Display panel, display device, and repair method of display panel

Abstract

The application discloses a display panel, a display device and a repairing method of the display panel, and relates to the technical field of display devices, wherein the display panel comprises a display area and a non-display area; the non-display area is arranged around the periphery of the display area, and the non-display area is provided with a driving chip, a first driving line, a second driving line and a connecting line; wherein the first driving line and the second driving line are respectively located on the two sides of the driving chip, and are electrically connected with the driving chip; at least part of the connecting line is located on different layers of the first driving line and the second driving line in the non-display area, and the projection of the surface of the non-display area at least partially overlaps. The display panel provided by the application can electrically conduct the connecting line, the first driving line and the second driving line in the area where the projections of the surface of the non-display area overlap by means of laser radiation or a counterbore process when the pin on one side of the driving chip is invalid, so that the display area can normally display, and the yield of products is improved.

Description

Technical Field

[0001] This invention relates to the field of display device technology, and in particular to a display panel, a display device, and a method for repairing the display panel. Background Technology

[0002] With the rapid development of display technology, the market has placed higher demands on the display effects of display panels. To meet these demands, the internal circuit design of display panels has become increasingly complex, especially with the ever-increasing number of output pins in the driver chip. To achieve high-density electrical connections, existing technologies typically place multiple bumps on one side of the driver chip, connecting these bumps to pads on the substrate, and thus connecting the various driver lines. For example, in a head-to-head display panel using a GDL (Gate Driver Less) driver architecture, the output signals on both sides of the driver chip are consistent, and the gate driver circuit is integrated in the non-display area of ​​the display panel and connected to the output pins of the driver chip via circuitry.

[0003] However, while this IC bump-connected substrate pad structure enables high-density electrical connections, damage can easily occur between the bump and the pads in practical applications. This damage can be caused by foreign objects, electrostatic discharge (ESD), and other factors, leading to problems such as damage to the conductive metal of the substrate, via corrosion, and ACF (anisotropic conductive adhesive) particle failure. These issues ultimately prevent the IC output signal from being transmitted normally and effectively to the GDL, resulting in display defects in the display panel and severely impacting product yield. Summary of the Invention

[0004] The main objective of this invention is to provide a display panel, a display device, and a method for repairing the display panel, aiming to solve the problem that damage easily occurs between the driver chip and the pads of existing display panels, leading to poor display performance.

[0005] To achieve the above objectives, the present invention provides a display panel comprising:

[0006] Display area; and

[0007] A non-display area is provided around the outer periphery of the display area, and a driver chip, a first driver line, a second driver line, and connecting lines are provided in the non-display area;

[0008] The first driving line and the second driving line are located on both sides of the driving chip and are electrically connected to the driving chip. At least a portion of the connecting line is located on a different layer within the non-display area from the first driving line and the second driving line, and at least partially overlaps with the projection of the connecting line onto the surface of the non-display area.

[0009] In one embodiment of the present invention, the connecting line includes a first connecting line, which is located on a different layer within the display area along with the first driving line and the second driving line. The two ends of the first connecting line coincide with the projections of the first driving line and the second driving line onto the surface of the non-display area, respectively.

[0010] In one embodiment of the present invention, the connecting line includes a second connecting line and two first connecting lines. The second connecting line is located on the same layer in the display area as the first driving line and the second driving line, and is spaced apart. The two first connecting lines and the second connector are located on different layers in the display area. One end of the first connecting line coincides with the projection of the first driving line or the second driving line onto the surface of the non-display area, and the other end coincides with the projection of the second connecting line onto the surface of the non-display area.

[0011] In one embodiment of the present invention, the connecting line includes a first connecting line and two second connecting lines. The two second connecting lines are respectively connected to the first driving line and the second driving line. The two second connecting lines are spaced apart. The first connecting line and the second connecting lines are located on different layers within the non-display area. The two ends of the first connecting line coincide with the projections of the two second connecting lines onto the surface of the non-display area.

[0012] In one embodiment of the present invention, the connecting line includes a first connecting line and a second connecting line. The first connecting line and the second connecting line are located on different layers within the display area relative to the first driving line and the second driving line, respectively. One end of the first connecting line coincides with the projection of the first driving line onto the surface of the non-display area, and the other end coincides with the projection of the second connecting line onto the surface of the non-display area. One end of the second connecting line relative to the first connecting line coincides with the projection of the second driving line onto the surface of the non-display area.

[0013] In one embodiment of the present invention, the connecting line and the driving chip are respectively located on opposite sides of the display area.

[0014] In one embodiment of the present invention, the connecting line and the driving chip are located on the same side of the display area.

[0015] In one embodiment of the present invention, the non-display area includes a plurality of first driving lines, a plurality of second driving lines, and a plurality of connecting lines. The plurality of first driving lines and the plurality of second driving lines are symmetrically arranged on both sides of the display area, and each of the connecting lines at least partially coincides with the projection of a first driving line and a second driving line onto the surface of the non-display area.

[0016] The present invention also proposes a display device, the display device comprising a backlight module and a display panel as described above; the backlight module is disposed opposite to the display panel, and the backlight module provides a display light source to the display panel.

[0017] The present invention also proposes a method for repairing the aforementioned display panel, the method comprising the steps of:

[0018] Light up the display panel to determine the location of the failed solder joint of the driver chip, and the first or second drive line connected to the failed solder joint;

[0019] The connecting line is electrically connected to the first driving line and the second driving line by means of laser penetration and fusion of the overlapping portions of the projections of the connecting line, the first driving line and the second driving line on the surface of the non-display area.

[0020] The display panel proposed in this invention includes a display area and a non-display area. The non-display area surrounds the display area and contains a driver chip, a first driver line, a second driver line, and connecting lines. The first and second driver lines are located on opposite sides of the driver chip and are electrically connected to it. Signals output from the pins on both sides of the driver chip are transmitted to the light-emitting structure of the display area via the first and second driver lines to control the display. At least a portion of the connecting lines is located on a different layer from the first and second driver lines, so that the first driver line cannot conduct through the connecting lines to the second driver line under normal display panel operation. Simultaneously, the projections of the connecting lines, the first driver line, and the second driver line onto the surface of the non-display area at least partially overlap. Therefore, when a pin on one side of the driver chip fails, the area where the projections of the connecting lines and the first and second driver lines overlap on the surface of the non-display area can be electrically connected using laser engraving or countersunk hole technology. This allows signals from the other side of the driver chip to be transmitted to the second driver line via the first driver line and connecting lines, or vice versa, ensuring normal display and improving product yield.

[0021] Simultaneously, during failure analysis, when an output pin on one side of the driver chip fails, causing an abnormal output signal, it is necessary to connect the normal signal on the other side of the driver chip to the driver circuit on the failed side via an external test circuit to verify the failure mechanism. Because the pin solder joints of the driver chip are small, connecting external test circuits often damages other circuits on the panel and the driver chip itself, making effective verification impossible.

[0022] This application uses a connecting line to transmit the output signal from one side of the driver chip to the other side, enabling the first and second driving lines on both sides of the driver chip to properly drive the light-emitting structure of the display area and perform failure mechanism analysis. Therefore, there is no need to connect an external test circuit to the driving circuit on the failed side of the driver chip, improving the convenience of failure analysis and avoiding damage to the display panel during failure analysis. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the structure of the display panel provided by the present invention in the first embodiment;

[0025] Figure 2 for Figure 1 Sectional view along AA;

[0026] Figure 3 This is a schematic diagram of the structure of the display panel provided by the present invention in a second embodiment;

[0027] Figure 4 for Figure 3 Sectional view along BB;

[0028] Figure 5 This is a schematic diagram of the structure of the display panel provided by the present invention in a third embodiment;

[0029] Figure 6 This is a schematic diagram of the structure of the display panel provided by the present invention in the sixth embodiment;

[0030] Figure 7 This is a flowchart of one embodiment of the display panel repair method provided by the present invention.

[0031] Explanation of icon numbers:

[0032] 10. Display area; 20. Non-display area; 21. Driver chip; 22. First driver line; 23. Second driver line; 24. Connecting line; 241. First connecting line; 242. Second connecting line; 25. Substrate; 26. Insulating layer; 27. Test pad.

[0033] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0034] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0035] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0036] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0037] This invention proposes a display panel.

[0038] Combination Figures 1 to 6 As shown, in one embodiment of the present invention, the display panel includes a display area 10 and a non-display area 20; the non-display area 20 is arranged around the outer periphery of the display area 10, and a driver chip 21, a first driver line 22, a second driver line 23 and a connecting line 24 are provided in the non-display area 20.

[0039] The first driving line 22 and the second driving line 23 are located on both sides of the driving chip 21 and are electrically connected to the driving chip 21. At least a portion of the connecting line 24 is located on a different layer within the non-display area 20 from the first driving line 22 and the second driving line 23, and at least partially overlaps with the projection on the surface of the non-display area 20.

[0040] In this embodiment, the driver chip 21 of the non-display area 20 adopts a highly integrated design. Its output pins transmit drive signals to the left and right sides of the display area 10 through the first drive line 22 and the second drive line 23, respectively. The driver chip 21 uses FC (Flip Chip) or BGA (Ball Grid Array) packaging technology and is directly connected to the substrate 25 of the non-display area 20 through a bump. This packaging method can reduce the connection length between the chip and the substrate 25, improve the signal transmission speed, and reduce electromagnetic interference during signal transmission, making it particularly suitable for high-resolution and high-refresh-rate display panel designs.

[0041] The design of the connecting line 24 provides an additional electrical connection for the display area 10. When the solder joint at the connection between the driver chip 21 and the first driving line 22 or the second driving line 23 experiences an open circuit or short circuit, the connecting line 24 can serve as a backup path to ensure normal signal transmission on both sides of the display area 10.

[0042] The connecting line 24 can be a single-segment straight line, a multi-segment straight line, or a curved line. Its width and length are designed according to the size of the non-display area 20 and the distance between the first driving line 22 and the second driving line 23. Placing the connecting line 24 in the non-display area 20 ensures signal transmission efficiency while avoiding the connecting line 24 occupying the light-emitting area of ​​the display area 10. The connecting line 24 is made of copper, silver, ITO (indium tin oxide), or other metals or alloys, which have good conductivity, high mechanical strength, and corrosion resistance, effectively reducing resistance loss during signal transmission and improving the service life of the connecting line 24.

[0043] The connecting line 24 is located at least partially on a different layer from the first driving line 22 and the second driving line 23. Within the non-display area 20, the first driving line 22 and the second driving line 23 are located on the same metal layer, formed on the surface of the substrate 25 by a deposition process. The connecting line 24 is positioned on the side of the first driving line 22 and the second driving line 23 facing away from the substrate 25, or a portion of the connecting line 24 is positioned on the side of the first driving line 22 and the second driving line 23 facing away from the substrate 25. In this interlayer structure design, an insulating layer 26 isolates the lines between layers, preventing signal interference and short circuits. Under normal conditions, the signal from the first driving line 22 cannot be transmitted to the second driving line 23 through the connecting line 24, thus maintaining isolation between the driving signals on both sides of the display area 10. The insulating layer 26 is made of organic or inorganic insulating materials such as polyimide (PI) and silicon dioxide (SiO2), possessing excellent insulation properties.

[0044] Meanwhile, since the connecting line 24 at least partially overlaps with the projection of the first driving line 22 and the second driving line 23 on the surface of the non-display area 20, when a pin on one side of the driving chip 21 fails, the area where the connecting line 24 overlaps with the projection of the first driving line 22 and the second driving line 23 on the surface of the non-display area 20 can be electrically connected by laser engraving or through-hole technology. This enables the signal on the other side of the driving chip 21 to be transmitted to the second driving line 23 through the first driving line 22 and the connecting line 24, or to the first driving line 22 through the second driving line 23 and the connecting line 24, so as to ensure that the display area 10 displays normally and improve the product yield.

[0045] Simultaneously, during failure analysis, when an output pin on one side of the driver chip 21 fails, causing an abnormal output signal, it is necessary to connect the normal signal on the other side of the driver chip 21 to the driver circuit on the failed side via an external test circuit to verify the failure mechanism. Because the solder joints of the driver chip 21 pins are small, connecting external test circuits often damages other circuits on the panel and the driver chip 21 itself, making effective verification impossible. This application uses a connecting line 24 to transmit the output signal from one side of the driver chip 21 to the other side, allowing the first driving line 22 and the second driving line 23 on both sides of the driver chip 21 to normally drive the light-emitting structure of the display area 10 and perform failure mechanism analysis. Therefore, it is unnecessary to connect an external test circuit to the driver circuit on the failed side of the driver chip 21, improving the convenience of failure analysis and avoiding damage to the display panel during failure analysis.

[0046] In addition, test pads 27 are respectively provided on the first drive line 22 and the second drive line 23. When repairing solder joints and analyzing and verifying solder joint failures, after connecting the connecting line 24 to the first drive line 22 and the second drive line 23, test equipment can be used with the test pads 27 as points to test whether the signal transmission of the first drive line 22 and the second drive line 23 is normal.

[0047] In summary, this embodiment, through the improved design of the interlayer structure and connection method of the connecting line 24, the first driving line 22 and the second driving line 23, facilitates repair when the solder joint of the driving chip 21 fails, improves the product yield of the display panel, and also improves the convenience of failure analysis.

[0048] The display panel can be a liquid crystal display (LCD), an organic light-emitting diode (OLED) panel, or other types of panels. It is understood that this application proposes an inventive concept to solve the display abnormality of the display area 10 caused by the failure of the solder joints of the driver chip 21, which can be applied to any of the aforementioned display panel structures. In head-to-head type display panels using a GDL (Gate Driver Less) driving architecture, the output signals on both sides of the driver chip 21 are consistent. Therefore, applying the technical solution of this application to a head-to-head type display panel, since the output signals on both sides of the driver chip 21 are consistent, connecting the first driving line 22 and the second driving line 23 through the connecting line 24 ensures that the driving signals transmitted to both sides of the display area 10 are consistent, effectively restoring the display effect of the display area 10.

[0049] To better illustrate the inventive concept of this application, the following six embodiments are also provided to facilitate a better understanding of the connection structure between the connecting line 24 and the first driving line 22 and the second driving line 23.

[0050] First embodiment:

[0051] Combination Figure 1 and Figure 2 As shown, in one embodiment of the present invention, the connecting line 24 includes a first connecting line 241. The first connecting line 241 is located in a different layer within the display area 10 along with the first driving line 22 and the second driving line 23. The two ends of the first connecting line 241 coincide with the projections of the first driving line 22 and the second driving line 23 onto the surface of the non-display area 20, respectively.

[0052] In this embodiment, the first driving line 22 and the second driving line 23 are located on opposite sides of the display area 10, and the driving chip 21 is located on the other side of the display, between the first driving line 22 and the second driving line 23, to facilitate connection with the first driving line 22 and the second driving line 23. The first connecting line 241 and the driving chip 21 can be located on the same side of the display area 10, or they can be located on opposite sides of the display area 10. The shape of the first connecting line 241 can be straight or curved. Figure 1 As shown, in this embodiment, the first connecting line 241 is a straight line, and both ends extend to the ends of the first driving line 22 and the second driving line 23 that are away from the driving chip 21.

[0053] The first connecting line 241, the first driving line 22, and the second driving line 23 are located on different layers. For example... Figure 2 As shown, the first driving line 22 and the second driving line 23 are located on the surface of the substrate 25. The first connecting line 241 is located on a layer away from the substrate 25, opposite to the first driving line 22 and the second driving line 23. An insulating layer 26 is provided between the first connecting line 241 and the first driving line 22 and the second driving line 23 to isolate the circuits of each layer and prevent signal interference and short circuits. The two ends of the first connecting line 241 coincide with the projections of the first driving line 22 and the second driving line 23 on the surface of the non-display area 20, respectively. Therefore, when repairing the solder joints of the driver chip 21 and analyzing solder joint failures, the portions of the first connecting line 241 that coincide with the projections of the first driving line 22 and the second driving line 23 on the surface of the non-display area 20 can be melted and connected together by laser engraving, thereby forming a stable electrical path.

[0054] Second embodiment:

[0055] Combination Figure 3 and Figure 4 As shown, in one embodiment of the present invention, the connecting line 24 includes a second connecting line 242 and two first connecting lines 241. The second connecting line 242 is located on the same layer in the display area 10 as the first driving line 22 and the second driving line 23, and is spaced apart. The two first connecting lines 241 and the second connector are located on different layers in the display area 10. One end of the first connecting line 241 coincides with the projection of the first driving line 22 or the second driving line 23 on the surface of the non-display area 20, and the other end coincides with the projection of the second connecting line 242 on the surface of the non-display area 20.

[0056] In this embodiment, the second connecting line 242 is disposed on the same layer as the first driving line 22 and the second driving line 23. Therefore, the first driving line 22, the second driving line 23, and the second connecting line 242 can be formed on the surface of the substrate 25 in one step by a deposition etching process, thereby simplifying the process and improving processing efficiency. The second connecting line 242 is spaced between the first driving line 22 and the second driving line 23 to avoid signal interference.

[0057] By configuring the connecting line 24 to include a second connecting line 242 and two first connecting lines 241, compared to the scheme in the first embodiment that only includes a first connecting line 241, this embodiment can reduce the length of the first connecting line 241 and the second connecting line 242, avoiding the large impedance generated by a long metal line from affecting the signal transmission of the drive line. At the same time, a long metal trace increases the risk of charge accumulation; therefore, by including the first connecting line 241 and the second connecting line 242, the risk of ESD (Electrostatic Discharge) that is easily caused by using a single connecting line 24 can be reduced.

[0058] Furthermore, such as Figure 3 As shown, the length of the second connecting line 242, which is on the same layer as the first driving line 22 and the second driving line 23, is designed to be relatively long, while the length of the first connecting line 241, which is on a different layer, is designed to be relatively short. This reduces the processing time of the first connecting line 241 on a different layer, thereby improving the overall processing efficiency of the display panel. In addition, it avoids the generation of a large electric field between the two metal layers on different layers, thereby minimizing the influence of the connecting line 24 on the driving signal.

[0059] One end of the first connecting line 241 coincides with the projection of the first driving line 22 or the second driving line 23 on the surface of the non-display area 20, and the other end coincides with the projection of the second connecting line 242 on the surface of the non-display area 20. Therefore, when repairing the solder joints of the driver chip 21 and analyzing solder joint failures, the portion of the first connecting line 241 that coincides with the projection of the first driving line 22 or the second driving line 23 on the surface of the non-display area 20, and the portion of the first connecting line 241 that coincides with the projection of the second connecting line 242 on the surface of the non-display area 20 can be melted and connected together by laser laser process, thereby forming a stable electrical path.

[0060] Third embodiment:

[0061] Combination Figure 5As shown, in one embodiment of the present invention, the connecting line 24 includes a first connecting line 241 and two second connecting lines 242. The two second connecting lines 242 are respectively connected to the first driving line 22 and the second driving line 23. The two second connecting lines 242 are spaced apart. The first connecting line 241 and the second connecting lines 242 are located in different layers within the non-display area 20. The two ends of the first connecting line 241 coincide with the projections of the two second connecting lines 242 onto the surface of the non-display area 20.

[0062] In this embodiment, the connecting line 24 includes a first connecting line 241 and two second connecting lines 242. This multi-segment line structure design can reduce the risk of ESD and the influence of metal traces on the drive signal compared to a single-segment line. For details, please refer to the description of the above embodiment, and no further details will be made here.

[0063] The first connecting line 241 is located between the two second connecting lines 242. Since the first connecting line 241 is located on a different layer than the second connecting lines 242, the first drive line 22, and the second drive line 23, its length is designed to be relatively short. Simultaneously, two second connecting lines 242 are provided, located at opposite ends of the first connecting line 241, further reducing the length of the second connecting lines 242. This further reduces the risk of ESD and the impact of metal traces on the drive signal.

[0064] In addition, in this embodiment, the ends of the two second connecting lines 242 that are away from the first connecting line 241 are connected to the first driving line 22 and the second driving line 23 respectively. Therefore, when repairing the solder joints of the driving chip 21 and analyzing solder joint failures, it is only necessary to fuse and connect the parts of the first connecting line 241 and the second connecting line 242 that overlap on the surface of the non-display area 20, thereby improving the repair efficiency.

[0065] Fourth embodiment:

[0066] In one embodiment of the present invention, the connecting line 24 includes a first connecting line 241 and a second connecting line 242. The first connecting line 241 and the second connecting line 242 are located in different layers within the display area 10 relative to the first driving line 22 and the second driving line 23. One end of the first connecting line 241 coincides with the projection of the first driving line 22 onto the surface of the non-display area 20, and the other end coincides with the projection of the second connecting line 242 onto the surface of the non-display area 20. One end of the second connecting line 242 relative to the first connecting line 241 coincides with the projection of the second driving line 23 onto the surface of the non-display area 20.

[0067] This embodiment is Figure 5In a different embodiment compared to the third embodiment, in this embodiment, the second connecting line 242 is also located on a different layer from the first driving line 22 and the second driving line 23. That is, the first connecting line 241, the second connecting line 242, and the first driving line 22 are located in different metal trace layers. Since the second connecting line 242 is not connected to the first driving line 22 or the second driving line 23 in the unrepaired state, the trace lengths of the first driving line 22 and the second driving line 23 can be reduced, thereby reducing the risk of ESD and the impact of the metal traces on the driving signal.

[0068] Fifth embodiment:

[0069] Combination Figure 1 , Figure 3 and Figure 5 As shown, in one embodiment of the present invention, the connecting line 24 and the driving chip 21 are located on opposite sides of the display area 10.

[0070] In this embodiment, the connecting line 24 and the driving chip 21 are respectively arranged on opposite sides of the display area 10, that is, within the non-display area 20. The driving chip 21, the first driving line 22, the connecting line 24 and the second driving line 23 are respectively arranged on the four sides of the annular non-display area 20, surrounding the display area 10. This positional design can effectively utilize the space of the non-display area 20, facilitate the routing layout of the connecting line 24, improve the processing of the connecting line 24 and the convenience of connecting the connecting line 24 with the first driving line 22 and the second driving line 23, and avoid damage to other lines or components.

[0071] Sixth embodiment:

[0072] Combination Figure 6 As shown, in one embodiment of the present invention, the connecting line 24 and the driving chip 21 are located on the same side of the display area 10.

[0073] In this embodiment, the connecting line 24 and the driver chip 21 are located on the same side of the display area 10, such as... Figure 6 As shown, the two ends of the connecting line 24 are respectively connected to the ends of the first driving line 22 and the second driving line 23 near the driving chip 21. Therefore, the length of the connecting line 24 can be effectively reduced, thereby reducing the risk of ESD and the impact of metal traces on the driving signal. At the same time, since the two ends of the connecting line 24 are close to the output pins of the driving chip 21, when performing solder joint repair and failure analysis verification, after connecting the two ends of the connecting line 24 to the first driving line 22 and the second driving line 23, the signal on one side of the driving chip 21 is transmitted to the other side through the connecting line 24. Since the length of the connecting line 24 is relatively short, the input driving signals on both sides of the display area 10 can be kept as consistent as possible to ensure the display effect of the display area 10.

[0074] Combination Figure 1 , Figure 3 , Figure 5 as well as Figure 6 As shown, in one embodiment of the present invention, the non-display area 20 includes multiple first driving lines 22, multiple second driving lines 23, and multiple connecting lines 24. The multiple first driving lines 22 and multiple second driving lines 23 are symmetrically arranged on both sides of the display area 10. Each connecting line 24 at least partially coincides with the projection of a first driving line 22 and a second driving line 23 onto the surface of the non-display area 20.

[0075] In this embodiment, the number of first driving lines 22 is the same as the number of second driving lines 23, and they are symmetrically distributed on both sides of the display area 10, respectively connecting to the output pins on both sides of the driving chip 21. Since the output signals on both sides of the driving chip 21 are symmetrical, when a solder joint on one side of the driving signal output pin fails, the driving line connected to that solder joint is first determined, and the two ends of its corresponding connecting line 24 are connected to the first driving line 22 and the second driving line 23 respectively, thus achieving solder joint repair and failure analysis verification. The connection structure of each connecting line 24 with the first driving line 22 and the second driving line 23 can be referred to the description in the above embodiment, and will not be further elaborated here.

[0076] The present invention also proposes a display device, which includes a backlight module and a display panel. The specific structure of the display panel is as described in the above embodiments. Since the display device adopts all the technical solutions of all the above embodiments of the display panel, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here. The backlight module is disposed opposite to the display panel, and the backlight module provides a display light source to the display panel.

[0077] In this embodiment, the display device includes, but is not limited to, smartphones, tablets, laptops, and televisions. By providing a connection line 24 as a spare line in the display panel, higher redundancy is provided for the display device. Even if a solder joint or circuit of the driver chip 21 fails, the first driver line 22 and the second driver line 23 can be connected via the connection line 24 to ensure normal signal transmission on both sides of the display area 10, ensuring the normal operation of the display device and significantly improving its reliability and lifespan.

[0078] This invention also proposes a method for repairing a display panel, the specific structure of which refers to the above-described embodiment. In conjunction with... Figure 7 As shown, the repair method includes the following steps:

[0079] S100: Light up the display panel to determine the location of the failed solder joint of the driver chip 21, and the first drive line 22 or the second drive line 23 connected to the failed solder joint;

[0080] S200: The connecting line 24 is electrically connected to the first driving line 22 and the second driving line 23 by passing through and fusing the overlapping portion of the projection of the connecting line 24, the first driving line 22 and the second driving line 23 on the surface of the non-display area 20 through a laser.

[0081] In this embodiment, firstly, the display panel is illuminated, and the display effect of the display panel is observed and tested using a testing tool to determine the location of the failed solder joint of the driver chip 21. A failed solder joint may cause some pixels to fail to display properly, manifesting as dark or bright spots. Using the testing tool, the pin of the driver chip 21 where the failed solder joint is located, as well as the first driving line 22 or the second driving line 23 connected to that pin, can be precisely located.

[0082] In the non-display area 20, based on the display panel design, locate the first drive line 22 or the second drive line 23 connected to the failed solder joint. Simultaneously, check the condition of the connecting line 24 to ensure it is not damaged. The design of the connecting line 24 (such as the first connecting line 241 and the second connecting line 242) provides an alternative path for repair, with its two ends coinciding with the projections of the first drive line 22 and the second drive line 23 onto the surface of the non-display area 20, respectively.

[0083] Using laser welding or through-hole technology, electrically connect both ends of the connecting wire 24 to the first drive wire 22 and the second drive wire 23, respectively. After completing the connection, turn the display panel on again and check the repaired display effect using a testing tool. If the display abnormality caused by the failed solder joint is resolved, the repair is successful. If problems persist, further inspection and adjustment of the connecting wire 24 or the drive circuit may be necessary.

[0084] The specific steps for electrically connecting the connecting wire 24 to the first driving wire 22 and the second driving wire 23 by laser welding are as follows:

[0085] Clean the welding area with high-purity alcohol or a specialized cleaning agent to remove surface oxide layers and impurities. Use high-precision positioning equipment (such as a laser alignment system) to ensure the welding points of the connecting line 24 and the drive line are aligned. Employ a high-energy laser beam, penetrating the portion of the projection of the connecting line 24, the first drive line 22, and the second drive line 23 onto the surface of the non-display area 20. The laser beam's energy melts and connects the overlapping portions of the connecting line 24, the first drive line 22, and the second drive line 23, forming a good electrical connection. Laser welding features high precision and a low heat-affected zone, effectively avoiding damage to surrounding circuitry. After laser welding, inspect the weld points using a microscope to ensure there are no instances of incomplete soldering or short circuits.

[0086] In other embodiments, through-hole technology can be used to pass through the overlapping portion of the connecting line 24, the first driving line 22, and the second driving line 23, and then deposit copper or other conductive metal on the inner wall of the through-hole to achieve electrical connection.

[0087] The above description is merely an exemplary embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention specification and drawings under the technical concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A method of repairing a display panel, characterized by, The display panel includes: Display area; and A non-display area is provided around the outer periphery of the display area, and a driver chip, a first driver line, a second driver line, and connecting lines are provided in the non-display area; The first driving line and the second driving line are located on both sides of the driving chip and are electrically connected to the driving chip. At least a portion of the connecting line is located on a different layer within the non-display area from the first driving line and the second driving line, and at least partially overlaps with the projection on the surface of the non-display area. The repair method includes the following steps: Light up the display panel to determine the location of the failed solder joint of the driver chip, and the first or second drive line connected to the failed solder joint; The connecting line is electrically connected to the first driving line and the second driving line by means of laser penetration and fusion of the overlapping portions of the projections of the connecting line, the first driving line and the second driving line on the surface of the non-display area.

2. The method for repairing a display panel as described in claim 1, characterized in that, The connecting line includes a first connecting line, which is located on a different layer within the display area along with the first driving line and the second driving line. The two ends of the first connecting line coincide with the projections of the first driving line and the second driving line onto the surface of the non-display area, respectively.

3. The method for repairing a display panel as described in claim 1, characterized in that, The connecting line includes a second connecting line and two first connecting lines. The second connecting line is located on the same layer as the first driving line and the second driving line in the display area and is spaced apart. The two first connecting lines and the second connecting line are located on different layers in the display area. One end of the first connecting line coincides with the projection of the first driving line or the second driving line on the surface of the non-display area, and the other end coincides with the projection of the second connecting line on the surface of the non-display area.

4. The method for repairing a display panel as described in claim 1, characterized in that, The connecting line includes a first connecting line and two second connecting lines. The two second connecting lines are respectively connected to the first driving line and the second driving line. The two second connecting lines are spaced apart. The first connecting line and the second connecting lines are located on different layers in the non-display area. The two ends of the first connecting line coincide with the projections of the two second connecting lines on the surface of the non-display area.

5. The method for repairing a display panel as described in claim 1, characterized in that, The connecting lines include a first connecting line and a second connecting line. The first connecting line and the second connecting line are located on different layers within the display area relative to the first driving line and the second driving line, respectively. One end of the first connecting line coincides with the projection of the first driving line onto the surface of the non-display area, and the other end coincides with the projection of the second connecting line onto the surface of the non-display area. One end of the second connecting line relative to the first connecting line coincides with the projection of the second driving line onto the surface of the non-display area.

6. The method for repairing a display panel as described in any one of claims 1 to 5, characterized in that, The connecting line and the driver chip are located on opposite sides of the display area.

7. The method for repairing a display panel as described in any one of claims 1 to 5, characterized in that, The connecting line and the driver chip are located on the same side of the display area.

8. The method for repairing a display panel as described in any one of claims 1 to 5, characterized in that, The non-display area is provided with multiple first driving lines, multiple second driving lines, and multiple connecting lines. The multiple first driving lines and multiple second driving lines are symmetrically arranged on both sides of the display area. Each connecting line at least partially coincides with the projection of a first driving line and a second driving line onto the surface of the non-display area.

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