Display device and electronic device

Abstract

The invention relates to a display device and an electronic device. The display device includes: a display panel including a display layer and a touch screen layer; a flexible printed circuit board electrically connected to one side of the display panel; a driving driver on the display panel; a processor on the flexible printed circuit board; and a plurality of mobile industrial processor interface (MIPI) data channels on the flexible printed circuit board and electrically connecting the processor and the drive driver to each other, in which each of the plurality of MIPI data channels includes a first access line and a second access line, and in at least one of the plurality of MIPI data channels, the processor and the drive driver are electrically connected to each other based on transmission of a low power state (LPS) signal. The phase of the signal at the first access line and the phase of the signal at the second access line are configured to be different from each other.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2024-0025305 filed on February 21, 2024, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] Aspects of one or more embodiments relate to a display device and an electronic device including the display device. Background Art

[0004] Typically, a display device includes a touch screen layer, and when a user's finger or a stylus touches the display device or approaches the display device, the presence and location of such touch or proximity may be detected.

[0005] In order for the touch screen layer to accurately detect the presence and location of a touch or proximity, it may be desirable to reduce the generation of noise in the touch screen layer.

[0006] The above information disclosed in this Background section is only for enhancement of understanding of the background technology and therefore the information discussed in this Background section does not necessarily constitute prior art. Summary of the Invention

[0007] Aspects of one or more embodiments relate to a display device and an electronic device including the display device, and for example, to a display device and an electronic device that can relatively reduce the occurrence of errors in a touch screen layer.

[0008] In some display devices, noise may exist in a touch screen layer or in a signal line electrically connected to the touch screen layer, and thus, errors may occur in the touch screen layer.

[0009] Aspects of one or more embodiments may include a display device in which occurrence of errors in a touch screen layer is relatively reduced.

[0010] Additional aspects will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the presented embodiments of the disclosure.

[0011] According to some embodiments, a display device includes: a display panel, including a display layer and a touch screen layer; a flexible printed circuit board, electrically connected to one side of the display panel; a driving driver, located on the display panel; a processor, located on the flexible printed circuit board; and a plurality of mobile industry processor interface (MIPI) data channels, located on the flexible printed circuit board and electrically connecting the processor and the driving driver to each other, wherein each of the plurality of MIPI data channels includes a first access line and a second access line, and in at least one of the plurality of MIPI data channels, based on transmission of a low power state (LPS) signal, a phase of a signal at the first access line and a phase of a signal at the second access line are configured to be different from each other.

[0012] According to some embodiments, based on at least one of the plurality of MIPI data lanes transmitting an LPS signal, a phase of the signal at the second access line may be opposite to a phase of the signal at the first access line.

[0013] According to some embodiments, based on at least one of the plurality of MIPI data lanes transmitting an LPS signal, the signal at the second access line may be an inverted signal of the signal at the first access line.

[0014] According to some embodiments, the display device may further include: a touch driver located on a flexible printed circuit board; and a plurality of touch signal lines located on the flexible printed circuit board, such that the plurality of touch signal lines and the plurality of MIPI data channels are located on different layers, the plurality of touch signal lines intersect with the plurality of MIPI data channels, and the plurality of touch signal lines electrically connect the touch driver and the touch screen layer to each other.

[0015] According to some embodiments, the display device may further include a touch communication line that is on the flexible printed circuit board and electrically connects the processor and the touch driver to each other.

[0016] According to some embodiments, in each of the plurality of MIPI data lanes, based on transmission of the LPS signal, a phase of a signal at a first access line and a phase of a signal at a second access line may be configured to be different from each other.

[0017] According to some embodiments, in each of the plurality of MIPI data lanes, based on transmission of the LPS signal, a phase of a signal at a first access line may be configured to be opposite to a phase of a signal at a second access line.

[0018] According to some embodiments, in each of the plurality of MIPI data lanes, based on transmission of the LPS signal, the signal at the first access line may be configured as an inverted signal of the signal at the second access line.

[0019] According to one or more embodiments, a display device includes: a display panel, including a display layer and a touch screen layer; a flexible printed circuit board, electrically connected to one side of the display panel; a driving driver, located on the display panel; a processor, located on the flexible printed circuit board; and a plurality of mobile industry processor interface (MIPI) data channels, located on the flexible printed circuit board and electrically connecting the processor and the driving driver to each other, wherein, in two adjacent channels among the plurality of MIPI data channels, based on the transmission of a low power state (LPS) signal, a signal phase at one channel and a signal phase at another channel are different from each other.

[0020] According to some embodiments, based on the transmission of the LPS signal, the phase of the signal at one channel may be opposite to the phase of the signal at another channel.

[0021] According to some embodiments, based on the transmission of the LPS signal, a signal at one channel may be an inverted signal of a signal at another channel.

[0022] According to some embodiments, the display device may further include: a touch driver located on a flexible printed circuit board; and a plurality of touch signal lines located on the flexible printed circuit board, such that the plurality of touch signal lines and the plurality of MIPI data channels are located on different layers, the plurality of touch signal lines intersect with the plurality of MIPI data channels, and the plurality of touch signal lines electrically connect the touch driver and the touch screen layer to each other.

[0023] According to some embodiments, the display device may further include a touch communication line that is on the flexible printed circuit board and electrically connects the processor and the touch driver to each other.

[0024] According to some embodiments, the number of the plurality of MIPI data lanes may be an even number, and based on transmission of the LPS signal, the phase of the signal at the odd-numbered MIPI data lanes may be configured to be different from the phase of the signal at the even-numbered MIPI data lanes.

[0025] According to some embodiments, the number of the plurality of MIPI data lanes may be an even number, and based on transmission of the LPS signal, the phase of the signal at the odd-numbered MIPI data lanes may be configured to be opposite to the phase of the signal at the even-numbered MIPI data lanes.

[0026] According to some embodiments, the number of the plurality of MIPI data lanes may be an even number, and based on transmission of the LPS signal, the signal at the odd-numbered MIPI data lane may be configured as an inverted signal of the signal at the even-numbered MIPI data lane.

[0027] According to some embodiments, each of the multiple MIPI data channels may include a first access line and a second access line, and in each of the multiple MIPI data channels, the phase of the signal at the first access line and the phase of the signal at the second access line may be configured to be the same.

[0028] According to one or more embodiments, a display device includes: a display panel, including a display layer and a touch screen layer; a flexible printed circuit board, electrically connected to one side of the display panel; a driving driver, located on the display panel; a processor, located on the flexible printed circuit board; and a plurality of mobile industry processor interface (MIPI) data channels, located on the flexible printed circuit board and electrically connecting the processor and the driving driver to each other, wherein each of the plurality of MIPI data channels includes a first access line and a second access line, and the number of the plurality of MIPI data channels is an odd number of three or greater, and when transmitting a low power state (LPS) signal, in a pair of two adjacent channels in the plurality of MIPI data channels, the phase of the signal at one channel in the pair and the phase of the signal at the other channel in the pair are different from each other, and in the remaining unpaired channels of the plurality of MIPI data channels, when transmitting the LPS signal, the phase of the signal at the first access line and the phase of the signal at the second access line are different from each other.

[0029] According to some embodiments, the signal at one channel of the pair may be an inverted signal of the signal at the other channel of the pair.

[0030] According to some embodiments, the signal at the first access line of the remaining unpaired channel may be an inverted signal of the signal at the second access line of the remaining unpaired channel.

[0031] According to one or more embodiments, an electronic device includes one of the above-mentioned display devices.

[0032] According to some embodiments, the electronic device is at least one of a smart phone, a mobile phone, a navigation device, a television (TV), a vehicle's instrument panel, a vehicle's central information display (CID) device, a vehicle's interior rearview mirror display, a vehicle's rear seat entertainment device, an electronic notebook, an electronic book, an ultra-mobile personal computer (PC), a laptop computer, a tablet computer, a portable media player (PMP), a smart watch, a watch phone, a glasses-type display, and a head-mounted display (HDM).

[0033] In addition to the aspects, features, and characteristics described above, further aspects, features, and characteristics will become apparent from the detailed description, claims, and accompanying drawings that serve to implement the following disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The above and other aspects, features and characteristics of certain embodiments of the present disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0035] Figure 1 is a plan view schematically illustrating a portion of a display device according to some embodiments;

[0036] Figure 2 It is schematically shown Figure 1 a cross-sectional view of a portion of;

[0037] Figure 3 It is schematically shown Figure 1 A magnified conceptual diagram of part of the ISA;

[0038] Figure 4 is a description Figure 1 A conceptual diagram of a method for communication between a driver and a processor is shown in FIG;

[0039] Figure 5 is a conceptual diagram illustrating the functionality of a universal data channel of a Mobile Industry Processor Interface (MIPI);

[0040] Figure 6 The diagram shows the application during one frame to the Figure 1 Waveform diagrams of a touch drive signal of a touch screen layer in a display device, a clock signal applied to a MIPI clock channel, and a signal applied to a MIPI data channel;

[0041] Figure 7 illustrates a waveform diagram showing that noise is generated in a touch driving signal applied to a touch screen layer of a display device according to a comparative example;

[0042] Figure 8 The diagram shows the Figure 1 A waveform diagram showing that no noise is generated in a touch drive signal of a touch screen layer of a display device;

[0043] Figure 9 and Figure 10 illustrates waveform diagrams of a touch drive signal applied to a touch screen layer included in a display device, a clock signal applied to a MIPI clock channel, and a signal applied to a MIPI data channel according to some embodiments; and

[0044] Figure 11 is a conceptual diagram describing a communication method between a driving driver and a processor included in a display device according to some embodiments. DETAILED DESCRIPTION

[0045] The present disclosure may have various modifications and various embodiments, and specific embodiments are illustrated in the drawings and described in more detail in the detailed description. With reference to the embodiments described in more detail with reference to the drawings, the effects and features of the present disclosure and the methods for implementing the present disclosure will become apparent. However, the embodiments according to the present disclosure are not limited to the embodiments described below and can be implemented in various forms.

[0046] Hereinafter, aspects of some embodiments will be described in more detail with reference to the accompanying drawings, and in the following description with reference to the accompanying drawings, like reference numerals refer to like components and redundant descriptions thereof will be omitted.

[0047] It will be understood that when a layer, region, or component is referred to as being "formed on" another layer, region, or component, the layer, region, or component may be directly or indirectly formed on the other layer, region, or component. That is, for example, there may be intervening layers, regions, or components. The sizes of the elements in the drawings may be exaggerated for ease of explanation. In other words, because the sizes and thicknesses of the components in the drawings are arbitrarily illustrated for ease of explanation, the present disclosure is not necessarily limited thereto.

[0048] According to an embodiment, the X-axis direction, the Y-axis direction, and the Z-axis direction are not limited to the directions of the three axes on the orthogonal coordinate system, but can be broadly interpreted as directions including these three axes. For example, the X-axis direction, the Y-axis direction, and the Z-axis direction can represent directions perpendicular to each other, or can represent different directions that are not perpendicular to each other.

[0049] In the following embodiments, the terms “first” and “second” are not used in a limiting sense but are used to distinguish one component from another.

[0050] It will also be understood that the terms “include”, “including”, “comprises”, “comprising” as used herein specify the presence of stated features or elements, but do not preclude the presence or addition of one or more other features or elements.

[0051] In the specification, "A and / or B" means only A, only B, or both A and B. In addition, "at least one of A and B" means only A, only B, or both A and B.

[0052] When a layer, region, component, etc. is connected to another layer, region, component, etc., the layer, region, component, etc. may not only be directly connected to the other layer, region, component, etc., but may also be indirectly connected to the other layer, region, component, etc. through an intervening layer, region, component, etc. For example, in the specification, when a layer, region, component, etc. is electrically connected to another layer, region, component, etc., the layer, region, component, etc. may not only be directly electrically connected to the other layer, region, component, etc., but may also be indirectly electrically connected to the other layer, region, component, etc. through an intervening layer, region, component, etc.

[0053] Figure 1 is a plan view schematically illustrating a portion of a display device 1 according to some embodiments.

[0054] The display device 1 may include a display panel and a flexible printed circuit board FPCB. The display panel includes a display layer and a touch screen layer. The display panel may include a display area DA and a peripheral area PA (e.g., at the periphery or outside the coverage area of ​​the display area DA). It is understood that the substrate 100 included in the display panel includes the display area DA and the peripheral area PA. The display layer includes an organic light emitting diode (OLED) (see FIG. Figure 2 ), and such a display device may be located in the display area DA of the display panel. The display panel may include a drive driver (display driver) DIC located in the peripheral area PA, and the drive driver DIC may drive pixel circuits, etc., electrically connected to the display device in the display area DA. In addition, the display device 1 may include a touch driver TIC located on the flexible printed circuit board FPCB and driving the touch screen layer, and a processor AP located on the flexible printed circuit board FPCB and controlling the drive driver DIC and the touch driver TIC.

[0055] For reference, the display device 1 according to some embodiments can be not only a portable electronic device (such as a mobile phone, a smart phone, a tablet personal computer (PC), an electronic notebook, an electronic book, a portable media player (PMP), a navigation device or an ultra-mobile personal computer (UMPC)), but also any electronic device (such as a television, a laptop computer, a monitor, a bulletin board or an Internet of Things (IoT) device). Optionally, the display device 1 according to some embodiments can be an electronic device, such as a wearable device, such as a smart watch, a watch phone, a glasses-type display or a head-mounted display (HMD). Optionally, the display device 1 according to some embodiments can be an electronic device, such as a dashboard of a vehicle, a central information display (CID) device arranged on the central dashboard or instrument panel of the vehicle, an in-car rearview mirror display instead of a side mirror of the vehicle, or a rear-seat entertainment device of the vehicle. In one or more embodiments, the electronic device may include the display device 1.

[0056] The driver DIC may be an integrated circuit chip and may be directly mounted on the substrate 100 of the display panel in a chip on glass (COG) or chip on plastic (COP) manner. Figure 1 The driver DIC is a driver of the display panel, but the embodiments of the present disclosure are not limited thereto. For example, the driver DIC can be mounted on a flexible printed circuit board FPCB. Based on the image data and / or control signals received from the processor AP through the mobile industry processor interface (MIPI) channel MIPIL, the driver DIC can enable the display area DA to display an image by transmitting data signals, etc. to the pixels of the display panel. According to some embodiments, the driver DIC can transmit control signals to the gate driver arranged in the peripheral area PA of the display panel, so that the scan signal, etc. is applied to the display area DA.

[0057] The flexible printed circuit board (FPCB) can be electrically connected to the pads located at the edge of the display panel (in the Y-axis direction). As described above, the touch driver TIC and the processor AP can be mounted on the flexible printed circuit board (FPCB). According to some embodiments, the driver DIC can also be mounted on the flexible printed circuit board (FPCB).

[0058] The touch driver TIC may be an integrated circuit chip that drives a touch screen layer included in the display panel and can detect the presence and position of a touch or proximity when a user's finger or a stylus touches or approaches the display device 1 .

[0059] The processor AP may be a graphics processing unit (GPU). Alternatively, the processor AP may be an application processor including a GPU. In the display device 1 according to some embodiments, the processor AP may represent an application processor including a GPU. The processor AP may transmit input image data and control signals to the drive driver DIC via a MIPI channel MIPIL extending from the processor AP on the flexible printed circuit board FPCB to the drive driver DIC of the display panel. In addition, the processor AP may transmit control signals for controlling the touch driver TIC to the touch driver TIC via a touch communication line TCL extending from the processor AP on the flexible printed circuit board FPCB. The MIPI channel MIPIL may include a MIPI clock channel and a MIPI data channel to be described below.

[0060] The touch screen layer may include areas corresponding to the display area DA and the peripheral area PA of the display panel.

[0061] The touch screen layer may be a capacitive touch screen layer configured to sense capacitance changes based on contact with a conductive object such as a finger or a stylus. The touch screen layer may be an additional touch screen panel attached to the display panel. Alternatively, the touch screen layer may be an embedded touch screen layer formed in the display panel. For example, the touch screen layer may be an on-cell embedded touch screen layer or an in-cell embedded touch screen layer. However, embodiments of the present disclosure are not limited thereto.

[0062] The touch screen layer may include a touch sensing area TSA corresponding to the display area DA of the display panel. In some embodiments, the touch screen layer may be arranged only in a limited area required for touch recognition. In this case, the touch screen layer may overlap only a portion of the display area DA. A plurality of drive electrodes TEa and a plurality of sensing electrodes REa may be arranged in the touch sensing area TSA.

[0063] A plurality of drive electrodes TEa may be spaced apart from one another along a first direction (X-axis direction) and a second direction (Y-axis direction). Here, adjacent drive electrodes TEa in the first direction may be connected to one another via a first connection electrode CTE1, and as a result, drive lines extending in the first direction (X-axis direction) may be arranged approximately parallel to one another along a second direction (Y-axis direction). The drive lines may be electrically connected to the touch driver TIC via corresponding drive signal lines TL.

[0064] The plurality of sensing electrodes REa may also be spaced apart from each other in the first direction (X-axis direction) and the second direction (Y-axis direction). Here, adjacent sensing electrodes REa in the second direction (Y-axis direction) may be connected to each other via the second connection electrode CTE2, and as a result, sensing lines extending in the second direction (Y-axis direction) may be arranged approximately parallel to each other along the first direction (X-axis direction). The sensing lines may be electrically connected to the touch driver TIC via corresponding sensing signal lines RL.

[0065] According to some embodiments, the first connection electrode CTE1 and the second connection electrode CTE2 may be electrically insulated from each other. Thus, the driving line and the sensing line may cross each other in a plan view (ie, on an XY plane).

[0066] The touch driver TIC can apply drive signals to the drive electrodes TEa via drive signal lines TL to drive the touch screen layer. Furthermore, the touch driver TIC can receive sense signals from the sense electrodes REa via sense signal lines RL. The drive signal lines TL and sense signal lines RL extend from the flexible printed circuit board (FPCB) where the touch driver TIC resides to the drive electrodes TEa and sense electrodes REa of the display panel. When a conductive object touches the touch screen layer, the capacitance between the drive electrodes TEa and the sense electrodes REa may change. The touch driver TIC can sense this capacitance change via the sense signal lines RL to identify a touch and detect touch information, such as the touch location.

[0067] In this regard, a touch driver TIC may include a signal driver, a signal sensor, a memory, and a touch controller. The signal driver may receive a control signal from the touch controller based on the driving frequency of the touch screen layer, and in response to the control signal, apply a driving signal to a plurality of drive electrodes TEa via drive signal lines TL based on the driving frequency of the touch screen layer. The signal sensor may receive sensing signals from a plurality of sensing electrodes REa and convert the sensing signals into digital signals. The signal sensor may include an analog front end configured to receive analog signals and an analog-to-digital converter configured to convert the received analog signals into digital signals. The memory may store software and / or algorithms for operating the touch driver TIC. The memory may include random access memory (RAM) and / or flash memory. The touch controller may control the operation of the touch driver TIC. The touch controller may transmit a control signal to the signal driver based on the driving frequency of the touch screen layer. The touch controller may determine a touch input and a touch position based on the sensing signals received from the sensing electrodes REa located on the touch screen layer. The touch controller may include a microcontroller unit (MCU) and / or a central processing unit (CPU).

[0068] According to some embodiments, the touch driver TIC may be a single chip including the above-described touch controller, or the touch driver TIC may be a chip including a signal driver, a signal sensor, and a memory, and the touch controller may be a separate chip from the touch driver TIC.

[0069] Figure 2 It is schematically shown Figure 1 Cross-sectional view of a portion of. Figure 2 is included in Figure 1 is a cross-sectional view of a portion of a display panel of the display device 1, and schematically shows Figure 1 A cross-sectional view of a portion of the display area DA. Figure 2As shown in FIG, a lower component layer 200, an organic light emitting diode OLED as a display device, an encapsulation layer 300, and a touch screen layer 400 may be positioned on a substrate 100. The lower component layer 200 may include a pixel circuit PC electrically connected to the organic light emitting diode OLED.

[0070] The substrate 100 may include glass, metal, or a polymer resin. When the substrate 100 is flexible or bendable, the substrate 100 may include a polymer resin such as polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate, or cellulose acetate propionate.

[0071] The buffer layer 202 may be located on the substrate 100. The buffer layer 202 may flatten the top surface of the substrate 100. A barrier layer 201 for blocking impurities such as oxygen or moisture from passing through the substrate 100 from the outside may be provided between the substrate 100 and the buffer layer 202. The barrier layer 201 and the buffer layer 202 may include an inorganic insulating material (such as silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, aluminum nitride, titanium oxide, titanium nitride, tantalum oxide, hafnium oxide, or zirconium oxide) or an organic insulating material (such as polyimide, polyester, or acrylic). According to some embodiments, the barrier layer 201 and the buffer layer 202 may be integral with each other.

[0072] A pixel circuit PC including a thin film transistor TFT and a storage capacitor Cst may be located on the buffer layer 202. Figure 2 In the figure, only one thin film transistor TFT is illustrated, but this is just for convenience, and the pixel circuit PC may include a plurality of thin film transistors TFT.

[0073] The thin film transistor TFT may include a semiconductor layer Act, a gate electrode GE, a drain electrode DE, and a source electrode SE. The semiconductor layer Act may be located on the buffer layer 202 and may include a semiconductor material, for example, amorphous silicon or polycrystalline silicon. However, the embodiments according to the present disclosure are not limited thereto, and the semiconductor layer Act may include various materials. For example, the semiconductor layer Act may include an organic semiconductor material or an oxide semiconductor material. Examples of oxide semiconductor materials include oxides of materials selected from Group 12 metal elements, Group 13 metal elements, or Group 14 metal elements, such as zinc (Zn), indium (In), gallium (Ga), tin (Sn), cadmium (Cd), and germanium (Ge), or combinations thereof.

[0074] The first gate insulating layer 203 may cover the semiconductor layer Act. The first gate insulating layer 203 may include an inorganic insulating material such as silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, aluminum nitride, titanium oxide, titanium nitride, tantalum oxide, hafnium oxide, or zirconium oxide. The first gate insulating layer 203 may have a single-layer structure or a multi-layer structure. The first gate insulating layer 203 insulates the semiconductor layer Act from the gate electrode GE.

[0075] The gate electrode GE may be located on the first gate insulating layer 203. If necessary, the gate electrode GE may be electrically connected to a gate line that applies an on / off signal to the thin film transistor TFT. For example, when viewed in a direction opposite to the Z-axis direction (i.e., in a plan view), the gate electrode GE may be a portion of the gate line, i.e., a portion of the gate line that overlaps with the semiconductor layer Act.

[0076] The gate electrode GE may include a metal material. Considering the adhesion to adjacent layers, the surface flatness of the stacked layers, and the processing performance, the gate electrode GE may include, for example, aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), or copper (Cu). According to some embodiments, the gate electrode GE may have a single-layer structure or a multi-layer structure. For example, the gate electrode GE may have a three-layer structure of molybdenum layer / aluminum layer / molybdenum layer.

[0077] The second gate insulating layer 204 may cover the gate electrode GE. The second gate insulating layer 204 may include an inorganic insulating material such as silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, aluminum nitride, titanium oxide, titanium nitride, tantalum oxide, hafnium oxide, or zirconium oxide. The second gate insulating layer 204 may have a single-layer structure or a multi-layer structure.

[0078] The second electrode CE2 of the storage capacitor Cst may be located on the second gate insulating layer 204. The second electrode CE2 may overlap the gate electrode GE. The gate electrode GE and the second electrode CE2 may overlap with each other with the second gate insulating layer 204 interposed therebetween, thereby forming the storage capacitor Cst. In other words, the gate electrode GE may operate as the first electrode CE1 of the storage capacitor Cst.

[0079] The second electrode CE2 may include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), or copper (Cu). According to some embodiments, the second electrode CE2 may have a single-layer structure or a multi-layer structure. For example, the second electrode CE2 may have a three-layer structure of molybdenum layer / aluminum layer / molybdenum layer.

[0080] The interlayer insulating layer 205 may cover the second electrode CE2. Furthermore, the source electrode SE and / or the drain electrode DE may be located on the interlayer insulating layer 205. In other words, the interlayer insulating layer 205 may electrically insulate the source electrode SE and the drain electrode DE from the second electrode CE2, etc. The interlayer insulating layer 205 may include an inorganic insulating material such as silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, aluminum nitride, titanium oxide, titanium nitride, tantalum oxide, hafnium oxide, or zirconium oxide. The interlayer insulating layer 205 may have a single-layer structure or a multi-layer structure.

[0081] The source electrode SE and / or the drain electrode DE may be located on the interlayer insulating layer 205. The source electrode SE and / or the drain electrode DE may include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), or copper (Cu). According to some embodiments, the source electrode SE and / or the drain electrode DE may have a single-layer structure or a multi-layer structure. For example, the source electrode SE and / or the drain electrode DE may have a three-layer structure, such as a titanium layer / aluminum layer / titanium layer.

[0082] exist Figure 2 In the embodiment, the thin film transistor TFT includes a source electrode SE and a drain electrode DE, but the present disclosure is not limited thereto. For example, a pixel circuit for controlling the operation of an organic light emitting diode OLED may include a plurality of thin film transistors. The semiconductor layer Act included in a first thin film transistor as one of the plurality of thin film transistors may be integrated with the semiconductor layer Act included in a second thin film transistor as another of the plurality of thin film transistors, and in this case, the first thin film transistor may not include a drain electrode, and the second thin film transistor may not include a source electrode. In other words, the drain region of the semiconductor layer Act included in the first thin film transistor and the source region of the semiconductor layer Act included in the second thin film transistor may be connected to or integrated with each other.

[0083] At the same time, the source electrode SE and / or the drain electrode DE can be part of a signal line or part of a connection electrode. For example, the source electrode SE and / or the drain electrode DE can be part of a data line or a part of a connection electrode located between the data line and the semiconductor layer Act to electrically connect the data line and the semiconductor layer Act. In this case, when viewed in a direction opposite to the Z-axis direction (i.e., in a plan view), the source electrode SE and / or the drain electrode DE can be part of the signal line or the connection electrode, i.e., a part of the signal line or the connection electrode that overlaps with the semiconductor layer Act. The source electrode SE and / or the drain electrode DE can contact the semiconductor layer Act through a contact hole formed in the interlayer insulating layer 205.

[0084] The planarization layer 207 may cover the thin film transistor TFT. Although the thin film transistor TFT exists below the planarization layer 207, the top surface of the planarization layer 207 may be approximately flat. In this regard, the planarization layer 207 may include an organic insulating material. For example, the planarization layer 207 may include a photoresist, benzocyclobutene (BCB), hexamethyldisiloxane (HMDSO), polymethyl methacrylate (PMMA), polystyrene, a polymer derivative having a phenolic group, an acrylic polymer, an imide polymer (polyimide), an aryl ether polymer, an amide polymer, a fluorine polymer, a paraxylene polymer, a vinyl alcohol polymer, or a mixture thereof.

[0085] According to some embodiments, at least one other insulating layer including an inorganic insulating material may be disposed between the thin film transistor TFT and the planarization layer 207. Furthermore, a connection electrode or a signal line may be provided between such an insulating layer and the planarization layer 207. When the insulating layer including an inorganic insulating material is disposed between the thin film transistor TFT and the planarization layer 207, the connection electrode or the signal line may also be disposed between the insulating layers.

[0086] The organic light emitting diode OLED may be positioned on the planarization layer 207. The organic light emitting diode OLED may include a pixel electrode 210, an intermediate layer 220 including an emission layer, and an opposing electrode 230.

[0087] The pixel electrode 210 may be a (semi-) transmissive electrode or a reflective electrode. For example, the pixel electrode 210 may include a reflective layer and a transparent conductive layer located on the reflective layer, wherein the reflective layer includes Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, or a compound thereof. The transparent conductive layer may include at least one of indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In2O3), indium gallium oxide (IGO), and aluminum zinc oxide (AZO). For example, the pixel electrode 210 may have a three-layer structure of ITO / Ag / ITO.

[0088] The pixel defining layer 209 may be located on the planarization layer 207. The pixel defining layer 209 may include an opening that exposes a central portion of the pixel electrode 210. The pixel defining layer 209 may increase the distance between the edge of the pixel electrode 210 and the counter electrode 230 located on the pixel electrode 210, thereby preventing or reducing the occurrence of arcing at the edge of the pixel electrode 210.

[0089] The pixel defining layer 209 may include at least one organic insulating material among polyimide, polyamide, acrylic resin, benzocyclobutene, and phenolic resin, and may be formed by spin coating or the like.

[0090] The intermediate layer 220 may be disposed between the pixel electrode 210 and the opposing electrode 230. The intermediate layer 220 may include a first functional layer 221, an emission layer 222, and a second functional layer 223.

[0091] The emission layer 222 may correspond to the pixel electrode 210. The emission layer 222 may include a high molecular weight or low molecular weight material and emit red light, green light, blue light, or white light. The first functional layer 221 may be arranged between the pixel electrode 210 and the emission layer 222, and the second functional layer 223 may be arranged between the emission layer 222 and the counter electrode 230. The first functional layer 221 and the second functional layer 223 may be integrated to correspond to multiple pixel electrodes 210. The first functional layer 221 may be a single layer or a multilayer. For example, when the first functional layer 221 is formed of a high molecular weight material, the first functional layer 221 may be a hole transport layer. When the first functional layer 221 is formed of a low molecular weight material, the first functional layer 221 may include a hole injection layer and a hole transport layer. The second functional layer 223 may be a single layer or a multilayer. The second functional layer 223 may include an electron transport layer and / or an electron injection layer.

[0092] The counter electrode 230 may be a (semi) transmissive electrode or a reflective electrode. For example, the counter electrode 230 may be a transparent or semi-transparent electrode and include Li, Ca, LiF, Al, Ag, Mg, or a compound thereof, or a multilayer structure material such as LiF / Ca or LiF / Al. The counter electrode 230 may also include a transparent conductive oxide (TCO) layer such as ITO, IZO, ZnO, or In2O3 on a metal film. The counter electrode 230 may be provided over the entire display area DA (see FIG. Figure 1 ) and is located on the intermediate layer 220 and / or the pixel defining layer 209. In other words, there may be one counter electrode 230 for a plurality of organic light emitting diodes OLED. In this regard, the counter electrode 230 may be referred to as a common electrode.

[0093] The organic light emitting diode OLED can be electrically connected to the thin film transistor TFT. Figure 2 In the embodiment, the pixel electrode 210 contacts the drain electrode DE of the thin film transistor TFT, but the embodiment of the present disclosure is not limited thereto. For example, various modifications are possible, for example, the connection electrode can be arranged between the pixel electrode 210 and the drain electrode DE of the thin film transistor TFT.

[0094] The encapsulation layer 300 may be located on the organic light emitting diode OLED. According to some embodiments, a capping layer may be disposed between the organic light emitting diode OLED and the encapsulation layer 300 to increase extraction efficiency of light generated in the organic light emitting diode OLED.

[0095] The encapsulation layer 300 may include at least one inorganic encapsulation layer and at least one organic encapsulation layer. Figure 2 In the embodiment, the encapsulation layer 300 includes a first inorganic encapsulation layer 310 and a second inorganic encapsulation layer 330 , and further, the encapsulation layer 300 includes an organic encapsulation layer 320 disposed between the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 .

[0096] Each of the first inorganic encapsulating layer 310 and the second inorganic encapsulating layer 330 may include one or more inorganic insulating materials. Inorganic insulating materials include aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), zinc oxide (ZnO x , which can be ZnO or ZnO2), silicon oxide (SiO x ), silicon nitride (SiN x ) and / or silicon oxynitride (SiON). The organic encapsulating layer 320 may further include polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyimide, polyethylene sulfonate, polyoxymethylene, polyarylate, HMDSO, acrylic resin, or a combination thereof.

[0097] The encapsulation layer 300 also includes the organic encapsulation layer 320 , and thus, the top surface of the encapsulation layer 300 may be approximately flat. Therefore, when components of the encapsulation layer 300 are formed on the encapsulation layer 300 , the possibility of defects may be relatively reduced.

[0098] The touch screen layer 400 may include a first touch insulating layer 410 , a first touch conductive layer MTL1 , a second touch insulating layer 420 , a second touch conductive layer MTL2 , and a third touch insulating layer 430 .

[0099] The first touch insulating layer 410 may be located on the encapsulation layer 300. The first touch insulating layer 410 may include an inorganic insulating material (such as silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, aluminum nitride, titanium oxide, titanium nitride, tantalum oxide, hafnium oxide, or zirconium oxide) or an organic insulating material (such as polyimide, polyester, or acrylic) and may have a single-layer structure or a multi-layer structure. Such a first touch insulating layer 410 can prevent or reduce damage to the encapsulation layer 300 and block interference signals that may be generated when driving the touch screen layer 400.

[0100] Each of the first touch conductive layer MTL1 and the second touch conductive layer MTL2 may have a single-layer structure or a multi-layer structure. Each of the first touch conductive layer MTL1 and the second touch conductive layer MTL2 may include a metal layer or a transparent conductive layer. The metal layer may include Mo, Ag, Ti, Cu, Al, or an alloy thereof. The transparent conductive layer may include a transparent conductive oxide such as ITO, IZO, ZnO, or ITZO. According to some embodiments, the transparent conductive layer may include a conductive polymer such as poly(3,4-ethylenedioxythiophene) (PEDOT), metal nanowires, or graphene.

[0101] Each of the first touch conductive layer MTL1 and the second touch conductive layer MTL2 may include a plurality of conductive patterns. The first touch conductive layer MTL1 may include a first conductive pattern, and the second touch conductive layer MTL2 may include a second conductive pattern. The first touch conductive layer MTL1 and the second touch conductive layer MTL2 may be electrically connected to each other through contact holes. The first touch conductive layer MTL1 and the second touch conductive layer MTL2 may have a mesh structure so that light emitted from the organic light emitting diode OLED is transmitted. The first touch conductive layer MTL1 and the second touch conductive layer MTL2 may not overlap with the emission area EA.

[0102] The second touch insulating layer 420 disposed between the first touch conductive layer MTL1 and the second touch conductive layer MTL2 may include an organic material or an inorganic material. For example, the second touch insulating layer 420 may include at least one material selected from acrylic resin, methacrylic resin, polyisoprene, vinyl resin, epoxy resin, polyurethane resin, cellulose resin, and perylene resin. Alternatively, the second touch insulating layer 420 may include at least one material selected from silicon nitride (SiN x ), aluminum nitride (AlN), zirconium nitride (ZrN), titanium nitride (TiN), hafnium nitride (HfN), tantalum nitride (TaN), silicon oxide (SiO x ), at least one material among aluminum oxide (Al2O3), titanium oxide (TiO2), tin oxide (SnO2), cerium oxide (CeO2) and silicon oxynitride (SiON).

[0103] The third touch insulating layer 430 may be located on the second touch conductive layer MTL2. The third touch insulating layer 430 may have a single-layer structure or a multi-layer structure. Similar to the second touch insulating layer 420 described above, the third touch insulating layer 430 may include an organic material or an inorganic material.

[0104] exist Figure 2 In the embodiment, the touch screen layer 400 is directly formed on the encapsulation layer 300, but the present disclosure is not limited thereto. For example, the touch screen layer 400 can be prepared as a functional module (e.g., a touch screen panel) separated from the display panel and attached to the display panel using an optically transparent adhesive.

[0105] As above Figure 1 As described above, the touch screen layer 400 may include driving electrodes TEa, driving signal lines TL electrically connected to the driving electrodes TEa, sensing electrodes REa, sensing signal lines RL electrically connected to the sensing electrodes REa, first connection electrodes CTE1 and second connection electrodes CTE2. Figure 2 The second touch conductive layer MTL2 may include sensing electrodes REa, driving electrodes TEa, and first connection electrodes CTE1 electrically connecting the driving electrodes TEa to each other. In other words, the driving electrodes TEa may be connected to each other through the first connection electrodes CTE1 formed on the same layer. For example, the driving electrodes TEa and the first connection electrodes CTE1 may be integrated with each other. The sensing electrodes REa located on the same layer as the driving electrodes TEa may be connected to each other through contact holes by second connection electrodes CTE2 formed on another layer. For example, Figure 2 The first touch conductive layer MTL1 may include a second connection electrode CTE2.

[0106] For example, the first touch conductive layer MTL1 may include the driving electrode TEa and the first connection electrode CTE1, and the second touch conductive layer MTL2 may include the sensing electrode REa and the second connection electrode CTE2.

[0107] Figure 3 It is schematically shown Figure 1 A magnified conceptual diagram of part of the ISA. Figure 1 and Figure 3 As shown in , the driving signal lines TL and the sensing signal lines RL may be located on different layers from the MIPI channel MIPIL, and the driving signal lines TL and the sensing signal lines RL intersect the MIPI channel MIPIL over the substrate 100 and / or the flexible printed circuit board FPCB. Figure 1 and Figure 3It is shown that the driving signal lines TL and the sensing signal lines RL are located on different layers from the MIPI channel MIPIL, and the driving signal lines TL and the sensing signal lines RL intersect the MIPI channel MIPIL on the flexible printed circuit board FPCB.

[0108] Figure 4 is a description Figure 1 A conceptual diagram of a communication method between a driver DIC and a processor AP shown in FIG.

[0109] The processor AP includes a transmission interface TI, and the driver DIC includes a reception interface RI, and thus, the processor AP and the driver DIC can communicate via the transmission interface TI and the reception interface RI. Such an interface may be MIPI. In other words, the transmission interface TI and the reception interface RI can communicate via MIPI.

[0110] The transmission interface TI and the receiving interface RI may include a clock channel and at least one data channel. Figure 4 In the embodiment, the transmission interface TI and the reception interface RI include four data channels.

[0111] Each channel includes two access lines and can communicate through these two access lines. For example, the clock channel can transmit clock signals Cp and Cn through the access lines. The access lines of the clock channel can perform unidirectional communication from the transmission interface TI to the reception interface RI. When the transmission interface TI and the reception interface RI include four data channels, the signals Dp0, Dn0, Dp1, Dn1, Dp2, Dn2, Dp3 and Dn3 can be transmitted through four pairs of access lines, such as Figure 4 As shown in . One pair of access lines among the four pairs of access lines can transmit signals Dp0 and Dn0 through bidirectional communication between the transmission interface TI and the reception interface RI, and the remaining three pairs of access lines can transmit signals Dp1, Dn1, Dp2, Dn2, Dp3, and Dn3 through unidirectional communication from the transmission interface TI to the reception interface RI. The clock channel and data channel included in the transmission interface TI and the reception interface RI can comply with the MIPI standard.

[0112] The signal transmitted from the transmission interface TI to the reception interface RI may be a data signal corresponding to an image to be realized on the display panel and / or a plurality of synchronization signals. The data signal may be transmitted through a data channel, and the synchronization signal may be transmitted through a clock channel.

[0113] Figure 5 is a conceptual diagram illustrating the functions of a universal data channel of MIPI. Figure 5 The figure shows the configuration of one channel including all common functions. Figure 5As shown in , a channel may include channel control and interface logic as well as input / output units (transmitter TX, receiver RX and contention detector CD).

[0114] The input / output unit (transmitter TX, receiver RX, and contention detector CD) may include a high-speed transmitter HS-TX, a high-speed receiver HS-RX, a low-power transmitter LP-TX, a low-power receiver LP-RX, and a low-power contention detector LP-CD. The transmitter TX of the input / output unit (transmitter TX, receiver RX, and contention detector CD) may include a low-power transmitter LP-TX and a high-speed transmitter HS-TX. The receiver RX of the input / output unit (transmitter TX, receiver RX, and contention detector CD) may include a high-speed receiver HS-RX, a low-power receiver LP-RX, and a terminal resistor R T (or terminal impedance R T The contention detector CD of the input / output unit (transmitter TX, receiver RX and contention detector CD) may include a low power contention detector LP-CD. The termination resistor R may be enabled only when each channel is in a high-speed receiving state. T .

[0115] High-speed signals may have a low voltage swing, eg, 200 mV, while low-power signals may have a high voltage swing, eg, 1.2V.

[0116] The high-speed transmitter HS-TX and the high-speed receiver HS-RX can be mainly used for high-speed data transmission, and the low-power transmitter LP-TX, the low-power receiver LP-RX and the low-power contention detector LP-CD can be mainly used for control, but the high-speed transmitter HS-TX, the high-speed receiver HS-RX, the low-power transmitter LP-TX, the low-power receiver LP-RX and the low-power contention detector LP-CD can be selectively used in other situations.

[0117] One channel may include one or both of the high-speed transmitter HS-TX and the high-speed receiver HS-RX. However, the high-speed transmitter HS-TX and the high-speed receiver HS-RX included in one channel may not be enabled at the same time (or synchronously).

[0118] When a channel includes a high-speed transmitter (HS-TX), it may also include a low-power transmitter (LP-TX). Similarly, when a channel includes a high-speed receiver (HS-RX), it may also include a low-power receiver (LP-RX). The low-power contention detector (LP-CD) may be used only for bidirectional operation. The low-power contention detector (LP-CD) can detect collisions only when the low-power transmitter (LP-TX) is in a low-power state.

[0119] Such input / output functions are controlled by the channel control and interface logic, which can perform the interface with the protocol layer and determine the global operation of the channel.

[0120] Figure 6 The diagram shows the application during a frame 1F to the Figure 1 1 is a waveform diagram of a touch driving signal TLS of the touch screen layer 400 in the display device 1, a clock signal clock applied to the MIPI clock channel, and signals Dp and Dn applied to the MIPI data channel.

[0121] As mentioned above, also refer to Figure 1 The touch driver TIC may apply a driving signal to the driving electrode TEa through the driving signal line TL to drive the touch screen layer. Figure 6 The touch drive signal TLS indicates the drive signal applied by the touch driver TIC to the drive electrode TEa through the drive signal line TL. Figure 6 As shown in , the touch driving signal TLS may have a periodically repeated pulse waveform.

[0122] Also refer to Figure 4 The clock signal clock is a signal transmitted from the transmission interface TI to the receiving interface RI through the clock channel. Figure 4 In FIG, the clock signal clock has been indicated as clock signals Cp and Cn.

[0123] As described above, each of the multiple MIPI channels MIPIL includes two access lines and can communicate through these two access lines. The signal Dp can be transmitted through a first access line as one of the two access lines, and the signal Dn can be transmitted through a second access line as the other of the two access lines. The signals Dp and Dn applied to the MIPI data channel include a low power state (LPS) signal and a high speed state (HSS) signal. The LPS signal may have a pulse waveform that repeats periodically. As described above, the LPS signal may have a high voltage swing with an absolute value of 1.2V, and may be a signal that distinguishes the start and end of the MIPI packet structure. The HSS signal is transmitted between the LPS signals, and as described above, the HSS signal has a low voltage swing of 200mV and is a signal for image data.

[0124] In the case of the display device 1 according to some embodiments, in at least one of the plurality of MIPI data channels, such as Figure 6 As shown in , when the LPS signal is transmitted, the phase of the signal Dn at the second access line and the phase of the signal Dp at the first access line may be different from each other. For example, in at least one of the plurality of MIPI data lanes, when the LPS signal is transmitted, as shown in Figure 6As shown in , the phase of the signal Dn at the second access line can be opposite to the phase of the signal Dp at the first access line. In other words, the signal Dn at the second access line can be an inverted signal of the signal Dp at the first access line. Therefore, Figure 6 , the magnitude of the signal Dp at the first access line is 1.2 V, and the magnitude of the signal Dn at the second access line is -1.2 V. When the HSS signal is transmitted, both the signal Dp at the first access line and the signal Dn at the second access line may be positive voltages.

[0125] In the case of such a display device 1 according to some embodiments, when transmitting the LPS signal, at least one of the multiple MIPI data channels may not have, or may have minimized or reduced, an electromagnetic impact on surrounding wiring or electronic devices. This is because the signal Dn at the second access line is an inverted signal of the signal Dp at the first access line, and the electromagnetic waves of the first access line that affect the surrounding wiring or electronic devices are roughly offset (i.e., destructive interference) by the electromagnetic waves of the second access line that affect the surrounding wiring or electronic devices.

[0126] Figure 7 A waveform diagram illustrating noise generated in a touch driving signal TLS applied to a touch screen layer of a display device according to a comparative example is shown. Also in the display device according to the comparative example, referring to Figure 1 , the touch driver TIC may apply a driving signal to the driving electrode TEa through the driving signal line TL to drive the touch screen layer. Figure 7 The touch drive signal TLS indicates the drive signal applied to the drive electrode TEa by the touch driver TIC through the drive signal line TL. Figure 7 As shown in , the touch driving signal TLS may have a periodically repeated pulse waveform.

[0127] According to the comparative example Figure 7 In the case of a display device, when the MIPI data channel transmits the LPS signal, the signal Dp at the first access line and the signal Dn at the second access line have the same phase and the same magnitude of 1.2V. Figure 1 and Figure 3 As described above, the driving signal lines TL electrically connecting the touch driver TIC and the driving electrodes TEa to each other and the sensing signal lines RL electrically connecting the touch driver TIC and the sensing electrodes REa to each other may be located on different layers from the MIPI channel MIPIL and may intersect with the MIPI channel MIPIL. Therefore, in the case of the display device according to the comparative example, the driving signal lines TL are affected by the intersection area (see FIG. Figure 1 and Figure 3 The influence of the signal Dp at the first access line and the signal Dn at the second access line of the MIPI channel MIPIL in the part ISA).

[0128] in this regard, Figure 7 FIG shows the actual touch driving signal TLS′ actually transmitted to the driving electrode TEa. Figure 7 As shown in FIG, even when the touch driver TIC applies a driving signal to the driving electrode TEa through the driving signal line TL to drive the touch screen layer, the actual touch driving signal TLS′ actually transmitted to the driving electrode TEa includes noise corresponding to the time when the signal Dp at the first access line and the signal Dn at the second access line increase from, for example, 0 volts (V) to 1.2 volts (V), and the time when the signal Dp at the first access line and the signal Dn at the second access line decrease from 1.2 V to 0 V. Therefore, the sensing signal transmitted to the touch driver TIC through the sensing signal line RL connected to the sensing electrode REa includes such noise, and as a result, an error may occur in the touch driver TIC, for example, the touch driver TIC may malfunction as if a touch has occurred although there is actually no touch.

[0129] However, in the case of the display device 1 according to some embodiments, in at least one of the multiple MIPI data channels, as described above, the signal Dn at the second access line may be an inverted signal of the signal Dp at the first access line. Therefore, when the MIPI data channel transmits the LPS signal, the MIPI data channel may not have, or may have minimized or reduced, electromagnetic influence on surrounding wiring or electronic devices.

[0130] Figure 8 The diagram shows the Figure 1 The waveform diagram of the touch driving signal TLS of the touch screen layer 400 of the display device 1 does not generate noise. Figure 1 , Figure 8 The touch drive signal TLS indicates the drive signal applied by the touch driver TIC to the drive electrode TEa through the drive signal line TL. Figure 8 As shown in , when the MIPI data channel transmits the LPS signal, the signal Dp at the first access line has a magnitude of 1.2V, but the signal Dn at the second access line has a magnitude of -1.2V. Therefore, as Figure 8 As shown in FIG, it is verified that the actual touch drive signal TLS' actually transmitted to the drive electrode TEa does not include noise corresponding to the time when the signal Dp at the first access line and the signal Dn at the second access line change. This is because the signal Dn at the second access line is an inverted signal of the signal Dp at the first access line, and the electromagnetic waves of the first access line that affect the surrounding wiring or electronic devices are roughly offset by the electromagnetic waves of the second access line that affect the surrounding wiring or electronic devices (i.e., destructive interference).

[0131] According to some embodiments, the phase of the signal Dn at the second access line can be configured to be different from or opposite to the phase of the signal Dp at the first access line, thereby relatively reducing the magnitude of noise included in the actual touch drive signal TLS' actually transmitted to the drive electrode TEa. Therefore, the occurrence of errors during the touch sensing process can be relatively reduced.

[0132] For reference, when the MIPI data channel transmits the HSS signal, no significant noise may occur in the touch drive signal TLS because the HSS signal has a low voltage swing of 200 mV as described above.

[0133] At the same time, the above description can be applied to each of the multiple MIPI data channels, rather than one of the multiple MIPI data channels. For example, in each of the multiple MIPI data channels, when the LPS signal is transmitted, the phase of the signal Dn at the second access line can be different from the phase of the signal Dp at the first access line. In addition, in each of the multiple MIPI data channels, when the LPS signal is transmitted, the phase of the signal Dn at the second access line can be opposite to the phase of the signal Dp at the first access line. According to some embodiments, in each of the multiple MIPI data channels, when the LPS signal is transmitted, the signal Dn at the second access line can be an inverted signal of the signal Dp at the first access line, thereby relatively reducing or preventing or reducing the occurrence of errors during the touch sensing process.

[0134] Figure 9 and Figure 10 Waveform diagrams of a touch driving signal TLS applied to the touch screen layer 400 included in the display device 1 , a clock signal clock applied to a MIPI clock lane, and signals Dp and Dn applied to a MIPI data lane are illustrated according to some embodiments.

[0135] In accordance with the above reference Figure 6 In the case of the display device 1 of some embodiments described in the examples, when transmitting the LPS signal, the phase of the signal Dn at the second access line and the phase of the signal Dp at the first access line included in one MIPI data channel are configured to be different from each other, thereby minimizing or reducing the occurrence of errors during the touch sensing process. However, in the case of the display device 1 according to some embodiments, for two adjacent channels in the MIPI data channel, when transmitting the LPS signal, the phase of the signal at one channel and the phase of the signal at the other channel are configured to be different from each other.

[0136] exist Figure 9In the embodiment, when the LPS signal is transmitted, in one channel of two adjacent MIPI data channels, the signal Dp at the first access line and the signal Dn at the second access line both have a magnitude of 1.2V. In other words, the signal Dp at the first access line and the signal Dn at the second access line can be the same, that is, 1.2V. Figure 10 In the other channel of the two adjacent MIPI data channels, the signal Dp at the first access line and the signal Dn at the second access line both have a magnitude of -1.2 V. In other words, the signal Dp at the first access line and the signal Dn at the second access line may be the same, that is, -1.2 V.

[0137] In this way, in two adjacent MIPI data lanes, when transmitting LPS signals, the signal at one lane can be an inverted signal of the signal at the other lane, and therefore, the two adjacent MIPI data lanes may not have, or may have minimized or reduced, electromagnetic influence on surrounding wiring or electronic devices. This is because the electromagnetic waves of one lane that affect surrounding wiring or electronic devices are roughly offset (i.e., destructive interference) by the electromagnetic waves of the other lane that affect surrounding wiring or electronic devices. Therefore, the occurrence of errors during the touch sensing process can be relatively reduced.

[0138] According to some embodiments, when transmitting an LPS signal, by configuring the phase of the signal on one of two adjacent MIPI data lanes to be different from or opposite to the phase of the signal on the other lane, the magnitude of noise included in the actual touch drive signal actually transmitted to the drive electrode TEa can be relatively reduced. Therefore, the occurrence of errors during the touch sensing process can be relatively reduced.

[0139] At the same time, if Figure 4 As shown in , the number of MIPI data channels can be an even number. In this case, when transmitting the LPS signal, the phase of the signal at the odd-numbered MIPI data channel and the phase of the signal at the even-numbered MIPI data channel can be different from each other. In addition, the phase of the signal at the odd-numbered MIPI data channel can be opposite to the phase of the signal at the even-numbered MIPI data channel. Specifically, the signal at the odd-numbered MIPI data channel can be an inverted signal of the signal at the even-numbered MIPI data channel, thereby minimizing, reducing or preventing errors caused by the MIPI data channel during the touch sensing process.

[0140] Figure 11 1 is a conceptual diagram describing a communication method between a driver DIC and a processor AP included in the display device 1 according to some embodiments. Figure 11 As shown in , the number of MIPI data lanes can be three.

[0141] In such a pair of two adjacent lanes among the MIPI data lanes, when transmitting the LPS signal, the above reference can be applied. Figure 9 and Figure 10 In other words, when transmitting an LPS signal, the phase of the signal on one channel of the pair can be different from the phase of the signal on the other channel of the pair. For example, when transmitting an LPS signal, the signal on one channel of the pair can be an inverted signal of the signal on the other channel of the pair. Such a pair of channels can be, for example, a channel that transmits signals Dp1 and Dn1 and a channel that transmits signals Dp2 and Dn2.

[0142] In addition, the above reference can be applied to the remaining unpaired channels (eg, channels for transmitting signals Dp0 and Dn0) among the plurality of MIPI data channels. Figure 6 In other words, for the remaining channels, when the LPS signal is transmitted, the phase of the signal at the first access line and the phase of the signal at the second access line may be different from each other. For example, when the LPS signal is transmitted, the signal at the first access line may be an inverted signal of the signal at the second access line in the remaining channels.

[0143] Therefore, the MIPI data channel may not have or may have minimized or reduced electromagnetic influence on surrounding wiring or electronic devices. In other words, the occurrence of errors during the touch sensing process can be relatively reduced.

[0144] When the number of MIPI data lanes is five, a similar approach can be applied. Figure 9 and Figure 10 The description described can be applied to a pair of first and second channels adjacent to each other and a pair of fourth and fifth channels adjacent to each other, with reference to Figure 6 The description of the description can be applied to the third channel as the remaining channels. Figure 9 and Figure 10 The description described can be applied to a pair of first and second channels adjacent to each other and a pair of third and fourth channels adjacent to each other, and with reference to Figure 6 The description can be applied to the fifth channel as the remaining channels.

[0145] Meanwhile, the above description may be applied to D-Phy among multiple layers of MIPI as well as to C-Phy.

[0146] According to some embodiments as described above, a display device in which the occurrence of errors in the touch screen layer is relatively reduced can be realized. The scope of the embodiments according to the present disclosure is not limited by these effects.

[0147] It should be understood that the embodiments described herein should be considered in a descriptive sense only and not for purposes of limitation. The description of features or aspects in each embodiment should generally be considered to be applicable to other similar features or aspects in other embodiments. Although one or more embodiments have been described with reference to the accompanying drawings, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope as defined by the appended claims and their equivalents.

Claims

1. A display device, wherein: The display device comprises: Display panel, including a display layer and a touch screen layer; a flexible printed circuit board electrically connected to one side of the display panel; A driving driver, located on the display panel; a processor located on the flexible printed circuit board; and a plurality of mobile industrial processor interface data channels located on the flexible printed circuit board and electrically connecting the processor and the drive driver to each other, Wherein, each of the multiple mobile industrial processor interface data channels includes a first access line and a second access line, and in at least one of the multiple mobile industrial processor interface data channels, based on the transmission of the low power state signal, the phase of the signal at the first access line and the phase of the signal at the second access line are configured to be different from each other.

2. The display device according to claim 1, wherein Based on the at least one of the plurality of mobile industry processor interface data channels transmitting the low power state signal, the phase of the signal at the second access line is opposite to the phase of the signal at the first access line.

3. The display device according to claim 1, wherein The low power state signal is transmitted based on the at least one of the plurality of mobile industry processor interface data channels, and the signal at the second access line is an inverted signal of the signal at the first access line. The display device according to claim 1 , wherein: The display device further includes: a touch driver, located on the flexible printed circuit board; and A plurality of touch signal lines are located on the flexible printed circuit board, such that the plurality of touch signal lines and the plurality of mobile industrial processor interface data channels are located on different layers, the plurality of touch signal lines intersect the plurality of mobile industrial processor interface data channels, and the plurality of touch signal lines electrically connect the touch driver and the touch screen layer to each other.

5. The display device according to claim 4, wherein The display device further includes a touch communication line that is located on the flexible printed circuit board and electrically connects the processor and the touch driver to each other. The display device according to claim 1 , wherein: In each of the plurality of mobile industry processor interface data channels, the phase of the signal at the first access line and the phase of the signal at the second access line are configured to be different from each other based on transmission of the low power state signal.

7. The display device according to claim 1, wherein In each of the plurality of mobile industry processor interface data channels, based on transmission of the low power state signal, the phase of the signal at the first access line is configured to be opposite to the phase of the signal at the second access line.

8. The display device according to claim 1, wherein In each of the plurality of mobile industry processor interface data channels, based on the transmission of the low power state signal, the signal at the first access line is configured as an inverted signal of the signal at the second access line.

9. A display device, wherein: The display device comprises: Display panel, including a display layer and a touch screen layer; a flexible printed circuit board electrically connected to one side of the display panel; A driving driver, located on the display panel; a processor located on the flexible printed circuit board; and a plurality of mobile industrial processor interface data channels located on the flexible printed circuit board and electrically connecting the processor and the drive driver to each other, Among two adjacent channels among the plurality of mobile industrial processor interface data channels, based on transmission of the low power state signal, a phase of a signal at one channel and a phase of a signal at another channel are different from each other.

10. The display device according to claim 9, wherein Based on the transmission of the low-power state signal, the phase of the signal at the one channel is opposite to the phase of the signal at the other channel.

11. The display device according to claim 9, wherein Based on the transmission of the low-power state signal, the signal at the one channel is an inverted signal of the signal at the other channel.

12. The display device according to claim 9, wherein The display device further includes: a touch driver, located on the flexible printed circuit board; and A plurality of touch signal lines are located on the flexible printed circuit board, such that the plurality of touch signal lines and the plurality of mobile industrial processor interface data channels are located on different layers, the plurality of touch signal lines intersect the plurality of mobile industrial processor interface data channels, and the plurality of touch signal lines electrically connect the touch driver and the touch screen layer to each other.

13. The display device according to claim 12, wherein The display device further includes a touch communication line that is located on the flexible printed circuit board and electrically connects the processor and the touch driver to each other.

14. The display device according to claim 9, wherein The number of the plurality of mobile industrial processor interface data channels is even, and based on the transmission of the low power state signal, the phase of the signal at the odd mobile industrial processor interface data channels is configured to be different from the phase of the signal at the even mobile industrial processor interface data channels.

15. The display device according to claim 9, wherein The number of the plurality of mobile industrial processor interface data channels is even, and based on the transmission of the low power state signal, the phase of the signal at the odd mobile industrial processor interface data channels is configured to be opposite to the phase of the signal at the even mobile industrial processor interface data channels.

16. The display device according to claim 9, wherein The number of the plurality of mobile industrial processor interface data channels is even, and based on the transmission of the low power state signal, the signals at the odd mobile industrial processor interface data channels are configured as inverted signals of the signals at the even mobile industrial processor interface data channels.

17. The display device according to claim 9, wherein Each of the plurality of mobile industrial processor interface data channels includes a first access line and a second access line, and in each of the plurality of mobile industrial processor interface data channels, a phase of a signal at the first access line and a phase of a signal at the second access line are configured to be the same.

18. A display device, wherein: The display device comprises: Display panel, including a display layer and a touch screen layer; a flexible printed circuit board electrically connected to one side of the display panel; A driving driver, located on the display panel; a processor located on the flexible printed circuit board; and a plurality of mobile industrial processor interface data channels located on the flexible printed circuit board and electrically connecting the processor and the drive driver to each other, wherein each of the plurality of mobile industrial processor interface data channels comprises a first access line and a second access line, and the number of the plurality of mobile industrial processor interface data channels is an odd number of three or greater, In a pair of two adjacent channels of the plurality of mobile industry processor interface data channels, a phase of a signal at one channel of the pair and a phase of a signal at the other channel of the pair are configured to be different from each other based on transmission of a low power state signal, and In the remaining unpaired channels of the plurality of mobile industrial processor interface data channels, a phase of a signal at the first access line and a phase of a signal at the second access line are configured to be different from each other based on transmission of the low power state signal.

19. The display device according to claim 18, wherein The signal at the one channel of the pair is an inverted signal of the signal at the other channel of the pair.

20. The display device according to claim 18, wherein The signal at the first access line of the remaining unpaired channel is an inverted signal of the signal at the second access line of the remaining unpaired channel.

21. An electronic device, wherein: The electronic device includes the display device according to any one of claims 1 to 20.

22. The electronic device according to claim 21, wherein The electronic device is at least one of a smart phone, a mobile phone, a navigation device, a television, a vehicle's dashboard, a vehicle's central information display device, a vehicle's interior rearview mirror display, a vehicle's rear seat entertainment device, an electronic notebook, an electronic book, an ultra-mobile personal computer, a laptop computer, a tablet computer, a portable media player, a smart watch, a watch phone, a glasses-type display, and a head-mounted display.

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