Loudspeaker module, control method and electronic equipment

Abstract

The invention discloses a loudspeaker module, a control method and electronic equipment, and belongs to the field of loudspeakers. The loudspeaker module comprises a loudspeaker, a shell and a deformation assembly, a sound outlet hole is formed in the shell, the shell is provided with an opening, the loudspeaker is arranged at the opening and seals the opening, the deformation assembly is connected to the shell, a sound cavity is defined by the deformation assembly, the loudspeaker and at least part of the inner wall of the shell, and the sound outlet hole is communicated with the sound cavity; and under the condition that the loudspeaker makes a sound, the deformation assembly deforms, so that the volume of the sound cavity is changed.

Description

Technical Field

[0001] This application belongs to the field of speakers, and particularly relates to a speaker module, a control method, and an electronic device. Background Art

[0002] With the development of technology, electronic devices are increasingly widely used. Through electronic devices, images can be captured, videos can be watched, music can be listened to, etc. Generally, a speaker module is provided in an electronic device. The speaker module includes a speaker and a housing. The speaker is disposed in the housing, and through holes are provided on the housing for the sound emitted by the speaker to pass out through the through holes. However, in related technologies, the sound effect of the speaker module is poor. Summary of the Invention

[0003] The purpose of the embodiments of this application is to provide a speaker module, a control method, and an electronic device, which at least solve the problem of poor sound effect of the speaker module.

[0004] In a first aspect, the embodiments of this application provide a speaker module, which includes: a speaker, a housing, and a deformation component;

[0005] An sound outlet hole is provided on the housing. The housing has an opening. The speaker is disposed at the opening, and the speaker seals the opening. The deformation component is connected to the housing, and at least part of the inner wall of the deformation component, the speaker, and the housing encloses a sound cavity. The sound outlet hole communicates with the sound cavity;

[0006] When the speaker emits sound, the deformation component deforms to change the volume of the sound cavity.

[0007] In a second aspect, the embodiments of this application provide a control method for controlling the speaker module in any one of the first aspects above; the control method includes:

[0008] When the speaker emits sound, control the deformation component to deform to change the volume of the sound cavity.

[0009] In a third aspect, the embodiments of this application provide an electronic device, which includes a controller and the speaker module in any one of the first aspects above;

[0010] Both the deformation component and the speaker are electrically connected to the controller.

[0011] In a fourth aspect, the embodiments of this application provide a control device, which includes:

[0012] A control module for controlling the deformation component to deform to change the volume of the sound cavity when the speaker emits sound.

[0013] Fifth aspect, an embodiment of the present application provides an electronic device, which includes a processor and a memory. The memory stores a program or instructions that can run on the processor. When the program or instructions are executed by the processor, the steps of the method in the second aspect are implemented.

[0014] Sixth aspect, an embodiment of the present application provides a readable storage medium, on which a program or instructions are stored. When the program or instructions are executed by a processor, the steps of the method in the second aspect are implemented.

[0015] Seventh aspect, an embodiment of the present application provides a chip, which includes a processor and a communication interface. The communication interface is coupled to the processor, and the processor is used to run a program or instructions to implement the method in the second aspect.

[0016] Eighth aspect, an embodiment of the present application provides a computer program product, which is stored in a storage medium and is executed by at least one processor to implement the method in the second aspect.

[0017] Since the housing is provided with sound outlet holes, the housing has an opening, the speaker is arranged at the opening, and the speaker seals the opening, and the deformation component is connected to the housing. Therefore, it is equivalent to that at least part of the inner wall of the deformation component, the speaker and the housing enclose to form a sound cavity, and the sound outlet holes are communicated with the sound cavity. Thus, once the speaker emits sound, the sound can propagate in the sound cavity and be transmitted out through the sound outlet holes. When the speaker emits sound, the deformation component can be deformed, so that the volume of the sound cavity can be changed. Furthermore, the changed sound cavity can resonate with the sound emitted by the speaker, improving the audible loudness of the sound transmitted out through the sound outlet holes, and further improving the sound emission effect of the speaker module. That is to say, in the embodiment of the present application, by arranging the deformation component and making at least part of the inner wall of the deformation component, the speaker and the housing enclose to form a sound cavity, when the speaker emits sound, the deformation component is deformed, so that the volume of the sound cavity can be changed. By adjusting the deformation of the deformation component, resonance between the changed sound cavity and the sound of the speaker can be achieved, improving the audible loudness of the sound transmitted through the sound outlet holes, and further improving the sound emission effect of the speaker module. Description of the Drawings

[0018] Figure 1 One of the schematic diagrams showing a speaker module provided by an embodiment of the present application;

[0019] Figure 2 Another schematic diagram showing a speaker module provided by an embodiment of the present application;

[0020] Figure 3 The flowchart showing a control method provided by an embodiment of the present application;

[0021] Figure 4Schematic diagram of a sound wave provided by an embodiment of the present application;

[0022] Figure 5 Schematic diagram of the frequency response curve of a speaker module with a sound cavity in an electronic device provided by an embodiment of the present application;

[0023] Figure 6 Schematic diagram of a control device provided by an embodiment of the present application;

[0024] Figure 7 Schematic diagram of an electronic device provided by an embodiment of the present application;

[0025] Figure 8 Schematic diagram of the hardware structure of an electronic device provided by an embodiment of the present application.

[0026] Reference numerals:

[0027] 10: Speaker; 20: Housing; 21: First sub-housing; 22: Second sub-housing; 201: Sound outlet hole; 202: Sound cavity; 30: Deformation component; 31: First electromagnetic component; 32: Elastic member; 33: Second electromagnetic component. Detailed implementation manners

[0028] The terms "first" and "second" in the description and claims of the present application may explicitly or implicitly include one or more of such features. In the description of the present application, unless otherwise specified, the meaning of "a plurality" is two or more. In addition, "and / or" in the description and claims means at least one of the connected objects, and the character " / " generally means an "or" relationship between the associated objects before and after.

[0029] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present application.

[0030] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0031] like Figures 1 to 2 As shown, the speaker module includes: a speaker 10 , a housing 20 and a deformation component 30 .

[0032] A sound outlet hole 201 is provided on the shell 20, and the shell 20 has an opening. The speaker 10 is provided at the opening, and the speaker 10 seals the opening. The deformation component 30 is connected to the shell 20, and the deformation component 30, the speaker 10 and at least part of the inner wall of the shell 20 enclose a sound cavity 202, and the sound outlet hole 201 is connected to the sound cavity 202; when the speaker 10 makes a sound, the deformation component 30 is deformed to change the volume of the sound cavity 202.

[0033] Since the shell 20 is provided with a sound outlet hole 201, the shell 20 has an opening, the speaker 10 is arranged at the opening, and the speaker 10 seals the opening, and the deformation component 30 is connected to the shell 20, it is equivalent to that the deformation component 30, the speaker 10 and at least part of the inner wall of the shell 20 enclose a sound cavity 202, and the sound outlet hole 201 is connected with the sound cavity 202, so that once the speaker 10 makes a sound, the sound can propagate in the sound cavity 202 and be transmitted from the sound outlet hole 201, and when the speaker 10 makes a sound, the deformation component 30 can be deformed, so that the volume of the sound cavity 202 can be changed, and then the changed sound cavity 202 can resonate with the sound emitted by the speaker 10, so that the audible loudness of the sound transmitted from the sound outlet hole 201 is improved, and then the sound effect of the speaker module is improved. That is, in the embodiment of the present application, a deformation component 30 is provided, and the deformation component 30, the loudspeaker 10, and at least a portion of the inner wall of the shell 20 are enclosed to form a sound cavity 202, so that when the loudspeaker 10 makes a sound, the deformation component 30 is deformed, and the volume of the sound cavity 202 can be changed. By adjusting the deformation of the deformation component 30, the sound resonance of the changed sound cavity 202 and the loudspeaker 10 can be achieved, thereby improving the audible loudness of the sound transmitted by the sound outlet 201, and thereby improving the sound effect of the speaker module.

[0034] It should be noted that in the embodiments of the present application, by providing the deformation component 30, and at least a part of the inner wall of the deformation component 30, the speaker 10, and the housing 20 enclose to form the sound cavity 202. Thus, once the deformation component 30 deforms, it is equivalent to deforming a part of the components forming the sound cavity 202, so that the volume of the sound cavity 202 will change. Furthermore, by adjusting the deformation amount of the deformation component 30, the sound cavity 202 after the volume change can resonate with the sound of the speaker 10, improving the sound effect of the speaker module.

[0035] In addition, in the embodiments of the present application, the housing 20 is formed of a non-deformable material, that is, the housing 20 is non-deformable. For example, the housing 20 is formed of a metal material, or for another example, the housing 20 is formed of a hard plastic.

[0036] Next, a specific description will be made on the principle that the deformation component 30 provided in the embodiments of the present application adjusts the volume of the sound cavity 202 to improve the sound effect of the speaker module;

[0037] According to the acoustic principle, the air in the sound cavity 202 and the small channels through which the speaker 10 emits sound form a resonator. It can be seen from this that the sound cavity 202 of the speaker 10 is a simple filter, and only the sound waves near this frequency can resonate due to the cavity resonance, greatly enhancing the energy level. In the embodiments of the present application, by deforming the deformation component 30, the volume of the sound cavity 202 is adjusted, and then the air compliance is changed, so that the resonance frequency of the sound cavity 202 changes. Furthermore, the sound cavity 202 can resonate with the sound of the speaker 10, improving the sound effect of the speaker module.

[0038] In addition, in the embodiments of the present application, the speaker 10 can be a parametric array speaker 10. Among them, the parametric array speaker 10 is a high-directivity sound source, and its working principle is to modulate the audio signal onto the ultrasonic carrier wave, and utilize the nonlinear effect of the air. During the forward movement of the ultrasonic wave, it continuously demodulates itself, generating an audio virtual sound source, and finally generating an audio sound with strong directivity. Compared with an ordinary speaker 10, the parametric array speaker 10 can generate a high-directivity low-frequency sound with a small aperture. For example, when the parametric array speaker 10 emits a sound wave of 100 kHz and 101 kHz, through the nonlinear demodulation of the air in the sound cavity 202, the user can hear the difference-frequency sound wave of the two ultrasonic frequencies, that is, a sound wave of 1 kHz. That is, when it is required that the speaker module emits a 1 kHz sound wave so that the user hears a 1 kHz sound wave, the frequency of the first carrier wave transmitted to the parametric array speaker 10 is 1 kHz. Thus, the parametric array speaker 10 can simultaneously emit sound waves of 100 kHz and 101 kHz, and through the nonlinear demodulation of the air in the sound cavity 202, the user can hear the difference-frequency sound wave of the sound waves of 101 kHz and 100 kHz, that is, the user hears a 1 kHz sound wave.

[0039] Of course, in the embodiments of the present application, the speaker 10 may also be other types of speakers 10, and the present application does not limit the specific type of the speaker 10.

[0040] In addition, in some embodiments, as Figure 1 shown, the deformation component 30 is located inside the housing 20, and the deformation component 30 is connected to the inner wall of the housing 20; the deformation component 30, the part of the inner wall of the housing 20 that is not connected to the deformation component 30, and the speaker 10 enclose to form a sound cavity 202.

[0041] Since the deformation component 30 is located inside the housing 20 and the deformation component 30 is connected to the inner wall of the housing 20, therefore, it is equivalent to that the deformation component 30, the part of the inner wall of the housing 20 that is not connected to the deformation component 30, and the speaker 10 enclose to form a sound cavity 202. At this time, once the deformation component 30 deforms, the volume of the sound cavity 202 can be directly changed. That is, by connecting the deformation component 30 to the inner wall of the housing 20, it is convenient to adjust the volume of the sound cavity 202, so that after the volume changes, the sound cavity 202 can resonate with the sound of the speaker 10, improving the sound effect of the speaker module.

[0042] It should be noted that the deformation component 30 can be bonded to the inner wall of the housing 20. Of course, the deformation component 30 can also be connected to the inner wall of the housing 20 in other ways. For example, the deformation component 30 is connected to the inner wall of the housing 20 through a connecting member. For another example, the deformation component 30 is welded to the inner wall of the housing 20. In this regard, the embodiments of the present application do not limit this here.

[0043] In addition, in the embodiments of the present application, the deformation component 30 includes at least one of an electroactive polymer and a deformable gas container.

[0044] When the deformation component 30 includes an electroactive polymer, the electroactive polymer can be fixed on the inner wall of the housing 20. When the speaker 10 component emits sound, a current can be applied to the electroactive polymer to cause the shape of the electroactive polymer to change. Once the shape of the electroactive polymer changes, the volume of the sound cavity 202 can be changed; when the deformation component 30 includes a deformable gas container, the deformable gas container can be connected to the inner wall of the housing 20. When the speaker 10 component emits sound, gas can be filled into the deformable gas container to increase the volume of the deformable gas container and adjust the volume of the sound cavity 202, or the gas contained in the deformable gas can be released to reduce the volume of the deformable gas container and adjust the volume of the sound cavity 202.

[0045] It should be noted that the deformation component 30 may only include an electro-deformable member. In this case, only the electro-deformable member can be fixed to the inner wall of the housing 20. Of course, the deformation component 30 may also only include a gas container. In this case, only the deformable gas container can be connected to the inner wall of the housing 20. The deformation component 30 may also include a combination of an electro-deformable member and a deformable gas container, that is, both the electro-deformable member and the deformable gas container are connected to the inner wall of the housing 20. Among them, the deformable gas container may be an airbag.

[0046] In addition, in some embodiments, as Figure 2 shown, the housing 20 includes a first sub-housing 21 and a second sub-housing 22; the first sub-housing 21 and the second sub-housing 22 are spaced apart from the body 20, the opening is provided in the first sub-housing 21, the speaker 10 is provided at the opening of the first sub-housing 21, the first sub-housing 21 and the second sub-housing 22 are connected by the deformation component 30, and the sound outlet hole 201 is provided in the first sub-housing 21 or the second sub-housing 22; the inner wall of the first sub-housing 21, the inner wall of the second sub-housing 22, the deformation component 30, and the speaker 10 enclose a sound cavity 202.

[0047] Since the first sub-housing 21 and the second sub-housing 22 are spaced apart from the body 20 and the first sub-housing 21 and the second sub-housing 22 are connected by the deformation component 30, therefore, it is equivalent to that the inner wall of the first sub-housing 21, the inner wall of the second sub-housing 22, the deformation component 30, and the speaker 10 enclose the sound cavity 202. Thus, once the deformation component 30 deforms, the relative positions of the first sub-housing 21 and the second sub-housing 22 can be changed, and further the volume of the sound cavity 202 can be changed. That is, by setting the first sub-housing 21 and the second sub-housing 22 to be connected by the deformation component 30, the volume change of the sound cavity 202 can be facilitated when the deformation component 30 deforms.

[0048] In addition, in some embodiments, the deformation component 30 includes a first electromagnetic member 31, an elastic member 32, and a second electromagnetic member 33; the first end of the elastic member 32 is connected to the first electromagnetic member 31, the second end of the elastic member 32 is connected to the second electromagnetic member 33, the first electromagnetic member 31 is connected to the first sub-housing 21, and the second electromagnetic member 33 is connected to the second sub-housing 22; the inner wall of the first sub-housing 21, the inner wall of the second sub-housing 22, the first electromagnetic member 31, the elastic member 32, the second electromagnetic member 33, and the speaker 10 enclose a sound cavity 202; when the first electromagnetic member 31 and the second electromagnetic member 33 are energized, the first electromagnetic member 31 and the second electromagnetic member 33 approach or move away from each other, causing the elastic member 32 to deform, so as to change the volume of the sound cavity 202.

[0049] Since the first end of the elastic member 32 is connected to the first electromagnetic member 31, the second end of the elastic member 32 is connected to the second electromagnetic member 33, the first electromagnetic member 31 is connected to the first sub-shell 21, and the second electromagnetic member 33 is connected to the second sub-shell 22. Therefore, it is equivalent that the inner wall of the first sub-shell 21, the inner wall of the second sub-shell 22, the first electromagnetic member 31, the elastic member 32, the second electromagnetic member 33, and the speaker 10 enclose to form a sound cavity 202. And once the first electromagnetic member 31 and the second electromagnetic member 33 are powered on, the first electromagnetic member 31 and the second electromagnetic member 33 can attract each other or repel each other. When the first electromagnetic member 31 and the second electromagnetic member 33 attract each other, the first electromagnetic member 31 and the second electromagnetic member 33 can approach each other, thereby deforming the elastic member 32, and the first sub-shell 21 and the second sub-shell 22 approach each other, causing the volume of the sound cavity 202 to change. When the first electromagnetic member 31 and the second electromagnetic member 33 repel each other, the first electromagnetic member 31 and the second electromagnetic member 33 can move away from each other, thereby deforming the elastic member 32, and the first sub-shell 21 and the second sub-shell 22 move away from each other, causing the volume of the sound cavity 202 to change. That is, by providing the first electromagnetic member 31, the elastic member 32, and the second electromagnetic member 33, it is convenient to adjust the volume of the sound cavity 202.

[0050] It should be noted that the first electromagnetic member 31 can be bonded to the first sub-shell 21, the second electromagnetic member 33 can be bonded to the second sub-shell 22, the first end of the elastic member 32 can be bonded to the first electromagnetic member 31, and the second end of the elastic member 32 can be bonded to the second electromagnetic member 33.

[0051] Since the housing 20 is provided with a sound outlet hole 201, the housing 20 has an opening. The speaker 10 is disposed at the opening, and the speaker 10 seals the opening. The deformation assembly 30 is connected to the housing 20. Therefore, it is equivalent that at least part of the inner walls of the deformation assembly 30, the speaker 10, and the housing 20 enclose to form a sound cavity 202, and the sound outlet hole 201 communicates with the sound cavity 202. Thus, once the speaker 10 emits sound, the sound can propagate in the sound cavity 202 and be transmitted out from the sound outlet hole 201. When the speaker 10 emits sound, the deformation assembly 30 can be deformed, so that the volume of the sound cavity 202 can change. Furthermore, the changed sound cavity 202 can resonate with the sound emitted by the speaker 10, improving the audible loudness of the sound transmitted from the sound outlet hole 201, and further improving the sound generation effect of the speaker module. That is to say, in the embodiment of the present application, by providing the deformation assembly 30 and making at least part of the inner walls of the deformation assembly 30, the speaker 10, and the housing 20 enclose to form a sound cavity 202, when the speaker 10 emits sound, the deformation assembly 30 is deformed, so that the volume of the sound cavity 202 can change. By adjusting the deformation of the deformation assembly 30, resonance between the changed sound cavity 202 and the sound of the speaker 10 can be realized, improving the audible loudness of the sound transmitted through the sound outlet hole 201, and further improving the sound generation effect of the speaker module.

[0052] The embodiment of the present application provides a control method for controlling the speaker module in any one of the above embodiments; as Figure 3 shown, the control method includes:

[0053] Step 301: When the speaker emits sound, control the deformation assembly to deform so as to change the volume of the sound cavity.

[0054] In some implementation manners, the implementation manner of step 301 may be: determining the first phase of the first carrier wave for controlling the speaker to emit sound, and determining the second phase of the second carrier wave emitted by the speaker; based on the first phase and the second phase, controlling the deformation assembly to deform so as to change the volume of the sound cavity.

[0055] Among them, when it is necessary for the speaker to emit sound, a first carrier wave needs to be sent to the speaker. The first carrier wave is essentially an electrical signal, and the electrical signal is essentially a waveform. Thus, the first phase of the first carrier wave can be determined. After the speaker receives the first carrier wave, the speaker will emit a carrier wave, that is, the speaker will emit a corresponding carrier wave according to the first carrier wave, and the second phase of the second carrier wave can be directly determined. Once the first phase and the second phase are determined, the deformation assembly can be controlled to deform according to the first phase and the second phase, so that the volume of the sound cavity changes.

[0056] For example, as Figure 4 shown, the first carrier wave is a sine wave signal.

[0057] In addition, Figure 5 is a schematic diagram of the frequency response curve of a speaker module with a sound cavity in an electronic device. As Figure 5 shown, it can be seen that due to the presence of the sound cavity at 6 - 7 kHz, a resonance peak will appear, and the sound pressure level in the nearby frequency band will increase significantly by 15 - 20 dB.

[0058] In addition, in the embodiments of the present application, the first carrier wave is the carrier wave that controls the speaker to emit sound, and the frequency of the first carrier wave is actually the frequency of the sound that the user needs to hear. The second carrier wave is the carrier wave actually emitted by the speaker. Among them, the speaker is a parametric array speaker. Thus, the speaker will emit two carrier waves with different frequencies, and the difference between the frequencies of the two carrier waves is equal to the frequency of the first carrier wave. The difference between the two frequencies emitted by the speaker is the frequency of the sound that the user hears. For example, when it is required that the parametric array speaker module emits a 1 kHz sound wave so that the user hears a 1 kHz sound wave, at this time, the frequency of the first carrier wave transmitted to the parametric array speaker is 1 kHz. Thus, the parametric array speaker can simultaneously emit 100 kHz and 101 kHz sound waves. Through the non - linear demodulation of the air in the sound cavity 202, the user can hear the difference - frequency sound wave of the 101 kHz and 100 kHz sound waves, that is, the user hears a 1 kHz sound wave.

[0059] In addition, in some embodiments, based on the first phase and the second phase, the implementation manner of controlling the deformation component to deform can be: when the first phase is the same as the second phase, control the shape of the deformation component to be the first shape, and the resonance frequency of the sound cavity is the same as the frequency of the second carrier wave; when the first phase is different from the second phase, control the shape of the deformation component to be the second shape, and the resonance frequency of the sound cavity is different from the frequency of the second carrier wave.

[0060] Among them, when the first phase is the same as the second phase, at this time, when the first carrier is modulated with the second carrier of the speaker, the resonance of the carrier can be enhanced, and the shape of the deformable component is the first shape. At this time, the resonant frequency of the sound cavity is the same as the frequency of the second carrier, which is conducive to the transmission of the second carrier in the sound cavity, and the second carrier is enhanced when it is transmitted in the sound cavity, which is conducive to the user hearing the sound. Among them, when the first phase is the same as the second phase, the deformable component can be controlled to remain unchanged, so that the shape of the control component is the first shape, so that the volume of the sound cavity remains unchanged. Of course, the deformable component can also be controlled to deform into the first shape, that is, the volume of the sound cavity changes, so that the resonance effect is further enhanced, and the sound effect of the speaker module is further improved; when the first phase is different from the second phase, at this time, when the first carrier is modulated with the second carrier of the speaker, the resonance of the carrier can be weakened, and the shape of the deformable component is the second shape. At this time, the resonant frequency of the sound cavity is different from the frequency of the second carrier, and the user is prevented from hearing the sound transmitted from the sound cavity as much as possible. When the first phase is different from the second phase, the deformation component can be controlled to deform into the second shape, so that the resonance frequency of the sound cavity and the carrier resonance changes, the sound wave is weakened, and the problem of poor sound quality caused by different phases is avoided.

[0061] Among them, when the deformation component includes a first electromagnetic component, an elastic component and a second electromagnetic component; the first end of the elastic component is connected to the first electromagnetic component, the second end of the elastic component is connected to the second electromagnetic component, the first electromagnetic component is connected to the first subshell, and the second electromagnetic component is connected to the second subshell; the inner wall of the first subshell, the inner wall of the second subshell, the first electromagnetic component, the elastic component, the second electromagnetic component and the speaker enclose a sound cavity. At this time, when the first phase and the second phase are the same, power can be supplied to the first electromagnetic component and the second electromagnetic component, so that the first electromagnetic component and the second electromagnetic component attract or repel each other, thereby changing the shape of the elastic component, changing the distance between the first magnetic component and the second magnetic component, and then making the shape of the deformation component formed by the first electromagnetic component, the elastic component and the second electromagnetic component be the first shape, and the resonant frequency of the sound cavity is the same as the frequency of the second carrier; when the first phase and the second phase are different, power can also be supplied to the first electromagnetic component and the second electromagnetic component, so that the first electromagnetic component and the second electromagnetic component attract or repel each other, thereby changing the shape of the elastic component, changing the distance between the first magnetic component and the second magnetic component, and then making the shape of the deformation component formed by the first electromagnetic component, the elastic component and the second electromagnetic component be the second shape, and the resonant frequency of the sound cavity is different from the frequency of the second carrier.

[0062] In addition, when the deformation component is an electro-deformable member, the electro-deformable member can be located inside the housing, and the electro-deformable member is connected to the inner wall of the housing. The electro-deformable member, the part of the inner wall of the housing that is not connected to the electro-deformable member, and the speaker enclose to form a sound cavity. At this time, when the first phase is the same as the second phase, power can be supplied to the electro-deformable member to make the shape of the electro-deformable member become the first shape, and the resonance frequency of the sound cavity is the same as the frequency of the second carrier wave; when the first phase is different from the second phase, power can also be supplied to the electro-deformable member to make the shape of the electro-deformable member become the second shape, and the resonance frequency of the sound cavity is different from the frequency of the second carrier wave.

[0063] In addition, when the deformation component is a deformable gas container, the deformable gas container can be located inside the housing, and the deformable gas container is connected to the inner wall of the housing. The deformable gas container, the part of the inner wall of the housing that is not connected to the deformable gas container, and the speaker enclose to form a sound cavity. At this time, when the first phase is the same as the second phase, the deformable gas container can be inflated or the gas in the deformable gas container can be discharged to make the shape of the deformable gas container become the first shape, and the resonance frequency of the sound cavity is the same as the frequency of the second carrier wave; when the first phase is different from the second phase, the deformable gas container can also be inflated or the gas in the deformable gas container can be discharged to make the deformable gas container become the second shape, and the resonance frequency of the sound cavity is different from the frequency of the second carrier wave.

[0064] In addition, in the embodiments of the present application, the speaker is a parametric array speaker, the second carrier wave includes a first sub-carrier wave and a second sub-carrier wave, the frequency of the first sub-carrier wave is different from the frequency of the second sub-carrier wave, and the frequencies of the first sub-carrier wave and the second sub-carrier wave are both greater than the frequency of the first carrier wave. Wherein, the difference between the frequency of the first sub-carrier wave and the frequency of the second sub-carrier wave is equal to the frequency of the first carrier wave.

[0065] In addition, in some implementation manners, the first phase of the first carrier wave includes a positive phase and a negative phase, and the phase of the first sub-carrier wave includes a positive phase and a negative phase; then when the first phase is the same as the second phase, the implementation manner of controlling the shape of the deformation component to be the first shape can be: when the first phase of the first carrier wave is the positive phase and the phase of the first sub-carrier wave is the positive phase, controlling the shape of the deformation component to be the first shape; when the first phase of the first carrier wave is the negative phase and the phase of the first sub-carrier wave is the negative phase, controlling the shape of the deformation component to be the first shape.

[0066] Among them, in the embodiments of the present application, the phase of the second sub-carrier includes a positive phase and a negative phase. When the first phase is the same as the second phase, the implementation manner of controlling the shape of the deformation component to be the first shape can be: when the first phase of the first carrier is a positive phase, the phase of the first sub-carrier is a positive phase, and the phase of the second sub-carrier is a positive phase, controlling the shape of the deformation component to be the first shape; when the first phase of the first carrier is a negative phase, the phase of the first sub-carrier is a negative phase, and the phase of the second sub-carrier is a negative phase, controlling the shape of the deformation component to be the first shape.

[0067] In addition, in some implementation manners, the first phase of the first carrier includes a positive phase and a negative phase, and the phase of the first sub-carrier includes a positive phase and a negative phase. When the first phase is different from the second phase, the implementation manner of controlling the shape of the deformation component to be the second shape can be: when the first phase of the first carrier is a positive phase and the phase of the first sub-carrier is a negative phase, controlling the shape of the deformation component to be the second shape; when the first phase of the first carrier is a negative phase and the phase of the first sub-carrier is a positive phase, controlling the shape of the deformation component to be the second shape.

[0068] Among them, in the embodiments of the present application, the phase of the second sub-carrier includes a positive phase and a negative phase. When the first phase is different from the second phase, the implementation manner of controlling the shape of the deformation component to be the second shape can be: when the first phase of the first carrier is a positive phase, the phase of the first sub-carrier is a negative phase, and the phase of the second sub-carrier is a negative phase, controlling the shape of the deformation component to be the second shape; when the first phase of the first carrier is a negative phase, the phase of the first sub-carrier is a positive phase, and the phase of the second sub-carrier is a positive phase, controlling the shape of the deformation component to be the first shape.

[0069] For example, assume that it is required to make the speaker module emit a single-frequency sine wave signal of 200 Hz. According to the formula T = 1 / f, its one fluctuation period is 5 ms. Among them, it is assumed that the first 2.5 ms will cause the positive-phase vibration of the air in the sound cavity, and the latter 2.5 ms will cause the negative-phase vibration of the air in the sound cavity. As Figure 4 shown, it is an example of one period of the 200 Hz sine wave signal.

[0070] When the speaker is a parametric array speaker, assume that the user needs to hear a sound of 200 Hz, that is, the frequency of the first carrier wave is 200 Hz. Assume that the parametric array speaker emits sound waves of 200.2 kHz and 200 kHz. That is, at time t0, the parametric array speaker emits sound waves of 200.2 kHz and 200 kHz simultaneously. The difference frequency between these two frequencies is 200 Hz, and it will gradually emerge due to the nonlinearity of the air and be heard by the user. The half-period of the 200 kHz sound wave is 2.5 μs, that is, the propagation time of half of the wavelength of the 200 kHz sound wave is 2.5 μs. Therefore, the half-period of 200 Hz, which is 2.5 ms, contains 1000 half-periods of the 200 kHz sound wave, among which 500 are positive-phase half-period signals and 500 are negative-phase half-period signals. That is, within the positive-phase half-period of 200 Hz, there are 500 positive-phase half-period signals and 500 negative-phase half-period signals of the 200 kHz sound wave. Therefore, when the 500 positive-phase half-period signals of the 200 kHz sound wave are propagating, controlling the deformation component to remain unchanged or controlling the shape of the deformation component to be the first shape can enable the positive-phase sound wave to pass through the sound outlet smoothly, and because the phases are the same, resonance will occur, greatly improving the audible loudness of the sound transmitted from the sound outlet. When the 500 negative-phase half-period signals of the 200 kHz sound wave are propagating, controlling the shape of the deformation component to be the second shape makes the resonance frequency of the sound wave in the sound cavity deviate greatly from 200 kHz, such as becoming lower than 150 kHz or higher than 250 kHz. Although the negative-phase sound wave can still radiate outward through the sound outlet, the energy will be 15 - 20 dB lower than that of the positive-phase sound wave, avoiding the problem of poor sound quality that may occur. Similarly, within the positive-phase half-period of 200 Hz, there are 500 positive-phase half-period signals and 500 negative-phase half-period signals of the 200 kHz sound wave. Therefore, when the 500 positive-phase half-period signals of the 200 kHz sound wave are propagating, controlling the shape of the deformation component to be the second shape makes the resonance frequency of the sound wave in the sound cavity deviate greatly from 200 kHz, such as becoming lower than 150 kHz or higher than 250 kHz. Although the negative-phase sound wave can still radiate outward through the sound outlet, the energy will be 15 - 20 dB lower than that of the positive-phase sound wave, avoiding the problem of poor sound quality that may occur. When the 500 negative-phase half-period signals of the 200 kHz sound wave are propagating, controlling the deformation component to remain unchanged or controlling the shape of the deformation component to be the first shape can enable the negative-phase sound wave to pass through the sound outlet smoothly, and because the phases are the same, resonance will occur, greatly improving the audible loudness of the sound transmitted from the sound outlet. Among them, the parametric speaker emits 200.2 kHz and 200 kHz simultaneously, so the phases of the sound waves of 200.2 kHz and 200 kHz are the same, that is, the sound waves of 200.2 kHz and 200 kHz are both in the positive phase or both in the negative phase at the same time.

[0071] In the embodiments of the present application, when the speaker emits sound, the deformation component is deformed, so that the volume of the sound cavity can be changed. By adjusting the deformation of the deformation component, resonance between the changed sound cavity and the sound of the speaker can be achieved, the audible loudness of the sound transmitted through the sound outlet hole can be improved, and further the sound emission effect of the speaker module can be improved.

[0072] An embodiment of the present application provides an electronic device, which includes a controller and the speaker module in any one of the above embodiments; both the deformation component and the speaker are electrically connected to the controller.

[0073] Among them, the controller can control the deformation component and the speaker, that is, when the controller controls the speaker to emit sound, it can control the deformation component to deform to change the volume of the sound cavity.

[0074] An embodiment of the present application provides a control module 600, as Figure 6 shown, the control module 600 includes:

[0075] A control module 601, configured to deform the deformation component when the speaker emits sound, so that the volume of the sound cavity changes.

[0076] Optionally, the control module 600 is further configured to:

[0077] Determine the first phase of the first carrier for controlling the speaker to emit sound, and determine the second phase of the carrier wave emitted by the speaker;

[0078] Based on the first phase and the second phase, control the deformation component to deform, so that the volume of the sound cavity changes.

[0079] Optionally, the control module 600 is further configured to:

[0080] When the first phase is the same as the second phase, control the shape of the deformation component to be the first shape, and the resonance frequency of the sound cavity is the same as the frequency of the second carrier wave;

[0081] When the first phase is different from the second phase, control the shape of the deformation component to be the second shape, and the resonance frequency of the sound cavity is different from the frequency of the second carrier wave.

[0082] Optionally, the speaker is a parametric array speaker, the second carrier wave includes a first sub-carrier wave and a second sub-carrier wave, the frequency of the first sub-carrier wave is different from the frequency of the second sub-carrier wave, and the frequencies of both the first sub-carrier wave and the second sub-carrier wave are greater than the frequency of the first carrier wave.

[0083] Optionally, the first phase of the first carrier wave includes a positive phase and a negative phase, and the phase of the first sub-carrier wave includes a positive phase and a negative phase; the control module 600 is further configured to:

[0084] When the first phase of the first carrier is a positive phase and the phase of the first sub-carrier is a positive phase, control the shape of the deformation component to be the first shape;

[0085] When the first phase of the first carrier is a negative phase and the phase of the first sub-carrier is a negative phase, control the shape of the deformation component to be the first shape.

[0086] Optionally, the first phase of the first carrier includes a positive phase and a negative phase, and the phase of the first sub-carrier includes a positive phase and a negative phase; the control module 600 is further configured to:

[0087] When the first phase of the first carrier is a positive phase and the phase of the first sub-carrier is a negative phase, control the shape of the deformation component to be the second shape;

[0088] When the first phase of the first carrier is a negative phase and the phase of the first sub-carrier is a positive phase, control the shape of the deformation component to be the second shape.

[0089] In the embodiment of the present application, when the speaker emits sound, the deformation component is deformed, so that the volume of the sound cavity can be changed. By adjusting the deformation of the deformation component, the resonance between the changed sound cavity and the sound of the speaker can be realized, the audible loudness of the sound transmitted through the sound outlet can be improved, and thus the sound generation effect of the speaker module can be improved.

[0090] The control device 600 in the embodiment of the present application may be an electronic device or a component in an electronic device, such as an integrated circuit or a chip. The electronic device may be a terminal or other devices other than the terminal. Exemplarily, the electronic device may be a mobile phone, a tablet computer, a notebook computer, a handheld computer, a vehicle-mounted electronic device, a Mobile Internet Device (MID), an augmented reality (AR) / virtual reality (VR) device, a robot, a wearable device, an ultra-mobile personal computer (UMPC), a netbook or a personal digital assistant (PDA), etc., and may also be a server, a Network Attached Storage (NAS), a personal computer (PC), a television (TV), a teller machine or a self-service machine, etc. The embodiment of the present application does not make specific limitations.

[0091] The control device 600 in the embodiments of the present application may be a device with an operating system. The operating system may be the Android operating system, the iOS operating system, or other possible operating systems, which are not specifically limited in the embodiments of the present application.

[0092] The control device 600 provided by the embodiments of the present application can implement Figure 3 each process implemented by the method embodiments. To avoid repetition, details are not described herein again.

[0093] Optionally, as Figure 7 shown, the embodiments of the present application further provide an electronic device 700, including a processor 701 and a memory 702. A program or instruction that can run on the processor 701 is stored on the memory 702. When the program or instruction is executed by the processor 701, it implements each step of the above control method embodiment and can achieve the same technical effect. To avoid repetition, details are not described herein again.

[0094] It should be noted that the electronic devices in the embodiments of the present application include the above-mentioned mobile electronic devices and non-mobile electronic devices.

[0095] Figure 8 It is a schematic diagram of the hardware structure of an electronic device for implementing the embodiments of the present application.

[0096] The electronic device 100 includes but is not limited to: a radio frequency unit 101, a network module 102, an audio output unit 103, an input unit 104, a sensor 105, a display unit 106, a user input unit 107, an interface unit 108, a memory 109, and a processor 110, etc.

[0097] Those skilled in the art can understand that the electronic device 100 may further include a power source (such as a battery) for supplying power to each component. The power source can be logically connected to the processor 110 through a power management system, so as to implement functions such as management of charging, discharging, and power consumption management through the power management system. Figure 8 The structure of the electronic device shown in

[0098] does not constitute a limitation on the electronic device. The electronic device may include more or fewer components than shown, or combine certain components, or have different component arrangements, which are not described herein again.

[0099] Optionally, the processor 110 is further configured to: when the speaker emits sound, control the deformation component to deform, so as to change the volume of the sound cavity.

[0100] Based on the first phase and the second phase, control the deformation of the deformation component to change the volume of the sound cavity.

[0101] Optionally, the processor 110 is further configured to:

[0102] When the first phase is the same as the second phase, control the shape of the deformation component to be the first shape, and the resonance frequency of the sound cavity is the same as the frequency of the second carrier wave;

[0103] When the first phase is different from the second phase, control the shape of the deformation component to be the second shape, and the resonance frequency of the sound cavity is different from the frequency of the second carrier wave.

[0104] Optionally, the speaker is a parametric array speaker, the second carrier wave includes a first sub-carrier wave and a second sub-carrier wave, the frequency of the first sub-carrier wave is different from the frequency of the second sub-carrier wave, and the frequencies of the first sub-carrier wave and the second sub-carrier wave are both greater than the frequency of the first carrier wave.

[0105] Optionally, the first phase of the first carrier wave includes a positive phase and a negative phase, and the phase of the first sub-carrier wave includes a positive phase and a negative phase; the processor 110 is further configured to:

[0106] When the first phase of the first carrier wave is the positive phase and the phase of the first sub-carrier wave is the positive phase, control the shape of the deformation component to be the first shape;

[0107] When the first phase of the first carrier wave is the negative phase and the phase of the first sub-carrier wave is the negative phase, control the shape of the deformation component to be the first shape.

[0108] Optionally, the first phase of the first carrier wave includes a positive phase and a negative phase, and the phase of the first sub-carrier wave includes a positive phase and a negative phase; the processor 110 is further configured to:

[0109] When the first phase of the first carrier wave is the positive phase and the phase of the first sub-carrier wave is the negative phase, control the shape of the deformation component to be the second shape;

[0110] When the first phase of the first carrier wave is the negative phase and the phase of the first sub-carrier wave is the positive phase, control the shape of the deformation component to be the second shape.

[0111] In the embodiment of the present application, by making the deformation component deform when the speaker emits sound, the volume of the sound cavity can be changed. By adjusting the deformation of the deformation component, the resonance between the changed sound cavity and the sound of the speaker can be realized, the audible loudness of the sound transmitted through the sound outlet hole can be improved, and thus the sound emission effect of the speaker module can be improved.

[0112] It should be understood that in the embodiments of the present application, the input unit 104 may include a Graphics Processing Unit (GPU) 1041 and a microphone 1042. The GPU 1041 processes the image data of static pictures or videos obtained by an image capturing device (such as a camera) in the video capturing mode or the image capturing mode. The display unit 106 may include a display panel 1061, and the display panel 1061 may be configured in the form of a liquid crystal display, an organic light emitting diode, etc. The user input unit 107 includes at least one of a touch panel 1071 and other input devices 1072. The touch panel 1071 is also called a touch screen. The touch panel 1071 may include two parts: a touch detection device and a touch controller. The other input devices 1072 may include, but are not limited to, a physical keyboard, function keys (such as volume control keys, switch keys, etc.), a trackball, a mouse, and a joystick, which will not be elaborated here.

[0113] The memory 109 can be used to store software programs and various data. The memory 109 mainly includes a first storage area for storing programs or instructions and a second storage area for storing data. Among them, the first storage area can store an operating system, applications or instructions required for at least one function (such as a sound playback function, an image playback function, etc.). In addition, the memory 109 can include volatile memory or non-volatile memory, or the memory 109 can include both volatile and non-volatile memory. Among them, the non-volatile memory can be a Read-Only Memory (ROM), a Programmable ROM (PROM), an Erasable PROM (EPROM), an Electrically Erasable PROM (EEPROM), or a flash memory. The volatile memory can be a Random Access Memory (RAM), a Static RAM (SRAM), a Dynamic RAM (DRAM), a Synchronous DRAM (SDRAM), a Double Data Rate SDRAM (DDR SDRAM), an Enhanced SDRAM (ESDRAM), a Synch link DRAM (SLDRAM), and a Direct Rambus RAM (DRRAM). The memory 109 in the embodiments of the present application includes, but is not limited to, these and any other suitable types of memory.

[0114] The processor 110 may include one or more processing units; optionally, the processor 110 integrates an application processor and a modem processor. Among them, the application processor mainly processes operations related to the operating system, user interface, application programs, etc., and the modem processor mainly processes wireless communication signals, such as a baseband processor. It can be understood that the above-mentioned modem processor may not be integrated into the processor 110 either.

[0115] The embodiment of the present application also provides a readable storage medium, on which a program or instruction is stored. When the program or instruction is executed by a processor, it implements each process of the above-mentioned control method embodiment and can achieve the same technical effect. To avoid repetition, it will not be elaborated here.

[0116] Among them, the processor is the processor in the electronic device in the above-mentioned embodiment. The readable storage medium includes a computer-readable storage medium, such as a computer read-only memory ROM, a random access memory RAM, a magnetic disk, or an optical disc, etc.

[0117] The embodiment of the present application further provides a chip, which includes a processor and a communication interface. The communication interface is coupled to the processor. The processor is used to run a program or instruction to implement each process of the above-mentioned control method embodiment and can achieve the same technical effect. To avoid repetition, it will not be elaborated here.

[0118] It should be understood that the chip mentioned in the embodiment of the present application may also be referred to as a system-on-chip, system chip, chip system, or system-on-chip, etc.

[0119] The embodiment of the present application provides a computer program product, which is stored in a storage medium. The program product is executed by at least one processor to implement each process of the above-mentioned control method embodiment and can achieve the same technical effect. To avoid repetition, it will not be elaborated here.

[0120] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0121] Although embodiments of the present application have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present application. The scope of the present application is defined by the claims and their equivalents.

Claims

1. A speaker module, characterized in that, The loudspeaker module includes: a loudspeaker, a housing, and a deformation component; An sound outlet hole is provided on the housing. The housing has an opening. The loudspeaker is disposed at the opening, and the loudspeaker seals the opening. The deformation component is connected to the housing, and at least a part of the inner wall of the deformation component, the loudspeaker, and the housing enclose a sound cavity, and the sound outlet hole communicates with the sound cavity; When the loudspeaker emits sound, the deformation component deforms to change the volume of the sound cavity.

2. The loudspeaker module according to claim 1, wherein The deformation component is located inside the housing, and the deformation component is connected to the inner wall of the housing; The deformation component, the part of the inner wall of the housing that is not connected to the deformation component, and the loudspeaker enclose to form the sound cavity.

3. The loudspeaker module according to claim 2, wherein The deformation component includes at least one of an electrostrictive element and a deformable gas container.

4. The loudspeaker module according to claim 1, wherein The housing includes a first sub-housing and a second sub-housing; The first sub-housing and the second sub-housing are spaced apart. The opening is provided on the first sub-housing. The loudspeaker is disposed at the opening of the first sub-housing. The first sub-housing and the second sub-housing are connected by the deformation component. The sound outlet hole is provided on the first sub-housing or the second sub-housing; The inner wall of the first sub-housing, the inner wall of the second sub-housing, the deformation component, and the loudspeaker enclose to form the sound cavity.

5. The loudspeaker module according to claim 4, wherein The deformation component includes a first electromagnetic member, an elastic member, and a second electromagnetic member; The first end of the elastic member is connected to the first electromagnetic member, the second end of the elastic member is connected to the second electromagnetic member, the first electromagnetic member is connected to the first sub-housing, and the second electromagnetic member is connected to the second sub-housing; The inner wall of the first sub-housing, the inner wall of the second sub-housing, the first electromagnetic member, the elastic member, the second electromagnetic member, and the loudspeaker enclose to form the sound cavity; When the first electromagnetic member and the second electromagnetic member are energized, the first electromagnetic member and the second electromagnetic member approach or move away from each other, causing the elastic member to deform to change the volume of the sound cavity.

6. The loudspeaker module according to any one of claims 1-5, characterized in that The loudspeaker is a parametric array loudspeaker.

7. A control method, characterized in that, For controlling the loudspeaker module according to any one of claims 1-6; The control method includes: When the loudspeaker emits sound, controlling the deformation component to deform to change the volume of the sound cavity.

8. The control method according to claim 7, characterized in that The step of, when the loudspeaker emits sound, controlling the deformation component to deform to change the volume of the sound cavity includes: Determining a first phase of a first carrier wave for controlling the loudspeaker to emit sound, and determining a second phase of a second carrier wave emitted by the loudspeaker; Based on the first phase and the second phase, controlling the deformation component to deform to change the volume of the sound cavity.

9. The control method according to claim 8, wherein The step of, based on the first phase and the second phase, controlling the deformation component to deform includes: When the first phase is the same as the second phase, controlling the shape of the deformation component to be a first shape, and the resonance frequency of the sound cavity is the same as the frequency of the second carrier wave; When the first phase is different from the second phase, control the shape of the deformation component to be a second shape, and the resonance frequency of the sound cavity is different from the frequency of the second carrier wave.

10. The control method according to claim 9, characterized in that, The loudspeaker is a parametric array loudspeaker, the second carrier wave includes a first sub-carrier wave and a second sub-carrier wave, the frequency of the first sub-carrier wave is different from the frequency of the second sub-carrier wave, and the frequencies of the first sub-carrier wave and the second sub-carrier wave are both greater than the frequency of the first carrier wave.

11. The control method according to claim 10, wherein The first phase of the first carrier wave includes a positive phase and a negative phase, and the phase of the first sub-carrier wave includes a positive phase and a negative phase; When the first phase is the same as the second phase, control the shape of the deformation component to be a first shape, including: When the first phase of the first carrier wave is a positive phase and the phase of the first sub-carrier wave is a positive phase, control the shape of the deformation component to be a first shape; When the first phase of the first carrier wave is a negative phase and the phase of the first sub-carrier wave is a negative phase, control the shape of the deformation component to be a first shape.

12. The control method according to claim 10, wherein The first phase of the first carrier wave includes a positive phase and a negative phase, and the phase of the first sub-carrier wave includes a positive phase and a negative phase; When the first phase is different from the second phase, control the shape of the deformation component to be a second shape, including: When the first phase of the first carrier wave is a positive phase and the phase of the first sub-carrier wave is a negative phase, control the shape of the deformation component to be a second shape; When the first phase of the first carrier wave is a negative phase and the phase of the first sub-carrier wave is a positive phase, control the shape of the deformation component to be a second shape.

13. An electronic device, characterized in that, The electronic device includes a controller and the loudspeaker module according to any one of claims 1-6; The deformation component and the loudspeaker are both electrically connected to the controller.

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