Assembly method, device and equipment of assembly component and storage medium

Abstract

The invention provides an assembling method and device of an assembling component, equipment and a storage medium. Relates to the technical field of computers. The method comprises the following steps: acquiring a sending protocol of an assembly structure of a target assembly component to obtain a target protocol; screening out a first assembly component set from existing assembly components except the target assembly component in the home design scheme; the first assembly component set comprises at least one first assembly component; the receiving protocol of the assembly structure of the first assembly component is a target protocol; based on the position information and the assembly structure of each first assembly component in the first assembly component set, screening to-be-adsorbed assembly components in the first assembly component set; under the condition that the to-be-adsorbed assembly component is screened out, the target assembly component and the to-be-adsorbed assembly component are assembled based on an assembly body rule, and a target assembly body is obtained; wherein the assembly body rule is used for restraining the first parameters of the target assembly component and the to-be-adsorbed assembly component to be kept consistent in the assembly process.

Description

Technical Field

[0001] The present disclosure relates to the field of computer technologies, and in particular, to technologies such as intelligent home decoration design and intelligent interaction. Background Art

[0002] In the fields of home and home decoration industries, multiple assembly components are usually used for assembly to complete the entire home design plan.

[0003] However, how to quickly assemble multiple assembly components into an assembly body is a problem faced currently. Summary of the Invention

[0004] The present disclosure provides an assembly method, device, equipment, and storage medium for assembly components to solve or alleviate one or more technical problems in the prior art.

[0005] In a first aspect, the present disclosure provides an assembly method for assembly components, including:

[0006] Obtaining a sending protocol of an assembly structure of a target assembly component to obtain a target protocol;

[0007] Screening out a first set of assembly components from the existing assembly components other than the target assembly component in the home design plan; the first set of assembly components includes at least one first assembly component; a receiving protocol of the assembly structure of the first assembly component is the target protocol;

[0008] Based on the position information and assembly structure of each first assembly component in the first set of assembly components, screening out assembly components to be adsorbed and assembled in the first set of assembly components;

[0009] In the case where the assembly components to be adsorbed and assembled are screened out, assembling the target assembly component and the assembly components to be adsorbed and assembled according to the assembly body rules to obtain a target assembly body;

[0010] Wherein, the assembly body rules are used to constrain that a first parameter of the target assembly component and the assembly components to be adsorbed and assembled remains consistent during the assembly process.

[0011] In a second aspect, the present disclosure provides an assembly device for assembly components, including:

[0012] An obtaining module, configured to obtain a sending protocol of an assembly structure of a target assembly component to obtain a target protocol;

[0013] A first screening module, configured to screen out a first set of assembly components from the existing assembly components other than the target assembly component in the home design plan; the first set of assembly components includes at least one first assembly component; a receiving protocol of the assembly structure of the first assembly component is the target protocol;

[0014] A second screening module, configured to screen the to-be-adsorbed and assembled components from the first set of assembled components based on the position information and the assembly structure of each first assembled component in the first set of assembled components;

[0015] An assembly module, configured to, when the to-be-adsorbed and assembled components are screened, assemble the target assembled component and the to-be-adsorbed and assembled components based on the assembly rules of the assembled body to obtain a target assembled body;

[0016] Wherein, the assembly rules of the assembled body are used to constrain the first parameters of the target assembled component and the to-be-adsorbed and assembled components to be consistent during the assembly process.

[0017] In a third aspect, an electronic device is provided, including:

[0018] At least one processor; and

[0019] A memory communicatively connected to the at least one processor; wherein,

[0020] The memory stores instructions executable by the at least one processor, and when the instructions are executed by the at least one processor, the at least one processor is enabled to execute any method in the embodiments of the present disclosure.

[0021] In a fourth aspect, a non-transitory computer-readable storage medium storing computer instructions is provided, wherein the computer instructions are used to cause the computer to execute any method in the embodiments of the present disclosure.

[0022] In a fifth aspect, a computer program product is provided, including a computer program, and when the computer program is executed by a processor, it implements any method in the embodiments of the present disclosure.

[0023] The beneficial effects of the technical solutions provided by the present disclosure at least include:

[0024] It should be understood that the content described in this part is not intended to identify the key or important features of the embodiments of the present disclosure, nor is it used to limit the scope of the present disclosure. Other features of the present disclosure will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In the drawings, unless otherwise specified, the same reference numerals throughout the several views denote the same or similar components or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings only depict some embodiments provided by the present disclosure and should not be regarded as limiting the scope of the present disclosure.

[0026] Figure 1 It is a schematic flowchart of the assembly method of the assembled components according to the embodiments of the present disclosure;

[0027] Figure 2 is the first schematic diagram of the visualization interface according to an embodiment of the present disclosure;

[0028] Figure 3 is the second schematic diagram of the visualization interface according to an embodiment of the present disclosure;

[0029] Figure 4 is the third schematic diagram of the visualization interface according to an embodiment of the present disclosure;

[0030] Figure 5 is the fourth schematic diagram of the visualization interface according to an embodiment of the present disclosure;

[0031] Figure 6 is the schematic flow diagram of determining the assembly components to be adsorbed according to an embodiment of the present disclosure;

[0032] Figure 7 is the schematic flow diagram of screening target high-level scripts according to an embodiment of the present disclosure;

[0033] Figure 8 is the schematic diagram of the assembly chain according to an embodiment of the present disclosure;

[0034] Figure 9 is the structural schematic diagram of the assembly device of the assembly component according to an embodiment of the present disclosure;

[0035] Figure 10 is the block diagram of the electronic device for implementing the assembly method of the assembly component according to an embodiment of the present disclosure. Detailed implementation manners

[0036] Hereinafter, the present disclosure will be further described in detail with reference to the accompanying drawings. The same reference numerals in the drawings denote elements having the same or similar functions. Although various aspects of the embodiments are shown in the drawings, the drawings do not have to be drawn to scale unless otherwise specified.

[0037] In addition, for better explaining the present disclosure, numerous specific details are given in the following detailed implementation manners. Those skilled in the art should understand that the present disclosure can still be implemented without some specific details. In some instances, methods, means, elements, and circuits well known to those skilled in the art are not described in detail so as to highlight the gist of the present disclosure.

[0038] The terms "first", "second", etc. in this disclosure are used to distinguish similar objects and do not necessarily describe a specific order or sequence. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a method, system, product, or device that includes a series of steps or units does not necessarily limit to those clearly listed steps or units, but may include other steps or units not clearly listed or inherent to these processes, methods, products, or devices.

[0039] A home design solution refers to the systematic planning and design of the indoor environment to meet the user's living needs, aesthetic preferences, and spatial functions. Its core goal is to create a layout that meets the user's usage requirements through reasonable layout and style matching.

[0040] An assembly component (Snapper) is an interactive basic component that constitutes a home design solution. Exemplarily, it can include panel parts, desktops, walls, etc.

[0041] Assembly refers to the process of combining assembly components into a formed object through standardized components and processes.

[0042] Since a home design solution includes multiple models, such as a wardrobe, a dining table, a screen, etc. Taking the wardrobe as an example, the wardrobe is composed of multiple components. Therefore, any panel part in the wardrobe can be an assembly component, and the assembly formed by multiple assembly components is the wardrobe. Taking the table as an example, the desktop can be an assembly component, and the table legs can be another assembly component. Assembling them can obtain an assembly that is a dining table.

[0043] In addition, different models can also be understood as assembling assembly components with other models.

[0044] In the embodiments of this disclosure, an assembly method for assembly components is proposed, as Figure 1 shown, including:

[0045] S101, obtaining the sending protocol of the assembly structure of the target assembly component to obtain the target protocol.

[0046] Among them, the target assembly component is an assembly component that has not been assembled with any assembly component in the home design solution. It can also be understood as an assembly component whose parameters in the home design solution have not been determined according to the user's needs. The parameters can be at least one of position parameters, dimension parameters, material parameters, etc.

[0047] S102, screening out a first set of assembly components from the existing assembly components in the home design solution other than the target assembly component; the first set of assembly components includes at least one first assembly component; the receiving protocol of the assembly structure of the first assembly component is the target protocol.

[0048] An existing assembly component is an assembly component whose parameters in the home design solution have been determined according to user requirements.

[0049] Among them, the sending protocol is used for the assembly components in the home design solution that can actively adsorb other assembly components. It can also be understood as the triggering condition for triggering the method provided in this embodiment of the present disclosure. For example, when a user filters out a target assembly component from the component library and adds it to the home design solution, if the target assembly component has this sending protocol, it will actively search for components that can be assembled with it among the existing components in the home design solution.

[0050] The receiving protocol is used for the assembly components in the home design solution that passively adsorb other assembly components. The receiving protocol is a prerequisite for being able to assemble with the target assembly component.

[0051] It should be noted that the assembly structure of any assembly component may include a sending protocol and / or a receiving protocol. When the protocol configured by the sending protocol of the assembly structure of the target assembly component is the same as the protocol configured by the receiving protocol of the assembly structure of the existing assembly component i, it is determined that adsorption is supported between the target assembly component and the existing assembly component i. Among them, the existing assembly component i is any existing assembly component among the existing assembly components other than the target assembly component in the home design solution.

[0052] It should be noted that the sending protocol and the receiving protocol of the assembly structure of each assembly component can be configured based on actual situations. Since the target assembly component needs to actively adsorb, the sending protocol needs to be configured, while the existing assembly component needs to passively adsorb, so the receiving protocol needs to be configured.

[0053] It should be noted that which protocols (including the sending protocol and / or the receiving protocol) are specifically configured for each assembly component can be set based on actual situations. Exemplarily, when it is required that assembly component m and assembly component n support assembly into an assembly body, when assembly component m is the target assembly component and assembly component n is the existing assembly component, the sending protocol of the assembly structure of assembly component m can be configured as protocol 1, and the receiving protocol configuration of the assembly structure of assembly component n can also be protocol 1. When assembly component n is the target assembly component and assembly component m is the existing assembly component, the sending protocol of the assembly structure of assembly component n can be configured as protocol 1, and the receiving protocol configuration of the assembly structure of assembly component m can also be protocol 1. In addition, the sending protocol and the receiving protocol of the assembly structure of assembly component n can both be configured as protocol 1, and the sending protocol and the receiving protocol of the assembly structure of assembly component m can also both be configured as protocol 1. This embodiment of the present disclosure does not limit this.

[0054] S103. Screen the assembly components to be adsorbed in the first assembly component set based on the position information and assembly structure of each first assembly component in the first assembly component set.

[0055] S104. In the case where the assembly components to be adsorbed are screened, assemble the target assembly component and the assembly components to be adsorbed based on the assembly rules of the assembly to obtain the target assembly.

[0056] Among them, the assembly rules are used to constrain the first parameters of the target assembly component and the assembly components to be adsorbed to be consistent during the assembly process.

[0057] Among them, the first parameter can be a model parameter of the assembly component, such as at least one of material parameters, dimension parameters, etc.

[0058] In the embodiments of the present disclosure, by obtaining the target protocol configured by the sending protocol of the assembly structure of the target assembly component, the first assembly component set that matches it can be accurately screened out from the existing assembly components in the home design plan. Furthermore, combining the position information and assembly structure of each first assembly component in the first assembly component set, the specific assembly components to be adsorbed that the target assembly component needs to be assembled can be quickly and accurately located, reducing the time for manually searching for suitable assembly components among a large number of assembly components in the home design model, making the assembly process faster and more convenient. In addition, in the case of assembling the target assembly component and the assembly components to be adsorbed based on the assembly rules of the assembly, the first parameters of the target assembly component and the assembly components to be adsorbed can be constrained to be consistent during the assembly process. For example, it helps to improve the consistency and coordination of the assembled target assembly in terms of material, dimension, etc., reduces assembly defects caused by inconsistent first parameters, and further simplifies the manual operation process, improving the assembly efficiency of the assembly components in the home design plan.

[0059] In addition, not limited to a specific home type, when the assembly components in the home design plan can be associated and configured with corresponding protocols (including sending protocols and / or receiving protocols), this method can be applied for assembly. This enables more flexible assembly and combination of assembly components when facing different home decoration styles, space layouts and other design plans, improving the adaptability and operability of the home design plan.

[0060] Before the assembly components are assembled, it is necessary to configure the assembly structure of each assembly component, where the assembly structure includes at least one of assembly points, assembly lines, and assembly surfaces.

[0061] In some embodiments, the interface diagram for configuring the sending protocol and / or receiving protocol of the assembly structure of any assembly component is as Figure 2As shown, any one of the "assembly point", "assembly line", and "assembly surface" can be assembled in the assembly structure. Taking the configuration of the assembly point as an example, click on the assembly point in the assembly structure, and the structure navigation interface will appear. This interface shows which assembly structures are configured for this assembly component. "Assembly Point - 1" is used to represent the detailed information of the assembly point. The position X, position Y, and position Z in this interface represent the coordinates of this assembly point, and the rotation X, rotation Y, and rotation Z represent the angles of rotation around each coordinate axis after this assembly point is connected to other assembly components. The configuration items of the receiving protocol and the sending protocol shown in this interface are used to configure the receiving protocol and the sending protocol.

[0062] In some embodiments, as Figure 3 shown, it is a schematic diagram of the interface for creating an assembly protocol. After creation, this assembly protocol can be configured as the sending protocol and / or the receiving protocol for Figure 2 the assembly structure shown. In Figure 3 , the operation item of "name" is used to define the protocol name, and the protocol name can be selected based on the actual situation. Figure 3 The operation item of "reference name" in

[0063] is also selected based on the actual situation. The reference name is used to represent the names of two assembly structures. Exemplarily, p1 is the assembly point A in assembly component 1, and p2 is the assembly point B in assembly component 2. The corresponding assembly structure or assembly component can be found through this reference name, and then the corresponding parameters can be read. During the assembly process, the relevant information of this assembly structure can also be read based on this reference name. Exemplarily, the target assembly component includes assembly structure A and assembly structure B; the assembly component to be adsorbed includes assembly structure C and assembly structure D. Among them, the sending protocol configured for assembly structure A is protocol a, and the reference name of protocol a is "A - C", where A represents assembly structure A and C represents assembly structure C. The sending protocol configured for assembly structure B is protocol b, and the reference name of protocol b is "B - E", where B represents assembly structure B and E represents assembly structure E. The receiving protocol configured for assembly structure C is protocol a. Thus, by identifying the protocol parameters, the assembly structure within the existing assembly component that has the same target protocol as the assembly structure of the target assembly component can be identified. Protocol a and the sending protocol configured for assembly structure A being protocol a are the same protocol. The receiving protocol configured for assembly structure D is protocol c, and the reference name of protocol c is "V - C", where V represents assembly structure V and C represents assembly structure C. Among them, both assembly structure E and assembly structure V are assembly structures in the existing assembly components other than the target assembly component in the home design scheme. In this case, based on protocol a, it can be determined that assembly structure A in the target assembly component needs to be assembled with assembly structure C in the assembly component to be adsorbed.

[0064] In addition, at least one of adsorption rules, adaptation rules, advanced scripts, and assembly rules needs to be created for association with the protocol.

[0065] Among them, the adsorption rule is used to represent the rule for adsorption between the assembly structures of two assembly components. Exemplarily, the adsorption rule can be used to specify the relative position and relative direction for adsorption between two assembly components. The adsorption rule supports configuring the adsorption type, which includes but is not limited to point-to-point, point-to-line, point-to-plane, line-to-line, etc. Exemplarily, the interface diagram for creating the adsorption rule is as Figure 4 shown: The name operation item can be set based on the actual situation; the "bind protocol" operation item is used to bind to the previously created assembly protocol; the "adsorption type" is any one of the aforementioned adsorption types; the "adsorption data" includes three-axis position and three-axis rotation, and the three-axis position and three-axis rotation are the ranges for rotating or moving the position of the assembly structure of the target assembly component.

[0066] In the case where the adsorption type is line-to-line, the interface diagram of its adsorption rule is as Figure 5 shown, where the "name", "bind protocol", and "adsorption type" are similar to the aforementioned expressions, and the embodiments of the present disclosure will not elaborate on them one by one here. Figure 5 The "adsorption data" in is used to represent the relative position and relative direction between two assembly lines. Exemplarily, it can include "whether in the same direction", "whether it can exceed", "positioning method", "alignment point of the common line", and "alignment point of the generatrix". "Whether in the same direction" indicates whether the directions of the two assembly lines are the same. "Whether it can exceed" indicates how to handle the situation where, for two assembly lines, when one assembly line is assembled with the other, the sizes of the two assembly lines do not completely match. When it is selected that it cannot exceed, the assembly line with the larger size is adjusted to the size of the smaller assembly line, and then they are matched. When it is selected that it can exceed, the sizes of the assembly lines are not adjusted. The "positioning method" indicates the method based on which the two assembly lines are aligned. When it is selected to align at a fixed point, alignment points need to be set at the alignment point of the common line and the alignment point of the generatrix so that the two assembly lines are aligned. Exemplarily, when the alignment point of the common line is 0.5 and the alignment point of the generatrix is 0.5, they are aligned based on the center points of the two assembly lines. When the alignment point of the common line is 0 and the alignment point of the generatrix is 0, they are aligned based on the right endpoints of the two assembly lines. When the alignment point of the common line is 1 and the alignment point of the generatrix is 1, they are aligned based on the left endpoints of the two assembly lines.

[0067] The specific adsorption data included in other adsorption types can be set based on the actual situation, and the embodiments of the present disclosure do not limit this.

[0068] In addition, the adaptation rule is used to constrain the assembly lines of the assembly components to be the same size as those of another assembly component when the adsorption type is line-to-line.

[0069] The advanced script is used to constrain the assembly structures of two assembly components to be consistent in preset parameters. Exemplarily, it may include parameters such as material and size.

[0070] When at least one of the adsorption rule, adaptation rule, advanced script, and assembly rule is created and bound to the target protocol, in Figure 2 it is possible to configure the sending protocol and / or receiving protocol in the assembly point - 1 as the corresponding assembly protocol, and then associate it with at least one of the adsorption rule, adaptation rule, advanced script, and assembly rule bound to the target protocol.

[0071] In the embodiments of the present disclosure, assembly points, assembly lines, and assembly surfaces are used as specific assembly reference elements, providing clear references for the connection and positioning between assembly components. During the assembly process, components can be precisely aligned and assembled based on the specific assembly structure, avoiding assembly deviations caused by unclear assembly structures, improving the automation level of the assembly process, and enhancing the assembly accuracy.

[0072] In some embodiments, screening for assembly components to be adsorbed in the first assembly component set based on the position information and assembly structure of each first assembly component in the first assembly component set can be implemented as:

[0073] Step A1, when the position information of any first assembly component in the first assembly component set is within the preset range of the target assembly component, use the any first assembly component as the second assembly component and add it to the second assembly component set.

[0074] Since the target assembly component is an assembly component that has not been assembled with any assembly component in the home design solution, for this target assembly component, there are expected assembly components to be adsorbed by the target object. Therefore, the target assembly component can be moved towards the position of the assembly components to be adsorbed, and then the assembly components within the preset range of the target assembly component can be determined as the second assembly component set.

[0075] Among them, the preset range can be a circle centered on the target assembly component with a radius of R. When any first assembly component is within this preset range, use the first assembly component as the second assembly component and add it to the second assembly component set.

[0076] In addition, the preset range can be square or other forms. The embodiments of the present disclosure do not limit the form and size of the preset range, which can be set based on the actual situation.

[0077] Step A2, when there are multiple assembly structures in each second assembly component in the second assembly component set, sort the second assembly components in the second assembly component set based on the preset order of the assembly structures to obtain a sorting result.

[0078] In the embodiments of the present disclosure, the adsorption types of the adsorption rules include, but are not limited to, point-to-point, point-to-line, point-to-plane, line-to-line, etc. Due to the relatively small and precise positioning area of the assembly points, accurate positioning can be achieved based on the assembly points, and thus accurate positioning can be achieved between the assembly components. The positioning area of the assembly line is larger than that of the assembly point and smaller than that of the assembly plane. Therefore, the preset order can be assembly point > assembly line > assembly plane.

[0079] In implementation, when the second assembly component set includes the second assembly component A, the second assembly component B, and the second assembly component C, the assembly structure of the second assembly component A includes the assembly point 1, the assembly structure of the second assembly component B includes the assembly plane 2, and the assembly structure of the second assembly component C includes the assembly line 3. In this case, the obtained sorting order is the second assembly component A - assembly point 1, the second assembly component C - assembly line 3, and the second assembly component B - assembly plane 2.

[0080] It can be understood that when the assembly structure is configured with an assembly point, the corresponding second assembly component is ranked first, and then sorted based on the preset order of the assembly structures to obtain a sorting result.

[0081] When the assembly structures of multiple second assembly components all include assembly points, the sorting can also be combined with the distances between each second assembly component and the target assembly component. When the distance between any second assembly component and the target assembly component is the closest and the assembly structure of this second assembly component is configured with an assembly point, this second assembly component can be ranked first, and then the sorting result is obtained by successively combining the preset order of the assembly structures based on the distances from near to far.

[0082] During implementation, multiple assembly structures can be configured for any second assembly component based on the foregoing method. Exemplarily, the second assembly component set includes second assembly component A, second assembly component B, and second assembly component C. The assembly structure of second assembly component A includes assembly point 1, assembly line 1, and assembly surface 1. The distance between second assembly component A and the target assembly component is a. The assembly structure of second assembly component B includes assembly point 2 and assembly surface 2. The distance between second assembly component B and the target assembly component is b. The assembly structure of second assembly component C includes assembly line 3. The distance between second assembly component C and the target assembly component is c. Wherein, b < a < c, and a, b, and c are all greater than 0. In this case, the obtained sorting order is second assembly component B - assembly point 2, second assembly component A - assembly point 1, second assembly component A - assembly line 1, second assembly component C - assembly line 3, second assembly component B - assembly surface 2, second assembly component A - assembly surface 1.

[0083] Step A3, when the second assembly component ranked first in the sorting result supports connection with the target assembly component, determine the second assembly component ranked first as the to-be-adsorbed assembly component.

[0084] During implementation, that the second assembly component ranked first supports connection with the target assembly component can be understood as that the assembly structures of the second assembly component and the target assembly component conform to the adsorption type in the adsorption rule associated with the target protocol. Exemplarily, when the assembly structure of the target assembly component is an assembly point and the adsorption type of the adsorption rule associated with the assembly structure of this target assembly component is point-to-point, the assembly structure of the second assembly component ranked first is also an assembly point, which means that the two support connection.

[0085] In another embodiment, when the second assembly component ranked first in the sorting result does not support connection with the target assembly component, based on the sorting result, each second assembly component is sequentially matched with the target assembly component, and the second assembly component that supports connection is determined as the to-be-adsorbed assembly component. In addition, when the second assembly component ranked first does not support connection with the target assembly component, the second assembly component ranked first can also be deleted to save resources.

[0086] Exemplarily, when the assembly structure of the target assembly component is an assembly point, and the adsorption type of the adsorption rule associated with the assembly structure of the target assembly component is point-to-line, the assembly structure of the second assembly component in the first position is also an assembly point, indicating that the two do not support connection. In this case, it is necessary to determine in the sorting result whether the second assembly component in the second position supports connection with the target assembly component. When the assembly structure of the second assembly component in the second position is an assembly line, it is determined that the two support connection. The second assembly component is determined as the to-be-adsorbed assembly component. Otherwise, continue to search for the next second assembly component in order according to the sorting result of the sorting result until the to-be-adsorbed assembly component is screened out, or all the second assembly components in the second assembly component set do not support connection with the target assembly component.

[0087] In some embodiments, the overall process of determining the to-be-adsorbed assembly component is as Figure 6 shown, including:

[0088] S601. Start dragging the target assembly component;

[0089] S602. Obtain the sending protocol of the assembly structure of the target assembly component to obtain the target protocol;

[0090] Among them, the assembly structure includes at least one of an assembly point, an assembly line, and an assembly surface.

[0091] S603. Screen out the first assembly component set from the existing assembly components other than the target assembly component in the home design scheme;

[0092] Among them, the first assembly component set includes at least one first assembly component; the receiving protocol of the assembly structure of the first assembly component is the target protocol.

[0093] S604. When the position information of any first assembly component in the first assembly component set is within the preset range of the target assembly component, use any first assembly component as the second assembly component and add it to the second assembly component set.

[0094] S605. When there are multiple assembly structures among the second assembly components in the second assembly component set, sort the second assembly components in the second assembly component set based on the preset order of the assembly structures and the position information of each second assembly component to obtain a sorting result.

[0095] S606. Determine whether the second assembly component ranked first in the sorting result supports connection with the target assembly component. If not, execute S607; if so, execute S608.

[0096] S607. Delete the second assembly component ranked first in the sorting result and execute S606.

[0097] S608, determine the second assembly component at the first position as the assembly component to be adsorbed.

[0098] In the embodiments of the present disclosure, only the components whose positions of any first assembly component in the first assembly component set meet the preset range are used as the second assembly components, which reduces the range of components that need to be further processed. In addition, the second assembly components are sorted, and the one ranked first is determined as the assembly component to be adsorbed. Based on this sorting mechanism, it is possible to determine which component is processed first according to the preset order of the assembly structure, combining the position information and the assembly structure to achieve precise screening and reasonable sorting, improving the assembly efficiency and accuracy.

[0099] In some embodiments, due to the diverse assembly structures, various rules can be executed based on the actual situation of the assembly structure. Specifically, it can also be implemented as follows:

[0100] Step B1, when it is determined that the assembly structure of the assembly component to be adsorbed is not an assembly line, the assembly structure of the target assembly component is not an assembly line, and a target high-level script is screened out from at least one high-level script associated with the target protocol, execute the target high-level script to obtain the execution result of the target high-level script.

[0101] During implementation, when it is determined that the assembly structure of the assembly component to be adsorbed is an assembly point and / or an assembly surface, and the assembly structure of the target assembly component is an assembly point and / or an assembly surface, the operation of screening the high-level script is performed. When the target high-level script is screened out, execute the target high-level script to obtain the execution result of the target high-level script. When no high-level script is screened out, maintain the default connection between the assembly component to be adsorbed and the target adsorption component, where the default connection is the connection method that does not require any modification after the adsorption rule is executed.

[0102] In some embodiments, when a target high-level script is screened out from at least one high-level script associated with the target protocol, execute the target high-level script to obtain the execution result of the target high-level script. Specifically, it can be implemented as follows: when the target high-level script is to add a supplementary part, execute the target high-level script to add a supplementary part between the target assembly component and the assembly component to be adsorbed.

[0103] The supplementary part is used to adjust the connection relationship or function matching between the assembly components. Exemplarily, two original assembly components may be incompatible, or their connection requires some additional support or adjustment. In this case, a supplementary part is needed to help these two assembly components connect.

[0104] In the embodiments of the present disclosure, an addendum is added between the target assembly component and the assembly component to be adsorbed through an advanced script, which can effectively meet the diverse requirements for component connection, support, or function supplementation in different assembly scenarios, making the assembly process more flexible. At the same time, using the advanced script method can automate the addition of the addendum, further improving the efficiency while reducing the waste of human resources.

[0105] In some embodiments, when screening out a target advanced script from at least one advanced script associated with the target protocol, executing the target advanced script to obtain the execution result of the target advanced script can be specifically implemented as: when the target advanced script is modified to a second parameter, executing the target advanced script to modify the parameters of the target assembly component and the assembly component to be adsorbed to the second parameter.

[0106] Among them, the second parameter is used to represent a certain type of model parameter in the assembly component, such as at least one of parameters including material, size, color, etc.

[0107] During implementation, when the intention of the target advanced script is to modify the second parameter of the target assembly component and the assembly component to be adsorbed to H, the execution result of the target advanced script is that the second parameter of the target assembly component and the assembly component to be adsorbed is modified to H.

[0108] In the embodiments of the present disclosure, the second parameter can be quickly modified through the advanced script, reducing the cumbersome process of manually adjusting the second parameter by humans, reducing the possibility of operation errors, and greatly improving the assembly efficiency.

[0109] In addition, in the case of an advanced script not associated with the target protocol, the default connection between the assembly component to be adsorbed and the target adsorption component is maintained, that is, the connection method that does not require any modification after the adsorption rule is originally executed.

[0110] In some embodiments, the overall flowchart of screening the target advanced script from at least one advanced script associated with the target protocol is as Figure 7 shown, including:

[0111] S701, determining whether the target protocol is associated with at least one advanced script; if there is an associated advanced script, execute S702; if there is no associated advanced script, execute S707.

[0112] S702, obtaining at least one advanced script associated with the target protocol to obtain a list of advanced scripts.

[0113] S703, determining whether the list of advanced scripts is empty; if so, execute S707; if not, execute S704;

[0114] S704. Determine whether the connection method of the first high-level script in the high-level script list matches that of the component to be adsorbed and assembled and the target adsorption component; if not, execute S705; if so, execute S707; in the case where the high-level script list is empty, execute S707.

[0115] S705. Delete the first high-level script from the high-level script list and execute S703.

[0116] S706. Execute the first high-level script to obtain the execution result.

[0117] S707. Maintain the default connection of the component to be adsorbed and assembled and the target adsorption component.

[0118] Step B2. On the basis of the execution result of the target high-level script, return to execute the assembly of the target assembly component and the component to be adsorbed and assembled based on the assembly rules.

[0119] That is to say, after the execution of the target high-level script is completed, that is, on the basis of the execution result of the target high-level script, the target assembly component and the component to be adsorbed and assembled are assembled based on the assembly rules.

[0120] In the embodiments of the present disclosure, in the case where the structures of the component to be adsorbed and assembled and the target assembly component are both non-assembly lines, the assembly method of the two can be flexibly adjusted by executing the selected target high-level script, so that the target assembly component and the component to be adsorbed and assembled can be better automatically assembled, reducing the cumbersome process of manual adjustment by personnel in the later stage to save human resources. In addition, in the face of different protocols or connection scenarios of different assembly components, there is no need to develop a new high-level script from scratch each time, and some parameters in the high-level script can be modified to achieve the reuse of the high-level script.

[0121] In some embodiments, the adaptation rule is applicable to the case of connecting assembly lines to assembly lines, and can be specifically implemented as:

[0122] Step C1. In the case where it is determined that the assembly structure of the component to be adsorbed and assembled is an assembly line, the assembly structure of the target assembly component is an assembly line, and the target protocol is associated with an adaptation rule, adjust the size of the assembly line in the target assembly component to the size of the assembly line in the component to be adsorbed and assembled based on the adaptation rule.

[0123] During implementation, in the case where it is determined that the assembly structure of the component to be adsorbed and assembled is an assembly line, the assembly structure of the target assembly component is an assembly line, and the target protocol is associated with an adaptation rule, the intention of the adaptation rule is to adjust the size of the assembly line in the target assembly component to the size of the assembly line in the component to be adsorbed and assembled, that is, it is necessary to adjust the target assembly component.

[0124] Exemplarily, when the size of the assembly line of the target assembly component is p and the size of the assembly line in the assembly component to be adsorbed is q, it is necessary to adjust the size p of the assembly line of the target assembly component to q, where both p and q are greater than 0.

[0125] Step C2, when screening out the target high-level script from at least one high-level script associated with the target protocol, execute the target high-level script to obtain the execution result of the target high-level script.

[0126] That is, it can be understood that based on the completion of the execution of the adaptation rule, from at least one high-level script associated with the target protocol, when screening out the target high-level script, execute the target high-level script to obtain the execution result of the target high-level script.

[0127] Step C3, based on the execution result of the target high-level script, return to execute the assembly of the target assembly component and the assembly component to be adsorbed based on the assembly body rule.

[0128] That is, it can be understood that after the execution of the target high-level script is completed, that is, based on the execution result of the target high-level script, the target assembly component and the assembly component to be adsorbed are assembled based on the assembly body rule.

[0129] In the embodiment of the present disclosure, when the assembly structures of the assembly component to be adsorbed and the target assembly component are both assembly lines and there is an adaptation rule, the size of the assembly line in the target assembly component is adjusted to the size of the assembly line in the assembly component to be adsorbed through the adaptation rule, so that the two are accurately matched in size, reducing problems such as assembly incompatibility, loose connection or misalignment caused by size differences, and improving the accuracy of assembly. After automatically adjusting the size based on the adaptation rule, by executing the target high-level script and obtaining its result, and then returning to execute the assembly based on the assembly body rule, the whole process has a high degree of automation, reducing the time of manual intervention and repeated debugging, quickly determining the best assembly plan and completing the assembly, and significantly improving the assembly efficiency.

[0130] In some embodiments, when the assembly component to be adsorbed is screened, the target assembly component and the assembly component to be adsorbed are assembled based on the assembly body rule to obtain a target assembly body, which can be specifically implemented as:

[0131] Step D1, construct a candidate assembly body based on the assembly chain of the assembly component to be adsorbed and the target assembly component; wherein, the assembly chain is the existing assembly component in the home design scheme that has a connection relationship with the assembly component to be adsorbed; the connection relationship includes direct connection or indirect connection.

[0132] Among them, the structural diagram of the assembly chain is as shown in Figure 8 When the assembly component A, the assembly component B, the assembly component to be adsorbed, and the target assembly component are connected in sequence, the assembly component A, the assembly component B, the assembly component to be adsorbed, and the target assembly component construct a candidate assembly.

[0133] Among them, direct connection means that there are no other intermediate assembly components between two assembly components, and they are connected through a direct physical or logical link. As shown in Figure 8 In it, the assembly component A and the assembly component B are directly connected.

[0134] Indirect connection means that there is one or more other intermediate assembly components connecting two assembly components. As shown in Figure 8 In it, the assembly component A and the assembly component to be adsorbed are indirectly connected.

[0135] Step D2, based on the assembly rules associated with the target protocol, determine the update parameter list of the upstream assembly component and the downstream assembly component of the candidate assembly.

[0136] Among them, the upstream assembly component is the assembly component that is first modified, and the downstream assembly component is the assembly component that adapts to the modification as the upstream assembly component is modified.

[0137] Among them, the assembly rules are divided into two-way constraints and one-way constraints. The two-way constraints are used to automatically determine the upstream assembly component and the downstream assembly component from the candidate assembly. The one-way constraints are used to read the upstream assembly component and the downstream assembly component from the assembly rules.

[0138] In some embodiments, the determining the update parameter list of the upstream assembly component and the downstream assembly component of the assembly based on the assembly rules associated with the target protocol can be specifically implemented as: when the assembly rules are two-way constraints and the first parameter of any assembly component in the candidate assembly is modified, determine the any assembly component as the upstream assembly component, and the update parameter list of the upstream assembly component; among them, the upstream assembly component is the modified any assembly component, and the update parameter list of the upstream assembly component is the first parameter of the modified any assembly component; regard the other assembly components in the candidate assembly except the upstream assembly component as the downstream assembly components; the first parameter of the downstream assembly component is modified based on the upstream assembly component to obtain the update parameter list of the downstream assembly component.

[0139] When the assembly rule is a two-way constraint, modify any assembly component. That is, regard the modified assembly component as the upstream assembly component, and regard the other assembly components except the upstream assembly component as the downstream assembly components. And as the first parameter of the upstream assembly component is modified, modify the first parameter of the downstream assembly components to obtain the updated parameter list of the downstream components.

[0140] Wherein, the first parameter can be at least one of parameters such as material, size, etc. The specific first parameter can be set based on the actual situation, and the embodiments of the present disclosure do not limit this.

[0141] In the embodiments of the present disclosure, based on the two-way constraint, the upstream assembly component and the downstream assembly component can be automatically identified. In this case, as the first parameter of the upstream assembly component is modified, the first parameter of the downstream assembly component is modified, which can realize the automatic association and update of the parameters of the assembly components to ensure the consistency and integrity of the entire assembly.

[0142] In some embodiments, determining the updated parameter list of the upstream assembly component and the downstream assembly component of the candidate assembly based on the assembly rule associated with the target protocol can be specifically implemented as: when the assembly rule is a one-way constraint, modify the first parameter of the upstream assembly component to obtain the updated parameter list of the upstream assembly component; the assembly rule includes the upstream assembly component, the downstream assembly component, and the first parameter; determine the downstream assembly component from the assembly rule, and modify the first parameter of the downstream assembly component based on the upstream assembly component to obtain the updated parameter list of the downstream assembly component.

[0143] When the assembly rule is a one-way constraint, the assembly rule specifies which assembly component is the upstream assembly component and which assembly component is the downstream assembly component. In this case, when the first parameter of the upstream assembly component is modified, the first parameter of the downstream assembly component is modified accordingly.

[0144] In the embodiments of the present disclosure, based on the one-way constraint, the upstream assembly component and the downstream assembly component can be obtained from the assembly rule. In this case, as the first parameter of the upstream assembly component is modified, the first parameter of the downstream assembly component is modified, which can realize the automatic association and update of the parameters of the specified assembly components to ensure the consistency of the assembly and improve the assembly efficiency.

[0145] Step D3, based on the updated parameter lists of the upstream assembly component and the downstream assembly component, assemble the target assembly component and the to-be-adsorbed assembly component in the candidate assembly to obtain the target assembly.

[0146] Among them, the updated parameter list of the upstream assembly component is the parameter list after the modification of the upstream assembly component, and the downstream updated parameter list is the parameter list after the modification of the downstream assembly component.

[0147] During implementation, the target assembly component and / or the assembly component to be adsorbed can be the upstream assembly component or the downstream assembly component, which is specifically defined based on the assembly rules.

[0148] In the embodiments of the present disclosure, through the assembly chain of the assembly component to be adsorbed, the assembly components having a connection relationship with the assembly component to be adsorbed and the target assembly component are constructed into a complete candidate assembly body. Then, by assembling the target assembly component and the assembly component to be adsorbed based on the assembly rules, the downstream assembly components in the entire assembly process can be automatically modified following the upstream assembly components, improving the assembly efficiency.

[0149] In some embodiments, in order to ensure the accuracy of the connection between each assembly component, it can also be implemented as: in the home design scheme, obtain the first assembly component whose assembly structure information contains a strong connection protocol; detect the assembly state of the first assembly component; in the case where the assembly state of the first assembly component is not assembled with other assembly components, give a prompt based on the assembly state.

[0150] During implementation, in the home design scheme, when an important structural component has not been assembled with other parts, the system can detect it in time and give a prompt to avoid omissions or errors in the subsequent assembly process, resulting in quality problems or functional defects in the entire home assembly. Exemplarily, the first assembly component can be a desktop. In the case where the desktop is not connected to the table legs, it means that the assembly state of the first assembly component is not assembled with other assembly components, and then a prompt for this assembly state is required.

[0151] The specific prompt method can be high - light warning, red - mark warning, etc.

[0152] When it is found that the first assembly component is not assembled with other assembly components, giving a prompt based on the assembly state can enable designers or assemblers to take measures in time to ensure that the component can be correctly assembled with other components.

[0153] In the embodiments of the present disclosure, by obtaining the first assembly component containing a strong connection protocol and detecting its assembly state, it is possible to timely discover the first assembly component that has not been assembled with other assembly components, so as to ensure the rationality and integrity of the assembly relationship between each assembly component.

[0154] In some embodiments, for the integrity of the connection between the assembly components in the home design solution, it can also be implemented as follows: in response to a second operation of the target object, two second assembly components that meet the prompt conditions are detected in the home design solution as an assembly component pair; in the case where the assembly component pair is detected, the target object is prompted that the assembly component pair supports being assembled together but has not been assembled;

[0155] The prompt conditions include:

[0156] The distance between the two assembly components in the assembly component pair is less than a preset threshold;

[0157] Based on the assembly structures of the two assembly components and the target protocol, it is determined that the two assembly components support being assembled together.

[0158] In the home design solution, when the distance between the positions of two assembly components is less than a preset threshold and it is determined according to their assembly structures and the target protocol that they can be assembled together, the system will promptly prompt the target object that these two components can be assembled but have not been assembled. This helps the target object to promptly discover the opportunity to assemble and avoid missing possible assembly combinations.

[0159] In the embodiments of the present disclosure, based on this method, real-time assembly prompts can be provided for the target object, improving the experience of the target object. When performing home design, there is no need to manually check the assembly situation of each assembly component. The system will automatically detect and prompt the assembly component pairs that meet the conditions, saving the time and effort of later manual inspection.

[0160] Based on the same technical concept, an assembly device 900 for assembly components is also proposed in the embodiments of the present disclosure, as Figure 9 shown, including:

[0161] An acquisition module 901, configured to acquire the sending protocol of the assembly structure of the target assembly component to obtain the target protocol;

[0162] A first screening module 902, configured to screen out a first set of assembly components from the existing assembly components other than the target assembly component in the home design solution; the first set of assembly components includes at least one first assembly component; the receiving protocol of the assembly structure of the first assembly component is the target protocol;

[0163] A second screening module 903, configured to screen out the assembly components to be adsorbed and assembled in the first set of assembly components based on the position information and assembly structures of the first assembly components in the first set of assembly components;

[0164] An assembly module 904, configured to, when the to-be-adsorbed and assembled component is screened out, assemble the target assembly component and the to-be-adsorbed and assembled component based on an assembly rule to obtain a target assembly;

[0165] Wherein, the assembly rule is used to constrain the first parameters of the target assembly component and the to-be-adsorbed and assembled component to be consistent during the assembly process.

[0166] In some embodiments, the assembly structure includes at least one of an assembly point, an assembly line, and an assembly surface.

[0167] In some embodiments, the second screening module includes:

[0168] A screening unit, configured to, when the position information of any first assembly component in the first set of assembly components is within the preset range of the target assembly component, use the any first assembly component as a second assembly component and add it to the second set of assembly components;

[0169] A sorting unit, configured to, when there are multiple assembly structures among the second assembly components in the second set of assembly components, sort the second assembly components in the second set of assembly components based on the preset order of the assembly structures to obtain a sorting result;

[0170] A processing unit, configured to, when the second assembly component ranked first in the sorting result supports connection with the target assembly component, determine the second assembly component ranked first as the to-be-adsorbed and assembled component.

[0171] In some embodiments, it further includes a first processing module, configured to:

[0172] When it is determined that the assembly structure of the to-be-adsorbed and assembled component is not an assembly line, the assembly structure of the target assembly component is not an assembly line, and a target high-level script is screened out from at least one high-level script associated with the target protocol, execute the target high-level script to obtain an execution result of the target high-level script;

[0173] Based on the execution result of the target high-level script, the assembly module returns to execute the assembly of the target assembly component and the to-be-adsorbed and assembled component based on the assembly rule.

[0174] In some embodiments, it further includes a second processing module, configured to:

[0175] When it is determined that the assembly structure of the assembly component to be adsorbed is an assembly line, the assembly structure of the target assembly component is an assembly line, and the target protocol is associated with an adaptation rule, the size of the assembly line in the target assembly component is adjusted to the size of the assembly line in the assembly component to be adsorbed based on the adaptation rule;

[0176] When filtering out the target advanced script from at least one advanced script associated with the target protocol, execute the target advanced script to obtain the execution result of the target advanced script;

[0177] Based on the execution result of the target advanced script, the assembly module returns to execute the assembly of the target assembly component and the assembly component to be adsorbed based on the assembly body rule.

[0178] In some embodiments, any one of the first processing module and the second processing module is specifically configured to:

[0179] When the target advanced script is to add a supplement, execute the target advanced script to add a supplement between the target assembly component and the assembly component to be adsorbed.

[0180] In some embodiments, any one of the first processing module and the second processing module is specifically configured to:

[0181] When the target advanced script is to modify to the second parameter, execute the target advanced script to modify the parameters of the target assembly component and the assembly component to be adsorbed to the second parameter.

[0182] In some embodiments, the assembly module includes:

[0183] A construction unit, configured to construct a candidate assembly body based on the assembly chain of the assembly component to be adsorbed and the target assembly component; wherein, the assembly chain is an existing assembly component in the home design solution that has a connection relationship with the assembly component to be adsorbed; the connection relationship includes direct connection or indirect connection;

[0184] A determination unit, configured to determine an updated parameter list of the upstream assembly component and the downstream assembly component of the candidate assembly body based on the assembly body rule associated with the target protocol;

[0185] An assembly unit, configured to assemble the target assembly component and the assembly component to be adsorbed in the candidate assembly body based on the updated parameter list of the upstream assembly component and the downstream assembly component to obtain a target assembly body.

[0186] In some embodiments, the determination unit includes:

[0187] The first processing subunit is configured to, when the assembly rule is a two-way constraint and the first parameter of any assembly component in the candidate assembly is modified, determine the any assembly component as an upstream assembly component and the updated parameter list of the upstream assembly component; wherein, the upstream assembly component is the any assembly component after modification, and the updated parameter list of the upstream assembly component is the first parameter of the any assembly component after modification.

[0188] The second processing subunit is configured to regard all assembly components in the candidate assembly except the upstream assembly component as downstream assembly components.

[0189] The third processing subunit is configured to modify the first parameter of the downstream assembly component based on the upstream assembly component to obtain the updated parameter list of the downstream assembly component.

[0190] In some embodiments, the determination unit includes:

[0191] The fourth processing subunit is configured to, when the assembly rule is a one-way constraint, modify the first parameter of the upstream assembly component to obtain the updated parameter list of the upstream assembly component; the assembly rule includes the upstream assembly component, the downstream assembly component, and the first parameter.

[0192] The fifth processing subunit is configured to determine the downstream assembly component from the assembly rule and modify the first parameter of the downstream assembly component based on the upstream assembly component to obtain the updated parameter list of the downstream assembly component.

[0193] In some embodiments, it further includes a first detection module, configured to:

[0194] In the home design solution, obtain a first assembly component whose assembly structure information contains a strong connection protocol.

[0195] Detect the assembly state of the first assembly component.

[0196] When the assembly state of the first assembly component is not assembled with other assembly components, give a prompt based on the assembly state.

[0197] In some embodiments, it further includes a second detection module, configured to:

[0198] In response to a second operation of a target object, detect two second assembly components that meet the prompt conditions in the home design solution as an assembly component pair.

[0199] When the assembly component pair is detected, prompt the target object that the assembly component pair supports being assembled together but is not assembled.

[0200] The prompting conditions include:

[0201] The distance between the two assembly components in the assembly component pair is less than a preset threshold;

[0202] Based on the assembly structures of the two assembly components and the target protocol, it is determined that the two assembly components support being assembled together.

[0203] For the specific functions and examples of each module and sub-module of the device according to the embodiments of the present disclosure, reference may be made to the relevant descriptions of the corresponding steps in the above method embodiments, which will not be elaborated herein.

[0204] In the technical solution of the present disclosure, the acquisition, storage, application, etc. of the user's personal information involved all comply with the provisions of relevant laws and regulations and do not violate public order and good customs.

[0205] Figure 10 It is a structural block diagram of an electronic device according to an embodiment of the present disclosure. As Figure 10 shown, the electronic device includes: a memory 1010 and a processor 1020. The memory 1010 stores a computer program that can run on the processor 1020. The number of the memory 1010 and the processor 1020 can be one or more. The memory 1010 can store one or more computer programs. When the one or more computer programs are executed by the electronic device, the electronic device executes the method provided in the above method embodiments. The electronic device may further include: a communication interface 1030, configured to communicate with external devices and perform data interaction and transmission.

[0206] If the memory 1010, the processor 1020, and the communication interface 1030 are implemented independently, the memory 1010, the processor 1020, and the communication interface 1030 can be interconnected through a bus and complete communication with each other. The bus may be an Industry Standard Architecture (ISA) bus, a Peripheral Component Interconnect (PCI) bus, an Extended Industry Standard Architecture (EISA) bus, etc. The bus can be divided into an address bus, a data bus, a control bus, etc. For the sake of representation, Figure 10 only a thick line is used to represent it in the figure, but it does not mean that there is only one bus or one type of bus.

[0207] Optionally, in a specific implementation, if the memory 1010, the processor 1020, and the communication interface 1030 are integrated on a single chip, the memory 1010, the processor 1020, and the communication interface 1030 can communicate with each other through an internal interface.

[0208] It should be understood that the above-mentioned processor may be a central processing unit (CPU), or may also be other general-purpose processors, digital signal processors (DSPs), application specific integrated circuits (ASICs), field programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor may be a microprocessor or any conventional processor, etc. It is worth noting that the processor may be a processor that supports the advanced reduced instruction set machine (ARM) architecture.

[0209] Further, optionally, the above-mentioned memory may include a read-only memory and a random access memory, and may also include a non-volatile random access memory. The memory may be a volatile memory or a non-volatile memory, or may include both volatile and non-volatile memories. Among them, the non-volatile memory may include a read-only memory (ROM), a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), an electrically erasable programmable read-only memory (EEPROM), or a flash memory. The volatile memory may include a random access memory (RAM), which is used as an external cache. By way of example but not limitation, many forms of RAM are available. For example, static random access memory (SRAM), dynamic random access memory (DRAM), synchronous dynamic random access memory (SDRAM), double data rate synchronous dynamic random access memory (DDR SDRAM), enhanced synchronous dynamic random access memory (ESDRAM), synchlink dynamic random access memory (SLDRAM), and direct rambus random access memory (DR RAM).

[0210] In the above embodiments, it can be implemented in whole or in part by software, hardware, firmware, or any combination thereof. When implemented using software, it can be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions. When the computer instructions are loaded and executed on a computer, the processes or functions described in the embodiments of the present disclosure are generated in whole or in part. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable devices. The computer instructions can be stored in a computer-readable storage medium, or transmitted from one computer-readable storage medium to another computer-readable storage medium. For example, the computer instructions can be transmitted from one website, computer, server, or data center to another website, computer, server, or data center by wire (e.g., coaxial cable, optical fiber, Digital Subscriber Line (DSL)) or wirelessly (e.g., infrared, Bluetooth, microwave, etc.). The computer-readable storage medium can be any available medium that can be accessed by a computer, or a data storage device such as a server or data center that includes one or more integrated available media. The available medium can be a magnetic medium (e.g., floppy disk, hard disk, magnetic tape), an optical medium (e.g., Digital Versatile Disc (DVD)), or a semiconductor medium (e.g., Solid State Disk (SSD)), etc. It should be noted that the computer-readable storage medium mentioned in the present disclosure can be a non-volatile storage medium, in other words, a non-transitory storage medium.

[0211] Those of ordinary skill in the art can understand that all or part of the steps for implementing the above embodiments can be completed by hardware, or can be completed by a program instructing relevant hardware. The program can be stored in a computer-readable storage medium, and the storage medium mentioned above can be a read-only memory, a magnetic disk, an optical disc, or the like.

[0212] In the description of the embodiments of the present disclosure, the descriptions with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples", etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present disclosure. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples.

[0213] In the description of the embodiments of the present disclosure, unless otherwise specified, " / " means "or". For example, A / B may mean A or B. The "and / or" herein is merely a description of the relationship between associated objects, indicating that there can be three relationships. For example, A and / or B may mean: A exists alone, A and B exist simultaneously, and B exists alone.

[0214] In the description of the embodiments of the present disclosure, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the embodiments of the present disclosure, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0215] The foregoing are only exemplary embodiments of the present disclosure and are not intended to limit the present disclosure. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present disclosure shall be included within the protection scope of the present disclosure.

Claims

1. A method for assembling an assembly component, comprising: Acquire the sending protocol of the assembly structure of the target assembly component to obtain the target protocol; Filtering out a first assembly component set from existing assembly components of the home design solution except the target assembly component; The first assembly component set includes at least one first assembly component; the receiving protocol of the assembly structure of the first assembly component is the target protocol; Based on the position information and assembly structure of each first assembly component in the first assembly component set, screening the assembly components to be adsorbed in the first assembly component set; In the case where the assembly component to be adsorbed is screened, the target assembly component and the assembly component to be adsorbed are assembled based on assembly rules to obtain a target assembly; The assembly rule is used to constrain the target assembly component and the assembly component to be adsorbed to maintain consistency in the first parameter during the assembly process. 2 . The method according to claim 1 , wherein the assembly structure comprises at least one of an assembly point, an assembly line, and an assembly surface.

3. The method according to claim 2, wherein the screening of the assembly components to be adsorbed in the first assembly component set based on the position information and assembly structure of each first assembly component in the first assembly component set comprises: When the position information of any first assembly component in the first assembly component set is within the preset range of the target assembly component, adding the any first assembly component as a second assembly component to the second assembly component set; In the case where there are multiple assembly structures in each second assembly component in the second assembly component set, sorting the second assembly components in the second assembly component set based on a preset order of the assembly structures to obtain a sorting result; When the ranking result indicates that the second assembly component ranked first supports connection with the target assembly component, the second assembly component ranked first is determined as the assembly component to be adsorbed.

4. The method according to claim 1, further comprising: When it is determined that the assembly structure of the assembly component to be adsorbed is not an assembly line, the assembly structure of the target assembly component is not an assembly line, and a target advanced script is screened out from at least one advanced script associated with the target protocol, the target advanced script is executed to obtain an execution result of the target advanced script; Based on the execution result of the target advanced script, the execution is returned to assemble the target assembly component and the assembly component to be adsorbed based on the assembly rule.

5. The method according to claim 1, further comprising: When it is determined that the assembly structure of the assembly component to be adsorbed is an assembly line, the assembly structure of the target assembly component is an assembly line, and the target protocol is associated with an adaptation rule, the size of the assembly line in the target assembly component is adjusted to the size of the assembly line in the assembly component to be adsorbed based on the adaptation rule; In the case where a target advanced script is screened out from at least one advanced script associated with the target protocol, executing the target advanced script to obtain an execution result of the target advanced script; Based on the execution result of the target advanced script, the process returns to execute the assembly rule-based assembly of the target assembly component and the assembly component to be adsorbed.

6. The method according to claim 4 or 5, wherein, when a target high-level script is selected from at least one high-level script associated with the target protocol, executing the target high-level script to obtain an execution result of the target high-level script comprises: In the case where the target advanced script is to add an additional component, the target advanced script is executed to add the additional component between the target assembly component and the assembly component to be adsorbed.

7. The method according to claim 4 or 5, wherein: In the case where a target advanced script is screened out from at least one advanced script associated with the target protocol, executing the target advanced script to obtain an execution result of the target advanced script includes: In the case where the target advanced script is modified to the second parameter, the target advanced script is executed to modify the parameters of the target assembly component and the assembly component to be adsorbed to the second parameter.

8. The method according to claim 1, wherein: In the case where the assembly component to be adsorbed is screened, the target assembly component and the assembly component to be adsorbed are assembled based on assembly rules to obtain a target assembly, including: Based on the assembly chain of the assembly component to be adsorbed and the target assembly component, a candidate assembly is constructed; wherein the assembly chain is an existing assembly component in the home design scheme that has a connection relationship with the assembly component to be adsorbed; the connection relationship includes a direct connection or an indirect connection; Determining an update parameter list of an upstream assembly component and a downstream assembly component of the candidate assembly based on an assembly rule associated with the target protocol; Based on the updated parameter lists of the upstream assembly components and the downstream assembly components, the target assembly components and the assembly components to be adsorbed in the candidate assembly are assembled to obtain a target assembly.

9. The method according to claim 8, wherein: The step of determining the update parameter list of the upstream assembly component and the downstream assembly component of the assembly based on the assembly rule associated with the target protocol includes: When the assembly rule is a bidirectional constraint and the first parameter of any assembly component in the candidate assembly is modified, determining that the any assembly component is an upstream assembly component and an updated parameter list of the upstream assembly component; wherein the upstream assembly component is the modified any assembly component, and the updated parameter list of the upstream assembly component is the modified first parameter of the any assembly component; All assembly components in the candidate assembly except the upstream assembly component are taken as downstream assembly components; The first parameter of the downstream assembly component is modified based on the upstream assembly component to obtain an updated parameter list of the downstream assembly component.

10. The method according to claim 8, wherein: The step of determining the update parameter list of the upstream assembly component and the downstream assembly component of the candidate assembly based on the assembly rule associated with the target protocol includes: In the case where the assembly rule is a unidirectional constraint, the first parameter of the upstream assembly component is modified to obtain an updated parameter list of the upstream assembly component; the assembly rule includes the upstream assembly component, the downstream assembly component and the first parameter; A downstream assembly component is determined from the assembly rule, and a first parameter of the downstream assembly component is modified based on the upstream assembly component to obtain an updated parameter list of the downstream assembly component.

11. The method according to any one of claims 1 to 9, further comprising: In the home design solution, obtaining a first assembly component having a strong connection protocol in the assembly structure information; detecting an assembly state of the first assembly component; When the assembly state of the first assembly component is not assembled with other assembly components, a prompt is given based on the assembly state.

12. The method according to any one of claims 1 to 9, further comprising: In response to a second operation of the target object, detecting two second assembly components satisfying the prompt condition in the home design solution as an assembly component pair; In the case where the assembly component pair is detected, prompting the target object that the assembly component pair can be assembled together but is not assembled; The prompt conditions include: The distance between two assembly components in the assembly component pair is less than a preset threshold; Based on the assembly structures of the two assembly components and the target protocol, it is determined that the two assembly components can be assembled together.

13. An assembly device for assembling a component, comprising: An acquisition module is used to acquire the sending protocol of the assembly structure of the target assembly component to obtain the target protocol; A first screening module, configured to screen out a first set of assembly components from existing assembly components of the home design solution except the target assembly component; The first assembly component set includes at least one first assembly component; the receiving protocol of the assembly structure of the first assembly component is the target protocol; A second screening module, configured to screen the assembly components to be adsorbed in the first assembly component set based on the position information and assembly structure of each first assembly component in the first assembly component set; An assembly module, for assembling the target assembly component and the assembly component to be adsorbed based on assembly rules to obtain a target assembly when the assembly component to be adsorbed is screened; The assembly rule is used to constrain the target assembly component and the assembly component to be adsorbed to maintain consistency in the first parameter during the assembly process.

14. An electronic device comprising: at least one processor; as well as a memory communicatively connected to the at least one processor; wherein, The memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to perform the method according to any one of claims 1 to 12.

15. A non-transitory computer-readable storage medium storing computer instructions, wherein: The computer instructions are used to cause the computer to execute the method according to any one of claims 1-12.

16. A computer program product comprising a computer program, which, when executed by a processor, implements the method according to any one of claims 1 to 12.

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