Display panel, display device and processing method

Abstract

The present application provides a display panel, a display device, and a processing method, relating to the field of display technology. The display panel includes a first substrate and a second substrate arranged opposite each other, the first substrate being provided with a light-emitting layer; the display panel having a display area and a non-display area; the second substrate being provided with heat dissipation channels, the heat dissipation channels including a first heat dissipation channel located in the display area and a second heat dissipation channel located in the non-display area; the heat dissipation channels are filled with a heat dissipation medium, which can flow in the first and second heat dissipation channels; the heat dissipation medium has a flow direction in the first heat dissipation channel, and the first heat dissipation channel has a first section and a second section connected in sequence in the direction of the heat dissipation medium flow, the throttling area of ​​the first section being larger than the throttling area of ​​the second section. The display surface provided by the present application has the advantage of good heat dissipation effect.

Description

Technical Field

[0001] The present application belongs to the technical field of display devices, and more specifically, relates to a display panel, a display device, and a processing method. Background Art

[0002] As a new display technology, sub-millimeter light-emitting diodes (MiniLEDs) have the core advantages of high brightness, high contrast, wide color gamut, long life, and energy saving. However, display panels that use MiniLED display technology generate a large amount of heat when operating at high brightness, which places higher demands on heat dissipation.

[0003] However, the heat dissipation effect of the MiniLED display panel in the related art is poor. Summary of the Invention

[0004] The purpose of the embodiments of the present application is to provide a display panel, a display device, and a processing method to solve the technical problem of poor heat dissipation effect of MiniLED display panels in the prior art.

[0005] In a first aspect, an embodiment of the present application provides a display panel.

[0006] The display panel provided by the embodiment of the present application includes a first substrate and a second substrate arranged opposite to each other, and a light-emitting layer is provided on the first substrate; the display panel has a display area and a non-display area, and a heat dissipation channel is provided in the second substrate, and the heat dissipation channel includes a first heat dissipation channel located in the display area and a second heat dissipation channel located in the non-display area, and the first heat dissipation channel is connected to the second heat dissipation channel; the heat dissipation channel is filled with a heat dissipation medium, and the heat dissipation medium can flow in the first heat dissipation channel and the second heat dissipation channel; wherein, the heat dissipation medium has a flow direction in the first heat dissipation channel, and the first heat dissipation channel has a first section and a second section connected in sequence in the flow direction of the heat dissipation medium, and the throttling area of ​​the first section is larger than the throttling area of ​​the second section.

[0007] The beneficial effect of the display panel provided by the embodiment of the present application is that: compared with the prior art, the heat dissipation medium in the heat dissipation channel of the display panel provided by the embodiment of the present application can flow in the heat dissipation channel, and the heat dissipation medium conducts the heat generated by the light-emitting layer in the display area to the non-display area, thereby improving the heat dissipation effect of the light-emitting layer through the heat dissipation medium, avoiding heat accumulation in the display area, and making the display panel provided by the embodiment of the present application have the advantage of better heat dissipation effect.

[0008] In addition, the first heat dissipation channel of the display panel provided by the embodiment of the present application is provided with a first section and a second section connected along the flow direction of the heat dissipation medium. The throttling area of ​​the first section is larger than the throttling area of ​​the second section. After the heat dissipation medium in the first heat dissipation channel is heated by the light-emitting layer, it can flow automatically in the direction from the first section to the second section, so that the heat dissipation medium in the first heat dissipation channel can continue to flow directionally in the first heat dissipation channel to the second heat dissipation channel, thereby carrying the heat generated by the light-emitting layer in the display area to the non-display area, so that the display panel provided by the embodiment of the present application has the advantage of better heat dissipation effect.

[0009] Optionally, there are multiple first segments and multiple second segments, and the multiple first segments and the multiple second segments are alternately arranged in sequence.

[0010] Optionally, the first section has a first liquid inlet end and a first liquid outlet end, and the distance between the first liquid outlet end and the first substrate is smaller than the distance between the first liquid inlet end and the first substrate; the second section has a second liquid inlet end and a second liquid outlet end, and the distance between the second liquid outlet end and the first substrate is larger than the distance between the second liquid inlet end and the substrate.

[0011] Optionally, there are multiple first heat dissipation channels, and the multiple first heat dissipation channels are arranged in parallel and spaced apart, and the liquid inlet ends of the multiple first heat dissipation channels are all connected to the second heat dissipation channel, and the liquid outlet ends of the multiple first heat dissipation channels are all connected to the second heat dissipation channel;

[0012] And / or, the light-emitting layer includes a plurality of light-emitting units arranged in an array, and the orthographic projections of the light-emitting units on the first substrate are located within the orthographic projections of the first heat dissipation channels on the first substrate.

[0013] Optionally, the second substrate includes a second base substrate and a packaging layer provided on the second base substrate, and the packaging layer and the second base substrate form the heat dissipation channel.

[0014] Optionally, the encapsulation layer is located on a side of the second base substrate away from the light-emitting layer; or, the encapsulation layer is located on a side of the second base substrate close to the light-emitting layer.

[0015] Optionally, the light-emitting layer includes a plurality of light-emitting units arranged in an array, the packaging layer is located on a side of the second base substrate close to the light-emitting units, and part of the first heat dissipation channel is located between two adjacent light-emitting units.

[0016] Optionally, a dam is provided between the second base substrate and the packaging layer, and the dam, the second base substrate and the packaging layer together form the heat dissipation channel.

[0017] In a second aspect, an embodiment of the present application provides a display device.

[0018] The display device provided in an embodiment of the present application includes the display panel described in any of the above embodiments.

[0019] It can be understood that the beneficial effects of the second aspect mentioned above can be found in the relevant description of the first aspect mentioned above, and will not be repeated here.

[0020] In a third aspect, an embodiment of the present application provides a processing method.

[0021] The processing method provided in the embodiments of the present application is used to process the display panel described in any of the above embodiments, or to process the display device described in any of the above embodiments, including the following steps:

[0022] Coating a dam on the surface of the second base substrate, wherein the dam is arranged around a preset area, and the dam is located at an edge of the second base substrate and has an opening;

[0023] Laminating the packaging layer to the second base substrate to form a heat dissipation channel by the cofferdam, the packaging layer and the second base substrate;

[0024] filling the heat dissipation channel with a heat dissipation medium through the opening;

[0025] closing the opening so that the second substrate, the dam, the packaging layer and the heat dissipation medium form a second substrate;

[0026] The second substrate is bonded to the first substrate provided with the light emitting layer to form a display panel.

[0027] It can be understood that the beneficial effects of the third aspect mentioned above can be found in the relevant description of the first aspect mentioned above, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0029] Figure 1 A schematic diagram of the structure of a display panel provided in an embodiment of the present application;

[0030] Figure 2 for Figure 1 Schematic cross-sectional view at AA in the middle;

[0031] Figure 3 for Figure 1 Schematic cross-sectional view at the middle BB;

[0032] Figure 4 The display panel provided in the embodiment of the present application is Figure 1 Schematic cross-sectional view at CC;

[0033] Figure 5 A display panel provided in another embodiment of the present application is Figure 1 Schematic cross-sectional view at CC;

[0034] Figure 6 for Figure 4 A partial enlarged schematic diagram of point D in the middle;

[0035] Figure 7 A flowchart of the processing method provided in an embodiment of the present application;

[0036] Figure 8 A schematic diagram of a processing method provided in an embodiment of the present application;

[0037] Figure 9 This is a schematic diagram of the cofferdam in the processing method provided in an embodiment of the present application.

[0038] Among them, the reference numerals in the figures are:

[0039] 100, display panel; 101, display area; 102, non-display area;

[0040] 10. a first substrate;

[0041] 20. Light-emitting layer; 21. Light-emitting unit;

[0042] 30. Second substrate; 301. Concave portion; 31. Second base substrate; 311. First surface; 32. Encapsulation layer; 321. Second surface; 33. Heat dissipation channel; 331. First heat dissipation channel; 331a. First section; 331a1. First liquid inlet; 331a2. First liquid outlet; 331b. Second section; 331b1. Second liquid inlet; 331b2. Second liquid outlet; 332. Second heat dissipation channel; 332a. First portion; 332b. Second portion; 332c. Third portion; 332d. Fourth portion; 34. Heat dissipation medium; 35. Weir; 351. Opening. DETAILED DESCRIPTION

[0043] In order to make the technical problems, technical solutions and beneficial effects to be solved by this application more clearly understood, this application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0044] It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being “connected to” another element, it may be directly connected to the other element or indirectly connected to the other element.

[0045] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0046] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. Throughout the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0047] Embodiments of the present application provide a display panel, a display device using the display panel, and a display panel processing method for processing the display panel.

[0048] The display panel provided in the embodiments of the present application can be any one of a light emitting diode (LED) display panel, a liquid crystal display (LCD), an organic light emitting diode (OLED) display panel, a sub-millimeter light emitting diode (Mini LED) display panel, and a micro LED (Micro LED / μLED) display panel.

[0049] Combined with the following Figures 1 to 5 An embodiment of the present application will be described in which the display panel provided is a sub-millimeter light emitting diode (MiniLight Emitting Diode, MiniLED) display panel.

[0050] As a new display technology, sub-millimeter light-emitting diodes have the core advantages of high brightness, high contrast, wide color gamut, long life and energy saving. For display panels that use MiniLED display technology, they will generate a lot of heat when working at high brightness, which puts higher requirements on heat dissipation.

[0051] However, the heat dissipation effect of the MiniLED display panel in the related art is poor.

[0052] It should be noted that the first direction hereinafter is the x direction shown in the figure, the second direction hereinafter is the y direction shown in the figure, and the thickness direction of the display panel hereinafter is the z direction shown in the figure.

[0053] The display panel 100 provided in the embodiment of the present application includes a first substrate 10 and a second substrate 30 that are oppositely arranged, and a light-emitting layer 20 is provided on the first substrate 10 .

[0054] In some embodiments, as Figure 3 、 Figure 4 and Figure 5 As shown, the light-emitting layer 20 includes a plurality of light-emitting units 21, and the plurality of light-emitting units 21 are arranged in an array on the surface of the first substrate 10 on one side of the thickness direction z of the display panel 100. The light-emitting units 21 are used to emit light to achieve the display effect of the display panel 100 provided in the embodiment of the present application.

[0055] The display panel 100 has a display area 101 and a non-display area 102. A heat dissipation channel 33 is provided in the second substrate 30. The heat dissipation channel 33 includes a first heat dissipation channel 331 located in the display area 101 and a second heat dissipation channel 332 located in the non-display area 102. The heat dissipation channel 33 is filled with a heat dissipation medium 34, and the heat dissipation medium 34 can flow in the first heat dissipation channel 331 and the second heat dissipation channel 332.

[0056] like Figure 1 and Figure 2 As shown, the non-display area 102 is arranged around the display area 101, and the light-emitting unit 21 is located in the display area 101. The light-emitting unit 21 can emit light and generate heat when powered on. The heat generated by the part of the light-emitting layer 20 located in the display area 101 can be conducted to the heat dissipation medium 34 in the first heat dissipation channel 331, so that the temperature of the heat dissipation medium 34 in the first heat dissipation channel 331 increases.

[0057] The first heat dissipation channel 331 and the second heat dissipation channel 332 are connected. The heat dissipation medium 34 in the first heat dissipation channel 331 can flow into the second heat dissipation channel 332, and the heat dissipation medium 34 in the second heat dissipation channel 332 can be conducted into the first heat dissipation channel 331. The temperature in the non-display area 102 is lower than the temperature in the display area 101. Therefore, after the heat dissipation medium 34 in the first heat dissipation channel 331 flows into the second heat dissipation channel 332, the heat is dissipated into the non-display area 102 in the second heat dissipation channel 332, thereby dissipating the heat of the light-emitting layer 20 in the display area 101 by heat convection. Compared with the display panel 100 in the related art that uses heat conduction and heat radiation, the heat dissipation effect can be significantly improved.

[0058] The beneficial effect of the display panel 100 provided by the embodiment of the present application is that: compared with the prior art, the heat dissipation medium 34 in the heat dissipation channel 33 of the display panel 100 provided by the embodiment of the present application can flow in the heat dissipation channel 33, and the heat dissipation medium 34 conducts the heat generated by the light-emitting layer 20 in the display area 101 to the non-display area 102, thereby improving the heat dissipation effect of the light-emitting layer 20 through the heat dissipation medium 34, avoiding heat accumulation in the display area 101, and making the display panel 100 provided by the embodiment of the present application have the advantage of better heat dissipation effect.

[0059] In some embodiments provided in the present application, the heat dissipation medium 34 has a flow direction a in the first heat dissipation channel 331, and the first heat dissipation channel 331 has a first section 331a and a second section 331b connected in sequence in the flow direction a of the heat dissipation medium 34, and the throttling area of ​​the first section 331a is greater than the throttling area of ​​the second section 331b.

[0060] like Figure 2 As shown, the heat dissipation medium 34 flows along the first direction x in the first heat dissipation channel 331, and the heat dissipation medium 34 flows from the display area 101 to the non-display area 102 along its flow direction a, thereby conducting the heat in the display area 101 to the non-display area 102 through the flow of the heat dissipation medium 34.

[0061] It should be noted that the throttling area refers to the cross-sectional area of ​​the heat dissipation channel 33 in a plane orthogonal to the flow direction of the heat dissipation medium 34 when the heat dissipation medium 34 flows in the heat dissipation channel 33 .

[0062] In some embodiments, the inner diameter of the first segment 331 a in at least one of the first direction x, the second direction y, and the thickness direction z of the display panel is greater than the inner diameter of the second segment 331 b in the corresponding direction.

[0063] The first section 331a is located upstream of the second section 331b in the flow direction a of the heat dissipation medium 34, and the throttling area of ​​the first section 331a is larger than the throttling area of ​​the second section 331b. When the heat dissipation medium 34 in the first heat dissipation channel 331 absorbs the heat emitted by the light-emitting layer 20 and heats up, the temperature of the heat dissipation medium 34 in the first section 331a and the temperature of the heat dissipation medium 34 in the second section 331b rise synchronously and expand synchronously.

[0064] The volume of the first section 331a is greater than that of the second section 331b. When the heat dissipation medium 34 in the first section 331a and the heat dissipation medium 34 in the second section 331b expand at the same expansion rate, the increased volume of the heat dissipation medium 34 in the first section 331a is greater than the increased volume of the heat dissipation medium 34 in the second section 331b. Under the action of the difference between the pressure exerted by the inner wall of the first section 331a on the heat dissipation medium 34 in the first section 331a and the pressure exerted by the inner wall of the second section 331b on the heat dissipation medium 34 in the second section 331b, the heat dissipation medium 34 in the first section 331a is driven to flow into the second section 331b.

[0065] Therefore, by setting the first section 331a and the second section 331b in the first heat dissipation channel 331, the heat dissipation medium 34 in the first heat dissipation channel 331 can flow in the direction from the first section 331a to the second section 331b after being heated by the light-emitting layer 20, so that the heat dissipation medium 34 in the first heat dissipation channel 331 can continue to flow in a direction within the first heat dissipation channel 331 to the second heat dissipation channel 332, thereby carrying the heat generated by the light-emitting layer 20 in the display area 101 to the non-display area 102.

[0066] In some embodiments provided in the present application, there are multiple first segments 331 a and multiple second segments 331 b, and the multiple first segments 331 a and the multiple second segments 331 b are alternately arranged in sequence.

[0067] like Figure 4 and Figure 5 As shown, the first heat dissipation channel 331 extends along the first direction x, and the first section 331a and the second section 331b are alternately arranged in sequence along the first direction x to form the first heat dissipation channel 331. One end of the first heat dissipation channel 331 is provided with the first section 331a, and the other end of the first heat dissipation channel 331 is provided with the second section 331b, thereby driving the heat dissipation medium 34 in the multiple first sections 331a and the multiple second sections 331b to flow along the first direction x, thereby preventing the heat dissipation medium 34 in the first heat dissipation channel 331 from flowing back.

[0068] In some embodiments provided in the present application, the first section 331a has a first liquid inlet end 331a1 and a first liquid outlet end 331a2, and the distance between the first liquid outlet end 331a2 and the first substrate 10 is smaller than the distance between the first liquid inlet end 331a1 and the first substrate 10, and the second section 331b has a second liquid inlet end 331b1 and a second liquid outlet end 331b2, and the distance between the second liquid outlet end 331b2 and the first substrate 10 is greater than the distance between the second liquid inlet end 331b1 and the substrate.

[0069] like Figure 4 、 Figure 5 and Figure 6 As shown, the first section 331a and the second section 331b are both arranged obliquely, the first liquid inlet end 331a1 of the first section 331a is away from the substrate, the first liquid outlet end 331a2 of the first section 331a is close to the first substrate 10, the second liquid inlet end 331b1 of the second section 331b is close to the first substrate 10, and the second liquid inlet end 331b1 of the second section 331b is connected to the first liquid outlet end 331a2 of the first section 331a, the second liquid outlet end 331b2 of the second section 331b is away from the first substrate 10, and the second liquid outlet end 331b2 of the second section 331b is connected to the first liquid inlet end 331a1 of another first section 331a, so that the first heat dissipation channel 331 composed of multiple first sections 331a and multiple second sections 331b is formed Figure 4 and Figure 5 The wavy structure shown in .

[0070] On the one hand, the first liquid outlet end 331a2 of the first section 331a and the second liquid inlet end 331b1 of the second section 331b are close to the light-emitting layer 20, so that when the light-emitting layer 20 generates heat during operation, the temperature of the heat dissipation medium 34 in the first liquid outlet end 331a2 of the first section 331a and the second liquid inlet end 331b1 of the second section 331b is higher than the temperature of the heat dissipation medium 34 in the first section 331a, and the temperature of the heat dissipation medium 34 in the first liquid outlet end 331a2 of the first section 331a and the second liquid inlet end 331b1 of the second section 331b is higher than the heat dissipation medium 34 in the second section 331b, so that the heat dissipation medium 34 at the connection between the first liquid outlet end 331a2 of the first section 331a and the second liquid inlet end 331b1 of the second section 331b is heated and diffused, driving the heat dissipation medium 34 in the first section 331a to flow into the second section 331b.

[0071] On the other hand, the first liquid inlet end 331a1 of the first section 331a and the second liquid outlet end 331b2 of the second section 331b are away from the light-emitting layer 20, so that the temperature of the heat dissipation medium 34 at the first liquid inlet end 331a1 of the first section 331a is lower than the temperature of the heat dissipation medium 34 at the first liquid outlet end 331a2 of the first section 331a, so that the tendency of the heat dissipation medium 34 at the first liquid inlet end 331a1 to flow back to the second liquid outlet end 331b2 is smaller than the tendency of the heat dissipation medium 34 at the first liquid outlet end 331a2 to flow to the second liquid inlet end 331b1, thereby preventing the heat dissipation medium 34 in the first heat dissipation channel 331 from flowing back.

[0072] In other embodiments provided in this application, Figure 4 、 Figure 5 and Figure 6 As shown, the throttling area of ​​the first section 331a gradually decreases along the first direction x, so that after the heat dissipation medium 34 in the first section 331a is heated and expanded by the light-emitting layer 20 in the display area 101, the heat dissipation medium 34 in the first section 331a is driven to flow along the first direction x through the inner wall of the first section 331a; the throttling area of ​​the second section 331b gradually decreases along the first direction x, so that after the heat dissipation medium 34 in the second section 331b is heated and expanded by the light-emitting layer 20 in the display area 101, the heat dissipation medium 34 in the second section 331b is driven to flow along the first direction x through the inner wall of the second section 331b.

[0073] In some embodiments provided in this application, Figure 4 As shown, the orthographic projection of the first liquid outlet end 331a2 of the first section 331a on the first substrate 10 is located within the orthographic projection of the light-emitting unit 21 on the first substrate 10, the orthographic projection of the second liquid inlet section of the second section 331b on the first substrate 10 is located within the orthographic projection of the light-emitting unit 21 on the first substrate 10, the orthographic projection of the first liquid inlet end 331a1 of the first section 331a on the first substrate 10 is staggered with the orthographic projection of the light-emitting unit 21 on the first substrate 10, and the orthographic projection of the second liquid outlet end 331b2 of the second section 331b on the first substrate 10 is staggered with the orthographic projection of the light-emitting unit 21 on the first substrate 10.

[0074] Thus, on one hand, the first liquid outlet end 331a2 of the first section 331a and the second liquid inlet end 331b1 of the second section 331b are close to the light emitting unit 21, and the first liquid inlet end 331a1 of the first section 331a and the second liquid outlet end 331b2 of the second section 331b are far away from the light emitting unit 21. The temperature of the heat dissipation medium 34 in the first liquid outlet end 331a2 of the first section 331a and the second liquid inlet end 331b1 of the second section 331b is higher than that in the first liquid inlet end 331a1 of the first section 331a and the second liquid outlet end 331b2 of the second section 331b. The temperature of the heat dissipation medium 34 causes the heat dissipation medium 34 at the connection between the first liquid outlet end 331a2 of the first section 331a and the second liquid inlet end 331b1 of the second section 331b to diffuse due to the heat, driving the heat dissipation medium 34 in the first section 331a to flow into the second section 331b. In addition, the tendency of the heat dissipation medium 34 at the first liquid inlet end 331a1 to flow back to the second liquid outlet end 331b2 is smaller than the tendency of the heat dissipation medium 34 at the first liquid outlet end 331a2 to flow to the second liquid inlet end 331b1, thereby preventing the heat dissipation medium 34 in the first heat dissipation channel 331 from flowing back.

[0075] In some other embodiments provided in the present application (not shown in the figures), the throttling area of ​​the first heat dissipation channel 331 gradually decreases along the first direction x, so that the heat dissipation medium 34 in the first heat dissipation channel 331 is driven to flow along the first direction x through the inner wall of the first heat dissipation channel 331 after being heated and expanded by the light-emitting layer 20 in the display area 101.

[0076] In some embodiments provided in the present application, there are multiple first heat dissipation channels 331, and the multiple first heat dissipation channels 331 are arranged in parallel and spaced apart. The liquid inlet ends of the multiple first heat dissipation channels 331 are all connected to the second heat dissipation channel 332, and the liquid outlet ends of the multiple first heat dissipation channels 331 are all connected to the second heat dissipation channel 332.

[0077] like Figure 2 and Figure 3 As shown, the first heat dissipation channel 331 extends along the first direction x, and multiple first heat dissipation channels 331 are arranged in parallel and spaced apart along the second direction y, so that the multiple first heat dissipation channels 331 are evenly distributed in the display area 101. By increasing the number of first heat dissipation channels 331, the heat dissipation effect of the display panel 100 provided in the embodiment of the present application is improved.

[0078] In some embodiments provided herein, the light-emitting layer 20 includes a plurality of light-emitting units 21 arranged in an array, and the orthographic projections of the light-emitting units 21 on the first substrate 10 are located within the orthographic projections of the first heat dissipation channels 331 on the first substrate 10 .

[0079] The light emitting unit 21 may be a light emitting diode, which can emit light and generate heat when powered on. Figure 4As shown, the first heat dissipation channel 331 covers one side of the light-emitting unit 21 in the thickness direction z of the display panel 100, thereby improving the heat exchange efficiency between the light-emitting unit 21 and the heat dissipation medium 34 in the first heat dissipation channel 331, and further improving the heat dissipation effect of the display panel 100 provided in the embodiment of the present application.

[0080] In some embodiments, the orthographic projections of the plurality of light emitting units 21 on the first substrate 10 are located within the orthographic projection of the same first heat dissipation channel 331 on the first substrate 10 .

[0081] In some other embodiments, the orthographic projections of the plurality of light emitting units 21 on the first substrate 10 are respectively located within the orthographic projections of the plurality of first heat dissipation channels 331 on the first substrate 10 .

[0082] In some embodiments provided in the present application, the second substrate 30 includes a second base substrate 31 and an encapsulation layer 32 provided on the second base substrate 31 . The encapsulation layer 32 and the second base substrate 31 form a heat dissipation channel 33 .

[0083] like Figure 4 As shown, the second substrate 30 is bonded to the first substrate 10 or machined onto the surface of the first substrate 10. The second base substrate 31 or encapsulation layer 32 abuts against the multiple light-emitting units 21 of the light-emitting layer 20 to conduct heat generated by the light-emitting units 21 to the heat dissipation medium 34 within the heat dissipation channel 33. The encapsulation layer 32 is made of one or more resin materials such as polypropylene (PP) and polyethylene (PE), while the second base substrate 31 is made of at least one of glass and polyethylene terephthalate (PET). A gap is defined between the second base substrate 31 and the encapsulation layer 32, forming a heat dissipation channel 33 within the gap.

[0084] Therefore, the second substrate 30 includes a second base substrate 31 and a packaging layer 32 arranged in a stacked manner. The heat dissipation channel 33 is processed between the second base substrate 31 and the packaging layer 32 by layered processing, thereby reducing the processing difficulty of the heat dissipation channel 33.

[0085] In some embodiments provided in the present application, the encapsulation layer 32 is located on a side of the second base substrate 31 facing away from the light-emitting unit 21 .

[0086] like Figure 4 As shown, the surface of the second base substrate 31 is connected to the multiple light-emitting units 21 of the light-emitting layer 20, and the encapsulation layer 32 is processed on the side of the second base substrate 31 away from the light-emitting unit 21. As a result, the surface flatness of the second base substrate 31 is relatively high, which improves the bonding effect between the second substrate 30 and the light-emitting layer 20, thereby improving the thermal conductivity between the light-emitting layer 20 and the second substrate 30, and improving the heat dissipation effect of the display panel 100 provided in the embodiment of the present application.

[0087] In some embodiments provided in the present application, the encapsulation layer 32 is located on a side of the second base substrate 31 close to the light emitting unit 21 .

[0088] like Figure 5 As shown, the second base substrate 31 is spaced apart from the light-emitting layer 20 in the thickness direction z of the display panel 100, and the encapsulation layer 32 is processed on the side of the second base substrate 31 facing the light-emitting layer 20. As a result, the surface flatness of the second base substrate 31 is higher, thereby improving the flatness of the surface of the second substrate 30 facing away from the first substrate 10.

[0089] In some embodiments provided herein, the encapsulation layer 32 is located on a side of the second base substrate 31 close to the light emitting unit 21 , and a portion of the first heat dissipation channel 331 is located between two adjacent light emitting units 21 .

[0090] like Figure 5 As shown, the first heat dissipation channel 331 is located between the packaging layer 32 and the second base substrate 31 layer, and part of the second substrate 30 is located between two adjacent light-emitting units 21, so that part of the first heat dissipation channel 331 is located between two adjacent light-emitting units 21, thereby increasing the heat exchange area between the first heat dissipation channel 331 and the light-emitting unit 21, thereby improving the heat dissipation effect of the display panel 100 provided in the embodiment of the present application.

[0091] In some embodiments, the encapsulation layer 32 abuts against the first substrate 10 .

[0092] In some embodiments, the first segment 331 a and the second segment 331 b are alternately arranged in a wave shape, and the connection between the first segment 331 a and the second segment 331 b is located between two adjacent light-emitting units 21 .

[0093] In some embodiments provided in this application, Figure 5 As shown, the first liquid outlet end 331a2 of the first segment 331a and the second liquid inlet end 331b1 of the second segment 331b are located between two adjacent light-emitting units 21, and the first liquid inlet end 331a1 of the first segment 331a and the second liquid outlet end 331b2 of the second segment 331b are located on one side of the light-emitting unit 21 in the thickness direction z of the display panel 100.

[0094] As a result, the temperature of the heat dissipation medium 34 at the first liquid outlet end 331a2 of the first section 331a and the second liquid inlet end 331b1 of the second section 331b is higher than the temperature of the heat dissipation medium 34 at the first liquid inlet end 331a1 of the first section 331a and the second liquid outlet end 331b2 of the second section 331b, so that the heat dissipation medium 34 at the connection between the first liquid outlet end 331a2 of the first section 331a and the second liquid inlet end 331b1 of the second section 331b is heated and diffused, driving the heat dissipation medium 34 in the first section 331a to flow into the second section 331b, and the tendency of the heat dissipation medium 34 at the first liquid inlet end 331a1 to flow back to the second liquid outlet end 331b2 is smaller than the tendency of the heat dissipation medium 34 at the first liquid outlet end 331a2 to flow to the second liquid inlet end 331b1, thereby preventing the heat dissipation medium 34 in the first heat dissipation channel 331 from flowing back.

[0095] In some embodiments provided in this application, Figure 5 As shown, the surface of the second substrate 30 facing the first substrate 10 is provided with a plurality of recessed portions 301, and the light-emitting units 21 are fitted into the recessed portions 301 in a one-to-one correspondence. Thus, the provision of the recessed portions 301 increases the heat exchange area between the light-emitting units 21 and the second substrate 30, thereby increasing the thermal conductivity between the light-emitting layer 20 and the second substrate 30, thereby improving the heat dissipation effect of the display panel 100 provided in the embodiment of the present application.

[0096] In some embodiments provided in the present application, the material of the heat dissipation medium 34 may include quantum dot material; the quantum dot material may include one or more materials with high thermal conductivity, such as graphene quantum dots (GQDs), cadmium selenide / zinc sulfide core-shell structure quantum dots (CdSe / ZnS) and bismuth tungstate (Bi2WO6).

[0097] Therefore, while the heat dissipation effect of the light emitting unit 21 is improved by the heat dissipation medium 34 , the heat dissipation medium 34 includes quantum dot material, and the heat dissipation medium 34 is located on the light emitting side of the light emitting unit 21 to improve the light emitting effect of the light emitting unit 21 .

[0098] In some embodiments provided in this application, Figure 3As shown, the second heat dissipation channel 332 is located in the non-display area 102, and the second heat dissipation channel 332 is arranged around the first heat dissipation channel 331. The second heat dissipation channel 332 includes a first portion 332a, a second portion 332b, a third portion 332c and a fourth portion 332d. The first heat dissipation channel 331 extends along the first direction x, and the first portion 332a and the second portion 332b are respectively located on both sides of the first heat dissipation channel 331 in the first direction x. The first portion 332a and the second portion 332b both extend along the second direction y. The third portion 332c and the fourth portion 332d are respectively located on both sides of the first heat dissipation channel 331 in the second direction y. The third portion 332c and the fourth portion 332d extend along the first direction x. The third portion 332c is connected between one end of the first portion 332a and one end of the second portion 332b. The fourth portion 332d is connected between the other end of the first portion 332a and the other end of the second portion 332b.

[0099] Thus, the heat dissipation medium 34 flowing out of the first heat dissipation channel 331 is circulated back into the first heat dissipation channel 331 through the second heat dissipation channel 332 after being cooled in the non-display area 102 , forming a circulation flow path for the heat dissipation medium 34 .

[0100] In some embodiments provided in the present application, a cofferdam 35 is provided between the second base substrate 31 and the packaging layer 32 , and the cofferdam 35 , the second base substrate 31 and the packaging layer 32 together form a heat dissipation channel 33 .

[0101] The display device provided in the embodiment of the present application is described below.

[0102] The display device provided in the embodiment of the present application includes the display panel 100 in any of the above embodiments.

[0103] The display panel 100 provided in the embodiment of the present application has the advantage of good heat dissipation effect, which reduces the accumulation of heat in the display panel 100. On the one hand, it improves the user experience of the display device provided in the embodiment of the present application, and on the other hand, it reduces the failure rate caused by overheating of the light-emitting unit 21.

[0104] The following combination Figures 7 to 9 The processing method provided in the embodiments of the present application is described.

[0105] The processing method provided in the embodiment of the present application is used to process the display panel 100 in any of the above embodiments, or to process the display device in any of the above embodiments, including the following steps:

[0106] S1, such as Figure 8 (a) and Figure 8As shown in (b), a dam 35 is coated on the first surface 311 of the second base substrate 31. The dam 35 is arranged around a preset setting area, and the dam 35 is located at the edge of the second base substrate 31 and has an opening 351. Figure 9 As shown, the set area is located on the first surface 311 of the second base substrate 31 , and the dam 35 is arranged around the set area. In some embodiments, there are multiple openings 351 to inject the heat dissipation medium 34 into the set area through the multiple openings 351 .

[0107] In some embodiments provided in this application, the cofferdam 35 is a sealant.

[0108] S2, such as Figure 8 (b) and Figure 8 As shown in (c), the encapsulation layer 32 is laminated to the second base substrate 31 to form a heat dissipation channel 33 by the cofferdam 35, the encapsulation layer 32 and the second base substrate 31; the encapsulation layer 32 has a second surface 321, and the second surface 321 has the same shape as the first surface 311. When the encapsulation layer 32 is laminated to the second base substrate 31, the first surface 311 and the second surface 321 are respectively sandwiched between the two sides of the cofferdam 35, and the heat dissipation channel 33 is formed by the first surface 311 of the second base substrate 31, the second surface 321 of the encapsulation layer 32 and the cofferdam 35.

[0109] S3, such as Figure 8 (c) and Figure 8 As shown in (d), the heat dissipation medium 34 is filled into the heat dissipation channel 33 through the opening 351 ; the heat dissipation medium 34 is made of liquid material and is injected into the heat dissipation channel 33 through the opening 351 at the edge of the cofferdam 35 so that the heat dissipation medium 34 is filled in the heat dissipation channel 33 .

[0110] In some embodiments, the heat dissipation medium 34 includes quantum dot material.

[0111] In some embodiments provided in the present application, the opening 351 includes an injection port and an exhaust port, which are arranged in opposite directions so that when the heat dissipation medium 34 is injected into the heat dissipation channel 33 through the injection port, the air in the heat dissipation channel 33 can be discharged from the exhaust port.

[0112] S4, such as Figure 8 (d) and Figure 8 As shown in (e), the opening 351 is sealed by a sealing glue, so that the second base substrate 31 , the cofferdam 35 , the packaging layer 32 and the heat dissipation medium 34 form a second substrate 30 .

[0113] S5 , laminating the second substrate 30 to the side of the light emitting layer 20 facing away from the first substrate 10 to form the display panel 100 .

[0114] Therefore, the display panel 100 obtained by the processing method provided in the embodiment of the present application can improve the heat dissipation efficiency of the light-emitting layer 20 through the heat dissipation medium 34 in the heat dissipation channel 33, so that the display panel 100 obtained by the processing method provided in the embodiment of the present application has the advantage of better heat dissipation effect.

[0115] The above are only specific embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present application should be included in the scope of protection of the present application.

Claims

1. A display panel, characterized in that: It comprises a first substrate and a second substrate arranged opposite to each other, wherein the first substrate is provided with a light-emitting layer; The display panel has a display area and a non-display area. The second substrate is provided with a heat dissipation channel, the heat dissipation channel including a first heat dissipation channel located in the display area and a second heat dissipation channel located in the non-display area, the first heat dissipation channel being connected to the second heat dissipation channel; The heat dissipation channel is filled with a heat dissipation medium, and the heat dissipation medium can flow in the first heat dissipation channel and the second heat dissipation channel; The heat dissipation medium has a flow direction in the first heat dissipation channel, and the first heat dissipation channel has a first section and a second section connected in sequence in the flow direction of the heat dissipation medium, and a throttling area of ​​the first section is larger than a throttling area of ​​the second section; There are multiple first sections, and multiple second sections, and the multiple first sections and the multiple second sections are alternately arranged in sequence; The first section has a first liquid inlet and a first liquid outlet, the distance between the first liquid outlet and the first substrate is smaller than the distance between the first liquid inlet and the first substrate, and the second section has a second liquid inlet and a second liquid outlet, the distance between the second liquid outlet and the first substrate is larger than the distance between the second liquid inlet and the substrate; When the heat dissipation medium in the first heat dissipation channel absorbs the heat emitted by the light-emitting layer and is heated, the temperature of the heat dissipation medium in the first section and the heat dissipation medium in the second section expand synchronously. Under the action of the difference between the pressure of the inner wall of the first section on the heat dissipation medium in the first section and the pressure of the inner wall of the second section on the heat dissipation medium in the second section, the heat dissipation medium in the first section is driven to flow into the second section.

2. The display panel according to claim 1, wherein There are multiple first heat dissipation channels, and the multiple first heat dissipation channels are arranged in parallel and spaced apart. The liquid inlet ends of the multiple first heat dissipation channels are all connected to the second heat dissipation channel, and the liquid outlet ends of the multiple first heat dissipation channels are all connected to the second heat dissipation channel. And / or, the light-emitting layer includes a plurality of light-emitting units arranged in an array, and the orthographic projections of the light-emitting units on the first substrate are located within the orthographic projections of the first heat dissipation channels on the first substrate.

3. The display panel according to claim 1, wherein The second substrate includes a second base substrate and a packaging layer provided on the second base substrate, and the packaging layer and the second base substrate form the heat dissipation channel.

4. The display panel according to claim 3, wherein: The encapsulation layer is located on a side of the second substrate away from the light-emitting layer; Alternatively, the encapsulation layer is located on a side of the second base substrate close to the light-emitting layer.

5. The display panel according to claim 4, wherein: The light-emitting layer includes a plurality of light-emitting units arranged in an array, the packaging layer is located on a side of the second base substrate close to the light-emitting units, and part of the first heat dissipation channel is located between two adjacent light-emitting units.

6. The display panel according to claim 3, wherein: A dam is provided between the second base substrate and the packaging layer, and the dam, the second base substrate and the packaging layer together form the heat dissipation channel.

7. A display device, characterized in that: The display panel comprises the display panel according to any one of claims 1 to 6.

8. A processing method for processing the display panel according to any one of claims 1 to 6, or for processing the display device according to claim 7, characterized in that: include: Coating a dam on the surface of the second base substrate, wherein the dam is arranged around a preset area, and the dam is located at an edge of the second base substrate and has an opening; Laminating the packaging layer to the second base substrate to form a heat dissipation channel by the cofferdam, the packaging layer and the second base substrate; filling the heat dissipation channel with a heat dissipation medium through the opening; closing the opening so that the second substrate, the dam, the packaging layer and the heat dissipation medium form a second substrate; The second substrate is bonded to the first substrate provided with the light emitting layer to form a display panel.

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