Golden LED light source module, light distribution method thereof and golden LED lamp

Abstract

The invention discloses a golden LED light source module, a light distribution method thereof and a golden LED lamp, and the light distribution method comprises the steps: testing the parameters of a yellow LED chip and a red LED chip under the current density of 1A / cm < 2 >-10A / cm < 2 >, and building an LED light source database; the target luminous flux phi and the current density J of the golden LED light source module are determined; selecting a yellow light LED chip and a red light LED chip from the light source database, and calculating the total luminous flux phi 1 of the selected yellow light LED chip and the total luminous flux phi 2 of the selected red light LED chip meeting the requirements of the golden light color temperature and the color rendering index under the current density J according to the target luminous flux of the golden light LED light source module; calculating the required particle number N of the yellow light LED chip and the required particle number M of the red light LED chip according to the phi 1, the phi 2, the spectrum and the luminous flux parameters of the selected yellow light LED chip and the red light LED chip; and synthesizing the yellow light LED chip and the red light LED chip into golden light lamp beads, and combining the golden light lamp beads to obtain the golden light LED light source module.

Description

Technical Field

[0001] This invention relates to semiconductor lighting technology, and more particularly to a golden yellow LED light source module and its light distribution method, and a golden yellow LED lamp. Background Technology

[0002] Golden light is a low color temperature light source developed by Nanchang University. It is created by combining yellow light emitted from yellow LED chips with red light emitted from red LED chips through spatial mixing. Its color temperature range is 1800K~2200K, and its color rendering index Ra>70. To meet the requirements of color temperature and color rendering index for golden light, the ratio of yellow LED chips to red LED chips in existing golden light LEDs is set at 1:1. For example, the ratio of yellow LED chips to red LED chips in the golden light LED chip disclosed in Chinese utility model patent CN221529972U is 1:1.

[0003] The typical operating current density of golden yellow LEDs is above 20 A / cm², which leads to relatively low luminous efficacy. To further improve luminous efficacy, the current density needs to be reduced based on the photoelectric characteristics of LEDs. However, reducing the current density causes a shift in the peak wavelength of the chip, and the degree of luminous efficacy improvement differs between yellow and red LED chips. Consequently, it becomes impossible to synthesize golden yellow light that simultaneously meets the color temperature and color rendering index requirements using the original 1:1 ratio of yellow and red LED chips. Summary of the Invention

[0004] To address the aforementioned technical problems, this invention provides a golden yellow LED light source module and its light distribution method.

[0005] In a first aspect, the present invention provides a light distribution method for a golden yellow LED light source module, wherein the golden yellow light is formed by mixing the light emitted from a yellow LED chip and a red LED chip, the color temperature range of the golden yellow light is 1800K~2200K, and the color rendering index is >70; the light distribution method includes the following steps: S1, Test 1A / cm 2 ~10A / cm 2 A database of LED light source parameters, including voltage, peak wavelength, spectrum, and luminous flux parameters of yellow and red LED chips prepared at current density, was established. S2. Determine the target luminous flux Φ of the golden yellow LED light source module and the current density J of the golden yellow LED chip and the red LED chip. The current density J is in the range of 1A / cm². 2 ~10A / cm 2 ; S3. Select yellow LED chips and red LED chips from the light source database. Based on the target luminous flux of the golden yellow LED light source module, calculate the total luminous flux Φ1 of the selected yellow LED chips and the total luminous flux Φ2 of the red LED chips that meet the requirements of golden yellow color temperature and color rendering index under the current density J. S4. Calculate the required number of selected yellow LED chips N and selected red LED chips M based on Φ1 and Φ2 and the spectral and luminous flux parameters of the selected yellow LED chip and red LED chip, wherein 1 < M / N ≤ 3. S5. Combine the selected yellow LED chip and red LED chip to form a golden light lamp bead. The color temperature range of the golden light lamp bead is 1500K-2500K. Combine the golden light lamp beads to obtain a golden light LED light source module.

[0006] The light distribution method for the golden LED light source module provided by this invention is at 1A / cm 2 ~10A / cm 2 This was proposed under low current density conditions. During the research process, the applicant discovered that within this current density range, the luminous efficacy of yellow and red LED chips was lower than that at 20 A / cm². 2 The above-mentioned current densities are all significantly improved, thereby enhancing the luminous efficacy of the golden LED light source module. Furthermore, the applicant also discovered that as the current density decreases, the luminous efficacy improvement of the golden LED chip is significantly greater than that of the red LED chip, and the peak wavelength of the golden LED chip shows a clear increasing trend. Therefore, the required number of golden LED chips, N, should be less than the number of red LED chips, M. The light distribution method proposed in this invention combines golden and red LED chips into golden LED beads that meet the color temperature requirements. Premixing the light within the LED beads reduces the color temperature difference between them, thus ensuring that the golden light emitted by the golden LED light source module obtained from the combination of golden LED beads meets the requirements.

[0007] As an optional scheme of the light distribution method of the present invention, M and N in step S4 satisfy the relationship N<M≤2N, then the golden light lamp bead in step S5 includes a first lamp bead and a second lamp bead; the first lamp bead is composed of two yellow LED chips and two red LED chips arranged in a square and connected in series, with LED chips of the same color distributed diagonally; the second lamp bead is composed of one yellow LED chip and two red LED chips arranged in a triangle and connected in series; the number of first lamp beads is X and the number of second lamp beads is Y, where X=(2N-M) / 2, Y=MN.

[0008] As an optional scheme of the light distribution method of the present invention, M and N in step S4 satisfy the relationship 2N<M≤3N, then the golden light lamp bead in step S5 includes a second lamp bead and a third lamp bead; the second lamp bead is composed of one yellow LED chip and two red LED chips arranged in a triangle and connected in series; the third lamp bead is composed of one yellow LED chip and three red LED chips arranged in a square and connected in series; the number of second lamp beads is Y and the number of third lamp beads is Z, where Y=3N-M and Z=M-2N.

[0009] As an optional solution for the light distribution method of the present invention, the yellow LED chip is a high-efficiency AlGaInN material yellow LED chip with a peak wavelength range of 540nm-590nm; the red LED chip is a high-efficiency AlGaInP material red LED chip with a peak wavelength range of 600nm-635nm.

[0010] As an optional solution of the light distribution method of the present invention, the red LED chip selected from the light source database in step S3 includes a first red LED chip and a second red LED chip. The peak wavelength range of the first red LED chip is 620nm-635nm, and the peak wavelength range of the second red LED chip is 610nm-620nm.

[0011] Secondly, the present invention provides a golden yellow LED light source module, which is prepared by the above-mentioned light distribution method.

[0012] Thirdly, the present invention provides a golden yellow LED lamp, including the aforementioned golden yellow LED light source module.

[0013] As an optional embodiment of the golden LED lamp of the present invention, it includes a secondary optical lens, a transparent optical medium layer, a plurality of golden LED beads, a soldering layer, a circuit board, a heat-conducting material, a heat sink, and a power supply; the golden LED beads are connected to the circuit board through the soldering layer; the circuit board is disposed on the heat sink, and a heat-conducting material is provided between the circuit board and the heat sink; the secondary optical lens seals the plurality of golden LED beads, the soldering layer, the circuit board, and the heat-conducting material on the heat sink; the golden LED beads have a planar package structure, and the transparent optical medium layer is filled between the golden LED beads and the secondary optical lens.

[0014] As a preferred embodiment of the above-mentioned optional solutions, the golden LED beads are uniformly distributed in a rectangular shape on the circuit board; the secondary optical lens contains several secondary optical lens packages; each golden LED bead has a corresponding and individual secondary optical lens package above it to adjust the light pattern of the golden LED bead, so as to meet the light pattern requirements of different lighting scenarios; there are gaps between adjacent secondary optical lens packages, wherein, along the length direction of the secondary optical lens package, the gap between adjacent secondary optical lens packages is ≥ 0.5 times the length of the secondary optical lens package, and along the width direction of the secondary optical lens package, the gap between adjacent secondary optical lens packages is ≥ 0.5 times the width of the secondary optical lens package; the material of the planar primary optical lens is silicone or epoxy resin; the material of the secondary optical lens is one of polycarbonate, polymethyl methacrylate, glass, epoxy resin, and silicone; the material of the transparent optical medium layer has a refractive index of 1.4-1.6 and a transmittance > 99%.

[0015] As a preferred embodiment of the above-mentioned optional solutions, the gold LED chip includes a packaging substrate, a die-bonding layer, an LED chip, a Zener diode, gold wires, and a planar primary optical lens; the LED chip is connected to the packaging substrate through the die-bonding layer; the LED chip and the Zener diode are electrically conducted to the packaging substrate through the gold wires; the planar primary optical lens seals the LED chip, Zener diode, die-bonding layer, and gold wires on the packaging substrate.

[0016] Additional aspects and advantages of the invention will be set forth in part in the description which follows, some of which will become clear as the description proceeds, and others will be learned by practicing the invention. Attached Figure Description

[0017] Figure 1 The luminous efficacy and peak wavelength of yellow and red LED chips under different current densities are shown.

[0018] Figure 2 This is a schematic diagram of the chip arrangement of the first LED bead in an embodiment of this application.

[0019] Figure 3 This is a schematic diagram of the chip arrangement of the second LED in an embodiment of this application.

[0020] Figure 4 This is a schematic diagram of the chip arrangement of the third LED in an embodiment of this application.

[0021] Figure 5 This is a schematic diagram of the structure of the golden LED light source module in the embodiments of this application.

[0022] Figure 6 This is a schematic diagram illustrating the difference between planar packaging and ball-head packaging in the embodiments of this application.

[0023] Figure 7 This is a schematic diagram of the structure of the golden light lamp bead in the embodiment of this application.

[0024] Figure 8 This is the spectrum of the yellow LED chip selected in Embodiment 1 of this application.

[0025] Figure 9 This is the spectrum of the red LED chip selected in Embodiment 1 of this application.

[0026] Figure 10 This is the spectrum of the first LED in Embodiment 1 of this application.

[0027] Figure 11 This is the spectrum of the second LED in Embodiment 1 of this application.

[0028] Figure 12 This is the spectrum of the golden LED light source module in Embodiment 1 of this application.

[0029] Figure 13 This is a schematic diagram of the series and parallel arrangement of the golden light LED beads in Embodiment 1 of this application.

[0030] Figure 14 This is the spectrum of the yellow LED chip selected in Embodiment 2 of this application.

[0031] Figure 15 This is the spectrum of the first type of red LED chip selected in Embodiment 2 of this application.

[0032] Figure 16 This is the spectrum of the second type of red LED chip selected in Embodiment 2 of this application.

[0033] Figure 17 This is the spectrum of the first LED in Embodiment 2 of this application.

[0034] Figure 18 This is the spectrum of the second type of lamp bead in Embodiment 2 of this application.

[0035] Figure 19 This is the spectrum of the second type of second lamp bead in Embodiment 2 of this application.

[0036] Figure 20 This is the spectrum of the golden LED light source module in Embodiment 2 of this application.

[0037] Figure 21 This is a schematic diagram of the series and parallel arrangement of the golden light LED beads in Embodiment 2 of this application.

[0038] Figure 22 The spectrum of the first type of yellow LED chip selected in Embodiment 3 of this application.

[0039] Figure 23The spectrum of the second type of yellow LED chip selected in Embodiment 3 of this application.

[0040] Figure 24 The spectrum of the first type of red LED chip selected in Embodiment 3 of this application.

[0041] Figure 25 The spectrum of the second type of red LED chip selected in Embodiment 3 of this application.

[0042] Figure 26 This is the spectrum of the second lamp bead in the first type of embodiment 3 of this application.

[0043] Figure 27 This is the spectrum of the second type of second lamp bead in Embodiment 3 of this application.

[0044] Figure 28 This is the spectrum of the third LED in Embodiment 3 of this application.

[0045] Figure 29 This is the spectrum of the golden LED light source module in Embodiment 3 of this application.

[0046] Figure 30 This is a schematic diagram of the series and parallel arrangement of the golden light LED beads in Embodiment 3 of this application.

[0047] In the diagram: 10-Yellow LED chip, 20-Red LED chip; 30-First LED bead, 40-Second LED bead, 50-Third LED bead; 11-Secondary optical lens, 12-Transparent optical dielectric layer, 13-Golden yellow LED bead, 14-Welding layer, 15-Circuit board, 16-Heat-conducting material, 17-Heat sink; 131-Packaging substrate, 132-Die bonding layer, 133-LED chip, 134-Zener diode, 135-Gold wire, 136-Planar primary optical lens. Detailed Implementation

[0048] To make the technical problems, technical solutions and beneficial effects of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. The specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0049] To further improve the luminous efficacy of golden LEDs, a scheme to reduce current density was adopted. The applicant found in their research that at 1 A / cm²... 2 ~10A / cm 2 Under low current density conditions, the luminous efficacy of yellow and red LED chips used to synthesize golden light is higher than that of commonly used 20A / cm² LEDs. 2All of the above current densities have been significantly improved. However, the luminous efficacy improvement of yellow LED chips is significantly higher than that of red LED chips, and the peak wavelength of yellow LED chips shows a clear increasing trend, such as... Figure 1 As shown. This phenomenon means that if the yellow LED chip and red LED chip are still configured in a 1:1 ratio for the golden light, the significant increase in the luminous flux of the yellow light will lead to an increase in the color temperature of the golden light, which may exceed the design requirements. In order to improve the luminous efficacy while meeting the requirements for the color temperature and color rendering index of the golden light, this application proposes a new light distribution method that no longer maintains a 1:1 ratio.

[0050] This application provides a light distribution method for a golden yellow LED light source module. The golden yellow light is formed by mixing the light emitted from a yellow LED chip 10 and a red LED chip 20. The color temperature range of the golden yellow light is 1800K~2200K, and the color rendering index is >70. The light distribution method includes the following steps: S1, Test 1A / cm 2 ~10A / cm 2 The voltage, peak wavelength, spectrum, and luminous flux parameters of the yellow LED chip 10 and red LED chip 20 prepared under current density are used to establish an LED light source database. S2. Determine the target luminous flux Φ of the golden yellow LED light source module and the current density J of the golden yellow LED chip and the red LED chip. The current density J is in the range of 1A / cm². 2 ~10A / cm 2 ; S3. Select yellow LED chip 10 and red LED chip 20 from the light source database. Based on the target luminous flux of the golden yellow LED light source module, calculate the total luminous flux Φ1 of the selected yellow LED chip and the total luminous flux Φ2 of the red LED chip that meet the requirements of golden yellow color temperature and color rendering index under the current density J. S4. Calculate the required number of selected yellow LED chips N and selected red LED chips M based on Φ1 and Φ2 and the spectral and luminous flux parameters of the selected yellow LED chip 10 and red LED chip 20, wherein 1 < M / N ≤ 3. S5. Combine the selected yellow LED chip 10 and red LED chip 20 to form a golden light lamp bead 13. The color temperature range of the golden light lamp bead 13 is 1500K-2500K. Combine the golden light lamp bead 13 to obtain a golden light LED light source module.

[0051] In some embodiments, M and N in step S4 satisfy the relationship N < M ≤ 2N, then the golden light LED bead 13 in step S5 includes a first LED bead 30 and a second LED bead 40; for example Figure 2As shown, the first LED bead 30 consists of two yellow LED chips 10 and two red LED chips 20 arranged in a square and connected in series, with LED chips of the same color distributed diagonally; as shown Figure 3 As shown, the second LED chip 40 consists of one yellow LED chip 10 and two red LED chips 20 arranged in a triangle and connected in series; the number of first LED chips 30 is X, and the number of second LED chips 40 is Y, where X = (2N-M) / 2, and Y = MN. It should be noted that when M and N satisfy the relationship N < M ≤ 2N, the number of yellow LED chips is less than the number of red LED chips. With four LED chips placed on the substrate, the combination of the first LED chip (yellow LED chip: red LED chip = 1:1) and the second LED chip (yellow LED chip: red LED chip = 1:2) produces golden light. Premixing the light within the LED chip reduces the color temperature difference between the chips, improving the overall uniformity of the golden LED module's color. If the LED chips are composed of pure yellow LED chips (color temperature around 5000K) or pure red LED chips (color temperature around 1000K), the color temperature difference between the chips is huge, leading to severe color separation problems when viewing the light source directly.

[0052] In some embodiments, M and N in step S4 satisfy the relationship 2N < M ≤ 3N, then the golden light bulb 13 in step S5 includes a second bulb 40 and a third bulb 50; for example Figure 3 As shown, the second LED chip 40 consists of one yellow LED chip 10 and two red LED chips 20 arranged in a triangle and connected in series; as shown Figure 4 As shown, the third LED chip 50 consists of one yellow LED chip 10 and three red LED chips 20 arranged in a square and connected in series; the number of second LED chips 40 is Y, and the number of third LED chips 50 is Z, where Y = 3N - M and Z = M - 2N. It should be noted that when M and N satisfy the relationship 2N < M ≤ 3N, the number of yellow LED chips is much less than that of red LED chips. When four LED chips are placed on the substrate, the golden light is obtained by combining the second LED chip (yellow LED chip: red LED chip = 1:2) and the third LED chip (yellow LED chip: red LED chip = 1:3). The chips premix the light within the LED chip, which can make the color temperature difference between the LED chips smaller and improve the overall uniformity of the golden light LED module.

[0053] In some embodiments, the yellow LED chip 10 is a high-efficiency AlGaInN material yellow LED chip with a peak wavelength range of 540nm-590nm; the red LED chip 20 is a high-efficiency AlGaInP material red LED chip with a peak wavelength range of 600nm-635nm.

[0054] In some embodiments, the red LED chip 20 selected from the light source database in step S3 includes a first red LED chip and a second red LED chip. The peak wavelength range of the first red LED chip is 620nm-635nm, and the peak wavelength range of the second red LED chip is 610nm-620nm. It should be noted that in the prior art, at high current densities, longer wavelength red LED chips are usually preferred because shorter wavelength red LED chips have lower thermal steady-state efficiency retention rates. However, the applicant found in its research that at current densities of 1A / cm²... 2 ~10A / cm 2 Within this range, the thermal steady-state efficiency maintenance rates of the second red LED chip with a peak wavelength of 610nm-620nm and the first red LED chip with a peak wavelength of 620nm-635nm are not significantly different. Therefore, selecting a portion of the shorter wavelength second red LED chips can improve the color rendering index. By adjusting the ratio of the first and second red LED chips, the color temperature and color rendering index requirements of golden yellow light can be better met.

[0055] This application also provides a golden LED light source module, which is prepared by the above-described light distribution method.

[0056] This application also provides a golden LED lamp, including the aforementioned golden LED light source module.

[0057] In some embodiments, such as Figure 5As shown, the system includes a secondary optical lens 11, a transparent optical medium layer 12, several golden LED chips 13, a solder layer 14, a circuit board 15, a heat-conducting material 16, a heat sink 17, and a power supply 18. The golden LED chips 13 are connected to the circuit board 15 through the solder layer 14. The circuit board 15 is disposed on the heat sink 17, and the heat-conducting material 16 is provided between the circuit board 15 and the heat sink 17. The secondary optical lens 11 seals the several golden LED chips 13, the solder layer 14, the circuit board 15, and the heat-conducting material 16 on the heat sink 17. The golden LED chips 13 have a planar package structure, and the transparent optical medium layer 12 is filled between the golden LED chips 13 and the secondary optical lens 11. It should be noted that when adopting a scheme to reduce the current density to improve the luminous efficacy of the golden LED lamp, in order to maintain the total luminous flux of the golden LED lamp, the number of golden LED chips needs to be significantly increased, and the number of secondary optical lens optical packages covering the circuit board needs to be increased by an equal and significant amount. Without increasing the heatsink area, the limited packaging area available on the heatsink is insufficient to accommodate a larger number of secondary lens optical packages. For ball-head packaging, the required packaging substrate size is greater than 2.5 times the size of the packaged LED chip, while planar packaging requires a packaging substrate size less than 1.5 times the size of the packaged LED chip, thus reducing the size of the LED chip and saving packaging area. Figure 6 As shown, LED chips can be packaged in a planar manner, but when using a spherical package, the primary optical lens cannot completely cover the LED chip. For LED chips that emit light directly, the luminous efficacy of a planar packaged LED is about 30% lower than that of a hemispherical package under the same conditions. By filling a transparent optical dielectric layer between the planar packaged golden LED chip and the secondary optical lens, air is eliminated between them, thus avoiding luminous efficacy loss. This allows for miniaturized packaging and high light extraction efficiency in golden LED lamps.

[0058] In some embodiments, the golden LED beads 13 are uniformly distributed in a rectangular shape on the circuit board 15; each golden LED bead has a corresponding and individual secondary optical lens package above it to adjust the light pattern of the golden LED bead, so as to meet the light pattern requirements of different lighting scenarios; there are gaps between adjacent secondary optical lens packages, wherein, along the length direction of the secondary optical lens package, the gap between adjacent secondary optical lens packages is ≥ 0.5 times the length of the secondary optical lens package, and along the width direction of the secondary optical lens package, the gap between adjacent secondary optical lens packages is ≥ 0.5 times the width of the secondary optical lens package; the power supply 18 is a high-voltage constant current power supply with an output DC voltage of 72~284V; the material of the planar primary optical lens 136 is silicone or epoxy resin; the material of the secondary optical lens 11 is one of polycarbonate, polymethyl methacrylate, glass, epoxy resin, and silicone; the material of the transparent optical medium layer 12 has a refractive index of 1.4-1.6 and a transmittance > 99%. It should be noted that maintaining a certain gap between adjacent secondary optical lens packages can reduce the light efficiency loss caused by mutual absorption between them. The high-voltage constant current output power supply used has a higher conversion efficiency than the low-voltage constant current output power supply. For example, the conversion efficiency of the same type of power supply with an output voltage of approximately 50V is 91%, while that of the same type with an output voltage of approximately 180V is 93.5%. When using a high-voltage constant current output power supply, the number of LED chips connected in series must be appropriately set to match the operating range of the high-voltage constant current output power supply, within 1A / cm... 2 -10A / cm 2 At current density, the required current for each series circuit can be obtained based on the chip size, at 1 A / cm². 2 -10A / cm 2 At the given current density, the voltage range of the yellow LED chip 10 is 2.1-2.4V, the voltage range of the red LED chip 20 is 1.8-2.0V, the voltage range of the first LED chip 30 is 7.8-8.8V, the voltage range of the second LED chip 40 is 5.7-6.4V, and the voltage range of the third LED chip 50 is 7.5-8.4V. The required output voltage can be obtained by determining the number of LEDs connected in series in each series circuit. The refractive index of the transparent optical medium layer (1.4-1.6) is similar to that of the primary and secondary optical lenses, which can reduce total internal reflection loss and Fresnel loss at different optical interfaces (primary optical lens / transparent optical medium layer / secondary optical lens interface) when light is emitted.

[0059] In some embodiments, such as Figure 7As shown, the gold LED chip 13 includes a packaging substrate 131, a die-bonding layer 132, an LED chip 133, a Zener diode 134, a gold wire 135, and a planar primary optical lens 136. The LED chip 133 is connected to the packaging substrate 131 through the die-bonding layer 132. The LED chip 133 and the Zener diode 134 are electrically connected to the packaging substrate 131 through the gold wire 135. The planar primary optical lens 136 seals the LED chip 133, the Zener diode 134, the die-bonding layer 132, and the gold wire 135 on the packaging substrate 131.

[0060] The following are some preferred embodiments of this application. Example 1

[0061] This embodiment provides a light distribution method for a golden yellow LED light source module. The golden yellow light is formed by mixing the light emitted from a yellow LED chip 10 and a red LED chip 20. The color temperature range of the golden yellow light is 1800K~2200K, and the color rendering index is >70. The light distribution method includes the following steps: S1, Test 1A / cm 2 A database of LED light source parameters was established, including the voltage, peak wavelength, spectrum, and luminous flux parameters of various yellow LED chips 10 with peak wavelengths of 540nm-590nm and various red LED chips 20 with peak wavelengths of 600nm-635nm, prepared at a current density of ~10A / cm2. The yellow LED chip 10 is a high-efficiency AlGaInN material yellow LED chip, and the red LED chip 20 is a high-efficiency AlGaInP material red LED chip.

[0062] S2. Determine the target luminous flux Φ = 5000 ± 200 lm and current density J = 10 A / cm² for the golden yellow LED light source module. 2 .

[0063] S3. Select one yellow LED chip 10 and one red LED chip 20 from the light source database. At a current density J = 10 A / cm² 2 At that time, the peak wavelength of the selected yellow LED chip 10 was 545nm, the electro-optical conversion efficiency was 34%, and the spectrum is shown in the figure. Figure 8 As shown; the selected red LED chip 20 has a peak wavelength of 627nm and an electro-optical conversion efficiency of 61%, and its spectrum is shown in the figure. Figure 9 As shown. Based on the color temperature requirement of 1800K~2200K and the requirement of a color rendering index >70, and with a preset total luminous flux of 5000±200lm as a constraint, the calculation was performed at a current density J=10A / cm². 2 The total luminous flux of the selected yellow LED chip 10 is Φ1=2971lm and the total luminous flux of the selected red LED chip 20 is Φ2=2168lm.

[0064] S4. Based on Φ1 and Φ2 and the spectral and luminous flux parameters of the selected yellow LED chip 10 and red LED chip 20, calculate the required number of selected yellow LED chips 10 (N=62) and the required number of selected red LED chips 20 (M=80).

[0065] S5. Combine the selected yellow LED chip 10 and red LED chip 20 to form a golden yellow LED bead 13. The golden yellow LED bead 13 has two types: a first LED bead 30 and a second LED bead 40. For example... Figure 2 As shown, the first LED bead 30 consists of two yellow LED chips 10 and two red LED chips 20 arranged in a square and connected in series, with LED chips of the same color distributed diagonally; as shown Figure 3 As shown, the second LED chip 40 consists of one yellow LED chip 10 and two red LED chips 20 arranged in a triangle and connected in series; the number of first LED chips 30 is X = (2N-M) / 2 = 22, and the number of second LED chips 40 is Y = MN = 18. The color temperature of the first LED chip 30 is 2326K, and its spectrum is as follows. Figure 10 As shown, the color temperature of the second LED chip 40 is 1614K, and its spectrum is as follows: Figure 11 As shown.

[0066] A golden LED light source module is obtained by combining 22 first LED beads (30) and 18 second LED beads (40). The golden LED light source module has a color temperature of 2010K, a color rendering index Ra=71.5, and a luminous efficacy of 173.5lm / W. The spectrum of the golden LED light source module is as follows: Figure 12 As shown.

[0067] At 20A / cm 2 Below, the luminous efficacy of a golden LED light source module composed of original golden LED chips with a 1:1 ratio of yellow and red LED chips is 140 lm / W, at 10 A / cm². 2 The luminous efficacy was improved by 24% after optimizing the light distribution at low current density.

[0068] This embodiment also provides a golden yellow LED light source module, which is prepared by the above-described light distribution method.

[0069] This embodiment also provides a golden LED lamp including the above-mentioned golden LED light source module, such as... Figure 5As shown, the system includes a secondary optical lens 11, a transparent optical medium layer 12, 40 gold LED beads 13, a solder layer 14, a circuit board 15, a heat-conducting material 16, a heat sink 17, and a power supply 18. The gold LED beads 13 are connected to the circuit board 15 through the solder layer 14. The circuit board 15 is disposed on the heat sink 17, and the heat-conducting material 16 is provided between the circuit board 15 and the heat sink 17. The secondary optical lens 11 seals the gold LED beads 13, the solder layer 14, the circuit board 15, and the heat-conducting material 16 on the heat sink 17. The gold LED beads 13 have a planar package structure, and the transparent optical medium layer 12 is filled between the gold LED beads 13 and the secondary optical lens 11. The gold LED beads 13 include 22 first LED beads 30 and 18 second LED beads 40.

[0070] like Figure 7 As shown, the golden LED chip 13 includes a packaging substrate 131, a die-bonding layer 132, an LED chip 133, a Zener diode 134, gold wires 135, and a planar primary optical lens 136. The LED chip 133 is connected to the packaging substrate 131 through the die-bonding layer 132. The LED chip 133 and the Zener diode 134 are electrically connected to the packaging substrate 131 through the gold wires 135. The planar primary optical lens 136 seals the LED chip 133, Zener diode 134, die-bonding layer 132, and gold wires 135 on the packaging substrate 131. The golden LED chip 13 does not contain phosphor; the golden light is a mixture of yellow and red light.

[0071] The aforementioned 40 golden LED beads 13 are arranged in 20 strings and two parallel arrays on the circuit board, as follows: Figure 13 As shown, each series circuit consists of 11 first LED beads 30 and 9 second LED beads 40 connected in series. The current of each circuit is 100mA. The power supply adopts a high-voltage constant current output power supply with an output current of 200mA and an output voltage of 151V.

[0072] The primary optical lens is made of silicone (OE-6636 Dow Corning) with a refractive index of 1.54, while the secondary optical lens is made of PC with a refractive index of 1.58. The transparent optical medium layer is made of KMT-L7552 two-component silicone with a refractive index of 1.54 and does not contain an air medium layer. The KMT-L7552 two-component silicone forms a continuous optical medium with the primary and secondary optical lenses, and the refractive indices are similar. This reduces total internal reflection loss and Fresnel loss at different optical interfaces (primary optical lens / transparent optical medium layer / secondary optical lens interface) when light is emitted, which helps to improve the luminous efficacy of the golden LED.

[0073] The aforementioned secondary optical lens comprises several secondary optical lens packages, which are uniformly distributed in a rectangular shape. There are gaps between adjacent secondary optical lens packages. Along the length direction of the secondary optical lens package, the gap between adjacent secondary optical lens packages is one time the length of the secondary optical lens package. Along the width direction of the secondary optical lens package, the gap between adjacent secondary optical lens packages is one time the width of the secondary optical lens package. The larger gap between the lens packages can reduce the mutual absorption between the lenses when light is emitted, which is beneficial to improving the luminous efficacy of the golden LED lamp.

[0074] When the aforementioned golden LED lamp operates stably at an ambient temperature of 25℃, considering thermal steady-state losses, power losses, and material light absorption, the current is 10A / cm. 2 The luminous efficacy is 140 lm / W at low current density, and at 20 A / cm 2 Under these conditions, the luminous efficacy of a gold-plated LED lamp with a 1:1 ratio of yellow to red LED chips is 106 lm / W, at 10 A / cm². 2 The light distribution was optimized at low current density, and the luminous efficacy was improved by 32% after adopting a high-voltage scheme. Example 2

[0075] This embodiment provides a light distribution method for a golden yellow LED light source module. The golden yellow light is formed by mixing the light emitted from a yellow LED chip 10 and a red LED chip 20. The color temperature range of the golden yellow light is 1800K~2200K, and the color rendering index is >70. The light distribution method includes the following steps: S1: Test the voltage, peak wavelength, spectrum, and luminous flux parameters of various yellow LED chips 10 with peak wavelengths of 540nm-590nm and various red LED chips 20 with peak wavelengths of 600nm-635nm at current densities of 1~10A / cm2, and establish an LED light source database. The yellow LED chip is a high-efficiency AlGaInN material yellow LED chip, and the red LED chip is a high-efficiency AlGaInP material red LED chip.

[0076] S2. Determine the target luminous flux Φ = 5000 ± 200 lm and current density J = 5 A / cm² for the golden yellow LED light source module. 2 .

[0077] S3: Select one type of yellow LED chip 10 and two types of red LED chips 20 from the light source database; wherein, at 5A / cm 2 At that time, the selected yellow LED chip 10 had a peak wavelength of 548nm and an electro-optical conversion efficiency of 37%, as shown in the spectrum. Figure 14As shown; the selected first type of red LED chip 20 has a peak wavelength of 629nm and an electro-optical conversion efficiency of 63%, and its spectrum is shown in the figure. Figure 15 As shown; the selected second type of red LED chip 20 has a peak wavelength of 615nm and an electro-optical conversion efficiency of 50%, and its spectrum is shown in the figure. Figure 16 As shown. Based on the color temperature requirement of 1800K~2200K and the requirement of a color rendering index >70, and with a preset total luminous flux of 5000±200lm as a constraint, the current density J=5A / cm² was calculated. 2 The total luminous flux of the selected yellow LED chip is Φ1=3049lm, the total luminous flux of the first type of red LED chip is Φ2=1912lm, and the total luminous flux of the second type of red LED chip is Φ3=153lm.

[0078] S4. Based on the spectral and luminous flux parameters of Φ1, Φ2, and Φ3, as well as the selected yellow LED chip 10 and red LED chip 20, calculate the required total number of selected yellow LED chips N=120 and the total number of selected red LED chips M=150+10=160.

[0079] S5. Combine the selected yellow LED chip 10 and red LED chip 20 to form a golden yellow LED bead 13. The golden yellow LED bead 13 has two types: a first LED bead 30 and a second LED bead 40. For example... Figure 2 As shown, the first LED bead 30 consists of two yellow LED chips 10 and two red LED chips 20 arranged in a square and connected in series, with LED chips of the same color distributed diagonally; as shown Figure 3 As shown, the second LED chip 40 consists of one yellow LED chip 10 and two red LED chips 20 arranged in a triangle and connected in series; the number of first LED chips 30 is X = (2N-M) / 2 = 40, and the number of second LED chips 40 is Y = MN = 40. The first LED chip 30 is composed of a yellow LED chip and a first type of red LED chip, with a color temperature of 2385K and a spectrum as shown. Figure 17 As shown, the second LED chip 40 contains a second LED chip 40 with a color temperature of 1651K, composed of a yellow LED chip and a first type of red LED chip, and its spectrum is as follows. Figure 18 As shown, and the second LED chip 40, composed of a yellow LED chip and two types of red LED chips, has a color temperature of 1739K and a spectrum as shown. Figure 19 As shown.

[0080] A golden LED light source module is obtained by combining 40 first LED beads and 40 second LED beads. The color temperature of the golden LED light source module is 2051K, the color rendering index Ra=71.8, and the luminous efficacy is 182.6lm / W. The spectrum of the golden LED light source module is as follows: Figure 20 As shown.

[0081] At 20A / cm 2 Below, the luminous efficacy of a golden LED light source module composed of original golden LED chips with a 1:1 ratio of yellow and red LED chips is 138 lm / W, at 5 A / cm². 2 The luminous efficacy was improved by 32.3% after optimizing the light distribution at low current density.

[0082] This embodiment also provides a golden yellow LED light source module, which is prepared by the above-described light distribution method.

[0083] This embodiment also provides a golden LED lamp including the above-mentioned golden LED light source module, such as... Figure 5 As shown, the system includes a secondary optical lens 11, a transparent optical medium layer 12, 40 gold LED beads 13, a solder layer 14, a circuit board 15, a heat-conducting material 16, a heat sink 17, and a power supply 18. The gold LED beads 13 are connected to the circuit board 15 through the solder layer 14. The circuit board 15 is disposed on the heat sink 17, and the heat-conducting material 16 is provided between the circuit board 15 and the heat sink 17. The secondary optical lens 11 seals the gold LED beads 13, the solder layer 14, the circuit board 15, and the heat-conducting material 16 on the heat sink 17. The gold LED beads 13 have a planar package structure, and the transparent optical medium layer 12 is filled between the gold LED beads 13 and the secondary optical lens 11. The gold LED beads 13 include 40 first LED beads 30 and 40 second LED beads 40.

[0084] like Figure 7 As shown, the golden LED chip 13 includes a packaging substrate 131, a die-bonding layer 132, an LED chip 133, a Zener diode 134, gold wires 135, and a planar primary optical lens 136. The LED chip 133 is connected to the packaging substrate 131 through the die-bonding layer 132. The LED chip 133 and the Zener diode 134 are electrically connected to the packaging substrate 131 through the gold wires 135. The planar primary optical lens 136 seals the LED chip 133, Zener diode 134, die-bonding layer 132, and gold wires 135 on the packaging substrate 131. The golden LED chip 13 does not contain phosphor; the golden light is a mixture of yellow and red light.

[0085] The aforementioned 80 planar packaged LEDs are arranged in a 20-series, 4-parallel configuration on the circuit board, such as... Figure 21 As shown, each series circuit consists of 10 A LEDs and 10 B LEDs connected in series, with a current of 50mA per circuit. The power supply uses a high-voltage constant current output power supply with an output current of 200mA and an output voltage of 150V.

[0086] The aforementioned planar primary optical lens is made of silicone (KMT-1279) with a refractive index of 1.54, and the secondary optical lens is made of PMMA with a refractive index of 1.49. The aforementioned continuous optical medium layer is made of ZJ-6250D two-component silicone with a refractive index of 1.41, and does not contain an air medium layer. The ZJ-6250D two-component silicone forms a continuous optical medium with the primary and secondary optical lenses, and the refractive indices are similar, which can reduce total internal reflection loss and Fresnel loss at different optical interfaces (primary optical lens / transparent optical medium layer / secondary optical lens interface) when light is emitted, thus helping to improve the luminous efficacy of golden LED lamps.

[0087] The aforementioned secondary optical lens comprises several secondary optical lens packages, which are uniformly distributed in a rectangular shape. There are gaps between adjacent secondary optical lens packages. Along the length direction of the secondary optical lens package, the gap between adjacent secondary optical lens packages is 0.75 times the length of the secondary optical lens package. Along the width direction of the secondary optical lens package, the gap between adjacent secondary optical lens packages is 0.75 times the width of the secondary optical lens package. The larger gap between the lens packages can reduce the mutual absorption between the lenses when light is emitted, which is beneficial to improving the luminous efficacy of the golden LED lamp. Example 3

[0088] This embodiment provides a light distribution method for a golden yellow LED light source module. The golden yellow light is formed by mixing the light emitted from a yellow LED chip 10 and a red LED chip 20. The color temperature range of the golden yellow light is 1800K~2200K, and the color rendering index is >70. The light distribution method includes the following steps: S1: Test the voltage, peak wavelength, spectrum, and luminous flux parameters of various yellow LED chips 10 with peak wavelengths of 540nm-590nm and various red LED chips 20 with peak wavelengths of 600nm-635nm at current densities of 1~10A / cm2, and establish an LED light source database. The yellow LED chip is a high-efficiency AlGaInN material yellow LED chip, and the red LED chip is a high-efficiency AlGaInP material red LED chip.

[0089] S2. Determine the target luminous flux Φ = 5000 ± 200 lm and current density J = 3 A / cm² for the golden yellow LED light source module. 2 .

[0090] S3: Select two types of yellow LED chips 10 and two types of red LED chips 20 from the light source database; among them, at 3A / cm 2At that time, the peak wavelength of the first type of yellow LED chip 10 was 550nm. Considering the improvement in yellow LED manufacturing technology, the electro-optical conversion efficiency was 70%, and the spectrum was as follows: Figure 22 As shown; the peak wavelength of the selected second type of yellow LED chip 10 is 560nm. Considering the improvement in yellow LED manufacturing technology, the electro-optical conversion efficiency is 65%, and the spectrum is as follows. Figure 23 As shown; the selected first type of red LED chip 20 has a peak wavelength of 629nm, an electro-optical conversion efficiency of 65%, and a spectrum as shown. Figure 24 As shown; the selected second type of red LED chip 20 has a peak wavelength of 615nm, an electro-optical conversion efficiency of 60%, and a spectrum as shown. Figure 25 As shown; based on the color temperature requirement of 1800K~2200K and the requirement of a color rendering index >70, and with a preset total luminous flux of 5000±200lm as a constraint, the current density J=3A / cm² is calculated. 2 The total luminous flux of the first type of yellow LED chip 10 is Φ1=2536 lm, the total luminous flux of the second type of yellow LED chip 10 is Φ2=502 lm, the total luminous flux of the first type of red LED chip 20 is Φ3=1653 lm, and the total luminous flux of the second type of red LED chip 20 is Φ4=452 lm.

[0091] S4: Based on Φ1, Φ 2、 The total number of selected yellow LED chips 10 N = 92 + 20 = 112 and the total number of selected red LED chips 20 M = 204 + 40 = 24 are calculated based on the spectral and luminous flux parameters of Φ3, Φ4, and the selected yellow LED chip 10 and red LED chip 20.

[0092] S5: Combine the selected yellow LED chip 10 and red LED chip 20 to form a golden yellow LED bead 13. The golden yellow LED bead 13 has two types: a second LED bead 40 and a third LED bead 50. For example... Figure 3 As shown, the second LED chip 40 includes one yellow LED chip 10 and two red LED chips 20. The three LED chips are arranged in a triangle and connected in series, as shown below. Figure 4 As shown, the third LED chip 50 includes one yellow LED chip 10 and three red LED chips 20, arranged in a square and connected in series; the number of second LED chips 40 is X = (2N-M) / 2 = 92, and the number of third LED chips 50 is Y = MN = 20; among them, the second LED chips 40 include a second LED chip 40 with a color temperature of 2135K composed of the first type of yellow light and the first type of red light, and the spectrum is as follows. Figure 26 As shown, the second LED chip 40, composed of a second type of yellow light and a second type of red light, has a color temperature of 1834K and a spectrum as shown. Figure 27As shown, the third LED chip 50 is composed of the first type of yellow LED chip and the first type of red LED chip, with a color temperature of 1731K and a spectrum as shown. Figure 28 As shown.

[0093] A golden LED light source module is obtained by combining 92 second LED beads (40) and 20 third LED beads (50). The color temperature of the golden LED light source module is 1985K, the color rendering index Ra=80.7, and the luminous efficacy is 245.4lm / W. The spectrum of the golden LED light source module is as follows: Figure 29 As shown; This embodiment also provides a golden yellow LED light source module, which is prepared by the above-described light distribution method.

[0094] This embodiment also provides a golden LED lamp including the above-mentioned golden LED light source module, such as... Figure 5 As shown, the system includes a secondary optical lens 11, a transparent optical medium layer 12, 40 gold LED beads 13, a solder layer 14, a circuit board 15, a heat-conducting material 16, a heat sink 17, and a power supply 18. The gold LED beads 13 are connected to the circuit board 15 via the solder layer 14. The circuit board 15 is mounted on the heat sink 17, and the heat-conducting material 16 is provided between the circuit board 15 and the heat sink 17. The secondary optical lens 11 seals the gold LED beads 13, the solder layer 14, the circuit board 15, and the heat-conducting material 16 onto the heat sink 17. The gold LED beads 13 have a planar package structure, and the transparent optical medium layer 12 fills the space between the gold LED beads 13 and the secondary optical lens 11. The gold LED beads 13 include 92 second LED beads 40 and 20 third LED beads 50. Figure 7 As shown, the golden LED chip 13 includes a packaging substrate 131, a die-bonding layer 132, an LED chip 133, a Zener diode 134, gold wires 135, and a planar primary optical lens 136. The LED chip 133 is connected to the packaging substrate 131 through the die-bonding layer 132. The LED chip 133 and the Zener diode 134 are electrically connected to the packaging substrate 131 through the gold wires 135. The planar primary optical lens 136 seals the LED chip 133, Zener diode 134, die-bonding layer 132, and gold wires 135 on the packaging substrate 131. The golden LED chip 13 does not contain phosphor; the golden light is a mixture of yellow and red light.

[0095] The aforementioned 112 planar packaged LEDs are arranged in 28 series-4 parallel configurations on the circuit board, as follows: Figure 30 As shown, each series circuit consists of 23 B LEDs and 5 C LEDs connected in series, with a current of 30mA per circuit. The power supply uses a high-voltage constant current output power supply with an output current of 120mA and an output voltage of 177V.

[0096] The aforementioned planar primary optical lens is made of silicone (KMT-1275) with a refractive index of 1.54, while the secondary optical lens is made of optical glass with a refractive index of 1.52. The aforementioned continuous optical medium layer is made of ZJ-6250D two-component silicone with a refractive index of 1.41 and does not contain an air medium layer. The ZJ-6250D two-component silicone forms a continuous optical medium with the primary and secondary optical lenses, and the refractive indices are similar. This can reduce total internal reflection loss and Fresnel loss at different optical interfaces (primary optical lens / transparent optical medium layer / secondary optical lens interface) when light is emitted, which helps to improve the luminous efficacy of golden LED lamps.

[0097] The aforementioned secondary optical lens comprises several secondary optical lens packages, which are uniformly distributed in a rectangular shape. There are gaps between adjacent secondary optical lens packages. Along the length direction of the secondary optical lens package, the gap between adjacent secondary optical lens packages is 0.5 times the length of the secondary optical lens package. Along the width direction of the secondary optical lens package, the gap between adjacent secondary optical lens packages is 0.5 times the width of the secondary optical lens package. The larger gap between the lens packages can reduce the mutual absorption between the lenses when light is emitted, which is beneficial to improving the luminous efficacy of the golden LED lamp.

[0098] It should be noted that in the embodiments of this application, the ratio of yellow LED chips to red LED chips in the golden light lamp beads is 1:1 to 1:3, demonstrating the arrangement of yellow and red LED chips on a substrate that can hold up to four chips. If the substrate can hold more than four chips, but the ratio of yellow LED chips to red LED chips is 1:1 to 1:3, it should also fall within the scope of protection of this application. It should also be noted that the types of yellow and red LED chips used in the light distribution method are not limited to the 1-2 types mentioned in the embodiments; adding more types of chips should also be within the scope of protection of this application.

Claims

1. A light distribution method for a golden LED light source module, characterized in that: The golden light is formed by mixing the light emitted from a yellow LED chip and a red LED chip. The color temperature range of the golden light is 1800K~2200K, and the color rendering index is >70. The light distribution method includes the following steps: S1, Test 1A / cm 2 ~10A / cm 2 A database of LED light source parameters, including voltage, peak wavelength, spectrum, and luminous flux parameters of yellow and red LED chips prepared at current density, was established. S2. Determine the target luminous flux Φ of the golden yellow LED light source module and the current density J of the golden yellow LED chip and the red LED chip, wherein the current density J is in the range of 1~10A / cm. 2 ; S3. Select yellow LED chips and red LED chips from the light source database. Based on the target luminous flux of the golden yellow LED light source module, calculate the total luminous flux Φ1 of the selected yellow LED chips and the total luminous flux Φ2 of the red LED chips that meet the requirements of golden yellow color temperature and color rendering index under the current density J. S4. Calculate the required number of selected yellow LED chips N and selected red LED chips M based on Φ1 and Φ2 and the spectral and luminous flux parameters of the selected yellow LED chip and red LED chip, wherein 1 < M / N ≤ 3. S5. Combine the selected yellow LED chip and red LED chip to form a golden light lamp bead, wherein the color temperature range of the golden light lamp bead is 1500K-2500K; combine the golden light lamp beads to obtain a golden light LED light source module.

2. The light distribution method for the golden LED light source module according to claim 1, characterized in that: In step S4, M and N satisfy the relationship N < M ≤ 2N. Therefore, the golden light LED beads in step S5 include a first LED bead and a second LED bead. The first LED bead consists of two yellow LED chips and two red LED chips arranged in a square and connected in series, with LED chips of the same color distributed diagonally. The second LED bead consists of one yellow LED chip and two red LED chips arranged in a triangle and connected in series. The number of the first LED beads is X and the number of the second LED beads is Y, where X = (2N - M) / 2 and Y = MN.

3. The light distribution method for the golden LED light source module according to claim 1, characterized in that: In step S4, M and N satisfy the relationship 2N < M ≤ 3N. Therefore, the golden light LED beads in step S5 include a second LED bead and a third LED bead. The second LED bead is composed of one yellow LED chip and two red LED chips arranged in a triangle and connected in series. The third LED bead is composed of one yellow LED chip and three red LED chips arranged in a square and connected in series. The number of the second LED beads is Y and the number of the third LED beads is Z, where Y = 3N - M and Z = M - 2N.

4. The light distribution method for the golden LED light source module according to claim 1, characterized in that: The yellow LED chip is a high-efficiency AlGaInN material yellow LED chip with a peak wavelength range of 540nm-590nm; the red LED chip is a high-efficiency AlGaInP material red LED chip with a peak wavelength range of 600nm-635nm.

5. The light distribution method for the golden LED light source module according to claim 1, characterized in that: The red LED chips selected from the light source database in step S3 include a first red LED chip and a second red LED chip. The peak wavelength range of the first red LED chip is 620nm-635nm, and the peak wavelength range of the second red LED chip is 610nm-620nm.

6. A golden LED light source module, characterized in that: It is prepared by the light distribution method according to any one of claims 1-5.

7. A golden LED lamp, characterized in that: Includes the golden LED light source module as described in claim 6.

8. The golden LED lamp according to claim 7, characterized in that: The device includes a secondary optical lens, a transparent optical medium layer, several golden LED beads, a soldering layer, a circuit board, a heat-conducting material, a heat sink, and a power supply. The golden LED beads are connected to the circuit board via the soldering layer. The circuit board is mounted on the heat sink, and a heat-conducting material is provided between the circuit board and the heat sink. The secondary optical lens seals the several golden LED beads, the soldering layer, the circuit board, and the heat-conducting material on the heat sink. The golden LED beads have a planar package structure, and a transparent optical medium layer is filled between the golden LED beads and the secondary optical lens.

9. The golden LED lamp according to claim 8, characterized in that: The gold-colored LED beads are uniformly distributed in a rectangular shape on the circuit board; the secondary optical lens comprises several secondary optical lens packages; each gold-colored LED bead has a corresponding and individual secondary optical lens package above it to control the light pattern of the gold-colored LED bead; there are gaps between adjacent secondary optical lens packages, wherein, along the length direction of the secondary optical lens package, the gap between adjacent secondary optical lens packages is ≥ 0.5 times the length of the secondary optical lens package, and along the width direction of the secondary optical lens package, the gap between adjacent secondary optical lens packages is ≥ 0.5 times the width of the secondary optical lens package; the power supply is a high-voltage DC power supply with an output DC voltage of 72V-284V; the material of the planar primary optical lens is silicone or epoxy resin; the material of the secondary optical lens is one of polycarbonate, polymethyl methacrylate, glass, epoxy resin, and silicone; the material of the transparent optical medium layer has a refractive index of 1.4-1.6 and a transmittance > 99%.

10. The golden LED lamp according to claim 8, characterized in that: The golden light LED bead includes a packaging substrate, a die-bonding layer, an LED chip, a Zener diode, gold wires, and a planar primary optical lens; the LED chip is connected to the packaging substrate through the die-bonding layer; the LED chip and the Zener diode are electrically conducted to the packaging substrate through the gold wires; the planar primary optical lens seals the LED chip, Zener diode, die-bonding layer, and gold wires on the packaging substrate.

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