Package structure for preventing microcracks of chip

Abstract

The application relates to the technical field of semiconductor packaging, in particular to a packaging structure for preventing microcracks of a chip, which comprises a substrate, a chip arranged on the substrate, the chip being attached to the substrate through an adhesive layer, a pressure sensor arranged on the substrate and corresponding to the chip, the pressure sensor being used for detecting the pressure received by the chip in the attaching process in real time, and a wireless transmission module arranged on the substrate, the wireless transmission module being connected with the pressure sensor, and the wireless transmission module being used for wirelessly sending the pressure data detected by the pressure sensor. The packaging structure is provided with the pressure sensor, so that the pressure received by the chip can be actively monitored, and the microcracks of the chip caused by excessive stress can be avoided.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging technology, and specifically to a packaging structure for preventing microcracks in chips. Background Technology

[0002] In semiconductor packaging, the die-mounting process refers to attaching a chip to a substrate. A commonly used bonding agent is DAF (Dieattach Film), which adheres to the bottom surface of the chip. The chip is then picked up by a nozzle and bonded to the substrate via the DAF film. During the die-mounting process, the pressure applied by the nozzle to the chip is often excessive due to a lack of monitoring methods. This excessive pressure can cause micro-cracks in the chip, thus affecting the packaging quality. Summary of the Invention

[0003] The purpose of this invention is to overcome the shortcomings of the prior art and provide a packaging structure to prevent chip microcracks. This solves the problem that the lack of monitoring means for mounting pressure in existing surface mount technology processes can easily lead to excessive pressure, causing microcracks in the chip and affecting the chip packaging quality.

[0004] The technical solution to achieve the above objectives is:

[0005] This invention provides a packaging structure for preventing chip microcracks, comprising:

[0006] substrate;

[0007] A chip disposed on the substrate, the chip being attached to the substrate via an adhesive layer;

[0008] A pressure sensor is disposed on the substrate and corresponds to the chip, the pressure sensor being used to detect the pressure exerted on the chip during the mounting process in real time;

[0009] A wireless transmission module is disposed on the substrate and is connected to the pressure sensor. The wireless transmission module is used to transmit the pressure data detected by the pressure sensor wirelessly.

[0010] A further improvement of the packaging structure for preventing chip microcracks in this invention is that the adhesive layer contains a plurality of negative thermal expansion microspheres.

[0011] A further improvement of the packaging structure for preventing chip microcracks in this invention is that the adhesive layer contains multiple supports.

[0012] A further improvement of the packaging structure for preventing chip microcracks in this invention is that a flexible structure is provided on the substrate corresponding to the chip's mounting area.

[0013] The further improvement of the packaging structure for preventing micro-cracks of chips of the present application is that a plurality of buffer grooves are arranged in the substrate below the flexible structure.

[0014] The further improvement of the packaging structure for preventing micro-cracks of chips of the present application is that the buffer grooves are filled with elastic bodies.

[0015] The present application also provides a packaging structure for preventing micro-cracks of chips, comprising:

[0016] a substrate;

[0017] a chip arranged above the substrate, the chip being arranged on the substrate through an adhesive layer, a plurality of negative thermal expansion microspheres and a plurality of support bodies being arranged in the adhesive layer, the support bodies being arranged staggered with the negative thermal expansion microspheres;

[0018] a pressure sensor arranged on the substrate and corresponding to the chip, the pressure sensor being used for real-time detection of the pressure received by the chip during the mounting process;

[0019] a wireless transmission module arranged on the substrate, the wireless transmission module being connected with the pressure sensor, the wireless transmission module being used for wireless emission of the pressure data detected by the pressure sensor.

[0020] The present application also provides a packaging structure for preventing micro-cracks of chips, comprising:

[0021] a substrate;

[0022] a chip arranged above the substrate, the chip being arranged on the substrate through an adhesive layer;

[0023] a pressure sensor arranged on the substrate and corresponding to the chip, the pressure sensor being used for real-time detection of the pressure received by the chip during the mounting process;

[0024] a wireless transmission module arranged on the substrate, the wireless transmission module being connected with the pressure sensor, the wireless transmission module being used for wireless emission of the pressure data detected by the pressure sensor.

[0025] a flexible structure arranged on the substrate and corresponding to the setting area of the chip, the flexible structure being arranged staggered with the pressure sensor.

[0026] The present application also provides a packaging structure for preventing micro-cracks of chips, comprising:

[0027] a substrate, comprising a first structural layer, a second structural layer and a third structural layer laminated together;

[0028] a chip arranged above the first structural layer, the chip being arranged on the first structural layer through an adhesive layer;

[0029] A flexible structure arranged in the first structure layer, the flexible structure corresponding to the arrangement area of the chip;

[0030] A plurality of buffer grooves arranged on the second structure layer and corresponding to the flexible structure;

[0031] A pressure sensor arranged on the second structure layer and corresponding to the chip, the pressure sensor being used for detecting the pressure received by the chip in the process of mounting in real time;

[0032] A wireless transmission module arranged in a buffer groove on the second structure layer, the wireless transmission module being connected with the pressure sensor, and the wireless transmission module being used for transmitting the pressure data detected by the pressure sensor wirelessly.

[0033] The packaging structure of the application has the following advantages:

[0034] The packaging structure of the application can detect the mounting pressure applied on the chip in real time in the process of mounting the chip by arranging the pressure sensor, and the detected mounting pressure is transmitted by the wireless transmission module, so that the controller can receive the mounting pressure and compare whether the mounting pressure reaches the warning value, and if the mounting pressure reaches the warning value, the controller can directly control the mounting to be stopped, thereby actively monitoring the pressure received by the chip and avoiding the micro-cracks of the chip caused by excessive stress.

[0035] The packaging structure of the application adds the negative thermal expansion microspheres in the adhesive layer to reduce the thermal expansion coefficient (CTE) of the adhesive layer, so that the thermal expansion coefficient of the adhesive layer is close to or matched with the thermal expansion coefficient of the chip (silicon), thereby avoiding the problem that the periodic shear stress is generated at the interface due to the large difference between the thermal expansion coefficients.

[0036] The packaging structure of the application arranges the support in the adhesive layer, the support can support the back of the chip like a “pier”, guarantee the flatness of the chip when being pressed, ensure the uniform stress of the chip, avoid the damage of the chip caused by the uneven mounting pressure, and prevent the micro-cracks of the chip caused by the uneven stress.

[0037] The packaging structure of the application arranges the flexible structure on the substrate corresponding to the chip, the flexible structure is used for absorbing the shear displacement of the chip in the horizontal direction in the process of pressing the chip, the chip will slide horizontally relative to the substrate due to the mismatching of the thermal expansion coefficients of the chip and the substrate, the shear deformation is absorbed by the flexible structure without transmitting the stress to the chip, thereby effectively protecting the chip and preventing the micro-cracks of the chip.

[0038] The packaging structure of the present application is provided with a buffer groove on the substrate, which plays a vertical elastic buffering role, absorbs longitudinal deformation, reduces the longitudinal tensile force and local extrusion of chip warping, and forms a two-stage buffer in combination with the flexible structure, which can absorb horizontal deformation and vertical deformation, greatly reduces the stress on the chip, and prevents the chip from generating micro-cracks. BRIEF DESCRIPTION OF DRAWINGS

[0039] Figure 1 A sectional view of a first embodiment of the packaging structure of the present application for preventing chip micro-cracks.

[0040] Figure 2 A sectional view of one embodiment of the adhesive layer in the packaging structure of the present application for preventing chip micro-cracks.

[0041] Figure 3 A sectional view of another embodiment of the adhesive layer in the packaging structure of the present application for preventing chip micro-cracks.

[0042] Figure 4 A sectional view of one embodiment of the substrate in the packaging structure of the present application for preventing chip micro-cracks.

[0043] Figure 5 A sectional view of another embodiment of the substrate in the packaging structure of the present application for preventing chip micro-cracks.

[0044] Figure 6 A sectional view of another embodiment of the substrate in the packaging structure of the present application for preventing chip micro-cracks.

[0045] Figure 7 A sectional view of another embodiment of the substrate in the packaging structure of the present application for preventing chip micro-cracks.

[0046] Figure 8 A sectional view of a second embodiment of the packaging structure of the present application for preventing chip micro-cracks.

[0047] Figure 9 A sectional view of a third embodiment of the packaging structure of the present application for preventing chip micro-cracks.

[0048] Figure 10 A sectional view of a fourth embodiment of the packaging structure of the present application for preventing chip micro-cracks.

[0049] Figure 11 A sectional view of a fifth embodiment of the packaging structure of the present application for preventing chip micro-cracks.

[0050] BRIEF DESCRIPTION OF DRAWINGS:

[0051] Substrate-21; Chip-22; Adhesive layer-23; Pressure sensor-24; Wireless transmission module-25; Flexible body-26; Buffer groove-27; Elastomer-28;

[0052] First structural layer - 211; Second structural layer - 212; Third structural layer - 213;

[0053] First adhesive layer - 231; Second adhesive layer - 232; Intermediate layer - 233; Support - 234; Negative thermal expansion microspheres - 235. Detailed Implementation

[0054] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0055] See Figure 1 This invention provides a packaging structure for preventing microcracks in chips, addressing the problem in existing technologies where excessive pressure can easily lead to microcracks due to the lack of surface mount pressure monitoring. This invention uses a pressure sensor installed on the corresponding chip to detect the surface mount pressure in real time. The detected pressure is transmitted wirelessly to a controller, which can monitor the surface mount pressure in real time and directly stop the surface mount operation when the pressure reaches a warning value, thus preventing excessive stress from causing microcracks in the chip. The packaging structure for preventing microcracks in chips according to this invention is described below with reference to the accompanying drawings.

[0056] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other.

[0057] See Figure 1 This image shows a cross-sectional view of a first embodiment of the packaging structure for preventing chip microcracks according to the present invention. The following is in conjunction with... Figure 1 The packaging structure for preventing chip microcracks according to the present invention will be described.

[0058] like Figure 1 As shown, the packaging structure for preventing chip microcracks of the present invention includes a substrate 21, a chip 22, an adhesive layer 23, a pressure sensor 24, and a wireless transmission module 25. The chip 22 is disposed on the substrate 21 through the adhesive layer 23. The pressure sensor 24 is disposed on the substrate 21 and is positioned corresponding to the chip 22. The pressure sensor 24 is used to detect the pressure on the chip 22 in real time during the mounting process. The wireless transmission module 25 is disposed on the substrate 21 and is connected to the pressure sensor 24, preferably through a wire or signal line. The wireless transmission module 25 is used to wirelessly transmit the pressure data detected by the pressure sensor 24.

[0059] The chip 22 is adsorbed by the suction nozzle when being mounted, the suction nozzle applies a mounting pressure to the chip 22, the chip 22 is adhered to the substrate 21 through the adhesive layer 23, the mounting pressure applied to the chip 22 by the suction nozzle can be detected in real time by the pressure sensor 24 and transmitted by the wireless transmission module 25. Preferably, a controller is arranged at the machine table for mounting the chip 22, the controller is wirelessly connected with the wireless transmission module 25, can receive the pressure data transmitted by the wireless transmission module 25, and the controller compares the pressure data with a warning value in real time, when the pressure data reaches the warning value, the controller controls the machine table to stop working, that is, the mounting of the chip 22 is stopped, so as to avoid that the chip 22 bears a large mounting pressure and the chip 22 generates micro cracks due to a large pressure. The controller can be wirelessly connected with the wireless transmission module 25 through a wireless transceiver module arranged at the controller, so as to realize wireless transmission and reception of data. The controller is also connected with the control system of the machine table, when the judgment condition is met, that is, when the real-time detected pressure data reaches the warning value, the controller forms a stop command to the control system of the machine table, so that the machine table stops working.

[0060] Further, the wireless transmission module 25 can adopt any one of Bluetooth, WIFI, 3G, 4G, 5G and the like to realize transmission of the pressure data.

[0061] Further, the substrate 21 is provided with embedding grooves corresponding to the pressure sensor 24 and the wireless transmission module 25, the pressure sensor 24 and the wireless transmission module 25 are arranged in the corresponding embedding grooves, wherein the top surface of the wireless transmission module 25 can be flush with the top surface of the substrate 21, or the top surface of the wireless transmission module 25 is lower than the top surface of the substrate 21, and the top surface of the pressure sensor 24 is slightly higher than the top surface of the substrate 21, so that when the chip 22 is combined with the adhesive layer 23 on the substrate 21, the chip 22 can be in contact with the pressure sensor 24, and the mounting pressure can be detected.

[0062] Since the interface will melt and change when the adhesive layer 23 is adhered, the exposed part of the top surface of the pressure sensor 24 can be embedded into the adhesive layer 23.

[0063] In one specific embodiment of the present application, as shown in Figure 2 The adhesive layer 23 is provided with a plurality of negative thermal expansion microspheres 235, the negative thermal expansion microspheres 235 are arranged to adjust the thermal expansion coefficient of the adhesive layer 23, the thermal expansion coefficient of the adhesive layer 23 is adjusted to be close to the thermal expansion coefficient of the material silicon of the chip 22, so as to avoid that the expansion / contraction rates of the materials are different due to a large difference in the thermal expansion coefficients when the temperature cycles, and periodic shear stress is generated at the interface, and then micro cracks of the chip are generated.

[0064] Further, the coefficient of thermal expansion of the negative thermal expansion microspheres 235 is about -5 ppm / ℃, and the negative thermal expansion microspheres 235 are made of negative thermal expansion materials, such as ZrW2O8, ZrW2O7, Sc2Mo3O 12 , Zr2(WO4)(PO4)2, and other compound materials. The content of the negative thermal expansion microspheres 235 can be 5% to 15% of the total weight of the adhesive layer 23.

[0065] Further, the negative thermal expansion microspheres 235 are subjected to surface plasma treatment to improve the bonding with the adhesive layer 23 and avoid agglomeration.

[0066] Further, the adhesive layer 23 is preferably a DAF film, and a certain amount of negative thermal expansion microspheres 235 are added to the DAF film to adjust the coefficient of thermal expansion of the DAF film to about 2 ppm / ℃, which matches the coefficient of thermal expansion of the silicon wafer, thereby reducing the stress caused by the difference in the coefficient of thermal expansion.

[0067] The negative thermal expansion material needs to be made into microspheres, such as about 3 μm to 7 μm in diameter. If the negative thermal expansion material is directly crushed and added to the matrix for preparing the DAF film, the coefficient of thermal expansion of the negative thermal expansion material will be positive, and even possibly fail. The preparation of the negative thermal expansion microspheres can be made by the existing technology, or can be made by a three-step method of hydrothermal, spraying, and sintering. Taking the Zr2(WO4)(PO4)2 system as an example, the first step is to perform hydrothermal synthesis, and the precursor is selected as: ZrOCl2·8H2O + (NH4) 10 W 12 O 41 ·xH2O + NH4H2PO4, the molar ratio of Zr:W:P = 2:1:2, AL(NO3)3 is added to adjust the coefficient of thermal expansion (CTE), 180℃ hydrothermal for 12h, to obtain amorphous precipitate; the second step is to perform spray drying and granulation, the solid content of the slurry is 20wt%, the inlet temperature is 220℃, and the outlet temperature is 110℃, to obtain spherical agglomerates with a diameter of about 7 μm to 10 μm; the third step is to perform sintering and surface modification, sintering at 1050℃ for 2h to obtain single Zr2(WO4)(PO4)2 compound, and the coefficient of thermal expansion is -2.8 ppm / ℃. The obtained microspheres are subjected to surface modification, and 3-(methacryloyloxy)propyltrimethoxysilane (MPS) is used for wet coating at a temperature of 60℃ for 2h to improve the bonding strength between the negative thermal expansion microspheres and the epoxy matrix in the DAF film.

[0068] Further, a plurality of support bodies 234 are arranged in the adhesive layer 23, and the support bodies 234 are spherical. The support bodies 234 are arranged to provide effective support, so that the chip 22 can be in a horizontal state when being attached, to ensure uniform stress and avoid the occurrence of micro-cracks caused by uneven stress.

[0069] The support 234 can be made of SiO2, Al2O3, or resin spheres. The diameter of the support 234 is approximately 15 μm to 30 μm. The support 234 can also be surface modified (e.g., with a silane coupling agent) to improve the bonding strength with the adhesive layer 23.

[0070] In a preferred embodiment, such as Figure 2 As shown, the adhesive layer 23 includes a first adhesive layer 231, a second adhesive layer 232, and an intermediate layer 233 located between the first adhesive layer 231 and the second adhesive layer 232. The support 234 is distributed in the intermediate layer 233, and the melting point of the support 234 is between 150°C and 200°C.

[0071] In one specific embodiment of the present invention, such as Figure 2 As shown, the adhesive layer 23 is provided with a plurality of supports 234 and a plurality of negative thermal expansion microspheres 235, wherein the supports 234 are distributed in the intermediate layer 233, and the negative expansion microspheres 235 are distributed in the first adhesive layer 231 and the second adhesive layer 232.

[0072] In another preferred embodiment, such as Figure 3 As shown, the support 234 disposed in the adhesive layer 23 is distributed in the intermediate layer 233, while the negative thermal expansion microspheres 235 are distributed in the first adhesive layer 231, the second adhesive layer 232 and the intermediate layer 233.

[0073] In another preferred embodiment, the adhesive layer 23 is a single-layer structure, within which a plurality of supports 234 and a plurality of negative thermal expansion microspheres 235 are distributed.

[0074] In one specific embodiment of the present invention, such as Figure 4 The substrate 21 has a flexible structure in the area corresponding to the chip, so that the chip 22 can be attached to the flexible structure when it is attached. The flexible structure has a certain deformation capacity, so during the chip 22 attachment process, the deformation of the flexible structure can absorb the shear stress caused by the mismatch of the thermal expansion coefficients between the chip and the substrate, reduce the stress on the chip, and thus prevent the chip from developing microcracks.

[0075] Furthermore, the flexible structure includes multiple flexible bodies 26, which are spaced apart on the substrate 21. The substrate 21 has multiple vertical holes arrayed corresponding to the areas where the chip 22 is mounted. The flexible bodies 26 fill these vertical holes, thus forming the flexible structure. The flexible bodies 26 are also arranged in an array, and the number of arrayed flexible bodies 26 is determined by the size of the chip 22. The flexible bodies 26 can be arranged in a 3x3 pattern, or alternatively in 4x4, 6x6, or 8x8 patterns. The diameter of the vertical holes is between 150μm and 250μm.

[0076] When the vertical hole is set with the flexible body 26, the setting position of the pressure sensor 24 and the wireless transmission module 25 is avoided on the top surface of the substrate 21.

[0077] The vertical hole can be formed by laser blind via on the substrate, the depth of the vertical hole can be controlled between 30 μm to 50 μm, then the flexible material such as PI (polyimide) or PDMS (polydimethylsiloxane) is selected to fill (optional spin coating, screen printing or hot pressing and other ways) into the vertical hole to form the flexible body 26, and the top surface of the flexible body 26 is coplanar with the top surface of the substrate 21 by grinding. The substrate 21 can be selected from BT, ABF, FR-4 or organic substrate.

[0078] The height of the flexible body 26 is low, and the vertical deformation is small compared with the lateral deformation, so the flexible body 26 is mainly used to absorb the shear deformation in the horizontal direction in the chip mounting process.

[0079] In one specific embodiment of the present application, as shown in Figure 5 A plurality of buffer grooves 27 are arranged in the substrate 21 corresponding to the lower side of the flexible structure.

[0080] The buffer groove 27 is vertically arranged to provide vertical deformation, which can absorb vertical displacement and reduce chip warpage. The buffer groove 27 in combination with the flexible body 26 can absorb stress in the lateral and vertical directions, effectively reduce the stress on the chip and prevent micro-cracks from occurring on the chip.

[0081] Further, the buffer groove 27 is vertically arranged, and the buffer groove 27 is arranged corresponding to the flexible body 26, that is, the buffer groove 27 is arranged below the flexible body 26. The diameter of the buffer groove 27 is between 200 μm and 350 μm, the diameter of the buffer groove 27 is greater than the diameter of the flexible body 26, the depth of the buffer groove 27 is 60 μm to 100 μm, and the buffer groove 27 is in a cylindrical shape.

[0082] In the manufacturing process, the buffer groove 27 can be formed by laser slotting on the back surface of the substrate 21, then the vertical hole is formed by laser slotting on the front surface of the substrate 21, then the flexible body 26 is filled into the vertical hole, and the copper foil is arranged on the back surface of the substrate 21.

[0083] Further, as shown in Figure 6 The buffer groove 27 is filled with an elastic body 28. The elastic body 28 can improve the absorption of vertical stress. The material of the elastic body 28 is foam, such as TPU microcellular foam, TPU elastomer, etc.

[0084] The elastic body 28 is not filled in the buffer groove 27, and part of the cavity is left in the buffer groove 27 to realize cooperative deformation. The height of the elastic body 28 is preferably selected between 50% and 70% of the depth of the buffer groove 27.

[0085] In a preferred embodiment, as shown in Figure 7 , the substrate 21 can also be a multi-layer laminated board, which comprises a first structural layer 211, a second structural layer 212, and a third structural layer 213, each of which is laminated to form the substrate. The first structural layer 211 is used to prepare a flexible structure, the second structural layer 212 can be provided with a buffer groove 27, and the third structural layer 213 can be provided with wiring to form an RDL (redistribution layer).

[0086] The material of the first structural layer 211 can be a PI film or an LCP film with a thickness of 12-25 μm, vertical holes are opened by laser, the vertical holes are filled with a flexible body 26, and the surface is polished to be flat, so that the flexible body 26 constitutes a flexible structure. The second structural layer 212 can be an FR-4 or an ABF chip with a thickness of 60-100 μm, and the buffer groove 27 is opened by laser. The buffer groove 27 can be a cavity or filled with an elastomer, and the third structural layer 213 can be a copper foil used for making an RDL and connecting solder balls. The three structural layers are laminated in register, and an adhesive layer can be used for adhesion between layers.

[0087] In a preferred embodiment, the front and back surfaces of the substrate 21 can be provided with an RDL, and then a through hole is opened on the substrate 21 to realize electrical connection of the upper and lower RDLs, as long as the position of the through hole is away from the buffer groove and the flexible body.

[0088] The application also provides a packaging structure for preventing micro-cracks of a chip, as shown in Figure 8 , which comprises a substrate 21, a chip 22, a pressure sensor, a wireless transmission module, and a flexible structure. The chip 22 is arranged on the substrate 21 and is attached to the substrate 21 by an adhesive layer 23. The pressure sensor is arranged on the substrate 21 and corresponds to the chip 22, and is used to detect the pressure received by the chip 22 during the attachment process. The wireless transmission module is arranged on the substrate 21 and is connected to the pressure sensor, and is used to wirelessly transmit the pressure data detected by the pressure sensor. The flexible structure is arranged on the substrate 21 and corresponds to the arrangement area of the chip 22, and is arranged in a staggered manner with the pressure sensor. The flexible structure comprises a plurality of flexible bodies 26, and each flexible body 26 is arranged in a spaced manner.

[0089] The application also provides a packaging structure for preventing micro-cracks of a chip, as shown in Figure 9As shown, the packaging structure comprises a substrate 21, a chip 22, a pressure sensor 24 and a wireless transmission module 25, wherein the chip 22 is arranged on the substrate 21, the chip 22 is arranged on the substrate 21 through an adhesive layer 23, a plurality of negative thermal expansion microspheres and a plurality of supporting bodies are arranged in the adhesive layer 23, and the supporting bodies and the negative thermal expansion microspheres are arranged staggeredly; the pressure sensor 24 is arranged on the substrate 21 and corresponds to the chip 22, the pressure sensor 24 is used for detecting the pressure received by the chip 22 in the mounting process in real time; the wireless transmission module 25 is arranged on the substrate 21, the wireless transmission module 25 is connected with the pressure sensor 24, and the wireless transmission module 25 is used for transmitting the pressure data detected by the pressure sensor 24 wirelessly.

[0090] Further, as shown in the embodiment, Figure 10 the difference between the embodiment and the embodiment shown in Figure 9 is that the substrate 21 is provided with a flexible structure, the flexible structure is arranged corresponding to the arrangement area of the chip, the flexible structure is arranged staggeredly with the pressure sensor, and further, the flexible structure comprises a plurality of flexible bodies 26.

[0091] The application further provides a packaging structure for preventing microcracks of a chip, as shown in the embodiment, Figure 11 the packaging structure comprises a substrate, a chip 22, a pressure sensor 24, a wireless transmission module 25, a flexible structure and a buffer groove 27, the substrate comprises a first structure layer 211, a second structure layer 212 and a third structure layer 213, the first structure layer 211 is provided with a flexible structure, the flexible structure comprises a plurality of flexible bodies 26, the flexible bodies 26 are embedded in vertical holes formed in the first structure layer 211; a plurality of buffer grooves 27 are formed in the second structure layer 212, the buffer grooves 27 correspond to the flexible bodies 26 and are located below the flexible bodies 26; the pressure sensor 24 is arranged on the top surface of the second structure layer 212, the wireless transmission module 25 is arranged in one buffer groove 27, the pressure sensor 24 is used for detecting the pressure received by the chip 22 in the mounting process in real time; the wireless transmission module 25 is connected with the pressure sensor 24, and the wireless transmission module 25 is used for transmitting the pressure data detected by the pressure sensor 24 wirelessly. The first structure layer 211, the second structure layer 212 and the third structure layer 213 are laminated and combined. The chip 22 is arranged on the first structure layer 211 through the adhesive layer 23.

[0092] The application is described in detail in the above embodiment combined with the drawings, and those skilled in the art can make various changes to the application according to the above description. Thus, some details in the embodiment should not constitute a limitation on the application, and the protection scope of the application is defined by the appended claims.

Claims

1. A packaging structure for preventing microcracks in chips, characterized in that, include: substrate; A chip disposed on the substrate, the chip being attached to the substrate via an adhesive layer; A pressure sensor is disposed on the substrate and corresponds to the chip, the pressure sensor being used to detect the pressure exerted on the chip during the mounting process in real time; A wireless transmission module is disposed on the substrate, the wireless transmission module is connected to the pressure sensor, and the wireless transmission module is used to transmit the pressure data detected by the pressure sensor wirelessly; The adhesive layer contains a plurality of negative thermal expansion microspheres, which are made of a negative thermal expansion material. The negative thermal expansion microspheres are used to adjust the thermal expansion coefficient of the adhesive layer to be close to that of silicon, the material of the chip.

2. The packaging structure for preventing chip microcracks as described in claim 1, characterized in that, The adhesive layer contains multiple supports.

3. The packaging structure for preventing chip microcracks as described in claim 1, characterized in that, The substrate has a flexible structure corresponding to the area where the chip is disposed.

4. The packaging structure for preventing chip microcracks as described in claim 3, characterized in that, The substrate has multiple buffer grooves located below the flexible structure.

5. The packaging structure for preventing chip microcracks as described in claim 4, characterized in that, The buffer groove is filled with an elastomer.

6. The packaging structure for preventing chip microcracks as described in claim 3, characterized in that, The substrate has multiple vertical holes arranged in an array corresponding to the chip's mounting area. The flexible structure includes a flexible body that fills the vertical hole.

7. A packaging structure for preventing microcracks in chips, characterized in that, include: substrate; A chip is disposed on the substrate, the chip being attached to the substrate via an adhesive layer. The adhesive layer contains a plurality of negative thermal expansion microspheres and a plurality of supports, the supports being staggered from the negative thermal expansion microspheres. The negative thermal expansion microspheres are made of a negative thermal expansion material and are used to adjust the thermal expansion coefficient of the adhesive layer to be close to that of silicon, the material of the chip. A pressure sensor is disposed on the substrate and corresponds to the chip, the pressure sensor being used to detect the pressure exerted on the chip during the mounting process in real time; A wireless transmission module is disposed on the substrate and is connected to the pressure sensor. The wireless transmission module is used to transmit the pressure data detected by the pressure sensor wirelessly.

8. A packaging structure for preventing microcracks in chips, characterized in that, include: substrate; A chip disposed on the substrate, the chip being attached to the substrate via an adhesive layer; A pressure sensor is disposed on the substrate and corresponds to the chip, the pressure sensor being used to detect the pressure exerted on the chip during the mounting process in real time; A wireless transmission module is disposed on the substrate, the wireless transmission module is connected to the pressure sensor, and the wireless transmission module is used to transmit the pressure data detected by the pressure sensor wirelessly; A flexible structure is disposed on the substrate and corresponding to the chip mounting area. The flexible structure is offset from the pressure sensor. The substrate has multiple vertical holes corresponding to the chip mounting area. The flexible structure includes multiple flexible bodies, which fill the vertical holes to form the flexible structure. The flexible bodies are used to absorb horizontal shear deformation during the chip mounting process.

9. A packaging structure for preventing microcracks in chips, characterized in that, include: The substrate includes a first structural layer, a second structural layer, and a third structural layer laminated together. A chip disposed on the first structural layer, the chip being attached to the first structural layer via an adhesive layer; A flexible structure is disposed within the first structural layer, the flexible structure being disposed in the chip mounting area; a plurality of vertical holes are disposed on the first structural layer corresponding to the chip mounting area, the flexible structure comprising a plurality of flexible bodies, the flexible bodies filling the vertical holes to form the flexible structure, the flexible bodies being used to absorb horizontal shear deformation during the chip mounting process. Multiple buffer slots are provided on the second structural layer and correspond to the flexible structure; A pressure sensor is disposed on the second structural layer and corresponds to the chip. The pressure sensor is used to detect the pressure on the chip during the mounting process in real time. A wireless transmission module is installed in a buffer slot on the second structural layer. The wireless transmission module is connected to the pressure sensor and is used to transmit the pressure data detected by the pressure sensor wirelessly.

Images