A semiconductor package mold and a packaging method

Abstract

The application relates to the technical field of semiconductor packaging, and discloses a semiconductor packaging mold and a packaging method, which comprise a machine cover, the bottom end of the machine cover is fixedly connected with a packaging mechanism, the top end of the packaging mechanism is detachably connected with a feeding mechanism, the left and right sides of the packaging mechanism are fixedly connected with rotating columns, the outer sides of the rotating columns are rotationally connected with connecting rods, the other ends of the connecting rods are rotationally connected with rotating shafts, the inner sides of the rotating shafts are rotationally connected with rolling shafts, the left and right sides of the packaging mechanism are fixedly connected with sliding blocks, sliding grooves for the rolling shafts to slide are arranged in the sliding blocks, the bottom ends of the sliding blocks are fixedly connected with supporting rings, and the inner walls of the two adjacent supporting rings are rotationally connected with sliding rods. In the application, the automatic unloading design can be completed when the mold is opened, the production rhythm is not interrupted, and therefore the efficiency of semiconductor packaging is greatly improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging technology, and in particular to a semiconductor packaging mold and packaging method. Background Technology

[0002] Semiconductor packaging technology is a key process for packaging integrated circuit chips into practical electronic devices. Its core objective is to protect the chip from physical damage and environmental interference, while simultaneously achieving electrical connectivity, heat dissipation, and signal transmission. The process includes steps such as die bonding, wire bonding, and molding, balancing performance, cost, and reliability through package structure design. Packaging technology directly affects chip lifespan, power consumption, and integration density, making it a crucial link in the semiconductor industry chain. Semiconductor packaging molds are the core tools for forming the package, playing a decisive role, especially in the molding compound injection molding stage. The mold must precisely control the flow path and curing process of the molding compound to ensure a dense and defect-free package structure.

[0003] However, in the existing technology, after the semiconductor is packaged, some semiconductor packaging molds require operators to manually transfer the material tray to a dedicated unloading station for demolding. Then, the material tray needs to be repositioned and the loading process needs to be repeated. This material turnover mode that relies on manual intervention causes production cycle interruptions, thereby reducing the efficiency of semiconductor packaging.

[0004] Therefore, a semiconductor packaging mold and packaging method are proposed to address the above problems. Summary of the Invention

[0005] To overcome the above deficiencies, the present invention provides a semiconductor packaging mold and packaging method, aiming to improve the problem in the prior art where some semiconductor packaging molds require operators to manually transfer the material tray to a dedicated unloading station for demolding after the semiconductor is packaged, and then repeat the loading process, causing production cycle interruption and thus reducing semiconductor packaging efficiency.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A semiconductor packaging mold includes a cover, a packaging mechanism fixedly connected to the bottom end of the cover, a feeding mechanism detachably connected to the top end of the packaging mechanism, rotating columns fixedly connected to both the left and right sides of the packaging mechanism, connecting rods rotatably connected to the outer sides of the rotating columns, a rotating shaft rotatably connected to the other end of the connecting rods, a roller rotatably connected to the inner side of the rotating shaft, sliders fixedly connected to both the left and right sides of the packaging mechanism, a sliding groove provided inside the slider for the roller to slide, support rings fixedly connected to the four corners of the bottom end of the slider, sliding rods rotatably connected to the inner walls of two adjacent support rings, and insertion posts for insertion into the lower mold fixedly connected to the four corners of the bottom end of the packaging mechanism.

[0008] As a further description of the above technical solution:

[0009] The packaging mechanism includes a multi-stage cylinder. The top of the multi-stage cylinder is fixedly connected to the bottom of the cover. A pressure plate is fixedly connected to the drive end of the multi-stage cylinder. An upper mold is fixedly connected to the bottom of the pressure plate. One end of the rotating column is fixedly connected to the outside of the upper mold. Two injection molding machines are fixedly connected to the top of the cover. A conveying pipe communicating with the upper mold is fixedly connected to the outside of the injection molding machines. Guide sleeves are fixedly connected to the four corners of the inner wall of the pressure plate. Guide columns are slidably connected to the inner wall of the guide sleeves. A guardrail is fixedly connected to the bottom of the cover. A body is fixedly connected to the bottom of the guardrail. A base plate is fixedly connected to the top of the body. A lower mold is fixedly connected to the top of the base plate.

[0010] As a further description of the above technical solution:

[0011] The feeding mechanism includes a material tray, the bottom of which is detachably connected to the top of the lower mold, a frame is fixedly connected to the top of the material tray, and two handles are fixedly connected to the front end of the material tray.

[0012] As a further description of the above technical solution:

[0013] The inner wall of the roller is slidably connected to multiple sliding columns, and a connecting member is rotatably connected to the adjacent side of the multiple sliding columns. Multiple movable beads are movably connected inside the connecting member.

[0014] As a further description of the above technical solution:

[0015] Two ramps are fixedly connected to the top of the base plate, a guide frame is fixedly connected to the rear end of the guardrail, and a ramp is fixedly connected to the rear end of the body.

[0016] As a further description of the above technical solution:

[0017] The outer side of the conveying pipe is slidably connected to the inner wall of the machine cover, and the outer side of the conveying pipe is fixedly connected to the inner wall of the pressure plate.

[0018] As a further description of the above technical solution:

[0019] The outer surface of the movable bead contacts the inner wall of the roller, and the outer surface of the movable bead also contacts the inner wall of the groove.

[0020] As a further description of the above technical solution:

[0021] The outer side of the support ring is slidably connected to the inner wall of the slope block, and the outer side of the sliding rod is also slidably connected to the inner wall of the slope block.

[0022] A semiconductor packaging method, applicable to the aforementioned semiconductor packaging mold, is described below:

[0023] S1. Place the semiconductor to be packaged onto the tray, then insert the post into the hole on the lower mold to fix them in place. At the same time, add plastic material to the injection molding machine to melt it in preparation for subsequent injection molding operations.

[0024] S2. Start this packaging device. The multi-stage cylinder drives the pressure plate and upper mold to descend until the upper mold, lower mold and material tray are closed. At this time, the thermoplastic fluid inside the injection molding machine will flow into the interior of the upper mold through the delivery pipe to inject the semiconductor loaded on the surface of the material tray. During the descent, the roller and its internal structure will also slide inside the slide groove until they are completely closed. At this time, the roller is in the right half of the U-shaped groove in the slide groove.

[0025] S3. After injection molding is completed, control the multi-stage cylinder to drive the pressure plate and upper mold to rise. At this time, the roller and its internal structure will continue to slide in the right half of the U-shaped groove in the slide. At the same time, after rising to a certain distance, it will drive the material tray to rotate. At this time, the slide rod will slide in the groove of the slope block until the material tray slides out of the guardrail along the slope block and guide frame and falls off the slope plate. At this time, the staff can collect it.

[0026] S4. After completing the above steps, the staff can place another tray full of semiconductors back onto the lower mold and continue the packaging operation.

[0027] The present invention has the following beneficial effects:

[0028] 1. In this invention, a tray filled with semiconductors is first placed on the top of the lower mold, and the inserts engage with the holes at the top of the lower mold. Then, a multi-stage cylinder is activated to lower the pressure plate and the upper mold. As the upper and lower molds slowly merge, the roller gradually slides to the right in the groove until they are fully merged. At this point, the roller is in the right half of the groove, specifically slightly to the right of the center of the U-shaped slot. After encapsulation, the multi-stage cylinder is activated to raise the pressure plate and the upper mold. Because the roller is in the right half of the U-shaped slot, it continues to slide to the right during the rise, causing the right side of the tray to rise, resulting in an inclined tray. As it continues to rise, the inserts disengage from the lower mold, and the tray slides along the ramp and guide frame under the action of the sliding rod until it falls from the top of the ramp. At this point, the tray can be collected by the operator. This automatic unloading design during mold opening eliminates production interruptions, significantly improving the efficiency of semiconductor packaging.

[0029] 2. In this invention, when the roller slides in the groove, the live balls here will slide synchronously in the groove under the restriction of the connecting parts, thereby forming a dynamic lubricating film during the movement and significantly reducing the interface friction coefficient. At the same time, the characteristic of multiple live balls sliding synchronously is used to achieve stress dispersion, effectively avoiding the jamming phenomenon that is easy to be generated by traditional single-point contact, and further optimizing the design of automatic unloading when opening the mold. Attached Figure Description

[0030] Figure 1 This is a three-dimensional schematic diagram of a semiconductor packaging mold and packaging method proposed in this invention;

[0031] Figure 2 This is a schematic diagram of the pressure plate of a semiconductor packaging mold and packaging method proposed in this invention;

[0032] Figure 3 This is a schematic diagram of the upper mold structure of a semiconductor packaging mold and packaging method proposed in this invention;

[0033] Figure 4 This is a schematic diagram of the structure of the roller in the semiconductor packaging mold and packaging method proposed in this invention;

[0034] Figure 5 This is a schematic diagram of the slider structure of a semiconductor packaging mold and packaging method proposed in this invention;

[0035] Figure 6 for Figure 3 Enlarged view of point A;

[0036] Figure 7 This is a schematic diagram of the material tray of a semiconductor packaging mold and packaging method proposed in this invention;

[0037] Figure 8 for Figure 7 Enlarged view of point B;

[0038] Figure 9 This is an overall flowchart of a packaging method in a semiconductor packaging mold proposed in this invention.

[0039] Legend:

[0040] 1. Machine body; 2. Guardrail; 3. Machine cover; 4. Multi-stage cylinder; 5. Pressure plate; 6. Upper mold; 7. Injection molding machine; 8. Conveyor pipe; 9. Guide sleeve; 10. Guide pillar; 11. Base plate; 12. Lower mold; 13. Material tray; 14. Enclosure frame; 15. Handle; 16. Rotating column; 17. Connecting rod; 18. Rotating shaft; 19. Roller; 20. Sliding column; 21. Connecting part; 22. Vibrating ball; 23. Sliding block; 24. Slide groove; 25. Support ring; 26. Sliding rod; 27. Insert column; 28. Slope block; 29. ​​Guide frame; 30. Slope plate. Detailed Implementation

[0041] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0042] Reference Figures 1 to 3 This invention provides an embodiment of a semiconductor packaging mold, comprising a cover 3, a guardrail 2 fixedly connected to the bottom of the cover 3, and a body 1 fixedly connected to the bottom of the guardrail 2. The body 1 is the entire packaging device. The cover 3 is used to protect various mechanisms on the surface of the body 1. A packaging mechanism is fixedly connected to the bottom of the cover 3. The packaging mechanism includes a multi-stage cylinder 4. The top of the multi-stage cylinder 4 is fixedly connected to the bottom of the cover 3, providing stable support for the multi-stage cylinder 4. A pressure plate 5 is fixedly connected to the drive end of the multi-stage cylinder 4, and an upper mold 6 is fixedly connected to the bottom of the pressure plate 5. After the multi-stage cylinder 4 is started, it can drive the pressure plate 5 and the upper mold 6 to slide up and down. Two injection molding machines 7 are fixedly connected to the top of the cover 3. A conveying pipe 8 communicating with the upper mold 6 is fixedly connected to the outside of the injection molding machines 7. The injection molding machines 7 can melt the plastic material to complete the subsequent semiconductor packaging operation, while the conveying pipe 8 is used to convey the hot melt fluid in the injection molding machines 7.

[0043] The external sliding connection of the conveying pipe 8 is to the inner wall of the cover 3, and the external fixed connection of the conveying pipe 8 is to the inner wall of the pressure plate 5. The length of the conveying pipe 8 here is only for illustration purposes. The operator can adjust or customize the specific length of the conveying pipe 8 according to the height of the upper mold 6 when it descends. Guide sleeves 9 are fixedly connected to the four corners of the inner wall of the pressure plate 5. Guide posts 10 are slidably connected to the inner wall of the guide sleeves 9. When the pressure plate 5 descends, it will drive the guide sleeves 9 to slide on the guide posts 10, ensuring the stability of the pressure plate 5 when it descends and preventing deviation. The top of the machine body 1 is fixedly connected to the bottom plate 11, and the top of the bottom plate 11 is fixedly connected to the lower mold 12. The machine body 1 and the bottom plate 11 here provide stable support for the lower mold 12, ensuring In the normal operation of the semiconductor packaging process, the top of the packaging mechanism is detachably connected to a feeding mechanism, which includes a tray 13. The tray 13 is used to hold multiple semiconductors to be packaged. The bottom of the tray 13 is detachably connected to the top of the lower mold 12. A frame 14 is fixedly connected to the top of the tray 13 to prevent the semiconductors from accidentally falling out of the tray 13. Two handles 15 are fixedly connected to the front of the tray 13 for the operator to use for feeding. Rotary columns 16 are fixedly connected to both sides of the packaging mechanism. One end of the rotating column 16 is fixedly connected to the outside of the upper mold 6. When the upper mold 6 descends, it can drive the rotating column 16 to descend together.

[0044] Reference Figures 3 to 5 A connecting rod 17 is rotatably connected to the outer side of the rotating column 16, and a rotating shaft 18 is rotatably connected to the other end of the connecting rod 17. The connecting rod 17 can rotate at the end of the rotating column 16, and the rotating shaft 18 can also rotate at the other end of the connecting rod 17. A roller 19 is rotatably connected to the inner side of the rotating shaft 18, and multiple sliding columns 20 are slidably connected to the inner wall of the roller 19. A connecting piece 21 is rotatably connected to the adjacent side of the multiple sliding columns 20. Multiple movable balls 22 are movably connected inside the connecting piece 21, and the outer side of the movable balls 22 is connected to the roller. The inner wall of the shaft 19 is in contact with the connecting piece 21, which connects multiple movable balls 22 together. At the same time, it can rotate around the shaft 19 under the drive of the sliding column 20. The left and right sides of the sealing mechanism are fixedly connected with sliders 23. The inside of the slider 23 is provided with a sliding groove 24 for the shaft 19 to slide. The outside of the movable balls 22 is also in contact with the inner wall of the sliding groove 24. When the upper mold 6 drives the rotating column 16 and the inner structure to descend, the shaft 19 and multiple movable balls 22 can slide inside the sliding groove 24.

[0045] Reference Figures 6 to 8 Each of the four corners of the bottom end of the slider 23 is fixedly connected with a support ring 25. The inner walls of two adjacent support rings 25 are rotatably connected with a slide rod 26. Each of the four corners of the bottom end of the packaging mechanism is fixedly connected with a pin 27 that is inserted into the lower mold 12. The shapes of the front and rear ends of the pin 27 are opposite. This design mainly ensures the fixation of the material tray 13 and the lower mold 12 under normal conditions, and can also slide out smoothly when unloading is required.

[0046] Reference Figure 3 Two ramps 28 are fixedly connected to the top of the base plate 11. The outer side of the support ring 25 is slidably connected to the inner wall of the ramp 28. The ramp 28 here provides guidance for the slide rod 26 to prevent the route from deviating. The outer side of the slide rod 26 is also slidably connected to the inner wall of the ramp 28. The rear end of the guardrail 2 is fixedly connected to the guide frame 29. The rear end of the machine body 1 is fixedly connected to the ramp 30. The guide frame 29 and the ramp 30 here are used to further guide the sliding material tray 13, which can then be collected by the staff.

[0047] Reference Figure 9 A semiconductor packaging method, applicable to the aforementioned semiconductor packaging mold, is described below:

[0048] S1. Place the semiconductor to be packaged onto the tray 13, and then insert the post 27 into the hole on the lower mold 12. Since the shapes of the front and rear posts 27 are opposite, they can be fixed under normal conditions. At the same time, add plastic material to the injection molding machine 7 to melt it in preparation for subsequent injection molding operations, i.e. semiconductor packaging operations.

[0049] S2. Start this packaging device. The multi-stage cylinder 4 drives the pressure plate 5 and the upper mold 6 to descend until the upper mold 6 closes with the lower mold 12 and the material tray 13. At this time, the thermoplastic fluid inside the injection molding machine 7 flows into the interior of the upper mold 6 through the delivery pipe 8 to inject the semiconductor loaded on the surface of the material tray 13. During the descent, the rotating column 16 and its inner structure also descend. At this time, the roller 19 and its inner wall structure will slide inside the slide groove 24. The multiple movable beads 22 connected by the connector 21 will form a dynamic lubricating film during the movement and significantly reduce the interface friction coefficient. At the same time, the stress is dispersed by the synchronous sliding characteristic of multiple movable beads 22, which effectively avoids the jamming phenomenon that is easy to occur in traditional single-point contact. Until the upper mold 6 is completely merged with the material tray 13 and the lower mold 12, the roller 19 is in the right half of the U-shaped groove in the slide groove 24. At this time, the semiconductor packaging step can begin.

[0050] S3. After injection molding is completed, control the multi-stage cylinder 4 to drive the pressure plate 5 and the upper mold 6 to rise. At this time, the roller 19 and its internal structure will continue to slide in the right half of the U-shaped groove in the slide 24. Since the roller 19 is in the right half of the slide 24, it will drive the right side of the material tray 13 to rise first when rising, so that the material tray 13 is tilted. At this time, the slide rod 26 will slide in the groove of the ramp 28 until the roller 19 and the ball bearing 22 slide out of the slide 24 from the right side of the slider 23. Then the material tray 13 will slide out of the guardrail 2 along the ramp 28 and the guide frame 29, and then fall from the ramp 30. At this time, the staff can collect it.

[0051] S4. After completing the above steps, the operator can place another tray 13 filled with semiconductors back onto the lower mold 12 to continue the packaging operation. The two trays 13 switch between operations, thus replacing the single tray 13 used in the prior art for loading and unloading. This design, which allows for automatic unloading during mold opening, eliminates production interruptions and greatly improves the efficiency of semiconductor packaging.

[0052] Working principle: The operator neatly arranges the semiconductor chips to be packaged in the grooves of the material tray 13. The frame 14 prevents the chips from falling out. Then, the chips are quickly positioned and locked to the lower mold 12 by the inserts 27. The reverse design of the front and rear inserts 27 ensures a stable connection under normal conditions. At the same time, the injection molding machine 7 heats the solid plastic material into a liquid state and injects it into the flow channel of the upper mold 6 through the delivery pipe 8, preparing for the subsequent semiconductor packaging.

[0053] When the multi-stage cylinder 4 drives the pressure plate 5 to move the upper mold 6 downwards, the guide sleeve 9 slides along the guide post 10 to ensure vertical accuracy. When the upper mold 6 and the lower mold 12 close, the hot melt fluid wraps around the chip in the material tray 13 to complete the injection molding and encapsulation. During this process, the rotating post 16 descends synchronously with the upper mold 6, and drives the roller 19 to slide in the slide groove 24 through the connecting rod 17 and the rotating shaft 18. The movable beads 22 on the inner wall of the roller 19 form a dynamic lubricating film under the constraint of the connecting piece 21. The friction coefficient is significantly reduced by the synchronous rolling of multiple particles. At the same time, the stress is balanced by the coordinated movement of the movable beads 22, avoiding the jamming phenomenon caused by traditional single-point contact. Until the upper mold 6 and the lower mold 12 are completely merged, the roller 19 is in the right half of the U-shaped groove in the slide groove 24.

[0054] After injection molding, the multi-stage cylinder 4 lifts the upper mold 6. Due to the off-center design of the right half of the groove 24 inside the slider 23, the roller 19 first lifts the right side of the material tray 13, causing it to tilt. At this time, the slide rod 26 slides along the arc-shaped groove of the ramp 28 until the roller 19 and the ball bearing 22 slide out of the groove 24 from the right side of the slider 23. Then, under the action of gravity and the guiding mechanism, the material tray 13 passes through the buffer slope of the guide frame 29 and the ramp 30 in sequence, and finally slides out of the guardrail 2 to achieve automatic unloading.

[0055] The alternating use of two material trays 13 eliminates downtime, the self-lubricating properties of the movable ball 22 and the optimized trajectory of the slide 24 ensure long-term stable operation, the cooperation between the guide sleeve 9 and the guide post 10 ensures the vertical movement accuracy of the pressure plate 5, and the linkage design of the support ring 25 and the slide rod 26 ensures a stable unloading trajectory. This device, through the coordinated use of technologies such as precise temperature control of the injection molding machine 7, quantitative material supply through the conveying pipe 8, dynamic lubrication of the movable ball 22, and space optimization of the slide 24, seamlessly connects the injection molding, heat dissipation, and unloading processes, significantly improving production efficiency and yield while reducing the error risks caused by manual intervention.

[0056] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A semiconductor packaging mold, comprising a cover (3), characterized in that: The bottom of the cover (3) is fixedly connected to a packaging mechanism. The top of the packaging mechanism is detachably connected to a feeding mechanism. Rotary columns (16) are fixedly connected to both the left and right sides of the packaging mechanism. A connecting rod (17) is rotatably connected to the outer side of the rotating column (16). A rotating shaft (18) is rotatably connected to the other end of the connecting rod (17). A roller (19) is rotatably connected to the inner side of the rotating shaft (18). A slider (23) is fixedly connected to both the left and right sides of the packaging mechanism. A sliding groove (24) is provided inside the slider (23) for the roller (19) to slide. Support rings (25) are fixedly connected to the four corners of the bottom of the slider (23). A sliding rod (26) is rotatably connected to the inner wall of two adjacent support rings (25). Insertion posts (27) that are inserted into the lower mold (12) are fixedly connected to the four corners of the bottom of the packaging mechanism. The packaging mechanism includes a multi-stage cylinder (4), the top of which is fixedly connected to the bottom of the cover (3), the driving end of which is fixedly connected to a pressure plate (5), the bottom of which is fixedly connected to an upper mold (6), one end of which is fixedly connected to the outside of the upper mold (6), the top of which is fixedly connected to two injection molding machines (7), the outside of which is fixedly connected to a conveying pipe (8) communicating with the upper mold (6), the four corners of the inner wall of the pressure plate (5) are fixedly connected to guide sleeves (9), the inner wall of which is slidably connected to guide pillars (10), the bottom of which is fixedly connected to a guardrail (2), the bottom of which is fixedly connected to a body (1), the top of which is fixedly connected to a base plate (11), and the top of which is fixedly connected to a lower mold (12). The feeding mechanism includes a material tray (13), the bottom end of which is detachably connected to the top end of the lower mold (12), a frame (14) is fixedly connected to the top end of the material tray (13), and two handles (15) are fixedly connected to the front end of the material tray (13). The top of the base plate (11) is fixedly connected to two ramps (28), the rear end of the guardrail (2) is fixedly connected to a guide frame (29), and the rear end of the body (1) is fixedly connected to a ramp (30).

2. A semiconductor packaging mold according to claim 1, characterized in that: The inner wall of the roller (19) is slidably connected to a plurality of sliding columns (20), and a connector (21) is rotatably connected to the adjacent side of the plurality of sliding columns (20), and a plurality of movable beads (22) are movably connected inside the connector (21).

3. A semiconductor packaging mold according to claim 2, characterized in that: The external part of the conveying pipe (8) is slidably connected to the inner wall of the machine cover (3), and the external part of the conveying pipe (8) is fixedly connected to the inner wall of the pressure plate (5).

4. A semiconductor packaging mold according to claim 3, characterized in that: The outside of the movable bead (22) is in contact with the inner wall of the roller (19), and the outside of the movable bead (22) is also in contact with the inner wall of the groove (24).

5. A semiconductor packaging mold according to claim 4, characterized in that: The outer side of the support ring (25) is slidably connected to the inner wall of the ramp (28), and the outer side of the slide rod (26) is also slidably connected to the inner wall of the ramp (28).

6. A semiconductor packaging method, wherein the packaging method uses the semiconductor packaging mold of claim 5 for packaging, characterized in that: The encapsulation method is as follows: S1. Place the semiconductor to be packaged onto the tray (13), then insert the post (27) into the hole on the lower mold (12) to fix them in place. At the same time, add plastic material to the injection molding machine (7) to melt it in preparation for subsequent injection molding operations. S2. Start this packaging device. The multi-stage cylinder (4) drives the pressure plate (5) and the upper mold (6) to descend until the upper mold (6) closes with the lower mold (12) and the material tray (13). At this time, the thermoplastic fluid inside the injection molding machine (7) will flow into the interior of the upper mold (6) through the delivery pipe (8) to inject the semiconductor loaded on the surface of the material tray (13). During the descent, the roller (19) and its internal structure will slide inside the slide groove (24) until they are completely closed. The roller (19) is in the right half of the U-shaped groove in the slide groove (24). S3. After injection molding is completed, control the multi-stage cylinder (4) to drive the pressure plate (5) and the upper mold (6) to rise. At this time, the roller (19) and its internal structure will continue to slide in the right half of the U-shaped groove in the slide (24). At the same time, after rising to a certain distance, it will drive the material tray (13) to rotate. At this time, the slide rod (26) will slide in the groove of the ramp (28) until the material tray (13) slides out of the range of the guardrail (2) along the ramp (28) and the guide frame (29) and falls from the ramp plate (30). At this time, the staff can collect it. S4. After completing the above steps, the staff can put another tray (13) filled with semiconductors back onto the lower mold (12) and continue the packaging operation.

Images