Automatic board separating method and apparatus for circuit board

Abstract

This invention relates to the field of circuit board depaneling technology, specifically an automated circuit board depaneling method and equipment, comprising the following steps: introducing nitrogen gas into a sealed processing chamber to maintain an oxygen concentration ≤100ppm and a humidity of 40~60%RH; using a multi-axis robotic arm to drive a composite milling cutter to cut the circuit board along a V-cut line, with the vibration amplitude of the cutting area monitored in real time as <5μm; simultaneously spraying argon-oxygen mixed plasma onto the cutting surface during the cutting process, with the argon-oxygen mixed plasma flow covering a temperature of 100~150℃; after depaneling, the burr height of the circuit board edge is ≤5μm, and the surface roughness Ra is ≤0.8μm. This invention achieves high quality and high efficiency in automated circuit board depaneling, meeting the stringent requirements of modern circuit board manufacturing for depaneling processes.

Description

Technical Field

[0001] This invention relates to the field of circuit board separation technology, and in particular to an automatic circuit board separation processing method and equipment. Background Technology

[0002] In the electronics manufacturing industry, circuit board separation is a crucial process. As electronic products continue to evolve towards miniaturization and integration, increasingly higher demands are placed on the precision, efficiency, and quality of circuit board separation. Currently, separation machines are widely used equipment in the circuit board separation process. Traditional separation machines typically use mechanical cutters or lasers to cut and separate circuit boards. However, these machines suffer from instability in practical applications. While existing laser separation machines offer high precision, they are easily affected by external factors during the cutting process, such as changes in temperature and humidity, which can cause instability in laser energy and focusing, thus impacting the separation quality.

[0003] Furthermore, the depaneled circuit boards often require further processing. Because the depaneling process generates burrs and residue, which can negatively impact the circuit board's performance and subsequent assembly, additional plasma equipment is needed to treat the depaneled boards to remove burrs and clean the surface. This separation of depaneling from subsequent processing equipment not only increases equipment costs and floor space but also necessitates transferring the circuit boards between different devices, significantly impacting production efficiency and extending the production cycle. Summary of the Invention

[0004] To address the aforementioned problems, this invention provides a high-quality and high-efficiency automatic circuit board separation process, which meets the stringent requirements of modern circuit board manufacturing for separation processing.

[0005] The technical solution adopted in this invention is: an automatic circuit board separation processing method, comprising the following steps: nitrogen gas is introduced into a sealed processing chamber to maintain an oxygen concentration ≤100ppm and a humidity of 40~60%RH; a multi-axis robotic arm drives a composite milling cutter to cut the circuit board along the V-cut line, and the vibration amplitude of the cutting area is monitored in real time to be <5μm; during the cutting process, argon-oxygen mixed plasma is simultaneously sprayed onto the cutting surface, and the argon-oxygen mixed plasma flow covers a temperature of 100~150℃; after separation, the burr height of the circuit board edge is ≤5μm, and the surface roughness Ra is ≤0.8μm.

[0006] A further improvement to the above scheme is that the composite milling cutter includes a milling cutter body, a main cutting edge disposed at the milling end of the milling cutter body, and micro secondary cutting edges. The main cutting edge is a helical cutting edge, and multiple of them are disposed in a ring and evenly distributed at the milling end of the milling cutter body. The micro secondary cutting edges are distributed at intervals with the main cutting edge.

[0007] A further improvement to the above scheme is that the helix angle of the main cutting edge is 35°±2°, the rake angle is 12°~15°, and the clearance angle is 8°~10°; the micro secondary cutting edge is distributed with a 0.2mm interval from the main cutting edge.

[0008] A further improvement to the above scheme is that the top of the micro-sub-blade is a spherical surface; micro-grooves are provided on the spherical surface, and the micro-grooves are used to break up the copper foil burrs generated by the cutting.

[0009] A further improvement to the above scheme is that a cooling channel is provided inside the milling cutter body, and the cooling channel is used to introduce liquid carbon dioxide at a temperature of -20℃ to -10℃, with a flow rate of 15±2mL / min.

[0010] A further improvement to the above scheme is that the argon-oxygen mixed plasma is composed of 70% argon and 30% oxygen, with a radio frequency power of 500W±50W, a jet speed of 20~30m / s, and a jet direction forming an angle of 25°±5° with the normal of the cutting surface.

[0011] A further improvement to the above scheme is that the jetting area of ​​the argon-oxygen mixed plasma covers a range of 3mm before and after the cutting trajectory, and the temperature of the cutting surface is fed back in real time by an infrared thermal imager to dynamically adjust the plasma power.

[0012] A further improvement to the above scheme is that a negative pressure adsorption stage is set in the sealed processing cavity, with an adsorption force of 0.3-0.5MPa, an adsorption hole diameter of 0.1mm, and a spacing of 2mm, so that the local deformation of the circuit board is ≤0.05mm.

[0013] A further improvement to the above solution is that the negative pressure adsorption stage has a built-in piezoelectric sensor to monitor the cutting force fluctuation in real time. When the cutting force changes by ≥10N, the multi-axis robotic arm is triggered to decelerate.

[0014] A further improvement to the above scheme is to perform laser scanning after cutting, and to initiate secondary plasma finishing for areas where the burr height exceeds the preset value. The finishing process uses pure argon plasma.

[0015] An automatic board separation device for realizing an automatic board separation process includes a sealed processing chamber, a multi-axis robotic arm, and a multi-sensor feedback system. The sealed processing chamber includes a nitrogen circulation system and a humidity controller. The nitrogen circulation system is used to fill the sealed processing chamber with nitrogen and for nitrogen circulation. The humidity controller is used to sense and control the humidity of the sealed processing chamber. The drive end of the multi-axis robotic arm is equipped with a composite milling cutter and a plasma spray gun. The multi-axis robotic arm is equipped with a drive spindle. The composite milling cutter is mounted on the drive spindle, and the plasma spray gun is located on one side of the drive spindle. The multi-sensor feedback system includes a vibration sensor and an infrared thermal imager. The vibration sensor is mounted on the negative pressure adsorption stage to sense the vibration amplitude of the cutting area. The infrared thermal imager is used to provide real-time feedback of the cutting surface temperature to dynamically adjust the plasma power. The distance between the plasma spray gun and the composite milling cutter is 2~3mm, and the angle of the plasma spray gun is dynamically controlled by a servo motor.

[0016] The beneficial effects of this invention are:

[0017] Compared to existing circuit board separation methods, this invention introduces nitrogen gas into a sealed processing chamber and strictly controls oxygen concentration and humidity, effectively preventing oxidation and moisture absorption of the circuit board during separation. The low-oxygen environment (≤100ppm) avoids oxidation of metal circuits and components, ensuring long-term stability and reliability. A suitable humidity range of 40-60%RH prevents short circuits caused by excessive humidity or static electricity caused by excessively low humidity, providing excellent environmental conditions for circuit board processing. A multi-axis robotic arm drives a composite milling cutter to cut the circuit board along a V-cut line, with real-time monitoring of vibration amplitude in the cutting area to ensure it is <5μm. This high-precision cutting method not only improves accuracy but also avoids cutting deviations and circuit damage caused by excessive vibration. The flexibility of the multi-axis robotic arm allows for precise control of the cutting path, ensuring both separation quality and efficiency. During the cutting process, argon-oxygen mixed plasma is simultaneously injected onto the cutting surface, with its flow coverage temperature controlled between 100-150℃. Argon-oxygen hybrid plasma can efficiently clean and treat cut surfaces, removing impurities and residues generated during the cutting process, while improving the microstructure and surface quality. A suitable temperature range helps the plasma achieve optimal results, avoiding damage to the circuit board due to excessive heat or ineffective cleaning due to insufficient temperature. After separation, the burr height of the circuit board edge is ≤5μm, and the surface roughness Ra is ≤0.8μm, achieving high-quality separation results. Low burr height and surface roughness ensure neat and flat circuit board edges, facilitating subsequent assembly and use, and reducing potential malfunctions and safety hazards caused by burrs and rough surfaces.

[0018] An automated board separation device for an automated circuit board separation process features several key environmental control features. A nitrogen circulation system within the sealed processing chamber fills and circulates nitrogen, effectively reducing oxygen concentration and preventing oxidation of the circuit boards during processing, thus ensuring their performance and stability. A humidity controller senses and controls the humidity within the chamber, maintaining it within a suitable range to prevent excessively high or low humidity from affecting circuit board quality and creating favorable environmental conditions for processing. The multi-axis robotic arm design significantly enhances processing flexibility and precision. Its drive end is equipped with a composite milling cutter and a plasma spray gun. The composite milling cutter, driven by the spindle, precisely cuts the circuit board along a preset path. The plasma spray gun, located on one side of the spindle and spaced 2-3 mm from the composite milling cutter, can simultaneously treat the cut surface. Furthermore, the angle of the plasma spray gun is dynamically controlled by a servo motor, allowing adjustment of the spray angle according to actual processing needs to ensure optimal treatment of the cut surface. A multi-sensor feedback system provides real-time monitoring and dynamic adjustment capabilities for the processing process. A vibration sensor is installed on the negative pressure adsorption stage to detect the vibration amplitude in the cutting area. If the vibration amplitude becomes abnormal, timely adjustments can be made to ensure the stability and precision of the cutting process. An infrared thermal imager provides real-time feedback on the cutting surface temperature and dynamically adjusts the plasma power accordingly, ensuring the temperature remains within a suitable range. This guarantees the effectiveness of the plasma treatment while preventing damage to the circuit board due to excessive heat. This invention achieves high-quality and high-efficiency automated circuit board separation, meeting the stringent requirements of modern circuit board manufacturing for this process. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the automatic plate separating equipment of the present invention;

[0020] Figure 2 for Figure 1 A schematic diagram of the negative pressure adsorption table in an automatic plate separating machine;

[0021] Figure 3 A schematic diagram of the structure of the composite milling cutter.

[0022] Figure 4 for Figure 3 Sectional view of AA;

[0023] Figure 5 for Figure 4 Enlarged diagram of point A in the diagram;

[0024] Figure 6 This is a flowchart illustrating the automatic circuit board separation process of the present invention.

[0025] Explanation of reference numerals in the attached drawings: 1. Sealed machining chamber; 11. Negative pressure adsorption stage; 111. Piezoelectric sensor; 112. Vibration sensor; 12. Nitrogen circulation system; 13. Humidity controller; 2. Multi-axis robotic arm; 3. Composite milling cutter; 31. Milling cutter body; 311. Cooling channel; 32. Main cutting edge; 33. Micro secondary cutting edge; 33. Spherical surface; 331. Micro groove; 332. Plasma spray gun; 4. Infrared thermal imager; 5. Detailed Implementation

[0026] To facilitate understanding of the present invention, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of the invention are shown in the drawings. However, the invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of the invention.

[0027] It should be noted that when a component is said to be "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Figures 1-6As shown, in one embodiment of the present invention, an automatic circuit board separation processing method is disclosed, comprising the following steps: nitrogen gas is introduced into a sealed processing chamber 1 to maintain an oxygen concentration ≤100ppm and a humidity of 40~60%RH; a multi-axis robotic arm 2 drives a composite milling cutter 3 to cut the circuit board along a V-cut line, with the vibration amplitude of the cutting area monitored in real time as <5μm; during the cutting process, argon-oxygen mixed plasma is simultaneously sprayed onto the cutting surface, with the argon-oxygen mixed plasma flow covering a temperature of 100~150℃; after separation, the burr height of the circuit board edge is ≤5μm, and the surface roughness Ra is ≤0.8μm. The present invention introduces nitrogen gas into the sealed processing chamber 1 and strictly controls the oxygen concentration and humidity, effectively preventing the circuit board from being oxidized and damp during the separation process. The low-oxygen environment with an oxygen concentration ≤100ppm avoids oxidation of the metal circuits and components on the circuit board, ensuring the long-term stability and reliability of the circuit board. The suitable humidity range of 40~60%RH prevents short circuits caused by excessive humidity or static electricity problems caused by excessively low humidity, providing favorable environmental conditions for circuit board processing. A multi-axis robotic arm 2 drives a composite milling cutter 3 to cut circuit boards along a V-cut line, and the vibration amplitude of the cutting area is monitored in real time to ensure that the vibration amplitude is <5μm. This high-precision cutting method not only improves cutting accuracy but also avoids cutting deviations and circuit damage caused by excessive vibration. The flexibility of the multi-axis robotic arm 2 allows for precise control of the cutting path, ensuring the quality and efficiency of board separation. During the cutting process, argon-oxygen mixed plasma is simultaneously sprayed onto the cutting surface, and its flow coverage temperature is controlled between 100~150℃. The argon-oxygen mixed plasma can efficiently clean and treat the cutting surface, removing impurities and residues generated during cutting, while improving the microstructure and surface quality. A suitable temperature range helps the plasma achieve optimal results, avoiding damage to the circuit board due to excessively high temperatures or ineffective cleaning due to excessively low temperatures. After separation, the burr height at the circuit board edge is ≤5μm, and the surface roughness Ra is ≤0.8μm, achieving a high-quality separation effect. Low burr height and surface roughness ensure that the edges of the circuit board are neat and flat, which is beneficial for subsequent assembly and use, and reduces the failures and safety hazards that may be caused by burrs and rough surfaces.

[0029] The composite milling cutter 3 includes a cutter body 31, a main cutting edge 32 disposed at the milling end of the cutter body 31, and micro-sub-edges 33. The main cutting edge 32 is a helical cutting edge, with multiple edges evenly distributed in a ring at the milling end of the cutter body 31. The micro-sub-edges 33 are spaced apart from the main cutting edge 32. In this embodiment, from the perspective of cutting capability, the helical cutting edge 32, with multiple edges evenly distributed in a ring at the milling end of the cutter body 31, enables the milling cutter to achieve continuous and efficient cutting when cutting circuit boards. The helical cutting edge can effectively disperse the cutting force during the cutting process, reducing the resistance during cutting and reducing vibration during the cutting process. Combined with the multi-axis robotic arm 2 driving the composite milling cutter 3 to cut along the V-cut line, and the vibration sensor monitoring the vibration amplitude of the cutting area in real time, the vibration control requirements can be better met, ensuring the stability and accuracy of cutting. The spaced distribution of the micro-sub-edges 33 with the main cutting edge 32 can further optimize the cutting effect. After the main cutting edge 32 completes its primary cutting task, the micro-sub-edge 33 performs fine finishing on the cut surface, reducing burrs on the edges of the circuit board after cutting. The burr height on the circuit board edges after separation must be ≤5μm. The presence of the micro-sub-edge 33 helps to meet this stringent standard, resulting in cleaner circuit board edges. During the cutting process, the main cutting edge 32 and the micro-sub-edge 33 work together to reduce the roughness of the cut surface, meeting the requirement of surface roughness Ra≤0.8μm, providing a good foundation for the subsequent use and assembly of the circuit board.

[0030] The main cutting edge 32 has a helix angle of 35°±2°, a rake angle of 12°~15°, and a clearance angle of 8°~10°. The micro-sub-edges 33 are distributed 0.2mm apart from the main cutting edge 32. Specifically, the top of the micro-sub-edges 33 is a spherical surface 331; micro-grooves 332 are provided on the spherical surface 331, and the micro-grooves 332 are used to break up the copper foil burrs generated during cutting. In this embodiment, the helix angle of the main cutting edge 32 is 35°±2°. The helix angle design enables the milling cutter to more effectively disperse the cutting force during the cutting process, reduce the resistance during cutting, and enhance the chip removal capability. Combined with the cutting environment in the closed machining cavity 1, the smoothness of the cutting process can be guaranteed, and the damage to the cutting surface caused by poor chip removal can be reduced. The rake angle is set at 12°~15° and the clearance angle is 8°~10°. This angle combination can optimize the friction and heat generation during the cutting process. A smaller clearance angle increases the cutting edge strength, ensuring less wear during circuit board cutting and extending the milling cutter's lifespan; a suitable rake angle makes cutting smoother and improves cutting efficiency. The micro-sub-edge 33 is spaced 0.2mm apart from the main cutting edge 32, allowing for timely fine finishing of the cut surface after the main cutting edge 32 completes its primary cut. The micro-sub-edge 33 has a spherical surface 331 at its top, with micro-grooves 332 on it, effectively breaking up copper foil burrs generated during cutting. In circuit board separation processing, the burr height at the edge of the separated circuit board must be ≤5μm to ensure a smoother and flatter edge.

[0031] The milling cutter body 31 has an internal cooling channel 311 for introducing liquid carbon dioxide at a temperature of -20°C to -10°C at a flow rate of 15±2 mL / min. In this embodiment, for temperature control, the liquid carbon dioxide at -20°C to -10°C introduced into the cooling channel 311 effectively removes the large amount of heat generated by the composite milling cutter 3 during circuit board cutting. High temperatures are generated during cutting due to friction between the cutter and the circuit board, which may cause deformation and delamination of the circuit board material, affecting its performance and quality. This cooling system keeps the temperature of the cutting area at a low level, ensuring the stability of the circuit board material and preventing damage caused by excessive temperature.

[0032] The main cutting edge 32 in the above embodiment is made of ultra-fine grain cemented carbide with a composition of WC-10%Co and a grain size of 0.2μm. It has a hardness of ≥92.5 HRA, a bending strength of 4500MPa, high wear resistance and impact toughness, and is suitable for high-speed cutting of FR4 / metal substrates.

[0033] The micro-sub-blade 33 has a base material of metal ceramic, TiCN-Ni-Mo (Ni content 8%), a hardness of 91.5 HRA, and a coefficient of friction of 0.25, which reduces copper foil adhesion; it is used for fine burr trimming.

[0034] The above embodiments are implemented under the conditions shown in the table below:

[0035]

[0036] The following table compares the cutting quality:

[0037]

[0038] The tool life and thermal management effect are shown in the table below:

[0039]

[0040] The effect of the microgroove 332 parameters on burr height is shown in the table below:

[0041]

[0042] The argon-oxygen mixed plasma consists of 70% argon and 30% oxygen, with a radio frequency power of 500W±50W, a jet velocity of 20~30m / s, and a jet direction forming a 25°±5° angle with the normal to the cutting surface. Specifically, the jet area of ​​the argon-oxygen mixed plasma covers a 3mm range before and after the cutting trajectory, and the plasma power is dynamically adjusted based on real-time feedback of the cutting surface temperature using an infrared thermal imager. In this embodiment, from a material processing perspective, the argon-oxygen mixed plasma, composed of 70% argon and 30% oxygen, can effectively treat the cutting surface. Argon has stable chemical properties and can act as a carrier and protective gas to prevent excessive oxidation of the cutting surface; oxygen has strong oxidizing properties and can react with and remove organic residues generated during the cutting process, thereby cleaning the cutting surface and improving its quality. In terms of energy control, the radio frequency power of 500W±50W provides stable and suitable energy for the plasma. This power range allows the plasma to have sufficient activity to effectively treat the cutting surface while avoiding damage to the circuit board due to excessive power. A jet velocity of 20-30 m / s ensures the plasma reaches the cutting surface promptly and takes effect. A suitable jet velocity allows for full contact between the plasma and the cutting surface, improving processing efficiency. An angle of 25°±5° between the jet direction and the normal to the cutting surface, along with a 3mm coverage area before and after the cutting trajectory, ensures complete plasma coverage of the cutting surface, providing uniform treatment and preventing incomplete treatment. Infrared thermal imagers provide real-time feedback on the cutting surface temperature to dynamically adjust the plasma power, allowing for energy adjustments based on the actual conditions of the cutting surface. During the cutting process, temperatures may vary in different areas; real-time temperature monitoring and dynamic power adjustment ensure optimal processing results under various conditions, improving the quality and stability of circuit board depaneling.

[0043] The above embodiments are implemented under the conditions shown in the table below:

[0044]

[0045] The table below compares the effects of different plasma treatments:

[0046]

[0047] The effects of dynamic power regulation are shown in the table below:

[0048]

[0049] The effect of different spray angles on the treatment effect is shown in the table below:

[0050]

[0051] The impact of the argon-oxygen ratio on key indicators is shown in the table below:

[0052]

[0053] Overall score = 0.4 × removal efficiency + 0.3 × (1 / oxidation weight gain) + 0.3 × (1 / resin damage)

[0054] A negative pressure adsorption platform 11 is installed inside the sealed processing chamber 1, with an adsorption force of 0.3-0.5 MPa, an adsorption hole diameter of 0.1 mm, and a spacing of 2 mm, ensuring that the local deformation of the circuit board is ≤0.05 mm. In this embodiment, from the perspective of fixing effect, the adsorption force is in the range of 0.3-0.5 MPa, which can provide sufficient and stable adsorption force for the circuit board, firmly fixing the circuit board to the adsorption platform. When the composite milling cutter 3 performs the cutting operation, a certain impact force and vibration will be generated. If the circuit board is not firmly fixed, displacement is likely to occur, resulting in cutting position deviation and affecting the separation accuracy. Stable adsorption force can effectively avoid this situation, ensuring that the cutting is carried out along the preset trajectory and improving the accuracy of separation. The design of adsorption hole diameter of 0.1 mm and spacing of 2 mm helps to achieve uniform adsorption. The uniformly distributed adsorption holes can make the adsorption force act evenly on the surface of the circuit board, avoiding deformation of the circuit board due to uneven local adsorption force. During the circuit board separation process, the flatness requirement of the circuit board is high, and the local deformation must be ≤0.05 mm. This design ensures the circuit board maintains good flatness during the adsorption process, reducing cutting errors caused by deformation and guaranteeing the quality of the cut surface. The negative pressure adsorption platform 11 within the sealed processing chamber 1 also reduces dust generation during processing. When the milling cutter cuts the circuit board, some dust particles are generated; the negative pressure adsorption effect can promptly adsorb these dust particles, maintaining a clean processing environment.

[0055] The negative pressure adsorption stage 11 incorporates a piezoelectric sensor 111 to monitor cutting force fluctuations in real time. When the cutting force suddenly changes by ≥10N, the multi-axis robotic arm 2 is triggered to reduce its speed. In this embodiment, the piezoelectric sensor 111 can accurately capture subtle changes in the cutting force during the cutting process. During circuit board separation, the cutting force should ideally be relatively stable. If fluctuations occur, it indicates a possible change in the cutting conditions, such as encountering special materials within the circuit board or uneven circuit distribution. Real-time monitoring allows for timely detection of these potential problems, providing a basis for subsequent adjustments. Triggering the multi-axis robotic arm to reduce its speed when the cutting force suddenly changes by ≥10N effectively protects the cutting tool and the circuit board. A sudden increase in cutting force indicates that the cutting tool has encountered significant resistance during cutting. If the robotic arm continues to operate at its original speed, it may lead to excessive wear or even damage to the cutting tool, and may also cause quality problems such as uneven cut surfaces and chipped edges on the circuit board. Timely reduction of the robotic arm speed allows the cutting tool to cope with resistance more smoothly, reducing tool wear and extending tool life. Moreover, after speed reduction, the cutting tool can handle the cutting situation more precisely, helping to improve the cutting quality of the circuit board and ensuring the smoothness and dimensional accuracy of the cut surface.

[0056] After cutting, laser scanning is performed. For areas where the burr height exceeds a preset value, a secondary plasma finishing process is initiated using pure argon plasma. In this embodiment, laser scanning can accurately detect burrs. After cutting, burrs may appear on the edge of the circuit board, with irregular height and distribution. Laser scanning can quickly and accurately detect the entire cut edge, precisely identifying areas where the burr height exceeds the preset value. This makes subsequent finishing work more targeted, avoiding blind processing and improving processing efficiency. The secondary plasma finishing process uses pure argon plasma, which can effectively remove burrs exceeding the standard. Pure argon plasma has high energy and stability, and during the finishing process, it can precisely act on the burr area, using the high-energy properties of plasma to melt or vaporize the burrs, thereby achieving the purpose of burr removal. This finishing method will not damage other parts of the circuit board, ensuring the overall quality of the circuit board. The finishing operation improves the quality and performance of the circuit board. The presence of burrs not only affects the appearance of the circuit board but may also cause problems such as short circuits and poor contact during subsequent use. By removing excessive burrs through secondary plasma finishing, the edges of the circuit board can be made smoother and neater, improving the electrical performance and stability of the circuit board and reducing the probability of failure.

[0057] like Figures 1-6As shown, an automatic board separation device for realizing an automatic board separation processing method for circuit boards includes a sealed processing chamber 1, a multi-axis robotic arm 2, and a multi-sensor feedback system. The sealed processing chamber 1 includes a nitrogen circulation system 12 and a humidity controller 13. The nitrogen circulation system 12 is used to fill the sealed processing chamber 1 with nitrogen and for nitrogen circulation. The humidity controller 13 is used to sense and control the humidity of the sealed processing chamber 1. The drive end of the multi-axis robotic arm 2 is equipped with a composite milling cutter 3 and a plasma spray gun 4. The multi-axis robotic arm 2 is equipped with a drive spindle 21. The composite milling cutter 3 is mounted on the drive spindle 21, and the plasma spray gun 4 is located on one side of the drive spindle 21. The multi-sensor feedback system includes a vibration sensor 112 and an infrared thermal imager 5. The vibration sensor 112 is mounted on the negative pressure adsorption stage 11 to sense the vibration amplitude of the cutting area. The infrared thermal imager 5 is used to provide real-time feedback of the cutting surface temperature to dynamically adjust the plasma power. The distance between the plasma spray gun 4 and the composite milling cutter 3 is 2~3mm, and the angle of the plasma spray gun 4 is dynamically controlled by a servo motor. In this embodiment, regarding environmental control, the nitrogen circulation system 12 of the sealed processing chamber 1 can fill the chamber with nitrogen and circulate it, effectively reducing the oxygen concentration inside the chamber and preventing the circuit board from being oxidized during processing, thus ensuring the performance and stability of the circuit board. The humidity controller 13 can sense and control the humidity inside the chamber, maintaining it within a suitable range to avoid affecting the quality of the circuit board due to excessively high or low humidity, creating favorable environmental conditions for processing. The design of the multi-axis robotic arm 2 greatly improves the flexibility and precision of processing. Its drive end is equipped with a composite milling cutter 3 and a plasma spray gun 4. The composite milling cutter 3 is driven by the drive spindle 21 and can accurately cut the circuit board along a preset path. The plasma spray gun 4 is located on one side of the drive spindle 21, with a distance of 2~3mm from the composite milling cutter 3, allowing for timely treatment of the cut surface while cutting. At the same time, the angle of the plasma spray gun 4 is dynamically controlled by a servo motor, which can adjust the spray angle according to actual processing needs to ensure the processing effect on the cut surface. The multi-sensor feedback system provides real-time monitoring and dynamic adjustment capabilities for the processing process. A vibration sensor 112 is installed on the negative pressure adsorption stage 11 to sense the vibration amplitude of the cutting area. If the vibration amplitude is abnormal, timely adjustments can be made to ensure the stability and precision of the cutting process. An infrared thermal imager 5 provides real-time feedback on the cutting surface temperature and dynamically adjusts the plasma power based on the temperature, ensuring the cutting surface temperature remains within a suitable range. This guarantees the plasma processing effect while preventing damage to the circuit board due to excessive temperature. This invention achieves high-quality and high-efficiency automatic circuit board separation processing, meeting the stringent requirements of modern circuit board manufacturing for separation processing.

[0058] The above embodiments merely illustrate several implementation methods of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this patent should be determined by the appended claims.

Claims

1. A method of automatically processing a circuit board, characterized by: Includes the following steps: Nitrogen gas is introduced into the sealed processing chamber to maintain an oxygen concentration of ≤100ppm and a humidity of 40~60%RH. A multi-axis robotic arm drives a composite milling cutter to cut circuit boards along the V-cut line, and the vibration amplitude of the cutting area is monitored in real time to be <5μm. During the cutting process, argon-oxygen mixed plasma is simultaneously injected onto the cutting surface, and the argon-oxygen mixed plasma flow covers a temperature of 100~150℃. After separation, the burr height on the edge of the circuit board is ≤5μm, and the surface roughness Ra is ≤0.8μm.

2. The automatic circuit board separation processing method according to claim 1, characterized in that: The composite milling cutter includes a milling cutter body, a main cutting edge disposed at the milling end of the milling cutter body, and micro secondary cutting edges. The main cutting edge is a helical cutting edge, and multiple of them are disposed in a ring evenly distributed at the milling end of the milling cutter body. The micro secondary cutting edges are distributed at intervals with the main cutting edge.

3. The automatic circuit board separation method according to claim 2, characterized in that: The main cutting edge has a helix angle of 35°±2°, a rake angle of 12°~15°, and a clearance angle of 8°~10°; the micro secondary cutting edge is distributed at a distance of 0.2mm from the main cutting edge.

4. The automatic circuit board separation processing method according to claim 3, characterized in that: The top of the micro-sub-blade is a spherical surface; micro-grooves are provided on the spherical surface, and the micro-grooves are used to break up the copper foil burrs generated by the cutting process.

5. The automatic circuit board separation processing method according to claim 2, characterized in that: The milling cutter body has an internal cooling channel for introducing liquid carbon dioxide at a temperature of -20℃ to -10℃, with a flow rate of 15±2mL / min.

6. The automatic circuit board separation processing method according to claim 1, characterized in that: The argon-oxygen mixed plasma consists of 70% argon and 30% oxygen, with a radio frequency power of 500W±50W, a jet speed of 20~30m / s, and a jet direction at an angle of 25°±5° to the normal of the cutting surface.

7. The automatic circuit board separation processing method according to claim 6, characterized in that: The argon-oxygen mixed plasma spray area covers a 3mm range before and after the cutting trajectory, and the plasma power is dynamically adjusted by real-time feedback of the cutting surface temperature through an infrared thermal imager.

8. The automatic circuit board separation processing method according to claim 1, characterized in that: The sealed processing chamber is equipped with a negative pressure adsorption platform with an adsorption force of 0.3-0.5MPa, an adsorption hole diameter of 0.1mm, and a spacing of 2mm, so that the local deformation of the circuit board is ≤0.05mm. The negative pressure adsorption platform has a built-in piezoelectric sensor to monitor the cutting force fluctuation in real time. When the cutting force changes by ≥10N, it triggers the multi-axis robotic arm to decelerate.

9. The automatic circuit board separation processing method according to claim 1, characterized in that: After cutting, laser scanning is performed, and secondary plasma finishing is initiated for areas where the burr height exceeds the preset value. Pure argon plasma is used for finishing.

10. An automatic board separating device for implementing the automatic board separating process of any one of claims 1 to 9, characterized in that: include A sealed processing chamber includes a nitrogen circulation system and a humidity controller. The nitrogen circulation system is used to fill the sealed processing chamber with nitrogen and circulate the nitrogen. The humidity controller is used to sense and control the humidity of the sealed processing chamber. A multi-axis robotic arm, wherein a composite milling cutter and a plasma spray gun are provided at the drive end of the multi-axis robotic arm, the multi-axis robotic arm is provided with a drive spindle, the composite milling cutter is mounted on the drive spindle, and the plasma spray gun is located on one side of the drive spindle; and The multi-sensor feedback system includes a vibration sensor and an infrared thermal imager. The vibration sensor is installed on the negative pressure adsorption stage to sense the vibration amplitude of the cutting area. The infrared thermal imager is used to provide real-time feedback on the temperature of the cutting surface to dynamically adjust the plasma power. The distance between the plasma spray gun and the composite milling cutter is 2~3mm, and the angle of the plasma spray gun is dynamically controlled by a servo motor.

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