Display panel, preparation method and display device

Abstract

The embodiment of the invention provides a display panel, a preparation method and a display device.The display panel comprises a substrate, the substrate is provided with a wiring area used for binding a driving chip, the wiring area is used for binding the driving chip through a conductive adhesive layer, and the conductive adhesive layer comprises conductive particles; the wiring area is provided with a first wire, a second wire and a plurality of wiring pins, at least parts of orthographic projections of the first wire and the second wire on the substrate are overlapped, and the overlapped parts form the wiring pins; wherein the wiring region is provided with an aggregation region for aggregating the conductive particles. According to the technology of the embodiment of the invention, not only is the yield of the display panel improved, but also the manufacturing cost of the display panel is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of display products, and in particular to a display panel, a preparation method and a display device. Background Art

[0002] At present, the market demand for high-end display products such as QHD (Quad High Definition) and UHD (Ultra High Definition) is gradually increasing, and the PPI (Pixels Per Inch) of display products of the same size is increasing simultaneously. Display products need to bind the display substrate to the integrated circuit (IC) so that the display substrate can display normally. For QHD or UHD display products, the number of pins in the binding area of ​​the display substrate increases and is more densely distributed, and the spacing between the pins is smaller.

[0003] In the related art, anisotropic conductive film (ACF) is usually used to bind the integrated circuit to the display substrate. However, in the actual binding process, the conductive particles in the ACF are easily gathered between adjacent pins and conduct each other, resulting in short circuits between the pins and poor signals, affecting the yield of the display product. Summary of the invention

[0004] Embodiments of the present application provide a display panel, a manufacturing method, and a display device to solve or alleviate one or more technical problems in the prior art.

[0005] In a first aspect, an embodiment of the present application provides a display panel, including a substrate, the substrate being provided with a wiring area for binding a driving chip, the wiring area being used to bind the driving chip through a conductive adhesive layer, the conductive adhesive layer comprising conductive particles; the wiring area being provided with a first routing line, a second routing line and a plurality of wiring pins, the orthographic projections of the first routing line and the second routing line on the substrate at least partially overlapping, the overlapping portion forming a wiring pin; wherein the wiring area being provided with a gathering area for gathering the conductive particles.

[0006] In one embodiment, the display panel includes a first metal layer, a first insulating layer, a second metal layer, a second insulating layer and a conductive layer stacked in a wiring area and in a direction away from the substrate; wherein the first routing line is formed in the first metal layer and the second routing line is formed in the second metal layer.

[0007] In one embodiment, the gathering area includes a first gathering area; a stop protrusion is provided between two adjacent connection pins, and opposite sides of the stop protrusion respectively form the first gathering area.

[0008] In one embodiment, two first grooves spaced apart from each other are provided between two adjacent connection pins, the first gathering area is defined by the first grooves, and the stop protrusion is formed between the two first grooves.

[0009] In one embodiment, the first groove is disposed through the conductive layer, the second metal layer and the first metal layer.

[0010] In one embodiment, the depth of the first groove is 0.6 to 1.0 um, and the width of the first groove is 3 to 3.5 um.

[0011] In one embodiment, a plurality of connection pins are arranged into a plurality of rows along a first direction, each row includes a plurality of connection pins arranged at intervals along a second direction, and the first direction is perpendicular to the second direction; wherein a stop protrusion is provided between two adjacent connection pins in the first direction and / or the second direction.

[0012] In one embodiment, a second groove is provided on a surface of the connection pin away from the substrate, and the second groove defines a second gathering area for gathering the conductive particles.

[0013] In one embodiment, the second groove is disposed through the conductive layer and the second metal layer.

[0014] In one embodiment, the depth of the second groove is 0.3 to 0.5 um, and the width of the second groove is 10 to 15 um.

[0015] In one embodiment, the first metal layer is a gate metal layer, the second metal layer is a source and drain metal layer, and the material of the conductive layer includes indium tin oxide; the first insulating layer is provided with a first via hole, and the second metal layer is electrically connected to the first metal layer through the first via hole; the second insulating layer is provided with a second via hole, and the conductive layer is electrically connected to the second metal layer through the second via hole.

[0016] In one embodiment, the diameter of the conductive particles is 2 to 4 um, and the conductive particles include a conductive portion and an insulating portion surrounding the conductive portion, and the insulating portion is broken under a preset condition to expose the conductive portion.

[0017] In a second aspect, an embodiment of the present application provides a method for preparing a display panel, comprising:

[0018] Sequentially preparing a first metal layer, a first insulating layer, a second metal layer, a second insulating layer, and a conductive layer in a wiring area of ​​the substrate to form a first wiring, a second wiring, and a wiring pin;

[0019] A stop protrusion is formed between two adjacent connection pins through an etching process to form a first aggregation area for gathering conductive particles on opposite sides of the stop protrusion; and / or a second groove is formed on the surface of the connection pin away from the substrate through an etching process, and the second groove defines a second aggregation area for gathering conductive particles.

[0020] In a third aspect, an embodiment of the present application further provides a display device, comprising a display panel of any one of the above-mentioned embodiments of the present application.

[0021] According to the display panel of the embodiment of the present application, by setting a gathering area for gathering conductive particles in the wiring area, the probability of conductive particles gathering between the wiring pins is reduced, which is conducive to reducing the probability of short circuits between the wiring pins, thereby reducing the occurrence of poor signal phenomena and improving the yield rate of the display panel. Secondly, the conductive adhesive layer of the embodiment of the present application can use conventional ACF adhesive with a higher density of conductive particles. Since the cost of conventional ACF adhesive is much lower than that of array ACF adhesive, the manufacturing cost of the display panel is significantly reduced.

[0022] The above summary is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present application will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the multiple drawings represent the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings only depict some embodiments disclosed in the present application and should not be regarded as limiting the scope of the present application.

[0024] Figure 1 A top view of a display panel according to an embodiment of the present application is shown;

[0025] Figure 2 Show Figure 1 Sectional view at AA in the middle;

[0026] Figure 3 A top view of a display panel according to another embodiment of the present application is shown;

[0027] Figure 4 Show Figure 3 Cross-section at the middle BB;

[0028] Figure 5 A top view of a display panel according to another embodiment of the present application is shown;

[0029] Figure 6 Show Figure 5Sectional view at CC;

[0030] Figure 7 A flow chart showing a method for manufacturing a display panel according to an embodiment of the present application is shown.

[0031] Description of reference numerals:

[0032] Display panel 1; wiring area 1a;

[0033] Substrate 10; first gathering area 101; second gathering area 102; first wiring 11; second wiring 12; connection pin 13; stop protrusion 14; first groove 15; second groove 16;

[0034] The first metal layer 20 , the first insulating layer 30 , the first via hole 31 , the second metal layer 40 , the second insulating layer 50 , the second via hole 51 , the conductive layer 60 , and the conductive particles 70 . DETAILED DESCRIPTION

[0035] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the present application. Therefore, the drawings and descriptions are considered to be exemplary and non-restrictive in nature.

[0036] Figure 1 A top view of a display panel 1 according to an embodiment of the present application is shown. Figure 2 Show Figure 1 The cross-section diagram at AA in the figure. Figure 1 and Figure 2 As shown, the display panel 1 includes a substrate 10, and the substrate 10 is provided with a wiring area 1a for binding a driving chip. The wiring area 1a is used to bind the driving chip through a conductive adhesive layer, and the conductive adhesive layer includes conductive particles 70; the wiring area 1a is provided with a first routing line 11, a second routing line 12 and a plurality of wiring pins 13, and at least part of the orthographic projections of the first routing line 11 and the second routing line 12 on the substrate 10 overlap, and the overlapping part forms the wiring pins 13; wherein, the wiring area 1a is provided with a gathering area for gathering the conductive particles 70.

[0037] In the embodiment of the present application, the substrate 10 may be an array substrate 10, and the wiring area 1a may be a source signal binding area of ​​the array substrate 10 for binding a driver chip (integrated circuit). The conductive adhesive layer may be an anisotropic conductive film (ACF). It is understood that the anisotropic conductive film includes a thermosetting colloid and a plurality of conductive particles 70, and the plurality of conductive particles 70 are evenly or unevenly distributed in the thermosetting colloid.

[0038] Exemplarily, the diameter of the conductive particles 70 can be 2 to 4 um, and the conductive particles 70 include a conductive part and an insulating part surrounding the outside of the conductive part, and the insulating part is broken under a preset condition to expose the conductive part. Specifically, in the process of binding the driver chip to the substrate 10, by setting an anisotropic conductive film between the two, and under the conditions of high temperature and pressure, the insulating part on the outside of the conductive particles 70 is broken, resulting in the inner conductive part being exposed, and the exposed conductive part is in contact with the electrode of the driver chip and the wiring pin 13 of the wiring area 1a, respectively, so as to achieve electrical conduction between the electrode of the driver chip and the wiring pin 13 of the wiring area 1a.

[0039] It should be noted that in the initial state of the conventional anisotropic conductive film, the conductive particles 70 are randomly scattered. Because the overall density of the conductive particles 70 is subject to specification, the conductive particles 70 are generally not in direct contact, but there may be a situation where there are more conductive particles 70 in a local position. For a high-resolution display panel 1, the arrangement of the wiring pins 13 is more dense, especially for a QHD or UHD display panel 1. Because the PPI is significantly improved at the same size, the wiring pins 13 in the wiring area 1a are gradually developed from the original two-row arrangement to a three-row arrangement (such as Figure 1 As shown in FIG. 1 , the distance between adjacent wiring pins 13 is smaller. In addition, since the wiring pins 13 are convex structures relative to the plane of the substrate 10, the area between adjacent wiring pins 13 forms a concave area. During the process of binding the driver chip to the substrate 10, the conductive particles 70 in the anisotropic conductive adhesive film move to the gap between adjacent wiring pins 13 under the action of pressure, causing a plurality of conductive particles 70 to accumulate between adjacent wiring pins 13. Under the action of pressure, the conductive particles 70 are broken, thereby causing the adjacent wiring pins 13 to be electrically conductive, resulting in a short circuit between the wiring pins 13, and then causing a poor signal phenomenon.

[0040] In order to avoid the above phenomenon, the related art can use array ACF glue as the conductive glue layer. The density of the conductive particles 70 in the array ACF glue is low and evenly distributed, which can ensure that the number of conductive particles 70 contacted by each wiring pin 13 is roughly the same, thereby avoiding the two situations of cold soldering between the driver chip and the substrate 10 and the aggregation of the conductive particles 70. However, due to the special manufacturing process of the array ACF glue, its manufacturing cost is much higher than that of conventional ACF glue, resulting in excessively high manufacturing costs of the display panel 1.

[0041] In some examples, the gathering area may be disposed between adjacent connection pins 13. Between adjacent connection pins 13, there may be two gathering areas disposed at intervals to avoid mutual contact between the conductive particles 70 gathered in the two gathering areas.

[0042] In other examples, the aggregation area may be disposed on the surface of the connection pins 13 so that the conductive particles 70 are aggregated on the connection pins 13 themselves, thereby reducing the distribution of the conductive particles 70 between adjacent connection pins 13 .

[0043] According to the display panel 1 of the embodiment of the present application, by setting a gathering area for gathering the conductive particles 70 in the wiring area 1a, the probability of the conductive particles 70 gathering between the connection pins 13 is reduced, which is conducive to reducing the probability of short circuits between the connection pins 13, thereby reducing the occurrence of poor signal phenomena and improving the yield rate of the display panel 1. Secondly, the conductive adhesive layer of the embodiment of the present application can use conventional ACF adhesive with a higher density of conductive particles 70. Since the cost of conventional ACF adhesive is much lower than that of array ACF adhesive, the manufacturing cost of the display panel 1 is significantly reduced.

[0044] In one embodiment, Figure 2 , Figure 4 and Figure 6 As shown, the display panel 1 includes a first metal layer 20, a first insulating layer 30, a second metal layer 40, a second insulating layer 50 and a conductive layer 60 which are stacked in a wiring area 1a and in a direction away from the substrate 10. Among them, the first wiring 11 is formed in the first metal layer 20, and the second wiring 12 is formed in the second metal layer 40. Specifically, the first metal layer 20 is a gate metal layer, the second metal layer 40 is a source and drain metal layer, and the material of the conductive layer 60 includes indium tin oxide (Indium Tin Oxide, ITO); the first insulating layer 30 is provided with a first via hole 31, and the second metal layer 40 is electrically connected to the first metal layer 20 through the first via hole 31; the second insulating layer 50 is provided with a second via hole 51, and the conductive layer 60 is electrically connected to the second metal layer 40 through the second via hole 51.

[0045] Exemplarily, the first insulating layer 30 may be a gate insulating layer, and the first insulating layer 30 covers the side of the first metal layer 20 away from the substrate 10 to achieve insulation protection for the gate metal layer. The second insulating layer 50 may be a source-drain insulating layer, and the second insulating layer 50 covers the side of the second metal layer 40 away from the substrate 10 to achieve insulation protection for the source-drain metal layer. The first wiring 11 is formed in the gate metal layer and may be a gate signal line, and the second wiring 12 is formed in the source-drain metal layer and may be a source-drain signal line. It can be understood that the first via 31 is arranged through the first insulating layer 30, and a portion of the second metal layer 40 is arranged through the first via 31 and extends to the first metal layer 20, so that the second metal layer 40 is electrically connected to the first metal layer 20; the second via 51 is arranged through the second insulating layer 50, and a portion of the conductive layer 60 is arranged through the second via 51 and extends to the second metal layer 40, so that the conductive layer 60 is electrically connected to the second metal layer 40.

[0046] In one embodiment, Figure 1 and Figure 2 As shown, the gathering area includes a first gathering area 101 ; a stop protrusion 14 is provided between two adjacent connection pins 13 , and opposite sides of the stop protrusion 14 respectively form the first gathering area 101 .

[0047] Exemplarily, the stop protrusion 14 is formed at the middle position between two adjacent connection pins 13, and two first gathering areas 101 spaced apart from each other are formed on opposite sides of the stop protrusion 14. The ratio of the height of the stop protrusion 14 to the diameter of the conductive particle 70 can be 0.2 to 0.4. For example, the diameter of the conductive particle 70 can be 2 to 4 um, and the height of the stop protrusion 14 can be about 0.8 um.

[0048] Through the above-mentioned embodiment, the gap between adjacent wiring pins 13 can be divided into two first aggregation areas 101 spaced apart from each other by the stop protrusions 14 set between adjacent wiring pins 13, thereby guiding the conductive particles 70 to move toward the first aggregation areas 101 during the binding process, and the stop protrusions 14 can block the conductive particles 70 gathered in the two first aggregation areas 101, thereby avoiding contact between the conductive particles 70 in the two first aggregation areas 101.

[0049] In the embodiment of the present application, the conductive layer 60 of the first gathering area 101 is removed accordingly to expose the second insulating layer 50 in the first gathering area 101 , so that the conductive particles 70 gathered in the first gathering area 101 are in contact with the second insulating layer 50 .

[0050] In some examples, the stop protrusion 14 can be formed by the second insulating layer 50 protruding in a direction away from the substrate 10. Specifically, during the preparation of the display panel 1, after the second insulating layer 50 is prepared on the second metal layer 40, a certain thickness of the second insulating layer 50 at the first gathering area 101 can be removed by an etching process, so that the portion of the second insulating layer 50 located between two adjacent first gathering areas 101 forms the stop protrusion 14.

[0051] In other examples, two first grooves 15 spaced apart from each other are provided between two adjacent connection pins 13, the first gathering area 101 is defined by the first grooves 15, and the stop protrusion 14 is formed between the two first grooves 15. Specifically, the first gathering area 101 can be formed on the surface of the second insulating layer 50 facing away from the substrate 10, and the first metal layer 20, the second metal layer 40 and the conductive layer 60 are all removed in the first gathering area 101 accordingly, so that the first gathering area 101 is formed into a groove structure, and a raised stop protrusion 14 is formed between the two first gathering areas 101.

[0052] In the embodiment of the present application, the height of the stop protrusion 14 may be substantially the same as the sum of the thicknesses of the first metal layer 20 and the second metal layer 40. For example, the thicknesses of the first metal layer 20 and the second metal layer 40 may be approximately 0.4 um respectively, and the height of the stop protrusion 14 may be approximately 0.8 um.

[0053] Optionally, the first groove 15 is provided through the conductive layer 60 , the second metal layer 40 and the first metal layer 20 .

[0054] Exemplarily, during the preparation of the display panel 1, after the first metal layer 20 is prepared, the portion of the first metal layer 20 that is opposite to the first gathering area 101 is removed by an etching process; then, the first insulating layer 30 and the second metal layer 40 are prepared in sequence, and the portion of the second metal layer 40 that is opposite to the first gathering area 101 is removed by an etching process; finally, the second insulating layer 50 and the conductive layer 60 are prepared, and the portion of the conductive layer 60 that is opposite to the first gathering area 101 is removed by an etching process, thereby forming two corresponding first grooves 15 at the two first gathering areas 101 between adjacent wiring pins 13.

[0055] Optionally, the depth of the first groove 15 is 0.6 to 1.0 um, and the width of the first groove 15 is 3 to 3.5 um.

[0056] Preferably, the depth of the first groove 15 can be 0.8um, and accordingly, the height of the stop protrusion 14 is also 0.8um; the width of the first groove 15 can be 3.2um. The width of the first groove 15 refers to the size of the first groove 15 in the direction opposite to two adjacent first protrusions.

[0057] In one embodiment, if Figure 1 As shown, a plurality of connection pins 13 are arranged into a plurality of rows along a first direction X, each row includes a plurality of connection pins 13 arranged at intervals along a second direction Y, and the first direction X is perpendicular to the second direction Y; wherein a stop protrusion 14 is provided between two adjacent connection pins 13 in the first direction X and / or the second direction Y.

[0058] In the embodiment of the present application, the first direction X may be the length direction of the substrate 10, and the second direction Y may be the width direction of the substrate 10. A plurality of connection pins 13 are arranged in a plurality of rows along the first direction X, and the plurality of rows of connection pins 13 are arranged at intervals in the second direction Y, and each row includes a plurality of connection pins 13 arranged at intervals along the first direction X. The length direction of the connection pins 13 is parallel to the second direction Y.

[0059] In some examples, a stop protrusion 14 is respectively disposed between any two adjacent connection pins 13 in the first direction X, so as to form two first gathering areas 101 spaced apart from each other between the two adjacent connection pins 13 .

[0060] In some other examples, a stop protrusion 14 is respectively disposed between any two adjacent connection pins 13 in the second direction Y, so as to form two first gathering areas 101 spaced apart from each other between the two adjacent connection pins 13 .

[0061] In some other examples, a stop protrusion 14 is provided between any two adjacent connection pins 13 in the first direction X and any two adjacent connection pins 13 in the second direction Y, so that two first gathering areas 101 spaced apart from each other are formed between two adjacent connection pins 13 in the first direction X and the second direction Y.

[0062] It should be noted that the specific setting position of the stop protrusion 14 can be flexibly set by those skilled in the art according to actual conditions. For example, when the distance between two adjacent connection pins 13 in the first direction X is smaller than the distance between two adjacent connection pins 13 in the second direction Y, the stop protrusion 14 can be set between any two adjacent connection pins 13 in the first direction X. For another example, when the distance between two adjacent connection pins 13 in the second direction Y is smaller than the distance between two adjacent connection pins 13 in the first direction X, the stop protrusion 14 can be set between any two adjacent connection pins 13 in the second direction Y.

[0063] In one embodiment, a second groove 16 is disposed on a surface of the connection pin 13 away from the substrate 10 , and the second groove 16 defines a second gathering area 102 for gathering the conductive particles 70 .

[0064] Exemplarily, the portion of the conductive layer 60 of the connection pin 13 facing the second gathering area 102 can be removed accordingly to expose the second insulating layer 50 in the first gathering area 101 , thereby allowing the conductive particles 70 gathered in the second gathering area 102 to contact the second insulating layer 50 .

[0065] In some examples, the second groove 16 is provided through the conductive layer 60 and the second metal layer 40. Specifically, the conductive layer 60 and the second metal layer 40 of the connection pin 13 that are opposite to the second gathering area 102 are removed accordingly, so as to form the second groove 16 corresponding to the second gathering area 102 on the surface of the connection pin 13 away from the substrate 10. More specifically, in the preparation process of the display panel 1, after the first metal layer 20, the first insulating layer 30 and the second metal layer 40 are prepared, the portion of the second metal layer 40 that is opposite to the second gathering area 102 is removed by an etching process; then, the second insulating layer 50 and the conductive layer 60 are prepared in sequence, and the portion of the conductive layer 60 that is opposite to the second gathering area 102 is removed by an etching process, so as to form the second groove 16 on the surface of the connection pin 13 away from the substrate 10. Among them, the depth of the second groove 16 can be 0.3 to 0.5um, and the width of the second groove 16 can be 10 to 15um.

[0066] In some other examples, the second groove 16 penetrates the conductive layer 60, the second metal layer 40 and the first metal layer 20. Specifically, the conductive layer 60, the second metal layer 40 and the first metal layer 20 of the connection pin 13 that are opposite to the second gathering area 102 are removed accordingly, so as to form the second groove 16 corresponding to the second gathering area 102 on the surface of the connection pin 13 away from the substrate 10. More specifically, in the preparation process of the display panel 1, after the first metal layer 20 is prepared, the portion of the first metal layer 20 of the connection pin 13 that is opposite to the second gathering area 102 is removed by an etching process; then, the first insulating layer 30 and the second metal layer 40 are prepared in sequence, and the portion of the second metal layer 40 that is opposite to the second gathering area 102 is removed by an etching process; finally, the second insulating layer 50 and the conductive layer 60 are prepared, and the portion of the conductive layer 60 that is opposite to the second gathering area 102 is removed by an etching process, so as to form the second groove 16 on the surface of the connection pin 13 away from the substrate 10. The depth of the second groove 16 may be 0.7 to 0.9 um, and the width of the second groove 16 may be 10 to 15 um.

[0067] According to another aspect of the embodiments of the present application, a method for preparing a display panel is also provided, which is used to prepare the display panel of any one of the above embodiments of the present application. Figure 7 A flow chart showing a method for preparing a display panel according to an embodiment of the present application is shown in FIG. Figure 7 As shown, the preparation method of the embodiment of the present application includes:

[0068] Step S101: sequentially preparing a first metal layer, a first insulating layer, a second metal layer, a second insulating layer and a conductive layer in a line region to form a first line, a second line and a connection pin;

[0069] Step S102: forming a stop protrusion between two adjacent connection pins through an etching process to form a first aggregation area for aggregating conductive particles on opposite sides of the stop protrusion; and / or forming a second groove on the surface of the connection pin away from the substrate through an etching process, the second groove defining a second aggregation area for aggregating conductive particles.

[0070] According to the method for preparing a display panel in an embodiment of the present application, by preparing a stop protrusion between two adjacent wiring pins to form two first gathering areas spaced apart from each other through the stop protrusion, and / or preparing a second groove on the surface of the wiring pin away from the substrate to form a second gathering area, the conductive particles of the conductive adhesive layer can be guided to the first gathering area and / or the second gathering area during the process of binding the driver chip, thereby reducing the probability of the conductive particles gathering between the wiring pins, which is beneficial to reducing the probability of short circuits between the wiring pins, thereby reducing the occurrence of poor signals and improving the yield rate of the display panel. Secondly, the preparation method in an embodiment of the present application can use conventional ACF glue with a higher density of conductive particles to bind the driver chip. Since the cost of conventional ACF glue is much lower than that of array ACF glue, the manufacturing cost of the display panel is significantly reduced.

[0071] According to another aspect of an embodiment of the present application, a display device is further provided, comprising the display panel of the above embodiment of the present application.

[0072] In addition, other components of the display device in the above embodiment may adopt various technical solutions known to ordinary technicians in this field now and in the future, and will not be described in detail here.

[0073] In the description of this specification, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0074] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0075] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0076] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0077] The disclosure above provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described above. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numerals and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed.

[0078] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of various changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A display panel, It is characterized in that The invention comprises a substrate, wherein the substrate is provided with a wiring area for binding a driver chip, wherein the wiring area is used to bind the driver chip through a conductive adhesive layer, wherein the conductive adhesive layer comprises conductive particles; the wiring area is provided with a first routing line, a second routing line and a plurality of wiring pins, wherein at least a part of the orthographic projections of the first routing line and the second routing line on the substrate overlap, and the overlapping part forms the wiring pins; Wherein, the wiring area is provided with a gathering area for gathering the conductive particles.

2. The display panel according to claim 1, It is characterized in that The display panel includes a first metal layer, a first insulating layer, a second metal layer, a second insulating layer and a conductive layer stacked in the wiring area and in a direction away from the substrate; wherein the first routing line is formed in the first metal layer, and the second routing line is formed in the second metal layer.

3. The display panel according to claim 2, It is characterized in that The gathering area includes a first gathering area; a stop protrusion is arranged between two adjacent connection pins, and the first gathering areas are formed on opposite sides of the stop protrusion respectively.

4. The display panel according to claim 3, It is characterized in that Two first grooves spaced apart from each other are arranged between two adjacent connection pins, the first gathering area is defined by the first grooves, and the stop protrusion is formed between the two first grooves.

5. The display panel according to claim 4, It is characterized in that The first groove is disposed through the conductive layer, the second metal layer and the first metal layer.

6. The display panel according to claim 4, It is characterized in that The depth of the first groove is 0.6 to 1.0 um, and the width of the first groove is 3 to 3.5 um.

7. The display panel according to claim 3, It is characterized in that The plurality of connection pins are arranged in a plurality of rows along a first direction, each row includes a plurality of connection pins arranged at intervals along a second direction, and the first direction is perpendicular to the second direction; Wherein, the stop protrusion is arranged between two adjacent connection pins in the first direction and / or the second direction.

8. The display panel according to claim 2, It is characterized in that A second groove is provided on a surface of the connection pin away from the substrate, and the second groove defines a second gathering area for gathering the conductive particles.

9. The display panel according to claim 8, It is characterized in that The second groove is disposed through the conductive layer and the second metal layer.

10. The display panel according to claim 8, It is characterized in that The depth of the second groove is 0.3 to 0.5 um, and the width of the second groove is 10 to 15 um.

11. The display panel according to any one of claims 2 to 10, It is characterized in that The first metal layer is a gate metal layer, the second metal layer is a source and drain metal layer, and the conductive layer is made of indium tin oxide; the first insulating layer is provided with a first via hole, and the second metal layer is electrically connected to the first metal layer through the first via hole; the second insulating layer is provided with a second via hole, and the conductive layer is electrically connected to the second metal layer through the second via hole.

12. The display panel according to any one of claims 1 to 10, It is characterized in that The diameter of the conductive particles is 2 to 4 um. The conductive particles include a conductive part and an insulating part surrounding the conductive part. The insulating part is broken under a preset condition to expose the conductive part.

13. A method for preparing a display panel, It is characterized in that include: Sequentially preparing a first metal layer, a first insulating layer, a second metal layer, a second insulating layer, and a conductive layer in a wiring area of ​​the substrate to form a first wiring, a second wiring, and a wiring pin; A stop protrusion is formed between two adjacent connection pins through an etching process to form a first aggregation area for gathering the conductive particles on opposite sides of the stop protrusion; and / or a second groove is formed on the surface of the connection pin away from the substrate through an etching process, and the second groove defines a second aggregation area for gathering the conductive particles.

14. A display device, It is characterized in that The invention comprises the display panel as claimed in any one of claims 1 to 12.

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