Display panel, preparation method and display device

Abstract

The invention relates to a display panel, a preparation method and a display device. The display panel comprises a substrate, an isolation structure, a step groove, a plurality of light-emitting structures and a plurality of inorganic packaging units. The isolation structure is located on one side of the substrate and encloses a plurality of isolation openings. The step groove is located on at least one side of the isolation opening and at least penetrates through part of the isolation structure. The step groove comprises at least two grooves which are communicated with each other, and a step face is arranged between every two adjacent grooves. At least part of the light-emitting structure is located in the isolation opening. The inorganic packaging units cover the corresponding light-emitting structures, and at least part of the inorganic packaging units extend into the step grooves from the corresponding isolation openings and cover the at least one step surface. The performance of the display panel can be effectively improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel, a preparation method thereof, and a display device. Background Art

[0002] Organic Light Emitting Diode (OLED) display technology is considered the most promising new display technology for the next generation. Compared with liquid crystal display technology, OLED display technology has advantages such as low energy consumption, low cost, self-luminescence, wide viewing angle, and fast response speed.

[0003] Traditionally, pixel patterning is achieved using a fine metal mask (FMM) during the production of OLED display panels. FMM technology is mature and boasts extensive mass production experience. However, it also suffers from limitations such as limited precision and high cost. FMM-free technology eliminates the limitations of traditional OLED processes on display size, resolution, and other performance characteristics, offering the advantages of high performance, full-scale scalability, and agile delivery. Patents CN118251982A, CN115666161A, CN116648095A, CN117062489A, CN118678742A, CN118785761A, CN115220A, CN118678729A, CN118660529A, and CN118660589A describe FMM-free technology for reference.

[0004] However, the performance of display panels formed using current fine metal mask-free technology still needs to be improved. Summary of the Invention

[0005] In order to overcome the technical problems mentioned in the above technical background, the embodiments of the present application provide a display panel, a preparation method, and a display device capable of improving performance.

[0006] A display panel, comprising:

[0007] substrate;

[0008] An isolation structure, located on one side of the substrate, enclosing a plurality of isolation openings;

[0009] a step groove located on at least one side of the isolation opening and penetrating at least a portion of the isolation structure, wherein the step groove comprises at least two mutually communicating grooves, with a step surface between two adjacent grooves;

[0010] a plurality of light-emitting structures, at least a portion of the light-emitting structures being located within the corresponding isolation openings;

[0011] A plurality of inorganic packaging units are provided, each of which covers the corresponding light-emitting structure, and at least a portion of the inorganic packaging units extends from the corresponding isolation opening into the step groove and covers at least one step surface.

[0012] In one embodiment, the display panel further includes:

[0013] an organic encapsulation layer, covering the inorganic encapsulation unit;

[0014] Optionally, the display panel further includes:

[0015] The second inorganic encapsulation layer covers the organic encapsulation layer.

[0016] In one embodiment,

[0017] A portion of the structure of the inorganic packaging unit extends to a sidewall of the step groove away from the corresponding isolation opening;

[0018] Optionally, the sidewall of the step groove is perpendicular to the plane where the substrate is located.

[0019] In one embodiment, the step groove includes a first groove and a second groove that are connected to each other, the first groove is located on a side of the second groove close to the substrate, and the orthographic projection of the top of the first groove on the substrate is located inside the orthographic projection of the bottom of the second groove on the substrate.

[0020] In one embodiment, the step groove includes a first groove and a second groove that are connected to each other, the first groove is located on the side of the second groove close to the substrate, and the orthographic projection of the bottom of the second groove on the substrate is located inside the orthographic projection of the top of the first groove on the substrate.

[0021] In one embodiment, the depth of the first groove is greater than the thickness of the light emitting structure;

[0022] Optionally, the light-emitting structure includes a light-emitting layer and a first electrode, wherein the first electrode is located on a side of the light-emitting layer away from the substrate and is electrically connected to the isolation structure;

[0023] Optionally, the light emitting structure further includes a light extraction layer, and the light extraction layer is located on a side of the first electrode away from the substrate;

[0024] Optionally, the display panel further includes a plurality of second electrodes arranged at intervals, the second electrodes are located on a side of the isolation structure close to the substrate, the isolation openings expose at least part of the corresponding second electrodes, and the light-emitting layer covers the corresponding second electrodes.

[0025] In one embodiment, the plurality of inorganic packaging units include a first packaging unit and a second packaging unit, wherein the first packaging unit and the second packaging unit cover light emitting structures for emitting light of different colors located in different isolation openings.

[0026] In the same region where the step groove is located, the second packaging unit is in contact with and connected to the first packaging unit.

[0027] In one embodiment, within the same region where the step groove is located, a portion of the structure of the second packaging unit is located on a side of the first packaging unit away from the substrate, and the second packaging unit overlaps a portion of the sidewall of the first packaging unit that covers the step groove;

[0028] Optionally, the step groove includes a first groove and a second groove that are connected to each other, and the first groove is located on a side of the second groove close to the substrate;

[0029] An edge of the second package unit overlaps with a portion of the first package unit covering a sidewall of the second groove, or an edge of the second package unit overlaps with a portion of the first package unit covering a sidewall of the first groove.

[0030] In one embodiment, the plurality of inorganic packaging units further include a third packaging unit, the first packaging unit, the second packaging unit, and the third packaging unit respectively cover light-emitting structures for emitting light of different colors located in different isolation openings, and the third packaging unit and the second packaging unit are respectively located on both sides of the first packaging unit.

[0031] In the same region where the step groove is located, the third packaging unit is in contact and connected with the first packaging unit.

[0032] In one embodiment, the display panel further includes a pixel definition layer, the pixel definition layer is located between the isolation structure and the substrate and encloses a plurality of pixel openings, the pixel openings are connected to the corresponding isolation openings;

[0033] The step groove exposes the pixel definition layer.

[0034] In one embodiment, the substrate includes an organic layer, the display panel further includes an inorganic layer, the inorganic layer covers the organic layer, and the isolation structure is located on a side of the inorganic layer away from the substrate.

[0035] The step groove exposes the inorganic layer, and a portion of the structure of the inorganic encapsulation unit contacts and connects to the inorganic layer in the step groove;

[0036] Optionally, the inorganic layer includes a pixel definition layer, the pixel definition layer encloses a plurality of pixel openings, and the pixel openings are connected to the corresponding isolation openings;

[0037] Optionally, the organic layer includes a planarization layer.

[0038] In one embodiment, the step groove penetrates the isolation structure and the inorganic layer and extends into the organic layer, and a portion of the inorganic encapsulation unit contacts and connects to the sidewall and / or bottom of the inorganic layer.

[0039] In one embodiment, among the at least two grooves of the step groove, the groove closest to the substrate exposes the top of the inorganic layer, and the orthographic projection of the groove adjacent to it on the substrate is located inside the orthographic projection of the groove closest to the substrate on the substrate.

[0040] A partial structure of the inorganic encapsulation unit contacts and connects to the top of the inorganic layer in the step groove.

[0041] A method for preparing a display panel, comprising:

[0042] providing a substrate;

[0043] forming an isolation structure on one side of the substrate, wherein the isolation structure encloses a plurality of isolation openings;

[0044] Etching the isolation structure at least twice to form a step groove on at least one side of the isolation opening, wherein the step groove includes at least two grooves connected to each other, and a step surface is formed between two adjacent grooves;

[0045] At least a portion of the light emitting structure is formed in the corresponding isolation opening, and an inorganic packaging unit covering the corresponding light emitting structure is formed, wherein at least a portion of the inorganic packaging unit extends from the isolation opening into the step groove and covers at least one step surface.

[0046] In one embodiment, etching the isolation structure at least twice to form a step groove on at least one side of the isolation opening includes:

[0047] forming a first patterned photoresist covering a portion of the isolation structure and the isolation opening, wherein the first patterned photoresist has a first opening;

[0048] Performing a first etching on the isolation structure based on the first opening to form a first initial groove;

[0049] removing the first patterned photoresist;

[0050] forming a second patterned photoresist covering a portion of the isolation structure and the isolation opening, wherein the second patterned photoresist has a second opening therein, and an orthographic projection of the first opening on the substrate is located inside an orthographic projection of the second opening on the substrate;

[0051] performing a second etching on the isolation structure based on the second opening to form a first groove corresponding to the first initial groove and a second groove communicating with the first groove;

[0052] Optionally, the first etching and / or the second etching comprises anisotropic etching;

[0053] Optionally, the anisotropic etching includes dry etching.

[0054] In one embodiment, etching the isolation structure at least twice to form a step groove on at least one side of the isolation opening includes:

[0055] forming a third patterned photoresist covering a portion of the isolation structure and the isolation opening, wherein the third patterned photoresist has a third opening;

[0056] etching the isolation structure based on the third opening to form a second groove;

[0057] The isolation structure is etched again based on the second groove to form a first groove below the second groove, wherein the orthographic projection of the bottom of the second groove on the substrate is located inside the orthographic projection of the top of the first groove on the substrate.

[0058] A display device includes the above-mentioned display panel or a display panel prepared according to the above-mentioned method for preparing the display panel.

[0059] The display panel, preparation method, and display device described above utilize a stepped groove extending through at least a portion of the isolation structure. The stepped groove comprises at least two interconnected grooves, with a stepped surface between adjacent grooves. This effectively increases the surface area of ​​the isolation structure outside the isolation opening. Furthermore, at least a portion of the inorganic encapsulation unit is configured to extend from the isolation opening into the stepped groove and cover at least one stepped surface, thereby increasing the encapsulation area of ​​the inorganic encapsulation unit and effectively improving the encapsulation effect.

[0060] Moreover, when the display panel is under stress (especially in a folding condition), an inorganic packaging unit is arranged to extend from the isolation opening into the step groove and cover at least one step surface. The stress generated by the inorganic packaging unit in each isolation opening can be dispersed in the isolation opening and the step groove, thereby preventing the stress from being concentrated on the side wall of the isolation opening. This can effectively prevent the inorganic packaging unit from breaking, so that the inorganic packaging unit can play a better role in preventing water and oxygen intrusion, thereby further improving the packaging reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0061] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0062] Figures 1 to 8 Schematic diagrams of partial cutout structures of display panels in different embodiments;

[0063] Figure 9 A schematic diagram of a display panel preparation process in one embodiment;

[0064] Figures 10 to 13 A schematic diagram of a partial cross-sectional structure of a display panel during preparation in one embodiment;

[0065] Figure 14 FIG. 1 is a schematic top view of a display panel in an embodiment.

[0066] Description of reference numerals:

[0067] 100-substrate, 200-isolation structure, 210-base, 220-isolation portion, 230-blocking portion, 300-step groove, 310-first groove, 320-second groove, 330-first initial groove, 410-light-emitting structure, 411-light-emitting layer, 412-first electrode, 420-second electrode, 500-inorganic encapsulation unit, 510-first encapsulation unit, 520-second encapsulation unit, 530-third encapsulation unit, 600-organic encapsulation layer, 700-second inorganic encapsulation layer, 800-pixel definition layer, 910-first patterned photoresist, 920-second patterned photoresist. DETAILED DESCRIPTION

[0068] To make the objectives, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Generally, the components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0069] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for protection, but merely represents selected embodiments of the present application. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments in the present application without making any creative efforts shall fall within the scope of protection of the present application.

[0070] It should be noted that similar reference numerals and letters represent similar items in the following figures. Therefore, once an item is defined in one figure, it does not need to be further defined or explained in subsequent figures. It should be noted that different features in the embodiments of the present application can be combined with each other without conflict.

[0071] For certain elements, terms such as "upper" or "above" are sometimes used to describe the position of the element in the Z direction, while "lower" or "below" is used to describe the position of the element in the opposite direction. In addition, when terms such as "upper," "above," "lower," "below," and "relatively" are used to define the relative position of two elements, they include not only a state in which the two elements are directly connected, but also a state in which the two elements are separated by a gap or other elements. In addition, terms such as "first," "second," and "third" are used only to distinguish and describe, and should not be understood to indicate or imply relative importance.

[0072] In one embodiment, a display panel is provided. The display panel may be an organic light emitting diode display panel (OLED) or a quantum dot light emitting diode (QLED). Figure 14 The display panel includes a display area AA having a display function and a non-display area NA.

[0073] The display area AA of the display panel may be in a rectangular shape, or in other shapes such as a square, a circle, or an ellipse.

[0074] The display area AA is provided with a plurality of pixels PX arranged in the X and Y directions. Pixels PX include a plurality of sub-pixels SPX that display different colors. In some embodiments, pixel PX includes a first sub-pixel SPX1, a second sub-pixel SPX2, and a third sub-pixel SPX3. For example, the first sub-pixel SPX1 is a blue sub-pixel, the second sub-pixel SPX2 is a green sub-pixel SPX2, and the third sub-pixel SPX3 is a red sub-pixel SPX3. In some embodiments, in addition to sub-pixels SPX1, SPX2, and SPX3, pixel PX also includes sub-pixels SPX that emit white light or other colors.

[0075] Subpixels SPX include pixel circuits and light-emitting devices driven by the pixel circuits to emit light of corresponding colors. The first subpixel SPX1 includes a first light-emitting device, the second subpixel SPX2 includes a second light-emitting device, and the third subpixel SPX3 includes a third light-emitting device. Each pixel circuit drives at least one light-emitting device to emit light. For example, the display area AA includes a normal display area and a light-transmitting display area. The light-transmitting display area is the display area corresponding to the sensor and has light-transmitting properties, while the normal display area is the display area not corresponding to the sensor. In the normal display area, one pixel circuit drives one light-emitting device to emit light, while in the light-transmitting display area, one pixel circuit drives one or more light-emitting devices to emit light.

[0076] Specifically, see Figure 1 The display panel includes a substrate 100 , an isolation structure 200 , a step groove 300 , a plurality of light emitting structures 410 and a plurality of inorganic encapsulation units 500 .

[0077] Illustratively, the substrate 100 may include a substrate, a pixel circuit layer, and a planarization layer.

[0078] The substrate may include a flexible substrate or a rigid substrate. The pixel circuit layer is located on one side of the substrate and includes a pixel circuit for driving the light-emitting device to emit light. The pixel circuit may include a transistor and a storage capacitor, etc. The pixel circuit may include a 7T1C, an 8T1C pixel circuit, etc. In addition, the pixel circuit layer also includes at least one insulating layer, which can isolate adjacent conductive layers in the pixel circuit layer, and may include at least one of an inorganic layer and an organic layer. The planarization layer is located on the side of the pixel circuit layer away from the substrate. Exemplarily, at least one wiring layer may also be provided on the pixel circuit layer. Each wiring layer may be covered with a planarization layer.

[0079] The isolation structure 200 is located on one side of the substrate 100 and can enclose an isolation opening.

[0080] For example, a plurality of second electrodes 420 spaced apart may be provided on the side of the top planarization layer away from the substrate. The second electrodes 420 may be, for example, anodes. Furthermore, the second electrodes 420 may be electrically connected to the pixel circuit layer through vias in the planarization layer and traces in the wiring layer. It will be understood that when a plurality of wiring layers and a plurality of planarization layers covering the plurality of wiring layers are provided on the pixel circuit layer, the top planarization layer is the planarization layer farthest from the pixel circuit layer. "Multiple" means two or more.

[0081] The isolation structure 200 may be located on a side of the second electrode 420 away from the substrate 100. The isolation opening may expose at least a portion of the corresponding second electrode 420.

[0082] The isolation structure 200 may be enclosed by a plurality of isolation openings. The plurality of isolation openings may be provided in a one-to-one correspondence with the second electrodes 420. Each isolation opening may expose the corresponding second electrode 420. For example, each isolation opening may partially expose the upper surface of the corresponding second electrode 420. Alternatively, each isolation opening may fully expose the upper surface of the corresponding second electrode 420. Here, the upper surface of the second electrode 420 may be the surface of the second electrode 420 away from the substrate 100.

[0083] For example, the isolation structure 200 may include an isolation portion 220 and a barrier portion 230 stacked in a direction away from the substrate 100 (ie, the Z direction).

[0084] The edge of the barrier portion 230 facing the isolation opening can protrude further than the side of the isolation portion 220 facing the isolation opening, thereby forming an overhanging eave toward the isolation opening. The isolation portion 220 and the barrier portion 230 can be made of different materials. The isolation portion 220 can be made of a conductive material, specifically at least one of aluminum (Al) and an aluminum alloy. The aluminum alloy can include at least one of aluminum-neodymium alloy (AlNd), aluminum-yttrium alloy (AlY), or aluminum-silicon alloy (AlSi). The barrier portion 230 can have a single-layer structure or a multi-layer structure. If the barrier portion 230 has a single-layer structure, the barrier portion 230 can be made of at least one of titanium, titanium nitride, molybdenum, tungsten, a molybdenum-tungsten alloy, or a molybdenum-niobium alloy. When the barrier portion 230 has a multi-layer structure, one layer of the barrier portion 230 may be made of at least one of titanium, titanium nitride, molybdenum, tungsten, a molybdenum-tungsten alloy, or a molybdenum-niobium alloy, and another layer of the barrier portion 230 may be made of a conductive oxide or an inorganic insulating material, such as indium tin oxide (ITO) or indium zinc oxide (IZO).

[0085] For example, the isolation structure 200 may include a base portion 210 , an isolation portion 220 , and a blocking portion 230 stacked in a direction away from the substrate 100 .

[0086] The base 210 is provided to protrude relative to the isolation portion 220 in a direction toward the isolation opening. The base 210 may be made of at least one of molybdenum (Mo), titanium (Ti), titanium nitride (TiN), molybdenum-tungsten alloy (MoW), or molybdenum-niobium alloy (MoNb).

[0087] The step groove 300 is located on at least one side of the isolation opening. Specifically, the step groove 300 can be located on at least one side of the isolation opening in any direction parallel to the substrate 100. Outside the same isolation opening, one step groove 300 can be provided, or multiple step grooves 300 can be provided at intervals. The step grooves 300 corresponding to adjacent isolation openings can be independent of each other. Alternatively, adjacent isolation openings can share the same step groove 300. The embodiments of the present application are not limited to this. And illustratively, the step groove 300 can be annular, so as to surround the corresponding isolation opening. Alternatively, outside the same isolation opening, multiple step grooves 300 can be provided at intervals, and the multiple step grooves 300 can together surround the corresponding isolation opening.

[0088] At the same time, the step groove 300 at least partially penetrates the isolation structure 200. Specifically, the step groove 300 may only partially penetrate the isolation structure 200 without penetrating the isolation structure 200. Alternatively, the step groove 300 may penetrate and penetrate the isolation structure 200. Alternatively, the step groove 300 may penetrate the isolation structure 200 and extend into the structure below the isolation structure 200. The structure below the isolation structure 200 is the structure located on the side of the isolation structure 200 close to the substrate 100.

[0089] Meanwhile, the step groove 300 includes at least two interconnected grooves, with a step surface between two adjacent grooves. The step surface may be parallel to the substrate 100 or non-parallel to the substrate 100. The number of step surfaces may be determined based on the number of grooves in the step groove 300. When the step groove 300 includes two grooves, the step groove 300 includes one step surface. When the step groove 300 includes more than two grooves, the step groove 300 includes two or more step surfaces.

[0090] At the same time, the opening size of each groove of the step groove 300 is not limited and can be set according to actual needs.

[0091] For example, the step groove 300 includes a first groove 310 and a second groove 320 that are interconnected. The first groove 310 is located on the side of the second groove 320 that is closer to the substrate 100, and the orthographic projection of the top of the first groove 310 on the substrate 100 is located inside the orthographic projection of the bottom of the second groove 320 on the substrate 100. In this case, the opening size of the second groove 320 can be larger than the opening size of the first groove 310.

[0092] For example, the step groove 300 includes a first groove 310 and a second groove 320 that are interconnected. The first groove 310 is located on a side of the second groove 320 that is closer to the substrate 100. The orthographic projection of the bottom of the second groove 320 on the substrate 100 is located inside the orthographic projection of the top of the first groove 310 on the substrate 100. In this case, the opening size of the first groove 310 can be larger than the opening size of the second groove 320.

[0093] At least a portion of the light emitting structure 410 is located in the corresponding isolation opening. For example, the light emitting structure 410 may include a light emitting layer 411 and a first electrode 412 .

[0094] For example, the light-emitting layer 411 may include a hole injection layer HIL, a hole transport layer HTL, an electron blocking layer EBL, a light-emitting material layer EML, a hole blocking layer HBL, an electron transport layer ETL, and an electron injection layer EIL stacked in a direction away from the substrate 100 (i.e., the Z direction). The light-emitting layer 411 may include one light-emitting material layer EML or multiple light-emitting material layers EML.

[0095] The first electrode 412 is located on a side of the light-emitting layer 411 away from the substrate 100. One of the first electrode 412 and the second electrode 420 is a cathode, and the other is an anode. For example, the first electrode 412 is a cathode, and the second electrode 420 is an anode.

[0096] The second electrode 420, light-emitting layer 411, and first electrode 412 corresponding to the same isolation opening can form one or more light-emitting devices. Multiple light-emitting devices can be formed corresponding to multiple isolation openings. Subpixel SPX includes at least the second electrode 420, the light-emitting layer 411, and the first electrode 412.

[0097] For example, the plurality of isolation openings enclosed by the isolation structure 200 may include a plurality of first isolation openings, a plurality of second isolation openings, and a plurality of third isolation openings. The plurality of light-emitting devices may include a plurality of first light-emitting devices, a plurality of second light-emitting devices, and a plurality of third light-emitting devices. The first light-emitting devices are arranged corresponding to the first isolation openings, the second light-emitting devices are arranged corresponding to the second isolation openings, and the third light-emitting devices are arranged corresponding to the third isolation openings.

[0098] For example, one isolation opening may be provided corresponding to one light emitting device, for example, the first light emitting device is provided in one-to-one correspondence with the first isolation opening, the second light emitting device is provided in one-to-one correspondence with the second isolation opening, and the third light emitting device is provided in one-to-one correspondence with the third isolation opening.

[0099] Exemplarily, one isolation opening may also be provided corresponding to a plurality of light-emitting devices. For example, a plurality of light-emitting devices emitting the same light-emitting color may be provided corresponding to one isolation opening.

[0100] The inorganic encapsulation unit 500 covers the corresponding light emitting structure 410. For example, the inorganic encapsulation unit 500 and the light emitting structure 410 may be provided in a one-to-one correspondence.

[0101] During the display panel manufacturing process, the light-emitting structure 410 can be formed through an evaporation process, thereby being separated by the eaves of the isolation opening. The inorganic encapsulation unit 500 can be formed through a chemical vapor deposition (CVD) process. The inorganic encapsulation unit 500 can cover the light-emitting structure 410 and the portion of the sidewall of the isolation structure 200 that is not covered by the light-emitting structure.

[0102] At the same time, at least a portion of the inorganic packaging unit 500 extends from the corresponding isolation opening into the step groove 300 and covers at least one step surface.

[0103] It can be understood that when the inorganic packaging unit 500 covers the step surface, it may contact the step surface or have other film layer structures between it and the step surface.

[0104] Specifically, step grooves 300 may be provided around all isolation openings, so that the inorganic packaging units 500 corresponding to all isolation openings extend into the step grooves 300. Alternatively, step grooves 300 may be provided around some isolation openings, while step grooves 300 may not be provided around other isolation openings, so that some inorganic packaging units 500 extend into the step grooves 300, while other inorganic packaging units 500 do not extend into the step grooves 300.

[0105] Furthermore, when the step groove 300 includes one step surface, the inorganic encapsulation unit 500 covers the step surface. When the step groove 300 includes more than one step surface, the inorganic encapsulation unit 500 may cover one or more step surfaces.

[0106] In this embodiment, a step groove 300 is provided that at least partially penetrates the isolation structure 200. The step groove 300 includes at least two interconnected grooves, with a step surface between two adjacent grooves. In this case, the surface area of ​​the isolation structure 200 outside the isolation opening can be effectively increased. At the same time, at least a portion of the inorganic packaging unit 500 is provided to extend from the isolation opening into the step groove 300 and cover at least one step surface, thereby increasing the packaging area of ​​the inorganic packaging unit 500, thereby effectively improving the packaging effect.

[0107] Moreover, when the display panel is under stress (especially in a folding condition), the inorganic packaging unit 500 is arranged to extend from the isolation opening into the step groove 300 and cover at least one step surface. The stress generated by the inorganic packaging unit 500 in each isolation opening can be dispersed in the isolation opening and the step groove 300, thereby preventing the stress from being concentrated on the side wall of the isolation opening. This can effectively prevent the inorganic packaging unit 500 from breaking, so that the inorganic packaging unit 500 can play a better role in preventing water and oxygen intrusion, thereby further improving the packaging reliability.

[0108] In one embodiment, see Figure 1 The display panel further includes an organic encapsulation layer 600. The organic encapsulation layer 600 covers the inorganic encapsulation unit 500. Specifically, the organic encapsulation layer 600 can simultaneously cover the inorganic encapsulation units 500 corresponding to each isolation opening. At the same time, the surface of the organic encapsulation unit away from the substrate 100 can be a relatively flat surface.

[0109] For example, the display panel further includes a second inorganic encapsulation layer 700. The second inorganic encapsulation layer 700 covers the organic encapsulation layer 600. Specifically, the second inorganic encapsulation layer 700 may cover a side of the organic encapsulation unit away from the substrate 100.

[0110] Due to the material difference, the bonding between the organic encapsulation layer 600 and the inorganic encapsulation unit 500 is weak, making them easily separated, which in turn can easily affect the encapsulation effect. In this embodiment, however, a step groove 300 is provided that penetrates at least a portion of the isolation structure 200, and the inorganic encapsulation unit 500 is provided to extend from the isolation opening into the step groove 300 and cover at least one step surface. This effectively increases the bonding area between the organic encapsulation layer 600 and each inorganic encapsulation unit 500, thereby effectively increasing the bonding strength between the organic encapsulation layer 600 and each inorganic encapsulation unit 500, preventing cracks between the organic encapsulation layer 600 and the inorganic encapsulation unit 500, and further improving the encapsulation effect.

[0111] In one embodiment, see Figure 1 , a portion of the inorganic encapsulation unit 500 extends to the sidewall of the step groove 300 away from its corresponding isolation opening. At this time, the edge of the inorganic encapsulation unit 500 located in the step groove 300 may contact the sidewall of the step groove 300.

[0112] During the display panel manufacturing process, the patterning of each sub-pixel is achieved through a photolithography process. Specifically, after forming the isolation opening and the step groove 300, the material layer of the light-emitting structure 410 can be evaporated on the entire surface through an evaporation process. The material layer of the light-emitting structure 410 is separated by the eaves of the isolation structure 200 in the isolation opening. Then, on the material layer of the light-emitting structure 410, a chemical vapor deposition process is used to form the material layer of the inorganic encapsulation unit 500 on the entire surface of the material layer of the light-emitting structure 410 and the isolation structure 200 not covered by the material layer of the light-emitting structure 410. Thereafter, a patterned photoresist is formed on the material layer of the inorganic encapsulation unit 500. The patterned photoresist covers the isolation opening corresponding to the sub-pixel of the current processing color and extends into the corresponding step groove 300. Thereafter, based on the patterned photoresist, the material layer of the inorganic encapsulation unit 500 is dry-etched to form the corresponding inorganic encapsulation unit 500. The inorganic encapsulation unit 500 extends from the isolation opening to the step groove 300. Furthermore, the edge of the inorganic encapsulation unit 500 located in the step groove 300 may contact the sidewall of the step groove 300 .

[0113] Afterwards, the material layer of the light-emitting structure 410 is wet-etched to form the light-emitting structure 410. During this process, since the edge of the inorganic packaging unit 500 located in the step groove 300 is in contact with the side wall of the step groove 300, the material layer of the light-emitting structure 410 below the inorganic packaging unit 500 in the step groove 300 can be completely covered by it and will not be removed by wet etching. Therefore, in the final product structure, no gap space will be formed between the inorganic packaging unit 500 and the step groove 300 due to the removal of the material layer of the light-emitting structure 410, thereby improving the structural stability of the product. It can be understood that in the embodiment of the present application, the light-emitting structure 410 is not only located in the isolation opening, but also in the step groove 300. However, the light-emitting structure 410 located in the step groove 300 is disconnected from the light-emitting structure 410 located in the isolation opening, so as not to affect the normal light emission of the light-emitting device.

[0114] At the same time, the inorganic encapsulation unit 500 extending to the sidewall of the step groove 300 away from its corresponding isolation opening can also increase the bonding area between the inorganic encapsulation unit 500 and the organic encapsulation unit in the step groove 300, thereby increasing the bonding force between the two.

[0115] Specifically, see Figure 1 and Figure 2The step groove 300 includes at least two interconnected grooves. The edge of the inorganic encapsulation unit 500 can fall on the sidewall of any groove. At the same time, when the edge of the inorganic encapsulation unit 500 located in the step groove 300 contacts the sidewall of the step groove 300, the edge of the inorganic encapsulation unit 500 can just contact the sidewall of the step groove 300, or after contacting the sidewall of the step groove 300, the edge of the inorganic encapsulation unit 500 can climb along the sidewall of the step groove 300 to contact and cover at least a portion of the sidewall of the step groove 300.

[0116] For example, see Figure 2 The step groove 300 includes a first groove 310 and a second groove 320 sequentially arranged in a direction away from the substrate 100. The edge of the inorganic packaging unit 500 can fall on the side wall of the first groove 310. And the side wall of the first groove 310 contacts the edge of the inorganic packaging unit 500. Alternatively, refer to Figure 1 , the edge of the inorganic encapsulation unit 500 can fall on the sidewall of the second groove 320. And the sidewall of the second groove 320 contacts the edge of the inorganic encapsulation unit 500. Of course, while the sidewall of the second groove 320 contacts the edge of the inorganic encapsulation unit 500, the sidewall of the first groove 310 can also contact the inorganic encapsulation unit 500.

[0117] For example, see Figure 1 or Figure 2 , the sidewalls of the step groove 300 are perpendicular to the plane of the substrate 100. Specifically, the "sidewalls of the step groove 300" here can be all the sidewalls of the step groove 300, or part of the sidewalls of the step groove 300. That is, all the sidewalls of the step groove 300 can be perpendicular to the plane of the substrate 100, or part of the sidewalls of the step groove 300 can be perpendicular to the plane of the substrate 100.

[0118] When the side wall of the step groove 300 is perpendicular to the plane where the substrate 100 is located, the angle between the side wall of the step groove 300 and the bottom of the step groove 300 is 90°. At this time, during the preparation of the display panel, the material layer of the light-emitting structure 410 formed by evaporation is not easy to climb on the vertical side wall of the step groove 300. Therefore, in the final product, the light-emitting structure 410 is rarely formed on the vertical side wall of the step groove 300, and the light-emitting structure 410 formed on the vertical side wall of the step groove 300 is discontinuous. The material layer of the inorganic packaging unit 500 is formed by a chemical vapor deposition process, so its coverage is better. Therefore, by setting the side wall of the step groove 300 to be perpendicular to the plane where the substrate 100 is located, it can be effectively achieved that the edge of the inorganic packaging unit 500 located in the step groove 300 can contact the side wall of the step groove 300.

[0119] Of course, the sidewalls of the step groove 300 are not limited to being perpendicular to the plane of the substrate 100. When the angle between the sidewalls of the step groove 300 and the bottom of the step groove 300 is greater than 90° but less than or equal to a preset angle, the sidewalls of the step groove 300 are nearly perpendicular to the substrate 100, thereby achieving discontinuity of the light-emitting structure 410 on the vertical sidewalls of the step groove 300 and contact of the inorganic encapsulation unit 500 with the sidewalls of the step groove 300. The preset angle can be set according to actual needs, for example, 95°.

[0120] Alternatively, the angle between the side wall of the step groove 300 and the bottom of the step groove 300 may also be less than 90°. In this case, the angle between the side wall of at least one groove of the step groove 300 and the bottom of the step groove 300 is less than 90°, so that at least one groove of the step groove 300 is in the shape of a small mouth and a large belly. In this case, during the preparation of the display panel, at least part of the side wall of the groove in the shape of a small mouth and a large belly will not be evaporated to the light-emitting structure 410 material due to the obstruction of the top, and thus will not be covered by the material layer of the light-emitting structure 410. The material layer of the inorganic encapsulation unit 500 is formed by a chemical vapor deposition process, so that it can contact the side wall of the step groove 300 that is not covered by the material layer of the light-emitting structure 410. For example, the angle between the side wall of the step groove 300 and the bottom of the step groove 300 can be greater than or equal to 85° and less than 90°.

[0121] Alternatively, see Figure 3 , of the two adjacent grooves of the step groove 300, the orthographic projection of the bottom of the groove far from the substrate 100 (such as the second groove 320) on the substrate 100 is located inside the orthographic projection of the top of the groove close to the substrate 100 (such as the first groove 310) on the substrate 100. At this time, the step groove 300 as a whole has a small mouth and a large belly. Therefore, during the display panel preparation process, at least part of the sidewall of the groove close to the substrate 100 (such as the first groove 310) will not be evaporated onto the material layer of the light-emitting structure 410, and thus will not be covered by the material layer of the light-emitting structure 410, thereby also allowing the inorganic packaging unit 500 to contact the sidewall of the groove. At the same time, the inorganic packaging unit 500 can also cover the step surface. It can be understood that at this time, there is no limit on the angle between the sidewall of the step groove 300 and the bottom of the step groove 300.

[0122] The isolation structure 200 is typically made of metal. The light-emitting structure 410 is typically made of an organic material. The inorganic packaging unit 500 contacts the sidewalls of the step groove 300. This effectively improves the direct bonding force and strength between the inorganic packaging unit 500 and the isolation structure 200, compared to a case where the inorganic packaging unit 500 completely contacts and covers the light-emitting structure 410, thereby effectively enhancing the packaging effect.

[0123] In one embodiment, the step groove 300 includes a first groove 310 and a second groove 320 that are connected to each other. The first groove 310 is located on a side of the second groove 320 close to the substrate 100 .

[0124] See also Figure 1 or Figure 2 , the orthographic projection of the top of the first groove 310 on the substrate 100 is located inside the orthographic projection of the bottom of the second groove 320 on the substrate 100. Alternatively, refer to Figure 3 , the orthographic projection of the bottom of the second groove 320 on the substrate 100 is located inside the orthographic projection of the top of the first groove 310 on the substrate 100 .

[0125] Meanwhile, the depth of the first groove 310 is greater than the thickness of the light emitting structure 410 .

[0126] For example, the light emitting structure 410 includes a light emitting layer 411 and a first electrode 412. The first electrode 412 is located on a side of the light emitting layer 411 away from the substrate 100 and is electrically connected to the isolation structure 200. In this case, the depth of the first groove 310 can be greater than the total thickness of the light emitting layer 411 and the first electrode 412.

[0127] Exemplarily, the light emitting structure 410 further includes a light extraction layer (not shown). The light extraction layer is located on the side of the first electrode 412 away from the substrate 100. In this case, the depth of the first groove 310 can be greater than the total thickness of the light emitting layer 411, the first electrode 412, and the light extraction layer.

[0128] In this embodiment, the depth of the first groove 310 is greater than the thickness of the light-emitting structure 410. Therefore, within the step groove 300, the light-emitting structure 410 does not completely fill the first groove 310. As a result, the portion of the inorganic encapsulation unit 500 within the step groove 300 can contact the sidewall of the first groove 310, thereby improving the bonding strength between the inorganic encapsulation unit 500 and the isolation structure 200, thereby improving the encapsulation effect.

[0129] In one embodiment, see Figure 4 The plurality of inorganic encapsulation units 500 include a first encapsulation unit 510 and a second encapsulation unit 520. The first encapsulation unit 510 and the second encapsulation unit 520 cover the light emitting structures 410 located in different isolation openings and configured to emit light of different colors.

[0130] In the same step groove 300, the second packaging unit 520 is in contact with the first packaging unit 510. At this time, the inorganic packaging units 500 corresponding to different isolation openings can be in contact with each other, thereby improving the water and oxygen resistance of each inorganic packaging unit 500 and thus improving packaging reliability.

[0131] In one embodiment, see Figure 4 or Figure 5 In the same step groove 300 area, part of the structure of the second packaging unit 520 is located on the side of the first packaging unit 510 away from the substrate 100, and the second packaging unit 520 overlaps with the part of the first packaging unit 510 covering the side wall of the step groove 300.

[0132] Specifically, the plurality of isolation openings within the isolation structure 200 may include a first isolation opening and a second isolation opening. During the display panel manufacturing process, a first light-emitting structure and a first encapsulation unit 510 may be formed corresponding to the first isolation opening. Then, a second light-emitting structure and a second encapsulation unit 520 may be formed corresponding to the second isolation opening.

[0133] For example, the sidewalls of the step-groove 300 may be perpendicular or nearly perpendicular to the substrate 100. Therefore, the first light-emitting structures on the sidewalls of the step-groove 300 are few and discontinuous, allowing the first package unit 510 to cover and contact the sidewalls of the step-groove 300. At the same time, the portion of the first package unit 510 covering the sidewalls of the step-groove 300 may be perpendicular or nearly perpendicular to the substrate 100. The portion of the first package unit 510 covering the sidewalls of the step-groove 300 is referred to as the first covering portion, and the first covering portion may be perpendicular or nearly perpendicular to the substrate 100. In this case, the second package unit 520 may extend to cover the first covering portion of the first package unit 510. Furthermore, because the first covering portion is perpendicular or nearly perpendicular to the substrate 100, the first light-emitting structures on the first covering portion are few and discontinuous. Therefore, the second package unit 520 may cover and contact the first covering portion, thereby achieving effective overlap between the second package unit 520 and the first package unit 510.

[0134] It is understood that the “first covering portion” of the first packaging unit 510 may cover the sidewall of the step groove 300 away from its corresponding isolation opening and / or the sidewall of the step groove 300 close to its corresponding isolation opening. This application does not impose any limitation on this.

[0135] Meanwhile, the step groove 300 includes at least two grooves that are interconnected. The sidewall of the step groove 300 covered by the above-mentioned "first covering portion" may be the sidewall of any one or more of the grooves.

[0136] For example, the step groove 300 includes a first groove 310 and a second groove 320 that are connected to each other. The first groove 310 is located on a side of the second groove 320 that is close to the substrate 100.

[0137] See also Figure 4The edge of the second packaging unit 520 overlaps with the portion of the first packaging unit 510 covering the sidewall of the second groove 320 , thereby achieving overlap between the second packaging unit 520 and the portion of the first packaging unit 510 covering the sidewall of the step groove 300 .

[0138] Alternatively, see Figure 5 The edge of the second packaging unit 520 overlaps with the portion of the first packaging unit 510 covering the sidewall of the first groove 310 , thereby achieving overlap between the second packaging unit 520 and the portion of the first packaging unit 510 covering the sidewall of the step groove 300 .

[0139] Of course, in other embodiments, the connection method between the second packaging unit 520 and the first packaging unit 510 is not limited to this. For example, the step groove 300 includes a first groove 310 and a second groove 320 arranged sequentially in a direction away from the substrate 100. The orthographic projection of the bottom of the second groove 320 on the substrate 100 is located inside the orthographic projection of the top of the first groove 310 on the substrate 100. Alternatively, the angle between the sidewall of the first groove 310 and the bottom of the first groove 310 is less than 90°, and the orthographic projection of the top of the first groove 310 on the substrate 100 is located inside the orthographic projection of the bottom of the first groove 310 on the substrate 100. In these cases, a shielding structure is provided above the bottom edge of the first groove 310. The light-emitting structure 410 formed by the evaporation process does not enter at least a portion of the shielded area of ​​the first groove 310. Furthermore, the first packaging unit 510 and the second packaging unit 520 can be formed by a chemical vapor deposition process. Therefore, the first packaging unit 510 and the second packaging unit 520 can also be connected at least partially in the shielded area of ​​the first groove 310.

[0140] In other embodiments, see Figure 6 The end of the second packaging unit 520 may not overlap with the first packaging unit 510. The end of the second packaging unit 520 may be spaced apart from the first packaging unit 510 in a direction perpendicular to the substrate.

[0141] In one embodiment, see Figure 4 or Figure 5 The plurality of inorganic encapsulation units 500 further include a third encapsulation unit 530. The first encapsulation unit 510, the second encapsulation unit 520, and the third encapsulation unit 530 respectively cover the light emitting structures 410 for emitting light of different colors located in different isolation openings.

[0142] Specifically, the multiple isolation openings within the isolation structure may include a first isolation opening and a second isolation opening. During the display panel manufacturing process, a first light-emitting structure and a first encapsulation unit 510 corresponding to the first isolation opening may be formed first. Then, a second light-emitting structure and a second encapsulation unit 520 corresponding to the second isolation opening may be formed. Then, a third light-emitting structure and a third encapsulation unit 530 corresponding to the third isolation opening may be formed. The light-emitting layers 411 of the first, second, and third light-emitting structures may be made of different materials.

[0143] Meanwhile, the third packaging unit 530 and the second packaging unit 520 are respectively located on two sides of the first packaging unit 510 .

[0144] In the same region of the step groove 300, the third packaging unit 530 is in contact with the first packaging unit 510. The configuration of the third packaging unit 530 can be similar to that of the second packaging unit 520, and will not be described in detail here.

[0145] In this embodiment, the first encapsulation unit 510, the second encapsulation unit 520, and the third encapsulation unit 530 respectively cover the light-emitting structures 410 for emitting light of different colors located within different isolation openings. Furthermore, the third encapsulation unit 530 and the second encapsulation unit 520 are located on either side of the first encapsulation unit 510, thereby facilitating effective overlap of the inorganic encapsulation units 500 corresponding to each color, thereby improving the bonding strength and packaging reliability of the inorganic encapsulation units 500.

[0146] In one embodiment, see Figure 1 The display panel further includes a pixel definition layer 800. The pixel definition layer 800 is located between the isolation structure 200 and the substrate 100. The pixel definition layer 800 encloses a plurality of pixel openings. The pixel openings communicate with corresponding isolation openings. The light-emitting structure 410 can be located within the pixel openings and the isolation openings.

[0147] For example, the pixel openings and the isolation openings may be provided in a one-to-one correspondence, and the orthographic projection of the pixel opening on the substrate 100 may be located inside the orthographic projection of the isolation opening on the substrate 100 .

[0148] Meanwhile, the pixel openings and the second electrodes 420 may be provided in a one-to-one correspondence. The pixel openings may partially expose the upper surface of the corresponding second electrode 420, or may completely expose the upper surface of the second electrode 420.

[0149] The pixel definition layer 800 may have a single-layer structure or a multi-layer structure.

[0150] Exemplarily, the pixel definition layer includes a plurality of sub-layers, and the plurality of sub-layers include a first sub-layer and a second sub-layer sequentially stacked in a direction away from the array substrate 100 , that is, the pixel definition layer may adopt a double-layer design.

[0151] For example, the first sub-layer has better film-forming properties than the second sub-layer. That is, under conditions of equal thickness, the first sub-layer can better cover the step structure formed by the second electrode 420 than the second sub-layer without generating cracks. Conversely, to achieve the same step coverage effect, the thickness of the first sub-layer must be thinner than that of the second sub-layer, that is, the thickness requirement for the first sub-layer is relatively low, which is conducive to thinning the product. In addition, good film-forming properties are reflected in the good coverage of the formed film, which is more dense and more conducive to isolating water vapor.

[0152] For example, the second sublayer has better etching resistance than the first sublayer. Since the side of the pixel definition layer 800 facing away from the substrate 100 is subject to etching during the display panel manufacturing process, selecting a material with stronger etching resistance as the second sublayer can improve the etching resistance of the pixel definition layer 800, further improving the reliability of the display panel.

[0153] Exemplarily, the first sub-layer and the second sub-layer are made of different materials. For example, the first sub-layer may be made of silicon nitride, and the second sub-layer may be made of silicon oxide.

[0154] Exemplarily, the thickness of the first sublayer is greater than or equal to 1000 micrometers and less than or equal to 5000 micrometers. For example, the thickness of the first sublayer is 1000 micrometers, 2000 micrometers, 3000 micrometers, 4000 micrometers, 5000 micrometers, etc.

[0155] Exemplarily, the thickness of the second sub-layer is greater than or equal to 500 micrometers and less than or equal to 3000 micrometers. For example, the thickness of the second sub-layer is 500 micrometers, 1000 micrometers, 2000 micrometers, 3000 micrometers, etc.

[0156] At the same time, the step groove 300 exposes the pixel definition layer 800 .

[0157] The pixel definition layer 800 may be made of an inorganic material. Meanwhile, the planarization layer in the substrate 100 may be made of an organic material. The pixel definition layer 800 can isolate water and oxygen in the organic material, such as the planarization layer, to prevent it from entering the light-emitting device.

[0158] In this embodiment, the step groove 300 exposes the pixel definition layer 800 and never affects the waterproof oxygen diffusion performance of the pixel definition layer 800, thereby ensuring the reliability of the light-emitting device.

[0159] In one embodiment, see Figure 7 or Figure 8The substrate 100 includes an organic layer. The display panel also includes an inorganic layer. The inorganic layer covers the organic layer. The isolation structure 200 is located on a side of the inorganic layer away from the substrate 100.

[0160] For example, the organic layer may include a planarization layer. When the substrate 100 includes a plurality of planarization layers, the organic layer may include at least a planarization layer located at a top layer.

[0161] Exemplarily, the inorganic layer may include a pixel definition layer 800 .

[0162] Exemplarily, the display panel may further include an inorganic protective layer. The inorganic layer may include an inorganic protective layer.

[0163] Specifically, the inorganic protective layer is located on the side of the planarization layer away from the substrate 100. The second electrode 420 can be located on the side of the inorganic protective layer away from the substrate 100. The pixel definition layer 800 can cover the second electrode 420 and the inorganic protective layer. During the display panel manufacturing process, the second electrode 420 exposed by the isolation opening may be damaged due to multiple etching processes. The inorganic protective layer below the second electrode 420 can prevent moisture in the organic materials such as the underlying planarization layer from invading the light-emitting structure 410 if the second electrode 420 is damaged.

[0164] The inorganic layer is exposed in the step groove 300. Part of the structure of the inorganic packaging unit 500 contacts and connects the inorganic layer in the step groove 300, thereby achieving connection between inorganic materials, thereby improving the film bonding strength of the inorganic packaging unit 500 and improving packaging reliability.

[0165] In one embodiment, the step groove 300 penetrates the isolation structure 200 and the inorganic layer and extends into the organic layer, and the inorganic encapsulation unit 500 connects to the sidewalls and / or bottom of the inorganic layer. It should be understood that the "inorganic layer sidewalls" here refer to the side portions of the inorganic layer exposed by the step groove 300 and facing the step groove 300. The bottom of the inorganic layer can be the lower surface portion of the inorganic layer exposed by the step groove 300 and facing the substrate.

[0166] For example, see Figure 7 or Figure 8 The step groove 300 includes a first groove 310 and a second groove 320 that are connected to each other. The first groove 310 is located on a side of the second groove 320 that is close to the substrate 100. At the same time, the sidewall of the step groove 300 is perpendicular or nearly perpendicular to the substrate 100.

[0167] At this time, there is a step difference between the bottom of the step groove 300 and the inorganic layer. Therefore, when the light-emitting structure 410 covers the bottom of the step groove 300, the inorganic encapsulation unit 500 can cover the light-emitting structure 410 and be in contact with the side wall of the inorganic layer. For example, at this time, the orthographic projection of the top of the first groove 310 on the substrate 100 can be located inside the orthographic projection of the bottom of the second groove 320 on the substrate 100. Of course, it is also possible to set the orthographic projection of the bottom of the second groove 320 on the substrate 100 to be located inside the orthographic projection of the top of the first groove 310 on the substrate 100.

[0168] For example, see Figure 8 The step groove 300 includes a first groove 310 and a second groove 320 that are interconnected. The first groove 310 is located on the side of the second groove 320 that is closer to the substrate 100. The orthographic projection of the bottom of the second groove 320 on the substrate 100 is located inside the orthographic projection of the top of the first groove 310 on the substrate 100.

[0169] In this case, the first groove 310 extends laterally relative to the second groove 320, and a shielding structure is provided above this laterally extended area, thereby forming a shielded area of ​​the first groove 310. The inorganic encapsulation unit 500 can extend deep into this shielded area, thereby contacting and connecting with the bottom of the inorganic layer (such as the bottom of the pixel definition layer 800 or the bottom of the inorganic protective layer). For example, the sidewalls of the step groove 300 are perpendicular or nearly perpendicular to the substrate 100. In this case, the inorganic encapsulation unit 500 can contact and connect with both the sidewalls and the bottom of the inorganic layer.

[0170] In one embodiment, see Figure 3 Of the at least two grooves of the stepped groove 300, the groove closest to the substrate (e.g., the first groove 310) exposes the top of the inorganic layer, that is, the top of the pixel definition layer 800 in the figure. Furthermore, the orthographic projection of the adjacent groove (e.g., the second groove 320) on the substrate 100 is located inside the orthographic projection of the groove closest to the substrate (e.g., the first groove 310) on the substrate 100.

[0171] Part of the structure of the inorganic encapsulation unit 500 contacts and connects to the top of the inorganic layer in the step groove 300 .

[0172] Exemplarily, the step groove 300 includes a first groove 310 and a second groove 320 that are interconnected. The first groove 310 is located on a side of the second groove 320 that is close to the substrate 100. The orthographic projection of the bottom of the second groove 320 on the substrate 100 is located inside the orthographic projection of the top of the first groove 310 on the substrate 100.

[0173] At the same time, the bottom of the first groove 310 exposes the top of the inorganic layer (eg, the top of the pixel definition layer 800 ). Therefore, the inorganic encapsulation unit 500 can contact and connect with the top of the inorganic layer in the step groove 300 .

[0174] Specifically, for example, the isolation structure 200 may include a base portion 210, an isolation portion 220, and a barrier portion 230 stacked in a direction away from the substrate 100. The second groove 320 may penetrate the barrier portion 230 and the isolation portion 220. The first groove 310 may penetrate the base portion 210, thereby exposing the inorganic layer (such as the pixel definition layer 800).

[0175] In one embodiment, see Figure 9 , and also provides a method for preparing a display panel, comprising:

[0176] Step S10, providing a substrate 100;

[0177] Step S20 , forming an isolation structure 200 on one side of the substrate 100 , wherein the isolation structure 200 encloses a plurality of isolation openings;

[0178] Step S30, etching the isolation structure 200 at least twice to form a step groove 300 on at least one side of the isolation opening, wherein the step groove 300 includes at least two grooves connected to each other, and a step surface is formed between two adjacent grooves;

[0179] In step S40 , at least a portion of the light emitting structure 410 is formed in the corresponding isolation opening, and an inorganic packaging unit 500 is formed to cover the light emitting structure 410 . At least a portion of the inorganic packaging unit 500 extends from the corresponding isolation opening into the step groove 300 and covers at least one step surface.

[0180] In step S10 , the substrate 100 may include a base, a pixel circuit layer, and a planarization layer.

[0181] The substrate may include a flexible substrate or a rigid substrate. The pixel circuit layer is located on one side of the substrate and includes a pixel circuit for driving the light-emitting device to emit light. The pixel circuit may include a transistor and a storage capacitor, etc. The pixel circuit may include a 7T1C, an 8T1C pixel circuit, etc. In addition, the pixel circuit layer also includes at least one insulating layer, which can isolate adjacent conductive layers in the pixel circuit layer, and may include at least one of an inorganic layer and an organic layer. The planarization layer is located on the side of the pixel circuit layer away from the substrate. Exemplarily, at least one wiring layer may also be provided on the pixel circuit layer. Each wiring layer may be covered with a planarization layer.

[0182] In step S20 , a material layer for the isolation structure 200 may be formed first, and then the material layer for the isolation structure 200 may be etched to form the isolation structure 200 .

[0183] For example, before forming the isolation structure 200 , a plurality of second electrodes 420 may be formed on a side of the top planarization layer away from the substrate.

[0184] A plurality of isolation openings may be provided in a one-to-one correspondence with the second electrodes 420. Each isolation opening may expose the corresponding second electrode 420. For example, each isolation opening may partially expose the upper surface of the corresponding second electrode 420. Alternatively, each isolation opening may fully expose the upper surface of the corresponding second electrode 420. Here, the upper surface of the second electrode 420 may be the surface of the second electrode 420 away from the substrate 100.

[0185] For example, the isolation structure 200 may include an isolation portion 220 and a barrier portion 230 stacked in a direction away from the substrate 100 (ie, the Z direction).

[0186] The edge of the barrier portion 230 facing the isolation opening can protrude further than the side of the isolation portion 220 facing the isolation opening, thereby forming an overhanging eave toward the isolation opening. The isolation portion 220 and the barrier portion 230 can be made of different materials. The isolation portion 220 can be made of a conductive material, specifically at least one of aluminum (Al) and an aluminum alloy. The aluminum alloy can include at least one of aluminum-neodymium alloy (AlNd), aluminum-yttrium alloy (AlY), or aluminum-silicon alloy (AlSi). The barrier portion 230 can have a single-layer structure or a multi-layer structure. If the barrier portion 230 has a single-layer structure, the barrier portion 230 can be made of at least one of titanium, titanium nitride, molybdenum, tungsten, a molybdenum-tungsten alloy, or a molybdenum-niobium alloy. When the barrier portion 230 has a multi-layer structure, one layer of the barrier portion 230 may be made of at least one of titanium, titanium nitride, molybdenum, tungsten, a molybdenum-tungsten alloy, or a molybdenum-niobium alloy, and another layer of the barrier portion 230 may be made of a conductive oxide or an inorganic insulating material, such as indium tin oxide (ITO) or indium zinc oxide (IZO).

[0187] For example, the isolation structure 200 may include a base portion 210 , an isolation portion 220 , and a blocking portion 230 stacked in a direction away from the substrate 100 .

[0188] The base 210 is provided to protrude relative to the isolation portion 220 in a direction toward the isolation opening. The base 210 may be made of at least one of molybdenum (Mo), titanium (Ti), titanium nitride (TiN), molybdenum-tungsten alloy (MoW), or molybdenum-niobium alloy (MoNb).

[0189] Illustratively, before forming the isolation structure 200 in step S20 , a material layer of the pixel definition layer 800 covering the plurality of second electrodes 420 may be further formed.

[0190] Then, after the isolation structure 200 is formed, the material layer of the pixel definition layer 800 may be etched based on each isolation opening, thereby forming a pixel opening connected to the isolation opening.

[0191] Exemplarily, the isolation structure 200 encloses a plurality of isolation openings, which may include a plurality of first isolation openings, a plurality of second isolation openings, and a plurality of third isolation openings.

[0192] The pixel definition layer 800 encloses a plurality of pixel openings. The plurality of pixel openings may include a first pixel opening communicating with the first isolation opening, a second pixel opening communicating with the second isolation opening, and a third pixel opening communicating with the third isolation opening. The orthographic projections of the first, second, and third pixel openings onto the substrate 100 may be the same or different in area. The orthographic projections of the pixel openings and the corresponding isolation openings onto the substrate 100 may or may not have the same shape. Generally speaking, the orthographic projection area of ​​an isolation opening onto the substrate 100 is larger than the orthographic projection area of ​​the pixel opening communicating with the isolation opening onto the substrate 100. The orthographic projections of the pixel openings of the light-emitting devices onto the substrate 100 overlap with the orthographic projections of the isolation openings onto the array substrate 100. The pixel definition layer 800 may be formed of an inorganic material, for example, using at least one of the inorganic insulating materials selected from silicon nitride (SiNx), silicon oxide (SiOx), and silicon oxynitride (SiON).

[0193] In step S30 , the isolation structure 200 may be etched at least twice, or the isolation structure 200 and the structure thereunder may be etched at least twice, by a photolithography process or the like, thereby forming the step groove 300 .

[0194] In step S40, the material layer of the light-emitting structure 410 can be evaporated on the entire surface through an evaporation process. The material layer of the light-emitting structure 410 is separated by the eaves of the isolation structure 200 in the isolation opening. Then, on the material layer of the light-emitting structure 410, a chemical vapor deposition process is used to form the material layer of the inorganic encapsulation unit 500 on the material layer of the light-emitting structure 410 and on the isolation structure 200 not covered by the material layer of the light-emitting structure 410. Thereafter, a patterned photoresist is formed on the material layer of the inorganic encapsulation unit 500. The patterned photoresist covers the isolation opening corresponding to the sub-pixel of the current processing color and extends into the corresponding step groove 300. Thereafter, based on the patterned photoresist, the material layer of the inorganic encapsulation unit 500 is dry-etched to form the corresponding inorganic encapsulation unit 500. The inorganic encapsulation unit 500 extends from the isolation opening into the step groove 300. Thereafter, the material layer of the light-emitting structure 410 is wet-etched to form the light-emitting structure 410.

[0195] In this embodiment, before forming the light-emitting structure 410 and the inorganic packaging unit 500 in the isolation opening, the isolation structure 200 is etched at least twice to form a step groove 300 on at least one side of the isolation opening. The step groove 300 includes at least two grooves that are interconnected, and there is a step surface between two adjacent grooves. In this case, the surface area of ​​the isolation structure 200 outside the isolation opening can be effectively increased. At the same time, the inorganic packaging unit 500 is arranged to extend from the isolation opening into the step groove 300 and cover at least one step surface, thereby increasing the packaging area of ​​the inorganic packaging unit 500, thereby effectively improving the packaging effect.

[0196] Moreover, when the display panel is under stress (especially in a folding condition), the inorganic packaging unit 500 is arranged to extend from the isolation opening into the step groove 300 and cover at least one step surface. The stress generated by the inorganic packaging unit 500 in each isolation opening can be dispersed in the isolation opening and the step groove 300, thereby preventing the stress from being concentrated on the side wall of the isolation opening. This can effectively prevent the inorganic packaging unit 500 from breaking, so that the inorganic packaging unit 500 can play a better role in preventing water and oxygen intrusion, thereby further improving the packaging reliability.

[0197] In one embodiment, step S30 includes:

[0198] Step S311, please refer to Figure 10 , forming a first patterned photoresist 910 covering a portion of the isolation structure 200 and the isolation opening, wherein the first patterned photoresist 910 has a first opening;

[0199] Step S312, please refer to Figure 11 , performing a first etching on the isolation structure 200 based on the first opening to form a first initial groove 330;

[0200] Step S313, removing the first patterned photoresist 910;

[0201] Step S314, please refer to Figure 12 , forming a second patterned photoresist 920 covering a portion of the isolation structure 200 and the isolation opening, wherein the second patterned photoresist 920 has a second opening, and the orthographic projection of the first opening on the substrate 100 is located inside the orthographic projection of the second opening on the substrate 100;

[0202] Step S315, please refer to Figure 13 , the isolation structure 200 is etched a second time based on the second opening to form a first groove 310 corresponding to the first initial groove 330 and a second groove 320 connected to the first groove 310 .

[0203] In step S311 , a first photoresist layer may be firstly coated on the entire surface, and then the first photoresist layer is exposed and developed to form a first patterned photoresist 910 having a first opening.

[0204] In step S312, when the isolation structure 200 is first etched, anisotropic etching may be used, for example, to facilitate controlling the size of the first initial groove 330. The anisotropic etching may be dry etching, for example.

[0205] In step S313 , the first patterned photoresist 910 is removed by a stripping process.

[0206] In step S314 , a second photoresist layer may be firstly coated on the entire surface, and then the second photoresist layer is exposed and developed to form a second patterned photoresist 920 having a second opening.

[0207] In step S315, when performing a second etching on the isolation structure 200, anisotropic etching may be used, for example, to facilitate controlling the extent of the second etching and thus to facilitate controlling the size of the final first groove 310 and the second groove 320. The anisotropic etching may be, for example, dry etching.

[0208] At this time, the orthographic projection of the top of the first groove 310 on the substrate 100 may be located inside the orthographic projection of the bottom of the second groove 320 on the substrate 100 .

[0209] In one embodiment, step S30 includes:

[0210] Step S321, forming a third patterned photoresist covering a portion of the isolation structure 200 and the isolation opening, wherein the third patterned photoresist has a third opening;

[0211] Step S322 , etching the isolation structure 200 based on the third opening to form a second groove 320 ;

[0212] In step S323 , the isolation structure 200 is etched again based on the second groove 320 to form a first groove 310 below the second groove 320 , wherein the orthographic projection of the bottom of the second groove 320 on the substrate 100 is located inside the orthographic projection of the top of the first groove 310 on the substrate 100 .

[0213] In step S321 , a third photoresist layer may be firstly coated on the entire surface, and then the third photoresist layer is exposed and developed to form a third patterned photoresist having a third opening.

[0214] In step S322, for example, the second groove 320 can be formed by etching based on the third opening using an anisotropic etching method (e.g., dry etching method), thereby facilitating control of the size and morphology of the second groove 320. Of course, the second groove 320 can also be formed by etching using an isotropic etching method (e.g., wet etching method).

[0215] In step S323, for example, an isotropic etching method may be used when etching the isolation structure 200 again based on the second groove 320. The isotropic etching method may be, for example, a wet etching method, so that the orthographic projection of the bottom of the second groove 320 on the substrate 100 is located inside the orthographic projection of the top of the first groove 310 on the substrate 100.

[0216] Illustratively, after step S323 , the third patterned photoresist may be removed by a stripping process.

[0217] For example, the isolation structure 200 may include a base portion 210, an isolation portion 220, and a barrier portion 230 stacked in a direction away from the substrate 100. When etching the isolation structure 200 based on the third opening in step S322, the base portion 210 and the isolation portion 220 may be dry-etched to form the second groove 320. In step S323, when etching the isolation structure 200 again based on the second groove 320, the base portion 210 may be wet-etched to form the first groove 310. In this case, the second groove 320 may penetrate the barrier portion 230 and the isolation portion 220. The first groove 310 may penetrate the base portion 210.

[0218] In one embodiment, a display device is provided, comprising the display panel of the present application. The display device may include a device with image processing capabilities, such as a mobile phone, desktop computer, laptop computer, tablet computer, vehicle-mounted display, wearable device, etc. Because the display device comprises the display panel of the present application, the electronic device has higher reliability.

[0219] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0220] The above-described embodiments merely illustrate several implementations of the present invention, and while their descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the patent for this invention shall be determined by the appended claims.

Claims

1. A display panel, characterized in that: include: substrate; An isolation structure, located on one side of the substrate, enclosing a plurality of isolation openings; a step groove located on at least one side of the isolation opening and penetrating at least a portion of the isolation structure, wherein the step groove comprises at least two mutually communicating grooves, with a step surface between two adjacent grooves; a plurality of light-emitting structures, at least a portion of the light-emitting structures being located within the corresponding isolation openings; A plurality of inorganic packaging units are provided, each of which covers the corresponding light-emitting structure, and at least a portion of the inorganic packaging units extends from the corresponding isolation opening into the step groove and covers at least one step surface.

2. The display panel according to claim 1, wherein: The display panel further includes: an organic encapsulation layer, covering the inorganic encapsulation unit; The display panel further includes: The second inorganic encapsulation layer covers the organic encapsulation layer.

3. The display panel according to claim 1, wherein: A portion of the inorganic packaging unit extends to a sidewall of the step groove away from the corresponding isolation opening.

4. The display panel according to claim 3, wherein: The sidewall of the step groove is perpendicular to the plane where the substrate is located.

5. The display panel according to claim 1, wherein: The step groove includes a first groove and a second groove that are connected to each other. The first groove is located on a side of the second groove close to the substrate, and the orthographic projection of the top of the first groove on the substrate is located inside the orthographic projection of the bottom of the second groove on the substrate.

6. The display panel according to claim 1, wherein: The step groove includes a first groove and a second groove that are connected to each other. The first groove is located on a side of the second groove close to the substrate, and the orthographic projection of the bottom of the second groove on the substrate is located inside the orthographic projection of the top of the first groove on the substrate.

7. The display panel according to claim 5 or 6, characterized in that: The depth of the first groove is greater than the thickness of the light emitting structure; The light-emitting structure includes a light-emitting layer and a first electrode, wherein the first electrode is located on a side of the light-emitting layer away from the substrate and is electrically connected to the isolation structure; The light emitting structure further includes a light extraction layer, wherein the light extraction layer is located on a side of the first electrode away from the substrate; The display panel further includes a plurality of second electrodes arranged at intervals. The second electrodes are located on a side of the isolation structure close to the substrate. The isolation openings expose at least part of the corresponding second electrodes, and the light-emitting layer covers the corresponding second electrodes.

8. The display panel according to claim 1, wherein: The plurality of inorganic packaging units include a first packaging unit and a second packaging unit, wherein the first packaging unit and the second packaging unit cover light emitting structures for emitting light of different colors located in different isolation openings. In the same region where the step groove is located, the second packaging unit is in contact with and connected to the first packaging unit.

9. The display panel according to claim 8, wherein: In the same region where the step groove is located, part of the structure of the second packaging unit is located on a side of the first packaging unit away from the substrate, and the second packaging unit overlaps with a portion of the sidewall of the first packaging unit covering the step groove.

10. The display panel according to claim 9, wherein: The step groove includes a first groove and a second groove that are connected to each other, and the first groove is located on a side of the second groove close to the substrate; An edge of the second package unit overlaps with a portion of the first package unit covering a sidewall of the second groove, or an edge of the second package unit overlaps with a portion of the first package unit covering a sidewall of the first groove.

11. The display panel according to claim 8, wherein The plurality of inorganic packaging units further include a third packaging unit, wherein the first packaging unit, the second packaging unit, and the third packaging unit respectively cover light-emitting structures for emitting light of different colors located in different isolation openings, and the third packaging unit and the second packaging unit are respectively located on both sides of the first packaging unit. In the same region where the step groove is located, the third packaging unit is in contact and connected with the first packaging unit.

12. The display panel according to claim 1, wherein The display panel further includes a pixel definition layer, the pixel definition layer being located between the isolation structure and the substrate and enclosing a plurality of pixel openings, the pixel openings being in communication with the corresponding isolation openings; The step groove exposes the pixel definition layer.

13. The display panel according to claim 1, wherein The substrate includes an organic layer, the display panel further includes an inorganic layer, the inorganic layer covers the organic layer, and the isolation structure is located on a side of the inorganic layer away from the substrate. The step groove exposes the inorganic layer, and a partial structure of the inorganic encapsulation unit contacts and connects to the inorganic layer in the step groove.

14. The display panel according to claim 13, wherein: The inorganic layer includes a pixel definition layer, the pixel definition layer encloses a plurality of pixel openings, and the pixel openings are connected to the corresponding isolation openings; The organic layer includes a planarization layer.

15. The display panel according to claim 13, wherein: The step groove penetrates the isolation structure and the inorganic layer and extends into the organic layer. A portion of the inorganic encapsulation unit contacts and is connected to a side wall and / or a bottom of the inorganic layer.

16. The display panel according to claim 13, wherein: Of the at least two grooves of the step groove, the groove closest to the substrate exposes the top of the inorganic layer, and the orthographic projection of the groove adjacent to it on the substrate is located inside the orthographic projection of the groove closest to the substrate on the substrate, A partial structure of the inorganic encapsulation unit contacts and connects to the top of the inorganic layer in the step groove.

17. A method for preparing a display panel, characterized in that: include: providing a substrate; forming an isolation structure on one side of the substrate, wherein the isolation structure encloses a plurality of isolation openings; Etching the isolation structure at least twice to form a step groove on at least one side of the isolation opening, wherein the step groove includes at least two grooves connected to each other, and a step surface is formed between two adjacent grooves; At least a portion of the light emitting structure is formed in the corresponding isolation opening, and an inorganic packaging unit covering the corresponding light emitting structure is formed, wherein at least a portion of the inorganic packaging unit extends from the corresponding isolation opening into the step groove and covers at least one step surface.

18. The method for manufacturing a display panel according to claim 17, wherein: The etching of the isolation structure at least twice to form a step groove on at least one side of the isolation opening includes: forming a first patterned photoresist covering a portion of the isolation structure and the isolation opening, wherein the first patterned photoresist has a first opening; Performing a first etching on the isolation structure based on the first opening to form a first initial groove; removing the first patterned photoresist; forming a second patterned photoresist covering a portion of the isolation structure and the isolation opening, wherein the second patterned photoresist has a second opening therein, and an orthographic projection of the first opening on the substrate is located inside an orthographic projection of the second opening on the substrate; The isolation structure is etched a second time based on the second opening to form a first groove corresponding to the first initial groove and a second groove communicating with the first groove.

19. The method for manufacturing a display panel according to claim 17, wherein: The etching of the isolation structure at least twice to form a step groove on at least one side of the isolation opening includes: forming a third patterned photoresist covering a portion of the isolation structure and the isolation opening, wherein the third patterned photoresist has a third opening; etching the isolation structure based on the third opening to form a second groove; The isolation structure is etched again based on the second groove to form a first groove below the second groove, wherein the orthographic projection of the bottom of the second groove on the substrate is located inside the orthographic projection of the top of the first groove on the substrate.

20. A display device, characterized in that: A display panel comprising the display panel according to any one of claims 1 to 16 or a display panel prepared according to the method for preparing a display panel according to any one of claims 17 to 19.

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