Stretchable display device

Abstract

The invention discloses stretchable display equipment. The stretchable display equipment comprises a first display unit, a second display unit and an elastic layer, the first display unit comprises a first substrate and a plurality of first light-emitting areas arranged in one direction. The second display unit and the first display unit are arranged in the direction, and the second display unit comprises a second substrate and a plurality of second light-emitting areas. The elastic layer connects the first display unit and the second display unit. Before the stretchable display device is stretched in the direction, a first distance exists between one of the first light-emitting areas and one of the second light-emitting areas in the direction, and a second distance exists between every two adjacent first light-emitting areas. After the stretchable display device is stretched in the direction, a third distance exists between one of the first light-emitting areas and one of the second light-emitting areas in the direction, a fourth distance exists between the two adjacent first light-emitting areas, and the difference value between the first distance and the third distance is larger than the difference value between the second distance and the fourth distance.

Description

[0001] This application is a divisional application of the invention patent application with the application date of July 19, 2019, the application number of 201910657091.9, and the invention name of "Manufacturing Method of Display Device and Electronic Device". Technical Field

[0002] The present invention relates to a display device, an electronic device, and a manufacturing method of the foregoing devices, and particularly to a display device, an electronic device including an elastic layer, and a manufacturing method of the foregoing devices. Background Art

[0003] In recent years, deformable electronic devices have become one of the focuses of the new generation of electronic technologies, such as flexible display devices or stretchable display devices. Therefore, the design requirements for providing the deformation function of electronic devices have also increased accordingly. Since deformable electronic devices are still very novel technologies, the industry still needs to continuously research and develop suitable structures, materials, and more suitable configurations of each component to manufacture deformable electronic devices that can balance the yield rate and cost. Summary of the Invention

[0004] One object of the present invention is to provide a display device or an electronic device, which includes an elastic layer between display units and can provide the deformation function of the display device or the electronic device.

[0005] An embodiment of the present invention provides a display device, which includes a first display unit, a second display unit, and an elastic layer. The first display unit includes a first light-emitting area, and the second display unit includes a second light-emitting area. The elastic layer connects the first display unit and the second display unit. In a display direction of the display device, the elastic layer includes a concave corresponding to the first light-emitting area.

[0006] An embodiment of the present invention provides a stretchable display device, which includes a first display unit, a second display unit, and an elastic layer. The first display unit includes a first substrate and a plurality of first light-emitting regions arranged on the first substrate along a direction. The second display unit is arranged along the direction with the first display unit. The second display unit includes a second substrate and a plurality of second light-emitting regions arranged on the second substrate. The elastic layer connects the first display unit and the second display unit. Among them, before the stretchable display device is stretched along the direction, one of the plurality of first light-emitting regions and one of the plurality of second light-emitting regions have a first distance in the direction, and the adjacent two of the plurality of first light-emitting regions have a second distance in the direction. After the stretchable display device is stretched along the direction, the one of the plurality of first light-emitting regions and the one of the plurality of second light-emitting regions have a third distance in the direction, and the adjacent two of the plurality of first light-emitting regions have a fourth distance, where the difference between the first distance and the third distance is greater than the difference between the second distance and the fourth distance.

[0007] An embodiment of the present invention provides a manufacturing method of an electronic device, which includes first providing a substrate, forming a first control layer and a second control layer on a first surface of the substrate, where there is a first trench between the first control layer and the second control layer. Then, form a top elastic layer on the substrate, covering at least a part of the first control layer, at least a part of the second control layer, and the first trench. Next, form a second trench corresponding to the first trench in the substrate. After that, form a bottom elastic layer on a second surface of the substrate, covering the second surface of the substrate and the second trench, where the second surface of the substrate is opposite to the first surface of the substrate.

[0008] An embodiment of the present invention provides another manufacturing method of an electronic device, which includes providing a substrate and a bottom elastic layer, where the substrate has a first surface and a second surface opposite to the first surface, and the bottom elastic layer is located on the second surface of the substrate. Then, form a first control layer and a second control layer on the first surface of the substrate, where there is a trench between the first control layer and the second control layer. Next, form a top elastic layer on the substrate, covering the first control layer, the second control layer, and the trench. Description of the Drawings

[0009] Figure 1 It is a partial top view schematic diagram of the first embodiment of the electronic device of the present invention.

[0010] Figure 2 Corresponding to Figure 1 It is a cross-sectional schematic diagram of the electronic device of the present invention shown.

[0011] Figure 3 It is a partial cross-sectional schematic diagram of the second embodiment of the electronic device of the present invention.

[0012] Figure 4 Partial cross-sectional schematic diagram of the third embodiment of the electronic device of the present invention.

[0013] Figure 5 Partial cross-sectional schematic diagram of the fourth embodiment of the electronic device of the present invention.

[0014] Figure 6 Partial cross-sectional schematic diagram of the fifth embodiment of the electronic device of the present invention.

[0015] Figure 7 Partial top view schematic diagram of the variation embodiment of the cavity of the elastic layer of the electronic device of the present invention.

[0016] Figure 8 Partial top view schematic diagram of the sixth embodiment of the electronic device of the present invention before and after stretching.

[0017] Figure 9 For Figure 8 Cross-sectional schematic diagram of the shown electronic device before and after stretching.

[0018] Figure 10 Partial top view schematic diagram of the variation embodiment of the connection area of the elastic layer of the electronic device of the present invention.

[0019] Figure 11 Partial top view schematic diagram of the variation embodiment of the wire of the electronic device of the present invention.

[0020] Figure 12 Flow schematic diagram of the first embodiment of the manufacturing method of the electronic device of the present invention.

[0021] Figure 13 Flow schematic diagram of the second embodiment of the manufacturing method of the electronic device of the present invention.

[0022] Figure 14 Flow schematic diagram of the third embodiment of the manufacturing method of the electronic device of the present invention.

[0023] Figure 15 Partial top view schematic diagram of another embodiment of the electronic device of the present invention.

[0024] Figure 16 For Figure 15 Cross-sectional schematic diagram of the shown electronic device along line segment A-B and line segment C-D.

[0025] Explanation of reference numerals: 100-display device; 102-substrate; 104, 106-buffer layer; 110, 112-connection pad; 114-first semiconductor layer; 116-multiple quantum well structure; 118-second semiconductor layer; 120-first contact electrode; 124-second contact electrode; 126-wire; 128-protective layer; 130, 180-functional layer; 134-pixel definition layer; 134a, 126a-opening; 140-upper notch; 142-lower notch; 144-protrusion structure; 146-rough structure; 148-insulating layer; 160, 166-support substrate; 162-first groove; 164, 170-second groove; 168, 172-groove; CIL-control layer; CR-connection region; CRa-first portion; CRb-second part; D1, D2-direction; Dd-display direction; DE-drain; ED-electronic device; EL1-top elastic layer; EL2-bottom elastic layer; ELA-elastic layer; GE-gate; IN-dielectric layer; LEU-light-emitting element; LR1-first light-emitting area; LR2-second light-emitting area; LU1-first display unit; LU2-second display unit; Re1, Re2-cavities; Re3, Re4-bottom cavities; SC-semiconductor layer; SE-source; TS1, TS2-surface; SU1-first substrate; SU2-second substrate; SUB-substrate; SUBa-first surface; SUBb-second surface; Td, Te, Tm, H1, H2-thickness; TFT-transistor; W1, W2, We1, We2-width. DETAILED DESCRIPTION

[0026] The present invention is described in detail below in conjunction with specific embodiments and drawings. It should be noted that in order to make it easier for readers to understand and the drawings are concise, the multiple drawings in the present invention only depict a portion of the device, and the specific elements in the drawings are not drawn according to the actual scale. In addition, the number and size of each element in the drawing are only for illustration and are not intended to limit the scope of the present invention.

[0027] Throughout the specification and claims of the present invention, certain terms are used to refer to specific elements. Those skilled in the art should understand that electronic device manufacturers may use different names to refer to the same element. This document does not intend to distinguish between elements that have the same function but different names. In the following specification and claims, terms such as "comprising" and "including" are open-ended terms, and thus should be interpreted as meaning "including but not limited to...". When the terms "comprising", "including" and / or "having" are used in this specification, they specify the presence of the stated features, regions, steps, operations and / or elements, but do not preclude the presence or addition of one or more other features, regions, steps, operations, elements and / or combinations thereof. When an element or film layer is referred to as being "on" or "connected to" another element or film layer, it can be directly on or directly connected to this other element or layer, or there may be intervening elements or film layers therebetween. In contrast, when an element is referred to as being "directly" "on" or "directly connected to" another element or film layer, there are no intervening elements or film layers therebetween.

[0028] Although terms such as "first", "second", "third", etc. may be used to describe or name different components, these components are not limited thereto. These terms are only used to distinguish one component in the specification from other components and have nothing to do with the manufacturing order of these components. The same terms may not be used in the claims, and "first", "second", "third", etc. may be used in place of them according to the order in which the elements are claimed in the claims. Accordingly, in the following specification, the first component may be the second component in the claims.

[0029] It should be noted that, without departing from the spirit of the present invention, the features in several different embodiments can be replaced, reorganized, and mixed to complete other embodiments.

[0030] Please refer to Figure 1 and Figure 2 , Figure 1 is a partial top view schematic diagram of the first embodiment of the electronic device of the present invention, Figure 2 corresponding to Figure 1Schematic cross-sectional view of the electronic device of the present invention shown. The electronic device ED of the present invention may include a display device, an antenna device, a sensing device, or a splicing device, but is not limited thereto. The electronic device ED may be a bendable or flexible electronic device. The electronic device may, for example, include a liquid crystal light-emitting diode; the light-emitting diode may, for example, include an organic light-emitting diode (OLED), an inorganic light-emitting diode (LED), a mini light-emitting diode (mini LED), a micro light-emitting diode (micro LED), or a quantum dot light-emitting diode (quantum dot, QD, which may be, for example, QLED, QDLED), and fluorescence, phosphor, or other suitable materials and any combination thereof may be included in the light-emitting diode or the electronic device, but is not limited thereto. In one embodiment, the chip size of the inorganic light-emitting diode may be, for example, about 300 micrometers (μm) to 10 millimeters (mm), the chip size of the mini light-emitting diode may be about 100 micrometers (μm) to 300 micrometers (μm), and the chip size of the micro light-emitting diode may be about 1 micrometer (μm) to 100 micrometers (μm), but is not limited thereto. The antenna device may be, for example, a liquid crystal antenna, but is not limited thereto. The splicing device may be, for example, a display splicing device or an antenna splicing device, but is not limited thereto. It should be noted that the electronic device may be any permutation and combination of the foregoing, but is not limited thereto. The following will illustrate the content of the present invention by taking the display device 100 as the electronic device or the splicing device, but the present invention is not limited thereto. For example, when the electronic device is an antenna device, only the display unit needs to be appropriately replaced with the working unit of the antenna. The display device 100 may be a curved display, a bendable or flexible display, where a bendable display means a display that can be bent, folded, stretched, flexed, or otherwise deformed (hereinafter all referred to as "bendable"), and the display can be deformed from a first state to a second state. In other words, during operation, the display may have a curved surface or present a bent state.Embodiment aspects of the display device 100 of the present invention may be: a non-self-emitting liquid crystal display (LCD), and a self-emitting organic light emitting diode display (OLED Display), an inorganic light emitting diode display (Inorganic Light Emitting Diode Display, LED Display), a mini inorganic light emitting diode display (Mini-LED Display), a micro inorganic light emitting diode (Micro-LED Display), a quantum dot diode display (Quantum-Dot LED Display, QLED Display), or an electrophoretic display (Electro-Phoretic Display, EPD), etc., various displays capable of presenting images and pictures, but not limited thereto.

[0031] The display device 100 of the present invention includes a first display unit LU1, a second display unit LU2, and an elastic layer ELA. The first display unit LU1 includes a first light-emitting region LR1, and the second display unit LU2 includes a second light-emitting region LR2. Specifically, the first display unit LU1 and the second display unit LU2 may respectively include multiple film layers and components required for displaying images or colors, but not limited thereto. Taking the first display unit LU1 as an example, it may include a first substrate SU1. The first substrate SU1 may include multiple material layers or film layers, such as a substrate 102, a buffer layer 104, and a buffer layer 106. The substrate 102 may be a rigid substrate or a flexible substrate. The materials of the substrate may include, for example, glass, quartz, or sapphire, metal, polyimide (PI), polycarbonate (PC), polyethylene terephthalate (PET), etc., or combinations of the foregoing, but not limited thereto. The number of buffer layers above the substrate 102 can be changed as needed. For example, there may be only one layer or more than two layers, not limited to Figure 2 those shown. In some embodiments, the first substrate SU1 may further include (but not limited to) an adhesive layer or a support substrate. A control layer CIL may be disposed on the first surface SUBa of the first substrate SU1. The control layer CIL may include (but not limited to) multiple wires, various electrical components (such as switching elements, driving elements, and / or capacitors), and light-emitting elements. For example, the control layer CIL corresponding to the first light-emitting region LR1 may include a transistor TFT and a light-emitting element LEU. Although Figure 2The illustrated transistor TFT is a top-gate type transistor, but the transistor TFT structure can also be in other forms, such as a bottom-gate type transistor, and the transistors TFT in the same display device 100 are not limited to only one type. The transistor TFT can be used as a driving element or a switching element, and it can include a semiconductor layer SC, a dielectric layer IN, a gate GE, a drain DE, a source SE, and other possible dielectric layers. The semiconductor layer SC can be formed of a semiconductor material, such as silicon or metal oxide, but is not limited thereto. For example, the semiconductor layer SC can be an amorphous silicon layer, a polycrystalline silicon layer, or an indium gallium zinc oxide (IGZO) layer. In a transistor TFT, the semiconductor layer SC can include a source contact, a drain contact, and a channel region disposed between the source contact and the drain contact. The source SE is electrically connected to the corresponding source contact through a via hole passing through the dielectric layer IN. The drain DE is electrically connected to the corresponding drain contact through another via hole passing through the dielectric layer IN. The light-emitting element LEU can include, but is not limited to, a light-emitting diode as described above. Figure 2The light-emitting element LEU shown is exemplified by a micro light-emitting diode. The light-emitting element LEU is disposed in the opening 134a of the pixel definition layer 134. The light-emitting element LEU can be a p-n diode, and can include, for example, a first semiconductor layer 114, a second semiconductor layer 118, and a multi quantum well (MQW) structure 116 disposed between the first semiconductor layer 114 and the second semiconductor layer 118. The light-emitting element LEU can also include a first contact electrode 120 connected to the first semiconductor layer 114 and a second contact electrode 124 connected to the second semiconductor layer 118. In this embodiment, the first semiconductor layer 114 is a p-type semiconductor layer, and the second semiconductor layer 118 is an n-type semiconductor layer, or vice versa. The first contact electrode 120 can be electrically connected to the drain DE of the transistor TFT through the connection pad 112, and the transistor TFT can be used as a driving element or a switching element of the light-emitting element LEU. The second contact electrode 124 can be electrically connected to the shared electrode wire or the operating voltage source through the connection pad 110, but is not limited thereto. The display device 100 can also selectively include a protective layer 128 and a functional layer 130. The protective layer 128 correspondingly covers the light-emitting element LEU and can provide functions such as waterproof and oxygen-proof, for example. The functional layer 130 can entirely cover the surface of the first substrate SU1 and can include, for example, a packaging layer, a touch layer, a cover layer, an antireflection layer, a protective layer, an insulating layer, or a combination of the above. In other embodiments, the protective layer 128 and / or the functional layer 130 can be a multi-layer structure, for example, a multi-layer structure stacked by an inorganic layer / organic layer / inorganic layer or an inorganic layer / organic layer / inorganic layer / organic layer / inorganic layer. In Figure 2 , the first display unit LU1 refers to the film layer from the first substrate SU1 to the functional layer 130. The area of one first display unit LU1 can be defined by a single first substrate SU1, that is, the area of the first display unit LU1 can be represented by the area of the first substrate SU1. The first display unit LU1 can include a plurality of first light-emitting regions LR1. In some embodiments, the first light-emitting region LR1 can be defined by the opening 134a of the pixel definition layer 134. In other embodiments, the first light-emitting region LR1 can be defined by the area of the light-emitting diode, but is not limited thereto. In other embodiments, the light-emitting element LEU can selectively be a vertical type light-emitting diode, and its two contact electrodes are respectively located on both sides of the semiconductor layer, but is not limited thereto.

[0032] The structure of the second display unit LU2 is similar to that of the first display unit LU1, including a second substrate SU2, on which a control layer CIL is provided. The control layer CIL may include transistors TFT and light-emitting elements LEU. The light-emitting element LEU is located in the opening 134a of the pixel definition layer 134, and a protective layer 128 and a functional layer 130 may be provided thereon. In some embodiments, the opening 134a of the pixel definition layer 134 may define the area of the second light-emitting region LR2, or alternatively, the size of the second light-emitting region LR2 may be defined by the area of the light-emitting diode of the light-emitting element LEU. The second substrate SU2 and the first substrate SU1 may be made of the same or different materials. In some embodiments, the second substrate SU2 and the first substrate SU1 may be formed from the same substrate SUB, and in the manufacturing process, a part of the substrate SUB may be removed to form the unconnected first substrate SU1 and second substrate SU2. The total thickness of the second display unit LU2 is represented by the thickness Td, and may be measured from the second surface SUBb (i.e., the lower surface of the substrate SUB) of the substrate SUB to the upper surface of the functional layer 130. Similarly, the total thickness of the first display unit LU1 may be defined in the same manner and represented by the thickness Td. Other details of the second display unit LU2 will not be elaborated further.

[0033] The elastic layer ELA of the display device 100 connects the first display unit LU1 and the second display unit LU2. In a display direction Dd of the display device 100, at least a part of the elastic layer ELA overlaps with the first display unit LU1 or the second display unit LU2. Specifically, the elastic layer ELA may partially overlap with the first display unit LU1 and the second display unit LU2 respectively, or completely cover the first display unit LU1 and the second display unit LU2. In addition, in the display direction Dd of the display device 100, the elastic layer ELA includes a concave Re1 corresponding to the first light-emitting region LR1, and may also include a concave Re2 corresponding to the second light-emitting region LR2. In some embodiments, the elastic layer ELA corresponding to the first display unit LU1 may include a plurality of concaves Re1. For example, the concaves Re1 may be arranged in an array along the directions D1 and D2. Figure 1 The directions D1 and D2 shown are exemplified as being perpendicular to each other, but this is not limiting. Similarly, the elastic layer ELA corresponding to the second display unit LU2 may include a plurality of concaves Re2, arranged in an array along the directions D1 and D2. The concaves Re1 and Re2 may have a rectangular or square top view shape, as Figure 1 shown, but this is not limiting. In other embodiments, the concaves Re1 and Re2 may have various different pattern designs. As Figure 2As shown, in some embodiments, the bottoms of the cavities Re1 and Re2 still have an elastic layer ELA, that is, the upper surfaces TS1 and TS2 of the first light-emitting region LR1 and the second light-emitting region LR2 are still covered by the elastic layer ELA. The ratio of the area of the cavity Re1 corresponding to the first display unit LU1 to the area of the first display unit LU1 is greater than or equal to 0.5 and less than 1. Specifically, Figure 1 in Figure 1 , there are four cavities Re1 corresponding to the first display unit LU1, and the ratio of the total area of the four cavities Re1 to the area of the first display unit LU1 (the area of the first substrate SU1) is greater than or equal to 0.5 and less than 1, but not limited thereto. The area of the cavity Re1 is defined and measured by its bottom area. For example, its boundary is defined by the bottom of the sidewall of the cavity Re1, or the projected area of the bottom of the cavity Re1 on the substrate SUB can be calculated. If there is a rough structure at the bottom of the cavity Re1, the calculation of the area should ignore the calculation of the surface area of the rough structure. The area ratio of the second display unit LU2 and the cavity Re2 can have a similar design and will not be elaborated here.

[0034] The part of the elastic layer ELA located between the first display unit LU1 and the second display unit LU2 can be defined as the connection region CR, which is used to connect the first display unit LU1 and the second display unit LU2. Specifically, the connection region CR can include a first part CRa and a second part CRb, and the thickness of the first part CRa can be different from the thickness of the second part CRb. For example, the second part CRb will cover the periphery of the first display unit LU1, including covering the outer edges and sidewalls of the upper and lower surfaces of the first display unit LU1, and the maximum thickness Te of the second part CRb may be greater than the thickness Td of the first display unit LU1. On the other hand, the thickness of the first part CRa can be adjusted according to the requirements of product design. For example, the minimum thickness Tm of the connection region CR (that is, the thickness of the first part CRa) can be equal to or different from (greater than or less than) the thickness Td of the first display unit LU1. In Figure 2 the shown embodiment, the minimum thickness Tm of the connection region CR is less than the thickness Td of the first display unit LU1. In one embodiment, the measurement position of the thickness Td is generally measured at a position adjacent to the source SE or drain DE of the transistor TFT electrically connecting the light-emitting element LEU. In one embodiment, the measurement position of the thickness Te is generally measured at a position slightly away from the display unit region and the connection region CR (excluding the extreme values at the region boundary). In another embodiment, the measurement position of the thickness Tm is generally measured at a position slightly away from the junction of the first part CRa and the second part CRb (excluding the extreme values at the region boundary). And the foregoing measurement state is also measured before stretching.

[0035] When the display device 100 undergoes deformation such as stretching, the first part CRa of the connection region CR is the main deformable part of the display device 100. For example, the first part CRa of the connection region CR can be stretched laterally along the direction D1, but not limited thereto. As Figure 2 shown, in some embodiments, since the first part CRa has a smaller thickness Tm relative to the second part CRb, the elastic layer ELA can include an upper recess 140 and a lower recess 142. In other embodiments, the elastic layer ELA can have only the upper recess 140 or only the lower recess 142, or have neither the upper recess 140 nor the lower recess 142. In addition, a wire 126 can be provided in the connection region CR, and its material can be the same as any conductive material in the control layer CIL. For example, it can be made of the same conductive layer as the source electrode SE, but not limited thereto. The pattern of the wire 126 in the figure is only schematic, and the number, pattern, and configuration of the wires can be adjusted according to actual needs. For example, the wire 126 can include a signal line for transmitting signals required during display operations, such as signals for transmitting the gate GE of the transistor TFT, but not limited thereto. Furthermore, the part of the elastic layer ELA covering the first display unit LU1 and the second display unit LU2 can be called the top elastic layer EL1, and the part of the elastic layer ELA disposed on the lower side of the substrate SUB can be called the bottom elastic layer EL2. The elastic layer ELA can include (but is not limited to) resin materials or other suitable materials, which can be a light-transmissive layer or a low light-transmissive layer. For example, it can be a light-blocking layer, that is, a material layer with low light transmittance. For example, its light transmittance within the visible light wavelength range is less than 50%, but not limited thereto, as long as it can effectively separate the emitted light between different cavities. In Figure 2 the shown embodiment, there is still a relatively thin elastic layer ELA covering the first light-emitting region LR1 and the second light-emitting region LR2 at the cavities Re1 and Re2, and the elastic layer ELA can be selected to have a higher light transmittance. The elastic layer ELA corresponding to the first light-emitting region LR1 and the second light-emitting region LR2 has cavities Re1 and Re2, which can reduce the influence of the elastic layer ELA on the optical performance. On the other hand, when the display device 100 is deformed, the elastic layer ELA may also be stretched accordingly. Since the elastic layer ELA on the surfaces of the first light-emitting region LR1 and the second light-emitting region LR2 in this embodiment is relatively thin, the influence of the stretching of the elastic layer ELA on the first light-emitting region LR1 and the second light-emitting region LR2 is relatively small.

[0036] The electronic device, display device, and their manufacturing methods of the present invention are not limited to the above embodiments. Other embodiments or variations will be further disclosed below. However, for the sake of simplicity and highlighting the differences between the embodiments or variations, the same reference numerals are used to label the same elements in the following text, and the repeated parts will not be described again. In addition, the conditions of the film layer materials, thicknesses, and manufacturing process steps in the subsequent embodiments of the present invention can all refer to the first embodiment, so they will not be described again.

[0037] Please refer to Figure 3 , Figure 3 , which is a partial cross-sectional schematic diagram of the second embodiment of the electronic device of the present invention. Figure 3 The cavities Re1 and Re2 of the elastic layer ELA of the display device 100 shown respectively expose a part of the first display unit LU1 and the second display unit LU2. In other words, the bottom of the cavity Re1 does not have the elastic layer ELA, and at least a part of the functional layer 130 of the first display unit LU1 is directly exposed at the bottom of the cavity Re1 without being covered by the elastic layer ELA; similarly, the bottom of the cavity Re2 does not have the elastic layer ELA, and at least a part of the functional layer 130 of the second display unit LU2 is directly exposed at the bottom of the cavity Re2 without being covered by the elastic layer ELA. This design enables the surfaces of the first light-emitting region LR1 and the second light-emitting region LR2 not to have the elastic layer ELA, which can reduce the influence of the elastic layer ELA on the optical performance. On the other hand, when the display device 100 is deformed, the surfaces of the first light-emitting region LR1 and the second light-emitting region LR2 are less likely to be pulled by the elastic layer ELA. Furthermore, Figure 3 the elastic layer ELA in Figure 3 may also have a bottom cavity Re3 corresponding to the cavity Re1 and a bottom cavity Re4 corresponding to the cavity Re2. The bottom cavity Re3 exposes the second surface SUBb of the first substrate SU1 (that is, the lower surface of the first substrate SU1). Further, the bottom elastic layer EL2 may not overlap with the first light-emitting region LR1 in the display direction Dd of the display device 100. Similarly, the bottom cavity Re4 may expose the second surface SUBb of the second substrate SU2 (that is, the lower surface of the second substrate SU2). In other words, the bottom elastic layer EL2 may not overlap with the second light-emitting region LR2 in the display direction Dd of the display device 100. In another embodiment, the bottoms of the bottom cavity Re3 and the bottom cavity Re4 may still have a relatively thin bottom elastic layer EL2 covering the second surface SUBb of the substrate SUB without exposing the display unit. Here, "exposure" refers to the area not covered by the elastic layer ELA, and it does not limit that there are other layers covering the area exposed by the elastic layer ELA. For example, in

[0038] Please refer to Figure 4 , Figure 4 , which is a partial cross-sectional schematic diagram of the third embodiment of the electronic device of the present invention. As Figure 4As shown, the first display unit LU1 may include a protrusion structure 144 located on the upper surface of the first display unit LU1, and the protrusion structure 144 may be directly covered in contact by the top elastic layer EL1. The protrusion structure 144 may be made of a material the same as or different from that of the functional layer 130. The protrusion structure 144 may include an insulating material or a packaging material. For example, when manufacturing the functional layer 130, a halftone mask or a semi-gray scale mask may be used to define the pattern of the functional layer 130. For example, the patterned functional layer 130 is disposed corresponding to the first substrate SU1 and the second substrate SU2 respectively, and the protrusion structure 144 is manufactured simultaneously. The protrusion structure 144 may improve the adhesion of the top elastic layer EL1 to the first display unit LU1. The surface of the second display unit LU2 may also include the protrusion structure 144, which will not be elaborated here. In some embodiments, the second surface SUBb of the substrate SUB may include a rough structure 146, and the rough structure 146 is covered by the elastic layer ELA. During the manufacturing process of the display device 100, a support substrate may be attached to the lower side of the substrate SUB with an adhesive layer first. After the control layer CIL and the top elastic layer EL1 are manufactured, the adhesive layer may be irradiated with a laser to separate the adhesive layer and the support substrate from the substrate SUB. The adhesive layer irradiated with the laser may generate gases such as hydrogen, which may form a rough surface on the second surface SUBb of the substrate SUB, that is, the rough structure 146. Then, the bottom elastic layer EL2 is formed on the second surface SUBb of the substrate SUB. The rough structure 146 may improve the adhesion performance between the bottom elastic layer EL2 and the substrate SUB.

[0039] Please refer to Figure 5 , Figure 5 which is a partial cross-sectional schematic diagram of the fourth embodiment of the electronic device of the present invention. Compared with the first embodiment of the present invention, in Figure 5 the shown display device 100, the cavities Re1 and Re2 of the elastic layer ELA of the display device 100 expose a part of the first display unit LU1 and the second display unit LU2 respectively; the minimum thickness Tm of the first part CRa of the connection region CR of the elastic layer ELA is greater than the total thickness Td of the first display unit LU1 or the second display unit LU2. In addition, an insulating layer 148 may be further provided on the upper surfaces TS1 and TS2 of the portions of the first light-emitting region LR1 and the second light-emitting region LR2 that are not covered by the elastic layer ELA. A part of the insulating layer 148 may be disposed in the cavities Re1 and Re2. The insulating layer 148 may be made of a material with a waterproof and oxygen-proof function to protect the first light-emitting region LR1 and the second light-emitting region LR2, so as to improve the reliability of the light-emitting elements LEU and electronic elements in the first light-emitting region LR1 and the second light-emitting region LR2. The thickness and height of the insulating layer 148 are not limited to Figure 5 as shown. For example, in some embodiments, its height may be lower than the elastic layer ELA on both sides of the cavities Re1 and Re2.

[0040] Please refer to Figure 6 , Figure 6 which is a partial cross-sectional schematic diagram of the fifth embodiment of the electronic device of the present invention. Figure 6 The elastic layer ELA (or a part of the elastic layer ELA) of the display device 100 shown can be one of the control layers CIL. For example, taking the pixel definition layer 134 as the top elastic layer EL1, at this time, the pixel definition layer 134 will extend between the first display unit LU1 and the second display unit LU2 to connect the two display units. In this design, the openings 134a of the pixel definition layer 134 can be defined as the recesses Re1 and Re2, corresponding to the first light-emitting region LR1 and the second light-emitting region LR2 respectively. In some embodiments, the substrate SUB can include fewer film layers than the previous embodiments, for example, including Figure 2 one of the buffer layer 106 and the substrate 102 shown. For example, in this design, the manufacturing process of the display device 100 can be to first fabricate the bottom elastic layer EL2 on the support substrate, and then sequentially fabricate a thinner substrate SUB (such as a buffer layer or a substrate) and a circuit layer (such as film layers including transistors, wires, and interlayer dielectrics) on the bottom elastic layer EL2, pattern the substrate SUB to form the separated first substrate SUB1 and second substrate SUB2, expose the bottom elastic layer EL2 between the two, and then form the pixel definition layer 134, the light-emitting element LEU, the protective layer 128, and the patterned functional layer 130, where the pixel definition layer 134 is formed between the first substrate SUB1 and the second substrate SUB2. After that, the support substrate under the bottom elastic layer EL2 can be removed to form Figure 6 the display device 100 shown. In another embodiment, a substrate SUB with better support force can also be provided first, a circuit layer is formed on the substrate SUB, and then the circuit layer is patterned to separate the circuit layer intervals of the display unit LU1 and the second display unit LU2, and then elements such as the pixel definition layer 134, the light-emitting element LEU, and the functional layer 130, as well as related wires, connection pads, or electrodes are formed, where the pixel definition layer 134 will cover the substrate SUB between the display unit LU1 and the second display unit LU2. Finally, the substrate SUB can be patterned to form a notch on the lower surface of the substrate SUB to complete the preliminary fabrication of the display device 100.

[0041] Please refer to Figure 7 , Figure 7 which is a partial top-down schematic diagram of a variant embodiment of the recess of the elastic layer of the electronic device of the present invention. Figure 7 Illustrates different variations of the recesses Re1 and Re2 of the elastic layer ELA, and the wire 126 is omitted ( Figures 8 to 10The wire 126 is also ignored and will not be elaborated further). In example (i), the recesses Re1 and Re2 may have a circular top view pattern. In example (ii), the recess Re1 corresponding to the first display unit LU1 may have a rectangular pattern and expose a plurality of first light-emitting regions LR1 at the same time, that is, one first display unit LU1 has one recess Re1, and one recess Re1 corresponds to a plurality of first light-emitting regions LR1 at the same time. The main difference between the recess Re1 in example (iii) and that in example (ii) is that the recess Re1 has a circular top view pattern. In example (iv), the recesses Re1 and Re1' corresponding to the first display unit LU1 may have different shapes, where each recess Re1 is circular and exposes one first light-emitting region LR1, while the recess Re1' may be irregular and expose a plurality of first light-emitting regions LR1 at the same time. The second display unit LU2 has a similar design, corresponding to two recesses Re2 and an open recess Re2'. Example (v) mainly shows that the recess Re1 on the first display unit LU1 and the recess Re2 on the second display unit LU2 may have different designs. For example, the recess Re1 may be similar to example (ii), and the recess Re2 may be similar to example (i), but not limited thereto. The shapes of the recesses Re1 and Re2 invented in examples (i) to (iv) and the first embodiment can be arbitrarily selected and combined with each other.

[0042] Please refer to Figure 8 and Figure 9 , Figure 8 is a partial top view schematic diagram of the sixth embodiment of the electronic device of the present invention before and after stretching, Figure 9 is Figure 8 a schematic cross-sectional view of the electronic device shown before and after stretching. A partial top view schematic diagram of the variation embodiment of the recess in the elastic layer. As Figure 8 shown, before stretching or in the unstretched state, the connection region CR of the display device 100 may have a minimum width W1 along the direction D2. When the connection region CR of the display device 100 is stretched along the direction D1, the length of the connection region CR along the direction D1 may become larger, but the width after stretching may become narrower. For example, the minimum width W2 of the connection region CR after stretching is smaller than the minimum width W1 of the connection region CR before stretching. In this embodiment, the direction D1 and the direction D2 are perpendicular to each other, but not limited thereto. As Figure 9 shown, before stretching, the connection region CR may have a minimum thickness H1 (or height), and the minimum thickness H2 of the connection region CR after stretching may be smaller than the minimum thickness H1 of the connection region CR before stretching, but not limited thereto. The measurement of the aforementioned minimum thickness H1 (or width, height) is generally to compare the thickness (or width, height) before and after stretching at the same relative position far from the first display unit LU1 and the second display unit LU2. For example Figure 9The minimum thickness H1 before stretching and the minimum thickness H2 after stretching can be measured at the same position in the central region of the connection region CR and approximately equidistant from the first display unit LU1 and the second display unit LU2. In other words, in some embodiments, the display device 100 can be stretched along the direction D1, and the width and / or thickness of the portion of the elastic layer ELA located between the first display unit LU1 and the second display unit LU2 (i.e., the connection region CR) can be different before the display device 100 is stretched or deformed and after stretching or deformation. In some embodiments, the areas of the first display unit LU1 and the second display unit LU2 do not change before and after stretching, but the present invention is not limited thereto. In some embodiments, the first display unit LU1 and the second display unit LU2 can also be designed to have a changed area after stretching.

[0043] Please refer to Figure 10 , Figure 10 which is a partial top view schematic diagram of a variation embodiment of the elastic layer connection region of the electronic device of the present invention. In Figure 10 example (i), the connection region CR can have a smaller width along the direction D2. For example, its minimum width We1 can be smaller than the minimum width We2 of the portion of the elastic layer ELA corresponding to the first display unit LU1, and can also be smaller than the width of the first display unit LU1 in the direction D2. In Figure 10 example (ii), the connection region CR can have a flexed shape, such as the shape of the number "2" or the letter "Z", but is not limited thereto, and can also be presented as folded into an irregular shape. In Figure 10 example (iii), the connection region CR can have a flexed design such as serrated, lightning-shaped or zipper-shaped. When the connection region CR has a folded or flexed design, the shape of the connection region CR may also change when the display device 100 is stretched. As can be seen from the above, the connection region CR of the present invention can be various folded and unfolded shapes, not limited to Figure 10 the examples shown.

[0044] Please refer to Figure 11 , Figure 11 which is a partial top view schematic diagram of a variation embodiment of the wire of the electronic device of the present invention. In Figure 11In example (i), the wire 126 extends along the direction D1 in a straight pattern. In example (ii), the wire 126 can have a flexed shape, such as a serrated distribution. In example (iii), the wire 126 can have an opening 126a, which can have the effect of releasing stress and reducing the probability of the wire 126 breaking due to deformation. In example (iv), the connection region CR and the wire 126 can have corresponding serrated patterns, that is, one side edge CRS of the connection region CR is not a single straight line or a single smooth curve, but has multiple turns and is in a Z-shaped or zigzag or wavy shape. In example (v), the connection region CR can have a serrated pattern, and the wire 126 is distributed corresponding to the connection region CR and can have a wavy pattern. The wire 126 located at the connection region CR can also have an anti-disconnection design, such as the wire 126 can have an opening (such as the opening 126a in example (iii)), have a widened width, and have a multi-layer structure, etc. In addition, the wire 126 corresponding to the connection region CR can use a ductile metal material, such as but not limited to a nano-wire. The pattern and configuration design of the connection region CR and the wire 126 of the present invention are not limited to Figure 10 and Figure 11 as shown, and its shape and corresponding quantity can be changed as needed without exceeding the spirit and scope of the present invention. In some embodiments, the shape of the wire 126 can correspond or not correspond to the shape of the elastic layer ELA of the connection region CR. In one embodiment, the overall path of the wire 126 can be greater than the total length of one side edge CRS of the connection region CR to cope with the tensile deformation of the connection region CR and still maintain the function of transmitting electrical signals without breaking the wire.

[0045] Please refer to Figure 12 , Figure 12 which is a schematic flow chart of the first embodiment of the manufacturing method of the electronic device of the present invention. The manufacturing method of the electronic device ED of the present invention can include first providing a substrate SUB, and then forming a first control layer CI1 and a second control layer CI2 on the first surface SUBa of the substrate SUB, where there is a first trench 162 between the first control layer CI1 and the second control layer CI2, as shown in the process (S1). The first control layer CI1 and the second control layer CI2 can respectively include a light-emitting element LEU. When forming the first control layer CI1 and the second control layer CI2, it can also include forming at least one wire 126 in the first trench 162. And, before forming the first control layer CI1 and the second control layer CI2, the manufacturing method of the present invention can also include providing a support substrate 160 on the second surface SUBb of the substrate SUB. When the substrate SUB is a flexible substrate or a flexible substrate, the support substrate 160 can provide a supporting force during the process. Then please refer to Figure 12As shown in the manufacturing process (S2), an elastic material layer can be formed comprehensively on the substrate SUB, and then the elastic material layer is patterned to form the top elastic layer EL1. The top elastic layer EL1 covers a part of the first control layer CI1 and a part of the second control layer CI2, and covers the sidewalls of the first control layer CI1 and the second control layer CI2 and the bottom of the first trench 162 to form an upper notch 140. The top elastic layer EL1 has cavities Re1 and Re2, respectively exposing the first light-emitting region LR1 and the second light-emitting region LR2. Then, the support substrate 160 can be removed, that is, the support substrate 160 is separated from the lower side of the substrate SUB. Next, in the manufacturing process (S3), a second trench 164 is formed in the substrate SUB, for example, an etching step is performed from the lower side of the substrate SUB to remove a part of the substrate SUB, forming the second trench 164 and the mutually separated first substrate SU1 and second substrate SU2. The second trench 164 can correspond to the first trench 162. Then, a bottom elastic layer EL2 is formed on the second surface SUBb of the substrate SUB, covering the second surface SUBb of the substrate SUB and the second trench 164. The bottom elastic layer EL2 filled in the second trench 164 forms a lower notch 142 between the first substrate SU1 and the second substrate SU2. Before forming the second trench 164, another support substrate 166 can be adhered to the upper side of the top elastic layer EL1. The support substrate 166 can be selectively adhered to the top elastic layer EL1 and the surface of the light-emitting region with an adhesive layer. Please refer to the manufacturing process (S4). After the bottom elastic layer EL2 is manufactured, the support substrate 166 can be removed to complete the preliminary manufacturing of the electronic device ED.

[0046] Please refer to Figure 13 , Figure 13 FIG. is a schematic flow chart of the second embodiment of the manufacturing method of the electronic device of the present invention. As shown in the process (S1), the second embodiment of the manufacturing method of the electronic device ED of the present invention may include first providing a substrate SUB, and the substrate SUB may include a base 102, a buffer layer 104, and a buffer layer 106. Then, a patterning process is performed to remove a part of the buffer layer 106 to form a trench 168 in the buffer layer 106. Then, as shown in the process (S2), a first control layer CI1 and a second control layer CI2 are respectively formed on the remaining buffer layer 106, and there is a first trench 162 between the first control layer CI1 and the second control layer CI2. Next, as shown in the process (S3), a top elastic layer EL1 is formed on the first control layer CI1 and the second control layer CI2, covering the upper surfaces and sidewalls of the first control layer CI1 and the second control layer CI2 and the bottom of the first trench 162, that is, the surface of the buffer layer 104 exposed by the first trench 162. Then, as shown in the process (S4), a part of the buffer layer 104 and the base 102 can be removed to form a second trench 170, which corresponds to the first trench 162 and exposes the top elastic layer EL1 in the first trench 162.

[0047] Please refer to Figure 14 , Figure 14 which is a schematic flowchart of the third embodiment of the manufacturing method of the electronic device of the present invention. As shown in process (S1), the third embodiment of the manufacturing method of the electronic device of the present invention includes providing a substrate SUB and a bottom elastic layer EL2, where the bottom elastic layer EL2 is located on the second surface SUBb of the substrate SUB. In some embodiments, the bottom elastic layer EL2 and the substrate SUB may be sequentially formed on a support substrate 160, that is, the bottom elastic layer EL2 is located between the first support substrate 160 and the substrate SUB, but this is not limited thereto. Then, as shown in process (S2), a part of the substrate SUB may be removed to form a first trench 162 in the substrate SUB, and a separated first substrate SU1 and second substrate SU2 are formed. Then, a first control layer CI1 and a second control layer CI2 may be formed on the first surface SUBa of the substrate SUB, corresponding to the first substrate SU1 and the second substrate SU2 respectively. There is a first trench 162 between the first control layer CI1 and the second control layer CI2. When forming the first control layer CI1 and the second control layer CI2, it may also include forming at least one wire 126 in the first trench 162. Then, as shown in process (S3), a top elastic layer EL1 is formed on the substrate SUUB, covering the first control layer CI1, the second control layer CI2, and the first trench 162. Finally, as shown in process (S4), the support substrate 160 may be removed to complete the preliminary manufacturing of the electronic device ED of the present invention.

[0048] Please refer to Figure 15 and Figure 16 , Figure 15 which is a partial top view schematic diagram of another embodiment of the electronic device of the present invention, Figure 16 and Figure 15 is a schematic cross-sectional view of the electronic device shown along line segments A - B and C - D. As Figure 15 shown, the electronic device ED may include a plurality of first display units LU1 and a plurality of second display units LU2, adjacent to each other along directions D1 and D2 and arranged in an array. As Figure 16 shown, in the cross-sectional structure of line segment A - B, an elastic layer ELA may not be provided between the first display unit LU1 and the second display unit LU2, that is, there is an opening OP between the elastic layer ELA corresponding to the first display unit LU1 and the elastic layer ELA corresponding to the second display unit LU2. On the other hand, in the cross-sectional structure of line segment C - D, an elastic layer ELA may be provided between the first display unit LU1 and the second display unit LU2, that is, the elastic layer ELA connects the first display unit LU1 and the second display unit LU2. As can be seen from the above, in the display unit array, adjacent display units may be connected by the elastic layer ELA, or there may be an opening OP of the elastic layer ELA between the display units without the elastic layer ELA. In Figure 15In the illustrated embodiment, a display unit can be connected to four adjacent display units via an elastic layer ELA, and there may be no elastic layer ELA between it and another four adjacent display units. However, the present invention is not limited thereto, and the number of display units to which a display unit is connected and / or the size, shape, position, etc. of the opening OP can vary according to requirements. In some embodiments, the manufacturing method of the electronic device ED includes first forming a substrate SUB (such as including a buffer layer) and a control layer CIL (such as including film layers such as a circuit layer, a pixel definition layer 134, a light-emitting element LEU, and a protective layer 128, etc.) on a continuous elastic layer ELA, and then forming trenches 172 in the above-mentioned film layers by means of a lithography etching process, a laser process, or other suitable processes. Then, a functional layer 180 is formed on the protective layer 128 of the control layer CIL and patterned to complete the fabrication of the first display unit LU1 and the second display unit LU2. In other embodiments, the functional layer 180 can be directly fabricated continuously on the protective layer 128, and then the lithography etching process, the laser process, or other suitable processes are carried out, and trenches 172 are formed in the functional layer 180, the pixel definition layer 134, the circuit layer, and the substrate SUB in a single patterning step to fabricate the first display unit LU1 and the second display unit LU2. Then, an etching process (or other processes such as laser) can be carried out from the upper side and / or the lower side of the elastic layer ELA to remove the elastic layer ELA between the first display unit LU1 and the second display unit LU2 at the line segment A-B to form an opening OP.

[0049] According to the present invention, there may be an elastic layer between two adjacent display units (or working units) in an electronic device, which can be used as a connection area and used to connect these two adjacent but spaced-apart display units (or working units). When the electronic device is deformed (such as stretched), the connection area can be the main deformation area, which can be stretched or deformed as required to change the distance between adjacent display units (or working units), thereby changing the overall appearance of the electronic device. The elastic layer can have a completely overlapping or partially overlapping part with the display unit (or working unit), and the elastic layer can have a cavity at the light-emitting area (or working area) corresponding to the display unit (or working unit). For example, the cavity has a thinner thickness or directly exposes the surface of the light-emitting area (or working area), reducing the influence of the elastic layer on the optical performance of the light-emitting area (or the electromagnetic wave performance of the working area).

[0050] The above description is only for the embodiments of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. As long as the features between the embodiments do not violate the spirit of the invention or conflict with each other, they can be arbitrarily mixed and used. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A stretchable display device, characterized in that, Comprising: A first display unit, comprising: A first substrate; and A plurality of first light-emitting regions, arranged on the first substrate and arranged in a direction; A second display unit, arranged in the direction with the first display unit, comprising: A second substrate; and A plurality of second light-emitting regions, arranged on the second substrate; and An elastic layer, connecting the first display unit and the second display unit; Wherein, before the stretchable display device is stretched in the direction, one of the plurality of first light-emitting regions and one of the plurality of second light-emitting regions have a first distance in the direction, and two adjacent ones of the plurality of first light-emitting regions have a second distance in the direction. After the stretchable display device is stretched in the direction, the one of the plurality of first light-emitting regions and the one of the plurality of second light-emitting regions have a third distance in the direction, and there is a fourth distance between the two adjacent ones of the plurality of first light-emitting regions; Wherein, the difference between the first distance and the third distance is greater than the difference between the second distance and the fourth distance.

2. The stretchable display device according to claim 1, wherein The first substrate and the second substrate include hard structures.

3. The stretchable display device according to claim 1, wherein, There is at least one first groove between the first display unit and the second display unit.

4. The stretchable display device according to claim 1, wherein The elastic layer contacts the upper surface of the first display unit and has a cavity. In the top view of the stretchable display device, the side wall of the cavity surrounds the plurality of first light-emitting regions.

5. The stretchable display device according to claim 1, wherein, There is at least one second groove between the first display unit and the second display unit.

6. The stretchable display device according to claim 1, wherein The lower surface of the first display unit has a rough structure.

7. The stretchable display device according to claim 6, wherein The rough structure is covered by the elastic layer.

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