperature sensing signal is connected to the D0 port of the processing chip. The D1 interface of the processing chip transmits the first control signal to the outside through the current limiting resistor R1. The D3 interface of the processing chip transmits the second control signal to the outside through the current limiting resistor R2.

[0016] Furthermore, the model of the temperature sensing chip is DS18B20, and the model of the processing chip is ESP8266.

[0017] By means of the above technical solution, the present invention provides a high-power IGBT integrated liquid cooling device and system, which has at least the following beneficial effects:

[0018] 1. The present invention, through the design of the air cooling holes opened on the liquid cooling plate, can increase the flow rate of the liquid inside the liquid cooling plate within the same time when the power of the hydraulic pump remains unchanged. The reason is that in the law of conservation of energy, when the work done remains unchanged, the mass of the flowing liquid decreases, while the speed increases. The physical principle, thereby taking away more heat, improves the heat dissipation efficiency of the liquid cooling plate, and reduces material loss and material cost. It can also increase the flow rate of the gas through smaller air cooling holes, increase the effect of air cooling and heat dissipation, and improve the heat dissipation efficiency of the heat exchanger.

[0019] 2. The present invention, through the coordination of the liquid cooling system and the air cooling system, can dissipate the heat of the IGBT through the liquid cooling system alone, and can also dissipate the heat of the IGBT through air cooling alone. At the same time, it can also perform efficient dual heat dissipation of the IGBT through the liquid cooling and air cooling systems. Through the coordination of the microprocessor module and the temperature sensing module, the heat dissipation mode can be adjusted according to the real-time temperature of the IGBT to save heat dissipation energy. It can not only efficiently complete the heat dissipation task, but also save energy consumption costs.

[0020] 3. The present invention sets two upper and lower water pipes between the liquid cooling plate and the hydraulic pump, so that the temperatures at the upper and lower ends of the liquid cooling plate can be equal, which can not only solve the problem of uneven heat dissipation of the IGBT liquid cooling plate, but also reduce the damage of the IGBT caused by long-term insufficient heat dissipation.

[0021] 4. The present invention can discharge the air in the liquid cooling system to the outside during the liquid cooling process by setting the exhaust pipe, thereby avoiding the generation of gas residue during the internal liquid injection process, affecting the heat dissipation effect of the liquid cooling plate, improving the heat dissipation efficiency of the liquid cooling plate, and ensuring the healthy operation and use of the IGBT.

[0022] 5. Through the coordinated action of the microprocessing module, the control module, and the temperature sensing module, the present invention can timely detect the ambient temperature of the IGBT, and quickly adjust the heat dissipation power according to the temperature change, avoiding the energy waste caused by continuous high-power operation and the IGBT damage failure problem caused by insufficient heat dissipation at low power, and improving the automation of the heat dissipation system. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The drawings described herein are used to provide a further understanding of the present application, form a part of the present application, and the schematic embodiments and descriptions thereof are used to explain the present application, and do not constitute an improper limitation to the present application. In the drawings:

[0024] Figure 1 is the outer three-dimensional structure diagram of a high-power IGBT integrated liquid cooling heat dissipation device of the present invention;

[0025] Figure 2 is the back three-dimensional structure diagram of the liquid cooling heat dissipation device of the present invention;

[0026] Figure 3 is the three-dimensional structure diagram of the inner protective shell of the liquid cooling heat dissipation device of the present invention;

[0027] Figure 4 is the three-dimensional structure diagram of the air cooling mechanism and the liquid cooling mechanism of the present invention;

[0028] Figure 5 is of the present invention Figure 4 partial enlarged view at A in;

[0029] Figure 6 is the three-dimensional structure diagram of the IGBT chip of the present invention;

[0030] Figure 7 is the top view of the liquid cooling heat dissipation device of the present invention;

[0031] Figure 8 is the side view of the liquid cooling heat dissipation device of the present invention;

[0032] Fig. 9 is the structural block diagram of a high-power IGBT integrated liquid cooling heat dissipation system of the present invention;

[0033] Fig.10 is the circuit diagram of the microprocessing module of the present invention;

[0034] Fig.11 is the circuit diagram of the temperature sensing module of the present invention;

[0035] Fig.12 is the circuit diagram of the first control circuit of the present invention;

[0036] Fig.13 is the circuit diagram of the second control circuit of the present invention.

[0037] In the figure: 1. outer shell; 2. air cooling mechanism; 21. air cooling power bracket; 22. air cooling fan blades; 3. liquid cooling mechanism; 31. liquid cooling box; 32. water guide pipe; 33. heat exchanger; 34. hydraulic pump; 35. liquid cooling plate; 36. air cooling hole; 37. exhaust pipe; 4. inner shell; 5. IGBT chip; 6. microprocessor module; 7. temperature sensing module; 8. control module; 9. power module. DETAILED DESCRIPTION

[0038] In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific implementation methods, so that the implementation process of how the present application uses technical means to solve technical problems and achieve technical effects can be fully understood and implemented accordingly.

[0039] Embodiment 1

[0040] Due to the low heat dissipation efficiency and uneven heat dissipation of existing technologies, please refer to Figure 1 - Figure 8 The present embodiment proposes a high-power IGBT integrated liquid cooling device, which can greatly improve the heat dissipation efficiency and evenly dissipate the heat of the IGBT. The device includes a shell 1, an inner protective shell 4 installed inside the shell 1, and an IGBT chip 5 installed on the side wall of the inner protective shell 4. The shell 1 is also provided with a liquid cooling mechanism 3 for liquid cooling the IGBT chip 5 and an air cooling mechanism 2 for assisting the liquid cooling mechanism 3 in air cooling. The liquid cooling mechanism 3 includes a liquid cooling box 31. The side end of the liquid cooling box 31 is fixedly connected to a plurality of water pipes 32. The bottom end of the water pipe 32 is fixed. A heat exchanger 33 with a water inlet and a water outlet is connected, the water outlet of the heat exchanger 33 is fixedly connected to a hydraulic pump 34, the side end of the hydraulic pump 34 is fixedly connected to a liquid cooling plate 35 for providing a flow space for the coolant, the water outlet end of the liquid cooling plate 35 is fixedly connected to the water inlet of the heat exchanger 33, the liquid cooling plate 35 is provided with air cooling holes 36 for providing air flow space, the side end of the liquid cooling box 31 is fixedly connected to an exhaust pipe 37 for exhausting air, a plurality of grids for facilitating heat dissipation are arranged inside the heat exchanger 33, and a control valve is provided on the side wall of the exhaust pipe 37.

[0041] The present invention protects the internal structure through the outer shell 1 and the inner protective shell 4, and forms an internal installation space. The number of IGBT chips 5 is set and installed according to the situation. The liquid cooling mechanism 3 and the air cooling mechanism 2 are responsible for dissipating the heat of the IGBT chip 5. Before and after the liquid cooling mechanism 3 is started, the coolant passes through the liquid cooling box 31 and enters the heat exchanger 33, the hydraulic pump 34, and the liquid cooling plate 35 in sequence through a plurality of water pipes 32 for connection. The coolant flows through the power of the hydraulic pump 34 and enters the liquid cooling plate 35 through the upper and lower double flow channels. After the liquid cooling plate 35 cools the IGBT chip 5, it passes through the heat exchanger 33 and returns to the liquid cooling box 31, thereby forming a cooling cycle. The heat exchange The heat exchanger 33 is a heat exchanger that can dissipate the heat absorbed by the coolant to the outside. The grid structure can increase the speed of heat dissipation. The air cooling mechanism 2 can also increase the heat dissipation speed of the heat exchanger 33 grid through high-speed cooling wind. The hydraulic pump 34 can not only provide power at a fixed power, but also adjust the flow rate at any time, so that the single liquid cooling efficiency can meet a certain amount of IGBT chips 5, and can also finely control the internal flow of the liquid cooling mechanism 3. The exhaust pipe 37 can discharge the gas inside the liquid cooling mechanism 3 at the initial startup, thereby putting the liquid cooling mechanism 3 in a vacuum state. The air cooling hole 36 can reduce the inflow quality of the liquid inside the liquid cooling plate 35, which can be in the hydraulic pump Under the condition of constant power, the flow rate of the liquid inside the liquid cooling plate is increased within the same period of time. The reason is that in the law of energy conservation, when the work done remains constant, the mass of the flowing liquid decreases, while the speed increases. This takes away more heat, improves the heat dissipation efficiency of the liquid cooling plate, and reduces material loss and material cost, which is helpful for the realization of air cooling. Through the cooperation of the liquid cooling system and the air cooling system, the IGBT can be cooled by the liquid cooling system alone, and the IGBT can also be cooled by air cooling alone. At the same time, the IGBT can also be efficiently cooled by both the liquid cooling and air cooling systems. Through the cooperation of the microprocessor module and the temperature sensing module, it can be based on the I The real-time temperature of GBT is used to adjust the cooling mode to save cooling energy. It can not only complete the cooling task efficiently, but also save energy consumption costs. By setting the upper and lower water pipes between the liquid cooling plate and the hydraulic pump, the upper and lower temperatures of the liquid cooling plate can be equalized, which can not only solve the problem of uneven heat dissipation of the IGBT liquid cooling plate, but also reduce the damage of the IGBT caused by long-term insufficient heat dissipation. Through the setting of the exhaust pipe, the air in the liquid cooling system can be discharged to the outside during the liquid cooling process to avoid the generation of gas residue during the internal liquid injection process, which affects the heat dissipation effect of the liquid cooling plate, improves the heat dissipation efficiency of the liquid cooling plate, and ensures the healthy operation and use of the IGBT.

[0042] The air cooling mechanism 2 includes an air cooling power bracket 21 , and a plurality of motors are fixedly connected inside the air cooling power bracket 21 . The rotating end of the motor is fixedly connected to an air cooling fan blade 22 . The side end of the air cooling power bracket 21 is fixedly connected to the side end of the heat exchanger 33 .

[0043] After being started, the air cooling mechanism 2 of the present invention drives the air cooling fan blades 22 to generate wind force through the motor, and provides air cooling and heat dissipation when the temperature of the IGBT chip 5 is low. When the temperature of the IGBT chip 5 is very high, it can dissipate heat for the IGBT chip 5 together with the liquid cooling mechanism 3. Through the action of the air cooling holes 36, the gas can increase the flow rate through the smaller air cooling holes, increase the effect of air cooling and heat dissipation, and improve the heat dissipation efficiency of the heat exchanger. The uneven distribution of the air cooling holes can also make the gas contact the outer surface of the IGBT chip 5 as much as possible. Through the design of the air cooling holes opened on the liquid cooling plate, the flow rate of the liquid inside the liquid cooling plate can be increased within the same time when the power of the hydraulic pump remains unchanged. The reason is that in the law of conservation of energy, when the work done remains unchanged, the flow The physical principle is that as the mass of the liquid decreases, the speed increases, thereby taking away more heat, improving the heat dissipation efficiency of the liquid cooling plate, and reducing material loss and material cost. It can also increase the flow rate of gas through smaller air-cooling holes, increase the effect of air-cooling heat dissipation, and improve the heat dissipation efficiency of the heat exchanger. Through the cooperation of the liquid cooling system and the air cooling system, the IGBT can be cooled by the liquid cooling system alone, and the IGBT can be cooled by air cooling alone. At the same time, the IGBT can also be efficiently cooled by both liquid cooling and air cooling systems. Through the cooperation of the microprocessor module and the temperature sensing module, the heat dissipation mode can be adjusted according to the real-time temperature of the IGBT to save heat dissipation energy. It can not only efficiently complete the heat dissipation task, but also save energy consumption costs.

[0044] Embodiment 2

[0045] In this embodiment, since the temperature of the IGBT chip 5 changes all the time, it is difficult to timely adjust the heat dissipation efficiency of the heat dissipation system through the monitoring of the staff, thereby causing energy consumption waste due to the inability to adjust the energy consumption in time. Please refer to Fig. 9 - Fig.12This embodiment proposes a high-power IGBT integrated liquid cooling and heat dissipation system, which can timely detect the temperature change of the IGBT chip 5 and adjust the power in time according to the change. The system includes a microprocessor module 6, and the liquid cooling and heat dissipation system also includes a temperature sensing module 7, a control module 8 and a power supply module 9. The temperature sensing module 7 is composed of a temperature sensing chip, a voltage dividing resistor R3 and a 3.3V external power supply. The temperature sensing chip transmits a temperature sensing signal to 6 through the DATA port. The 3.3V external power supply is connected to the DATA port through the voltage dividing resistor R3. The control module 8 is composed of a first control circuit, a second control circuit, and a hydraulic The hydraulic pump and the motor are composed of a first control circuit connected to the hydraulic pump, and the second control circuit is connected to the motor. The first control circuit is composed of a current limiting resistor R4, a transistor Q1, a single-phase diode D1, a relay switch and a control power supply. The current limiting resistor R4 is connected to the base of the transistor Q1, and the collector of the transistor Q1 is connected to the hydraulic pump through the relay switch. The single-phase diode D1 and the relay switch are connected in parallel, and the control power supply is connected to the hydraulic pump through the relay switch. The first control circuit and the second control circuit have the same structure. The model of the temperature sensing chip is DS18B20, and the model of the processing chip is ESP8266.

[0046] The present invention divides the temperature of the IGBT into three levels, namely low heat, medium heat and high heat. The low heat range is 20-40 degrees Celsius, the medium heat range is 40-100 degrees Celsius, and the high heat range is 100-120 degrees Celsius. The low heat is dissipated by the air cooling mechanism 2, the medium heat is dissipated by the liquid cooling mechanism 3, and the high heat is dissipated by the air cooling mechanism 2 and the liquid cooling mechanism 3. The temperature of the IGBT is timely detected by the temperature sensing module 7, the temperature of the IGBT is obtained in real time, and the temperature signal is transmitted to the microprocessing module 6. The microprocessing module 6 detects the temperature of the IGBT in real time. The control module 8 starts or adjusts the air cooling mechanism 2 and the liquid cooling mechanism 3 according to the three levels of temperature T, thereby completing the power adjustment. The first control circuit and the second control circuit in the control module 8 have the same structure, which can reduce the complexity of the circuit. Through the cooperation of the microprocessor module, the control module and the temperature sensing module, the ambient temperature of the IGBT can be detected in time, and the heat dissipation power can be quickly adjusted according to the temperature change, thereby avoiding energy waste caused by continuous high-power operation and IGBT damage caused by insufficient heat dissipation due to low power, thereby improving the automation of the heat dissipation system.

[0047] The microprocessor module 6 consists of a processing chip, a current limiting resistor R1 and a current limiting resistor R2. The temperature sensing signal is connected to the D0 port of the processing chip. The D1 interface of the processing chip transmits the first control signal to the outside through the current limiting resistor R1, and the D3 interface of the processing chip transmits the second control signal to the outside through the current limiting resistor R2.

[0048] The present invention can further control the air cooling mechanism 2 and the liquid cooling mechanism 3 to adjust the heat dissipation system through the control of the microprocessor module 6, thereby improving the intelligence and automation of the heat dissipation system and greatly improving the working efficiency of the heat dissipation system.

[0049] Each embodiment in this specification is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the embodiments can be referred to each other. For the above embodiments, since they are basically similar to the method embodiments, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiments.

[0050] The above implementation methods have been described in detail. Specific examples are used herein to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. At the same time, for those skilled in the art, according to the idea of ​​the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A high-power IGBT integrated liquid cooling device, comprising a housing (1), an inner protective housing (4) installed inside the housing (1), and a plurality of IGBT chips (5) installed on the side wall of the inner protective housing (4), characterized in that: A liquid cooling mechanism (3) for liquid cooling and heat dissipation of the IGBT chip (5) is also provided in the housing (1); The liquid cooling mechanism (3) comprises a liquid cooling box (31), a plurality of water pipes (32) are fixedly connected to the side end of the liquid cooling box (31), a heat exchanger (33) having a water inlet and a water outlet is fixedly connected to the bottom end of the water pipe (32), a hydraulic pump (34) is fixedly connected to the water outlet of the heat exchanger (33), a liquid cooling plate (35) for providing a flow space for the coolant is fixedly connected to the side end of the hydraulic pump (34), and the water outlet end of the liquid cooling plate (35) is fixedly connected to the water inlet of the heat exchanger (33).

2. The liquid cooling device according to claim 1, characterized in that: The liquid cooling plate (35) is provided with an air cooling hole (36) for providing air flow space, and the side end of the liquid cooling box (31) is fixedly connected with an exhaust pipe (37) for exhausting air.

3. The liquid cooling device according to claim 1, characterized in that: The heat exchanger (33) is provided with a plurality of grid plates for facilitating heat dissipation, and a control valve is provided on the side wall of the exhaust pipe (37).

4. The liquid cooling device according to claim 1, characterized in that: The housing (1) is provided with an air cooling mechanism (2) for air cooling and dissipating heat for the liquid cooling mechanism (3), the air cooling mechanism (2) comprising an air cooling power bracket (21), a plurality of motors being fixedly connected inside the air cooling power bracket (21), and an air cooling fan blade (22) being fixedly connected to the rotating end of the motor.

5. The liquid cooling device according to claim 4, characterized in that: The side end of the air-cooling power support (21) is fixedly connected to the side end of the heat exchanger (33).

6. A liquid cooling system applied to the high-power IGBT integrated liquid cooling device according to any one of claims 1 to 5, comprising a microprocessor module (6), characterized in that: The liquid cooling and heat dissipation system further comprises a temperature sensing module (7), a control module (8) and a power supply module (9); The temperature sensing module (7) is composed of a temperature sensing chip, a voltage divider resistor R3 and a 3.3V external power supply. The temperature sensing chip transmits a temperature sensing signal to 6 via a DATA port, and the 3.3V external power supply is connected to the DATA port via a voltage divider resistor R3. The control module (8) is composed of a first control circuit, a second control circuit, a hydraulic pump and an electric motor. The first control circuit is connected to the hydraulic pump, and the second control circuit is connected to the electric motor.

7. The liquid cooling system according to claim 6, characterized in that: The first control circuit is composed of a current limiting resistor R4, a transistor Q1, a unidirectional diode D1, a relay switch and a control power supply. The current limiting resistor R4 is connected to the base of the transistor Q1, the collector of the transistor Q1 is connected to the hydraulic pump through the relay switch, the unidirectional diode D1 and the relay switch are connected in parallel, and the control power supply is connected to the hydraulic pump through the relay switch. The first control circuit is the same as the second control circuit.

8. The liquid cooling system according to claim 6, characterized in that: The microprocessing module (6) is composed of a processing chip, a current limiting resistor R1 and a current limiting resistor R2. The temperature sensing signal is connected to the D0 port of the processing chip. The D1 interface of the processing chip transmits a first control signal to the outside through the current limiting resistor R1. The D3 interface of the processing chip transmits a second control signal to the outside through the current limiting resistor R2.

9. The liquid cooling system according to claim 6, characterized in that: The model of the temperature sensing chip is DS18B20, and the model of the processing chip is ESP8266.

Images