Display module and display device

Abstract

The invention relates to a display module and a display device. The display module comprises a display panel, a cover plate assembly and a non-Newtonian fluid material. The cover plate assembly is arranged on one side of the display panel and comprises an ultra-thin glass layer and a covering layer, the ultra-thin glass layer is located on one side of the display panel, and the covering layer at least covers the side, away from the display panel, of the ultra-thin glass layer; the non-Newtonian fluid material is located between the ultra-thin glass layer and the display panel, and the non-Newtonian fluid material is an anti-impact material with a shear thickening function; the bending performance of the display module can be guaranteed in the bending process, and meanwhile, under high-speed impact, the dynamic bonds in the non-Newtonian fluid are used for breaking to absorb energy and disperse impact force, so that the display module has the folding performance and high impact resistance.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display module and a display device. Background Art

[0002] Folding display devices are a future technology development trend. Folding has brought a new development direction to the display industry. Currently, the most popular ones are organic light emitting diode (OLED) display devices. They have unique bending and folding properties, which can be prepared into folding display devices in various forms. They are easy to carry and store when going out, and have received widespread attention in the market.

[0003] At present, when the outermost cover of the folding display module is made of organic polymer film, the surface of the folding display module usually feels soft, plastic-like, and has severe creases. At the same time, organic polymers are very helpful in improving the impact resistance of the display module. Simply removing the organic polymer film will cause the display module to have insufficient impact resistance. Summary of the Invention

[0004] The embodiments of the present application provide a display module and a display device that can reduce the risk of creases while meeting the requirements for impact resistance.

[0005] An embodiment of the present application provides a display module, comprising:

[0006] Display panel;

[0007] a cover plate assembly, disposed on the light-emitting side of the display panel, the cover plate assembly comprising an ultra-thin glass layer and a cover layer, the ultra-thin glass layer being located on one side of the display panel, the cover layer at least covering a side of the ultra-thin glass layer away from the display panel;

[0008] a non-cowhide buffer layer, disposed between the display panel and the ultra-thin glass layer, wherein the modulus of the non-cowhide buffer layer increases with increasing strain rate;

[0009] Wherein, the distance from the non-cowhide buffer layer to the display panel is shorter than the distance from the non-cowhide buffer layer to the ultra-thin glass layer.

[0010] Optionally, the non-cow buffer layer material includes at least one of thermoplastic polyurethane, silicone gel, and shear thickening material.

[0011] Optionally, the thickness of the non-cow buffer layer is greater than or equal to 15 μm and less than or equal to 100 μm, and the modulus of the non-cow buffer layer is greater than or equal to 10 MPa and less than or equal to 500 MPa.

[0012] Optionally, a first adhesive layer is provided between the non-cowhide buffer layer and the display panel.

[0013] Optionally, the thickness of the first adhesive layer is equal to the distance from the non-coated buffer layer to the display panel, and the thickness of the adhesive layer is greater than or equal to 15 μm and less than or equal to 75 μm.

[0014] Optionally, an organic film layer is provided on the non-coated buffer layer, and the non-coated buffer layer is provided on a side of the organic film layer facing the display panel.

[0015] Optionally, an organic film layer is provided on the non-cow buffer layer;

[0016] A second adhesive layer is provided between the non-coated buffer layer and the organic film layer.

[0017] Optionally, the display module further includes:

[0018] a third adhesive layer, disposed between the organic film layer and the ultra-thin glass layer;

[0019] The cover assembly further includes a black light-shielding layer, which is disposed on a side of the ultra-thin glass layer close to the display panel;

[0020] The cover plate assembly further comprises a hard functional layer, which is arranged on a side of the cover layer away from the display panel;

[0021] a protective film layer, disposed on a side of the hard functional layer facing away from the display panel;

[0022] The fourth adhesive layer is disposed between the protective film layer and the hard functional layer.

[0023] Optionally, the covering layer also covers the sidewalls of the ultra-thin glass layer.

[0024] Optionally, the display module includes a bending zone and a non-bending zone arranged on at least one side of the bending zone, the thickness of the ultra-thin glass layer is not equal in the bending zone and the non-bending zone, and the distance from the non-cowhide buffer layer in the bending zone to the ultra-thin glass layer is greater than or equal to the distance from the non-cowhide buffer layer in the non-bending zone to the ultra-thin glass layer.

[0025] Optionally, the display module is of an outward-folding type, a groove is provided on the side of the ultra-thin glass layer away from the display panel, the groove is located in the bending zone, the covering layer at least covers the side of the ultra-thin glass layer away from the display panel and fills the groove, and the distance from the non-cowhide buffer layer in the bending zone to the ultra-thin glass layer is equal to the distance from the non-cowhide buffer layer in the non-bending zone to the ultra-thin glass layer.

[0026] Optionally, the display module is of an inward-folding type, a groove is provided on the side of the ultra-thin glass layer close to the display panel, the groove is located in the bending area, the covering layer covers the side of the ultra-thin glass layer close to the display panel and fills the groove, and the distance from the non-cowhide buffer layer to the ultra-thin glass layer in the bending area is greater than the distance from the non-cowhide buffer layer to the ultra-thin glass layer in the non-bending area.

[0027] Correspondingly, an embodiment of the present application further provides a display device, which includes the display module as described in any one of the above embodiments.

[0028] Beneficial effects:

[0029] The present application discloses a display module and a display device. An ultra-thin glass layer is provided in the cover assembly to effectively improve the hardness of the cover, improve the touch and reduce the crease phenomenon. At the same time, in order to have both impact resistance and shock resistance, a non-cow buffer layer is provided between the ultra-thin glass layer and the display panel. The non-cow buffer layer has a modulus that increases with the increase of strain rate. When an external force instantly impacts, the non-cow buffer layer can increase the modulus to absorb the external force impact, thereby improving the impact resistance of the display module. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The following detailed description of the specific embodiments of the present application in conjunction with the accompanying drawings will make the technical solutions and other beneficial effects of the present application apparent.

[0031] Figure 1 A schematic diagram of a display module according to an embodiment of the present invention

[0032] Figure 2 A schematic diagram of the first structure of the display module provided in an embodiment of the present application;

[0033] Figure 3 Schematic diagram of strain rate-stress curve of non-cow material provided in the embodiment of the present application;

[0034] Figure 4 Schematic diagram of the dynamic bond structure of the non-cow material provided in the embodiment of the present application;

[0035] Figure 5 Another structural schematic diagram of a display module provided in an embodiment of the present application;

[0036] Figure 6 A schematic diagram of the structure of a display module with outward-folding ultra-thin glass of unequal thickness provided in an embodiment of the present application;

[0037] Figure 7 A schematic diagram of the structure of a display module with inward-folding ultra-thin glass of unequal thickness provided in an embodiment of the present application;

[0038] Description of reference numerals:

[0039] 1. Panel; 2. First OCA adhesive layer; 5. Organic film layer; 6. Second OCA adhesive layer; 7. Cover layer; 8. Third OCA adhesive layer; 9. Protective film layer;

[0040] 100, display module; 10, display panel; W1, bending area; W2, non-bending area;

[0041] 20. first adhesive layer;

[0042] 30. Non-cow buffer layer; 31. Polymer molecular main chain; 32. Modified polymer molecular main chain; 33. Dynamic bond;

[0043] 40. second adhesive layer;

[0044] 50. Organic film layer;

[0045] 60. third adhesive layer;

[0046] 70. Cover plate assembly; 71. Ultra-thin glass layer; 72. Cover layer; 73. Black light-shielding layer; 74. Hard functional layer; 75. Groove;

[0047] 80. fourth adhesive layer;

[0048] 90. Protective film layer;

[0049] L1, the vertical distance from the non-cowhide buffer layer to the display panel; L2, the vertical distance from the non-cowhide buffer layer to the ultra-wave glass layer; L2.1, the vertical distance from the non-cowhide buffer layer to the ultra-thin glass layer in the non-bending area; L2.2, the vertical distance from the non-cowhide buffer layer to the ultra-thin glass layer in the bending area. DETAILED DESCRIPTION

[0050] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative efforts are within the scope of protection of this application. In addition, it should be understood that the specific embodiments described here are only used to illustrate and explain the present application and are not used to limit the present application. In this application, the various embodiments can be combined with each other but will not be repeated one by one. In addition, unless otherwise specified, the directional words used, such as "upper" and "lower", generally refer to the upper and lower parts of the device in actual use or working state, specifically the drawing direction in the drawings; while "inner" and "outer" refer to the outline of the device; the terms "first", "second", "third", etc. are used only as labels and do not impose numerical requirements or establish an order.

[0051] The embodiments of the present application provide a display module and a display device, which are described in detail below. It should be noted that the order of description of the following embodiments does not limit the preferred order of the embodiments.

[0052] Please refer to Figure 1 The folding display module includes a panel 1, a first OCA adhesive layer 2, an organic film layer 5, a second OCA adhesive layer 6, a cover layer 7, a third OCA adhesive layer 8, and a protective film layer 9 stacked in sequence; currently, when the cover layer directly uses glass as the outermost cover layer, such as ultra-thin glass (UTG), the hardness of the cover can be improved and creases can be reduced. However, due to the lack of protection of an organic film layer, the impact resistance of the display module will be reduced, which will bring the risk of failure.

[0053] See also Figure 2 The present invention provides a display module 100 including a bending region W1 and a non-bending region W2 disposed on at least one side of the bending region W1. The display module 100 includes a display panel 10, a cover assembly 70, and a non-coated buffer layer 30; wherein the cover assembly 70 includes an ultra-thin glass layer 71 and a cover layer 72;

[0054] The display panel 10 is disposed in the bending region W1 and the non-bending region W2. A cover assembly 70 is disposed on the light-emitting side of the display panel 10. The ultra-thin glass layer 71 in the cover assembly 70 is disposed on the side closest to the display panel 10, and a cover layer 72 covers at least the side of the ultra-thin glass layer 71 facing away from the display panel 10. A non-coated buffer layer 30 is disposed between the display panel and the cover assembly.

[0055] The vertical distance between the non-coated buffer layer 30 and the display panel 10 is L1, and the vertical distance between the non-coated buffer layer 30 and the ultra-thin glass layer 71 is L2, and L1 is smaller than L2.

[0056] During implementation, the embodiment of the present application provides the ultra-thin glass layer 71 in the cover assembly 70 to effectively improve the hardness of the cover 70, improve the tactile feel, and reduce the crease phenomenon. At the same time, to overcome the problem of easy shattering of ultra-thin glass, a cover layer 72 is provided on at least one side of the ultra-thin glass layer 71 away from the display panel 10. The cover layer 72 can effectively protect the ultra-thin glass layer 71 and prevent the ultra-thin glass layer from shattering. The cover layer 72 can be made of materials such as polyethylene terephthalate (PET), thermoplastic polyurethane (TPU), or polymethyl methacrylate (PMMA).

[0057] It should be noted that the use of ultra-thin glass in the cover assembly, while improving the tactile feel and crease phenomenon, often leads to a reduction in impact resistance, such as a decrease in pen drop and ball drop performance. In order to improve the impact resistance, a non-cow buffer layer 30 is provided between the ultra-thin glass layer 71 and the display panel 10, wherein the material of the non-cow buffer layer 30 has the property that the stress (modulus) increases with the increase of the external stress rate. When an external impact acts on the outer surface of the cover assembly 70, the non-cow buffer layer 30 located on the lower side of the cover assembly 70 can absorb part of the external impact by increasing the modulus, thereby improving the impact resistance of the display module 100.

[0058] It should also be understood that the smaller the vertical distance between the non-cow buffer layer 30 and the display panel 10, the greater the improvement in the impact resistance of the display panel 10; this is mainly because the non-cow buffer layer 30 can absorb external impact energy, and the closer it is to the display panel 10, the better the effect of directly absorbing the impact energy on the display panel 10, and at the same time it can also provide additional structural support to a certain extent, which can reduce the deformation of the display panel 10; so when the vertical distance L1 between the non-cow buffer layer 30 and the display panel 10 is smaller than the vertical distance L2 between the non-cow buffer layer 30 and the ultra-thin glass layer 71, the non-cow buffer layer 30 is closer to the display panel 10, and the effect of improving the impact resistance to the outside world is more obvious.

[0059] It should be noted that the display panel 10 is an OLED display panel, and the display module can be a foldable display module.

[0060] In some embodiments, the display panel 10 may include a substrate and a thin film transistor layer disposed on the substrate, with the thin film transistor layer located on a side of the substrate proximal to the cover assembly 70. The substrate may be a rigid substrate, such as a glass substrate; or a flexible substrate, such as a polyimide substrate. When the substrate is a flexible substrate, it may be formed from multiple sub-substrates made of the same material, such as polyimide, with adjacent sub-substrates bonded together by adhesive sub-layers.

[0061] In some embodiments, the thin film transistor layer includes a thin film transistor, which includes a semiconductor located on a substrate. The semiconductor can be formed of polysilicon or a metal oxide (such as indium gallium zinc oxide). The semiconductor is divided into a channel region and a source region and a drain region formed on both sides of the channel region. The thin film transistor layer also includes a first gate insulating layer, which covers the semiconductor. The thin film transistor also includes a first gate formed on the first gate insulating layer, and the first gate overlaps with the channel region. The first gate can be formed as multiple layers or a single layer including a low-resistance material such as Al, Ti, Mo, Cu, Ni, or an alloy thereof, or a material with high corrosion resistance. The thin film transistor layer also includes a second gate insulating layer, which covers the first gate. The thin film transistor also includes a second gate located on the second gate insulating layer, which overlaps with the first gate. The second gate can be formed as multiple layers or a single layer including a low-resistance material such as Al, Ti, Mo, Cu, Ni, or an alloy thereof, or a material with high corrosion resistance. The thin film transistor layer also includes a first interlayer insulating layer formed on the second gate. The first interlayer insulating layer, the first gate insulating layer and the second gate insulating layer include a source contact hole and a drain contact hole, and the source region and the drain region are exposed through the source contact hole and the drain contact hole respectively.

[0062] The thin film transistor also includes a source electrode and a drain electrode arranged in the same layer, both formed on the first interlayer insulating layer, the source electrode is connected to the source region through the source contact hole, and the drain electrode is connected to the drain region through the drain contact hole. The source electrode and the drain electrode can be multiple layers or a single layer formed of a low-resistance material such as Al, Ti, Mo, Cu, Ni, or their alloys, or a material with high corrosion resistance. For example, the source electrode and the drain electrode can be a triple layer of Ti / Cu / Ti, Ti / Ag / Ti, Ti / Al / Ti or Mo / Al / Mo, or other single or multilayer structures.

[0063] In some embodiments, the display panel 10 further includes a planar layer located between the thin film transistor layer and the light emitting layer, and the planar layer covers the source electrode and the drain electrode.

[0064] In some embodiments, the display panel 10 further includes an anode layer located on a side of the planar layer away from the thin-film transistor layer. The anode layer includes a plurality of anodes, each corresponding to a pixel unit. Each anode is electrically connected to a thin-film transistor. The planar layer includes anode contact holes, through which the anodes contact the source or drain of the thin-film transistor.

[0065] In some embodiments, the display panel 10 further includes a pixel definition layer, which is disposed on a side of the planar layer away from the thin-film transistor layer. The pixel definition layer includes pixel definition portions and openings located between the pixel definition portions. The display panel 10 further includes a light-emitting layer, which includes a plurality of pixel units. The pixel units are located within the openings. The openings expose a portion of the anode and cover the edges of the anode. The pixel units may include red pixel units, green pixel units, and blue pixel units.

[0066] In some embodiments, the display panel 10 further includes a cathode layer, which covers the light-emitting layer. In the direction from the anode to the cathode layer, the light-emitting layer includes a hole-forming organic layer, a light-emitting material layer, and an electronic organic layer stacked in sequence. The hole-forming organic layer may include a hole injection layer and a hole transport layer, the hole injection layer is in direct contact with the anode, and the hole transport layer is located between the hole injection layer and the light-emitting material layer. The hole-forming organic layer may further include an electron blocking layer located between the hole transport layer and the light-emitting material layer. The electronic organic layer may include an electron injection layer and an electron transport layer, the electron injection layer is in direct contact with the cathode layer, and the electron transport layer is located between the electron injection layer and the light-emitting material layer. The electronic organic layer may further include a hole blocking layer located between the electron transport layer and the light-emitting layer.

[0067] In some embodiments, the display panel 10 further includes an encapsulation layer located on a side of the cathode layer away from the light-emitting layer. The encapsulation layer is formed by alternating a plurality of inorganic and organic film layers. For example, along the direction from the substrate to the thin-film transistor layer, the encapsulation layer includes a first inorganic encapsulation sublayer, a first organic encapsulation sublayer, and a second inorganic encapsulation sublayer.

[0068] In some embodiments, the display panel 10 further includes a touch layer located on a side of the encapsulation layer away from the light-emitting layer. The touch layer can implement touch control using self-capacitive touch or mutual-capacitive touch. When the touch layer implements touch control using self-capacitive touch, the touch layer can have only one touch metal layer.

[0069] When the touch layer implements the touch function through mutual capacitive touch, the touch layer includes a first touch metal layer, a touch insulating layer, and a second touch metal layer, wherein the touch insulating layer is located on a side of the first touch metal layer away from the encapsulation layer, and the second touch metal layer is located on a side of the touch insulating layer away from the encapsulation layer. The first touch metal layer can be directly disposed on the encapsulation layer, or a spacer layer can be further disposed between the first touch layer and the encapsulation layer, and the spacer layer can include an inorganic spacer layer and / or an organic spacer layer. The first touch metal layer includes a first touch electrode, a second touch electrode, and a first bridge wire, and the second touch metal layer includes a second bridge wire, and both the first touch electrode and the second touch electrode are metal networks; or the second touch metal layer includes a first touch electrode, a second touch electrode, and a first bridge wire, and the first touch metal layer includes the second bridge wire.

[0070] Optionally, in some embodiments of the present application, the non-cow buffer layer material may include energy-absorbing and impact-resistant materials such as thermoplastic polyurethanes (TPU), silicone gel, and shear thickening materials. Energy-absorbing and impact-resistant materials are softer and have larger deformations, and thus have better energy absorption effects. Energy-absorbing and impact-resistant materials can achieve the effect that the screen becomes stronger when encountering strong forces and softer when encountering soft forces, and can improve the reliability of the folding screen. In particular, when the buffer layer material is TPU, its energy absorption effect is the best.

[0071] See also Figure 3 Non-cow cushioning materials can convert the mechanical energy generated by impact or extrusion into heat energy, and absorb the impact energy or extrusion energy. Non-cow cushioning materials have shear thickening properties. At low shear strain rates, the material remains soft and has a low material modulus. Its bending performance is better. At high shear strain rates, the elastic modulus of non-cow cushioning materials increases, which can effectively block external impact stress or extrusion stress and protect the display module from damage.

[0072] Understandable, see Figure 4 The molecular structure of the non-cow buffer material includes a bonded polymer molecular main chain 31 and a modified polymer molecular main chain 32, wherein the modified polymer molecular main chain 32 has a dynamic bond 33; when the non-cow buffer layer is subjected to a force at a low strain rate, the dynamic bond 33 reversibly breaks and reorganizes, the modified polymer molecular main chain 32 slides freely, and the material remains flexible, such as similar to plasticine; when the non-cow buffer layer is subjected to a force at a high strain rate, the dynamic bond 33 breaks and absorbs energy, and the modified polymer molecular main chain 32 quickly cross-links to form a rigid network to disperse the impact force, such as similar to armor.

[0073] Optionally, in some embodiments of the present application, the thickness of the non-cow buffer layer 30 may be 15 μm to 100 μm, and the modulus may be 10 MPa to 500 MPa.

[0074] It is understandable that the selection of the thickness and modulus of the non-cow buffer layer 30 must take into account the impact on the bending performance and appearance characteristics of the display module. When the thickness is too large and the modulus is too large, the buffering performance is very good, but it is not easy to fold. When the thickness is too thin and the modulus is too small, the folding performance is very good, but the buffering performance is poor. At the same time, a small modulus will cause some unevenness in the appearance of the display module, affecting the appearance visibility. Based on the above requirements, the thickness of the non-cow buffer layer 30 is selected to be between 15μm and 100μm. For example, the thickness of the non-cow buffer layer 30 can be 15μm, 20μm, 25μm, 30μm, 35μm, 40μm, 45μm, 50μm, 55μm, 60μm, 65μm, 70μm, 75μm, 80μm, 85μm, 90μm, 95μm, 100μm. The preferred thickness is 25μm. The modulus of the non-cow cushioning layer 30 is selected to be between 10 MPa and 500 MPa. For example, the modulus of the non-cow cushioning layer 30 can be 10 MPa, 20 MPa, 30 MPa, 40 MPa, 50 MPa, 60 MPa, 70 MPa, 80 MPa, 90 MPa, 100 MPa, 150 MPa, 200 MPa, 250 MPa, 300 MPa, 350 MPa, 400 MPa, 450 MPa, or 500 MPa. The preferred modulus is 70 MPa.

[0075] Optionally, in some embodiments of the present application, the non-cow buffer layer 30 and the display panel 10 are connected by a first adhesive layer 20. The first adhesive layer 20 includes an optically transparent adhesive (OCA), a pressure-sensitive adhesive (PSA), etc. Considering the influence on optical performance, OCA is preferred.

[0076] It can be understood that the non-cow buffer layer 30 is connected to the display panel 10 through OCA, which allows the non-cow buffer layer to be closer to the display panel 10, thereby greatly improving the impact resistance of the display panel 10. In addition, the OCA is more firmly combined with the display panel and is not easy to separate when folded.

[0077] Optionally, in some embodiments of the present application, the thickness of the first adhesive layer 20 is equal to the vertical distance L1 between the non-cow buffer layer 30 and the display panel 10. There is only the first adhesive layer 20 between the non-cow buffer layer 30 and the display panel 10. The closer the non-cow buffer layer is to the display panel, the greater the improvement in the impact resistance of the display panel. The thickness of the first adhesive layer 20 is between 15μm and 75μm. For example, the thickness of the adhesive layer can be 15μm, 20μm, 25μm, 30μm, 35μm, 40μm, 45μm, 50μm, 55μm, 60μm, 65μm, 70μm, or 75μm. The preferred thickness is 25μm and 50μm.

[0078] It is understandable that if the thickness of the first adhesive layer 20 is too thin, it will affect the bonding performance between the non-cow buffer layer 30 and the display panel 10 during the bending process. If it is too thick, it will affect the impact protection effect of the non-cow buffer layer 30 on the display panel 10. At the same time, the overall thickness and appearance performance of the display module should be considered to select a suitable thickness.

[0079] Optionally, in some embodiments of this application, please refer to Figure 5 The non-cow buffer layer 30 is provided on the side of the organic film layer 50 facing the display panel 10 by coating. The organic film layer 50 may include any one of polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), cycloolefin copolymer (COC) or polymethyl methacrylate PMMA, or a combination of at least two of the above materials.

[0080] As you can understand, the production process is illustrated using PET as an example. PET raw material is typically a roll. In this case, a layer of TPU is directly coated onto the PET roll, then cured, laminated with OCA, and then cut into pieces. This manufacturing process is highly efficient, mature, and feasible for mass production. Furthermore, in the subsequent display module manufacturing process, the integrated sheet of PET, TPU coated on PET, and OCA is attached to the display panel 10. This simplifies the entire process and the stacking structure, while also improving impact resistance.

[0081] Optionally, in some embodiments of this application, please refer to Figure 2 The non-cow buffer layer 30 is connected to the organic film layer 50 through the second adhesive layer 40. The second adhesive layer 40 includes OCA, PSA, etc., and the organic film layer includes PET, PI, PU (polyurethane) and other materials.

[0082] It can be understood that the production process is illustrated by taking the organic film layer 50 as PET and the non-coat material as TPU as an example. Since TPU is connected to PET through OCA, the TPU coating process cannot be performed on the PET roll. They can only be cut into sheets first, and then attached to the display panel 10 in sequence by sheet pasting. The entire process is highly feasible, but the stacked structure has an extra layer of OCA, and the overall thickness is increased, which will simultaneously bring about a greater improvement in impact resistance.

[0083] Optionally, in some embodiments of this application, please refer to Figure 2The organic film layer 50 and the ultra-thin glass layer 71 are connected by a third adhesive layer 60, which is usually OCA; the cover assembly 70 also includes a black shading layer 73, which is arranged on the side of the ultra-thin glass layer 71 close to the display panel 10, and the black shading layer is usually ink (BM); the cover assembly 70 also includes a hard functional layer 74, which is arranged on the side of the cover layer 72 away from the display panel 10, and the hard functional layer 74 is usually a hard coating (HC); the protective film layer 90 is arranged on the side of the hard functional layer 74 away from the display panel 10, and the protective film layer 90 is connected to the hard functional layer 74 through a fourth adhesive layer 80, the protective film layer 90 is usually PET, and the fourth adhesive layer 80 is usually OCA.

[0084] The orthographic projection boundary of the protective film layer 90 on the hard functional layer 74 and the orthographic projection boundary of the fourth adhesive layer 80 on the hard functional layer 74 both coincide with each other, that is, the side surfaces of the protective film layer 90 and the fourth adhesive layer 80 are flush. Furthermore, the orthographic projection of the protective film layer 90 on the hard functional layer 74 and the orthographic projection of the fourth adhesive layer 80 on the hard functional layer 74 are both located within the coverage area of ​​the hard functional layer 74, and the orthographic projection boundary of the protective film layer 90 on the hard functional layer 74 is spaced apart from the boundary of the hard functional layer 74, while the orthographic projection of the fourth adhesive layer 80 on the hard functional layer 74 is spaced apart from the boundary of the hard functional layer 74.

[0085] As you can understand, in the cover assembly 70, UTG is applied on the outermost side, so ink is applied on the side of the UTG closest to the display panel to shield the edge. At the same time, HC is applied on the side of the UTG away from the display panel to further improve the surface hardness of the cover and enhance touch performance. In addition, a layer of PET and OCA is set on the side of the HC away from the display panel 10. On the one hand, this can protect the UTG and prevent it from breaking. On the other hand, it can be replaced if the PET surface is damaged. The PET and OCA are set inward with the UTG to facilitate maintenance and replacement.

[0086] Optionally, in some embodiments of this application, please refer to Figure 2 The covering layer 72 also covers the side wall of the ultra-thin glass layer 71 to better protect the ultra-thin glass layer 71 .

[0087] Optionally, in some embodiments of the present application, the thickness of the ultra-thin glass layer 71 may be unequal in the bending zone W1 and the non-bending zone W2, wherein the thickness of the ultra-thin glass layer 71 in the non-bending zone is greater than the thickness in the bending zone, and the distance from the non-cowhide buffer layer 30 to the ultra-thin glass layer 71 in the bending zone W1 is less than or equal to the distance from the non-cowhide buffer layer 30 to the ultra-thin glass layer 71 in the non-bending zone W2.

[0088] It can be understood that in the bending zone W2, the thickness of the ultra-thin glass layer 71 can be thinned to increase the bending performance of the ultra-thin glass layer 71. At the same time, the thinned ultra-thin glass layer 71 will cause the vertical distance L2 from the non-cow buffer layer 30 to the ultra-thin glass layer 71 to be unequal in the bending zone and the non-bending zone, where the value of L2 in the bending zone W1 is greater than or equal to the value in the non-bending zone W2. At this time, the impact resistance of the non-cow buffer layer 30 in the bending zone W1 is improved more than the impact resistance of the non-bending zone W2.

[0089] Optionally, in some embodiments of this application, please refer to Figure 6 When the display module 100 is foldable, a groove 75 is defined on the side of the ultra-thin glass layer 71 away from the display panel 10. The groove 75 is located within the bending region W1. The covering layer 72 covers at least the side of the ultra-thin glass layer 71 away from the display panel 10 and fills the groove 75. In the bending region W1, the distance from the non-cowhide buffer layer 30 to the ultra-thin glass layer 71 is equal to the distance from the non-cowhide buffer layer 30 to the ultra-thin glass layer 71 in the non-bending region W2. In other words, the side of the ultra-thin glass layer closest to the non-cowhide buffer layer 30 is flat.

[0090] It is understandable that when the display module 100 is an outward folding type, and the ultra-thin glass is designed to have unequal thicknesses in the bending zone W1 and the non-bending zone W2, in order to ensure the bending performance of the bending zone W1, the ultra-thin glass in the bending zone W1 needs to be grooved and thinned. Considering that the outward folding is the bending of the display panel 10 in the direction away from the cover assembly 70, in order to ensure that the ultra-thin glass in the bending zone W1 is subjected to compressive stress, the side of the ultra-thin glass away from the display panel 10 must be grooved and thinned. Since the ultra-thin glass in the bending zone W1 is not thinned and is subjected to compressive stress rather than tensile stress, it is not easy for the ultra-thin glass in the bending zone to fail. At the same time, the covering layer 72 covers and fills the groove 75, ensuring the flatness of the side of the ultra-thin glass away from the display panel 10 and preventing the ultra-thin glass from shattering.

[0091] Optionally, in some embodiments of this application, please refer to Figure 7 When the display module 100 is inward-folding, a groove 75 is defined on the side of the ultra-thin glass layer 71 close to the display panel 10. The groove 75 is located within the bending region W1. The cover layer 72 covers the side of the ultra-thin glass layer 71 close to the display panel 10 and fills the groove 75. In the bending region W1, the vertical distance from the non-cowhide buffer layer 30 to the ultra-thin glass layer 71 is L2.2. In the non-bending region W2, the vertical distance from the non-cowhide buffer layer 30 to the ultra-thin glass layer 71 is L2.1, and L2.2>L2.1. In other words, the side of the ultra-thin glass layer 71 facing the display panel 10 is a grooved surface.

[0092] It is understandable that when the display module 100 is inward-folding and the ultra-thin glass is designed to have unequal thickness in the bending zone W1 and the non-bending zone W2, in order to ensure the bending performance of the bending zone W1, the ultra-thin glass in the bending zone W1 needs to be grooved and thinned. Considering that the inward folding is the bending of the display panel 10 toward the cover assembly 70, in order to ensure that the ultra-thin glass in the bending zone W1 is subjected to compressive stress, the side of the ultra-thin glass close to the display panel 10 must be grooved and thinned. The ultra-thin glass in the bending zone W1 that is not thinned is subjected to compressive stress rather than tensile stress, so it is not easy for the ultra-thin glass in the bending zone to fail. At the same time, the covering layer 72 covers and fills the groove 75, ensuring the flatness of the side of the ultra-thin glass close to the display panel 10, ensuring that the ultra-thin glass can be flatly bonded to the display panel, and preventing the ultra-thin glass from shattering.

[0093] In addition, an embodiment of the present application further provides a display device, which includes the display module 100 described in any one of the above embodiments.

[0094] In summary, the embodiment of the present application can effectively improve the hardness of the cover assembly 70, improve the touch and crease phenomenon by setting an ultra-thin glass layer 71 in the cover assembly 70, and at the same time set a non-cow buffer layer 30 between the ultra-thin glass layer 71 and the display panel 10. Through the shear thickening characteristics of the material of the non-cow buffer layer 30, the impact resistance of the display module under high-speed impact is increased, while the bending performance under slow speed is guaranteed. The vertical distance L1 between the non-cow buffer layer 30 and the display panel is smaller than the vertical distance L2 between the non-cow buffer layer 30 and the ultra-thin glass layer 71, so that the non-cow buffer layer 30 is as close to the display panel 10 as possible. At the same time, the non-cow buffer layer 30 and the ultra-thin glass layer 71 have more buffering distance, which can maximize the improvement of the impact resistance of the display module 100 under high-speed impact, especially the improvement of the impact resistance of the bending zone W1, thereby improving the reliability of the display module.

[0095] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0096] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0097] The above is a detailed introduction to a display module, display device, and mobile terminal provided in the embodiments of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the technical solutions and core ideas of the present application. Ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A display module, characterized in that: include: Display panel; a cover plate assembly, disposed on the light-emitting side of the display panel, the cover plate assembly comprising an ultra-thin glass layer and a cover layer, the ultra-thin glass layer being located on one side of the display panel, the cover layer at least covering a side of the ultra-thin glass layer away from the display panel; a non-cowhide buffer layer, disposed between the display panel and the ultra-thin glass layer, wherein the modulus of the non-cowhide buffer layer increases with increasing strain rate; Wherein, the distance from the non-cowhide buffer layer to the display panel is shorter than the distance from the non-cowhide buffer layer to the ultra-thin glass layer.

2. The display module according to claim 1, wherein: The non-cow buffer layer material includes at least one of thermoplastic polyurethane, silicone gel, and shear thickening material.

3. The display module according to claim 1, wherein: The thickness of the non-cow buffer layer is greater than or equal to 15 μm and less than or equal to 100 μm, and the modulus of the non-cow buffer layer is greater than or equal to 10 MPa and less than or equal to 500 MPa.

4. The display module according to claim 1, wherein: A first adhesive layer is provided between the non-cowhide buffer layer and the display panel.

5. The display module according to claim 4, wherein: The thickness of the first adhesive layer is equal to the distance from the non-coated buffer layer to the display panel, and the thickness of the adhesive layer is greater than or equal to 15 μm and less than or equal to 75 μm.

6. The display module according to claim 1, wherein: An organic film layer is provided on the non-coal buffer layer, and the non-coal buffer layer is provided on a side of the organic film layer facing the display panel.

7. The display module according to claim 1, wherein: An organic film layer is provided on the non-cow buffer layer; A second adhesive layer is provided between the non-coated buffer layer and the organic film layer.

8. The display module according to any one of claims 1 to 7, wherein: The display module further includes: a third adhesive layer, disposed between the organic film layer and the ultra-thin glass layer; The cover assembly further includes a black light-shielding layer, which is disposed on a side of the ultra-thin glass layer close to the display panel; The cover plate assembly further comprises a hard functional layer, which is arranged on a side of the cover layer away from the display panel; a protective film layer, disposed on a side of the hard functional layer facing away from the display panel; The fourth adhesive layer is disposed between the protective film layer and the hard functional layer.

9. The display module according to any one of claims 1 to 7, wherein: The cover layer also covers the sidewalls of the ultra-thin glass layer.

10. The display module according to claim 9, wherein: The display module includes a bending area and a non-bending area arranged on at least one side of the bending area. The thickness of the ultra-thin glass layer is not equal in the bending area and the non-bending area. The distance from the non-cowhide buffer layer in the bending area to the ultra-thin glass layer is greater than or equal to the distance from the non-cowhide buffer layer in the non-bending area to the ultra-thin glass layer.

11. The display module according to claim 10, wherein: The display module is an outward-folding type, and a groove is provided on the side of the ultra-thin glass layer away from the display panel. The groove is located in the bending zone. The covering layer at least covers the side of the ultra-thin glass layer away from the display panel and fills the groove. The distance from the non-cowhide buffer layer to the ultra-thin glass layer in the bending zone is equal to the distance from the non-cowhide buffer layer to the ultra-thin glass layer in the non-bending zone.

12. The display module according to claim 10, wherein: The display module is of an inward-folding type, and a groove is provided on the side of the ultra-thin glass layer close to the display panel. The groove is located in the bending area. The covering layer covers the side of the ultra-thin glass layer close to the display panel and fills the groove. The distance from the non-cowhide buffer layer to the ultra-thin glass layer in the bending area is greater than the distance from the non-cowhide buffer layer to the ultra-thin glass layer in the non-bending area.

13. A display device, characterized in that: The display module comprises the display module according to any one of claims 1 to 12.

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