Method and system for monitoring faults of connector in real time

Abstract

The invention relates to the technical field of connector monitoring, in particular to a method and a system for monitoring faults of a connector in real time. The method comprises the following steps: acquiring object data of a connector, acquiring operating environment parameters including temperature, humidity, current, voltage and vibration conditions, and comprehensively evaluating the operating state of the connector; the mechanical toughness deterioration trend of the connector is detected, the gradual change failure condition of the contact interface is further analyzed, and the dynamic power attenuation degree of the connector is predicted; analyzing an internal component loss condition caused by the heat effect, and detecting a fatigue aggravation condition in the connector; and the aging trend of the assembly is evaluated according to the fatigue aggravation degree, the overall stability degradation degree of the connector is further evaluated, accurate monitoring of the connector fault is finally realized, and connector fault data is obtained. According to the invention, the connector fault identification is optimized, so that the connector fault identification is more accurate.

Description

Technical Field

[0001] The present invention relates to the technical field of connector monitoring, and particularly to a method and system for real-time monitoring of connector failures. Background Art

[0002] Connectors are important components in electrical equipment and are applied in fields such as power, communication, automotive, and aerospace. Their failures can lead to system instability and even pose serious safety hazards. Existing connector failure monitoring technologies mainly rely on regular inspections and manual detections, which are inefficient and unable to provide real-time warnings. By collecting multiple parameters and analyzing data, real-time monitoring of the working state of connectors, including factors such as operation duration, working intensity, environmental humidity, and electrical contact, can timely warn of connector failures and improve the operation reliability and safety of equipment. Existing technologies mainly rely on manual inspections and regular checks to identify connector failures, and cannot achieve real-time monitoring and timely warnings. Most existing systems lack comprehensive analysis of various operating environment parameters and cannot comprehensively evaluate the working state of connectors. However, traditional connector monitoring has problems such as inaccurate prediction of connector failure trends and inaccurate analysis of connector power attenuation. Summary of the Invention

[0003] Based on this, it is necessary to provide a method and system for real-time monitoring of connector failures to solve at least one of the above technical problems.

[0004] To achieve the above object, a method for real-time monitoring of connector failures includes the following steps:

[0005] Step S1: Obtain connector object data; collect connector operating environment parameters according to the connector object data; evaluate the connector operating state based on the connector operating environment parameters and the connector object data;

[0006] Step S2: Detect the deterioration trend of the connector mechanical toughness according to the connector operating state; detect the gradual contact failure of the connector based on the deterioration trend of the connector mechanical toughness; predict the degree of dynamic transmission power attenuation of the connector based on the gradual contact failure of the connector;

[0007] Step S3: Determine the cumulative situation of the connector heat effect based on the degree of dynamic transmission power attenuation of the connector; predict the loss condition of the connector internal components according to the cumulative situation of the connector heat effect; detect the degree of increased internal fatigue of the connector according to the loss condition of the connector internal components;

[0008] Step S4: Evaluate the aging trend of the connector components based on the degree of increased internal fatigue of the connector; evaluate the degree of deterioration of the stability of the connector components according to the aging trend of the connector components; perform connector failure monitoring according to the degree of deterioration of the stability of the connector components to obtain connector failure data.

[0009] By obtaining connector object data and collecting operating environment parameters, the present invention accurately evaluates the operating state of the connector, providing basic support for subsequent health state analysis. Combining with the operating state of the connector, it can effectively identify the deterioration trend of mechanical toughness and avoid poor contact caused by metal material fatigue, plastic deformation or structural loosening. Based on the deterioration trend of mechanical toughness, the gradual failure of the contact interface can be further detected, reducing the risk of increased contact impedance caused by oxidation, pollution or wear, and improving the long-term stable working ability of the connector. On this basis, by analyzing the gradual failure of the contact, the degree of dynamic power attenuation can be predicted to ensure the normal current transmission ability under load change conditions and prevent the aggravation of power loss. Dynamic power attenuation will affect the accumulation of heat effects in the connector. Reasonably measuring the heat accumulation level can reduce the risk of accelerated material aging due to excessive local temperature rise and optimize the heat dissipation design. The continuous action of heat effect accumulation will cause losses in the internal components of the connector. By analyzing the loss condition, the service life of key components can be accurately grasped to avoid failure problems caused by local overload. As the degree of loss increases, the internal fatigue phenomenon of the connector will be aggravated, resulting in a decrease in the yield strength of the material and an acceleration of the propagation of microcracks, thus affecting the stability of the overall structure. Based on the aggravation of fatigue, the aging trend of the connector components can be effectively evaluated, and the degree of deterioration of the overall stability of the connector can be evaluated in combination with the aging trend to ensure that reasonable mechanical and electrical characteristics can still be maintained under long-term service conditions. Through the analysis of stability deterioration, a complete fault monitoring system can be established to obtain the fault data of the connector in real time. Therefore, the present invention is an optimized treatment for the traditional real-time monitoring of connector faults, solving the problems of inaccurate prediction of connector fault trends and inaccurate analysis of connector power attenuation existing in the traditional real-time monitoring of connector faults, and improving the accuracy of connector fault trend prediction and the accuracy of connector power attenuation analysis.

[0010] The present invention also provides a real-time monitoring system for connector faults, which is used to execute the method for real-time monitoring of connector faults as described above. The real-time monitoring system for connector faults includes:

[0011] An operating state evaluation module, configured to obtain connector object data; collect connector operating environment parameters according to the connector object data; evaluate the operating state of the connector based on the connector operating environment parameters and the connector object data;

[0012] A power attenuation degree prediction module, configured to detect the deterioration trend of the mechanical toughness of the connector according to the operating state of the connector; detect the gradual failure of the connector contact based on the deterioration trend of the connector mechanical toughness; predict the degree of dynamic transmission power attenuation of the connector based on the gradual failure of the connector contact;

[0013] The fatigue aggravation degree detection module is used to determine the cumulative situation of the connector thermal effect based on the dynamic power attenuation degree of the connector during power transmission; predict the loss condition of the internal components of the connector according to the cumulative situation of the connector thermal effect; detect the fatigue aggravation degree inside the connector according to the loss condition of the internal components of the connector.

[0014] The connector fault monitoring module is used to evaluate the aging trend of the connector components based on the fatigue aggravation degree inside the connector; evaluate the deterioration degree of the stability of the connector components according to the aging trend of the connector components; perform connector fault monitoring according to the deterioration degree of the stability of the connector components to obtain connector fault data. Description of the Drawings

[0015] Figure 1 It is a schematic diagram of the step flow of a method for real-time monitoring of connector faults;

[0016] Figure 2 It is Figure 1 a schematic diagram of the detailed implementation step flow of step S3 in

[0017] Figure 3 It is Figure 1 a schematic diagram of the detailed implementation step flow of step S4 in

[0018] The realization, functional features and advantages of the object of the present invention will be further described in conjunction with the embodiments with reference to the drawings. Detailed Embodiments

[0019] The technical method of the present invention will be clearly and completely described below with reference to the drawings. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0020] In addition, the drawings are only schematic diagrams of the present invention and are not necessarily drawn to scale. The same reference numerals in the drawings represent the same or similar parts, and thus their repeated description will be omitted. Some of the block diagrams shown in the drawings are functional entities and do not necessarily correspond to physically or logically independent entities. The functional entities can be implemented in software form, or in one or more hardware modules or integrated circuits, or in different networks and / or processor methods and / or microcontroller methods.

[0021] It should be understood that although terms such as "first", "second", etc. may be used herein to describe various units, these units should not be limited by these terms. These terms are only used to distinguish one unit from another. For example, without departing from the scope of the exemplary embodiments, the first unit may be referred to as the second unit, and similarly the second unit may be referred to as the first unit. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0022] To achieve the above object, please refer to Figures 1 to 3 , a method for real-time monitoring of connector faults, comprising the following steps:

[0023] Step S1: Obtain connector object data; collect connector operating environment parameters according to the connector object data; evaluate the operating state of the connector based on the connector operating environment parameters and the connector object data;

[0024] In the embodiments of the present invention, during the implementation process, devices such as temperature sensors, humidity sensors, and vibration sensors are required to obtain connector object data. These sensors monitor the working environment and working state of the connector in real time through precise measurement and high-frequency data acquisition. Specifically, the measurement range of the temperature sensor is set to 0-100°C to ensure that it can cover the working temperature range of the connector, and the minimum temperature change is set to 0.05°C to ensure that temperature changes are accurately captured. The sampling frequency of the temperature sensor is set to 10 Hz to ensure the timeliness of the data and effectively reflect the real-time changes in temperature. The humidity measurement range of the humidity sensor is set to 0% to 100% RH, covering the entire range from dry to high-humidity environments, and the minimum humidity change is 0.1% RH, which can finely capture the minute fluctuations in humidity. The sampling frequency of the humidity sensor is set to 5 Hz, which can perform timed acquisition according to the changes in environmental humidity to ensure the accuracy and timeliness of the data. The vibration sensor is specifically used to monitor the vibration information of the connector, and the sampling frequency is 50 Hz to ensure that it can capture the minute vibration changes generated by the connector during operation at a high frequency. The real-time nature of vibration is crucial for detecting mechanical problems. All these sensors are connected to the central control unit through a specially designed adapter, and the data is transmitted to the control system wirelessly or wiredly after being collected. During the data transmission process, to ensure the integrity of the data and the stability of the transmission, a highly reliable communication protocol is used, and the transmitted signals are encrypted. The received data is processed in the central control system for data cleaning and preprocessing, including removing noise, eliminating abnormal data, and filling in missing values. This step ensures the accuracy of the data and avoids data errors caused by external interference or hardware problems. After data cleaning, algorithm models are used to comprehensively evaluate the working environment and state of the connector. Commonly used algorithm models include the weighted average method or the fuzzy logic model. These algorithms can comprehensively consider the temperature, humidity, vibration, and other data collected by each sensor, combined with performance indicators such as the current and voltage of the connector, for multi-factor analysis. During the evaluation process, the system will conduct a comparative analysis of environmental parameters such as temperature, humidity, and vibration with the working state of the connector to determine whether the connector is in an overloaded, overheated, overloaded, or potentially risky state. For example, too high a temperature will cause the connector to overheat, too high a humidity will cause poor electrical contact, and excessive vibration will cause mechanical damage or poor contact. The system will generate a detailed data on the operating state of the connector.

[0025] Step S2: Detect the deterioration trend of the mechanical toughness of the connector according to the operating state of the connector; detect the gradual contact failure of the connector based on the deterioration trend of the mechanical toughness of the connector; predict the degree of dynamic power attenuation of the connector based on the gradual contact failure of the connector;

[0026] In the embodiments of the present invention, according to the operating state of the connector evaluated in step S1 and combined with the real-time collected data, the mechanical toughness degradation trend of the connector is further detected. To detect the mechanical toughness degradation, it is necessary to collect the corrosion condition of the internal metal structure of the connector, and the surface condition of the connector is monitored in real time through a sensor or a vision detection system. The monitoring of the metal corrosion state is judged by the change of the surface resistance. Specifically, when the resistance value of the connector metal surface shows an abnormal change and exceeds the set resistance threshold, it is determined that the metal components of the connector have corroded. Metal corrosion will cause the conductivity of the connector to decrease, thus affecting the normal operation of the connector. Accurately monitor the process of metal corrosion, combine resistance monitoring with periodic visual inspection, and further judge the extent of corrosion expansion and its potential impact on the connector performance by calculating the trend of resistance value change. Immediately afterwards, a stress analysis model is adopted to evaluate the mechanical stress growth of the connector components by combining the embrittlement degree of the connector metal components. The embrittlement degree is related to the fatigue or corrosion damage of the material, and the embrittlement state is judged by regularly inspecting the connector metal components and combining material science analysis. The stress analysis model predicts the stress distribution of the metal components by considering factors such as temperature, humidity and external load in the working environment of the connector. When the mechanical stress exceeds the tensile strength of the material, the components will break or become loose, further affecting the stability and reliability of the connector. By monitoring the stress distribution of the connector components and the embrittlement of the metal components in real time, the mechanical failure trend of the connector is predicted in advance, and necessary preventive measures are taken to avoid sudden failures or damages. Based on the mechanical toughness degradation trend of the connector, precision measuring instruments such as displacement sensors or ultrasonic sensors are further used to monitor the contact point gap of the connector in real time. The increase in the contact point gap will affect the contact stability and current conduction efficiency of the connector. When the contact point gap exceeds the set threshold, the system will determine that the contact gradual failure has occurred. The occurrence of contact gradual failure indicates that the mechanical performance of the connector is degrading, and poor contact will cause the current to be unable to conduct stably, leading to a decline in the performance of the connector or a system failure. After confirming the contact gradual failure, analyze its impact on power transmission, and based on the power attenuation prediction model, calculate the dynamic transmission power attenuation of the connector. Specifically, the transmission power attenuation is detected through real-time current monitoring, load testing and connector electrical performance testing. By monitoring the change of the working current of the connector, if the current fluctuation exceeds the preset normal range, or the output efficiency of voltage and current is found to be lower than the set standard in the load test, it can be judged that the power transmission efficiency of the connector is gradually decaying, so as to predict the degree of its power attenuation. Combining the results of load testing and electrical performance testing, the system can comprehensively evaluate the power attenuation trend of the connector.

[0027] Step S3: Determine the cumulative situation of the connector's thermal effect based on the dynamic power attenuation during the transmission of the connector; predict the loss status of the internal components of the connector according to the cumulative situation of the connector's thermal effect; detect the degree of increased fatigue inside the connector according to the loss status of the internal components of the connector;

[0028] In the embodiments of the present invention, the cumulative thermal effect of the connector is determined by using the data on the degree of dynamic power attenuation of the connector obtained in step S2. In a specific implementation, the temperature change of the connector is monitored in real time through a thermocouple or infrared thermal imaging technology. These temperature monitoring tools can accurately capture the temperature changes on the surface and key parts of the connector. The thermocouple obtains temperature data by directly contacting the surface of the connector, while the infrared thermal imaging technology can perform non-contact monitoring on the temperature of the connector surface and the surrounding environment. These temperature data provide a basis for analyzing the temperature rise caused by power attenuation of the connector. Combining the increased power consumption caused by power attenuation and the thermal effect model, the cumulative thermal effect of the connector is calculated. The thermal effect model accurately predicts the trend of temperature change by considering the working load of the connector, current changes, external environmental temperature, and the internal heat conduction characteristics of the connector. When the temperature of the connector continues to rise and exceeds the predetermined safe temperature threshold, the system needs to start the cooling system or trigger a status alarm in a timely manner. The cooling system is started in an active cooling manner, such as fan cooling or liquid cooling devices, and bypass cooling measures are started according to the environmental conditions to ensure that the connector operates within a safe temperature range, thereby avoiding performance degradation or failures caused by overheating. Next, combining the real-time temperature data, the thermal effect model, and the heat conduction characteristics of each component of the connector, the system predicts the loss status of the internal components of the connector. Specifically, the assessment of the loss degree depends on the rate of temperature change, the degree of surface aging of the components, and the change in the resistance of the connector components. The faster the rate of temperature change, the greater the thermal stress on the connector, resulting in increased expansion, contraction, or fatigue of the material. The surface aging of the components can be detected through signs of surface cracks or corrosion, and the change in resistance reflects whether the conductive performance of the connector is affected, thereby judging its loss situation. Combining these data, the system can obtain the loss situation of each component of the connector, which helps to further analyze the long-term operation stability of the connector. According to the loss data, the degree of increased fatigue of the connector is further detected. The assessment of increased fatigue depends on the stress-strain data of the connector, and methods such as finite element analysis (FEA) are used to simulate the internal structure of the connector. Finite element analysis reconstructs the geometric model and working load of the connector in a computer simulation environment to predict the distribution of internal stress and strain under different operating conditions, and then judge the fatigue situation of the connector under high temperature or high load operation. The process of increased fatigue is manifested as microscopic structural damage to the material, such as cracks in the lattice structure, plastic deformation, etc. These damages will gradually expand under the action of continuous temperature changes and current fluctuations. Finite element analysis predicts the fatigue trend of the connector by gradually accumulating these stress and strain data, and determines whether the fatigue reaches a critical state by setting a fatigue standard value. When the fatigue value exceeds the set standard, the system will automatically judge that the internal components of the connector have been damaged or abnormal, such as poor contact, fracture, or failure, etc.

[0029] Step S4: Evaluate the aging trend of the connector assembly based on the degree of fatigue aggravation inside the connector; evaluate the degree of stability deterioration of the connector assembly according to the aging trend of the connector assembly; perform connector fault monitoring based on the degree of stability deterioration of the connector assembly to obtain connector fault data.

[0030] In the embodiment of the present invention, based on the fatigue aggravation degree data obtained in step S3, the aging trend of the connector assembly is evaluated. The evaluation of the aging trend is carried out by fitting the life curve of the connector assembly and combining multiple experimental data to obtain the aging rate of the connector assembly. Specifically, through a large amount of accelerated aging experimental data, the aging characteristics of the connector under different working environments are obtained. These experimental data cover the durability of the connector under different temperature, humidity and load conditions, and combine indicators such as stress-strain test, temperature change and current fluctuation to model the aging behavior of the connector. In the model, empirical formulas or mathematical functions, such as the exponential decay model, are used to fit the aging curve of the connector assembly to obtain the aging rate of the connector assembly under specific environmental conditions. This rate helps the system predict the performance degradation of the connector assembly in the future period of time, and then judge whether it is necessary to perform maintenance or replace components in advance. By continuously monitoring the chemical composition, structural characteristics of the connector material and the working environment (such as temperature, humidity), the aging degree of the connector is calculated in real time. The chemical composition and structural characteristics of the material will directly affect its durability. For example, some metal materials will undergo corrosion and other reactions in high temperature and humidity environments, resulting in a gradual decline in their mechanical properties. The system integrates temperature sensors, humidity sensors and environmental monitoring equipment to obtain the change data of the environment around the connector in real time, and combines the aging rate model to automatically calculate the real-time aging degree of the connector. When the working environment changes, such as the temperature rises and the humidity increases, the aging rate of the connector accelerates, and real-time monitoring can provide timely updated information for the aging prediction of the connector. According to the aging trend of the component, the degree of stability deterioration of the connector is further evaluated. The detection of stability deterioration can be carried out by methods such as vibration analysis, noise detection and current fluctuation monitoring to judge in real time whether problems such as performance decline, poor contact or electrical short circuit occur in the connector. Specifically, vibration analysis can detect mechanical looseness or damage caused by aging of the connector. An increase in the vibration amplitude means that there is poor contact or mechanical damage inside the connector; noise detection helps to identify whether abnormal sounds occur when the connector is working. Abnormal noises are caused by problems such as metal corrosion and component loosening; current fluctuation monitoring judges the stability of the electrical performance by tracking the current output of the connector in real time. The fluctuation of the current reflects poor contact of the connector or increased loss of internal components, resulting in poor current transmission. Through these methods, the stability change of the connector during use can be monitored in real time, and potential risks or faults can be detected in time.

[0031] Preferably, step S1 includes the following steps:

[0032] Step S11: Set the temperature measurement range of the temperature sensor to 0 - 100 °C, the minimum temperature change to 0.05 °C, and the temperature sampling frequency to 10 Hz;

[0033] In the embodiment of the present invention, the temperature measurement range of the temperature sensor is set to 0 °C to 100 °C, the minimum temperature change is 0.05 °C, and the temperature sampling frequency is 10 Hz. To ensure the accuracy and precision of the temperature data, a temperature sensor that can cover the working environment of the connector is selected to ensure that the temperature changes occurring during the operation of the connector can be captured. When installing the sensor, it is necessary to ensure that it is in close contact with the working surface of the connector or within the effective distance range to avoid interference from environmental factors. The temperature sensor converts the temperature signal into a voltage signal through an analog circuit and performs digital processing through an analog-to-digital converter (ADC). In actual operation, the sampling frequency of the temperature sensor is set to 10 Hz, that is, 10 data samples are taken per second, which can accurately reflect the changing trend of the temperature.

[0034] Step S12: Set the humidity measurement range of the humidity sensor to 0% - 100% RH, the minimum humidity change to 0.1% RH, and the humidity sampling frequency to 5 Hz;

[0035] In the embodiment of the present invention, the humidity measurement range of the humidity sensor is set to 0% to 100% relative humidity (RH), the minimum humidity change is 0.1% RH, and the humidity sampling frequency is 5 Hz. To comprehensively monitor the humidity of the working environment of the connector, a humidity sensor with high precision and high stability is selected, which can perform accurate measurements within a wide humidity range. The humidity sensor adopts a capacitive or resistive sensing principle, and reflects the humidity change by changing the capacitance value or resistance value of the sensor surface material. The output signal is transmitted to the analog-to-digital converter (ADC) and converted into digital data. The humidity sampling frequency is set to 5 Hz, that is, 5 humidity data samples are taken per second, ensuring that the fluctuations in the environmental humidity can be captured in real time. The installation position of the humidity sensor and the connector needs to ensure that it can accurately sense the humidity change around the connector to avoid measurement result deviation caused by improper installation position.

[0036] Step S13: Obtain the connector object data;

[0037] In the embodiments of the present invention, the acquisition of connector object data is crucial. Through multiple sensors (temperature sensors and humidity sensors) installed near the connector, the operating environment and status data of the connector are collected in real time. During specific implementation, ensure that the connection between the sensors and the connector is normal, and the power supply and signal lines of the sensors are stable. The temperature and humidity sensors will periodically collect environmental data. The temperature sensor will obtain the temperature changes in the environment where the connector is located, and the humidity sensor will record the relative humidity changes around the connector. By installing sensors such as vibration sensors and stress sensors to obtain mechanical load and vibration data, more comprehensive operating data of the connector can be provided. When the connector is operating, these data are transmitted to the data storage device or the central processing unit in real time through the data acquisition system to ensure the accuracy, real-time performance, and integrity of data acquisition.

[0038] Step S14: Use the humidity sensor and the temperature sensor to collect the operating environment parameters of the connector for the connector object data;

[0039] In the embodiments of the present invention, the humidity sensor and the temperature sensor collect data on the operating environment parameters of the connector. Through the temperature sensor and the humidity sensor installed near the surface of the connector, the temperature and humidity changes around the connector can be monitored in real time. When the data collected by the sensors is digitally processed, it will be transmitted to the data acquisition system in real time. During specific operation, the temperature sensor will regularly read the temperature of the connector's operating environment, and the humidity sensor will regularly read the relative humidity data of the surrounding environment. The data collected by the sensors is transmitted to the central processing unit in real time through the transmission line (such as wired or wireless transmission). The data transmission channel during the acquisition process should ensure stability, and encryption technology is used for data protection to prevent data loss or tampering. At the same time, a reasonable sampling period needs to be set to ensure that environmental data can be accurately and continuously obtained. When the temperature or humidity changes significantly, the system can respond in a timely manner and take alarm or necessary measures.

[0040] Step S15: Evaluate the operating status of the connector based on the operating environment parameters of the connector and the connector object data.

[0041] In the embodiment of the present invention, the operating state of the connector is evaluated based on the operating environment parameters of the connector and the connector object data. The temperature and humidity data obtained through step S11 and step S12 are used to evaluate whether the working environment of the connector is within the normal range. If the temperature is higher than the set safety threshold (for example, exceeding 90 °C) or the humidity exceeds the set critical value (for example, exceeding 80% RH), there is a risk of overheating or overhumidity of the connector. By obtaining the operating environment data, the operating duration of the connector is statistically counted. If the operating duration exceeds 2,500 hours, the system will evaluate the operating intensity of the connector based on the historical data of long-term operation. According to the data at this time, it is judged whether the connector is in a high-load or low-load operating state. On this basis, according to the change of humidity data, it is judged whether there is a risk of moisture accumulation. When the humidity change exceeds 70% RH, the estimated internal moisture accumulation condition is calculated further. If it exceeds 10 g, it is preliminarily judged that there is moisture accumulation inside the connector, and the impact of this on the performance of the connector is evaluated accordingly. The system will comprehensively evaluate the operating state of the connector according to the operating intensity, humidity change and moisture accumulation situation, and judge whether there is a probability of failure.

[0042] Preferably, step S15 includes the following steps:

[0043] Step S151: Statistically count the operating duration parameter of the connector according to the connector object data;

[0044] In the embodiment of the present invention, the operating duration parameter of the connector is statistically counted according to the connector object data. The operating duration of the connector is accurately counted, and the working state of the connector is monitored in real time by using sensors (such as temperature sensors, humidity sensors or current sensors) installed near the connector. In the specific operation process, whether the connector is in the working state is judged through the monitoring data of these sensors. If the connector is in the working state, the system starts to accumulate the operating duration. Through the data collected by the sensors, whenever the connector starts to work, the acquisition system will enable a timer and regularly record the time change. If the connector does not fail within a certain period of time, it is considered that the connector is in the normal operating state. At this time, the timer will keep increasing until the connector stops working. In this way, the system can accurately count the total operating duration of the connector from startup to shutdown. For example, if the connector works for 8 hours in a day, the system will record an operating duration of 8 hours. This step is the basis for subsequent evaluation of the connector state and provides the usage duration of the connector.

[0045] Step S152: Evaluate the operating intensity of the connector when the operating duration parameter of the connector exceeds 2,500 h;

[0046] In the embodiments of the present invention, the operating intensity of the connector is evaluated based on the operating duration parameter of the connector (for example, exceeding 2,500 hours). During specific operations, the system compares the operating duration parameter of the connector obtained through step S151 with a preset working threshold. For example, when the cumulative operating duration of the connector exceeds 2,500 hours, the system starts to evaluate the operating intensity of the connector. The evaluation of the operating intensity is based on the changes in the workload and usage environment borne by the connector. By analyzing parameters such as temperature, humidity, and mechanical stress, the working intensity of the connector is evaluated. If the connector is in a working environment with high temperature, high humidity, or high load for a long time, its working intensity is high, and the system will correspondingly adjust the evaluation model to consider the impact of these environmental factors on the connector. At this time, based on the monitoring data of the operating duration and working environment, the system can calculate the cumulative load suffered by the connector in different time periods, so as to estimate the current working intensity. If the evaluation result shows that the working intensity of the connector is large, it indicates that the connector is already in a high-risk state, accelerating aging or malfunctioning.

[0047] Step S153: Collect the change in the humidity of the operating environment according to the operating environment parameters of the connector;

[0048] In the embodiments of the present invention, the change in the humidity of the operating environment is collected according to the operating environment parameters of the connector. A humidity sensor is used to monitor the humidity change in the environment where the connector is located in real time. The humidity sensor can detect the real-time change in the relative humidity in the environment and transmit the data to the central processing system. Each collected humidity data will be stored and compared with the historical data. If a significant change in the environmental humidity is found, the system will record the amplitude and frequency of the humidity change in real time. At this time, the sampling frequency of the humidity sensor is set to 5 Hz, that is, 5 humidity data are collected per second, so that the fluctuation change of the humidity can be captured more accurately. By regularly monitoring and analyzing the humidity data, the system can evaluate the potential impact of the humidity change on the connector. Suppose the environmental humidity changes greatly in a short period of time, such as a sudden increase or decrease, the system will record this change and analyze its impact on the internal structure, contact surface, or electrical performance of the connector.

[0049] Step S154: Estimate the moisture accumulation condition inside the connector when the change in the humidity of the operating environment exceeds 70% RH;

[0050] In the embodiments of the present invention, according to the change of the humidity in the operating environment, when the relative humidity (RH) exceeds 70%, the water accumulation condition inside the connector is estimated. The humidity sensor transmits the real-time collected humidity data to the data processing system, and the system screens and analyzes the data according to the set threshold (70% RH). If the humidity change exceeds this threshold, the system starts to analyze the water accumulation situation inside the connector. At this time, through the designed algorithm, according to the change of the historical humidity data and the temperature change, the system predicts the area where water accumulation occurs inside the connector, especially in the connector contact surface or the circuit board area. This analysis is achieved by establishing a relationship model between the humidity inside the connector and the change of the external humidity. If the environmental humidity remains high, the system identifies the probability of water accumulation inside the connector and, based on this, evaluates whether the water content reaches a level sufficient to affect the normal operation of the connector. If the water accumulation exceeds the set safety value, the system prompts the risk of electrical failure caused by moisture.

[0051] Step S155: Detect the influence on the operation of the connector according to the change of the humidity in the operating environment and the water accumulation condition inside the connector when it exceeds 10 g;

[0052] In the embodiments of the present invention, according to the change of the humidity in the operating environment and the water accumulation condition inside the connector when it exceeds 10 grams, the influence on the operation of the connector is detected. Assume that in steps S153 and S154, through real-time monitoring data, it is found that when the environmental humidity change exceeds 70% RH and the water accumulation exceeds 10 g, the system will further evaluate the influence on the operation of the connector suffered. Based on the amount of water accumulation, calculate its potential impact on the connector material, including the risk of corrosion at the contact point or poor electrical contact. By comparing with the historical failure data, the system can further infer the potential damage of water to the performance of the connector. In addition, the system will predict the trend of increased resistance, poor contact or decreased electrical performance of the connector contact surface according to the speed and position of the accumulated water.

[0053] Step S156: Evaluate the operation state of the connector based on the operation work intensity of the connector and the influence on the operation of the connector.

[0054] In the embodiments of the present invention, the operating state of the connector is evaluated based on the operating intensity and operating impact of the connector. According to the operating intensity evaluation obtained in step S152 and the operating impact obtained in step S155, the system combines multiple monitoring parameters to comprehensively judge the overall operating state of the connector. During specific operation, the system will combine data such as operating duration, operating intensity, environmental humidity, moisture accumulation, and temperature, and evaluate the health state of the connector through a multi-dimensional analysis model. If the operating intensity is high and the moisture accumulation exceeds the set threshold, the system will determine that the connector is in a pre-failure state. Especially in a high-humidity environment, the risk of poor contact or degradation of electrical performance will increase. In this case, the system will evaluate the damage degree of the connector according to the operating impact situation.

[0055] Preferably, the detection of the deterioration trend of the mechanical toughness of the connector in step S2 includes:

[0056] Determine the corrosion state of the internal metal structure of the connector according to the operating state of the connector;

[0057] In the embodiments of the present invention, the corrosion state of the internal metal structure of the connector is determined by real-time monitoring of the operating state of the connector. For this purpose, the system uses operating environment parameters such as the temperature, humidity, and current of the connector, and combines a corrosion model to evaluate the corrosion of metal components. During the specific implementation process, the temperature and humidity sensors record the humidity and temperature change data of the environment around the connector in real time. Especially when the environmental humidity exceeds 70% RH and the temperature is high, the metal components are more likely to corrode. The system uses the collected data and adopts a known corrosion rate model to evaluate the corrosion layer on the metal surface, and calculates the corrosion depth and corrosion area. The change in the resistance of the metal surface is detected by the sensor, and then the corrosion situation of the metal is reflected. The areas with a larger degree of corrosion show an increase in resistance. Through the comparison of these data, the system can accurately judge the corrosion state of the internal metal structure of the connector.

[0058] Detect the embrittlement degree of the metal components of the connector according to the corrosion state of the internal metal structure of the connector;

[0059] In the embodiments of the present invention, according to the corrosion state of the metal structure obtained in the previous step, the embrittlement degree of the metal components of the connector is further detected. Corrosion can lead to an increase in the hardness and a decrease in the ductility of the metal material, thus making the metal components brittle. For this reason, the system evaluates the embrittlement of the metal by analyzing the depth and scope of the metal corrosion and combining with the material mechanics model. By detecting the change in the hardness of the metal components inside the connector, using a hardness measuring instrument (such as a Vickers hardness tester or a Brinell hardness tester) to measure the hardness of the key metal components, and combining with the corrosion state, the degree of metal embrittlement is obtained. In addition, the system further improves the embrittlement evaluation of the metal components by collecting temperature change data and combining with the embrittlement characteristics of the metal material at different temperatures. Metal components with a higher degree of embrittlement are more likely to crack or break when subjected to mechanical loads or impacts.

[0060] Identify the mechanical stress growth of the connector components based on the embrittlement degree of the connector metal components;

[0061] In the embodiments of the present invention, once the embrittlement degree of the connector metal components is identified, the system will continue to identify the mechanical stress growth of the metal components in the working state. Mechanical stress will be generated in the metal components of the connector, especially when the connector is frequently plugged and unplugged or mechanically vibrated. The system indirectly infers the change in mechanical stress by installing stress sensors around the connector or by the change in current. The stress sensor can monitor the stress change on the surface of the connector metal components in real time. If the connector bears excessive stress, the sensor will detect the corresponding stress fluctuation, and the data is transmitted to the central processing unit through the transmission interface. Combining the foregoing embrittlement evaluation, the system can determine the stress state of the connector under specific working conditions through the stress analysis model. Through these data, it is judged whether the connector components bear stress exceeding their tolerance limit, so as to evaluate the risk in its long-term use.

[0062] Estimate the fracture trend of the connector components by using the mechanical stress growth of the connector components and the embrittlement degree of the connector metal components;

[0063] In the embodiments of the present invention, by combining the mechanical stress growth of the connector components and the embrittlement degree of the metal components, the system can estimate the fracture trend of the connector components. Through the comprehensive analysis of the mechanical stress and embrittlement data, based on the material mechanics theory and the fracture mechanics model, the fracture analysis of the connector metal components is carried out. For example, based on the stress concentration effect and the distribution of the embrittlement area, the system can identify the fracture point and make a prediction according to the fatigue strength of the material. If the stress of the connector metal components continues to increase and the degree of embrittlement is high, the system will judge that the component will fracture at a certain time in the future.

[0064] Estimate the loosening trend of the connector components according to the mechanical stress growth of the connector components;

[0065] In the embodiments of the present invention, by monitoring the mechanical stress growth of the connector components, the loosening trend of the connector components is predicted. During long-term use of the connector, especially in an environment with large vibrations, the components may become loose due to long-term stress. Stress sensors and acceleration sensors are used to detect the minute displacements or changes of the metal components of the connector, and then infer the loosening condition of the connector components. If the sensors detect that the gap between the connector components gradually increases or the position changes slightly, the system will analyze the probability of loosening according to the trend of stress fluctuations. Detecting the loosening trend helps to repair or replace the connector before a failure occurs, avoiding problems such as poor contact or power-off caused by loosening.

[0066] Detect the mechanical toughness degradation trend of the connector based on the loosening trend and the fracture trend of the connector components.

[0067] In the embodiments of the present invention, based on the loosening trend and the fracture trend of the connector components, the mechanical toughness degradation trend of the connector is comprehensively judged. By combining the loosening trend and the fracture trend with factors such as the actual stress data, embrittlement degree, and workload collected during the use of the connector, the system can evaluate the overall mechanical toughness of the connector. For example, when the loosening and fracture risks gradually increase, the system will predict whether the mechanical toughness of the connector has begun to degrade according to the historical data and the changes in the current state. If the toughness degradation is severe, the working performance and reliability of the connector will be greatly reduced, and at this time the system will issue a warning.

[0068] Preferably, the detection of the connector contact gradual failure condition in step S2 includes:

[0069] Collect the growth of the contact point gap of the connector according to the mechanical toughness degradation trend of the connector;

[0070] In the embodiments of the present invention, the growth of the contact point gap of the connector is collected according to the mechanical toughness degradation trend of the connector. The mechanical toughness degradation of the connector is manifested as the deformation of the components or the gradual wear of the contact surface, which will cause the gap between the contact points to gradually increase. High-precision contact sensors are used, and these sensors can measure the minute displacements or gap changes between the connector contact points in real time. As the connector is used, these sensors can capture the distance changes between the contact points, especially when the connector experiences multiple insertions and extractions, vibrations, or physical stresses, the gap between the contact points gradually increases. By continuously monitoring multiple contact points, the system can obtain the trend of the growth of the contact point gap.

[0071] Detect the uneven contact condition of the connector according to the growth of the contact point gap of the connector;

[0072] In the embodiments of the present invention, after obtaining the data on the growth of the contact point gaps, the system analyzes these data to detect whether there is an uneven contact condition in the connector. Since the forces on different contact points of the connector are different, there are significant differences in the rates of gap growth. This uneven contact condition leads to a decline in the performance of the connector. Data is collected at different positions of the connector by multiple sensors, and the force distribution of the contact points is analyzed in combination with a mechanical model. By comparing the gap growth rates of each contact point, the system identifies which contact points have a significantly faster gap growth rate than others. This information helps to promptly detect the uneven contact problem of the connector. Once an uneven contact situation is detected, the system will issue a warning message to obtain the uneven contact condition of the connector.

[0073] Predict the degree of intensification of the mechanical vibration of the connector based on the uneven contact condition of the connector and the growth of the contact point gaps of the connector;

[0074] In the embodiments of the present invention, based on the uneven contact condition and the growth of the contact point gaps, the system further predicts the degree of intensification of the mechanical vibration of the connector. The uneven contact causes local stress concentration inside the connector, resulting in stronger mechanical vibration during vibration, especially in the case of frequent plugging and unplugging or a vibrating environment, where the amplitude of the mechanical vibration increases significantly. By combining the growth of the contact point gaps with the data from the vibration sensors, a vibration intensification prediction model is established. This model can predict the change in the vibration intensity that will occur next by analyzing the relationship between the rate of change of the contact point gaps and the uneven contact. If the vibration amplitude increases, it will have a negative impact on the long-term stability of the connector, and the system will predict the trend of vibration intensification in real time based on these data.

[0075] Estimate the resonance trend of the connector components based on the degree of intensification of the mechanical vibration of the connector and the growth of the contact point gaps of the connector;

[0076] In the embodiments of the present invention, in the context of the intensification of mechanical vibration, the system further predicts the resonance trend of the connector components. Resonance occurs when the vibration frequency of the connector components matches the frequency of the external vibration source, and the vibration amplitude will increase sharply, leading to fatigue or rupture of the connector components. The system evaluates whether the connector enters the resonance state by analyzing the vibration frequency captured by the vibration sensor and the change in the contact point gaps, in combination with frequency analysis techniques. For example, when the contact point gaps increase while the vibration amplitude gradually increases, the system will judge whether the connector is approaching or has entered the resonance frequency range based on these data. Obtain the resonance trend of the connector components.

[0077] Detect the misconnection situation of the connector based on the resonance trend of the connector components and the degree of intensification of the mechanical vibration of the connector;

[0078] In the embodiments of the present invention, based on the resonance trend and the degree of vibration intensification of the connector components, it is detected whether the connector has a misaligned connection. Resonance causes relative displacement of the connector components, increasing the risk of misaligned connection. A high-precision displacement sensor or acceleration sensor is used to monitor the relative position changes between the components of the connector. When the connector vibrates or resonates, these sensors can capture tiny displacements and transmit the data to the system for analysis in real time. If the components of the connector are misaligned, the sensors immediately detect this change and provide real-time feedback. The system calculates the degree of misalignment based on the collected data.

[0079] Detect the wear condition of the contact point of the connector based on the resonance trend of the connector components and the degree of intensification of the mechanical vibration of the connector;

[0080] In the embodiments of the present invention, in the case of resonance and increasing vibration, the wear of the contact point intensifies, and the wear condition of the contact point will continue to be monitored. The increasing wear will cause the contact surface to be uneven, thus affecting the quality of electrical contact. By installing contact sensors, factors such as the resistance change, surface deformation, and vibration fluctuation of the contact point are monitored. These sensors can detect in real time whether there is wear or damage on the surface of the contact point. As the wear intensifies, irregular deformation will appear on the surface of the contact point, and the reliability of electrical contact will gradually decline. The system can accurately evaluate the wear condition of the contact point and predict the development trend of wear through continuous monitoring of the wear data.

[0081] Determine the attenuation trend of the flatness of the contact surface according to the wear condition of the contact point of the connector;

[0082] In the embodiments of the present invention, the wear of the contact point directly affects the flatness of the contact surface, and the system will also evaluate the attenuation trend of the flatness of the contact surface based on the wear condition. The flatness of the contact surface will gradually attenuate as the wear intensifies, which will make the contact quality of the connector worse. To detect the change, a dedicated contact surface flatness measuring instrument or sensor is used to regularly monitor the change in the shape of the contact surface. These sensors can detect tiny protrusions or depressions on the contact surface and judge whether the flatness of the contact surface has attenuated by measuring the morphological changes on the surface of the contact point. As the flatness of the contact surface declines, the electrical contact of the connector becomes unstable, resulting in a decrease in the connection quality. The system will evaluate the trend of flatness attenuation through the monitored data.

[0083] Detect the gradual failure condition of the connector contact according to the attenuation trend of the flatness of the contact surface and the misaligned connection condition of the connector.

[0084] In the embodiments of the present invention, the system will comprehensively detect the contact gradual failure of the connector by combining the attenuation trend of the contact surface flatness and the misaligned connection of the connector. The attenuation of the contact surface flatness and the component misalignment are two main factors leading to the gradual failure of the connector contact. The system will predict the occurrence time of the contact failure by analyzing the attenuation of the contact surface flatness and the misalignment situation. Once the flatness attenuation reaches a certain level and the misalignment phenomenon intensifies simultaneously, the system can accurately predict the failure trend of the connector contact.

[0085] Preferably, the prediction of the power attenuation degree of the dynamic transmission of the connector in step S2 includes:

[0086] Collect the current transmission state of the connector;

[0087] In the embodiments of the present invention, a current sensor is used to monitor the current in the connector. The measurement range of the current sensor should cover the current intensity range during the normal operation of the connector, and the measurement accuracy should reach 0.1 A or higher. The sensor collects data in real time, and transmits and records the current data through the data acquisition module. To ensure the real-time and accuracy of the data, the sampling frequency of the sensor is set to at least 10 Hz. By continuously monitoring the current during the operation of the connector, the data recording module transmits the current change situation each time to the processing system.

[0088] Identify the trend of poor electrical contact of the connector based on the contact gradual failure of the connector;

[0089] In the embodiments of the present invention, the identification of the trend of poor electrical contact is completed by analyzing the growth of the contact point gap of the connector, and a specially designed contact pressure sensor is used to monitor the pressure change of the contact point of the connector. When the contact point pressure drops to the set threshold, it indicates that the contact surface is worn or aged, and the trend of poor contact gradually appears. Combining the mechanical load and temperature data of the connector, further judge whether the contact state of the contact point becomes worse and whether it causes the current transmission to be blocked. According to the collected contact point data, a contact poor warning is generated in real time, and the degree of poor contact is evaluated according to the trend analysis.

[0090] Detect the abnormal current transmission state of the connector according to the trend of poor electrical contact of the connector and the current transmission state of the connector;

[0091] In the embodiments of the present invention, the trend of poor electrical contact of the connector is confirmed by monitoring the abnormal current transmission state. When the trend of poor electrical contact gradually intensifies, the current transmission of the connector will be affected, and current fluctuations or current mutations will occur. At this time, the current sensor will detect the transmission abnormality by comparing the standard current value and the real-time data. If it is detected that the current deviates from the normal range, the system automatically marks it as an abnormal current transmission and activates the alarm mechanism. At the same time, the abnormal current state is further classified, such as sudden current impact or continuous current attenuation.

[0092] Predict connector voltage fluctuations based on abnormal current transmission status of the connector;

[0093] In the embodiment of the present invention, after the abnormal state of current transmission is detected, the voltage fluctuation condition is estimated next. Voltage fluctuation is caused by the unstable current flow inside the connector. The current fluctuation will affect the change of the voltage inside the connector, resulting in irregular voltage fluctuation. The system measures the correlation between the abnormal state of the connector current and the voltage change, combines the amplitude and frequency of the abnormal current, and uses the relationship between the current and voltage fluctuations for dynamic prediction, thereby estimating the trend of voltage fluctuation and analyzing the severity of voltage deviation.

[0094] Predict the voltage gradient growth trend based on the connector voltage fluctuation conditions;

[0095] In the embodiment of the present invention, based on the obtained voltage fluctuation data, the system further predicts the growth trend of the voltage gradient. The voltage gradient refers to the voltage difference between different points inside the connector. The instability of the current will lead to an increase in the voltage gradient, and this increase trend is closely related to the internal resistance of the connector, the condition of the contact surface, and the degree of poor electrical contact. By analyzing the voltage fluctuation data, combined with the working environment and temperature influence of the equipment, the system can accurately estimate the growth trend of the voltage gradient and monitor the increase of the voltage difference in real time.

[0096] Calculate the connector arc discharge probability based on the voltage gradient growth trend;

[0097] In the embodiment of the present invention, the increase of voltage gradient induces arc discharge, especially when the contact inside the connector is poor. The system calculates the probability of arc discharge by analyzing the growth trend of voltage gradient and combining the relevant physical characteristics of arc discharge. The occurrence of arc discharge is positively correlated with the voltage gradient. Therefore, by measuring the change of voltage gradient in real time, the system calculates the probability of arc discharge and predicts the impact of arc damage on the connector.

[0098] Use the connector arc discharge probability and voltage gradient growth trend to predict the connector short circuit condition;

[0099] In the embodiments of the present invention, according to the probability of arc discharge and the growth trend of the voltage gradient, the system further estimates the short - circuit condition of the connector. The voltage gradient refers to the rate of change of the voltage difference across the connector. When the voltage gradient exceeds a certain threshold, it means that during the power transmission process of the connector, the voltage difference increases, resulting in arc discharge phenomena in the area where the insulating material of the contact point is damaged or the electrical contact is poor. The probability of arc discharge is obtained by monitoring the operating environment of the connector, current fluctuations, and changes in the contact point resistance. An increase in the probability of arc discharge usually indicates that the electrical contact condition of the contact point of the connector has deteriorated, and there is a potential risk of short - circuit. When the growth trend of the voltage gradient shows an accelerating state and the probability of arc discharge rises, the system can identify the signs of a short - circuit inside the connector. The system establishes a short - circuit prediction model by comprehensively analyzing current, voltage, and contact surface data, and combines historical current and voltage data to monitor the performance of the connector under different voltage and current conditions. Under the increase of current or voltage instability, uneven current transmission or poor contact occurs on the contact surface, resulting in local heating, which in turn induces a short - circuit phenomenon. By real - time collecting and analyzing these electrical data, the system can timely identify the short - circuit risk inside the connector and estimate the probability of its occurrence.

[0100] Predict the arc damage condition of the connector based on the short - circuit condition of the connector and the probability of arc discharge of the connector;

[0101] In the embodiments of the present invention, once the short - circuit condition is confirmed, the system immediately enters the arc damage prediction stage. Under short - circuit conditions, the current will increase sharply, resulting in arc discharge phenomena at the contact points of the connector. During arc discharge, the contact point area will instantaneously withstand high temperatures, and its temperature can reach several thousand degrees instantaneously. This extreme temperature causes the metal material at the contact point to melt, oxidize, and even ablate instantaneously, resulting in an uneven contact surface and a significant increase in resistance. The occurrence of the arc not only causes damage to the physical surface of the contact point but also generates an oxide layer caused by the arc. This oxide layer will further impede the flow of current, thereby affecting the electrical performance of the connector and shortening its service life. The system can identify the occurrence interval and duration of arc discharge by monitoring the frequency of arc discharge, thereby judging the cumulative damage degree of the arc to the contact point. The frequent occurrence of arc discharge indicates that the contact point is exposed to a high - temperature environment for a long time. This continuous thermal stress will cause metal fatigue and corrosion, further increasing the risk of damage. The system also monitors the temperature change during arc discharge and judges the aggravation of the damage degree through the rapid change of temperature.

[0102] Predict the degree of dynamic power transmission attenuation of the connector based on the arc damage condition of the connector and the short - circuit condition of the connector.

[0103] In the embodiments of the present invention, through a detailed analysis of the arc damage situation and short - circuit conditions, the system can more accurately predict the degree of dynamic power attenuation of the connector. Arc damage usually occurs at the contact points inside the connector, especially in cases of unstable voltage, poor contact, or sudden current changes. When arc discharge occurs, the contact points are affected by instantaneous high temperatures, causing the metal surface to melt, oxidize, or even ablate, greatly weakening their electrical performance. These changes not only increase the resistance, leading to poor contact and further affecting the normal operation of the connector. At the same time, the occurrence of a short - circuit condition is usually accompanied by a sudden increase in current and a transient voltage change. This extreme electrical state exacerbates the risk of arc discharge and causes a sharp rise in the internal temperature of the connector. The increase in the short - circuit frequency is closely related to the periodic fluctuations of arc discharge. The frequent occurrence of arc discharge keeps the contact points of the connector in a high - temperature environment, gradually accelerating the degradation of metal components. By real - time monitoring the arc discharge cycle, the frequency of short - circuit occurrence, and the temperature change trend, and combining current and voltage data, the system comprehensively evaluates the working state of the connector, and then predicts the power attenuation trend of the connector during long - term use. By analyzing the influence of voltage fluctuations, short - circuit phenomena, and arc discharge, the system can not only identify the severity of the current power attenuation but also early - warn of the risk of increased power attenuation in the future.

[0104] Preferably, step S3 includes the following steps:

[0105] Step S31: Determine the cumulative heat effect of the connector based on the degree of dynamic power attenuation of the connector;

[0106] In the embodiments of the present invention, based on the degree of dynamic power attenuation of the connector, the system begins to determine the cumulative heat effect of the connector. During the use of the connector, the instability of power transmission (such as poor electrical contact, short - circuit, or arc discharge) will cause heat generation. Over time, these heats will continuously accumulate, thereby affecting the performance of the connector. To accurately determine the cumulative heat effect, temperature sensors are installed at key parts of the connector. These sensors can monitor the temperature changes of each part of the connector in real - time. Through the collected temperature data, the heat accumulation trend of the connector during long - term operation is analyzed. Combining factors such as current intensity, voltage fluctuations, and poor contact, the system calculates the cumulative degree of the heat effect and establishes a cumulative heat - effect model based on historical data. This model can accurately measure the cumulative process of the connector being heated based on the rate of temperature change and the fluctuations of electrical loads.

[0107] Step S32: Predict the heat - effect conduction trend of the connector according to the cumulative heat effect of the connector;

[0108] In the embodiments of the present invention, the system predicts the conduction trend of the connector's thermal effect according to the cumulative situation of the connector's thermal effect. The conduction of the thermal effect gradually spreads through conductors, contact points, and various components of the connector, affecting the overall performance of the connector. Analyze the conduction trend of the thermal effect, simulate it through a heat conduction model, and combine the data of temperature sensors to calculate how heat conducts from the contact points of the connector to the components. Specifically, the system will establish a multi-dimensional thermal effect conduction model based on the thermal conductivity, material properties of different components, and the thermal resistance value of the contact interface. Based on this model, predict the temperature change trend of each component inside the connector, and determine the process of the thermal effect spreading from the inside of the connector to the outside. Through the heat conduction analysis under different working conditions, the system can predict the heat dissipation capacity of the connector and discover potential heat accumulation risks.

[0109] Step S33: Predict the loss status of the internal components of the connector according to the conduction trend of the connector's thermal effect and the cumulative situation of the connector's thermal effect;

[0110] In the embodiments of the present invention, based on the conduction trend of the connector's thermal effect and the cumulative situation of the thermal effect, the system predicts the loss status of the internal components of the connector. The accumulation of the thermal effect not only affects the surface temperature of the connector, but also causes the aging, deterioration, or damage of the internal materials of the connector. In this step, the system analyzes the influence of heat on different internal components of the connector through high-precision sensors and heat transfer models. These sensors monitor the temperature changes of key components inside the connector, and at the same time, combine the data of the thermal effect conduction trend to evaluate the temperature fluctuations of the internal components and the accumulation of long-term thermal stress. As the temperature continues to rise, materials such as metal conductors, plastics, or rubbers inside the connector will undergo thermal expansion, deformation, or chemical reactions, resulting in a decline in their performance. The system predicts which components are at risk of premature failure through the correlation analysis between the thermal effect and the component aging rate, helping to identify the loss situation in a timely manner.

[0111] Step S34: Detect the degree of increased fatigue inside the connector according to the loss status of the internal components of the connector and the conduction trend of the connector's thermal effect.

[0112] In the embodiments of the present invention, based on the loss condition of the internal components of the connector and the conduction trend of the thermal effect, the degree of internal fatigue aggravation of the connector is further detected. With the accumulation of the thermal effect, each component of the connector (such as conductors, contact surfaces, etc.) will undergo different degrees of thermal cycling and mechanical stress, resulting in fatigue damage under long-term operation. To evaluate this fatigue aggravation, the mechanical stress and temperature changes of the connector are monitored through sensors. Specifically, the stress sensor installed inside the connector in the system captures the external impact or internal stress received by the connector in real time, and combines the feedback of the temperature sensor to analyze the interaction between temperature and mechanical stress. Through the analysis of these data, the system uses a fatigue damage model to predict the degree of fatigue aggravation of the connector components. The rapid increase in temperature and stress changes will exacerbate the fatigue damage of the internal components of the connector, thereby affecting the long-term stability of the connector. Combining the service life and working load of the connector, the time point of accelerated fatigue damage is predicted, an alarm is issued in a timely manner, and preventive measures are recommended to prevent sudden failures of the connector.

[0113] Preferably, step S31 includes the following steps:

[0114] Step S311: Identify the current fluctuation condition of the connector according to the dynamic power attenuation degree of the connector;

[0115] In the embodiments of the present invention, according to the dynamic power attenuation degree of the connector, the current fluctuation condition of the connector is identified. For this purpose, the system needs to monitor the current change condition of the connector in real time through a current sensor. Current fluctuations are closely related to factors such as the contact quality of the connector and changes in electrical loads. By collecting the current data of the connector in real time, the fluctuation condition of the current in different time periods can be captured. By analyzing the data of the current fluctuations, the system can accurately identify whether the connector has current instability. For example, characteristics such as the frequency and amplitude of the current fluctuations can provide evidence of abnormal fluctuations in power transmission. Using these data, the current fluctuations are quantified, the trend of power attenuation is further judged, and the future current fluctuation pattern is predicted.

[0116] Step S312: Detect the instantaneous overload condition of the connector current based on the connector current fluctuation condition;

[0117] In the embodiments of the present invention, the current instantaneous overload condition is detected based on the current fluctuation of the connector. Current instantaneous overload refers to the situation where the current borne by the connector exceeds its designed carrying capacity within a short period of time, which may cause overheating or damage to the connector. To detect current instantaneous overload, a high-precision current sensor is used to capture the instantaneous fluctuation of the connector current in real time, especially the current peak value. The system compares the current fluctuation data with the rated current of the connector to determine whether there is an instantaneous overload phenomenon. If the current exceeds the design value and the duration is short, it is identified as current instantaneous overload, and the amplitude and duration of the overload are recorded. Through this detection, the system can timely capture the current anomaly that causes damage to the connector.

[0118] Step S313: Predict the connector current impact condition based on the connector current instantaneous overload condition;

[0119] In the embodiments of the present invention, based on the current instantaneous overload condition, the system predicts the connector current impact condition. Current impact is the violent fluctuation of the current caused by instantaneous overload or operations such as the startup and shutdown of electrical equipment, which causes electrical or mechanical impact on the connector. To predict current impact, through continuous monitoring of the current overload data and combining historical data, factors such as the frequency, intensity, and duration of the current fluctuation when the current overload event occurs are analyzed. Through the change of the current waveform, the system can judge the occurrence probability of the current impact and the intensity of the impact, and further estimate the damage degree caused by the current impact to the connector. For example, if the system detects that the amplitude and frequency of a certain current impact reach the preset threshold, the system will issue a warning message for the current impact.

[0120] Step S314: Measure the temperature increase of the connector assembly according to the connector current impact condition and the connector current instantaneous overload condition;

[0121] In the embodiments of the present invention, according to the connector current impact condition and the current instantaneous overload condition, the system measures the temperature increase of the connector assembly. Current overload and current impact will cause a large amount of heat to be generated in the connector components, resulting in a sharp rise in temperature. Therefore, the system installs temperature sensors to monitor the temperature change of each component of the connector in real time. Based on the data collected by the sensors, the temperature increase of each component of the connector after the current impact and overload events is calculated. Combining these temperature data with the current fluctuation and overload data helps to analyze the influence of the thermal effect on the connector and provide reliable temperature rise prediction. The real-time data of the temperature increase will be used for subsequent thermal effect analysis to help the system detect the heat dissipation ability of the connector and the potential risk of thermal failure.

[0122] Step S315: Detect the growth trend of the contact point resistance of the connector according to the temperature increase of the connector assembly;

[0123] In the embodiments of the present invention, the resistance growth trend of the connector contact point is detected according to the temperature increase amount of the connector assembly. The increase in temperature will cause the resistance of the connector contact point to change. Especially in the high-current channel of the connector, the resistance of the contact point will gradually increase with the increase in temperature. By monitoring the temperature increase amount in real time, the resistance change of the contact point is monitored through a resistance sensor. Based on the thermal effect model and combined with the temperature data, the system calculates the change trend of the resistance of the connector contact point. If the resistance growth of the contact point exceeds a predetermined threshold, it will affect the electrical performance, resulting in poor contact or overheating. By accurately monitoring the resistance change, the system can timely detect the decline trend of the electrical performance of the contact point.

[0124] Step S316: Detect the superposition effect of the connector thermal effect on the resistance growth trend of the connector contact point according to the connector current impact condition;

[0125] In the embodiments of the present invention, according to the current impact condition of the connector, the growth trend of the contact point resistance is further detected to analyze the superposition effect of the connector thermal effect. The current impact not only causes instantaneous overload but also causes the temperature of the contact point to rise sharply, thus exacerbating the resistance growth. The system combines the characteristics of the current impact with the resistance growth trend of the contact point to evaluate the superposition effect of its thermal effect. Specifically, the system combines the temperature fluctuation and resistance change caused by the current impact, and predicts the growth rate of the contact point resistance through a thermodynamics model. During the peak period of the current impact, the resistance of the connector contact point shows exponential growth. The system can timely identify this change and analyze its impact on the electrical performance of the connector.

[0126] Step S317: Determine the cumulative situation of the connector thermal effect based on the superposition effect of the connector thermal effect and the temperature increase amount of the connector assembly.

[0127] In the embodiments of the present invention, based on the superposition effect of the connector thermal effect and the temperature increase amount of the component, the system determines the cumulative situation of the connector thermal effect. The cumulative thermal effect will cause the long-term deterioration of the connector and increase the risk of failure. By determining the cumulative situation of the thermal effect, combined with the aforementioned temperature increase amount, current impact condition and resistance change trend, the cumulative degree of the connector thermal effect is comprehensively analyzed. Through the thermal effect model, the system calculates the thermal effect accumulation of the connector in multiple working cycles, and identifies problems such as abnormal temperature and insufficient heat dissipation. If the thermal effect accumulates to a certain extent, it will cause fatigue, deformation or failure of the internal components of the connector. The system monitors the process of thermal effect accumulation.

[0128] Especially importantly, step S33 includes the following steps:

[0129] Step S331: Estimate the degree of internal thermal overload of the connector according to the thermal effect conduction trend of the connector and the cumulative situation of the connector thermal effect;

[0130] In the embodiments of the present invention, when estimating the internal thermal overload degree of the connector, it is necessary to arrange temperature sensors to ensure the comprehensiveness of data acquisition. The temperature sensors adopt platinum resistance thermometers, with a measurement range of -40°C to 150°C, a temperature accuracy of 0.01°C, and a sampling frequency set at 50Hz. The temperature sensors are installed at key parts such as the connector housing, metal contact points, plastic insulators, and pin connection parts to comprehensively obtain the temperature change data during the heat conduction process. In addition, an infrared thermal imager is used to scan the overall temperature distribution of the connector, with a resolution set at 640×480 pixels, ensuring that the temperature gradient information can be clearly captured. The heat conduction situation inside the connector is calculated by the finite difference method, the heat source position is determined based on the data of the thermal imager, and the heat transfer path is calculated in combination with the real-time temperature change of the thermocouple sensor. Then, the temperature gradient is calculated according to Fourier's law of heat conduction to evaluate the heat diffusion rate inside the connector. Based on the heat capacity, thermal conductivity, and specific heat capacity of the connector material, the heat accumulation situation is calculated to determine whether the local heat causes an abnormal temperature rise due to insufficient heat dissipation. When calculating the heat accumulation, the temperature data at multiple time points are selected, the temperature change trend of each part is analyzed, and the heat transfer situation per unit time is calculated in combination with the heat flux formula. When the temperature change exceeds the set safety threshold, or the temperature gradient is greater than the allowable range, it indicates that the inside of the connector is in a thermal overload state, and the thermal overload degree is quantified by the thermal overload coefficient.

[0131] Step S332: Estimate the overheating and melting trend of the connector assembly according to the internal thermal overload degree of the connector;

[0132] In the embodiments of the present invention, after obtaining the thermal overload coefficient in step S331, it is necessary to further evaluate the overheating and melting trend of the connector assembly, and compare the real-time temperature data of the connector with the melting point and thermal decomposition temperature of the material. For example, the oxidation damage temperature of the metal contact is set at 150°C, the material softening temperature is set at 500°C, the thermal decomposition temperature of the plastic insulator is set at 250°C, and the melting temperature is set at 350°C. When the local temperature of the connector approaches the critical temperature of the material, the temperature rise rate is calculated to determine whether there is a risk of over-temperature in a short time. The thermal diffusion method is used to calculate the temperature field, and combined with the steady-state thermal analysis and transient thermal analysis in heat transfer, it is judged whether the temperature will rapidly rise to the material melting point in a short time. For plastic components, focus on whether they undergo thermal decomposition or carbonization. For metal components, pay attention to whether the material softens or melts due to excessive temperature. When the local temperature exceeds the safety threshold, it is necessary to further combine thermal fatigue analysis to evaluate whether long-term overheating will cause material structure degradation or performance reduction. Combining the thermal overload degree, temperature distribution, and material melting characteristics, the overheating and melting trend of the connector assembly is output.

[0133] Step S333: Estimate the fracture condition of the circuit board solder joints according to the internal thermal overload degree of the connector;

[0134] In the embodiment of the present invention, after evaluating the overheating and melting trend of the connector assembly, the fracture condition of the circuit board solder joints is further analyzed. According to the temperature data in step S331, the temperature change of the solder joints is obtained, and combined with the temperature gradient of the solder joint area measured by the thermal imager, it is judged whether the solder joints are in a high-temperature environment. The solder joint material is made of Sn-Ag-Cu alloy, and its melting point is about 217°C. Under the long-term high temperature action, the solder joints are prone to fatigue cracking due to thermal expansion and cooling shrinkage. When judging the fracture risk of the solder joints, the finite element analysis (FEA) method is used to calculate the thermal stress of the solder joints. The infrared thermometer is used to obtain the temperature distribution on the surface of the solder joints, and combined with the internal heat conduction characteristics of the solder joints, the internal temperature change is calculated. The thermal expansion coefficient of the solder joints is relatively large. When the temperature changes violently, the stress concentration between the solder joints and the circuit board will increase, resulting in microcracks or fatigue fractures in the solder joints. The X-ray non-destructive testing (X-ray) is used to scan the internal structure of the solder joints to analyze whether there are bubbles, cracks or voids. When microcracks appear in the solder joints due to long-term thermal overload, the scanning electron microscope (SEM) is further used to magnify and observe the crack propagation, and combined with the thermal cycle data of the solder joints, its remaining life is evaluated. Based on the thermal fatigue analysis results of the solder joints, the fracture trend data of the solder joints are output.

[0135] Step S334: Predict the loss condition of the internal components of the connector based on the overheating and melting trend of the connector assembly and the fracture condition of the circuit board solder joints.

[0136] In the embodiments of the present invention, after obtaining the overheating and melting trend of the connector assembly and the solder joint fracture condition of the circuit board, it is necessary to comprehensively analyze the loss situation of each component inside the connector, combine with the thermal overload trend data in step S332 to determine the damage degree of the plastic insulation layer of the connector, and judge whether it has been carbonized or melted. If the plastic structure is damaged, resulting in internal short circuit or poor contact of the connector, further analyze the loss situation of the metal contact. For the metal contact, use a high-resolution optical microscope to observe the oxidation of the contact surface, and combine with a resistance measuring instrument to measure the contact resistance value. When the resistance value exceeds the set threshold (such as 1 mΩ), it indicates that the surface oxide layer of the contact point thickens due to high temperature, thus affecting the electrical conductivity. In addition, combine with the solder joint fracture data to calculate the overall mechanical stability of the connector and evaluate the reliability after long-term use. For the loss situation of the circuit board, use a high-frequency impedance analyzer to detect the change in the electrical conductivity of the solder joints on the circuit board, and combine with the solder joint fracture trend data to judge whether the solder joints have performance degradation due to thermal fatigue. At the same time, use X-ray to detect the damage of the internal copper wires of the circuit board and analyze whether the copper foil layer is peeled off or fractured due to overheating. Based on the thermal loss data, solder joint fracture condition and overall mechanical structure analysis results of the connector assembly, comprehensively output the loss state of the internal components of the connector and provide specific loss degree data.

[0137] Particularly importantly, step S34 includes the following steps:

[0138] Step S341: Predict the micro-deformation condition of the internal components of the connector according to the loss condition of the internal components of the connector;

[0139] In the embodiments of the present invention, when performing the prediction of the micro-deformation condition, based on the loss data obtained in step S334, select the key monitoring areas, including the metal contacts, plastic housing, insulation layer and solder joint positions of the connector. Use a three-dimensional laser scanner to perform high-precision surface measurement on the internal components of the connector to obtain the initial form data. The resolution of the laser scanner is set to 0.1 μm, and the scanning frequency is 100 Hz to ensure that fine deformations can be captured. After long-term temperature-stress action, use the laser scanner again to obtain the morphological change data of the connector, and calculate the micro-deformation conditions of each area through a point cloud comparison algorithm. For the metal contacts, combine with a metallurgical microscope to observe the change in the grain structure of the material, and use a nano-indentation tester to measure the hardness attenuation degree of the material to evaluate whether the metal material has deformed due to thermal aging. In the plastic housing part, use an optical interference microscope to measure the micron-level expansion or contraction change on the surface, and combine with thermogravimetric analysis (TGA) data to judge whether the plastic material has micro-deformations due to long-term high-temperature action.

[0140] Step S342: Monitor the local crack propagation trend of the connector according to the micro-deformation state of the internal components of the connector;

[0141] In the embodiment of the present invention, after the micro-deformation analysis is completed, the local crack propagation trend is further monitored. An ultrasonic scanning microscope (C-SAM) is used to detect cracks inside the solder joints, metal contacts, and plastic insulators of the connector. This device uses high-frequency ultrasonic waves to scan the internal structure and can detect cracks smaller than 5 μm, ensuring that early micro-crack propagation can be identified. The digital image correlation (DIC) technology is used to perform real-time strain measurement on the surface of the connector. The DIC system consists of a high-speed industrial camera and image processing software. By tracking the displacement changes of the tiny surface textures, the local strain distribution is calculated. When the strain value in a certain area exceeds the set threshold, it indicates that the crack begins to propagate. For the metal contacts, a scanning electron microscope (SEM) is used to observe the crack propagation path, and energy dispersive spectroscopy (EDS) is combined to detect the element distribution at the crack, and analyze whether the crack is aggravated due to oxidation or material deterioration. In the solder joint area, X-ray computed tomography (XCT) technology is used to obtain the three-dimensional structure of the solder joint, identify the internal propagation morphology of the crack, and combine the thermal cycle history data of the solder joint to calculate the crack growth rate.

[0142] Step S343: Identify the degree of attenuation of the connector's structural integrity based on the local crack propagation trend of the connector and the micro-deformation conditions of the internal components of the connector;

[0143] In the embodiment of the present invention, after obtaining the crack propagation trend and micro-deformation data, it is necessary to analyze the overall structural integrity of the connector. The crack propagation trend data and the micro-deformation data are superimposed and compared to determine whether the crack propagation area is consistent with the high-strain area. For the area with a relatively fast crack propagation rate, the finite element analysis (FEA) method is further used to simulate the stress distribution under the action of external loads and calculate the overall force condition of the connector. In the metal contact part, dynamic mechanical analysis (DMA) is used to measure the Young's modulus and shear modulus of the material, and combined with fatigue test data, the strength attenuation under long-term use is evaluated. In the plastic structure part, thermomechanical analysis (TMA) is used to measure its expansion coefficient under different temperature conditions, and combined with TGA data to judge whether there is material degradation. In the solder joint area, the four-probe method is used to measure the resistance change of the solder joint, and combined with the stress relaxation test, to judge whether the solder joint shows an increase in resistance due to the decline of the structural integrity. Combining the above various test methods, the overall structural integrity of the connector is comprehensively analyzed.

[0144] Step S344: Measure the thermal expansion degree of the connector components based on the thermal effect conduction trend of the connector;

[0145] In an embodiment of the present invention, after completing the evaluation of the attenuation of structural integrity, it is necessary to measure the thermal expansion degree of each component of the connector, and use a high-precision dilatometer to measure the linear expansion coefficients of the metal contact, plastic insulation layer, and solder joint material under different temperature conditions. This device uses non-contact optical measurement with an accuracy of up to 0.01 μm to ensure that thermal expansion changes can be accurately captured. Use an infrared thermal imager to record the temperature distribution of each part of the connector, and combine the real-time temperature data measured by the thermocouple to calculate the local thermal gradient. For metal materials, further combine the TMA data to analyze the thermal expansion degree of different parts to determine whether there is uneven expansion. In the solder joint area, use X-ray diffraction (XRD) to analyze the internal microstructure changes, and combine the stress relaxation test data to evaluate the expansion of the solder joint under thermal cycling. Integrate the thermal expansion measurement data of each area and output the thermal expansion degree of the connector components.

[0146] Step S345: Predict the growth trend of internal stress in the connector based on the thermal expansion degree of the connector components;

[0147] In an embodiment of the present invention, after measuring the thermal expansion degree, it is necessary to further analyze the growth of internal stress caused by thermal expansion. Use DIC technology to measure the strain distribution on the surface of the connector, and combine finite element analysis (FEA) to calculate the change in internal stress caused by thermal expansion. In the metal contact part, combine the DMA data to analyze the influence of thermal expansion on the internal lattice structure of the material and evaluate whether there is a region of thermal stress concentration. For the plastic structure part, combine the thermal expansion data measured by TMA to calculate the residual stress distribution under different temperature conditions. In the solder joint area, use XRD technology to analyze the stress state inside the solder joint, and combine the micro stress sensor to measure the actual stress value. Integrate the stress data of each area and output the growth trend of internal stress inside the connector.

[0148] Step S346: Detect the degree of increased internal fatigue of the connector using the growth trend of internal stress in the connector and the degree of attenuation of the connector's structural integrity.

[0149] In an embodiment of the present invention, after obtaining the growth trend of internal stress and the data of structural integrity attenuation, it is necessary to analyze the degree of increased fatigue of the connector. Use a fatigue testing machine to conduct high and low temperature alternating load tests, and combine DMA to measure the damage accumulation of the material. For the metal contact, use SEM to observe the propagation path of fatigue cracks, and combine XRD data analysis to analyze the microstructural changes in the stress concentration area. In the plastic insulation part, combine TGA and TMA data to analyze whether the material creeps due to long-term stress. In the solder joint area, combine XCT data to evaluate the propagation of fatigue cracks in the solder joint, and integrate the fatigue analysis data of each area.

[0150] Preferably, step S4 includes the following steps:

[0151] Step S41: Evaluate the aging trend of the connector assembly based on the degree of fatigue aggravation inside the connector;

[0152] In the embodiment of the present invention, the aging trend of the connector assembly is evaluated based on the degree of fatigue aggravation inside the connector. Fatigue aggravation is the damage continuously accumulated during the use of the connector, which leads to the gradual decline of the performance of the connector and affects its stability. During the implementation process, the system will use various sensors such as temperature sensors and strain sensors to monitor the fatigue status of the internal components of the connector in real time. By analyzing the data in multiple aspects such as current fluctuations, temperature changes, and mechanical pressures experienced by the connector, the system can evaluate the fatigue accumulation inside the connector assembly. The linkage information of temperature, pressure, and current fluctuations will provide key data for the evaluation of fatigue aggravation. For example, if the temperature rises at the key parts of the connector and is accompanied by current fluctuations, the fatigue phenomenon of the connector will be aggravated. The system analyzes these data through a set model, accurately quantifies the acceleration rate of connector fatigue, and then evaluates the aging trend of the connector assembly.

[0153] Step S42: Detect the degree of performance decay of the connector assembly according to the aging trend of the connector assembly;

[0154] In the embodiment of the present invention, the degree of performance decay of the connector assembly is detected according to the aging trend of the connector assembly. Over time, the connector assembly will experience multiple factors such as mechanical wear and material degradation, resulting in a gradual decline in its performance. The system monitors the working parameters of the components in real time and combines historical data to track the aging process of each component of the connector. For example, by monitoring the change in the resistance of the connector, if the resistance gradually increases, it is inferred that the electrical conductivity inside the connector has declined, and then the degree of performance decay of the connector assembly is determined. In addition, the change in temperature can also reflect the thermal effect of the connector assembly, and the thermal effect accelerates the aging of the components. The system combines the data collected by the temperature sensor with information such as current and voltage, and uses a physical model to calculate the performance decay of the components.

[0155] Step S43: Evaluate the degree of deterioration of the stability of the connector assembly according to the degree of performance decay of the connector assembly and the aging trend of the connector assembly;

[0156] In the embodiments of the present invention, according to the degree of performance attenuation and aging trend of the connector assembly, the system evaluates the degree of deterioration of the stability of the connector assembly. The deterioration of the stability of the connector assembly is caused by factors such as internal material degradation and mechanical damage, which will cause phenomena such as loosening and poor contact of the connector after long-term use. In implementation, the system combines the component aging and performance attenuation data in the foregoing steps and uses a stability analysis model to evaluate the stability of the component. Specifically, the system will compare the performance attenuation data of the component with the aging trend to determine whether the connector has an unstable working condition. If there is poor contact or uneven change in resistance at the electrical contact point, the system will judge whether the stability of the connector assembly has deteriorated based on these changes. In addition, the system will also combine environmental factors of the connector, such as temperature and humidity changes, etc., for comprehensive evaluation to obtain the degree of deterioration of the stability of the connector assembly.

[0157] Step S44: Perform connector fault monitoring according to the degree of deterioration of the stability of the connector assembly and the degree of performance attenuation of the connector assembly to obtain connector fault data.

[0158] In the embodiments of the present invention, connector fault monitoring is performed according to the degree of deterioration of the stability of the connector assembly and the degree of performance attenuation to obtain connector fault data. According to the foregoing stability and performance data, the operating state of the connector is monitored in real time to identify potential fault risks. For example, if the resistance of the connector changes rapidly and is accompanied by an abnormal increase in temperature, it indicates that there is a fault inside the connector. In implementation, the system continuously monitors key parameters of the connector, such as current, voltage, temperature, and mechanical stress, etc., and combines the foregoing aging and attenuation trend analysis to generate connector fault data. The system analyzes the fault data according to different threshold settings. If it detects that the fault data reaches the predetermined alarm standard, the system will send an alarm signal to remind the equipment maintenance personnel to take measures in time.

[0159] The present invention also provides a real-time connector fault monitoring system for performing the real-time connector fault monitoring method as described above. The real-time connector fault monitoring system includes:

[0160] An operating state evaluation module for obtaining connector object data; collecting connector operating environment parameters according to the connector object data; evaluating the operating state of the connector based on the connector operating environment parameters and the connector object data;

[0161] A power attenuation degree prediction module for detecting the deterioration trend of the mechanical toughness of the connector according to the operating state of the connector; detecting the contact gradual failure condition of the connector based on the deterioration trend of the mechanical toughness of the connector; predicting the dynamic transmission power attenuation degree of the connector based on the contact gradual failure condition of the connector;

[0162] The fatigue aggravation degree detection module is used to determine the cumulative situation of the connector thermal effect based on the dynamic power attenuation degree of the connector during power transmission; predict the loss condition of the internal components of the connector according to the cumulative situation of the connector thermal effect; and detect the fatigue aggravation degree inside the connector according to the loss condition of the internal components of the connector.

[0163] The connector fault monitoring module is used to evaluate the aging trend of the connector components based on the fatigue aggravation degree inside the connector; evaluate the deterioration degree of the stability of the connector components according to the aging trend of the connector components; and perform connector fault monitoring according to the deterioration degree of the stability of the connector components to obtain connector fault data.

[0164] The above are only specific embodiments of the present invention, enabling those skilled in the art to understand or implement the present invention. Various modifications to these embodiments will be obvious to those skilled in the art. The general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to these embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features invented herein.

Claims

1. A method for real-time monitoring of connector faults, characterized in that, It includes the following steps: Step S1: Obtain connector object data; Collect connector operating environment parameters according to the connector object data; Evaluate the connector operating status based on the connector operating environment parameters and the connector object data; Step S2: Detect the deterioration trend of the connector mechanical toughness according to the connector operating status; Detect the connector contact gradual failure condition based on the connector mechanical toughness deterioration trend; Predict the degree of dynamic power transmission attenuation of the connector based on the connector contact gradual failure condition; Step S3: Determine the cumulative situation of the connector thermal effect based on the degree of dynamic power transmission attenuation of the connector; Predict the loss status of the connector internal components according to the cumulative situation of the connector thermal effect; Detect the degree of increased internal fatigue of the connector according to the loss status of the connector internal components; Step S4: Evaluate the aging trend of the connector components based on the degree of increased internal fatigue of the connector; Evaluate the degree of deterioration of the connector component stability according to the connector component aging trend; Perform connector fault monitoring according to the degree of deterioration of the connector component stability to obtain connector fault data.

2. The method for real-time monitoring of connector faults according to claim 1, characterized in that, Step S1 includes the following steps: Step S11: Set the temperature measurement range of the temperature sensor to 0 - 100°C, the minimum temperature change to 0.05°C, and the temperature sampling frequency to 10Hz; Step S12: Set the humidity measurement range of the humidity sensor to 0% - 100%RH, the minimum humidity change to 0.1%RH, and the humidity sampling frequency to 5Hz; Step S13: Obtain connector object data; Step S14: Use the humidity sensor and the temperature sensor to collect the connector operating environment parameters for the connector object data; Step S15: Evaluate the connector operating status based on the connector operating environment parameters and the connector object data.

3. The method for real-time monitoring of connector faults according to claim 2, characterized in that, Step S15 includes the following steps: Step S151: Statistically calculate the connector operating duration parameter according to the connector object data; Step S152: Evaluate the connector operating work intensity when the connector operating duration parameter exceeds 2500h; Step S153: Collect the change situation of the operating environment humidity according to the connector operating environment parameters; Step S154: Estimate the internal moisture accumulation condition of the connector when the change situation of the operating environment humidity exceeds 70%RH; Step S155: Detect the influence situation of the connector operation when the change situation of the operating environment humidity and the internal moisture accumulation condition of the connector exceed 10g; Step S156: Evaluate the connector operating status based on the connector operating work intensity and the connector operation influence situation.

4. The method for real-time monitoring of connector faults according to claim 1, characterized in that, The detection of the connector mechanical toughness deterioration trend described in Step S2 includes: Determine the corrosion state of the internal metal structure of the connector according to the connector operating status; Detect the embrittlement degree of the connector metal parts according to the corrosion state of the internal metal structure of the connector; Identify the growth situation of the connector component mechanical stress based on the embrittlement degree of the connector metal parts; Use the growth situation of the connector component mechanical stress and the embrittlement degree of the connector metal parts to estimate the fracture trend of the connector components; Estimate the loosening trend of the connector components according to the growth situation of the connector component mechanical stress; Detect the connector mechanical toughness deterioration trend based on the connector component loosening trend and the connector component fracture trend.

5. The method for real-time monitoring of connector faults according to claim 1, characterized in that, The detection of the connector contact gradual failure situation described in step S2 includes: Collect the growth of the gap at the connector contact point according to the deterioration trend of the connector mechanical toughness; Detect the uneven contact condition of the connector according to the growth of the gap at the connector contact point; Predict the degree of increased mechanical vibration of the connector based on the uneven contact condition of the connector and the growth of the gap at the connector contact point; Estimate the resonance trend of the connector components by using the degree of increased mechanical vibration of the connector and the growth of the gap at the connector contact point; Detect the misaligned connection situation of the connector based on the resonance trend of the connector components and the degree of increased mechanical vibration of the connector; Detect the wear condition of the connector contact point based on the resonance trend of the connector components and the degree of increased mechanical vibration of the connector; Determine the attenuation trend of the contact surface flatness according to the wear condition of the connector contact point; Detect the connector contact gradual failure situation according to the attenuation trend of the contact surface flatness and the misaligned connection situation of the connector.

6. The real-time monitoring method for connector faults according to claim 1, characterized in that, The prediction of the degree of attenuation of the dynamic power transmission of the connector described in step S2 includes: Collect the current transmission state of the connector; Identify the trend of poor electrical contact of the connector based on the connector contact gradual failure situation; Detect the abnormal current transmission state of the connector according to the trend of poor electrical contact of the connector for the current transmission state of the connector; Estimate the voltage fluctuation condition of the connector based on the abnormal current transmission state of the connector; Predict the growth trend of the voltage gradient according to the voltage fluctuation condition of the connector; Calculate the probability of arc discharge of the connector based on the growth trend of the voltage gradient; Estimate the short - circuit condition of the connector by using the probability of arc discharge of the connector and the growth trend of the voltage gradient; Predict the arc damage situation of the connector according to the short - circuit condition of the connector and the probability of arc discharge of the connector; Predict the degree of attenuation of the dynamic power transmission of the connector according to the arc damage situation of the connector and the short - circuit condition of the connector.

7. The method for real-time monitoring of connector faults according to claim 1, characterized in that, Step S3 includes the following steps: Step S31: Determine the cumulative heat effect of the connector based on the degree of attenuation of the dynamic power transmission of the connector; Step S32: Predict the heat effect conduction trend of the connector according to the cumulative heat effect of the connector; Step S33: Predict the loss condition of the internal components of the connector according to the heat effect conduction trend of the connector and the cumulative heat effect of the connector; Step S34: Detect the degree of increased internal fatigue of the connector according to the loss condition of the internal components of the connector and the heat effect conduction trend of the connector.

8. The method for real-time monitoring of connector faults according to claim 7, wherein Step S31 includes the following steps: Step S311: Identify the current fluctuation situation of the connector according to the degree of attenuation of the dynamic power transmission of the connector; Step S312: Detect the instantaneous overload condition of the connector current based on the current fluctuation situation of the connector; Step S313: Predict the current impact situation of the connector based on the instantaneous overload condition of the connector current; Step S314: Measure the temperature increase of the connector components according to the current impact situation of the connector and the instantaneous overload condition of the connector current; Step S315: Detect the growth trend of the contact point resistance of the connector according to the temperature increase of the connector components; Step S316: Detect the heat effect superposition effect of the connector according to the growth trend of the contact point resistance of the connector for the current impact situation of the connector; Step S317: Determine the cumulative heat effect of the connector based on the heat effect superposition effect of the connector and the temperature increase of the connector components.

9. The method for real-time monitoring of connector faults according to claim 1, characterized in that Step S4 includes the following steps: Step S41: Evaluate the aging trend of the connector component based on the degree of increased internal fatigue of the connector; Step S42: Detect the degree of performance degradation of the connector component according to the aging trend of the connector component; Step S43: Evaluate the degree of deterioration of the stability of the connector component based on the degree of performance degradation of the connector component and the aging trend of the connector component; Step S44: Conduct connector fault monitoring based on the degree of deterioration of the stability of the connector component and the degree of performance degradation of the connector component to obtain connector fault data.

10. A real-time monitoring system for connector faults, characterized in that, For implementing the method for real-time monitoring of connector faults as described in claim 1, the system for real-time monitoring of connector faults includes: An operating state evaluation module, configured to obtain connector object data; collect connector operating environment parameters according to the connector object data; evaluate the operating state of the connector based on the connector operating environment parameters and the connector object data; A power attenuation degree prediction module, configured to detect the deterioration trend of the connector mechanical toughness according to the operating state of the connector; detect the contact gradual failure condition of the connector based on the deterioration trend of the connector mechanical toughness; predict the dynamic transmission power attenuation degree of the connector based on the contact gradual failure condition of the connector; A fatigue aggravation degree detection module, configured to determine the accumulation of the connector thermal effect based on the dynamic transmission power attenuation degree of the connector; predict the loss condition of the internal components of the connector according to the accumulation of the connector thermal effect; detect the degree of increased internal fatigue of the connector according to the loss condition of the internal components of the connector; A connector fault monitoring module, configured to evaluate the aging trend of the connector component based on the degree of increased internal fatigue of the connector; evaluate the degree of deterioration of the stability of the connector component according to the aging trend of the connector component; conduct connector fault monitoring according to the degree of deterioration of the stability of the connector component to obtain connector fault data.

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