LED display module, preparation method of LED display module and LED display screen

Abstract

The invention is suitable for the technical field of display equipment, and provides an LED display module, a preparation method of the LED display module and an LED display screen. The LED display module comprises an LED display panel and a side sealing layer, the LED display panel comprises an optical film module, the side sealing layer is arranged on the side portion of the optical film module in a surrounding mode, and the side sealing layer is made of shading materials. According to the technical scheme provided by the invention, the technical problem that white edges exist when the LED display screen is black in the prior art is solved.

Description

Technical Field

[0001] This application belongs to the technical field of display devices, and more specifically, relates to an LED display module, a preparation method of the LED display module, and an LED display screen. Background Art

[0002] The COB (Chip On Board) packaging process is a packaging technology that directly assembles bare chips on a circuit board. This technology realizes the electrical connection between the chip and the circuit board through wire bonding or flip-chip soldering, etc., and completes the chip packaging by pouring protective materials.

[0003] Currently, the COB packaging process is widely used in LED (Light Emitting Diode) display screens. In related technologies, in order to improve the display effect of the LED display screen, an optical film layer needs to be made after chip packaging. However, the optical film layer is soft, and problems such as curling and burrs are likely to occur at its edges, which in turn causes the problem of white edges when the LED display screen is blacked out. Summary of the Invention

[0004] The purpose of the embodiments of this application is to provide an LED display module, a preparation method of the LED display module, and an LED display screen, which are used to solve the technical problem of white edges existing in the LED display screen in the related technology when it is blacked out.

[0005] An embodiment of the first aspect of this application provides an LED display module, including an LED display panel and a side sealing layer. The LED display panel includes an optical film module, and the side sealing layer surrounds the side of the optical film module. The side sealing layer is made of a light-shielding material.

[0006] The LED display module provided by the embodiments of this application can effectively block defects such as curling, burrs, and residual glue of the optical film module by setting a light-shielding material on the side of the optical film module to form a side sealing layer, thereby eliminating the white edge problem at the seam of the LED display module and improving the visual consistency of related LED display screen products in the blacked-out state.

[0007] In some embodiments, the optical film module includes an optical adhesive layer and at least one optical film layer stacked along a first direction, and the side sealing layer surrounds the sides of the optical adhesive layer and the optical film layer.

[0008] In the above design, the optical adhesive layer can tightly bond the optical film layer to the LED display panel, ensuring the stability and reliability of the connection between the optical film layer and the LED display panel. At the same time, the optical adhesive layer can also fill the gap between the optical film layer and the LED display panel, reducing bubbles and unevenness, which is beneficial to improving the light output and display effect of the LED display module.

[0009] In some embodiments, the optical film layer is a polyester film, a triacetate film, or a super birefringent polyester film, and / or the optical film layer has one or more of an anti-glare coating, an anti-reflection coating, and an anti-fingerprint coating.

[0010] In the above design, the optical film layer has good optical properties, which is beneficial to improving the display effect of the LED display module.

[0011] In some embodiments, the optical adhesive layer includes a thermosetting optical adhesive or an ultraviolet light-curing optical adhesive.

[0012] In the above design, the optical adhesive layer has good bonding strength and can reliably connect the optical film layer and the LED display panel.

[0013] In some embodiments, the thickness of the optical film layer is 25μm - 200μm, and / or the thickness of the optical adhesive layer is 10μm - 100μm, and / or the viscosity between the optical adhesive layer and the LED display panel is 15N / 25mm - 30N / 25mm, and / or the light-shielding material is a black colloid, the optical density of the side-sealing layer is less than 4, and / or along the direction parallel to the display surface of the LED display panel, the width of the side-sealing layer is 10μm - 15μm.

[0014] In the above design, the structure of the LED display module is reasonable and has a good display effect.

[0015] In some embodiments, the LED display panel further includes a substrate, a plurality of LED light-emitting units, and a packaging layer. The substrate, the plurality of LED light-emitting units, the packaging layer, and the optical film module are stacked in a first direction, and the packaging layer is used to package the plurality of LED light-emitting units.

[0016] In the above design, the structure of the LED display module is reasonable and has a good display effect.

[0017] In some embodiments, the side-sealing layer also surrounds the side of a part of the packaging layer, and the outer edge of the side-sealing layer is flush with the outer edge of the remaining part of the packaging layer.

[0018] In the above design, by extending the side-sealing layer to the packaging layer, it can ensure that the optical film module is completely covered and prevent the problem of white edges from occurring in the black screen state.

[0019] In some embodiments, along the first direction, the part of the side-sealing layer surrounding the side of the packaging layer has a thickness of 10μm - 15μm.

[0020] In the above design, the thickness of the side-sealing layer covering the packaging layer is limited between 10μm - 15μm, which can ensure that a relatively large exposed area is provided on the side of the packaging layer, so that light can be emitted normally and prevent the problem of black edges from occurring during screen display.

[0021] In some embodiments, the LED display module further includes a driving chip, which is disposed on the substrate and electrically connected to the LED light-emitting unit through the substrate.

[0022] In the above design, by integrating the components on the substrate, it is beneficial to improve the structural compactness of the LED display module and facilitate the unified packaging of the LED display module.

[0023] An embodiment of the second aspect of the present application provides a method for manufacturing an LED display module, including: providing a panel body, the panel body includes a substrate, an LED light-emitting unit, a packaging layer, and an optical film module stacked in a first direction, the panel body includes a functional area and a board edge area surrounding the functional area; making a first groove on the panel body, the first groove surrounds the functional area, and the first groove is partially located in the functional area and the other part is located in the board edge area, and the first groove penetrates the optical film module; making a side sealing layer, the side sealing layer is at least filled in the first groove; cutting the panel body so that the side sealing layer surrounds the side of the optical film module, and the side sealing layer is flush with the outer edge of at least part of the packaging layer.

[0024] In the method for manufacturing an LED display module provided by the embodiment of the present application, by making a side sealing layer structure on the side of the optical film module, it can effectively block defects such as curling, burrs, and residual glue of the optical film module, thereby eliminating the white edge problem at the seam of the LED display module, improving the visual consistency of the related LED display screen product in the black screen state. At the same time, this structural design of the side sealing layer also ensures that the side of the packaging layer can emit light normally, that is, while solving the white edge problem, it also ensures the side light-emitting effect of the LED display module and related LED display screen products. In addition, since the side sealing layer can seal the optical film module in the circumferential direction, that is, it can isolate the optical film module from the external environment, it can prevent the optical film module from absorbing external water vapor and experiencing abnormal phenomena such as shrinkage and expansion, which is also beneficial to improving the product quality and long-term reliability of the LED display module.

[0025] In some embodiments, making the side sealing layer includes: filling a light-shielding material in the first groove and curing the light-shielding material to form the side sealing layer; cutting the panel body includes: removing the board edge area of the panel body and the light-shielding material located in the board edge area.

[0026] In the above design, the panel body is first subjected to a depth control cutting to form an area for filling the light-shielding material on the side of the optical film module. Then, after filling the light-shielding material, the panel body is subjected to a second cutting to completely remove the board edge area of the panel body and the redundant light-shielding material, thereby forming the final side sealing layer structure. This manufacturing method has a simple process and relatively high processing efficiency.

[0027] In some embodiments, fabricating the encapsulation layer includes: cutting off a part of the board edge area of the panel body, coating a light-shielding material on the side of the panel body and curing the light-shielding material; cutting the panel body includes: cutting off the light-shielding material located outside the functional area.

[0028] In the above design, the panel body is first subjected to a controlled-depth cutting to form an area for pouring the light-shielding material on the side of the optical film module, and then the panel body is subjected to a second cutting to remove the board edge area of the panel body, forming a stepped board edge on the side of the panel body. After coating the light-shielding material on the stepped board edge, the panel body is subjected to a third cutting to remove the excess light-shielding material covering the encapsulation layer, thereby forming the final side encapsulation layer structure. This preparation method provides an optional processing method, and in the final cutting process, the panel body can be finely trimmed to improve the accuracy of the LED display module product.

[0029] In some embodiments, the first groove further extends to the encapsulation layer. Along the first direction, the depth of the first groove extending to the encapsulation layer is 10 μm - 15 μm.

[0030] In the above design, by extending the first groove into the encapsulation layer, the manufacturing difficulty of the first groove can be simplified, the product processing and manufacturing efficiency can be improved, and in this design, it is ensured that the side encapsulation layer can completely cover the optical film module, while ensuring that there is a large exposed area on the side of the encapsulation layer.

[0031] An embodiment of the third aspect of the present application provides an LED display screen, including a plurality of LED display modules in the first aspect, and / or including a plurality of LED display modules fabricated by using the preparation method of the LED display module in the second aspect.

[0032] The LED display screen provided by the embodiments of the present application can effectively improve the product quality of the LED display screen by adopting the LED display module in the first aspect or the LED display module fabricated by using the preparation method in the second aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the following drawings are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0034] Figure 1 It is a schematic structural diagram of the LED display module provided by the embodiment of the present application;

[0035] Figure 2Schematic diagram of the structure of the panel body provided by the embodiment of the present application;

[0036] Figure 3 Schematic diagram of the structure for fabricating a first groove on the panel body provided by an embodiment of the present application;

[0037] Figure 4 Schematic diagram of the structure of the panel body with a first groove fabricated thereon provided by an embodiment of the present application;

[0038] Figure 5 Schematic diagram of the structure for filling a light-shielding material in the first groove on the panel body provided by an embodiment of the present application;

[0039] Figure 6 Schematic diagram of the structure for cutting off the board edge area of the panel body provided by an embodiment of the present application;

[0040] Figure 7 Schematic diagram of the structure for cutting off the board edge area of the panel body provided by another embodiment of the present application;

[0041] Figure 8 Schematic diagram of the structure of the panel body after cutting off the board edge area provided by another embodiment of the present application;

[0042] Figure 9 Schematic diagram of the structure for coating a light-shielding material on the side of the panel body provided by another embodiment of the present application;

[0043] Figure 10 Schematic diagram of the structure for cutting off the light-shielding material outside the functional area of the panel body provided by another embodiment of the present application;

[0044] Figure 11 Flowchart of the preparation method of the LED display module provided by the embodiment of the present application;

[0045] Figure 12 Flowchart of the preparation method of the LED display module provided by an embodiment of the present application;

[0046] Figure 13 Flowchart of the preparation method of the LED display module provided by another embodiment of the present application.

[0047] The label details involved in the above drawings are as follows:

[0048] 100. LED display module; 101. Panel body;

[0049] 1. Substrate; 11. First surface; 12. Second surface; 13. Solder mask ink;

[0050] 2. LED light-emitting unit;

[0051] 3. Encapsulation layer;

[0052] 4. Optical film module; 41. Optical adhesive layer; 42. Optical film layer;

[0053] 5. Side sealing layer;

[0054] 6. Driving chip. Detailed implementation manners

[0055] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application clearer and more understandable, the present application will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0056] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element. Without conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present application will be described in detail below with reference to the drawings and embodiments.

[0057] It should be understood that the orientation or positional relationship indicated by the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be understood as a limitation to the present application.

[0058] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, "a plurality of" means more than two unless otherwise specifically defined.

[0059] Referring to Figure 1 , an embodiment of the first aspect of the present application provides an LED display module 100.

[0060] The LED display module 100 provided by the embodiment of the present application includes an LED display panel and a side sealing layer 5. The LED display panel includes an optical film module 4. The side sealing layer 5 is disposed around the side of the optical film module 4 (for example Figure 1 the part indicated by the arrow a in

[0061] The LED display panel is the main body of the LED. In addition to the optical film module 4, it also includes structures such as supports, light-emitting and encapsulation, as well as necessary conductive lines.

[0062] The optical film module 4 includes at least an optical film. The optical film can be of various types, and different types of optical films have different optical effects. For example, the optical film module 4 can include a diffusion film, which is used to improve the uniformity of the light emitted by the LED display module 100; the optical film module 4 can include a brightness enhancement film, which is used to improve the light utilization rate to enhance the brightness of the light emitted by the LED display module 100.

[0063] The side sealing layer 5 is closely attached to the side of the optical film module 4. Since the optical film module 4 is made of soft material, it is easy to have curling or burrs at the edges after cutting, and there may also be residual glue in some cases. The side sealing layer 5 covers the side of the optical film module 4 and is used to physically block defects such as curling, burrs and residual glue. The side sealing layer 5 is made of a light-shielding material and is used to visually eliminate the white edges at the seams of the LED display module 100 and improve the visual consistency in the black screen state.

[0064] The LED display module 100 provided by the embodiment of the present application can effectively block defects such as curling, burrs and residual glue of the optical film module 4 by providing a light-shielding material at the side of the optical film module 4 to form the side sealing layer 5, thereby being able to eliminate the white edge problem at the seams of the LED display module 100 and improve the visual consistency of the related LED display products in the black screen state.

[0065] Please refer to Figure 1 , in some embodiments, the optical film module 4 includes an optical adhesive layer 41 and at least one optical film layer 42 stacked along the first direction Y, and the side sealing layer 5 surrounds the sides of the optical adhesive layer 41 and the optical film layer 42.

[0066] For example, the optical film module 4 includes an optical adhesive layer 41 and one optical film layer 42. The optical adhesive layer 41 is disposed on the inner surface of the optical film layer 42 and is used to connect the optical film layer 42 to the LED display panel.

[0067] With the above design, the optical adhesive layer 41 can tightly connect the optical film layer 42 to the LED display panel, ensuring the stability and reliability of the connection between the optical film layer 42 and the LED display panel. At the same time, the optical adhesive layer 41 can also fill the gap between the optical film layer 42 and the LED display panel, reducing bubbles and unevenness, thereby being beneficial to improving the light output and display effect of the LED display module 100.

[0068] It can be understood that in some embodiments, the optical film layer 42 can also be fixed to the encapsulation layer 3 through a sealant, a nested structure, etc. designed around the side of the optical film layer 42.

[0069] In the embodiments provided by the present application, the type of the optical film layer 42 is not unique.

[0070] Optionally, in some embodiments, the optical film layer 42 may be a polyethylene terephthalate (PET) film.

[0071] The PET film has high transparency and high light transmittance, which is beneficial to improving the display clarity of the LED display module 100. At the same time, the PET film also has good strength and hardness, can withstand a certain amount of physical stress, and resist friction and scratches during daily use.

[0072] In some embodiments, the optical film layer 42 may be a triacetate cellulose (TAC) film.

[0073] The TAC film has high transparency and low refractive index, which is beneficial to improving the display clarity and color reduction effect of the LED display module 100.

[0074] In some embodiments, the optical film layer 42 may be a surface roughened film (SRF).

[0075] The SRF film can scatter light evenly, reduce the dark spots of the LED display module 100, and improve the display picture quality.

[0076] In some embodiments, the optical film layer 42 has one or more of an anti-glare coating, an anti-reflection coating, and an anti-fingerprint coating.

[0077] Specifically, the above coatings can be made on the optical film through a variety of surface treatment processes. For example, the above coatings can be made by coating, sputtering, evaporation, lamination, etc.

[0078] The anti-glare coating can scatter the incident light and reduce the specular reflection of the screen, so that the LED display module 100 has good visibility at different angles; the anti-reflection coating can reduce light reflection, thereby improving the contrast of the screen and making the picture of the LED display module 100 clearer; the anti-fingerprint coating can reduce the residue of fingerprints and other stains and keep the screen clean.

[0079] In some embodiments, the thickness of the optical film layer 42 is 25 μm - 200 μm. Here, μm is the length unit micrometer, that is, micron.

[0080] For example, the thickness of the optical film layer 42 can be 25 μm, 50 μm, 90 μm, 125 μm, 160 μm, 200 μm.

[0081] With the above design, on the one hand, the optical film layer 42 can maintain a high light transmittance, thus ensuring that the emitted light of the LED light-emitting unit 2 can effectively pass through. On the other hand, the optical film layer 42 within this thickness range has sufficient mechanical strength and good flexibility, and can meet the design requirements of various products.

[0082] In some embodiments, the optical adhesive layer 41 includes a thermosetting optical adhesive or an ultraviolet light-curing optical adhesive.

[0083] Exemplarily, the optical adhesive layer 41 can be, but is not limited to, a polysiloxane cross-linked optical adhesive, a polyimide optical adhesive, a thickened optical adhesive, an amorphous optical adhesive, an epoxy resin optical adhesive, an acrylate optical adhesive, a dimethyl group cross-linked optical adhesive, an acrylate UV adhesive, a silicone UV adhesive, and so on.

[0084] The thermosetting optical adhesive needs to be heated to cause a chemical reaction in the colloid, thereby curing. The curing temperature is generally between 80°C and 150°C, and the specific curing temperature and curing time need to be determined according to the type of colloid. The thermosetting optical adhesive has good thermal stability and high bonding strength, and can be used for a long time and maintain stable performance.

[0085] The ultraviolet light-curing optical adhesive needs to undergo a chemical reaction through ultraviolet light irradiation to cure. The curing time is generally from several seconds to several minutes, and specifically needs to be determined according to the type of colloid. The ultraviolet light-curing optical adhesive can be rapidly cured in a short time, which is beneficial to improving the production efficiency of products. At the same time, no waste gas and other pollutants are generated during the curing process, which is more environmentally friendly.

[0086] It can be understood that in some other embodiments, the optical adhesive layer 41 can also include a pressure-sensitive optical adhesive and so on.

[0087] In some embodiments, the viscosity between the optical adhesive layer 41 and the LED display panel is 15 N / 25 mm - 30 N / 25 mm. Among them, N is the unit of force Newton, which is also the abbreviation of Newton, and mm is the unit of length millimeter, which is also the abbreviation of millimeter. N / mm can represent the magnitude of the force borne or applied by a certain material or object per millimeter of length.

[0088] Exemplarily, the LED display panel includes a packaging layer 3, and the viscosity between the optical adhesive layer 41 and the packaging layer 3 is 15 N / 25 mm, 20 N / 25 mm, 25 N / 25 mm, 30 N / 25 mm.

[0089] The viscosity between the optical adhesive layer 41 and the LED display panel reflects the peeling strength between the two. The higher the viscosity, the stronger the connection between the two and the more difficult it is to separate.

[0090] With the above design, on the one hand, the optical adhesive layer 41 has good bonding strength, and the optical adhesive layer 41 and the LED display panel can be bonded together stably and firmly for a long time. On the other hand, the colloid within this viscosity range has good fluidity and filling properties. The colloid can be evenly coated on the surface of the LED display panel, such as the encapsulation layer 3, and fill the minute unevenness or gaps on the surface of the LED display panel, thereby facilitating the reduction of bubbles and voids between the film layers and enhancing the bonding strength between the film layers.

[0091] In some embodiments, the thickness of the optical adhesive layer 41 is 10 μm - 100 μm.

[0092] Exemplarily, the thickness of the optical adhesive layer 41 can be 10 μm, 30 μm, 50 μm, 80 μm, 100 μm.

[0093] With the above design, the optical adhesive layer 41 has a reasonable thickness and can maintain a high transparency, thus ensuring that light can effectively pass through.

[0094] Please refer to Figure 1 , in some embodiments, the LED display panel further includes a substrate 1, a plurality of LED light-emitting units 2, and an encapsulation layer 3. The substrate 1, the plurality of LED light-emitting units 2, the encapsulation layer 3, and the optical film module 4 are stacked along the first direction Y. The encapsulation layer 3 is used to encapsulate the plurality of LED light-emitting units 2.

[0095] The substrate 1 is the support foundation of the LED display module 100, capable of supporting and fixing the LED light-emitting units 2, each film layer structure, and related electronic components. The substrate 1 is also used to lay out various conductive lines to connect the LED light-emitting units 2, the driving circuit, and other electronic components. The substrate 1 can be a printed circuit board, a flexible circuit board, a glass substrate, a ceramic substrate, etc. The thickness, size, and shape of the substrate 1 are determined according to the design requirements.

[0096] The LED light-emitting unit 2 is used to convert electrical energy into light energy. The LED light-emitting unit 2 can be an LED light-emitting chip. Along the first direction Y, the LED light-emitting unit 2 protrudes from the substrate 1. The plurality of LED light-emitting units 2 are spaced apart on the substrate 1 and can be arranged according to a certain rule. For example, the plurality of LED light-emitting units 2 can be arranged in a rectangular array, a circular array, or an array of other shapes. The LED light-emitting unit 2 can be, but is not limited to, being bonded to the substrate 1 by welding or conductive adhesive.

[0097] The encapsulation layer 3 covers the surfaces of the substrate 1 and the multiple LED light-emitting units 2. Along the first direction Y, the thickness of the encapsulation layer 3 is greater than that of the LED light-emitting units 2 to completely cover the LED light-emitting units 2. The encapsulation layer 3 is used to provide protection for the LED light-emitting units 2. For example, the encapsulation layer 3 can isolate external impurities such as dust and water vapor to avoid contamination and corrosion of the surfaces of the LED light-emitting units 2 and the substrate 1. At the same time, the encapsulation layer 3 can also resist a certain amount of external impact and reduce the risk of damage to the LED light-emitting units due to collision or extrusion. In some cases, the encapsulation layer 3 can also be used to improve the optical performance of the LED light-emitting units 2 or enhance heat dissipation, etc. The material of the encapsulation layer 3 can be various, such as transparent epoxy resin, silica gel, etc. The encapsulation layer 3 can be a single-layer structure or a multi-layer structure. The side of the encapsulation layer 3 away from the substrate 1 has a flat surface to ensure that the optical film module 4 can be flatly attached to the encapsulation layer 3.

[0098] Please refer to Figure 1 , in some embodiments, the side encapsulation layer 5 also surrounds the side of a part of the encapsulation layer 3, and the outer edge of the side encapsulation layer 5 is flush with the outer edge of the remaining part of the encapsulation layer 3.

[0099] The side encapsulation layer 5 covers the side of the optical film module 4 and also covers the part of the encapsulation layer 3 connected to the optical film module 4. The outer edge of the side encapsulation layer 5 is flush with the outer edge of the remaining part of the encapsulation layer 3, that is, there is a part of the side of the encapsulation layer 3 that is not covered by the side encapsulation layer 5, and the outer edge of the side encapsulation layer 5 is flush with the outer edge of the encapsulation layer 3 that is not covered by the side encapsulation layer 5.

[0100] Since the thickness of the optical film module 4 is relatively thin, in actual processing and manufacturing, limited by the processing accuracy, there is a certain risk that the light-shielding material cannot be completely and only coated on the side of the optical film module 4. In the above embodiments, by extending the side encapsulation layer 5 to the encapsulation layer 3, it can ensure that the optical film module 4 is completely covered and ensure that there is no white edge problem in the black screen state.

[0101] In some embodiments, along the first direction Y, the part of the side encapsulation layer 5 surrounding the encapsulation layer 3 has a thickness of 10 μm - 15 μm.

[0102] For example, the thickness of the part of the side encapsulation layer 5 surrounding the encapsulation layer 3 is 10 μm, 12 μm, 15 μm.

[0103] In the above design, the thickness of the side encapsulation layer 5 covering the encapsulation layer 3 is limited between 10 μm - 15 μm, which can ensure that there is a large exposed area on the side of the encapsulation layer 3, so that light can be emitted normally and avoid the black edge problem when the screen is displayed.

[0104] In some embodiments, the light-shielding material is a black colloid, and the optical density of the side encapsulation layer 5 is less than 4.

[0105] Exemplarily, the light-shielding material can be black epoxy resin glue, polyurethane glue, etc. The light-shielding material can be disposed on the side of the optical film module 4 or the encapsulation layer 3 by means of coating, perfusion, etc.

[0106] The optical density reflects the light absorption ability of the light-shielding material. The smaller the optical density, the less light is absorbed, and the corresponding transmittance is larger.

[0107] With the above design, on the one hand, the black colloid can effectively block defects such as curling, burrs, and residual glue of the optical film module 4, ensuring that the white edge problem at the seam of the LED display module 100 can be eliminated. On the other hand, maintaining the optical density of the side-sealing layer 5 within a reasonable range can ensure the normal propagation of light and avoid the black edge problem at the seam of the LED display module 100 in the display state.

[0108] It can be understood that in some other embodiments, the side-sealing layer 5 can also be other dark-colored light-shielding tapes.

[0109] In some embodiments, along the direction parallel to the display surface of the LED display panel, the width of the side-sealing layer 5 is 10μm - 15μm.

[0110] Exemplarily, the width of the side-sealing layer 5 can be 10μm, 12μm, or 15μm.

[0111] The display surface of the LED display panel is also its light-emitting surface. It should be noted that the width of the side-sealing layer 5 refers to the dimension in the direction parallel to the surface of the LED display panel and perpendicular to the extension direction of its corresponding side.

[0112] With the above design, on the one hand, the side-sealing layer 5 has sufficient thickness to completely cover defects such as curling, burrs, and residual glue at the edge of the optical film module 4 and effectively block these defects. On the other hand, this width range is suitable for various coating processes such as slit coating and spraying, which is also beneficial to reducing the manufacturing difficulty of the LED display module 100.

[0113] In some embodiments, the optical film module 4 includes an optical glue layer 41 and an optical film layer 42. The thickness of the optical film layer 42 is 25μm - 200μm, the thickness of the optical glue layer 41 is 10μm - 100μm, the viscosity between the optical glue layer 41 and the LED display panel is 15N / 25mm - 30N / 25mm, the light-shielding material is black colloid, and the optical density of the side-sealing layer 5 is less than 4. Along the direction parallel to the surface of the LED display panel, the width of the side-sealing layer 5 is 10μm - 15μm.

[0114] With the above design, the LED display module 100 has a reasonable structure and good display effect.

[0115] In some embodiments, the LED display module 100 further includes a driving chip 6. The driving chip 6 is disposed on the substrate 1 and electrically connected to the LED light-emitting unit 2 through the substrate 1.

[0116] Exemplarily, in a specific embodiment, the substrate 1 is a printed circuit board. The printed circuit board includes an opposite first surface 11 and a second surface 12. A plurality of LED light-emitting units 2 are disposed on the first surface 11, and the driving chip 6 is disposed on the second surface 12. The plurality of LED light-emitting units 2 are electrically connected to the driving chip 6 through conductive lines in the printed circuit board. Wherein, the first surface 11 of the printed circuit board further has a solder mask 13, and the solder mask 13 is provided with slots at positions corresponding to the LED light-emitting units 2 to ensure the connection between the LED light-emitting units 2 and the conductive lines in the board.

[0117] The driving chip 6 is used to receive the data signal from an external controller and convert the data signal into an electrical signal to be transmitted to the LED light-emitting unit 2, thereby controlling the display time, brightness, color, etc. of the LED light-emitting unit 2. The position of the driving chip 6 needs to consider the layout of the conductive lines on the substrate 1 to ensure that the driving chip 6 can be reliably connected to the LED light-emitting unit 2. At the same time, the driving chip 6 can be disposed in a relatively open area on the substrate 1 to maintain good heat dissipation. The setting position of the driving chip 6 is not unique. Optionally, the driving chip 6 can be disposed on the surface of the substrate 1 away from the LED light-emitting unit 2 and disposed opposite to the LED light-emitting unit 2, or the driving chip 6 can also be disposed in a non-functional area at the edge of the substrate 1.

[0118] With the above design, by integrating each component on the substrate 1, it is beneficial to improve the structural compactness of the LED display module 100 and facilitate the unified packaging of the LED display module 100.

[0119] In summary, for the LED display module 100 provided by the embodiments of the present application, by providing the side sealing layer 5 structure, it can effectively block defects such as curling, burrs, and residual glue of the optical film module 4, thereby eliminating the white edge problem at the seam of the LED display module 100 and improving the visual consistency of the related LED display products in the black screen state. At the same time, this structural design of the side sealing layer 5 also ensures that the side of the encapsulation layer 3 can emit light normally, that is, on the premise of solving the white edge problem, it also ensures the side light-emitting effect of the LED display module 100 and related LED display products.

[0120] Please refer to Figures 2 - 13 , the embodiments of the second aspect of the present application provide a manufacturing method of an LED display module 100.

[0121] Please refer to Figures 1 - 6 , and Figure 11 , the manufacturing method of the LED display module 100 provided by the embodiments of the present application includes:

[0122] S10. Provide a panel body 101, which includes a substrate 1, an LED light-emitting unit 2, a packaging layer 3, and an optical film module 4 stacked along a first direction Y. The panel body 101 includes a functional area and a board edge area surrounding the functional area.

[0123] Please refer to Figure 2 , Figure 2 which is a schematic structural diagram of the panel body 101.

[0124] The substrate 1 is the supporting foundation of the panel body 101, capable of supporting and fixing the LED light-emitting unit 2, each film layer structure, and related electronic components. The substrate 1 is also used to lay out various conductive lines to connect the LED light-emitting unit 2, the driving circuit, and other electronic components. The substrate 1 can be a printed circuit board, a flexible circuit board, a glass substrate, a ceramic substrate, etc. The thickness, size, and shape of the substrate 1 are determined according to design requirements.

[0125] The LED light-emitting unit 2 is used to convert electrical energy into light energy. The LED light-emitting unit 2 can be an LED light-emitting chip. Along the first direction Y, the LED light-emitting unit 2 protrudes from the substrate 1. A plurality of LED light-emitting units 2 are arranged at intervals on the substrate 1 and can be arranged according to a certain rule. For example, a plurality of LED light-emitting units 2 can be arranged in a rectangular array, a circular array, or an array of other shapes. The LED light-emitting unit 2 can be, but is not limited to, being bonded to the substrate 1 by welding or conductive adhesive.

[0126] The packaging layer 3 covers the surfaces of the substrate 1 and the LED light-emitting unit 2. Along the first direction Y, the thickness of the packaging layer 3 is greater than the thickness of the LED light-emitting unit 2 to completely cover the LED light-emitting unit 2. The packaging layer 3 is used to provide protection for the LED light-emitting unit 2. For example, the packaging layer 3 can isolate external impurities such as dust and moisture to avoid contamination and corrosion of the surfaces of the LED light-emitting unit 2 and the substrate 1. At the same time, the packaging layer 3 can also resist a certain external impact and reduce the risk of damage to the LED light-emitting unit due to collision or extrusion. In some cases, the packaging layer 3 can also be used to improve the optical performance of the LED light-emitting unit 2 or enhance heat dissipation, etc. The material of the packaging layer 3 can be various, such as transparent epoxy resin, silica gel, etc. The packaging layer 3 can be a single-layer structure or a multi-layer structure. The side of the packaging layer 3 away from the substrate 1 has a flat surface to ensure that the optical film module 4 can be flatly attached to the packaging layer 3.

[0127] The optical film module 4 includes at least an optical film. The optical film can be of various types, and different types of optical films have different optical effects. For example, the optical film module 4 can include a diffusion film, which is used to improve the uniformity of the light emitted by the LED display module 100; the optical film module 4 can include a brightness enhancement film, which is used to improve the light utilization rate to enhance the brightness of the light emitted by the LED display module 100.

[0128] S20. A first groove 14 is formed on the panel body 101. The first groove 14 surrounds the functional area, and a part of the first groove 14 is located within the functional area, and the other part is located within the board edge area. The first groove 14 penetrates through the optical film module 4.

[0129] Please refer to Figure 3 and Figure 4 , Figure 3 FIG. is a schematic structural diagram of cutting the first groove 14 on the panel body 101 by using a milling cutter, Figure 4 FIG. is a schematic structural diagram of forming the first groove 14 on the panel body 101.

[0130] For example, the first groove 14 can be formed by cutting with a 7-CNC milling cutter, or in some embodiments, the first groove 14 can also be formed by laser drilling.

[0131] The first groove 14 is located at the boundary position between the functional area and the board edge area. Since the first groove 14 has a certain width, a part of it is formed on the functional area, and the other part is formed on the board edge area. The first groove 14 surrounds the edge of the functional area and forms a closed structure.

[0132] S30. A side sealing layer 5 is formed. The side sealing layer 5 is at least filled in the first groove 14.

[0133] The side sealing layer 5 is made of a light-shielding material and is closely attached to the side of the optical film module 4.

[0134] Since the optical film module 4 is soft in material, after cutting, there are likely to be curling or burrs at the edges, and in some cases, there may also be residual glue. The side sealing layer 5 covers the side of the optical film module 4 and is used to physically block defects such as curling, burrs, and residual glue. The side sealing layer 5 is selected as a light-shielding material and is used to visually eliminate the white edges at the seams of the LED display module 100 and improve the visual consistency in the black screen state.

[0135] S40. The panel body 101 is cut so that the side sealing layer 5 surrounds the side of the optical film module 4, and the side sealing layer 5 is flush with the outer edge of at least a part of the encapsulation layer 3.

[0136] For example, the panel body 101 can be cut by using a 7-CNC milling cutter.

[0137] The outer edge of the side sealing layer 5 is flush with the outer edge of at least a part of the encapsulation layer 3, that is, the side sealing layer 5 does not cover the encapsulation layer 3 at all or at least there is a part of the side of the encapsulation layer 3 that is not covered by the side sealing layer 5. For example, in some embodiments, the side sealing layer 5 covers a part of the encapsulation layer 3, and the outer edge of the side sealing layer 5 is flush with the outer edge of the remaining part of the encapsulation layer 3.

[0138] In the manufacturing method of the LED display module 100 provided by the embodiments of the present application, by fabricating the side sealing layer 5 structure on the side of the optical film module 4, defects such as curling, burrs, and residual glue of the optical film module 4 can be effectively blocked, thereby eliminating the white edge problem at the seam of the LED display module 100 and improving the visual consistency of the related LED display screen products in the black screen state. At the same time, this structural design of the side sealing layer 5 also ensures that the side of the encapsulation layer 3 can emit light normally, that is, on the premise of solving the white edge problem, the side light-emitting effect of the LED display module 100 and related LED display screen products is also ensured. In addition, since the side sealing layer 5 can seal the optical film module 4 in the circumferential direction, that is, it can isolate the optical film module 4 from the external environment, thereby preventing the optical film module 4 from absorbing external water vapor and experiencing abnormal phenomena such as shrinkage and expansion. This is also beneficial to improving the product quality and long-term reliability of the LED display module 100.

[0139] In the embodiments provided by the present application, the methods of fabricating the side sealing layer 5 and cutting the panel body 101 are not unique.

[0140] For example, please refer to Figure 12 , in some embodiments, step S30 includes: filling a light-shielding material in the first groove 14 and curing the light-shielding material to form the side sealing layer 5. Optionally, the light-shielding material can be filled in the first groove 14 by methods such as injection molding, dispensing, or spraying. Step S40 includes: cutting off the board edge area of the panel body 101 and the light-shielding material located in the board edge area. Optionally, a 7-CNC milling cutter can be used to cut off the board edge area of the panel body 101 and the light-shielding material located in the board edge area.

[0141] Please refer to Figure 5 and Figure 6 , Figure 5 is a schematic structural diagram of filling a light-shielding material in the first groove 14, Figure 6 is a schematic structural diagram of cutting off the board edge area of the panel body 101 and the light-shielding material located in the board edge area.

[0142] It can be understood that by cutting along the boundary line between the board edge area and the functional area, the panel body 101 in the board edge area and the corresponding light-shielding material can be cut synchronously, and the outer edge of the side sealing layer 5 can be made flush with the outer edge of at least a part of the encapsulation layer 3.

[0143] In the above embodiments, the panel body 101 is first subjected to a controlled-depth cutting to form a region for pouring a light-shielding material on the side of the optical film module 4. Then, after filling the light-shielding material, the panel body 101 is subjected to a second cutting to completely remove the board edge area of the panel body 101 and the redundant light-shielding material, thereby forming the final side seal layer 5 structure. This preparation method has a simple process and relatively high processing efficiency.

[0144] Exemplarily, please refer to Figure 13 , in some embodiments, step S30 includes: cutting off a part of the board edge area of the panel body 101, coating a light-shielding material on the side of the panel body 101 and curing the light-shielding material. Optionally, a 7-CNC milling cutter can be used to cut off the board edge area of the panel body 101, and the light-shielding material can be coated on the side of the panel body 101 by means of slit coating, spraying, etc. The coating width of the light-shielding material is 5 μm - 20 μm. Step S40 includes: cutting off the light-shielding material located outside the functional area, where the light-shielding material outside the functional area refers to the light-shielding material located at the position of the original board edge area, and this part does not include the light-shielding material retained in the first groove 14. Optionally, a 7-CNC milling cutter can be used to cut off the light-shielding material located outside the functional area.

[0145] Please refer to Figures 7 - 10 , Figure 7 FIG. is a schematic structural diagram of using a milling cutter to cut off a part of the board edge area of the panel body 101, Figure 8 FIG. is a schematic structural diagram of the panel body 101 after cutting off a part of the board edge area of the panel body 101, Figure 9 FIG. is a schematic structural diagram of coating a light-shielding material on the side of the panel body 101, Figure 10 FIG. is a schematic structural diagram of cutting off the light-shielding material of the panel body 101 located outside the functional area.

[0146] In the above embodiments, the panel body 101 is first subjected to a controlled-depth cutting to form a region for pouring a light-shielding material on the side of the optical film module 4. Then, the panel body 101 is subjected to a second cutting to remove the board edge area of the panel body 101, and a stepped board edge is formed on the side of the panel body 101. After coating the light-shielding material on the stepped board edge, the panel body 101 is subjected to a third cutting to remove the redundant light-shielding material covering the encapsulation layer 3, thereby forming the final side seal layer 5 structure. This preparation method provides an optional processing method, and in the final cutting process, the panel body 101 can be finely trimmed to improve the accuracy of the LED display module 100 product.

[0147] Please refer to Figure 4 , in some embodiments, the first groove 14 also extends to the encapsulation layer 3, and along the first direction Y, the depth of the first groove 14 extending to the encapsulation layer 3 is 10 μm - 15 μm.

[0148] For example, the first groove 14 extends to a depth of 10 μm, 12 μm, or 15 μm into the encapsulation layer 3 .

[0149] In step S20 , a milling cutter may be used to cut and form the first groove 14 , with the cutting depth completely covering the optical film module 4 and extending into the encapsulation layer 3 by 10 μm-15 μm.

[0150] Since the thickness of the optical film module 4 is relatively thin, if the first groove 14 is only provided in the optical film module 4, higher processing precision is required. In the above design, by extending the first groove 14 into the encapsulation layer 3, the difficulty of making the first groove 14 can be simplified, and the processing efficiency of the product can be improved. Moreover, under this design, it is ensured that the side sealing layer 5 can completely cover the optical film module 4, while ensuring that the side of the encapsulation layer 3 has a larger exposed area.

[0151] In some embodiments, the light shielding material is a black colloid, and the optical density of the side sealing layer 5 is less than 4.

[0152] For example, the shading material may be black epoxy glue, polyurethane glue, etc.

[0153] With the above design, on the one hand, the black colloid can effectively block defects such as curling, burrs and residual glue of the optical film module 4, ensuring that the white edge problem at the joints of the LED display module 100 can be eliminated. On the other hand, maintaining the optical density of the side sealing layer 5 within a reasonable range can ensure the normal propagation of light and avoid the black edge problem at the joints of the LED display module 100 when it is in the display state.

[0154] In some embodiments, along a direction parallel to the surface of the substrate 1 , the width of the first groove 14 in the functional area is 10 μm-15 μm.

[0155] For example, the width of the side sealing layer 5 may be 10 μm, 12 μm, or 15 μm.

[0156] It should be noted that the width of the side sealing layer 5 refers to the dimension in the extending direction parallel to the surface of the substrate 1 and perpendicular to the side thereof.

[0157] With the above design, on the one hand, the side sealing layer 5 has sufficient thickness to completely cover the defects such as curling, burrs and residual glue on the edge of the optical film module 4 and effectively block these defects. On the other hand, this width range is suitable for various spraying processes such as slit coating and spraying, which is also beneficial to reduce the difficulty of manufacturing the LED display module 100.

[0158] In summary, for the manufacturing method of the LED display module 100 provided in this application, by fabricating the side seal layer 5 structure on the side of the optical film module 4, defects such as curling, burrs, and residual glue of the optical film module 4 can be effectively blocked, thereby eliminating the white edge problem at the seam of the LED display module 100, improving the visual consistency of the related LED display products in the black screen state. At the same time, this structural design of the side seal layer 5 also ensures that the side of the encapsulation layer 3 can emit light normally, that is, on the premise of solving the white edge problem, the side light-emitting effect of the LED display module 100 and related LED display products is ensured.

[0159] An embodiment of the third aspect of this application provides an LED display screen, including multiple LED display modules 100 in the first aspect, and / or including multiple LED display modules 100 manufactured by using the manufacturing method of the LED display module 100 in the second aspect.

[0160] Multiple LED display modules 100 can form an LED display screen by splicing.

[0161] The LED display screen provided in the embodiment of this application can effectively improve the product quality of the LED display screen by adopting the LED display module 100 in the first aspect or the LED display module 100 manufactured by using the manufacturing method in the second aspect.

[0162] The above are only the preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent replacements, and improvements made within the spirit and principle of this application shall be included in the protection scope of this application.

Claims

1. An LED display module, characterized in that: It comprises an LED display panel and a side sealing layer. The LED display panel comprises an optical film module. The side sealing layer is arranged around the side of the optical film module and is made of a light-shielding material.

2. The LED display module according to claim 1, characterized in that: The optical film module comprises an optical adhesive layer and at least one optical film layer stacked along a first direction, and the side sealing layer surrounds the sides of the optical adhesive layer and the optical film layer.

3. The LED display module according to claim 2, characterized in that: The optical film layer is a polyester film or a triacetate cellulose film or a super-refractive polyester film, and / or the optical film layer has one or more of an anti-glare coating, an anti-reflection coating, and an anti-fingerprint coating.

4. The LED display module according to claim 2, characterized in that: The optical adhesive layer includes a heat-curing optical adhesive or an ultraviolet light-curing optical adhesive.

5. The LED display module according to claim 2, characterized in that: The thickness of the optical film layer is 25μm-200μm, and / or the thickness of the optical adhesive layer is 10μm-100μm, and / or the viscosity between the optical adhesive layer and the LED display panel is 15N / 25mm-30N / 25mm, and / or the shading material is a black colloid, the optical density of the side sealing layer is less than 4, and / or the width of the side sealing layer is 10μm-15μm along a direction parallel to the display surface of the LED display panel.

6. The LED display module according to any one of claims 1 to 5, characterized in that: The LED display panel also includes a substrate, a plurality of LED light-emitting units and a packaging layer. The substrate, the plurality of LED light-emitting units, the packaging layer and the optical film module are stacked along a first direction, and the packaging layer is used to encapsulate the plurality of LED light-emitting units.

7. The LED display module according to claim 6, characterized in that: The side sealing layer is also arranged around a part of the side of the packaging layer, and the outer edge of the side sealing layer is flush with the outer edge of the remaining part of the packaging layer. 8 . The LED display module according to claim 7 , wherein along the first direction, a portion of the side sealing layer surrounding a side portion of the packaging layer has a thickness of 10 μm-15 μm.

9. The LED display module according to claim 6, characterized in that: The LED display module further includes a driving chip, which is disposed on the substrate and electrically connected to the LED light-emitting unit through the substrate.

10. A method for preparing an LED display module, characterized in that: include: Providing a panel body, the panel body comprising a substrate, an LED light-emitting unit, a packaging layer and an optical film module stacked along a first direction, the panel body comprising a functional area and a panel edge area surrounding the functional area; Making a first groove on the panel body, the first groove surrounds the functional area, and the first groove is partially located in the functional area, and the other part is located in the panel edge area, and the first groove runs through the optical film module; Making a side sealing layer, wherein the side sealing layer at least fills the first groove; The panel body is cut so that the side sealing layer surrounds the side of the optical film module, and the side sealing layer is flush with the outer edge of at least part of the packaging layer.

11. The method for preparing an LED display module according to claim 10, characterized in that: The manufacturing of the side sealing layer comprises: filling the first groove with a light shielding material, and curing the light shielding material to form the side sealing layer; Cutting the panel body includes: removing the panel edge area of ​​the panel body and the light shielding material located in the panel edge area.

12. The method for preparing an LED display module according to claim 10, wherein: The manufacturing of the encapsulation layer includes: cutting off a portion of the panel edge area of ​​the panel body, coating a light shielding material on the side of the panel body and curing the light shielding material; Cutting the panel body includes: removing the light shielding material outside the functional area.

13. The method for preparing an LED display module according to any one of claims 10 to 12, characterized in that: The first groove further extends to the packaging layer. Along the first direction, the first groove extends to the packaging layer to a depth of 10 μm-15 μm.

14. An LED display screen, characterized in that: The method comprises a plurality of LED display modules according to any one of claims 1 to 9, and / or a plurality of LED display modules manufactured by the method for manufacturing an LED display module according to any one of claims 10 to 13.

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