Display panel, preparation method of display panel and display device

Abstract

The embodiment of the invention provides a display panel, a preparation method of the display panel and a display device, the display panel comprises a substrate, a pixel definition layer, an isolation structure, a light-emitting function layer and a first electrode layer, the pixel definition layer comprises a pixel limiting part and a plurality of pixel openings, and the pixel limiting part comprises a first limiting layer and a second limiting layer; the isolation structure is arranged on the side, away from the substrate, of the second limiting layer, a plurality of isolation openings are defined by the isolation structure, and the isolation openings communicate with the pixel openings; the light-emitting functional layer comprises a plurality of light-emitting units; the first electrode layer comprises a plurality of first electrodes, each first electrode comprises a first conducting layer and a second conducting layer, each second conducting layer comprises a second connecting part and a second edge part which are connected, and the two opposite sides, perpendicular to the direction of the substrate, of each second connecting part make contact with the corresponding first conducting layer and the corresponding light-emitting unit correspondingly; the second edge portion and the first conductive layer are arranged at an interval and located between the first limiting layer and the second limiting layer. The display panel provided by the invention is high in reliability.

Description

Technical Field

[0001] The present application relates to the technical field of display devices, and in particular to a display panel, a method for manufacturing a display panel, and a display device. Background Art

[0002] Organic Light Emitting Diode (OLED) display technology is considered the most promising new display technology for the next generation. Compared with liquid crystal display technology, OLED display technology has advantages such as low energy consumption, low cost, self-luminescence, wide viewing angle, and fast response speed.

[0003] Traditionally, pixel patterning is achieved using a fine metal mask (FMM) during the production of OLED display panels. FMM technology is mature and boasts extensive mass production experience. However, it also suffers from limitations such as limited precision and high cost. FMM-free technology eliminates the limitations of traditional OLED processes on display size, resolution, and other performance characteristics, offering the advantages of high performance, full-scale scalability, and agile delivery. Patents CN118251982A, CN116648095A, CN117062489A, CN118742138A, CN118678783A, CN118660598A, CN118675450A, CN118824188A, and CN118781966A describe FMM-free technology for reference.

[0004] However, in the related art, the edges of the first electrode for driving the light-emitting unit are uneven, resulting in uneven distribution of the film layer on one side of the first electrode, causing low reliability of the display panel. Summary of the Invention

[0005] The embodiments of the present application provide a display panel, a method for manufacturing a display panel, and a display device, which are intended to improve the uniform distribution of a film layer located on one side of a first electrode and improve the reliability of the display panel.

[0006] An embodiment of a first aspect of the present application provides a display panel, including: substrate; a pixel definition layer disposed on one side of the substrate, the pixel definition layer comprising a pixel defining portion and a plurality of pixel openings enclosed by the pixel defining portion, the pixel defining portion comprising a first defining layer and a second defining layer, the second defining layer being located on a side of the first defining layer facing away from the substrate; An isolation structure is provided on a side of the second limiting layer facing away from the substrate, the isolation structure encloses and forms a plurality of isolation openings, and the isolation openings are connected to corresponding pixel openings; The light-emitting functional layer includes a plurality of light-emitting units, at least a portion of the light-emitting units is disposed within the pixel openings and extends along the second defining layer toward the sidewalls of the corresponding pixel openings; The first electrode layer includes multiple first electrodes, the first electrode includes a first conductive layer and a second conductive layer, the first conductive layer is located on the side of the first limiting layer close to the substrate, the second conductive layer includes a second connecting portion and a second edge portion connected to each other, the second connecting portion is in contact with the first conductive layer and the light-emitting unit on opposite sides perpendicular to the substrate, and the second edge portion is spaced apart from the first conductive layer and is located between the first limiting layer and the second limiting layer.

[0007] An embodiment of the second aspect of the present application further provides a display panel, including: substrate; A pixel definition layer is provided on one side of the substrate, the pixel definition layer includes a pixel defining portion and a pixel opening formed by the pixel defining portion, the pixel defining portion includes a first defining layer and a second defining layer, and the second defining layer is located on a side of the first defining layer away from the substrate; An isolation structure is provided on a side of the pixel defining portion facing away from the substrate, the isolation structure enclosing a plurality of isolation openings, the isolation openings being in communication with corresponding pixel openings; The light-emitting functional layer includes a plurality of light-emitting units, at least a portion of the light-emitting units is disposed within the pixel openings and extends along the second defining layer toward the sidewalls of the corresponding pixel openings; a protective layer having a first opening communicating with the pixel opening; The first electrode layer includes multiple first electrodes, the first electrode is arranged on the side of the light-emitting unit facing the substrate, the first electrode includes a first conductive layer and a second conductive layer, the first conductive layer, the protective layer and the first defining layer are stacked in sequence, the protective layer has a first opening connected to the pixel opening, a portion of the second conductive layer is located in the first opening and between the first conductive layer and the light-emitting unit, and a portion of the second conductive layer is located between the first defining layer and the second defining layer.

[0008] An embodiment of the third aspect of the present application further provides a method for manufacturing a display panel, comprising: At least one conductive material layer is provided on one side of the substrate, and the at least one conductive material layer is patterned, wherein the at least one conductive material layer includes a first conductive material layer, and the first conductive material layer forms a plurality of spaced first conductive layers; A first defining layer and an etching protection structure are provided on the substrate, wherein an orthographic projection of the first conductive layer on the substrate partially overlaps with an orthographic projection of the first defining layer on the substrate, the first defining layer has a second opening, and the second opening exposes a portion of the first conductive layer. The etching protection structure is located on a side of the first defining layer facing away from the substrate, and an orthographic projection of a surface of the etching protection structure close to the substrate on the substrate is located within an orthographic projection of a surface of the etching protection structure facing away from the substrate on the substrate. A second conductive material layer is provided on the substrate, the second conductive material layer is disconnected at the edge of the etching protection structure, the second conductive material layer located in the second opening and in contact with the first conductive layer forms a second connecting portion of the second conductive layer, and the second conductive material layer in contact with the first limiting layer forms a second edge portion of the second conductive layer, and the second edge portion is spaced apart from the first conductive layer; Removing the etching protection structure; A second defining material layer and an isolation material layer are sequentially provided on the substrate, and the isolation material layer and the second defining material layer are patterned, the second defining material layer forms a second defining layer, the second edge portion is located between the first defining layer and the second defining layer, the first defining layer and the second defining layer enclose a plurality of pixel openings, the isolation material layer forms an isolation structure, the isolation structure encloses a plurality of isolation openings, and the isolation openings are connected to the corresponding pixel openings; A plurality of light-emitting units and a plurality of second electrodes are prepared, wherein at least a portion of the light-emitting unit is arranged in the pixel opening and is located on the side of the second connection portion away from the first conductive layer, the light-emitting unit extends along the second defining layer toward the side wall of the corresponding pixel opening, and the second electrode is located on the side of the light-emitting unit away from the substrate.

[0009] An embodiment of the fourth aspect of the present application further provides a display device, comprising a display panel provided by any of the embodiments of the first and second aspects above, or a display panel prepared by any of the embodiments of the third aspect above.

[0010] In the display panel provided in the embodiments of the present application, by providing opposite sides of the second connection portion in contact with the first conductive layer and the light-emitting unit, respectively, the first conductive layer, the second connection portion, and the light-emitting unit can be electrically connected in sequence, enabling the first electrode to provide a voltage to the light-emitting unit. By providing the pixel defining portion with a first defining layer and a second defining layer, with the first conductive layer located on the side of the first defining layer closest to the substrate, if a crack forms in the first defining layer extending along the first conductive layer, the second defining layer located on the side of the first defining layer can cover the crack, thereby reducing or preventing the crack in the pixel definition layer from exposing undesirable film layers. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Other features, objects and advantages of the present application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings, in which the same or similar reference numerals represent the same or similar features.

[0012] Figure 1 is a schematic diagram of a planar structure of a display panel provided in an embodiment of the present application; Figure 2 is a schematic diagram of a partial cross-sectional structure of a display panel provided in an embodiment of the present application; Figure 3is a schematic diagram of a partial cross-sectional structure of a display panel provided in an embodiment of the present application; Figure 4 is a schematic diagram of a partial cross-sectional structure of a display panel provided in an embodiment of the present application; Figure 5 This is a schematic diagram of a pixel driving circuit of a display panel provided in an embodiment of the present application; Figure 6 is a schematic diagram of a partial cross-sectional structure of a display panel provided in an embodiment of the present application; Figure 7 is a schematic diagram of a partial cross-sectional structure of a display panel provided in an embodiment of the present application; Figure 8 is a schematic diagram of a partial cross-sectional structure of a display panel provided in an embodiment of the present application; Figure 9 is a schematic diagram of a partial cross-sectional structure of a display panel provided in an embodiment of the present application; Figure 10 is a schematic diagram of a partial cross-sectional structure of a display panel provided in an embodiment of the present application; Figure 11 This is a schematic flow chart of a method for manufacturing a display panel provided in an embodiment of the present application.

[0013] Description of reference numerals: 1. Substrate; 11. Underlay; 12. Transistor; T1. Driving transistor; T2. Switching transistor; 13. Driving circuit layer; 14. Planar layer; 2. Pixel definition layer; 21. First defining layer; 211. First defining portion; 212. Second defining portion; 22. Second defining layer; 221. Third defining portion; 222. Fourth defining portion; 23. Pixel opening; 30a, first light emitting device; 30b, second light emitting device; 30c, third light emitting device; 3, light emitting unit; 4. First electrode; 41. First conductive layer; 411. First connecting portion; 412. First edge portion; 42. Second conductive layer; 421. Second connecting portion; 422. Second edge portion; 43. Third conductive layer; 44. Protective layer; 441. First opening; 5. Second electrode; 511. Main body; 512. Contact portion; 6. Isolation structure; 61. First sublayer; 62. Second sublayer; 63. Third sublayer; 64. Isolation opening; 64a. First isolation opening; 64b. Second isolation opening; 64c. Third isolation opening; 71. Encapsulation unit; 72. Second encapsulation layer; 73. Third encapsulation layer; AA, display area; NA, non-display area; PX, sub-pixel; SPX1, first sub-pixel; SPX2, second sub-pixel; SPX3, third sub-pixel; 200, etching protection structure; 410, first conductive material layer; 430, third conductive material layer; 440, first etching protection layer; Z, first direction; X, second direction; Y, third direction. DETAILED DESCRIPTION

[0014] To make the objectives, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Generally, the components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0015] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for protection, but merely represents selected embodiments of the present application. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments in the present application without making any creative efforts shall fall within the scope of protection of the present application.

[0016] It should be noted that similar reference numerals and letters represent similar items in the following figures. Therefore, once an item is defined in one figure, it does not need to be further defined or explained in subsequent figures. It should be noted that different features in the embodiments of the present application can be combined with each other without conflict.

[0017] For ease of understanding, the drawings show mutually orthogonal X-axis, Y-axis, and Z-axis. The direction along the X-axis is referred to as the X-direction, the direction along the Y-axis is referred to as the Y-direction, and the direction along the Z-axis is referred to as the Z-direction. The Z-direction is the normal direction relative to the plane containing the X-direction and the Y-direction. In addition, the situation where various elements are viewed parallel to the plane containing the X-direction and the Y-direction is referred to as a top view. Alternatively, the planes in the X-direction and the Y-direction are parallel to the display surface of the display panel, and the Z-direction is parallel to the thickness direction of the display panel.

[0018] For some elements, the terms "upper" or "above" are sometimes used when describing the position of an element in the Z direction, and the terms "lower" or "below" are sometimes used when describing the position of an element in the opposite direction. In addition, when the terms "upper", "above", "lower", "below", "relative" and the like are used to define the positional relationship between two elements, they not only include the state in which the two elements are directly connected, but also include the state in which the two elements are separated by a gap or other elements. In addition, the terms "first", "second", "third" and the like are only used for differentiation and cannot be understood as indicating or implying relative importance.

[0019] In the related art, the edge of the first electrode for driving the light-emitting unit is not aligned, so that the film layer on the side of the first electrode is unevenly distributed, resulting in low reliability of the display panel.

[0020] For example, the undercut structure on the side of the first electrode close to the substrate causes the pixel definition layer, isolation structure and the like on the side of the first electrode to break, and the broken film layer exposes the film layer to be protected, resulting in corrosion of the film layer to be protected by the reagents used in the process of preparing the display panel, which not only affects the structure of the subsequently prepared film layer, but also may cause the encapsulation of the light-emitting structure by the encapsulation layer to fail, resulting in low reliability of the display panel.

[0021] Figure 1 is a structural schematic diagram of a display panel according to an embodiment of the present application. The display panel can be an organic light-emitting diode display panel (OLED) or a quantum dot light-emitting diode display panel (QLED). The display panel includes a display area AA having a display function and a non-display area NA.

[0022] The display area AA of the display panel can have a rectangular shape, or a square, circular or elliptical shape, or other shapes.

[0023] The display area AA includes a plurality of pixels PX arranged in the X direction and the Y direction. The pixel PX includes a plurality of sub-pixels SPX displaying different colors. In some embodiments, the pixel PX includes a first sub-pixel SPX1, a second sub-pixel SPX2 and a third sub-pixel SPX3, for example, the first sub-pixel SPX1 is a blue sub-pixel PX, the second sub-pixel SPX2 is a green sub-pixel PX, and the third sub-pixel SPX3 is a red sub-pixel PX. In some embodiments, the pixel PX includes sub-pixels SPX1, SPX2, SPX3 in addition to the sub-pixels SPX1, SPX2, SPX3, and sub-pixels SPX for emitting white or other color light.

[0024] Please refer to Figure 2The sub-pixel SPX includes a pixel driving circuit and a light-emitting device driven by the pixel driving circuit to emit light of a corresponding color. The first sub-pixel SPX1 includes a first light-emitting device 30a, the second sub-pixel SPX2 includes a second light-emitting device 30b, and the third sub-pixel SPX3 includes a third light-emitting device 30c. One pixel driving circuit drives at least one light-emitting device to emit light. For example, the display area AA includes a normal display area AA and a light-transmitting display area AA. The light-transmitting display area AA is a display area AA that is set corresponding to a sensor and has light-transmitting properties. The normal display area AA is a display area AA that is not set corresponding to a sensor. In the normal display area AA, one pixel driving circuit drives one light-emitting device to emit light. In the light-transmitting display area AA, one pixel driving circuit drives one or more light-emitting devices to emit light.

[0025] like Figures 2-3 As shown, the display panel provided by the embodiment of the first aspect of the present application includes a substrate 1, a pixel definition layer 2, an isolation structure 6, a light-emitting functional layer and a first electrode layer, the pixel definition layer 2 is arranged on one side of the substrate 1, the pixel definition layer 2 includes a pixel defining portion and a plurality of pixel openings 23 formed by the pixel defining portion, the pixel defining portion includes a first defining layer 21 and a second defining layer 22, the second defining layer 22 is located on the side of the first defining layer 21 away from the substrate 1; the isolation structure 6 is arranged on the side of the second defining layer 22 away from the substrate 1, the isolation structure 6 encloses a plurality of isolation openings 64, and the isolation openings 64 are connected to the corresponding pixel openings 23; the light-emitting functional layer includes a plurality of light-emitting units 3 At least part of the light-emitting unit 3 is arranged in the pixel opening 23 and extends along the second defining layer 22 toward the side wall of the corresponding pixel opening 23; the first electrode layer includes a plurality of first electrodes 4, the first electrode 4 includes a first conductive layer 41 and a second conductive layer 42, the first conductive layer 41 is located on the side of the first defining layer 21 close to the substrate 1, the second conductive layer 42 includes a second connecting portion 421 and a second edge portion 422 connected to each other, the second connecting portion 421 contacts the first conductive layer 41 and the light-emitting unit 3 on opposite sides in a direction perpendicular to the substrate 1, and the second edge portion 422 is spaced apart from the first conductive layer 41 and is located between the first defining layer 21 and the second defining layer 22.

[0026] See also Figure 4There are many ways to set up the substrate 1. Optionally, the substrate 1 also includes a substrate 11 and a pixel driving circuit. For example, the substrate 1 includes a substrate 11, a driving circuit layer 13 and a flat layer 14 arranged on the substrate 11. The pixel driving circuit includes a transistor 12 and a capacitor, the capacitor includes a first electrode and a second electrode, and the transistor 12 includes a source, a drain, a gate and a semiconductor layer. The driving circuit layer 13 also includes a plurality of signal lines, such as data signal lines, scanning signal lines, driving power supply voltage signal lines, etc. The driving circuit layer 13 includes a plurality of conductive layers, and the plurality of conductive layers include a first metal layer, a second metal layer and a third metal layer. The gate and the first electrode can be located in the first metal layer, the second electrode can be located in the second metal layer, and the source and drain can be located in the third metal layer.

[0027] Optional, reference Figure 5 The pixel driving circuit includes a driving transistor T1 and a switching transistor T2, the source of the switching transistor T2 is connected to the data line L1 providing the data signal Data, the gate of the switching transistor T2 is connected to the scan line L2 providing the scan signal Scan, the drain of the switching transistor T2 is connected to the gate of the driving transistor T1, the two ends of the storage capacitor C are respectively connected to the gate and source of the driving transistor T1, the source of the driving transistor T1 is connected to the first power signal line L3, the drain of the driving transistor T1 is connected to the light-emitting unit 3, and the light-emitting unit 3 is connected to the second power signal line L4. Figure 5 This is an embodiment of the pixel driving circuit. The pixel driving circuit of this application is not limited to Figure 5 The 2T1C pixel driving circuit shown may also be other pixel driving circuits, such as 7T1C, 8T1C pixel driving circuits, etc.

[0028] Please refer to Figure 2 and Figure 3 Optionally, a first electrode layer is provided on the substrate 1. The first electrode layer includes a plurality of first electrodes 4 distributed in an array. Each first electrode 4 is provided corresponding to each pixel opening 23. The first electrode 4 is used to drive the light-emitting unit 3 to emit light. A portion of the first electrode 4 is exposed by the pixel opening 23, and another portion of the first electrode 4 is located between the pixel defining portion and the substrate 1.

[0029] The first electrode 4 can include a multi-layer structure, for example, the first electrode 4 includes a plurality of conductive layers, the plurality of conductive layers can be 2 layers, 3 layers, 4 layers, or the like, and any two conductive layers can be made of the same material or different materials. When the first electrode 4 includes 2 conductive layers, the first electrode 4 includes a first conductive layer 41 and a second conductive layer 42 which are laminated and in contact. When the first electrode 4 includes 3 conductive layers, the first electrode 4 includes a first conductive layer 41 and a second conductive layer 42 which are laminated and in contact, and a conductive layer disposed on the side of the first conductive layer 41 close to the substrate 1. When the first electrode 4 includes 4 conductive layers, the first electrode 4 includes a first conductive layer 41 and a second conductive layer 42 which are laminated and in contact, and two conductive layers disposed on the side of the first conductive layer 41 close to the substrate 1, and so on.

[0030] The material of the pixel definition layer 2 can be set in various ways, for example, the material of the pixel definition layer 2 is an inorganic material, for example, the pixel definition layer 2 is formed by using at least one of silicon nitride (SiN x ), silicon oxide (SiO x ), and silicon oxynitride (SiON) inorganic insulating materials.

[0031] In an embodiment, the pixel definition layer 2 includes a plurality of sub-layers, and the pixel definition layer 2 includes a first limiting layer 21 and a second limiting layer 22 which are sequentially laminated and arranged away from the substrate 1, that is, the pixel definition layer 2 can be designed as a double-layer structure. The pixel opening 23 can penetrate the first limiting layer 21 and the second limiting layer 22, and at least part of the light emitting unit 3 is arranged in the pixel opening 23, and the light emitting unit 3 further extends along the second limiting layer 22 towards the sidewall of the corresponding pixel opening 23.

[0032] The second conductive layer 42 includes a second connecting portion 421 and a second edge portion 422 which are connected, and the second connecting portion 421 and the second edge portion 422 can be formed together, and the second edge portion 422 can be arranged around the second connecting portion 421. The second connecting portion 421 is in contact with the first conductive layer 41 and the light emitting unit 3 on opposite sides in the direction perpendicular to the substrate 1, so that the first conductive layer 41, the second connecting portion 421 and the light emitting unit 3 can be sequentially electrically connected, and the first electrode 4 provides voltage for the light emitting unit 3. The first conductive layer 41 is located on the side of the first limiting layer 21 close to the substrate 1, and part of the first limiting layer 21 extends along the first conductive layer 41. When a crack is generated in the first limiting layer 21 extending along the first conductive layer 41, the second limiting layer 22 on the side of the first limiting layer 21 can cover the crack, thereby reducing or avoiding the exposure of the crack in the pixel definition layer 2 to the film layer which is not required to be exposed.

[0033] In the embodiment provided herein, by providing opposite sides of the second connection portion 421 in contact with the first conductive layer 41 and the light-emitting unit 3, respectively, the first conductive layer 41, the second connection portion 421, and the light-emitting unit 3 can be electrically connected in sequence, thereby enabling the first electrode 4 to provide a voltage to the light-emitting unit 3. By providing the pixel defining portion to include the first defining layer 21 and the second defining layer 22, with the first conductive layer 41 located on the side of the first defining layer 21 close to the substrate 1, when a crack forms in the first defining layer 21 extending along the first conductive layer 41, the second defining layer 22 located on the side of the first defining layer 21 can cover the crack, thereby reducing or preventing the crack in the pixel definition layer 2 from exposing undesirable film layers.

[0034] In some embodiments, the first defining layer 21 and the second defining layer 22 can be made of different materials. The first defining layer 21 has better film-forming properties than the second defining layer 22. That is, under conditions of equal thickness, the first defining layer 21 can better cover the step structure formed by the first conductive portion than the second defining layer 22 without generating cracks. Conversely, to achieve the same step coverage effect, the thickness of the first defining layer 21 must be thinner than that of the second defining layer 22. In other words, the thickness requirement for the first defining layer 21 is relatively low, which facilitates thinning of the product. In addition, good film-forming properties are reflected in the good coverage of the formed film, which is more dense and more conducive to isolating water vapor. In other words, the material density of the first defining layer 21 is greater than that of the second defining layer 22.

[0035] For example, the second defining layer 22 has better etching resistance than the first defining layer 21. Since the side of the pixel definition layer 2 facing away from the substrate 1 is etched during the display panel manufacturing process, selecting a material with stronger etching resistance as the second defining layer 22 can improve the etching resistance of the pixel definition layer 2 and further enhance the reliability of the display panel.

[0036] Exemplarily, the first defining layer 21 and the second defining layer 22 are made of different materials. For example, the first defining layer 21 is made of silicon nitride, and the second defining layer 22 is made of silicon oxide.

[0037] Exemplarily, the thickness of the first defining layer 21 is greater than or equal to 1000 micrometers and less than or equal to 5000 micrometers. For example, the thickness of the first defining layer 21 is 1000 micrometers, 2000 micrometers, 3000 micrometers, 4000 micrometers, 5000 micrometers, etc.

[0038] Exemplarily, the thickness of the second defining layer 22 is greater than or equal to 500 micrometers and less than or equal to 3000 micrometers. For example, the thickness of the second defining layer 22 is 500 micrometers, 1000 micrometers, 2000 micrometers, 3000 micrometers, and so on.

[0039] In some embodiments, the first electrode 4 further includes a third conductive layer 43, which is located on a side of the first conductive layer 41 close to the substrate 1, and an orthographic projection of the third conductive layer 43 on the substrate 1 is located within an orthographic projection of the first conductive layer 41 on the substrate 1, wherein: The orthographic projection of the second edge portion 422 on the substrate 1 covers the edge of the orthographic projection of the first conductive layer 41 on the substrate 1 , and the orthographic projection of the second edge portion 422 on the substrate 1 covers the edge of the orthographic projection of the third conductive layer 43 on the substrate 1 .

[0040] The materials of the first conductive layer 41 and the third conductive layer 43 are different, thereby improving the conductivity and antioxidant capacity of the first electrode 4. The different materials can be different components of the materials used, or they can be the same components with different proportions of the components. When the materials used to prepare the first conductive layer 41 and the third conductive layer 43 come into contact with the same etching solution, the two have different etching rates, thereby forming an undercut structure at the edge of the first conductive layer 41 and the side wall of the third conductive layer 43 close to the substrate 1, that is, the edge of the third conductive layer 43 is recessed compared to the edge of the first conductive layer 41, and the orthographic projection of the third conductive layer 43 on the substrate 1 is located within the orthographic projection of the first conductive layer 41 on the substrate 1.

[0041] The surface of the first conductive layer 41 near the substrate 1 and the edge of the third conductive layer 43 enclose a cavity. The first defining layer 21 can extend along the substrate 1 to the surface of the first conductive layer 41. The first defining layer 21 can block the cavity, allowing the first defining layer 21 to continue extending. When a crack forms in the portion of the first defining layer 21 extending along the first conductive layer 41, the orthographic projection of the second edge portion 422 on the substrate 1 covers the edge of the orthographic projection of the first conductive layer 41 on the substrate 1, and the orthographic projection of the second edge portion 422 on the substrate 1 covers the edge of the orthographic projection of the third conductive layer 43 on the substrate 1. Therefore, the second edge portion 422 has the ability to prevent water vapor from passing through the crack of the first defining layer 21 and contacting the light-emitting unit 3.

[0042] Please refer to Figure 5 In some embodiments, the display panel further includes an organic insulating layer, a portion of the organic insulating layer is located between the third conductive layer 43 and the substrate 1 , and another portion of the driving circuit layer 13 is located between the first defining layer 21 and the substrate 1 .

[0043] An organic insulating material can be provided on substrate 1 to form an organic insulating layer, and the flattening layer 14 in substrate 1 can also be used as an organic insulating layer. Flattening layer 14 is provided on the side of drive circuit layer 13 near the light-emitting functional layer. First electrode 4 can be connected to the circuit in drive circuit layer 13. Flattening layer 14 can electrically isolate first electrode 4 from some conductive structures in drive circuit layer 13. Flattening layer 14 can also flatten drive circuit layer 13. Third conductive layer 43 and first conductive layer 41 can be formed on flattening layer 14, with portions of flattening layer 14 exposed between third conductive layers 43 of adjacent first electrodes 4. The prepared first defining layer 21 is partially located on flattening layer 14 and partially located on first conductive layer 41.

[0044] In some embodiments, the isolation structure 6 includes a first sublayer 61 and a second sublayer 62, and the first sublayer 61 and the second sublayer 62 are stacked in a direction away from the substrate 1. The second sublayer 62 protrudes toward the isolation opening 64 relative to the first sublayer 61. The edge of the orthographic projection of the second edge portion 422 on the substrate 1 is located within the orthographic projection of the first sublayer 61 on the substrate 1. The edge of the orthographic projection of the first conductive layer 41 on the substrate 1 is located within the orthographic projection of the first sublayer 61 on the substrate 1. The edge of the orthographic projection of the third conductive layer 43 on the substrate 1 is located within the orthographic projection of the first sublayer 61 on the substrate 1.

[0045] In these optional embodiments, the isolation structure 6 includes a first sublayer 61 and a second sublayer 62. The second sublayer 62 is arranged to protrude relative to the first sublayer 61 toward the isolation opening 64, so that a recess can be formed under the second sublayer 62. During the preparation of the light-emitting unit 3, the light-emitting material can be broken at the edge of the second sublayer 62 to form independent light-emitting units 3.

[0046] When preparing the isolation structure 6, a first isolation material and a second isolation material are provided for forming the isolation structure 6, and the first isolation material and the second isolation material are uniformly distributed on one side of the second limiting material in sequence. The stacked first isolation material and the second isolation material are patterned so that the first isolation material forms the first sublayer 61 and the second isolation material forms the second sublayer 62. The edge of the orthographic projection of the second edge portion 422 on the substrate 1 is set to be located within the orthographic projection of the first sublayer 61 on the substrate 1, the edge of the orthographic projection of the first conductive layer 41 on the substrate 1 is set to be located within the orthographic projection of the first sublayer 61 on the substrate 1, and the edge of the orthographic projection of the third conductive layer 43 on the substrate 1 is set to be located within the orthographic projection of the first sublayer 61 on the substrate 1, so that the prepared first sublayer 61 can be raised by the second edge portion 422, the first conductive layer 41 and the third conductive layer 43, and the edge of the prepared second sublayer 62 facing away from the surface of the substrate 1 is flat, thereby avoiding warping of the edge of the second sublayer 62.

[0047] In some embodiments, the material of the first conductive layer 41 includes at least one of silver and a silver alloy.

[0048] In some embodiments, the material of the first conductive layer 41 includes at least one metal material with excellent light reflectivity, such as silver or a silver alloy. The first conductive layer 41 not only has good electrical conductivity but also excellent light reflection capabilities. Light emitted by the light-emitting unit 3 can pass through the second conductive layer 42 and enter the first conductive layer 41, where it is reflected, thereby improving the luminous efficiency of the display panel. The third conductive layer 43 and the second conductive layer 42 located on either side of the first conductive layer 41 also protect the first conductive layer 41 during subsequent manufacturing processes, minimizing damage to the first conductive layer 41.

[0049] In some embodiments, the material of the third conductive layer 43 is a transparent conductive oxide, including but not limited to at least one of indium tin oxide (ITO), indium zinc oxide (IZO), or indium gallium zinc oxide (IGZO).

[0050] In other embodiments, the material of the second conductive layer 42 is a transparent conductive oxide, and the conductive oxide includes but is not limited to at least one of indium tin oxide, indium zinc oxide, or indium gallium zinc oxide.

[0051] In other embodiments, the second conductive layer 42 and the third conductive layer 43 are made of the same material. The same material means that the components of the materials used in both layers are the same, and the proportions of the components are the same, which simplifies the storage of materials in the preparation process.

[0052] In some embodiments, the orthographic projection of the first conductive layer 41 on the substrate 1 is located within the orthographic projection of the second conductive layer 42 on the substrate 1, that is, the first conductive layer 41 has a larger projected area than the second conductive layer 42. When cracks are generated in the first defining layer 21 along the portion extending from the first conductive layer 41, the first conductive layer 41 can prevent water vapor from passing through the cracks in the first defining layer 21 and contacting the light-emitting unit 3.

[0053] In some embodiments, the display panel further includes a second electrode layer, the second electrode layer including a second electrode 5 located on a side of the corresponding light-emitting unit 3 facing away from the substrate 1. Optionally, the light-emitting device comprises the aforementioned first electrode 4, light-emitting unit 3, and second electrode 5. Optionally, the second electrode 5 is located in each isolation opening 64. Optionally, the second electrode 5 is electrically connected to the isolation structure 6.

[0054] Optionally, at least one light-emitting unit 3 includes a hole injection layer HIL, a hole transport layer HTL, an electron blocking layer EBL, a light-emitting material layer EML, a hole blocking layer HBL, an electron transport layer ETL, and an electron injection layer EIL, which are stacked in a direction away from the substrate 1 (thickness direction Z). The light-emitting unit 3 may include a single light-emitting material layer EML, or a stacked light-emitting unit 3 including multiple light-emitting material layers EML.

[0055] During the light-emitting process of the light-emitting unit 3, the first electrode 4 is used to generate holes, and the second electrode 5 is used to generate electrons. The holes and electrons combine within the light-emitting unit 3 to cause the light-emitting unit 3 to emit light. The first electrode 4 is in contact with the light-emitting unit 3, and part of the light-emitting unit 3 may overlap with the isolation structure 6. This may cause holes to crosstalk between adjacent light-emitting units 3 through the light-emitting unit 3 and the isolation structure 6.

[0056] In order for the light-emitting unit 3 to emit light, a pixel voltage is supplied to the first electrode 4 and a common voltage is supplied to the second electrode 5, respectively. This creates a potential difference between the first electrode 4 and the second electrode 5, causing the light-emitting unit 3 disposed between the first electrode 4 and the second electrode 5 to emit light. In one embodiment, when a potential difference is formed between the first electrode 4 and the second electrode 5 of the light-emitting unit 3, the light-emitting material layer EML of the light-emitting unit 3 emits light.

[0057] The pixel voltage of the first electrode 4 is provided by the pixel driving circuit, and the common voltage of the second electrode 5 is provided by the isolation structure 6. Specifically, the second electrode 5 is electrically connected to the isolation structure 6. By providing the common voltage to the isolation structure 6, the common voltage is supplied to the second electrode 5. In other words, the isolation structure 6 has the function of supplying the common voltage to the second electrode 5.

[0058] In some embodiments, the second electrode 5 is electrically connected to the isolation structure 6 , and a portion of the second defining layer 22 is located between the second edge portion 422 and the second electrode 5 .

[0059] The second connection portion 421, the light emitting unit 3 and the second electrode 5 can be stacked in sequence. Part of the second defining layer 22 is located between the second edge portion 422 and the second electrode 5, thereby reducing or avoiding short circuit between the second edge portion 422 and the second electrode 5.

[0060] In some embodiments, a portion of the second defining layer 22 is located between the second edge portion 422 and the light emitting unit 3 .

[0061] The second conductive layer 42, the second definition layer, the light-emitting unit 3, and the second electrode 5 can be fabricated sequentially. The second definition layer 22 can not only separate the second edge portion 422 from the second electrode 5, but also separate the second edge portion 422 from the light-emitting unit 3, thereby reducing or avoiding electrical connection between the second electrode 5 fabricated later and the second conductive layer 42.

[0062] In some embodiments, the second edge portion 422 extends along the surface of the first defining layer 21 facing the pixel opening 23 to a side of the first defining layer 21 facing away from the substrate 1 .

[0063] When preparing a display panel, the first conductive layer 41 and the first defining layer 21 can be prepared first, and then the second conductive layer 42 and the second defining layer 22 can be prepared. The shape and area of ​​the second conductive layer 42 prepared later can be controlled so that the second conductive layer 42 not only covers the first conductive layer 41 exposed from the first defining layer 21, but also covers the surface of the first defining layer 21 facing the pixel opening 23 and the side of the first defining layer 21 facing away from the substrate 1, thereby ensuring effective electrical connection between the first conductive layer 41 and the second conductive layer 42.

[0064] In some embodiments, the light emitting unit 3 extends along the surface of the second defining layer 22 facing the pixel opening 23 to the side of the second defining layer 22 facing away from the substrate 1 , and the light emitting unit 3 is spaced apart from the isolation structure 6 .

[0065] The shape and area of ​​the prepared light-emitting unit 3 can be controlled so that the light-emitting unit 3 can not only cover the second conductive layer 42 exposed from the second defining layer 22, but also cover the surface of the second defining layer 22 facing the pixel opening 23, and the side of the second defining layer 22 facing away from the substrate 1, ensuring that the second conductive layer 42 and the light-emitting unit 3 are effectively electrically connected.

[0066] See also Figure 6 In other embodiments, the second edge portion 422 extends along the surface of the first defining layer 21 toward the pixel opening 23 , and the end of the second edge portion 422 away from the second connection portion 421 is located on the surface of the first defining layer 21 toward the pixel opening 23 .

[0067] When preparing a display panel, the first conductive layer 41 and the first defining layer 21 can be prepared first, and then the second conductive layer 42 and the second defining layer 22 can be prepared. The shape and area of ​​the second conductive layer 42 prepared later can be controlled so that the second conductive layer 42 not only covers the first conductive layer 41 exposed from the first defining layer 21, but also covers the surface of the first defining layer 21 facing the pixel opening 23, thereby ensuring effective electrical connection between the first conductive layer 41 and the second conductive layer 42.

[0068] In some embodiments, the light emitting unit 3 extends along the surface of the second defining layer 22 facing the pixel opening 23 , and an edge of the light emitting unit 3 is located on the surface of the second defining layer 22 facing the pixel opening 23 .

[0069] The shape and area of the prepared light emitting unit 3 can be controlled so that the light emitting unit 3 can not only cover the second conductive layer 42 exposed from the second defining layer 22, but also cover the surface of the second defining layer 22 facing the pixel opening 23, ensuring that the second conductive layer 42 and the light emitting unit 3 are effectively electrically connected.

[0070] Referring to Figure 7 The second defining layer 22 can be obtained by patterning the second defining material layer. In some embodiments, the edge of the second defining layer 22 is in contact with the surface of the second edge portion 422 away from the substrate 1, the edge of the second defining layer 22 is all or part of the surface of the second defining layer 22 facing the pixel opening 23, and the orthographic projection of the second defining layer 22 on the substrate 1 partially overlaps the orthographic projection of the second edge portion 422 on the substrate 1.

[0071] Referring to Figure 6 In other embodiments, the second defining layer 22 extends along the second edge portion 422 to the surface of the second edge portion 422 facing the pixel opening 23 away from the substrate 1, and the edge of the second defining layer 22 is in contact with the surface of the second edge portion 422 facing the pixel opening 23.

[0072] The second defining layer 22 is not only in contact with the surface of the second edge portion 422 away from the substrate 1, but also in contact with the surface of the second edge portion 422 facing the pixel opening 23.

[0073] In other embodiments, the second defining layer 22 extends along the second edge portion 422 to the surface of the second connecting portion 421 away from the substrate 1.

[0074] The second defining layer 22 is not only in contact with the surface of the second edge portion 422 away from the substrate 1, but also in contact with the surface of the second edge portion 422 facing the pixel opening 23 and the surface of the second connecting portion 421 away from the substrate 1. At least part of the surface of the second connecting portion 421 away from the substrate 1 is in contact with the light emitting unit 3.

[0075] In some embodiments, the display panel further comprises a protective layer 44, the first conductive layer 41 comprises a first connecting portion 411 and a first edge portion 412 connected to each other, the protective layer 44 is located between the first edge portion 412 and the first defining layer 21, the protective layer 44 has a first opening 441 communicating with the pixel opening 23, and at least part of the second connecting portion 421 is arranged in the first opening 441 and in contact with the first connecting portion 411.

[0076] When preparing the display panel, a third conductive material layer, a first conductive material layer, and a first etching protection layer are prepared in sequence. The first etching protection layer has a third opening that exposes the first conductive material layer. The first conductive material layer and the third conductive material layer exposed to the third opening are wet-etched to form a plurality of spaced first conductive layers 41 on the first conductive material layer, and a plurality of spaced third conductive layers 43 on the third conductive material layer. Then, a first limiting layer 21 and other film layers are prepared. Before preparing the second conductive layer 42, the first etching protection layer is etched to form a protection layer 44 having a first opening 441 on the first etching protection layer. At least a portion of the second conductive layer 42 prepared later is disposed in the first opening 441 and in contact with the first connecting portion 411. The first etching protection layer without the first opening 441 can protect the second conductive layer 42 during the preparation of the first limiting layer 21 and other film layers.

[0077] See also Figure 8 In some embodiments, the first defining layer 21 includes a first defining portion 211 and a second defining portion 212. The first defining portion 211 is located between adjacent first conductive layers 41. The second defining portion 212 extends from the first defining portion 211 along the second conductive layer 42 to the side of the protective layer 44 facing away from the substrate 1. The surface of the first defining portion 211 facing away from the substrate 1 is recessed toward the direction closer to the substrate 1 relative to the surface of the second defining portion 212 facing away from the substrate 1.

[0078] The first defining portion 211 and the second defining portion 212 can be prepared together. The first plurality of third conductive layers 43, first conductive layers 41, and first etching protection layers 440 are spaced apart and prepared first. At least a portion of the first defining portion 211, which is prepared later, is located between the spaced third conductive layers 43, the spaced first conductive layers 41, and the spaced first etching protection layers 440. The second defining portion 212, which is prepared later, extends along the side surfaces of the first conductive layer 41 and the side surfaces of the first etching protection layer 440 to the side of the first etching protection layer 440 facing away from the substrate 1. The first defining layer 21 can protect the side surfaces of the first conductive layer 41 and block the aforementioned cavity.

[0079] The second defining portion 212 is raised by the stacked third conductive layer 43, the first conductive layer 41 and the protective layer 44, so that the surface of the first defining portion 211 facing away from the substrate 1 is recessed toward the substrate 1 relative to the surface of the second defining portion 212 facing away from the substrate 1, and the distance from the surface of the first defining portion 211 facing away from the substrate 1 to the substrate 1 is smaller than the distance from the surface of the second defining portion 212 facing away from the substrate 1 to the substrate 1.

[0080] In some embodiments, the second defining layer 22 includes a third defining portion 221 and a fourth defining portion 222 connected to each other, the third defining portion 221 is located on the side of the first defining portion 211 facing away from the substrate 1, the fourth defining portion 222 is located on the side of the second defining portion 212 facing away from the substrate 1, the second edge portion 422 is located between the second defining portion 212 and the fourth defining portion 222, the surface of the third defining portion 221 facing away from the substrate 1 is recessed toward the direction closer to the substrate 1 relative to the surface of the fourth defining portion 222 facing away from the substrate 1, and the isolation structure 6 is arranged on the side of the second defining layer 22 facing away from the substrate 1.

[0081] In the second defining layer 22 prepared later, the third defining portion 221 is located on the side of the first defining portion 211 facing away from the substrate 1, and the fourth defining portion 222 is located on the side of the second defining portion 212 facing away from the substrate 1, so that the fourth defining portion 222 is raised by the stacked third conductive layer 43, the first conductive layer 41 and the protective layer 44, so that the surface of the fourth defining portion 222 facing away from the substrate 1 is recessed toward the direction closer to the substrate 1 relative to the surface of the third defining portion 221 facing away from the substrate 1, and the distance from the surface of the fourth defining portion 222 facing away from the substrate 1 to the substrate 1 is smaller than the distance from the surface of the third defining portion 221 facing away from the substrate 1 to the substrate 1.

[0082] In some embodiments, the second edge portion 422 extends from the surface of the first defining portion 211 toward the pixel opening 23 to the surface of the first defining portion 211 away from the substrate 1, and the fourth defining portion 222 is not only elevated by the stacked third conductive layer 43, the first conductive layer 41 and the protective layer 44, but also by the second edge portion 422.

[0083] In some embodiments, part of the isolation structure 6 is supported on a side of the third defining portion 221 facing away from the substrate 1 , and part of the isolation structure 6 is supported on a side of the fourth defining portion 222 facing away from the substrate 1 .

[0084] The isolation structure 6 prepared later can be partially located on the third limiting portion 221 and partially located on the fourth limiting portion 222. Since there is a step difference between the surface of the third limiting portion 221 facing away from the substrate 1 and the surface of the fourth limiting portion 222 facing away from the substrate 1, part of the isolation structure 6 is raised by the fourth limiting portion 222, and the surface of the isolation structure 6 facing away from the substrate 1 is non-planar, and the orthographic projection of the second limiting portion 212 on the substrate 1 overlaps with the edge of the orthographic projection of the isolation structure 6 on the substrate 1.

[0085] See also Figure 9 In some embodiments, the isolation structure 6 further includes a third sublayer 63, which is located on the side of the first sublayer 61 facing the substrate 1, and the third sublayer 63 is protruded relative to the first sublayer 61 toward the isolation opening 64, and the orthographic projection of the third sublayer 63 on the substrate 1 is interlaced with the orthographic projection of the first electrode 4 on the substrate 1.

[0086] During the preparation of the isolation structure 6 , when the first sub-layer 61 is side-etched, the third sub-layer 63 can provide protection to the film layer on the substrate 1 side.

[0087] Optionally, the materials of the first sublayer 61 and the second sublayer 62 are different, and the etching rate of the first sublayer 61 is lower than the etching rate of the second sublayer 62. The material of the first sublayer 61 includes a conductive material, specifically at least one of copper (Cu), copper alloy, aluminum (Al), and aluminum alloy. The aluminum alloy may include at least one of aluminum neodymium alloy (AlNd), aluminum yttrium alloy (AlY), or aluminum silicon alloy (AlSi). The second sublayer 62 may be a single-layer structure or a multi-layer structure. When the second sublayer 62 is a single-layer structure, the material of the second sublayer 62 may include at least one of titanium, titanium nitride, molybdenum, tungsten, molybdenum-tungsten alloy, or molybdenum-niobium alloy. Figure 7 As shown, when the second sub-layer 62 has a multi-layer structure, one layer of the second sub-layer 302 may be made of at least one of titanium, titanium nitride, molybdenum, tungsten, a molybdenum-tungsten alloy, or a molybdenum-niobium alloy, and another layer of the second sub-layer 62 may be made of a conductive oxide or an inorganic insulating material, such as indium tin oxide (ITO) or indium zinc oxide (IZO).

[0088] Optionally, the material of the third sublayer 63 includes a conductive material. For example, the material of the third sublayer 63 may include at least one of molybdenum (Mo), titanium (Ti), titanium nitride (TiN), molybdenum-tungsten alloy (MoW), or molybdenum-niobium alloy (MoNb).

[0089] In some embodiments, the second electrode 5 overlaps the third sublayer 63 .

[0090] The second electrode 5 is formed of a metal material such as an alloy of magnesium and silver (MgAg), etc. The second electrode 5 also extends to the surface of the third sub-layer 63 facing away from the substrate 1 and overlaps with the third sub-layer 63 .

[0091] Optionally, the second electrode 5 includes a main portion 511 and a contact portion 512 surrounding the main portion 511 in a closed ring shape, and the contact portion 512 contacts the third sub-layer 63. Specifically, the contact portion 512 may contact the sidewall of the third sub-layer 63; the contact portion 512 may also extend to the surface of the third sub-layer 63 facing away from the substrate 11, and the contact portion 512 contacts the surface of the third sub-layer 63 facing away from the substrate 11.

[0092] For example, the material of the first sub-layer 61 includes a conductive material, and the second electrode 5 is electrically connected to the first sub-layer 61. Figure 9 As shown, the materials of the first sublayer 61 and the third sublayer 63 both include conductive materials, and the second electrode 5 is electrically connected to the third sublayer 63 and the first sublayer 61 .

[0093] See also Figure 10 In some embodiments, the plurality of first electrodes 4 include a first sub-electrode and a second sub-electrode, and the plurality of light-emitting units 3 include a first light-emitting unit 3a for emitting a first color light and a second light-emitting unit 3b for emitting a first color light; along the direction from the substrate 1 to the first conductive layer 41, the thickness of the second conductive layer 42 in the first sub-electrode is H1, and the thickness of the second conductive layer 42 in the second sub-electrode is H2, and H1 and H2 are different.

[0094] The second conductive layer 42 in different first electrodes 4 for contacting different light-emitting units 3 has different thicknesses, so that the distance from the second electrode 5 corresponding to different light-emitting units 3 to the first conductive layer 41 is different, thereby adjusting the distance from the light emitted by the light-emitting unit 3 to the first conductive layer 41. Therefore, by adjusting the values ​​of H1 and H2, a microcavity effect can be achieved for the light-emitting units 3 for emitting light of different wavelengths, thereby improving the luminous efficiency of different light-emitting units 3.

[0095] In other embodiments, the plurality of first electrodes 4 include a third sub-electrode, and the plurality of light-emitting units 3 include a third light-emitting unit 3c for emitting a third color light; along the direction from the substrate 1 to the first conductive layer 41, the thickness of the second conductive layer 42 in the third sub-electrode is H3, and H1, H2, and H3 are different.

[0096] The first color light, the second color light and the third color light have different wavelengths. Optionally, the first color light, the second color light and the third color light are red light, blue light and green light.

[0097] See also Figure 2 In some embodiments, the display panel further includes a first encapsulation layer, the first encapsulation layer includes a plurality of encapsulation portions 71, the encapsulation portions 71 are located on the side of the light-emitting unit 3 facing away from the substrate 1, the encapsulation portions 71 also cover the isolation structure 6, the side wall facing the isolation opening 64, and extend to the side of the isolation structure 6 facing away from the substrate 1.

[0098] The encapsulation portion 71 is located on a side of the second electrode 5 facing away from the substrate 1 , passes through a sidewall of the isolation structure 6 , and extends to a side of the isolation structure 6 facing away from the substrate 1 .

[0099] For example, Figure 8 As shown, the packaging portion 71 includes a first segment 711 and a second segment 712 that are interconnected. The first segment 711 is located in the isolation opening 64 and is arranged on the side of the light-emitting unit 3 facing away from the substrate 1. The second segment 712 is located on the side of the isolation structure 6 facing the isolation opening 64. The side surface of the first segment 711 facing away from the substrate 1 and the side surface of the second segment 712 facing away from the isolation structure 6 are at least partially interconnected to enclose a gap space.

[0100] For example, the side surface of the first segment 711 facing away from the substrate 1 and the side surface of the second segment 712 facing away from the isolation structure 6 may not be connected.

[0101] In some embodiments, the display panel further includes a second encapsulation layer 72 and a third encapsulation layer 73. The second encapsulation layer 72 covers the isolation structure 6 and the encapsulation portion 71, and the third encapsulation layer 73 covers the second encapsulation layer 72. Both the first encapsulation layer 73 and the third encapsulation layer 73 are made of inorganic materials, including at least one of silicon nitride (SiN), silicon oxide (SiO), and silicon oxynitride (SiON). The second encapsulation layer 72 is an organic insulating material, such as an epoxy resin, acrylic resin, or other resin material. The second encapsulation layer 72 and the third encapsulation layer 73 are continuously disposed at least throughout the display area AA, with portions also disposed in the non-display area NA.

[0102] The second encapsulation layer 72 can be filled in the fracture to block the fracture and improve the encapsulation effect of the first encapsulation layer and the second encapsulation layer 72 as a whole on the light-emitting unit 3. The second encapsulation layer 72 can be filled in the fracture and in the gap between the isolation structure 6 and the second sub-layer 62 to reduce or prevent peeling between the encapsulation portion 71 and the isolation structure 6.

[0103] In some embodiments, the display panel may further include at least one film layer including a touch layer, a polarizer, a color filter substrate 1 , a protective cover, etc. The film layer may also be bonded to the display panel via an adhesive layer such as an optical clear adhesive (OCA).

[0104] See also Figures 1-10In the second aspect, a display panel is provided, comprising: a substrate 1, a pixel definition layer 2, an isolation structure 6, a light-emitting functional layer, a protective layer 44 and a first electrode layer, wherein the pixel definition layer 2 is arranged on one side of the substrate 1, the pixel definition layer 2 comprises a pixel defining portion and a pixel opening 23 formed by the pixel defining portion, the pixel defining portion comprises a first defining layer 21 and a second defining layer 22, the second defining layer 22 is located on a side of the first defining layer 21 away from the substrate 1; the isolation structure 6 is arranged on a side of the pixel defining portion away from the substrate 1, the isolation structure 6 encloses a plurality of isolation openings 64, and the isolation openings 64 are connected to the pixel opening 23; the light-emitting functional layer comprises a plurality of light-emitting units 3, the light-emitting units 3 is arranged in the pixel opening 23 and extends along the second defining layer 22 toward the side wall of the corresponding pixel opening 23; the protective layer 44 has a first opening 441 connected to the pixel opening 23; the first electrode layer includes a plurality of first electrodes 4, the first electrode 4 is arranged on the side of the light-emitting unit 3 facing the substrate 1, the first electrode 4 includes a first conductive layer 41 and a second conductive layer 42, the first conductive layer 41, the protective layer 44 and the first defining layer 21 are stacked in sequence, a portion of the second conductive layer 42 is located in the first opening 441 and between the first conductive layer 41 and the light-emitting unit 3, and a portion of the second conductive layer 42 is located between the first defining layer 21 and the second defining layer 22.

[0105] The isolation structure 6 in the second aspect may be configured with reference to the isolation structure 6 in the first aspect, and the first electrode 4 in the second aspect may be configured with reference to the first electrode 4 in the first aspect.

[0106] In the display panel of this embodiment, portions of the second conductive layer 42 are arranged in contact with the first conductive layer 41 and the light-emitting unit 3, respectively, so that the first conductive layer 41, the second conductive layer 42, and the light-emitting unit 3 can be electrically connected in sequence, enabling the first electrode 4 to provide a voltage to the light-emitting unit 3. By configuring the pixel defining portion to include the first defining layer 21 and the second defining layer 22, with the first conductive layer 41 located on the side of the first defining layer 21 closer to the substrate 1, if a crack forms in the first defining layer 21 extending along the first conductive layer 41, the second defining layer 22 located on the side of the first defining layer 21 can cover the crack, thereby reducing or preventing the crack in the pixel definition layer 2 from exposing undesirable film layers.

[0107] Next, a method for manufacturing the display panel 10 according to the embodiment of the present application will be described.

[0108] See also Figure 11 , the manufacturing method of the display panel 10 includes: S100, providing at least one conductive material layer on one side of a substrate 1, and patterning the at least one conductive material layer, wherein the at least one conductive material layer includes a first conductive material layer 410, and the first conductive material layer 410 forms a plurality of spaced first conductive layers 41; S200, providing a first limiting layer 21 and an etching protection structure 200 on a substrate 1, wherein an orthographic projection of the first conductive layer 41 on the substrate 1 partially overlaps with an orthographic projection of the first limiting layer 21 on the substrate 1, the first limiting layer 21 having a second opening D1, the second opening D1 exposing a portion of the first conductive layer 41, the etching protection structure 200 being located on a side of the first limiting layer 21 facing away from the substrate 1, and the orthographic projection of a surface of the etching protection structure 200 close to the substrate 1 on the substrate 1 being within the orthographic projection of a surface of the etching protection structure 200 facing away from the substrate 1 on the substrate 1; S300, a second conductive material layer is provided on the substrate 1. The second conductive material layer is disconnected at the edge of the etching protection structure 200. The second conductive material layer located in the second opening D1 and in contact with the first conductive layer 41 forms a second connecting portion 421 of the second conductive layer 42. The second conductive material layer in contact with the first limiting layer 21 forms a second edge portion 422 of the second conductive layer 42. The second edge portion 422 is spaced apart from the first conductive layer 41. S400, removing the etching protection structure 200; S500, sequentially providing a second defining material layer and an isolation material layer on the substrate 1, and patterning the isolation material layer and the second defining material layer. The second defining material layer forms a second defining layer 22, and the second edge portion 422 is located between the first defining layer 21 and the second defining layer 22. The first defining layer 21 and the second defining layer 22 enclose a plurality of pixel openings 23. The isolation material layer forms an isolation structure 6. The isolation structure 6 encloses a plurality of isolation openings 64. The isolation openings 64 are in communication with the corresponding pixel openings 23. S600, prepare multiple light-emitting units 3 and multiple second electrodes 5, at least part of the light-emitting unit 3 is arranged in the pixel opening 23 and is located on the side of the second connecting portion 421 away from the first conductive layer 41, the light-emitting unit 3 extends along the second limiting layer 22 toward the side wall of the corresponding pixel opening 23, and the second electrode 5 is located on the side of the light-emitting unit 3 away from the substrate 1.

[0109] In S200, by providing an etching protection structure 200, the orthographic projection of the surface of the etching protection structure 200 close to the substrate 1 on the substrate 1 is located within the orthographic projection of the surface of the etching protection structure 200 facing away from the substrate 1 on the substrate 1, so that the second conductive material layer is disconnected at the edge of the etching protection structure 200, thereby forming a plurality of spaced second conductive layers 42. Because the first defining layer 21 is prepared first and then the second defining layer 22 is prepared, when cracks are present in the first defining layer 21, the second defining layer 22 can cover the cracks in the first defining layer 21. Because the second defining layer 22 is prepared before the isolation structure 6 is prepared, the second defining layer 22 can avoid or reduce contact between the isolation structure 6 and the second conductive layer 42.

[0110] In some embodiments, S100 includes: S110 , sequentially disposing a third conductive material layer 430 and a first conductive material layer 410 on one side of the substrate 1 ; S120 , forming a patterned first etching protection layer 440 on the first conductive material layer 410 , wherein the first etching protection layer 440 has a third opening exposing the first conductive material layer 410 ; S130, wet-etching the first conductive material layer 410 and the third conductive material layer 430 exposed in the third opening, so that the first conductive material layer 410 forms a plurality of spaced first conductive layers 41, and the third conductive material layer 430 forms a plurality of spaced third conductive layers 43, wherein the orthographic projection of the third conductive layer 43 on the substrate 1 is within the orthographic projection of the first conductive layer 41 on the substrate 1.

[0111] By providing the first etching protection layer 440 , the first etching protection layer 440 can protect the prepared third conductive layer 43 and the first conductive layer 41 .

[0112] In some embodiments, S200 includes: S210, sequentially disposing a first limiting material layer and a second etching protection layer on the substrate 1; S220 , patterning the second etch protection layer to form an etch protection structure 200 having a fourth opening, wherein the fourth opening exposes a portion of the first limiting material layer; S230, dry etching is performed on the first limiting material layer and the first etching protection layer 440 exposed at the fourth opening, and the first etching protection layer 440 forms a protection layer 44 having a first opening 441, and the first opening 441 exposes a portion of the first conductive layer 41, and the first limiting material layer forms a first limiting layer 21 having a second opening.

[0113] The first etching protection layer 440 can reduce or avoid damage to the prepared third conductive layer 43 and the first conductive layer 41 caused by the step of forming the second etching protection layer 44 .

[0114] In some embodiments, S300 includes: S310, vapor-depositing a second conductive material layer on the substrate 1, wherein the second conductive material layer is disconnected at the edge of the etching protection structure 200, and a portion of the second conductive material layer is located within the second opening and in contact with the first conductive layer 41, and a portion of the second conductive material layer is located on a side of the etching protection structure 200 facing away from the substrate 1; S400 includes: The etching protection structure 200 and the second conductive material layer located on the side of the etching protection structure 200 facing away from the substrate 1 are removed.

[0115] In some embodiments, the plurality of first electrodes 4 include first sub-electrodes and second sub-electrodes, the plurality of second openings include first sub-openings and second sub-openings, and the plurality of light-emitting units 3 include first light-emitting units for emitting light of a first color and second light-emitting units for emitting light of the first color; S300: S310 , providing a second conductive material layer on the substrate 1 , wherein the thickness of the second conductive material layer is H1 along a direction from the substrate 1 to the first conductive layer 41 ; S320, removing the second conductive material layer located in the second sub-opening, and forming the second conductive material layer located in the first sub-opening into a first sub-electrode; S330, providing a second conductive material layer on the substrate 1, wherein the thickness of the second conductive material layer is H2 along the direction from the substrate 1 to the first conductive layer 41, and H1 and H2 are different; S340, removing the second conductive material layer located on one side of the first sub-electrode, and forming the second conductive material layer located in the second sub-opening into a second sub-electrode; S600 includes: S610, disposing a first light-emitting unit and a second electrode 5 in contact with the first light-emitting unit on one side of the first sub-electrode; S620 , disposing a second light emitting unit and a second electrode 5 in contact with the second light emitting unit on one side of the second sub-electrode.

[0116] In S310, the second conductive layer 42 of the first light-emitting device 30a is fabricated. Since the second conductive layer 42 of the first light-emitting device 30a is fabricated as a single layer, the first openings 441 communicating with the plurality of first isolation openings 64a, the plurality of second isolation openings 64b, and the plurality of third isolation openings 64c all contain the second conductive material layer. The second conductive material layer is removed from the first openings 441 communicating with the plurality of second isolation openings 64b and the plurality of third isolation openings 64c by etching, thereby leaving the second conductive layer 42 only within the first openings 441 communicating with the plurality of first isolation openings 64a.

[0117] In S330, the second conductive layer 42 of the second light-emitting device 30b is fabricated. Since the second conductive layer 42 of the second light-emitting device is fabricated as a single layer, the second conductive material layer is present in the first openings 441 communicating with the plurality of first isolation openings 64a, the plurality of second isolation openings 64b, and the plurality of third isolation openings 64c. The second conductive material layer is removed from the first openings 441 communicating with the plurality of first isolation openings 64a and the plurality of third isolation openings 64c by etching, thereby leaving the second conductive layer 42 only in the first openings 441 communicating with the plurality of second isolation openings 64b.

[0118] In S600, a first encapsulation layer corresponding to the first light-emitting device 30a is fabricated. Since the film layer and the first encapsulation layer of the first light-emitting device 30a are fabricated as a single layer, the film layer and the first encapsulation layer of the first light-emitting device 30a are located at the positions of the plurality of first isolation openings 64a, the plurality of second isolation openings 64b, and the plurality of third isolation openings 64c.

[0119] The film layer and the first encapsulation layer of the first light-emitting device 30a at the positions of the multiple second isolation openings 64b and the multiple third isolation openings 64c are etched away, thereby forming the light-emitting unit 3 and the second electrode 5 of the first light-emitting device 30a and the encapsulation part 71 of the first light-emitting device 30a only at the positions of the multiple first isolation openings 64a.

[0120] Based on the above steps, the light-emitting unit 3 and the second electrode 5 of the second light-emitting device 30b and the packaging part 71 of the second light-emitting device 30b are respectively set at the positions of the multiple second isolation openings 64b, and the light-emitting unit 3 and the second electrode 5 of the third light-emitting device 30c and the packaging part 71 of the third light-emitting device 30c are set at the positions of the multiple third isolation openings 64c.

[0121] In some possible implementations, the present application further provides a display device comprising the display panel described herein. The display device may include a device with image processing capabilities, such as a mobile phone, desktop computer, laptop computer, tablet computer, vehicle-mounted display, wearable device, etc. Because the display device comprises the display panel described herein, the display device has higher reliability.

[0122] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0123] The above embodiments merely illustrate several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the patent for this invention shall be determined by the appended claims.

[0124] Although the present application has been described with reference to preferred embodiments, various modifications may be made thereto and components may be substituted with equivalents without departing from the scope of the present application. In particular, the various technical features described in the various embodiments may be combined in any manner as long as there are no structural conflicts. The present application is not limited to the specific embodiments disclosed herein, but encompasses all technical solutions within the scope of the claims.

Claims

1. A display panel, characterized in that: include: substrate; a pixel definition layer disposed on one side of the substrate, the pixel definition layer comprising a pixel defining portion and a plurality of pixel openings enclosed by the pixel defining portion, the pixel defining portion comprising a first defining layer and a second defining layer, the second defining layer being located on a side of the first defining layer facing away from the substrate; an isolation structure, disposed on a side of the second defining layer facing away from the substrate, the isolation structure enclosing a plurality of isolation openings, the isolation openings being connected to the corresponding pixel openings; a light-emitting functional layer comprising a plurality of light-emitting units, at least a portion of each of the light-emitting units being disposed within the pixel opening and extending along the second defining layer toward a sidewall of the corresponding pixel opening; The first electrode layer includes a plurality of first electrodes, wherein the first electrodes include a first conductive layer and a second conductive layer, the first conductive layer is located on a side of the first defining layer close to the substrate, the second conductive layer includes a second connecting portion and a second edge portion connected to each other, the second connecting portion is in contact with the first conductive layer and the light-emitting unit on opposite sides perpendicular to the substrate, and the second edge portion is located between the first defining layer and the second defining layer.

2. The display panel according to claim 1, wherein: The first electrode further includes a third conductive layer, the third conductive layer being located on a side of the first conductive layer close to the substrate, and an orthographic projection of the third conductive layer on the substrate being located within an orthographic projection of the first conductive layer on the substrate, wherein: The orthographic projection of the second edge portion on the substrate covers an edge of the orthographic projection of the first conductive layer on the substrate, and the orthographic projection of the second edge portion on the substrate covers an edge of the orthographic projection of the third conductive layer on the substrate.

3. The display panel according to claim 2, wherein: The display panel further includes: An organic insulating layer, a portion of the organic insulating layer is located between the third conductive layer and the substrate, and another portion of the organic insulating layer is located between the first defining layer and the substrate.

4. The display panel according to claim 2, wherein: The isolation structure includes a first sublayer and a second sublayer, wherein the first sublayer and the second sublayer are sequentially stacked in a direction away from the substrate, and the second sublayer protrudes relative to the first sublayer toward the isolation opening, wherein: The edge of the orthographic projection of the second edge portion on the substrate is located within the orthographic projection of the first sub-layer on the substrate, the edge of the orthographic projection of the first conductive layer on the substrate is located within the orthographic projection of the first sub-layer on the substrate, and the edge of the orthographic projection of the third conductive layer on the substrate is located within the orthographic projection of the first sub-layer on the substrate.

5. The display panel according to claim 2, wherein: The material of the first conductive layer includes at least one of silver and silver alloy; And / or, the material of the third conductive layer includes at least one of indium tin oxide, indium zinc oxide or indium gallium zinc oxide.

6. The display panel according to claim 1 or 2, wherein: The orthographic projection of the first conductive layer on the substrate is located within the orthographic projection of the second conductive layer on the substrate.

7. The display panel according to claim 1, wherein: The display panel further includes a second electrode layer, the second electrode layer includes a plurality of second electrodes, the second electrodes are located on a side of the corresponding light-emitting unit facing away from the substrate, the second electrodes are electrically connected to the isolation structure, and a portion of the second defining layer is located between the second edge portion and the second electrodes; and / or, A portion of the second defining layer is located between the second edge portion and the light emitting unit.

8. The display panel according to claim 1, wherein: The second edge portion extends along a surface of the first defining layer facing the pixel opening to a side of the first defining layer facing away from the substrate; and / or, The light emitting unit extends along a surface of the second defining layer facing the pixel opening to a side of the second defining layer away from the substrate, and the light emitting unit is spaced apart from the isolation structure.

9. The display panel according to claim 1, wherein: The second edge portion extends along a surface of the first defining layer facing the pixel opening, and an end portion of the second edge portion facing away from the second connecting portion is located on the surface of the first defining layer facing the pixel opening; and / or, The light emitting unit extends along a surface of the second defining layer facing the pixel opening, and an edge of the light emitting unit is located on the surface of the second defining layer facing the pixel opening.

10. The display panel according to claim 1, wherein The edge of the second defining layer is in contact with the surface of the second edge portion facing away from the substrate; Alternatively, the second defining layer extends along the surface of the second edge portion facing away from the substrate to the surface of the second edge portion facing the pixel opening, and the edge of the second defining layer contacts the surface of the second edge portion facing the pixel opening; Alternatively, the second limiting layer extends along the second edge portion to a portion of the surface of the second connecting portion facing away from the substrate.

11. The display panel according to claim 1, wherein The display panel also includes a protective layer, the first conductive layer includes a first connecting portion and a first edge portion connected to each other, the protective layer is located between the first edge portion and the first defining layer, the protective layer has a first opening connected to the pixel opening, and at least a portion of the second connecting portion is arranged in the first opening and in contact with the first connecting portion.

12. The display panel according to claim 11, wherein: The first defining layer includes a first defining portion and a second defining portion, the first defining portion is located between adjacent first conductive layers, the second defining portion extends from the first defining portion along the first conductive layer to the side of the protective layer facing away from the substrate, and the surface of the first defining portion facing away from the substrate is recessed toward the substrate relative to the surface of the second defining portion facing away from the substrate.

13. The display panel according to claim 12, wherein: The second defining layer includes a third defining portion and a fourth defining portion that are connected to each other, the third defining portion is located on the side of the first defining portion facing away from the substrate, the fourth defining portion is located on the side of the second defining portion facing away from the substrate, the second edge portion is located between the second defining portion and the fourth defining portion, the surface of the third defining portion facing away from the substrate is recessed toward the substrate relative to the surface of the fourth defining portion facing away from the substrate, and the isolation structure is arranged on the side of the second defining layer facing away from the substrate.

14. The display panel according to claim 13, wherein: Part of the isolation structure is supported on a side of the third defining portion facing away from the substrate, and part of the isolation structure is supported on a side of the fourth defining portion facing away from the substrate.

15. The display panel according to claim 1, wherein The multiple first electrodes include a first sub-electrode and a second sub-electrode, and the multiple light-emitting units include a first light-emitting unit for emitting a first color light and a second light-emitting unit for emitting the first color light; along the direction from the substrate to the first conductive layer, the thickness of the second conductive layer in the first sub-electrode is H1, and the thickness of the second conductive layer in the second sub-electrode is H2, and H1 and H2 are different.

16. A display panel, characterized in that: include: substrate; a pixel definition layer disposed on one side of the substrate, the pixel definition layer comprising a pixel defining portion and a pixel opening enclosed by the pixel defining portion, the pixel defining portion comprising a first defining layer and a second defining layer, the second defining layer being located on a side of the first defining layer facing away from the substrate; an isolation structure, disposed on a side of the pixel defining portion facing away from the substrate, the isolation structure enclosing a plurality of isolation openings, the isolation openings being in communication with the corresponding pixel openings; a light-emitting functional layer comprising a plurality of light-emitting units, at least a portion of each of the light-emitting units being disposed within the pixel opening and extending along the second defining layer toward a sidewall of the corresponding pixel opening; a protective layer having a first opening communicating with the pixel opening; The first electrode layer includes a plurality of first electrodes, wherein the first electrodes are arranged on the side of the light-emitting unit facing the substrate, the first electrode includes a first conductive layer and a second conductive layer, the first conductive layer, the protective layer and the first defining layer are stacked in sequence, a portion of the second conductive layer is located in the first opening and between the first conductive layer and the light-emitting unit, and a portion of the second conductive layer is located between the first defining layer and the second defining layer.

17. A method for preparing a display panel, characterized in that: include: At least one conductive material layer is provided on one side of the substrate, and the at least one conductive material layer is patterned, wherein the at least one conductive material layer includes a first conductive material layer, and the first conductive material layer forms a plurality of spaced first conductive layers; A first defining layer and an etch protection structure are provided on the substrate, wherein the orthographic projection of the first conductive layer on the substrate partially overlaps with the orthographic projection of the first defining layer on the substrate, the first defining layer has a second opening, and the second opening exposes a portion of the first conductive layer, the etch protection structure is located on a side of the first defining layer facing away from the substrate, and the orthographic projection of a surface of the etch protection structure close to the substrate on the substrate is located within the orthographic projection of a surface of the etch protection structure facing away from the substrate on the substrate; A second conductive material layer is provided on the substrate, wherein the second conductive material layer is disconnected at an edge of the etching protection structure, the second conductive material layer located in the second opening and in contact with the first conductive layer forms a second connecting portion of the second conductive layer, and the second conductive material layer in contact with the first limiting layer forms a second edge portion of the second conductive layer, and the second edge portion is spaced apart from the first conductive layer; removing the etching protection structure; A second defining material layer and an isolation material layer are sequentially provided on the substrate, and the isolation material layer and the second defining material layer are patterned, wherein the second defining material layer forms a second defining layer, the second edge portion is located between the first defining layer and the second defining layer, the first defining layer and the second defining layer enclose a plurality of pixel openings, the isolation material layer forms an isolation structure, the isolation structure encloses a plurality of isolation openings, and the isolation openings are connected to the corresponding pixel openings; A plurality of light-emitting units and a plurality of second electrodes are prepared, wherein at least a portion of the light-emitting unit is arranged in the pixel opening and is located on the side of the second connecting portion away from the first conductive layer, the light-emitting unit extends along the second defining layer toward the corresponding side wall of the pixel opening, and the second electrode is located on the side of the light-emitting unit away from the substrate.

18. The method for manufacturing a display panel according to claim 17, wherein: The step of providing at least one conductive material layer on one side of the substrate and patterning the at least one conductive material layer comprises: A third conductive material layer and a first conductive material layer are sequentially provided on one side of the substrate; forming a patterned first etch protection layer on the first conductive material layer, wherein the first etch protection layer has a third opening exposing the first conductive material layer; The first conductive material layer and the third conductive material layer exposed to the third opening are wet etched, and the first conductive material layer forms a plurality of spaced first conductive layers, and the third conductive material layer forms a plurality of spaced third conductive layers, and the orthographic projection of the third conductive layer on the substrate is located within the orthographic projection of the first conductive layer on the substrate.

19. The method for manufacturing a display panel according to claim 18, wherein: Providing a first limiting layer and an etching protection structure on the substrate includes: sequentially disposing a first limiting material layer and a second etching protection layer on the substrate; performing patterning on the second etch protection layer to form the etch protection structure having a fourth opening, wherein the fourth opening exposes a portion of the first limiting material layer; The first limiting material layer and the first etching protection layer exposed to the fourth opening are dry-etched to form a protection layer having a first opening, the first opening exposing a portion of the first conductive layer, and the first limiting material layer forming the first limiting layer having the second opening.

20. The method for manufacturing a display panel according to claim 17, wherein: The providing a second conductive material layer on the substrate comprises: Depositing a second conductive material layer on the substrate, wherein the second conductive material layer is disconnected at an edge of the etch protection structure, a portion of the second conductive material layer is located within the second opening and in contact with the first conductive layer, and a portion of the second conductive material layer is located on a side of the etch protection structure facing away from the substrate; The removing of the etching protection structure comprises: The etch protection structure and the second conductive material layer located on a side of the etch protection structure facing away from the substrate are removed.

21. The method for manufacturing a display panel according to claim 17, wherein: The plurality of first electrodes include first sub-electrodes and second sub-electrodes, the plurality of second openings include first sub-openings and second sub-openings, and the plurality of light-emitting units include first light-emitting units for emitting light of a first color and second light-emitting units for emitting light of the first color; The providing a second conductive material layer on the substrate comprises: Disposing a second conductive material layer on the substrate, wherein the thickness of the second conductive material layer is H1 along a direction from the substrate to the first conductive layer; removing the second conductive material layer located in the second sub-opening, and allowing the second conductive material layer located in the first sub-opening to form the second conductive layer of the first sub-electrode; Disposing a second conductive material layer on the substrate, wherein the thickness of the second conductive material layer is H2 along a direction from the substrate to the first conductive layer, and H1 and H2 are different; removing the second conductive material layer located on one side of the first sub-electrode, and the second conductive material layer located in the second sub-opening forms the second conductive layer of the second sub-electrode; The preparation of the plurality of light-emitting units comprises: The first light-emitting unit and the second electrode in contact with the first light-emitting unit are provided on one side of the first sub-electrode; The second light emitting unit and the second electrode in contact with the second light emitting unit are disposed on one side of the second sub-electrode.

22. A display device, characterized in that: A display panel comprising the display panel according to any one of claims 1 to 16, or a display panel prepared by the method for preparing a display panel according to any one of claims 17 to 21.

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