A die bonding structure of an LED display module

Abstract

The application relates to the die bonding technology field of an LED display module, and discloses a die bonding structure of an LED display module, which comprises a driving piece, the driving piece comprises a driving rod fixedly connected to an output shaft of a numerical control motor, a connecting rod is fixedly connected to the side wall of the driving rod, and a swing arm is fixedly connected to the inner wall of the connecting rod. Before use, a worker installs the equipment at a required position through a mounting rack, ensures that the right side of the swing arm is a die bonding support and the left side is a wafer tray, utilizes the regular swing characteristics of the swing arm, and sets a transmission mechanism and a scraping mechanism in the equipment. The limiting rod slides the sliding block and the L-shaped sliding plate, the L-shaped sliding plate scrapes and cleans the bottom of the wafer suction block through the sponge, and through the application of the above components, the equipment can effectively remove the residual colloid at the bottom of the wafer suction block during use, so that the colloid residue does not affect the subsequent die bonding efficiency.

Description

TECHNICAL FIELD

[0001] The application relates to a die bonding structure of an LED display module. BACKGROUND

[0002] The die bonding structure of the LED display module belongs to the field of semiconductor device manufacturing and mainly relates to fixing and connecting technologies of LED chips.

[0003] However, in the die bonding process, part of the glue is squeezed on the glue disc and adhered to the inside of the support along with the operation of the glue dispensing rod. SUMMARY

[0004] To solve the above technical problems, the application provides a die bonding structure of an LED display module, which comprises a numerical control motor.

[0005] The mounting mechanism is used for fixing and mounting the whole device to ensure that the device does not shake during operation.

[0006] The transmission mechanism is fixedly arranged on the side wall of the mounting mechanism and is used for removing residual glue in the die bonding environment and providing driving force.

[0007] The scraping mechanism is fixedly arranged on the inner wall of the transmission mechanism and is used for converting the movement force of the transmission mechanism into a scraping thrust.

[0008] Before use, the device is installed at the required position through the mounting mechanism, and then the numerical control motor drives the scraping mechanism to perform the scraping process through the transmission mechanism.

[0009] Preferably, the mounting mechanism comprises:

[0010] The fixing assembly is fixedly connected to the side wall of the numerical control motor through a fixing piece.

[0011] The fixing piece comprises a fixing block fixedly connected to the bottom of the numerical control motor.

[0012] The driving assembly is fixedly connected to the outer wall of the output shaft of the numerical control motor through a driving piece.

[0013] The driving member comprises a driving rod fixedly connected to the output shaft of the numerical control motor, a connecting rod fixedly connected to the side wall of the driving rod, and a swing arm fixedly connected to the inner wall of the connecting rod.

[0014] During operation of the device, the numerical control motor drives the connecting rod and the swing arm to swing through the driving rod, thereby completing the wafer transportation process of the device foundation.

[0015] Preferably, the transmission mechanism comprises:

[0016] The linkage assembly is fixedly connected to the outer wall of the swing arm through a linkage member;

[0017] The linkage member comprises a through-hole slot formed in the top of the swing arm, and a sliding rail is fixedly connected to the inner wall of the through-hole slot;

[0018] The pulling assembly is fixedly connected to the side wall of the swing arm through a pulling member;

[0019] The pulling member comprises a sliding rail one fixedly connected to the side wall of the swing arm, and an L-shaped sliding rod is slidingly connected to the inner wall of the sliding rail one;

[0020] When the swing arm swings regularly under the action of the numerical control motor, the swing force is transmitted to the pulling assembly through the linkage assembly, so that the pulling assembly drives the scraping mechanism to perform the scraping process.

[0021] Preferably, the scraping mechanism comprises:

[0022] The scraping assembly is rotatably connected to the inner wall of the L-shaped sliding rod through a rotating member;

[0023] The rotating member comprises a rotating plate rotatably connected to the inner wall of the L-shaped sliding rod, and a sponge is fixedly connected to the top of the rotating plate;

[0024] The pushing assembly is fixedly connected to the inner wall of the rotating plate through a contact member;

[0025] The contact member comprises a torsional spring fixedly connected to the inner wall of the rotating plate, and the other end of the torsional spring is fixedly connected to the outer wall of the L-shaped sliding rod;

[0026] The torsional spring drives part of the rotating plate to reset, so that when the L-shaped sliding rod moves outward, the torsional spring drives the rotating plate and the sponge away from the scraping area.

[0027] Preferably, the fixing assembly comprises a mounting bracket fixedly connected to the end of the connecting frame away from the fixed block one;

[0028] Before use, the staff installs the device at the desired position through the mounting bracket, and ensures that the right side of the swing arm is the die bonding support and the left side is the wafer disc;

[0029] In use, the worker fixes the device in the desired position through the mounting frame, and ensures that the right side of the swing arm is the die bonding support and the left side is the wafer tray, as shown in Figure 1 After the device is debugged, the numerical control motor drives the connecting rod and the swing arm to swing regularly.

[0030] Preferably, the driving assembly includes a wafer suction block fixedly connected to the end of the swing arm away from the connecting rod;

[0031] Wherein, when the wafer suction block reaches the top of the wafer tray, it grabs a wafer, and under the swing of the swing arm, the wafer is placed on the wafer support, and the wafer suction block pushes the wafer into the designated position.

[0032] Preferably, the linkage assembly includes a support plate fixedly connected to the side wall of the fixed block, a sliding block slidingly connected to the inner wall of the sliding rail, and a limiting rod rotatably connected to the top of the sliding block, wherein the end of the limiting rod away from the sliding block is rotatably connected to the right bottom of the support plate.

[0033] Wherein, when the swing arm swings to the right, the limiting rod will push the sliding block to slide outward along the inner wall of the sliding rail, and when the swing arm swings to the left, the limiting rod will drive the sliding block to move along the inner wall of the sliding rail towards the connecting rod.

[0034] Preferably, the pulling assembly includes a push rod fixedly connected to the bottom of the sliding block, and an L-shaped slide plate fixedly connected to the end of the push rod away from the sliding block, and a sliding rail two fixedly connected to the bottom of the L-shaped slide rod.

[0035] When the limiting rod drives the push rod to move synchronously through the sliding block, the moving force will be transmitted to the L-shaped slide plate through the push rod, driving the scraping mechanism to scrape and clean;

[0036] When the swing arm moves the wafer towards the die bonding support through the wafer suction block, the angle between the support plate and the sliding rail decreases, at this time the limiting rod will push the sliding block and the push rod to slide outward along the inner wall of the sliding rail, at this time the push rod drives the L-shaped slide plate to slide outward along the inner wall of the sliding rail two synchronously, showing a state as Figure 7 .

[0037] Preferably, the scraping assembly includes a vertical sliding groove opened in the top of the L-shaped slide plate, a sliding rod slidingly connected to the top of the vertical sliding groove, and a rolling column rotatably connected to the side wall of the sliding rod.

[0038] After the swing arm completes the die bonding process, the swing arm will rotate to the position of the wafer tray again, at this time, the limiting rod drives the sliding block and the push rod to move along the inner wall of the sliding rail to the direction of the support plate, so that the sliding block can drive the L-shaped slide plate to move synchronously, at this time, the L-shaped slide plate drives the sliding rod and the rolling column to move, so that the rolling column is in contact with the outer wall of the inclined surface, with the movement of the rolling column, the rotating plate will drive the sponge to be raised upward around the torsional spring, then the L-shaped slide plate drives the L-shaped slide rod and the sponge to move to the direction of the support plate, at this time, the sponge will scratch and clean the bottom of the wafer suction block, removing the residual glue on the bottom of the limiting rod;

[0039] When the sponge is in contact with the bottom of the wafer suction block, the sliding rod is closer to the position of the torsional spring, so that the rotating plate forms an upwardly raised state, and when the sponge passes through the top of the wafer suction block, the sliding rod will slide downward along the inner wall of the vertical sliding groove;

[0040] The torsional spring always generates a torsional force, forcing the rotating plate to rotate counterclockwise around the torsional spring, and when the sliding rod reaches the outermost of the sliding rail two, the torsional spring will drive the sponge to the bottom, and the pushing force of the push rod will drive the sliding rail two and the L-shaped slide rod to slide outward along the inner wall of the sliding rail one, so that when the swing arm swings to the die bonding support, the sponge will move away from the bottom of the wafer suction block.

[0041] Preferably, the pushing assembly includes an inclined surface opened in the bottom of the rotating plate, and the bottom of the sliding rod is fixedly connected with a spring one;

[0042] When the sliding rod slides downward, the reaction force of the spring one will push the sponge to adhere to the bottom of the wafer suction block;

[0043] The sliding rail two has a long sliding space reserved inside, so that after the wafer is grabbed and installed, even if the limiting rod drives the push rod to move, the L-shaped slide plate still needs to move a small displacement along the inner wall of the sliding rail two, which provides enough time for the wafer suction block to shrink after the device completes the grabbing and installation, avoiding too fast running speed, causing the torsional spring to be stuck in the side wall of the wafer suction block, affecting the operation of the device.

[0044] The present application has the following advantages:

[0045] (1) The present application utilizes the regular swing characteristics of the swing arm, and sets a transmission mechanism and a scratching mechanism inside the device, wherein the limiting rod drives the sliding block and the L-shaped slide plate to slide, and the L-shaped slide plate scratches and cleans the bottom of the wafer suction block through the sponge, through the application of the above components, the device can effectively remove the residual glue on the bottom of the wafer suction block during use, avoiding the influence of residual glue on the efficiency of subsequent die bonding.

[0046] (2) The sponge is used for cleaning the bottom colloid of the suction block, the rolling column and the inclined surface are arranged in the equipment, when the swing arm moves to the direction of the die bonding support, the rolling column moves outward, a torsional spring is pushed, the horizontal height of the rotating plate is lower than the limiting rod, in this process, the bottom of the limiting rod has a wafer, and the height of the sponge is far lower than the bottom of the rotating plate, so that the sponge will not contact the bottom of the suction block when the suction block transports the wafer, the cleaning is ensured, and the wafer is prevented from falling off due to the cleaning position;

[0047] (3) The sponge is used for cleaning the bottom colloid of the suction block, the rolling column and the inclined surface are arranged in the equipment, when the swing arm moves to the direction of the die bonding support, the rolling column moves outward, a torsional spring is pushed, the horizontal height of the rotating plate is lower than the limiting rod, in this process, the bottom of the limiting rod has a wafer, and the height of the sponge is far lower than the bottom of the rotating plate, so that the sponge will not contact the bottom of the suction block when the suction block transports the wafer, the cleaning is ensured, and the wafer is prevented from falling off due to the cleaning position;

[0048] (4) The longer sliding space is reserved in the sliding rail two, so that after the wafer is gripped and installed, even if the limiting rod drives the push rod to move, the L-shaped slide plate still needs to displace a small section on the inner wall of the sliding rail two, so that the suction block has enough time to shrink after the equipment completes gripping and installation, the running speed is prevented from being too high, the torsional spring is prevented from being stuck on the side wall of the suction block, and the operation of the equipment is affected. BRIEF DESCRIPTION OF DRAWINGS

[0049] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiment description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without any creative effort.

[0050] Figure 1 It is a schematic diagram of the overall structure of the present application;

[0051] Figure 2 It is a schematic diagram of the bottom of the overall structure of the present application;

[0052] Figure 3 It is a schematic diagram of the driving assembly of the present application;

[0053] Figure 4 It is a schematic diagram of the transmission mechanism of the present application;

[0054] Figure 5 It is a schematic diagram of the pulling assembly of the present application;

[0055] Figure 6An enlarged schematic view of A in the present application; Figure 5 An enlarged schematic view of A in the present application;

[0056] Figure 7 A cross-sectional schematic view of the scraping mechanism in the present application;

[0057] Figure 8 A cross-sectional schematic view of the pushing assembly in the present application;

[0058] Figure 9 An enlarged schematic view of B in the present application; Figure 8 An enlarged schematic view of B in the present application;

[0059] In the drawings, the components represented by each reference numeral are listed as follows:

[0060] In the drawings, 1 is the mounting mechanism, 11 is the fixing assembly, 12 is the driving assembly, 13 is the numerical control motor, 111 is the fixing block, 112 is the connecting frame, 113 is the mounting frame, 121 is the driving rod, 122 is the connecting rod, 123 is the swing arm, 124 is the crystal suction block, 2 is the transmission mechanism, 21 is the linkage assembly, 22 is the pulling assembly, 211 is the through-hole groove, 212 is the sliding rail, 213 is the sliding block, 214 is the limiting rod, 215 is the support plate, 221 is the sliding rail one, 222 is the L-shaped sliding rod, 223 is the pushing rod, 224 is the L-shaped sliding plate, 225 is the sliding rail two, 3 is the scraping mechanism, 31 is the scraping assembly, 32 is the pushing assembly, 311 is the rotating plate, 312 is the sponge, 313 is the sliding rod, 314 is the rolling column, 321 is the torsional spring, 322 is the inclined surface, 323 is the vertical sliding groove, and 324 is the spring one. DETAILED DESCRIPTION

[0061] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0062] Embodiment one, please refer to Figure 1 - Figure 9 The present application is a die bonding structure of an LED display module, which comprises a numerical control motor 13.

[0063] The mounting mechanism 1 is used for fixedly mounting the whole device, so that the device will not shake during operation.

[0064] The transmission mechanism 2 is fixedly arranged on the side wall of the mounting mechanism 1, and is used for removing residual colloid in the die bonding environment and providing driving force.

[0065] Scratching mechanism 3, the scratching mechanism 3 is fixedly arranged on the inner wall of the transmission mechanism 2, is used for converting the moving force of the transmission mechanism 2 into the pushing force of scratching;

[0066] Wherein, before use, the device is installed at the required position through the installation mechanism 1, and then the numerical control motor 13 drives the scratching mechanism 3 to carry out the scratching process through the transmission mechanism 2.

[0067] The installation mechanism 1 comprises:

[0068] The fixed assembly 11 is fixedly connected to the side wall of the numerical control motor 13 through the fixing piece;

[0069] The fixing piece comprises a fixed block 111 fixedly connected to the bottom of the numerical control motor 13;

[0070] The driving assembly 12 is fixedly connected to the output shaft outer wall of the numerical control motor 13 through the driving piece;

[0071] The driving piece comprises a driving rod 121 fixedly connected to the output shaft of the numerical control motor 13, a connecting rod 122 fixedly connected to the side wall of the driving rod 121, and a swing arm 123 fixedly connected to the inner wall of the connecting rod 122;

[0072] Wherein, when the device is running, the numerical control motor 13 drives the connecting rod 122 and the swing arm 123 to swing through the driving rod 121, and the wafer transportation process of the device foundation is completed.

[0073] The transmission mechanism 2 comprises:

[0074] The linkage assembly 21 is fixedly connected to the outer wall of the swing arm 123 through the linkage piece;

[0075] The linkage piece comprises a through hole groove 211 opened in the top of the swing arm 123, and a sliding rail 212 fixedly connected to the inner wall of the through hole groove 211;

[0076] The pulling assembly 22 is fixedly connected to the side wall of the swing arm 123 through the pulling piece;

[0077] The pulling piece comprises a sliding rail one 221 fixedly connected to the side wall of the swing arm 123, and an L-shaped sliding rod 222 slidably connected to the inner wall of the sliding rail one 221;

[0078] Wherein, when the swing arm 123 is regularly swung by the numerical control motor 13, at this time, the swinging force is transmitted to the pulling assembly 22 through the linkage assembly 21, so that the pulling assembly 22 drives the scratching mechanism 3 to carry out the scratching process.

[0079] The scratching mechanism 3 comprises:

[0080] Scratching assembly 31, which is rotatably connected to the inner wall of the L-shaped slide rod 222 through a rotating part;

[0081] The rotating part comprises a rotating plate 311 rotatably connected to the inner wall of the L-shaped slide rod 222, and the top of the rotating plate 311 is fixedly connected with a sponge 312;

[0082] Pushing assembly 32, which is fixedly connected to the inner wall of the rotating plate 311 through a contact part;

[0083] The contact part comprises a torsional spring 321 fixedly connected to the inner wall of the rotating plate 311, and the other end of the torsional spring 321 is fixedly connected with the outer wall of the L-shaped slide rod 222;

[0084] Wherein, the torsional spring 321 will drive part of the rotating plate 311 to reset, so that when the L-shaped slide rod 222 moves outward, the torsional spring 321 will drive the rotating plate 311 and the sponge 312 away from the scratching area.

[0085] Embodiment two, please refer to Figure 3 - Figure 9 The fixing assembly 11 comprises a mounting bracket 113 fixedly connected to the end of the connecting frame 112 away from the fixed block 111, based on example one.

[0086] Wherein, before use, the staff installs the equipment at the required position through the mounting bracket 113, and ensures that the right side of the swing arm 123 is the die bonding support and the left side is the wafer tray;

[0087] In use, the staff fixes the equipment at the required position through the mounting bracket 113, and ensures that the right side of the swing arm 123 is the die bonding support and the left side is the wafer tray, as shown in Figure 1 After completing the equipment debugging, the numerical control motor 13 drives the connecting rod 122 and the swing arm 123 to swing regularly through the driving rod 121.

[0088] The driving assembly 12 comprises a wafer suction block 124 fixedly connected to the end of the swing arm 123 away from the connecting rod 122;

[0089] Wherein, when the wafer suction block 124 reaches the top of the wafer tray, it grabs a wafer and reaches the wafer support under the swing of the swing arm 123, and the wafer suction block 124 inserts the wafer into the designated position.

[0090] The linkage assembly 21 comprises a support plate 215 fixedly connected to the side wall of the fixed block 111, and a sliding block 213 slidingly connected to the inner wall of the sliding rail 212, and the top of the sliding block 213 is rotatably connected with a limiting rod 214, and the end of the limiting rod 214 away from the sliding block 213 is rotatably connected with the right bottom of the support plate 215;

[0091] When the swing arm 123 swings to the right, the limiting rod 214 pushes the sliding block 213 to slide outward along the inner wall of the sliding rail 212, and when the swing arm 123 swings to the left, the limiting rod 214 drives the sliding block 213 to move along the inner wall of the sliding rail 212 to the direction of the connecting rod 122.

[0092] The pulling assembly 22 comprises a pushing rod 223 fixedly connected to the bottom of the sliding block 213, and the end of the pushing rod 223 away from the sliding block 213 is fixedly connected with an L-shaped sliding plate 224, and the bottom of the L-shaped sliding plate 224 is fixedly connected with a sliding rail two 225.

[0093] When the limiting rod 214 drives the pushing rod 223 to move synchronously through the sliding block 213, the moving force is transmitted to the L-shaped sliding plate 224 through the pushing rod 223, so that the scraping mechanism 3 is driven to scrape and clean.

[0094] When the swing arm 123 drives the wafer to move to the direction of the die bonding support through the suction crystal block 124, the angle between the supporting plate 215 and the sliding rail 212 decreases, at this time, the limiting rod 214 pushes the sliding block 213 and the pushing rod 223 to slide outward along the inner wall of the sliding rail 212, at this time, the pushing rod 223 drives the L-shaped sliding plate 224 to synchronously slide outward along the inner wall of the sliding rail two 225, and the state as shown in Figure 7 is presented.

[0095] The scraping assembly 31 comprises a vertical sliding groove 323 opened in the top of the L-shaped sliding plate 224, a sliding rod 313 slidably connected to the top of the vertical sliding groove 323, and a rolling column 314 rotatably connected to the side wall of the sliding rod 313.

[0096] After the swing arm 123 completes the die bonding process, the swing arm 123 is rotated to the position of the wafer again, at this time, the limiting rod 214 drives the sliding block 213 and the pushing rod 223 to move along the inner wall of the sliding rail 212 to the direction of the supporting plate 215, so that the sliding block 213 can drive the L-shaped sliding plate 224 to synchronously displace, at this time, the L-shaped sliding plate 224 drives the sliding rod 313 and the rolling column 314 to move, so that the rolling column 314 is in contact with the outer wall of the inclined surface 322, with the movement of the rolling column 314, the rotating plate 311 drives the sponge 312 to be raised upward with the torsional spring 321 as the center, and then the L-shaped sliding plate 224 drives the L-shaped sliding rod 222 and the sponge 312 to move to the direction of the supporting plate 215 through the sliding rail two 225, at this time, the sponge 312 scrapes and cleans the bottom of the suction crystal block 124, and removes the residual glue at the bottom of the limiting rod 214.

[0097] When the sponge 312 contacts the bottom of the suction block 124, the sliding rod 313 is closer to the torsion spring 321, so that the rotating plate 311 is in an upwardly curved state, and when the sponge 312 passes through the top of the suction block 124, the sliding rod 313 slides downward along the inner wall of the vertical sliding groove 323;

[0098] The torsion spring 321 always generates a torsion force, forcing the rotating plate 311 to rotate counterclockwise around the torsion spring 321, and when the sliding rod 313 reaches the outermost of the sliding rail two 225, the torsion spring 321 drives the sponge 312 to the bottom, and the pushing rod 223 pushes the L-shaped sliding plate 224, which drives the sliding rail two 225 and the L-shaped sliding rod 222 to slide outward along the inner wall of the sliding rail one 221, so that when the swing arm 123 swings towards the die bonding support, the sponge 312 moves away from the bottom of the suction block 124.

[0099] The pushing assembly 32 includes an inclined surface 322 formed in the bottom of the rotating plate 311, and the bottom of the sliding rod 313 is fixedly connected with a spring one 324;

[0100] When the sliding rod 313 slides downward, the reaction force of the spring one 324 pushes the sponge 312 to tightly adhere to the bottom of the suction block 124.

[0101] The sliding rail two 225 has a long sliding space reserved inside, so that after the wafer is grabbed and installed, even if the limiting rod 214 drives the pushing rod 223 to move, the L-shaped sliding plate 224 still needs to displace a small distance along the inner wall of the sliding rail two 225, which provides sufficient time for the suction block 124 to shrink after the device completes the grabbing and installation, avoiding too fast running speed, causing the torsion spring 321 to be stuck in the side wall of the suction block 124, affecting the operation of the device.

[0102] One specific application of the embodiment is that in use, the worker fixes the device at the desired position through the mounting frame 113, and ensures that the right side of the swing arm 123 is the die bonding support and the left side is the wafer tray, as shown in Figure 1 After the device is debugged, the numerical control motor 13 drives the connecting rod 122 and the swing arm 123 to swing regularly through the driving rod 121, and in this process, a wafer is grabbed when the suction block 124 reaches the top of the wafer tray, and is placed on the wafer support under the swing of the swing arm 123, and the suction block 124 pushes the wafer into the specified position of the die bonding support, completing the basic die bonding process of the device.

[0103] In this process, when the swing arm 123 moves the wafer to the direction of the die bonding support through the suction block 124, the angle between the support plate 215 and the sliding rail 212 decreases, at this time the limiting rod 214 will push the sliding block 213 and the push rod 223 to slide outward along the inner wall of the sliding rail 212, at this time the push rod 223 drives the L-shaped sliding plate 224 to slide outward along the inner wall of the sliding rail two 225 synchronously, showing the state as shown in Figure 7 During this process, the torsional spring 321 always generates a torsional force, forcing the rotating plate 311 to rotate counterclockwise around the torsional spring 321, and when the sliding rod 313 reaches the outermost part of the sliding rail two 225, the torsional spring 321 will drive the sponge 312 to the bottom, and the pushing force of the push rod 223 will drive the sliding rail two 225 and the L-shaped sliding rod 222 to slide outward along the inner wall of the sliding rail one 221 through the L-shaped sliding plate 224, so that when the swing arm 123 swings to the direction of the die bonding support, the sponge 312 will move away from the bottom of the suction block 124;

[0104] After the swing arm 123 completes the die bonding process, the swing arm 123 will rotate to the position of the wafer again, at this time the limiting rod 214 drives the sliding block 213 and the push rod 223 to move along the inner wall of the sliding rail 212 to the direction of the support plate 215, so that the sliding block 213 can drive the L-shaped sliding plate 224 to move synchronously, at this time the L-shaped sliding plate 224 drives the sliding rod 313 and the rolling column 314 to move, so that the rolling column 314 contacts the outer wall of the inclined surface 322, and as the rolling column 314 moves, the rotating plate 311 drives the sponge 312 to rise upward around the torsional spring 321, and then the L-shaped sliding plate 224 drives the L-shaped sliding rod 222 and the sponge 312 to move to the direction of the support plate 215 through 2245, at this time the sponge 312 will scratch and clean the bottom of the suction block 124, removing the residual glue at the bottom of the limiting rod 214;

[0105] In addition, the sliding rail two 225 has a long sliding space inside, so that after the wafer is grabbed and installed, even if the limiting rod 214 drives the push rod 223 to move, the L-shaped sliding plate 224 still needs to move a small distance along the inner wall of the sliding rail two 225, which provides enough time for the suction block 124 to shrink after the device completes the grabbing and installation, avoiding too fast running speed, causing the torsional spring 321 to be stuck in the side wall of the suction block 124, affecting the operation of the device.

[0106] The preferred embodiments of the application disclosed above are only to facilitate the elucidation of the application. The preferred embodiments do not describe all the details of the application and limit the application to the specific embodiments described. Obviously, many modifications and variations can be made in light of the teachings above. The description is chosen and described in order to best explain the principles of the application and its practical application to thereby enable others skilled in the art to best utilize the application and get the best results from the application. The application is only limited by the claims and their full scope and equivalents.

Claims

1. A die bonding structure of an LED display module, comprising a numerical control motor (13), characterized in that, Also include: The installation mechanism (1) is used for fixing the installation of the whole device, and ensures that the device does not shake during operation; Transmission mechanism (2), the transmission mechanism (2) is fixedly arranged on the side wall of the installation mechanism (1), is used for removing the residual glue in the die bonding environment, and provides driving force; Scratch mechanism (3), the scratch mechanism (3) is fixedly arranged on the inner wall of the transmission mechanism (2), is used for converting the moving force of the transmission mechanism (2) into the pushing force of the scratch; Wherein, before use, the device is installed at the required position through the installation mechanism (1), and then the numerical control motor (13) drives the scratch mechanism (3) to carry out the scratch process through the transmission mechanism (2); The installation mechanism (1) comprises: The fixed component (11) is fixedly connected to the side wall of the numerical control motor (13) through the fixing piece; The fixing piece comprises a fixed block (111) fixedly connected to the bottom of the numerical control motor (13); The driving component (12) is fixedly connected to the output shaft outer wall of the numerical control motor (13) through the driving piece; The driving piece comprises a driving rod (121) fixedly connected to the output shaft of the numerical control motor (13), a connecting rod (122) fixedly connected to the side wall of the driving rod (121), and a swing arm (123) fixedly connected to the inner wall of the connecting rod (122); Wherein, during the operation of the device, the numerical control motor (13) drives the connecting rod (122) and the swing arm (123) to swing through the driving rod (121), and completes the wafer transportation process of the device foundation; The transmission mechanism (2) comprises: The linkage assembly (21) is fixedly connected to the outer wall of the swing arm (123) through the linkage piece; The linkage piece comprises a through hole slot (211) formed in the top of the swing arm (123), and a sliding rail (212) fixedly connected to the inner wall of the through hole slot (211); The pulling component (22) is fixedly connected to the side wall of the swing arm (123) through the pulling piece; The pulling piece comprises a sliding rail one (221) fixedly connected to the side wall of the swing arm (123), and an L-shaped sliding rod (222) slidably connected to the inner wall of the sliding rail one (221); Wherein, when the swing arm (123) is regularly swung by the numerical control motor (13), the swing force is transmitted to the pulling component (22) through the linkage assembly (21) at this time, so that the pulling component (22) drives the scratch mechanism (3) to carry out the scratch process; The scratch mechanism (3) comprises: The scratch assembly (31) is rotatably connected to the inner wall of the L-shaped sliding rod (222) through the rotating piece; The rotating piece comprises a rotating plate (311) rotatably connected to the inner wall of the L-shaped sliding rod (222), and a sponge (312) fixedly connected to the top of the rotating plate (311); The pushing assembly (32) is fixedly connected to the inner wall of the rotating plate (311) through the contact piece; The contact piece comprises a torsion spring (321) fixedly connected at the inner wall of the rotating plate (311), and the other end of the torsion spring (321) is fixedly connected with the outer wall of the L-shaped slide rod (222); Wherein, the torsion spring (321) drives the part of the rotating plate (311) to reset, so that when the L-shaped slide rod (222) moves outward, the torsion spring (321) drives the rotating plate (311) and the sponge (312) away from the scratching area. 2.The die bonding structure of an LED display module according to claim 1, characterized in that: The fixing assembly (11) comprises a mounting rack (113) fixedly connected at one end of the connecting frame (112) away from the fixed block (111); Wherein, before use, the staff installs the equipment at the required position through the mounting rack (113), and ensures that the right side of the swing arm (123) is the die bonding support and the left side is the wafer tray. 3.The die bonding structure of an LED display module according to claim 2, characterized in that: The driving assembly (12) comprises a wafer suction block (124) fixedly connected at one end of the swing arm (123) away from the connecting rod (122); Wherein, when the wafer suction block (124) reaches the top of the wafer tray, it grabs a wafer and reaches the wafer support under the swing of the swing arm (123), and the wafer suction block (124) inserts the wafer into the designated position. 4.The die bonding structure of an LED display module according to claim 3, characterized in that: The linkage assembly (21) comprises a support plate (215) fixedly connected at the side wall of the fixed block (111), a sliding block (213) slidably connected at the inner wall of the sliding rail (212), a limiting rod (214) rotatably connected at the top of the sliding block (213), and the right bottom of the support plate (215) is rotatably connected with one end of the limiting rod (214) away from the sliding block (213); Wherein, when the swing arm (123) swings to the right, the limiting rod (214) pushes the sliding block (213) to slide outward along the inner wall of the sliding rail (212), and when the swing arm (123) swings to the left, the limiting rod (214) drives the sliding block (213) to move along the inner wall of the sliding rail (212) to the direction of the connecting rod (122). 5.The die bonding structure of an LED display module according to claim 4, characterized in that: The pulling assembly (22) comprises a pushing rod (223) fixedly connected at the bottom of the sliding block (213), and the one end of the pushing rod (223) away from the sliding block (213) is fixedly connected with an L-shaped slide plate (224), and the bottom of the L-shaped slide rod (222) is fixedly connected with a sliding rail two (225); When the limiting rod (214) drives the pushing rod (223) to move synchronously through the sliding block (213), the moving force is transmitted to the L-shaped slide plate (224) through the pushing rod (223), and the scratching mechanism (3) is driven to scratch and clean. 6.The die bonding structure of an LED display module according to claim 5, characterized in that: The scratching assembly (31) comprises a vertical sliding groove (323) opened at the top of the L-shaped slide plate (224), a sliding rod (313) slidably connected at the top of the vertical sliding groove (323), and a rolling column (314) rotatably connected at the side wall of the sliding rod (313); Wherein, when sponge (312) contacts with the bottom of the crystal block (124), the rotating plate (311) forms a upward state due to the position of the slide rod (313) is closer to the position of the torsion spring (321), and when sponge (312) passes through the top of the crystal block (124), the slide rod (313) will slide down along the inner wall of the vertical sliding groove (323) at this time. 7.The die bonding structure of the LED display module according to claim 6, characterized in that: The push assembly (32) comprises an inclined surface (322) opened at the bottom of the rotating plate (311), and the bottom of the slide rod (313) is fixedly connected with a spring one (324). Wherein, when the slide rod (313) slides down, the reaction force of the spring one (324) will push the sponge (312) to tightly adhere to the bottom of the crystal block (124).

Images