Force feedback system

Abstract

The embodiment of the invention provides a force feedback system. The force feedback system comprises a glove body. A microprocessor coupled to the glove body, the microprocessor communicatively coupled to an external computing device; the microprocessor is arranged on the glove body, each finger force feedback piece is mechanically coupled to the glove body and is in communication coupling with the microprocessor, and the finger force feedback pieces are configured to provide force feedback for fingers corresponding to the finger force feedback pieces according to instructions of the microprocessor. Each finger force feedback piece comprises a pull rope for tracking the movement of the fingers, a transmission part for moving along with the pull rope and a stop part, and a plurality of stop structures are sequentially arranged on the transmission part; and the stop component is configured to be matched with any one of the plurality of stop structures so as to brake the finger.

Description

A force feedback system

[0001] Cross-references

[0002] This specification claims priority to the international application No. PCT / CN2023 / 124295 filed on October 12, 2023, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This specification relates to the technical field of electronic components, and in particular to a force feedback system. Background Art

[0004] With the gradual maturity of AR / VR technology and the rise of the metaverse concept, intelligent electronic devices used for human-computer interaction are increasingly demanding mechanical perception and simulation to provide users with more realistic feedback. Fingers are the most important part of the body in determining mechanical perception and feedback. However, in order to reproduce finger force feedback, finger force feedback devices require complex and numerous components, resulting in high power consumption and large size.

[0005] Therefore, it is necessary to create a force feedback system that can improve the efficiency of finger force feedback while reducing the power consumption and size of the finger force feedback component.

[0006] Summary of the Invention

[0007] One embodiment of this specification provides a force feedback system. The force feedback system includes a glove body; a microprocessor coupled to the glove body, the microprocessor being communicatively coupled to an external computing device; and a plurality of finger force feedback members, each of which is mechanically coupled to the glove body and communicatively coupled to the microprocessor, and configured to provide force feedback to the corresponding finger according to instructions from the microprocessor. Each finger force feedback member includes a pull cord that tracks the movement of the finger, a transmission component that moves with the pull cord, and a stop component. The transmission component is sequentially provided with a plurality of stop structures, and the stop component is configured to cooperate with any of the multiple stop structures to brake the finger.

[0008] In some embodiments, each finger force feedback member includes a shell located on the back of the palm, and the transmission component and the stop component are located in the shell, wherein the force feedback system also includes a fingertip cover, and the pull rope mechanically connects the fingertip cover and the transmission component.

[0009] In some embodiments, each finger force feedback member further includes a wire groove arranged between the finger joints of the glove body, and the drawstring passes through the wire groove to connect the fingertip cover and the transmission component.

[0010] In some embodiments, the transmission component includes a spool, the pull rope is wound around the spool, a stop structure is arranged on the surface of the spool, and the stop component includes a stop plate that can be inserted into a groove between the stop structures.

[0011] In some embodiments, the gradient of one side of the stopping structure abutting against the stopping plate is greater than the gradient of the other side.

[0012] In some embodiments, the teeth spacing of the stop structure is less than 2 mm.

[0013] In some embodiments, the teeth of the stop structure are spaced apart by less than 1 mm.

[0014] In some embodiments, a limiting protrusion is arranged on the inner side surface of the shell opposite to the stopping structure.

[0015] In some embodiments, the height of the limiting protrusion is greater than the height of the stopping structure.

[0016] In some embodiments, the stopping component includes a transmission rod, and the transmission rod is configured to press or release the stopping plate according to instructions, wherein when the transmission rod presses the stopping plate, the stopping plate is inserted into the groove between the stopping structures.

[0017] In some embodiments, the stop member includes a piezoelectric structure configured to drive the stop plate to be inserted into the inter-stop structure groove.

[0018] In some embodiments, the retaining plate corresponds to multiple depths when inserted into the groove between the retaining structures.

[0019] In some embodiments, each finger force feedback member further includes a sensing component configured to detect the movement distance of the pull rope and transmit data related to the movement distance of the pull rope to a microprocessor.

[0020] In some embodiments, the transmission component includes a spool, the pull rope is wound on the spool, and the sensing component includes a magnet mechanically connected to the spool and a magnetic field sensor for measuring rotation information of the magnet as the spool rotates.

[0021] In some embodiments, the magnet and the magnetic field sensor are coaxially arranged along a central axis of the bobbin when the bobbin rotates.

[0022] In some embodiments, the magnet is mechanically connected to a side surface of the bobbin, and a limiting protrusion is arranged on the side surface.

[0023] In some embodiments, the height of the limiting protrusion is greater than the height of the magnet.

[0024] In some embodiments, each finger force feedback member further includes a strain sensor, which is arranged at a finger joint of the glove body and is configured to read the posture data of the finger.

[0025] In some embodiments, the transmission component includes a spool and a scroll spring mechanically connected to the spool, the pull rope is wound around the spool, and the scroll spring is configured to drive the spool to rotate in the opposite direction to reset the pull rope after the finger releases the external tension.

[0026] In some embodiments, the spring constant of the volute spring is less than 100 N / m. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The present application will be further described in the form of exemplary embodiments, which will be described in detail with reference to the accompanying drawings. These embodiments are not limiting, and in these embodiments, like numbers represent like structures, wherein:

[0028] FIG1 is a schematic diagram of a framework of an exemplary force feedback system according to some embodiments of this specification;

[0029] FIG2 is a schematic diagram of an exemplary microprocessor according to some embodiments of the present specification;

[0030] 3 is a schematic diagram illustrating an exemplary microprocessor communicatively coupled to an external computing device according to some embodiments of the present specification;

[0031] FIG4A is a schematic diagram of an exemplary force feedback system according to some embodiments of the present specification;

[0032] FIG4B is a side view schematic diagram of the force feedback system shown in FIG4A;

[0033] FIG5A is a partial structural diagram of an exemplary finger force feedback member according to some embodiments of this specification;

[0034] FIG5B is a schematic diagram of a partial structural side view of an exemplary stopping component according to some embodiments of the present specification;

[0035] FIG6A is a partial structural diagram of another exemplary finger force feedback component according to some embodiments of this specification;

[0036] 6B is a schematic diagram of a partial structural side view of another exemplary stopping component according to some embodiments of the present specification;

[0037] FIG7A is a partial structural diagram of another exemplary finger force feedback component according to some embodiments of this specification;

[0038] 7B is a schematic diagram of a partial structural side view of another exemplary stopping component according to some embodiments of the present specification;

[0039] FIG8 is a schematic diagram of a partial structural side view of another exemplary stopping component according to some embodiments of this specification;

[0040] FIG9 is a schematic diagram of joint positions of a user's hand according to some embodiments of this specification;

[0041] FIG10 is an exemplary schematic diagram of a hand motion coordinate system according to some embodiments of this specification;

[0042] FIG11 is a schematic diagram of a second strain sensor according to some embodiments of this specification;

[0043] FIG12 is a schematic diagram of a second strain sensor according to yet other embodiments of this specification;

[0044] FIG13A is a schematic diagram showing the distribution of four capacitor structures on a flexible substrate according to some embodiments of this specification;

[0045] FIG13B is a schematic diagram of the cross-sectional structure of the four capacitor structures shown in FIG13A along the Y-axis;

[0046] FIG14A is a schematic diagram of a second sensor without deformation according to some embodiments of this specification;

[0047] FIG14B is a schematic diagram of the deformation of the second sensor shown in FIG14A after being stretched or compressed along the long axis direction;

[0048] FIG15 is a side view of the second sensor shown in FIG14A after being bent and deformed around an axis parallel to the short axis direction;

[0049] FIG16 is a schematic top view of the second sensor shown in FIG14A after being bent and deformed about an axis parallel to the thickness direction;

[0050] FIG17 is a schematic cross-sectional view of a second strain sensor according to some embodiments of the present specification. DETAILED DESCRIPTION

[0051] To more clearly illustrate the technical solutions of the embodiments of this application, the following is a brief introduction to the drawings required for describing the embodiments. Obviously, the drawings described below are merely examples or embodiments of this application. Those skilled in the art can apply this application to other similar scenarios based on these drawings without inventive effort. Unless otherwise apparent from the context or otherwise noted, the same reference numerals in the figures represent the same structure or operation.

[0052] It should be understood that the terms "system," "device," "unit," and / or "module" used herein are a method for distinguishing different components, elements, parts, portions, or assemblies at different levels. However, if other terms can achieve the same purpose, the terms may be replaced by other expressions.

[0053] As used in this application and the claims, unless the context clearly indicates otherwise, the words "a," "an," "an," and / or "the" are not intended to refer to the singular but may include the plural. Generally speaking, the terms "comprises" and "include" only indicate the inclusion of the steps and elements specifically identified, and these steps and elements do not constitute an exclusive list. A method or apparatus may also include other steps or elements.

[0054] Flowcharts are used in this application to illustrate the operations performed by the systems according to the embodiments of the present application. It should be understood that the preceding or following operations are not necessarily performed in exact order. Instead, the steps may be processed in reverse order or simultaneously. Furthermore, other operations may be added to these processes, or one or more operations may be removed from these processes.

[0055] FIG1 is a schematic diagram of a force feedback system according to some embodiments of the present disclosure. In some embodiments, as shown in FIG1 , the force feedback system 100 may include a glove body 110 , a microprocessor 120 , and a finger force feedback member 130 .

[0056] The force feedback system 100 is a system that provides feedback to the user on the reaction force of a target object in a virtual environment. The force feedback system 100 can sense the user's hand's actions on the target object (e.g., grasping, stroking, touching, slapping, etc.) and simulate the reaction force corresponding to the action and feedback it to the user, helping the user to feel the target object in the virtual environment through force and / or touch. The force feedback system 100 can provide feedback to the user on the reaction force corresponding to the action through one or more devices, such as motion capture gloves, VR gloves, force feedback gloves, tactile feedback gloves, etc.

[0057] The glove body 110 refers to a wearable item for fitting with the hand. In some embodiments, in order to facilitate the fitting of the glove body 110 to the hand joints (for example, including the interphalangeal joints, metacarpophalangeal joints, wrist joints, etc.), the glove body 110 has a structure that adapts to the shape of the hand and extends along the hand joints. In some embodiments, the glove body 110 can be a flexible fabric that easily deforms along with the fingers when subjected to external force (such as bending deformation, etc.). In some embodiments, the glove body 110 can provide support for the finger force feedback part 130 to facilitate the arrangement of the finger force feedback part 130. For example, the glove body 110 can include one or more layers of flexible structure (for example, flexible fabric). The finger force feedback part 130 can be fixed to the surface of a layer of flexible structure by means of gluing, pressing or sewing.

[0058] The finger force feedback member 130 is a component that feeds back the reaction force of the target object in the virtual environment to the finger of the user.

[0059] In some embodiments, the force feedback system 100 may include multiple finger force feedback elements 130. For example, each finger may correspond to a finger force feedback element 130. In some embodiments, the finger force feedback element 130 may be mechanically coupled to the glove body 110. For example, each finger force feedback element 130 may be mechanically coupled to the back of the palm of the glove body 110 near the base of the corresponding finger. By way of example only, each finger force feedback element 130 may be fixed to the back of the palm of the glove body 110 near the base of the finger by gluing, pressing, or sewing.

[0060] In some embodiments, the finger force feedback member 130 can be communicatively coupled to the microprocessor 120 and provide force feedback to the corresponding finger according to instructions from the microprocessor 120. In some embodiments, the finger force feedback member 130 can generate a sensing signal and transmit it to the microprocessor 120. The microprocessor 120 can further generate an instruction for controlling the finger force feedback member 130 based on the sensing signal, thereby enabling interaction with the finger force feedback member 130.

[0061] In some embodiments, each finger force feedback member 130 may include a pull cord that tracks the movement of the finger, a transmission component that moves with the pull cord, and a stop component. In some embodiments, a plurality of stop structures may be arranged in sequence on the transmission component. The stop component may be configured to cooperate with any of the plurality of stop structures to brake the finger. For example, the transmission component may include a spool, the pull cord is wound around the spool, and the spool may be driven to rotate under the action of an external tension. The plurality of stop structures may include ratchets arranged on the spool, and the stop component includes a stop plate that can be inserted into the grooves between the ratchets. When the stop plate is inserted into the grooves between the ratchets, it can hinder the rotation of the spool, thereby achieving a braking effect. The pull cord is connected to the fingertip cover, so that the braking force generated by the stop plate on the spool can be transmitted to the fingertip cover, allowing the user's fingers to feel the feedback force generated by the brake.

[0062] In some embodiments, the finger force feedback member 130 may include a sensing component. The sensing component may detect the movement state of the pull cord (e.g., movement direction, movement speed, movement distance, etc.) and transmit data related to the movement state of the pull cord to the microprocessor 120. The microprocessor 120 may transmit the data related to the movement state of the pull cord to an external computing device coupled thereto. The external computing device may determine the movement of the finger based on the data related to the movement state of the pull cord and generate corresponding information and / or control signals based on the determination result. The information and / or control signals may be further transmitted to the microprocessor 120 to control the operation of the finger force feedback member 130.

[0063] In some embodiments, the finger force feedback member 130 may include a strain sensor, which may be disposed at a finger joint of the glove body 110 and configured to read finger posture data.

[0064] For the specific structure of the finger force feedback member 130 , please refer to FIG. 5A to FIG. 8 and the related descriptions.

[0065] The microprocessor 120 can be communicatively coupled to an external computing device and each finger force feedback element 130, and process data and / or information obtained from each finger force feedback element 130 and / or the external computing device, thereby enabling interaction between the external computing device and the finger force feedback elements 130. External computing devices include computers, mobile phones, AR / VR devices, robots, etc. Interactions can include, for example, force feedback, controlling the external computing device's on / off function, volume adjustment, program execution on the external computing device (e.g., controlling a game character's movement), fitness feedback, etc. In some embodiments, the microprocessor 120 can be coupled to the glove body 110. For example, the microprocessor 120 can be attached to a surface of a flexible structure of the glove body 110 (e.g., attached to the back of the palm of the glove body 110) by gluing, laminating, or sewing. In some embodiments, data related to the finger force feedback elements 130 can be transmitted to the microprocessor 120 via wires. In some embodiments, the microprocessor 120 can include one or more processing chips that analyze and process the received data. In some embodiments, the microprocessor 120 is a standalone processing device. In some embodiments, the microprocessor 120 may be an external device or a part of the glove body 110. For example, the microprocessor 120 may be integrated into the external computing device or the glove body 110.

[0066] FIG. 2 is a schematic diagram of an exemplary microprocessor according to some embodiments of the present specification.

[0067] As shown in FIG. 2 , the microprocessor 120 may include a data processing module 220 , a wireless transmission module 210 , a power supply module 230 , and an inertial sensing module 240 .

[0068] The wireless transmission module 210 can be used to communicate with an external computing device (e.g., a computer, AR / VR host, robot, etc.). For example, the wireless transmission module 210 can transmit data related to the finger force feedback member 130 (e.g., data related to the distance the pull cord moves, finger posture data, etc.) to the external computing device via a network. For another example, the wireless transmission module 210 can also transmit data related to the inertial sensing module 240 (e.g., data related to the overall spatial motion of the user's hand) to the external computing device via a network. For another example, the wireless transmission module 210 can obtain control signals for controlling the finger force feedback member 130 from the external computing device via a network. In some embodiments, the network includes a public network (e.g., the Internet), a private network (e.g., a local area network (LAN), a wide area network (WAN), etc.), a wired network (e.g., an Ethernet network), a wireless network (e.g., a Wi-Fi network), a cellular network (e.g., a Long Term Evolution (LTE) network), a virtual private network ("VPN"), a satellite network, a telephone network, a router, a hub, a switch, a server computer, and / or any combination thereof.

[0069] The data processing module 220 can be used to process data and / or information obtained from an external computing device and / or the finger force feedback member 130. For example, the data processing module 220 can receive and process signals sent by the sensor components of the finger force feedback member 130 and transmit them to the external computing device via the wireless transmission module 210. For another example, the data processing module 220 can generate instructions based on the signals received by the wireless transmission module 210 and transmit them to the finger force feedback member 130, thereby controlling the operation of the stop components in the finger force feedback member 130 and achieving finger braking.

[0070] The power module 230 can be used to power the microprocessor 120 and / or the finger force feedback member 130. For example, the power module 230 can power components such as the stopper and the sensor in the finger force feedback member 130. In some embodiments, the power module 230 can include at least one battery or battery pack.

[0071] The inertial sensing module 240 can be used to capture the spatial motion of the user's hand as a whole. In some embodiments, the spatial motion of the hand as a whole can be represented by the motion of the user's wrist joint, which can include three degrees of freedom: flexion, swinging, and rotation. The flexion and swinging of the wrist joint are controlled by the wrist joint and can cause deformation of the wrist joint. The rotation of the wrist joint is controlled by the rotation of the user's forearm, causing the entire wrist joint to rotate. In some embodiments, to capture the three degrees of freedom of the wrist joint, the inertial sensing module 240 can include two inertial sensors. The two inertial sensors can be arranged on the glove body 110, corresponding to areas on either side of the wrist joint (e.g., positions 14 and 15 shown in FIG9 ). The two sides of the wrist joint refer to the two sides of the wrist joint in the direction of arm extension, i.e., the front and back sides of the wrist joint. The front side of the wrist joint refers to the side facing the back of the hand, and the back side of the wrist joint refers to the side facing the forearm. For ease of understanding, the two sides of the wrist joint can be understood as the areas of the hand or forearm that are close to the wrist joint in two directions but do not substantially deform with the deformation of the wrist joint. Two inertial sensors can respectively collect position information on both sides of the wrist joint, and work together to identify the overall wrist joint's motion in three degrees of freedom: rotation, flexion, and swing. In some embodiments, to collect wrist joint motion in all three degrees of freedom, the inertial sensing module 240 may include an inertial sensor and a strain sensor. The inertial sensor and strain sensor work together to collect wrist joint motion. In some embodiments, the strain sensor may include a multi-degree-of-freedom sensor, which can be used to collect deformation of the wrist joint in multiple degrees of freedom. By way of example only, the inertial sensor and strain sensor can be arranged on the glove body 110, with the strain sensor located at the wrist joint and the inertial sensor located in an area outside the wrist joint, such as the front or back of the wrist joint. In some embodiments, the inertial sensor can be located on either side of the wrist joint in the direction of arm extension. Using two inertial sensors or a combination of inertial sensors and strain sensors can capture wrist joint motion in multiple degrees of freedom. Users can flexibly select different sensor types to achieve multi-degree-of-freedom motion capture based on different application scenarios. For more information on multi-degree-of-freedom strain sensors, please refer to Figures 11-17 and the related descriptions.

[0072] FIG. 3 is a schematic diagram illustrating an exemplary microprocessor communicatively coupled to an external computing device according to some embodiments of the present specification.

[0073] 3 , the microprocessor 120 may be communicatively coupled to an external computing device 140 and each finger force feedback member 130, thereby enabling interaction between the external computing device 140 and the finger force feedback member 130. The interaction between the external computing device 140 and the finger force feedback member 130 may include sensing and force feedback.

[0074] During the sensing process between the external computing device 140 and the finger force feedback member 130, the sensor component 131 in the finger force feedback member 130 can generate a sensing signal based on the state of the finger force feedback member 130 and transmit it to the microprocessor 120. For example, the state of the finger force feedback member 130 can include the movement state of the pull cord (e.g., movement direction, movement speed, movement distance, etc.). The movement state of the pull cord can reflect the movement of the corresponding finger. For example, when the finger is bent, the pull cord moves, the pull cord is pulled out, and the movement distance gradually increases. When the finger is straightened or tilted upward, the pull cord returns to its original position, and the movement distance gradually decreases. The sensor component 131 can detect the movement state of the pull cord (e.g., through a magnetic field) and generate data related to the movement state of the pull cord (i.e., a sensing signal) and transmit it to the microprocessor 120. For another example, the state of the finger force feedback member 130 can also include the posture of the finger, such as the deformation of one or more degrees of freedom of the finger (bending, swinging, rotation, etc.). As just an example, each finger force feedback member 130 may include a strain sensor, which is disposed at a finger joint of the glove body 110 and configured to read the posture data of the finger and send the data to the microprocessor 120 .

[0075] During the force feedback process between the external computing device 140 and the finger force feedback member 130, the external computing device 140 can determine the finger's motion (e.g., whether deformation occurs, the type of deformation, the degree of deformation, etc.) based on the sensor signal and / or finger posture data, and generate corresponding information and / or control signals based on the determination result. The information and / or control signals can be further transmitted to the microprocessor 120 to control the operation of the finger force feedback member 130. For example, the external computing device 140 can simulate the current hand posture based on the determination result of the finger motion and display it on a display device. For another example, the external computing device 140 can determine whether to brake the finger based on the determination result of the finger motion and the current scene information and generate a corresponding control signal. The microprocessor 120 can generate a corresponding control instruction based on the control signal. The stop component 132 and the transmission component (not shown) in the finger force feedback member 130 can cooperate to control the braking or release of the pull rope based on the control instruction, so that the finger connected to the pull rope through the fingertip sleeve can feel the force feedback.

[0076] Figure 4A is a schematic diagram of an exemplary force feedback system according to some embodiments of the present specification. Figure 4B is a side view frame diagram of the force feedback system shown in Figure 4A.

[0077] 4A and 4B , the force feedback system 400 may include a glove body 110, a microprocessor 120, a finger force feedback member 130, and a fingertip cover 140. The microprocessor 120 and the finger force feedback member 130 may be coupled to the glove body 110. For example, the microprocessor 120 and the finger force feedback member 130 may be fixed to the back of the palm of the glove body 110 via a base 150. The microprocessor 120 may be connected to the finger force feedback member 130 (e.g., to a circuit board (not shown) in the finger force feedback member 130) via a wired or wireless connection to send control instructions to the finger force feedback member 130 or read sensor signals and / or posture data generated by the finger force feedback member 130.

[0078] There can be multiple (e.g., five) finger force feedback members 130 for providing force feedback to corresponding fingers. Each finger force feedback member 130 may include a pull cord 136 that tracks finger movement, a transmission component (not shown) that moves with the pull cord, and a stop component (not shown). The finger force feedback member 130 may include a housing 134 located on the back of the palm, and the transmission component and the stop component may be located within the housing 134. The pull cord 136 may mechanically connect the fingertip cover 140 to the transmission component within the housing 134. As shown in Figures 4A and 4B, the finger force feedback member 130 may include a wire groove arranged between the finger joints of the glove body 110 (e.g., a wire groove 135-a arranged between the metacarpophalangeal joint 111-a and the interphalangeal joint 111-b, a wire groove 135-b arranged between the interphalangeal joint 111-b and the interphalangeal joint 111-c, etc.). The pull cord 136 may pass through the wire groove to connect the fingertip cover 140 and the transmission component.

[0079] In some embodiments, a plurality of stop structures may be sequentially arranged on the transmission component. The stop component may be configured to cooperate with any of the plurality of stop structures according to instructions from the microprocessor 120 to brake or release the pull cord 136. The pull cord 136 may further transmit the braking force of the finger force feedback component 130 to the fingertip cover 140, allowing the user's finger to feel the feedback force generated by the brake, thereby achieving force feedback of the force feedback system 100. The microprocessor 120 may also read the sensor signals and / or posture data generated by the finger force feedback component 130, thereby determining the motion state or posture of the user's finger.

[0080] FIG5A is a partial structural diagram of an exemplary finger force feedback member according to some embodiments of this specification. In some embodiments, as shown in FIG5A , the finger force feedback member 130 may include a sensing component 131, a stop component 132, a transmission component 133, a pull cord 136, and a rotating shaft frame 137. The transmission component 133 may be located within the rotating shaft frame 137, and the stop component 132 may be located outside the rotating shaft frame 137. The transmission component 133 and the stop component 132 may both be encapsulated by a housing (e.g., the housing 134 shown in FIG4B ). In some embodiments, the stop component 132 may also be disposed within the rotating shaft frame 137, in which case the rotating shaft frame 137 may serve as the housing.

[0081] The transmission component 133 may include a bobbin 531 and a volute spring 532 mechanically connected to the bobbin 531. As shown in FIG5A, the rotating shaft frame 137 may be fixedly connected to the housing of the finger force feedback member 130 (for example, the housing 134 shown in FIG4B), or the rotating shaft frame 137 itself may serve as the housing of the finger force feedback member 130. The bobbin 531 is arranged in the rotating shaft frame 137, and the upper side wall 531-1 of the bobbin 531 has an opening. The inner wall of the rotating shaft frame 137 corresponding to the upper side wall 531-1 may include a bobbin column 137-1 extending toward the rotating shaft frame 137. The bobbin column 137-1 passes through the opening of the upper side wall 531-1 and extends into the interior of the bobbin 531, and is rotatably connected to the lower side wall 531-2 of the bobbin 531, so that the bobbin 531 is suspended inside the rotating shaft frame 137. The drawstring 136 is wound around the spool 531. When the drawstring 136 is pulled by an external force, the spool 531 can be driven by the drawstring 136 to rotate relative to the spool post 137-1. The rotation axis can be indicated by the dashed line aa' in the figure. When the finger force feedback member 130 is coupled to the glove body 110, the upper sidewall 531-1 and lower sidewall 531-2 of the spool 531 are parallel or approximately parallel to the back of the palm. The upper sidewall 531-1 refers to the sidewall of the spool 531 that is relatively far from the base, and the lower sidewall 531-2 refers to the sidewall of the spool 531 that is relatively close to the base. The rotation axis aa' can be perpendicular or approximately perpendicular to the back of the palm. In some embodiments, to maintain stability during rotation of the spool 531, the spool 531 can be a cylindrical structure with the rotation axis aa' as its central axis, with the opening of the upper sidewall 531-1 located at the center of the upper sidewall 531-1. The central axis of the spool column 137 - 1 may coincide with the central axis of the spool 531 .

[0082] The scroll spring 532 can be mechanically connected to the spool 531 and configured to drive the spool 531 to rotate in the opposite direction to reset the pull cord 136 after the finger releases the external tension. As shown in Figure 5A, the scroll spring 532 can be disposed within the spool 531, with one end connected to the spool post 137-1 and the other end connected to the inner wall of the spool 531. When the finger applies external tension, the pull cord 136 is pulled out, driving the spool 531 to rotate, which in turn drives the scroll spring 532 to rotate and tighten. After the finger releases the external tension, the scroll spring 532 can drive the spool 531 to rotate in the opposite direction to reset the pull cord 136.

[0083] In some embodiments, the spring constant of the spiral spring 532 can be set to adjust the restoring force of the spiral spring 532. If the spring constant of the spiral spring 532 is too small, the restoring force will be too small, which may be detrimental to the resetting of the pull rope 136 and affect the subsequent braking effect of the pull rope. If the spring constant of the spiral spring 532 is too large, it will significantly increase the sense of resistance when the finger is bent, affecting the user experience. In addition, an excessively large spring constant may also cause the spool 531 to rotate too fast or rotate unstably after the external force of the finger is released, thereby affecting the sensing process of the sensing component. Therefore, in some embodiments, the spring constant of the spiral spring 532 can be less than 100 N / m, so that the user experience can be improved while effectively resetting the pull rope 136.

[0084] In some alternative embodiments, an elastic pull rope can be used to achieve the aforementioned reset. Exemplary elastic pull ropes include ropes made of rubber or elastic fibers. The elastic pull rope's own resilience is similar to the restoring force provided by the aforementioned volute spring 532. Specifically, when the finger applies an external pulling force, the elastic pull rope is stretched, driving the spool 531 to rotate; after the finger releases the external pulling force, the elastic pull rope uses its own resilience to restore to its original length. The elastic pull rope's stiffness coefficient can be set to adjust the elastic pull rope's restoring force, to avoid the elastic pull rope increasing the sense of resistance when the finger is bent due to an excessively large stiffness coefficient, and to avoid the situation where the elastic pull rope cannot be restored to its original length due to an excessively small stiffness decimal. In some embodiments, the elastic pull rope's stiffness coefficient can be less than 60 N / m.

[0085] FIG5B is a schematic diagram of the structure of the stop component shown in FIG5A . As shown in FIG5A and FIG5B , the surface (or upper surface) of the spool 531 is sequentially arranged with a plurality of stop structures 533 (e.g., ratchets, etc.). When the pull cord 136 drives the spool 531 to rotate, the stop structures 533 rotate along with the spool 531. As an example only, the rotation direction of the stop structure 533 can be direction A. The stop component 132 can cooperate with the stop structure 533 to brake the finger (or pull cord 136). Specifically, the stop component 132 can include an actuator 521, a stop plate 522, and a transmission rod 523.

[0086] The actuator 521 can move based on control commands and drive the transmission rod 523 to move. As shown in FIG5A , the actuator 521 can be mounted on the rotating shaft frame 137, for example, fixedly connected to the upper surface of the rotating shaft frame 137. One end of the transmission rod 523 is connected to the actuator 521, while the other end (or free end) can be suspended in the air. When the actuator 521 receives a control command from the microprocessor 120, it can move based on the command and transmit the movement to the transmission rod 523. The transmission rod 523 can further convert the movement of the actuator 521 into up and down movement, causing the free end of the transmission rod 523 to rise or fall. The free end of the transmission rod 523 can be suspended above the stopper 522. When the free end of the transmission rod 523 falls, the movement of the actuator 521 is transmitted to the stopper 522, causing the stopper 522 to insert into the groove between the stop structures 533, thereby applying pressure to the stopper 522 according to the command. In some embodiments, the actuator 521 may be a micro-servo, or an electric component such as a piezoelectric sheet, a telescopic motor, or an electromagnet.

[0087] The stopper 522 is a structure that can be inserted into the groove between the stop structures 533. In some embodiments, the stopper 522 can be an elastic component. For example, the stopper 522 can be an elastic spring or a rigid component with a spring structure. One end of the stopper 522 can be connected to the rotating shaft frame 137 (e.g., fixedly or rotatably connected), and the other end (or free end) can be bent and extended toward the stop structure 533 and suspended above the stop structure 533. The position of the stopper 522 when it is not subjected to the force of the transmission rod 523 can be referred to as the static position. When the stopper 522 is in the static position, the spool 531 can move in direction A under the action of the pull rope 136. When the transmission rod 523 (e.g., the free end) moves downward under the action of the actuator 521, the stopper 522 is forced downward by the transmission rod 523. The free end of the stopper 522 is inserted into the groove between the stop structures 533, thereby limiting the movement of the stop structures 533 (i.e., braking effect). When the transmission rod 523 moves upward, the pressure on the stopper 522 is released, and the stopper 522 returns to the static position under the action of its own elasticity, and the stop structure 533 is loosened, so that the spool 531 can rotate normally.

[0088] Figure 6A is a partial structural diagram of another exemplary finger force feedback component according to some embodiments of this specification. The finger force feedback component shown in Figure 6A is substantially identical to the finger force feedback component shown in Figure 5A , except that the finger force feedback component shown in Figure 6A can achieve braking through a piezoelectric structure. As shown in Figure 6A , the stop component 132 may include a piezoelectric structure 621.

[0089] The piezoelectric structure 621 can be a component that generates movement under the action of a driving voltage. Specifically, the driving voltage acts on the piezoelectric layer of the piezoelectric structure 621, causing the piezoelectric layer to deform, thereby causing the piezoelectric structure 621 to move. In some embodiments, the piezoelectric layer can be made of a piezoelectric material. Exemplary piezoelectric materials may include piezoelectric ceramics, piezoelectric crystals (e.g., barium titanate, lead zirconate titanate, etc.), piezoelectric polymers (e.g., polyvinylidene fluoride), etc., or any combination thereof. In some embodiments, the piezoelectric structure 621 can be of any shape, such as a sheet, a block, a columnar, an annular structure, etc., or any combination thereof.

[0090] Figure 6B is a schematic diagram of the structure of the stop member shown in Figure 6A. As shown in Figures 6A and 6B , the piezoelectric structure 621 can be a cantilever beam with one end fixed to the shaft frame 137, with one end (or fixed end) fixed to the shaft frame 137 and the other end (or free end) suspended above or connected to the stop plate 622. One end of the stop plate 622 can be connected to the shaft frame 137 (e.g., fixedly or rotatably connected), while the other end (or free end) can be bent and extended toward the stop structure 633 and suspended above the stop structure 633. When the finger force feedback member 130 generates a driving voltage based on a control command to control the piezoelectric structure 621 to produce a downward deformation, the stop plate 622 can be driven to move downward, causing the free end of the stop plate 622 to insert into the groove between the stop structures 633, thereby limiting the movement of the spool 631. When the finger force feedback member 130 stops generating the driving voltage based on the control instruction, the piezoelectric structure 621 restores its shape and releases the stop plate 622, and the stop plate 622 returns to the static position upward (for example, one end of the stop plate 622 is fixedly connected to the rotating shaft frame 137, and the free end of the piezoelectric structure 621 is suspended above the stop plate 622. At this time, the stop plate 622 can return to the static position upward under the action of its own elasticity; for another example, one end of the stop plate 622 is rotatably connected to the rotating shaft frame 137, and the free end of the piezoelectric structure 621 is connected to the stop plate 622. At this time, the stop plate 622 can return to the static position upward under the drive of the piezoelectric structure 621), thereby releasing the stop structure 633 and the spool 631 can rotate normally.

[0091] Figure 7A is a partial structural diagram of another exemplary finger force feedback component according to some embodiments of this specification. As shown in Figure 7A , the stopper component 132 may include a piezoelectric structure 721. Figure 7B is a structural diagram of the stopper component shown in Figure 7A . As shown in Figures 7A and 7B , the piezoelectric structure 721 may be a piezoelectric plate directly disposed on the surface of the stopper 722. When the finger force feedback component 130 generates a driving voltage based on a control instruction to control the piezoelectric plate to deform downward, the deformation of the piezoelectric plate can cause the free end of the stopper 722 to bend downward, causing the free end of the stopper 722 to insert into a groove between the stopper structures 733, thereby restricting the movement of the spool 731. When the force feedback system 100 stops generating the driving voltage based on the control instruction, the piezoelectric plate can restore its shape and drive the stopper 722 to move upward, thereby releasing the stopper 722 and allowing the spool 731 to rotate normally.

[0092] In some embodiments of this specification, a piezoelectric structure is used to achieve coordinated braking with a stopper structure. This simplifies the overall structure of the stopper component, facilitating production and assembly. Furthermore, the piezoelectric structure can be a sheet-like structure with a relatively small size, which can reduce the overall size of the stopper component and the finger force feedback component, facilitating the miniaturization of the finger force feedback component.

[0093] In some embodiments, the gradient of the side of the retaining structure that contacts the retaining plate can be greater than the gradient of the other side. In the embodiments of this specification, the gradient of a side of the retaining structure can refer to the slope of that side. When the side is flat, the slope can be represented by the angle between the side and the upper side of the spool 531. When the side is curved, the slope can be represented by the angle between a tangent to the side (e.g., the tangent at the point of contact with the retaining plate) and the upper side of the spool 531. For example, as shown in FIG5B , the retaining structure can include a ratchet. The gradient of one side 533-1 of the ratchet teeth that contacts the retaining plate 522 can be a right angle of 90°, while the gradient of the other side 533-2 can be an acute angle less than 90°. In some embodiments, the shape of the free end of the retaining plate 522 can match the gradient of the retaining structure 522. For example, the gradient of the free end of the retaining plate 522 can also be a right angle of 90°. When the stop plate 522 is inserted into the groove between the ratchets, the free end of the stop plate 522 abuts against one side 533-1 of the stop structure 522. At this time, since the gradient of one side 533-1 of the stop structure 522 is large, the stop plate 522 abuts against one side 533-1 of the stop structure 522 to prevent the spool 531 from continuing to move along direction A, thereby achieving rapid braking.

[0094] As can be seen from the foregoing, ratchet teeth can quickly switch between the braking and release states. However, ratchet teeth cannot achieve a transition between the braking and release states, cannot simulate different braking forces, and accordingly cannot provide different feedback forces. In some embodiments, a stopper and a stopper structure can be configured so that the stopper can be inserted into the groove between the teeth of the stopper structure to a plurality of corresponding depths, thereby providing different feedback forces.

[0095] Figure 8 is a schematic diagram of another exemplary stopper structure according to some embodiments of this specification. As shown in Figure 8 , the stopper structure 833 may include a ratchet. The shape of the end 822-a of the stopper 822 matches that of the ratchet. By controlling the downward pressure of the stopper 822, different feedback force simulations can be achieved. For example, to provide different feedback forces, the stopper 822 may be elastic. When the stopper 822 abuts against a side 833-1 of the stopper structure 833 to achieve braking, the transmission rod 823 is controlled to continue pressing the stopper 822 downward. This causes the stopper 822 to deform due to its inherent elasticity, with greater deformation corresponding to greater feedback force. For another example, the stopper 822 may be inserted into the groove between the ratchets at multiple depths. These multiple depths can correspond to different feedback force magnitudes, thereby simulating different feedback forces. By way of example only, when the stopper 822 is in a stationary position, the stopper structure 833 may move along with the spool 831 in direction B. When the stopper 822 moves downward and inserts into the groove between the ratchet wheels, the end 822-a of the stopper 822 abuts against a side 833-1 of the stop structure 833. The resulting resistance provides feedback force to the user's finger. Depending on the depth of insertion of the stopper 822 into the groove between the ratchet wheels, the angle of contact between the stopper 822 and the spool 831 varies, and the magnitude of the feedback force provided to the user's finger also varies accordingly. Thus, varying degrees of force feedback can be achieved by controlling the insertion depth of the stopper 822 into the groove between the ratchet wheels.

[0096] By providing an intermediate transition between braking and releasing, the force feedback experienced by a finger when grasping or touching an object can be better simulated. For example, when a finger grasps an elastic object, from initial contact to final grip, the finger experiences a gradually increasing feedback force, and the intermediate transition between braking and releasing can reflect this process. In some embodiments, to ensure that force feedback more closely matches the expectations of a real-world scenario, multiple stop components as described above can be provided. These stop components can be made of different materials or have different structures, thereby exhibiting different braking effects. For example, two stop components with different stiffness can be made of materials of different hardness. A stop component with greater stiffness can achieve faster braking when engaged with the stop structure, while a stop component with less stiffness can achieve relatively "slower" braking when engaged with the stop structure. Compared to a stop component with greater stiffness, this better reflects the intermediate state of gradually increasing feedback force. Similarly, stop components with different structures (e.g., the stop components shown in Figures 7B and 8) can also achieve different braking effects. In practical applications, the required stopping components can be flexibly selected for braking according to the scenario to be simulated.

[0097] The tooth spacing may refer to the distance between two adjacent stop structures. For example, the stop structure may include a ratchet, and the tooth spacing may be the distance between the tips of two adjacent teeth in the ratchet. In some embodiments, the tooth spacing may affect the control accuracy of the stop component 132. For example, when the tooth spacing is small, the stop plate may quickly abut against the stop structure when moving downward, thereby achieving instant braking and improving the control accuracy of the stop component 132. In some embodiments, the tooth spacing of the stop structure may be less than 2 mm, thereby ensuring the control accuracy of the stop component 132. In some embodiments, in order to further improve the control accuracy of the stop component 132, the tooth spacing of the stop structure may be less than 1 mm.

[0098] In some embodiments, as shown in FIG5A , a limiting protrusion 139 - 1 may be disposed on the inner side surface of the rotating shaft frame 137 opposite the stop structure 533. The limiting protrusion 139 - 1 may be a protruding structure that limits the position of a component. For example, the limiting protrusion 139 - 1 may be used to limit the distance between the inner side surface of the rotating shaft frame 137 and the stop structure 533, thereby preventing friction between the stop structure 533 and the rotating shaft frame 137 from affecting the accuracy of force feedback. In some embodiments, the limiting protrusion 139 - 1 may be staggered from the stop structure 533. For example, in a projection plane along the central axis aa' of the spool 531, the limiting protrusion 139 - 1 and the stop structure 533 do not overlap. In some embodiments, the limiting protrusions 139 - 1 may be distributed around the inner surface of the rotating shaft frame 137. For example, the inner surface of the rotating shaft frame 137 may be provided with a plurality of limiting protrusions 139-1, which may be distributed around the central axis aa' of the spool 531. In some embodiments, the plurality of limiting protrusions 139-1 may be evenly distributed along a circle centered at the central axis aa' on the inner side surface of the rotating shaft frame 137, thereby uniformly limiting the distance between the inner side surface of the rotating shaft frame 137 and the stop structure 533, thereby preventing the spool 531 from tilting during rotation and causing friction between the stop structure 533 and the rotating shaft frame 137. It should be noted that the position of the limiting protrusions 139-1 shown in FIG5A is merely illustrative. In some embodiments, the limiting protrusions 139-1 may be provided at any location that can limit the distance between the inner side surface of the rotating shaft frame 137 and the stop structure 533. For example, the limiting protrusions 139-1 may be provided on the upper surface of the spool 531, i.e., the plane where the stop structure 533 is located.

[0099] In some embodiments, the height of the limiting protrusion 139-1 can be greater than the stop structure 533, wherein the height of the limiting protrusion 139-1 refers to the length dimension of the limiting protrusion 139-1 along the direction of the central axis aa' of the spool 531. By setting the height of the limiting protrusion 139-1 to be greater than the height of the stop structure 533, the relative position between the spool 531 and the rotating shaft frame 137 can be limited. For example, when the spool 531 rotates and generates an upward deviation and is about to contact the rotating shaft frame 137, because the height of the limiting protrusion 139-1 is greater than the height of the stop structure 533, the limiting protrusion 139-1 can first contact the upper surface of the spool 531 where the stop structure 533 is located, thereby preventing friction between the stop structure 533 and the rotating shaft frame 137 and ensuring the accuracy of force feedback. In some embodiments, the height of the limiting protrusion 139-1 can be less than the distance between the upper surface of the spool 531 and the inner side surface of the rotating shaft frame 137, thereby reducing friction between the limiting protrusion 139-1 and the upper surface of the spool 531. In some embodiments, to prevent the friction between the limiting protrusion 139-1 and the upper surface of the spool 531 from affecting the accuracy of force feedback, the limiting protrusion 139-1 can have a smooth surface.

[0100] The embodiments of this specification are illustratively described using the example of the position-limiting protrusion 139-1 being set on the inner side of the rotating shaft frame. In some embodiments, the position-limiting protrusion 139-1 can be set at other locations. For example, the position-limiting protrusion 139-1 can be set on the upper surface of the spool 531. For another example, the shell of the finger force feedback member 130 (for example, the shell 134 shown in Figure 2) can be used interchangeably with the rotating shaft frame. As an example only, the stop member 132 can be located inside the rotating shaft frame 137. In this case, the rotating shaft frame 137 can serve as a shell, and the position-limiting protrusion 139-1 can be set on the inner side of the shell opposite to the stop structure.

[0101] As shown in FIG5A , each finger force feedback member further includes a sensor component 131. The sensor component 131 can be configured to detect the travel distance of the pull cord 136 and transmit data related to the travel distance of the pull cord 136 to the microprocessor 120. Based on the data related to the travel distance of the pull cord 136 and current scene information, the microprocessor 120 or an external computing device 140 can determine whether to brake the finger and generate a corresponding control signal.

[0102] The sensing component 131 may include a magnet 511 and a magnetic field sensor 512. The magnet 511 is mechanically connected to the spool 531 so that it rotates with the spool. For example, the magnet 511 may be mechanically connected to the outer surface of the lower sidewall 531-2 of the spool 531 (or the lower surface of the spool 531). The magnetic field sensor 512 may be positioned opposite the magnet 511. For example, the magnetic field sensor 512 may be positioned on the inner side of the rotating shaft frame opposite the magnet 511. Alternatively, the magnetic field sensor 512 may be embedded in the inner side of the rotating shaft frame opposite the magnet 511, such that the upper surface of the magnetic field sensor 512 is coplanar with the inner side of the shaft frame. The magnetic field sensor 512 may be used to measure rotational information of the magnet 511 as the spool 531 rotates. By way of example only, the magnetic field sensor 512 and the magnet 511 may be cylindrical and coaxially arranged. When the pull cord 136 is pulled out or rotated back in response to an external pulling force, the spool 531 can rotate about the central axis aa', and the magnet 511 can rotate along with the spool 531, causing the direction of the magnetic field to change. The magnetic field sensor 512 can detect the change in the magnetic field and generate a sensing signal. This change can reflect the rotation information of the spool 531, thereby reflecting the motion state of the pull cord 136. For example, the direction of the magnetic field change can reflect the direction of rotation of the spool 531, that is, the direction of movement of the pull cord 136 (pulling out or resetting). For another example, the rate of change of the magnetic field can reflect the rate of rotation of the spool 531, that is, the speed of movement of the pull cord 136. For another example, the total amount of change in the magnetic field can reflect the degree of rotation of the spool 531, that is, the distance traveled by the pull cord 136. The motion state of the pull cord 136 can further reflect the motion state of the user's finger. For example, based on the motion state of the pull cord 136, it can be determined whether the user's finger is bent and the degree of bending.

[0103] In some embodiments, the finger force feedback member 130 may further include a printed circuit board (PCB) 160. The PCB 160 may be used to read data generated by the finger force feedback member 130 (e.g., sensing signals from the sensing component 131, finger posture data generated by the strain sensor, etc.) and / or input control commands to the finger force feedback member 130. As shown in FIG5A , the PCB 160 may be disposed at the bottom of the finger force feedback member 130. The PCB 160 may read data generated by the finger force feedback member 130 and transmit it to the microprocessor 120, or receive control commands from the microprocessor 120 to control the stop member 132 to achieve braking.

[0104] As shown in FIG5A , in some embodiments, the magnet 511 and the magnetic field sensor 512 can be coaxially arranged along the central axis aa′ of the rotating spool 531. This arrangement allows the magnet 511 and the spool 531 to rotate synchronously about the central axis, allowing the magnetic field sensor 512 to accurately sense changes in the magnetic field, thereby accurately and timely detecting the motion state of the pull cord 136.

[0105] As shown in FIG5A , the magnet 511 is attached to the lower surface of the bobbin 531. A limiting protrusion 139-2 may be disposed on the lower surface of the bobbin 531. The limiting protrusion 139-2 can be used to limit the distance between the lower surface of the bobbin 531 and the inner side surface of the rotating shaft frame 531, thereby reducing or preventing friction between the lower surface of the bobbin 531 and the rotating shaft frame. The limiting protrusion 139-2 can also be used to limit the position of the magnet 511 relative to the magnetic field sensor 512, allowing a distance between the magnet 511 and the magnetic field sensor 512 to prevent contact between the magnet 511 and the magnetic field sensor 512, thereby affecting magnetic field changes and sensing. In some embodiments, the limiting protrusion 139-2 can be staggered relative to the magnetic field sensor 512. For example, in a projection plane along the central axis aa' of the bobbin 531, the limiting protrusion 139-2 and the magnetic field sensor 512 do not overlap. In some embodiments, the limiting protrusion 139-2 can be distributed around the lower surface of the bobbin 531. For example, a plurality of limiting protrusions 139-2 may be provided on the lower surface of the bobbin 531, and the plurality of limiting protrusions 139-2 may be distributed around the central axis aa' of the bobbin 531. In some embodiments, the plurality of limiting protrusions 139-2 may be evenly distributed on the lower surface of the bobbin 531 along a circle centered on the position of the central axis aa', thereby evenly limiting the position of the lower surface of the bobbin 531 relative to the magnetic field sensor 512, thereby preventing the bobbin 531 from tilting during rotation, thereby preventing contact between the magnet 511 and the magnetic field sensor 512. It should be noted that the location of the limiting protrusions 139-2 shown in FIG5A is for illustrative purposes only. In some embodiments, the limiting protrusions 139-2 may also be provided on the inner side surface of the rotating shaft frame 137 opposite to the magnet 511.

[0106] In some embodiments, the height of the limiting protrusion 139-2 can be greater than the height of the magnet 511. The heights of the limiting protrusion 139-2 and the magnet 511 refer to the lengths of the limiting protrusion 139-2 and the magnet 511 along the direction of the central axis aa' of the spool 531. In some embodiments of the present specification, by setting the height of the limiting protrusion 139-2 to be greater than the height of the magnet 511, the position of the lower surface of the spool 531 relative to the magnetic field sensor 512 can be limited, so that a distance can be separated from the magnetic field sensor 512, thereby preventing the magnet 511 from contacting the magnetic field sensor 512 and affecting the change and sensing of the magnetic field. For example, as shown in FIG5A, the magnetic field sensor 512 can be embedded in the inner side surface of the rotating shaft frame opposite the magnet 511, so that the upper surface of the magnetic field sensor 512 is coplanar with the inner side surface of the rotating shaft frame 137 opposite the magnet 511. When the bobbin 531 rotates and deflects downward, causing the magnet 511 to contact the magnetic field sensor 512 (or the inner side of the rotating shaft frame 137), since the height of the limiting protrusion 139-2 is greater than the height of the magnet 511, the limiting protrusion 139-2 can first contact the inner side of the rotating shaft frame 137, so that a distance can be separated between the magnet 511 and the magnetic field sensor 512, thereby preventing the magnet 511 from contacting the magnetic field sensor 512 and affecting the change and sensing of the magnetic field. In some embodiments, the height of the limiting protrusion 139-2 can be less than the distance between the lower surface of the bobbin 531 and the inner side of the rotating shaft frame 137, thereby reducing the friction between the limiting protrusion 139-2 and the inner side of the rotating shaft frame 137. In some embodiments, to prevent the friction between the limiting protrusion 139-2 and the inner side of the rotating shaft frame 137 from affecting the accuracy of the force feedback, the limiting protrusion 139-1 can have a smooth surface structure.

[0107] The embodiments of this specification are illustratively described by taking the example of the limiting protrusion 139-2 being set on the lower surface of the bobbin. In some embodiments, the limiting protrusion 139-2 can be set at other positions. For example, the limiting protrusion 139-2 can be set on the inner side of the rotating shaft frame (i.e., the inner side opposite to the magnet 511). For another example, the shell of the finger force feedback member (for example, the shell 134 shown in Figure 2) can be used interchangeably with the rotating shaft frame. As an example only, the stop member 132 can be located inside the rotating shaft frame 137, in which case the rotating shaft frame 137 can serve as a shell, and the limiting protrusion 193-2 can be set on the inner side of the shell opposite to the magnet 511.

[0108] In some embodiments, the finger force feedback member 130 may include a strain sensor. In some embodiments, the strain sensor may be configured to read the posture data of the finger. When the user wears the glove body 110 to generate finger movement, the finger area of ​​the glove body 110 is deformed by the external force, and the strain sensor can convert the deformation information at the finger joint (for example, deformation direction, deformation size, etc.) into an electrical signal. The electrical signal generated by the strain sensor can reflect the posture data at the corresponding area of ​​the finger. The microprocessor 120 or the external computing device 140 can determine whether to brake the finger and generate a corresponding control signal based on the electrical signal generated by the strain sensor and the current scene information. In some embodiments, the strain sensor may include but is not limited to a capacitive strain sensor, an inductive sensor, a resistive sensor, an optical fiber sensor, etc.

[0109] In some embodiments, strain sensors can be arranged at the finger joints of the glove body 110. For example, in conjunction with Figures 4A and 4B, strain sensors can be arranged at the metacarpophalangeal joints 111-a, the interphalangeal joints 111-b, and the interphalangeal joints 111-c. Further in conjunction with Figure 9, Figure 9 is a schematic diagram of the joint positions of the user's hand according to some embodiments of this specification. The finger joints of the hand can include metacarpophalangeal joints at positions 0, 2, 5, 8, and 11, and interphalangeal joints at positions 1, 3, 6, 9, 12, 4, 7, 10, and 13. In some embodiments, the finger force feedback member 130 can include multiple strain sensors arranged at the finger joints on the glove body 110. For example, the multiple strain sensors can include a first strain sensor arranged at the interphalangeal joints 1, 3, 6, 9, 12, 4, 7, 10, and 13, and the first strain sensor is configured to measure the deformation of the interphalangeal joints in a single degree of freedom. For another example, the multiple strain sensors may further include second strain sensors disposed at metacarpophalangeal joints 0, 2, 5, 8, and 11, the second strain sensors being configured to measure deformation of the metacarpophalangeal joints in two degrees of freedom. In some embodiments, the first strain sensor comprises a single-degree-of-freedom sensor, such as a single-axis sensor (e.g., an inductive, resistive bending sensor, or a capacitive stretch sensor). The second strain sensor comprises a multi-degree-of-freedom sensor, such as a multi-axis sensor (e.g., a capacitive multi-axis motion sensor).

[0110] The degrees of freedom described in this specification refer to the dimensions in which an object can move. To facilitate the description of the degrees of freedom of hand movement, a three-dimensional coordinate system is established for hand movement, such as the one shown in Figure 10. In this coordinate system, the origin is the metacarpophalangeal joint, the direction of finger extension is the Y-axis, and the direction perpendicular to the hand plane is the Z-axis. The hand plane can refer to the plane of the palm portion. For example, when the palm of the hand is placed flat on a table, the table or a plane passing through the hand and parallel to the table can be used as the hand plane. This three-dimensional coordinate system can be used to describe the degrees of freedom of hand movement. Specifically, in the three-dimensional coordinate system shown in Figure 10, rotation of the hand about the X-axis is defined as bending, rotation of the hand about the Z-axis is defined as swinging, and rotation of the hand about the Y-axis is defined as rotation. The interphalangeal joints can only bend and rotate. In other words, deformation of the interphalangeal joints corresponds only to bending, a single degree of freedom. The metacarpophalangeal joints can bend, swing, and rotate. In other words, deformation of the metacarpophalangeal joints corresponds to both bending and swinging degrees of freedom. Thus, when any interphalangeal joint is bent, the first strain sensor can measure the deformation of the glove body 110 at the corresponding interphalangeal joint. When any metacarpophalangeal joint is bent or swung, the second strain sensor can measure the deformation of the glove body 110 at the corresponding metacarpophalangeal joint.

[0111] Continuing with FIG9 , interphalangeal joints 4, 7, 10, and 13 are distal interphalangeal joints relatively far from the palm, and interphalangeal joints 1, 3, 6, 9, and 12 are proximal interphalangeal joints relatively close to the palm. In some embodiments, the movement of the distal interphalangeal joints is manifested as following the movement of the preceding joint (the proximal interphalangeal joint). Typically, they do not bend independently, but rather bend together with the proximal interphalangeal joints. Therefore, first strain sensors may not be separately arranged at the distal interphalangeal joints, but only at the proximal interphalangeal joints. In some embodiments, deformation data at the distal interphalangeal joints may be generated by mapping deformation data of the corresponding proximal interphalangeal joints. Therefore, the force feedback system 100 can collect deformation data of at least five proximal interphalangeal joints in a single degree of freedom through multiple first strain sensors, and collect deformation data of five metacarpophalangeal joints in two degrees of freedom through multiple second strain sensors. In total, the multiple first strain sensors and the multiple second strain sensors jointly provide deformation data of at least 15 degrees of freedom on at least the user's fingers, thereby determining the posture data of the fingers.

[0112] In some embodiments, the finger posture data acquired by the multiple strain sensors may be combined with the motion data of the user's wrist joint acquired by the inertial sensing module 240 to jointly determine the user's hand posture.

[0113] In some embodiments, the first strain sensor is a uniaxial sensor that collects the deformation of the interphalangeal joint in a single degree of freedom (i.e., bending). In some embodiments, the first strain sensor includes various flexible bending sensors, such as inductive sensors, resistive sensors, capacitive sensors, optical fiber sensors, etc. As an example only, the first strain sensor includes an inductive sensor, the inductance of which can change with the deformation of the interphalangeal joint. Specifically, the inductive sensor deforms as the interphalangeal joint moves, and its inductance changes in response to the deformation of the inductive sensor. By collecting parameters related to the inductance of the inductive sensor and analyzing their changes, the bending condition of the inductive sensor (such as bending angle, bending direction, etc.) can be calculated more accurately. For example, the electrical quantity of the inductance of the inductive sensor is proportional to the deformation of the inductive sensor. Therefore, the change in the electrical quantity of the inductance of the inductive sensor can characterize the deformation or bending degree of the interphalangeal joint. Since the interphalangeal joint only corresponds to one bending degree of freedom, using a uniaxial sensor (such as an inductive sensor) to measure the movement of the interphalangeal joint has a simple structure and low product cost. In addition, the first strain sensor can be arranged only at the interphalangeal joint closest to the metacarpophalangeal joint of each finger of the user, thereby simplifying the structure of the finger force feedback component, reducing product costs, and ensuring the accuracy of deformation data collection.

[0114] In some embodiments, the second strain sensor is a multi-axis sensor configured to capture deformation of the metacarpophalangeal joint in two degrees of freedom (i.e., flexion and swing). In some embodiments, the second strain sensor comprises various flexible flexure sensors, such as inductive sensors, resistive sensors, capacitive sensors, and fiber optic sensors. By way of example only, the second strain sensor comprises multiple capacitive structures, the capacitance of which can vary separately with changes in the metacarpophalangeal joint in each degree of freedom.

[0115] 11 and 12 , second strain sensor 1100 includes a flexible substrate 1110, a first capacitive structure 1120, and a second capacitive structure 1130. As shown in FIG11 , first capacitive structure 1120 and second capacitive structure 1130 are located on both sides of flexible substrate 1110 along the thickness direction, and the projection of first capacitive structure 1120 on flexible substrate 1110 at least partially overlaps with the projection of second capacitive structure 1130 on flexible substrate 1110. In some embodiments, as shown in FIG12 , first capacitive structure 1120 and second capacitive structure 1130 are located on the same side of flexible substrate 1110 along the thickness direction.

[0116] The flexible substrate 1110 is flexible and easily deforms (e.g., bends) when subjected to external forces. In some embodiments, to facilitate conformation to human joints, the flexible substrate 1110 may have a flat structure. In this case, the flexible substrate 1110 has a thickness direction, which may be the Z-axis direction as shown in FIG11 .

[0117] The capacitor structure (including the first capacitor structure 1120 and the second capacitor structure 1130) is used to measure the structure of the bending deformation of the flexible substrate 1110. Specifically, the capacitor structure has a corresponding area, and the electrical quantity of the capacitor structure (for example, capacitance) is proportional to its area (or the dimensional parameters related to the area, such as the length, width or bending angle of the second strain sensor of the capacitor structure). That is, the electrical quantity of the capacitor structure in different directions is proportional to the deformation of the second strain sensor in different degrees of freedom, thereby reflecting the deformation (such as bending angle, bending direction). It should be understood that the second strain sensor may include but is not limited to a capacitor structure. For example, it may also be a resistor structure or a capacitor-resistor composite structure. In some embodiments, the first capacitor structure 1120 and the second capacitor structure 1130 may include a multilayer structure arranged on the same side surface of the thickness direction of the flexible substrate 1110 (the Z-axis direction as shown in Figure 11 or Figure 12), and the layers of each multilayer structure are stacked along the thickness direction. Among them, the multilayer structure is a structure formed by stacking layered structures. The layers of each multilayer structure stacked along the thickness direction can be understood as follows: the layers of the multiple layered structures of the first capacitor structure 1120 and the second capacitor structure 1130 are arranged along the thickness direction of the flexible substrate 1110 and stacked together. In some embodiments, the multilayer structure includes a second conductive layer, an intermediate layer, and a first conductive layer. In some embodiments, the multilayer structure includes a second conductive layer, a second intermediate layer, a third conductive layer, a first intermediate layer, and a first conductive layer. Specific layered structures included in the multilayer structure can be found below.

[0118] When different capacitive structures are arranged at different positions of the second strain sensor 1100, these capacitive structures will produce different responses to the deformation of the flexible substrate 1110 in different dimensions. When the flexible substrate 1110 deforms in a certain dimension, the detection parameters generated by these capacitive structures have characteristics corresponding to the deformation of this dimension; and when the flexible substrate 1110 deforms in another dimension, the detection parameters generated by these capacitive structures will have characteristics corresponding to it. It can be understood that the characteristics of the detection parameters generated by these capacitive structures will correspond to the deformation dimensions of the flexible substrate 1110 one-to-one. Based on this, the deformation of the flexible substrate 1110 can be identified based on the detection parameters of each capacitive structure. In some embodiments, the processor (e.g., microprocessor 120 or external computing device) can determine the deformation of the flexible substrate 1110 in at least two dimensions based on the capacitance-related parameters of each capacitive structure (e.g., first capacitive structure 1120, second capacitive structure 1130) using a specific algorithm. For example, the deformation of the flexible substrate 1110 in at least two dimensions is determined using a machine learning model, a mapping relationship, or a functional relationship. The description of deformation in at least two dimensions can be found in the following.

[0119] When the second strain sensor 1100 (flexible substrate 1110) is bent and deformed, the physical shape of at least a portion of the capacitive structure (e.g., the first capacitive structure 1120 and the second capacitive structure 1130) located on the flexible substrate 1110 changes, thereby causing the corresponding capacitance to change. For example, bending of the second strain sensor 1100 may cause the area of ​​the capacitive structure to change, thereby changing the capacitance of the capacitive structure. By collecting the capacitance of the capacitive structure or parameters related to capacitance and analyzing changes in the capacitance of the capacitive structure or parameters related to capacitance, the bending condition of the second strain sensor 1100 (e.g., bending angle, bending direction) can be more accurately sensed.

[0120] As shown in FIG11 , in some embodiments, first and second capacitive structures 1120 and 1130 are respectively located on opposite sides of the flexible substrate 1110 along the thickness direction. In some embodiments, the first and second capacitive structures 1120 and 1130 are symmetrically arranged along the flexible substrate 1110 along the thickness direction. In this case, the projection of the first and second capacitive structures 1120 and 1130 on the flexible substrate 1110 completely overlap. When the first and second capacitive structures 1120 and 1130 are symmetrically arranged about the flexible substrate 1110 along the thickness direction, the two capacitive structures have the same response to some external disturbances (for example, the overall stretching or compression of the second strain sensor along a certain direction). In this case, based on the capacitance-related parameters of the capacitive structures, a differential processing algorithm can be used to eliminate the influence of external disturbances on the second strain sensor 1100, thereby improving the sensitivity of determining deformation in at least two degrees of freedom of the flexible substrate 1110.

[0121] In some embodiments, the flexible substrate 1110 includes a short axis and a long axis perpendicular to the thickness direction. The deformation in multiple degrees of freedom generated by the second strain sensor 1100 (flexible substrate 1110) shown in FIG11 includes at least bending deformation about an axis parallel to the short axis and tensile or compressive deformation along the long axis. The short axis can be the X-axis shown in FIG11 , and the long axis can be the Y-axis shown in FIG11 .

[0122] As shown in FIG11 , when the second strain sensor 1100 is bent and deformed about an axis parallel to the minor axis (i.e., the X-axis), the first capacitor structure 1120 and the second capacitor structure 1130 undergo tensile deformation and compressive deformation, respectively. For example, the first capacitor structure 1120 is bent and elongated, while the second capacitor structure 1130 is bent and compressed. At this time, the capacitances of the first capacitor structure 1120 and the second capacitor structure 1130 undergo opposite changes. In this case, the difference in capacitance between the first capacitor structure 1120 and the second capacitor structure 1130 can reflect the bending direction and degree of the second strain sensor 1100 about the axis parallel to the X-axis. Since the first capacitor structure 1120 and the second capacitor structure 1130 are stretched and compressed to substantially the same degree, the sum of their capacitances can remain substantially unchanged.

[0123] When the second strain sensor 1100 is stretched or compressed along its longitudinal axis, the first capacitor structure 1120 and the second capacitor structure 1130 are stretched or compressed synchronously, and the capacitances of the first capacitor structure 1120 and the second capacitor structure 1130 change synchronously. In this case, the difference in capacitance between the first capacitor structure 1120 and the second capacitor structure 1130 remains substantially unchanged (or close to zero), and the sum of the two capacitances reflects the degree of stretching or compression of the second strain sensor 1100 along its longitudinal axis.

[0124] In some embodiments, by comparing the capacitance characteristics of the first and second capacitive structures 1120 and 1130 in the two degrees of freedom, for example, the relationship between the sum (or difference) of their capacitances and the deformation of the flexible substrate 1110, mutual interference between the deformations in the two degrees of freedom can be avoided, effectively distinguishing the deformations of the flexible substrate 1110 in the two degrees of freedom. For example, when the second strain sensor 1100 is stretched or compressed as a whole, the first and second capacitive structures 1120 and 1130 will stretch or compress synchronously. This synchronous stretching or compression of the first and second capacitive structures 1120 and 1130 is considered common-mode interference. In this case, differential processing of the signal (e.g., capacitance) can eliminate this common-mode interference, rendering the second strain sensor 1100 insensitive to its own stretching or compression deformation and sensitive only to bending deformation about an axis parallel to the minor axis (i.e., the X-axis), enabling the second strain sensor 1100 to accurately detect bending deformation in this degree of freedom. That is, the difference in capacitance between the first capacitor structure 1120 and the second capacitor structure 1130 primarily reflects the bending deformation of the flexible substrate 1110 about an axis parallel to the minor axis (i.e., the X-axis). Similarly, the sum of the capacitances of the first capacitor structure 1120 and the second capacitor structure 1130 primarily reflects the tensile or compressive deformation of the flexible substrate 1110 along the major axis. The detection principle for tensile or compressive deformation along the major axis is similar to that of the second strain sensor 1100 having four capacitor structures. For detailed descriptions, please refer to Figures 14A to 16 and the related descriptions.

[0125] As shown in Figure 12, in some embodiments, the flexible substrate 1110 includes a long axis direction perpendicular to the thickness direction, and the first capacitor structure 1120 and the second capacitor structure 1130 are distributed on the same side of the flexible substrate 1110 in the thickness direction. The first capacitor structure 1120 and the second capacitor structure 1130 are arranged side by side and both extend along the long axis direction of the flexible substrate 1110.

[0126] In some embodiments, the first capacitor structure 1120 and the second capacitor structure 1130 are symmetrically arranged along a mid-section parallel to a plane formed by the thickness direction and the long axis direction, and the mid-section is located on the flexible substrate 1110. When the first capacitor structure 1120 and the second capacitor structure 1130 are symmetrically arranged about the flexible substrate 1110 along the mid-section, the two capacitor structures have the same response to partial external interference (for example, the second strain sensor 1100 is stretched or compressed as a whole along a certain direction). In this case, the processing circuit 16 can eliminate the influence of the external interference on the second strain sensor 1100 through a differential processing algorithm based on the capacitance-related parameters of the capacitor structures (for example, the first capacitor structure 1120 and the second capacitor structure 1130), thereby improving the sensitivity of determining the deformation of the flexible substrate 1110 in at least two degrees of freedom. For more information about the mid-section, please refer to Figures 13A and 13B and the related descriptions.

[0127] In some embodiments, the degree of freedom deformation generated by the second strain sensor 1100 (flexible substrate 1110 ) shown in FIG. 12 includes at least bending deformation around an axis parallel to the thickness direction and tensile or compressive deformation along the long axis direction.

[0128] As shown in FIG12 , when the second strain sensor 1100 is bent and deformed about an axis parallel to the thickness direction (i.e., the Z-axis), the first capacitor structure 1120 and the second capacitor structure 1130 undergo tensile deformation and compressive deformation, respectively. For example, the first capacitor structure 1120 is bent and elongated, while the second capacitor structure 1130 is bent and compressed. At this time, the capacitances of the first capacitor structure 1120 and the second capacitor structure 1130 undergo opposite changes. In this case, the difference in capacitance between the first capacitor structure 1120 and the second capacitor structure 1130 can reflect the bending direction and degree of the second strain sensor 1100 about the axis parallel to the Z-axis. Since the first capacitor structure 1120 and the second capacitor structure 1130 are stretched and compressed to substantially the same degree, the sum of their capacitances can remain substantially unchanged.

[0129] When the second strain sensor 1100 shown in FIG12 is stretched or compressed along its long axis, the first capacitor structure 1120 and the second capacitor structure 1130 are stretched or compressed synchronously, and the capacitances of the first capacitor structure 1120 and the second capacitor structure 1130 change synchronously. In this case, the difference in capacitance between the first capacitor structure 1120 and the second capacitor structure 1130 remains substantially unchanged (or close to zero), and the sum of the two capacitances reflects the degree of stretching or compression of the second strain sensor 1100 along its long axis.

[0130] In some embodiments, by comparing the capacitance characteristics of the first and second capacitive structures 1120 and 1130 in the two degrees of freedom, for example, the relationship between the sum (or difference) of their capacitances and the deformation of the flexible substrate 1110, mutual interference between the deformations in the two degrees of freedom can be avoided, effectively distinguishing the deformations of the flexible substrate 1110 in the two degrees of freedom. For example, when the second strain sensor 1100 is stretched or compressed as a whole, the first and second capacitive structures 1120 and 1130 will stretch or compress synchronously. This synchronous stretching or compression of the first and second capacitive structures 1120 and 1130 can be considered common-mode interference. In this case, differential processing of the signal (e.g., capacitance) can eliminate this common-mode interference, rendering the second strain sensor 1100 insensitive to its own stretching or compression deformation and sensitive only to bending deformation about an axis parallel to the thickness direction (i.e., the Z-axis), enabling the second strain sensor 1100 to accurately detect bending deformation in this degree of freedom. That is, the difference in capacitance between the first capacitor structure 1120 and the second capacitor structure 1130 primarily reflects the bending deformation of the flexible substrate 1110 about an axis parallel to the thickness direction (i.e., the Z-axis direction). Similarly, the sum of the capacitances of the first capacitor structure 1120 and the second capacitor structure 1130 primarily reflects the tensile or compressive deformation of the flexible substrate 1110 along the longitudinal axis. The detection principle for tensile or compressive deformation along the longitudinal axis is similar to that of the second strain sensor 1100 having four capacitor structures. For detailed descriptions, please refer to Figures 14A to 16 and the related descriptions.

[0131] FIG13A is a schematic diagram showing the distribution of four capacitor structures on a flexible substrate according to some embodiments of this specification; FIG13B is a schematic diagram showing the cross-sectional structure of the four capacitor structures shown in FIG13A along the Y-axis.

[0132] As shown in Figures 13A and 13B, in some embodiments, compared to Figure 12, the second strain sensor 1100 further includes a third capacitor structure 1140 and a fourth capacitor structure 1150. The first capacitor structure 1120 and the second capacitor structure 1130 are arranged side by side on one side of the flexible substrate 1110 along the thickness direction and both extend along the long axis; the third capacitor structure 1140 and the fourth capacitor structure 1150 are arranged side by side on the other side of the flexible substrate 1110 along the thickness direction and both extend along the long axis.

[0133] In some embodiments, the processor reads capacitance-related parameters of the first capacitor structure 1120 , the second capacitor structure 1130 , the third capacitor structure 1140 , and the fourth capacitor structure 1150 , and determines deformation of the flexible substrate 1110 in at least two degrees of freedom based on the parameters.

[0134] In some embodiments, the degrees of freedom deformation generated by the second strain sensor 1100 (flexible substrate 1110) shown in FIG13A include at least bending deformation about an axis parallel to the thickness direction, bending deformation about an axis parallel to the short axis direction, and tensile or compressive deformation along the long axis of the flexible substrate 1110. For illustrative purposes, the capacitance-related parameters of various capacitive structures under different degrees of freedom deformation are described below with reference to FIG14A , FIG14B , FIG15 , and FIG16 .

[0135] In some embodiments, parameters related to capacitance include: C1, C2, C3, C4, Ctotal, dCx, and dCz; where Ctotal = C1 + C2 + C3 + C4, dCx after a composite differential operation = (C1 + C2) - (C3 + C4), and dCz after a composite differential operation = (C1 + C3) - (C2 + C4). Where C1, C2, C3, and C4 represent the capacitances of the first capacitor structure 1120, the second capacitor structure 1130, the third capacitor structure 1140, and the fourth capacitor structure 1150, respectively.

[0136] In some embodiments, the first capacitor structure 1120 and the second capacitor structure 1130 are symmetrically arranged about a first middle section S1, and the third capacitor structure 1140 and the fourth capacitor structure 1150 are symmetrically arranged about the first middle section S1. The first middle section S1 represents: a cross section of the flexible substrate 1110 that is parallel to a plane formed by the thickness direction and the long axis direction; the first capacitor structure 1120 and the third capacitor structure 1140 are symmetrically arranged about a second middle section S2 of the flexible substrate 1110, and the second capacitor structure 1130 and the fourth capacitor structure 1150 are symmetrically arranged about the second middle section S2. The second middle section S2 represents: a midplane of the flexible substrate 1110 that is parallel to a plane formed by the long axis direction and the short axis direction.

[0137] By providing four symmetrical capacitor structures on the second strain sensor 1100 and performing a composite differential operation, common-mode interference can be effectively eliminated during the process of identifying sensor bending deformation. As an example, when the second strain sensor 1100 is stretched or compressed as a whole, the first capacitor structure 1120, the second capacitor structure 1130, the third capacitor structure 1140, and the fourth capacitor structure 1150 will be stretched or compressed synchronously. The stretching or compression of these four capacitor structures is considered common-mode interference. The dCx and dCz obtained by providing four capacitor structures and performing composite differential processing on the signals remain unchanged, effectively eliminating this common-mode interference. This makes the flexible second strain sensor 1100 insensitive to its own stretching or compression deformation and only sensitive to its own bending deformation, thereby increasing the accuracy of the second strain sensor 1100.

[0138] FIG14A is a schematic diagram of a second sensor without deformation according to some embodiments of the present specification; FIG14B is a schematic diagram of the deformation of the second sensor shown in FIG14A after being stretched or compressed along the long axis direction.

[0139] In some embodiments, when the first capacitor structure 1120 , the second capacitor structure 1130 , the third capacitor structure 1140 and the fourth capacitor structure 1150 are all capacitor structures, the second strain sensor 1100 can identify tensile or compressive deformation along the long axis of the flexible substrate 11 based on parameters related to capacitance.

[0140] In some embodiments, when the second strain sensor 1100 shown in FIG14A is not deformed, the capacitance of the four capacitor structures can be obtained by the following formula (1). For illustrative purposes only, the four capacitor structures of the second strain sensor 1100 are considered to be completely identical and symmetrical about the flexible substrate 1110 (i.e., the first middle section S1 and the second middle section S2).

[0141] Wherein, ε0 represents the dielectric constant of vacuum; ε represents the relative dielectric constant of each of the four capacitor structures (i.e., the middle layer, see below); d represents the thickness of the dielectric layer of each of the four capacitor structures; A represents the area of ​​each of the four capacitor structures on the plane formed by the long axis direction and the short axis direction; L0 represents the initial length of each of the four capacitor structures in the long axis direction of the flexible substrate 1110; w represents the width of each of the four capacitor structures in the short axis direction of the flexible substrate 1110.

[0142] In some embodiments, as shown in FIG14B , after the second strain sensor 1100 is stretched or compressed along the long axis (i.e., the Y-axis), the initial length L0 of each of the four capacitor structures is stretched or compressed to Lx. Considering that the thickness of each of the four capacitor structures changes very little, for ease of explanation, it is approximately assumed that the thickness of each of the four capacitor structures remains unchanged. Based on formula (1), the capacitance change of the four capacitor structures can be expressed as follows: formula (2).

[0143] At this time, Ctotal, dCx, and dCz are determined by the following formulas (3), (4), and (5), respectively. dCx=(C1+C2)-(C3+C4)=0 (4) dCz=(C1+C3)-(C2+C4)=0 (5)

[0144] When the second strain sensor 1100 is stretched or compressed along the longitudinal axis, the four capacitor structures are stretched or compressed synchronously, and the capacitance of the four capacitor structures changes synchronously. In this case, the sum of the capacitances of the four capacitor structures can reflect the degree of stretching or compression of the second strain sensor 1100 (flexible substrate 1110) along the longitudinal axis. According to formulas (2) and (3), Ctotal is only related to the length Lx of the capacitor structure after the change, and Lx can be used to represent the stretching or compressing deformation of the second strain sensor 1100 along the longitudinal axis. Therefore, Ctotal can be used to reflect the stretching or compressing deformation of the second strain sensor 1100 (flexible substrate 1110) along the longitudinal axis.

[0145] According to formula (4), dCx reflects the difference between the sum of the capacitance C1 of the first capacitor structure 1120 and the capacitance C2 of the second capacitor structure 1130, and the sum of the capacitance C3 of the third capacitor structure 1140 and the capacitance C4 of the fourth capacitor structure 1150. Referring to the structural distribution of the four capacitor structures in FIG14B , it can be seen that the sum of the capacitance C1 of the first capacitor structure 1120 and the capacitance C2 of the second capacitor structure 1130, i.e., C1+C2, can reflect the bending deformation of the upper side of the flexible substrate 1110 in the thickness direction; the sum of the capacitance C3 of the third capacitor structure 1140 and the capacitance C4 of the fourth capacitor structure 1150, i.e., C3+C4, can reflect the bending deformation of the lower side of the flexible substrate 1110 in the thickness direction. Therefore, dCx is used to reflect the difference in bending deformation generated on the upper and lower side surfaces (i.e., the upper and lower side surfaces along the thickness direction) of the flexible substrate 1110 when it is deformed. It is related to the bending deformation around an axis parallel to the short axis direction (i.e., the X-axis direction). Deformation caused by tension or compression along the long axis direction (i.e., the Y-axis direction) does not cause deformation difference between the upper and lower side surfaces of the flexible substrate 1110, so dCx is a constant of 0.

[0146] Similarly, according to formula (5), dCz is used to reflect the difference in bending deformation generated on the two side surfaces along the short axis direction when the flexible substrate 1110 is deformed. dCz is only related to the bending deformation around an axis parallel to the thickness direction (i.e., the Z-axis direction). Deformation caused by tension or compression along the long axis direction (i.e., the Y-axis direction) does not cause a difference in deformation between the two side surfaces of the flexible substrate 1110 along the short axis direction, so dCz is also a constant of 0.

[0147] In some embodiments, the output parameter Ctotal of the second strain sensor 1100 along the Y-axis varies linearly with the stretched or compressed length Lx, exhibiting extremely high linearity. Both dCz and dCx are zero, unaffected by the stretched or compressed length Lx. Therefore, the second strain sensor 1100 can identify tensile or compressive deformation along the long axis of the flexible substrate 1110 based on the capacitance-related parameter Ctotal.

[0148] FIG15 is a side view schematic diagram of the second sensor shown in FIG14A after being bent and deformed around an axis parallel to the short axis direction.

[0149] In some embodiments, when the first capacitor structure 1120, the second capacitor structure 1130, the third capacitor structure 1140 and the fourth capacitor structure 1150 are all capacitor structures, the second strain sensor 1100 can identify bending deformation along the flexible substrate 1110 around an axis parallel to the short axis direction based on the parameter dCx related to the capacitance.

[0150] As shown in Figures 14A and 15, when the second strain sensor 1100 is bent and deformed around an axis parallel to the short axis direction (i.e., the X-axis direction), for the convenience of explanation, the second strain sensor 1100 after bending and deformation is approximately considered to be an arc, the first capacitor structure 1120 and the second capacitor structure 1130 are bent and elongated to L1, and the third capacitor structure 1140 and the fourth capacitor structure 1150 are bent and compressed to L3. Considering that the thickness of each of the four capacitor structures changes very little, for the convenience of explanation, it is approximately considered that the thickness of each of the four capacitor structures remains unchanged. According to formula (1), the capacitance C1 of the first capacitor structure 1120 and the capacitance C2 of the second capacitor structure 1130 change to the following formula (6), and the capacitance C3 of the third capacitor structure 1140 and the capacitance C4 of the fourth capacitor structure 1150 change to the following formula (7).

[0151] At this time, Ctotal, dCx, and dCz are determined by the following formulas (8), (9), and (10), respectively. dCz=(C1+C3)-(C2+C4)=0 (10)

[0152] In which, R0 represents the radius of the arc of the flexible substrate 1110 when it is bent and deformed; R1 represents the radius of the arc of the first capacitor structure 1120 and the second capacitor structure 1130 when it is bent and deformed; R2 represents the radius of the arc of the third capacitor structure 1140 and the fourth capacitor structure 1150 when it is bent and deformed; t represents the thickness of the second strain sensor 1100 as shown in Figure 14A; L1 represents the length of the arc of the first capacitor structure 1120 and the second capacitor structure 1130 when it is bent and deformed; L3 represents the length of the arc of the third capacitor structure 1140 and the fourth capacitor structure 1150 when it is bent and deformed.

[0153] When the second strain sensor 1100 is bent and deformed along an axis parallel to the short axis, for example, the first capacitor structure 1120 and the second capacitor structure 1130 are bent and stretched, and the third capacitor structure 1140 and the fourth capacitor structure 1150 are bent and compressed. At this time, the sum of the capacitance C1 of the first capacitor structure 1120 and the capacitance C2 of the second capacitor structure 1130, i.e., C1+C2, and the sum of the capacitance C3 of the third capacitor structure 1140 and the capacitance C4 of the fourth capacitor structure 1150, i.e., C3+C4, have an opposite change relationship. At this time, Ctotal obtained by adding the capacitances of the four capacitor structures can offset the change trends of C1+C2 and C3+C4. That is, Ctotal is the constant shown in formula (8) at this time, and Ctotal cannot be used to reflect the bending deformation of the second strain sensor 1100 along the axis parallel to the short axis.

[0154] In some embodiments, the output parameter dCx of the second strain sensor 1100 after bending about an axis parallel to the minor axis (i.e., the X-axis) varies linearly and proportionally with the bending angle β, exhibiting extremely high linearity. Both dCz and Ctotal are constants and are unaffected by the bending angle β. Therefore, the second strain sensor 1100 can identify bending deformation about an axis parallel to the minor axis based on the capacitance-related parameter dCx.

[0155] It should be noted that, in addition to the case of the four capacitor structures described above, the second strain sensor 1100 may have three or more capacitor structures distributed on the two side surfaces of the flexible substrate 1110 along the thickness direction, and all extend along the long axis direction. As long as the deformations of different dimensions can be characterized by the capacitance-related parameters of these capacitor structures, deformations of multiple dimensions can be identified. As an example only, there are three capacitor structures on the second strain sensor 1100, two of which are distributed on the upper side of the flexible substrate and the other is distributed on the lower side of the flexible substrate. At this time, the capacitance-related parameters of the three capacitor structures are also related to the bending deformation around the X-axis (or Z-axis). At this time, the bending deformation of the second strain sensor 1100 around the X-axis (or Z-axis) can also be calculated by combining the capacitance-related parameters generated by the three sensor structures.

[0156] FIG16 is a schematic top view of the second sensor shown in FIG14A after being bent and deformed around an axis parallel to the thickness direction.

[0157] In some embodiments, when the first capacitor structure 1120 , the second capacitor structure 1130 , the third capacitor structure 1140 , and the fourth capacitor structure 1150 are all capacitor structures, the second strain sensor 1100 can identify bending deformation along the flexible substrate 1110 around an axis parallel to the thickness direction based on a parameter dCz related to capacitance.

[0158] As shown in Figures 14A and 16, when the second strain sensor 1100 is bent and deformed along an axis parallel to the thickness direction (i.e., the Z-axis direction), for the convenience of explanation, it is approximately considered that the second strain sensor 1100 after bending and deformation can be a circular arc, the first capacitor structure 1120 and the third capacitor structure 1140 (not shown in Figure 16) are bent and elongated to L4, and the second capacitor structure 1130 and the fourth capacitor structure 1150 (not shown in Figure 16) are bent and compressed to L2. Considering that the thickness of each of the four capacitor structures changes very little, for the convenience of explanation, it is approximately considered that the thickness of each of the four capacitor structures remains unchanged. According to formula (1), the capacitance C1 of the first capacitor structure 1120 and the capacitance C3 of the third capacitor structure 1140 are expressed by the following formula (11), and the capacitance C2 of the second capacitor structure 1130 and the capacitance C4 of the fourth capacitor structure 1150 change to the following formula (12).

[0159] At this time, Ctotal, dCx, and dCz are determined by the following formulas (13), (14), and (15), respectively. dCx=(C1+C2)-(C3+C4)=0 (14)

[0160] In which, r0 represents the radius of the arc of the bending deformation of the flexible substrate 1110; r1 represents the radius of the arc of the bending deformation of the first capacitor structure 1120 and the third capacitor structure 1140; r2 represents the radius of the arc of the bending deformation of the second capacitor structure 1130 and the fourth capacitor structure 1150; L2 represents the length of the arc of the bending deformation of the first capacitor structure 1120 and the third capacitor structure 1140; L4 represents the length of the arc of the bending deformation of the second capacitor structure 1130 and the fourth capacitor structure 1150.

[0161] In some embodiments, the output parameter dCz of the second strain sensor 1100 after bending about an axis parallel to the thickness direction (i.e., the Z-axis) varies linearly with the bending angle α, exhibiting extremely high linearity. Both dCx and Ctotal are constants and are unaffected by the bending angle α. Therefore, the second strain sensor 1100 can identify bending deformation about an axis parallel to the thickness direction based on the capacitance-related parameter dCz.

[0162] In some embodiments, when the first capacitor structure 1120, the second capacitor structure 1130, the third capacitor structure 1140, and the fourth capacitor structure 1150 are all resistor structures, the processor can determine the deformation of the flexible substrate 1110 in at least two dimensions based on the resistance parameters related to the four capacitor structures. For example, the resistances of the four capacitor structures are: Substituting the areas of each capacitive structure after deformation of the second strain sensor 1100 into the calculation and performing a differential operation, a result similar to a capacitance-related parameter can be obtained, enabling the processor to determine the bending deformation of the second strain sensor 1100 about an axis parallel to the thickness direction, the bending deformation about an axis parallel to the short axis direction, and the tensile or compressive deformation along the long axis of the flexible substrate. Here, ρ represents the resistivity of each of the four capacitive structures (i.e., the middle layer, as described below).

[0163] In some embodiments, the processor can identify composite deformation of the second strain sensor 1100, including bending deformation about an axis parallel to the thickness direction, bending deformation about an axis parallel to the short axis direction, and tensile or compressive deformation along the long axis of the flexible substrate 1110. For example, the processor can simultaneously calculate changes in capacitance-related parameters Ctotal, dCx, and dCz, thereby simultaneously recovering components of deformation in different dimensions and restoring the actual bending deformation of the second strain sensor 1100.

[0164] Therefore, the embodiments of this specification can measure the deformation of multiple degrees of freedom (for example, including bending around the X-axis, bending around the Z-axis, and stretching along the Y-axis) through a single sensor, thereby realizing the detection of posture data of multiple dimensions of the finger, which is conducive to simplifying the preparation process and miniaturization design while improving the detection accuracy.

[0165] FIG17 is a schematic cross-sectional view of a second strain sensor according to some embodiments of the present specification.

[0166] As shown in FIG17 , in some embodiments, each capacitor structure includes a second conductive layer, an intermediate layer, and a first conductive layer stacked sequentially away from the flexible substrate 1110 along the thickness direction. For example, the first capacitor structure 1120 includes a second conductive layer 1122, intermediate layers 112-53, and a first conductive layer 1121, stacked sequentially away from the flexible substrate 1110; the second capacitor structure 1130 includes a second conductive layer 1132, intermediate layers 112-53, and a first conductive layer 1131, stacked sequentially away from the flexible substrate 1110; the third capacitor structure 1140 includes a second conductive layer 1142, intermediate layers 114-55, and a first conductive layer 1141, stacked sequentially away from the flexible substrate 1110; and the fourth capacitor structure 1150 includes a second conductive layer 1152, intermediate layers 114-55, and a first conductive layer 1151, stacked sequentially away from the flexible substrate 1110. In some embodiments, the intermediate layer is interposed between the first and second conductive layers.

[0167] In some embodiments, the first conductive layer and the second conductive layer of each capacitor structure include an elastic conductive material, which can make the first conductive layer and the second conductive layer conductive and can return to their original shape when the external force disappears. In some embodiments, the elastic conductive material includes but is not limited to conductive film, conductive ink, conductive polymer material, conductive gel, liquid metal, etc. In some embodiments, the first conductive layer and the second conductive layer include a conductive film, which is made by mixing conductive particles with a polymer material. In some embodiments, the polymer material includes but is not limited to silicone, rubber or resin, etc. In some embodiments, the first conductive layer and the second conductive layer include conductive ink, which is made by mixing conductive particles with an ink material, and the conductive ink can be printed to obtain a conductive pattern. In some embodiments, the first conductive layer and the second conductive layer include a conductive polymer material, conductive gel, liquid metal, etc. In some embodiments, the conductive polymer material includes but is not limited to polypyrrole, poly (3, 4-ethylenedioxythiophene) - polystyrene sulfonate (PEDOT:PSS, Poly (3, 4-ethylenedioxythiophene) polystyrene sulfonate), etc.

[0168] In some embodiments, the elastic conductive material includes an elastic material filled with conductive particles. The conductivity of the first conductive layer and the second conductive layer can be adjusted by adjusting the density of the conductive particles filled in the elastic material. In some embodiments, the elastic material includes silicone, rubber, resin, polydimethylsiloxane (PDMS), polyurethane, styrene-butadiene-styrene (SBS), etc. In some embodiments, the conductive particles include metal powder and carbon powder, carbon nanotubes, silver nanowires, carbon black, graphite powder, graphene, etc.

[0169] In some embodiments, the intermediate layer comprises an elastic insulating material, in which case each capacitor structure is a capacitor structure. For example, the elastic insulating material includes silicone, rubber, polydimethylsiloxane (PDMS), thermoplastic polyurethane (TPU), etc. In some embodiments, the intermediate layer comprises a high-resistance elastic material, and the resistivity of the intermediate layer is more than 1000 times greater than the resistivity of the first conductive layer and the second conductive layer. In this case, each capacitor structure is a capacitor-resistor composite capacitor structure.

[0170] In some embodiments, the thickness of the first conductive layer and the second conductive layer of each capacitor structure is in the range of 1 to 100 μm. In some embodiments, the width of the first conductive layer and the second conductive layer of each capacitor structure is in the range of 0.5 to 10 mm. In some embodiments, the spacing between the first conductive layer 1121 of the first capacitor structure 1120 and the first conductive layer 1131 of the second capacitor structure 1130 is in the range of 0.02 to 2 mm. In some embodiments, the spacing between the second conductive layer 1122 of the first capacitor structure 1120 and the second conductive layer 1132 of the second capacitor structure 1130 is in the range of 0.02 to 2 mm. In some embodiments, the spacing between the first conductive layer 1141 of the third capacitor structure 1140 and the first conductive layer 1151 of the fourth capacitor structure 1150 is in the range of 0.02 to 2 mm. In some embodiments, the spacing between the second conductive layer 1142 of the third capacitor structure 1140 and the second conductive layer 1152 of the fourth capacitor structure 1150 is in the range of 0.02 to 2 mm.

[0171] In some embodiments, the conductivity of the first conductive layer is greater than the conductivity of the intermediate layer.

[0172] Conductivity is a parameter used to describe the ease with which charge flows in a substance. Since the conductivity of the first conductive layer is greater than that of the second conductive layer, the first conductive layer has better conductivity. Therefore, the resistance of the first conductive layer is less than that of the second conductive layer. It should be noted that in this specification, the resistance of a component refers to the resistance between two surfaces of the component spaced apart along the thickness direction of the flexible substrate 1110. The resistance of the first conductive layer refers to the resistance between two surfaces of the first conductive layer spaced apart along the thickness direction of the flexible substrate 1110, and the resistance of the second conductive layer may refer to the resistance between two surfaces of the second conductive layer spaced apart along the thickness direction of the flexible substrate 1110. In some embodiments, the conductivity of the first conductive layer may be more than 100 times the conductivity of the second conductive layer. In some embodiments, the conductivity of the first conductive layer may be greater than that of the second conductive layer by setting the density of the conductive particles filled in the elastic material of the first conductive layer to be greater than the density of the conductive particles filled in the elastic material of the second conductive layer.

[0173] When the capacitor structure (e.g., the first capacitor structure 1120, the second capacitor structure 1130, the third capacitor structure 1140, and the fourth capacitor structure 1150) is a capacitor-resistor composite capacitor structure or a single capacitor structure, the resistance between the two surfaces of the intermediate layer along the thickness direction of the flexible substrate 1110 should not be too small to facilitate subsequent resistance measurement and analysis of resistance changes. In some embodiments, the resistance between the two surfaces of the intermediate layer along the thickness direction of the flexible substrate 1110 is greater than 0.8 MΩ. For example, when the capacitor structure (e.g., the first capacitor structure 1120, the second capacitor structure 1130, the third capacitor structure 1140, and the fourth capacitor structure 1150) is a capacitor-resistor composite capacitor structure, the resistance between the two surfaces of the intermediate layer along the thickness direction of the flexible substrate 1110 can also be 0.8 MΩ to 1150 GΩ. For another example, when the capacitor structure (e.g., the first capacitor structure 1120, the second capacitor structure 1130, the third capacitor structure 1140, and the fourth capacitor structure 1150) is a single capacitor structure, the resistance between the two surfaces of the intermediate layer spaced apart along the thickness direction of the flexible substrate 1110 can be greater, for example, the resistance can be greater than 1150 GΩ.

[0174] By setting the resistance between the two surfaces of the intermediate layer along the thickness direction of the flexible substrate 1110 to be greater than 0.8 MΩ, the intermediate layer can be made conductive while having a sufficiently large resistance, thereby ensuring the measurement of the resistance of the intermediate layer and the analysis of the change in resistance, which can accurately reflect the bending condition of the second strain sensor 1100.

[0175] In some embodiments, the relative dielectric constant of the intermediate layer is greater than 2. The relative dielectric constant is a physical parameter that characterizes the dielectric or polarization properties of a dielectric material. Its value is equal to the ratio of the capacitance of a capacitor of the same size made with the corresponding material as the dielectric medium to the capacitance of a capacitor made with a vacuum as the dielectric medium. The relative dielectric constant also characterizes the material's ability to store electricity, also known as relative permittivity. Materials with a relative dielectric constant greater than 2 are polar materials. In other words, an intermediate layer with a relative dielectric constant greater than 2 has a certain degree of electricity storage capacity. Therefore, the intermediate layer can be equivalent to a parallel combination of a resistor and a capacitor.

[0176] In some embodiments, the relative dielectric constant of the intermediate layer may be greater than or equal to 4. Preferably, the relative dielectric constant of the intermediate layer is greater than 5. In some embodiments, the relative dielectric constant of the intermediate layer is greater than 10.

[0177] Setting the relative dielectric constant of the intermediate layer to be greater than 2 allows the intermediate layer to function as both a resistor and a capacitor. During bending of the second strain sensor 1100, both the capacitance and resistance of the intermediate layer change with the deformation of the flexible substrate 1110. Therefore, parameters related to the capacitance and resistance of the intermediate layer can reflect the bending of the second strain sensor 1100. In this embodiment, the simultaneous presence of capacitance and resistance to reflect the bending of the second strain sensor 1100 significantly improves the sensitivity and accuracy of the second strain sensor 1100.

[0178] In addition, by setting the resistance between the two surfaces of the intermediate layer along the thickness direction of the flexible substrate 1110 to be greater than 0.8 MΩ, it can also be ensured that the intermediate layer can exhibit both better resistance performance and better capacitance performance, thereby ensuring the sensitivity and accuracy of the second strain sensor 1100.

[0179] In some embodiments, the two capacitor structures on the same side surface of the flexible substrate 1110 can share a first conductive layer, and the second conductive layers of the two capacitor structures are spaced apart along the short axis direction of the flexible substrate 1110. In some embodiments, more conductive layers (such as a third conductive layer, etc.) can be provided in a stacked manner along the thickness direction of each inductive structure, which can effectively improve the sensitivity of the sensor 1100 in detecting deformations in various degrees of freedom. For example, each capacitor structure includes a second conductive layer, a second intermediate layer, a third conductive layer, a first intermediate layer, and a first conductive layer stacked in sequence away from the flexible substrate 1110 along the thickness direction. The parameters of the third conductive layer, the first conductive layer, and the second conductive layer are consistent; the parameters of the second intermediate layer, the first intermediate layer, and the intermediate layer described above are consistent.

[0180] In some embodiments of the present specification, by applying a stopping structure (for example, a ratchet, etc.) in conjunction with a stopping component on a finger force feedback piece to perform force feedback, the structure of the finger force feedback piece can be simplified and the size of the finger force feedback piece can be reduced, thereby achieving miniaturization of the force feedback glove while reducing power consumption.

[0181] While the basic concepts have been described above, it will be apparent to those skilled in the art that the detailed disclosure is merely illustrative and does not limit this specification. Although not explicitly stated herein, various modifications, improvements, and revisions to this specification may be made by those skilled in the art. Such modifications, improvements, and revisions are suggested in this specification and remain within the spirit and scope of the exemplary embodiments of this specification.

[0182] This specification also uses specific terms to describe the embodiments of this specification. For example, "one embodiment," "an embodiment," and / or "some embodiments" refer to a feature, structure, or characteristic associated with at least one embodiment of this specification. Therefore, it should be emphasized and noted that references to "one embodiment," "an embodiment," or "an alternative embodiment" two or more times in different locations in this specification do not necessarily refer to the same embodiment. Furthermore, certain features, structures, or characteristics of one or more embodiments of this specification may be appropriately combined.

[0183] In addition, unless expressly stated in the claims, the order of the processing elements and sequences, the use of alphanumeric characters, or the use of other names described in this specification are not intended to limit the order of the processes and methods of this specification. Although the above disclosure discusses some of the invention embodiments currently considered useful through various examples, it should be understood that such details are for illustrative purposes only, and the appended claims are not limited to the disclosed embodiments. On the contrary, the claims are intended to cover all modifications and equivalent combinations that are consistent with the spirit and scope of the embodiments of this specification. For example, although the system components described above can be implemented by hardware devices, they can also be implemented only by software solutions, such as installing the described system on an existing server or mobile device.

[0184] Similarly, it should be noted that, in order to simplify the presentation of this specification and thus facilitate understanding of one or more embodiments of the invention, the foregoing descriptions of the embodiments of this specification sometimes combine multiple features into a single embodiment, figure, or description thereof. However, this disclosure method does not imply that the subject matter of this specification requires more features than those recited in the claims. In fact, an embodiment may have fewer features than all of the features of a single disclosed embodiment.

[0185] In some embodiments, numbers are used to describe the quantity of components and attributes. It should be understood that such numbers used in the description of the embodiments are modified by the modifiers "about", "approximately" or "substantially" in some examples. Unless otherwise stated, "about", "approximately" or "substantially" indicate that the numbers are allowed to vary by ±20%. Accordingly, in some embodiments, the numerical parameters used in the description and claims are approximate values, which may change according to the required characteristics of individual embodiments. In some embodiments, the numerical parameters should take into account the specified significant digits and adopt the general method of retaining digits. Although the numerical domains and parameters used to confirm the breadth of their range in some embodiments of this specification are approximate values, in specific embodiments, the settings of such numerical values ​​are as accurate as possible within the feasible range.

[0186] Each patent, patent application, patent application publication, and other materials, such as articles, books, specifications, publications, and documents, cited in this specification is hereby incorporated by reference in its entirety. This includes application history documents that are inconsistent with or conflict with the content of this specification, as well as documents (currently or subsequently attached to this specification) that limit the broadest scope of the claims of this specification. It should be noted that if the descriptions, definitions, and / or terminology used in the accompanying materials are inconsistent or conflicting with the content of this specification, the descriptions, definitions, and / or terminology used in this specification will control.

[0187] Finally, it should be understood that the embodiments described in this specification are intended only to illustrate the principles of the embodiments of this specification. Other variations may also fall within the scope of this specification. Therefore, by way of example and not limitation, alternative configurations of the embodiments of this specification may be considered consistent with the teachings of this specification. Accordingly, the embodiments of this specification are not limited to the embodiments explicitly described and illustrated in this specification.

Claims

1. A force feedback system, comprising: Glove body; a microprocessor coupled to the glove body, the microprocessor being communicatively coupled to an external computing device; as well as A plurality of finger force feedback members, each of which is mechanically coupled to the glove body and communicatively coupled to the microprocessor, and is configured to provide force feedback to the corresponding finger according to the instruction of the microprocessor, wherein: Each of the finger force feedback components includes a pull rope that tracks the movement of the finger, a transmission component that moves following the pull rope, and a stop component. A plurality of stop structures are sequentially arranged on the transmission component, and the stop component is configured to cooperate with any one of the plurality of stop structures to achieve braking of the finger.

2. The force feedback system according to claim 1, wherein each finger force feedback member comprises a shell located on the back of the palm, the transmission member and the stop member are located in the shell, wherein: The force feedback system further comprises a fingertip cover, and the pull rope mechanically connects the fingertip cover and the transmission component.

3. The force feedback system according to claim 2, wherein each finger force feedback member further comprises a wire groove arranged between the finger joints of the glove body, and the drawstring passes through the wire groove to connect the fingertip cover and the transmission component.

4. The force feedback system according to claim 2, wherein the transmission component comprises a spool, the pull rope is wound around the spool, a stop structure is arranged on the surface of the spool, and the stop component comprises a stop plate that can be inserted into a groove between the stop structures. 5 . The force feedback system according to claim 4 , wherein the gradient of one side of the stop structure abutting against the stop plate is greater than the gradient of the other side. The force feedback system according to claim 4 , wherein the tooth spacing of the stop structure is less than 2 mm. 7 . The force feedback system according to claim 6 , wherein the tooth spacing of the stop structure is less than 1 mm. 8 . The force feedback system according to claim 4 , wherein a limiting protrusion is arranged on an inner side surface of the housing opposite to the stop structure. 9 . The force feedback system according to claim 8 , wherein the height of the limiting protrusion is greater than the height of the stopping structure.

10. The force feedback system according to claim 4, wherein the stop member comprises a transmission rod, and the transmission rod is configured to press or release the stop plate according to instructions, wherein: When the transmission rod applies pressure to the stopper, the stopper is inserted into the groove between the stopper structures. 11 . The force feedback system according to claim 4 , wherein the stop member comprises a piezoelectric structure, and the piezoelectric structure is configured to drive the stop plate to be inserted into the groove between the stop structures.

12. The force feedback system according to claim 10 or 11, wherein the stop plate corresponds to multiple depths when inserted into the groove between the stop structures.

13. The force feedback system according to claim 1, wherein each finger force feedback member further comprises a sensing component configured to detect a moving distance of the pull cable and transmit data related to the moving distance of the pull cable to a microprocessor.

14. The force feedback system according to claim 13, wherein the transmission component comprises a spool, the pull rope is wound around the spool, and the sensing component comprises a magnet mechanically connected to the spool and a magnetic field sensor for measuring rotation information of the magnet as the spool rotates. 15 . The force feedback system according to claim 14 , wherein the magnet and the magnetic field sensor are coaxially arranged along a central axis of the rotation of the bobbin.

16. The force feedback system according to claim 14, wherein the magnet is mechanically connected to a side surface of the bobbin, and a limiting protrusion is arranged on the side surface. 17 . The force feedback system according to claim 16 , wherein the height of the limiting protrusion is greater than the height of the magnet.

18. The force feedback system according to claim 1, wherein each finger force feedback member further comprises a strain sensor, wherein the strain sensor is arranged at a finger joint of the glove body and is configured to read posture data of the finger.

19. The force feedback system according to claim 1, wherein the transmission component comprises a spool and a scroll spring mechanically connected to the spool, the pull rope is wound around the spool, and the scroll spring is configured to drive the spool to rotate in the opposite direction to reset the pull rope after the finger releases the external tension. 20 . The force feedback system according to claim 19 , wherein the spring constant of the spiral spring is less than 100 N / m.

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