A bionic finger, robotic hand and robot

Abstract

This invention discloses a bionic finger, robotic hand, and robot. The bionic finger includes: a phalanx, comprising a base and a nail portion, the base and nail portion being integrally formed; a support body, mounted on the nail portion; a circuit board, located on the side of the support body opposite to the nail portion; and a sensing envelope, connected to the support body and enclosing the circuit board and support body, abutting against the edges of the base and nail portion. The sensing envelope mimics the skin of a real finger and assists in achieving touch sensing functionality; the sensing envelope abuts against the nail portion, mimicking the skin and nail of a real finger. The nail portion is located on the upper surface of the fingertip, and the sensing envelope covers the front, lower, left, and right surfaces of the fingertip. The support body is configured to assemble the circuit board and sensing envelope onto the phalanx. The sensing envelope is connected to the support body, so that the circuit board is held within the support body and the sensing envelope. The bionic finger exhibits high biomimetic effects in both morphology and function.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of robots, in particular to a bionic finger, a robot hand and a robot. BACKGROUND

[0002] The robot hand is applied to the field of robots or artificial limbs, so that the robot can form a bionic robot and the artificial limb can assist the daily life of the disabled.

[0003] The existing finger has a touch function and a small size, and the bionic finger is difficult to consider the touch function and the shape, so the bionic effect of the bionic finger still needs to be improved.

[0004] Therefore, the prior art still needs to be improved and developed. SUMMARY

[0005] The technical problem to be solved by the present application is to provide a bionic finger, a robot hand and a robot, which aims to solve the problem that the bionic finger in the prior art is difficult to consider the touch function and the shape, resulting in the bionic effect still needs to be improved.

[0006] The technical scheme adopted by the present application to solve the technical problem is as follows:

[0007] A bionic finger, comprising:

[0008] A finger joint comprising a finger base and a nail part, the finger base and the nail part being formed in one piece;

[0009] A support body mounted on the nail part;

[0010] A circuit board located on the side of the support body away from the nail part;

[0011] An induction wrapping body connected to the support body and wrapping the circuit board and the support body, and abutting against the edge of the finger base and the edge of the nail part.

[0012] The bionic finger, wherein the induction wrapping body comprises:

[0013] A hard part, a via hole being formed on the hard part;

[0014] A flexible conductive part located on the side of the via hole away from the circuit board;

[0015] An insulating wrapping layer wrapping the hard part and the flexible conductive part;

[0016] Wherein, the hard part, the flexible conductive part and the insulating wrapping layer are formed in one piece by in-mold injection.

[0017] The bionic finger, wherein the flexible conductive part comprises:

[0018] A shell layer is arranged around the via hole.

[0019] A platform part is arranged in the shell layer.

[0020] A convex part is arranged on the platform part.

[0021] The surface of the platform part is parallel to the circuit board.

[0022] The bionic finger, wherein the platform part has two, and each of the platform parts has one convex part.

[0023] The bionic finger, wherein the hard part is formed with a placing groove, and the via hole is located at the bottom of the placing groove.

[0024] The circuit board and the support body are both placed in the placing groove.

[0025] The bionic finger, wherein the support body is formed with an avoiding groove towards the position of the via hole.

[0026] The bionic finger, wherein the front end of the circuit board is clamped with the hard part, or the front end of the support body is clamped with the hard part.

[0027] The rear end of the circuit board and the rear end of the support body are both connected with the hard part.

[0028] The top of the support body is connected with the nail part.

[0029] The bionic finger, wherein the knuckles are made of metal material.

[0030] The support body and the hard part are both made of plastic.

[0031] The flexible conductive part is made of conductive silica gel.

[0032] The insulating wrapping layer is made of insulating silica gel.

[0033] A robot hand, comprising the bionic finger according to any one of the above.

[0034] A robot, comprising the bionic finger according to any one of the above or the robot hand according to the above.

[0035] Beneficial effects: the configured induction package imitates the skin of a real finger, and assists in realizing the touch sensing function; the configured induction package abuts against the nail part, imitates the skin and nail of a real finger. The nail part is located on the upper surface of the finger end part, and the induction package covers the front surface, lower surface, left surface and right surface of the finger end part. The configured support body realizes the assembly of the circuit board and the induction package on the knuckle. The induction package is connected with the support body, so that the circuit board is clamped in the support body and the induction package, realizing the installation of the circuit board. The bionic finger has high bionic effect in form and function. BRIEF DESCRIPTION OF DRAWINGS

[0036] Figure 1 is a perspective view of a bionic finger in an embodiment of the present application.

[0037] Figure 2 is a top view of a bionic finger in an embodiment of the present application.

[0038] Figure 3 is Figure 2 a sectional view in direction A.

[0039] Figure 4 is a first exploded view of a bionic finger in an embodiment of the present application.

[0040] Figure 5 is a second exploded view of a bionic finger in an embodiment of the present application.

[0041] Figure 6 is a structural schematic view of an induction package in an embodiment of the present application.

[0042] Figure 7 is a first exploded view of an induction package in an embodiment of the present application.

[0043] Figure 8 is a second exploded view of an induction package in an embodiment of the present application.

[0044] Figure 9 is a first sectional view of an induction package in an embodiment of the present application.

[0045] Figure 10 is a second sectional view of an induction package in an embodiment of the present application.

[0046] Figure 11 is a structural schematic view of a knuckle in an embodiment of the present application.

[0047] Figure 12 is a first structural schematic view of a support body in an embodiment of the present application.

[0048] Figure 13 is a second structural schematic view of a support body in an embodiment of the present application.

[0049] Figure 14 is a structural schematic diagram of a robot in an embodiment of the present application.

[0050] Figure 15 is a structural schematic diagram of a robot in an embodiment of the present application.

[0051] Legend of reference signs:

[0052] 10, knuckle; 11, base of finger; 12, nail part;

[0053] 20, support body; 21, avoiding slot;

[0054] 30, circuit board;

[0055] 40, inductive wrapping body; 41, hard part; 411, via hole; 412, placing slot; 413, clamping slot; 414, T-shaped hole; 415, vertical wall; 416, first support table; 42, flexible conductive part; 421, shell layer; 422, platform part; 423, protruding part; 424, T-shaped part; 425, second support table; 43, insulating wrapping layer; 431, limiting part. DETAILED DESCRIPTION

[0056] To make the objectives, technical solutions and advantages of the present application clearer and more explicit, the present application is further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and do not limit the present application.

[0057] Please refer to Figures 1-13 , some embodiments of the bionic finger are provided.

[0058] As shown in Figures 1-3 and Figure 11 , the bionic finger of the present application comprises:

[0059] The knuckle 10 comprises the base of finger 11 and the nail part 12, and the base of finger 11 and the nail part 12 form an integral body;

[0060] The support body 20 is installed on the nail part 12;

[0061] The circuit board 30 is located on the side of the support body 20 away from the nail part 12;

[0062] The inductive wrapping body 40 is connected with the support body 20 and wraps the circuit board 30 and the support body 20, and abuts against the edge of the base of finger 11 and the edge of the nail part 12.

[0063] Specifically, the knuckle 10 is the end knuckle of the finger, and the real finger mainly touches the end knuckle 10, and the end knuckle 10 is attached with a nail. In order to improve the bionic effect of the finger, the sensing package 40 is configured to bionically simulate the skin of the real finger and assist in realizing the touch sensing function; the sensing package 40 is configured to abut against the nail part 12 to bionically simulate the skin and the nail of the real finger. The nail part 12 is located on the upper surface of the end of the finger, and the sensing package 40 covers the front surface, the lower surface, the left surface and the right surface of the end of the finger. The support 20 is configured to realize the assembly of the circuit board 30 and the sensing package 40 on the knuckle 10. The sensing package 40 is connected with the support 20, so that the circuit board 30 is clamped in the support 20 and the sensing package 40 to realize the installation of the circuit board 30. The bionic finger has high bionic effect in form and function.

[0064] In a preferred implementation of the embodiment of the present application, as shown in Figures 6-10 The sensing package 40 comprises:

[0065] The hard part 41 is formed with a through hole 411;

[0066] The flexible conductive part 42 is located on the side of the through hole 411 away from the circuit board 30;

[0067] The insulating wrapping layer 43 wraps the hard part 41 and the flexible conductive part 42;

[0068] The hard part 41, the flexible conductive part 42 and the insulating wrapping layer 43 are formed into an integrated structure by in-mold injection.

[0069] Specifically, the induction package 40 is an integral structure and cannot be disassembled. The hard part 41 is prepared first, for example, the hard part 41 can be prepared by injection molding; then the hard part 41 is placed in a mold, and a first in-mold injection is used to form the flexible conductive part 42 on the basis of the hard part 41; finally, the hard part 41 and the flexible conductive part 42 are placed in another mold, and a second in-mold injection is used to form the insulating wrapping layer 43 on the basis of the hard part 41 and the flexible conductive part 42. The two in-mold injections make the hard part 41, the flexible conductive part 42 and the insulating wrapping layer 43 form an integral structure in the mold. The hard part 41 is connected with the support body 20, and when the insulating wrapping layer 43 is extruded, it will drive the flexible conductive part 42 to deform and move, and pass through the through hole 411 to extrude the circuit board 30. The hard part 41 is made of hard material, for example, plastic. The flexible conductive part 42 can be made of flexible conductive material, for example, conductive silicone. The insulating wrapping layer 43 is made of flexible insulating material, for example, insulating silicone. The flexible conductive material and the flexible insulating material use the same base material, for example, both use silicone, which can enhance the connection strength between the flexible conductive part 42 and the insulating wrapping layer 43. The conductive silicone is based on the base material (silicone) and increases the conductive dopant, thereby having conductivity.

[0070] To further improve the connection strength between the components in the induction package 40, a T-shaped hole 414 is formed on the hard part 41, a T-shaped part 424 is formed on the flexible conductive part 42, the T-shaped part 424 is located in the T-shaped hole 414, and the horizontal direction of the flexible conductive part 42 is limited by the T-shaped hole 414. A vertical wall 415 is formed on the hard part 41, and a limiting part 431 is formed on the insulating wrapping layer 43, the limiting part 431 is located above the vertical wall 415. The vertical wall 415 extends along the edge of the hard part 41 to form a placing groove 412. The upper surface edge of the flexible conductive part 42 is attached to the lower surface edge of the hard part 41. The vertical direction of the flexible conductive part 42 and the insulating wrapping layer 43 is respectively limited by the lower surface of the hard part 41 and the upper surface of the vertical wall 415.

[0071] In a preferred implementation manner of the embodiment of the present application, as shown in Figures 9-10 the flexible conductive part 42 comprises:

[0072] a shell layer 421, which is arranged around the through hole 411;

[0073] a platform part 422, which is arranged in the shell layer 421;

[0074] a protruding part 423, which is arranged on the platform part 422;

[0075] wherein the surface of the platform part 422 is parallel to the circuit board 30.

[0076] Specifically, the shell layer 421 is convex, similar to the shape of the finger pulp of a real finger. The surface of the platform portion 422 is planar, the convex portion 423 protrudes from the surface of the platform portion 422 and faces the circuit board 30. The surface of the convex portion 423 is curved, which can be spherical or ellipsoidal.

[0077] A first support platform 416 is formed on the hard portion 41, and the first support platform 416 has two, which are located on both sides of the T-shaped hole 414. A second support platform 425 is formed on the shell layer 421, and the position of the second support platform 425 corresponds to the position of the first support platform 416, and the second support platform 425 has two. The contact area between the hard portion 41 and the shell layer 421 is increased by the first support platform 416 and the second support platform 425, and the connection strength of the two is improved. The first support platform 416 blocks the T-shaped portion 424, which increases the difficulty of the T-shaped portion 424 from the T-shaped hole 414.

[0078] In a preferred implementation manner of the embodiment of the present application, as shown in Figures 9-10 , the platform portion 422 has two, and each of the platform portions 422 has one convex portion 423.

[0079] Specifically, the platform portion 422 can have one or more, for example, two platform portions 422 are adopted. Each platform portion 422 is configured with one convex portion 423, and two platform portions 422 are adopted, so that there are two convex portions 423. There are electrodes on the circuit board 30, and each convex portion 423 corresponds to at least two electrodes, and there is an electric field between the two electrodes. Due to the movement of the convex portion 423, the electric field distribution between the two electrodes is changed, resulting in a change in the capacitance between the two electrodes.

[0080] In a preferred implementation manner of the embodiment of the present application, as shown in Figure 6 , Figure 7 and Figure 9 , the hard portion 41 is formed with a placing groove 412, and the via hole 411 is located at the bottom of the placing groove 412; the circuit board 30 and the support body 20 are placed in the placing groove 412.

[0081] Specifically, the upper surface of the hard portion 41 forms the placing groove 412, and the circuit board 30 and the support body 20 are placed in the placing groove 412, and the support body 20 and the hard portion 41 are connected by a locking member.

[0082] In a preferred implementation manner of the embodiment of the present application, as shown in Figure 3 , Figure 12 and Figure 13 , the support body 20 is formed with an avoiding groove 21 towards the position of the via hole 411.

[0083] Specifically, the support body 20 is formed with an avoiding slot 21 corresponding to the position of the through hole 411, which can accommodate the electronic device on the circuit board 30 and avoid deformation of the circuit board 30.

[0084] In a preferred implementation of the embodiment of the present application, as shown in Figure 3 , Figure 9 and Figure 10 , the front end of the circuit board 30 is clamped with the hard part 41, or the front end of the support body 20 is clamped with the hard part 41.

[0085] Specifically, the hard part 41 is formed with a clamping slot 413, and the front end of the circuit board 30 or the front end of the support body 20 is clamped into the clamping slot 413, so that the inductive wrapping body 40 is clamped with the front end of the circuit board 30 (or the front end of the support body 20).

[0086] In a preferred implementation of the embodiment of the present application, as shown in Figures 3-5 , the rear end of the circuit board 30 and the rear end of the support body 20 are both connected with the hard part 41.

[0087] Specifically, the rear end of the support body 20 is connected with the hard part 41 and clamps and fixes the circuit board 30. For example, a locking accessory can be used to pass through the support body 20 and the circuit board 30 and be connected with the hard part 41.

[0088] In a preferred implementation of the embodiment of the present application, as shown in Figures 2-5 , the top of the support body 20 is connected with the nail part 12.

[0089] Specifically, the top of the support body 20 is connected with the nail part 12, for example, a locking accessory can be used to pass through the nail part 12 and be connected with the top of the support body 20.

[0090] In a preferred implementation of the embodiment of the present application, the knuckle 10 is made of a metal material.

[0091] Specifically, the knuckle 10 is made of a hard material, for example, a plastic or a metal material.

[0092] In a preferred implementation of the embodiment of the present application, the support body 20 and the hard part 41 are both made of plastic.

[0093] Specifically, the support body 20 and the hard part 41 are both made of a hard material, for example, plastic.

[0094] Based on the bionic finger described in any of the above embodiments, the present application further provides an embodiment of a robot hand.

[0095] The machine hand of the present application comprises the bionic finger as described in any of the above embodiments. The machine hand can be a single-finger machine hand or a multi-finger machine hand, such as a two-finger machine hand or a three-finger machine hand. The machine hand can perform intended tasks such as grasping or carrying objects, operating tools, and showing different gestures. Figure 14 The machine hand has five fingers, any of which can adopt the bionic finger as described in any of the above embodiments, for example, the index finger, the middle finger, the ring finger, and the little finger.

[0096] Based on the bionic finger or the machine hand as described in any of the above embodiments, the present application further provides an embodiment of a robot.

[0097] The robot of the present application comprises the bionic finger or the machine hand as described in any of the above embodiments. The robot can be a special robot, a wheeled robot, a legged robot, a crawler robot, a squirming robot, a flying robot, a floating robot, a diving robot, a ground robot, an underground robot, a space robot, a SCARA robot, a parallel robot, a master-slave robot, a collaborative robot, etc. The robot can adopt a single-arm robot or a multi-arm robot. Figure 15 The wheeled robot has bionic arms, any of which can adopt the machine hand or the bionic finger as described in any of the above embodiments.

[0098] It should be understood that the application of the present application is not limited to the above examples, and those skilled in the art can make improvements or modifications according to the above description, and all such improvements and modifications shall fall within the scope of protection of the claims of the present application.

Claims

1. A bionic finger, characterized in that, The application relates to a bionic finger. The application relates to a bionic finger. The application relates to a bionic finger. The application relates to a bionic finger. The application relates to a bionic finger. The application relates to a bionic finger. The application relates to a bionic finger. The application relates to a bionic finger. The application relates to a bionic finger. The application relates to a bionic finger.

2. The bionic finger according to claim 1, characterized in that, The application relates to a bionic finger. The application relates to a bionic finger. The application relates to a bionic finger. The application relates to a bionic finger. The application relates to a bionic finger.

3. The bionic finger according to claim 2, characterized in that, The application relates to a bionic finger.

4. The bionic finger according to claim 1, characterized in that, The application relates to a bionic finger. The application relates to a bionic finger.

5. The bionic finger according to claim 1, characterized in that, The application relates to a bionic finger.

6. The bionic finger according to any one of claims 1-5, characterized in that, The application relates to a bionic finger. The application relates to a bionic finger. The application relates to a bionic finger.

7. The bionic finger according to any one of claims 1-5, characterized in that, The application relates to a bionic finger. The application relates to a bionic finger. The application relates to a bionic finger. The application relates to a bionic finger.

8. A robot hand, characterized in that The application relates to a bionic finger. The application relates to a bionic finger.

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