Method for reducing noise of electronic equipment

Abstract

The invention relates to a method for reducing noise of electronic equipment, which can effectively reduce electromagnetic noise caused by mainboard current interference and radio frequency magnetic field interference so as to improve the electromagnetic compatibility of the equipment and more reliably meet the market access requirement. Meanwhile, compared with a traditional large-area shielding scheme, the nanocrystalline material sheet with the specific size and layout adopted in the method can act near a noise source more accurately, a more efficient noise suppression effect is achieved, and therefore the use amount of needed shielding materials can be remarkably reduced and the production cost can be reduced while the shielding performance is guaranteed or even improved. The influence of the shielding material on the internal space and the weight of the equipment is reduced, and the light and thin design and the improvement of the heat dissipation performance of the electronic equipment are facilitated; in addition, the method is easy to implement, does not need to carry out large-scale modification on the circuit design of the existing electronic equipment, can be quickly deployed on a production line, and has a good industrial application prospect.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic devices, and particularly to a method for reducing the noise of electronic devices. Background Art

[0002] With the development of mobile communication technology and electronic devices, people have higher and higher requirements for the audio performance of electronic devices in various environments. Especially for people wearing hearing aids, the electromagnetic interference generated by electronic devices may affect the normal operation of hearing aids, resulting in hearing impairment. To solve this problem, the Federal Communications Commission (FCC) of the United States has formulated the Hearing Aid Compatibility (HAC) standard, and the HAC2019 standard is a mandatory requirement for mobile communication devices. The HAC2019 test aims to evaluate whether an electronic device will generate unnecessary electromagnetic noise interference during short-range communication, so as to ensure the normal use experience of hearing aid users.

[0003] The HAC2019 test requires that under specific conditions, the electromagnetic interference generated by an electronic device must be lower than a certain limit value. If the device fails the test, it cannot be sold in the US market, which poses a great challenge to electronic device manufacturers. To solve the electromagnetic interference problem in electronic devices, currently, mainly conductive materials (such as metals) are used to wrap the circuit board or specific components to block the propagation of electromagnetic waves and reduce interference, or filter circuits are constructed using electronic components such as capacitors and inductors to filter out electromagnetic waves of specific frequencies.

[0004] Although the above methods can alleviate the electromagnetic interference problem to a certain extent, there are still drawbacks in practice. For example, using conductive materials to wrap the circuit board or specific components is simple and easy to implement, but there are often problems such as poor shielding effect, high cost, increased device weight and volume; while the design and debugging of filter circuits are relatively complex, and there may be problems such as insertion loss. Summary of the Invention

[0005] To solve the above problems, the present invention provides a method for reducing the noise of electronic devices that can effectively reduce the electromagnetic noise caused by main board current interference and radio frequency magnetic field interference and more reliably meet the market access requirements.

[0006] To achieve the above object, the method for reducing the noise of electronic devices designed by the present invention includes the following steps:

[0007] S10. Analyze the noise energy map of the main board of the electronic device to determine the position of the noise source;

[0008] S20. Select at least two nanocrystalline material sheets with a magnetic permeability of 8000u and a thickness of 0.05 mm;

[0009] S30. Symmetrically paste the nanocrystalline material sheet into the battery compartment of the main board of the electronic device, and make the nanocrystalline material sheet adhere to the position near the noise source;

[0010] S40. Conduct the HAC2019 noise test, and adjust the attachment position of the nanocrystalline material sheet according to the noise energy diagram of the test result.

[0011] Preferably, the nanocrystalline material sheet is a YM50B 0.05T nanocrystalline material.

[0012] Preferably, step S30 includes the step of symmetrically pasting the nanocrystalline material sheet into the battery compartment of the main board of the electronic device, and making the nanocrystalline material sheet distributed in the width direction of the battery compartment.

[0013] Preferably, there are two nanocrystalline material sheets, and the width of the nanocrystalline material sheet on the left side of the battery compartment is greater than the width of the nanocrystalline material sheet on the right side of the battery compartment, and the sizes of the two nanocrystalline material sheets are 83mm * 15mm and 83mm * 13mm respectively.

[0014] Preferably, step S30 further includes the step of pasting the nanocrystalline material sheet onto the bottom wall of the battery compartment of the main board of the electronic device.

[0015] Preferably, in step S40, adjusting the attachment position of the nanocrystalline material sheet includes adjusting the number, shape or direction of the nanocrystalline material sheet.

[0016] Preferably, the electronic device is a mobile phone.

[0017] Preferably, the HAC2019 noise test includes noise tests for the GSM850 and LTE B41 frequency bands.

[0018] The method for reducing the noise of electronic devices designed by the present invention utilizes nanocrystalline material sheets of specific models, sizes, and shapes and precisely attaches them to specific areas of the battery compartment of the main board of the electronic device, which can effectively reduce the electromagnetic noise caused by main board current interference and radio frequency magnetic field interference, thereby improving the electromagnetic compatibility of the device and more reliably meeting the market access requirements. At the same time, compared with the traditional large-area shielding scheme, the nanocrystalline material sheets with specific sizes and layouts adopted by this method can act more precisely near the noise source, achieving a more efficient noise suppression effect. Furthermore, while ensuring or even enhancing the shielding performance, the amount of shielding material required can be significantly reduced, the production cost can be lowered, and the impact of the shielding material on the internal space and weight of the device can be alleviated, which is beneficial to the thin and light design of the electronic device and the improvement of the heat dissipation performance. In addition, this method is easy to implement, does not require large-scale modification of the circuit design of existing electronic devices, can be quickly deployed on the production line, and has good industrial application prospects. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a flowchart of the method for reducing the noise of electronic devices provided by an embodiment of the present application.

[0020] Figure 2 is the noise test energy diagram provided by an embodiment of the present application.

[0021] Figure 3 is a schematic diagram of the main board area mapping the noise energy provided by an embodiment of the present application. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0022] The preferred embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are only for the purpose of illustrating and explaining the present invention, and are not used to limit the present invention.

[0023] The method for reducing the noise of electronic devices described in this embodiment is specifically a mobile phone for the electronic device, such as Figure 1 shown, and includes the following steps:

[0024] S10. Analyze the noise energy diagram of the main board of the electronic device to determine the location of the noise source.

[0025] Specifically, as Figure 2 、 Figure 3As shown, a professional spectrum analyzer or noise test software can be used to collect the electromagnetic noise data of the mobile phone motherboard in the normal working state, and an intuitive noise energy map can be generated based on this data. This energy map can visually present the electromagnetic noise intensity distribution of each area on the motherboard, usually represented by different colors or brightness levels. For example, through the analysis of the noise energy map of a specific mobile phone motherboard, it may be found that the electromagnetic noise radiation intensity is relatively high in areas close to the radio frequency module, power management unit, or high-frequency clock circuit, etc. These are the positions of the noise sources that need to be focused on and processed. In this way, it can provide an accurate basis for selecting the pasting positions of nanocrystalline materials in the subsequent steps.

[0026] S20. Select at least two nanocrystalline material sheets with a permeability of 8000μ and a thickness of 0.05mm. For example, select YM50B 0.05T nanocrystalline material sheets with a permeability of not less than 8000μ and a thickness of 0.05mm. This material has good electromagnetic noise absorption characteristics at specific frequencies and can absorb or guide noise more effectively, thus achieving a better noise reduction effect.

[0027] S30. Symmetrically paste the nanocrystalline material sheets into the battery compartment of the motherboard of the electronic device, and make the nanocrystalline material sheets adhere near the noise source positions. When pasting, it is necessary to make the nanocrystalline material sheets as close as possible to the noise source positions determined in step S10 to ensure that they can absorb or guide electromagnetic noise more effectively.

[0028] Specifically, the pasting method of the nanocrystalline material sheets needs to meet the following requirements: First, the nanocrystalline material sheets should be symmetrically pasted in the battery compartment to ensure uniform absorption of electromagnetic noise. Second, the nanocrystalline material sheets need to be distributed in the width direction of the battery compartment to maximize their coverage of electromagnetic noise. Preferably, two nanocrystalline material sheets with different widths can be selected in this step. For example, one with a width of 83mm * 15mm and the other with a width of 83mm * 13mm. And paste these two nanocrystalline material sheets symmetrically on both sides of the battery compartment, and make the one with the larger width adhere to the side closer to the noise source to achieve a better noise reduction effect. For example, if it is determined in step S10 that the noise source is on the left side of the battery compartment, then paste the nanocrystalline material sheet with a width of 83mm * 15mm on the left side of the battery compartment, and the other nanocrystalline material sheet with a width of 83mm * 13mm on the right side of the battery compartment. In actual operation, thermal conductive glue or double-sided tape can be used to firmly paste and fix the nanocrystalline material sheets in the battery compartment to prevent them from moving or falling off, thus affecting the noise reduction effect. In addition, in order to ensure that the nanocrystalline material sheets are fully attached to the inner wall of the battery compartment, appropriate tools can be used to gently press them to make them adhere more firmly.

[0029] S40. Conduct the HAC2019 noise test, and adjust the attachment position of the nanocrystalline material sheet according to the noise energy map of the test results. In this embodiment, adjusting the attachment position of the nanocrystalline material sheet includes adjusting the number, shape or orientation of the nanocrystalline material sheet, and the HAC2019 noise test includes the noise test for the GSM850 and LTE B41 frequency bands.

[0030] Specifically, after the nanocrystalline material sheet is attached, it is necessary to collect the electromagnetic noise data of the mobile phone in the working state by using professional HAC2019 test equipment in a standard HAC2019 test environment to generate a new noise energy map. Subsequently, by comparing the noise energy maps before and after attaching the nanocrystalline material sheet, the noise reduction effect of the nanocrystalline material sheet can be intuitively evaluated, and the areas where the noise is still strong can be located. If the test results show that the electromagnetic noise intensity still exceeds the requirements of the HAC2019 standard, it is necessary to dynamically adjust the attachment of the nanocrystalline material sheet according to the new noise energy map to obtain the best noise reduction performance.

[0031] The specific methods of dynamic adjustment include: First, according to the new noise energy map, if it is found that the position of the noise source has shifted, it is necessary to adjust the attachment position of the nanocrystalline material sheet accordingly to make it closer to the new noise source. Second, the attachment angle and orientation of the nanocrystalline material sheet can be adjusted to better absorb or guide the electromagnetic noise in a specific direction. In addition, the number of nanocrystalline material sheets can be appropriately increased or decreased according to the test results, or nanocrystalline material sheets of other shapes can be replaced to further optimize the noise reduction effect. In actual operation, it may be necessary to conduct tests and adjustments multiple times to optimize the noise reduction performance of the nanocrystalline material sheet and ultimately ensure that the mobile phone successfully passes the HAC2019 test.

[0032] To verify the effectiveness of this method in practical applications, this embodiment focuses on testing the noise in the GSM850 and LTE B41 frequency bands. This is because at these two frequency bands, the radio frequency power of the mobile phone is relatively high, and strong electromagnetic interference is likely to be generated. Therefore, focusing on testing these two frequency bands can better evaluate the noise reduction effect.

[0033] Preferably, step S30 further includes the step of pasting the nanocrystalline material sheet onto the bottom wall of the battery compartment of the electronic device main board. In this way, the nanocrystalline material sheet can be closer to the main board or other components that may generate electromagnetic noise inside the electronic device more directly and tightly, thereby maximizing the electromagnetic wave absorption characteristics of the nanocrystalline material and improving the noise suppression effect. In addition, the bottom wall of the battery compartment usually has a relatively flat surface, which is convenient for attaching the nanocrystalline material sheet, and the structure of the battery compartment itself can provide certain physical support to enhance the stability of the attachment.

[0034] The method for reducing the noise of an electronic device provided in this embodiment uses a nanocrystalline material sheet with a specific model, size, and shape and precisely attaches it to a specific area of the battery compartment of the main board of the electronic device, which can effectively reduce the electromagnetic noise caused by the interference of the main board current and the radio frequency magnetic field, thereby improving the electromagnetic compatibility of the device and more reliably meeting the market access requirements; at the same time, compared with the traditional large-area shielding scheme, the nanocrystalline material sheet with a specific size and layout adopted by this method can act more precisely near the noise source, achieving a more efficient noise suppression effect. Furthermore, it can significantly reduce the amount of shielding material required while ensuring or even improving the shielding performance, reduce the production cost, and alleviate the impact of the shielding material on the internal space and weight of the device, which is beneficial to the thin and light design of the electronic device and the improvement of the heat dissipation performance; in addition, this method is easy to implement, does not require large-scale modification of the circuit design of the existing electronic device, and can be quickly deployed on the production line, having good industrial application prospects.

[0035] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "vertical", "upper", "lower", "horizontal", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0036] In the description of the present invention, it should also be noted that unless otherwise clearly specified and defined, the terms "set", "install", "connect", and "couple" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0037] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A method for reducing noise of electronic equipment, characterized in that: The following steps are involved: S10. Analyze the noise energy diagram of the electronic device motherboard to determine the location of the noise source; S20. Select at least two nanocrystalline material sheets having a magnetic permeability of 8000u and a thickness of 0.05mm; S30. symmetrically attaching the nanocrystalline material sheet to the battery compartment of the electronic device mainboard, and attaching the nanocrystalline material sheet near the noise source; S40. Perform HAC2019 noise test and adjust the attachment position of the nanocrystalline material sheet according to the noise energy diagram of the test result.

2. The method for reducing noise of electronic equipment according to claim 1, characterized in that: The nanocrystalline material sheet is YM50B 0.05T nanocrystalline material.

3. The method for reducing noise of electronic equipment according to claim 1, characterized in that: Step S30 includes the step of symmetrically pasting the nanocrystalline material sheet into the battery compartment of the electronic device mainboard, and distributing the nanocrystalline material sheet in the width direction of the battery compartment.

4. The method for reducing noise of electronic equipment according to claim 3, characterized in that: There are two nanocrystalline material sheets, and the width of the nanocrystalline material sheet located on the left side of the battery compartment is greater than the width of the nanocrystalline material sheet located on the right side of the battery compartment, and the sizes of the two nanocrystalline material sheets are 83mm*15mm and 83mm*13mm respectively.

5. The method for reducing noise of electronic equipment according to claim 1, characterized in that: Step S30 also includes the step of sticking the nanocrystalline material sheet to the bottom wall of the battery compartment of the mainboard of the electronic device.

6. The method for reducing noise of electronic equipment according to claim 1, characterized in that: In step S40, adjusting the attachment position of the nanocrystalline material sheet includes adjusting the number, shape or direction of the nanocrystalline material sheet.

7. The method for reducing noise of electronic equipment according to claim 1, characterized in that: The electronic device is a mobile phone.

8. The method for reducing noise of electronic equipment according to claim 1, characterized in that: The HAC2019 noise test includes noise tests for GSM850 and LTE B41 frequency bands.

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