Manufacturing method of automobile laser radar rigid-flex PCB (printed circuit board)

Through the combination of composite substrates and multi-process methods, the rigidity and flexibility of automotive lidar circuit boards are optimized, which solves the problems of high-density interconnection and mechanical impact resistance, and achieves the synchronous improvement of high-frequency signal integrity and mechanical stability.

CN120456432APending Publication Date: 2025-08-08HUIZHOU ZHONGJING ELECTRONICS TECH CO LTD
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Patent Information

Application Number
CN202510627578.8
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-05-15
Publication Date
2025-08-08

AI Technical Summary

Technical Problem

In the prior art, the circuit board of the automotive lidar transmitter module has shortcomings in high-density interconnection and mechanical impact resistance, resulting in extended signal paths, increased risk of solder cracking and interface fatigue failure, making it difficult to meet the needs of high integration and long-term reliability.

Method used

A composite substrate with rigid layer, flexible layer and cover layer is used to build a high-bound force interface and multi-stage enhancement network through plasma activation treatment, interface coupling agent spraying, staged compression, laser drilling and hole metallization, UV photolysis treatment and other processes to optimize thermal conductivity and mechanical properties, reduce signal loss, and suppress warpage and interlayer delamination.

Benefits of technology

It achieves synchronous improvement of high-frequency signal integrity and mechanical stability, significantly enhances the impact resistance and signal transmission reliability of the circuit board, and solves the contradictions in traditional designs.

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Abstract

The invention relates to the technical field of electronic device manufacturing, and discloses an automobile laser radar rigid-flexible PCB manufacturing method, which comprises the following steps: preparing a rigid layer-flexible layer-covering layer composite base material, performing plasma activation on a flexible layer copper surface, spraying a coupling agent, and pre-curing to form a bonding layer; the method comprises the following steps of: preparing a golden finger region, precisely pasting a PI (Polyimide) protective adhesive tape coated with nano TiO2 on the golden finger region, constructing an eight-layer structure by adopting a staged laminating process, forming an interconnection structure through laser drilling and hole metallization, and finally processing the outline of the golden finger by combining a precise mold and carrying out UV (Ultraviolet) photolysis surface treatment. The performance of the rigid-flex board is improved through collaborative innovation of materials and processes; heat conduction and bending resistance are optimized through gradient filler; the multi-scale bonding enhances the damp-heat resistance of the interface; photolysis-adhesive tape synergistically cleans residual adhesive; the signal loss is reduced through plasma-laser; stress relief and warping prevention are achieved through staged pressing, and the stability and signal integrity of the high-density rigid-flex board in high-frequency, mechanical and thermal environments are achieved.
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