AOI detection mechanism of die bonder

Abstract

The present application relates to die bonder technical field, especially in a kind of AOI detection mechanism of die bonder, including workbench, transmission component and AOI detection component, workbench is provided with first stand and second stand, tail end of first stand is provided with limit plate, limit plate is provided with Y-axis displacement mechanism, output end of Y-axis displacement mechanism is provided with first connecting plate, the outside of AOI detection component is provided with second connecting plate, the front end of first connecting plate is connected with second connecting plate, AOI detection component includes camera, lens group, light source and annular light source.The present application can realize high-precision detection, especially for the identification ability of subtle defect is greatly enhanced, ensure the high quality standard of final product, its structure is simple and compact, reduces the complex assembly component, improves the flexibility and application range of equipment, the whole AOI detection component is ingeniously placed in the top tail end of transmission component, saves space, improves the overall integration of equipment.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of die bonder, in particular to an AOI detection mechanism of die bonder. BACKGROUND

[0002] With the increasing demand for product quality and production efficiency in the electronic manufacturing industry, traditional manual quality detection methods have been difficult to meet the needs of modern production. Especially in the field of semiconductor packaging, die bonder as one of the key equipment plays a crucial role in the chip packaging process. However, the traditional die bonder lacks efficient automated detection means, resulting in low production efficiency and unstable product quality.

[0003] Most of the existing die bonder relies on manual inspection or simple mechanical detection devices to ensure the accuracy of chip mounting, which not only increases the labor cost, but also due to the existence of human factors, it is easy to produce misjudgment and missed detection phenomenon, which affects the quality of the final product. In addition, some detection schemes using basic photoelectric sensors can improve the detection efficiency to a certain extent, but their detection precision is limited and cannot meet the recognition needs of subtle defects. SUMMARY

[0004] The present application aims to at least solve the technical problems existing in the prior art. To this end, the present application provides an AOI detection mechanism of die bonder, which has the characteristics of simple structure, easy to adjust, high integration, etc., and can effectively realize accurate detection of chips.

[0005] According to the AOI detection mechanism of die bonder according to some embodiments of the present application, the workbench is provided with a first stand and a second stand, the tail end of the first stand is provided with a limiting plate, the limiting plate is provided with a Y-axis displacement mechanism, the output end of the Y-axis displacement mechanism is provided with a first connecting plate, the outer side of the AOI detection assembly is provided with a second connecting plate, the front end of the first connecting plate is connected with the second connecting plate, the AOI detection assembly includes a camera, a lens group, a light source and a ring light source, the camera, the lens group, the light source and the ring light source are arranged in order from top to bottom, the transmission mechanism is arranged on the second stand, and the AOI detection assembly is arranged at the top tail end of the transmission mechanism.

[0006] According to the AOI detection mechanism of die bonder according to some embodiments of the present application, at least the following beneficial effects are achieved:

[0007] The AOI detection mechanism can realize high-precision detection by integrating a high-resolution camera, an optimally designed lens group and a suitable light source, especially the identification ability of subtle defects is greatly enhanced, ensuring the high-quality standard of the final product, the design of the detection mechanism considers the convenience in actual production, the structure is simple and compact, the complex assembly parts are reduced, the configuration of the Y-axis displacement mechanism and the connecting plate enables the AOI detection assembly to be accurately adjusted in position as needed, adapts to the detection requirements of chips of different specifications, improves the flexibility and application range of the equipment, the entire AOI detection assembly is cleverly placed at the top tail end of the transmission mechanism, and is stably installed through the connection of the first connecting plate and the second connecting plate, space is saved, and the overall integration of the equipment is improved.

[0008] According to the AOI detection mechanism of the die bonder according to some embodiments of the application, the second connecting plate is sequentially provided with a first fixed plate, a second fixed plate, a third fixed plate and a fourth fixed plate from top to bottom, the camera is connected with the first fixed plate, the lens group is connected with the second fixed plate, the light source is connected with the third fixed plate, and the annular light source is connected with the fourth fixed plate.

[0009] According to the AOI detection mechanism of the die bonder according to some embodiments of the application, the top of the second connecting plate is provided with a driving motor, the output end of the driving motor is provided with a lead screw, the lead screw is sleeved with a lead screw nut, the outer periphery of the lead screw nut is provided with a third connecting plate, the bottom outer side of the third connecting plate is provided with a fifth fixed plate, the fifth fixed plate is provided with a jet pipe, and the top of the jet pipe is provided with a hose.

[0010] According to the AOI detection mechanism of the die bonder according to some embodiments of the application, the outer side of the first connecting plate is provided with a side plate, the outer side of the Y-axis displacement mechanism is provided with a sliding rail, the inner side of the side plate is provided with a sliding block, and the sliding block is in sliding connection with the sliding rail.

[0011] According to the AOI detection mechanism of the die bonder according to some embodiments of the application, the outer bottom of the Y-axis displacement mechanism is provided with a code reader, the outer bottom of the side plate is provided with an encoded ruler, the code reader is correspondingly arranged with the encoded ruler, and the outer bottom of the Y-axis displacement mechanism is provided with two photoelectric switches.

[0012] The application discloses an AOI detection mechanism of a die bonder, which comprises a rack, a linear driving mechanism, a lifting mechanism and a lifting platform.

[0013] The application discloses an AOI detection mechanism of a die bonder, wherein the output end of the lifting mechanism is provided with a first positioning plate, the bottom of the first positioning plate is provided with a second positioning plate, the rear end of the lifting platform is provided with positioning blocks on both sides, and a positioning groove is arranged between the two positioning blocks.

[0014] The application discloses an AOI detection mechanism of a die bonder, wherein the positioning blocks are provided with gas connection ports, the left and right ends of the connecting part are provided with first gas flow channels, the rear end of the lifting platform is provided with a second gas flow channel, the second gas flow channel is arranged on the rear end of the lifting platform, the middle part of the lifting platform is provided with a containing space, and the top of the lifting platform is provided with a plurality of containing grooves.

[0015] The application discloses an AOI detection mechanism of a die bonder, wherein the second gas flow channel is arranged transversely, the two first gas flow channels are respectively communicated with both ends of the second gas flow channel, the top of the first gas flow channel is provided with a long strip-shaped notch, and the containing space is communicated with the second gas flow channel through the notch.

[0016] The application discloses an AOI detection mechanism of a die bonder, wherein the dispensing functional head and the height measuring functional head are arranged on the top of the second avoiding space.

[0017] Additional aspects and advantages of the application will be made apparent by the following description. BRIEF DESCRIPTION OF DRAWINGS

[0018] The above and / or additional aspects and advantages of the present application will become apparent and more readily appreciated from the following description of the embodiments, taken in conjunction with the references to the following drawings, of which:

[0019] Figure 1 Structure diagram of the embodiment of the present application.

[0020] Figure 2 Structure diagram of the AOI detection assembly of the embodiment of the present application Figure One .

[0021] Figure 3 Structure diagram of the AOI detection assembly of the embodiment of the present application Figure Two .

[0022] Figure 4 Structure diagram of the transmission mechanism of the embodiment of the present application.

[0023] Figure 5 Side view of the transmission mechanism of the embodiment of the present application.

[0024] Figure 6 Structure diagram of the lifting mechanism of the embodiment of the present application.

[0025] Figure 7 Sectional view of the lifting mechanism of the embodiment of the present application.

[0026] Figure 8 Structure diagram of Figure 7 the enlarged view of A part in FIG. 6.

[0027] Mark No. : 1, workbench, 2, transmission mechanism, 3, AOI detection assembly, 4, first stand, 5, second stand, 6, limiting plate, 7, Y-axis displacement mechanism, 8, first connecting plate, 9, second connecting plate, 10, camera, 11, lens group, 12, light source, 13, annular light source, 14, first fixed plate, 15, second fixed plate, 16, third fixed plate, 17, fourth fixed plate, 18, driving motor, 19, screw rod, 20, screw rod nut, 21, third connecting plate, 22, fifth fixed plate, 23, air jet pipe, 24, hose, 25, side plate, 26, slide rail, 28, code reader, 29, coded ruler, 30, photoelectric switch, 31, rack, 32, linear driving mechanism, 33, lifting mechanism, 33, lifting platform, 35, first connecting frame, 36, second connecting frame, 37, first avoiding space, 38, second avoiding space, 39, connecting part, 40, first avoiding groove, 41, first positioning plate, 42, second positioning plate, 43, positioning block, 44, positioning groove, 45, gas connection port, 46, first gas flow channel, 47, second gas flow channel, 48, long strip-shaped notch, 49, accommodating space, 50, containing groove, 53, assembly plate, 54, first step part, 55, second step part, 56, third connecting plate, 57, second avoiding groove, 58, first boss, 59, second boss, 60, third connecting frame, 61, third avoiding groove. DETAILED DESCRIPTION

[0028] Embodiments of the present application are described below in detail, examples of which are shown in the drawings, wherein the same or similar reference signs represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary, only for explaining the present application, and cannot be understood as limiting the present application.

[0029] In the description of the present application, it is understood that the orientation description, such as the orientation or position relationship indicated by up, down, left, right, front, back, etc. is based on the orientation or position relationship shown in the drawings, only for the convenience of describing the present application and simplifying the description, and is not intended to indicate or imply that the indicated module or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0030] In the description of the present application, if there is a description of first, second, only for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features or implicitly indicating the sequence of indicated technical features.

[0031] In the description of the present application, unless otherwise explicitly defined, the words such as arrangement, installation, connection, etc. should be understood broadly, and the person skilled in the art can determine the specific meaning of the above words in the present application in combination with the specific content of the technical solution.

[0032] As shown in the figure, the embodiment of the present application provides an AOI detection mechanism of a die bonder. Figures 1-8

[0033] An AOI detection mechanism of a die bonder, comprising a workbench 1, a transmission mechanism 2 and an AOI detection assembly 3, the workbench 1 is provided with a first stand 4 and a second stand 5, the tail end of the first stand 4 is provided with a limiting plate 6, the limiting plate 6 is provided with a Y-axis displacement mechanism 7, the output end of the Y-axis displacement mechanism 7 is provided with a first connecting plate 8, the outer side of the AOI detection assembly 3 is provided with a second connecting plate 9, the front end of the first connecting plate 8 is connected with the second connecting plate 9, the AOI detection assembly 3 comprises a camera 10, a lens group 11, a light source 12 and a ring light source 13, the camera 10, the lens group 11, the light source 12 and the ring light source 13 are arranged in order from top to bottom, the transmission mechanism 2 is arranged on the second stand 5, and the AOI detection assembly 3 is arranged at the top tail end of the transmission mechanism 2.

[0034] The present application can realize high-precision detection by integrating a high-resolution camera 10, an optimally designed lens group 11 and a suitable light source 12, especially the recognition ability for subtle defects is greatly enhanced, which ensures the high-quality standard of the final product, and the design of the detection mechanism considers the convenience in actual production, and the structure is simple and compact, which reduces complex assembly parts, the configuration of the Y-axis displacement mechanism 7 and the connecting plate enables the AOI detection assembly 3 to be accurately adjusted in position as needed, adapts to chip detection requirements of different specifications, improves the flexibility and application range of the equipment, the entire AOI detection assembly 3 is cleverly placed at the top tail end of the transmission mechanism 2, and is stably installed through the connection of the first connecting plate 8 and the second connecting plate 9, which saves space and improves the overall integration of the equipment.

[0035] ​The AOI detection mechanism of the die bonder disclosed in the embodiment, the second connecting plate 9 is sequentially provided with the first fixed plate 14, the second fixed plate 15, the third fixed plate 16 and the fourth fixed plate 17 from top to bottom, the camera 10 is connected with the first fixed plate 14, the lens group 11 is connected with the second fixed plate 15, the light source 12 is connected with the third fixed plate 16, and the annular light source 13 is connected with the fourth fixed plate 17. Specifically, the first fixed plate 14 to the fourth fixed plate 17 sequentially provided on the second connecting plate 9 provide the camera 10, the lens group 11, the light source 12 and the annular light source 13 with stable and adjustable mounting positions, and the layered design not only helps the accurate alignment of the components, but also facilitates maintenance and replacement, thereby improving the reliability and maintenance convenience of the equipment.

[0036] The AOI detection mechanism of the die bonder disclosed in the embodiment, the top of the second connecting plate 9 is provided with a driving motor 18, the output end of the driving motor 18 is provided with a lead screw 19, the lead screw 19 is sleeved with a lead screw nut 20, the outer periphery of the lead screw nut 20 is provided with a third connecting plate 21, the bottom outer side of the third connecting plate 21 is provided with a fifth fixed plate 22, the fifth fixed plate 22 is provided with a jet pipe 23, and the top of the jet pipe 23 is provided with a hose 24. Specifically, the moving mechanism composed of the driving motor 18, the lead screw 19 and the lead screw nut 20 can realize the accurate displacement of the fifth fixed plate 22 and the jet pipe 23 thereon, so as to remove dust or foreign matters in the detection area, ensure the cleanliness of the detection environment, and further improve the accuracy of the detection result.

[0037] The AOI detection mechanism of the die bonder disclosed in the embodiment, the outer side of the first connecting plate 8 is provided with a side plate 25, the outer side of the Y-axis displacement mechanism 7 is provided with a sliding rail 26, the inner side of the side plate 25 is provided with a sliding block (not shown), and the sliding block is in sliding connection with the sliding rail 26. Specifically, the sliding rail 26 provided on the outer side of the Y-axis displacement mechanism 7 cooperates with the sliding block on the inner side of the side plate 25 to provide a stable and accurate moving mode, enhance the stability of the equipment during operation, effectively reduce the influence of mechanical vibration on the detection process, and improve the detection precision.

[0038] The Y-axis displacement mechanism 7 is provided with a code reader 28 at the outer bottom, the bottom outer side of the side plate 25 is provided with an encoding ruler 29, the code reader 28 is correspondingly arranged with the encoding ruler 29, and the outer bottom of the Y-axis displacement mechanism 7 is provided with two photoelectric switches 30. Specifically, the combination of the code reader 28 and the encoding ruler 29 arranged at the outer bottom of the Y-axis displacement mechanism 7 can monitor and feed back the position information of the first connecting plate 8 in real time, and the photoelectric switch 30 is used for limiting the stroke range, ensuring the safety and accuracy of the operation of the equipment, improving the degree of automation, and enhancing the control accuracy and response speed of the system. It can be understood that the two photoelectric switches 30 correspond to the width range of the transmission mechanism.

[0039] The AOI detection mechanism of the die bonder described in the embodiment comprises a rack 31, a linear drive mechanism 32, a lifting mechanism 33 and a lifting platform 34, the front end of the rack 31 is provided with a first connecting frame 35, the front end of the first connecting frame 35 is provided with a second connecting frame 36, the first connecting frame 35 and the second connecting frame 36 are provided with a first space 37, the first connecting frame 35 and the second connecting frame 36 are provided with a second space 38, the linear drive mechanism 32 is arranged at the top of the rack 31, the output end of the linear drive mechanism 32 is connected with the lifting mechanism 33, the lifting mechanism 33 is located in the first space 37, the output end of the lifting mechanism 33 is connected with the lifting platform 34, the rear end of the lifting platform 34 is provided with a connecting part 39, the top of the connecting part 39 is provided with a first space recess 40, the first connecting frame 35 is located in the first space recess 40, and the front end of the lifting platform 34 extends into the second space 38. Specifically, by designing the first space 37 and the second space 38, the linear drive mechanism 32 and the lifting mechanism 33 avoid direct contact with the track or other fixed parts during operation, thereby greatly reducing the possibility of metal dust and mechanical vibration caused by friction, helping to prevent the semiconductor product from being contaminated, ensuring that its electrical performance is not affected, protecting the chip from the risk of scattering due to vibration, thereby improving the quality of the final product, reducing the maintenance cost, and at the same time, the first space recess 40 is arranged at the connecting part at the rear end of the lifting platform 34, and the first connecting frame 35 is located therein, so that the overall structure does not occupy the space at the bottom of the rack, and the space is cleverly avoided, which is beneficial to the arrangement of various components at the bottom of the rack.

[0040] The AOI detection mechanism of the die bonder disclosed in the embodiment is characterized in that the output end of the lifting mechanism 33 is provided with a first positioning plate 41, the bottom of the first positioning plate 41 is provided with a second positioning plate 42, the rear end of the lifting platform 34 is provided with positioning blocks 43 on both sides, positioning grooves 44 are arranged between the two positioning blocks 43, and the bottom of the second positioning plate 42 is connected with the bottom of the positioning groove 44.

[0041] The AOI detection mechanism of the die bonder disclosed in the embodiment is characterized in that the positioning blocks 43 are all provided with gas connection ports 45, the left and right ends of the connecting part 39 are both provided with first gas flow channels 46, the rear end of the lifting platform 34 is provided with a second gas flow channel 47, the second gas flow channel 47 is arranged transversely, the two first gas flow channels 46 are respectively communicated with both ends of the second gas flow channel 47, the top of the first gas flow channel 46 is provided with a long strip-shaped notch 48, and the accommodating space 49 is communicated with the second gas flow channel 47 through the notch 48. The middle part of the lifting platform 34 is provided with an accommodating space 49, the top of the lifting platform 34 is provided with a plurality of accommodating grooves 50, the gas connection port 45, the first gas flow channel 46, the second gas flow channel 47, the accommodating space 49 and the accommodating groove 50 are sequentially communicated, and the accommodating grooves 50 are arranged in an array. Specifically, the gas connection ports 45 are arranged on the positioning blocks 43, the first and second gas flow channels 46 and 47, the accommodating space 49 and the accommodating grooves 50 are arranged on the lifting platform 34, a complete gas flow path is formed, the chips can be adsorbed in the accommodating grooves 50, and the stability of chip transmission is greatly improved.

[0042] The AOI detection mechanism of the die bonder disclosed in the embodiment is characterized in that the positioning blocks 43 are arranged on both sides of the positioning grooves 44, the first gas flow channels 46 are connected to both sides of the second gas flow channel 47, the connecting part 39 is provided with the first avoidance recess 40, the first gas flow channel 46 needs to be provided with a corner, and therefore the width L3 of the first gas flow channel 46 and the width L4 of the second gas flow channel 47 should be greater than the height L5 of the accommodating space 49, so as to ensure the efficiency of the gas in the accommodating space 49 being sucked into the first gas flow channel 46 from the second gas flow channel 47 and finally being sucked out from the gas connection port 45. The size of the flow channel and the accommodating space 49 ensures the chip adsorption effect of the embodiment under the condition of the first avoidance recess 40.

[0043] The AOI detection mechanism of the die bonder disclosed in the embodiment is characterized in that the dispensing function head and the height measuring function head are both located at the top of the second avoidance space 38. Specifically, the dispensing function head and the height measuring function head are both located at the top of the second avoidance space 38, which not only makes full use of the space but also avoids interference between them, ensures efficient dispensing and height measuring, and improves the overall work efficiency and product quality.

[0044] The AOI detection mechanism of the die bonder disclosed in the embodiment, the output end of the linear drive mechanism 32 is provided with a first positioning plate 41, the front end of the first positioning plate 41 is provided with a second positioning plate 42, the second positioning plate 42 extends into the first avoiding space 37, the bottom of the second positioning plate 42 is provided with an assembly plate 53, and the lifting mechanism 33 is arranged on the assembly plate 53. Specifically, the output end of the linear drive mechanism 32 is provided with the first positioning plate 41 and the second positioning plate 42, so that the lifting mechanism 33 is more stable, and the second positioning plate 42 can extend into the first avoiding space 37, so that the accuracy control during operation is ensured, and the reliability of the whole transmission mechanism is improved.

[0045] The AOI detection mechanism of the die bonder disclosed in the embodiment, the first connecting plate 8 is provided with a first step portion 54 on one side of the top thereof close to the second connecting plate 9, the second connecting plate 9 is provided with a second step portion 55 on one side of the top thereof close to the first connecting plate 8, and the first step portion 54 and the second step portion 55 are correspondingly arranged. Specifically, the first connecting plate 8 and the second connecting plate 9 are provided with the step portions corresponding to each other, so that the lifting platform 34 can be lifted between the two step portions, and the range of the forward and backward movement of the lifting platform 34 is limited.

[0046] The AOI detection mechanism of the die bonder disclosed in the embodiment, the distance between the top of the first avoiding groove 40 and the bottom of the first connecting frame 35 is L1, the height of the first step portion 54 and the height of the second step portion 55 are both L2, and L1 is less than L2. Specifically, L1 refers to the distance between the top of the first avoiding groove 40 and the bottom of the first connecting frame 35 when the lifting platform 34 is located at the bottommost position, that is, the maximum height to which the lifting platform 34 can be lifted is less than the height of the first step portion 54 and the second step portion 55, so that the lifting platform 34 is always located between the first step portion 54 and the second step portion 55.

[0047] The AOI detection mechanism of the die bonder disclosed in the embodiment, a plurality of third connecting plates 56 are arranged between the first connecting frame 35 and the second connecting frame 36, the bottom of each third connecting plate 56 is recessed upward to form a second avoiding groove 57, and the second avoiding groove 57 is located at the top of the second avoiding space 38. Specifically, a plurality of third connecting plates 56 are arranged between the first connecting frame 35 and the second connecting frame 36, and the bottom is recessed upward to form a second avoiding groove 57, so that the stability of the connection is ensured, and the avoiding space is provided, so that the chip is not in contact with the chip on the lifting platform 34 during transmission.

[0048] The second stand 5 is provided with two, the front and rear ends of the second stand 5 are respectively provided with a first boss 58 and a second boss 59, the front end of the second connecting frame 36 is provided with a third connecting frame 60, the third connecting frame 60 is connected with the top of the first boss 58, the two ends of the rack 31 are respectively connected with two second bosses 59, the first boss 58 and the second boss 59 are provided with a third avoiding groove 61, the first avoiding space 37 and the second avoiding space 38 are located at the top of the third avoiding groove 61. Specifically, the first boss 58 and the second boss 59 provided at the front and rear ends of the stand, and the design of the third connecting frame 60 provide a solid foundation support for the whole device, the third avoiding groove 61 formed can avoid the lifting mechanism 33 and the lifting platform 34, that is, the lifting mechanism 33 and the lifting platform 34 are all in the third avoiding groove 61, can smoothly slide, and will not interfere.

[0049] Although the embodiments of the present application have been shown and described, those skilled in the art can understand that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and purposes of the present application, and the scope of the present application is defined by the claims and their equivalents.

Claims

1. An AOI inspection mechanism for a die bonder, characterized in that: The device includes a workbench, a transmission mechanism, and an AOI (Automated Optical Inspection) component. The workbench has a first stand and a second stand. A limit plate is located at the tail end of the first stand, and a Y-axis displacement mechanism is mounted on the limit plate. A first connecting plate is located at the output end of the Y-axis displacement mechanism. A second connecting plate is located on the outer side of the AOI component, and the front end of the first connecting plate is connected to the second connecting plate. The AOI component includes a camera, a lens assembly, a light source, and a ring light source, arranged sequentially from top to bottom. The transmission mechanism is mounted on the second stand, and the AOI component is located at the top tail end of the transmission mechanism. A side plate is located on the outer side of the first connecting plate. A slide rail is located on the outer side of the Y-axis displacement mechanism, and a slider is located on the inner side of the side plate, slidably connected to the slide rail. A barcode reader is located at the bottom outer side of the Y-axis displacement mechanism, and an encoding ruler is located on the bottom outer side of the side plate, with the barcode reader corresponding to the encoding ruler. Two photoelectric switches are located at the bottom outer side of the Y-axis displacement mechanism. The transmission mechanism includes a frame, a linear drive mechanism, a lifting mechanism, and a lifting platform. A first connecting frame is located at the front end of the frame, and a second connecting frame is located at the front end of the first connecting frame. A first clearance space is provided between the frame and the first connecting frame, and a second clearance space is provided between the first connecting frame and the second connecting frame. The linear drive mechanism is located at the top of the frame, and its output end is connected to the lifting mechanism. The lifting mechanism is located within the first clearance space, and its output end is connected to the lifting platform. A connecting portion is located at the rear end of the lifting platform, and a first clearance groove is located at the top of the connecting portion. The first connecting frame is located within the first clearance groove, and the front end of the lifting platform extends into the second clearance space.

2. The AOI inspection mechanism for a die bonder according to claim 1, characterized in that: The second connecting plate is provided with a first fixing plate, a second fixing plate, a third fixing plate and a fourth fixing plate arranged in sequence from top to bottom. The camera is connected to the first fixing plate, the lens group is connected to the second fixing plate, the light source is connected to the third fixing plate, and the ring light source is connected to the fourth fixing plate.

3. The AOI inspection mechanism for a die bonder according to claim 1, characterized in that: A drive motor is provided on the top of the second connecting plate, a lead screw is provided at the output end of the drive motor, a lead screw nut is sleeved on the lead screw, a third connecting plate is provided on the outer periphery of the lead screw nut, a fifth fixing plate is provided on the bottom outer side of the third connecting plate, an air jet pipe is provided on the fifth fixing plate, and a hose is provided on the top of the air jet pipe.

4. The AOI inspection mechanism for a die bonder according to claim 1, characterized in that: The output end of the lifting mechanism is provided with a first positioning plate, the bottom of the first positioning plate is provided with a second positioning plate, positioning blocks are provided on both sides of the rear end of the lifting platform, a positioning groove is provided between the two positioning blocks, and the bottom of the second positioning plate is connected to the bottom of the positioning groove.

5. The AOI inspection mechanism for a die bonder according to claim 4, characterized in that: Each positioning block is provided with a gas connection port, and the left and right ends of the connection part are provided with a first gas flow channel. The rear end of the lifting platform is provided with a second gas flow channel. The middle part of the lifting platform is provided with a receiving space, and the top of the lifting platform is provided with multiple receiving slots. The gas connection port, the first gas flow channel, the second gas flow channel, the receiving space and the receiving slots are connected in sequence, and the receiving slots are distributed in an array.

6. The AOI inspection mechanism for a die bonder according to claim 5, characterized in that: The second gas flow channel is arranged horizontally, and the two first gas flow channels are respectively connected to the two ends of the second gas flow channel. The top of the first gas flow channel is provided with an elongated notch, and the accommodating space is connected to the second gas flow channel through the notch.

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