Display panel, preparation method of display panel and display device

Abstract

The invention relates to a display panel, a preparation method of the display panel and a display device. The display panel includes: an array substrate; the pixel definition layer is arranged on one side of the array substrate, and a plurality of pixel openings are defined by the pixel definition layer; the light-emitting device layer is arranged on one side of the array substrate, and the light-emitting device layer comprises a plurality of light-emitting devices corresponding to the plurality of pixel openings; the touch film layer is arranged on the sides, away from the array substrate, of the pixel definition layer and the light-emitting device layer, and the surface of the side, away from the pixel definition layer and the light-emitting device layer, of the touch film layer is covered with a blackening layer; the blackening layer is configured to be formed by processing the metal layer in the touch film layer. The blackening layer is formed on the surface of the touch film layer, so that the reflectivity of the touch film layer is reduced, and the production cost of the display panel is reduced.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a display panel, a method for manufacturing a display panel, and a display device. Background Art

[0002] With the continuous advancement of active-matrix organic light-emitting diode (AMOLED) technology, the demand for display image quality, such as contrast and black-out effects, is becoming increasingly stringent. The basic structure of a display panel consists of light-emitting devices mounted on an array backplane. This backplane contains a large amount of highly reflective metal. Excessive reflectivity can affect display quality, such as contrast. Furthermore, some screens incorporate touchscreens. The touch-sensing electrode layer of these touchscreens is typically made of metal, which has a high reflectivity and can also affect display quality.

[0003] In traditional technology, a polarizer is usually attached to an AMOLED display to reduce the reflectivity of the metal in the display panel.

[0004] However, traditional display panels with integrated polarizers suffer from reduced light extraction efficiency. Polarizer transmittance is generally below 50%, reducing display brightness and increasing power consumption. In foldable displays, the high folding stress of the polarizers can affect the display's folding durability, inevitably causing film delamination and creases, and in severe cases, even rendering the display inoperable. Summary of the Invention

[0005] Based on this, it is necessary to provide a display panel, a method for manufacturing a display panel, and a display device that can improve light extraction efficiency in order to address the above technical issues.

[0006] In a first aspect, the present application provides a display panel, comprising:

[0007] array substrate;

[0008] A pixel definition layer is provided on one side of the array substrate, wherein the pixel definition layer defines a plurality of pixel openings;

[0009] a light-emitting device layer disposed on one side of the array substrate, the light-emitting device layer comprising a plurality of light-emitting devices disposed corresponding to the plurality of pixel openings; the light-emitting devices comprising a first electrode, a light-emitting layer, and a second electrode stacked in a direction away from the array substrate; the pixel openings exposing a portion of a surface of the first electrode of the corresponding light-emitting device, and at least a portion of the light-emitting layer of the corresponding light-emitting device being disposed within the pixel openings;

[0010] A touch film layer is provided on a side of the pixel definition layer and the light emitting device layer away from the array substrate, and a surface of the touch film layer away from the pixel definition layer and the light emitting device layer is covered with a blackened layer;

[0011] The blackened layer is configured to be formed by processing the metal layer in the touch film layer.

[0012] In one embodiment, the touch film layer includes:

[0013] a bridging layer, provided on a side of the pixel definition layer and the light-emitting device layer away from the array substrate;

[0014] an insulating layer, provided on a side of the bridging layer away from the pixel definition layer and the light-emitting device layer;

[0015] The metal electrode layer is provided on the side of the insulating layer away from the bridge layer; the blackened layer is formed by oxidizing the surface of the side of the metal electrode layer away from the bridge layer.

[0016] In one embodiment, the metal electrode layer comprises:

[0017] a first metal layer, provided on a side of the insulating layer away from the pixel definition layer and the light-emitting device layer;

[0018] a second metal layer, disposed on a side of the first metal layer facing away from the bridge layer;

[0019] a third metal layer, disposed on a side of the second metal layer facing away from the first metal layer;

[0020] Optionally, the blackened layer is formed by oxidizing the surface of the third metal layer on a side facing away from the second metal layer;

[0021] Optionally, the blackened layer and the third metal layer include the same element.

[0022] In one embodiment, the first metal layer includes any one of titanium, molybdenum, and titanium-molybdenum alloy;

[0023] And / or, the second metal layer includes a low-resistance metal layer;

[0024] And / or, the third metal layer includes any one of titanium, molybdenum, and titanium-molybdenum alloy;

[0025] Optionally, the thickness of the first metal layer is greater than 20 nm and less than 80 nm;

[0026] Optionally, the thickness of the second metal layer is greater than 100 nm and less than 800 nm;

[0027] Optionally, the thickness of the third metal layer is greater than 20 nm and less than 80 nm.

[0028] In one embodiment, the material of the blackened layer includes at least one of molybdenum oxide and titanium oxide.

[0029] In one embodiment, the pixel definition layer includes:

[0030] A first pixel definition layer is provided on one side of the array substrate, and the first pixel definition layer is a black pixel definition layer;

[0031] The second pixel definition layer is arranged on a side of the first pixel definition layer away from the array substrate.

[0032] In one embodiment, the display panel further includes:

[0033] A color filter layer is provided on a side of the touch film layer away from the light-emitting device layer; the color filter layer includes a plurality of filters, and the filters are provided in a one-to-one correspondence with the light-emitting devices;

[0034] Optionally, the blackened layer is reused as a black matrix of the color filter layer.

[0035] In one embodiment, the blackened layer has a plurality of light-transmitting openings, which are arranged in a one-to-one correspondence with the color filters; the orthographic projections of the light-transmitting openings on the array substrate overlap with at least part of the orthographic projections of the corresponding color filters on the array substrate.

[0036] In a second aspect, the present application further provides a method for preparing a display panel, the method comprising:

[0037] providing an array substrate;

[0038] forming a pixel definition layer on one side of the array substrate, wherein the pixel definition layer defines a plurality of pixel openings;

[0039] A light-emitting device layer is formed on one side of the array substrate, the light-emitting device layer including a plurality of light-emitting devices arranged corresponding to the plurality of pixel openings; the light-emitting devices include a first electrode, a light-emitting layer, and a second electrode stacked in a direction away from the array substrate; the pixel openings expose a portion of a surface of the first electrode of the corresponding light-emitting device, and at least a portion of the light-emitting layer of the corresponding light-emitting device is disposed within the pixel openings;

[0040] A touch film layer and a blackening layer are formed on a side of the pixel definition layer and the light emitting device layer away from the array substrate.

[0041] In a third aspect, the present application further provides a display device comprising the display panel described in the first aspect.

[0042] The display panel, method for manufacturing a display panel, and display device described above include: an array substrate; a pixel definition layer disposed on one side of the array substrate, the pixel definition layer defining a plurality of pixel openings; a light-emitting device layer disposed on one side of the array substrate, the light-emitting device layer including a plurality of light-emitting devices disposed corresponding to the plurality of pixel openings; the light-emitting devices including a first electrode, a light-emitting layer, and a second electrode stacked and arranged in a direction away from the array substrate; the pixel openings exposing a portion of the surface of the first electrode of the corresponding light-emitting device, and at least a portion of the light-emitting layer of the corresponding light-emitting device disposed within the pixel openings; a touch film layer disposed on a side of the pixel definition layer and the light-emitting device layer facing away from the array substrate, the surface of the touch film layer facing away from the pixel definition layer and the light-emitting device layer being covered with a blackening layer; the blackening layer being configured to be formed by processing a metal layer in the touch film layer. The blackening layer is formed on the surface of the metal layer in the touch film layer, thereby reducing the reflectivity of the metal layer in the touch film layer. The blackening layer is directly formed by processing the metal layer in the touch film layer, eliminating the need for additional deposition or other preparation processes and the introduction of other materials, thereby reducing the production cost of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] In order to more clearly illustrate the technical solutions in the embodiments of the present application or related technologies, the following briefly introduces the drawings required for use in the embodiments of the present application or related technical descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying any creative work.

[0044] Figure 1 A structural block diagram of a display panel in one embodiment;

[0045] Figure 2 It is a structural block diagram of a display panel in another embodiment;

[0046] Figure 3 It is a structural block diagram of a display panel in another embodiment;

[0047] Figure 4 It is a structural block diagram of a display panel in another embodiment;

[0048] Figure 5 is a top view of a display panel in one embodiment;

[0049] Figure 6 is a schematic flow chart of a method for preparing a display panel in one embodiment;

[0050] Figure 7 FIG. 4 is a flow chart of a method for preparing a display panel in another embodiment.

[0051] Description of reference numerals:

[0052] 10: array substrate; 20: pixel definition layer; 30: light-emitting device layer;

[0053] 40: touch film layer; 50: blackening layer; 60: color film layer;

[0054] 70: pixel opening; 401: bridging layer; 402: insulating layer;

[0055] 403: metal electrode layer; 201: first pixel definition layer; 202: second pixel definition layer;

[0056] 501: light-transmitting port; 301: light-emitting device; 601: filter. DETAILED DESCRIPTION

[0057] In order to make the purpose, technical solutions and advantages of this application more clear, the following further describes this application in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0058] It should be understood that although the terms "first", "second", etc. may be used herein to describe various elements, they do not indicate any order, quantity or importance, but are simply used to distinguish different components. These terms are only used to distinguish one element from another. For example, without departing from the scope of this application, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element. "Include" or "comprising" and similar words mean that the elements or objects that appear before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0059] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application. The term "and / or" as used herein includes any and all combinations of one or more of the relevant listed items.

[0060] With the advancement of active-matrix organic light-emitting diode (AMOLED) technology, the demand for display image quality, such as contrast and black-out effects, is becoming increasingly stringent. The basic structure of a display panel consists of light-emitting devices fabricated on an array substrate, which contains a large amount of highly reflective metal (including the anode). Furthermore, most screens incorporate a touchscreen, whose sensor layer has a high reflectivity. To improve contrast and reduce reflection of ambient light, AMOLED displays are typically attached with polarizers. However, in foldable displays, to reduce folding stress and improve light extraction efficiency, the polarizers may be removed, resulting in increased reflectivity.

[0061] After removing the polarizer, one solution to the reflectivity issue is to integrate a black matrix and color filter above the screen, a technique known as Color Filter on Encapsulation (COE). This technology utilizes the light-absorbing properties of the black matrix material to block the highly reflective metal layer beneath it. The color filter material's filtering properties are utilized: color filter R transmits red light, color filter G transmits green light, and color filter B transmits blue light, corresponding to the colors emitted by the underlying OLEDs. The anode metal's reflection of ambient light does not affect contrast. However, this approach suffers from long production cycles and high costs.

[0062] Based on this, the present application provides a display panel, a method for preparing a display panel, and a display device that improve light extraction efficiency and shorten production cycle.

[0063] In one embodiment, a display panel is provided. Figure 1 As shown, the display panel includes: an array substrate 10; a pixel definition layer 20, which is arranged on one side of the array substrate 10, and the pixel definition layer 20 defines a plurality of pixel openings 70; a light-emitting device layer 30, which is arranged on one side of the array substrate 10, and the light-emitting device layer 30 includes a plurality of light-emitting devices 301 arranged corresponding to the plurality of pixel openings 70; the light-emitting device 301 includes a first electrode, a light-emitting layer and a second electrode stacked in a direction away from the array substrate 10; the pixel opening 70 exposes a portion of the surface of the first electrode of the corresponding light-emitting device 301, and at least a portion of the light-emitting layer of the corresponding light-emitting device 301 is arranged in the pixel opening 70; a touch film layer 40, which is arranged on a side of the pixel definition layer 20 and the light-emitting device layer 30 away from the array substrate 10, and the surface of the touch film layer 40 away from the pixel definition layer 20 and the light-emitting device layer 30 is covered with a blackening layer 50.

[0064] The blackened layer 50 is formed by processing the metal electrode layer in the touch film layer 40 .

[0065] In the embodiment of the present application, the array substrate 10 provides physical support for the display panel. Specifically, the array substrate 10 provides physical support for the pixel definition layer 20 and the light-emitting device 301. The array substrate 10 can withstand the weight of the screen itself and external pressure, ensuring that the panel remains flat during production and use, maintaining the relative positions of various components, and preventing deformation of the screen that affects the display effect. The array substrate 10 may include various transistors, such as switching transistors and drive transistors.

[0066] In an embodiment of the present application, the pixel definition layer 20 is disposed on one side of the array substrate 10, and the light-emitting device 301 is disposed on the same side of the array substrate 10. The pixel definition layer 20 defines a plurality of pixel openings 70, and at least a portion of the light-emitting device 301 is disposed within the pixel opening 70. Specifically, the first electrode, the second electrode, the light-emitting layer and other structures of the light-emitting device 301 are at least partially disposed within the pixel opening 70, wherein the first electrode is an anode and the second electrode is a cathode.

[0067] In the embodiment of the present application, the light-emitting device 301 includes a first electrode, a light-emitting layer, and a second electrode. The light-emitting layer includes at least a light-emitting functional material. In addition, it may also include one or more of a hole injection layer (HIL), a hole transport layer (HTL), an electron injection layer (EIL), an electron transport layer (ETL), a hole block layer (HBL), and an electron block layer (EBL). Alternatively, the light-emitting layer may be a stacked light-emitting layer, that is, including at least two light-emitting layers and a charge generation layer (CGL) located between each adjacent light-emitting layer. In the embodiment of the present application, the first electrode may be the anode of the light-emitting device 301, which is provided between the array substrate 10 and the pixel definition layer 20 and partially exposed to the pixel opening 70.

[0068] Optionally, in an embodiment of the present application, an encapsulation film layer is included between the touch film layer 40 and the light-emitting device layer 30. The encapsulation film layer can be a stacked structure of an inorganic layer and an organic layer. For example, at least one first inorganic layer can be formed on the side of the light-emitting device layer 30 away from the array substrate, at least one organic layer can be formed on the side of the first inorganic layer away from the light-emitting device layer 30, and at least one second inorganic layer can be formed on the side of the organic layer away from the first inorganic layer, thereby forming an encapsulation film layer.

[0069] In the embodiment of the present application, the touch film layer 40 is one of the core functional layers of the touch display, responsible for converting a user's physical touch actions (such as finger presses and slides) into electrical signals, thereby enabling human-computer interaction. The touch film layer 40 may include at least one metal layer, and a blackening layer 50 is formed on the side of the touch film layer 40 facing away from the pixel definition layer 20 and the light-emitting device layer 30.

[0070] Optionally, the blackened layer 50 may be obtained by processing the metal layer in the touch film layer 40 .

[0071] Optionally, the blackened layer 50 may be in a color such as black or gray that has a light-shielding effect.

[0072] The display panel includes: an array substrate; a pixel definition layer disposed on one side of the array substrate, the pixel definition layer defining a plurality of pixel openings; a light-emitting device layer disposed on one side of the array substrate, the light-emitting device layer including a plurality of light-emitting devices disposed corresponding to the plurality of pixel openings; the light-emitting devices including a first electrode, a light-emitting layer, and a second electrode stacked and arranged in a direction away from the array substrate; the pixel openings exposing a portion of the surface of the first electrode of the corresponding light-emitting device, and at least a portion of the light-emitting layer of the corresponding light-emitting device disposed within the pixel openings; a touch film layer disposed on a side of the pixel definition layer and the light-emitting device layer facing away from the array substrate, the surface of the touch film layer facing away from the pixel definition layer and the light-emitting device layer being covered with a blackening layer; the blackening layer being configured to be formed by processing a metal layer in the touch film layer. The blackening layer is formed on the surface of the metal layer in the touch film layer, thereby reducing the reflectivity of the metal layer in the touch film layer. The blackening layer is directly formed by processing the metal layer in the touch film layer, eliminating the need for additional deposition or other preparation processes and the introduction of other materials, thereby reducing the production cost of the display panel.

[0073] In one embodiment, Figure 2 As shown, the touch film layer 40 includes: a bridging layer 401, which is arranged on the side of the pixel definition layer 20 and the light-emitting device layer 30 away from the array substrate 10; an insulating layer 402, which is arranged on the side of the bridging layer 401 away from the pixel definition layer 20 and the light-emitting device layer 30; a metal electrode layer 403, which is arranged on the side of the insulating layer 402 away from the bridging layer 401; and a blackening layer 50 formed by oxidizing the surface of the metal electrode layer 403 away from the bridging layer 401.

[0074] In this embodiment of the present application, a bridging layer 401, an insulating layer 402, and a metal electrode layer 403 are sequentially formed on the side of the pixel definition layer 20 and the light-emitting device layer 30 facing away from the array substrate 10. The metal electrode layer 403 can be referred to as a sensor layer. The surface of the metal electrode layer 403 facing away from the bridging layer 401 is oxidized to form a blackened layer 50.

[0075] In the embodiment of the present application, the metal electrode layer 403 is used to directly sense user touch actions, such as changes in pressure or electrostatic field, and convert the touch actions into raw electrical signals. The sensor layer can be capacitive touch or resistive touch. Capacitive touch uses a diamond-shaped grid formed by etching fine indium tin oxide (ITO), or low-resistance metals such as aluminum and its alloys, copper and its alloys, silver nanowires, or multi-layer metal stacks. It detects touch-induced capacitance changes through self-capacitive or mutual-capacitive modes. Resistive touch consists of two uniform conductive films, one above the other. When pressed, the two films come into contact, causing a sudden change in resistance, forming a voltage differential signal.

[0076] In this embodiment of the present application, insulating layer 402 is used to block leakage paths between the sensor layer and the external environment / other conductors, preventing ghost line effects. It also buffers external impacts, preventing failure of the sensor layer due to compression and deformation. Insulating layer 402 can be made of a highly transparent material to ensure that the display effect is not affected. Alternatively, insulating layer 402 can be made of insulating materials such as polyester (PET / PEN), polyacrylate, polyimide (PI), SiO2 coating, or composite laminates.

[0077] In an embodiment of the present application, the bridging layer 401 is used to transmit the weak analog signal generated by the sensor layer to the IC chip with low loss; and penetrate the insulating layer 402 and the air gap to connect the sensor layer with the external circuit; and optimize the signal transmission path to reduce noise interference.

[0078] Optionally, the bridging layer 401 may be a grid structure, and the metal electrode layer 403 may be a grid structure corresponding to the bridging layer 401 .

[0079] In the above-mentioned application embodiment, the touch film layer includes a bridging layer, an insulating layer and a metal electrode layer, so that the touch film layer can convert the user's physical contact action into an electrical signal, and the surface of the metal electrode layer facing away from the bridging layer is oxidized to form a blackening layer, which has a shading effect for the touch film layer, thereby reducing the reflectivity of the touch film layer, and no other materials need to be introduced.

[0080] In one embodiment, the metal electrode layer 403 includes: a first metal layer, which is arranged on the side of the insulating layer 402 away from the pixel definition layer 20 and the light-emitting device layer 30; a second metal layer, which is arranged on the side of the first metal layer away from the bridging layer 401; and a third metal layer, which is arranged on the side of the second metal layer away from the first metal layer.

[0081] In an embodiment of the present application, the metal electrode layer 403 may be a stacked structure. For example, in an embodiment of the present application, the metal electrode layer 403 may include three metal layers, and a first metal layer, a second metal layer and a third metal layer are formed in sequence on the side of the bridging layer 401 away from the pixel definition layer 20 and the light-emitting device layer 30.

[0082] Optionally, the blackened layer 50 is formed by oxidizing the surface of the third metal layer on a side facing away from the second metal layer.

[0083] Optionally, the blackened layer 50 and the third metal layer include the same element, that is, the blackened layer 50 includes an oxide of the metal element in the third metal layer.

[0084] Optionally, the first metal layer includes any one of titanium, molybdenum, and titanium-molybdenum alloy; and / or the second metal layer includes a low-resistance metal layer; and / or the third metal layer includes any one of titanium, molybdenum, and titanium-molybdenum alloy.

[0085] For example, the second metal layer may include aluminum, copper, silver, or alloys thereof.

[0086] Optionally, the thickness of the first metal layer is greater than 20 nm and less than 80 nm; the thickness of the second metal layer is greater than 100 nm and less than 800 nm; and the thickness of the third metal layer is greater than 20 nm and less than 80 nm.

[0087] Optionally, the material of the blackened layer 50 includes at least one of molybdenum oxide and titanium oxide. In the embodiment of the present application, if the third metal layer includes molybdenum, the material of the blackened layer 50 includes molybdenum oxide; if the third metal layer includes titanium, the material of the blackened layer 50 includes titanium oxide. Metal oxides generally have low reflectivity, especially molybdenum oxide, which has low reflectivity and can appear black in appearance. As the surface metal of the sensor, it is not easily visible when the screen is off.

[0088] In the above application embodiment, the surface of the third metal layer of the metal electrode layer of the stacked structure is oxidized to form a black layer, which has a light-shielding effect for the touch film layer, thereby reducing the reflectivity of the touch film layer without introducing other materials.

[0089] In one embodiment, Figure 3 As shown, the pixel definition layer 20 includes: a first pixel definition layer 201, which is arranged on one side of the array substrate 10, and the first pixel definition layer 201 is a black pixel definition layer; a second pixel definition layer 202, which is arranged on the side of the first pixel definition layer 201 away from the array substrate 10.

[0090] In the embodiment of the present application, a black first pixel definition layer 201 is formed on one side of the array substrate 10. The black material can cover the gaps between adjacent pixels and unrelated areas to prevent light leakage, shield the anode outside the light-emitting area and other film layers of the array backplane below, further reducing reflectivity. An opening area corresponding to the pixel unit is formed to limit the effective light-emitting or display range of a single pixel. Optionally, the first pixel definition layer 201 can be made of a material with high light-shielding properties to ensure effective absorption of visible light. For example, the high light-shielding material can include black resin or a metal composite.

[0091] In the embodiment of the present application, a second pixel definition layer 202 is formed on the side of the first pixel definition layer 201 facing away from the array substrate 10. This allows for fine-tuning of the pixel openings 70 defined in the first pixel definition layer 201, enhancing the sharpness of the opening edges. It also provides a flat surface, filling in minor surface undulations on the first pixel definition layer 201 and providing a smooth base for subsequent functional layers such as the light-emitting layer and encapsulation layer. Optionally, the second pixel definition layer 202 can be made of a transparent or translucent material (such as a photosensitive resin) to balance light transmittance and process compatibility.

[0092] Optionally, the material of the first pixel definition layer is a mixture of organic and inorganic materials, and its absorbance is generally greater than 1.0.

[0093] In the above-mentioned application embodiment, the first pixel definition layer can effectively suppress ambient light interference and improve display contrast, and the transparent characteristics of the second pixel definition layer ensure efficient transmission of light; and the double-layer structure can optimize material selection and process parameters respectively, optimize the display performance of the display panel, and gradually narrow the pixel opening error through two exposure processes, thereby improving the consistency of display resolution.

[0094] In one embodiment, Figure 4 As shown, the display panel further includes: a color filter layer 60, which is arranged on the side of the touch film layer 40 away from the light-emitting device layer 30; the color filter layer 60 includes a plurality of filters 601, and the filters 601 are arranged in a one-to-one correspondence with the light-emitting devices 301.

[0095] The multiple filters 601 are color filters, including a red filter, a blue filter, and a green filter. The position of each filter 601 corresponds to the position of the light-emitting device 301 .

[0096] In the embodiment of the present application, after the touch film layer 40 is completed, a normal photolithography process is performed to pattern the touch film layer 40 and complete the subsequent manufacturing processes of the integrated touch screen. Furthermore, the black matrix is ​​not formed in the COE process, and the color filters R, G, and B are formed using a yellow light process. That is, a color filter layer 60 is formed on the side of the touch film layer 40 facing away from the light-emitting device layer 30. The color filter layer includes multiple filters 601, that is, a filter 601 is disposed directly above each light-emitting device 301. The size of the filter 601 is slightly larger than the effective light-emitting area of ​​the light-emitting device 301. The orthographic projection of the filter 601 on the array substrate 10 can overlap with the orthographic projection of the corresponding light-emitting device 301 on the array substrate 10. The spacing between the filters 601 is consistent with the spacing between the light-emitting devices 301, forming a periodically arranged pixel unit.

[0097] It should be noted that in traditional COE technology, the previously independent color filter layer is integrated into the encapsulation layer, eliminating the polarizer in the traditional backplane. The birefringence of the encapsulation material is utilized to control the light path, simplifying the structure and reducing light loss. In traditional COE technology, a black matrix is ​​formed in the encapsulation layer. The light absorption properties of the black matrix material shield the highly reflective metal layer below it. The color filter material's filtering properties are utilized: color filter R transmits red light, color filter G transmits green light, and color filter B transmits blue light, corresponding to the color of the light emitted by the underlying OLED. For example, a standard RCA cleaning process can be used to remove particles and organic residue from the surface of the array substrate 10, followed by an oxygen plasma treatment to enhance subsequent film adhesion. RGB sub-pixels are formed through inkjet printing or photolithography. Furthermore, a high-purity organic dye (such as anthocyanin derivative) is mixed with a UV-curable resin and exposed using a mask to form the filter pattern. Chemical mechanical polishing is used to achieve a surface roughness that meets preset requirements, ensuring uniform coverage of the functional layer.

[0098] In the embodiment of the present application, the blackened layer 50 is optionally reused as the black matrix of the color filter layer 60. In conventional technology, the black matrix is ​​used to block the ambient light reflection in the non-display area to prevent crosstalk; form a precise boundary of the pixel opening 70 to control the light mixing range; and absorb stray light generated by the light-emitting device 301 to improve dark state performance. In the embodiment of the present application, the blackened layer 50 formed by covering the surface with the blackened layer 50 can achieve the above functions. The blackened layer 50 is reused as the black matrix of the color filter layer 60, and the black matrix is ​​no longer produced in the COE technology. This achieves the goal of reducing the production of the black matrix layer in the COE technology without affecting the reflectivity of the screen, thereby preventing the display contrast and the appearance of the screen being turned off from being affected.

[0099] Optionally, the black layer 50 has a plurality of light-transmitting openings 501, and the light-transmitting openings 501 are arranged in a one-to-one correspondence with the color filters 601; the orthographic projections of the light-transmitting openings 501 on the array substrate 10 overlap with at least a portion of the orthographic projections of the corresponding color filters 601 on the array substrate 10. For example, the top view of the display panel in the embodiment of the present application can be as follows: Figure 5 As shown, Figure 4 Can be along Figure 5 Cross-sectional view along the dashed line. Optionally, a light transmission port 501 is positioned directly below each filter 601, with the two filters facing each other horizontally. The light transmission port 501 is slightly larger than the effective light transmission area of ​​the filter 601 to ensure full collection of filtered light. The edges of the light transmission port 501 can adopt an inverted trapezoidal design (wide at the top and narrow at the bottom) to optimize the angle of incidence of light.

[0100] Optionally, in an embodiment of the present application, the display panel further includes a cover layer, which may be referred to as an OC layer. The cover layer is disposed on the side of the color filter layer facing away from the touch film layer 40. The OC layer may serve as the outermost protective layer of the display panel, providing both optical optimization and physical protection. For example, the OC layer may block water and oxygen penetration, extending device life; fill minor undulations in the underlying structure, providing a smooth substrate for subsequent processes (such as lamination of a cover plate); reduce interfacial reflections and improve light transmittance through refractive index matching; and employ a hardening material (such as SiO2 or a silicone coating) to enhance surface hardness. Optionally, the OC layer may be applied using a spin coating or slit coating process to ensure that the film thickness uniformity is less than a uniformity threshold; the curing process may be UV curing or thermal curing (120°C x 30 min); and adhesion control may include plasma pre-treating the underlying surface to ensure that the OC layer adhesion exceeds an adhesion threshold.

[0101] In the above-mentioned embodiment of the present application, a color filter layer is formed on the side of the touch film layer away from the light-emitting device layer, and the blackened layer is reused as a black matrix of the color filter layer. The black matrix is ​​not produced in the COE technology, which reduces the preparation steps in the preparation process and reduces the production cost of the display without affecting the display effect and appearance effect.

[0102] In one embodiment, a method for preparing a display panel is provided. Figure 6 As shown, the method includes:

[0103] S201, providing an array substrate.

[0104] In this embodiment, a substrate is provided, and an inorganic material is deposited on the substrate to form at least one buffer layer and / or an insulating layer to prevent metal ions in the substrate from diffusing into the channel and causing characteristic deviation. Furthermore, transistors can be formed on one side of the substrate, i.e., the side of the buffer layer and / or the insulating layer facing away from the substrate, to form an array substrate 10.

[0105] For example, amorphous silicon (a-Si) can be deposited on one side of the substrate, then converted to polycrystalline silicon (p-Si) using excimer laser annealing. Furthermore, photolithography, dry etching, and lift-off processes are used to shape the p-Si into an effective shape, forming the active layer. Subsequent processes such as deposition of different functional film layers, photolithography, dry or wet etching, photoresist stripping, and ion implantation complete the fabrication of an array substrate with integrated thin-film transistor driver circuits.

[0106] S202 , forming a pixel definition layer on one side of the array substrate, wherein the pixel definition layer defines a plurality of pixel openings.

[0107] In the embodiment of the present application, a pixel definition layer is formed on one side of the array substrate 10 . Optionally, the pixel definition layer may include a first pixel definition layer 201 and a second pixel definition layer 202 .

[0108] As an optional embodiment, a photoresist can be evenly coated on the surface of the array substrate 10 using a spin coating method, and the coated pixel definition layer 20 can be patterned using photolithography technology to define the position and shape of multiple pixel openings 70. The photolithography process includes steps such as coating, exposure, and development. First, a layer of photoresist is coated on the surface of the pixel definition layer 20; then, a photolithography machine is used to transfer the pixel opening 70 pattern on the mask to the photoresist, and exposure causes the photoresist to chemically react in the illuminated area; finally, a developer is used to dissolve the photoresist in the unexposed area, exposing the pixel definition layer 20 underneath, thereby forming the pattern of pixel openings 70. After the photolithography process is completed, an etching process is required to remove the portion of the pixel definition layer 20 not protected by the photoresist to further define the multiple pixel openings 70. Etching processes can be divided into wet etching and dry etching. Wet etching uses a chemical etching solution to corrode the pixel definition layer 20; dry etching uses plasma to etch the pixel definition layer 20. During the etching process, parameters such as etching time and etching rate need to be controlled to ensure that the size and shape accuracy of the pixel opening 70 meet the requirements.

[0109] As an optional implementation, the first pixel definition layer 201 and the second pixel definition layer 202 may be made of a black photosensitive material and a transparent / semi-transparent photosensitive material, respectively, patterned using photolithography technology, and cured by high-temperature baking.

[0110] S203, forming a light-emitting device layer on one side of the array substrate, the light-emitting device layer including a plurality of light-emitting devices arranged corresponding to the plurality of pixel openings; the light-emitting device including a first electrode, a light-emitting layer and a second electrode stacked in a direction away from the array substrate; the pixel opening exposes a portion of the surface of the first electrode of the corresponding light-emitting device, and at least a portion of the light-emitting layer of the corresponding light-emitting device is arranged in the pixel opening.

[0111] In an embodiment of the present application, the selected light-emitting material is deposited in the pixel opening 70 through a specific deposition process. Common deposition processes include vacuum evaporation, solution processing, and physical vapor deposition. In the vacuum evaporation method, the light-emitting material is heated and evaporated in a high vacuum environment, and then deposited on the surface of the array substrate 10 in the pixel opening 70; in the solution processing method, the light-emitting material is dissolved in a solvent, and then the solution is applied to the pixel opening 70 through processes such as spin coating and dip coating, and finally a light-emitting film is formed by evaporation of the solvent; in the physical vapor deposition method, the light-emitting material is deposited on the surface of the array substrate 10 in the pixel opening 70 using physical methods, such as magnetron sputtering and thermal evaporation. During the deposition process, parameters such as deposition rate, deposition thickness, and deposition conditions need to be controlled to ensure the uniformity and density of the light-emitting material.

[0112] S204 , forming a touch film layer and a blackening layer on a side of the pixel definition layer and the light emitting device layer facing away from the array substrate.

[0113] In the embodiment of the present application, a bridging layer 401, an insulating layer 402 and a metal electrode layer 403 are sequentially formed on the side of the pixel definition layer 20 and the light-emitting device layer 30 facing away from the array substrate 10, wherein the metal electrode layer 403 can be represented as a sensor layer.

[0114] In the embodiment of the present application, the surface of the metal electrode layer 403 facing away from the bridge layer 401 is oxidized to form a blackened layer 50 .

[0115] For example, in the embodiment of the present application, the metal electrode layer 403 may include three metal layers, with a first metal layer, a second metal layer, and a third metal layer sequentially formed on the side of the bridging layer 401 facing away from the pixel definition layer 20 and the light-emitting device layer 30. The blackened layer 50 may be formed by oxidizing the surface of the third metal layer facing away from the second metal layer.

[0116] In the above-mentioned method for preparing a display panel, an array substrate is provided; a pixel definition layer is formed on one side of the array substrate, the pixel definition layer defining a plurality of pixel openings; a light-emitting device layer is formed on one side of the array substrate, the light-emitting device layer including a plurality of light-emitting devices arranged corresponding to the plurality of pixel openings; the light-emitting devices include a first electrode, a light-emitting layer, and a second electrode stacked in a direction away from the array substrate; the pixel openings expose a portion of the surface of the first electrode of the corresponding light-emitting device, and at least a portion of the light-emitting layer of the corresponding light-emitting device is disposed within the pixel openings; a touch film layer is formed on a side of the pixel definition layer and the light-emitting device layer facing away from the array substrate; and a blackening layer is formed on a surface of the touch film layer facing away from the pixel definition layer and the light-emitting device layer. The blackening layer is formed on the surface of the metal layer in the touch film layer, thereby reducing the reflectivity of the metal layer in the touch film layer. The blackening layer is directly formed by processing the metal layer in the touch film layer, and does not require additional deposition or other preparation processes, nor does it require the introduction of other materials, thereby reducing the production cost of the display panel.

[0117] In one embodiment, an implementation of the above S204 is provided, wherein the touch film layer includes a bridge layer, an insulating layer and a metal electrode layer, such as Figure 7 As shown, the above-mentioned “forming a touch film layer and a blackening layer on the side of the pixel definition layer and the light-emitting device layer facing away from the array substrate” includes:

[0118] S301 , forming a bridge layer and an insulating layer on a side of the pixel definition layer and the light-emitting device layer facing away from the array substrate.

[0119] S302 , depositing a metal material layer on a side of the insulating layer away from the bridge layer and performing an oxidation treatment to form a black material layer on a surface of the metal material layer away from the insulating layer.

[0120] S303 , performing photolithography patterning processing on the metal material layer and the black material layer to form a metal electrode layer and a black layer.

[0121] In the embodiment of the present application, a bridging layer 401, an insulating layer 402, and a metal material layer are sequentially formed on the side of the pixel definition layer 20 and the light-emitting device layer 30 facing away from the array substrate 10. The surface of the metal electrode layer 403 facing away from the bridging layer 401 is oxidized to form a black material layer. Furthermore, electrodes are formed on the metal material layer using a specific photolithographic patterning method to form the metal electrode layer 403, and a blackening layer 50 is formed.

[0122] Alternatively, for metal electrodes, vacuum evaporation or sputtering is typically used to deposit metal materials onto the luminescent material to form an electrode pattern. During the electrode fabrication process, parameters such as electrode thickness, width, and spacing must be controlled to ensure that the electrode's conductivity and optical properties meet requirements.

[0123] In the above-mentioned application embodiment, a blackening layer is formed on the surface of the metal electrode layer, which has a shading effect on the metal electrode layer, thereby reducing the reflectivity of the metal electrode layer. No additional deposition or other preparation processes are required, and no other materials need to be introduced, thereby reducing the production cost of the display panel.

[0124] In one embodiment, the present application provides a display device, which includes the display panel in the above embodiment.

[0125] The display device can be a laptop computer, a mobile phone, a wireless device, a personal digital assistant (PDA), a handheld or portable computer, a GPS receiver / navigator, a camera, an MP4 video player, a camcorder, a game console, a watch, a clock, a calculator, a television monitor, a flat-panel display, a computer monitor, a car display (e.g., an odometer display, etc.), a navigator, a cockpit controller and / or display, a display of a camera view (e.g., a display of a rearview camera in a vehicle), an electronic photo, an electronic billboard or sign, a projector, etc.

[0126] The technical features of the above embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this application.

[0127] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present application shall be determined by the appended claims.

Claims

1. A display panel, characterized in that: The display panel includes: array substrate; A pixel definition layer is provided on one side of the array substrate, wherein the pixel definition layer defines a plurality of pixel openings; a light-emitting device layer disposed on one side of the array substrate, the light-emitting device layer comprising a plurality of light-emitting devices disposed corresponding to the plurality of pixel openings; the light-emitting devices comprising a first electrode, a light-emitting layer, and a second electrode stacked in a direction away from the array substrate; the pixel openings exposing a portion of a surface of the first electrode of the corresponding light-emitting device, and at least a portion of the light-emitting layer of the corresponding light-emitting device being disposed within the pixel openings; A touch film layer is provided on a side of the pixel definition layer and the light emitting device layer away from the array substrate, and a surface of the touch film layer away from the pixel definition layer and the light emitting device layer is covered with a blackened layer; The blackened layer is configured to be formed by processing the metal layer in the touch film layer.

2. The display panel according to claim 1, wherein: The touch film layer includes: a bridging layer, provided on a side of the pixel definition layer and the light-emitting device layer away from the array substrate; an insulating layer, provided on a side of the bridging layer away from the pixel definition layer and the light-emitting device layer; The metal electrode layer is provided on the side of the insulating layer away from the bridge layer; the blackened layer is formed by oxidizing the surface of the side of the metal electrode layer away from the bridge layer.

3. The display panel according to claim 2, wherein: The metal electrode layer comprises: a first metal layer, provided on a side of the insulating layer away from the pixel definition layer and the light-emitting device layer; a second metal layer, disposed on a side of the first metal layer facing away from the bridge layer; a third metal layer, disposed on a side of the second metal layer facing away from the first metal layer; Optionally, the blackened layer is formed by oxidizing the surface of the third metal layer on a side facing away from the second metal layer; Optionally, the blackened layer and the third metal layer include the same element.

4. The display panel according to claim 3, wherein: The first metal layer includes any one of titanium, molybdenum, and titanium-molybdenum alloy; And / or, the second metal layer includes a low-resistance metal layer; And / or, the third metal layer includes any one of titanium, molybdenum, and titanium-molybdenum alloy; Optionally, the thickness of the first metal layer is greater than 20 nm and less than 80 nm; Optionally, the thickness of the second metal layer is greater than 100 nm and less than 800 nm; Optionally, the thickness of the third metal layer is greater than 20 nm and less than 80 nm.

5. The display panel according to any one of claims 1 to 4, characterized in that: The material of the blackened layer includes at least one of molybdenum oxide and titanium oxide.

6. The display panel according to claim 1, wherein: The pixel definition layer includes: A first pixel definition layer is provided on one side of the array substrate, and the first pixel definition layer is a black pixel definition layer; The second pixel definition layer is arranged on a side of the first pixel definition layer away from the array substrate.

7. The display panel according to claim 1, wherein: The display panel further includes: A color filter layer is provided on a side of the touch film layer away from the light-emitting device layer; the color filter layer includes a plurality of filters, and the filters are provided in a one-to-one correspondence with the light-emitting devices; Optionally, the blackened layer has a plurality of light transmission openings, which are arranged in one-to-one correspondence with the color filters; the orthographic projections of the light transmission openings on the array substrate overlap with at least part of the orthographic projections of the corresponding color filters on the array substrate.

8. A method for preparing a display panel, characterized in that: The method comprises: providing an array substrate; forming a pixel definition layer on one side of the array substrate, wherein the pixel definition layer defines a plurality of pixel openings; A light-emitting device layer is formed on one side of the array substrate, the light-emitting device layer including a plurality of light-emitting devices arranged corresponding to the plurality of pixel openings; the light-emitting devices include a first electrode, a light-emitting layer, and a second electrode stacked in a direction away from the array substrate; the pixel openings expose a portion of a surface of the first electrode of the corresponding light-emitting device, and at least a portion of the light-emitting layer of the corresponding light-emitting device is disposed within the pixel openings; A touch film layer and a blackening layer are formed on a side of the pixel definition layer and the light emitting device layer away from the array substrate.

9. The method for manufacturing a display panel according to claim 8, wherein: The touch film layer includes a bridge layer, an insulating layer, and a metal electrode layer; the touch film layer and the blackening layer are formed on the side of the pixel definition layer and the light emitting device layer away from the array substrate, including: forming a bridging layer and an insulating layer on a side of the pixel definition layer and the light-emitting device layer facing away from the array substrate; Depositing a metal material layer on a side of the insulating layer away from the bridging layer and performing an oxidation treatment to form a black material layer on a surface of the metal material layer away from the insulating layer; The metal material layer and the black material layer are subjected to photolithography patterning processing to form the metal electrode layer and the black layer.

10. A display device, characterized in that: The display panel comprises any one of claims 1 to 8.

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