Manufacturing method of display device, display device and instrument

Abstract

The invention provides a manufacturing method of a display device, the display device and an instrument.The manufacturing method comprises the following steps that a middle plate is placed in a positioning jig, an adhesive is injected into a groove of the middle plate through an automatic dispensing machine, and the middle plate is of a hollow structure; the glass cover plate is pressed into the positioning jig, and pressure maintaining is conducted for the first time; standing for a second time; and attaching the PCB on which the LEDs are attached to the middle plate. The LED is attached to the glass cover plate through the middle plate, when the LED is lightened, the light emitting requirement of the surface of the module can be met only by 8500 cd of the light emitting intensity of the LED, the full view angle is in the best display, the internal temperature rise of the whole instrument can be controlled to be 30 DEG C or below, and compared with the production requirement of an LCD and the LED, the production cost and the rework cost are both very low.

Description

Technical Field

[0001] The present invention relates to the field of power electronics technology, and in particular to a manufacturing method of a display device, a display device and an instrument. Background Art

[0002] The display instrument is the human-machine interface that can provide the driver with the required information such as speed, distance, battery life and gear position. It is an important window for the driver to understand the vehicle status and is an indispensable component of every vehicle. The accuracy and reliability of information transmission are directly related to driving safety.

[0003] In the related art, the combined screen is mostly made of LCD (Liquid Crystal Display) screens bonded by OCA (Optically Clear Adhesive, a special adhesive for bonding transparent optical elements). When the LCD screen is bonded with OCA glue, this production process not only has high production requirements, but also has high production costs and high rework costs. In addition, the transmittance of the LCD screen itself is less than 10%, and only by using OCA glue with a transmittance of 50% can a better integrated black effect be achieved. These factors will cause the overall transmittance of the LCD screen to be less than 5%, and the optimal viewing angle of the LCD is less than 60°. Therefore, the luminous intensity of the backlight needs to be greater than 12000cd to make the brightness of the module surface reach more than 600cd / m2, which will bring about the problem of internal temperature rise of the entire instrument, and the temperature rise will reach more than 40°C. Summary of the Invention

[0004] In order to solve the above technical problems, the present invention provides a method for manufacturing a display device.

[0005] The present invention also provides a display device.

[0006] The present invention also provides a meter.

[0007] The technical solution adopted in the present invention is as follows:

[0008] A first aspect of the present invention provides a method for manufacturing a display device, comprising the following steps: placing a middle plate in a positioning jig, injecting adhesive into a groove of the middle plate using an automatic dispensing machine, wherein the middle plate has a hollow structure; pressing a glass cover plate into the positioning jig and maintaining the pressure for a first time; allowing it to stand for a second time; and bonding a PCB (Printed Circuit Board) with LEDs attached to the middle plate.

[0009] The manufacturing method of the display device proposed above in the present invention also has the following additional technical features:

[0010] According to an embodiment of the present invention, the manufacturing method of the display device further includes: bonding the front frame and the glass cover plate together by adhesive.

[0011] According to one embodiment of the present invention, an automatic dispensing machine is used to inject adhesive into the groove of the middle plate, specifically including: presetting the injection temperature to a first set temperature, and using a first injection pressure for injection.

[0012] According to one embodiment of the present invention, the PCB with LEDs attached is combined with the middle plate, specifically including: controlling the positioning posts of the middle plate to pass through the through holes of the PCB, and using a hot riveting technique to expand the positioning posts so that the PCB and the middle plate are combined after cooling.

[0013] According to one embodiment of the present invention, the adhesive is polyurethane hot melt adhesive.

[0014] According to one embodiment of the present invention, the glass cover is attached to the TFT display unit.

[0015] According to one embodiment of the present invention, a semi-transparent black optical coating with a first transmittance is printed on the back of the area where the glass cover plate is bonded to the PCB; and a semi-transparent black optical coating with a second transmittance is printed on the back of the area where the glass cover plate is bonded to the TFT (Thin Film Transistor) display unit.

[0016] A second embodiment of the present invention provides a display device manufactured using the method for manufacturing the display device described in the first embodiment of the present invention.

[0017] A third embodiment of the present invention provides an instrument, comprising the display device described in the second embodiment.

[0018] The present invention has the following beneficial effects:

[0019] The present invention achieves the bonding of LED and glass cover through the middle plate. When the LED is lit, the luminous intensity of only 8500cd is enough to meet the luminous requirements of the module surface. Not only is the display at the best at all viewing angles, but the internal temperature rise of the entire instrument can be controlled below 30°C. Compared with LCD, the production requirements, production costs and rework costs of LED are very low.

[0020] The present invention can realize the integration of LED display and TFT display in the instrument, and different display contents adopt different display units, which is suitable for outdoor and high brightness occasions and can meet the quality requirements of dynamic display contents. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 is a flow chart of a method for manufacturing a display device according to one embodiment of the present invention;

[0022] Figure 2 is a front view of a middle plate according to one embodiment of the present invention;

[0023] Figure 3 is a schematic diagram of a middle plate and a glass cover plate after being bonded together according to an embodiment of the present invention;

[0024] Figure 4 is a front cross-section of a display device completed by bonding according to one embodiment of the present invention;

[0025] Figure 5 is an assembly diagram of a display device according to one embodiment of the present invention. DETAILED DESCRIPTION

[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0027] The following describes a method for manufacturing a display device, a display device, and an instrument according to an embodiment of the present invention with reference to the accompanying drawings.

[0028] Figure 1 FIG. 1 is a flow chart of a method for manufacturing a display device according to an embodiment of the present invention. Figure 1 As shown, the method includes the following steps:

[0029] S1, placing the middle plate in a positioning fixture, and using an automatic dispensing machine to inject adhesive into the groove of the middle plate, wherein the middle plate has a hollow structure.

[0030] Furthermore, according to an embodiment of the present invention, an automatic glue dispensing machine is used to inject adhesive into the groove of the middle plate, specifically including: presetting the glue injection temperature to a first set temperature, and using a first glue injection pressure for glue injection.

[0031] The first set temperature may be 150° C., and the first injection pressure may be 0.37-0.38 MPa.

[0032] S2, press the glass cover into the positioning fixture and maintain the pressure for the first time.

[0033] The first time can be thought of as 3 minutes.

[0034] S3, standing for a second time.

[0035] The second time may be 10 hours.

[0036] S4, attach the PCB with LEDs to the middle board.

[0037] Furthermore, in one embodiment of the present invention, the PCB with LEDs attached is joined to the midplane by controlling the midplane's positioning posts to pass through the PCB's through-holes and using a heat riveting technique to expand the posts, allowing the PCB to bond to the midplane after cooling. This method offers the advantages of low cost, high automation, and no thread slippage.

[0038] S5, attach the front frame and the glass cover with adhesive.

[0039] Specifically, if Figure 2 As shown, the middle plate 21 (light shield) includes a groove 211. The middle plate 21 is bonded to the glass cover plate 1 through the adhesive in the groove 211. When bonding the glass cover plate 1 and the middle plate 21, adhesive (such as glue) can be injected into the groove 211 of the middle plate 21 using an automatic dispensing machine to achieve bonding. Reinforcement ribs can be set around the display area (i.e., the hollow area) of the middle plate as glue overflow grooves. The display area is surrounded by 0.3mm reinforcement ribs 212. Figure 2 Only a portion of the reinforcing ribs 212 is shown for illustration. After the glue is squeezed out, the overflow groove can block excess glue outside the display area, thereby preventing the glue from affecting the display effect and ensuring the flatness of the middle plate.

[0040] In the embodiment of the present invention, the adhesive is a polyurethane hot melt adhesive. This adhesive has a low elastic modulus (44.7 MPa) after curing. As an adhesive between the middle plate and the glass, it can effectively solve the problem of hard stretching and shedding caused by the different expansion coefficients of the two materials at high and low temperatures.

[0041] In one embodiment of the present invention, in step S2, the glass cover plate with the TFT display unit attached thereto can be directly pressed into a positioning fixture, thereby enabling practical integration of the TFT display unit and the LED. According to one embodiment of the present invention, a translucent black optical coating with a first transmittance is printed on the back surface of the glass cover plate in the area where it is attached to the PCB; and a translucent black optical coating with a second transmittance is printed on the back surface of the glass cover plate in the area where it is attached to the TFT display unit.

[0042] Specifically, the back of the bonding area between the glass cover and the PCB (LED display unit) can be printed with a translucent black optical coating (such as translucent black ink) with a transmittance of 7%. There is also a layer of white silk screen under the semi-transparent black optical coating to diverge the light source. When the LED is not emitting light, the external light source shines on the glass surface, and most of the light source will be absorbed by the semi-transparent black optical coating, thereby achieving an integrated black effect. When lit, the LED luminous intensity only needs 8500cd to meet the module surface luminous requirement of 600cd / m2. The full viewing angle is in the best display, and the internal temperature rise of the entire instrument can be controlled below 30°C. The two display units are combined with the glass cover in a bonding manner, which can present a better integrated black effect when not lit. At the same time, the use of bonding substrates with different transmittances during bonding can balance the luminous intensity on both sides.

[0043] In summary, the manufacturing method of the display device of the present invention can be performed by the following steps:

[0044] 1. Place the middle plate in the positioning fixture with the front side facing up, and use an automatic dispensing machine to inject about 0.7g of black hot melt glue into the groove. The preheating temperature before injection is: 150℃, and the glue pressure is: 0.37-0.38MPa. It is necessary to ensure that the glue overflows the limiting ribs, and then press the glass cover plate with the 2.8-inch TFT into the positioning fixture. It is necessary to ensure that the relative position offset between the middle plate and the glass cover plate is less than 0.3mm, and maintain the pressure for 3 minutes. At this time, it can be ensured that there is enough glue between the middle plate and the glass cover plate, and the display content will not be misaligned due to offset. The screen module after pressure maintenance needs to be packaged separately and left to stand for 10 hours before entering the next process. If Figure 3 As shown, there is no gap between the middle plate 21 and the glass cover plate 1 after the bonding is completed.

[0045] 2. Combine the PCB with LEDs attached to the middle plate. The middle plate's positioning posts pass through the PCB's through-holes and are expanded using heat riveting. After cooling, the PCB and middle plate can be tightly combined.

[0046] 3. The front frame is then bonded to the display device using adhesive.

[0047] The main cross-section of the bonded display device can be seen in Figure 4 As shown, Figure 4 2 is the LED display unit composed of the PCB with LEDs attached and the middle board, and 3 is the TFT display unit. The assembly diagram of the display device can be found in Figure 5 As shown, Figure 5 1 in the middle is a glass cover.

[0048] The display device of the present invention may further include a driving circuit, which includes NFC (Near Field Communication), a display driving module, a Bluetooth module, an electronic lock driving module, an ambient light driving module, an external communication module, and an MCU.

[0049] Among them, NFC is used to send analog signals to the NFC antenna; the display driver module is connected to the display module and is used to drive the display module; the Bluetooth module is connected to the speaker and display module, and the Bluetooth module is used to obtain playback information according to the communication protocol, and drive the speaker or display module according to the playback information. The playback information includes: sound information and display information; the electronic lock driver module is used to drive the external electronic lock; the atmosphere light driver module is used to drive the atmosphere light; the external communication module is used to communicate with the outside; the MCU (Microcontroller Unit) is respectively connected to the NFC, display driver module, Bluetooth module, electronic lock driver module, atmosphere light driver module and external communication module, and is used to control the NFC, display driver module, Bluetooth module, electronic lock driver module, atmosphere light driver module and external communication module.

[0050] Specifically, NFC, display driver module, Bluetooth module, electronic lock driver module, atmosphere light driver module, external communication module and MCU are integrated on a PCBA (Printed Circuit Board Assembly). The display driver module can drive the display module to display vehicle speed, battery level, fault, indicator light and other display information. The Bluetooth module or MCU can realize music playback and navigation screen projection. The Bluetooth module communicates with the map APP through a protocol to obtain the navigation information of the map APP. The Bluetooth module directly drives the display module to display navigation icons and other display information based on the navigation information, and drives the speaker to play the navigation voice sound information. Or the Bluetooth module conveys the data information to the MCU, and finally drives the display module through the MCU to display icons such as left turn, right turn, straight go, U-turn, etc., and displays the current road signs and the distance to the intersection. In this way, the navigation screen projection function is completed.

[0051] The Bluetooth module acquires music information from the app, such as lyrics, song title, and sound. It then directly drives the display module, which then creates a dynamic music map displaying lyrics, song title, and other information, which in turn drives the speaker to play sound. Alternatively, the module transmits this data to the MCU, which then drives the display module, which then displays the information and plays sound through the speaker. This completes the music screen projection function.

[0052] At the same time, the MCU can also control the external electronic lock by controlling the electronic lock driver module, realize the NFC function by controlling the NFC, control the atmosphere light by controlling the atmosphere light driver module, and communicate with the outside through the external communication module.

[0053] In this way, the drivers of multiple functions are integrated into one instrument panel, achieving a more integrated design and cost savings.

[0054] In summary, according to the manufacturing method of the display device of the embodiment of the present invention, the LED and the glass cover plate are bonded together via the middle plate. When illuminated, the LED luminous intensity only needs to be 8500cd to meet the luminous requirements of the module surface. Not only is the display at an optimal level across all viewing angles, but the internal temperature rise of the entire instrument can be controlled below 30°C. Compared to LCDs, the production requirements, production costs, and rework costs of LEDs are all very low. The present invention can integrate LED and TFT displays in instruments, using different display units for different display content. This makes it suitable for outdoor applications and high-brightness applications, while also meeting the quality requirements of dynamic display content.

[0055] The present invention also provides a display device manufactured using the above-mentioned display device manufacturing method. By bonding the LEDs to the glass cover plate via a midplane, the LEDs only require 8500cd of luminous intensity when lit to meet the module surface illumination requirements. This not only provides optimal display at all viewing angles, but also keeps the internal temperature rise of the entire instrument below 30°C. Compared to LCDs, LEDs have significantly lower production requirements, production costs, and rework costs.

[0056] The present invention also provides an instrument including the aforementioned display device. By bonding the LEDs to the glass cover via a midplane, the LEDs require only 8500cd of luminous intensity when lit to meet the module's surface illumination requirements. This not only provides optimal display at all viewing angles, but also keeps the internal temperature rise of the instrument below 30°C. Furthermore, compared to LCDs, LEDs have significantly lower production requirements, production costs, and rework costs.

[0057] In the description of this specification, the reference terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and features of different embodiments or examples without contradiction.

[0058] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0059] Any process or method description in a flowchart or otherwise described herein may be understood to represent a module, segment or portion of code comprising one or more executable instructions for implementing the steps of a custom logical function or process, and the scope of the preferred embodiments of the present invention includes alternative implementations in which functions may be performed out of the order shown or discussed, including performing functions in a substantially simultaneous manner or in the reverse order depending on the functions involved, which should be understood by those skilled in the art to which the embodiments of the present invention pertain.

[0060] In addition, the functional units in the various embodiments of the present invention may be integrated into a single processing module, or each unit may exist physically separately, or two or more units may be integrated into a single module. The aforementioned integrated modules may be implemented in the form of hardware or in the form of software functional modules. If the integrated modules are implemented in the form of software functional modules and sold or used as independent products, they may also be stored in a computer-readable storage medium.

[0061] Although the embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and are not to be construed as limitations on the present invention. A person skilled in the art may change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. A method for manufacturing a display device, characterized in that: The following steps are involved: Placing the middle plate in a positioning jig, and injecting adhesive into the groove of the middle plate using an automatic dispensing machine, wherein the middle plate has a hollow structure; Press the glass cover into the positioning fixture and maintain the pressure for the first time; Let stand for a second time; Attach the PCB with LEDs to the middle board.

2. The method for manufacturing a display device according to claim 1, wherein: Also includes: Attach the front frame to the glass cover with adhesive.

3. The method for manufacturing a display device according to claim 1, wherein: Use an automatic dispensing machine to inject adhesive into the groove of the mid-plate, including: The glue injection temperature is preset to a first set temperature, and the glue injection is performed using a first glue injection pressure.

4. The method for manufacturing a display device according to claim 1, wherein: Combine the PCB with LEDs attached to the midboard, specifically including: The positioning posts of the control mid-plate pass through the through-holes of the PCB, and the hot riveting technology is used to expand the positioning posts so that the PCB and the mid-plate are combined after cooling.

5. The method for manufacturing a display device according to claim 1, wherein: The adhesive is polyurethane hot melt adhesive.

6. The method for manufacturing a display device according to claim 1, wherein: The glass cover is attached to the TFT display unit.

7. The method for manufacturing a display device according to claim 6, wherein: The back surface of the glass cover plate and the PCB bonding area is printed with a semi-transparent black optical coating of a first transmittance; the back surface of the glass cover plate and the TFT display unit bonding area is printed with a semi-transparent black optical coating of a second transmittance.

8. A display device, characterized in that: It is manufactured based on the manufacturing method of the display device according to any one of claims 1 to 7.

9. An instrument, characterized in that: The device comprises the display device according to claim 8.

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