Wafer cleaning device and wafer cleaning method

Through the design of double-sided brush rollers and positioning components, combined with the coordinated spraying of deionized water, chemical liquid and nitrogen, efficient double-sided cleaning and step-drying of wafers are achieved, solving the problems of low cleaning efficiency and unstable quality in the prior art, and adapting to the rapid replacement of wafers of different sizes.

CN120565462APending Publication Date: 2025-08-29BEIJING SEMICORE MICROELECTRONICS EQUIPMENT CO LTD
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Patent Information

Application Number
CN202510947858.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-07-09
Publication Date
2025-08-29

AI Technical Summary

Technical Problem

The existing wafer cleaning methods cannot efficiently remove stubborn particles, have low cleaning efficiency, and cannot achieve simultaneous cleaning of both sides of the wafer surface, resulting in production efficiency and quality problems.

Method used

The wafer is clamped with two parallel brush rollers and positioning components, combined with the spray design of deionized water, chemical liquid and nitrogen, to realize dynamic double-sided cleaning and step-drying of the wafer. The adaptive clamping of the positioning wheel is adapted to wafers of different sizes, and combined with the synchronous driving of the multi-claw chuck, to ensure rotation stability and cleaning effect.

Benefits of technology

It realizes efficient double-sided cleaning of wafers, shortens cleaning time, avoids micro scratches and dry spots, improves cleaning efficiency and quality, adapts to the rapid replacement of wafers of different sizes, and solves the problems of low efficiency and unstable quality in traditional cleaning.

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Abstract

The invention provides a wafer cleaning device and a wafer cleaning method, and belongs to the field of chemical mechanical polishing, the wafer cleaning device comprises a positioning assembly, a blowing mechanism and two brush rollers, the two brush rollers are parallel to each other and have the freedom degrees of moving along the axes of the two brush rollers and rotating around the axes of the two brush rollers, and the positioning assembly is used for positioning the two brush rollers. The two brush rollers are respectively arranged on the upper and lower sides of a wafer to be cleaned; the positioning assembly comprises a plurality of positioning wheels, the positioning wheels are arranged at intervals around the circumference of the to-be-cleaned wafer, the wheel surfaces of the positioning wheels are in running fit with the to-be-cleaned wafer, and positioning grooves capable of axially locking the wafer are formed in the wheel surfaces of the positioning wheels; the blowing mechanism comprises a deionized water nozzle and a chemical liquid nozzle, the blowing direction of the deionized water nozzle faces the upper side face of the wafer, and the blowing direction of the chemical liquid nozzle faces the upper side face of the wafer to be cleaned. Compared with the prior art, the technical problem that the existing wafer cleaning efficiency cannot meet the production requirements of wafers is solved.
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