Mini-LED display screen module, preparation method thereof and Mini-LED display screen

Abstract

The invention relates to the technical field of LED display screen manufacturing, in particular to a Mini-LED display screen module, a preparation method of the Mini-LED display screen module and a Mini-LED display screen. The preparation method comprises the following steps: providing a PCB; printing first solder paste on the display surface to form a plurality of first solder paste points; fixing the Mini-LED chip on the display surface to obtain a first intermediate product; first reflow soldering is carried out, the first solder paste point is solidified, and a second intermediate product is obtained; coating a packaging adhesive, and curing to obtain a packaging adhesive layer, so as to obtain a third intermediate product; printing second solder paste to form a plurality of second solder paste points; mounting the electric connection assembly on the display surface to obtain a fourth intermediate product; second reflow soldering is carried out, the second solder paste point is solidified, and the Mini-LED display screen is obtained; wherein the melting point of the first solder paste is larger than that of the second solder paste; the glass transition temperature of the packaging adhesive layer minus the melting point of the second solder paste is greater than or equal to 20 DEG C. By implementing the invention, the first pass yield of products can be improved, and the production cost is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of LED display manufacturing, and in particular to a Mini-LED display module, a preparation method thereof, and a Mini-LED display. Background Art

[0002] Currently, LED displays generally include LED display modules, box structures, hardware fittings, signal receiving devices, etc. Among them, the LED display module is the most core component, which is mainly composed of a PCB board, LEDs, IC devices, etc. LED chips are generally soldered to the PCB board through solder paste. As the requirement for display accuracy becomes higher and higher, the size of LED chips becomes smaller and smaller. Currently, the size of Mini-LEDs used in Mini-LED displays is generally about 50-200 μm, which means that a large number of Mini-LED chips are required for Mini-LED-based displays, usually tens of thousands. When fixing Mini-LED chips, a large amount of solder paste needs to be printed, that is, the number of pads on the PCB board is also large and the size is small. The display requires a large number of solder paste dots and the pad size is small, which leads to high requirements for the adhesion of pads. However, in the traditional method for preparing LED displays, the electrical connection components are first mounted and reflow soldered, which results in that, on the one hand, the pads on the display surface of the PCB board will be micro-oxidized, reducing the adhesion performance of the pads and significantly reducing the first-pass yield; on the other hand, the PCB board will be slightly warped, resulting in easy misalignment when printing solder paste dots and reducing the first-pass yield. The conventional solution is to put the product into a nitrogen cabinet after mounting the electrical connection components and perform reflow soldering in a nitrogen atmosphere. The nitrogen consumption is large and the cost is high. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide a Mini-LED display module and a preparation method thereof, which can improve the first-pass yield of products and reduce the manufacturing cost.

[0004] Another technical problem to be solved by the present invention is to provide a Mini-LED display.

[0005] To solve the above technical problems, the present invention provides a preparation method for a Mini-LED display module, which includes the following steps:

[0006] (1) Provide a PCB board, the PCB board having opposite driving and display surfaces; a plurality of first pads are provided on the display surface;

[0007] (2) Print first solder paste on the display surface to form a plurality of first solder paste dots; the first solder paste dots are formed on the first pads;

[0008] (3) Fix the Mini-LED chip to the display surface to obtain a first intermediate product; wherein, the electrode of the Mini-LED chip is connected to the first solder paste dot;

[0009] (4) Perform first reflow soldering on the first intermediate product to cure the first solder paste dot and obtain a second intermediate product;

[0010] (5) Coat encapsulation glue on one side of the display surface of the second intermediate product and cure it to obtain an encapsulation glue layer, thus obtaining a third intermediate product;

[0011] (6) Print second solder paste on one side of the driving surface of the third intermediate product to form a plurality of second solder paste dots;

[0012] (7) Mount the electrical connection component on the display surface to obtain a fourth intermediate product; wherein, the electrical connection component is connected to the second solder paste dot;

[0013] (8) Perform second reflow soldering on the fourth intermediate product to cure the second solder paste dot and obtain a Mini-LED display screen;

[0014] Among them, the melting point of the first solder paste > the melting point of the second solder paste;

[0015] The glass transition temperature of the encapsulation glue layer - the melting point of the second solder paste ≥ 20°C.

[0016] As an improvement to the above technical solution, the melting point of the first solder paste - the melting point of the second solder paste = 20 - 30°C.

[0017] As an improvement to the above technical solution, the Shore hardness of the encapsulation glue layer ≥ 50HD.

[0018] As an improvement to the above technical solution, the Shore hardness of the encapsulation glue layer is 55 - 64HD.

[0019] As an improvement to the above technical solution, in steps (1) to (5), the number of particles in the working environment is 1000 - 3500 pieces / m 3 , the particle size of the particles ≤ 0.5μm, the environmental temperature is 18 - 20°C, and the humidity is 40 - 60%;

[0020] In steps (6) to (8), the number of particles in the working environment is 10000 - 35000 pieces / m 3 , the particle size of the particles ≤ 0.5μm, the environmental temperature is 18 - 20°C, and the humidity is 40 - 60%.

[0021] As an improvement to the above technical solution, the size of the first pad ≤ 100μm.

[0022] As an improvement of the above technical solution, in step (6), the encapsulation glue is cured by baking to form an encapsulation glue layer, the baking temperature is 120-180 °C, and the baking duration is 1-2 h.

[0023] As an improvement of the above technical solution, the electrical connection component includes a resistor, a capacitor, a power supply socket, and a connection terminal.

[0024] Correspondingly, the present invention also discloses a Mini-LED display screen module, which is prepared by the preparation method of the above Mini-LED display screen module.

[0025] Correspondingly, the present invention also discloses a Mini-LED display screen, which includes the above Mini-LED display screen module.

[0026] Implementing the present invention has the following beneficial effects:

[0027] In the preparation method of the Mini-LED display screen module in an embodiment of the present invention, firstly, the Mini-LED chips are fixed on the display surface of the PCB board, and then the electrical connection components are mounted on the driving surface. Based on this process, a large number of micro pads on the display surface of the PCB board can be prevented from being oxidized, the bonding strength between the first solder paste dots and the first pads is improved, the stability and reliability of the display screen are ensured, and there is no need to use a large number of nitrogen-containing storage cabinets for storing intermediates, which greatly reduces the manufacturing cost. Secondly, by controlling the melting point of the first solder paste to be higher than that of the second solder paste, the first solder paste can be prevented from remelting during the second reflow soldering process, ensuring the accuracy of soldering and the quality of the finished product, and improving the through rate. Thirdly, by encapsulating and baking and curing the fixed Mini-LED chips, a dense protective layer can be formed on the surface of the Mini-LED chips, and then when the electrical connection components are mounted subsequently, dust, particles, etc. can be prevented from falling on the surface of the Mini-LED chips and affecting their performance, improving the through rate of the product. Fourthly, by controlling the difference between the melting point of the second solder paste and the glass transition temperature of the first encapsulation glue, the stability of the encapsulation glue layer during the second reflow soldering process is ensured, and it is prevented from being damaged by the high temperature of the reflow soldering. Therefore, the preparation method of the Mini-LED display screen module of the present invention not only effectively reduces the production cost, but also significantly improves the through rate of the product. Specifically, the through rate of the traditional Mini-LED display screen is generally below 95%, while the through rate in the present invention can reach more than 97.5%. Description of the Drawings

[0028] Figure 1 is a flowchart of the preparation method of the Mini-LED display screen module in an embodiment of the present invention. Detailed Embodiments

[0029] To make the objectives, technical solutions and advantages of this application clearer and more understandable, the following further elaborates on this application in conjunction with the attached drawings and embodiments. The examples of the embodiments are shown in the attached drawings, where the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below by referring to the attached drawings are exemplary and are only used to explain this application, and should not be construed as a limitation of this application. In addition, it should be understood that the specific embodiments described herein are only used to explain this application and are not used to limit this application.

[0030] In the description of this application, it should be understood that the orientation or positional relationships indicated by terms such as "length", "width", "upper", "lower", "left", "right", "horizontal", "top", "bottom", etc. are based on the orientation or positional relationships shown in the attached drawings. These are only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of this application.

[0031] In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of the said features.

[0032] See Figure 1 , the present invention discloses a method for preparing a Mini-LED display module, which includes the following steps:

[0033] S1: Provide a PCB board;

[0034] S2: Print a first solder paste on the display surface to form a plurality of first solder paste dots;

[0035] S3: Fix the Mini-LED chips to the display surface to obtain a first intermediate product;

[0036] S4: Perform a first reflow soldering on the first intermediate product to cure the first solder paste dots and obtain a second intermediate product;

[0037] S5: Coat a packaging glue on one side of the display surface of the second intermediate product and cure it to obtain a packaging glue layer, thus obtaining a third intermediate product;

[0038] S6: Print a second solder paste on one side of the driving surface of the third intermediate product to form a plurality of second solder paste dots;

[0039] S7: Mount the electrical connection components on the display surface to obtain a fourth intermediate product;

[0040] S8: Perform the second reflow soldering on the fourth intermediate product to cure the second solder paste dots, thereby obtaining the Mini-LED display screen;

[0041] Wherein, the melting point of the first solder paste > the melting point of the second solder paste, and the glass transition temperature of the encapsulation adhesive layer - the melting point of the second solder paste ≥ 20°C.

[0042] In the method for preparing the Mini-LED display screen module based on the above embodiments, firstly, the Mini-LED chips are fixed on the display surface of the PCB board, and then the electrical connection components are mounted on the driving surface. Based on this process, a large number of micro pads on the display surface of the PCB board can be prevented from being oxidized, the bonding strength between the first solder paste dots and the first pads is improved, the stability and reliability of the display screen are ensured, and there is no need to use a large number of nitrogen-containing storage cabinets for storing the intermediate products, thus significantly reducing the manufacturing cost. Secondly, by controlling the melting point of the first solder paste to be greater than that of the second solder paste, the first solder paste can be prevented from remelting during the second reflow soldering process, ensuring the accuracy of soldering and the quality of the finished product, and improving the first-pass yield. Thirdly, by encapsulating and baking and curing the fixed Mini-LED chips, a dense protective layer can be formed on the surface of the Mini-LED chips, and then when the electrical connection components are mounted subsequently, dust, particles, etc. can be prevented from falling onto the surface of the Mini-LED chips, affecting their performance, and improving the first-pass yield of the product. Fourthly, by controlling the difference between the melting point of the second solder paste and the glass transition temperature of the first encapsulation adhesive, the stability of the encapsulation adhesive layer during the second reflow soldering process is ensured, and it is prevented from being damaged by the high temperature of the reflow soldering. Therefore, the method for preparing the Mini-LED display screen module of the present invention not only effectively reduces the production cost, but also significantly improves the first-pass yield of the product.

[0043] Specifically, in step S1, the provided PCB board needs to be subjected to surface cleaning treatment to ensure no oil stains and impurities. The PCB board has two opposite sides, one side is the driving surface for mounting the electrical connection components; the other side is the display surface for fixing the Mini-LED chips. A plurality of first pads are provided on the display surface, and they are made of Cu or a Cu / Ni / Au multi-layer composite structure. The first pads are circular or square, but are not limited thereto. The size of the first pads ≤ 120μm. It should be noted that the size of the first pads refers to the characteristic size of their patterns. For example, when the first pads are circular, their diameter is the characteristic size; when the first pads are square, their side length is the characteristic size. Preferably, in some embodiments, the size of the first pads ≤ 100μm, such as 85μm, 90μm, 95μm or 100μm, but are not limited thereto. More preferably, the size of the first pads is 80 - 90μm. In the present invention, the size of the first pads is small and the number is large, so the risk of oxidation is high. The preparation method of the present invention can effectively reduce the risk of oxidation.

[0044] Specifically, a plurality of second solder pads are provided on the driving surface of the PCB board, which are used to form second solder paste dots. The size of the second solder pad is larger than that of the first solder pad to ensure the stability of the electrical connection component. Specifically, it can be set according to the specific type and pin size of the electrical connection component.

[0045] Specifically, in step S2, the first solder paste can be printed onto the first solder pad through a screen printing process to form the first solder paste dot. After printing, it is detected by a 3D AOI detection device, and the unqualified products are repaired.

[0046] Specifically, in step S2, the first solder paste can be a medium-temperature solder paste or a high-temperature solder paste. Among them, the melting point of the medium-temperature solder paste is between 150°C and 200°C, which is generally a Sn-Bi-Ag alloy, but not limited to this. The melting point of the high-temperature solder paste is between 210°C and 250°C, which is generally a Sn-Ag-Cu alloy. By using the medium-temperature solder paste and the high-temperature solder paste, it can prevent the first solder paste from remelting during the subsequent second reflow soldering process, and cause the Mini-LED chip to fall off, displace or skew under the action of gravity, thereby ensuring the fixing stability of the Mini-LED chip. It should be noted that the reflow soldering equipment generally uses a conveyor belt for transmission. In order to meet the requirement that the solder paste melts and reflows into a spherical shape during the reflow soldering process, it is required that the solder paste dot is located on the upper surface side of the conveyor belt. Otherwise, the melted solder paste will slide down due to gravity, or it is difficult to form a stable solder joint, affecting the soldering quality. Therefore, during the second reflow soldering, the display surface is located on the lower surface side of the conveyor belt. If the first solder paste dot on the display surface that has been soldered remelts, problems such as Mini-LED chip falling off, displacement or skew will occur. For this reason, in the present invention, it is controlled that the melting point of the first solder paste > the melting point of the second solder paste to avoid the remelting of the first solder paste during the second reflow soldering process. More preferably, it is controlled that the melting point of the first solder paste - the melting point of the second solder paste = 20 - 30°C to prevent the displacement caused by the softening of the first solder paste dot and improve the first-pass yield of the Mini-LED display module.

[0047] Specifically, in step S3, the blue film on which the Mini-LED chip is placed can be expanded first, and then the Mini-LED chip can be accurately placed on the first solder paste dot through a die bonding process, but not limited to this. Preferably, in some embodiments, after the Mini-LED chip is fixed to the display surface, an AOI device is used to detect the die bonding situation to ensure that the chip position is accurate.

[0048] Specifically, in step S4, a first reflow soldering is performed using a reflow soldering device to ensure that the first solder paste dot melts and forms a firm soldering connection. Specifically, in order to optimize the soldering quality, the temperature of the soldering reflow zone should be controlled to be 10 - 30°C higher than the melting point of the first solder paste. Specifically, in some embodiments, the temperature curve of the first reflow soldering is as follows:

[0049] Heat up at a heating rate of 1 - 2 °C / s to 130 - 160 °C; in this stage, the solvent in the first solder paste is removed. By controlling the heating rate, the thermal shock to the PCB board can be reduced, preventing it from deforming and affecting the connection between the Mini-LED chip and the first solder paste dot.

[0050] Keep it at 130 - 160 °C for 60 - 90 s; in this stage, the solvent completely volatilizes, the solder paste gradually softens, and the flux is activated to fully wet the PCB board, laying a good foundation for subsequent reflow.

[0051] Heat up at a heating rate of 2.5 - 3 °C / s to the reflow temperature and maintain it at this reflow temperature for 30 - 60 s; in this stage, the first solder paste completely melts to form a stable solder joint, ensuring the firm fixation of the Mini-LED chip.

[0052] Finally, cool down at a cooling rate of 3 - 6 °C / s to 50 - 70 °C. By controlling the cooling rate, the solder joint can crystallize densely, improving the mechanical strength and reliability of the welding structure and effectively preventing the solder joint from cracking caused by thermal stress.

[0053] Preferably, in some embodiments, the first reflow soldering is carried out in a nitrogen - protected atmosphere to reduce oxidation and the probability of defects such as false soldering and blackening.

[0054] Specifically, in step S5, the encapsulation glue is coated on the Mini-LED chip and its surrounding area through a dispensing process to ensure uniform coverage, but not limited to this. Among them, the encapsulation glue can be epoxy resin glue, silicone glue, or epoxy resin glue modified with silicone resin, but not limited to this. After coating the encapsulation glue, it can be cured by ultraviolet light curing and / or baking curing to form an encapsulation glue layer. To avoid softening of the encapsulation glue layer during the subsequent second reflow soldering, a high - temperature - resistant encapsulation glue should be selected. Specifically, in the present invention, the glass transition temperature of the encapsulation glue layer obtained by curing the encapsulation glue - the melting point of the second solder paste ≥ 20 °C, so that the encapsulation glue layer remains basically stable and does not deform during the second reflow soldering. Preferably, in some embodiments, the glass transition temperature of the encapsulation glue layer - the melting point of the second solder paste = 20 - 40 °C. If the glass transition temperature of the encapsulation glue layer is too high, the toughness is poor and the bonding performance with the PCB board is reduced.

[0055] Furthermore, in some embodiments, controlling the Shore hardness of the encapsulation adhesive layer to be ≥50HD can further reduce the risk of softening of the encapsulation adhesive layer during the second reflow soldering process, improve the first-pass yield, and simplify the process without introducing fixtures. It should be noted that during the second reflow soldering process, if no fixture is introduced, part of the encapsulation adhesive layer is located on the conveyor belt. If it softens, conveyor belt marks will be left, reducing the first-pass yield. Therefore, by controlling the hardness of the encapsulation adhesive layer, the present invention can effectively avoid the problem of conveyor belt marks and ensure product quality. At the same time, the use of fixtures is avoided. Fixtures will inevitably introduce clamping marks, etc., reducing the first-pass yield. The present invention can solve this problem.

[0056] Specifically, in step S6, the second solder paste can be printed onto the driving surface through a screen printing process to form second solder paste dots. After printing, it is inspected using a 3D AOI inspection device, and defective products are repaired.

[0057] Specifically, in step S6, the second solder paste can be a low-temperature solder paste or a medium-temperature solder paste. Among them, the melting point of the low-temperature solder paste is between 130°C and 150°C, and it is generally a Sn-Bi alloy; the melting point of the medium-temperature solder paste is between 150°C and 200°C, and it is generally a Sn-Bi-Ag alloy, but is not limited thereto. By using a medium-temperature solder paste or a low-temperature solder paste, the soldering temperature of the second reflow soldering can be reduced.

[0058] Specifically, in step S7, the electrical connection components are mounted on the driving surface through a surface mount technology (SMT). After mounting, it is inspected using an AOI device (Automated Optical Inspection). Qualified products enter the second reflow soldering, and defective products are repaired. Among them, the electrical connection components include resistors, capacitors, power sockets, connection terminals, etc., but are not limited thereto.

[0059] Specifically, in step S8, the second reflow soldering is specifically carried out using a reflow soldering device to ensure that the second solder paste dots melt and form a firm soldering connection. Specifically, in some embodiments, the temperature curve of the second reflow soldering is as follows:

[0060] Heat up to 110 - 150°C at a heating rate of 1 - 2°C / s; in this stage, the solvent in the second solder paste is removed. By controlling the heating rate, the thermal shock to the PCB board can be reduced, preventing it from deforming and affecting the connection between the Mini-LED chip and the first solder paste dots.

[0061] Keep it at 110 - 150°C for 60 - 90s; in this stage, the solvent completely volatilizes, the solder paste gradually softens, and the flux is activated to fully wet the PCB board, laying a good foundation for subsequent reflow.

[0062] Heat up to the reflux temperature at a heating rate of 2.5 - 3 °C / s and maintain at this reflux temperature for 30 - 60 s; at this stage, the second solder paste is completely melted to form a stable solder joint, ensuring that the Mini-LED chip is firmly fixed.

[0063] Finally, cool down to 50 - 70 °C at a cooling rate of 3 - 6 °C / s. By controlling the cooling rate, the solder joint can be made to crystallize densely, improving the mechanical strength and reliability of the welding structure and effectively preventing the solder joint from cracking due to thermal stress.

[0064] Specifically, the second reflow soldering can be carried out in an oxygen-containing atmosphere (such as air) or an inert atmosphere (such as nitrogen), but is not limited thereto.

[0065] Specifically, in some embodiments, in steps S1 - S5, the number of particles in the working environment is 1000 - 3500 particles / m 3 , the particle size of the particles ≤ 0.5 μm, the ambient temperature is 18 - 20 °C, and the humidity is 40 - 60%; in steps S6 - S8, the number of particles in the working environment is 10000 - 35000 particles / m 3 , the particle size of the particles ≤ 0.5 μm, the ambient temperature is 18 - 20 °C, and the humidity is 40 - 60%. Since the electrical connection components are all pre-packaged devices and have low requirements for the environment, the operating process has low requirements for the working environment. However, fixing the Mini-LED chip requires a higher environmental cleanliness. Therefore, if not encapsulated and the electrical connection components are directly mounted after fixing the Mini-LED chip, the surface of the Mini-LED chip is likely to be contaminated, greatly reducing the product first-pass yield.

[0066] In summary, in the method for preparing the Mini-LED display module of the present invention, the Mini-LED chip is fixed and encapsulated first, and then the electrical connection components are mounted, reducing the production cost and improving the first-pass yield. Moreover, the present invention also controls the melting point of the solder paste and the glass transition temperature of the encapsulation adhesive layer to prevent the Mini-LED chip from being damaged during the reflow soldering of the electrical connection components, greatly improving the first-pass yield of the product. Specifically, the first-pass yield of traditional Mini-LED displays is generally below 95%, while the first-pass yield in the present invention can reach above 97.5%.

[0067] In the description of this specification, the descriptions referring to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples", etc., mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of this application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0068] Although the embodiments of this application have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of this application, and the scope of this application is defined by the claims and their equivalents.

Claims

1. A preparation method of a Mini-LED display module, characterized in that, It includes the following steps: (1) Provide a PCB board, which has opposite driving surfaces and a display surface; a plurality of first pads are provided on the display surface; (2) Print first solder paste on the display surface to form a plurality of first solder paste dots; the first solder paste dots are formed on the first pads; (3) Fix the Mini-LED chips to the display surface to obtain a first intermediate product; wherein, the electrodes of the Mini-LED chips are connected to the first solder paste dots; (4) Perform first reflow soldering on the first intermediate product to cure the first solder paste dots and obtain a second intermediate product; (5) Coat encapsulation glue on one side of the display surface of the second intermediate product and cure it to obtain an encapsulation glue layer, thus obtaining a third intermediate product; (6) Print second solder paste on one side of the driving surface of the third intermediate product to form a plurality of second solder paste dots; (7) Mount the electrical connection components to the display surface to obtain a fourth intermediate product; wherein, the electrical connection components are connected to the second solder paste dots; (8) Perform second reflow soldering on the fourth intermediate product to cure the second solder paste dots and obtain a Mini-LED display screen; Wherein, the melting point of the first solder paste > the melting point of the second solder paste; The glass transition temperature of the encapsulation glue layer - the melting point of the second solder paste ≥ 20°C.

2. The manufacturing method of the Mini-LED display module according to claim 1, characterized in that The melting point of the first solder paste - the melting point of the second solder paste = 20 - 30°C.

3. The manufacturing method of the Mini-LED display module according to claim 1, characterized in that, The Shore hardness of the encapsulation glue layer ≥ 50HD.

4. The manufacturing method of the Mini-LED display module according to claim 1, characterized in that, The Shore hardness of the encapsulation glue layer is 55 - 64HD.

5. The manufacturing method of the Mini-LED display module according to any one of claims 1 to 4, characterized in that, In steps (1) to (5), the number of particles in the working environment is 1,000 to 3,500 particles / m 3 , the particle size of the particles is ≤ 0.5 μm, the environmental temperature is 18 to 20 °C, and the humidity is 40 to 60%; In steps (6)-(8), the number of particles in the working environment is 10,000-35,000 particles / m 3 , the particle size of the particles is ≤0.5 μm, the ambient temperature is 18-20 °C, and the humidity is 40-60%.

6. The manufacturing method of the Mini-LED display module according to claim 1, wherein The size of the first pad ≤ 100μm.

7. The manufacturing method of the Mini-LED display module according to claim 1, wherein, In step (6), the encapsulation glue is cured by baking to form an encapsulation glue layer, the baking temperature is 120 - 180°C, and the baking duration is 1 - 2h.

8. The manufacturing method of the Mini-LED display module according to claim 1, wherein, The electrical connection components include resistors, capacitors, power sockets, and connection terminals.

9. A Mini-LED display module, characterized in that, It is prepared by the preparation method of the Mini-LED display screen module according to any one of claims 1 - 8.

10. A Mini-LED display screen, characterized in that, It includes the Mini-LED display screen module according to claim 9.

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