A test system and PCB board

Abstract

The application provides a test system and a PCB board, and belongs to the technical field of quality testing. The system comprises a line selection module configured to select a current detection link from a first detection link and a second detection link, the first detection link is a link for detecting the connection state of a target non-load part and surrounding lines corresponding to a target signal in a target signal link, the second detection link is a link for detecting the connection state of a target load part in the target signal link, the target non-load part is configured with a first test point corresponding to the target signal, and the target load part is configured with a second test point corresponding to the target signal; and a light-emitting detection module configured to determine the connection state of the current detection link by a light-emitting state when the first test point or the second test point is inserted into a test pin, so as to determine the connection state of the target signal link. The application aims to test the signal link of the non-load part on the PCB board.

Description

Technical Field

[0001] This application relates to the technical field of quality testing, and more specifically, to a testing system and a PCB board. Background Technology

[0002] In the modern electronics industry, PCB circuit boards have become the core carrier of various intelligent devices. Faced with increasingly fierce market competition, the industry is constantly raising the standards for the stability and durability of PCB products. To ensure the quality of the circuit boards, after the components are assembled in the PCBA stage, various tests are carried out to ensure the quality of the PCB products, such as flying probe testing, functional testing, open and short circuit testing, and intelligent testing.

[0003] Since PCB boards may be equipped with different component configurations according to different customer needs, there may be unfinished components on the PCB board. However, in order to improve the quality of the PCB board, it is still necessary to test the signal links of the unfinished components.

[0004] However, most current methods for testing the signal links on PCBs are based on complete links, that is, testing the signal links corresponding to the components above. It is difficult to test the signal links of components not above the components. Therefore, there is an urgent need for a system that can test the signal links of components not above the components. Summary of the Invention

[0005] This application provides a testing system and a PCB board, which are designed to test the signal links of components on the PCB board.

[0006] In a first aspect, embodiments of this application provide a testing system applied to a PCB board. The system is used to detect the connection status of a target signal link between a target unloaded component and a target load component on the PCB board, wherein the target signal link is a link for transmitting target signals between the target unloaded component and a target load component. The system includes: The line selection module is used to select the current detection link from the first detection link and the second detection link. The first detection link is used to detect the connection status of the target unattached part and the surrounding lines corresponding to the target signal in the target signal link. The second detection link is used to detect the connection status of the target load part in the target signal link. The target unattached part is configured with a first measurement point corresponding to the target signal, and the target load part is configured with a second measurement point corresponding to the target signal. The light emission detection module is used to determine the connection status of the current detection link by observing the light emission status after the first or second test point is inserted with a test pin, thereby determining the connection status of the target signal link.

[0007] Optionally, the light emission detection module includes a power supply and a light-emitting diode, the line selection module includes a line selector and a master selection switch, and the system further includes a control device; The positive terminal of the power supply is connected to the input terminal of the master selection switch device, the negative terminal of the power supply is connected to the negative terminal of the light-emitting diode, and the positive terminal of the light-emitting diode is connected to the first connection pin of the line selector. The second connection pin of the line selector is connected to the surrounding line corresponding to the target signal, and the first test point configured on the target unattached part is connected to the first output terminal of the total selection switch device to form a first detection link; The third connection pin of the line selector is connected to the second test point configured on the target load component, and is connected to the second output terminal of the main selection switch device through the second test point to form a second detection link; The controller is used to send a link selection signal to the master selection switch, and the master selection switch responds to the link selection signal to determine the currently detected link.

[0008] Optionally, when the target unattached part has multiple target signals, the system further includes a first selection switch device and a second selection switch device; The multiple input terminals of the first selection switch are connected to the surrounding lines corresponding to each target signal, and the output terminal of the first selection switch is connected to the second connection pin of the line selector. The multiple input terminals of the second selection switch are connected to the second measurement points configured on the target load parts corresponding to each target signal, and the output terminal of the second selection switch is connected to the third connection pin of the line selector. The controller is also configured to, in response to a switching operation, send a first selection control signal to the first selection switch device and a second selection control signal to the second selection switch device. The first selection control signal is used to switch the surrounding lines corresponding to the target signal in the first detection link, and the second selection control signal is used to switch the target load component in the second detection link.

[0009] Optionally, the controller is further configured to: Real-time detection of the insertion signal of the test pins at the first and second test points; When the insertion signal of the test pin is detected at the first test point, an enable signal is sent to the general selection switch and the first selection switch to make the first detection link the current detection link; When the insertion signal of the test pin is detected at the second test point, an enable signal is sent to the general selection switch and the second selection switch to make the second detection link the current detection link.

[0010] Optionally, pressure sensors are provided in the first measuring point and the second measuring point; When the test pin is inserted into the first or second test point, the pressure sensor sends the pressure detection result as an insertion signal to the controller.

[0011] Optionally, the first and second measuring points are first blind vias comprising layers L1 to L2, second blind vias comprising layers Ln-1 to Ln, and buried vias comprising layers L2 to Ln-1, and the first and second blind vias are plated with copper.

[0012] Optionally, the line selector includes an insulated connector, on which a first connector pin, a second connector pin, and a third connector pin are provided; In the first connecting pin, the second connecting pin and the third connecting pin, a set of sockets is provided between any two connecting pins. Each set of sockets includes a first socket and a second socket. The first socket is connected to one connecting pin through a wire, and the second socket is connected to another connecting pin through a wire. Each set of sockets is provided with a connecting component, which is detachably connected to each set of sockets. The connecting component is used to connect the first socket and the second socket, and is also used to adjust the resistance value in the current detection link.

[0013] Optionally, the connection assembly includes a first flexible board for insertion into the first socket and a second flexible board for insertion into the second socket; The first flexible board is provided with multiple sets of first connectors. Each first connector includes a first metal contact terminal, a target resistor, and a first pin connected in sequence by wires. When the first flexible board is inserted into the first socket, the first metal contact terminal contacts the metal contact terminal provided on the inner wall of the first socket, and the number of the first metal contact terminal is the same as the number of the metal contact terminal provided on the inner wall of the first socket. The second flexible board is provided with multiple sets of second connectors. The second connectors include second metal contact terminals and second pins connected in sequence by wires. When the second flexible board is inserted into the second socket, the second metal contact terminals contact the metal contact terminals provided on the inner wall of the second socket, and the number of the second metal contact terminals is the same as the number of the metal contact terminals provided on the inner wall of the second socket. Multiple metal contact terminals disposed on the inner walls of the first and second sockets are connected in series by wires; The first pin and the second pin are provided with snap-fit ​​components. When the snap-fit ​​components are in the snap-fit ​​state, the first pin and the second pin are in contact.

[0014] Optionally, the card connector includes a card connector tab and a card interface; The snap-fit ​​tab is positioned at the end of the first pin furthest from the target resistor; The card interface is located at the end of the second pin that is furthest from the second metal contact terminal; When the card connector is inserted into the card interface, the card connector is in a snap-fit ​​state; When the snap-fit ​​tab is pulled out of the card interface, the snap-fit ​​component is in an un-snapped state.

[0015] Secondly, embodiments of this application provide a PCB board, the PCB board including the testing system described in the first aspect of the embodiments.

[0016] Beneficial effects: This system can test the connection status of target signal links of target components on a PCB board. The target signal link is divided into the target component and the surrounding lines corresponding to the target signal as one part of the test object, which is tested through the first detection link. The target load component in the target signal link is the other part of the test object, which is tested through the second detection link.

[0017] The circuit selection module selects the current detection link from the first and second detection links. The light emission detection module inserts test pins into the first test point corresponding to the target signal configured on the target unattached component or the second test point corresponding to the target signal configured on the target load component. The connection status of the current detection link is determined by the light emission status, thereby determining the connection status of the target signal link. This allows for testing the connection status of the target signal link of the unattached component on the PCB board, testing for open and short circuits, and dividing the target signal link into two parts for testing, which also improves testing efficiency. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a functional block diagram of a test system proposed in an embodiment of this application; Figure 2 This is a connection diagram of a test system proposed in an embodiment of this application; Figure 3 This is a connection diagram of a test system provided in an embodiment of this application; Figure 4 This is a schematic diagram of a measuring point proposed in an embodiment of this application; Figure 5 This is a schematic diagram of the measuring point positions for a DIP type part according to an embodiment of this application; Figure 6 This is a schematic diagram of the structure of a line selector provided in an embodiment of this application; Figure 7 This is a schematic diagram of the interior of a socket according to an embodiment of this application; Figure 8 This is a schematic diagram of a connection component provided in an embodiment of this application. Detailed Implementation

[0020] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0021] PCB: Printed Circuit Board; PCBA: Printed Circuit Board Assembly refers to the process of integrating components onto a bare PCB board via surface mount technology (SMT) and then through die insertion (DIP). Both SMT and DIP are methods of integrating components onto a PCB board. SMT does not require drilling holes in the PCB, while DIP requires inserting the pins of the components into pre-drilled holes.

[0022] In the modern electronics industry, PCB circuit boards have become the core carrier of various intelligent devices. Faced with increasingly fierce market competition, the industry is constantly raising the standards for the stability and durability of PCB products. To ensure the quality of circuit boards, engineers must strictly implement standardized design processes. In particular, when dealing with core circuit modules, they must prioritize component screening and performance verification, and ensure product quality through systematic reliability testing.

[0023] In the PCBA stage, after the components are assembled, various tests are conducted to ensure the quality of the PCB product, such as flying probe testing, functional testing, open and short circuit testing, and intelligent testing. However, with the increasing complexity of electronic devices, the quality testing of PCBA also faces greater challenges. High-density components and the number of nodes limit the above testing methods. In order to ensure the reliability of PCBA quality and to make PCBA testing go smoothly, improvements need to be made to the PCB R&D design for special components.

[0024] During the research and development of PCBs, test points are added to the link signals (net) that need to be tested, provided that space permits. These test points are used for flying probe testing during the PCBA stage to test for open and short circuits in the link signals (net).

[0025] After the components are assembled in the PCBA stage, functional tests can be used to test the quality of the PCB board for a complete network link.

[0026] Open / short circuit tests use current sensing or resistance measurement to determine the connection status between various solder joints and traces on the PCB.

[0027] Intelligent testing encompasses AI stress testing systems, environmental simulation matrices, and three-dimensional upgrade paths. For AI stress testing systems, some industrial control equipment manufacturers introduce machine learning algorithms to conduct stress tests. By applying currents exceeding rated current and using thermal imaging data to train fault prediction models, product reliability and lifespan are significantly improved. Environmental simulation matrices, through multi-dimensional environmental simulations of temperature, humidity, and vibration, verify PCB performance in real-world environments, significantly reducing on-site failure rates. Three-dimensional upgrade paths, including dynamic signal tracing methods, AI stress testing systems, and environmental simulation matrices, enhance signal integrity verification efficiency and product reliability. It can be seen that intelligent testing ultimately targets the integrity of the network (net).

[0028] In summary, current tests need to meet the following conditions: Flying probe testing requires adding a test point or via on the link signal net.

[0029] Functional testing: Requires a complete link signal net.

[0030] Open / short circuit test: requires a complete link signal net.

[0031] Intelligent testing: requires a complete link signal net.

[0032] However, due to the research and design of PCB boards, a single motherboard may be assembled into multiple configurations. For example, different customers have different needs, and the same motherboard may have different component configurations depending on the customer's requirements. Therefore, there may be missing components on the PCB board, that is, a link may have missing components, resulting in an incomplete link. In addition, the area of ​​PCB boards is currently being compressed towards smaller sizes, and the component density is also very high. Therefore, it is obviously impossible to add test points to every link signal net on the PCB board. So, for incomplete links and links without test points, the current testing methods cannot meet the requirements for testing open and short circuits of link signals net.

[0033] Therefore, this application provides a testing system for testing the signal links of unattached components on a PCB board, which can not only test the signal links of unattached components on the PCB board, but also improve testing efficiency.

[0034] The testing system provided in this application embodiment can be applied to PCB boards, such as in the PCBA stage, after the PCB board has been assembled according to customer requirements. The system is used to detect the connection status of the target signal link of the target unassembled part on the PCB board. The target signal link is the link between the target unassembled part and the target load part for transmitting target signals.

[0035] Unconfigured components refer to components that do not require configuration. However, when designing a PCB board, the signals and signal links of these unconfigured components are already designed. It's just that the unconfigured components are not used according to the user's requirements. However, in order to improve the quality of the PCB board, the signal links of each signal of the unconfigured components still need to be tested to determine whether there are any open or short circuit problems in the connection status of the signal links.

[0036] In actual implementation, the target unattached parts and the target signal links that need to be tested can be determined according to the test requirements. The reserved assembly position of the target unattached parts will be designed with surrounding lines for transmitting target signals to the load parts, forming the target signal link for the transmission of target signals of the target unattached parts.

[0037] Reference Figure 1 The diagram shows a functional block diagram of a test system according to an embodiment of this application. The test system is applied to a PCB board and includes a line selection module and a light emission detection module.

[0038] Specifically, the line selection module is used to select the current detection link from the first detection link and the second detection link.

[0039] The first detection link is used to detect the connection status of the target unattached part and the surrounding lines corresponding to the target signal in the target signal link; the second detection link is used to detect the connection status of the target load part in the target signal link; the target unattached part is configured with a first measurement point corresponding to the target signal, and the target load part is configured with a second measurement point corresponding to the target signal.

[0040] The light emission detection module is used to determine the connection status of the current detection link by observing the light emission status after the first or second test point is inserted with a test pin, thereby determining the connection status of the target signal link.

[0041] In actual implementation, after determining the target unloaded part and the target signal link, the test system provided in this application embodiment can be deployed on the PCB board, and the first test point corresponding to the target signal can be configured on the target unloaded part, and the second test point corresponding to the target signal can be configured on the target load part.

[0042] By dividing the target signal link corresponding to the target signal of the unloaded part into two test objects—the unloaded part and the surrounding lines corresponding to the target signal as one test object, and the target load part as another test object—and switching the current detection link through the line selection module, the connection status of the two test objects can be detected separately, narrowing the scope of investigation and improving testing efficiency.

[0043] In one feasible implementation, taking a signal from a target component as the target signal and testing the target test link corresponding to the target signal as an example, the light emission detection module of the test system includes a power supply and a light-emitting diode, the line selection module includes a line selector and a master selection switch, and the system also includes a control device.

[0044] Reference Figure 2 The diagram shows a connection schematic of the test system provided in an embodiment of this application, where solid lines represent detection links and dashed lines represent signal interaction paths with control devices.

[0045] The positive terminal of the power supply is connected to the input terminal of the master selection switch, the negative terminal of the power supply is connected to the negative terminal of the light-emitting diode, and the positive terminal of the light-emitting diode is connected to the first connection pin of the line selector.

[0046] The second connection pin of the line selector is connected to the surrounding line corresponding to the target signal, and the first test point configured on the target unattached part is connected to the first output terminal of the total selection switch device, forming the first detection link.

[0047] The third connection pin of the line selector is connected to the second test point configured on the target load component, and is connected to the second output terminal of the main selection switch device through the second test point to form a second detection link.

[0048] The controller is configured to send a link selection signal to the master selection switch in response to a link selection operation, and the master selection switch determines the currently detected link in response to the link selection signal.

[0049] In actual implementation, the controller can be the BMC deployed on the PCB board, or other controllers on the PCB board, or additional controllers can be deployed. The switch device can be a Switch IC switch chip, and this application embodiment does not impose any restrictions.

[0050] For example, when the first detection link needs to be tested, the tester can select the first detection link through the link selection operation. In response to the link selection operation, the controller sends a first link selection signal to the general selection switch device. After responding to the first link selection signal, the general selection switch device will select to connect the first detection link.

[0051] Then, insert the test pin into the first test point. The first detection link is connected. If the LED is in the light-emitting state, the surrounding circuits corresponding to the target component and the target signal are normal and there is no open or short circuit problem. If the LED is not in the light-emitting state, there is an open or short circuit problem in this section of the surrounding circuits corresponding to the target component and the target signal, and the open or short circuit problem needs to be investigated and repaired.

[0052] When the second detection link needs to be tested, the tester can select the second detection link through the link selection operation. In response to the link selection operation, the controller sends a second link selection signal to the main selection switch device. After responding to the second link selection signal, the main selection switch device will select to connect the second detection link.

[0053] Then, insert the test pin into the second test point. The second detection link is connected. If the LED is in the light-emitting state, the target load component does not have an open or short circuit problem. If the LED is not in the light-emitting state, the target load component has an open or short circuit problem, and the open or short circuit problem needs to be investigated and repaired.

[0054] In addition to the tester determining the current test link through the link selection operation, pressure sensors can also be set at the first and second test points. When the test pin is inserted into the first or second test point, the pressure sensor sends the pressure detection result as an insertion signal to the controller.

[0055] The controller is used to detect the insertion signal of the test pin in the first and second test points in real time. When the insertion signal of the test pin is detected in the first test point, a first link selection signal is sent to the master selection switch. In response to the first link selection signal, the master selection switch will select to connect the first detection link. When the insertion signal of the test pin is detected in the second test point, a second link selection signal is sent to the master selection switch. In response to the second link selection signal, the master selection switch will select to connect the second detection link.

[0056] In one feasible implementation, when multiple signals of the target unattached part are used as target signals and the target test link corresponding to each target signal is tested, the system further includes a first selection switch device and a second selection switch device.

[0057] Reference Figure 3 The diagram shows a connection schematic of the test system provided in an embodiment of this application, where solid lines represent detection links and dashed lines represent signal interaction paths with control devices.

[0058] The multiple input terminals of the first selection switch are connected to the surrounding lines corresponding to each target signal, and the output terminal of the first selection switch is connected to the second connection pin of the line selector.

[0059] The multiple input terminals of the second selection switch are connected to the second measurement points configured on the target load components corresponding to each target signal, and the output terminal of the second selection switch is connected to the third connection pin of the line selector.

[0060] The controller is also configured to, in response to a switching operation, send a first selection control signal to the first selection switch device and a second selection control signal to the second selection switch device. The first selection control signal is used to switch the surrounding lines corresponding to the target signal in the first detection link, and the second selection control signal is used to switch the target load component in the second detection link.

[0061] For example, when the target unattached part includes three target signals, the target transmission link 1 corresponding to target signal 1 includes surrounding line 1 and load part 1, the target transmission link 2 corresponding to target signal 2 includes surrounding line 2 and load part 2, and the target transmission link 3 corresponding to target signal 3 includes surrounding line 3 and load part 3. Furthermore, a first test point is configured on the target unattached part to test the three target signals respectively, and a second test point corresponding to the target signal is configured on load part 1, load part 2, and load part 3. That is, each target signal corresponds to a test point on the target unattached part and the load part respectively.

[0062] The three input terminals of the first selection switch are connected to peripheral line 1, peripheral line 2 and peripheral line 3 respectively; the three input terminals of the second selection switch are connected to the second measurement point configured on load component 1, the second measurement point configured on load component 2 and the second measurement point configured on load component 3 respectively.

[0063] Testers switch the surrounding lines corresponding to the target signal in the first detection link and / or switch the target load components in the second detection link to test target transmission link 1, target transmission link 2 and target transmission link 3.

[0064] After determining any target transmission link to be tested through a switching operation, the controller is further configured to: The insertion signal of the test pin in the first and second test points is detected in real time. For example, a pressure sensor can be set in each of the first and second test points. When the test pin is inserted into any of the first or second test points, the pressure sensor in that test point sends the pressure detection result as an insertion signal to the controller. When the insertion signal of the test pin is detected at the first test point, an enable signal is sent to the general selection switch and the first selection switch to make the first detection link the current detection link.

[0065] When the insertion signal of the test pin is detected at the second test point, an enable signal is sent to the general selection switch and the second selection switch to make the second detection link the current detection link.

[0066] Reference Figure 4 The diagram shows a schematic of the measuring points provided in the embodiments of this application. In a feasible implementation, the first measuring point and the second measuring point are a first blind via including layers L1 to L2, a second blind via including layers Ln-1 to Ln, and a buried via including layers L2 to Ln-1, and the first blind via and the second blind via are plated with copper.

[0067] In actual implementation, when a pressure sensor is installed at the measuring point, the pressure sensor can be set at the L2 layer of the measuring point.

[0068] Because measuring points are placed on the unloaded and load components, there will be an extra wire in the signal. If the wire is too long, it may affect the integrity of the signal link and the quality of the transmitted signal. By designing measuring points with copper plating on the top and bottom and no copper plating in the middle, the length of the extra wire in the signal link can be effectively reduced.

[0069] For example, the entire PCB board is 92.9 mil thick, of which the layer thickness of L1 / L2 and Ln / Ln-1 is 3 mil. If the test point is designed with copper-plated through-holes, the excess wire length would be at least 92.9 mil, or even longer. However, for the test point provided in this application embodiment, which has copper plating on the top and bottom and no copper plating in the middle, the excess wire length is only 3 mil, which has a smaller impact on signal quality.

[0070] When the test pin is inserted into the test point, the L1 and Ln layers of the test point are connected, and the corresponding detection link of the test point is turned on. When the test pin is removed, the corresponding detection link of the test point is no longer turned on, and the excess wires of the tested link can be kept to a minimum, so that the signal quality is not affected.

[0071] In actual implementation, when selecting the configuration location of test points, the unloaded components and load components include SMT components and reflow soldering DIP type components. These types of components have stencils. When installing components, solder paste is brushed into the holes of the pads or DIP type pins. In order to better solder, the solder paste contains non-conductive flux, which forms a protective film on the surface of the solder paste. Therefore, directly inserting the test pins into the holes of the components often results in no conductivity. It is necessary to wipe off the flux, but this will affect the testing speed, and thus affect the production speed.

[0072] Therefore, when the unloaded component or the load component is an SMT component, the test point can be placed on the PIN corresponding to the target signal. After the subsequent test is completed, the L1 layer blind hole on the PIN can be filled with resin and then electroplated to fill it, so as to ensure the integrity of the component loading conditions.

[0073] Reference Figure 5 This document illustrates a schematic diagram of the test point location for DIP type components provided in an embodiment of this application. When the unloaded component or the load component is a reflow soldering DIP type component, if the pad of the signal PIN hole of the DIP type component is large enough, the test point can be designed on the pad in the same way as the SMT component, but the test point is required to be more than 7mil away from the hole wall to ensure that the hole is not damaged. If the pad is not large enough, it can be offset from the pad or tangent to the pad.

[0074] Reference Figure 6 The diagram shows a schematic of the structure of a line selector provided in an embodiment of this application. The line selector includes an insulated connector, on which a first connector pin, a second connector pin, and a third connector pin are provided.

[0075] In actual implementation, the line selector is installed on the PCB board. The first, second, and third connecting pins are conductive. The line selector is placed between the surrounding lines of the target component and the target load component.

[0076] For the line selector provided in the embodiments of this application, a set of sockets is provided between any two of the first connecting pin, the second connecting pin and the third connecting pin. Each set of sockets includes a first socket and a second socket. Any socket is a groove on the connector. The first socket is connected to one connecting pin through a wire, and the second socket is connected to another connecting pin through a wire.

[0077] Reference Figure 7 The diagram shows the interior of a socket provided in an embodiment of this application. The inner walls of the first socket and the second socket are provided with a plurality of metal contact terminals, and the plurality of metal contact terminals are connected in series by wires.

[0078] Each set of sockets is provided with a connecting component, which is detachably connected to each set of sockets. The connecting component is used to connect the first socket and the second socket, and is also used to adjust the resistance value in the current detection link.

[0079] Reference Figure 8 The diagram shows a connection component provided in an embodiment of this application. The connection component includes a first flexible board for insertion into a first socket and a second flexible board for insertion into a second socket.

[0080] The first flexible board is provided with multiple sets of first connectors, each of which includes a first metal contact terminal, a target resistor, and a first pin connected in sequence by wires.

[0081] When the first flexible board is inserted into the first socket, the first metal contact terminal contacts the metal contact terminal provided on the inner wall of the first socket, and the number of the first metal contact terminals is the same as the number of metal contact terminals provided on the inner wall of the first socket, and the layout spacing of the metal contact terminals is also the same.

[0082] The second flexible board is provided with multiple sets of second connectors, each of which includes a second metal contact terminal and a second pin connected in sequence by wires.

[0083] When the second flexible board is inserted into the second socket, the second metal contact terminal contacts the metal contact terminal provided on the inner wall of the second socket, and the number of the second metal contact terminals is the same as the number of metal contact terminals provided on the inner wall of the second socket, and the layout spacing of the metal contact terminals is also the same.

[0084] The first and second pins are provided with snap-fit ​​components. When the snap-fit ​​components are in the snap-fit ​​state, the first and second pins are in contact. The first and second pins are made of metal with wire properties. In actual implementation, the material of the pins can be selected according to the actual application requirements. This embodiment does not impose any restrictions.

[0085] like Figure 8 The latching component includes a latching tab and a latching interface. The latching tab is disposed at the end of the first pin away from the target resistor, and the latching interface is disposed at the end of the second pin away from the second metal contact terminal.

[0086] The card interface can be made of rubber, and the snap-fit ​​piece can be a triangular rubber piece, making it easier for testers to remove or insert the snap-fit ​​piece from the card interface with less effort; when the snap-fit ​​piece is inserted into the card interface, the snap-fit ​​piece is in a snap-fit ​​state; when the snap-fit ​​piece is removed from the card interface, the snap-fit ​​piece is in a non-snaggable state.

[0087] In actual implementation, the resistance value in the detection link can be changed by adjusting the number of the snap-fit ​​connectors. The resistance value of the target resistor can be set according to the actual application requirements, and this embodiment does not impose any restrictions.

[0088] Assume that the first flexible circuit board has two sets of first connectors: first connector 1 and first connector 2, and the second flexible circuit board has two sets of second connectors: second connector 1 and second connector 2. The target resistance in each set of first connectors is 1 ohm.

[0089] When only the first connector 1 and the second connector 1 are connected by the snap-fit, a resistance of 1 ohm is added to the detection link connected by the two connector pins. When the first connector 1 and the second connector 1, and the first connector 2 and the second connector 2 are all connected by their respective snap-fit ​​devices, two 1-ohm resistors are connected in parallel. According to the equivalent formula for multiple resistors connected in parallel:

[0090] That is, a 1 / 2 ohm resistor has been added to the detection link connected by the two pins.

[0091] When testing the first detection link and the second detection link, a connecting component is inserted into a set of sockets between the first and second connecting pins of the line selector, and into a set of sockets between the first and third connecting pins, so that the first detection link and the second detection link can be tested respectively.

[0092] In one feasible implementation, if the target non-attached part is attached, a connecting component can be inserted into a set of sockets between the second and third connecting pins of the line selector. At this time, the target signal link from the attached part to the target load part is complete, and functional testing can continue. If the functional test is normal, it indicates that the target signal link is normal. If the functional test cannot be performed, it indicates that there is a problem with the target signal link, and further investigation is required.

[0093] The testing system provided in this application embodiment can test the connection status of target signal links for unfinished components on a PCB board. The target signal link is divided into the unfinished component and the surrounding circuits corresponding to the target signal as one part of the test object, which is tested through a first detection link. The target load component in the target signal link is used as another part of the test object, which is tested through a second detection link. This not only improves testing efficiency but also allows for more complete testing of the finished PCB board, improving the quality of the PCB board, reducing the probability of PCB board repair and return to the factory, thereby improving the quality of electronic products and reducing the defect rate.

[0094] This application also provides a PCB board, which includes the testing system described in this embodiment.

[0095] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0096] Those skilled in the art will understand that embodiments of this application can be provided as methods, apparatus, or computer program products. Therefore, embodiments of this application can take the form of entirely hardware embodiments, entirely software embodiments, or embodiments combining software and hardware aspects. Furthermore, embodiments of this application can take the form of computer program products implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0097] This application describes embodiments with reference to flowchart illustrations and / or block diagrams of methods, terminal devices (systems), and computer program products according to embodiments of this application. It should be understood that each block of the flowchart illustrations and / or block diagrams, as well as combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing terminal device to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing terminal device, generate instructions for implementing the flowchart illustrations. Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0098] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing terminal device to operate in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0099] These computer program instructions can also be loaded onto a computer or other programmable data processing terminal equipment, causing a series of operational steps to be performed on the computer or other programmable terminal equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable terminal equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0100] Although preferred embodiments of the present application have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of the embodiments of the present application.

[0101] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or terminal device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or terminal device. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or terminal device that includes said element.

[0102] This document uses specific examples to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only for the purpose of helping to understand the methods and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A testing system, characterized in that, Applied to PCB boards, the system is used to detect the connection status of a target signal link between a target unloaded component and a target load component on the PCB board, wherein the target signal link is the link for transmitting target signals between the target unloaded component and the target load component; the system includes: The line selection module is used to select the current detection link from the first detection link and the second detection link. The first detection link is used to detect the connection status of the target unused part and the surrounding lines corresponding to the target signal in the target signal link. The second detection link is used to detect the connection status of the target load part in the target signal link. The target unused part is configured with a first measurement point corresponding to the target signal, and the target load part is configured with a second measurement point corresponding to the target signal. The line selection module includes a line selector and a master selection switch. The light emission detection module is used to determine the connection status of the current detection link by observing the light emission state after the test pin is inserted at the first or second test point, thereby determining the connection status of the target signal link; the light emission detection module includes a power supply and a light-emitting diode; The system also includes control devices; The positive terminal of the power supply is connected to the input terminal of the master selection switch device, the negative terminal of the power supply is connected to the negative terminal of the light-emitting diode, and the positive terminal of the light-emitting diode is connected to the first connection pin of the line selector. The second connection pin of the line selector is connected to the surrounding line corresponding to the target signal, and the first test point configured on the target unattached part is connected to the first output terminal of the total selection switch device to form a first detection link; The third connection pin of the line selector is connected to the second test point configured on the target load component, and is connected to the second output terminal of the main selection switch device through the second test point to form a second detection link; The controller is used to send a link selection signal to the master selection switch, and the master selection switch responds to the link selection signal to determine the currently detected link.

2. The system according to claim 1, characterized in that, When the target unattached part has multiple target signals, the system further includes a first selection switch device and a second selection switch device; The multiple input terminals of the first selection switch are connected to the surrounding lines corresponding to each target signal, and the output terminal of the first selection switch is connected to the second connection pin of the line selector. The multiple input terminals of the second selection switch are connected to the second measurement points configured on the target load parts corresponding to each target signal, and the output terminal of the second selection switch is connected to the third connection pin of the line selector. The controller is also configured to, in response to a switching operation, send a first selection control signal to the first selection switch device and a second selection control signal to the second selection switch device. The first selection control signal is used to switch the surrounding lines corresponding to the target signal in the first detection link, and the second selection control signal is used to switch the target load component in the second detection link.

3. The system according to claim 2, characterized in that, The control device is also used for: Real-time detection of the insertion signal of the test pins at the first and second test points; When the insertion signal of the test pin is detected at the first test point, an enable signal is sent to the general selection switch and the first selection switch to make the first detection link the current detection link; When the insertion signal of the test pin is detected at the second test point, an enable signal is sent to the general selection switch and the second selection switch to make the second detection link the current detection link.

4. The system according to claim 3, characterized in that, Pressure sensors are installed in the first and second measuring points; When the test pin is inserted into the first or second test point, the pressure sensor sends the pressure detection result as an insertion signal to the controller.

5. The system according to any one of claims 1-4, characterized in that, The first and second measuring points are first blind vias including layers L1 to L2, second blind vias including layers Ln-1 to Ln, and buried vias including layers L2 to Ln-1, and the first and second blind vias are plated with copper.

6. The system according to claim 1, characterized in that, The line selector includes an insulated connector, on which a first connector, a second connector, and a third connector are provided; In the first connecting pin, the second connecting pin and the third connecting pin, a set of sockets is provided between any two connecting pins. Each set of sockets includes a first socket and a second socket. The first socket is connected to one connecting pin through a wire, and the second socket is connected to another connecting pin through a wire. Each set of sockets is provided with a connecting component, which is detachably connected to each set of sockets. The connecting component is used to connect the first socket and the second socket, and is also used to adjust the resistance value in the current detection link.

7. The system according to claim 6, characterized in that, The connection assembly includes a first flexible board for insertion into the first socket and a second flexible board for insertion into the second socket; The first flexible board is provided with multiple sets of first connectors. Each first connector includes a first metal contact terminal, a target resistor, and a first pin connected in sequence by wires. When the first flexible board is inserted into the first socket, the first metal contact terminal contacts the metal contact terminal provided on the inner wall of the first socket, and the number of the first metal contact terminal is the same as the number of the metal contact terminal provided on the inner wall of the first socket. The second flexible board is provided with multiple sets of second connectors. The second connectors include second metal contact terminals and second pins connected in sequence by wires. When the second flexible board is inserted into the second socket, the second metal contact terminals contact the metal contact terminals provided on the inner wall of the second socket, and the number of the second metal contact terminals is the same as the number of the metal contact terminals provided on the inner wall of the second socket. Multiple metal contact terminals disposed on the inner walls of the first and second sockets are connected in series by wires; The first and second pins are provided with snap-fit ​​components. When the snap-fit ​​components are in the snap-fit ​​state, the first and second pins are in contact.

8. The system according to claim 7, characterized in that, The card connector includes a card connector tab and a card interface; The snap-fit ​​tab is positioned at the end of the first pin furthest from the target resistor; The card interface is located at the end of the second pin that is furthest from the second metal contact terminal; When the card connector is inserted into the card interface, the card connector is in a snap-fit ​​state; When the snap-fit ​​tab is pulled out of the card interface, the snap-fit ​​component is in an un-snapped state.

9. A PCB board, characterized in that, The PCB board includes the testing system according to any one of claims 1-8.

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