Display panel, preparation method thereof and display device

Abstract

The embodiment of the invention provides a display panel, a preparation method thereof and a display device. The display panel comprises a substrate; a first electrode layer; the pixel defining layer is arranged on one side of the substrate and comprises a pixel limiting part and pixel openings, the multiple pixel openings are distributed in an array mode, and the orthographic projection of the pixel openings on the substrate and the orthographic projection of the first electrode on the substrate are at least partially overlapped; the isolation opening is communicated with the pixel opening, the isolation structure comprises a lap joint layer and a first sub-layer which are stacked in the direction away from the substrate, and the lap joint layer protrudes towards the isolation opening relative to the first sub-layer; the first insulating part covers the lapping layer; wherein the first electrode comprises a plurality of sub-layers which are stacked in the thickness direction of the display panel, the plurality of sub-layers comprise a first conductive sub-layer, the first conductive sub-layer comprises an edge segment, and the edge segment is located on the side, away from the substrate, of the first insulating part. The processing performance of the display panel can be improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display devices, and in particular to a display panel, a preparation method thereof, and a display device. BACKGROUND

[0002] Organic light emitting diode (OLED) display technology is considered as the most potential new display technology of the next generation. Compared with liquid crystal display technology, OLED display technology has the advantages of low energy consumption, low cost, self-luminous, wide viewing angle, and fast response speed.

[0003] In the preparation process of a conventional OLED display panel, a fine metal mask (FMM) is usually used to realize patterning of a light-emitting pixel. The FMM technology is mature and has rich experience in mass production. However, the FMM technology also has the problems of limited precision and high cost. The fine metal mask-free technology eliminates the limitations of the conventional OLED process on the size, resolution, and other performance of the display screen, and has the advantages of high performance, full-size, and agile delivery. For reference, the related content of the fine metal mask-free technology is recorded in patents CN118251982A, CN116648095A, CN117062489A, CN118742138A, CN118678783A, CN118660598A, CN118675450A, CN118824188A, CN118781966A.

[0004] However, the process performance of the previous OLED display product needs to be improved. SUMMARY

[0005] Embodiments of the present application provide a display panel, a preparation method thereof, and a display device, which aim to improve the process performance of the display panel.

[0006] Embodiments of the first aspect of the present application provide a display panel, comprising: a substrate; a pixel definition layer disposed on one side of the substrate and comprising a pixel limiting portion and a plurality of pixel openings arranged in an array; an isolation structure disposed on a side of the pixel definition layer away from the substrate and enclosing a separate opening, the separate opening being in communication with the corresponding pixel opening, the isolation structure comprising a first sub-layer and a lap joint layer disposed in a stack in a direction away from the substrate, the lap joint layer being protrudingly disposed towards the separate opening relative to the first sub-layer; a first insulating portion covering a surface of the lap joint layer away from the substrate and a side surface of the lap joint layer towards the separate opening; a first electrode layer disposed on one side of the substrate and comprising a plurality of first electrodes arranged at intervals, the first electrode comprising at least a first conductive sub-layer located within the corresponding pixel opening, the first conductive sub-layer extending along a side wall of the pixel opening and having an edge segment located on a side of the first insulating portion away from the substrate; and a plurality of light emitting units located on a side of the corresponding first electrode away from the substrate; wherein a distance between the edge segment and the first sub-layer is greater than a distance between the first edge portion and the first sub-layer.

[0007] According to an embodiment of the first aspect of the present application, the display panel further comprises a second electrode layer, the second electrode layer comprising a plurality of second electrodes located on a side of the corresponding light emitting unit away from the substrate, wherein: the light emitting unit has a second edge portion covering the edge segment and in contact with the first edge portion; the second electrode has a third edge portion covering the second edge portion and in contact with the first sub-layer; the second edge portion is spaced apart from the lap joint layer by the first edge portion, and the second edge portion is spaced apart from the first sub-layer by the third edge portion.

[0008] According to an embodiment of the first aspect of the present application, further comprising: a second insulating portion covering at least part of a surface of the edge segment away from the substrate and covering a surface of the edge segment towards the separate opening.

[0009] According to any one of the preceding embodiments of the first aspect of the present application, the second insulating portion is in the form of a closed ring around the pixel opening; and / or the first insulating portion is in the form of a closed ring around the pixel opening.

[0010] According to any one of the preceding embodiments of the first aspect of the present application, further comprising a second electrode layer, the second electrode layer comprising a second electrode located on a side of the light emitting unit away from the substrate, The first insulating portion and the second insulating portion are both provided with a clearance gap between the first sub-layer, the second electrode covers the lap joint layer exposed by the clearance gap, and / or at least one of the first insulating portion and the second insulating portion is in contact with the first sub-layer, and the second electrode covers at least part of the surface of the first sub-layer facing the isolation opening.

[0011] According to any one of the preceding embodiments of the first aspect of the present application, the first insulating portion has a density greater than that of the pixel defining portion, and / or the second insulating portion has a density greater than that of the pixel defining portion.

[0012] According to any one of the preceding embodiments of the first aspect of the present application, the first insulating portion has a film thickness less than that of the lap joint layer, and / or the second insulating portion has a film thickness less than that of the lap joint layer.

[0013] According to any one of the preceding embodiments of the first aspect of the present application, the light emitting unit is located within the second insulating portion in the orthographic projection of the substrate, or the light emitting unit is located on the side of the second insulating portion facing the pixel opening.

[0014] According to any one of the preceding embodiments of the first aspect of the present application, the surface of the second insulating portion away from the substrate includes a first sub-surface, a second sub-surface, and a third sub-surface connected between the first sub-surface and the second sub-surface and extending in the thickness direction of the display panel, the light emitting unit is located on the side of the third sub-surface facing the pixel opening, or the second sub-surface is located on the side of the third sub-surface away from the pixel opening, and the light emitting unit is located within the second sub-surface in the orthographic projection of the substrate.

[0015] According to any one of the preceding embodiments of the first aspect of the present application, the first sub-layer includes a center segment and a transition segment surrounding the center segment, the edge segment is connected to the side of the transition segment away from the center segment, the transition segment covers the side surface of the pixel defining portion facing the pixel opening, and at least part of the edge segment is located between the first insulating portion and the second insulating portion.

[0016] According to any one of the preceding embodiments of the first aspect of the present application, the first insulating portion extends to the edge of the pixel opening, and the transition segment further covers the surface of the first insulating portion facing the pixel opening.

[0017] According to any one of the preceding embodiments of the first aspect of the present application, the first insulating portion extends to the edge of the pixel opening and covers part of the pixel defining portion.

[0018] According to any one of the foregoing embodiments of the first aspect of the present application, the isolation structure further comprises a second sub-layer on the side of the first sub-layer facing away from the substrate, the second sub-layer is arranged protruding towards the isolation opening relative to the first sub-layer, and the first insulating portion overlaps with the part of the second sub-layer in the orthographic projection of the substrate.

[0019] According to any one of the foregoing embodiments of the first aspect of the present application, the plurality of light emitting units comprises first, second and third light emitting units with different light emitting colors, and the film thickness of the first conductive sub-layer corresponding to at least two of the first, second and third light emitting units is different.

[0020] According to any one of the foregoing embodiments of the first aspect of the present application, the first electrode further comprises a second conductive sub-layer on the side of the first conductive sub-layer facing the substrate and a third conductive sub-layer on the side of the second conductive sub-layer facing the substrate, a part of the second conductive sub-layer is in contact with the first conductive sub-layer, and another part of the second conductive sub-layer is between the pixel defining portion and the substrate, the third conductive sub-layer overlaps with the second conductive sub-layer in the orthographic projection of the substrate, wherein the material of the first conductive sub-layer and the third conductive sub-layer comprises metal oxide, and the material of the second conductive sub-layer comprises metal.

[0021] According to any one of the foregoing embodiments of the first aspect of the present application, a protection portion is arranged between the second conductive sub-layer and the pixel defining portion, the material of the protection portion comprises insulating material, and the protection portion is arranged around the pixel opening.

[0022] The embodiments of the first aspect of the present application also provide a display panel, comprising: a substrate; a pixel definition layer arranged on one side of the substrate and comprising a pixel defining portion and a pixel opening, a plurality of pixel openings are arranged in an array, and the pixel opening is used to accommodate a light emitting unit; a first electrode layer arranged on one side of the substrate and comprising a plurality of first electrodes arranged at intervals, the first electrode at least comprises a first conductive sub-layer located in the corresponding pixel opening; and a plurality of light emitting units located on the side of the corresponding first electrode facing away from the substrate; wherein the first conductive sub-layer comprises an edge segment covering the edge of the pixel defining portion facing away from the top surface of the substrate, and the side of the edge segment facing away from the substrate is covered with a second insulating portion.

[0023] According to the embodiments of the first aspect of the present application, the isolation structure comprises a lapping layer and a first sub-layer arranged in a stack in a direction away from the substrate, the lapping layer is arranged protruding towards the isolation opening relative to the first sub-layer, The edge segment and the overlap layer are spaced apart, and the second insulating part covers a surface of the edge segment away from the substrate and a side surface of the edge segment toward the isolation structure. Alternatively, the display panel further comprises a first insulating part, the first insulating part covering at least part of the overlap layer, and at least part of the edge segment being located on a side of the first insulating part away from the substrate.

[0024] According to any one of the foregoing embodiments of the first aspect of the application, the display panel further comprises: a second electrode layer comprising a second electrode located on a side of the light-emitting unit away from the substrate, The first insulating part and the second insulating part are both provided with a clearance gap between the first sub-layer, and the second electrode covers the overlap layer exposed by the clearance gap.

[0025] The second aspect of the application also provides a method for manufacturing a display panel, comprising: performing a patterning process on a material layer to form a plurality of second conductive sub-layers spaced apart and a preliminary protection part located on a side of the second conductive sub-layers away from the substrate; A pixel definition material layer and an isolation structure material layer are provided on a side of the second conductive sub-layers away from the substrate, and the isolation structure material layer is subjected to a patterning process to form an isolation structure, the isolation structure enclosing a separation opening, the isolation structure comprising an overlap layer and a first sub-layer stacked in a direction away from the substrate, the overlap layer being protrudingly arranged relative to the first sub-layer toward the separation opening; A first insulating material layer is provided on a side of the pixel definition material layer and the isolation structure away from the substrate, and the pixel definition material layer and the first insulating material layer are subjected to a patterning process to form a pixel definition layer and a first preliminary insulating part, the pixel definition layer comprising a pixel limiting part and a pixel opening, the first preliminary insulating part enclosing a first preliminary opening in communication with the pixel opening, and the first preliminary insulating part covering at least part of the isolation structure; A first conductive material layer is provided on a side of the first preliminary insulating part, the pixel definition layer and the isolation structure away from the substrate, and the first conductive material layer is subjected to a patterning process to form a first conductive sub-layer, the first conductive sub-layer comprising a center segment located in the pixel opening, an edge segment located on a top surface of the pixel limiting part away from the substrate, and a transition segment connecting the center segment and the edge segment, the edge segment being located on a side of the first preliminary insulating part away from the substrate.

[0026] According to the embodiment of the second aspect of the present application, in the step of disposing a first insulating material layer on the side of the pixel definition material layer and the isolation structure away from the substrate, and patterning the pixel definition material layer and the first insulating material layer to form a pixel definition layer and a first preliminary insulating portion, the pixel definition material layer and the isolation structure are disposed on the substrate, and the first insulating material layer is disposed on the side of the pixel definition material layer and the isolation structure away from the substrate. The pixel definition material layer and the preliminary protection portion are patterned to form the pixel definition layer and a protection portion, the protection portion being disposed between the second conductive sub-layer and the pixel limiting portion and surrounding the pixel opening. A first insulating material layer is disposed on the side of the pixel definition layer and the isolation structure away from the substrate, and the first insulating material layer is patterned to form the first preliminary insulating portion. Alternatively, in the step of disposing a first insulating material layer on the side of the pixel definition material layer and the isolation structure away from the substrate, and patterning the pixel definition material layer and the first insulating material layer to form a pixel definition layer and a first preliminary insulating portion, the pixel definition material layer and the isolation structure are disposed on the substrate, and the first insulating material layer is disposed on the side of the pixel definition material layer and the isolation structure away from the substrate. A first insulating material layer is disposed on the side of the pixel definition material layer and the isolation structure away from the substrate. The preliminary protection portion, the pixel definition material layer, and the first insulating material layer are patterned to form a protection portion, the pixel definition layer, and the first preliminary insulating portion, the protection portion being disposed between the second conductive sub-layer and the pixel limiting portion and surrounding the pixel opening.

[0027] According to any one of the foregoing embodiments of the second aspect of the present application, the display panel further comprises: A second insulating material layer is disposed on the side of the first conductive sub-layer away from the substrate, and the second insulating material layer and the first preliminary insulating portion are patterned to form a second insulating portion and a first insulating portion, the first insulating portion covering part of the pixel limiting portion and part of the first insulating portion of the overlap layer, and the second insulating portion covering at least part of the side surface of the edge segment away from the substrate. Alternatively, the first preliminary insulating portion is patterned to form a first insulating portion, the first insulating portion covering at least part of the overlap layer.

[0028] The third aspect of the present application also provides a display device, which comprises the display panel prepared by any one of the first aspect embodiments or the display panel provided by any one of the second aspect embodiments.

[0029] In the display panel provided by the embodiment of the present application, the display panel comprises a substrate, a pixel definition layer, an isolation structure, a first insulating part, a first electrode layer and a light emitting unit. The first electrode of the first electrode layer and the pixel opening of the pixel definition layer are correspondingly arranged, so that the first electrode can be in contact with the light emitting unit in the pixel opening, and the first electrode can drive the light emitting unit to emit light for display. The isolation structure encloses an isolation opening, and the isolation structure can be used to separate the light emitting material into light emitting units that are independent of each other and located in the isolation openings. The first insulating part covers the lapping layer, and the distance between the edge section and the first sub-layer is greater than the distance between the first edge part and the first sub-layer. When the first conductive sub-layer of the first electrode is prepared subsequently, the edge section of the first conductive sub-layer is located on the side of the first insulating part away from the substrate, that is, the first insulating part is located between the first conductive sub-layer and the lapping layer, which can improve the short circuit connection problem of the first conductive sub-layer and the isolation structure, thereby reducing the process difficulty and improving the process performance of the display panel. BRIEF DESCRIPTION OF DRAWINGS

[0030] Other features, objects, and advantages of the present application will become more apparent from the following detailed description of non-limiting embodiments thereof as taken in conjunction with the accompanying drawings, in which like references denote like features.

[0031] Figure 1 FIG. 1 is a structural schematic diagram of a display panel provided by an embodiment of the present application; Figure 2 FIG. 2 is a partial enlarged structural schematic diagram of FIG. 1; Figure 1 Figure 3 FIG. 3 is a partial sectional view in an embodiment; Figure 2 Figure 4 FIG. 4 is a structural schematic diagram of a pixel driving circuit of a display panel provided by an embodiment of the present application; Figure 5 FIG. 5 is a partial sectional view in another embodiment; Figure 2 Figure 6 FIG. 6 is a partial sectional view in still another embodiment; Figure 2 Figure 7 FIG. 7 is a partial sectional view in yet another embodiment; Figure 2 Figure 8 FIG. 8 is a partial sectional view in yet another embodiment; Figure 2 Figure 9 FIG. 9 is a partial sectional view in yet another embodiment; Figure 2 Figure 10 FIG. 10 is a partial sectional view in yet another embodiment; Figure 2 ​​​​​​​​Figure 11 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present application; Figures 11a to 11d is a process structure diagram of a method for manufacturing a display panel according to an embodiment of the present application; Figure 12 is a flowchart of a method for manufacturing a display panel according to another embodiment of the present application; Figure 12a is a process structure diagram of a method for manufacturing a display panel according to an embodiment of the present application; Figure 13 is a flowchart of a method for manufacturing a display panel according to still another embodiment of the present application; Figure 13a is a process structure diagram of a method for manufacturing a display panel according to an embodiment of the present application; Figure 14 is a flowchart of a method for manufacturing a display panel according to yet another embodiment of the present application; Figure 14a is a process structure diagram of a method for manufacturing a display panel according to an embodiment of the present application.

[0032] Legend of reference signs: 100, substrate; 200, pixel definition layer; 201, first definition layer; 202, second definition layer; 210, pixel limiting portion; 220, pixel opening; 230, light emitting unit; 300, isolation structure; 301, first sub-layer; 302, second sub-layer; 303, lapping layer; 310, isolation opening; 400, first electrode layer; 410, first electrode; 411, first conductive sub-layer; 411a, edge segment; 411b, transition segment; 411c, center segment; 412, second conductive sub-layer; 413, third conductive sub-layer; 420, protection portion; 500, second electrode layer; 510, second electrode; 511, main body portion; 512, lapping portion; 600, encapsulation layer; 610, first encapsulation layer; 610a, encapsulation portion; 611, first encapsulation portion; 612, second encapsulation portion; 613, third encapsulation portion; 620, second encapsulation layer; 630, third encapsulation layer; 710, first insulation portion; 720, second insulation portion; 721, first sub-face; 722, second sub-face; 723, third sub-face; 730, accommodation gap; X, first direction; Y, second direction; Z, thickness direction; AA, display area; NA, non-display area. DETAILED DESCRIPTION

[0033] So that the purposes, technical solutions and advantages of the embodiments of the present application are more apparent, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings can be arranged and designed in various different configurations.

[0034] Therefore, the detailed description of the embodiments of the present application provided below in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without making creative efforts fall within the scope of protection of the present application.

[0035] It should be noted that similar reference numerals and letters represent similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. It should be noted that different features in the embodiments of the present application can be combined with each other without conflict.

[0036] For easy understanding, mutually orthogonal X-axis, Y-axis and Z-axis are recorded in the drawings. The direction along the X-axis is referred to as the X direction, the direction along the Y-axis is referred to as the Y direction, and the direction along the Z-axis is referred to as the Z direction. The Z direction is the normal direction with respect to the plane containing the X direction and the Y direction. In addition, the case where various elements are observed in parallel with the plane containing the X direction and the Y direction is referred to as a plan view. Or the plane of the X direction and the Y direction is a plane parallel to the display surface of the display panel, and the Z direction is a direction parallel to the thickness direction Z of the display panel.

[0037] For some elements, the terms "upper" or "above" are sometimes used when describing the position of an element in the Z direction, and the terms "lower" or "below" are used when describing the position of an element in the opposite direction. In addition, when the terms "upper", "above", "lower", "below", "relative" and the like are used to define the positional relationship of two elements with respect to each other, they not only include the state where the above two elements are directly connected, but also include the state where the above two elements are separated by a gap, other elements. In addition, the terms "first", "second", "third" and the like are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0038] Figure 1is a structural schematic diagram of a display panel according to an embodiment of the present application. The display panel can be an organic light emitting diode display panel (OLED) or a quantum dot light emitting diode display panel (QLED). The display panel includes a display area AA having a display function and a non-display area NA.

[0039] The display area AA of the display panel can have a rectangular shape, or a square, circular, or elliptical shape, or other shapes.

[0040] The display area AA includes a plurality of pixels PX arranged in an X direction and a Y direction. The pixel PX includes a plurality of sub-pixels SPX that display different colors. In some embodiments, the pixel PX includes a first sub-pixel SPX1, a second sub-pixel SPX2, and a third sub-pixel SPX3. For example, the first sub-pixel SPX1 is a blue sub-pixel, the second sub-pixel SPX2 is a green sub-pixel, and the third sub-pixel SPX3 is a red sub-pixel. In some embodiments, the pixel PX includes a sub-pixel SPX that emits white or other color light in addition to the sub-pixels SPX1, SPX2, and SPX3.

[0041] The sub-pixel SPX includes a pixel circuit and a light emitting device driven by the pixel circuit to emit light of a corresponding color. The first sub-pixel SPX1 includes a first light emitting device, the second sub-pixel SPX2 includes a second light emitting device, and the third sub-pixel SPX3 includes a third light emitting device. One pixel circuit drives at least one light emitting device to emit light. For example, the display area AA includes a normal display area AA and a light transmission display area AA. The light transmission display area AA is a display area AA provided for a sensor and having a light transmission property. The normal display area AA is a display area AA not provided for a sensor. In the normal display area AA, one pixel circuit drives one light emitting device to emit light. In the light transmission display area AA, one pixel circuit drives one or more light emitting devices to emit light.

[0042] As shown in FIG. 1, the display panel includes a display area AA and a non-display area NA. The display area AA includes a plurality of pixels PX arranged in an X direction and a Y direction. The pixel PX includes a plurality of sub-pixels SPX that display different colors. In some embodiments, the pixel PX includes a first sub-pixel SPX1, a second sub-pixel SPX2, and a third sub-pixel SPX3. For example, the first sub-pixel SPX1 is a blue sub-pixel, the second sub-pixel SPX2 is a green sub-pixel, and the third sub-pixel SPX3 is a red sub-pixel. In some embodiments, the pixel PX includes a sub-pixel SPX that emits white or other color light in addition to the sub-pixels SPX1, SPX2, and SPX3. Figures 2 to 3As shown, the first aspect of the present application provides a display panel, comprising: a substrate 100; a pixel definition layer 200 disposed on one side of the substrate 100 and comprising a pixel limiting portion 210 and a pixel opening 220, a plurality of pixel openings 220 are arrayed, and the pixel opening 220 is used to accommodate a light emitting unit 230; an isolation structure 300 disposed on one side of the substrate 100 and enclosing a separate opening 310, the separate opening 310 and the pixel opening 220 are communicated, and the isolation structure 300 comprises a lap joint layer 303 and a first sub-layer 301 stacked in a direction away from the substrate 100, the lap joint layer 303 is protrudingly disposed towards the separate opening 310 relative to the first sub-layer 301; a first insulating portion 710 covering the surface of the lap joint layer 303 away from the substrate 100 and the side of the lap joint layer 303 towards the separate opening 310, and having a first edge portion located on the side of the lap joint layer 303 away from the substrate 100; a first electrode layer 400 disposed on one side of the substrate 100 and comprising a plurality of first electrodes 410 spaced apart, the first electrode 410 at least comprises a first conductive sub-layer 411 located in the corresponding pixel opening 220, the first conductive sub-layer 411 extends along the side wall of the pixel opening 220 and has an edge segment 411a located on the side of the first insulating portion 710 away from the substrate 100; a plurality of light emitting units 230, the light emitting unit 230 is located on the side of the corresponding first electrode 410 away from the substrate 100; wherein the distance between the edge segment 411a and the first sub-layer 301 is greater than the distance between the first edge portion and the first sub-layer 301.

[0043] In the display panel provided in the embodiments of the present application, the display panel comprises a substrate 100, a pixel definition layer 200, an isolation structure 300, a first insulating portion 710, a first electrode layer 400 and a plurality of light emitting units 230. The first electrode 410 of the first electrode layer 400 and the pixel opening 220 of the pixel definition layer 200 are arranged correspondingly, so that the first electrode 410 can be connected with the light emitting unit 230 in the pixel opening 220, and the first electrode 410 can drive the light emitting unit 230 to emit light for display. The isolation structure 300 encloses an isolation opening 310, and the isolation structure 300 can be used to separate the light emitting material into the light emitting units 230 which are independent of each other and located in the isolation openings 310. The first insulating portion 710 covers the lap joint layer 303, and the distance between the edge segment 411a and the first sub-layer 301 is greater than the distance between the first edge portion and the first sub-layer 301. When the first conductive sub-layer 411 of the first electrode 410 is prepared subsequently, the edge segment 411a of the first conductive sub-layer 411 is located on the side of the first insulating portion 710 away from the substrate 100, that is, the first insulating portion 710 is located between the first conductive sub-layer 411 and the lap joint layer 303, which can improve the short circuit connection problem of the first conductive sub-layer 411 and the isolation structure 300, and further reduce the process difficulty and improve the process performance of the display panel.

[0044] Optionally, the pixel opening 220 in the orthographic projection of the substrate 100 and the first electrode 410 in the orthographic projection of the substrate 100 at least partially overlap. At least part of the light emitting unit 230 is located in the pixel opening 220 and connected with the first electrode 410.

[0045] The first electrode 410 can be a single-layer structure comprising a first conductive sub-layer 411, or the first electrode 410 can comprise a plurality of sub-layers.

[0046] The first electrode 410 can be formed by a plurality of sub-layers. For example, the plurality of sub-layers can include a metal layer, and a pair of conductive oxide layers respectively covering the upper surface and the lower surface of the metal layer. For example, the first conductive sub-layer 411 can be a conductive oxide layer, and the material of the first conductive sub-layer 411 can include a metal oxide. The plurality of sub-layers can further include a second conductive sub-layer 412, which is located on the side of the first conductive sub-layer 411 facing the substrate 100, and a portion of the second conductive sub-layer 412 is in contact with the first conductive sub-layer 411, and another portion of the second conductive sub-layer 412 is located between the pixel defining portion 210 and the substrate 100. Optionally, the material of the second conductive sub-layer 412 can include a metal, such as silver. Each conductive oxide layer can be formed by a transparent conductive oxide, such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), or IGZO (Indium Gallium Zinc Oxide).

[0047] Optionally, the first electrode 410 can further include a third conductive sub-layer 413, which is located on the side of the second conductive sub-layer 412 facing the substrate 100, and the third conductive sub-layer 413 can be in contact with the second conductive sub-layer 412, and the third conductive sub-layer 413 and the second conductive sub-layer 412 can be formed in the same patterning process. Optionally, the third conductive sub-layer 413 can be a conductive oxide layer, and the material of the third conductive sub-layer 413 can include a metal oxide, which can improve the problem that the second conductive sub-layer 412 is easily oxidized.

[0048] Optionally, a protective portion 420 can be provided between the second conductive sub-layer 412 and the pixel defining portion 210, and the protective portion 420 can surround the pixel opening 220. By providing the protective portion 420, during the preparation of the second conductive sub-layer 412 and the third conductive sub-layer 413, an insulating material can be provided on the material layer of the second conductive sub-layer 412, and the insulating material can protect the second conductive sub-layer 412. Before the first conductive sub-layer 411 is prepared, the insulating material can be patterned to form the protective portion 420 surrounding the pixel opening 220, and the subsequent first conductive sub-layer 411 can be electrically connected to the second conductive sub-layer 412 through the pixel opening 220. Before the first conductive sub-layer 411 covers the second conductive sub-layer 412, the insulating material can provide insulation protection for the second conductive sub-layer 412. The material of the protective portion 420 can include photoresist or the like, so that the protective portion 420 has good insulation performance and can be easily patterned, which can reduce the process difficulty.

[0049] There are many optional ways to set up the substrate 100, such as Figure 3 As shown, the substrate 100 also includes a substrate and a pixel driving circuit. For example, the substrate 100 includes a substrate and a driving circuit layer and a planarization layer arranged on the substrate. The pixel driving circuit includes a transistor and a capacitor, the capacitor includes a first plate and a second plate, and the transistor includes a source, a drain, a gate and a semiconductor layer. The driving circuit layer also includes a plurality of signal lines, such as a data signal line, a scanning signal line, a driving power supply voltage signal line, etc. The driving circuit layer includes a plurality of conductive layers, the plurality of conductive layers include a first conductive layer, a second conductive layer and a third conductive layer, the gate and the first plate can be located in the first conductive layer, the second plate can be located in the second conductive layer, and the source and drain can be located in the third conductive layer.

[0050] Optional, reference Figure 4 The pixel driving circuit includes a driving transistor T1 and a switching transistor T2. The source of the switching transistor T2 is connected to a data line providing a data signal Data, the gate of the switching transistor T2 is connected to a scan line providing a scan signal Scan, the drain of the switching transistor T2 is connected to the gate of the driving transistor T1, the two ends of the storage capacitor C1 are respectively connected to the gate and source of the driving transistor T1, and the drain of the driving transistor T1 is connected to the light-emitting device. Figure 4 This is an embodiment of the pixel driving circuit. The pixel driving circuit of this application is not limited to Figure 4 The 2T1C pixel driving circuit shown may also be other pixel driving circuits, such as 7T1C, 8T1C pixel driving circuits, etc.

[0051] In some optional embodiments, the isolation structure 300 includes a first sublayer 301 and a second sublayer 302 stacked in a direction away from the substrate 100 , and the second sublayer 302 protrudes relative to the first sublayer 301 toward the isolation opening 310 .

[0052] In these optional embodiments, the isolation structure 300 includes a first sublayer 301 and a second sublayer 302. The second sublayer 302 is arranged to protrude relative to the first sublayer 301 toward the isolation opening 310, so that a recess can be formed under the second sublayer 302. During the preparation of the light-emitting unit 230, the light-emitting material can be broken at the edge of the second sublayer 302 to form independent light-emitting units 230.

[0053] Optionally, the isolation structure 300 further includes the aforementioned overlapping layer 303, which is located on the side of the first sub-layer 301 facing the substrate 100, and the overlapping layer 303 is provided to protrude relative to the first sub-layer 301 toward the isolation opening 310. During the preparation process of the isolation structure 300, when the first sub-layer 301 is side-etched, the overlapping layer 303 can provide protection for the film layer on the substrate 100 side.

[0054] Optionally, the first sub-layer 301 and the second sub-layer 302 are made of different materials, and the etching rate of the first sub-layer 301 is less than that of the second sub-layer 302. The material of the first sub-layer 301 includes a conductive material, and specifically can include at least one of aluminum (Al) and an aluminum alloy. The aluminum alloy can include at least one of an aluminum-neodymium alloy (AlNd), an aluminum-yttrium alloy (AlY), or an aluminum-silicon alloy (AlSi). The second sub-layer 302 can be a single-layer structure or a multi-layer structure. When the second sub-layer 302 is a single-layer structure, the material of the second sub-layer 302 can include at least one of titanium, titanium nitride, molybdenum, tungsten, a molybdenum-tungsten alloy, or a molybdenum-niobium alloy. When the second sub-layer 302 is a multi-layer structure, one layer of the second sub-layer 302 is made of at least one of titanium, titanium nitride, molybdenum, tungsten, a molybdenum-tungsten alloy, or a molybdenum-niobium alloy, and another layer of the second sub-layer 302 is made of a conductive oxide or an inorganic insulating material. The conductive oxide can be, for example, indium tin oxide (ITO) or indium zinc oxide (IZO).

[0055] Optionally, the material of the overlap layer 303 includes a conductive material, for example, the material of the overlap layer 303 can include at least one of molybdenum (Mo), titanium (Ti), titanium nitride (TiN), a molybdenum-tungsten alloy (MoW), or a molybdenum-niobium alloy (MoNb).

[0056] Optionally, the display panel further includes a second electrode layer 500, and the second electrode layer 500 includes a second electrode 510 located on the side of each light-emitting unit 230 away from the substrate 100. Optionally, the light-emitting device is composed of the first electrode 410, the light-emitting unit 230, and the second electrode 510. Optionally, the second electrode 510 is located in each isolation opening 310. Optionally, the second electrode 510 is electrically connected to the isolation structure 300. For example, the material of the first sub-layer 301 includes a conductive material, and the second electrode 510 is electrically connected to the first sub-layer 301. Alternatively, the materials of the first sub-layer 301 and the overlap layer 303 both include conductive materials, and the second electrode 510 is electrically connected to the overlap layer 303 and the first sub-layer 301.

[0057] Optionally, at least one light-emitting unit 230 includes, in the direction away from the substrate 100 (the thickness direction Z), a hole injection layer HIL, a hole transport layer HTL, an electron blocking layer EBL, a light-emitting material layer EML, a hole blocking layer HBL, an electron transport layer ETL, and an electron injection layer EIL, which are stacked in sequence. The light-emitting unit 230 can include one light-emitting material layer EML or a stacked light-emitting structure including multiple light-emitting material layers EML.

[0058] In the light emitting process of the light emitting unit 230, the first electrode 410 is used to generate holes, the second electrode 510 is used to generate electrons, and the holes and the electrons combine in the light emitting unit 230 to make the light emitting unit 230 emit light. The first electrode 410 is in contact with the light emitting unit 230, and part of the light emitting unit 230 can be overlapped with the isolation structure 300, which can cause the holes to be crosstalked between adjacent light emitting units 230 through the light emitting unit 230 and the isolation structure 300. In the embodiment of the present application, the pixel defining part 210 is provided with a recess, which can cause at least part of the light emitting unit 230 to be broken at the recess, thereby reducing the transmission area of the holes and improving the problem of lateral crosstalk.

[0059] In order for the light emitting unit 230 to emit light, a pixel voltage is provided to the first electrode 410 and a common voltage is provided to the second electrode 510, and a potential difference is formed between the first electrode 410 and the second electrode 510, so that the light emitting structure provided between the first electrode 410 and the second electrode 510 emits light. In one embodiment, if a potential difference is formed between the first electrode 410 and the second electrode 510 of the light emitting unit 230, the light emitting material layer EML of the light emitting unit 230 emits light.

[0060] The pixel voltage of the first electrode 410 is provided by the pixel driving circuit, and the common voltage of the second electrode 510 is provided by the isolation structure 300. Specifically, the second electrode 510 is electrically connected to the isolation structure 300, and the common voltage is supplied to the second electrode 510 by providing the common voltage to the isolation structure 300. That is, the isolation structure 300 has the function of supplying the common voltage to the second electrode 510.

[0061] In some optional embodiments, as shown in Figure 3 The display panel further includes a second electrode layer 500, the second electrode layer 500 includes a plurality of second electrodes 510, and the second electrodes 510 are located on the side of the corresponding light emitting unit 230 away from the substrate 100. The light emitting unit 230 has a second edge part, the second edge part covers the edge segment 411a and is in contact with the first edge part. The second electrode 510 has a third edge part, the third edge part covers the second edge part and is in contact with the first sub-layer 301. The second edge part is spaced from the lap joint layer 303 by the first edge part, and the second edge part is spaced from the first sub-layer 301 by the third edge part.

[0062] In these optional embodiments, a first insulating part 710 is provided between the lap joint layer 303 and the first conductive sub-layer 411, and the light emitting unit 230 is provided between the first conductive sub-layer 411 and the second electrode 510. The light emitting unit 230 covers the edge segment 411a, which can improve the problem of short circuit connection between the second electrode 510 and the first conductive sub-layer 411.

[0063] In other optional embodiments, such as Figure 5 As shown, the display panel further includes a second insulating portion 720 , and the second insulating portion 720 covers at least a portion of a surface of the edge segment 411 a facing away from the substrate 100 .

[0064] In these optional embodiments, a second insulating portion 720 is provided on the side of the edge segment 411a facing away from the substrate 100. The second insulating portion 720 can cover at least a portion of the surface of the edge segment 411a facing away from the substrate 100. When the above-mentioned second electrode 510 is subsequently prepared, the second electrode 510 can fall on the second insulating portion 720, thereby improving the problem of short circuit connection between the first electrode 410 and the second electrode 510.

[0065] There are many ways to set the shape of the first insulating portion 710 and the second insulating portion 720. For example, the edge segment 411a is formed in a closed ring around the pixel opening 220, and the first insulating portion 710 is formed in a closed ring around the pixel opening 220, so that the first insulating portion 710 is correspondingly provided under the edge segments 411a at different positions around the pixel opening 220, which can improve the problem of short circuit connection between the edge segments 411a at different positions and the overlapping layer 303.

[0066] Optionally, the second insulating portion 720 forms a closed ring around the pixel opening 220 , so that the edge segments 411 a at different positions around the pixel opening 220 are all covered with the second insulating portion 720 , thereby improving the short circuit problem between the edge segments 411 a at different positions and the second electrode 510 .

[0067] There are many ways to set the material of the pixel definition layer 200. For example, the material of the pixel definition layer 200 is an inorganic material, such as the pixel definition layer 200 is formed using at least one inorganic insulating material selected from silicon nitride (SiNx), silicon oxide (SiOx), and silicon oxynitride (SiON). Figure 3 and Figure 5 As shown, the pixel definition layer 200 may be a single-layer structure.

[0068] In one embodiment, Figure 6 As shown, the pixel definition layer 200 includes multiple sub-layers, and the pixel definition layer 200 includes a first definition layer 201 and a second definition layer 202 stacked in sequence in a direction away from the substrate 100, that is, the pixel definition layer 200 can adopt a double-layer design.

[0069] Exemplarily, the film-forming property of the first definition layer 201 is better than that of the second definition layer 202. That is, under the condition of equal thickness, the first definition layer 201 can better cover the step structure formed by the first electrode 410 than the second definition layer 202, and no crack is generated. Conversely, to obtain the same step coverage effect, the thickness of the first definition layer 201 is required to be thinner than that of the second definition layer 202, that is, the thickness requirement of the first definition layer 201 is relatively low, which is beneficial to product thinning. In addition, good film-forming property means that the formed film has good coverage and is more compact, which is more conducive to water vapor isolation. That is, the material density of the first definition layer 201 is greater than that of the second definition layer 202.

[0070] Exemplarily, the etching resistance of the second definition layer 202 is better than that of the first definition layer 201. Since the side of the pixel definition layer 200 away from the substrate 100 will be etched during the preparation of the display panel, by selecting a material with stronger etching resistance as the second definition layer 202, the etching resistance of the pixel definition layer 200 can be improved, and the reliability of the display panel is further improved.

[0071] Exemplarily, the materials of the first definition layer 201 and the second definition layer 202 are different. For example, the material of the first definition layer 201 includes silicon nitride, and the material of the second definition layer 202 includes silicon oxide.

[0072] Exemplarily, the thickness of the first definition layer 201 is greater than or equal to 1000 microns and less than or equal to 5000 microns. For example, the thickness of the first definition layer 201 is 1000 microns, 2000 microns, 3000 microns, 4000 microns, 5000 microns, etc.

[0073] Exemplarily, the thickness of the second definition layer 202 is greater than or equal to 500 microns and less than or equal to 3000 microns. For example, the thickness of the second definition layer 202 is 500 microns, 1000 microns, 2000 microns, 3000 microns, etc.

[0074] In some optional embodiments, when the display panel includes the second electrode layer 500 described above, the second electrode layer 500 includes the second electrode 510 located on the side of the light-emitting unit 230 away from the substrate 100, and the second electrode 510 and the isolation structure 300 are electrically connected in various manners. For example, as shown in FIG. 6A, the second electrode 510 and the isolation structure 300 are electrically connected through a conductive material 610. Figure 3 and Figure 5As shown, a clearance gap 730 is provided between the first insulating portion 710, the second insulating portion 720, and the first sub-layer 301, and the second electrode 510 covers the portion of the bonding layer 303 exposed by the clearance gap 730. This allows the second electrode 510 to be electrically connected to the isolation structure 300 through the bonding layer 303. In this case, the second electrode 510 may only cover at least the portion of the bonding layer 303 exposed by the clearance gap 730, or the second electrode 510 may extend from the clearance gap 730 to the first sub-layer 301, and the second electrode 510 may also cover at least a portion of the surface of the first sub-layer 301 facing the isolation opening 310.

[0075] In other optional embodiments, such as Figure 7 As shown, the second insulating part 720 and / or the first insulating part 710 can completely cover the overlapping layer 303 not covered by the first sub-layer 301. For example, at least one of the first insulating part 710 and the second insulating part 720 is in contact with the first sub-layer 301. At this time, the second electrode 510 can directly extend from the side of the second insulating part 720 and / or the first insulating part 710 away from the substrate 100 to the first sub-layer 301 and be electrically connected to the first sub-layer 301.

[0076] In some optional embodiments, the density of the first insulating portion 710 is greater than the density of the pixel defining portion 210 , and / or the density of the second insulating portion 720 is greater than the density of the pixel defining portion 210 .

[0077] In these optional embodiments, the first insulating part 710 and / or the second insulating part 720 have a high density, and the first insulating part 710 and / or the second insulating part 720 can be prepared and formed using atomic layer deposition technology (ALD), so that the first insulating part 710 and / or the second insulating part 720 have good density and improve their insulation performance.

[0078] In some optional embodiments, since the first insulating part 710 and / or the second insulating part 720 are prepared using atomic layer deposition technology, the film thickness of the first insulating part 710 and / or the second insulating part 720 can be precisely controlled. In some preferred embodiments, the film thickness of the first insulating part 710 is smaller than the film thickness of the overlapping layer 303, and / or the film thickness of the second insulating part 720 is smaller than the film thickness of the overlapping layer 303.

[0079] In these optional embodiments, the film thickness of the first insulating portion 710 and / or the second insulating portion 720 is less than the film thickness of the lap joint layer 303, so that the first insulating portion 710 and / or the second insulating portion 720 can better cover the lap joint layer 303, and the first insulating portion 710 and / or the second insulating portion 720 can more densely wrap the lap joint layer 303. In addition, because the film thickness of the first insulating portion 710 and / or the second insulating portion 720 is less than the film thickness of the lap joint layer 303, the added first insulating portion 710 and / or the second insulating portion 720 can also avoid affecting the continuity of the cathode lap joint due to the thickness. That is, the film thickness of the first insulating portion 710 and / or the second insulating portion 720 is less than the film thickness of the lap joint layer 303, which can make the cathode more continuously lap to the lap joint layer 303.

[0080] The second insulating portion 720 can be arranged in various ways. For example, the second insulating portion 720 can only cover the surface of the first conductive sub-layer 411 away from the substrate 100.

[0081] Alternatively, in other optional embodiments, the second insulating portion 720 covers the surface of the edge segment 411a away from the substrate 100 and the side surface of the edge segment 411a towards the first sub-layer 301.

[0082] Optionally, the first conductive sub-layer 411 includes a first top surface away from the substrate 100, a first bottom surface towards the substrate 100, and a first side surface connecting the first top surface and the first bottom surface.

[0083] In these optional embodiments, the second insulating portion 720 not only covers the corresponding first top surface of the edge segment 411a, but also covers the first side surface of the edge segment 411a towards the first sub-layer 301, which can better ensure that the second electrode 510 and the first electrode 410 are not short-circuited.

[0084] Optionally, the second insulating portion 720 extends to the surface of the first insulating portion 710 away from the substrate 100, and the edge of the first insulating portion 710 away from the pixel opening 220 is located on one side of the second insulating portion 720 away from the pixel opening 220.

[0085] In these optional embodiments, the end of the second insulating portion 720 extends to the first insulating portion 710, and the second insulating portion 720 and the first insulating portion 710 can better wrap the first conductive sub-layer 411, and better improve the short-circuit connection problem between the first conductive sub-layer 411 and the lap joint layer 303 of the isolation structure 300 and the second electrode 510.

[0086] Optionally, the edge of the first insulating portion 710 extends to the side of the end of the second insulating portion 720 facing the first sub-layer 301 of the isolation structure 300, so as to ensure that the end of the second insulating portion 720 can be lapped on the surface of the first insulating portion 710 away from the substrate 100.

[0087] When the display panel includes the first insulating portion 710 and the second insulating portion 720 described above, there are various ways to arrange the relative positions of the light emitting unit 230, the first insulating portion 710, and the second insulating portion 720. For example, as shown in FIG. 7A, the first insulating portion 710 and / or the second insulating portion 720 can be arranged around the light emitting unit 230 and spaced apart from the edge of the light emitting unit 230. Figure 8

[0088] In other optional embodiments, as shown in FIG. 7B, the orthographic projection edge of the light emitting unit 230 is located within the orthographic projection of the second insulating portion 720 on the substrate 100, or, as shown in FIG. 7C, the light emitting unit 230 is located on the side of the second insulating portion 720 facing the pixel opening 220. Figure 7 Figure 8

[0089] In these optional embodiments, the orthographic projection edge of the light emitting unit 230 is located within the orthographic projection of the second insulating portion 720 on the substrate 100, i.e., the edge of the light emitting unit 230 itself is located on the second insulating portion 720, which can improve the problem of the contact between the light emitting unit 230 and the isolation structure 300 causing the lateral crosstalk of carriers. Alternatively, the light emitting unit 230 is located on the side of the second insulating portion 720 facing the pixel opening 220, i.e., the second insulating portion 720 is arranged around the light emitting unit 230, which can also improve the problem of the contact between the light emitting unit 230 and the isolation structure 300 causing the lateral crosstalk of carriers.

[0090] There are various ways to arrange the distribution of the first insulating portion 710. The first insulating portion 710 can cover only the lapping layer 303, for example, the first insulating portion 710 covers at least part of the top surface of the lapping layer 303 away from the substrate 100 and the side surface of the lapping layer 303 facing the isolation opening 310. Alternatively, the first insulating portion 710 covers at least part of the lapping layer 303 and at least part of the pixel defining portion 210 away from the substrate 100. The larger the distribution area of the first insulating portion 710, the better it can improve the problem of short-circuit connection between the first conductive sub-layer 411 and the isolation structure 300.

[0091] ​​​The present embodiment of the present application is described using an example in which the first insulating portion 710 covers at least a portion of the overlapping layer 303 and at least a portion of the top surface of the pixel defining portion 210 facing away from the substrate 100. When the first insulating portion 710 covers at least a portion of the overlapping layer 303 and at least a portion of the top surface of the pixel defining portion 210 facing away from the substrate 100, a stepped surface is formed on the surface of the first insulating portion 710 facing away from the substrate 100 due to the presence of a stepped surface between the overlapping layer 303 and the pixel defining portion 210. This, in turn, results in a stepped surface formed on the surface of the edge segment 411a covering the first insulating portion 710 and a stepped surface formed on the surface of the second insulating portion 720 covering the edge segment 411a.

[0092] In some optional embodiments, such as Figure 5 As shown, the surface of the second insulating portion 720 facing away from the substrate 100 includes a first sub-surface 721, a second sub-surface 722, and a third sub-surface 723 connected between the first sub-surface and the second sub-surface 722 and extending along the display panel thickness direction Z. In these optional embodiments, the surface of the second insulating portion 720 facing away from the substrate 100 is stepped and includes the first sub-surface 721, the second sub-surface 722, and the third sub-surface 723.

[0093] When the second insulating portion 720 includes a first sub-surface 721, a second sub-surface 722, and a third sub-surface 723, the light-emitting unit 230 is located on the side of the third sub-surface 723 facing the pixel opening 220, or the second sub-surface 722 is located on the side of the third sub-surface 723 facing away from the pixel opening 220, and the edge of the orthographic projection of the light-emitting unit 230 on the substrate 100 is located within the orthographic projection of the second sub-surface 722 on the substrate 100. That is, the edge of the light-emitting unit 230 is located on the second insulating portion 720, which can improve the problem of lateral carrier crosstalk caused by the contact between the light-emitting unit 230 and the isolation structure 300.

[0094] In some optional embodiments, the first conductive sublayer 411 includes a central segment 411c and a transition segment 411b surrounding the central segment 411c, the edge segment 411a is connected to the side of the transition segment 411b facing away from the central segment 411c, the transition segment 411b covers the side surface of the pixel defining portion 210 facing the pixel opening 220, and at least part of the edge segment 411a is located between the first insulating portion 710 and the second insulating portion 720.

[0095] In these optional embodiments, the first conductive sub-layer 411 can be electrically connected to the second conductive sub-layer 412 through the central segment 411c, the transition segment 411b is located in the pixel opening 220 and covers the side surface of the pixel defining portion 210 facing the pixel opening 220, and the transition segment 411b can also be in contact with the light emitting unit 230, which can improve the effective light emitting area of the light emitting unit 230. The edge segment 411a is connected to the transition segment 411b away from the central segment 411c, and the edge segment 411a can further improve the distribution area of the first conductive sub-layer 411.

[0096] Optionally, the first insulating portion 710 extends to the edge of the pixel opening 220, and the transition segment 411b also covers the surface of the first insulating portion 710 facing the pixel opening 220, which can further increase the distribution area of the transition segment 411b and increase the distribution area of the first insulating portion 710. The first insulating portion 710 can extend to the edge of the pixel opening 220.

[0097] In some optional embodiments, referring to the above, the first insulating portion 710 can only cover the lap joint layer 303. Alternatively, the first insulating portion 710 also covers part of the pixel defining portion 210 to increase the distribution area of the first insulating portion 710, for example, the first insulating portion 710 extends to the edge of the pixel opening 220 to further increase the distribution area of the first insulating portion 710.

[0098] In some optional embodiments, when the isolation structure 300 includes the first sub-layer 301 and the second sub-layer 302 described above, the first insulating portion 710 partially overlaps the second sub-layer 302 on the substrate 100 to increase the distribution area of the first insulating portion 710, so that the first insulating portion 710 can cover more area of the lap joint layer 303, and better improve the short circuit connection problem between the first conductive sub-layer 411 and the lap joint layer 303.

[0099] In some optional embodiments, the plurality of light emitting units 230 include first, second, and third light emitting units with different light emitting colors, and the film thickness of the first conductive sub-layer 411 corresponding to at least two of the first, second, and third light emitting units is different. So that light emitting units 230 of different colors are correspondingly provided with different microcavity effects, which can better improve the light emitting efficiency.

[0100] In some optional embodiments, the first electrode 410 can include the first conductive sub-layer 411, the second conductive sub-layer 412 and the protective portion 420 as described above. Optionally, the protective portion 420 is arranged flush with respect to the edge of the pixel opening 220 and the edge of the second conductive sub-layer 412. Here, flush is not strictly geometrically flush, for example, the distance between the edge of the protective portion 420 facing away from the pixel opening 220 and the edge of the second conductive sub-layer 412 is less than or equal to 2 microns, and the protective portion 420 can be considered to be flush with respect to the edge of the pixel opening 220 and the edge of the second conductive sub-layer 412, so that the edge of the protective portion 420 facing away from the pixel opening 220 and the edge of the second conductive sub-layer 412 can be formed in the same process step.

[0101] The display panel further includes a first encapsulation layer 610, as shown in Figure 3 The first encapsulation layer 610 includes a plurality of encapsulation portions 610a, which are located on the side of the second electrode 510 facing away from the substrate 100 and extend to the side of the isolation structure 300 facing away from the substrate 100 through the side wall of the isolation structure 300.

[0102] For example, as shown in Figure 9 and Figure 10 The encapsulation portion 610a includes a first segment and a second segment connected to each other, the first segment is located on the side of the light emitting unit 230 facing away from the substrate 100 and is arranged in the isolation opening 310, and the second segment is located on the side of the isolation structure 300 facing the isolation opening 310. The side surface of the first segment facing away from the substrate 100 and the side surface of the second segment facing away from the isolation structure 300 are at least partially connected to each other to enclose a gap space.

[0103] For example, as shown in Figure 3 The side surface of the first segment facing away from the substrate 100 and the side surface of the second segment facing away from the isolation structure 300 can also not be connected.

[0104] As shown in Figure 3 The display panel further includes a second encapsulation layer 620 and a third encapsulation layer 630, the second encapsulation layer 620 covers the isolation structure 300 and the encapsulation portion 610a, and the third encapsulation layer 630 covers the second encapsulation layer 620. The first encapsulation layer 610 and the third encapsulation layer 630 are both inorganic materials, and the materials of the first encapsulation layer 610 and the third encapsulation layer 630 include at least one of silicon nitride (SiN), silicon oxide (SiO), and silicon oxynitride (SiON). The second encapsulation layer 620 is an organic insulating material, such as an epoxy resin, an acrylic resin, or the like. The second encapsulation layer 620 and the third encapsulation layer 630 are continuously arranged at least on the display area AA as a whole, and a part thereof is also arranged in the non-display area NA.

[0105] The display panel 10 can further include at least one film layer such as a touch layer, a polarizer, a color film substrate 100, a protective cover plate, etc. The film layer can be bonded to the display panel via an adhesive layer such as an optical clear adhesive (OCA).

[0106] As shown in Figures 1 to 10 The display panel provided by the embodiment of the first aspect of the present application further includes a substrate 100, a pixel definition layer 200 arranged on one side of the substrate 100 and including a pixel limiting portion 210 and a plurality of pixel openings 220, the plurality of pixel openings 220 being arranged in an array, a first electrode layer 400 arranged on one side of the substrate 100 and including a plurality of first electrodes 410 arranged at intervals, the first electrodes 410 including at least a first conductive sub-layer 411 located in the corresponding pixel opening 220, and a plurality of light emitting units 230 located on the side of the corresponding first electrode 410 away from the substrate 100. The first conductive sub-layer 411 includes an edge segment 411a covering the edge of the pixel limiting portion 210 away from the top surface of the substrate 100, and the edge segment 411a is covered with a second insulating portion 720 on the side thereof away from the substrate 100.

[0107] In the display panel provided by the embodiment of the present application, the display panel includes a substrate 100, a first electrode layer 400, and a pixel definition layer 200. The first electrode 410 of the first electrode layer 400 and the pixel opening 220 of the pixel definition layer 200 are arranged correspondingly, so that the first electrode 410 can be connected to the light emitting unit 230 in the pixel opening 220, and the first electrode 410 can drive the light emitting unit 230 in the pixel opening 220 to emit light for display. The first electrode 410 includes a first conductive sub-layer 411, and the edge segment 411a of the first conductive sub-layer 411 is covered with a second insulating portion 720. When a second electrode 510 is prepared subsequently, the short circuit connection problem between the second electrode 510 and the first conductive sub-layer 411 can be improved, thereby improving the process performance and use performance of the display panel.

[0108] The display panel provided by the embodiment of the present application and the display panel of any of the above embodiments can be cross-referenced to each other, and the repeated parts will not be described here.

[0109] When the edge segment 411a is provided with the second insulating portion 720 and the display panel includes the isolation structure 300 described above, the edge segment 411a and the lap joint layer 303 can be arranged in a mutually insulating manner in multiple ways, for example, the edge segment 411a and the lap joint layer 303 are arranged at intervals, so that the first conductive sub-layer 411 and the isolation structure 300 are arranged in a mutually insulating manner, thereby improving the short circuit connection problem of the first electrode 410 and the isolation structure 300.

[0110] Optionally, when the edge segment 411a and the overlap layer 303 of the isolation structure 300 are spaced apart, the second insulating portion 720 can cover the top surface of the edge segment 411a away from the substrate 100 and the side surface of the edge segment 411a towards the isolation structure 300, so that the pixel defining portion 210 and the second insulating portion 720 can better wrap the edge segment 411a and better improve the short circuit connection between the edge segment 411a and the second electrode 510, the isolation structure 300.

[0111] Alternatively, in some other optional embodiments, the display panel further comprises the first insulating portion 710 described above, the first insulating portion 710 covers at least part of the overlap layer 303, and at least part of the edge segment 411a is located on the side of the first insulating portion 710 away from the substrate 100, so as to improve the problem of short circuit connection between the first conductive sub-layer 411 and the isolation structure 300.

[0112] Embodiments of the second aspect of the present application also provide a preparation method of a display panel, which can be the display panel provided in any of the embodiments of the first aspect described above. Please refer to Figures 1 to 11 , the preparation method of the display panel comprises: Step S01: as shown in Figure 11a , a second conductive material layer and a protective material layer are arranged on one side of the substrate 100, and the second conductive material layer and the protective material layer are subjected to a patterning process to form a plurality of second conductive sub-layers 412 spaced apart and a preliminary protective portion located on the side of the second conductive sub-layers 412 away from the substrate 100.

[0113] Step S02: as shown in Figure 11b , a pixel defining material layer and an isolation structure 300 material layer are arranged on the side of the second conductive sub-layers 412 away from the substrate 100, and the isolation structure 300 material layer is subjected to a patterning process to form the isolation structure 300, the isolation structure 300 encloses the isolation opening 310, and the isolation structure 300 comprises the overlap layer 303 and the first sub-layer 301 arranged in a stacked manner away from the substrate 100, and the overlap layer 303 is arranged protruding towards the isolation opening 310 relative to the first sub-layer 301.

[0114] Step S03: as shown in Figure 11cAs shown, a first insulating material layer is disposed on a side of the pixel definition material layer and the isolation structure 300 away from the substrate 100, and the pixel definition material layer and the first insulating material layer are subjected to a patterning process to form a pixel definition layer 200 and a first preliminary insulating portion, the pixel definition layer 200 includes a pixel limiting portion 210 and a pixel opening 220, the first preliminary insulating portion encloses a first preliminary opening in communication with the pixel opening 220, and the first preliminary insulating portion covers at least part of the isolation structure 300.

[0115] Step S04: As shown, Figure 11d a first conductive material layer is disposed on a side of the first preliminary insulating portion, the pixel definition layer 200 and the isolation structure 300 away from the substrate 100, and the first conductive material layer is subjected to a patterning process to form a first conductive sub-layer 411, the first conductive sub-layer 411 includes a center segment 411c located at the center of the pixel opening 220, an edge segment 411a located at an edge of the pixel limiting portion 210 away from the top surface of the substrate 100, and a transition segment 411b connecting the center segment 411c and the edge segment 411a, and the edge segment 411a is located on a side of the first preliminary insulating portion away from the substrate 100.

[0116] In the preparation method of the display panel provided in the embodiments of the present application, first, the second conductive sub-layer 412 and the preliminary protection portion are prepared by disposing the second conductive material layer and the protection material layer in step S01, and the preliminary protection portion can completely cover the second conductive sub-layer 412 to provide protection for the second conductive sub-layer 412. Then, the isolation structure 300 is prepared in step S02, which can be used to prepare the light emitting unit 230, so that the light emitting material is broken into independent light emitting units 230. Then, the pixel definition layer 200 and the first preliminary insulating portion are prepared in step S03, and when the first conductive sub-layer 411 is prepared in step S04, the first preliminary insulating portion covers the isolation structure 300, which can improve the short circuit connection problem of the first conductive sub-layer 411 and the isolation structure 300.

[0117] There are many ways to pattern the pixel definition material layer, the first insulating material layer and the preliminary protection portion in step S03, and in some optional embodiments, as shown, Figure 12 Step S03 includes: Step S031: As shown, Figure 12a the pixel definition material layer and the preliminary protection portion are subjected to a patterning process to form the pixel definition layer 200 and a protection portion 420, the protection portion 420 is located between the second conductive sub-layer 412 and the pixel limiting portion 210 and is arranged around the pixel opening 220.

[0118] Step S032: AsFigure 11c As shown, a first insulating material layer is provided on a side of the pixel definition layer 200 and the isolation structure 300 away from the substrate 100 , and the first insulating material layer is patterned to form the first preliminary insulating portion.

[0119] In these optional embodiments, before setting the first insulating material layer, the pixel definition material layer and the preliminary protective portion can be patterned to form the pixel definition layer 200 and the protective portion 420, and then the first insulating material layer is set and the first insulating material layer is patterned to form the first preliminary insulating portion.

[0120] In other optional embodiments, such as Figure 13 As shown, step S03 includes: Step S031': Figure 13a As shown, a first insulating material layer is provided on the side of the pixel definition material layer and the isolation structure 300 facing away from the substrate 100 .

[0121] Step S032': Figure 11c As shown, the preliminary protection portion, the pixel definition material layer and the first insulating material layer are patterned to form a protection portion 420, the pixel definition layer 200 and the first preliminary insulating portion, and the protection portion 420 is located between the second conductive sublayer 412 and the pixel defining portion 210 and is arranged around the pixel opening 220.

[0122] In these optional embodiments, before the pixel definition material layer and the preliminary protective portion are patterned, a first insulating material layer is first set through step S031', and then the preliminary protective portion, the pixel definition material layer and the first insulating material layer are patterned at the same time in step S032', so that the preliminary protective portion forms the protective portion 420, the pixel definition material layer forms the pixel definition layer 200, and the first insulating material layer forms the first preliminary insulating portion, which can simplify the preparation process of the display panel and improve the preparation efficiency of the display panel.

[0123] In some optional embodiments, such as Figure 14 As shown, after step S04, the following steps may also be included: Step S05: Figure 14a As shown, a second insulating material layer is provided on the side of the first conductive sublayer 411 facing away from the substrate 100, and the second insulating material layer and the first preliminary insulating portion are patterned to form a second insulating portion 720 and a first insulating portion 710, wherein the first insulating portion 710 covers a portion of the pixel defining portion 210 and a portion of the first insulating portion 710 of the overlapping layer 303, and the second insulating portion 720 covers at least a portion of the surface of the side of the edge segment 411a facing away from the substrate 100.

[0124] In the optional embodiments, after step S04, a second insulating portion 720 is further formed by step S05, and the first preliminary insulating portion covering the isolation structure 300 is removed to form the first insulating portion 710 when the second insulating portion 720 is formed, for example, the first preliminary insulating portion covering the first sub-layer 301 and the second sub-layer 302 of the isolation structure 300 is removed to form the first insulating portion 710 covering at least part of the lapping layer 303. On the one hand, the short circuit connection problem of the first electrode 410 and the second electrode 510 can be improved by adding the second insulating portion 720, and on the other hand, the first preliminary insulating portion covering the isolation structure 300 is removed when the second insulating material layer is patterned, which can simplify the preparation process of the display panel.

[0125] In other optional embodiments, the display panel can not include the second insulating portion 720, and then after step S04, the first preliminary insulating portion can be patterned to form the first insulating portion 710, and the first insulating portion 710 covers part of the lapping layer 303 to improve the short circuit connection problem between the first conductive sub-layer 411 and the lapping layer 303.

[0126] Embodiments of the third aspect of the present application further provide a display device, which includes the display panel of any one of the first aspect embodiments or the display panel prepared by any one of the second aspect embodiments. Since the display device of the present application includes the display panel of any one of the first aspect embodiments or the display panel prepared by any one of the second aspect embodiments, the display device of the present application has the beneficial effects of the display panel of any one of the first aspect embodiments or the display panel prepared by any one of the second aspect embodiments, which will not be described here.

[0127] The display device in the embodiments of the present application includes but is not limited to mobile phones, personal digital assistants (PDA), tablet computers, e-books, televisions, access control systems, smart fixed-line phones, consoles and other devices with display functions.

[0128] The technical features of the above embodiments can be combined in any manner. To make the description concise, not all possible combinations of the technical features in the above embodiments are described, however, as long as the combinations of the technical features do not exist contradictions, they should be considered as the scope of the present application.

[0129] The above embodiments only express several implementation manners of the present application, which are described in a more specific and detailed manner, but should not be understood as a limitation on the patent scope of the present application. It should be noted that, for those skilled in the art, several modifications and improvements can be made without departing from the concept of the present application, which all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.

[0130] Although the present application has been described with reference to the preferred embodiments, various modifications and replacements can be made to it without departing from the scope of the present application, and the components therein can be replaced with equivalents. In particular, the technical features mentioned in each embodiment can be combined in any manner as long as there is no structural conflict. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A display panel, characterized in that: include: substrate; A pixel definition layer is provided on one side of the substrate and includes a pixel defining portion and a plurality of pixel openings, wherein the plurality of pixel openings are distributed in an array; an isolation structure disposed on a side of the pixel definition layer facing away from the substrate and enclosing an isolation opening, the isolation opening being in communication with the corresponding pixel opening, the isolation structure comprising an overlap layer and a first sublayer stacked in a direction away from the substrate, the overlap layer protruding relative to the first sublayer toward the isolation opening; a first insulating portion covering at least a portion of a surface of the overlapping layer facing away from the substrate and a side of the overlapping layer facing the isolation opening, and having a first edge portion located on a side of the overlapping layer facing away from the substrate; a first electrode layer disposed on one side of the substrate and comprising a plurality of first electrodes spaced apart from each other, the first electrodes comprising at least a first conductive sublayer located within the corresponding pixel opening, the first conductive sublayer extending along a sidewall of the pixel opening and having an edge segment located on a side of the first insulating portion facing away from the substrate; a plurality of light-emitting units, each of the light-emitting units being located on a side of the corresponding first electrode facing away from the substrate; The distance between the edge segment and the first sub-layer is greater than the distance between the first edge portion and the first sub-layer.

2. The display panel according to claim 1, wherein: The display panel further includes a second electrode layer, the second electrode layer including a plurality of second electrodes, and the second electrodes are located on a side of the corresponding light-emitting unit facing away from the substrate, wherein: The light emitting unit has a second edge portion, the second edge portion covers the edge segment and contacts the first edge portion; The second electrode has a third edge portion, the third edge portion covers the second edge portion and contacts the first sublayer; The second edge portion is separated from the overlapping layer by the first edge portion, and the second edge portion is separated from the first sub-layer by the third edge portion.

3. The display panel according to claim 1, wherein: Also includes: A second insulating portion covers at least a portion of a side surface of the edge segment facing away from the substrate, and the second insulating portion covers a side surface of the edge segment facing the isolation opening.

4. The display panel according to claim 3, wherein: The second insulating portion surrounds the pixel opening in a closed ring shape; and / or the first insulating portion surrounds the pixel opening in a closed ring shape.

5. The display panel according to claim 3, wherein: It also includes a second electrode layer, wherein the second electrode layer includes a second electrode located on a side of the light-emitting unit away from the substrate, wherein: A clearance gap is provided between the first insulating portion and the second insulating portion and the first sublayer, and the second electrode covers the overlapping layer exposed by the clearance gap; and / or, At least one of the first insulating portion and the second insulating portion is in contact with the first sub-layer, and the second electrode covers at least a portion of a surface of the first sub-layer facing the isolation opening.

6. The display panel according to claim 3, wherein: The density of the first insulating portion is greater than the density of the pixel defining portion, and / or the density of the second insulating portion is greater than the density of the pixel defining portion.

7. The display panel according to claim 3, wherein: The thickness of the first insulating portion is smaller than the thickness of the overlapping layer, and / or the thickness of the second insulating portion is smaller than the thickness of the overlapping layer.

8. The display panel according to claim 3, wherein: The light emitting unit is located within the orthographic projection of the second insulating portion on the substrate at an edge of the orthographic projection of the substrate, or the light emitting unit is located on a side of the second insulating portion facing the pixel opening.

9. The display panel according to claim 8, wherein: The surface of the second insulating portion facing away from the substrate includes a first sub-surface, a second sub-surface, and a third sub-surface connected between the first sub-surface and the second sub-surface and extending along the thickness direction of the display panel. The light-emitting unit is located on the side of the third sub-surface facing the pixel opening, or the second sub-surface is located on the side of the third sub-surface away from the pixel opening, and the edge of the orthographic projection of the light-emitting unit on the substrate is located within the orthographic projection of the second sub-surface on the substrate.

10. The display panel according to claim 3, wherein: The first conductive sublayer includes a central segment and a transition segment surrounding the central segment, the edge segment is connected to the side of the transition segment facing away from the central segment, the transition segment covers the side surface of the pixel defining portion facing the pixel opening, and at least part of the edge segment is located between the first insulating portion and the second insulating portion.

11. The display panel according to claim 10, wherein: The first insulating portion extends to an edge of the pixel opening, and the transition segment further covers a surface of the first insulating portion facing the pixel opening.

12. The display panel according to claim 1, wherein The first insulating portion extends to the edge of the pixel opening and covers a portion of the pixel defining portion.

13. The display panel according to claim 1, wherein The isolation structure also includes a second sublayer located on the side of the first sublayer away from the substrate, the second sublayer is protruding toward the isolation opening relative to the first sublayer, and the orthographic projection of the first insulating part on the substrate and the orthographic projection of the second sublayer on the substrate partially overlap.

14. The display panel according to claim 1, wherein The plurality of light-emitting units include a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit emitting light of different colors, and at least two of the first light-emitting unit, the second light-emitting unit, and the third light-emitting unit correspond to the first conductive sublayer with different film thicknesses.

15. The display panel according to claim 1, wherein The first electrode further includes a second conductive sublayer located on a side of the first conductive sublayer facing the substrate, and a third conductive sublayer located on a side of the second conductive sublayer facing the substrate, a portion of the second conductive sublayer is in contact with and connected to the first conductive sublayer, another portion of the second conductive sublayer is located between the pixel defining portion and the substrate, and an orthographic projection of the third conductive sublayer on the substrate overlaps with an orthographic projection of the second conductive sublayer on the substrate. The materials of the first conductive sublayer and the third conductive sublayer include metal oxide, and the material of the second conductive sublayer includes metal.

16. The display panel according to claim 15, wherein: A protection portion is provided between the second conductive sublayer and the pixel defining portion. The material of the protection portion includes an insulating material. The protection portion is provided around the pixel opening.

17. A display panel, characterized in that: include: substrate; A pixel definition layer is provided on one side of the substrate and includes a pixel defining portion and a pixel opening, wherein a plurality of the pixel openings are distributed in an array, and the pixel openings are used to accommodate light-emitting units; a first electrode layer, disposed on one side of the substrate and comprising a plurality of first electrodes distributed at intervals, wherein the first electrodes at least include a first conductive sublayer located in the corresponding pixel opening; A plurality of light-emitting units are located on the side of the corresponding first electrode facing away from the substrate; wherein the first conductive sublayer includes an edge segment covering the pixel defining portion facing away from the top surface of the substrate, and the side of the edge segment facing away from the substrate is covered with a second insulating portion.

18. The display panel according to claim 17, wherein: Also includes: An isolation structure is provided on one side of the substrate and encloses an isolation opening, the isolation structure comprising a lap joint layer and a first sub-layer stacked in a direction away from the substrate, the lap joint layer protruding toward the isolation opening relative to the first sub-layer, The edge segment and the overlapping layer are spaced apart, and the second insulating portion covers the surface of the edge segment facing away from the substrate and the side surface of the edge segment facing the isolation structure; Alternatively, the method further includes a first insulating portion, wherein the first insulating portion covers at least a portion of the overlapping layer, and at least a portion of the edge segments is located on a side of the first insulating portion facing away from the substrate.

19. The display panel according to claim 18, wherein: Also includes: The second electrode layer includes a second electrode located on a side of the light emitting unit away from the substrate. A clearance gap is provided between the first insulating portion, the second insulating portion and the first sub-layer, and the second electrode covers the overlapping layer exposed by the clearance gap.

20. A method for preparing a display panel, characterized in that: include: Disposing a second conductive material layer and a protective material layer on one side of the substrate, and patterning the second conductive material layer and the protective material layer to form a plurality of spaced-apart second conductive sublayers and a preliminary protective portion located on a side of the second conductive sublayer facing away from the substrate; A pixel definition material layer and an isolation structure material layer are provided on a side of the second conductive sublayer facing away from the substrate, and the isolation structure material layer is patterned to form an isolation structure, wherein the isolation structure encloses an isolation opening, and the isolation structure includes an overlap layer and a first sublayer stacked in a direction away from the substrate, wherein the overlap layer protrudes relative to the first sublayer toward the isolation opening; A first insulating material layer is provided on a side of the pixel definition material layer and the isolation structure facing away from the substrate, and the pixel definition material layer and the first insulating material layer are patterned to form a pixel definition layer and a first preliminary insulating portion, wherein the pixel definition layer includes a pixel defining portion and a pixel opening, the first preliminary insulating portion encloses a first preliminary opening communicating with the pixel opening, and the first preliminary insulating portion covers at least a portion of the isolation structure; A first conductive material layer is provided on the side of the first preliminary insulating portion, the pixel definition layer and the isolation structure facing away from the substrate, and the first conductive material layer is patterned to form a first conductive sublayer, the first conductive sublayer including a central segment located at the pixel opening, an edge segment located at the pixel definition portion facing away from the top surface of the substrate, and a transition segment connecting the central segment and the edge segment, the edge segment being located on the side of the first preliminary insulating portion facing away from the substrate.

21. The preparation method according to claim 20, characterized in that In the step of providing a first insulating material layer on a side of the pixel definition material layer and the isolation structure facing away from the substrate, and patterning the pixel definition material layer and the first insulating material layer to form a pixel definition layer and a first preliminary insulating portion: Patterning the pixel definition material layer and the preliminary protection portion to form the pixel definition layer and the protection portion, wherein the protection portion is located between the second conductive sublayer and the pixel definition portion and surrounds the pixel opening; Disposing a first insulating material layer on a side of the pixel definition layer and the isolation structure facing away from the substrate, and patterning the first insulating material layer to form the first preliminary insulating portion; Alternatively, in the step of providing a first insulating material layer on a side of the pixel definition material layer and the isolation structure facing away from the substrate, and patterning the pixel definition material layer and the first insulating material layer to form the pixel definition layer and the first preliminary insulating portion: Disposing a first insulating material layer on a side of the pixel definition material layer and the isolation structure facing away from the substrate; The preliminary protection portion, the pixel definition material layer and the first insulating material layer are patterned to form a protection portion, the pixel definition layer and the first preliminary insulating portion. The protection portion is located between the second conductive sublayer and the pixel definition portion and is arranged around the pixel opening.

22. The preparation method according to claim 20, characterized in that Also includes: Disposing a second insulating material layer on a side of the first conductive sublayer facing away from the substrate, patterning the second insulating material layer and the first preliminary insulating portion to form a second insulating portion and a first insulating portion, wherein the first insulating portion covers a portion of the pixel defining portion and a portion of the first insulating portion of the overlapping layer, and the second insulating portion covers at least a portion of a surface of the edge segment facing away from the substrate; Alternatively, the first preliminary insulating portion is patterned to form a first insulating portion, and the first insulating portion covers at least a portion of the overlapping layer.

23. A display device, characterized in that: A display panel comprising the display panel according to any one of claims 1 to 19, or a display panel prepared by the preparation method according to any one of claims 20 to 22.

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