Driver state monitoring all-in-one machine and driver state monitoring system

Abstract

The invention provides a driver state monitoring all-in-one machine, a driver state monitoring system and an automobile. The driver state monitoring all-in-one machine comprises a shell; the first circuit board is arranged in the shell, and the first circuit board is provided with a first surface and a second surface; the control unit is arranged on the first surface of the first circuit board; the second circuit board is arranged in the shell, the second circuit board is provided with a third surface and a fourth surface, and the third surface of the second circuit board and the second surface of the first circuit board are arranged oppositely and separately; the system-on-chip is arranged on the fourth surface of the second circuit board; and the image acquisition assembly is arranged on the fourth surface of the second circuit board, and signals are transmitted between the image acquisition assembly and the system-on-chip through an MIPI protocol, so that the use of hardware can be effectively reduced, the occupied space is reduced, and the heat dissipation requirement is met.

Description

Technical Field

[0001] The present application relates to the technical fields of automotive electronics, driver monitoring systems, and image processing technology, and particularly relates to a driver status monitoring integrated machine, a driver status monitoring system, and an automobile. Background Art

[0002] In modern automobiles, a driver monitoring system (DMS) is an important safety function used to monitor the driving status of a driver, ensure that the driver remains alert and focused, and thus reduce the occurrence of traffic accidents. The DMS system collects the face image of the driver through a camera and analyzes information such as the driver's line of sight, facial expression, and fatigue level through image processing technology.

[0003] The camera of a traditional DMS is responsible for collecting the face image of the driver and transmitting the image to a system on chip (SOC) inside the controller through a FAKRA (FAchKReisAutomobil) coaxial cable. The SOC sends the processing result to a microcontroller unit (MCU), and the MCU sends the result to a superior controller through a CAN bus (serial communication bus).

[0004] In terms of hardware, the DMS needs to use a pair of serial deserializer chips, two groups of POC (Power Over Coaxia) circuits, a FAKRA cable several meters long, and two FAKRA connectors to achieve data transmission between the camera and the system on chip, resulting in high hardware costs. The traditional split design of the DMS occupies a large amount of space, has a complex wiring, and high installation and later maintenance costs. Summary of the Invention

[0005] In view of this, embodiments of the present application provide a driver status monitoring integrated machine, system, and automobile, which can save installation space, reduce hardware costs, and assembly and maintenance costs.

[0006] In a first aspect, an embodiment of the present application provides a driver status monitoring integrated machine, including a housing, a first circuit board, a second circuit board, a control unit, a system on chip, and an image acquisition component. The first circuit board and the second circuit board are arranged inside the housing. The first circuit board has a first surface and a second surface, and the control unit is arranged on the first surface of the first circuit board. The second circuit board has a third surface and a fourth surface, the third surface is arranged opposite to and isolated from the second surface of the first circuit board, and the system on chip and the image acquisition component are arranged on the fourth surface of the second circuit board. A signal is transmitted between the image acquisition component and the system on chip through the MIPI protocol.

[0007] In combination with the first aspect, in certain implementations of the first aspect, the integrated driver status monitoring device further includes: a third circuit board and a light-emitting component. The third circuit board is disposed within the housing. The third circuit board is located on a side of the second circuit board away from the first circuit board, and the third circuit board is disposed separately from the second circuit board. The light-emitting component is disposed on a surface of the third circuit board away from the second circuit board.

[0008] In combination with the first aspect, in certain implementations of the first aspect, the area of the third circuit board is smaller than the area of the second circuit board, and the orthographic projection of the image acquisition component on the second circuit board is at least partially outside the orthographic projection of the third circuit board on the second circuit board.

[0009] In combination with the first aspect, in certain implementations of the first aspect, the integrated driver status monitoring device further includes: a mounting bracket and an ear plate. The mounting bracket is connected to the housing. The ear plate is disposed on the mounting bracket, and the ear plate is adapted to be connected to the frame structure of the vehicle.

[0010] In combination with the first aspect, in certain implementations of the first aspect, the image acquisition component includes a lens, and the integrated driver status monitoring device further includes: a light-shielding foam and a filter. The light-shielding foam is annular and is located on the periphery of the lens. The filter is disposed on a side of the lens away from the second circuit board.

[0011] In combination with the first aspect, in certain implementations of the first aspect, the housing includes: a first housing and a second housing. The first housing is provided with fins on its outer sidewall. The second housing covers the first housing, and the second housing is detachably connected to the first housing.

[0012] In a second aspect, an embodiment of the present application provides an integrated driver status monitoring device, including: a housing, a fourth circuit board, a control unit, a fifth circuit board, a system-on-chip, and an image acquisition component. The fourth circuit board is disposed within the housing, and the fourth circuit board is provided with through holes. The control unit is disposed on the fourth circuit board. The fifth circuit board is disposed within the housing, and the fifth circuit board is disposed opposite to and separately from the fourth circuit board. The system-on-chip is disposed on the fifth circuit board. The image acquisition component is disposed on a surface of the fifth circuit board opposite to the fourth circuit board, and signals are transmitted between the image acquisition component and the system-on-chip through the MIPI protocol, and at least a part of the image acquisition component passes through the through holes.

[0013] In combination with the second aspect, in certain implementations of the second aspect, the integrated driver status monitoring device further includes a light-emitting component, and the light-emitting component is disposed on a surface of the fourth circuit board away from the fifth circuit board.

[0014] In combination with the second aspect, in some implementations of the second aspect, the driver status monitoring all-in-one machine further includes a sixth circuit board, which is disposed inside the housing. The sixth circuit board is provided with a power interface for connecting an external power supply, and the sixth circuit board is located on a side of the first circuit board away from the fifth circuit board.

[0015] In a third aspect, an embodiment of the present application provides a driver status monitoring system, including the driver status monitoring all-in-one machine as described in the foregoing embodiments.

[0016] In the embodiments of the present application, by optimizing the positions of components, the main components are respectively disposed on two back-to-back circuit boards. In cooperation with installing the image acquisition component and the system-on-chip on the same circuit board, and transmitting signals between them using the MIPI protocol, it is possible to effectively reduce the use of hardware, reduce the occupied space, and take into account the heat dissipation requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] By describing the embodiments of the present application in more detail in conjunction with the accompanying drawings, the above and other objects, features, and advantages of the present application will become more obvious. The drawings are used to provide a further understanding of the embodiments of the present application, and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the present application, and do not constitute a limitation to the present application. In the drawings, the same reference numerals generally represent the same components or steps.

[0018] Figure 1 Shown is a schematic installation diagram of a driver status monitoring device in the prior art.

[0019] Figure 2 Shown is a structural block diagram of a driver status monitoring device in the prior art.

[0020] Figure 3 Shown is a structural block diagram of a driver status monitoring all-in-one machine provided by an embodiment of the present application.

[0021] Figure 4 Shown is an exploded schematic diagram of a driver status monitoring all-in-one machine provided by an embodiment of the present application.

[0022] Figure 5 Shown is a structural block diagram of a driver status monitoring all-in-one machine provided by another embodiment of the present application.

[0023] Figure 6 Shown is an exploded schematic diagram of a driver status monitoring all-in-one machine provided by another embodiment of the present application.

[0024] In the above-mentioned drawings, the meanings of the reference numerals are specifically as follows:

[0025] A01 - vehicle body frame;

[0026] A02 - A - pillar;

[0027] A03 - Camera;

[0028] A04 - Controller;

[0029] 01 - Housing;

[0030] 011 - First housing;

[0031] 0111 - Fin;

[0032] 012 - Second housing;

[0033] 02 - First circuit board;

[0034] 021 - Through - hole;

[0035] 03 - Power interface;

[0036] 04 - Second circuit board;

[0037] 05 - System - on - chip;

[0038] 06 - Image acquisition component;

[0039] 07 - Third circuit board;

[0040] 08 - Light - emitting component;

[0041] 09 - Connecting pipe;

[0042] 10 - Mounting bracket;

[0043] 101 - Ear plate;

[0044] 11 - Fastening bolt;

[0045] 12 - Light - shielding foam;

[0046] 13 - Filter;

[0047] 14 - Power management chip;

[0048] 15 - Mounting bolt;

[0049] 17 - Fourth circuit board;

[0050] 18 - Fifth circuit board;

[0051] 19 - Sixth circuit board. Detailed implementation manners

[0052] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0053] The terms used herein are only for describing specific embodiments and are not intended to limit the present disclosure. The terms "including", "comprising", etc. used herein indicate the presence of the described features, steps, operations, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, or components.

[0054] All terms used herein, including technical and scientific terms, have the meanings commonly understood by those of ordinary skill in the art, unless otherwise defined. It should be noted that the terms used herein should be interpreted as having a meaning consistent with the context of this specification and should not be interpreted in an idealized or overly rigid manner.

[0055] In the case of using expressions such as "at least one of A, B, and C, etc.", generally, it should be interpreted according to the meaning commonly understood by those of ordinary skill in the art. For example, "a system having at least one of A, B, and C" should include, but is not limited to, a system having only A, only B, only C, having A and B, having A and C, having B and C, and / or having A, B, and C. In the case of using expressions such as "at least one of A, B, or C, etc.", generally, it should be interpreted according to the meaning commonly understood by those of ordinary skill in the art. For example, "a system having at least one of A, B, or C" should include, but is not limited to, a system having only A, only B, only C, having A and B, having A and C, having B and C, and / or having A, B, and C.

[0056] It should also be noted that the directional terms mentioned in the embodiments, such as "up", "down", "front", "back", "left", "right", etc., are only references to the directions in the accompanying drawings and are not used to limit the protection scope of the present disclosure. Throughout the drawings, the same elements are represented by the same or similar reference numerals. When it may cause confusion in the understanding of the present disclosure, the conventional structures or configurations will be omitted.

[0057] Figure 1 Shown is a schematic installation diagram of a driver status monitoring device in the prior art; Figure 2 Shown is a structural block diagram of a driver status monitoring device in the prior art.

[0058] Such as Figure 1 and Figure 2As shown, the vehicle body frame A01 includes components such as A-pillars A02, B-pillars, C-pillars, vehicle frames, and vehicle roofs. In traditional DMS, it generally includes two separate parts: a camera and a controller. Among them, the camera A03 is generally installed on the A-pillar A02 and is used to obtain the facial information of the driver, including but not limited to the position of the feature points on the edge of the eyes, the maximum height difference between the upper and lower eyelids, the area of the eye region, the number of blinks or time intervals, the duration of eye closure, etc. The specific judgment process, judgment method, and judgment principle will not be elaborated here too much. This part of the content is prior art and not the innovation point of this application.

[0059] As Figure 2 shown, the image processing controller is installed at other positions inside the cockpit. For example, as shown in the figure, it is installed under the seat, or at other positions, such as under the center console, etc. The camera is responsible for collecting the driver's face image and transmitting the image to the SOC inside the image processing controller through the FAKRA coaxial cable for processing. Among them, a pair of serial deserializer chips need to be set at the camera end and the image controller end to complete the data transmission. The SOC sends the processing result to the MCU, and the MCU sends the result to the main controller through the CAN bus. The image processing controller is powered by the whole vehicle, and the MCU is responsible for the power management and monitoring of the DMS system. The camera is powered by the MCU through the POC (Power Over Coax) circuit.

[0060] In the above technical solution of the prior art, it is necessary to install the camera and the controller at different positions of the vehicle, which occupies a large space and increases the installation complexity and the required man-hours.

[0061] Figure 3 As shown is the structural block diagram of a driver status monitoring all-in-one machine provided by an embodiment of the present application. Figure 4 As shown is the exploded view of a driver status monitoring all-in-one machine provided by an embodiment of the present application.

[0062] In a first aspect, an embodiment of the present application provides a driver status monitoring all-in-one machine, as Figure 3 and Figure 4As shown in the figure, the integrated driver status monitor includes: a housing 01, a first circuit board 02, a control unit, a second circuit board 04, a system-on-chip 05, and an image acquisition component 06. The first circuit board 02 is disposed within the housing 01 and has a first surface and a second surface. The control unit is disposed on the first surface of the first circuit board 02. The second circuit board 04 is disposed within the housing 01 and has a third surface and a fourth surface. The third surface of the second circuit board 04 is disposed opposite to and isolated from the second surface of the first circuit board 02. The system-on-chip 05 is disposed on the fourth surface of the second circuit board 04. The image acquisition component 06 is disposed on the fourth surface of the second circuit board 04, and signals are transmitted between the image acquisition component 06 and the system-on-chip 05 through the MIPI protocol. Herein, the isolated setting means separating a certain part from other parts by physical or technical means to achieve the purposes of protection, safety, avoiding short circuits, or functional independence. The isolated setting is equivalent to a non-contact setting. In this application, it mainly refers to thermal isolation and electrical isolation.

[0063] In this embodiment, by mounting the image acquisition component 06 and the system-on-chip 05 on the same circuit board and transmitting signals between them through the MIPI protocol, therefore, there is no need to provide a FAKRA coaxial cable and a FAKRA connector between the camera and the image controller. At the same time, because there is no need for a FAKRA coaxial cable and a FAKRA connector, there is also no need to provide a pair of serializer / deserializer chips at the camera end and the image controller end, and there is no need to additionally provide a POC circuit to supply power to the camera. Based on the above structure, a large amount of hardware usage can be saved, the cost can be saved, and the occupied space can be reduced. Moreover, by disposing the heat-generating component, the system-on-chip and the image acquisition component, on the second circuit board, and disposing the heat-generating component, the control unit, on the first circuit board disposed opposite to the second circuit board, the aggregation of heat can be effectively reduced, facilitating heat dissipation.

[0064] Combined with the first aspect, in some implementation manners of the first aspect, the user information (including but not limited to user personal information, user image information, user device information, etc.) and data (including but not limited to data for analysis, stored data, displayed data, etc.) involved are all information and data authorized by the user or fully authorized by all parties. Moreover, the processing of relevant data, such as collection, storage, use, processing, transmission, provision, disclosure, and application, all complies with relevant laws, regulations, and standards, takes necessary confidentiality measures, does not violate public order and good customs, and provides corresponding operation entrances for the user to choose to authorize or refuse.

[0065] Combined with the first aspect, in some implementation manners of the first aspect, the housing 01, as a supporting component of the integrated driver status monitor, mainly plays a role of fixing and supporting, and provides an installation space for accommodating other components.

[0066] In combination with the first aspect, in some implementations of the first aspect, two circuit boards arranged back-to-back are provided at intervals in the thickness direction within the housing 01. Components with different heat generation capabilities and heat dissipation requirements, such as a system-on-chip, an image acquisition component, and a control unit, are respectively placed on different circuit boards. The circuit boards are located at different positions within the housing 01, which can effectively utilize the space within the housing 01, avoid excessive heat concentration, and dissipate heat in two or more directions (for example, the heat generated by the system-on-chip and the image acquisition component is mainly dissipated in the direction away from the fourth surface, and the heat generated by the control unit is mainly dissipated in the direction away from the first surface), improving the heat dissipation efficiency and reducing the overall volume of the device.

[0067] In combination with the first aspect, in some implementations of the first aspect, the image acquisition component 06 and the system-on-chip 05 are simultaneously provided on the second circuit board 04, and the signals are transmitted between them through the MIPI protocol, which can avoid additional cable connections (as well as corresponding connectors, serializer / deserializer chips, etc.). Specifically, the MIPI signal transmission between the image acquisition component 06 (including a camera) and the system-on-chip 05 is implemented through circuits on a printed circuit board (PCB). These circuits include differential signal lines, impedance matching circuits, filtering circuits, etc., which together constitute the transmission channel for MIPI signals to ensure the quality and stability of MIPI signals during transmission. Based on this design, the space occupied by some components can be saved, the installation process can be simplified, thereby reducing the hardware cost and improving the stability and reliability of the system.

[0068] In this embodiment, the image acquisition component 06 has a transmitter end, including a module for data packaging and encoding, which converts pixel data into byte data suitable for transmission via the MIPI protocol; Structurally, the image acquisition component 06 includes a high-speed transmitter (HS-TX) and a low-power transmitter (LP-TX) for transmitting data at the physical layer. The system-on-chip 05 has a receiver end, including a module for data unpacking and decoding, which converts the received byte data back into pixel data; Structurally, it includes a high-speed receiver (HS-RX) and a low-power receiver (LP-RX) for receiving data at the physical layer. Optionally, the MIPI protocol supports simultaneous data transmission on multiple data channels to increase the bandwidth and rate of data transmission. In addition, in order to implement MIPI protocol communication between the image acquisition component 06 and the system-on-chip 05, the driver status monitoring all-in-one machine further includes differential signal lines, a clock generator, and other auxiliary components (such as resistors, capacitors, etc.). The differential signal lines, the clock generator, and other auxiliary components are usually installed in the connection part between the image acquisition component 06 and the system-on-chip 05, or near these two components, mainly by providing a stable and reliable signal transmission path and clock signal to support communication between the image acquisition component 06 and the system-on-chip 05. The differential signal lines are used to transmit differential signals, which can reduce the influence of electromagnetic interference and noise and improve the stability and reliability of data transmission. The clock generator is used to generate a clock signal to ensure that data is transmitted at the correct timing. Other auxiliary components such as resistors and capacitors may be used for functions such as signal regulation, filtering, or providing necessary circuit protection. These components work together to enable efficient and reliable MIPI protocol communication between the image acquisition component 06 and the system-on-chip 05.

[0069] In combination with the first aspect, in some implementation manners of the first aspect, the driver status monitoring all-in-one machine further includes a third circuit board 07 and a lighting component 08. The third circuit board 07 is disposed within the housing 01. The third circuit board 07 is located on a side of the second circuit board 04 away from the first circuit board 02, and the third circuit board 07 is disposed in isolation from the second circuit board 04; The lighting component 08 is disposed on a side of the third circuit board 07 away from the second circuit board.

[0070] In this embodiment, by providing the third circuit board 07 and the lighting component 08, the image acquisition component 06 is supplemented with light to ensure that the image acquisition component 06 can work properly in various working environments and obtain high-quality image data.

[0071] In combination with the first aspect, in some implementation manners of the first aspect, a driving circuit connected to the lighting component 08 is provided on the third circuit board 07. The lighting component 08 includes a supplementary light, for example, an LED lamp. The lighting component is used to supplement light to the image acquisition component.

[0072] In combination with the first aspect, in certain implementations of the first aspect, the area of the third circuit board 07 is smaller than the area of the second circuit board 04, and at least a part of the image acquisition component 06 is located in an area outside the projection of the third circuit board 07 on the second circuit board 04. That is, the projection of the third circuit board 07 on the second circuit board 04 does not overlap with the projection of the image acquisition component 06 on the second circuit board 04.

[0073] In this embodiment, optimizing the shape and area of the third circuit board 07 can avoid the third circuit board 07 from blocking the image acquisition component 06, without affecting the normal acquisition of image data by the image acquisition component 06, and can make full use of the space inside the housing 01. Specifically, the lens part of the image acquisition component 06 is located in an area outside the projection of the third circuit board 07 on the second circuit board 04.

[0074] In combination with the first aspect, in certain implementations of the first aspect, the third circuit board 07 is provided with mounting holes, and threaded blind holes are provided on the inner side wall of the housing 01. The third circuit board 07 is installed and fixed on the housing 01 through mounting bolts.

[0075] In combination with the first aspect, in certain implementations of the first aspect, the driver status monitoring all-in-one machine further includes: a mounting bracket 10 and an ear plate 101. The mounting bracket 10 is used to connect with the housing 01. Specifically, the housing 01 and the mounting bracket 10 can be connected through fastening bolts 11. In some alternative solutions, the mounting bracket 10 can also be connected by means such as bonding and snap connection. An ear plate 101 extends outward from the side edge of the mounting bracket 10. The ear plate 101 has an opening, and is connected to the frame structure of the vehicle through this opening. For example, corresponding openings are also provided on the frame structure, and the ear plate 101 and the frame structure are connected by bolts. Further, the driver status monitoring all-in-one machine can be installed inside the A-pillar of the vehicle. Specifically, an opening is reserved on the A-pillar, and in cooperation with the opening on the ear plate 101, the two are fixedly connected by bolts. Among them, an opening for exposing the image acquisition component 06 is also provided on the A-pillar. After the driver status monitoring all-in-one machine is installed, the image acquisition component 06 obtains the image information of the driver through the reserved opening.

[0076] In combination with the first aspect, in certain implementations of the first aspect, the image acquisition component 06 includes a lens, and the driver status monitoring all-in-one machine further includes: a light-shielding foam 12 and a filter 13. The light-shielding foam 12 is annular, and the light-shielding foam 12 is located on the periphery of the lens. The filter 13 is arranged on the side of the lens away from the second circuit board 04.

[0077] In this embodiment, the light-shielding foam 12 can effectively block the light from around the camera, preventing non-imaging light from entering the lens, thereby improving the clarity and contrast of the captured image. Especially when shooting against the light, side light, or using a flash, the light-shielding foam 12 can significantly reduce light interference and avoid unnecessary haze or light spots in the photo, thus improving the accuracy of the acquired image.

[0078] Furthermore, the light-shielding foam 12 can also protect the lens from accidental damage to a certain extent, reduce the impact of external vibrations on the camera to a certain extent, improve the shooting stability. At the same time, the material and design of the light-shielding foam 12 endow it with certain dust-proof and moisture-proof capabilities.

[0079] In this embodiment, the filter 13 can filter out specific light received by the camera lens, such as infrared rays. The CCD (Charge Coupled Device) sensor in a color camera can also sense infrared rays, which will cause the D.S.P (Digital Signal Processing) to be unable to correctly calculate the color. Therefore, using the filter 13 can separate the infrared part, ensuring that the camera captures the correct color. The filter 13 can also trim the light entering the lens to improve the quality of the captured image. Utilizing the physical polarization characteristics of the filter 13, the direct part of the light can be retained, and the oblique part can be reflected or absorbed, thus avoiding interference with adjacent photosensitive elements and ensuring the clarity and contrast of the captured image. The filter 13 can serve as a barrier to protect the camera lens from erosion and damage by external environments such as sand, wind, and rain. This helps to extend the service life of the camera and ensures the stability and clarity of the captured image.

[0080] Combined with the first aspect, in some implementation manners of the first aspect, the driver status monitoring all-in-one machine further includes a power management chip 14. The power management chip 14 is disposed on the second circuit board 04 and is electrically connected to the light-emitting component, the image acquisition component, the SOC, and the control unit respectively to provide power.

[0081] Combined with the first aspect, in some implementation manners of the first aspect, the electrical connection manner between the power management chip and the control unit can be determined according to specific design requirements and the layout of the circuit board. For example, the direct wiring method or the connector / socket connection method can be adopted. Specifically, the direct wiring method includes bare wire connection (for example, directly connecting the output terminal of the power management chip 14 to the input terminal of the control unit through a bare wire, such as a wire) or soldering connection (connecting the output pin of the power management chip and the input pin of the control unit together by soldering). Connectors (such as plugs and sockets) can also be installed at the output terminal of the power management chip and the input terminal of the control unit respectively. By plugging the connectors together, the electrical connection between the power management chip and the control unit is achieved, which is convenient for disassembly and replacement and increases the flexibility of the circuit.

[0082] In combination with the first aspect, in some implementations of the first aspect, such as Figure 4 shown, the integrated driver status monitor further includes a connector, which is connected to the vehicle / upper-level controller through CAN (serial communication bus), low-speed signal harness, etc. The connector is electrically connected to an external power supply and a power management chip 14 in the housing 01.

[0083] Optionally, a filtering device is further provided between the power management chip 14 and the connector. The filtering device is arranged on the first circuit board 02 and is used to filter out high-frequency noise that may be introduced during power supply, suppress electromagnetic interference that may be generated when the power management chip 14 is working, and reduce the impact of power fluctuations on the power management chip 14, thereby improving the stability and reliability of the system.

[0084] In combination with the first aspect, in some implementations of the first aspect, the integrated driver status monitor includes a connector, and the connector further includes a power interface. The power interface is arranged on the first circuit board 02 and is connected to the power management chip 14. The power interface is used to connect to an external power supply and provide power to the power management chip 14.

[0085] In combination with the first aspect, in some implementations of the first aspect, the housing 01 includes: a first housing 011 and a second housing 012. The first housing 011 has fins on its outer side wall. The second housing 012 covers the first housing, and the second housing 012 is detachably connected to the first housing 011. For example, it further includes a connecting pipe 09. The first housing 011 is provided with structures such as a limiting groove and a limiting hole for the connecting pipe 09 to pass through. Threaded holes are opened at both ends of the connecting pipe 09, and both ends of the connecting pipe 09 are respectively connected to the first housing 011 and the second housing 012 by screws.

[0086] In combination with the first aspect, in some implementations of the first aspect, the second housing 012 is connected to the first housing 011 by screw connection or snap connection with concave-convex fit (snap connection structure or buckle position structure). Specifically, the snap can be designed in various forms, such as a card seat type, a hook type, and an elastic snap, etc.

[0087] In combination with the first aspect, in some implementations of the first aspect, optionally, a stepped card slot (not shown in the figure) is provided on the inner side wall of the first housing 011. The shape and area of the stepped card slot respectively match those of the first circuit board 02 and the second circuit board 04, so as to facilitate the fixed installation of the first circuit board 02 and the second circuit board 04 in the first housing 011. Optionally, the first circuit board 02 and the second circuit board 04 are connected to the first housing 011 by means of screw connection, snap connection, etc.

[0088] In connection with the first aspect, in certain implementations of the first aspect, the third circuit board 07 and the second housing 012 are connected by mounting bolts 15.

[0089] Figure 5 The following is a block diagram of a driver status monitoring all-in-one device provided by another embodiment of the present application. Figure 6 The following is an exploded view of a driver status monitoring all-in-one device provided by another embodiment of the present application.

[0090] In a second aspect, an embodiment of the present application provides a driver status monitoring all-in-one device. As Figure 5 and Figure 6 shown, the driver status monitoring all-in-one device includes: a housing 01, a fourth circuit board 17, a control unit, a fifth circuit board 18, a system-on-chip 05, and an image acquisition component 06. The fourth circuit board 17 is disposed within the housing 01, and through holes 021 are provided on the fourth circuit board 17. The control unit is disposed on the fourth circuit board 17. The fifth circuit board 18 is disposed within the housing 01, and the fifth circuit board 18 is disposed opposite to and isolated from the fourth circuit board 17. The system-on-chip 05 is disposed on the fifth circuit board 18. The image acquisition component 06 is disposed on a surface of the fifth circuit board 18 opposite to the fourth circuit board 17. A signal is transmitted between the image acquisition component 06 and the system-on-chip 05 through the MIPI protocol, and at least a part of the image acquisition component 06 passes through the through holes 021.

[0091] In this embodiment, the image acquisition component 06 and the system-on-chip 05 are mounted on the same circuit board, and a signal is transmitted between the two through the MIPI protocol. Therefore, there is no need to provide a FAKRA coaxial cable and a FAKRA connector between the camera and the image controller. Since there is no need for a FAKRA coaxial cable and a FAKRA connector, there is also no need to provide a pair of serializer / deserializer chips at the camera end and the image controller end, and there is no need to additionally provide a POC circuit to supply power to the camera. Based on the above structure, a large amount of hardware can be saved, the cost is saved, and the occupied space is reduced. Moreover, through holes 021 for a part of the structure of the image acquisition component 06 to pass through are provided on the first circuit board 02, further improving the space utilization rate and reducing the overall volume of the device.

[0092] In connection with the second aspect, in certain implementations of the second aspect, both the system-on-chip 05 and the image acquisition component 06 are disposed on a surface of the fifth circuit board 18 opposite to the fourth circuit board 17, and the control unit is disposed on a surface of the fourth circuit board 17 away from the fifth circuit board 18.

[0093] In this embodiment, by optimizing the spatial positions of the heat-generating components in the driver status monitoring all-in-one machine, the space inside the housing 01 can be effectively utilized, heat concentration can be avoided, and heat dissipation can be carried out in two or more directions to improve the heat dissipation efficiency. Specifically, the heat generated by the system-on-chip 05 and the image acquisition component 06 is mainly transferred and dissipated in the direction away from the fourth circuit board 17 of the fifth circuit board 18, while the heat generated by the control unit is transferred and dissipated in the opposite direction (the direction of the fourth circuit board 17 away from the fifth circuit board 18), thereby improving the heat dissipation efficiency, further reducing the overall volume of the device, enhancing its applicability, and adapting to multiple models of automobiles.

[0094] Combined with the second aspect, in some implementation manners of the second aspect, the housing 01 serves as a support component of the driver status monitoring all-in-one machine, mainly playing a role of fixing and supporting, and providing an installation space for accommodating other components.

[0095] Combined with the second aspect, in some implementation manners of the second aspect, the image acquisition component 06 and the system-on-chip 05 are both arranged on the fifth circuit board 18, and the signals are transmitted between them through the MIPI protocol, which can avoid additional cable connections (as well as corresponding connectors, serializer / deserializer chips, etc.). Specifically, the MIPI signal transmission between the image acquisition component 06 (including the camera) and the system-on-chip 05 is realized through the circuits on the printed circuit board (PCB). These circuits include differential signal lines, impedance matching circuits, filtering circuits, etc., which together constitute the transmission channel of the MIPI signal to ensure the quality and stability of the MIPI signal during transmission. Based on this design, the space occupied by some components can be saved, the installation process can be simplified, thereby reducing the hardware cost and improving the stability and reliability of the system.

[0096] In this embodiment, the image acquisition component 06 has a transmitter end, including a module for data packing and encoding, which converts pixel data into byte data suitable for transmission via the MIPI protocol; Structurally, the image acquisition component 06 includes a high-speed transmitter (HS-TX) and a low-power transmitter (LP-TX) for transmitting data at the physical layer. The system-on-chip 05 has a receiver end, including a module for data unpacking and decoding, which converts the received byte data back into pixel data; Structurally, it includes a high-speed receiver (HS-RX) and a low-power receiver (LP-RX) for receiving data at the physical layer. Optionally, the MIPI protocol supports simultaneous data transmission through multiple data channels to increase the bandwidth and rate of data transmission. In addition, in order to implement MIPI protocol communication between the image acquisition component 06 and the system-on-chip 05, the driver status monitoring all-in-one machine further includes differential signal lines, a clock generator, and other auxiliary components (such as resistors, capacitors, etc.). The differential signal lines, the clock generator, and other auxiliary components are usually installed at the connection part between the image acquisition component 06 and the system-on-chip 05, or near these two components, mainly by providing a stable and reliable signal transmission path and clock signal to support communication between the image acquisition component 06 and the system-on-chip 05. The differential signal lines are used to transmit differential signals, which can reduce the influence of electromagnetic interference and noise and improve the stability and reliability of data transmission. The clock generator is used to generate a clock signal to ensure that data is transmitted in the correct timing. Other auxiliary components such as resistors and capacitors may be used to adjust signals, filter, or provide necessary circuit protection and other functions. These components work together to enable efficient and reliable MIPI protocol communication between the image acquisition component 06 and the system-on-chip 05.

[0097] Combined with the second aspect, in some implementation manners of the second aspect, the image acquisition component 06 includes a lens, wherein the shape of the through hole 021 is adapted to the shape of the lens. Optionally, at least part of the structure of the lens passes through the through hole 021 on the fourth circuit board 17. Based on this, the internal space of the housing 01 can be utilized to a greater extent, thereby reducing the overall size of the driver status monitoring all-in-one machine, facilitating better installation of the driver status monitoring all-in-one machine, and improving its applicability to adapt to multiple models of automobiles.

[0098] Combined with the second aspect, in some implementation manners of the second aspect, the driver status monitoring all-in-one machine further includes a lighting component 08, and the lighting component 08 is arranged on one side of the fourth circuit board 17 away from the fifth circuit board 18.

[0099] In this embodiment, by arranging the lighting component 08 on the fourth circuit board 17, the image acquisition component 06 can be supplemented with light to ensure that the image acquisition component 06 can work normally in various working environments and obtain high-quality image data.

[0100] In combination with the second aspect, in some implementations of the second aspect, a driving circuit connected to the light-emitting component 08 is provided on the fourth circuit board 17 to ensure the normal operation of the light-emitting component 08. The light-emitting component 08 includes a supplementary light, for example, an LED lamp.

[0101] In combination with the second aspect, in some implementations of the second aspect, the driver status monitoring all-in-one machine further includes: a mounting bracket 10 and an ear plate 101. The mounting bracket 10 is used to connect to the housing 01. Specifically, the housing 01 and the mounting bracket 10 can be connected by fastening bolts 11. In some alternative solutions, the mounting bracket 10 can also be connected by means such as adhesion and snap connection. An ear plate 101 extends outward from the side edge of the mounting bracket 10. An opening is provided on the ear plate 101, and the ear plate 101 is connected to the frame structure of the vehicle through this opening. For example, corresponding openings are also provided on the frame structure, and the ear plate 101 and the frame structure are connected by bolts. Further, the driver status monitoring all-in-one machine can be installed inside the A-pillar of the vehicle. Specifically, an opening is reserved on the A-pillar, and the two are fixedly connected by bolts in cooperation with the opening on the ear plate 101. Among them, a window for exposing the image acquisition component 06 is provided on the A-pillar. After the driver status monitoring all-in-one machine is installed, the image acquisition component 06 obtains the image information of the driver through the reserved window.

[0102] In combination with the second aspect, in some implementations of the second aspect, the driver status monitoring all-in-one machine further includes a power management chip. Optionally, as Figure 5 shown, the power management chips are respectively provided on the fourth circuit board 17 and the fifth circuit board 18, and the two power management chips are respectively electrically connected to the control unit.

[0103] In this embodiment, by respectively providing a power management chip (PMIC) on the fourth circuit board 17 and the fifth circuit board 18, it is possible to achieve refined management of the power supply of each circuit board, improving the performance and stability of the entire device.

[0104] The power management chip located on the fifth circuit board 18 is respectively connected to the image acquisition component and the SOC to provide power. The power management chip located on the fourth circuit board 17 is connected to the light-emitting component to provide power. The power management chip located on the fourth circuit board 17 and the power management chip located on the fifth circuit board 18 are respectively connected to the MCU to achieve stable control of the MCU. For example, when one of the power management chips has a problem, the other power management chip can still stably provide power for the MCU.

[0105] In combination with the second aspect, in some implementations of the second aspect, such as Figure 5As shown, the integrated driver status monitoring device also includes a connector, which is connected to the vehicle / superior controller via CAN (serial communication bus), a low-speed signal harness, etc. The connector is electrically connected to an external power supply and a power management chip in the housing 01.

[0106] In conjunction with the second aspect, in certain implementations of the second aspect, such as Figure 5 and Figure 6 As shown, the integrated driver status monitoring device further includes a sixth circuit board 19, which is disposed in the housing 01. The connector further includes a power interface 03 for connecting an external power source, which is disposed on the sixth circuit board 19, and the sixth circuit board 19 is located on a side of the fourth circuit board 17 away from the fifth circuit board 18.

[0107] In this embodiment, the power interface 03 on the sixth circuit board 19 is electrically connected to an external power source to supply power to the fourth circuit board 17 , the fifth circuit board 18 and the components thereon.

[0108] Optionally, in combination with the second aspect, a filter device is also arranged between the power management chip and the connector. The filter device is arranged on the sixth circuit board. The filter device is used to filter high-frequency noise that may be introduced during the power supply process, suppress electromagnetic interference that may be generated by the power management chip during operation, and reduce the impact of power supply fluctuations on the power management chip, thereby improving the stability and reliability of the system.

[0109] In combination with the second aspect, in certain implementations of the second aspect, the shell 01 includes: a first shell 011 and a second shell 012. The first shell 011 is provided with fins on its outer side wall. Preferably, the fifth circuit board 18 is disposed in the shell 01 at one end close to the fins, so as to quickly dissipate the heat generated by the system-on-chip and the image acquisition component. The second shell 012 is covered on the first shell, and the second shell 012 is detachably connected to the first shell 011. For example, it also includes a connecting tube 09, and the first shell 011 is provided with a limiting groove, a limiting hole and other structures for the connecting tube 09 to pass through, and threaded holes are provided at both ends of the connecting tube 09, and the two ends of the connecting tube 09 are respectively connected to the first shell 011 and the second shell 012 by screws.

[0110] In combination with the second aspect, in certain implementations of the second aspect, the second shell 012 is connected to the first shell 011 by screws or a snap-fit ​​connection (snap-fit ​​connection structure or buckle structure). Specifically, the snap can be designed into various forms, such as a socket type, a hook type, and an elastic snap.

[0111] In combination with the second aspect, in certain implementation manners of the second aspect, optionally, a stepped card slot (not shown in the figure) is provided on the inner side wall of the first housing 011. The shape and area of the stepped card slot respectively match those of the fifth circuit board 18 and the fourth circuit board 17, so as to facilitate the fixed installation of the fourth circuit board 17 and the fifth circuit board 18 in the first housing 011. Optionally, the fourth circuit board 17 and the fifth circuit board 18 are connected to the first housing 011 by means of screw connection, snap connection, etc.

[0112] In combination with the second aspect, in certain implementation manners of the second aspect, mounting holes are formed on the sixth circuit board 19, and threaded blind holes are provided on the inner side wall of the second housing 012. The sixth circuit board 19 is mounted and fixed on the second housing 012 by means of mounting bolts.

[0113] In combination with the second aspect, in certain implementation manners of the second aspect, the driver status monitoring all-in-one machine further includes: a light-shielding foam 12 and a filter 13. The light-shielding foam 12 is annular, and the light-shielding foam 12 is located on the periphery of the lens of the image acquisition component 06. The filter 13 is disposed on the side of the lens away from the fifth circuit board 18.

[0114] In this embodiment, the light-shielding foam 12 can effectively block the light from around the camera, preventing non-imaging light from entering the lens, thereby improving the clarity and contrast of the captured image. Especially when shooting against the light, side light or using a flash, the light-shielding foam 12 can significantly reduce light interference, avoiding unnecessary haze or light spots in the photo, thereby improving the accuracy of the acquired image.

[0115] Furthermore, the light-shielding foam 12 can also protect the lens from accidental damage to a certain extent, and reduce the impact of external vibration on the camera to a certain extent, improving the shooting stability. At the same time, the material and design of the light-shielding foam 12 endow it with certain dust-proof and moisture-proof capabilities.

[0116] In a third aspect, an embodiment of the present application provides a driver status monitoring system, including the driver status monitoring all-in-one machine as described in the foregoing embodiment.

[0117] So far, the embodiments of the present disclosure have been described in detail with reference to the accompanying drawings. It should be noted that the implementation manners not depicted or described in the drawings or the text of the specification are all forms known to those of ordinary skill in the art and have not been described in detail. In addition, the above definitions of each component are not limited to the specific structures, shapes or manners mentioned in the embodiments, and those of ordinary skill in the art can make simple changes or substitutions thereto.

[0118] It should also be noted that in the specific embodiments of the present disclosure, unless there is a clear indication or description to the contrary, the numerical parameters in this specification and the appended claims are approximate values and can be changed according to the required characteristics obtained through the content of the present disclosure. Specifically, all the numbers representing dimensions, range conditions, etc. of the components used in the specification and the claims should be understood to be modified by the term "about" in all cases. Generally, the meaning expressed is that it includes a change of ±10% in some embodiments, a change of ±5% in some embodiments, a change of ±1% in some embodiments, and a change of ±0.5% in some embodiments for a specific quantity.

[0119] Those skilled in the art can understand that the features recited in the various embodiments and / or claims of the present invention can be combined or combined in various ways, even if such combinations or combinations are not explicitly recited in the present invention. In particular, without departing from the spirit and teachings of the present invention, the features recited in the various embodiments and / or claims of the present invention can be combined and combined in various ways. All such combinations and / or combinations fall within the scope of the present invention.

[0120] The specific embodiments described above further elaborate on the purpose, technical solutions, and beneficial effects of the present invention. It should be understood that the above are only specific embodiments of the present invention and are not used to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.

Claims

1. A driver status monitoring integrated machine, characterized in that: include: case; A first circuit board is disposed in the housing, wherein the first circuit board has a first surface and a second surface; A control unit, arranged on the first surface of the first circuit board; A second circuit board is arranged in the housing, the second circuit board has a third surface and a fourth surface, the third surface is arranged opposite to and isolated from the second surface of the first circuit board; A system on chip, disposed on a fourth surface of the second circuit board; The image acquisition component is arranged on the fourth surface of the second circuit board, and the image acquisition component transmits signals to the system on chip through the MIPI protocol.

2. The integrated driver status monitoring device according to claim 1, characterized in that: Also includes: A third circuit board is arranged in the housing, the third circuit board is located on a side of the second circuit board away from the first circuit board, and the third circuit board is isolated from the second circuit board; The light emitting component is arranged on a surface of the third circuit board away from the second circuit board.

3. The integrated driver status monitoring device according to claim 2, characterized in that: The area of ​​the third circuit board is smaller than that of the second circuit board, and the orthographic projection of the image acquisition component on the second circuit board is at least partially located outside the orthographic projection of the third circuit board on the second circuit board.

4. The integrated driver status monitoring device according to claim 1, characterized in that: Also includes: A mounting bracket connected to the housing; A lug plate is arranged on the mounting bracket, and the lug plate is suitable for being connected to a frame structure of a car.

5. The integrated driver status monitoring device according to claim 1, characterized in that: The image acquisition component includes a lens, and the driver status monitoring integrated machine also includes: Light-shielding foam, in a ring shape, located around the lens; The filter is arranged on a side of the lens away from the second circuit board.

6. The integrated driver status monitoring device according to claim 1, characterized in that: The housing comprises: A first shell having fins disposed on its outer side wall; The second shell is covered on the first shell, and the second shell is detachably connected to the first shell.

7. A driver status monitoring integrated machine, characterized in that: include: case; A fourth circuit board is arranged in the housing, and the fourth circuit board is provided with a through hole; A control unit, arranged on the fourth circuit board; a fifth circuit board, disposed in the housing, the fifth circuit board being disposed opposite to and isolated from the fourth circuit board; A system on chip, arranged on the fifth circuit board; An image acquisition component is arranged on a surface of the fifth circuit board opposite to the fourth circuit board, and signals are transmitted between the image acquisition component and the system on chip via the MIPI protocol. The image acquisition component at least partially passes through the through hole.

8. The integrated driver status monitoring device according to claim 7, characterized in that: Also includes: The light emitting component is arranged on a side of the fourth circuit board away from the fifth circuit board.

9. The integrated driver status monitoring device according to claim 7, characterized in that: Also includes: A sixth circuit board is arranged in the housing, and a power interface for connecting to an external power source is arranged on the sixth circuit board. The sixth circuit board is located on a side of the fourth circuit board away from the fifth circuit board.

10. A driver status monitoring system, characterized in that: It comprises a driver status monitoring integrated machine as described in any one of claims 1 to 9.

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