Display panel, display device and manufacturing method

Abstract

The invention discloses a display panel, a display device and a manufacturing method, and belongs to the technical field of display. The display panel comprises a driving backboard, a first electrode layer, a filling layer, an organic light-emitting layer and a second electrode layer, according to the invention, the first electrode is arranged to be an electrode structure with the metal sub-electrode and the protection conductive sub-electrode, the metal sub-electrode is electrically connected with the driving circuit, and the metal sub-electrode also plays a role in conducting electricity and reflecting light emitted by the organic light-emitting layer; the protective conductive sub-electrode can protect the side, away from the driving back plate, of the metal sub-electrode, the surface quality of the side, away from the driving back plate, of the metal sub-electrode is kept, and corrosion caused by cleaning liquid and the like is avoided. Moreover, the surface of the side, away from the driving back plate, of the protection conductive sub-electrode is flush with the surface of the side, away from the driving back plate, of the filling layer, so that the smooth surface is beneficial to the quality of formation of a structural layer in a subsequent process, and the performance of the display panel is ensured.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel, a display device, and a manufacturing method. Background Art

[0002] With the development of organic light emitting device (OLED) display technology, the market has increasingly stringent requirements for display device performance, such as display panel brightness, service life, and power consumption. However, any structural abnormalities or defects in the light emitting devices within a display panel can affect their performance.

[0003] For example, the surface quality problem of the anode of the display panel; or, there is an insulating and isolating filling layer between the anodes of the two light-emitting devices, but the filling layer is not flush with the surface of the anode; both will affect the subsequent process quality, resulting in the performance of the light-emitting device being affected, and ultimately the performance of the display panel being affected. Summary of the Invention

[0004] The present invention provides a display panel, a display device, and a manufacturing method. The present invention can solve the performance problems of display panels in the prior art caused by the electrodes of the light-emitting devices. The technical solution is as follows:

[0005] In one aspect, a display panel is provided, comprising: a driving backplane, a first electrode layer, a filling layer, an organic light-emitting layer, and a second electrode layer;

[0006] The first electrode layer is located on one side of the driving backplane, and the first electrode layer has a plurality of first electrodes that are separately arranged, and the first electrodes are electrically connected to the driving backplane;

[0007] The filling layer is located on a side of the driving backplane where the first electrode layer is provided, and is distributed between two adjacent first electrodes;

[0008] The organic light-emitting layer is located on a side of the first electrode layer and the filling layer away from the driving backplane;

[0009] The second electrode layer is located on a side of the organic light emitting layer away from the driving backplane;

[0010] Among them, the first electrode includes: a metal sub-electrode and a protective conductive sub-electrode stacked in a direction away from the driving backplane; the surface of the protective conductive sub-electrode away from the driving backplane is flush with the surface of the filling layer away from the driving backplane.

[0011] Optionally, the metal sub-electrode includes at least two stacked sub-metal layers, and the thickness of the sub-metal layer closest to the protective conductive sub-electrode among the at least two sub-metal layers is greater than the thickness of the protective conductive sub-electrode.

[0012] Optionally, in the metal sub-electrode, the thickness of each sub-metal layer is greater than the thickness of the protective conductive sub-electrode.

[0013] Optionally, the at least two sub-metal layers include: a first sub-metal layer and a second sub-metal layer; the first sub-metal layer is closer to the driving backplane than the second sub-metal layer, the second sub-metal layer is in direct contact with the protective conductive sub-electrode, and the thickness of the first sub-metal layer is less than the thickness of the second sub-metal layer.

[0014] Optionally, the reflectivity of the first sub-metal layer to visible light is lower than the reflectivity of the second sub-metal layer to visible light, and / or the electrical conductivity of the first sub-metal layer is lower than the electrical conductivity of the second sub-metal layer.

[0015] Optionally, the material for protecting the conductive sub-electrode includes a metal oxide material.

[0016] Optionally, the metal element in the protective conductive sub-electrode is the same as a metal element in the metal sub-electrode.

[0017] Optionally, when the metal sub-electrode includes at least two sub-metal layers stacked together, the material of the sub-metal layer closest to the protective conductive sub-electrode among the at least two sub-metal layers includes metallic aluminum; and the material of the protective conductive sub-electrode includes aluminum oxide.

[0018] Optionally, the first electrode further includes: a transparent conductive sub-electrode located on a side of the protective conductive sub-electrode away from the metal sub-electrode.

[0019] On the other hand, a display device is provided, comprising a driver chip and any one of the above-mentioned display panels, wherein the driver chip is electrically connected to the display panel.

[0020] In another aspect, a method for manufacturing a display panel is provided, the method comprising:

[0021] Provide driver backplane;

[0022] A first electrode layer and a filling layer are formed on one side of the driving backplane; the first electrode layer has a plurality of first electrodes that are separately arranged, and the first electrodes are electrically connected to the driving backplane; the filling layer is distributed between two adjacent first electrodes;

[0023] forming an organic light-emitting layer on a side of the first electrode layer and the filling layer facing away from the driving backplane;

[0024] forming a second electrode layer on a side of the organic light-emitting layer facing away from the driving backplane;

[0025] Among them, the first electrode includes: a metal sub-electrode and a protective conductive sub-electrode stacked in a direction away from the driving backplane; the surface of the protective conductive sub-electrode away from the driving backplane is flush with the surface of the filling layer away from the driving backplane.

[0026] Optionally, forming a first electrode layer and a filling layer on one side of the driving backplane includes:

[0027] forming a metal material layer on one side of the driving backplane, and patterning the metal material layer to obtain a plurality of metal transition electrodes that are separately arranged;

[0028] forming a filling covering layer on a side of the plurality of metal transition electrodes away from the driving back plate; a portion of the filling covering layer is distributed between two adjacent metal transition electrodes, and another portion covers a side of each metal transition electrode away from the driving back plate;

[0029] The portion of the filling covering layer covering the metal transition electrode is removed, and the portion of each metal transition electrode away from the driving backplane is oxidized to obtain the first electrode layer and the filling layer.

[0030] Optionally, removing a portion of the filling covering layer that covers the metal transition electrode includes:

[0031] The portion of the filling covering layer away from the driving backplane is ground flat until the portion of the filling covering layer covering the metal transition electrode is removed to obtain the filling layer, and the portion of the metal transition electrode away from the driving backplane is oxidized to become the protective conductive sub-electrode.

[0032] Optionally, performing a grinding process on a portion of the filling cover layer facing away from the driving back plate includes:

[0033] Using a chemical mechanical polishing process, the portion of the filling cover layer away from the driving back plate is ground flat;

[0034] The polishing liquid used in the chemical mechanical polishing process contains an oxidant.

[0035] Optionally, after forming the protective conductive sub-electrode, the manufacturing method further includes:

[0036] Cleaning the side of the protective conductive sub-electrode facing away from the driving back plate;

[0037] A transparent conductive sub-electrode is formed on a side of the protective conductive sub-electrode away from the driving backplane.

[0038] The beneficial effects of the technical solution provided by the embodiments of the present application are:

[0039] By configuring the first electrode to have an electrode structure comprising a metal sub-electrode and a protective conductive sub-electrode, the metal sub-electrode is electrically connected to the drive circuit. The metal sub-electrode also functions as a conductor and reflects light emitted by the organic light-emitting layer. The protective conductive sub-electrode protects the side of the metal sub-electrode facing away from the drive backplane, maintaining the surface quality of the metal sub-electrode facing away from the drive backplane and preventing corrosion from cleaning fluids and the like. Furthermore, the surface of the protective conductive sub-electrode facing away from the drive backplane is flush with the surface of the filling layer facing away from the drive backplane. This flat surface improves the quality of the structural layer formed in subsequent processes, thereby ensuring the performance of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0041] Figure 1 is a schematic diagram of a manufacturing process of a display panel;

[0042] Figure 2 A schematic diagram of the structure of a display panel provided in an embodiment of the present application;

[0043] Figure 3 A schematic structural diagram of the first electrode layer and the filling layer provided in an embodiment of the present application;

[0044] Figure 4 Another structural schematic diagram of the first electrode provided in an embodiment of the present application;

[0045] Figure 5 A schematic flow chart of a method for manufacturing a display panel according to an embodiment of the present application;

[0046] Figure 6 A schematic diagram of the manufacturing process of the first electrode layer and the filling layer provided in an embodiment of the present application;

[0047] Figure 7 A schematic diagram showing a comparison of electrical characteristic measurements of the protective conductive sub-electrodes provided in an embodiment of the present application. DETAILED DESCRIPTION

[0048] In order to make the objectives, technical solutions and advantages of this application clearer, the implementation methods of this application will be further described in detail below with reference to the accompanying drawings.

[0049] In the field of OLED displays, top-emitting OLED display panels are increasingly widely used. In addition to the hole injection function, the anode structure of this type of display panel also needs to have a high reflectivity to reflect the light emitted by the organic light-emitting layer. If there are defects on the surface of the anode structure, such as corrosion, bulges or pits, etc., on the one hand, it will affect the conductivity and / or reflection between the anode and the organic light-emitting layer, and on the other hand, it will also cause leakage, which will affect the luminous performance of the light-emitting device, such as the start-up and life of the light-emitting device, and will also cause the problem of luminous color shift. In addition, the OLED display panel has a variety of organic layers arranged in a whole layer, such as the organic light-emitting layer, and the height difference / break difference between the filling layer around the anode structure and the anode will affect the quality of these organic layers and ultimately affect the performance of the display panel.

[0050] In addition, for OLED display panels with strong microcavities, a transparent conductive layer will be provided in the light-emitting device to adjust the length of the microcavity (cavity length). For example, a transparent conductive layer can be provided between the existing metal anode and the organic light-emitting layer. For such OLED display panels with strong microcavities, the anode structure of the light-emitting device can include a metal sub-electrode and a transparent conductive sub-electrode. The surface quality of the metal sub-electrode and the difference between the metal sub-electrode and the filling layer will also affect the overlap quality of the transparent conductive sub-electrode and the metal sub-electrode. In the current manufacturing process of display panels, the metal sub-electrode and the transparent conductive sub-electrode are formed in two steps. For example, please refer to Figure 1 , Figure 1 This is a schematic diagram of the manufacturing process of a display panel. The metal sub-electrode 01 is formed by depositing and patterning a metal film on the driving backplane 00. Subsequently, an insulating material is required to form a filling covering layer 02 to fill between the two metal sub-electrodes 01 and cover the side of the metal sub-electrode 01 facing away from the driving backplane 00. A dry etching process is then used to perform back etching to remove the insulating material on the top of the metal sub-electrode 01 to form a filling layer 02a. However, there is a height difference between the surface of the metal sub-electrode 01 and the filling layer 02a obtained by the above process. In addition, before the subsequent manufacturing process of the transparent conductive sub-electrode is carried out, the surface of the metal sub-electrode 01 needs to be cleaned, and the cleaning solution will also cause the surface of the metal sub-electrode 01 to be corroded.

[0051] It can be seen that in an OLED display panel, the surface quality of the anode and the step difference between the anode and the filling layer will affect the performance of the light-emitting device, that is, the performance of the display panel.

[0052] The display panel provided in the embodiment of the present application provides a transparent conductive sub-electrode on the side of the metal sub-electrode facing away from the driving backplane. On the one hand, the surface of the metal sub-electrode is protected, and on the other hand, it is flush with the surface of the filling layer, thereby ensuring that the metal sub-electrode of the first electrode is not corroded, and is conducive to the preparation of subsequent structural layers, thereby ensuring the performance of the display panel.

[0053] Please refer to Figure 2 and Figure 3 , Figure 2 A schematic diagram of the structure of a display panel provided in an embodiment of the present application is shown in FIG. Figure 3 This is a structural diagram of the first electrode layer and the filling layer provided in an embodiment of the present application. The display panel 000 may include: a driving backplane 001, a first electrode layer 002A, a filling layer 003, an organic light-emitting layer 005 and a second electrode layer 006.

[0054] The first electrode layer 002A is located on one side of the driving backplane 001 . The first electrode layer 002A includes a plurality of separately arranged first electrodes 002 . The first electrodes 002 are electrically connected to the driving backplane 001 .

[0055] The filling layer 003 is located on a side of the driving backplane 001 where the first electrode layer 002A is provided, and is distributed between two adjacent first electrodes 002 .

[0056] The organic light emitting layer 005 is located on a side of the first electrode layer 002A and the filling layer 003 facing away from the driving backplane 001 .

[0057] The second electrode layer 006 is located on a side of the organic light emitting layer 005 facing away from the driving backplane 001 .

[0058] Among them, the first electrode 002 may include: a metal sub-electrode 002a and a protective conductive sub-electrode 002b stacked in a direction away from the driving backplane 001; the surface of the protective conductive sub-electrode 002b away from the driving backplane 001 is flush with the surface of the filling layer 003 away from the driving backplane 001.

[0059] like Figure 3 As shown, in this embodiment of the present application, a protective conductive sub-electrode 002b is provided on the side of the metal sub-electrode 002a facing away from the driver backplane 001. Protective conductive sub-electrode 002b provides a degree of protection from corrosion by cleaning fluids and other agents, while also providing electrical conductivity, thus preventing electrical conduction between metal sub-electrode 002a and organic light-emitting layer 005. This ensures that, regardless of whether a transparent conductive sub-electrode 002c is subsequently formed, the surface quality of metal sub-electrode 002a is not affected by the cleaning process, maintaining high conductivity and reflectivity, thereby guaranteeing the performance of display panel 000.

[0060] In addition, the surface of the protective conductive sub-electrode 002b facing away from the driving backplane 001 is flush with the surface of the filling layer 003 facing away from the driving backplane 001, which can ensure the quality of subsequent structural layers such as the organic light-emitting layer 005 on the side of the first electrode layer 002A facing away from the driving backplane 001.

[0061] Exemplarily, the material for protecting the conductive sub-electrode 002b may include a material with high transparency and high transmittance to visible light. In this way, the surface of the metal sub-electrode 002a can effectively reflect the light emitted by the organic light-emitting layer 005, thereby ensuring the normal operation of the top-emitting display panel 000 through high transmittance while achieving protection and conductivity.

[0062] For example, the driving backplane 001 provided in the embodiment of the present application may be a silicon-based driving backplane. The silicon-based driving backplane has rigidity, which allows for various methods to be used to make the surface of the protective conductive sub-electrode 002b facing away from the driving backplane 001 flush with the surface of the filling layer 003 facing away from the driving backplane 001. For example, the driving backplane 001 formed with the first electrode layer 002A and the filling layer 003 may be polished using a chemical mechanical polishing process to make the surface of the protective conductive sub-electrode 002b facing away from the driving backplane 001 flush with the surface of the filling layer 003 facing away from the driving backplane 001, and the method is not limited to etching.

[0063] In the embodiments of the present application, the first electrode is configured to have an electrode structure comprising a metal sub-electrode and a protective conductive sub-electrode. The metal sub-electrode is electrically connected to the drive circuit and also functions as a conductor and reflector of light emitted by the organic light-emitting layer. The protective conductive sub-electrode protects the side of the metal sub-electrode facing away from the drive backplane, maintaining the quality of the surface of the metal sub-electrode facing away from the drive backplane and preventing corrosion by cleaning fluids, etc. Furthermore, the surface of the protective conductive sub-electrode facing away from the drive backplane is flush with the surface of the filling layer facing away from the drive backplane. This flat surface improves the quality of the structural layer formed in subsequent processes, thereby ensuring the performance of the display panel.

[0064] In some possible implementations, considering that the protective conductive sub-electrode 002b needs to have both protective function and conductive performance, the material of the protective conductive sub-electrode 002b may include a metal oxide material.

[0065] Metal oxide materials have higher electrical conductivity than non-metal oxide materials and offer greater passivation protection than metal materials. This ensures that the metal sub-electrode 002a is protected while also achieving electrical conductivity with the organic light-emitting layer 005. It should be noted that in this embodiment, the passivation effect of the protective conductive sub-electrode 002b is described as providing higher passivation protection than the metal sub-electrode 002a. This does not limit the protective conductive sub-electrode 002b to an insulating material.

[0066] Exemplary materials for protecting the conductive sub-electrode 002b include metal oxides with a certain passivation effect, such as aluminum oxide, molybdenum trioxide, hafnium dioxide, titanium oxide, and tungsten trioxide. Metal doping can be used to enhance conductivity if necessary. Furthermore, metal oxide materials with high visible light transmittance are selected to effectively ensure that the metal sub-electrode 002a reflects light from the organic light-emitting layer 005.

[0067] In some possible implementations, considering the connection effect between the protective conductive sub-electrode 002b and the metal sub-electrode 002a, the metal element in the protective conductive sub-electrode 002b is the same as a metal element in the metal sub-electrode 002a.

[0068] Using a material having the same metal element to form the protective conductive sub-electrode 002b can improve the connection strength between the protective conductive sub-electrode 002b and the metal sub-electrode 002a, and reduce the overlap impedance between the protective conductive sub-electrode 002b and the metal sub-electrode 002a, thereby ensuring the conductivity of the first electrode 002.

[0069] For example, the formation of aluminum oxide by a thin film process on metallic aluminum and the formation of aluminum oxide by a thin film process on metallic silver are used as examples. When aluminum oxide is deposited on metallic aluminum, because the base aluminum and aluminum oxide have the same aluminum element, the two have elemental homology, which makes the interface atoms highly matched and the chemical bonds continuous. High bonding strength is exhibited mainly through chemical bonding, and under certain conditions (such as a thin oxide layer or defects), it can conduct electricity through the continuity or defect tunneling of the aluminum element. When aluminum oxide is deposited on metallic silver, silver and aluminum oxide have no shared elements and belong to a heterologous system, which can easily lead to interface atomic mismatch and chemical bond breakage. It mainly relies on physical bonding, has low bonding strength and is easy to delaminate. At the same time, due to the lack of elemental conductive channels, the interface is highly insulating and has weak conductivity.

[0070] For example, when the metal element in the protective conductive sub-electrode 002b is the same as a metal element in the metal sub-electrode 002a, the protective conductive sub-electrode 002b can be a metal oxide layer formed by oxidizing the side of the metal sub-electrode 002a facing away from the driving backplane 001.

[0071] For example, the material used to protect the conductive sub-electrode 002b may include aluminum oxide. Because the aluminum oxide film may contain residual, incompletely oxidized aluminum or defects such as oxygen vacancies, and is directly connected to the metal sub-electrode 002a through the aluminum element, a conductive path can be formed by leveraging the continuity of the aluminum metal or the defect tunneling effect. A deposited aluminum oxide film, while having the same thickness but with a denser structure and fewer defects, exhibits relatively stronger insulation properties. Therefore, an aluminum oxide film formed by oxidation exhibits higher conductivity than an aluminum oxide film formed by thin film deposition.

[0072] In some possible implementations, metal sub-electrode 002a may include at least two stacked sub-metal layers. The sub-metal layer closest to protective conductive sub-electrode 002b may be made of aluminum, while the material of protective conductive sub-electrode 002b may be made of aluminum oxide. In terms of thickness, the sub-metal layer closest to protective conductive sub-electrode 002b may be thicker than the protective conductive sub-electrode 002b.

[0073] Exemplarily, in the metal sub-electrode 002a, the thickness of each sub-metal layer is greater than the thickness of the protective conductive sub-electrode 002b.

[0074] In the field of OLED display panel technology, anode metal materials are generally made of highly reflective metals such as aluminum or silver, with aluminum being one of the most popular materials. Therefore, if the sub-metal layer closest to the protective conductive sub-electrode 002b can be made of aluminum, the material of the protective conductive sub-electrode 002b can be made of aluminum oxide. This ensures the best possible connection between the protective conductive sub-electrode 002b and the sub-metal layer, with high connection strength and conductivity.

[0075] In some possible implementations, in the above embodiment, in order to reduce the material requirements and formation process requirements for the protective conductive sub-electrode 002b, the thickness of the protective conductive sub-electrode 002b is less than or equal to 10 nanometers.

[0076] The protective conductive sub-electrode 002b, with a thickness of less than or equal to 10 nanometers, can achieve electrical conductivity through quantum tunneling, eliminating restrictions on the specific material and formation process of the protective conductive sub-electrode 002b, or whether it contains the same metallic element as the metal sub-electrode 002a. This simplifies the process steps and reduces costs.

[0077] Some possible implementations, such as Figure 3As shown, in an embodiment of the present application, at least two sub-metal layers may include a first sub-metal layer 0021 and a second sub-metal layer 0022; the first sub-metal layer 0021 is closer to the driving backplane 001 than the second sub-metal layer 0022, the second sub-metal layer 0022 is in direct contact with the protective conductive sub-electrode 002b, and the thickness of the first sub-metal layer 0021 is less than the thickness of the second sub-metal layer 0022.

[0078] Exemplarily, the reflectivity of the first sub-metal layer 0021 to visible light is lower than that of the second sub-metal layer 0022, and / or the electrical conductivity of the first sub-metal layer 0021 is lower than that of the second sub-metal layer 0022. The thicker second sub-metal layer 0022 primarily conducts and reflects light, while the thinner first sub-metal layer 0021 is used to enhance the connection between the first electrode 002 and the driver backplane 001.

[0079] For example, the first sub-metal layer 0021 may be a titanium layer, and the second sub-metal layer 0022 may be an aluminum layer. The titanium layer may function as an adhesion layer, helping the aluminum layer to better connect to the driver backplane 001.

[0080] For some possible implementations, see Figure 4 , Figure 4 This is another structural diagram of the first electrode 002 provided in an embodiment of the present application. The first electrode 002 may further include: a transparent conductive sub-electrode 002c located on a side of the protective conductive sub-electrode 002b away from the metal sub-electrode 002a.

[0081] For example, for an OLED display panel with a strong microcavity, the cavity length of the microcavity is adjusted by providing a transparent conductive sub-electrode 002c. For example, the material of the transparent conductive sub-electrode 002c may include indium tin oxide (ITO).

[0082] The display panel 000 provided in the embodiment of the present application is as follows: Figure 2 As shown, in addition to the above-mentioned first electrode layer 002A, organic light-emitting layer 005 and second electrode layer 006, other available structural layers may also be included, such as pixel definition layer 004, encapsulation layer 007, touch layer, etc.

[0083] For example, Figure 2 As shown, the display panel 000 may further include: a pixel definition layer 004; the pixel definition layer 004 is located on the side of the first electrode layer 002A away from the driving backplane 001, and the pixel definition layer 004 has a plurality of pixel openings; and the organic light-emitting layer 005 is located on the side of the pixel definition layer 004 away from the driving backplane 001.

[0084] The plurality of pixel openings correspond to the plurality of first electrodes 002 , and the orthographic projections of the pixel openings on the driving backplane 001 are located within the orthographic projections of the corresponding first electrodes 002 on the driving backplane 001 .

[0085] For example, Figure 2 As shown, the display panel 000 may further include: an encapsulation layer 007 ; the encapsulation layer 007 is located on a side of the second electrode layer 006 away from the driving backplane 001 .

[0086] In summary, the display panel provided by the embodiment of the present application may include a driving backplane, a first electrode layer, a filling layer, an organic light-emitting layer, and a second electrode layer. By setting the first electrode to have an electrode structure having a metal sub-electrode and a protective conductive sub-electrode, the metal sub-electrode is electrically connected to the driving circuit. The metal sub-electrode also plays the role of conducting electricity and reflecting the light emitted by the organic light-emitting layer. The protective conductive sub-electrode can protect the side of the metal sub-electrode away from the driving backplane, maintain the quality of the surface of the metal sub-electrode away from the driving backplane, and avoid corrosion by cleaning fluids, etc. Moreover, the surface of the protective conductive sub-electrode away from the driving backplane is flush with the surface of the filling layer away from the driving backplane. In this way, the flat surface is conducive to the quality of the structural layer formed in the subsequent process, thereby ensuring the performance of the display panel.

[0087] An embodiment of the present application further provides a display device, which may include a driver chip and a display panel described in any of the above embodiments, wherein the driver chip is electrically connected to the display panel.

[0088] Exemplarily, the display device may be a display screen in a display device such as a mobile phone, tablet computer, laptop computer, monitor, smart TV, etc. The display device may also have the technical effects of the above-mentioned display panel, which will not be described again here.

[0089] The present application also provides a method for manufacturing a display panel. Figure 5 , Figure 5 A schematic flow chart of a method for manufacturing a display panel provided in an embodiment of the present application, the method may include:

[0090] Step S001: provide a driving backplane.

[0091] Step S002: forming a first electrode layer and a filling layer on one side of the driving backplane; the first electrode layer has a plurality of separately arranged first electrodes, and the first electrodes are electrically connected to the driving backplane; and the filling layer is distributed between two adjacent first electrodes.

[0092] Among them, the first electrode 002 may include: a metal sub-electrode 002a and a protective conductive sub-electrode 002b stacked in a direction away from the driving backplane 001; the surface of the protective conductive sub-electrode 002b away from the driving backplane 001 is flush with the surface of the filling layer 003 away from the driving backplane 001.

[0093] Step S003 : forming an organic light-emitting layer on a side of the first electrode layer and the filling layer facing away from the driving backplane.

[0094] Step S004 : forming a second electrode layer on a side of the organic light-emitting layer facing away from the driving backplane.

[0095] The manufacturing method provided in the embodiment of the present application can obtain the display panel described in the above embodiment, which has the corresponding technical effects of the above display panel and will not be repeated here.

[0096] Below, some steps in the manufacturing method provided in the embodiments of the present application are described in detail. For steps not described in detail, reference can be made to the process steps in the related art. The steps described in detail are not intended to limit the manufacturing method provided in the embodiments of the present application, but are intended to further illustrate the implementation of the manufacturing method.

[0097] For some possible implementations, see Figure 6 , Figure 6 A schematic diagram of the manufacturing process of the first electrode layer and the filling layer provided in an embodiment of the present application. In the above step S002, forming the first electrode layer and the filling layer on one side of the driving backplane may include:

[0098] Step S101: forming a metal material layer on one side of the driving backplane, and patterning the metal material layer to obtain a plurality of separately arranged metal transition electrodes.

[0099] Step S102 : forming a filling covering layer on the side of the plurality of metal transition electrodes away from the driving backplane; a portion of the filling covering layer is distributed between two adjacent metal transition electrodes, and another portion covers the side of each metal transition electrode away from the driving backplane.

[0100] Step S103 : removing the portion of the filling covering layer covering the metal transition electrodes, and oxidizing the portion of each metal transition electrode away from the driving backplane, so as to obtain a first electrode layer and a filling layer.

[0101] In the embodiment of the present application, in step S103, the portion of the metal transition electrode 002B facing away from the driver backplane 001 is oxidized to obtain the metal sub-electrode 002a and the protective conductive sub-electrode 002b. The protective conductive sub-electrode 002b obtained by this method can have higher connection strength and conductivity than that obtained by thin film deposition.

[0102] For example, when the metal sub-electrodes include metal aluminum and metal titanium, in the above step S101, patterning the metal material layer may include:

[0103] Step S201, patterning the metal material layer by dry etching; wherein the source power of the dry etching is 1000 W-1500 W, and the bias power is 400 W-800 W; the etching gas in the dry etching includes argon, and the flow rate of the argon is 20 sccm-50 sccm.

[0104] For example, the source power of dry etching is 1000 watts, and the bias power is 700 watts; the etching gases in the dry etching include argon, chlorine, and helium, the flow rate of argon is 35 sccm, and the flow rates of chlorine and helium are 100 sccm.

[0105] Common gases used for etching titanium and aluminum are chlorine, boron chloride, sulfur fluoride, etc. The products generated by the reaction of these etching gases with Al (such as aluminum chloride, aluminum fluoride, etc.) are less volatile and are easy to remain, especially at low temperatures (<150°C). On the one hand, these residues will remain on the side and top edge of the aluminum layer. If the metal aluminum surface is subsequently cleaned, the corrosion of the aluminum surface will be aggravated, and larger holes will be formed. The above phenomena can be called aluminum corrosion. On the other hand, these residues will also affect the subsequent etching of metal titanium. Therefore, in an embodiment of the present application, by adding argon gas, increasing the bias power and power, increasing the dissociation and longitudinal bombardment force of chlorine plasma, these residues are bombarded and peeled off, and then extracted from the etching equipment. In this way, in the process of patterning the metal material layer, the residues generated by aluminum etching are removed, and the problems caused by aluminum corrosion are solved.

[0106] In some possible implementations, in the above step S103, removing the portion of the filling covering layer covering the metal transition electrode may include:

[0107] Step S202 : grinding the portion of the filling covering layer away from the driving back plate until the portion of the filling covering layer covering the metal transition electrode is removed to obtain a filling layer, and oxidizing the portion of the metal transition electrode away from the driving back plate to form a protective conductive sub-electrode.

[0108] In the embodiment of the present application, a portion of the filling covering layer 003A covering the metal transition electrode 002B is removed by a flattening process, so that the surface of the protective conductive sub-electrode 002b facing away from the driving backplate 001 is flush with the surface of the filling layer 003 facing away from the driving backplate 001. During the flattening process, or after the flattening process is completed, the surface of the metal transition electrode 002B facing away from the driving backplate 001 can be oxidized to oxidize a portion of the metal transition electrode 002B into the protective conductive sub-electrode 002b. The oxidation process can be thermal oxidation, chemical oxidation, or the like.

[0109] For example, in the above step S202, the grinding process for the portion of the filling cover layer away from the driver back plate may include:

[0110] Step S301: Using a chemical mechanical polishing process, grind flat the portion of the filling cover layer away from the driver back plate.

[0111] The polishing liquid used in the chemical mechanical polishing process contains an oxidant.

[0112] In the embodiment of the present application, a chemical mechanical polishing process is used to smooth the filling cover layer 003A. After the surface of the metal transition electrode 002B facing away from the driver backplate 001 is flush with the surface of the filling layer 003 facing away from the driver backplate 001, polishing is continued using a polishing liquid containing an oxidant. This allows the surface of the metal transition electrode 002B facing away from the driver backplate 001 to be oxidized, and ensures that the surface of the protective conductive sub-electrode 002b facing away from the driver backplate 001 is flush with the surface of the filling layer 003 facing away from the driver backplate 001.

[0113] In some possible implementations, after forming the protective conductive sub-electrode, the manufacturing method may further include:

[0114] Step S0021: Cleaning the side of the protective conductive sub-electrode facing away from the driving backplane.

[0115] Step S0022: forming a transparent conductive sub-electrode on the side of the protective conductive sub-electrode facing away from the driving backplane.

[0116] For an OLED display panel with a strong microcavity, the display panel 000 also includes a transparent conductive sub-electrode 002c located on the side of the organic light-emitting layer 005 facing the driving backplane 001. Since the process of forming the metal sub-electrode 002a and the protective conductive sub-electrode 002b on the driving backplane 001 is not in the same process as the process of forming the transparent conductive sub-electrode 002c. Therefore, after the process flow, it is necessary to clean the side of the protective conductive sub-electrode 002b away from the driving backplane 001. Since the protective conductive sub-electrode 002b has a certain protective passivation function, it can be prevented from being corroded by the cleaning solution. Compared with the method of cleaning the surface of the metal sub-electrode 002a in the related art, the embodiment of the present application will not have the problem of the metal surface being corroded by the cleaning solution. In this way, the overlapping effect between the protective conductive sub-electrode 002b and the transparent conductive sub-electrode 002c is good and the conductivity is good.

[0117] For example, please refer to Figure 7 , Figure 7 The electrical characteristic measurement comparison diagram of the protective conductive sub-electrode provided in the embodiment of the present application is illustrated by taking the metal sub-electrode 002a as a metal layer (Al), the protective conductive sub-electrode 002b as aluminum oxide (Al2O3), and the transparent conductive sub-electrode 002c as ITO as an example. Figure 7 As shown, the conductive structure formed by the overlapping protective conductive sub-electrode 002b and the transparent conductive sub-electrode 002c has higher conductivity and lower impedance than the conductive structure formed by the overlapping metal sub-electrode 002a and the transparent conductive sub-electrode 002c. This is because the surface of the metal sub-electrode 002a may be corroded after cleaning. These surface defects can weaken the overlapping connection between the metal sub-electrode 002a and the transparent conductive sub-electrode 002c, reducing the conductive performance.

[0118] The manufacturing method of the display panel provided in the embodiment of the present application can obtain the display panel described in the above embodiment, and the method steps provided in each embodiment can obtain the various structural layers of the corresponding display panel. Each method step has the technical effect of the corresponding structural layer, which will not be repeated here.

[0119] It should be noted that in the accompanying drawings, the sizes of layers and regions may be exaggerated for clarity of illustration. It will also be understood that when an element or layer is referred to as being "on" another element or layer, it may be directly on the other element, or there may be an intermediate layer. In addition, it will be understood that when an element or layer is referred to as being "under" another element or layer, it may be directly under the other element, or there may be more than one intermediate layer or element. In addition, it will also be understood that when a layer or element is referred to as being "between" two layers or elements, it may be the only layer between the two layers or elements, or there may also be more than one intermediate layer or element. Similar reference numerals throughout the text indicate similar elements.

[0120] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The term "plurality" refers to two or more than two, unless expressly limited otherwise.

[0121] The above description is merely an optional embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A display panel, characterized in that: include: driving the backplane, the first electrode layer, the filling layer, the organic light-emitting layer, and the second electrode layer; The first electrode layer is located on one side of the driving backplane, and the first electrode layer has a plurality of first electrodes that are separately arranged, and the first electrodes are electrically connected to the driving backplane; The filling layer is located on a side of the driving backplane where the first electrode layer is provided, and is distributed between two adjacent first electrodes; The organic light-emitting layer is located on a side of the first electrode layer and the filling layer away from the driving backplane; The second electrode layer is located on a side of the organic light emitting layer away from the driving backplane; Among them, the first electrode includes: a metal sub-electrode and a protective conductive sub-electrode stacked in a direction away from the driving backplane; the surface of the protective conductive sub-electrode away from the driving backplane is flush with the surface of the filling layer away from the driving backplane.

2. The display panel according to claim 1, wherein: The metal sub-electrode includes at least two stacked sub-metal layers, and the thickness of the sub-metal layer closest to the protective conductive sub-electrode among the at least two sub-metal layers is greater than the thickness of the protective conductive sub-electrode.

3. The display panel according to claim 2, wherein: In the metal sub-electrodes, the thickness of each of the sub-metal layers is greater than the thickness of the protective conductive sub-electrode.

4. The display panel according to claim 2 or 3, wherein: The at least two sub-metal layers include: a first sub-metal layer and a second sub-metal layer; the first sub-metal layer is closer to the driving backplane than the second sub-metal layer, the second sub-metal layer is in direct contact with the protective conductive sub-electrode, and the thickness of the first sub-metal layer is less than the thickness of the second sub-metal layer.

5. The display panel according to claim 4, wherein: The reflectivity of the first sub-metal layer to visible light is lower than the reflectivity of the second sub-metal layer to visible light, and / or the electrical conductivity of the first sub-metal layer is lower than the electrical conductivity of the second sub-metal layer.

6. The display panel according to any one of claims 1 to 3 and 5, characterized in that: The material for protecting the conductive sub-electrode includes a metal oxide material.

7. The display panel according to claim 6, wherein: The metal element in the protective conductive sub-electrode is the same as a metal element in the metal sub-electrode.

8. The display panel according to claim 7, wherein: In the case where the metal sub-electrode includes at least two stacked sub-metal layers, the material of the sub-metal layer closest to the protective conductive sub-electrode among the at least two sub-metal layers includes metallic aluminum; and the material of the protective conductive sub-electrode includes aluminum oxide.

9. The display panel according to any one of claims 1-3, 5, 7-8, characterized in that: The first electrode further includes: a transparent conductive sub-electrode located on a side of the protective conductive sub-electrode away from the metal sub-electrode.

10. A display device, characterized in that: The device comprises a driving chip and the display panel according to any one of claims 1 to 9, wherein the driving chip is electrically connected to the display panel.

11. A method for manufacturing a display panel, characterized in that: The method comprises: Provide driver backplane; A first electrode layer and a filling layer are formed on one side of the driving backplane; the first electrode layer has a plurality of first electrodes that are separately arranged, and the first electrodes are electrically connected to the driving backplane; the filling layer is distributed between two adjacent first electrodes; forming an organic light-emitting layer on a side of the first electrode layer and the filling layer facing away from the driving backplane; forming a second electrode layer on a side of the organic light-emitting layer facing away from the driving backplane; Among them, the first electrode includes: a metal sub-electrode and a protective conductive sub-electrode stacked in a direction away from the driving backplane; the surface of the protective conductive sub-electrode away from the driving backplane is flush with the surface of the filling layer away from the driving backplane.

12. The manufacturing method according to claim 11, characterized in that: A first electrode layer and a filling layer are formed on one side of the driving backplane, comprising: forming a metal material layer on one side of the driving backplane, and patterning the metal material layer to obtain a plurality of metal transition electrodes that are separately arranged; forming a filling covering layer on a side of the plurality of metal transition electrodes away from the driving back plate; a portion of the filling covering layer is distributed between two adjacent metal transition electrodes, and another portion covers a side of each metal transition electrode away from the driving back plate; The portion of the filling covering layer covering the metal transition electrode is removed, and the portion of each metal transition electrode away from the driving backplane is oxidized to obtain the first electrode layer and the filling layer.

13. The manufacturing method according to claim 12, characterized in that: Removing a portion of the filling covering layer covering the metal transition electrode includes: The portion of the filling covering layer away from the driving backplane is ground flat until the portion of the filling covering layer covering the metal transition electrode is removed to obtain the filling layer, and the portion of the metal transition electrode away from the driving backplane is oxidized to become the protective conductive sub-electrode.

14. The manufacturing method according to claim 13, characterized in that: The portion of the filling covering layer facing away from the driving back plate is subjected to a flattening process, comprising: Using a chemical mechanical polishing process, the portion of the filling cover layer away from the driving back plate is ground flat; The polishing liquid used in the chemical mechanical polishing process contains an oxidant.

15. The manufacturing method according to any one of claims 11 to 14, characterized in that: After forming the protective conductive sub-electrode, the manufacturing method further includes: Cleaning the side of the protective conductive sub-electrode facing away from the driving back plate; A transparent conductive sub-electrode is formed on a side of the protective conductive sub-electrode away from the driving backplane.

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