Chemical nickel plating solution for surface treatment of composite protection conductive terminal, method for surface treatment of composite protection conductive terminal and product of composite protection conductive terminal
By using chemical nickel plating solution and micro-arc oxidation treatment, a uniform and dense nickel plating layer is formed, which solves the problem of insufficient bonding strength of the metal plating layer of conductive terminals and improves their durability and electrical stability in corrosive environments.
Patent Information
- Application Number
- CN202511137241.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-14
- Publication Date
- 2025-11-25
AI Technical Summary
In corrosive environments, the bonding strength between the metal plating layer and the substrate of conductive terminals is insufficient, making them prone to peeling off under complex working conditions such as mechanical vibration and temperature changes, which affects electrical performance and service life.
A chemical nickel plating solution is used, which contains components such as nickel salt, thiourea, reducing agent, complexing agent, stabilizer, wetting agent and surfactant. A uniform and dense nickel plating layer is formed on the surface of the conductive terminal through chemical nickel plating, and combined with micro-arc oxidation treatment, the adhesion between the plating layer and the substrate is enhanced.
It improves the bonding strength between the coating and the substrate, reduces coating peeling, enhances the corrosion resistance and electrical properties of the conductive terminals, and extends their service life.
Smart Images
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Abstract
Description
Technical Field
[0001] This application relates to the field of conductive terminal surface treatment technology, and more specifically, to a chemical nickel plating solution for surface treatment of composite protective conductive terminals, a method for surface treatment of composite protective conductive terminals, and a product thereof. Background Technology
[0002] As a key component for achieving electrical connections, the performance of conductive terminals directly affects the stability and reliability of the entire circuit. However, conductive terminals often face complex environmental conditions in practical applications, especially corrosive environments, which pose a severe challenge to their performance.
[0003] Corrosive environments typically contain various chemical media, such as acids, alkalis, salts, and oxygen. When these chemicals come into contact with the surface of conductive terminals, they react to form corrosion products. For example, in humid air, the metal on the surface of a conductive terminal reacts with oxygen to form oxides; in a saline environment, chloride ions penetrate the oxide film on the metal surface, initiating deeper corrosion. The formation of corrosion products increases the surface roughness and resistance of the conductive terminals, and may even trigger localized electrochemical reactions, further accelerating the corrosion process and ultimately affecting the electrical performance of the conductive terminals and reducing their service life.
[0004] To improve the durability of conductive terminals in corrosive environments, surface plating technology is widely used in the industry. By plating one or more layers of metal, such as nickel, gold, tin, or zinc, the corrosion resistance of conductive terminals can be significantly improved. These metals can form a dense oxide film in air, effectively preventing external corrosive media from contacting the base metal. For example, nickel plating has good hardness and corrosion resistance, while gold plating is widely used in high-requirement electrical connection parts due to its excellent chemical stability.
[0005] However, the bonding strength between the metal plating layer and the conductive terminal substrate in existing technologies remains insufficient. During long-term use, especially under complex conditions such as mechanical vibration and temperature changes, the plating layer is prone to peeling. Once the plating layer peels off, the surface of the conductive terminal will be re-exposed to the corrosive environment, leading to a decrease in electrical contact stability and potentially causing safety hazards such as short circuits. Summary of the Invention
[0006] To address the issue of limited bonding strength between conductive terminals and the metal plating layer, this application provides a chemical nickel plating solution for surface treatment of composite protective conductive terminals, a method for surface treatment of composite protective conductive terminals, and the product thereof.
[0007] In a first aspect, this application provides a chemical nickel plating solution for surface treatment of composite protective conductive terminals, employing the following technical solution: A chemical nickel plating solution for surface treatment of composite protective conductive terminals, using water as a solvent, comprises the following components according to concentration: nickel salt 20-45 g / L Thiourea 80-100g / L Reducing agent 20-35g / L Methylsulfonic acid 20-30 g / L Complexing agent 15-30g / L Tetrasodium iminodisuccinate 30-40 g / L stabilizer 10-30g / L wetting agent 15-40g / L Surfactant 3-6g / L Bismuth acetate 0.5-1 g / L Sodium hexametaphosphate 20-40 g / L Ethylhexyl sulfate 1-2 g / L; The surfactant is composed of hexadecyltrimethylammonium bromide and cocamidopropyl betaine in a weight ratio of 1:(3-6).
[0008] By adopting the above-mentioned technical solution, the conductive terminals treated with this chemical nickel plating solution are less prone to peeling and delamination of the nickel plating layer and the conductive terminals. Even under the influence of complex working conditions such as mechanical vibration and temperature changes during long-term use, they can still maintain good bonding performance, effectively blocking the erosion of corrosive media, thereby extending the service life of the conductive terminals.
[0009] In this application, a uniform nickel plating layer is formed on the surface of the conductive terminal through a chemical reaction. Nickel-phosphorus alloys possess excellent corrosion resistance and can form a dense protective film in corrosive environments, effectively blocking contact between corrosive media such as acids, alkalis, salts, and oxygen and the base metal, thus enhancing corrosion resistance. Simultaneously, tetrasodium iminodisuccinate can regulate the concentration and reaction rate of metal ions in the plating solution, resulting in more uniform plating deposition and further enhancing the adhesion between the plating layer and the substrate, effectively reducing peeling under complex conditions such as mechanical vibration and temperature changes. Thiourea in the plating solution refines the grain size, making the microstructure of the plating layer more compact, thereby improving the overall strength and toughness of the plating layer and enhancing its anti-peeling ability. Bismuth acetate additive promotes uniform growth of the plating layer, further optimizing the microstructure and improving the adhesion strength between the plating layer and the substrate. Sodium hexametaphosphate and stabilizers stabilize the chemical properties of the plating solution, preventing unnecessary chemical reactions of metal ions in the plating solution, thereby ensuring the quality and performance of the plating layer. In addition, stable coating chemistry also helps improve the durability of conductive terminals in complex corrosive environments, enabling them to maintain good electrical and physical properties during long-term use.
[0010] Components such as reducing agents and methanesulfonic acid promote uniform deposition of the coating, resulting in a smoother and more even coating on the conductive terminal surface, reducing surface roughness, and improving the adhesion between the coating and the conductive terminal. A smooth surface reduces the adhesion and accumulation of corrosive media, thus lowering the corrosion rate and improving the electrical contact performance of the conductive terminal, reducing contact resistance. The addition of wetting agents and surfactants reduces the surface tension of the plating solution, improving its dispersibility and wettability on the conductive terminal surface. This allows the plating solution to more evenly cover all parts of the conductive terminal, including complex shapes and corners, contributing to improved coating uniformity and preventing localized corrosion and performance differences caused by uneven coating thickness. Components such as complexing agents and stabilizers regulate the concentration and reaction rate of metal ions in the plating solution, resulting in a more uniform and stable deposition rate.
[0011] The synergistic use of hexadecyltrimethylammonium bromide and cocamidopropyl betaine forms an adsorption layer on the surface of the conductive terminal, enhancing the interaction between the plating solution and the base metal. This improves the wettability and adhesion between the two, ensuring a tight bond between the plating layer and the base metal during deposition. This strengthens the bond and effectively reduces peeling under complex conditions. Simultaneously, it promotes more uniform plating spread on the conductive terminal surface, reducing uneven plating thickness caused by surface tension variations. This ensures uniform deposition, preventing localized areas of excessive thickness or thinness, thus improving the overall uniformity and quality of the plating.
[0012] Preferably, the reducing agent is composed of sodium borohydride and sodium gluconate in a weight ratio of 5:(1-2).
[0013] Sodium borohydride, as a strong reducing agent, can rapidly reduce nickel ions, accelerate coating deposition, and improve production efficiency. However, using sodium borohydride alone may lead to excessively rapid coating deposition, resulting in uneven thickness and defects. The addition of sodium gluconate effectively solves this problem. As a mild reducing agent, it can regulate the reduction rate of the plating bath, making the coating deposition more uniform, reducing defects such as porosity and cracks, and improving the density and corrosion resistance of the coating.
[0014] Furthermore, sodium gluconate can stabilize the chemical properties of the plating bath, prevent metal ion precipitation or aggregation, adjust the pH value of the plating bath, and extend the service life of the plating bath. This combination also reduces the impact of impurities and contaminants in the plating bath on the coating quality, further optimizing the uniformity and adhesion of the coating. Through this synergistic effect, the surface coating of the conductive terminals is smoother and flatter, the contact resistance is reduced, and the electrical performance is improved. At the same time, the uniform and dense coating can better block corrosive media, extending the service life of the conductive terminals in corrosive environments.
[0015] Preferably, the complexing agent is composed of sodium oxalate, potassium sodium tartrate, and disodium ethylenediaminetetraacetate in a weight ratio of (2-5):(1-3):7.
[0016] Sodium oxalate and potassium sodium tartrate, as mild complexing agents, can adjust the pH of the plating bath, ensuring that the reaction takes place under optimal conditions. They also form stable complexes with nickel ions, preventing metal ion precipitation or aggregation. Disodium ethylenediaminetetraacetate further enhances the stability of the plating bath. By forming a very stable complex with nickel ions, it significantly improves the chemical stability of the plating bath and extends its service life.
[0017] The synergistic effect of this combination ensures uniform deposition of the coating on the surface of the conductive terminal, reducing inconsistent coating thickness caused by uneven plating solution. Simultaneously, the complexing agent reduces impurities and bubbles in the plating solution, preventing defects such as porosity and cracks, significantly improving the density and corrosion resistance of the coating. A uniform and dense coating better prevents corrosive media from contacting the base metal, extending the service life of the conductive terminal in corrosive environments.
[0018] Preferably, the stabilizer is composed of benzotriazole, urea and polyethylene glycol in a weight ratio of (6-10):(1-3):5.
[0019] By adopting the above technical solutions, the stability of electroless nickel plating solution is improved, ensuring that the plating solution remains stable within a wide pH range. This avoids the degradation of plating quality caused by pH changes, makes it easier for the plating solution to evenly cover the surface of conductive terminals, improves the uniformity and density of the plating layer, reduces impurities and bubbles in the plating solution, avoids the formation of defects such as pores and cracks, and further improves the quality and performance of the plating layer.
[0020] Preferably, the wetting agent comprises at least one of sodium dodecyl sulfate, sodium dodecylbenzene sulfonate, polyoxyethylene ether, ethylene glycol butyl ether, alkylphenol polyoxyethylene ether, fatty alcohol polyoxyethylene ether, polyoxypropylene ether, and alkyl glycoside.
[0021] By using the above-mentioned wetting agent, the wettability of the electroless nickel plating solution can be further improved, making it easier for the plating solution to spread on the surface of the conductive terminal, improving the density, uniformity and adhesion stability of the plating layer, ensuring that the plating layer is uniformly deposited on the surface of the conductive terminal, avoiding the problem of local excessive thickness or thinness, thereby enhancing the corrosion resistance of the plating layer.
[0022] Preferably, the nickel salt includes at least one of nickel sulfate, nickel acetate, and nickel hypophosphite.
[0023] By using the above-mentioned nickel salts, the performance of the plating solution can be improved, ensuring uniform deposition of the coating, reducing coating defects, enhancing corrosion resistance, and improving the adhesion of the coating to conductive terminals.
[0024] Secondly, this application provides a method for surface treatment of composite protective conductive terminals, employing the following technical solution: A method for surface treatment of a composite protective conductive terminal includes the following preparation steps: S1. Clean the surface of the conductive terminals; S2. Perform micro-arc oxidation treatment on the cleaned conductive terminals; S3. Electroless nickel plating is performed on the conductive terminals after micro-arc oxidation treatment to obtain composite protective conductive terminals; The electroless nickel plating solution used for electroless nickel plating is the electroless nickel plating solution for surface treatment of the composite protective conductive terminal described in the first aspect.
[0025] By employing the above technical solution, micro-arc oxidation treatment forms a dense ceramic oxide layer on the surface of the conductive terminal. This oxide layer possesses high hardness, good wear resistance, and corrosion resistance, significantly improving the surface performance of the conductive terminal. The ceramic oxide layer effectively prevents corrosive media from contacting the base metal, significantly improving the corrosion resistance of the conductive terminal and extending its service life. Simultaneously, the micro-arc oxidation layer provides a good bonding foundation for electroless nickel plating, enhancing the adhesion between the plating layer and the substrate and reducing the risk of plating peeling. Electroless nickel plating forms a uniform and dense nickel plating layer on the surface of the micro-arc oxidation layer, further enhancing the corrosion resistance of the conductive terminal while ensuring that the plating layer and the conductive terminal are not easily delaminated.
[0026] Preferably, the electroless nickel plating temperature is 50-60℃ and the time is 80-100 min.
[0027] By employing the above technical solutions and optimizing the time and temperature of electroless nickel plating, a dense structure can be formed in the coating, better preventing the penetration of corrosive media and enhancing the corrosion resistance of the conductive terminals. Simultaneously, it enables the coating to form good chemical bonds and physical intercalation with the substrate, ensuring sufficient coating growth and tight bonding with the substrate, thereby significantly improving coating adhesion. Even under complex operating conditions such as mechanical vibration and temperature changes, the coating is not easily peeled off, ensuring the long-term stability of the conductive terminals.
[0028] Preferably, the current density of the micro-arc oxidation is 5-15 A / dm². 2 The voltage is 200-600V, and the time is 10-30min.
[0029] By adopting the above technical solution and optimizing the current density, voltage, and time of micro-arc oxidation, a uniform and dense ceramic oxide layer can be formed on the surface of the conductive terminal. The oxide layer has good adhesion and can be tightly bonded to the base metal. At the same time, it provides a good bonding foundation for subsequent electroless nickel plating, which can enhance the adhesion between the plating layer and the substrate and reduce the risk of plating peeling.
[0030] Thirdly, this application provides a composite protective conductive terminal, which adopts the following technical solution: A composite protective conductive terminal, wherein the composite protective conductive terminal is prepared by the surface treatment method of the composite protective conductive terminal described in the second aspect.
[0031] By adopting the above technical solution, the composite protective conductive terminal is designed to withstand complex operating conditions such as mechanical vibration and frequent insertion and removal without the plating easily peeling off, ensuring the long-term stability of the conductive terminal. Simultaneously, it exhibits excellent corrosion resistance, significantly extending the service life of the conductive terminal in complex corrosive environments such as humid, salty, acidic, and alkaline conditions.
[0032] In summary, this application has the following beneficial effects: 1. The conductive terminals treated with the electroless nickel plating solution of this application have a tight bond between the nickel plating layer and the conductive terminal substrate. Even under the influence of complex working conditions such as mechanical vibration and temperature changes during long-term use, they can still maintain good bonding performance and are not prone to peeling or delamination.
[0033] 2. The nickel plating layer formed on the surface of the conductive terminal by the electroless nickel plating solution can generate a dense protective film in corrosive environments, effectively blocking the contact between corrosive media such as acids, alkalis, salts, and oxygen and the base metal, significantly enhancing the corrosion resistance of the conductive terminal and enabling it to remain stable in complex corrosive environments for a long time. Detailed Implementation Example
[0034] Example 1 A chemical nickel plating solution for surface treatment of composite protective conductive terminals is prepared by the following method: 20g of nickel salt (nickel sulfate), 80g of thiourea, 20g of reducing agent, 20g of methanesulfonic acid, 15g of complexing agent, 30g of tetrasodium iminodisuccinate, 10g of stabilizer, 15g of wetting agent (sodium dodecyl sulfate), 3g of surfactant, 0.5g of bismuth acetate, 20g of sodium hexametaphosphate, and 1g of ethylhexyl sulfate (sodium ethylhexyl sulfate) were dissolved in 1L of purified water to obtain a chemical nickel plating solution for surface treatment of composite protective conductive terminals.
[0035] The surfactant is composed of hexadecyltrimethylammonium bromide and cocamidopropyl betaine in a weight ratio of 1:3; the reducing agent is composed of sodium borohydride and sodium gluconate in a weight ratio of 5:1. The complexing agent is composed of sodium oxalate, potassium sodium tartrate, and disodium ethylenediaminetetraacetate in a weight ratio of 2:1:7. The stabilizer is composed of benzotriazole, urea and polyethylene glycol in a weight ratio of 6:1:5.
[0036] The difference between Examples 2-3 and Example 1 lies in the types, amounts, and parameters of the raw materials used to prepare the electroless nickel plating solution for the surface treatment of composite protective conductive terminals. Specific differences are shown in Table 1. Table 1. Raw material types, dosages, and parameters for preparing electroless nickel plating solutions for surface treatment of composite protective conductive terminals. Example 4 A chemical nickel plating solution for surface treatment of composite protective conductive terminals, the difference between this embodiment and Embodiment 1 is that the reducing agent is sodium borohydride 1,2-.
[0037] Example 5 A chemical nickel plating solution for surface treatment of composite protective conductive terminals. The difference between this embodiment and Embodiment 1 is that the complexing agent is composed of sodium oxalate and potassium sodium tartrate in a weight ratio of 2:1.
[0038] Example 6 A chemical nickel plating solution for surface treatment of composite protective conductive terminals. The difference between this embodiment and Example 1 is that the stabilizer is composed of benzotriazole and urea in a weight ratio of 6:1.
[0039] Comparative Example Comparative Example 1 A chemical nickel plating solution for surface treatment of composite protective conductive terminals. The difference between this comparative example and Example 1 is that the surfactant is hexadecyltrimethylammonium bromide.
[0040] Comparative Example 2 A chemical nickel plating solution for surface treatment of composite protective conductive terminals. The difference between this comparative example and Example 1 is that no surfactant is added.
[0041] Comparative Example 3 A chemical nickel plating solution for surface treatment of composite protective conductive terminals. The difference between this comparative example and Example 1 is that cyanoguanidine is used instead of thiourea.
[0042] Comparative Example 4 A chemical nickel plating solution for surface treatment of composite protective conductive terminals. The difference between this comparative example and Example 1 is that maleic acid is used instead of methanesulfonic acid.
[0043] Comparative Example 5 A chemical nickel plating solution for surface treatment of composite protective conductive terminals. The difference between this comparative example and Example 1 is that a certain substance is used instead of tetrasodium iminodisuccinate.
[0044] Comparative Example 6 A chemical nickel plating solution for surface treatment of composite protective conductive terminals. The difference between this comparative example and Example 1 is that cerium sulfate is used instead of bismuth acetate.
[0045] Comparative Example 7 A chemical nickel plating solution for surface treatment of composite protective conductive terminals. The difference between this comparative example and Example 1 is that sodium hypophosphite is used instead of sodium hexametaphosphate.
[0046] Comparative Example 8 A chemical nickel plating solution for surface treatment of composite protective conductive terminals. The difference between this comparative example and Example 1 is that ethylhexyl sulfate is not added.
[0047] Application examples Application Example 1 A method for surface treatment of a composite protective conductive terminal includes the following preparation steps: S1. Clean the surface of the conductive terminals; S2. Perform micro-arc oxidation treatment on the cleaned conductive terminals; The current density of micro-arc oxidation is 5 A / dm. 2 The voltage is 200V and the time is 30 minutes. S3. Electroless nickel plating is performed on the conductive terminals after micro-arc oxidation treatment to obtain composite protective conductive terminals; The electroless nickel plating temperature is 50℃ and the time is 80 minutes.
[0048] The electroless nickel plating solution used for electroless nickel plating is the electroless nickel plating solution for surface treatment of composite protective conductive terminals described in Example 1.
[0049] The difference between Application Example 2-3 and Application Example 1 lies in the different steps and parameters used in preparing the composite protective conductive terminal. The specific differences are shown in Table 2. Table 1. Steps and parameters for preparing composite protective conductive terminals The difference between Application Example 4-14 and Application Example 1 lies in the source of the electroless nickel plating solution used for the surface treatment of the composite protective conductive terminal. The specific differences are shown in Table 3: Table 3 Application Example 4-14 Source of electroless nickel plating solution for surface treatment of composite protective conductive terminals Application of comparative examples Application Comparative Example 1 A method for surface treatment of composite protective conductive terminals. The difference between this comparative example and application example 1 is that step S2 is omitted.
[0050] Detection methods / test methods Thermal shock test of coating adhesion: The box-type resistance furnace was heated to 280℃, the composite protective conductive terminal was placed in it, and after holding it at that temperature for 25 minutes, it was rapidly cooled in water at room temperature. This step was repeated 8 times. The surface was then observed with a 200x metallographic microscope. It was found that the coating had no blistering or cracks and the adhesion was very good.
[0051] Scratch test: Using a steel knife with a ground 30° acute angle, scratch 5 rows of square grids with a length and width of 1mm on the sample, and use strong adhesive tape to pull the coating in the grid in a vertical manner. Observe the peeling of the coating after the adhesive tape is pulled, and compare the strength of the adhesion.
[0052] Salt spray test: A neutral salt spray test was conducted according to the salt spray corrosion test standard of GB / T10125-97, with a test cycle of 24 hours. Then, the corrosion resistance level of the coating was evaluated according to the corrosion grade standard recommended by GB 5944-86. The specific method is as follows: A transparent plastic film or plexiglass plate with 5mm × 5mm squares was covered over the test area of the sample, dividing the test area into several squares with a side length of 5mm. The total number of squares was counted, denoted as N. Squares located at the edge of the sample that exceed half were counted as one square; those less than half were ignored. After the corrosion test, the number of corrosion points on the substrate and the number of squares corroded in the coating were counted, denoted as n. The corrosion rate was calculated using the formula: Corrosion rate (%) = 100 * n / N. The experimental data are shown in Table 4. Table 4. Experimental data from Application Examples 1-16 In thermal shock testing, the coatings in Examples 1-8 showed no blistering or cracking and had excellent adhesion, while the coatings in Examples 9-16 showed varying degrees of blistering or cracking and had poor adhesion. In the scratch test: the coatings in Examples 1-8 showed no peeling or flaking and had strong adhesion, while the coatings in Examples 9-16 showed varying degrees of peeling and had poor adhesion. In the corrosion resistance test, Application Examples 1-8 showed low corrosion rates and good corrosion resistance, while Application Examples 9-16 showed high corrosion rates and poor corrosion resistance. This indicates that the chemical nickel plating solution for surface treatment of composite protective conductive terminals prepared by the formulation in this application can effectively improve the adhesion, thermal stability and corrosion resistance of the plating layer.
[0053] Application examples 6-8 show that by optimizing the amount and type of reducing agent, complexing agent, and stabilizer, the adhesion, thermal stability, and corrosion resistance of the coating can be effectively improved.
[0054] Application examples 8-9 demonstrate that the composition and addition of surfactants have a significant impact on the adhesion and corrosion resistance of the coating. Surfactants can reduce the surface tension of the plating solution, improve the dispersibility and wettability of the plating solution on the surface of conductive terminals, thereby enhancing the uniformity and adhesion of the coating.
[0055] Application examples 10-16 show that the reasonable combination of thiourea, methanesulfonic acid, tetrasodium iminodisuccinate, bismuth acetate, sodium hexametaphosphate, and ethylhexyl sulfate can improve the adhesion, thermal stability, and corrosion resistance of the coating.
[0056] Comparative Example 1 shows that micro-arc oxidation treatment of conductive terminals is beneficial to improving the adhesion of the coating.
[0057] This specific embodiment is merely an explanation of this application and is not intended to limit it. After reading this specification, those skilled in the art can make modifications to this embodiment without contributing any inventive step, but such modifications are protected by patent law as long as they fall within the scope of the claims of this application.
Claims
1. A chemical nickel plating solution for surface treatment of composite protective conductive terminals, characterized in that, The electroless nickel plating solution uses water as a solvent and comprises the following components according to concentration: Nickel salt 20-45g / L Thiourea 80-100g / L Reducing agent 20-35g / L Methylsulfonic acid 20-30 g / L Complexing agent 15-30g / L Tetrasodium iminodisuccinate 30-40 g / L stabilizer 10-30g / L wetting agent 15-40g / L Surfactant 3-6g / L Bismuth acetate 0.5-1 g / L Sodium hexametaphosphate 20-40 g / L Ethylhexyl sulfate 1-2 g / L; The surfactant is composed of hexadecyltrimethylammonium bromide and cocamidopropyl betaine in a weight ratio of 1:(3-6).
2. The electroless nickel plating solution for surface treatment of composite protective conductive terminals according to claim 1, characterized in that: The reducing agent is composed of sodium borohydride and sodium gluconate in a weight ratio of 5:(1-2).
3. The electroless nickel plating solution for surface treatment of composite protective conductive terminals according to claim 1, characterized in that: The complexing agent is composed of sodium oxalate, potassium sodium tartrate, and disodium ethylenediaminetetraacetate in a weight ratio of (2-5):(1-3):
7.
4. The electroless nickel plating solution for surface treatment of composite protective conductive terminals according to claim 1, characterized in that: The stabilizer is composed of benzotriazole, urea and polyethylene glycol in a weight ratio of (6-10):(1-3):
5.
5. The electroless nickel plating solution for surface treatment of composite protective conductive terminals according to claim 1, characterized in that: The wetting agent includes at least one of sodium dodecyl sulfate, sodium dodecylbenzene sulfonate, polyoxyethylene ether, ethylene glycol butyl ether, alkylphenol polyoxyethylene ether, fatty alcohol polyoxyethylene ether, polyoxypropylene ether, and alkyl glycoside.
6. The electroless nickel plating solution for surface treatment of composite protective conductive terminals according to claim 1, characterized in that: The nickel salt includes at least one of nickel sulfate, nickel acetate, and nickel hypophosphite.
7. A method for surface treatment of composite protective conductive terminals, characterized in that, The preparation steps include the following: S1. Clean the surface of the conductive terminals; S2. Perform micro-arc oxidation treatment on the cleaned conductive terminals; S3. Electroless nickel plating is performed on the conductive terminals after micro-arc oxidation treatment to obtain composite protective conductive terminals; The electroless nickel plating solution used for electroless nickel plating is the electroless nickel plating solution for surface treatment of composite protective conductive terminals as described in any one of claims 1-6.
8. The method for surface treatment of a composite protective conductive terminal according to claim 7, characterized in that: The electroless nickel plating temperature is 50-60℃ and the time is 80-100min.
9. The method for surface treatment of a composite protective conductive terminal according to claim 7, characterized in that: The current density of the micro-arc oxidation is 5-15 A / dm², the voltage is 200-600 V, and the time is 10-30 min.
10. A composite protective conductive terminal, characterized in that: The composite protective conductive terminal is prepared by the surface treatment method of the composite protective conductive terminal according to any one of claims 7-9.