Display device

Abstract

A display device according to one embodiment of the present specification includes a display panel including a display area including pixels and a non-display area located around the display area, and a molding disposed on a side surface of the display panel, in which the display panel includes: a substrate; at least one panel inorganic layer on the substrate; a light emitting portion on the at least one panel inorganic layer; a touch portion including at least one touch inorganic layer on the light emitting portion and a touch electrode on the at least one touch inorganic layer; and a first touch organic layer on the touch portion, and the substrate, the at least one panel inorganic layer, and the first touch organic layer are in direct contact with the molding.

Description

[0001] Cross-references to related applications

[0002] This application claims priority to Korean Patent Application No. 10-2024-0069780, filed on May 29, 2024, the entire contents of which are incorporated herein by reference for all purposes. Technical Field

[0003] This specification relates to display devices, and more specifically to display devices capable of achieving narrow bezels and preventing crack propagation. Background Technology

[0004] With the development of the information society, the demand for display devices for displaying images is constantly increasing, and various types of display devices are being used, such as liquid crystal display (LCD) devices and organic light-emitting diode (OLED) display devices.

[0005] The display device includes multiple pixels and multiple switching elements for driving and controlling the pixels. Summary of the Invention

[0006] The embodiments described in this specification are intended to provide a display device with a narrow bezel.

[0007] Embodiments of this specification are also intended to provide a display device in which the rigidity of the trim line (or edge) is ensured.

[0008] Embodiments of this specification are also intended to provide a display device in which film lifting or peeling between membranes is improved by removing organic film steps on the clad part.

[0009] The embodiments described herein are also intended to provide a display device that reduces stress between membranes by enhancing the bonding strength between membranes and is robust to membrane warping.

[0010] The embodiments described herein are also intended to provide a display device that is robust to crack propagation.

[0011] The purpose of this specification is not limited to the purposes described above, and other technical purposes can be inferred from the following embodiments.

[0012] According to one embodiment, a display device is provided comprising a display panel and a molded part disposed on a side surface of the display panel. The display panel includes a display area and a non-display area surrounding the display area. The display panel comprises: a substrate; at least one panel inorganic layer on the substrate; a light-emitting portion on the at least one panel inorganic layer; a touch portion including at least one touch inorganic layer on the light-emitting portion and touch electrodes on the at least one touch inorganic layer; and a first touch organic layer on the touch portion. The substrate, the at least one panel inorganic layer, and the first touch organic layer are in direct contact with the molded part.

[0013] According to another embodiment, a display device is provided, comprising: a substrate including a display area containing pixels and a non-display area surrounding the display area; at least one panel inorganic layer on the substrate; a protective layer on the at least one panel inorganic layer; a light-emitting portion including an anode electrode on the protective layer, an organic layer on the anode electrode, and a cathode electrode on the organic layer; a dam covering the edge of the anode electrode and disposed between the anode electrode and the organic layer; and a covering portion including a spacer between the dam and the organic layer, located in the non-display area, and formed by the protective layer, the dam, or the spacer, wherein the at least one panel inorganic layer includes a first stop hole overlapping the covering portion and passing through the covering portion along the thickness direction of the display panel, and the covering portion fills the first stop hole and is in direct contact with the substrate.

[0014] The detailed description of other embodiments is included in the specific implementation and accompanying drawings. Attached Figure Description

[0015] Figure 1 This is a plan view of a display device according to one embodiment.

[0016] Figure 2 It shows the basis Figure 1 A cross-sectional view of the display panel in a bent state.

[0017] Figure 3 It shows the basis Figure 1 A plan view of the curved state of the display device.

[0018] Figure 4 It is along Figure 3 Cross-sectional view of the midline A-A'.

[0019] Figure 5 It is along Figure 3 Cross-sectional view of the midline B-B'.

[0020] Figure 6 yes Figure 5 Enlarged cross-sectional view of region Q1 in the middle.

[0021] Figure 7 It is along Figure 3 Cross-sectional view of the midline C-C'.

[0022] Figure 8 yes Figure 7 Enlarged cross-sectional view of region Q2 in the middle.

[0023] Figure 9 This is a cross-sectional view of the display device based on the comparative example.

[0024] Figure 10 This is a cross-sectional view of a display device according to another embodiment.

[0025] Figure 11 This is a schematic diagram showing a crack formed at the end of the display panel and blocked by a first stop hole and a second stop hole.

[0026] Figure 12 Is showing the removal based on Figure 10 A schematic diagram of the process of cutting out a portion of the display device.

[0027] Figure 13 This is a cross-sectional view of a display device according to yet another embodiment.

[0028] Figure 14 yes Figure 13 Enlarged cross-sectional view of region Q3 in the middle. Detailed Implementation

[0029] In the following description, embodiments will be described with reference to the accompanying drawings.

[0030] The same reference numerals indicate the same parts. Furthermore, in the figures, the thickness, scale, and dimensions of parts may be enlarged for effective description of the technical content. For ease of description, the scale of the parts shown in the figures differs from the actual scale, and is therefore not limited to the scale shown in the figures.

[0031] In the specification, when a first component (or area, layer, part, etc.) is described as "on the second component", "connected" or "coupled to" the second component, it means that the first component can be directly connected / coupled to the second component, or that a third component can be provided between the first component and the second component.

[0032] The term "and / or" includes all one or more combinations that can be defined by the associated configuration.

[0033] Terms such as "first" and "second" can be used to describe various components, but components are not limited by these terms. These terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the implementation, a first component may be referred to as a second component, and similarly, a second component may be referred to as a first component. Unless the context clearly specifies otherwise, the singular includes the plural.

[0034] Terms such as “below,” “under,” “above,” and “on top” are used to describe the relationship between the components shown in the figures. These terms are relative concepts and describe the direction relative to the markings in the figures. For example, one or more other parts may be positioned between two parts, provided that “immediately” or “directly” is not used. Spatially relative terms such as “below or below,” “lower,” “above,” and “upper” can be used to readily describe the relationship between one element or component and another element or component as shown in the figures. Spatially relative terms should be understood to include terms that encompass different directions of use or operation of the components in addition to the directions shown in the figures. For example, in the case of inverted components shown in the figures, an element described as positioned “below” or “under” another component may be positioned “above” another component. Thus, the exemplary term “below” can include both downward and upward directions.

[0035] It should be understood that terms such as “comprising” or “having” are intended to specifically describe the presence of features, quantities, steps, operations, components, parts or combinations thereof described in the specification, and do not preclude the possibility of the existence or addition of one or more other features, numbers, steps, operations, components, parts or combinations thereof.

[0036] Features of the various embodiments described herein may be coupled or combined in whole or in part, and various technologies are interoperable and driven, and the embodiments may be implemented independently of each other or together in an associated relationship.

[0037] The display device described herein will be described below with reference to the accompanying drawings and embodiments.

[0038] Figure 1 This is a plan view of a display device according to one embodiment.

[0039] Reference Figure 1According to one embodiment, the display device 1 may include a display panel 100. The display panel 100 may include a display area DA comprising a plurality of pixels PX and a non-display area NDA surrounding the display area DA. The flat surface shape of the display area DA may be rectangular. However, embodiments of this specification are not limited thereto, and the flat surface shape of the display area DA may be square, circular, elliptical, or other polygonal shapes. For example, the display area DA may have a rectangular shape with rounded corners, but is not limited thereto, and may also have a rectangular shape with beveled corners.

[0040] In the implementation, the first direction DR1 and the second direction DR2 are different directions and intersect each other, for example, perpendicular directions in a plan view. Figure 1 In this embodiment, the first direction DR1 can typically be the same as the extension direction of the short side of the display panel 100, and the second direction DR2 can be the same as the extension direction of the long side of the display panel 100. However, the directions described in the embodiment should be understood as indicating relative directions, and the embodiment is not limited to the described directions.

[0041] The display area DA may include a short side extending along a first direction DR1 and a long side extending along a second direction DR2. A non-display area NDA may surround the display area DA. The non-display area NDA may be disposed on one side and the other side of the display area DA along the first direction DR1, and on one side and the other side of the display area DA along the second direction DR2.

[0042] The non-display area NDA located on the other side of the display area DA along the second direction DR2 may extend further along the second direction DR2 from the center portion of the other side toward the display area DA on the other side of the second direction DR2. The width of the non-display area NDA extending further along the second direction DR2 from the center portion of the other side toward the display area DA on the other side of the second direction DR2 in the first direction DR1 may be smaller than the width of the non-display area NDA near the other side of the display area DA in the second direction DR2 in the first direction DR1.

[0043] Display device 1 may include a main region MR, a sub-region SR, and a curved region BR between the main region MR and the sub-region SR. A display region DA and non-display regions NDA surrounding the four sides of the display region DA constitute the main region MR, and the portion extending along the second direction DR2 from the center of the other side toward the other side of the display region DA in the second direction DR2 may constitute the curved region BR and the sub-region SR. The curved region BR may be disposed between the sub-region SR and the main region MR. The sub-region SR may include a first pad area PA1 and a second pad area PA2 located at the end of the sub-region SR on the other side in the second direction DR2. Display device 1 may also include a data driver unit DIC and a printed circuit board FPCB. The data driver unit DIC may be disposed in the first pad area PA1, and the printed circuit board FPCB may be attached to the second pad area PA2. Multiple pads connected to the data driver unit DIC and the printed circuit board FPCB may be disposed in the first pad area PA1 and the second pad area PA2. For example, the data driver unit DIC may be configured in the form of a driver chip (IC), but is not limited thereto. In one embodiment, an example of setting up the data drive unit DIC by chip-on-plastic method directly mounted on the display panel 100 is described. However, the embodiments described herein are not limited to this, and the data drive unit DIC can be set up by chip-on-glass or chip-on-film methods.

[0044] According to one embodiment, the display panel 100 may further include a clad part (CLP). The clad part CLP may be disposed on the main region MR, and may not be disposed on the curved region BR and the sub-region SR. The clad part CLP may be disposed on the non-display region NDA. The clad part CLP may be disposed in the non-display region NDA located on one side of the display region DA in the first direction DR1, the non-display region NDA located on the other side of the first direction DR1, and the non-display region NDA located on one side of the display region DA in the second direction DR2. The clad part CLP disposed in the non-display region NDA located on one side of the display region DA in the first direction DR1, the non-display region NDA located on the other side of the first direction DR1, and the non-display region NDA located on one side of the display region DA in the second direction DR2 may be integrally formed, but the embodiments described herein are not limited thereto. The clad part CLP may also be configured to partially extend into the non-display region NDA located on the other side of the display region DA in the second direction DR2, but the embodiments described herein are not limited thereto.

[0045] Figure 2It shows the basis Figure 1 A cross-sectional view of the display panel in a bent state.

[0046] Reference Figure 2 According to one embodiment of the display device 1, the curved region BR of the display panel 100 can be bent in the thickness direction (or third direction DR3) of the display panel 100. Therefore, the main region MR and the sub-region SR can overlap each other in the thickness direction. The display panel 100 can be bent such that the lower surface of the main region MR faces the upper surface of the sub-region SR. A printed circuit board FPCB can be attached to the end of the sub-region SR.

[0047] Figure 3 It shows the basis Figure 1 A plan view of the curved state of the display device.

[0048] Reference Figure 3 The display device 1 may also include a molded part (MDP) and a housing (HSP).

[0049] The curved area BR of the display panel 100 can be bent, allowing the sub-area SR to overlap with the main area MR. The printed circuit board FPCB and the data drive unit DIC can each overlap with the main area MR.

[0050] A molded MDP can be disposed on the exterior of the display panel 100. The molded MDP can be disposed along the edge of the curved display panel 100. The molded MDP can be in direct contact with the side surface of the curved display panel 100. The molded MDP can include an organic material. The molded MDP can include an organic material that repeatedly shrinks and expands according to heat. The molded MDP can be used, for example, to support the display panel 100.

[0051] A housing HSP can be provided on the exterior of the display panel 100 and the molded part MDP. The housing HSP can be provided along the edge of the molded part MDP.

[0052] Figure 4 It is along Figure 3 Cross-sectional view of the midline A-A'.

[0053] Reference Figure 4The display panel 100 may include: a substrate 101, a first thin-film transistor 120, a second thin-film transistor 130, a light-emitting portion 150, an encapsulation portion 170, a touch portion 180, and touch organic layers 190 and 195. The display panel 100 may include at least one panel inorganic layer and at least one touch inorganic layer between the substrate 101 and the touch organic layer 190. The at least one panel inorganic layer may include at least one of a buffer layer 102, a first insulating layer 103, a second insulating layer 104, a third insulating layer 105, a fourth insulating layer 106, a fifth insulating layer 108, and a sixth insulating layer 109, and the at least one touch inorganic layer may include at least one of a touch buffer layer 181 and an insulating layer 184.

[0054] The substrate 101 may include one or more plastic materials. For example, the substrate 101 may be a multilayer substrate comprising multiple plastic materials (e.g., polyimide). For example, the substrate 101 may include a first substrate portion 101a and a second substrate portion 101b, each comprising a plastic material, and a third substrate portion 101c comprising an inorganic material between the first substrate portion 101a and the second substrate portion 101b, but the embodiments described herein are not limited thereto.

[0055] A first light-shielding layer 126 can be disposed on the substrate 101. The first light-shielding layer 126 can prevent light from being transmitted to the first semiconductor layer 123 of the first thin-film transistor 120. For example, the first semiconductor layer 123 can be disposed overlapping the first light-shielding layer 126. The first light-shielding layer 126 can be formed of a single layer or multiple layers of one of molybdenum (Mo), aluminum (Al), chromium (Cr), nickel (Ni), neodymium (Nd) and copper (Cu) or their alloys, but the embodiments described in this specification are not limited thereto.

[0056] A buffer layer 102 can be disposed on the first light-shielding layer 126. The buffer layer 102 can minimize or delay the diffusion of moisture or oxygen permeating the substrate 101. The buffer layer 102 can be formed by at least one alternating stacking of silicon nitride (SiNx) and silicon oxide (SiOx), but the embodiments described in this specification are not limited thereto.

[0057] A first insulating layer 103 may be disposed on the buffer layer 102. The first insulating layer 103 can prevent short circuits between components of the first thin-film transistor 120 and the first light-shielding layer 126. The first insulating layer 103 may be formed of the same material as the buffer layer 102, but the embodiments described herein are not limited thereto. For example, the first insulating layer 103 may be formed of inorganic materials such as silicon nitride (SiNx) or silicon oxide (SiOx), but the embodiments described herein are not limited thereto.

[0058] The first thin-film transistor 120 can be disposed on the first insulating layer 103. The first thin-film transistor 120 may include a first source electrode 121, a first gate electrode 122, a first semiconductor layer 123, and a first drain electrode 124.

[0059] The first semiconductor layer 123 may be disposed on the first insulating layer 103. The first semiconductor layer 123 may include metal oxide semiconductors such as indium gallium zinc oxide (IGZO) and silicon-based semiconductor materials such as amorphous silicon and polycrystalline silicon, but the embodiments described herein are not limited thereto. The first semiconductor layer 123 may include a channel region, a source region, and a drain region.

[0060] Because polycrystalline semiconductor layers have higher mobility than amorphous semiconductor layers and oxide semiconductor layers, they consume less power and have higher reliability. Therefore, driving transistors can be formed from polycrystalline semiconductor layers.

[0061] A second insulating layer 104 may be disposed on the first semiconductor layer 123. The second insulating layer 104 may be formed of the same material as the first insulating layer 103 and may prevent short circuits between the first semiconductor layer 123 and other components of the first thin-film transistor 120.

[0062] The first gate electrode 122 can be disposed on the second insulating layer 104. The first gate electrode 122 can be disposed on the second insulating layer 104 to overlap with the channel region of the first semiconductor layer 123. The first gate electrode 122 can be formed of a single layer or multiple layers of molybdenum (Mo), copper (Cu), titanium (Ti), aluminum (Al), chromium (Cr), gold (Au), nickel (Ni), neodymium (Nd), or compounds thereof, but the embodiments described in this specification are not limited thereto. The first gate electrode 122 can be disposed together with the gate line.

[0063] A third insulating layer 105 may be disposed on the first gate electrode 122. The third insulating layer 105 may be formed of the same material as the first insulating layer 103 or the second insulating layer 104, but the embodiments described herein are not limited thereto.

[0064] The first source electrode 121 and the first drain electrode 124 can be disposed on the third insulating layer 105.

[0065] The first source electrode 121 and the first drain electrode 124 can be electrically connected to the first semiconductor layer 123 through contact holes. The first source electrode 121 and the first drain electrode 124 can be formed of a metallic material. For example, the first source electrode 121 and the first drain electrode 124 can be formed of a single layer or multiple layers of one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (nd), and copper (Cu) or their alloys, but the embodiments described in this specification are not limited thereto.

[0066] The first source electrode 121 and the first drain electrode 124 can be disposed along the data line. For example, the data line can be formed of the same material as the first source electrode 121 and the first drain electrode 124, and formed on the same layer as the first source electrode 121 and the first drain electrode 124, but the embodiments described herein are not limited thereto.

[0067] The storage electrode 140 can be configured to be spaced apart from the first thin-film transistor 120. The storage electrode 140 may include a first storage electrode 141, a second storage electrode 142, and a third storage electrode 143.

[0068] The first storage electrode 141 may be formed of the same material as the first gate electrode 122 and disposed on the same layer as the first gate electrode 122, but the embodiments described herein are not limited thereto.

[0069] A third insulating layer 105 may be disposed on the first storage electrode 141. A second storage electrode 142 may be disposed on the third insulating layer 105, and the third insulating layer 105 between the first storage electrode 141 and the second storage electrode 142 may serve as a dielectric to generate a capacitor. The second storage electrode 142 may be formed of the same material as the first storage electrode 141, but the embodiments described herein are not limited thereto.

[0070] The second thin-film transistor 130 can be configured to be spaced apart from the first thin-film transistor 120 and the storage electrode 140. The second thin-film transistor 130 may include a second source electrode 131, a second gate electrode 132, a second semiconductor layer 133, and a second drain electrode 134.

[0071] The second light-shielding layer 136 can be disposed on the same layer as the second storage electrode 142.

[0072] Similar to the first light-shielding layer 126, the second light-shielding layer 136 can prevent light from propagating to the second semiconductor layer 133, thereby extending the lifetime of the second thin-film transistor 130. For example, the second semiconductor layer 133 can be configured to overlap with the second light-shielding layer 136.

[0073] The fourth insulating layer 106 may be disposed on the second light-shielding layer 136. The fourth insulating layer 106 may be formed of the same material as the first insulating layer 103, the second insulating layer 104 or the third insulating layer 105, but the embodiments described herein are not limited thereto.

[0074] The second semiconductor layer 133 can be disposed on the fourth insulating layer 106. The second semiconductor layer 133 may include a source region, a drain region, and a channel region between the source region and the drain region.

[0075] The second semiconductor layer 133 may include metal oxide semiconductors such as indium gallium zinc oxide (IGZO) and silicon-based semiconductor materials such as amorphous silicon and polycrystalline silicon, but the embodiments described herein are not limited thereto.

[0076] The fifth insulating layer 108 may be disposed on the second semiconductor layer 133. The fifth insulating layer 108 may be formed of the same material as the first insulating layer 103, the second insulating layer 104, the third insulating layer 105 or the fourth insulating layer 106, but the embodiments described herein are not limited thereto.

[0077] The second gate electrode 132 can be disposed on the fifth insulating layer 108.

[0078] The second gate electrode 132 may be formed of the same material as the first gate electrode 122. For example, the second gate electrode 132 may be formed of a single layer or multiple layers of molybdenum (Mo), copper (Cu), titanium (Ti), aluminum (Al), chromium (Cr), gold (Au), nickel (Ni), neodymium (nd) or compounds thereof, but the embodiments described herein are not limited thereto.

[0079] The sixth insulating layer 109 may be disposed on the second gate electrode 132. The sixth insulating layer 109 may be formed of the same material as the first insulating layer 103, the second insulating layer 104, the third insulating layer 105, the fourth insulating layer 106 or the fifth insulating layer 108, but the embodiments described herein are not limited thereto.

[0080] The first source electrode 121, the first drain electrode 124, the third storage electrode 143, the second source electrode 131, and the second drain electrode 134 can be disposed on the sixth insulating layer 109.

[0081] The third storage electrode 143, the second source electrode 131, and the second drain electrode 134 may be formed of the same material as the first source electrode 121 and the first drain electrode 124, and disposed on the same layer as the first source electrode 121 and the first drain electrode 124, but the embodiments described herein are not limited thereto. For example, the third storage electrode 143, the second source electrode 131, and the second drain electrode 134 may be formed of a single layer or multiple layers of one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (nd), and copper (Cu) or their alloys, but the embodiments described herein are not limited thereto. For example, the third storage electrode 143 and the second source electrode 131 may be directly connected, but the embodiments described herein are not limited thereto.

[0082] The first thin-film transistor 120 may be a driving transistor, and the second thin-film transistor 130 may be a switching transistor, but the embodiments described herein are not limited thereto.

[0083] The first protective layer 111 can be disposed on the first source electrode 121 and the first drain electrode 124.

[0084] The first protective layer 111 can planarize the upper part of the first thin-film transistor 120 and protect the first thin-film transistor 120. The first protective layer 111 can be formed of an organic material. For example, the first protective layer 111 can be formed of an organic material including acrylic resin, epoxy resin, phenolic resin, polyamide resin or polyimide resin, but the embodiments in this specification are not limited thereto.

[0085] A second protective layer 112 may be disposed on the first protective layer 111. The second protective layer 112 may be formed of the same material as the first protective layer 111, but the embodiments described herein are not limited thereto.

[0086] The connecting electrode 145 can be disposed between the first protective layer 111 and the second protective layer 112.

[0087] The connecting electrode 145 can electrically connect the first thin-film transistor 120 to the light-emitting portion 150. The connecting electrode 145 can be formed of the same material as the first source electrode 121 and the first drain electrode 124, but the embodiments described herein are not limited thereto.

[0088] The connecting electrode 145 may be formed of a single layer or multiple layers of one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd) and copper (Cu) or their alloys, but the embodiments described in this specification are not limited thereto.

[0089] The light-emitting portion 150 can be disposed on the second protective layer 112. The light-emitting portion 150 may include an anode electrode 151, an organic layer 152, and a cathode electrode 153.

[0090] The anode electrode 151 can be disposed on the second protective layer 112. The anode electrode 151 can be electrically connected to the first thin-film transistor 120 through contact holes formed in the second protective layer 112. The anode electrode 151 can be a reflective electrode that reflects light, but the embodiments described herein are not limited thereto. The anode electrode 151 can include a metallic material with high reflectivity, such as a stacked structure of aluminum (Al) and titanium (Ti) (Ti / Al / Ti), a stacked structure of aluminum (Al) and indium tin oxide (ITO) (ITO / Al / ITO), or an APC (Ag-Pd-Cu) alloy, and can be formed from a single layer or multiple layers, but the embodiments described herein are not limited thereto.

[0091] An organic layer 152 may be disposed on the anode electrode 151. The organic layer 152 may include one or more light-emitting structures (or light-emitting elements, or components) stacked on the anode electrode 151 in a sequence or reverse order of hole transfer layers and electron transfer layers. For example, the hole transfer layer may include a hole transport layer, a hole injection layer, an electron blocking layer, a p-type charge generation layer, etc., but the embodiments described herein are not limited thereto. For example, the electron transfer layer may include an electron transport layer, an electron injection layer, a hole blocking layer, an n-type charge generation layer, etc., but the embodiments described herein are not limited thereto. The organic layer 152 may be an organic light-emitting layer, an inorganic light-emitting layer, a quantum dot light-emitting layer, a micro light-emitting diode, a micro mini light-emitting diode, etc., but the embodiments described herein are not limited thereto. For example, the organic layer 152 of a display panel 100 according to one embodiment of this specification may include an organic light-emitting layer. The organic layer 152 may include a red light-emitting layer, a green light-emitting layer, and a blue light-emitting layer. The organic layer 152 may be a white light-emitting layer, but the embodiments described herein are not limited thereto.

[0092] The cathode electrode 153 can be disposed on the organic layer 152. The cathode electrode 153 can be a transparent electrode that transmits light, but the embodiments described herein are not limited thereto. For example, the cathode electrode 153 can include a transparent conductive material, such as indium tin oxide (ITO) or indium zinc oxide (IZO), or a metal that transmits visible light, but the embodiments described herein are not limited thereto.

[0093] A dam 154 can be provided to expose the anode electrode 151. The dam 154 can define an opening (or light-emitting area) for a sub-pixel and can be configured to cover the edge portion (or boundary portion) of the anode electrode 151. Each sub-pixel can include a red light emitting area, a green light emitting area, and a blue light emitting area. For example, a sub-pixel can be a pixel, but is not limited to this terminology. The dam 154 can be formed of a material containing black pigment or an organic material (e.g., benzocyclobutene resin, polyimide resin, acrylic resin, photopolymer, etc.), but embodiments described herein are not limited thereto. When the dam 154 is formed of a material containing black pigment or black dye, the dam 154 can be a black dam. When the dam 154 is formed of a material containing black pigment or black dye, it can shield external light or light reflected from the outside, thereby further increasing the brightness of the display device. Spacers 155 can also be provided on the dam 154. The spacers can be formed of the same material as the dam 154, but embodiments described herein are not limited thereto.

[0094] The encapsulation portion 170 can be disposed above the dam 154 or the light-emitting portion 150. The encapsulation portion 170 may include one or more insulating layers. For example, the encapsulation portion 170 may include a first encapsulation layer 171, a second encapsulation layer 172 disposed on the first encapsulation layer 171, and a third encapsulation layer 173 disposed on the second encapsulation layer 172. The encapsulation portion 170 may include one or more inorganic layers and one or more organic layers. For example, the first encapsulation layer 171 and the third encapsulation layer 173 may include inorganic materials, and the second encapsulation layer 172 may include organic materials, but the embodiments described herein are not limited thereto.

[0095] A touch buffer layer 181 may be disposed on the encapsulation portion 170. For example, the touch buffer layer 181 may be disposed on the third encapsulation layer 173. The touch buffer layer 181 may be formed of the same material as the buffer layer 102, but embodiments described herein are not limited thereto. An insulating layer 184 may be disposed on the touch buffer layer 181. The insulating layer 184 can prevent short circuits between the touch electrodes. The insulating layer 184 may be made of silicon oxide (SiOx), silicon nitride (SiNx), or multiple layers thereof, but embodiments described herein are not limited thereto. A first touch electrode 185 may be disposed on the insulating layer 184. The first touch electrode 185 may include a touch electrode 185a extending along a first direction and a touch electrode 185b extending along a second direction different from the first direction.

[0096] The second touch electrode 182 can be disposed between the touch buffer layer 181 and the insulating layer 184.

[0097] The second touch electrode 182 can be electrically connected to the touch electrode 185a through a contact hole formed in the insulating layer 184. For example, the touch electrode 185a and the second touch electrode 182 can extend along a first direction.

[0098] The first touch electrode 185 and the second touch electrode 182 may include metallic materials. For example, the first touch electrode 185 and the second touch electrode 182 may be formed of titanium (Ti), nickel (Ni), aluminum (Al) or alloys thereof, and may be formed of three layers, such as titanium (Ti) / aluminum (Al) / titanium (Ti), but the embodiments described herein are not limited thereto.

[0099] Figure 5 It is along Figure 3 Cross-sectional view of the midline B-B'.

[0100] Reference Figure 4 and Figure 5The display device 1 may include a display panel 100, a polarizing layer 200, a cover layer 300, a backplate layer 600, a plate layer 800, bonding layers 710, 720, 730, 740, and 750, a cover layer MCL, a molded part MDP, a molded frame MFP, and a housing HSP. The molded frame MFP may be used, for example, for assembling and fixing the display panel 100, for structural support of the display panel 100, for integrated assembly of the display panel 100, and for dust and shock protection of the display panel 100, etc. The molded frame MFP may be made of, for example, high-strength engineering plastics (such as PC / ABS).

[0101] The curved area BR of the display panel 100 can have a curved shape and can be curved in the thickness direction. The main area MR and the sub-area SR of the display panel 100 can overlap each other.

[0102] A polarizing layer 200 can be disposed on the main region MR of the display panel 100. The polarizing layer 200 can polarize light emitted from the display panel 100 at a polarization angle. The polarizing layer 200 can emit light polarized at the polarization angle to the outside. The polarizing layer 200 may include the function of blocking the reflection of external light other than light polarized at that polarization angle. The polarizing layer 200 may include a first phase retardation layer, a second phase retardation layer on the first phase retardation layer, and a polarizing layer on the second phase retardation layer. Figure 5 The example shown is that the polarization layer 200 and the display panel 100 are separated, but the embodiments described in this specification are not limited to this, and the polarization layer 200 may be included in the display panel 100.

[0103] The cover layer 300 can be disposed on the polarizing layer 200. The cover layer 300 can be formed of a glass material including glass, quartz, etc., but the embodiments described herein are not limited to this, and the cover layer 300 can also be formed of a plastic material. The cover layer 300 can be disposed above the display panel 100 to protect components disposed below the cover layer 300 from the outside. The cover layer 300 can be a cover layer formed by chemical reinforcement, but the embodiments described herein are not limited to this. The cover layer 300 can be a cover window, a window cover, or a cover component, but the embodiments described herein are not limited to this.

[0104] The cover layer 300 can protect the components disposed beneath it from the outside. However, as described above, since the cover layer 300 is made of glass, it may be damaged by external forces, resulting in glass fragments. These glass fragments may break off to the outside of the display device 1. According to embodiments of this specification, in order to prevent glass fragments from breaking due to damage to the cover layer 300 or to increase the durability of the cover layer 300, the display device 1 may also include at least one additional layer on the cover layer 300. For example, the display device 1 may also include a film or coating on the cover layer 300, but embodiments of this specification are not limited thereto.

[0105] The side surface of the cover layer 300 may protrude further outward than the side surface of the display panel 100. For example, the side surface of the cover layer 300 may protrude further outward than the end of the curved region BR of the display panel 100, but the embodiments described herein are not limited thereto.

[0106] The back panel layer 600 can be disposed below the display panel 100. The back panel layer 600 can be disposed below the display panel 100 to support the display panel 100. The back panel layer 600 may include a material capable of supporting the display panel 100. For example, the back panel layer 600 may include polyethylene terephthalate (PET), polyimide (PI), or polycarbonate (PC), but embodiments described herein are not limited to these. When the display device 1 is folded, the back panel layer 600 can maintain a constant curvature of the display panel 100 and suppress wrinkles on the upper surface of the display panel 100.

[0107] The back panel layer 600 may include a first back panel layer 610 on the main region MR and a second back panel layer 620 on the sub-region SR. The first back panel layer 610 may be disposed between the main region MR of the display panel 100 and the panel layer 800, and the second back panel layer 620 may be disposed between the sub-region SR of the display panel 100 and the panel layer 800. The back panel layer 600 may not be disposed on the curved region BR.

[0108] A plate layer 800 may be disposed between the first backplate layer 610 and the second backplate layer 620. The plate layer 800 may include metal. For example, the plate layer 800 may include stainless steel, but the embodiments described herein are not limited thereto.

[0109] Additional bonding layers may be provided between the aforementioned components 100, 200, 300, 600, and 800. The bonding layers may include a first bonding layer 710, a second bonding layer 720, a third bonding layer 730, a fourth bonding layer 740, a fifth bonding layer 750, and a sixth bonding layer 760.

[0110] The first bonding layer 710 can be disposed between the display panel 100 and the polarizing layer 200. The first bonding layer 710 can connect or couple the display panel 100 to the polarizing layer 200.

[0111] The second bonding layer 720 can be disposed between the polarizing layer 200 and the cover layer 300. The second bonding layer 720 can connect or couple the polarizing layer 200 to the cover layer 300.

[0112] A third bonding layer 730 may be disposed between the first backplane layer 610 and the board layer 800. The third bonding layer 730 may connect or couple the first backplane layer 610 to the board layer 800.

[0113] A fourth bonding layer 740 may be disposed between the second backsheet layer 620 and the board layer 800. The fourth bonding layer 740 may connect or couple the second backsheet layer 620 to the board layer 800.

[0114] A fifth bonding layer 750 can be disposed between the molded frame MFP and the cover layer MCL. The fifth bonding layer 750 can connect or couple the molded frame MFP to the cover layer MCL.

[0115] A sixth bonding layer 760 can be disposed between the molded part MDP and the housing HSP. The sixth bonding layer 760 can connect or couple the molded part MDP to the housing HSP.

[0116] The first bonding layer 710 and the second bonding layer 720 may each include a transparent adhesive, but the embodiments described herein are not limited thereto. For example, the transparent adhesive may be a transparent resin (OCR) or a transparent adhesive (OCA), but the embodiments described herein are not limited thereto. The third bonding layer 730, the fourth bonding layer 740, the fifth bonding layer 750 and the sixth bonding layer 760 may each include a pressure-sensitive adhesive (PSA), but the embodiments described herein are not limited thereto.

[0117] A cover layer MCL can be disposed on one surface of the curved region BR of the display panel 100. The cover layer MCL may include a plastic material and can be coated onto one surface of the curved region BR of the display panel 100 to cover the curved region BR of the display panel 100. Connecting wires (e.g., see...) Figure 6The connecting line LL is disposed on the bending region BR. The cover layer MCL protects the connecting line LL from external impacts and prevents moisture penetration into the connecting line LL. Furthermore, when the bending region BR of the display panel 100 is bent into a curved shape with a constant radius of curvature, the cover layer MCL can be used to position the connecting line LL on a neutral plane. Since a neutral plane with zero tension and compressive force is formed in the bending region BR, and the connecting line LL is located on the neutral plane, the connecting line LL can receive zero bending stress when the display panel 100 bends, and therefore can bend without being damaged by bending stress.

[0118] The cover layer MCL can contact the side surfaces of the polarizing layer 200 and the first bonding layer 710. A portion of the cover layer MCL can extend into the sub-region SR. On the sub-region SR, the cover layer MCL can be coupled to the molded frame MFP via the fifth bonding layer 750.

[0119] The data driving unit (DIC) can be disposed in the first pad region PA1 of the sub-region SR, and the printed circuit board (FPCB) can be disposed in the second pad region PA2. The printed circuit board (FPCB) can be electrically connected to the pads on the display panel 100 via an anisotropic conductive film (ACF). The cover layer (MCL) may not overlap with the data driving unit (DIC), but the embodiments described in this specification are not limited thereto.

[0120] The molded frame (MFP) can be positioned below the cover layer (MCL). The molded frame (MFP) and the cover layer (MCL) can be bonded together via the fifth bonding layer (750).

[0121] A molded part MDP can be disposed on the cover layer MCL. The molded part MDP can cover the outer surface of the curved region BR of the display panel 100. For example, the molded part MDP can be in direct contact with the cover layer MCL, the lower surface of the cover layer 300, the side surface of the fifth bonding layer 750, and the upper, side, and lower surfaces of the molded frame MFP. The molded part MDP can also be in contact with the inner surface of the housing HSP. The molded part MDP can also be disposed within the curved region BR. The molded part MDP can be in contact with the inner surface of the curved region BR, the side surfaces of the first backplate layer 610 and the second backplate layer 620, and the side surface of the plate layer 800.

[0122] The housing HSP can be positioned on the outermost side of the display device 1. The portion of the housing HSP extending along the thickness direction (or the third direction DR3) can directly contact the cover layer 300 and the molded part MDP. The portion of the housing HSP extending along the second direction DR2 can be coupled to the molded part MDP through the sixth bonding layer 760.

[0123] Figure 6 yes Figure 5Enlarged cross-sectional view of region Q1 in the middle. Figure 6 The main area MR and the curved area BR of the display device 1 are shown together. Figure 5 The curved region BR is a region with a curved shape, but for ease of description, it is shown as... Figure 6 The flat, curved region BR.

[0124] Reference Figure 4 , Figure 5 and Figure 6 Therefore, the inorganic layers 102, 103, 104, 105, 106, 108, and 109 of the panel do not need to be disposed in the bending region BR. Thus, the first protective layer 111 can directly contact the substrate 101 in the bending region BR.

[0125] The connecting line LL can be placed on the first protective layer 111. The connecting line LL can be connected to... Figure 5 The data drive unit (DIC) pad (or data pad) connects to the data line on the display area (DA). The connection line LL can be located at... Figure 4 The connection line LL is located on the same layer as the first source electrode 121, but the embodiments described herein are not limited thereto, and the connection line LL may also be located on the same layer as the first source electrode 121.

[0126] The second protective layer 112 can be placed on the connecting line LL. The second protective layer 112 can be placed in the main region MR and the bending region BR.

[0127] Three dams, D1, D2, and D3, can be placed in the main region MR adjacent to the curved region BR. The first dam D1 can be placed between the display region DA and the curved region BR, the second dam D2 can be placed between the first dam D1 and the third dam D3, and the third dam D3 can be placed between the second dam D2 and the curved region BR. The second protective layer 112 can form the first layer of the third dam D3.

[0128] The dike 154 can be installed on the second protective layer 112. The dike 154 can be installed on the main region MR and the curved region BR. In the main region MR, the dike 154 can form a first layer of the first dam D1, a first layer of the second dam D2, and a second layer of the third dam D3. In the third dam D3, the dike 154, as the second layer, can be installed to completely cover the second protective layer 112, which is the first layer, but the embodiments described in this specification are not limited to this.

[0129] Spacers 155 can be disposed on the embankment 154. Spacers 155 can be disposed on the main region MR and the curved region BR. In the main region MR, spacers 155 can form a second layer of the first dam D1, a second layer of the second dam D2, and a third layer of the third dam D3. In each of the second dam D2 and the third dam D3, spacers 155 can have the same area as the embankment 154, but the embodiments described herein are not limited thereto.

[0130] The encapsulation portion 170 can be disposed on the spacer 155. The first encapsulation layer 171 can be disposed in the main region MR, but may not be disposed in the bending region BR. The first encapsulation layer 171 can directly contact the first dam D1, the second dam D2, and the third dam D3. The second encapsulation layer 172 can be terminated by the first dam D1, and the third encapsulation layer 173 can be disposed in the main region MR, but may not be disposed in the bending region BR. The third encapsulation layer 173 can directly contact the first encapsulation layer 171 on the first dam D1.

[0131] The touch inorganic film can be disposed on the encapsulation portion 170. The touch inorganic film can be disposed in the main region MR, but may not be disposed in the bending region BR. The touch inorganic film may include a touch buffer layer 181 and an insulating layer 184.

[0132] The first touch organic layer 190 may be disposed on the insulating layer 184. The first touch organic layer 190 may be formed of an organic material comprising acrylic resin, epoxy resin, phenolic resin, polyamide resin or polyimide resin, but the embodiments described herein are not limited thereto.

[0133] The first touch organic layer 190 can be disposed in the main region MR, and the first touch organic layer 190 can form a fourth dam D4 in the curved region BR. The fourth dam D4 can be directly disposed on the spacer 155, and the fourth dam D4 can be separated from the boundary between the curved region BR and the main region MR by a predetermined distance, but the embodiments described herein are not limited thereto. The fourth dam D4 can be a touch organic layer dam. In the fourth dam D4, the second touch organic layer 195 can be terminated. The second touch organic layer 195 can be in direct contact with the side surface of the fourth dam D4.

[0134] A second touch organic layer 195 may be disposed on the first touch organic layer 190. The second touch organic layer 195 may be formed of an organic material comprising acrylic resin, epoxy resin, phenolic resin, polyamide resin or polyimide resin, but the embodiments described herein are not limited thereto.

[0135] In the curved region BR, the second touch organic layer 195 can directly contact the side surface of the fourth dam D4, the upper surface of the spacer 155, and the side surface of the first touch organic layer 190.

[0136] The cover layer MCL can be disposed on the second touch organic layer 195. The cover layer MCL can be disposed on the curved region BR, but can be disposed outside the main region MR. The cover layer MCL can be in direct contact with the upper and side surfaces of the fourth dam D4, the upper surface of the second touch organic layer 195, and the upper surface of the spacer 155.

[0137] Figure 7 It is along Figure 3 Cross-sectional view of the midline C-C'. Figure 7 The main region MR is shown, which includes the display area DA and the non-display area NDA. Figure 7 A cross-sectional view of the right side region of the display device 1 is shown. The cross-sectional view of the right side region of the display device 1 may be substantially the same as the cross-sectional views of the left side and upper region of the display device 1.

[0138] Reference Figures 4 to 7 The molded MDP can directly contact the side surfaces of the display panel 100, the first backplate layer 610, and the panel layer 800. The molded MDP can directly contact the side and lower surfaces of the molded frame MFP. The molded MDP can be bonded to the housing HSP via the sixth bonding layer 760. The molded MDP can contact the lower surface of the cover layer 300 and the inner surface of the housing HSP.

[0139] Figure 8 yes Figure 7 Enlarged cross-sectional view of region Q2 in the middle.

[0140] Reference Figures 4 to 8 The side surface of the display panel 100 may be in direct contact with the molded MDP, and the molded MDP may include an organic material that deforms (expands or contracts) significantly due to heat, as described above. Therefore, the side surface of the display panel 100 may be susceptible to rigidity. Because the side surface of the display panel 100 is susceptible to rigidity, film peeling or delamination between the films may occur around the side surface of the display panel 100. Furthermore, because film peeling or delamination between the films may occur around the side surface of the display panel 100, the likelihood of cracks appearing around the side surface of the display panel 100 is high.

[0141] When only the substrate 101 and the second touch organic layer 195 of the display panel 100 extend to the side surface of the display panel 100, the side surface of the display panel 100 is still susceptible to rigidity. The side surface of the display panel 100 may be a cut side surface.

[0142] In the case of the display device 1 according to one embodiment, at least one panel inorganic layer, inorganic layers 171 and 173 of the encapsulation portion 170, and at least one touch inorganic layer can be disposed on the side surface of the display panel 100. That is, the side surface of the buffer layer 102, the side surface of the first insulating layer 103, the side surface of the second insulating layer 104, the side surface of the third insulating layer 105, the side surface of the fourth insulating layer 106, the side surface of the fifth insulating layer 108, and the side surface of the sixth insulating layer 109 can each be aligned with the side surface of the substrate 101 and can directly contact the molded MDP. Furthermore, the side surfaces of the first inorganic layer 171 and the second inorganic layer 173 can each be aligned with the side surface of the substrate 101 and can directly contact the molded MDP. Furthermore, the side surfaces of the touch buffer layer 181 and the side surface of the insulating layer 184 can each be aligned with the side surface of the substrate 101 and can directly contact the molded MDP. In the display panel 100 of the display device 1 according to one embodiment, since the side surface of at least one panel inorganic layer, the side surfaces of the inorganic layers 171 and 173 of the encapsulation portion 170 and the side surface of at least one touch inorganic layer are arranged to be aligned with the side surface of the substrate 101, the rigidity of the side surface of the display panel 100 can be ensured.

[0143] Furthermore, in the case of the display panel 100 according to one embodiment, the side surface of the first touch organic layer 190 can be aligned with the side surface of the second touch organic layer 195, and the side surface of the first touch organic layer 190 can directly contact the molded part MDP. That is, since no step is formed between the first touch organic layer 190 and the second touch organic layer 195 on the main region MR, film lifting or peeling between the covered portion CLP and the first touch organic layer 190 or between the first touch organic layer 190 and the second touch organic layer 195 can be improved.

[0144] Figure 9 This is a cross-sectional view of the display device based on the comparative example.

[0145] Reference Figure 8 and Figure 9In the case of the display device 1a according to the comparative example, the side surfaces of one or more panel inorganic layers 102', 103', 104', 105', 106', 108', and 109', the side surfaces of inorganic layers 171' and 173' of the encapsulation portion 170', and the side surfaces of one or more touch inorganic layers 181' and 184' may be located inside the side surfaces of the substrate 101. The side surfaces of one or more panel inorganic layers 102', 103', 104', 105', 106', 108', and 109' may terminate at the encapsulation portion CLP and may contact the encapsulation portion CLP. The inorganic layers 171' and 173' of the encapsulation portion 170' and one or more touch inorganic layers 181' and 184' may extend to the outside of the encapsulation portion CLP and may be terminated within the side surfaces of the substrate 101. Furthermore, the first touch organic layer 190' may terminate at the encapsulation portion CLP. Therefore, the second touch organic layer 195 may contact the side surface of the first touch organic layer 190' and cover the side surfaces of the inorganic layers 171' and 173' of the encapsulation portion 170', as well as the side surfaces of one or more touch inorganic layers 181' and 184'. Figure 9 As shown, since the side surface of the substrate 101 and the side surface of the second touch organic layer 195 can be in direct contact with the molded MDP, and the molded MDP deforms (expands or contracts) greatly due to heat, the side surface of the display panel 100 (see...) Figure 1 It may be very susceptible to rigidity.

[0146] However, as mentioned above Figure 8 As described in the description, in the case of the display device 1 according to one embodiment, since the side surfaces of one or more panel inorganic layers, the side surfaces of inorganic layers 171 and 173 of the encapsulation portion 170, and the side surfaces of one or more touch inorganic layers are arranged to be aligned with the side surface of the substrate 101, the rigidity of the side surface of the display panel 100 can be ensured.

[0147] Furthermore, in the case of the display panel 100 according to one embodiment, the side surface of the first touch organic layer 190 can be aligned with the side surface of the second touch organic layer 195, and the side surface of the first touch organic layer 190 can directly contact the molded part MDP. That is, since no step is formed between the first touch organic layer 190 and the second touch organic layer 195 on the main region MR, film lifting or peeling between the covered portion CLP and the first touch organic layer 190 or between the first touch organic layer 190 and the second touch organic layer 195 can be improved.

[0148] In the following description, a display device according to other embodiments will be described. In the following embodiments, details regarding... Figures 1 to 9 The accompanying drawings or detailed descriptions of the components may be included, or repeated descriptions may be omitted.

[0149] Figure 10 This is a cross-sectional view of a display device according to another embodiment. Figure 11 This is a schematic diagram showing a crack formed at the end of the display panel and blocked by a first stop hole and a second stop hole. Figure 12 It shows the removal based on Figure 10 A schematic diagram of the process of cutting out a portion of the display device.

[0150] Reference Figures 10 to 12 The display device 2 according to another embodiment and according to Figure 8 The difference of the display device 1 is that it also includes a first stop hole TH1 and a second stop hole TH2.

[0151] More specifically, the first stop hole TH1 may be formed in at least one panel inorganic layer, and the second stop hole TH2 may be formed in at least one touch inorganic layer and the first inorganic layer 171_1 and the second inorganic layer 173_1 of the encapsulation portion 170_1.

[0152] For example, the first stop hole TH1 can pass through the buffer layer 102_1, the first insulating layer 103_1, the second insulating layer 104_1, the third insulating layer 105_1, the fourth insulating layer 106_1, the fifth insulating layer 108_1 and the sixth insulating layer 109_1 along the thickness direction.

[0153] For example, the second stop hole TH2 can pass through the insulating layer 184_1, the touch buffer layer 181_1, the second inorganic layer 173_1, and the first inorganic layer 171_1 along the thickness direction.

[0154] In the first stop hole TH1, the covering portion CLP_1 can directly contact the substrate 101, and in the second stop hole TH2, the first touch organic layer 190_1 can directly contact the covering portion CLP_1. For example, the second protective layer 112_1 of the covering portion CLP_1 can directly contact the substrate 101, and the first touch organic layer 190_1 can directly contact the spacer 155 of the covering portion CLP_1.

[0155] The second substrate portion 101b of the substrate 101 may include an organic material, the covering portion CLP_1 may include an organic material, and the first touch organic layer 190_1 may include an organic material. Therefore, since the covering portion CLP_1 is in direct contact with the substrate 101 in the first stop hole TH1, and the first touch organic layer 190_1 is in direct contact with the covering portion CLP_1 in the second stop hole TH2, the bonding strength between the films can be enhanced, thereby improving film warping.

[0156] Furthermore, by capturing the residual film formed at the ends of the panel inorganic layer, the inorganic layers 171_1 and 173_1 of the encapsulation portion 170_1, and the touch inorganic layer via the covering portion CLP_1 and the first touch organic layer 190_1, foreign matter defects and dark spot defects can be prevented.

[0157] Furthermore, the first stop hole TH1 and the second stop hole TH2 can function as a stopper. This is because the display panel 100 (see...) Figure 1 The side surfaces of the display panel 100 are susceptible to rigidity, leading to film peeling or delamination between the films around the side surfaces. Furthermore, due to this film peeling or delamination, the likelihood of cracks appearing around the side surfaces of the display panel 100 is high. These cracks can propagate into the interior of the display panel 100 through the inorganic layers disposed around its side surfaces. However, as... Figure 11 As shown, cracks appearing around the side surface of the display panel 100 can be stopped by each of the first stop hole TH1 and the second stop hole TH2.

[0158] Furthermore, the covering portion CLP_1 can be located outside the third dam D3. The covering portion CLP_1 can be disposed on the side surface of the display panel 100 (see...). Figure 1 Between the outermost part of the display panel 100 and the third dam D3. That is, the covering part CLP_1 can be located at the outermost edge of the display panel 100. By forming the first stop hole TH1 and the second stop hole TH2 on the outermost covering part CLP of the display panel 100, cracks appearing on the side surface of the display panel 100 can be stopped at the outermost edge of the display panel 100.

[0159] like Figure 12 As shown, the display panel of display device 2a may include a cutting area TMP before cutting. The cutting area TMP can be removed by a laser. When the cutting area TMP is removed, Figure 11 The side surface of the display panel of the display device 2 is exposed. Even during the removal of the cut area TMP, the possibility of cracks appearing on the side surface of the display panel is high. However, according to another embodiment of the display device 2, by using the outermost part of the display panel 100 (see...) Figure 1 A first stop hole TH1 and a second stop hole TH2 are formed on the covered portion CLP of the display panel 100, which can stop the cracks that appear on the side surface of the display panel 100 at the outermost end of the display panel 100.

[0160] Figure 13 This is a cross-sectional view of a display device according to yet another embodiment. Figure 14 yes Figure 13Enlarged cross-sectional view of region Q3 in the middle.

[0161] Reference Figure 13 and Figure 14 The display panel of the display device 3 according to another embodiment and according to Figure 10 The difference of the display device 2 is that a first residual film RD1 can be formed on the inner surface of one or more panel inorganic layers 102_1, 103_1, 104_1, 105_1, 106_1, 108_1 and 109_1 in the first stop hole TH1, and a second residual film RD2 can be formed on the inner surface of inorganic layers 171_1 and 173_1 or one or more touch inorganic layers 181_1 and 184_1 in the second stop hole TH2.

[0162] More specifically, the first residual film RD1 and the second residual film RD2 can be captured by the encapsulation portion CLP_1 in the first stop hole TH1 and the first touch organic layer 190_1 in the second stop hole TH2, respectively.

[0163] The first residual film RD1 can be disposed between the covering portion CLP_1 within the first stop hole TH1 and the inner surfaces of one or more panel inorganic layers 102_1, 103_1, 104_1, 105_1, 106_1, 108_1, and 109_1. The second residual film RD2 can be disposed between the first touch organic layer 190_1 and the inner surfaces of inorganic layers 171_1 and 173_1, or one or more touch inorganic layers 181_1 and 184_1, within the second stop hole TH2. Alternatively, the first residual film RD1 can be disposed between the upper surface of the second substrate portion 101b and the covering portion CLP_1, and the second residual film RD2 can be disposed between the first touch organic layer 190_1 and the covering portion CLP_1; however, the embodiments described in this specification are not limited to these.

[0164] For example, it can be formed Figure 4 The first residual film RD1 is formed during the process of forming the first gate electrode 122, the process of forming the second light-shielding layer 136, or the process of forming the first source electrode 121, and for example, it can be formed during the process of forming the first gate electrode 122. Figure 4 The second residual film RD2 is formed during the process of forming the cathode electrode 153, the process of forming the second touch electrode 182, or the process of forming the first touch electrode 185. That is, the first residual film RD1 may include the same material as the first gate electrode 122, the second light-shielding layer 136, or the first source electrode 121, and the second residual film RD2 may include the same material as the cathode electrode 153 or the second touch electrode 182.

[0165] When the first residual film RD1 or the second residual film RD2 is exposed and remains at the ends of one or more panel inorganic layers 102_1, 103_1, 104_1, 105_1, 106_1, 108_1 and 109_1, at the ends of one or more inorganic layers 171_1 and 173_1, or at the ends of one or more touch inorganic layers 181_1 and 184_1, the first residual film RD1 or the second residual film RD2 can be present in the display panel 100 (see... Figure 1 Internal movement can lead to foreign object defects or dark spot defects.

[0166] However, in the case of the display device 3 according to this embodiment, the first residual film RD1 and the second residual film RD2 can be captured by the covering portion CLP_1 in the first stop hole TH1 and the first touch organic layer 190_1 in the second stop hole TH2, respectively. Therefore, foreign matter defects or dark spot defects can be prevented.

[0167] A display device according to an embodiment of this specification includes a display panel and a molded part disposed on a side surface of the display panel. The display panel includes a display area containing pixels and a non-display area surrounding the display area. The display panel includes: a substrate; at least one panel inorganic layer on the substrate; a light-emitting portion on the at least one panel inorganic layer; a touch portion including at least one touch inorganic layer on the light-emitting portion and touch electrodes on the at least one touch inorganic layer; and a first touch organic layer on the touch portion. The substrate, the at least one panel inorganic layer, and the first touch organic layer are in direct contact with the molded part.

[0168] According to the embodiments of this specification, the side surface of the substrate, the side surface of the at least one panel inorganic layer, the side surface of the at least one touch inorganic layer, and the side surface of the first touch organic layer can be aligned.

[0169] The display device according to the embodiments of this specification may further include: a second touch organic layer on a first touch organic layer, wherein the second touch organic layer may be in direct contact with the molded part, and the side surface of the second touch organic layer may be aligned with the side surface of the first touch organic layer.

[0170] According to the embodiments of this specification, the display panel may include a main region, a sub-region overlapping the main region, and a curved region between the main region and the sub-region, and the curved region may have a curved shape.

[0171] The display device according to the embodiments of this specification may further include: a molded frame below the display panel, and the molded part may directly contact the side surface and the lower surface of the molded frame.

[0172] The display device according to the embodiments of this specification may further include: a back plate layer between the display panel and the molding frame and a plate layer between the back plate layer and the molding frame, and the molding member in the curved area may be in direct contact with the back plate layer and the plate layer.

[0173] The display device according to the embodiments of this specification may further include: a cover layer on a curved area of ​​the display panel, and the cover layer may be in direct contact with the molded part.

[0174] According to the embodiments of the present specification, in the display device, the at least one panel inorganic layer and the at least one touch inorganic layer may not be disposed in the bending region, the first touch organic layer may include a touch organic layer dam located in the bending region, and the second touch organic layer may terminate at the touch organic layer dam.

[0175] The display device according to the embodiments of this specification may further include: a covering portion located in a non-display area of ​​the main area and a dam between the covering portion and the display area.

[0176] The display device according to the embodiments of this specification may further include: a first protective layer between the at least one inorganic layer of the panel and the light-emitting portion, a second protective layer between the first protective layer and the light-emitting portion, a dam on the anode electrode of the light-emitting portion, and a spacer between the dam and the touch portion, wherein the covering portion and the dam may be formed from at least one of the first protective layer, the second protective layer, the dam, and the spacer.

[0177] According to the embodiments of the present specification, the covering portion of the display device may include a second protective layer, a dam, and spacers.

[0178] According to the embodiments of this specification, the at least one inorganic layer of the panel may include a first stop hole that overlaps with the covering portion and passes through the covering portion along the thickness direction of the display panel.

[0179] According to the embodiments of this specification, in the display device, the covering portion can fill the first stop hole and directly contact the substrate.

[0180] The display device according to embodiments of this specification may further include: a first residual film between the side surface of the at least one inorganic layer of the panel and the covered portion, wherein the first residual film may include metal.

[0181] According to the embodiments of this specification, the at least one touch inorganic layer may include a second stop hole that overlaps with the covering portion and passes through the covering portion along the thickness direction of the display panel.

[0182] According to the embodiments of the present specification, in the display device, the first touch organic layer can fill the second stop hole and directly contact the covered portion.

[0183] The display device according to embodiments of this specification may further include: a second residual film between the at least one panel inorganic layer and the first touch organic layer, wherein the second residual film may include metal.

[0184] A display device according to an embodiment of this specification includes: a substrate including a display area containing pixels and a non-display area surrounding the display area; at least one panel inorganic layer on the substrate; a protective layer on the at least one panel inorganic layer; a light-emitting portion including an anode electrode on the protective layer, an organic layer on the anode electrode, and a cathode electrode on the organic layer; a dam covering the edge of the anode electrode and disposed between the anode electrode and the organic layer; and a covering portion including a spacer between the dam and the organic layer, located in the non-display area, and formed by the protective layer, the dam, or the spacer, wherein the at least one panel inorganic layer includes a first stop hole overlapping the covering portion and passing through the covering portion in the thickness direction, and the covering portion fills the first stop hole and is in direct contact with the substrate.

[0185] The display device according to the embodiments of this specification may further include: a touch portion and a first touch organic layer on the touch portion, the touch portion including at least one touch inorganic layer on the light-emitting portion and touch electrodes on the at least one touch inorganic layer, wherein the at least one touch inorganic layer may include a second stop hole overlapping with the covering portion and passing through the covering portion in the thickness direction, and the first touch organic layer may fill the second stop hole and be in direct contact with the covering portion.

[0186] The display device according to the embodiments of this specification may further include: a dam disposed between the covered portion and the display area, wherein the dam may be formed by a protective layer, a dike or a spacer.

[0187] According to the embodiment of the display device, by arranging at least one panel inorganic layer and at least one touch inorganic layer respectively aligned with the side surface of the substrate, the rigidity of the cut line (edge) of the display panel can be ensured.

[0188] Furthermore, according to the display device of the embodiment, by aligning the first touch organic layer with the side surface of the substrate and the side surface of the second touch organic layer on the first touch organic layer, organic film steps on the covered portion can be removed. Therefore, film lifting between the covered portion and the first touch organic layer, or between the first touch organic layer and the second touch organic layer, or film peeling can be improved.

[0189] Furthermore, the display device according to the embodiment may include a covering portion disposed around the left, right, or upper end of a display panel. The at least one panel inorganic layer may include a first stop hole passing through the covering portion in the thickness direction, and the at least one touch inorganic layer may include a second stop hole passing through the covering portion in the thickness direction. The covering portion can contact the substrate through the first stop hole, and the first touch organic layer can contact the covering portion through the second stop hole. The covering portion, the substrate, and the first touch organic layer may each comprise an organic material. Therefore, the display device according to the embodiment can improve film lifting by enhancing the bonding strength between the films on the covering portion.

[0190] Furthermore, according to the display device of the embodiment, a first stop hole and a second stop hole can be formed in the outermost covering portion of the display panel. Therefore, it is not necessary to form a separate stop hole on the inner side of the covering portion (or in the non-display area between the covering portion and the display area), thereby achieving a narrow bezel.

[0191] Furthermore, according to the embodiment of the display device, by forming a first stop hole and a second stop hole in the outermost covering portion of the display panel, cracks at the end of the display panel caused by external forces can be blocked at the outermost end of the display panel.

[0192] Furthermore, according to the embodiment of the display device, foreign object defects and dark spot defects can be prevented by capturing the residual film formed at the ends of the panel inorganic layer and the touch inorganic layer via the covering portion and the first touch organic layer.

[0193] Furthermore, according to the embodiment of the display device, by blocking the cracks at the outermost end of the display panel through the first stop hole and the second stop hole, moisture can be prevented from seeping into the display area through the cracks, thereby extending the life of the display device.

[0194] However, the effects that can be obtained from this specification are not limited to those described above, and those skilled in the art to which this specification pertains will be able to clearly understand other effects not mentioned from the following description.

[0195] Although embodiments of the invention have been described above with reference to the accompanying drawings, those skilled in the art will understand that the technical configurations described above can be implemented in other specific forms without altering their technical spirit or essential characteristics. Therefore, it should be understood that the embodiments described above are illustrative in all respects and not restrictive. Furthermore, the scope of the invention is described by the appended claims rather than a detailed description. Moreover, the meaning and scope of the claims, as well as all changes or modifications derived from equivalent concepts, should be interpreted as being included within the scope of the invention.

[0196] Explanation of reference numerals in the attached figures

[0197] 1, 2, 3: Display device

[0198] 100: Display panel

[0199] CLP: Encapsulated portion

[0200] D1, D2, D3, D4: Dam

Claims

1. A display device, comprising: The display panel includes a display area containing pixels and a non-display area surrounding the display area; as well as The molded part on the side surface of the display panel, The display panel includes: substrate; At least one panel inorganic layer on the substrate; The light-emitting portion on the inorganic layer of the at least one panel; The touch portion includes at least one touch inorganic layer on the light-emitting portion and a touch electrode on the at least one touch inorganic layer; and The first touch organic layer on the touch portion, and The substrate, the at least one panel inorganic layer, and the first touch organic layer are in contact with the molded part.

2. The display device according to claim 1, wherein, The side surfaces of the substrate, the at least one panel inorganic layer, the at least one touch inorganic layer, and the first touch organic layer are aligned.

3. The display device according to claim 2, wherein, The side surface of at least one of the touch inorganic layers is in direct contact with the molded part.

4. The display device according to claim 2, further comprising: A second touch organic layer on the first touch organic layer, wherein the second touch organic layer is in direct contact with the molded part, and the side surface of the second touch organic layer is aligned with the side surface of the first touch organic layer.

5. The display device according to claim 4, wherein, The display panel includes: a main area, a sub-area overlapping the main area, and a curved area between the main area and the sub-area, wherein the curved area has a curved shape.

6. The display device according to claim 5, further comprising: A molded frame below the display panel, wherein the molded component is in direct contact with the side and lower surfaces of the molded frame.

7. The display device according to claim 6, further comprising: The back panel layer between the display panel and the molded frame; And a plate layer between the back plate layer and the molded frame, wherein the molded part in the bending region is in direct contact with the back plate layer and the plate layer.

8. The display device according to claim 5, further comprising: A cover layer on the curved area of ​​the display panel, wherein the cover layer is in direct contact with the molded part.

9. The display device according to claim 5, wherein, The at least one panel inorganic layer and the at least one touch inorganic layer are not disposed in the bending region, the first touch organic layer includes a touch organic layer dam located in the bending region, and the second touch organic layer terminates at the touch organic layer dam.

10. The display device according to claim 5, further comprising: The covered portion located in the non-display area of ​​the main area; And the dam between the covered portion and the display area.

11. The display device according to claim 10, further comprising: The at least one panel inorganic layer and the light-emitting portion are provided with a first protective layer, a second protective layer between the first protective layer and the light-emitting portion, a dam on the anode electrode of the light-emitting portion, and a spacer between the dam and the touch portion, wherein the covering portion and the dam are each formed from at least one of the first protective layer, the second protective layer, the dam and the spacer.

12. The display device according to claim 11, wherein, The covering portion includes the second protective layer, the dike, and the spacer.

13. The display device according to claim 12, wherein, The at least one inorganic layer of the panel includes a first stop hole, which overlaps with the covering portion and passes through the covering portion along the thickness direction of the display panel.

14. The display device according to claim 13, wherein, The covering portion fills the first stop hole and makes direct contact with the substrate.

15. The display device according to claim 14, further comprising: A first residual film between the side surface of the at least one inorganic layer of the panel and the covered portion, wherein the first residual film comprises a metal.

16. The display device according to claim 12, wherein, The at least one contact inorganic layer includes a second stop hole that overlaps with the covering portion and passes through the covering portion along the thickness direction of the display panel.

17. The display device according to claim 16, wherein, The first touch organic layer fills the second stop hole and comes into direct contact with the covered portion.

18. The display device according to claim 17, further comprising: A second residual film between the at least one panel inorganic layer and the first touch organic layer, wherein the second residual film comprises a metal.

19. A display device, comprising: The display panel includes a display area containing pixels and a non-display area surrounding the display area; At least one inorganic layer on the substrate of the display panel; A protective layer on the at least one inorganic layer of the panel; The light-emitting portion includes an anode electrode on the protective layer, an organic layer on the anode electrode, and a cathode electrode on the organic layer; A dike, which covers the edge of the anode electrode and is disposed between the anode electrode and the organic layer; as well as Spacers, the spacers being located between the dike and the organic layer. This includes a covering portion located in the non-display area and formed by the protective layer, the dike, or the spacer. The at least one inorganic layer of the panel includes a first stop hole, which overlaps with the covering portion and passes through the covering portion along the thickness direction of the display panel. The covering portion fills the first stop hole and makes direct contact with the substrate.

20. The display device according to claim 19, further comprising: The touch portion includes a touch portion and a first touch organic layer on the touch portion. The touch portion includes at least one touch inorganic layer on the light-emitting portion and a touch electrode on the at least one touch inorganic layer. The at least one touch inorganic layer includes a second stop hole that overlaps with the covering portion and passes through the covering portion along the thickness direction. The first touch organic layer fills the second stop hole and is in direct contact with the covering portion.

21. The display device according to claim 20, further comprising: A dam between the covered portion and the display area, wherein the dam is formed by the protective layer, the dike, or the spacer.

Images