Terahertz miniaturized multi-channel receiving front end with laminated and self-packaged metal sheets and implementation method of terahertz miniaturized multi-channel receiving front end

Abstract

The invention discloses a metal sheet laminated self-packaged terahertz miniaturized multichannel receiving front end which is formed by arranging terahertz miniaturized receiving units on a plane in an array mode, and each receiving unit comprises a radio frequency function circuit module, a bottom fixing substrate, a PCB power supply board and a radio frequency connector. Wherein the radio frequency functional circuit module is formed by stacking and self-packaging metal sheets, and comprises three components, namely a low-noise amplification module, a down-conversion module and a frequency multiplication amplification module, the three components are fixed on the bottom fixed substrate from top to bottom according to the link sequence of the receiving front end, and the PCB power supply board and the radio frequency connector are both mounted on the back surface of the bottom fixed substrate. Patterns are processed on a plurality of metal sheets, then a closed cavity is formed in a stacked and fixed mode, and self-packaging of a functional circuit module is achieved by loading a micro-coaxial structure of a three-dimensional electromagnetic band gap structure; the terahertz wave filter is compact in structure, small in unit size and suitable for multi-channel layout or array expansion, and has practical value in a terahertz communication system.

Description

Technical Field

[0001] The present invention belongs to the field of communication technology, relates to millimeter wave and terahertz communication, and specifically relates to a terahertz miniaturized multi-channel receiving front end with self-encapsulation of stacked metal sheets and an implementation method thereof. Background Art

[0002] The new generation of wireless communication technologies places higher demands on communication speed and channel capacity. The millimeter-wave terahertz band offers significant advantages, including high operating frequency, large channel capacity, and high communication speed, leading to its increasingly widespread application in wireless communications. The terahertz communication receiving front-end, consisting primarily of key components such as low-noise amplifiers, mixers, frequency multipliers, and amplifiers, is a crucial component of terahertz communication systems. Traditional multi-channel receiving front-end designs utilize a combination of discrete components. Each independent functional circuit is encapsulated within a metal cavity. Multiple packaged components are interconnected via waveguide transmission lines, arranged in parallel, to form a terahertz communication link unit. This design approach allows for independent debugging and monitoring of each functional component, ensuring stable performance. However, the discrete component architecture results in large packaging volume, high manufacturing costs, and low integration. Therefore, miniaturization of terahertz multi-channel receiving front-ends using traditional design principles is difficult.

[0003] Multi-channel receiver front-ends based on all-solid-state electronics enable miniaturization and high integration. However, because all the functional circuit modules required for the receiver front-end are integrated on a single chip, system design is complex and production costs are high. Furthermore, due to the chip's inherently low power handling capacity, some circuits have a narrow operating bandwidth, making them unsuitable for broadband, high-power applications. Summary of the Invention

[0004] In response to the shortcomings of the existing technology, the present invention proposes a terahertz miniaturized multi-channel receiving front end and implementation method using self-packaged metal sheet stacking. The various radio frequency functional circuit module devices required for the terahertz receiving front end are stacked in a three-dimensional manner to form a compact integrated structure in the vertical direction. Each functional circuit module adopts self-packaged metal sheet stacking technology, and through an integrated design, the performance indicators of each device are comprehensively guaranteed to achieve terahertz signal reception and frequency conversion processing. The present invention is small in size, low in cost, highly integrated, and easy to expand into large arrays. It is a preferred solution for multi-channel arrayed terahertz systems. By utilizing the form of multi-layer metal plate stacking, the difficulties of terahertz waveguide chip packaging and processing, which are difficult and costly, are overcome.

[0005] To achieve the above object, the technical solution adopted by the present invention is as follows:

[0006] A terahertz miniaturized multi-channel receiving front end with a self-packaged metal sheet stacking is composed of terahertz miniaturized receiving units arranged in an array on a plane. The terahertz miniaturized receiving units include a radio frequency functional circuit module, a bottom fixed substrate, a PCB power supply board, and a radio frequency connector. The radio frequency functional circuit module is self-packaged by stacking metal sheets and includes three components: a low-noise amplifier module, a down-conversion module, and a frequency multiplication amplifier module. The three components are fixed to the bottom fixed substrate from top to bottom according to the link sequence of the receiving front end. The PCB power supply board and the radio frequency connector are both mounted on the back of the bottom fixed substrate.

[0007] Furthermore, the components or devices in the RF functional circuit module are stacked in three dimensions to form a compact integrated structure in the vertical direction; the signal transmission between the various components of the RF functional circuit module adopts a vertical waveguide transmission line, and the broadband, low-loss transmission conversion of the signal in the horizontal-vertical-horizontal direction is completed through a metal micro-coaxial probe.

[0008] Furthermore, each component of the radio frequency functional circuit module is formed into a closed cavity by laminating and solidifying multiple metal sheets after processing patterns on them, and self-encapsulation is achieved by loading a metal micro-coaxial structure with a three-dimensional electromagnetic band gap structure.

[0009] Furthermore, the thickness t of the metal sheet is selected to be 1 / 8λ0 to 1 / 4λ0, where λ0 is the wavelength corresponding to the working frequency band of the multi-channel receiving front end.

[0010] Furthermore, the low-noise amplifier module is formed into a self-packaged module by stacking and solidifying multiple layers of metal sheets, with the LNA chip arranged on the middle metal sheet; each metal sheet is loaded with periodically sliding symmetrical holes as a three-dimensional electromagnetic bandgap structure to prevent electromagnetic wave leakage and increase the operating bandwidth; standard rectangular waveguide ports are reserved on the top metal sheet and the bottom metal sheet for vertical signal transmission and interconnection between components; the LNA chip introduces the signal into the metal micro-coaxial structure of the middle metal sheet through gold bonding wires, thereby realizing vertical-horizontal-vertical transmission of terahertz signals.

[0011] Furthermore, the down-conversion module is formed by stacking and solidifying multiple layers of metal sheets to form a self-packaged module, and the Mixer chip and Mixer intermediate frequency signal transmission line are arranged on the middle metal sheet; each metal sheet is loaded with periodic sliding symmetrical holes as a three-dimensional electromagnetic bandgap structure to prevent electromagnetic wave leakage and increase the working bandwidth; standard rectangular waveguide ports are reserved on the top metal sheet and the bottom metal sheet for vertical signal transmission and interconnection between components; the Mixer chip introduces RF and LO signals into the metal micro-coaxial structure of the middle metal sheet through gold wire bonding lines to complete the vertical-horizontal-vertical transmission of the terahertz signal, and the IF signal is output from the IF output SMP connector in the RF connector through the Mixer intermediate frequency signal transmission line.

[0012] Furthermore, the frequency multiplication amplification module is formed by stacking and solidifying multiple layers of metal sheets to form a self-packaged module, with the amplifier chip and the frequency multiplier chip arranged on the middle layer of metal sheet. Each metal sheet is loaded with periodically sliding symmetrical holes as a three-dimensional electromagnetic bandgap structure to prevent electromagnetic wave leakage and increase the working bandwidth; a standard rectangular waveguide port is reserved on the top metal sheet for vertical signal transmission and interconnection between components; the amplifier chip and the frequency multiplier chip introduce the signal into the metal micro-coaxial structure of the middle layer of metal sheet through gold bonding wires to realize the vertical-horizontal transmission of the terahertz signal; the frequency multiplier input signal is fed into the LO input SMP connector of the RF connector.

[0013] Furthermore, the bottom fixed substrate is fixed with metal pins and fixing holes to fix the metal sheets of each component of the radio frequency functional circuit module arranged in a chain sequence above; the radio frequency connector and the PCB power supply board are fixed on the back thereof, which are respectively connected to the functional circuits of the corresponding layers; the bottom fixed substrate is a solid material.

[0014] Furthermore, the PCB power supply board includes a low-noise amplifier and its power supply circuit, which is connected to the corresponding chip power supply peripheral circuit on the upper layer through a glass insulator and performs power supply control.

[0015] The present invention also provides a method for implementing a terahertz miniaturized multi-channel receiving front end of a metal sheet stacked self-packaged system, the method comprising:

[0016] 1) Preparing multiple metal sheets, processing patterns on the metal sheets and loading periodically sliding symmetrical holes to form a three-dimensional electromagnetic bandgap structure, using a stacking and solidification method to form a closed cavity to achieve self-encapsulation of the radio frequency functional circuit module, and reserving standard rectangular waveguide ports on the top metal sheet and / or the bottom metal sheet of each component; the internal chip of each component introduces the signal into the metal micro-coaxial structure of the intermediate metal sheet through gold wire bonding;

[0017] 2) According to the link sequence of the receiving front end, the components of the radio frequency functional circuit module are stacked three-dimensionally from top to bottom and fixed on the bottom fixed substrate, forming a compact and integrated terahertz miniaturized receiving unit in the vertical direction; wherein, the signal transmission between the components of the radio frequency functional circuit module adopts a vertical waveguide transmission line, and the internal chip introduces the signal into the metal micro-coaxial probe of the intermediate metal plate through the gold wire bonding line, completing the broadband, low-loss transmission conversion of the signal in the horizontal-vertical-horizontal direction; the terahertz RF signal enters the receiving front end through the standard rectangular waveguide port on the top layer, and the IF signal after processing by the low-noise amplification module and the down-conversion module is output from the IF output SMP connector; the LO signal required by the down-conversion module is fed from the LO input SMP connector and fed into the down-conversion module through the frequency multiplication amplification module;

[0018] 3) Arrange several terahertz miniaturized receiving units in an array on a plane to form a multi-channel communication front-end system.

[0019] Compared with the prior art, the advantages of the present invention are:

[0020] The present invention is based on the metal sheet stacking self-packaging technology to achieve three-dimensional stacking of terahertz miniaturized multi-channel receiving front-end functional modules; the functional circuit module is packaged by a stacked metal sheet micro-coaxial structure loaded with a three-dimensional electromagnetic band gap structure to achieve broadband, low-loss transmission conversion of terahertz signals in the horizontal-vertical-horizontal directions; the metal sheet stacking self-packaging process significantly reduces the packaging difficulty and processing cost of the circuit module, and the structure is compact, which is conducive to array layout and expansion. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 Schematic diagram of the overall structure of a terahertz miniaturized multi-channel receiving front end based on metal sheet stacking and self-packaging in an embodiment of the present invention.

[0022] Figure 2 This is a cross-sectional view of the geometric center of the terahertz miniaturized multi-channel receiving front-end unit in an embodiment of the present invention.

[0023] Figure 3 Schematic diagram of the low-noise amplifier module structure in an embodiment of the present invention.

[0024] Figure 4 Schematic diagram of the structure of the down-conversion module in an embodiment of the present invention.

[0025] Figure 5 Schematic diagram of the structure of the frequency multiplication and amplification module in an embodiment of the present invention.

[0026] Figure 6 Schematic diagram of the bottom fixed substrate structure in an embodiment of the present invention.

[0027] Figure 71 is the S-parameter simulation result of the D-band micro-coaxial structure loaded with a three-dimensional electromagnetic bandgap structure in an embodiment of the present invention.

[0028] Figure 8 These are the S-parameter simulation results of the E-band micro-coaxial structure loaded with a three-dimensional electromagnetic bandgap structure in an embodiment of the present invention.

[0029] Figure 9 This is the simulation result of the frequency conversion loss of the receiving front end in the embodiment of the present invention. DETAILED DESCRIPTION

[0030] To facilitate understanding of the present invention, the present invention will be described in more detail below with reference to the accompanying drawings and collective examples. Preferred embodiments of the present invention are shown in the accompanying drawings, and the examples are not intended to limit the present invention to these examples. On the contrary, the present invention is intended to cover alternatives, modifications, and equivalents that may be included within the spirit and scope of the present invention as defined by the appended claims. In addition, in the following detailed description of the present invention, certain specific details are set forth in order to provide a thorough understanding of the present invention, and the present invention can be practiced without these specific details.

[0031] The self-encapsulated RF functional circuit module of the present invention utilizes a closed cavity formed by laminating and solidifying multiple metal sheets after patterning. This self-encapsulation is achieved by loading a micro-coaxial structure with a three-dimensional electromagnetic bandgap structure. Signals between components are transmitted using vertical waveguides, and metal micro-coaxial probes achieve broadband, low-loss signal transmission and conversion in the horizontal-vertical-horizontal direction. This device features a compact structure, a small unit volume, a simple packaging method, and low processing costs. It is suitable for multi-channel layouts or array expansion, and has practical value in terahertz communication systems.

[0032] In the present invention, taking the D-band 4×2 receiving array as an example, Figure 1 As shown, the terahertz miniaturized multi-channel receiving front end based on metal sheet stacking and self-packaging is composed of terahertz miniaturized receiving units arranged in an array on a plane. Its overall main structure includes: a low-noise amplifier module 1, a down-conversion module 2, a frequency-doubling amplifier module 3, a bottom fixed substrate 4, a PCB power supply board 5, an LO input SMP connector 6, and an IF output SMP connector 7. Among them, the low-noise amplifier module 1, the down-conversion module 2, and the frequency-doubling amplifier module 3 constitute the three main components of the radio frequency functional circuit module. A terahertz miniaturized receiving unit can include only the radio frequency functional circuit module, the LO input SMP connector 6, and the IF output SMP connector 7, or it can further include a bottom fixed substrate 4 and a PCB power supply board 5. That is, the bottom fixed substrate 4 and PCB power supply board 5 can be shared parts, or each receiving unit can use an independent bottom fixed substrate 4 and PCB power supply board 5.

[0033] The various components of the RF functional circuit module of the present invention are located on a bottom fixed substrate 4. Each component is constructed from multiple stacked metal sheets in a self-encapsulated package. The LO signal is fed into the module through the LO input SMP connector 6, and the IF signal, generated by the downconversion module 2 after downconversion, is fed out through the IF output SMP connector 7.

[0034] Figure 2 This is a cross-sectional view of the geometric center of the terahertz miniaturized multi-channel receiving front-end unit. Through the structural section, the composition and internal structure of the self-packaged RF functional circuit module of each metal sheet stacked in the receiving unit can be clearly seen, and the transmission channel and energy flow of the terahertz signal are clarified. The terahertz miniaturized receiving unit in this embodiment is composed of 22 layers of self-packaged metal sheets, and the multiple layers of metal sheets are fixed to the bottom fixed substrate 4. In this embodiment, the low-noise amplification module 1 includes 7 layers of first metal sheets with a thickness of 0.2 mm, and the total thickness of the module is 1.4 mm; the down-conversion module 2 includes 9 layers of second metal sheets with a thickness of 0.2 mm, and the total thickness of the module is 1.8 mm; the frequency multiplication amplification module 3 includes 6 layers of third metal sheets with a thickness of 0.3 mm, and the total thickness of the module is 1.8 mm.

[0035] Figure 3 The following is a schematic diagram of the structure of the low-noise amplifier module 1. The seven layers of first metal plates forming the self-encapsulation module are, from top to bottom, first metal plate A101, first metal plate B102, first metal plate C103, first metal plate D104, first metal plate E105, first metal plate F106, and first metal plate G107. Each metal plate is provided with first periodically sliding symmetric holes 110 to form a three-dimensional electromagnetic bandgap structure, effectively preventing electromagnetic wave leakage. In this embodiment, first metal plate A101 is the topmost metal plate, and first metal plate G107 is the bottommost metal plate. In this embodiment, first metal plate D104 is the middle metal plate, serving as the chip encapsulation layer. The LNA chip 108 and LNA peripheral power supply circuit 109 are mounted on the first metal plate D104. A first WR-6 standard rectangular waveguide port 111 with a cross-sectional dimension of 1.651 mm x 0.8255 mm is reserved on both the first metal plate A101 and the first metal plate G107. Specifically, in this embodiment, a metal micro-coaxial structure is provided on the first metal plate D104, creating a cavity for the LNA chip 108 and the LNA peripheral power supply circuit 109. The LNA chip 108 transmits signals to the metal micro-coaxial structure on the first metal plate D104 via gold bonding wires, enabling vertical-horizontal-vertical transmission of terahertz signals. The LNA peripheral power supply circuit 109 provides a DC bias for the LNA chip 108.

[0036] In this embodiment, the first periodic sliding symmetrical holes 110 provided on each metal sheet are circular holes with a diameter of 0.9 mm, an arrangement period in the x and y directions of the holes is 1.8 mm, and the operating frequency band is the D band (110 GHz-170 GHz).

[0037] Figure 4 This is a schematic diagram of the structure of the downconversion module 2. The nine layers of second metal sheets forming the self-encapsulation module are, from top to bottom, second metal sheet A201, second metal sheet B202, second metal sheet C203, second metal sheet D204, second metal sheet E205, second metal sheet F206, second metal sheet G207, second metal sheet H208, and second metal sheet I209. Each metal sheet is provided with second periodically sliding symmetric holes A212 and second periodically sliding symmetric holes B213 to form a three-dimensional electromagnetic bandgap structure, effectively preventing electromagnetic wave leakage. The second periodically sliding symmetric holes A212 and second periodically sliding symmetric holes B213 have different operating frequency bands. In this embodiment, second metal sheet A201 is the topmost metal sheet, and second metal sheet I209 is the bottommost metal sheet. In this embodiment, second metal sheet F206 is the middle metal sheet, serving as the chip encapsulation layer. The mixer chip 210 and the mixer intermediate frequency signal transmission line 211 are mounted on the second metal plate F206. A second WR-6 standard rectangular waveguide port 214 with a cross-sectional dimension of 1.651 mm × 0.8255 mm is reserved on the second metal plate A201. A WR-12 standard rectangular waveguide port 215 with a cross-sectional dimension of 3.099 mm × 1.549 mm is reserved on the second metal plate I209. Specifically, in this embodiment, a metal micro-coaxial structure is disposed on the second metal plate F206, with a cavity structure reserved for the mixer chip 210 and the mixer intermediate frequency signal transmission line 211. The mixer chip 210 introduces the RF and LO signals into the metal micro-coaxial structure on the second metal plate F206 via gold bonding wires, completing the vertical-horizontal-vertical transmission of the terahertz signal. The IF signal is output to the IF output SMP connector 7 via the mixer intermediate frequency signal transmission line 211.

[0038] In this embodiment, the second periodically sliding symmetric holes A212 provided on each metal plate are circular holes with a diameter of 0.9 mm and a periodicity of 1.8 mm in the x- and y-directions. The second periodically sliding symmetric holes B213 are circular holes with a diameter of 1.35 mm and a periodicity of 2.7 mm in the x- and y-directions. The second periodically sliding symmetric holes A212 operate in the D-band (110-170 GHz), while the second periodically sliding symmetric holes B213 operate in the E-band (60-90 GHz).

[0039] Figure 5This is a schematic diagram of the structure of the frequency multiplication and amplification module 3. The six layers of third metal sheets forming the self-encapsulation module are, from top to bottom, third metal sheet A301, third metal sheet B302, third metal sheet C303, third metal sheet D304, third metal sheet E305, and third metal sheet F306. Each metal sheet is provided with third periodically sliding symmetric holes 311, forming a three-dimensional electromagnetic band gap structure that effectively prevents electromagnetic wave leakage. In this embodiment, third metal sheet A301 is the topmost metal sheet, and third metal sheet F306 is the bottommost metal sheet. In this embodiment, third metal sheet C303 is the middle metal sheet, serving as the chip encapsulation layer. The amplifier chip 307, frequency multiplier chip 308, frequency multiplier input circuit board 309, and amplifier peripheral circuitry 310 are mounted on the third metal plate A301. A first WR-12 standard rectangular waveguide port 312 with a cross-sectional size of 3.099 mm x 1.549 mm is reserved on the third metal plate A301. Specifically, in this embodiment, a metal micro-coaxial structure is mounted on the third metal plate C303, which contains a cavity structure for housing the amplifier chip 307, frequency multiplier chip 308, frequency multiplier input circuit board 309, and amplifier peripheral power supply circuitry 310. The amplifier chip 307 and the frequency multiplier chip 308 introduce the signal into the metal micro-coaxial structure on the third metal plate C303 through gold bonding wires, realizing the vertical-horizontal transmission of the terahertz signal; the frequency multiplier input signal is fed from the LO input SMP connector 6 and fed into the frequency multiplier chip 308 through the frequency multiplier input circuit board 309; the amplifier peripheral power supply circuit 310 provides DC bias for the amplifier chip 307.

[0040] In this embodiment, the third periodic sliding symmetrical holes 311 are circular holes with a diameter of 1.35 mm, an arrangement period of 2.7 mm in the x and y directions, and an operating frequency band of the E band (60-90 GHz).

[0041] Figure 6 Figure 4 shows the structure of the bottom fixed substrate 4. Pins 8 secure the bottom fixed substrate 4 to the upper layer of the self-encapsulated multi-layer metal plate structure and secure the PCB power supply board 55 on the back. Glass insulators 9 connect the PCB power supply board 5 to the peripheral power supply circuit of the upper self-encapsulated module, enabling DC bias feed input. The back of the bottom fixed substrate secures the LO input SMP connector 6 and the IF output SMP connector 7.

[0042] Figure 7 、 Figure 8 The S parameter simulation results of the micro-coaxial structure loaded with a three-dimensional electromagnetic band gap structure are shown in Figure 2. Figure 7 The S-parameter simulation results of the D-band micro-coaxial structure show that the return loss is better than 15dB and the insertion loss is better than 0.7dB within the range of 110GHz-170GHz. Figure 8The S-parameter simulation results for the E-band micro-coaxial structure show that the return loss is better than 15dB and the insertion loss is better than 0.6dB in the 60GHz-90GHz range. These simulation results demonstrate that the micro-coaxial structure loaded with a 3D electromagnetic bandgap structure exhibits wide operating bandwidth and low loss within the operating frequency band.

[0043] Figure 9 This is the simulation result of the receiver front-end conversion loss. In this embodiment, the receiver front-end RF operating frequency range covers 120GHz-160GHz. The frequency multiplication and amplification module generates a local oscillator drive signal from 60GHz to 75GHz with a signal power better than 10dBm. This signal is fed into the down-conversion module for harmonic mixing, and the output intermediate frequency signal operates from DC to 10GHz. According to the simulated conversion loss, it is better than 15dB in the 120GHz-160GHz range, demonstrating the characteristics of compact integration, broadband, and low conversion loss.

[0044] In the above embodiment, the terahertz miniaturized multi-channel receiving front end is composed of 8 receiving units distributed in an array in a plane. The overall size of the array unit excluding the RF connector is 30mm×20mm×10mm, and the size of the 8-channel receiving front end is 60mm×80mm×10mm, showing the advantages of small size, high integration, and easy arraying; the core components of the terahertz miniaturized multi-channel receiving front end are self-packaged by multi-layer metal sheets, and the entire complex cavity structure and corresponding functional circuits are layered designed based on the stacking and segmentation method. By loading the stacked metal sheet micro-coaxial structure with a three-dimensional electromagnetic band gap structure, broadband, low-loss transmission and conversion of terahertz signals in the horizontal-vertical-horizontal directions are realized, thereby realizing a compact and miniaturized integrated design.

[0045] Finally, it should be noted that the purpose of disclosing the embodiments is to facilitate a further understanding of the present invention. However, those skilled in the art will appreciate that various substitutions and modifications are possible without departing from the spirit and scope of the present invention and the appended claims. Therefore, the present invention should not be limited to the contents disclosed in the embodiments; the scope of protection claimed by the present invention shall be determined by the scope defined in the claims.

Claims

1. A terahertz miniaturized multi-channel receiving front end with a metal sheet stacked and self-encapsulated structure, which is composed of terahertz miniaturized receiving units arranged in an array on a plane, characterized in that: The miniaturized terahertz receiving unit includes a radio frequency functional circuit module, a bottom fixed substrate, a PCB power supply board and a radio frequency connector; wherein the radio frequency functional circuit module is composed of a self-encapsulated stack of metal sheets, and includes three components: a low-noise amplifier module, a down-conversion module and a frequency multiplication amplifier module. The three components are fixed on the bottom fixed substrate from top to bottom according to the link sequence of the receiving front end, and the PCB power supply board and the radio frequency connector are both installed on the back of the bottom fixed substrate.

2. The metal sheet stacked self-packaged terahertz miniaturized multi-channel receiving front end according to claim 1, characterized in that: The devices in the radio frequency functional circuit module are stacked in three dimensions to form a compact integrated structure in the vertical direction. The signal transmission between the various components of the radio frequency functional circuit module adopts a vertical waveguide transmission line, and the broadband, low-loss transmission conversion of the signal in the horizontal-vertical-horizontal direction is completed through a metal micro-coaxial probe.

3. The metal sheet stacked self-packaged terahertz miniaturized multi-channel receiving front end according to claim 1 or 2, characterized in that: The components of the radio frequency functional circuit module are formed by processing patterns on multiple metal sheets and then stacking and solidifying them to form a closed cavity, and self-encapsulation is achieved by loading a metal micro-coaxial structure with a three-dimensional electromagnetic band gap structure.

4. The metal sheet stacked self-packaged terahertz miniaturized multi-channel receiving front end according to claim 3, characterized in that: The thickness t of the metal sheet is selected to be 1 / 8λ0 to 1 / 4λ0, where λ0 is the wavelength corresponding to the working frequency band of the multi-channel receiving front end.

5. The metal sheet stacked self-packaged terahertz miniaturized multi-channel receiving front end according to claim 3, characterized in that: The low-noise amplifier module is a self-packaged module formed by stacking and solidifying multiple layers of metal sheets, with an LNA chip disposed in the middle metal sheet. Each metal sheet is loaded with periodically sliding symmetrical holes as a three-dimensional electromagnetic bandgap structure to prevent electromagnetic wave leakage and increase the operating bandwidth. Standard rectangular waveguide ports are reserved on both the top and bottom metal sheets for vertical signal transmission and interconnection between components. The LNA chip introduces signals into the metal micro-coaxial structure of the middle metal sheet via gold bonding wires, achieving vertical-horizontal-vertical transmission of terahertz signals.

6. The metal sheet stacked self-packaged terahertz miniaturized multi-channel receiving front end according to claim 3, characterized in that: The down-conversion module is a self-packaged module formed by stacking and solidifying multiple layers of metal sheets. The mixer chip and mixer intermediate frequency signal transmission line are arranged on the middle metal sheet. Each metal sheet is loaded with periodically sliding symmetrical holes as a three-dimensional electromagnetic bandgap structure to prevent electromagnetic wave leakage and increase the operating bandwidth. Standard rectangular waveguide ports are reserved on the top and bottom metal sheets for vertical signal transmission and interconnection between components. The mixer chip introduces RF and LO signals into the metal micro-coaxial structure of the middle metal sheet via gold bonding wires, completing the vertical-horizontal-vertical transmission of the terahertz signal. The IF signal is output from the IF output SMP connector in the RF connector via the mixer intermediate frequency signal transmission line.

7. The metal sheet stacked self-packaged terahertz miniaturized multi-channel receiving front end according to claim 3, characterized in that: The frequency multiplication amplification module is formed by stacking and solidifying multiple layers of metal sheets to form a self-packaged module. The amplifier chip and the frequency multiplier chip are arranged on the middle layer of metal sheets. Each metal sheet is loaded with periodic sliding symmetrical holes as a three-dimensional electromagnetic bandgap structure to prevent electromagnetic wave leakage and increase the operating bandwidth. A standard rectangular waveguide port is reserved on the top metal sheet for vertical signal transmission and interconnection between components. The amplifier chip and the frequency multiplier chip introduce the signal into the metal micro-coaxial structure of the middle layer of metal sheets through gold wire bonding lines to realize the vertical-horizontal transmission of terahertz signals. The frequency multiplier input signal is fed into the LO input SMP connector of the RF connector.

8. The metal sheet stacked self-packaged terahertz miniaturized multi-channel receiving front end according to claim 1, characterized in that: The bottom fixed substrate is fixed with metal pins and fixed holes to fix the metal sheets of each component of the radio frequency functional circuit module arranged in a chain sequence above; the radio frequency connector and the PCB power supply board are fixed on the back, which are respectively connected to the functional circuits of the corresponding layers; the bottom fixed substrate is a solid material.

9. The metal sheet stacked self-packaged terahertz miniaturized multi-channel receiving front end according to claim 1, characterized in that: The PCB power supply board includes a low-noise amplifier and its power supply circuit, which is connected to the corresponding chip power supply peripheral circuit on the upper layer through a glass insulator and performs power supply control.

10. A method for realizing a terahertz miniaturized multi-channel receiving front end with a metal sheet stacking self-packaged, characterized in that: The implementation method includes: 1) Preparing multiple metal sheets, processing patterns on the metal sheets and loading periodically sliding symmetrical holes to form a three-dimensional electromagnetic bandgap structure, using a stacking and solidification method to form a closed cavity to achieve self-encapsulation of the radio frequency functional circuit module, and reserving standard rectangular waveguide ports on the top metal sheet and / or the bottom metal sheet of each component; the internal chip of each component introduces the signal into the metal micro-coaxial structure of the intermediate metal sheet through gold wire bonding; 2) According to the link sequence of the receiving front end, the components of the radio frequency functional circuit module are stacked three-dimensionally from top to bottom and fixed on the bottom fixed substrate, forming a compact and integrated terahertz miniaturized receiving unit in the vertical direction; wherein, the signal transmission between the components of the radio frequency functional circuit module adopts a vertical waveguide transmission line, and the internal chip introduces the signal into the metal micro-coaxial probe of the intermediate metal plate through the gold wire bonding line, completing the broadband, low-loss transmission conversion of the signal in the horizontal-vertical-horizontal direction; the terahertz RF signal enters the receiving front end through the standard rectangular waveguide port on the top layer, and the IF signal after processing by the low-noise amplification module and the down-conversion module is output from the IF output SMP connector; the LO signal is fed from the LO input SMP connector and fed into the down-conversion module through the frequency multiplication amplification module; 3) Arrange several terahertz miniaturized receiving units in an array on a plane to form a multi-channel communication front-end system.

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