PET (Polyethylene Terephthalate) and ETFE (Ethylene Terephthalate) compounded release film for semiconductor packaging and preparation method thereof

By using a three-layer release film composed of PET and ETFE, combined with nano-silica and segmented curing process, the problems of temperature resistance and unstable peel force of traditional release films are solved, achieving high-temperature stability and high precision requirements in semiconductor packaging.

CN120941853APending Publication Date: 2025-11-14ZHEJIANG GREEN NEW MATERIALS +1
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Patent Information

Application Number
CN202510936642.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-07-08
Publication Date
2025-11-14

AI Technical Summary

Technical Problem

Traditional single-material release films have problems such as insufficient temperature resistance, chemical resistance, unstable peeling force, high cost and low mechanical strength in semiconductor packaging processes, making it difficult to meet the requirements of high filler compatibility and long-term reliability.

Method used

Release films employing a three-layer composite structure consisting of a PET substrate layer, an adhesive layer, and an ETFE layer are enhanced in adhesion through plasma treatment or corona treatment, combined with nano-silica to improve heat resistance, and utilize segmented curing and hot-pressing composite processes. The components of the adhesive layer work synergistically to improve overall performance.

Benefits of technology

It achieves stable peel strength and organic solvent resistance at 175℃, overcomes the performance limitations of single film structures, improves bonding strength and stability, and meets the high temperature and high precision requirements of semiconductor packaging.

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Abstract

The invention discloses a release film for semiconductor packaging based on PET and ETFE compounding and a preparation method of the release film, and belongs to the technical field of film materials, the release film structurally comprises a PET base material layer, an adhesive layer and an ETFE layer which are sequentially arranged, and the adhesive layer is prepared from the following raw materials in parts by mass: 40-60 parts of fluorine-containing acrylate compound; 20 to 30 parts of epoxy modified organic silicon resin; 5 to 10 parts of nano silicon dioxide; 1 to 2 parts of a photoinitiator; wherein the surface of the contact side of the PET base material layer and the adhesive layer is subjected to plasma treatment or corona treatment, and the dyne value is larger than or equal to 50 mN / m; the surface of the side, making contact with the adhesive layer, of the ETFE layer is subjected to fluoridation treatment, and the surface roughness Ra is smaller than or equal to 1 micrometer. The release film has the advantages of controllable release force in a range of 0.1-5N / 25mm, good stability, temperature resistance of 175 DEG C, good organic solvent resistance, and wide application prospect in the field of semiconductor packaging.
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