Loudspeaker and electronic equipment

Abstract

The invention provides a loudspeaker and electronic equipment, and belongs to the technical field of loudspeakers, and the loudspeaker comprises a magnetic cover; the first magnetic assembly is arranged on the magnetic cover and used for generating a magnetic field; the support assembly is arranged on one side of the magnetic cover, and the support assembly and the first magnetic assembly are located on the same side of the magnetic cover; the voice coil assembly is arranged on the support assembly and located on the side, away from the magnetic cover, of the first magnetic assembly; the vibrating diaphragm assembly is connected with the voice coil assembly, and the vibrating diaphragm assembly is located on the side, away from the support assembly, of the voice coil assembly; wherein the voice coil assembly comprises a first coil and a second coil, and the second coil is located between the first coil and the first magnetic assembly; two ends of the first coil are respectively provided with a first bonding pad and a second bonding pad, two ends of the second coil are respectively provided with a third bonding pad and a fourth bonding pad, the second bonding pad is electrically connected with the third bonding pad, and when the first coil and the second coil are electrified, the current on the first coil and the current on the second coil are opposite in direction.

Description

Technical Field

[0001] This application belongs to the technical field of speakers, and particularly relates to a speaker and an electronic device. Background Art

[0002] As Figure 1 shown, the speaker 100' generally includes a dome 110', a diaphragm 120', a voice coil 130', a chassis 140', a shrapnel 150', an annular pole piece 160', a side magnet 170', a center pole piece 180', a center magnet 190' and a magnetic shield 200'. As Figure 2 shown, the voice coil 130' is generally formed by winding a wire 132'.

[0003] As Figure 3 shown, the working principle of the speaker 100' is that an alternating current is passed through the voice coil 130', and the voice coil 130' cuts the magnetic induction lines in the magnetic field formed by the magnetic circuit of the speaker 100' to generate a Lorentz force (the current direction is not parallel to the magnetic induction line direction), thereby driving the diaphragm 120' to push the air to emit sound.

[0004] As Figure 4 and Figure 5 shown, the current direction on the voice coil 130', the magnetic induction line direction of the magnetic field and the Lorentz force conform to the left-hand rule.

[0005] However, when the electronic device is working, a large periodic current will be generated on the circuit board 230'. When the position of the working speaker 100' is close to the circuit board 230' of the electronic device, due to electromagnetic induction, the voice coil 130' of the speaker 100' is equivalent to a secondary coil, and an induced current will be generated when it is close to the energized circuit board 230', coupling the current signal of the circuit board 230' into the voice coil 130'. The induced current is affected by the Lorentz force in the magnetic circuit of the speaker 100', thereby driving the diaphragm 120' to vibrate and push the air to generate a "buzzing" current sound.

[0006] In the related art, in order to solve the current sound generated by the speaker 100', the following several methods are usually adopted:

[0007] As Figure 6 shown, a resistor 210' is connected in series on the circuit of the speaker 100' to reduce the interference signal coupled to the voice coil 130' by using the resistor 210', but such a structure will reduce the magnitude of the audio current.

[0008] As Figure 7 shown, the wiring of the circuit board 230' is changed to avoid large current wiring in the area of the circuit board 230' corresponding to the speaker 100', but this limits the layout of the circuit board 230' and increases the design difficulty of the circuit board 230'.

[0009] As Figure 8 shown, a sampling coil 220' is added. The sampling coil 220' is located between the speaker 100' and the circuit board 230', so as to collect the interference signal on the circuit board 230' through the sampling coil 220'. Then, a compensation signal is generated and transmitted to the speaker 100'. However, if there are multiple interference sources in such a structure, it will be complicated to sample multiple interference sources and then generate a compensation signal through a processing module for multiple interference sources. Once the phases are not aligned, the compensation signal will be superimposed on the interference signal and the original interference signal, making the interference sound more serious. Summary of the Invention

[0010] An object of the embodiments of the present application is to provide a speaker and an electronic device, which can effectively solve the technical problem that the speaker is prone to current noise due to the interference of the circuit board during operation.

[0011] In a first aspect, an embodiment of the present application provides a speaker, including:

[0012] A magnetic cover;

[0013] A first magnetic component, arranged in the magnetic cover, and the first magnetic component is used to generate a magnetic field;

[0014] A bracket component, arranged on one side of the magnetic cover, and the bracket component and the first magnetic component are on the same side of the magnetic cover;

[0015] A voice coil component, arranged in the bracket component, and the voice coil component is on the side of the first magnetic component away from the magnetic cover;

[0016] A diaphragm component, connected to the voice coil component, and the diaphragm component is on the side of the voice coil component away from the bracket component;

[0017] Among them, the voice coil component includes a first coil and a second coil, and the second coil is located between the first coil and the first magnetic component; both ends of the first coil respectively have a first pad and a second pad, both ends of the second coil respectively have a third pad and a fourth pad, the second pad and the third pad are electrically connected, and when the first coil and the second coil are powered, the directions of the current on the first coil and the current on the second coil are opposite.

[0018] In a second aspect, an embodiment of the present application provides an electronic device, including:

[0019] A housing;

[0020] The speaker provided in the embodiment of the first aspect, and the speaker is located inside the housing.

[0021] In the embodiments of the present application, the loudspeaker includes a magnetic cover, a first magnetic component, a bracket component, a voice coil component, and a diaphragm component. The first magnetic component is arranged inside the magnetic cover, the bracket component is arranged on one side of the magnetic cover, the voice coil component is arranged on the bracket component, the diaphragm component is connected to the voice coil component and is located on the side of the voice coil component away from the bracket component. When the voice coil component is powered on, the current in the voice coil component and the magnetic field of the first magnetic component induce each other, so that the voice coil component moves, drives the diaphragm component to vibrate, and emits sound.

[0022] Among them, the voice coil component includes a first coil and a second coil stacked on top of each other. The second coil is located between the first coil and the first magnetic component. Both ends of the first coil respectively have a first pad and a second pad, both ends of the second coil respectively have a third pad and a fourth pad, and the second pad and the third pad are electrically connected. When the voice coil component is powered on, that is, when the first coil and the second coil are powered on, the directions of the current in the first coil and the current in the second coil are opposite. When the voice coil component is affected by the current of the circuit board or other currents, the interference signals coupled by the first coil and the second coil are opposite, so that the interference signals in the first coil and the second coil cancel each other out, reducing the possibility of the loudspeaker emitting interference sounds. Moreover, this structure does not add additional devices wirelessly or adjust the layout of the circuit board, and has a simple structure and good anti-interference performance. Description of the Drawings

[0023] The above and / or additional aspects and advantages of the present application will become obvious and easy to understand from the description of the embodiments in conjunction with the following drawings, where:

[0024] Figure 1 Shows an exploded view of a loudspeaker in the related art;

[0025] Figure 2 Shows a cross-sectional view of the voice coil in a loudspeaker in the related art;

[0026] Figure 3 Shows a cross-sectional view of a partial structure of a loudspeaker in the related art;

[0027] Figure 4 Shows a schematic diagram of a partial structure of a loudspeaker in the related art;

[0028] Figure 5 Shows a schematic diagram of the left-hand rule of the force direction of the middle voice coil of a loudspeaker in the related art;

[0029] Figure 6 Shows one of the schematic diagrams of reducing interference of a loudspeaker in the related art;

[0030] Figure 7 Shows another schematic diagram of reducing interference of a loudspeaker in the related art;

[0031] Figure 8 The third schematic diagram showing the reduction of interference by a speaker in the related art;

[0032] Figure 9 The first cross-sectional view of a speaker provided by an embodiment of the present application;

[0033] Figure 10 The exploded view of a speaker provided by an embodiment of the present application;

[0034] Figure 11 The exploded view of the voice coil assembly of a speaker provided by an embodiment of the present application;

[0035] Figure 12 The schematic diagram showing the current flow directions of the first coil and the second coil in a speaker provided by an embodiment of the present application;

[0036] Figure 13 The first partial cross-sectional view of the voice coil assembly of a speaker provided by an embodiment of the present application;

[0037] Figure 14 The second partial cross-sectional view of the voice coil assembly of a speaker provided by an embodiment of the present application;

[0038] Figure 15 The schematic diagram of the voice coil assembly and the flexible circuit board of a speaker provided by an embodiment of the present application;

[0039] Figure 16 The partial cross-sectional view of the voice coil assembly, the first magnetic component, and the magnetic cover of a speaker provided by an embodiment of the present application;

[0040] Figure 17 The schematic diagram of the first coil and the first insulating layer in a speaker provided by an embodiment of the present application;

[0041] Figure 18 The second cross-sectional view of a speaker provided by an embodiment of the present application;

[0042] Figure 19 The schematic diagram of an electronic device provided by an embodiment of the present application;

[0043] Figure 20 The schematic diagram of the impedance comparison between a speaker provided by an embodiment of the present application and a speaker in the related art;

[0044] Figure 21 The schematic diagram of the frequency response comparison between a speaker provided by an embodiment of the present application and a speaker in the related art;

[0045] Figure 22The figure shows a schematic diagram of the comparison of the temperature rise of the loudspeaker provided by an embodiment of the present application and the loudspeaker in the related art.

[0046] Figures 1 to 8 Reference numerals:

[0047] 100’ Loudspeaker, 110’ Dome, 120’ Diaphragm, 130’ Voice coil, 132’ Lead wire, 140’ Frame, 150’ Shrapnel, 160’ Ring-shaped pole piece, 170’ Edge magnet, 180’ Central pole piece, 190’ Central magnet, 200’ Magnetic shield, 210’ Resistor, 220’ Sampling coil, 230’ Circuit board;

[0048] Figures 9 to 19 Reference numerals:

[0049] 100 Loudspeaker, 110 Magnetic shield, 120 First magnetic component, 130 Bracket component, 132 Bracket, 134 Frame, 140 Voice coil component, 142 First coil, 144 First pad, 146 Second pad, 148 Second coil, 150 Third pad, 152 Fourth pad, 154 First insulating layer, 156 Eighth pad, 158 Ninth pad, 160 Second insulating layer, 162 Through hole, 164 Support layer, 170 Diaphragm component, 172 Diaphragm, 174 Dome, 180 Flexible circuit board, 182 Board body, 184 Vibration arm, 186 Fifth pad, 188 Sixth pad, 190 Seventh pad, 200 Second magnetic component, 210 Support component, 300 Electronic device, 310 Housing. Detailed implementation manners

[0050] The embodiments of the present application will be described in detail below. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present application and should not be construed as a limitation to the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts fall within the scope of protection of the present application.

[0051] The terms "first" and "second" in the description and claims of the present application may explicitly or implicitly include one or more of such features. In the description of the present application, unless otherwise specified, the meaning of "a plurality" is two or more. In addition, "and / or" in the description and claims means at least one of the connected objects, and the character " / " generally means an "or" relationship between the associated objects before and after.

[0052] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0053] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0054] Combine the following Figures 9 to 22 The accompanying drawings illustrate a speaker 100 and an electronic device 300 according to embodiments of the present application.

[0055] First, as Figure 9 , Figure 10 and Figure 11 As shown, the embodiment of the present application provides a loudspeaker 100, including: a magnetic cover 110; a first magnetic component 120, which is arranged on the magnetic cover 110, and the first magnetic component 120 is used to generate a magnetic field; a bracket component 130, which is arranged on one side of the magnetic cover 110, and the bracket component 130 and the first magnetic component 120 are located on the same side of the magnetic cover 110; a voice coil component 140, which is arranged on the bracket component 130, and the voice coil component 140 is located on the side of the first magnetic component 120 away from the magnetic cover 110; a diaphragm component 170, which is connected to the voice coil component 140, and the diaphragm component 170 is located on the back of the voice coil component 140. From the side of the bracket assembly 130; wherein the voice coil assembly 140 includes a first coil 142 and a second coil 148, the second coil 148 is located between the first coil 142 and the first magnetic assembly 120; the first coil 142 has a first soldering pad 144 and a second soldering pad 146 at both ends, and the second coil 148 has a third soldering pad 150 and a fourth soldering pad 152 at both ends, the second soldering pad 146 and the third soldering pad 150 are electrically connected, and when the first coil 142 and the second coil 148 are powered, the current in the first coil 142 and the current in the second coil 148 are in opposite directions.

[0056] In an embodiment of the present application, the loudspeaker 100 includes a magnetic cover 110, a first magnetic component 120, a bracket component 130, a voice coil component 140, and a diaphragm component 170. The first magnetic component 120 is disposed within the magnetic cover 110. The bracket component 130 is disposed on one side of the magnetic cover 110. The voice coil component 140 is disposed on the bracket component 130. The diaphragm component 170 is connected to the voice coil component 140 and is located on the side of the voice coil component 140 away from the bracket component 130. Thus, when the voice coil component 140 is energized, the current in the voice coil component 140 and the magnetic field of the first magnetic component 120 interact, causing the voice coil component 140 to move, driving the diaphragm component 170 to vibrate and emit sound.

[0057] Wherein, the voice coil component 140 includes a stacked first coil 142 and second coil 148. The second coil 148 is located between the first coil 142 and the first magnetic component 120. The two ends of the first coil 142 respectively have a first pad 144 and a second pad 146. The two ends of the second coil 148 respectively have a third pad 150 and a fourth pad 152. The second pad 146 and the third pad 150 are electrically connected. When the voice coil component 140 is energized, that is, when the first coil 142 and the second coil 148 are energized, the directions of the currents in the first coil 142 and the second coil 148 are opposite. Thus, when the voice coil component 140 is affected by the current of the circuit board or other currents, the interference signals coupled by the first coil 142 and the second coil 148 are opposite, so that the interference signals in the first coil 142 and the second coil 148 cancel each other out, reducing the possibility of the loudspeaker 100 emitting interference sound. Moreover, this structure does not add extra components wirelessly or adjust the layout of the circuit board, and has a simple structure and good anti-interference performance.

[0058] The loudspeaker 100 provided by this solution has a new structure of the voice coil component 140, such that when it is close to the circuit board, the secondary current signals coupled by the voice coil component 140 from the current in the circuit board are always opposite in direction at its four peripheries. In this way, the secondary current cannot obtain the Lorentz force in the magnetic field of the loudspeaker 100, and cannot emit interference sound through the loudspeaker 100, fundamentally solving the interference sound of the current to the loudspeaker 100.

[0059] As Figure 11 and Figure 12 shown, as a possible implementation manner, the first coil 142 is a planar coil. The first coil 142 includes a first pad 144 and a second pad 146. The second pad 146 is located on the inner layer of the first coil 142. The second coil 148 is a planar coil. The third pad 150 is located on the inner layer of the second coil 148, and the fourth pad 152 is located on the outer layer of the second coil 148. Wherein, the winding directions of the first coil 142 and the second coil 148 are the same.

[0060] Specifically, the first coil 142 and the second coil 148 are planar coils. The low thickness of the planar coils is beneficial to reducing the volume of the speaker 100. The first pad 144 is located on the outer layer of the first coil 142, the second pad 146 is located on the inner layer of the first coil 142, the third pad 150 is located on the inner layer of the second coil 148, and the fourth pad 152 is located on the outer layer of the second coil 148. Also, the second pad 146 and the third pad 150, which are both located on the inner layer, are electrically connected, making the operation more convenient, with a simple structure and high reliability. Moreover, the winding directions of the first coil 142 and the second coil 148 are the same, ensuring that the current can enter the first coil 142 from the first pad 144 and flow out of the first coil 142 from the second pad 146. Then, the current flows into the second coil 148 through the third pad 150 and flows out of the second coil 148 from the fourth pad 152. During the whole process, the current in the first coil 142 flows from the outside to the inside, and the current in the second coil 148 flows from the inside to the outside. Considering that the winding directions of the first coil 142 and the second coil 148 are the same, the directions of the currents in the first coil 142 and the second coil 148 are opposite. The above structures of the first coil 142 and the second coil 148 are simple, the connection method is convenient, and the reliability is high.

[0061] As Figure 11 , Figure 12 , Figure 13 and Figure 14 shown, the winding directions of the first coil 142 and the second coil 148 are the same. Combining the above structures, the directions of the currents in the first coil 142 and the second coil 148 are opposite, and the magnitudes of the currents passing through are equal. Furthermore, the interference signals generated by the currents in the first coil 142 and the second coil 148 coupled to the circuit board can cancel each other out, avoiding the current interference noise emitted by the speaker 100.

[0062] When there are at least two sets of the first coil 142 and the second coil 148 in the voice coil assembly 140, the coils with the same current direction are connected in parallel through pads, and the coils with opposite current directions are connected in series through pads.

[0063] Figure 12 The arrow directions in Figure 13 and Figure 14 indicate the current directions. As shown in

[0064] As Figure 11 shown, in the projection area corresponding to the second pad 146 and the third pad 150 of the second insulating layer 160, via holes 162 need to be provided, and the via holes 162 are electroplated with metal to ensure the electrical connection between the second pad 146 of the first coil 142 and the third pad 150 of the second coil 148.

[0065] AsFigure 11 and Figure 12 As shown in Figure 12 , as a possible implementation, the first coil 142 and the second coil 148 are formed by processing a sheet material.

[0066] In a possible implementation, the first coil and the second coil can be copper foil traces or other metal materials. The cross-section of the copper foil can be quadrilateral or circular. This application does not make specific limitations in this regard.

[0067] Specifically, the first coil 142 and the second coil 148 are formed by processing a sheet material. Since the inductance of the coil is related to the cross-sectional area of the coil, therefore, in this application, using a sheet material to process the first coil 142 and the second coil 148 can reduce the inductance of the first coil 142 and the second coil 148. The reduction of the inductance makes the impedance of the voice coil assembly 140 lower, and the heat generated by the heating of the voice coil assembly 140 also decreases synchronously. The temperature tolerance of the speaker 100, the tolerance power of the speaker 100, and the efficiency of the speaker 100 will also increase synchronously. And the weakening of the inductance will reduce the non-linearity of the inductance, reduce harmonic distortion, and can more effectively improve the audio effect.

[0068] Among them, the manufacturing method of the first coil 142 and the second coil 148 can be through etching or laser engraving, etc. Its overall manufacturing scheme is similar to the manufacturing scheme of semiconductors. The inductance of the first coil 142 and the second coil 148 designed in this way is relatively low. Then, when the speaker 100 works, the heat generated by the voice coil assembly 140 is also lower than that of the speaker in the related technology. The electro-acoustic conversion efficiency is high. At the same time, it can also improve the loudness of high frequencies, increase the high-frequency details of the external sound, and is beneficial to the improvement of the external sound effect.

[0069] As Figure 12 shown, since the current directions in the first coil 142 and the second coil 148 are opposite, on the one hand, it solves the problem of current noise interference on the circuit board, and on the other hand, it effectively reduces the high-frequency inductance (2KHz - 20KHz) of the voice coil assembly 140.

[0070] Because the current when the speaker 100 works is an alternating current, an alternating magnetic field will be generated when the alternating current passes through the voice coil of the speaker 100. Due to the principle of electromagnetic induction, an induced back electromotive force will be generated in the coil, which hinders the working current of the speaker 100. The voice coil assembly 140 designed in this scheme will weaken the back electromotive force. According to where V represents the induced electromotive force, L represents the inductance, dI represents the current change amount, and dt represents the time change amount. It can be known that when the electromotive force weakens, the inductance L will decrease. Specifically as Figure 20 shown. As Figure 21 shown, the reduction of the high-frequency inductance can, on the one hand, improve the high-frequency frequency response of the micro speaker 100. Better optimize the external sound effect and details. On the other hand, asFigure 22 As shown, the reduction of the inductance makes the impedance of the first coil 142 and the second coil 148 lower, and the heat generated by the heating of the voice coil assembly 140 also decreases synchronously. The temperature tolerance, the power tolerance, and the efficiency of the speaker 100 will also increase synchronously. At the same time, the weakening of the inductance will reduce the non-linearity of the inductance, reduce the harmonic distortion, and more effectively improve the audio effect.

[0071] As Figure 11 shown, as a possible implementation, the voice coil assembly 140 further includes: a support layer 164 located on the side of the second coil 148 away from the first coil 142; a first insulating layer 154 located between the first coil 142 and the second coil 148, and the first insulating layer 154 has a through hole 162, and the through hole 162 is opposite to the second pad 146 and the third pad 150; a second insulating layer 160 located on the side of the first coil 142 away from the second coil 148.

[0072] Specifically, the voice coil assembly 140 further includes a support layer 164, a first insulating layer 154, and a second insulating layer 160. The support layer 164 is located on the side of the second coil 148 away from the first coil 142 to support the first coil 142 and the second coil 148. The first insulating layer 154 is located between the first coil 142 and the second coil 148 to insulate the first coil 142 and the second coil 148, ensuring that the first coil 142 and the second coil 148 are only electrically connected through the second pad 146 and the third pad 150, and preventing the first coil 142 and the second coil 148 from short-circuiting. The first insulating layer 154 has a through hole 162, and the through hole 162 is opposite to the second pad 146 and the third pad 150, thereby ensuring the electrical connection between the second pad 146 and the third pad 150. The second insulating layer 160 is located on the side of the first coil 142 away from the second coil 148 to protect the first coil 142 and the second coil 148.

[0073] A metal layer can be provided at the through hole 162 to ensure the electrical connection between the second pad 146 and the third pad 150.

[0074] Optionally, an eighth pad 156 and a ninth pad 158 are provided on the second insulating layer 160. The eighth pad 156 is electrically connected to the first pad 144, and the ninth pad 158 is electrically connected to the fourth pad 152, thereby reducing the difficulty of energizing the first coil 142 and the second coil 148.

[0075] The voice coil assembly 140 includes a first insulating layer 154, a second coil 148, a second insulating layer 160, a first coil 142, and a support layer 164. There is at least one second insulating layer 160 between the first coil 142 and the second coil 148 to prevent short - circuiting between the first coil 142 and the second coil 148. The manufacturing methods of the first coil 142 and the second coil 148 are similar to those of semiconductors. The speaker 100 can be provided with one voice coil assembly 140 or at least two voice coil assemblies 140 according to size and performance requirements. The first coil 142 and the second coil 148 are processed and formed on a substrate by etching, and the cross - sections of the first coil 142 and the second coil 148 can be quadrilateral, circular, etc.

[0076] As Figure 9 , Figure 10 and Figure 15 shown, as a possible implementation, the speaker 100 further includes: a flexible circuit board 180, disposed on the bracket assembly 130 and electrically connected to the first coil 142 and the second coil 148.

[0077] Specifically, the speaker 100 further includes a flexible circuit board 180 disposed on the bracket assembly 130. The flexible circuit board 180 is electrically connected to the first coil 142 and the second coil 148, and the influence of the vibration of the voice coil assembly 140 on the circuit is reduced through the flexible circuit board 180.

[0078] As Figure 9 and Figure 10 shown, as a possible implementation, the bracket assembly 130 includes: a chassis 134, disposed on the side of the magnetic shield 110 facing the diaphragm assembly 170, and the flexible circuit board 180 is disposed on the side of the chassis 134 facing the magnetic shield 110; a bracket 132, disposed inside the chassis 134, and the voice coil assembly 140 is disposed on the bracket 132.

[0079] Specifically, the bracket assembly 130 includes a chassis 134 and a bracket 132. The chassis 134 is disposed on the side of the magnetic shield 110 facing the diaphragm assembly 170, the bracket 132 is disposed inside the chassis 134, the flexible circuit board 180 is disposed on the side of the chassis 134 facing the magnetic shield 110, and the voice coil assembly 140 is disposed on the bracket 132. Thus, through the arrangement of the chassis 134 and the bracket 132, the structural stability of the speaker 100 is ensured, and the reliability of the movement of the voice coil assembly 140 is ensured.

[0080] As Figure 15As shown, as a possible implementation, the flexible circuit board 180 includes: a board body 182 disposed on the basin frame 134. The board body 182 has a fifth pad 186 and a sixth pad 188, and the fifth pad 186 and the sixth pad 188 are used to connect to an external circuit; a vibration arm 184 connected to the board body 182; a seventh pad 190 disposed on the vibration arm 184, and the seventh pad 190 is electrically connected to the voice coil assembly 140.

[0081] Specifically, the flexible circuit board 180 includes a board body 182, a vibration arm 184, and a seventh pad 190. The vibration arm 184 is disposed on the board body 182, and the seventh pad 190 is disposed on the vibration arm 184. The board body 182 has a fifth pad 186 and a sixth pad 188. The flexible circuit board 180 is connected to the external circuit through the fifth pad 186 and the sixth pad 188. The board body 182 is fixed to the basin frame 134 to ensure the fixation of the board body 182 and the reliability of the connection between the flexible circuit board 180 and the external circuit. The seventh pad 190 is electrically connected to the voice coil assembly 140, thereby reducing the current delivered to the first coil 142 and the second coil 148. Moreover, the distance between the seventh pad 190 and the board body 182 is extended through the vibration arm 184 to adapt to the vibration of the voice coil assembly 140 and ensure the reliability of the connection between the flexible circuit board 180 and the voice coil assembly 140.

[0082] As Figure 12 shown, the first coil 142 has a first pad 144 and a second pad 146, and the second coil 148 has a third pad 150 and a fourth pad 152. The first pad 144 can be used for the input of current, the second pad 146 can be used for the output of current, the third pad 150 can be used for the input of current, and the fourth pad 152 can be used for the output of current. The second pad 146 is connected to the third pad 150. The voice coil assembly 140 is connected to the external circuit through the flexible circuit board 180. The flexible circuit board 180 has a fifth pad 186, a sixth pad 188, and a seventh pad 190. The seventh pad 190 is used to connect to the first pad 144 and the fourth pad 152. The circuit enters the flexible circuit board 180 from the fifth pad 186, then enters the vibration arm 184 of the flexible circuit board 180, then enters the seventh pad 190 of the flexible circuit board 180, then enters the first pad 144, flows out through the first coil 142 from the second pad 146, enters the third pad 150, flows out through the second coil 148 from the fourth pad 152, enters the seventh pad 190 of the flexible circuit board 180, then passes through the vibration arm 184 of the flexible circuit board 180, and then flows out of the flexible circuit board 180 from the sixth pad 188, thus forming an electrical circuit loop.

[0083] Among them, there are two vibration arms 184 and two seventh pads 190 respectively. One vibration arm 184 is connected to one seventh pad 190, one seventh pad 190 is connected to the first pad 144, the other vibration arm 184 is connected to the other seventh pad 190, and the other seventh pad 190 is connected to the fourth pad 152.

[0084] As Figure 9 and Figure 10 shown, as a possible implementation manner, the diaphragm assembly 170 includes: a diaphragm 172, which is connected to the chassis 134, and a part of the diaphragm 172 is bent toward one side of the chassis 134; a dome 174, which is arranged on the side of the diaphragm 172 facing the bracket assembly 130, and the dome 174 is connected to the bracket 132.

[0085] Specifically, the diaphragm assembly 170 includes a diaphragm 172 and a dome 174. The diaphragm 172 is connected to the chassis 134, and a part of the diaphragm 172 is bent toward one side of the chassis 134, so as to ensure that the diaphragm 172 can achieve waterproof and dustproof. The dome 174 is arranged on the side of the diaphragm 172 facing the bracket assembly 130, and the dome 174 is connected to the bracket 132. Thus, the voice coil assembly 140 can drive the dome 174 to move through the bracket 132, and then drive the diaphragm 172 to vibrate to form sound.

[0086] As Figure 9 and Figure 10 shown, the loudspeaker 100 includes a dome 174, a diaphragm 172, a bracket 132, a voice coil assembly 140 and a flexible circuit board 180. The dome 174, the diaphragm 172, the bracket 132, the voice coil assembly 140 and the flexible circuit board 180 form a vibration system, the first magnetic assembly 120 and the magnetic shield 110 form a magnetic circuit system, and the chassis 134.

[0087] The dome 174 and the diaphragm 172 are bonded together by glue. The voice coil assembly 140 and the bracket 132 are bonded together by glue. The bracket 132 serves to fix the flexible circuit board 180 and the voice coil assembly 140, and its material can be a hard metal such as aerospace aluminum. One end of the upper part of the bracket 132 is bonded to the dome 174 by silicone or hot melt adhesive, the other end of the upper part of the bracket 132 is bonded to the voice coil assembly 140 by silicone or hot melt adhesive, and one end of the bottom is bonded to the flexible circuit board 180 by hot melt adhesive. The flexible circuit board 180 mainly serves for electrical connection, and its material is mainly composed of a composite of polyimide (Pi) film + copper (Cu) foil. Part of it is bonded to the chassis 134, part of it is bonded to the bracket 132, and it moves together with the vibration system.

[0088] As Figure 9As shown in the figure, in order to meet the waterproof rating requirements, the diaphragm 172 has a concave folded ring shape in appearance, and the dome 174 is located below the diaphragm 172 and bonded by glue, such as photocurable (UV) glue or resin. The material of the diaphragm 172 can be a thermoplastic material or a thermoelastic material, such as polyetherether ketone (PEEK) and PEEK composite film, thermoplastic polyurethane (TPU), polyethylene naphthalate (PEN), polyethylene terephthalate (PET) related composite film, thermoplastic polyester elastomer (TPEE) composite film or rubber film. The material of the dome 174 can be PEN, PET, carbon fiber, magnesium alloy, aluminum (AL) foil + polymethacrylimide (PMI) / PET composite, copper foil material or carbon nanotube and other materials.

[0089] As Figure 16 shown, as a possible implementation manner, the magnetic parts in the first magnetic assembly 120 are arranged according to the Halbach array.

[0090] Specifically, the first magnetic assembly 120 includes a plurality of first magnetic parts, and the plurality of first magnetic parts are arranged according to the Halbach array, so as to enhance the magnetic field strength of the first magnetic assembly 120, and the magnetic field on the side of the first magnetic assembly 120 facing the voice coil assembly 140 can be enhanced.

[0091] In order to ensure the normal vibration of the voice coil assembly 140, there are a plurality of magnetic poles in the first magnetic assembly 120. Figure 16 The arrow direction in the figure indicates the N pole direction of the first magnetic part. The magnetic induction lines generated by its magnetic field are perpendicular to the current directions in the first coil 142 and the second coil 148. As Figure 16 shown, the current directions in the first coil and the second coil are perpendicular to the paper surface, and the magnetic induction intensity on the side facing the voice coil assembly 140 is the largest, and the magnetic induction intensity on the side close to the magnetic cover 110 is the smallest. The direction of its magnetic induction lines is perpendicular to the current directions in the first coil 142 and the second coil 148, providing an effective driving force for the operation of the speaker 100.

[0092] As Figure 17 shown, as a possible implementation manner, the number of the first coils 142 is multiple, and the multiple first coils 142 are arranged in an array; the number of the second coils 148 is multiple, and the multiple second coils 148 are arranged in an array; among them, the first coils 142 and the second coils 148 are arranged in one-to-one correspondence.

[0093] Specifically, the number of first coils 142 and the number of second coils 148 can be multiple, and multiple first coils 142 are arranged in an array, and multiple second coils 148 are arranged in an array. Adding the first coils 142 and the second coils 148 helps to improve the performance of the speaker 100. The first coils 142 and the second coils 148 are set in a one-to-one correspondence, thereby ensuring that the interference currents coupled to the first coils 142 and the second coils 148 can offset each other.

[0094] like Figure 17 As shown, a plurality of first coils 142 can be etched on a two-dimensional substrate surface, the number of which is a multiple of 4, to ensure that currents of equal magnitude and opposite directions flow in both the long axis and the short axis directions. Multiple layers of this structure can also be packaged together, including at least one substrate layer, one coil layer, and one insulating layer.

[0095] The first coil 142 and the second coil 148 in the voice coil assembly 140 may also be packaged in the XYZ three-dimensional space.

[0096] Specifically, one insulating layer and one coil layer may be a set, and the voice coil includes at least two sets of insulating layers and coil layers.

[0097] like Figure 18 As shown, as a possible implementation, the loudspeaker 100 further includes: a support assembly 210 disposed on a side of the diaphragm assembly 170 away from the bracket assembly 130 ; and a second magnetic assembly 200 disposed on a side of the bracket assembly 130 facing the voice coil assembly 140 .

[0098] Specifically, the speaker 100 also includes a supporting component 210 and a second magnetic component 200. The supporting component 210 is arranged on the side of the diaphragm component 170 away from the bracket component 130, and the second magnetic component 200 is arranged on the side of the supporting component 210 toward the voice coil component 140. The first magnetic component 120 and the second magnetic component 200 are used to form a magnetic field, which can increase the magnetic field and help improve the performance of the speaker 100.

[0099] like Figure 18 As shown, in order to increase the performance of the speaker 100, a second magnetic component 200 can be set on the side of the diaphragm assembly 170 away from the voice coil. The second magnetic component 200 is fixed by a support component 210, so that the voice coil assembly 140 has magnetic components in both the upper and lower directions, thereby improving the strength of the magnetic field.

[0100] The magnetic elements in the second magnetic assembly 200 are arranged according to a Halbach array.

[0101] Specifically, the second magnetic component 200 includes a plurality of second magnetic elements, and the plurality of second magnetic elements are arranged in a Halbach array, thereby enhancing the magnetic field strength of the second magnetic component 200, which can be to enhance the magnetic field on the side of the second magnetic component 200 facing the voice coil component 140.

[0102] In a second aspect, as Figure 19 shown, an embodiment of the present application provides an electronic device 300, including: a housing 310; a speaker 100 provided in an embodiment of the first aspect, and the speaker 100 is located inside the housing 310.

[0103] Since the electronic device 300 provided in the present application includes the speaker 100 provided in the embodiment of the first aspect, therefore, it has all the beneficial effects of the speaker 100 provided in the embodiment of the first aspect, and will not be elaborated herein one by one.

[0104] As described above, the problem of the circuit board causing interference to the speaker 100 and generating interference current noise is solved from the device end of the speaker. The two coils are completely the same except for the direction, and the interference is solved more thoroughly without the need to add external devices, such as changing the layout of the circuit board, the difficulty of wiring, or software measures.

[0105] The electronic device 300 can be a terminal or other devices other than the electronic device 300. Exemplarily, the electronic device 300 can be a mobile phone, a tablet computer, a laptop computer, a handheld computer, a music playing device, a private network communication terminal device (such as a walkie-talkie), a mobile Internet device (MID), an augmented reality / virtual reality / mixed reality device, a robot, a wearable device, an ultra-mobile personal computer (UMPC), a netbook, or a personal digital assistant (PDA), etc. The embodiments of the present application do not make specific limitations.

[0106] In the description of this specification, the description referring to terms such as "an embodiment" or "specific embodiment" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0107] Although embodiments of the present application have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present application. The scope of the present application is defined by the claims and their equivalents.

Claims

1. A loudspeaker, characterized in that, include: Magnetic cover; A first magnetic component, disposed on the magnetic cover, and the first magnetic component is used to generate a magnetic field; A bracket assembly is arranged on one side of the magnetic cover, wherein the bracket assembly and the first magnetic assembly are located on the same side of the magnetic cover; A voice coil assembly, disposed on the bracket assembly, the voice coil assembly being located on a side of the first magnetic assembly away from the magnetic cover; A diaphragm assembly connected to the voice coil assembly, wherein the diaphragm assembly is located on a side of the voice coil assembly away from the bracket assembly; The voice coil assembly includes a first coil and a second coil, the second coil is located between the first coil and the first magnetic assembly; the first coil has a first soldering pad and a second soldering pad at both ends, respectively, the second coil has a third soldering pad and a fourth soldering pad at both ends, the second soldering pad and the third soldering pad are electrically connected, and when the first coil and the second coil are energized, the current in the first coil and the current in the second coil are in opposite directions.

2. The loudspeaker according to claim 1, characterized in that The first coil is a planar coil, the first pad is located on an outer layer of the first coil, and the second pad is located on an inner layer of the first coil; The second coil is a planar coil, the third pad is located in the inner layer of the first coil, and the fourth pad is located in the outer layer of the second coil; The first coil and the second coil have the same rotation direction.

3. The loudspeaker according to claim 1 or 2, characterized in that The voice coil assembly further comprises: a supporting layer, located on a side of the second coil facing away from the first coil; A first insulating layer is located between the first coil and the second coil, the first insulating layer has a through hole, and the through hole is opposite to the second pad and the third pad; The second insulating layer is located on a side of the first coil facing away from the second coil.

4. The loudspeaker according to claim 1 or 2, characterized in that, Also includes: The flexible circuit board is arranged on the support assembly and is electrically connected to the first coil and the second coil.

5. The loudspeaker according to claim 4, characterized in that, The bracket assembly comprises: A basin frame is arranged on a side of the magnetic cover facing the diaphragm assembly, and the flexible circuit board is arranged on a side of the basin frame facing the magnetic cover; The bracket is arranged on the inner side of the basin frame, and the voice coil assembly is arranged on the bracket.

6. The loudspeaker according to claim 5, characterized in that, The flexible circuit board comprises: A plate body, arranged on the basin frame, the plate body having a fifth solder pad and a sixth solder pad, the fifth solder pad and the sixth solder pad being used to connect to an external circuit; A vibration arm connected to the plate body; A seventh soldering pad is provided on the vibration arm, and the seventh soldering pad is electrically connected to the voice coil assembly.

7. The loudspeaker according to claim 5, characterized in that, The diaphragm assembly comprises: A diaphragm is connected to the basin frame, and a portion of the diaphragm is bent toward one side of the basin frame; The ball top is arranged on a side of the diaphragm facing the bracket assembly, and the ball top is connected to the bracket.

8. The loudspeaker according to claim 1 or 2, characterized in that: The magnetic components in the first magnetic assembly are arranged according to a Halbach array.

9. The loudspeaker according to claim 1 or 2, characterized in that, Also includes: A support assembly, arranged on a side of the diaphragm assembly away from the support assembly; The second magnetic component is arranged on a side of the supporting component facing the voice coil component.

10. An electronic device, characterized in that, include: Frame; The loudspeaker according to any one of claims 1 to 9, wherein the loudspeaker is located inside the housing.

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