Display device

Abstract

A display device according to an embodiment includes a substrate, a transistor disposed on the substrate, a light emitting device electrically connected to the transistor, a first layer on the light emitting device, and a color conversion layer including quantum dots in contact with the first layer. One surface of the first layer includes a first region exhibiting hydrophilicity and a second region exhibiting hydrophobicity.

Description

Technical Field

[0001] The present disclosure relates to a display device. Background Art

[0002] A light-emitting device is a device in which holes supplied from an anode and electrons supplied from a cathode combine in a light-emitting layer formed between the anode and the cathode to form excitons, and the excitons emit light while being stabilized.

[0003] The light-emitting device has various advantages such as a wide viewing angle, a fast response time, a thin thickness, and low power consumption, and thus is widely applied to various electrical and electronic devices such as televisions, monitors, and mobile phones.

[0004] In recent years, in order to realize a high-efficiency display device, a display device including a color conversion layer has been proposed. The color conversion layer can change the color of incident light into other colors. Summary of the Invention

[0005] An embodiment is for providing a display device in which the adhesion between a color conversion layer and a first layer on which the color conversion layer is formed is improved and the color conversion layer includes residue-free patterning.

[0006] A display device according to an embodiment includes: a substrate, a transistor disposed on the substrate, a light-emitting device electrically connected to the transistor, a first layer disposed on the light-emitting device, and a color conversion layer in contact with the first layer and including quantum dots, and one surface of the first layer includes a first region showing hydrophilicity and a second region showing hydrophobicity.

[0007] The first region may include an acrylate group.

[0008] The second region may include HexaMethylDiSilazane (HMDS).

[0009] The first region and the second region may be randomly arranged.

[0010] The area ratio of the first region and the second region may be 4:6 to 6:4.

[0011] The color conversion layer may be covalently bonded to the first region.

[0012] The color conversion layer may include an acrylate-based photocurable group.

[0013] The acrylate-based photocurable group may form a covalent bond with the first region.

[0014] The above-mentioned light-emitting device can emit blue light.

[0015] The above-mentioned color conversion layer may include: a first color conversion layer containing red quantum dots, and a second color conversion layer containing green quantum dots.

[0016] A display device according to an embodiment includes: a substrate, a transistor disposed on the substrate, a light-emitting device electrically connected to the transistor, a first layer located on the light-emitting device, and a color conversion layer in contact with the first layer, and an interface between the first layer and the color conversion layer includes a first region where the first layer and the color conversion layer form a covalent bond.

[0017] The interface between the first layer and the color conversion layer further includes: a second region where the first layer and the color conversion layer do not form a covalent bond, and the first region and the second region may be randomly arranged.

[0018] The above-mentioned first layer may be one of a glass substrate, an organic insulating layer, and an inorganic insulating layer.

[0019] The above-mentioned first region may be surface-treated with a first compound represented by the following Chemical Formula 1 to Chemical Formula 2.

[0020] [Chemical Formula 1]

[0021]

[0022] [Chemical Formula 2]

[0023]

[0024] In the above Chemical Formula 2, R is an alkyl group having 1 to 20 carbon atoms.

[0025] The above-mentioned second region may be surface-treated with a second compound represented by the following Chemical Formula 3.

[0026] [Chemical Formula 3]

[0027]

[0028] The area ratio of the above-mentioned first region and the second region may be 4:6 to 6:4.

[0029] The above-mentioned color conversion layer may contain an acrylate-based photocurable group.

[0030] The above-mentioned acrylate-based photocurable group may form a covalent bond with the above-mentioned first region.

[0031] The above-mentioned light-emitting device can emit blue light.

[0032] The above color conversion layer may include: a first color conversion layer containing red quantum dots and a second color conversion layer containing green quantum dots.

[0033] (Advantages of the Invention)

[0034] According to the embodiment, the adhesion between the color conversion layer and the first layer on which the color conversion layer is formed is improved, and a residue-free patterned color conversion layer can be provided, so that the reliability of the display device can be improved. Description of the Drawings

[0035] Figure 1 It is a diagram showing a first layer surface-treated according to an embodiment.

[0036] Figures 2 to 4 They are diagrams showing a first layer surface-treated according to the manufacturing process of an embodiment, respectively.

[0037] Figure 5 It is an exploded perspective view of a display device according to an embodiment.

[0038] Figure 6 It is a cross-sectional view of a display panel according to an embodiment.

[0039] Figure 7 It is a cross-sectional view of a display panel according to an embodiment.

[0040] Figure 8 It is an image showing the contact angle of a first layer surface-treated according to an embodiment.

[0041] Figure 9 and Figure 10 It is an image showing the contact angle of a first layer surface-treated according to a comparative example.

[0042] Figure 11 It is an image of patterning with a photosensitive resin composition on a first layer surface-treated according to an embodiment.

[0043] Figure 12 It is an image of patterning with a photosensitive resin composition on a first layer surface-treated according to a comparative example.

[0044] Figures 13 to 15 It is a table showing images according to embodiments and comparative examples.

[0045] Description of Reference Numerals

[0046] SUB1: Substrate

[0047] ED: Light-emitting device

[0048] L1: First layer

[0049] CCL1, CCL2: Color Conversion Layer

[0050] R1: First Region

[0051] R2: Second Region. Detailed Implementation Manner

[0052] Hereinafter, each embodiment of the present invention will be described in detail in a manner that can be easily implemented by those skilled in the technical field to which the present invention pertains with reference to the accompanying drawings. The present invention can be implemented in various different forms and is not limited to the embodiments described herein.

[0053] For clear description of the present invention, parts irrelevant to the description are omitted, and the same reference numerals are given to the same or similar components throughout the specification.

[0054] In addition, the sizes and thicknesses of the components shown in the figures are arbitrarily shown for convenience of description, and thus the present invention is not necessarily limited to the illustration. In order to clearly show each layer and region in the figures, the thicknesses are enlarged. In addition, for convenience of description in the figures, the thicknesses of some layers and regions are exaggeratedly shown.

[0055] In addition, when it is stated that a part of a layer, film, region, plate, etc. is "above" or "on" another part, it includes not only the case where it is "directly above" the other part, but also the case where there are other parts in between. On the contrary, when it is stated that a certain part is "directly above" another part, it means that there are no other parts in between. In addition, the so-called "above" or "on" the reference part means being above or on the reference part, and does not necessarily mean being "above" or "on" in the opposite direction of gravity.

[0056] In addition, throughout the specification, when it is stated that a certain part "includes" a certain component, unless there is a particularly contrary description, it means that other components can be further included, rather than excluding other components.

[0057] In addition, throughout the specification, when it is stated "on a plane", it refers to the case of looking at the object part from above, and when it is stated "in a cross-section", it refers to the case of looking at the cross-section obtained by vertically cutting the object part from the side.

[0058] Hereinafter, with reference to Figures 1 to 4 the interface between the first layer and the color conversion layer according to an embodiment is studied. Figure 1 is a diagram showing the first layer that has been surface-treated according to an embodiment, Figures 2 to 4 are respectively diagrams showing the first layer that has been surface-treated according to the manufacturing process of an embodiment.

[0059] With reference to Figure 1, a display device according to an embodiment may include a first layer L1. According to an embodiment, the first layer L1 may be any one of a glass substrate, an organic insulating layer, or an inorganic insulating layer. The first layer L1 according to an embodiment may be a layer on which a color conversion layer is formed as described below.

[0060] As Figure 1 shown, the first layer L1 may include a first region R1 and a second region R2. The first region R1 and the second region R2 may be randomly arranged. The ratio of the area occupied by the first region R1 to the area occupied by the second region R2 may be from 4:6 to 6:4.

[0061] The first region R1 may be a region surface-treated with a first compound A containing an acrylate group. Specifically, the first region R1 may be a region surface-treated with a first compound A represented by the following Chemical Formula 1 to Chemical Formula 2. The first region R1 may exhibit hydrophilicity through the first compound A represented by Chemical Formula 1 to Chemical Formula 2. Specifically, as Figure 2 shown, the first compound A represented by Chemical Formula 1 to Chemical Formula 2 may be in a state of being bonded to one surface of the first layer L1.

[0062] [Chemical Formula 1]

[0063]

[0064] [Chemical Formula 2]

[0065]

[0066] In the above Chemical Formula 2, R is an alkyl group having 1 to 20 carbon atoms.

[0067] The second region R2 may be a region surface-treated with a second compound B. The second region R2 may be a region surface-treated with a second compound B represented by the following Chemical Formula 3. Through the second compound B represented by Chemical Formula 3, the second region R2 may exhibit hydrophobicity.

[0068] [Chemical Formula 3]

[0069]

[0070] As Figure 1 shown, a color conversion layer according to an embodiment may be formed on the surface-treated first layer L1. The color conversion layer is formed of a photosensitive resin composition and may be formed through a photocuring process, an exposure process, and a development process.

[0071] The photosensitive resin composition PR for forming a color conversion layer according to an embodiment may include as Figure 3A photocurable group as shown below. The above photocurable group may be an acrylate-based photocurable group.

[0072] The acrylate-based photocurable group may combine with the first compound represented by Chemical Formula 1 to Chemical Formula 2 formed in the first region R1 during the exposure process as Figure 4 shown. Therefore, the color conversion layer CCL according to an embodiment may be in a state of covalently bonding with the first region R1 as Figure 4 shown. In the first region R1, the first layer L1 may form a covalent bond with the color conversion layer CCL.

[0073] On the contrary, the second region R2 shows hydrophobicity, and the color conversion layer located on the second region R2 does not make additional direct bonding with the second region R2. In the second region R2, the first layer L1 and the color conversion layer do not form a covalent bond.

[0074] Next, refer to Figures 5 to 7 to study the display device according to an embodiment. Figure 5 is an exploded perspective view of a display device according to an embodiment, Figure 6 is a cross-sectional view of a display panel according to an embodiment, Figure 7 is a cross-sectional view of a display panel according to an embodiment.

[0075] Refer to Figure 5 According to an embodiment, the display device 1000 may include a display panel DP and a housing HM.

[0076] One side of the display panel DP that displays an image is parallel to the plane defined by the first direction DR1 and the second direction DR2. The normal direction of the side that displays the image, that is, the thickness direction of the display panel DP, is indicated by the third direction DR3. The front (or upper surface) and the back (or lower surface) of each component are distinguished by the third direction DR3. However, the directions indicated by the first to third directions DR1, DR2, DR3 can be converted to other directions as a relative concept.

[0077] The display panel DP may be a flat rigid display panel, but it is not limited thereto, and it may also be a flexible display panel. On the other hand, the display panel DP may be formed of an organic light-emitting display panel. However, the type of the display panel DP is not limited thereto, and it may be composed of various types of panels. For example, the display panel DP may also be composed of a liquid crystal display panel, an electrophoretic display panel, an electro-wetting display panel, etc. In addition, the display panel DP may also be composed of a new generation display panel such as a micro light-emitting diode display panel, a quantum dot light-emitting diode display panel, a quantum dot organic light-emitting diode display panel, etc.

[0078] A micro light-emitting diode (Micro LED) display panel is formed by forming each pixel with light-emitting diodes sized from 10 to 100 micrometers. Such a micro light-emitting diode display panel has the advantages of using inorganic materials, being able to omit the backlight, having a fast response speed, being able to achieve high brightness with low power, and not breaking when bent, etc.

[0079] A quantum dot light-emitting diode display panel is configured by attaching a film containing quantum dots or forming it with a material containing quantum dots. Quantum dots refer to particles composed of inorganic materials such as indium and cadmium, which emit light by themselves and have a diameter formed to be less than a few nanometers. By adjusting the particle size of the quantum dots, light of the desired color can be displayed. A quantum dot organic light-emitting diode display panel uses a blue organic light-emitting diode as a light source and is configured by attaching a film containing red and green quantum dots thereon or vapor-depositing a material containing red and green quantum dots to achieve colors. The display panel DP according to an embodiment can also be composed of various other display panels.

[0080] As Figure 5 shown, the display panel DP includes a display area DA for displaying an image and a non-display area PA adjacent to the display area DA. The non-display area PA is an area that does not display an image. As an example, the display area DA can be quadrilateral, and the non-display area PA can have a shape surrounding the display area DA. However, it is not limited thereto, and the shapes of the display area DA and the non-display area PA can be designed relatively.

[0081] The housing HM provides a prescribed internal space. The display panel DP is installed inside the housing HM. Inside the housing HM, various electronic components, such as a power supply unit, a storage device, a sound input / output module, etc., can be installed in addition to the display panel DP.

[0082] Referring to Figure 6 In the substrate SUB corresponding to Figure 5 the display area DA, a plurality of pixels PA1, PA2, PA3 can be formed. Each of the pixels PA1, PA2, PA3 can include a plurality of transistors and light-emitting devices connected thereto.

[0083] The sealing layer ENC can be located on the plurality of pixels PA1, PA2, PA3. The display area DA can be protected by the sealing layer ENC from external air, moisture, etc. The sealing layer ENC can be integrally provided in a manner overlapping the entire surface of the display area DA, or can be partially disposed on the non-display area PA.

[0084] The first color conversion unit CC1, the second color conversion unit CC2, and the transmissive unit CC3 may be located on the sealing layer ENC. It may be that the first color conversion unit CC1 overlaps with the first pixel PA1, the second color conversion unit CC2 overlaps with the second pixel PA2, and the transmissive unit CC3 overlaps with the third pixel PA3.

[0085] The light emitted from the first pixel PA1 may pass through the first color conversion unit CC1 to provide red light LR. The light emitted from the second pixel PA2 may pass through the second color conversion unit CC2 to provide green light LG. The light emitted from the third pixel PA3 may pass through the transmissive unit CC3 to provide blue light LB.

[0086] Next, refer to Figure 7 to study the cross-sectional structure of the display area DA.

[0087] The display unit DC according to an embodiment includes a first substrate SUB1. The first substrate SUB1 may include a flexible material such as plastic that can be bent, folded, or curled well.

[0088] The buffer layer BF may be located on the first substrate SUB1. The buffer layer BF may include silicon nitride (SiN x ), silicon oxide (SiO2), or silicon oxynitride, etc. The buffer layer BF is located between the first substrate SUB1 and the semiconductor layer ACT. During the crystallization process for forming polysilicon, it can block impurities from the first substrate SUB1 to improve the characteristics of the polysilicon, and flatten the first substrate SUB1 to relieve the pressure on the semiconductor layer ACT formed above the buffer layer BF.

[0089] The semiconductor layer ACT is provided above the buffer layer BF. The semiconductor layer ACT may be composed of polysilicon or an oxide semiconductor. The semiconductor layer ACT includes a channel region C, a source region S, and a drain region D. The source region S and the drain region D are respectively disposed on both sides of the channel region C. The channel region C is an intrinsic semiconductor without doped impurities, and the source region S and the drain region D are impurity semiconductors doped with conductive impurities. The semiconductor layer ACT may also be composed of an oxide semiconductor. In this case, in order to protect the oxide semiconductor material that is vulnerable to external environments such as high temperature, an additional protective layer (not shown) may be added.

[0090] A gate insulating film GI is provided above the semiconductor layer ACT. The gate insulating film GI may be a single layer or a multilayer including at least one of silicon nitride (SiN x ), silicon oxide (SiO2), and silicon oxynitride.

[0091] Above the gate insulating film GI, a gate electrode GE is provided. The gate electrode GE can be a multilayer film formed by laminating metal film layers including any one of copper (Cu), copper alloy, aluminum (Al), aluminum alloy, molybdenum (Mo), and molybdenum alloy.

[0092] Above the gate electrode GE and the gate insulating film GI, an interlayer insulating film IL1 is provided. The interlayer insulating film IL1 can include silicon nitride (SiN x ), silicon oxide (SiO2), or silicon oxynitride, etc. Openings respectively exposing the source region S and the drain region D are located in the interlayer insulating film IL1.

[0093] A source electrode SE and a drain electrode DE are located above the interlayer insulating film IL1. The source electrode SE and the drain electrode DE are respectively connected to the source region S and the drain region D of the semiconductor layer ACT through the openings formed in the interlayer insulating film IL1.

[0094] Above the interlayer insulating film IL1, the source electrode SE, and the drain electrode DE, a protective film IL2 is provided. The protective film IL2 covers the interlayer insulating film IL1, the source electrode SE, and the drain electrode DE to planarize them, so that the first electrode E1 can be formed without steps above the protective film IL2. Such a protective film IL2 can be made of organic substances such as polyacrylates resin, polyimides resin, or a laminated film of organic substances and inorganic substances.

[0095] Above the protective film IL2, a first electrode E1 is provided. The first electrode E1 is connected to the drain electrode DE through the opening of the protective film IL2.

[0096] The driving transistor composed of the gate electrode GE, the semiconductor layer ACT, the source electrode SE, and the drain electrode DE is connected to the first electrode E1 to supply driving current to the light-emitting device ED. The display device according to this embodiment, in addition to Figure 7 the illustrated driving transistor, may further include a switching transistor (not shown) and a compensation transistor (not shown). The switching transistor is connected to the data line and transmits a data voltage in response to a scan signal. The compensation transistor is connected to the driving transistor and compensates the threshold voltage of the driving transistor in response to the scan signal.

[0097] Above the protective film IL2 and the first electrode E1, there is a pixel definition layer PDL. The pixel definition layer PDL may have pixel openings that overlap with the first electrode E1 and define the light-emitting regions. The pixel definition layer PDL may contain organic substances such as polyacrylates resin and polyimides resin, or inorganic substances such as silica series. The pixel openings may have a planar shape almost similar to that of the first electrode E1, and may have a planar rhombus or an octagon similar to a rhombus, but is not limited thereto, and may also have any shape such as a quadrilateral or a polygon.

[0098] Above the first electrode E1 that overlaps with the pixel openings, there is a light-emitting layer EML. The light-emitting layer EML may be composed of low-molecular organic substances or high-molecular organic substances such as PEDOT (poly(3,4-ethylenedioxythiophene)). In addition, the light-emitting layer EML may be a multilayer film further including one or more of a hole injection layer (HIL), a hole transporting layer (HTL), an electron transporting layer (ETL), and an electron injection layer (EIL).

[0099] Most of the light-emitting layer EML may be located within the pixel openings, or may be located on the side or above the pixel definition layer PDL.

[0100] Above the light-emitting layer EML, there is a second electrode E2. The second electrode E2 may be provided across a plurality of pixels and may obtain a common voltage through a common voltage transfer portion (not shown) in the non-display region.

[0101] The first electrode E1, the light-emitting layer EML, and the second electrode E2 may form a light-emitting device ED. The light-emitting device ED according to one embodiment may emit blue light, and according to another embodiment, may also emit light that is a mixture of blue light and green light.

[0102] Among them, the first electrode E1 may be a hole injection electrode, i.e., an anode, and the second electrode E2 may be an electron injection electrode, i.e., a cathode. However, the embodiment is not limited thereto, and according to the driving method of the organic light-emitting display device, the first electrode E1 may be a cathode and the second electrode E2 may be an anode.

[0103] Holes and electrons are respectively injected into the light-emitting layer EML from the first electrode E1 and the second electrode E2. When the excitons formed by the combined injected holes and electrons drop from the excited state to the ground state, light is emitted.

[0104] The encapsulation layer ENC is located above the second electrode E2. The encapsulation layer ENC not only covers the upper surface of the display layer including the light-emitting device ED, but also covers the side surfaces, thereby sealing the display layer.

[0105] The light-emitting device is very vulnerable to moisture and oxygen. Therefore, the encapsulation layer ENC seals the display layer to block the inflow of external moisture and oxygen. The encapsulation layer ENC can include a plurality of layers. Among them, it can be formed as a composite film including both an inorganic layer and an organic layer, and can be formed as a three-layer structure in which the first inorganic layer EIL1, the organic layer EOL, and the second inorganic layer EIL2 are formed in sequence.

[0106] A color conversion layer CC can be provided on the encapsulation layer ENC.

[0107] The color conversion part CC can include a partition wall BK1 located on the encapsulation layer ENC. The partition wall BK1 can include a first opening OP1, a second opening OP2, and a third opening OP3 that overlap with the pixel opening. The sizes of the first opening OP1, the second opening OP2, and the third opening OP3 can be the same or different from each other.

[0108] The first color conversion layer CCL1 can be located within the first opening OP1. The first color conversion layer CCL1 can convert the supplied light into red. The first color conversion layer CCL1 can contain red quantum dots. The second color conversion layer CCL2 can be located within the second opening OP2. The second color conversion layer CCL2 can convert the supplied light into green. The second color conversion layer CCL2 can contain green quantum dots.

[0109] The transmissive layer TL can overlap with the third opening OP3. Regarding the transmissive layer TL, the transmissive layer TL can be located in a portion corresponding to the blue light emitting region BLA in the space divided by the partition wall BK1.

[0110] The transmissive layer TL can contain a scatterer SC. The scatterer SC can be one or more selected from SiO2, BaSO4, Al2O3, ZnO, ZrO2, and TiO2. The transmissive layer TL can include a polymer resin and the scatterer contained in the polymer resin. As an example, the transmissive layer TL can include TiO2, but is not limited thereto. The transmissive layer TL can transmit the light incident from the light-emitting device ED.

[0111] In such a display panel according to the present embodiment, the first color conversion layer CCL1 converts incident light into red light and emits it. In addition, the second color conversion layer CCL2 converts incident light into green light and emits it. However, the light incident on the transmissive layer TL is transmitted without changing its color. The incident light may include blue light. The incident light may be single blue light, or a mixture of blue light and green light. Alternatively, it may also include blue light, green light, and red light at the same time.

[0112] The first color conversion layer CCL1 and the second color conversion layer CCL2 may be located on the encapsulation layer ENC. The first color conversion layer CCL1 and the second color conversion layer CCL2 may be in contact with the encapsulation layer ENC. In Figure 7 the embodiment of Figure 1 the first layer described in

[0113] may be the encapsulation layer ENC, and in particular, may be the second inorganic layer EIL2. Figures 1 to 4 Referring to the above Figures 1 to 4 , the interfaces between the first color conversion layer CCL1 and the encapsulation layer ENC, and between the second color conversion layer CCL2 and the encapsulation layer ENC may include a first region and a second region. The content of the first layer L1 described referring to the above Figures 1 to 4 may be applicable to the encapsulation layer ENC, and the bonding relationship between one surface of the encapsulation layer ENC and the first color conversion layer CCL1 may be applicable to the content described through the above

[0114] The interfaces between the first color conversion layer CCL1 and the encapsulation layer ENC, and between the second color conversion layer CCL2 and the encapsulation layer ENC may include a first region with hydrophilicity and a second region with hydrophobicity as described above. The first region and the second region may be randomly arranged. The ratio of the area occupied by the first region to the area occupied by the second region may be from 4:6 to 6:4, and as an example, may be 5:5.

[0115] The first region may be a region surface-treated with a first compound containing an acrylate group. Specifically, the first region may be a region surface-treated with a first compound represented by the following Chemical Formula 1 to Chemical Formula 2. The first region may exhibit hydrophilicity through the first compound represented by Chemical Formula 1 to Chemical Formula 2. Specifically, the first compound represented by Chemical Formula 1 to Chemical Formula 2 may be in a state of being bonded to one surface of the second inorganic layer EIL2.

[0116] [Chemical Formula 1]

[0117]

[0118] [Chemical Formula 2]

[0119]

[0120] In the above Chemical Formula 2, R is an alkyl group having 1 to 20 carbon atoms.

[0121] The second region may be a region surface-treated with a second compound. The second region may be a region surface-treated with a second compound represented by the following Chemical Formula 3. By the second compound represented by Chemical Formula 3, the second region can exhibit hydrophobicity.

[0122] [Chemical Formula 3]

[0123]

[0124] According to an embodiment, the first color conversion layer CCL1 and the second color conversion layer CCL2 may be formed on the surface-treated sealing layer ENC. The color conversion layers CCL1 and CCL2 may be formed of a photosensitive resin composition and may be formed through a photocuring process, an exposure process, and a development process.

[0125] The photosensitive resin composition for forming the color conversion layers CCL1 and CCL2 according to an embodiment may contain a photocurable group, and the photocurable group may be an acrylate-based photocurable group.

[0126] The acrylate-based photocurable group may bind to the first compounds represented by Chemical Formulas 1 to 2 formed in the first region during the exposure process. According to an embodiment, the first color conversion layer CCL1 and the second color conversion layer CCL2 may be in a state of covalently binding to a part of the sealing layer ENC, particularly the first region. In contrast, the second region exhibits hydrophobicity, and the color conversion layers CCL1 and CCL2 located on the second region do not directly bind to the second region R2 individually.

[0127] Then, the quantum dots respectively included in the first color conversion layer CCL1 and the second color conversion layer CCL2 will be described in detail below.

[0128] In the present specification, quantum dots (hereinafter also referred to as semiconductor nanocrystals) may include II-VI group compounds, III-V group compounds, IV-VI group compounds, group IV elements or compounds, I-III-VI group compounds, II-III-VI group compounds, I-II-IV-VI group compounds, or combinations thereof.

[0129] The above II-VI group compounds may be selected from the following compounds: binary compounds selected from CdSe, CdTe, ZnS, ZnSe, ZnTe, ZnO, HgS, HgSe, HgTe, MgSe, MgS, and mixtures thereof; ternary compounds selected from AgInS, CuInS, CdSeS, CdSeTe, CdSTe, ZnSeS, ZnSeTe, ZnSTe, HgSeS, HgSeTe, HgSTe, CdZnS, CdZnSe, CdZnTe, CdHgS, CdHgSe, CdHgTe, HgZnS, HgZnSe, HgZnTe, MgZnSe, MgZnS, and mixtures thereof; and quaternary compounds selected from HgZnTeS, CdZnSeS, CdZnSeTe, CdZnSTe, CdHgSeS, CdHgSeTe, CdHgSTe, HgZnSeS, HgZnSeTe, HgZnSTe, and mixtures thereof. The above II-VI group compounds may further contain group III metals.

[0130] The above III-V group compounds may be selected from the following compounds: binary compounds selected from GaN, GaP, GaAs, GaSb, AlN, AlP, AlAs, AlSb, InN, InP, InAs, InSb, and mixtures thereof; ternary compounds selected from GaNP, GaNAs, GaNSb, GaPAs, GaPSb, AlNP, AlNAs, AlNSb, AlPAs, AlPSb, InGaP, InNP, InNAs, InNSb, InPAs, InZnP, InPSb, and mixtures thereof; and quaternary compounds selected from GaAlNP, GaAlNAs, GaAlNSb, GaAlPAs, GaAlPSb, GaInNP, GaInNAs, GaInNSb, GaInPAs, GaInPSb, InAlNP, InAlNAs, InAlNSb, InAlPAs, InAlPSb, InZnP, and mixtures thereof. The above III-V group compounds may further contain group II metals (e.g., InZnP).

[0131] The above Group IV-VI compounds may be selected from the following compounds: binary compounds selected from SnS, SnSe, SnTe, PbS, PbSe, PbTe, and mixtures thereof; ternary compounds selected from SnSeS, SnSeTe, SnSTe, PbSeS, PbSeTe, PbSTe, SnPbS, SnPbSe, SnPbTe, and mixtures thereof; and quaternary compounds selected from SnPbSSe, SnPbSeTe, SnPbSTe, and mixtures thereof.

[0132] The above Group IV element or compound may be selected from the following compounds: single-element compounds selected from Si, Ge, and combinations thereof; and binary compounds selected from SiC, SiGe, and combinations thereof, but is not limited thereto.

[0133] Examples of the above Group I-III-VI compounds include CuInSe2, CuInS2, CuInGaSe, and CuInGaS, but are not limited thereto. Examples of the above Group I-II-IV-VI compounds include CuZnSnSe and CuZnSnS, but are not limited thereto. The above Group IV element or compound may be selected from the following compounds: single elements selected from Si, Ge, and mixtures thereof; and binary compounds selected from SiC, SiGe, and mixtures thereof.

[0134] The above Group II-III-VI compounds may be selected from ZnGaS, ZnAlS, ZnInS, ZnGaSe, ZnAlSe, ZnInSe, ZnGaTe, ZnAlTe, ZnInTe, ZnGaO, ZnAlO, ZnInO, HgGaS, HgAlS, HgInS, HgGaSe, HgAlSe, HgInSe, HgGaTe, HgAlTe, HgInTe, MgGaS, MgAlS, MgInS, MgGaSe, MgAlSe, MgInSe, and combinations thereof, but are not limited thereto.

[0135] The above Group I-II-IV-VI compounds may be selected from CuZnSnSe and CuZnSnS, but are not limited thereto.

[0136] In a specific example, the quantum dots may not contain cadmium. The quantum dots may include semiconductor nanocrystals based on Group III-V compounds containing indium and phosphorus. The above Group III-V compounds may further contain zinc. The quantum dots may include semiconductor nanocrystals based on Group II-VI compounds containing chalcogen elements (e.g., sulfur, selenium, tellurium, or combinations thereof) and zinc.

[0137] In a quantum dot, the above-described binary compound, ternary compound, and / or quaternary compound may be present in the particle at a uniform concentration, or may be present in the same particle with a concentration distribution partially in different states. In addition, a core / shell structure in which one quantum dot surrounds other quantum dots may also be provided. The interface between the core and the shell may have a concentration gradient in which the concentration of the elements present in the shell decreases as it approaches the center.

[0138] In some embodiments, the quantum dot may have a core-shell structure including a core containing the above-described nanocrystal and a shell surrounding the core. The shell of the above-described quantum dot may function as a protective layer for preventing chemical denaturation of the core and maintaining semiconductor properties and / or as a charging layer for imparting electrophoretic properties to the quantum dot. The shell may be a single layer or multiple layers. The interface between the core and the shell may have a concentration gradient in which the concentration of the elements present in the shell decreases as it approaches the center. Examples of the shell of the above-described quantum dot include metal or non-metal oxides, semiconductor compounds, or combinations thereof.

[0139] For example, the above metal or non-metal oxides may include binary compounds such as SiO2, Al2O3, TiO2, ZnO, MnO, Mn2O3, Mn3O4, CuO, FeO, Fe2O3, Fe3O4, CoO, Co3O4, NiO; or ternary compounds such as MgAl2O4, CoFe2O4, NiFe2O4, CoMn2O4, but the present invention is not limited thereto.

[0140] In addition, examples of the above semiconductor compounds include CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, ZnSeS, ZnTeS, GaAs, GaP, GaSb, HgS, HgSe, HgTe, InAs, InP, InGaP, InSb, AlAs, AlP, AlSb, etc., but the present invention is not limited thereto.

[0141] The interface between the core and the shell may have a concentration gradient in which the concentration of the elements present in the shell decreases as it approaches the center. In addition, the above semiconductor nanocrystal may also have a structure including a semiconductor nanocrystal core and multiple shells surrounding it. In a specific example, the above multiple shells may have two or more layers, for example, two, three, four, five, or more layers. The two adjacent layers of the shell may have a single composition or different compositions. Each layer in the multiple shells may have a structure that varies according to the radius.

[0142] The quantum dots may have a full width at half maximum (FWHM) of the emission wavelength spectrum of about 45 nm or less, preferably about 40 nm or less, and more preferably about 30 nm or less. Within this range, color purity and color reproducibility can be improved. In addition, the light emitted by such quantum dots is emitted in all directions, so the viewing angle of the light can be increased.

[0143] The materials of the shell and the core of the above-mentioned quantum dots may have different band gaps from each other. For example, the band gap of the shell material may be larger compared to the core material. In another specific example, the band gap of the shell material may be smaller compared to the core material. The above-mentioned quantum dots may have multiple layers of shells. In the multiple layers of shells, the band gap of the outer layer may be larger compared to the band gap of the inner layer (i.e., the layer closer to the core). In the multiple layers of shells, the band gap of the outer layer may be smaller compared to the band gap of the inner layer.

[0144] The absorption / emission wavelength of the quantum dots can be adjusted by adjusting the composition and size. The maximum emission peak wavelength of the quantum dots may have a wavelength range from ultraviolet to infrared or longer wavelengths.

[0145] The quantum dots may have a quantum efficiency of about 10% or more, for example, about 30% or more, about 50% or more, about 60% or more, about 70% or more, about 90% or more, or even 100%. The quantum dots may have a relatively narrow spectrum. The quantum dots may have a full width at half maximum of the emission wavelength spectrum of, for example, about 50 nm or less, for example, about 45 nm or less, about 40 nm or less, or about 30 nm or less.

[0146] The above-mentioned quantum dots may have a particle size of about 1 nm or more and about 100 nm or less. The size of the particle refers to the diameter of the particle or the diameter converted by assuming a spherical shape based on a two-dimensional image obtained by transmission electron microscope analysis. The above-mentioned quantum dots may have a size of about 1 nm to about 20 nm, for example, 2 nm or more, 3 nm or more, or 4 nm or more and 50 nm or less, 40 nm or less, 30 nm or less, 20 nm or less, 15 nm or less, for example, 10 nm or less. The shape of the quantum dots is not particularly limited. For example, the shape of the above-mentioned quantum dots may include spherical, polyhedral, pyramidal, multi-pod, square, rectangular, nanotube, nanorod, nanowire, nanosheet, or a combination thereof, but is not limited thereto.

[0147] The quantum dots can be commercially available or synthesized appropriately. When synthesizing the quantum dots into a colloid, the particle size can be adjusted relatively freely, and the particle size can also be adjusted uniformly.

[0148] The quantum dots may include organic ligands (e.g., having hydrophobic residues and / or hydrophilic residues). The above-mentioned organic ligand residues may be bound to the surface of the above-mentioned quantum dots. The above-mentioned organic ligands include RCOOH, RNH2, R2NH, R3N, RSH, R3PO, R3P, ROH, RCOOR, RPO(OH)2, RHPOOH, R2POOH, or a combination thereof, where each R may independently be a C3 to C40 (e.g., above C5 and below C24) substituted or unsubstituted alkyl group, a C3 to C40 substituted or unsubstituted aliphatic hydrocarbon group such as a substituted or unsubstituted alkenyl group, a C6 to C40 substituted or unsubstituted aromatic hydrocarbon group such as a substituted or unsubstituted aryl group of C6 to C40 (e.g., above C6 and below C20), or a combination thereof.

[0149] Examples of the above-mentioned organic ligands may include thiol compounds such as methanethiol, ethanethiol, propanethiol, butanethiol, pentanethiol, hexanethiol, octanethiol, dodecanethiol, hexadecanethiol, octadecanethiol, benzyl mercaptan; amines such as methylamine, ethylamine, propylamine, butylamine, pentylamine, hexylamine, octylamine, nonylamine, decylamine, dodecylamine, hexadecylamine, octadecylamine, dimethylamine, diethylamine, dipropylamine, tributylamine, trioctylamine; carboxylic acid compounds such as formic acid, acetic acid, propionic acid, butyric acid, valeric acid, hexanoic acid, heptanoic acid, octanoic acid, dodecanoic acid, hexadecanoic acid, octadecanoic acid, oleic acid, benzoic acid; phosphine compounds such as methylphosphine, ethylphosphine, propylphosphine, butylphosphine, pentylphosphine, octylphosphine, dioctylphosphine, tributylphosphine, trioctylphosphine; phosphine compounds or their oxides such as methylphosphine oxide, ethylphosphine oxide, propylphosphine oxide, butylphosphine oxide, pentylphosphine oxide, tributylphosphine oxide, octylphosphine oxide, dioctylphosphine oxide, trioctylphosphine oxide; diphenylphosphine, triphenylphosphine compounds or their oxides; C5 to C20 alkylphosphonic acids such as hexylphosphonic acid, octylphosphonic acid, dodecylphosphonic acid, tetradecylphosphonic acid, hexadecylphosphonic acid, octadecylphosphonic acid, C5 to C20 alkylphosphonic acids, etc., but are not limited thereto. The quantum dots may contain a single hydrophobic organic ligand or a mixture of one or more thereof. The above-mentioned hydrophobic organic ligands may not contain (e.g., acrylate groups, methacrylate groups, etc.) photopolymerizable residues.

[0150] The first insulating layer IL3 may be located on the partition wall BK1, the first color conversion layer CCL1, the second color conversion layer CCL2, and the transmissive layer TL. The first insulating layer IL3 may have a form covering the partition wall BK1, the first color conversion layer CCL1, the second color conversion layer CCL2, and the transmissive layer TL. The first insulating layer IL3 may include at least one of silicon nitride, silicon oxide, and silicon oxynitride. According to one embodiment, the first insulating layer IL3 may be omitted.

[0151] The filling layer FL may be located on the first insulating layer IL3. The filling layer FL may combine the components located on the first substrate SUB1 and the components located on the second substrate SUB2. A display panel may be formed through the filling layer FL.

[0152] A second insulating layer IL4 may be provided on the filling layer FL. As an example, the second insulating layer IL4 may include silicon nitride (SiN x ), silicon oxide (SiO2), silicon oxynitride, etc. According to an embodiment, the second insulating layer IL4 may be omitted.

[0153] A third insulating layer IL5 may be provided on the second insulating layer IL4. As an example, the third insulating layer IL5 may include an organic substance or an inorganic substance such as silicon nitride (SiN x ), silicon oxide (SiO2), or silicon oxynitride.

[0154] The color conversion unit CC includes a first color filter CF1, a second color filter CF2, and a third color filter CF3 located between the second substrate SUB2 and the display unit DC.

[0155] The first color filter CF1 may overlap with the transmissive layer TL. The first color filter CF1 transmits blue light passing through the transmissive layer TL, and light of other wavelengths may be absorbed, thereby improving the purity of the blue light emitted to the outside of the display device. The second color filter CF2 may overlap with the first color conversion layer CCL1. The second color filter CF2 transmits red light passing through the first color conversion layer CCL1, and light of other wavelengths may be absorbed, thereby improving the purity of the red light emitted to the outside of the display device. The third color filter CF3 may overlap with the second color conversion layer CCL2. The third color filter CF3 transmits green light passing through the second color conversion layer CCL2, and light of other wavelengths may be absorbed, thereby improving the purity of the green light emitted to the outside of the display device.

[0156] At least two or more of the third color filter CF3, the second color filter CF2, and the first color filter CF1 overlap in the non-light-emitting region NLA1 to function as a light-shielding member. The non-light-emitting region NLA1 may overlap with the pixel defining film PDL of the display unit DC and the partition wall BK1 of the color conversion unit CC.

[0157] According to an embodiment, the color conversion layers CCL1 and CCL2 are formed in a stable pattern on the sealing layer ENC and adhered with appropriate adhesion, so the reliability of the display device can be improved. On the other hand, although the embodiments in which the color conversion layer is in contact with the sealing layer are described in this specification, it is not limited thereto. The color conversion layer may be formed on a glass substrate or on an organic insulating layer, and the embodiments applying the above content are of course also possible.

[0158] Next, refer to Figures 8 to 15 to study the examples and comparative examples. Figure 8 is an image showing the contact angle of the first layer that has been surface-treated according to an embodiment, Figure 9 and Figure 10 is an image showing the contact angle of the first layer that has been surface-treated according to the comparative example, Figure 11 is an image of patterning with a photosensitive resin composition on the surface-treated first layer according to the embodiment, Figure 12 is an image of patterning with a photosensitive resin composition on the surface-treated first layer according to the comparative example, Figures 13 to 15 is a table showing the images according to the embodiment and the comparative example.

[0159] First, Figure 8 is an image showing the contact angle when the surface of the first layer according to an embodiment of the present invention has both hydrophobicity and hydrophilicity. After treating the surface of the first layer with a solution in which a first compound providing hydrophilicity and a second compound providing hydrophobicity are mixed in a ratio of 5:5, the contact angle was confirmed and shown to be approximately 26.9 degrees.

[0160] In contrast, as Figure 9 shows, when the surface of the first layer is treated with the first compound to have only hydrophilicity, a contact angle of approximately 6.1 degrees is shown. As Figure 10 shows, when the surface of the first layer is treated with the second compound to have only hydrophobicity, a contact angle of approximately 52.1 degrees is shown.

[0161] In addition, as a result of the patterning process of the same first layer using a photosensitive resin composition as Figure 11 shows, it was confirmed that a clear patterning process was performed without residue or tearing. This is because when patterning is performed on the first layer that provides both hydrophilicity and hydrophobicity using a photosensitive resin composition containing a photocurable group, the photocurable group forms a covalent bond with the hydrophilic region, thereby improving the adhesion of the exposed area.

[0162] In contrast, as Figure 12 shows, when the surface of the first layer is surface-treated to have only hydrophilicity, it was confirmed that tearing of the photosensitive resin composition occurred during the development process and patterning could not be performed.

[0163] Next, refer to Figure 13 to study the contact angle when the mixing ratio of the first compound providing hydrophilicity to the surface of the first layer and the second compound providing hydrophobicity to the surface of the first layer is changed from 10:0 to 0:10, and a process evaluation was performed.

[0164] As the mixing ratio of the second compound increases, the hydrophobicity of the first layer surface increases, and thus it is confirmed that the contact angle increases. In addition, it is confirmed that as the mixing ratio of the first compound increases, the photosensitive resin composition formed on the first layer cannot be patterned. It is confirmed that this is due to the repulsion force between the first layer and the photosensitive resin composition, resulting in warping.

[0165] However, when the mixing ratio of the first compound to the second compound is greater than 7:3 and less than 3:7, it is confirmed that the film of the photosensitive resin composition does not warp and is patterned at an appropriate level.

[0166] In addition, referring to Figure 14 , Comparative Example 1 is an image of a photosensitive resin composition coated on the first layer without additional surface treatment and subjected to a patterning process. It is confirmed that when no additional surface treatment is performed, as the patterning process progresses, the patterned color conversion layer warps. Comparative Example 2 is a case where the surface of the first layer is hydrophilized only with the first compound. At this time, it is confirmed that the patterning process cannot be performed and overall tearing occurs. In addition, Comparative Example 3 is a case where the surface of the first layer is hydrophobized only with the second compound. It is confirmed that a considerable amount of residue remains in other areas after the patterning process is completed. On the contrary, it is confirmed that in the example where the first compound and the second compound are mixed at a ratio of 5:5 and the surface of the first layer is treated, not only the patterning process is performed without residue, but also the adhesion is excellent.

[0167] Referring to Figure 15 , except for the case of surface treatment with the first compound, the surface of the first layer was also treated with other siloxane-based compounds, and the adhesion of the photosensitive resin composition was evaluated. According to Figure 15 , it is confirmed that when the surface of the first layer is treated with other siloxane-based compounds, the adhesion is not improved at all. That is, it is confirmed that only when the surface is treated with the first compound, the adhesion between the first layer and the exposed photosensitive resin composition is improved. Alkoxy groups, carboxyl groups, amine groups, etc. do not form additional bonds with the photosensitive resin composition. On the contrary, the adhesion is improved by the covalent bond between the first layer treated with the first compound and the exposed photosensitive resin composition.

[0168] Although the embodiments of the present invention have been described in detail above, the scope of the rights of the present invention is not limited thereto. Various modifications and improvements by those skilled in the art who utilize the basic concepts of the present invention defined in the claims of the present invention also fall within the scope of protection claimed by the present invention.

Claims

1. A display device, comprising: substrate, a transistor disposed on the substrate, a light emitting device electrically connected to the transistor, a first layer located on the light emitting device, and a color conversion layer connected to the first layer and comprising quantum dots, One surface of the first layer comprises: a first region exhibiting hydrophilicity, and A second region showing hydrophobicity.

2. The display device according to claim 1, wherein: The first region comprises acrylate groups.

3. The display device according to claim 1, wherein: The second region contains hexamethyldisilazane (HMDS).

4. The display device according to claim 1, wherein: The first area and the second area are randomly arranged.

5. The display device according to claim 1, wherein: An area ratio of the first region to the second region is 4:6 to 6:

4.

6. The display device according to claim 1, wherein: The color conversion layer is covalently bonded to the first region.

7. The display device according to claim 6, wherein: The color conversion layer contains acrylate photocurable groups.

8. The display device according to claim 7, wherein: The acrylate photocurable group forms a covalent bond with the first region.

9. The display device according to claim 1, wherein: The light emitting device emits blue light.

10. The display device according to claim 1, wherein: The color conversion layer comprises: a first color conversion layer comprising red quantum dots, and A second color conversion layer containing green quantum dots.

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