AR (Augmented Reality) module, light display assembly and packaging method thereof

Abstract

The invention belongs to the technical field of camera AR / VR, and particularly relates to a light display assembly which comprises a substrate and a molded base, the top of the substrate is connected with an LED display screen in an attached mode, gold wires are electrically connected between the two sides of the top of the substrate and the top of the LED display screen, the top of the LED display screen is provided with an isolation rubber layer, and the isolation rubber layer is arranged on the substrate. An isolation rubber layer is arranged on the top of an LED display screen, a molded base bearing table is replaced with the isolation rubber layer, a supporting platform is provided for an I-R light filter, stress buffering is provided for the I-R light filter, breakage of the I-R light filter caused by stress conduction is reduced, the isolation rubber layer is arranged at the position of a non-display area of the LED display screen, and in the molding forming process, the isolation rubber layer is not prone to deformation, so that the service life of the LED display screen is prolonged, and the service life of the LED display screen is prolonged. The isolating rubber layer is used for isolating the molding material from entering an effective display area of the LED display screen, so that the photosensitive element is prevented from being polluted in a molding process.

Description

Technical Field

[0001] This invention belongs to the field of camera AR / VR technology, and specifically relates to an AR module and a light display component and their packaging method. Background Technology

[0002] AR module packaging technology involves attaching an LED display screen to a circuit board assembly using adhesive, then connecting the circuit board and the LED display screen for conductivity via gold wires. The circuit board also incorporates capacitors, resistors, and other electronic components to control the output current, thus ensuring optimal display performance. With the increasing prevalence and development of AR & VR devices, AR modules are increasingly demanding multi-functional integration, thinness, and miniaturization. This aims to reduce the volume occupied by the AR module in AR smart electronic devices. Therefore, applying MOC (Modular Object Packaging) technology to AR modules can reduce their dimensions and thickness.

[0003] For AR modules, there are relatively fragile but highly sensitive electronic components, especially LED displays. When applying MOC (Modular Molding) technology to AR modules, during the molding process, on the one hand, a sealed environment needs to be set up for the effective light-emitting area of ​​the LED display to prevent the flowable molding material from seeping into the effective light-emitting area of ​​the LED display and causing it to malfunction; on the other hand, although MOC can reduce the corresponding size, as AR modules become larger and larger to meet the requirements of a more saturated viewing angle, the corresponding protective device, the IR filter (which protects the LED display), is becoming increasingly larger. This IR filter is directly assembled onto the top surface of the molding base so that the IR filter is held above the display area of ​​the LED display by the sealing molding part.

[0004] Furthermore, the molded base is a solid state after molding and has a certain degree of hardness, while the IR filter is made of fragile materials. When the IR filter is assembled onto the molded base, it is inevitable that it will break due to the stress between them. If it is directly attached to the LED display screen and then the molded base is formed, the molding surface of the mold needs to be pressed against the IR filter, which may damage the IR filter. Moreover, the molded base is usually a thermosetting material, which needs to be thermoset at a relatively high temperature. This will cause the adhesive connecting the IR filter and the LED display screen to shrink after curing, resulting in uneven stress on the IR filter, causing cracks or even breakage. Summary of the Invention

[0005] To address the aforementioned issues, this invention provides a light display component, comprising a substrate and a molded base. An LED display screen is attached to the top of the substrate, and gold wires are electrically connected between the top two sides of the substrate and the top of the LED display screen. An insulating adhesive layer is provided on the top of the LED display screen.

[0006] Furthermore, several sets of electronic devices are provided on the top two sides of the substrate, and several sets of sealing cavities for snapping into the several sets of electronic devices are opened on the bottom two sides of the molded base.

[0007] Furthermore, the bottom of the molded base is provided with an inner edge groove for fitting and connecting to the insulating adhesive layer.

[0008] Furthermore, the top of the molded base is provided with an outer edge groove, and an IR filter is attached and connected in the outer edge groove.

[0009] The AR module of this invention includes the light-displaying component and the LED display panel. The light-displaying component is the light-displaying component as described in any of the above embodiments, and the outer wall of the LED display panel is provided with two sets of cutting channels.

[0010] Furthermore, the two sets of cutting channels are arranged in an interlaced manner, and the central axis of the two sets of cutting channels coincides with the central axis of the LED display panel.

[0011] Furthermore, the LED display panel utilizes two sets of cutting channels to divide the edge of the LED display panel into four non-display areas.

[0012] Furthermore, each of the four non-display areas is equipped with a light-emitting component.

[0013] Furthermore, each set of light-displaying components has several sets of screen PADs on both sides, and the several sets of screen PADs are embedded in the non-display area.

[0014] Furthermore, several groups of screen PAD points are longitudinally distributed at equal intervals along the edge of the LED display panel and on the side of the LED display panel near the cutting channel.

[0015] The beneficial effects of this invention are:

[0016] An insulating layer is installed on the top of the LED display screen, replacing the molded base support platform. This provides a support platform for the IR filter, buffers stress on the IR filter, and reduces the risk of breakage due to stress transmission. The insulating layer is placed in the non-display area of ​​the LED display screen and, during the molding process, prevents the molding material from entering the effective display area of ​​the LED display screen, thus preventing contamination of the photosensitive element during the molding process.

[0017] Other features and advantages of the invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of the invention may be realized and obtained by means of the structures pointed out in the description, claims and drawings. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 A schematic diagram showing the structural connection of the AR module and the light display component according to an embodiment of the present invention is shown;

[0020] Figure 2 A cross-sectional view of the structure of a light-displaying component according to an embodiment of the present invention is shown.

[0021] In the diagram: 1. LED display panel; 2. Cutting channel; 3. Light display component; 31. Substrate; 32. LED display screen; 33. Isolation adhesive layer; 34. Gold wire; 35. Electronic components; 36. Molded base; 37. IR filter; 4. Non-display area; 5. Screen PAD dots. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0023] This invention provides an AR module, including an LED display panel 1; for example, such as... Figure 1 As shown.

[0024] The outer wall of the LED display panel 1 is provided with two sets of cutting channels 2. The two sets of cutting channels 2 are arranged in an interlaced manner, and the central axis of the two sets of cutting channels 2 coincides with the central axis of the LED display panel 1. The LED display panel 1 uses the two sets of cutting channels 2 to divide the edge of the LED display panel 1 into four sets of non-display areas 4. Each of the four sets of non-display areas 4 is provided with a light display component 3. Each set of light display components 3 has several sets of screen PAD dots 5 on both sides, and the several sets of screen PAD dots 5 are embedded in the non-display area 4.

[0025] Furthermore, several groups of screen PAD points 5 are longitudinally distributed at equal intervals along the edge of the LED display panel 1 and on the side of the LED display panel 1 near the cutting channel 2.

[0026] Specifically, the LED display panel 1 is used to assemble several groups of light-emitting components 3, and the LED display panel 1 is divided into multiple groups of light-emitting components 3 by using the designed cutting channels 2. The screen PAD points 5 are distributed on both sides of the light-emitting components 3 by using the non-display areas 4 at the edges of the multiple groups of light-emitting components 3, thereby increasing the specific functional areas or contact points of the light-emitting components 3, so that users or technicians can correct the touch sensitivity of the light-emitting components 3 through the screen PAD points 5.

[0027] The light-emitting component 3 includes a substrate 31 and a molded base 36; for example, such as Figure 2 As shown.

[0028] An LED display screen 32 is attached to the top of the substrate 31. Gold wires 34 are electrically connected between the top two sides of the substrate 31 and the top of the LED display screen 32. An isolation layer 33 is provided on the top of the LED display screen 32. Several sets of electronic devices 35 are also provided on the top two sides of the substrate 31. Several sets of sealing cavities for snapping into several sets of electronic devices 35 are opened on the bottom two sides of the molded base 36. An inner edge groove for attaching to the isolation layer 33 is opened on the bottom of the molded base 36. An outer edge groove is opened on the top of the molded base 36, and an IR filter 37 is attached to the outer edge groove.

[0029] Furthermore, the substrate 31, LED display screen 32, gold wire 34, and electronic device 35 are all electrically connected to the IR filter 37.

[0030] Specifically, an isolation layer 33 is provided on the top of the LED display screen 32. The isolation layer 33 replaces the molded base support platform to provide a support platform for the IR filter 37, and provides stress buffer for the IR filter 37, reducing the risk of the IR filter 37 breaking due to stress transmission. The isolation layer 33 is located in the non-display area 4 of the LED display screen 32. In the molding process, the isolation layer 33 isolates the molding material from entering the effective display area of ​​the LED display screen 32, so as to prevent the photosensitive element from being contaminated in the molding process.

[0031] The working principle of the AR module and light display component proposed in this embodiment of the invention is as follows:

[0032] An insulating adhesive layer 33 is provided on the top of the LED display screen 32. The insulating adhesive layer 33 replaces the molded base support platform to provide a support platform for the IR filter 37, and provides stress buffer for the IR filter 37, reducing the risk of the IR filter 37 breaking due to stress transmission. The insulating adhesive layer 33 is located in the non-display area 4 of the LED display screen 32. In the molding process, the insulating adhesive layer 33 isolates the molding material from entering the effective display area of ​​the LED display screen 32, so as to prevent the photosensitive element from being contaminated in the molding process.

[0033] Based on the aforementioned AR module and light-emitting component, this embodiment of the invention also provides a packaging method for the AR module and light-emitting component, comprising the following steps:

[0034] The LED display panel 1 is cut into individual small pieces using the cutting channel 2 (laser cutting);

[0035] Next, the LED chips are glued to the substrate 31, and the gold wire is made to conduct the gold wire to the substrate 31 using a gold wire bonding machine, so that the LED display screen 32 can light up and operate normally.

[0036] The MOC (Metal Oxide-Crust) process is used for sealing and wrapping.

[0037] Furthermore, the MOC process involves heating the molding material through a mold to make it a flowable plastic material. The mold is designed with flow channels to guide the flowable plastic material into the designated mold. The mold is divided into male and female molds. When the flowable plastic material reaches the designated position, the male and female molds need to be closed. Once the flowable plastic material fills the mold cavity, the male and female molds are opened, and the MOC is completed.

[0038] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A light-emitting component, characterized in that: It includes a substrate (31) and a molded base (36). An LED display screen (32) is attached to the top of the substrate (31). Gold wires (34) are electrically connected between the top two sides of the substrate (31) and the top of the LED display screen (32). An isolation adhesive layer (33) is provided on the top of the LED display screen (32).

2. The light-displaying component according to claim 1, characterized in that: Several sets of electronic devices (35) are also provided on the top two sides of the substrate (31), and several sets of sealing cavities for snapping into the several sets of electronic devices (35) are opened on the bottom two sides of the molded base (36).

3. The light-displaying component according to claim 2, characterized in that: The bottom of the molded base (36) has an inner edge groove for fitting and connecting to the insulating adhesive layer (33).

4. The light-displaying component according to claim 3, characterized in that: The top of the molded base (36) is provided with an outer edge groove, and an IR filter (37) is attached to the outer edge groove.

5. An AR module, characterized in that, The device includes the light-displaying component and the LED display panel (1). The light-displaying component is the light-displaying component as described in any one of claims 1-4. The outer wall of the LED display panel (1) is provided with two sets of cutting channels (2).

6. The AR module according to claim 5, characterized in that: The two sets of cutting channels (2) are arranged in an interlaced manner, and the central axis of the two sets of cutting channels (2) coincides with the central axis of the LED display panel (1).

7. The AR module according to claim 6, characterized in that: The LED display panel (1) uses two sets of cutting channels (2) to divide the edge of the LED display panel (1) into four sets of non-display areas (4).

8. The AR module according to claim 7, characterized in that: Each of the four groups of non-display areas (4) is equipped with a light-displaying component (3).

9. The AR module according to claim 8, characterized in that: Each of the light-displaying components (3) has several sets of screen PAD points (5) on both sides, and the several sets of screen PAD points (5) are embedded in the non-display area (4).

10. The AR module according to claim 9, characterized in that: Several sets of screen PAD points (5) are longitudinally distributed at equal intervals at the edge of the LED display panel (1) and on the side of the LED display panel (1) near the cutting channel (2).

Images