Intelligent shockproof chip insole

Abstract

The invention relates to the field of intelligent wearing, in particular to an intelligent shockproof chip insole. According to the intelligent shockproof chip insole, the monitoring chip arranged in the heel supporting pad can intelligently monitor the foot of a user across the folding heel panel, and the U-shaped overturning frame can be controlled by adjusting the spiral supporting block to drive the heel supporting pad and the folding heel panel to overturn up and down; the insole can be switched between a heightening mode and a flat bottom mode, multiple purposes of the insole are achieved, the damping air bag can provide excellent damping and buffering effects for the monitoring chip, in addition, massage ball columns are further arranged on the adjustable sliding plate, and foot massage can be conducted through the massage ball columns in the flat bottom mode. The technical defects that one monitoring chip module can only be installed on one insole, and the use cost of using different intelligent insoles by a user is increased are overcome.

Description

Technical Field

[0001] The present invention relates to the field of smart wearables, and in particular to a smart shockproof chip insole. Background Art

[0002] Smart insoles, as an insole product that combines intelligent technology with shockproof functions, are designed to enhance sports experience and comfort. The core technologies of the monitoring chip modules usually include pressure sensors, inertial measurement units, wireless communication modules and data processing modules, which are used to monitor plantar pressure distribution, gait parameters and motion data. Smart insoles use flexible materials and new sensor technologies to improve comfort and durability. With the continuous development of technology, smart insoles are developing towards a more intelligent, personalized and integrated direction under the cross-integration of multiple fields such as materials science, electronic engineering and computer science. However, usually a monitoring chip module can only be installed on one smart insole. When the user needs to switch between flat insoles and height-enhancing insoles, they need to be equipped with flat insoles with monitoring chip modules and height-enhancing insoles with monitoring chip modules respectively, which increases the cost of using different smart insoles. Summary of the Invention

[0003] In order to overcome the disadvantage that one monitoring chip module can only be installed on one insole, which increases the cost of using different smart insoles for users, the present invention provides an intelligent shockproof chip insole.

[0004] The technical solution of the present invention is: an intelligent shockproof chip insole, comprising a bottom plate, an inclined palm plate, a folding heel plate, a sole support pad, a heel support pad, a U-shaped flip frame, a heel flip pad, a connecting slider, a fixing cylinder, a spiral support block, a signal transceiver and power supply integrated module and a monitoring chip; the bottom plate is provided with an inclined palm plate corresponding to the sole part and a folding heel plate corresponding to the heel part in sequence, and the upper surface of the inclined palm plate is provided with an inclined surface structure inclined downward toward the side away from the folding heel plate; the bottom plate is provided with a sole support pad and a heel support pad in sequence; both the sole support pad and the heel support pad are made of elastic insole material; a A U-shaped flip frame; a heel flip pad is fixedly connected to the U-shaped flip frame, and the heel flip pad is tightly attached to the upper surface of the heel support pad; the inclined palm panel is sleeved on the outside of the sole support pad; the folding heel panel is sleeved on the outside of the heel support pad and the heel flip pad; a connecting slider is rotatably connected to the U-shaped flip frame; a fixed cylinder is fixedly connected between the bottom plate and the heel support pad; a spiral support block is screwed into the fixed cylinder; the connecting slider is slidably connected to the spiral support block; a signal transceiver and power supply integrated module is installed between the bottom plate and the heel support pad; a monitoring chip for intelligent monitoring of the user's foot is installed on the heel flip pad; the monitoring chip is electrically connected to the signal transceiver and power supply integrated module.

[0005] Furthermore, no less than two reinforcing rods are fixedly connected to the U-shaped turning frame.

[0006] Furthermore, a buffer support block is fixedly connected to the heel support pad; the buffer support block supports and aligns the reinforcing rod above the signal transceiver and power supply integrated module.

[0007] Furthermore, a shock-absorbing airbag is installed between the bottom plate and the heel support pad; the top of the shock-absorbing airbag is in close contact with the monitoring chip.

[0008] Furthermore, a first sliding groove structure is provided on the sole support pad; a second sliding groove structure connected to the first sliding groove structure is provided on the heel flip pad; a skateboard is slidably connected to the first sliding groove structure; a plurality of massage ball head columns are provided on the skateboard; a first pulling groove structure is provided on the heel support pad; a second pulling groove structure connected to the first pulling groove structure is provided on the heel flip pad; a pulling block is fixed to the bottom of the skateboard; the pulling block is slidably connected to the first pulling groove structure and the second pulling groove structure.

[0009] Furthermore, the massage ball head posts are all slidably connected to the skateboard, and the upper surface of the skateboard is set to an inclined structure that is adapted to the upper surface of the sole support pad; a micro tension spring is fixedly connected between each massage ball head post and the skateboard; a number of guide groove structures are opened on the sole support pad; the massage ball head posts are tightly attached to the inner bottom of the corresponding guide groove structure.

[0010] Furthermore, the guide groove structure is configured as an inclined surface structure that tilts downward toward the side away from the heel flip pad, and the length of the massage ball head column on the skateboard increases toward the side away from the heel flip pad.

[0011] Furthermore, a plurality of convex strip structures are provided in the area where the inclined palm plate is aligned with the second slide groove structure; and a plurality of slot structures adapted to the convex strip structures are provided on the surface of the slide plate.

[0012] Furthermore, a waterproof elastic membrane having a first groove structure for covering the heel support pad is fixedly connected to the bottom plate.

[0013] Furthermore, a sealing ring is fixedly connected between the fixing cylinder and the bottom plate.

[0014] Beneficial effects: The intelligent shock-proof chip insole of the present invention is mainly composed of a bottom plate, a sole support pad, a heel support pad, and an inclined palm panel and a folding heel panel wrapped on the surface thereof. The monitoring chip provided in the heel support pad can perform intelligent monitoring of the user's foot through the folding heel panel. By adjusting the spiral support block, the U-shaped flip frame can be controlled to drive the heel support pad and the folding heel panel to flip up and down, allowing the insole to switch between the height-increasing mode and the flat-bottom mode, realizing multiple uses of one insole. The provided shock-absorbing airbag can provide excellent shock-absorbing and buffering effects for the monitoring chip. In addition, a massage ball head column is provided on the adjustable skateboard, and the foot can be massaged by the massage ball head column in the flat-bottom mode; it overcomes the technical defect that a monitoring chip module can only be installed on one insole, which increases the cost of using different smart insoles for users. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a three-dimensional diagram of a flat-bottomed intelligent shockproof chip insole;

[0016] Figure 2 This is a three-dimensional diagram of the bottom plate of an intelligent shockproof chip insole;

[0017] Figure 3 This is a three-dimensional cross-sectional view of the tilted palm panel and folded heel panel of an intelligent shock-proof chip insole;

[0018] Figure 4 This is a three-dimensional cross-sectional view of the heel flip pad of an intelligent shockproof chip insole;

[0019] Figure 5 This is a three-dimensional diagram of a U-shaped flip frame of an intelligent shockproof chip insole;

[0020] Figure 6 This is a three-dimensional cross-sectional view of the sole support pad of an intelligent shockproof chip insole;

[0021] Figure 7 A three-dimensional image of a skateboard with an intelligent shockproof chip insole;

[0022] Figure 8 A three-dimensional diagram of the massage ball head column of this intelligent shockproof chip insole;

[0023] Figure 9 This is a three-dimensional diagram of the height-increasing mode of an intelligent shock-proof chip insole.

[0024] Figure numerals: 11-base plate, 12-inclined palm panel, 1201-convex strip structure, 13-folding heel panel, 14-waterproof elastic membrane, 15-sealing ring, 21-sole support pad, 2101-first slide groove structure, 2102-guide groove structure, 22-heel support pad, 2201-first pull groove structure, 23-U-shaped flip frame, 24-heel flip pad, 2401-second slide groove structure, 2402-second pull groove structure, 25-connecting slider, 26-fixing cylinder, 27-spiral support block, 28-reinforcement rod, 29-buffer support block, 31-signal transceiver and power supply integrated module, 32-monitoring chip, 33-shock-absorbing airbag, 41-slide plate, 4101-slot structure, 42-massage ball head column, 43-micro tension spring, 44-pull block. DETAILED DESCRIPTION

[0025] The embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0026] Example 1, a smart shockproof chip insole of this embodiment, hereinafter referred to as this insole, as Figures 1-9 As shown, it includes a base plate 11, an inclined palm panel 12, a folding heel panel 13, a sole support pad 21, a heel support pad 22, a U-shaped flip frame 23, a heel flip pad 24, a connecting slider 25, a fixing tube 26, a spiral support block 27, a signal transceiver and power supply integrated module 31 and a monitoring chip 32; the base plate 11 is provided with an inclined palm panel 12 corresponding to the sole part; the base plate 11 is provided with a folding heel panel 13 corresponding to the heel part; the upper surface of the inclined palm panel 12 is set as an inclined surface structure inclined downward toward the side away from the folding heel panel 13; the sole support pad 21 is fixedly connected to the base plate 11; the heel support pad 22 is fixedly connected to the base plate 11; the sole support pad 21 and the heel support pad 22 are both made of elastic rubber insole material; the sole support pad 21 is rotatably connected to the U-shaped flip frame 23; the heel flip pad 24 is fixedly connected to the U-shaped flip frame 23, and the heel flip pad 24 is initially close to the heel support pad 22 Surface; the inclined palm panel 12 is sleeved on the outside of the sole support pad 21; the folding heel panel 13 is sleeved on the outside of the heel support pad 22 and the heel flip pad 24; a connecting slider 25 is rotatably connected to the U-shaped flip frame 23; a fixing cylinder 26 is commonly fixed between the bottom plate 11 and the heel support pad 22; a spiral support block 27 is screwed into the fixing cylinder 26 through a threaded structure, and a handle structure is provided at the bottom of the spiral support block 27; the connecting slider 25 is slidably connected to the spiral support block 27; a signal transceiver and power supply integrated module 31 is commonly installed between the bottom plate 11 and the heel support pad 22, and the signal transceiver and power supply integrated module 31 integrates a signal transceiver module for wireless signal transceiver and a small power supply module for power supply; a monitoring chip 32 is installed on the heel flip pad 24 for performing corresponding intelligent monitoring of the user's foot through the folding heel panel 13; the monitoring chip 32 is electrically connected to the signal transceiver and power supply integrated module 31.

[0027] like Figure 4 As shown, two reinforcing rods 28 are fixedly connected to the U-shaped flip frame 23; two buffer support blocks 29 aligned with the signal transceiver and power supply integrated module 31 are fixedly connected to the heel support pad 22; the two buffer support blocks 29 jointly support the reinforcing rod 28 aligned above the signal transceiver and power supply integrated module 31; when the user's foot steps on the heel flip pad 24 and applies a downward extrusion force to the U-shaped flip frame 23 and the reinforcing rod 28, the two buffer support blocks 29 jointly provide a buffer support force to the reinforcing rod 28 and the heel flip pad 24 located above the signal transceiver and power supply integrated module 31, so that most of the downward extrusion force from the reinforcing rod 28 is transferred to the two buffer support blocks 29, thereby preventing the signal transceiver and power supply integrated module 31 from being subjected to more extrusion force from the reinforcing rod 28 and the heel flip pad 24 above it.

[0028] like Figure 4 As shown, a shock-absorbing airbag 33 is installed between the base plate 11 and the heel support pad 22, and the shock-absorbing airbag 33 is filled with pressurized gas; the top of the shock-absorbing airbag 33 is in close contact with the monitoring chip 32; no matter whether the heel flip pad 24 is in the increased mode or the flat-bottom mode, the top of the shock-absorbing airbag 33 can be in close contact with the monitoring chip 32 in the heel flip pad 24 under the action of the elastic deformation ability provided by the pressurized gas, and the pressurized gas inside the shock-absorbing airbag 33 provides the monitoring chip 32 with a better shock-absorbing and buffering effect.

[0029] The method of using the smart shockproof chip insole of this embodiment is as follows.

[0030] After the user puts the insole into the shoe, the heel flip pad 24 on the U-shaped flip frame 23 is initially in the position as shown in FIG. Figure 1 The insole is shown in a state of close contact with the heel support pad 22. At this time, the insole is in a flat-bottom mode, and the shock-absorbing airbag 33 is in a compressed state. The pressurized gas inside the compressed shock-absorbing airbag 33 is in a maximum pressure state. The greater the pressure of the pressurized gas inside the shock-absorbing airbag 33, the better the shock-absorbing and buffering effect provided by the shock-absorbing airbag 33 close to the monitoring chip 32. When the user wears the insole in flat-bottom mode for strenuous exercise, the shock-absorbing airbag 33 can cooperate with the elastic rubber insole material heel support pad 22 to provide shock absorption and buffering for the monitoring chip 32 in the heel flip pad 24. At the same time, the signal transceiver and power supply integrated module 31 cooperates with the monitoring chip 32 to perform corresponding monitoring work and wireless signal transmission work.

[0031] When the user takes the insole out of the shoe, the user manually rotates the spiral support block 27 through the handle structure, so that the spiral support block 27 rotates and moves upward along the thread structure of the fixed cylinder 26. The spiral support block 27 pushes the connecting slider 25 to drive the U-shaped flip frame 23 and the heel flip pad 24 connected thereto to flip upward. At the same time, the heel flip pad 24 drives the folding heel panel 13 to flip upward away from the inclined palm panel 12 to the side as shown in FIG. Figure 9 In the height-increasing mode shown, after the user puts the insole in the height-increasing mode into the shoe, the height-increasing effect can be achieved by wearing the insole in the height-increasing mode, and the shock-absorbing airbag 33 is pushed upward by the internal pressurized gas to remain close to the monitoring chip 32. The shock-absorbing airbag 33 provides shock absorption and buffering for the monitoring chip 32 in the heel flip pad 24, allowing the signal transceiver and power supply integrated module 31 to cooperate with the monitoring chip 32 to perform corresponding monitoring work and wireless signal transmission work.

[0032] Example 2, based on the above example 1, Figures 1-9 As shown, the sole support pad 21 of this embodiment is provided with a first sliding groove structure 2101; the heel flip pad 24 is provided with a second sliding groove structure 2401 connected to the first sliding groove structure 2101; the first sliding groove structure 2101 is slidably connected to the slide plate 41; a plurality of massage ball head columns 42 are provided on the slide plate 41; the heel support pad 22 is provided with a first groove structure 2201; the heel flip pad 24 is provided with a second groove structure 2402, and the second groove structure 2402 is connected to the first groove structure 2201; a pull block 44 is fixed to the bottom of the slide plate 41; the pull block 44 is slidably connected to the first groove structure 2201 and the second groove structure 2402; each massage ball head column 42 is slidably connected to the slide plate 41, and the slide plate The upper surface of 41 is set to be an inclined structure adapted to the upper surface of the sole support pad 21; a micro tension spring 43 is fixedly connected between each massage ball head column 42 and the skateboard 41; a plurality of guide groove structures 2102 are provided on the sole support pad 21; the bottom of each massage ball head column 42 is tightly attached to the inner bottom of the corresponding guide groove structure 2102, and the top height of the massage ball head column 42 is initially not higher than the upper surface height of the skateboard 41; the guide groove structure 2102 is set to be an inclined structure inclined downward toward the side away from the heel flip pad 24, so the farther the distance between the massage ball head column 42 and the heel flip pad 24, the longer the length, that is, the length of the massage ball head column 42 on the skateboard 41 increases toward the side away from the heel flip pad 24.

[0033] In the initial normal state, the skateboard 41 is located in the first slide groove structure 2101 of the sole support pad 21. After switching to the heightening mode, most of the pressure on the user's foot is squeezed on the sole support pad 21 corresponding to the sole of the foot. At this time, the massage ball head column 42 is in a state of being stored inside the skateboard 41 and will not be squeezed with the user's sole, avoiding excessive squeezing force between the user's sole and the massage ball head column 42 and hurting the user's foot. After switching to the flat bottom mode, the user can manually pull the pull block 44 to move along the first groove structure 2201 and the second groove structure 2402. At the same time, the pull block 44 drives the skateboard 41 and the massage ball head column 42 connected thereto from the first slide groove structure 2101 of the sole support pad 21 to the second groove structure 2402 of the heel flip pad 24. The massage ball head column 42 moves along As the inclined guide groove structure 2102 moves toward the heel flip pad 24, the massage ball head column 42 is supported upward by the inclined guide groove structure 2102 and will emerge upward from the slide plate 41. At the same time, the massage ball head column 42 drives the micro tension spring 43 to stretch, so that the massage ball head column 42 remains in a state of being exposed upward from the slide plate 41 and enters the heel flip pad 24, so that the massage ball head column 42 can be closely attached to the posterior area of ​​the arch between the sole and heel of the user. Since the closer the distance between the massage ball head column 42 and the sole support pad 21, the longer the length of the massage ball head column 42 is, the massage ball head column 42 with increasing length can perfectly fit according to the arc structure of the posterior area of ​​the user's arch. Then, when the user walks, the posterior area of ​​the user's arch can be massaged by the massage ball head column 42, thereby promoting blood circulation in the foot.

[0034] like Figure 3 and Figure 6 As shown, the area where the inclined palm panel 12 of this embodiment is aligned with the second slide groove structure 2401 is provided with several ridge structures 1201; the surface of the skateboard 41 is provided with several slot structures 4101 adapted to the ridge structures 1201; when the skateboard 41 moves to the second slide groove structure 2401 of the heel flip pad 24, the ridge structure 1201 of the inclined palm surface is inserted into the slot structure 4101 corresponding to the surface of the skateboard 41, so that the inclined palm surface is firmly fixed on the skateboard 41 through the locking structure between the ridge structure 1201 and the slot structure 4101, avoiding the human foot driving the inclined palm surface to continuously contact and rub against the massage ball head column 42 on the skateboard 41, resulting in serious wear in the area where the inclined palm surface is aligned with the second slide groove structure 2401.

[0035] Example 3, based on the above Example 2, Figures 1-9As shown, a waterproof elastic membrane 14 is fixed to the bottom plate 11 of this embodiment, and the waterproof elastic membrane 14 covers the bottom of the first groove structure 2201 of the heel support pad 22, preventing external water vapor from passing through the first groove structure 2201 and the second groove structure 2402 in sequence, causing the sole support pad 21, the heel support pad 22 and the heel flip pad 24 to be soaked by external water vapor. In addition, the user can pull the pull block 44 through the waterproof elastic membrane 14 to drive the slide plate 41 to move; a sealing ring 15 is fixed between the fixed tube 26 and the bottom plate 11, and the sealing ring 15 can prevent the gap between the bottom plate 11 and the fixed tube 26 from being worn due to long-term wear, causing external water vapor to pass through the gap, causing the heel support pad 22 and the heel flip pad 24 to be soaked by external water vapor, thereby enhancing the waterproof performance of the insole.

[0036] Although the present invention has been described in detail with reference to the above embodiments, it will be apparent to those skilled in the art from this disclosure that various changes or modifications may be made to the present invention without departing from the principles and spirit of the invention as defined in the claims. Therefore, the detailed description of the disclosed embodiments is intended to be illustrative only and not to limit the present invention, which is to be defined by the claims.

Claims

1. An intelligent shockproof chip insole, comprising a bottom plate (11); Its characteristics are: The shoe further comprises an inclined palm panel (12) and a folding heel panel (13); the bottom plate (11) is provided with an inclined palm panel (12) corresponding to the sole portion and a folding heel panel (13) corresponding to the heel portion, and the upper surface of the inclined palm panel (12) is provided with an inclined surface structure inclined downwardly toward the side away from the folding heel panel (13); the bottom plate (11) is provided with a sole support pad (21) and a heel support pad (22) in sequence; both the sole support pad (21) and the heel support pad (22) are made of elastic insole material; a U-shaped flip frame (23) is rotatably connected to the sole support pad (21); a heel flip pad (24) is fixedly connected to the U-shaped flip frame (23), and the heel flip pad (24) is in close contact with the upper surface of the heel support pad (22); the inclined palm panel (1 2) is sleeved on the outside of the sole support pad (21); the folding heel panel (13) is sleeved on the outside of the heel support pad (22) and the heel flip pad (24); a connecting slider (25) is rotatably connected to the U-shaped flip frame (23); a fixing cylinder (26) is fixedly connected between the bottom plate (11) and the heel support pad (22); a spiral support block (27) is rotatably connected in the fixing cylinder (26); the connecting slider (25) is slidably connected to the spiral support block (27); a signal transceiver and power supply integrated module (31) is installed between the bottom plate (11) and the heel support pad (22); a monitoring chip (32) for intelligently monitoring the user's foot is installed on the heel flip pad (24); the monitoring chip (32) is electrically connected to the signal transceiver and power supply integrated module (31).

2. The intelligent shockproof chip insole according to claim 1, characterized in that: No less than two reinforcing rods (28) are fixedly connected to the U-shaped turning frame (23).

3. The intelligent shockproof chip insole according to claim 2, characterized in that: A buffer support block (29) is fixedly connected to the heel support pad (22); the buffer support block (29) supports and aligns the reinforcing rod (28) above the signal transceiver and power supply integrated module (31).

4. The intelligent shockproof chip insole according to claim 1, characterized in that: A shock-absorbing airbag (33) is installed between the bottom plate (11) and the heel support pad (22); the top of the shock-absorbing airbag (33) is in close contact with the monitoring chip (32).

5. The intelligent shockproof chip insole according to claim 1, characterized in that: A first sliding groove structure (2101) is provided on the sole support pad (21); a second sliding groove structure (2401) connected to the first sliding groove structure (2101) is provided on the heel flip pad (24); a slide plate (41) is slidably connected to the first sliding groove structure (2101); a plurality of massage ball head columns (42) are provided on the slide plate (41); a first pulling groove structure (2201) is provided on the heel support pad (22); a second pulling groove structure (2402) connected to the first pulling groove structure (2201) is provided on the heel flip pad (24); a pulling block (44) is fixed to the bottom of the slide plate (41); and the pulling block (44) is slidably connected to the first pulling groove structure (2201) and the second pulling groove structure (2402).

6. The intelligent shockproof chip insole according to claim 5, characterized in that: The massage ball head columns (42) are all slidably connected to the slide plate (41), and the upper surface of the slide plate (41) is set to an inclined structure adapted to the upper surface of the sole support pad (21); a micro tension spring (43) is fixedly connected between each massage ball head column (42) and the slide plate (41); a plurality of guide groove structures (2102) are provided on the sole support pad (21); and the massage ball head columns (42) are closely attached to the inner bottom of the corresponding guide groove structure (2102).

7. The intelligent shockproof chip insole according to claim 6, characterized in that: The guide groove structure (2102) is configured as an inclined surface structure that tilts downward toward the side away from the heel flip pad (24), and the length of the massage ball head column (42) on the slide plate (41) increases toward the side away from the heel flip pad (24).

8. The intelligent shockproof chip insole according to claim 7, characterized in that: A plurality of convex strip structures (1201) are provided in an area of ​​the inclined palm panel (12) aligned with the second slide groove structure (2401); and a plurality of slot structures (4101) adapted to the convex strip structures (1201) are provided on the surface of the slide plate (41).

9. The intelligent shockproof chip insole according to claim 5, characterized in that: A waterproof elastic membrane (14) for covering the first groove structure (2201) of the heel support pad (22) is fixedly connected to the bottom plate (11).

10. The intelligent shockproof chip insole according to any one of claims 1 to 9, characterized in that: A sealing ring (15) is fixedly connected between the fixed cylinder (26) and the bottom plate (11).

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