A new type of communication vehicle integrated system
By using a modular equipment platform and Category 5 bus design, the problems of cable redundancy and clock synchronization in traditional communication vehicles are solved, enabling equipment health management and nanosecond-level clock synchronization, thereby improving system expansion efficiency and communication quality.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- THE 54TH RESEARCH INSTITUTE OF CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION
- Filing Date
- 2025-02-25
- Publication Date
- 2026-05-19
AI Technical Summary
Traditional communication vehicles suffer from problems such as redundant cables, difficulty in system expansion, low maintenance efficiency, and poor clock synchronization accuracy, resulting in a large number of cables, large space occupation, severe electromagnetic interference, difficulty in fault location, and poor quality of cooperative communication.
A modular device platform is adopted, and interconnection between devices is achieved through five types of buses (switching, management, clock, cryptography and power buses). Combined with technologies such as LSTM model and quantum random number generator, device health management, nanosecond-level clock synchronization and intelligent dynamic power distribution are realized.
This significantly reduces the number of cables integrated into the communication vehicle, improves system expansion efficiency, reduces fault repair time, and enhances clock synchronization accuracy and communication quality.
Smart Images

Figure CN120074971B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to a novel integrated communication vehicle system, belonging to the field of tactical communication. Background Technology
[0002] Traditional communication vehicles employ a distributed equipment layout and independent wiring mode, which has significant technical drawbacks:
[0003] 1. Cable Redundancy Issue: Taking a certain type of communication vehicle as an example, it needs to integrate 12 types of communication equipment (including switches, servers, encryption machines, etc.). Each device is independently powered and connected point-to-point, resulting in more than 313 cables in the entire vehicle (including 130 power cables and 183 signal cables), with a total weight of 28 kg and occupying 0.2 m of space. 3 .
[0004] 2. Difficulty in system expansion: Adding new equipment requires redesigning the cabling path, and the typical expansion cycle takes more than 72 hours. In addition, the intertwined cables cause electromagnetic interference (tests show that crosstalk between adjacent cables reaches -28dB).
[0005] 3. Low maintenance efficiency: Fault location requires manual inspection segment by segment. Statistical data shows that the average time to repair a fault (MTTR) is as long as 4.5 hours, of which 68% of the time is spent on cable inspection.
[0006] 4. Poor clock synchronization accuracy: Each device uses an independent clock source, and the time deviation of the entire network exceeds ±500μs, which seriously affects the quality of collaborative communication. Summary of the Invention
[0007] To address the aforementioned problems, this invention discloses a novel communication vehicle integration system, which achieves a revolutionary approach to communication vehicle integration through two-level reconstruction at the physical and protocol layers:
[0008] A novel communication vehicle integrated system includes: a modular equipment carrier platform, which is composed of a 6061-T6 aluminum alloy frame and has a three-layer structure comprising an upper equipment installation area, a middle platform bus area, and a lower cooling fan area;
[0009] The upper-level equipment installation area integrates standardized equipment interfaces, including a shock-resistant locking mechanism and a 48-pin military connector, enabling blind-plug installation of modular equipment.
[0010] The five types of buses integrated within the middle-layer platform bus area are:
[0011] a) Switching bus: The modular device platform integrates switching modules and a switching bus; the switching modules construct a star topology network through the switching bus to send and receive services and support VLAN isolation;
[0012] b) Management Bus: The modular device platform integrates a management module and a management bus; the management module interacts with the management agent module of the modular device through the management bus, based on the device management protocol and device management messages, to achieve device health monitoring;
[0013] c) Clock bus: The modular device carrier platform integrates a clock module and a clock bus. The clock module interacts with the clock agent module of the modular device through the clock bus, based on the device clock protocol and device clock messages, to achieve nanosecond-level synchronization.
[0014] d) Cryptographic bus: The modular device carrier platform integrates a cryptographic module and a cryptographic bus. The cryptographic module interacts with the cryptographic proxy module of the modular device through the cryptographic bus, based on the device cryptographic protocol and device cryptographic messages. It supports SM2 / SM4 / SM9 encryption algorithms.
[0015] e) Power bus: The modular device carrier platform integrates power modules and power buses. The power modules interact with the power agent modules of the modular devices through the power bus, based on the device power protocol and device power messages, to support dynamic power distribution.
[0016] The lower cooling fan area integrates cooling fans and heat dissipation channels to achieve heat dissipation for modular equipment.
[0017] Furthermore,
[0018] The device management protocol interaction process is as follows:
[0019] Step 101: After the modular device is powered on, the management agent module sends a discovery message to the management module via broadcast, reporting that the modular device has been powered on and its status information after power-on, including temperature (T), voltage (V), vibration (G), CPU load (L), memory utilization (M), and packet loss rate (P).
[0020] Step 102: After receiving the discovery message from the modular device, the management module sends a polling message to the management module every 30 seconds by default to query the status information of the modular device.
[0021] Step 103: After receiving the polling message from the management module, the management agent module replies with a status report message, reporting the status information of the modular device, including temperature (T), voltage (V), vibration (G), CPU load (L), memory utilization (M), and packet loss rate (P).
[0022] Step 104: Based on the status information received from the management module, the management module dynamically constructs a modular device health model. The modular device health calculation formula is as follows:
[0023] Y = a * X T+b*X V +c*X G +d*X L +e*X M +f*X P
[0024] Among them, X T X V X G X L X M X P These are the changes in temperature (T), voltage (V), vibration (G), CPU load (L), memory utilization (M), and packet loss rate (P) for the most recent two times, respectively, with a, b, c, d, e, and f being the corresponding weighting coefficients.
[0025] Step 105: The management module dynamically adjusts the polling interval based on the modular device health status. The polling interval is set as follows:
[0026]
[0027]
[0028] Step 106: The management module uses an LSTM model to predict the probability of failure (0-100%) of the modular device in the next 24 hours based on the received modular device temperature (T), voltage (V), vibration (G), CPU load (L), memory utilization (M), and packet loss rate (P).
[0029] Step 107: If the predicted probability of modular equipment failure is ≥80%, an alarm will be sent to the user to remind them to conduct an inspection or replace the equipment as soon as possible.
[0030] Device management messages are carried on Ethernet packets, with the Ethernet packet type field being 0x88D2. Device management messages include: discovery messages, polling messages, and status report messages.
[0031] Furthermore,
[0032] The device clock protocol interaction includes:
[0033] Step 201, the clock module periodically (synchronization interval T) new =2 seconds, basic period) to send a device clock message carrying timestamp t1;
[0034] Step 202: The clock proxy module records the message arrival time t2;
[0035] Step 203: After a random delay (between 0 and 1 millisecond), the clock agent sends a device clock message carrying timestamp t3.
[0036] Step 204: The clock module returns a device clock message carrying timestamp t4.
[0037] Step 205: The clock proxy module records the message arrival time t4, calculates the clock deviation OS_raw=(t2-t1-t4+t3) / 2, calculates the path delay DL=(t2-t1+t4-t3) / 2, and calculates the network jitter Jitter=|(t2-t1)-(t4-t3)|;
[0038] Step 206: Calculate the optimal synchronization interval T in real time based on network jitter and clock skew (OS). new =T base *(1+α*|OS_raw|+β*Jitter), and adjust the subsequent clock synchronization interval.
[0039] Wherein: T base = 2 seconds (base cycle), α = 0.1 (deviation weighting coefficient), β = 0.05 (jitter weighting coefficient)
[0040] Step 207: Calculate the temperature drift compensation amount T_T = k1*(T_current - T_cal) + k2*(T_current - T_cal) 2
[0041] Wherein, T_current is the ambient temperature value of the device acquired in real time by a temperature sensor, and T_cal is the reference temperature calibrated under standard laboratory conditions (e.g., 25℃), used to calculate the temperature deviation. k1 is the first-order temperature compensation coefficient (unit: ns / ℃), used to describe the linear effect of temperature changes on clock deviation, set to k1 = 0.05ns / ℃ (meaning that for every 1℃ increase, the clock deviation increases linearly by 0.05ns). k2 is the second-order temperature compensation coefficient (unit: ns / ℃²), used to describe the nonlinear effect of temperature changes (e.g., the frequency-temperature curve of a crystal oscillator exhibits parabolic characteristics), set to k2 = 0.001ns / ℃² (meaning that for every 1℃ deviation of the temperature from T_cal, the nonlinear deviation increases by 0.001ns).
[0042] Step 208: Calculate the phase noise compensation caused by the vibration of the communication vehicle. The calculation formula is as follows:
[0043] T_V=∫(a(t)*K)dt
[0044] (a(t) is the real-time vibration acceleration collected by an accelerometer (such as a MEMS triaxial accelerometer), and K is the vibration-time deviation conversion coefficient (unit: ns / g), which is used to describe the cumulative effect of unit vibration acceleration on clock deviation. The default K = 0.1 ns / g)
[0045] Step 209: Correct the local clock to achieve time synchronization with the clock module, ensuring dynamic adaptation to the network environment and maintaining clock synchronization accuracy. The calculation formula is as follows:
[0046] OS_corrected=OS_raw-(T_T+T_V)
[0047] Where OS_raw is the calculated uncorrected clock skew (in ns), and OS_corrected is the corrected clock skew (in ns).
[0048] The device clock message is carried on an Ethernet packet, and the Ethernet packet type field is 0x88D3.
[0049] Furthermore,
[0050] The specific device cryptographic protocol interaction process is as follows:
[0051] Step 301: The cryptographic module integrates a quantum random number generator (QRNG) to collect photon polarization states in real time and generate a quantum entropy source QRNG_output. Simultaneously, it combines a chaotic mapping (Logisticμ = 3.999) to generate a chaotic sequence Chaos_sequence, which is then XORed with the quantum entropy source to generate the session key Sec. The calculation formula is as follows:
[0052] Sec=QRNG_output⊕Chaos_sequence
[0053] Step 302: When the modular device is connected, the cryptographic proxy module is used to collect hardware fingerprints (SHA3-256 (FPGA bit stream), acoustic features (MFCC coefficients + Gaussian mixture model) and dynamic power consumption signatures (power consumption trace of running specific instructions), and send authentication and encryption request messages to the cryptographic module.
[0054] Step 303: Upon receiving the data, the cryptographic module verifies it. If verification fails, it refuses to send the session key, determines that an attack may exist, and sends a power-off command to the corresponding modular device to the power module; if verification succeeds, it sends the session key to the cryptographic proxy module.
[0055] Step 304: The password proxy module calls the encryption algorithm, encrypts the data using the session key, and sends it to the receiving end.
[0056] Furthermore,
[0057] The device power protocol interaction process includes:
[0058] Step 401: After the modular device is powered on, the power proxy module sends a registration request message to the power module, carrying the device hardware fingerprint (SHA3-256), rated power (16-bit), security certificate (SM2 signature), and dynamic power consumption feature code information. This requests the power allocation required by the modular device.
[0059] Step 402: Upon receiving the power module, the certificate validity is verified, and the power consumption feature code is compared with the database to prevent cloned devices from accessing the system. If verification fails, power supply to the modular device is refused; if verification passes, power is dynamically allocated according to the power requirements of the modular device.
[0060] Step 403: The power module uses an LSTM neural network model, inputting historical power sequences (sampled every 1 second), device type, and task queue depth, to predict the modular device power consumption Ppred for the next 30 seconds, and dynamically pre-allocates power. This transforms traditional reactive power allocation into predictive power allocation, shortening the power supply response time for sudden load increases and avoiding instantaneous overload.
[0061] Step 404: The power proxy module monitors the device-side voltage in real time. If it finds that the voltage change does not meet the usage requirements of the modular device, it sends feedback to the power module in real time, and the power module makes dynamic adjustments.
[0062] Step 405: The power module receives the power-off command sent by the password module and directly cuts off the power to the corresponding modular device.
[0063] Step 406: When the power module detects a current greater than 110% of the rated value, it sends an overload power-off message to the power agent module of the modular device and cuts off the power supply.
[0064] Compared with the prior art, the present invention has the following advantages:
[0065] This invention proposes a communication vehicle integration method that addresses the problem of excessive cable count in traditional distributed cabling methods. It proposes a modular equipment carrier platform where communication equipment is modularly designed and deployed. Interconnect cables between devices are integrated into the modular equipment carrier platform for connecting the modular devices deployed on it. The modular equipment carrier platform employs a bus-based cabling system, primarily composed of five types of buses: switching, management, clock, cryptography, and power. This provides five types of connections for the modular devices integrated on the platform: information exchange, health management, clock information, cryptography management, and power management. This significantly reduces the number of cables required for integration in the communication vehicle. Attached Figure Description
[0066] Figure 1 This is a schematic diagram of the internal structure of the modular equipment carrier platform of the present invention. Detailed Implementation
[0067] The present invention will be further described below.
[0068] I. Physical Layer Reconstruction – Modular Equipment Platform Design
[0069] 1. Structural Design: Utilizing a 6061-T6 aluminum alloy frame, divided into three layers: upper, middle, and lower.
[0070] (1) The upper layer is the equipment installation area, which integrates the installation frame and anti-vibration locking mechanism to support 8 modular equipment;
[0071] (2) The middle layer is the platform bus area, with independent shielded channels for five types of functional buses. The inner wall of the channel is copper plated (thickness 50μm), and the shielding effectiveness reaches 90dB.
[0072] (3) The lower layer is a cooling fan area, which uses 5 centrifugal fans to build a positive pressure ventilation system with an air volume ≥200CFM.
[0073] 2. Interface Design: Standardized device interfaces include:
[0074] (1) Mechanical interface: Three-point buckle locking, insertion and extraction force ≤20N;
[0075] (2) Electrical interface: 48-pin military connector, integrating network port (4 sets), SMA (2 sets), and power contacts (6 sets).
[0076] II. Protocol Layer Reconstruction – Five-Bus Coordination Mechanism
[0077] a) Switching bus: The modular device platform integrates switching modules and a switching bus. The switching modules construct a star topology network through the switching bus to send and receive services and support VLAN isolation.
[0078] b) Management Bus: The modular device carrier platform integrates a management module and a management bus. The management module interacts with the management agent module of the modular device through the management bus, based on the device management protocol and device management messages, to realize device health monitoring.
[0079] c) Clock bus: The modular device carrier platform integrates a clock module and a clock bus. The clock module interacts with the clock agent module of the modular device through the clock bus, based on the device clock protocol and device clock messages, to achieve nanosecond-level synchronization.
[0080] d) Cryptographic bus: The modular device carrier platform integrates a cryptographic module and a cryptographic bus. The cryptographic module interacts with the cryptographic proxy module of the modular device through the cryptographic bus, based on the device cryptographic protocol and device cryptographic messages, and supports SM2 / SM4 / SM9 encryption algorithms.
[0081] e) Power bus: The modular equipment carrier platform integrates power modules and power buses. The power modules interact with the power agent modules of the modular equipment through the power bus, based on the equipment power protocol and equipment power messages, to support intelligent dynamic power distribution.
[0082] III. Modular Equipment Design
[0083] Existing equipment (switches, servers, encryption machines, etc.) is transformed into modular devices, containing switching proxy modules, management proxy modules, cryptographic proxy modules, clock proxy modules, and power proxy modules. A 48-pin military-grade connector is mounted on the back, interconnecting with the modular device's platform and interacting via corresponding buses and protocols.
[0084] like Figure 1 As shown, this invention designs a novel integrated communication vehicle system. By designing a modular equipment carrier platform, communication equipment is modularly designed and deployed on the platform. Interconnecting cables between devices are built into the modular equipment carrier platform for connecting the modular devices deployed on it. The modular equipment carrier platform adopts a bus-type cabling method, mainly composed of five types of buses: switching, management, clock, cryptography, and power. It can integrate the modular devices mounted on the platform, providing five types of connections: information exchange, health management, clock information, cryptography management, and power management.
[0085] 1. Construction of Modular Equipment Support Platform
[0086] (1) Mechanical structure design
[0087] Overall frame: Constructed from 6061-T6 aluminum alloy profiles. The frame consists of three layers:
[0088] a) Upper equipment installation area: Install 8 modular equipment slots, each slot is equipped with a three-point anti-vibration locking mechanism (locking force ≥200N, unlocking force ≤20N).
[0089] b) Mid-layer platform bus area: Five independent shielded channels (50mm × 80mm) are provided to accommodate the switching bus, management bus, clock bus, cryptographic bus, and power bus, respectively. The inner walls of the channels are copper plated (50μm thick, shielding effectiveness ≥90dB@1GHz).
[0090] c) Lower cooling fan area: Built-in 5 centrifugal fans to form a positive pressure cooling system, and the air inlet is equipped with a HEPA filter (filtration efficiency 99.97%).
[0091] 2. Switching bus implementation:
[0092] It uses the Broadcom BCM56960 switching chip, with a backplane bandwidth of 40Gbps, and supports VLAN segmentation and QoS priority marking.
[0093] The physical layer uses CAT7 shielded twisted pair cable (AWG24 gauge), and each device is allocated one 10 Gigabit port (10GBase-T).
[0094] 3. Management bus implementation:
[0095] The management module is deployed on an ARM Cortex-A53 processor (1.2GHz).
[0096] (1) The device management protocol interaction includes:
[0097] Step 101: After the modular device is powered on, the management agent module sends a discovery message to the management module via broadcast, reporting that the modular device has been powered on and its status information after power-on, including temperature (T), voltage (V), vibration (G), CPU load (L), memory utilization (M), and packet loss rate (P).
[0098] Step 102: After receiving the discovery message from the modular device, the management module sends a polling message to the management module every 30 seconds by default to query the status information of the modular device.
[0099] Step 103: After receiving the polling message from the management module, the management agent module replies with a status report message, reporting the status information of the modular device, including temperature (T), voltage (V), vibration (G), CPU load (L), memory utilization (M), and packet loss rate (P).
[0100] Step 104: Based on the status information received from the management module, the management module dynamically constructs a modular device health model. The modular device health calculation formula is as follows:
[0101] Y = a * X T +b*X V +c*X G +d*X L +e*X M +f*X P
[0102] Among them, X T X V X G X L X M X PThese are the changes in temperature (T), voltage (V), vibration (G), CPU load (L), memory utilization (M), and packet loss rate (P) for the most recent two times, respectively, with a, b, c, d, e, and f being the corresponding weighting coefficients.
[0103] Step 105: The management module dynamically adjusts the polling interval based on the modular device health status. The polling interval is set as follows:
[0104] Health Polling interval ≥80 300 seconds 60-79 120 seconds <60 30 seconds
[0105] Step 106: The management module uses an LSTM model to predict the probability of failure (0-100%) of the modular device in the next 24 hours based on the received modular device temperature (T), voltage (V), vibration (G), CPU load (L), memory utilization (M), and packet loss rate (P).
[0106] Step 107: If the predicted probability of modular equipment failure is ≥80%, an alarm will be sent to the user to remind them to conduct an inspection or replace the equipment as soon as possible.
[0107] Device management messages are carried on Ethernet packets, with the Ethernet packet type field being 0x88D2. Device management messages include: discovery messages, polling messages, and status report messages.
[0108] (2) The device management messages mentioned above include:
[0109] a) Device management messages are carried on Ethernet packets, with the Ethernet packet type field being 0x88D2. Device management messages include: Discover, Get, Put, and Alarm messages.
[0110] b) Device management message format, as shown in Table 1:
[0111] Table 1
[0112]
[0113] 4. Clock bus implementation:
[0114] The clock module uses a Symmetricom SA.45s cesium atomic clock (accuracy ±1×10-12) and is equipped with a Beidou time synchronization module.
[0115] (1) The device clock protocol interaction includes:
[0116] Step 201, the clock module periodically (synchronization interval T) new =2 seconds, basic period) to send a device clock message carrying timestamp t1;
[0117] Step 202: The clock proxy module records the message arrival time t2;
[0118] Step 203: After a random delay (between 0 and 1 millisecond), the clock agent sends a device clock message carrying timestamp t3.
[0119] Step 204: The clock module returns a device clock message carrying timestamp t4.
[0120] Step 205: The clock proxy module records the message arrival time t4, calculates the clock deviation OS_raw=(t2-t1-t4+t3) / 2, calculates the path delay DL=(t2-t1+t4-t3) / 2, and calculates the network jitter Jitter=|(t2-t1)-(t4-t3)|;
[0121] Step 206: Calculate the optimal synchronization interval T in real time based on network jitter and clock skew (OS). new =T base *(1+α*|OS_raw|+β*Jitter), and adjust the subsequent clock synchronization interval.
[0122] Wherein: T base = 2 seconds (base cycle), α = 0.1 (deviation weighting coefficient), β = 0.05 (jitter weighting coefficient)
[0123] Step 207: Calculate the temperature drift compensation amount T_T = k1*(T_current - T_cal) + k2*(T_current - T_cal) 2
[0124] Wherein, T_current is the ambient temperature value of the device acquired in real time by a temperature sensor, and T_cal is the reference temperature calibrated under standard laboratory conditions (e.g., 25℃), used to calculate the temperature deviation. k1 is the first-order temperature compensation coefficient (unit: ns / ℃), used to describe the linear effect of temperature changes on clock deviation, set to k1 = 0.05ns / ℃ (meaning that for every 1℃ increase, the clock deviation increases linearly by 0.05ns). k2 is the second-order temperature compensation coefficient (unit: ns / ℃²), used to describe the nonlinear effect of temperature changes (e.g., the frequency-temperature curve of a crystal oscillator exhibits parabolic characteristics), set to k2 = 0.001ns / ℃² (meaning that for every 1℃ deviation of the temperature from T_cal, the nonlinear deviation increases by 0.001ns).
[0125] Step 208: Calculate the phase noise compensation caused by the vibration of the communication vehicle. The calculation formula is as follows:
[0126] T_V=∫(a(t)*K)dt
[0127] (a(t) is the real-time vibration acceleration collected by an accelerometer (such as a MEMS triaxial accelerometer), and K is the vibration-time deviation conversion coefficient (unit: ns / g), which is used to describe the cumulative effect of unit vibration acceleration on clock deviation. The default K = 0.1 ns / g)
[0128] Step 209: Correct the local clock to achieve time synchronization with the clock module, ensuring dynamic adaptation to the network environment and maintaining clock synchronization accuracy. The calculation formula is as follows:
[0129] OS_corrected=OS_raw-(T_T+T_V)
[0130] Where OS_raw is the calculated uncorrected clock skew (in ns), and OS_corrected is the corrected clock skew (in ns).
[0131] The device clock message is carried on an Ethernet packet, and the Ethernet packet type field is 0x88D3.
[0132] (2) The device clock message includes:
[0133] a) The device clock message is carried on an Ethernet message, and the Ethernet message type field is 0x88D3.
[0134] b) Device clock message format, as shown in Table 2:
[0135] Table 2
[0136] Fields length illustrate Ver 1 byte Version Sn 2 bytes Message sequence number ID 4 bytes Device ID Timestamp 10 bytes Timestamp of the time of transmission (nanosecond level) Correct 8 bytes Path delay compensation
[0137] 5. Implementation of the cryptographic bus:
[0138] It integrates the Jiangnan Keyou SJK1928 cryptographic chip, supports SM2 / SM4 / SM9 algorithms, and has a key generation rate of up to 500 times / second. Encryption requests are sent via the PCIe 3.0 interface, with a bus response time of ≤10μs.
[0139] (1) The device cryptographic protocol interaction includes:
[0140] Step 301: The cryptographic module integrates a quantum random number generator (QRNG) to collect photon polarization states in real time and generate a quantum entropy source QRNG_output. Simultaneously, it combines a chaotic mapping (Logisticμ = 3.999) to generate a chaotic sequence Chaos_sequence, which is then XORed with the quantum entropy source to generate the session key Sec. The calculation formula is as follows:
[0141] Sec=QRNG_output⊕Chaos_sequence
[0142] Step 302: When the modular device is connected, the cryptographic proxy module is used to collect hardware fingerprints (SHA3-256 (FPGA bit stream), acoustic features (MFCC coefficients + Gaussian mixture model) and dynamic power consumption signatures (power consumption trace of running specific instructions), and send authentication and encryption request messages to the cryptographic module.
[0143] Step 303: Upon receiving the data, the cryptographic module verifies it. If verification fails, it refuses to send the session key, determines that an attack may exist, and sends a power-off command to the corresponding modular device to the power module; if verification succeeds, it sends the session key to the cryptographic proxy module.
[0144] Step 304: The password proxy module calls the encryption algorithm, encrypts the data using the session key, and sends it to the receiving end.
[0145] (2) The device password message mentioned above includes:
[0146] The protocol message format is shown in Table 3:
[0147] Table 3
[0148] Fields length illustrate Type 1 byte Message type: 0x1 for encrypted request message, 0x2 for encrypted response message. Crypt 1 byte Encryption type: 0x1 for SM2, 0x2 for SM4, 0x1 for SM9 Len 2 bytes Identify the length of the data payload Data variable Plaintext / ciphertext data
[0149] 6. Power bus implementation:
[0150] It adopts the Vicor DCM3623 power module, which dynamically adjusts the output power according to the equipment load (step accuracy 1%), and the overcurrent protection threshold can be set programmably (default 110% of rated current).
[0151] (1) The device power protocol interaction includes:
[0152] Step 401: After the modular device is powered on, the power proxy module sends a registration request message to the power module, carrying the device hardware fingerprint (SHA3-256), rated power (16-bit), security certificate (SM2 signature), and dynamic power consumption feature code information. This requests the power allocation required by the modular device.
[0153] Step 402: Upon receiving the power module, the certificate validity is verified, and the power consumption feature code is compared with the database to prevent cloned devices from accessing the system. If verification fails, power supply to the modular device is refused; if verification passes, power is dynamically allocated according to the power requirements of the modular device.
[0154] Step 403: The power module uses an LSTM neural network model, inputting historical power sequences (sampled every 1 second), device type, and task queue depth, to predict the modular device power consumption Ppred for the next 30 seconds, and dynamically pre-allocates power. This transforms traditional reactive power allocation into predictive power allocation, shortening the power supply response time for sudden load increases and avoiding instantaneous overload.
[0155] Step 404: The power proxy module monitors the device-side voltage in real time. If it finds that the voltage change does not meet the usage requirements of the modular device, it sends feedback to the power module in real time, and the power module makes dynamic adjustments.
[0156] Step 405: The power module receives the power-off command sent by the password module and directly cuts off the power to the corresponding modular device.
[0157] Step 406: When the power module detects a current greater than 110% of the rated value, it sends an overload power-off message to the power agent module of the modular device and cuts off the power supply.
[0158] (2) The device power message includes:
[0159] The protocol message format is shown in Table 4:
[0160] Table 4
[0161] Fields length illustrate Type 1 byte Message type: 0x1 is a power request message, 0x2 is an overload power failure message. Pow 2 bytes Power required for modular equipment (in W) Sta 1 byte Device status: 0x00 = Normal, 0x01 = Overload
[0162] 7. Equipment Installation and Integration
[0163] (1) Modular equipment deployment
[0164] Existing equipment (switches, servers, encryption machines, etc.) is transformed into modular devices, containing switching proxy modules, management proxy modules, cryptographic proxy modules, clock proxy modules, and power proxy modules. A 48-pin military-grade connector is mounted on the back, interconnecting with the modular device's platform and interacting via corresponding buses and protocols.
[0165] (2) Rapid loading process
[0166] ① The modular equipment support platform is fixed to the communication vehicle with four bolts (torque 50 N·m);
[0167] ② Insert the modular devices into the slots of the modular device carrier platform in sequence. When you hear the "click" sound of the locking mechanism, the installation is complete.
Claims
1. A novel integrated communication vehicle system, characterized in that, include: The modular equipment carrier platform is composed of a 6061-T6 aluminum alloy frame, which includes a three-layer structure: an upper equipment installation area, a middle platform bus area, and a lower heat dissipation fan area. The upper equipment installation area integrates standardized equipment interfaces, including a shockproof locking mechanism and a 48-pin military connector, enabling blind-plug installation of modular equipment; The five types of buses integrated within the middle-layer platform bus area are: a) Switching bus: The modular device platform integrates switching modules and a switching bus; the switching modules construct a star topology network through the switching bus to send and receive services and support VLAN isolation; b) Management Bus: The modular device platform integrates management modules and a management bus; The management module interacts with the management agent module of the modular device through the management bus, based on the device management protocol and device management messages, to build a device health model and predict the probability of future failures. c) Clock bus: The modular device carrier platform integrates a clock module and a clock bus. The clock module interacts with the clock agent module of the modular device through the clock bus, based on the device clock protocol and device clock messages, to achieve nanosecond-level synchronization. d) Cryptographic bus: The modular device carrier platform integrates a cryptographic module and a cryptographic bus. The cryptographic module interacts with the cryptographic proxy module of the modular device through the cryptographic bus, based on the device cryptographic protocol and device cryptographic messages. It supports SM2 / SM4 / SM9 encryption algorithms. e) Power bus: The modular device carrier platform integrates power modules and power buses. The power modules interact with the power agent modules of the modular devices through the power bus, based on the device power protocol and device power messages, to support dynamic power distribution. The lower cooling fan area integrates cooling fans and heat dissipation channels to achieve heat dissipation for modular equipment.
2. The novel communication vehicle integrated system according to claim 1, characterized in that, The device management protocol interaction process is as follows: Step 101: After the modular device is powered on, the management agent module sends a discovery message to the management module via broadcast, reporting that the modular device has been powered on and its status information after power-on, including temperature, voltage, vibration, CPU load, memory usage and packet loss rate. Step 102: After receiving the discovery message from the modular device, the management module sends a polling message to the management agent module every 30 seconds by default to query the status information of the modular device. Step 103: After receiving the polling message from the management module, the management agent module replies with a status report message, reporting the status information of the modular device, including temperature, voltage, vibration, CPU load, memory usage and packet loss rate. Step 104: The management module dynamically constructs a modular device health model based on the received modular device status information. The modular device health is determined by the changes in temperature, voltage, vibration, CPU load, memory usage, and packet loss rate over the last two times. Step 105: The management module dynamically adjusts the polling time interval based on the modular device health status; Step 106: The management module uses an LSTM model to predict the probability of failure of the modular device in the next 24 hours based on the received modular device temperature, voltage, vibration, CPU load, memory usage, and packet loss rate. Step 107: If the predicted probability of modular equipment failure is ≥80%, an alarm will be sent to the user to remind them to conduct an inspection or replace the equipment as soon as possible; Device management messages are carried on Ethernet packets, with the Ethernet packet type field being 0x88D2. Device management messages include: discovery messages, polling messages, and status report messages.
3. The novel communication vehicle integrated system according to claim 1, characterized in that, The clock bus includes deployed temperature and vibration sensors to collect environmental data in real time. The device clock protocol interaction includes: Step 201: The clock module periodically sends a device clock message carrying a timestamp t1; Step 202: The clock proxy module records the message arrival time t2; Step 203: After a random delay, the clock agent sends a device clock message carrying timestamp t3. Step 204: The clock module returns a device clock message carrying timestamp t4; Step 205: The clock proxy module records the message arrival time t4, calculates the clock deviation OS_raw=(t2-t1-t4+t3) / 2, calculates the path delay DL=(t2-t1+t4-t3) / 2, and calculates the network jitter Jitter=|(t2-t1)-(t4-t3)|. Step 206: Calculate the optimal synchronization interval T in real time based on network jitter and clock skew OS. new = T base *(1+α*|OS_raw|+β*Jitter), and adjust the subsequent clock synchronization interval; Wherein: T base =Basic period, α = Deviation weighting coefficient, β = Jitter weighting coefficient; Step 207, calculate the temperature drift compensation: T_T=k1*(T_current-T_cal)+k2*(T_current-T_cal) 2 Where T_current is the temperature value of the environment in which the device is located, which is collected in real time by a temperature sensor; T_cal is the reference temperature calibrated under standard laboratory conditions, which is used to calculate the temperature deviation; k1 is the first-order temperature compensation coefficient, which is used to describe the linear effect of temperature change on clock deviation; k2 is the second-order temperature compensation coefficient, which is used to describe the nonlinear effect of temperature change. Step 208: Calculate the phase noise compensation caused by the vibration of the communication vehicle. The calculation formula is as follows: ; a(t) is the real-time vibration acceleration collected by the accelerometer, and K is the vibration-time deviation conversion coefficient, which is used to describe the cumulative effect of unit vibration acceleration on clock deviation. Step 209: Correct the local clock to achieve time synchronization with the clock module, ensuring dynamic adaptation to the network environment and maintaining clock synchronization accuracy; the calculation formula is as follows: OS_corrected = OS_raw - (T_T + T_V) Where OS_raw is the calculated uncorrected clock skew, and OS_corrected is the corrected clock skew; The device clock message is carried by an Ethernet message, and the Ethernet message type field is 0x88D3.
4. The novel communication vehicle integrated system according to claim 1, characterized in that, The specific device cryptographic protocol interaction process is as follows: Step 301: The cryptographic module integrates a quantum random number generator (QRNG) to collect photon polarization states in real time and generate a quantum entropy source (QRNG_output). Simultaneously, it combines a chaotic mapping to generate a chaotic sequence (Chaos_sequence), which is then XORed with the quantum entropy source to generate the session key (Sec). The calculation formula is as follows: Sec = QRNG_output ⊕ Chaos_sequence; Step 302: When the modular device is connected, the cryptographic proxy module is used to collect hardware fingerprint, voiceprint features and dynamic power consumption signature, and send authentication and encryption request messages to the cryptographic module. Step 303: Upon receiving the data, the cryptographic module verifies it. If verification fails, it refuses to send the session key, determines that an attack may exist, and sends a power-off command to the corresponding modular device to the power module. If verification passes, it sends the session key to the cryptographic proxy module to proceed to the next step. Step 304: The password proxy module calls the encryption algorithm, encrypts the data using the session key, and sends it to the receiving end.
5. The novel communication vehicle integrated system according to claim 1, characterized in that, The device power protocol interaction process includes: Step 401: After the modular device is powered on, the power proxy module sends a registration request message to the power module, carrying the device hardware fingerprint, rated power, security certificate, and dynamic power consumption feature code information; and requests the power allocation required by the modular device. Step 402: After receiving the power module, verify the validity of the certificate and compare it with the power consumption feature code database to prevent cloned devices from accessing the device; if the verification fails, refuse to supply power to the modular device; if the verification passes, dynamically allocate power according to the power requirements of the modular device. Step 403: The power module uses an LSTM neural network model, inputting historical power sequences, device type, and task queue depth, to predict the modular device power consumption Ppred for the next 30 seconds and dynamically pre-allocate power. This transforms traditional reactive power allocation into predictive power allocation, shortening the power supply response time for sudden load increases and avoiding instantaneous overload. Step 404: The power proxy module monitors the device-side voltage in real time. If it finds that the voltage change does not meet the usage requirements of the modular device, it sends feedback to the power module in real time, and the power module makes dynamic adjustments. Step 405: The power module receives the power-off command sent by the password module and directly cuts off the power to the corresponding modular device. Step 406: When the power module detects a current greater than 110% of the rated value, it sends an overload power-off message to the power agent module of the modular device and cuts off the power supply.