Chip temperature measurement and morphology synchronous in-situ monitoring system based on femtosecond laser
Through a femtosecond laser-based temperature measurement and morphology synchronous in-situ monitoring system, using components such as femtosecond pulse lasers for time domain and space transformation, the problem of synchronous ultrafast temperature measurement and imaging of chips in existing technologies is solved, and high-precision synchronous temperature and morphology detection is achieved.
Patent Information
- Application Number
- CN202510904634.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-01
- Publication Date
- 2025-09-12
AI Technical Summary
Existing technologies cannot achieve simultaneous ultrafast temperature measurement and imaging of chips, and cannot perform dynamic monitoring in situations such as chip short circuits or power failures. Existing methods may interfere with the normal operation of the chip or have limited measurement accuracy.
A femtosecond laser-based synchronous in-situ temperature and morphology monitoring system is adopted. It uses components such as femtosecond pulse laser, time dispersion unit, non-polarization beam splitter, spatial dispersion component, high-speed photodetector and high-speed digital oscilloscope, combined with Hilbert transform for time domain and space transformation, to achieve synchronous detection of transient temperature and morphology on the chip surface.
It achieves MHz-level synchronous monitoring of chip surface temperature and morphology, greatly improving the test sampling rate and enabling high-precision measurements under transient changes.