Rare earth light emitting diode lighting apparatus and cooling control method

Abstract

The application provides a rare earth light emitting diode lighting device and a cooling control method. The lighting device is used to determine a heat load temperature threshold of the lighting device in a current working state through cumulative aging characteristics of each LED chip in the lighting device and historical time sequence characteristics of a heat load temperature. When a real-time junction temperature of the lighting device is greater than the heat load temperature threshold, the cumulative effect value of the thermal fatigue temperature in each LED chip of the lighting device is calculated based on the junction temperature information of the lighting device, the heat accumulation characteristics of the thermal fatigue temperature in the lighting device are determined through all the cumulative effect values, and the thermal fatigue state value of the lighting device after a specified time period is predicted according to the heat accumulation characteristics and the temperature gradient of the shell temperature information of the lighting device. The rare earth light emitting diode in the lighting device is actively and preventively cooled through the temperature difference between the thermal fatigue state value and the real-time junction temperature. The active cooling control of the lighting device based on the dynamic temperature threshold and the fatigue accumulation is realized.

Description

Technical Field

[0001] This application relates to the field of lighting equipment cooling technology, and more specifically, to a rare earth light-emitting diode lighting device and a cooling control method. Background Technology

[0002] Rare-earth LED lighting equipment is a high-efficiency, energy-saving lighting device that utilizes the fluorescence conversion technology of rare-earth luminescent materials to achieve white light emission. The light-emitting principle of rare-earth LED lighting equipment is that the 4f electron layer of rare-earth elements emits light of a fixed wavelength through electron transitions. Rare-earth LED lighting equipment has advantages such as narrow emission spectrum band, high color purity, vibrant colors, high conversion efficiency, and stable physical and chemical properties, and is applied in the fields of LCD backlighting, full-color displays, and laser lighting.

[0003] Current cooling control strategies for rare-earth LED lighting devices only trigger the cooling mechanism when the temperature exceeds a preset fixed threshold. This approach fails to address the complex and non-uniform thermal environment of LED lighting devices in actual operation. Due to differences in the spatial distribution of LED chips within the luminaire, variations in heat dissipation path impedance, and slight fluctuations in packaging material properties, the actual junction temperature and aging rate of each chip exhibit significant differences. A uniform temperature threshold cannot identify these individual state variations: for chips with poor heat dissipation or those already experiencing localized aging, the temperature threshold may be too high, leading to a prolonged risk of overheating and accelerated light decay; conversely, for chips with good heat dissipation, the temperature threshold may be too conservative, causing frequent and unnecessary activation of the cooling system, wasting energy and shortening the lifespan of cooling components. Fixed threshold management lacks the ability to perceive and adapt to the non-uniformity of the device's internal state, thus limiting the accuracy and efficiency of thermal control. Therefore, achieving active cooling control that integrates dynamic temperature thresholds and fatigue accumulation in lighting devices has become a challenge for the industry. Summary of the Invention

[0004] This application provides a rare-earth light-emitting diode lighting device and a cooling control method, which can realize active cooling control in the lighting device by integrating dynamic temperature threshold and fatigue accumulation.

[0005] In a first aspect, this application provides a cooling control method for cooling rare-earth light-emitting diode lighting devices, comprising:

[0006] When the lighting equipment is working, the junction temperature information of each LED chip in the rare earth light-emitting diode of the lighting equipment is collected, and the shell temperature information of the lighting equipment is obtained.

[0007] Extract the cumulative aging characteristics of each LED chip in the lighting equipment and the historical time-series characteristics of the heat load temperature from the historical junction temperature information. Determine the heat load temperature threshold of the lighting equipment under the current working state through the historical time-series characteristics and each cumulative aging characteristic.

[0008] When the real-time junction temperature of the lighting device is greater than the heat load temperature threshold, the cumulative effect value of the thermal fatigue temperature in each LED chip of the lighting device is calculated based on the junction temperature information. The heat accumulation characteristics of the thermal fatigue temperature in the lighting device are determined by all the cumulative effect values. The thermal fatigue state value of the lighting device after a specified time period is predicted based on the heat accumulation characteristics and the temperature gradient of the shell temperature information.

[0009] Preventive active cooling of rare-earth light-emitting diodes in lighting equipment is achieved by using the temperature difference between the thermal fatigue state value and the real-time junction temperature.

[0010] In some embodiments, extracting the historical time-series characteristics of the thermal load temperature from the cumulative aging characteristics and historical junction temperature information of each LED chip in the lighting device specifically includes:

[0011] Obtain historical junction temperature information and operating data of lighting equipment;

[0012] For each LED chip in the lighting equipment, the cumulative aging value of the LED chip in each lighting operation is calculated based on the working data, and the moving average temperature, temperature change rate and out-of-bounds time of the heat load temperature in the LED chip are calculated based on the historical junction temperature information.

[0013] The cumulative aging characteristics of the LED chip are determined by all the cumulative aging values, and the timing characteristics of the LED chip are determined by the moving average temperature, the temperature change rate, and the time of exceeding the limit, thereby obtaining the cumulative aging characteristics and timing characteristics of each LED chip in the lighting device.

[0014] Based on all the temporal characteristics, determine the historical temporal characteristics of the thermal load temperature in the lighting equipment.

[0015] In some embodiments, determining the heat load temperature threshold of the lighting device under its current operating state through the historical time series characteristics and various cumulative aging characteristics specifically includes:

[0016] For each LED chip in the lighting equipment, obtain the initial threshold of the LED chip thermal load temperature;

[0017] By fine-tuning the initial threshold based on the cumulative aging characteristics and timing characteristics of the LED chip, the safe threshold for the thermal load temperature of the LED chip is obtained, and then the safe threshold for the thermal load temperature of each LED chip is obtained.

[0018] The thermal load temperature threshold for the lighting equipment under its current operating condition is determined based on all safety thresholds.

[0019] In some embodiments, calculating the cumulative effect value of thermal fatigue temperature in each LED chip of the lighting device based on the junction temperature information specifically includes:

[0020] For each LED chip in the lighting equipment, the junction temperature curve of the LED chip is extracted from the junction temperature information;

[0021] The junction temperature curve is divided into multiple thermal cycling stages, and the average temperature and temperature change range of each thermal cycling stage are calculated to determine the thermal fatigue damage of each thermal cycling stage in the LED chip.

[0022] The cumulative effect of thermal fatigue temperature in LED chips is determined by identifying all thermal fatigue damage, and then the cumulative effect of thermal fatigue temperature in each LED chip in the lighting equipment is determined.

[0023] In some embodiments, determining the cumulative heat characteristics of thermal fatigue temperature in a lighting device using all cumulative effect values ​​specifically includes:

[0024] Extract the maximum value and statistical characteristics of thermal fatigue temperature in lighting equipment from all cumulative effect values;

[0025] The cumulative heat characteristics of thermal fatigue temperature in lighting equipment are determined by the maximum value characteristics and the statistical characteristics.

[0026] In some embodiments, predicting the thermal fatigue state value of the lighting device after a specified time period based on the temperature gradient of the heat accumulation characteristics and the housing temperature information specifically includes:

[0027] Initialize a fatigue accumulation model based on temperature field mapping;

[0028] The temperature gradient of the shell temperature information is used as the thermal resistance characterization parameter in the fatigue accumulation model.

[0029] The heat accumulation feature is used as the initial damage state in the fatigue accumulation model;

[0030] The thermal fatigue state of the lighting equipment is predicted using a fatigue accumulation model that inputs the thermal resistance characterization parameters and the initial damage state, and the thermal fatigue state value of the lighting equipment is obtained after a specified time period.

[0031] In some embodiments, preventative active cooling of rare-earth light-emitting diodes in lighting equipment based on the temperature difference between the thermal fatigue state value and the real-time junction temperature specifically includes:

[0032] Determine the temperature difference between the thermal fatigue state value and the real-time junction temperature;

[0033] The intensity of cooling demand for the lighting equipment after a specified time period is determined by the temperature difference value.

[0034] The cooling control signal for the rare-earth light-emitting diodes in the lighting equipment is generated based on the intensity of the cooling demand.

[0035] Secondly, this application provides a rare-earth light-emitting diode lighting device, including a cooling control unit, the cooling control unit comprising:

[0036] The data acquisition module is used to acquire the junction temperature information of each LED chip in the rare earth light-emitting diode of the lighting equipment and to obtain the shell temperature information of the lighting equipment when the lighting equipment is working.

[0037] The processing module is used to extract the cumulative aging characteristics of each LED chip in the lighting equipment and the historical time-series characteristics of the heat load temperature in the historical junction temperature information, and to determine the heat load temperature threshold of the lighting equipment in the current working state through the historical time-series characteristics and each cumulative aging characteristic.

[0038] The processing module is also used to calculate the cumulative effect value of thermal fatigue temperature in each LED chip of the lighting device based on the junction temperature information when the real-time junction temperature of the lighting device is greater than the heat load temperature threshold, determine the heat accumulation characteristics of thermal fatigue temperature in the lighting device through all the cumulative effect values, and predict the thermal fatigue state value of the lighting device after a specified time period based on the heat accumulation characteristics and the temperature gradient of the shell temperature information.

[0039] An execution module is used to perform preventative active cooling of rare-earth light-emitting diodes in lighting equipment based on the temperature difference between the thermal fatigue state value and the real-time junction temperature.

[0040] Thirdly, this application provides a computer device, the computer device including a memory and a processor, the memory for storing a computer program, and the processor for calling and running the computer program from the memory, so that the computer device performs the above-described cooling control method.

[0041] Fourthly, this application provides a computer-readable storage medium storing instructions or code that, when executed on a computer, cause the computer to implement the aforementioned cooling control method.

[0042] The technical solutions provided by the embodiments disclosed in this application have the following beneficial effects:

[0043] This application provides a rare-earth light-emitting diode (LED) lighting device and cooling control method. When the lighting device is operating, the junction temperature information of each LED chip in the rare-earth LED is collected, and the casing temperature information of the lighting device is obtained. The cumulative aging characteristics of each LED chip in the lighting device and the historical time-series characteristics of the heat load temperature in the historical junction temperature information are extracted. The heat load temperature threshold of the lighting device under the current operating state is determined through the historical time-series characteristics and the cumulative aging characteristics. When the real-time junction temperature of the lighting device is greater than the heat load temperature threshold, the cumulative effect value of the thermal fatigue temperature in each LED chip of the lighting device is calculated based on the junction temperature information. The heat accumulation characteristics of the thermal fatigue temperature in the lighting device are determined through all the cumulative effect values. The thermal fatigue state value of the lighting device after a specified time period is predicted based on the heat accumulation characteristics and the temperature gradient of the casing temperature information. Preventive active cooling of the rare-earth LED in the lighting device is performed based on the temperature difference between the thermal fatigue state value and the real-time junction temperature.

[0044] Therefore, in this application, the rare-earth LEDs in the lighting equipment are preventively cooled by the temperature difference between the thermal fatigue state value and the real-time junction temperature. First, by determining the thermal load temperature threshold, a precise assessment of the thermal load on the lighting equipment under current operating conditions can be obtained, thereby enabling real-time monitoring and early warning of the lighting equipment's thermal state. Determining the thermal load temperature threshold allows the lighting equipment to take timely measures when the junction temperature approaches or exceeds the threshold, avoiding performance degradation and shortened lifespan due to excessive heating. This provides a scientific basis for subsequent active cooling control, ensuring stable operation of the lighting equipment within a safe temperature range, extending equipment lifespan, and improving lighting quality and reliability. Then, the thermal fatigue state value is determined... The fatigue state value can predict the potential thermal fatigue status of lighting equipment after a specified period, thereby enabling proactive management of the equipment's future thermal state. This allows for early understanding of potential performance changes due to thermal fatigue accumulation during long-term operation, enabling adjustments to cooling strategies based on the predictions. Preventative active cooling of rare-earth LEDs effectively mitigates the negative impact of thermal fatigue on equipment performance, preventing damage from sudden thermal fatigue failures, further improving the reliability and stability of lighting equipment, and optimizing its long-term operational performance. In summary, based on the above scheme, active cooling control integrating dynamic temperature thresholds and fatigue accumulation can be achieved in lighting equipment. Attached Figure Description

[0045] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0046] Figure 1 This is an exemplary flowchart of a cooling control method according to some embodiments of this application;

[0047] Figure 2 This is a flowchart illustrating the process of determining the cumulative effect value according to some embodiments of this application;

[0048] Figure 3 This is a schematic diagram of the structure of a cooling control unit according to some embodiments of this application;

[0049] Figure 4 This is a schematic diagram of the structure of a computer device implementing a cooling control method according to some embodiments of this application. Detailed Implementation

[0050] To better understand the technical solution of this application, the technical solution of this application will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0051] refer to Figure 1 The figure is an exemplary flowchart of a cooling control method according to some embodiments of this application. The cooling control method mainly includes the following steps:

[0052] In step 101, when the lighting device is emitting light, the junction temperature information of each LED chip in the rare earth light-emitting diode of the lighting device is collected, and the casing temperature information of the lighting device is obtained.

[0053] It should be noted that, in this application, the junction temperature information refers to the temperature value of the PN junction inside the rare earth light-emitting diode chip when it is working, and this junction temperature information is in degrees Celsius; the casing temperature information refers to the temperature value of the surface of the heat dissipation casing of the rare earth light-emitting diode lighting device, also in degrees Celsius.

[0054] In practical implementation, the junction temperature information of each LED chip in the rare-earth light-emitting diode of the lighting equipment can be collected in the following way: For each LED chip in the rare-earth light-emitting diode of the lighting equipment, the real-time junction temperature value of the LED chip is measured using the forward voltage method when the lighting equipment is emitting light. That is, firstly, the temperature-voltage coefficient (K value, unit is mV / ℃) of the LED chip is calibrated in a high-precision temperature control box to establish the corresponding relationship. In actual operation, a very small measuring current that does not cause heat generation is applied to the LED to quickly measure its forward voltage drop Vf1, and then the operating current is immediately switched to make it emit light normally. When measurement is needed, the current is quickly switched again to measure the voltage drop Vf2 at this time. By using the difference between the two voltage drops (ΔVf=Vf2-Vf1) and the known K value, the real-time junction temperature value (Tj = T_calibrated + ΔVf) can be calculated. / K) is used as the real-time junction temperature value of the LED chip, where T_calibrated is the reference junction temperature value measured experimentally. The set of all real-time junction temperature values ​​is used as the junction temperature information of the LED chip. The junction temperature information of each LED chip in the rare earth light-emitting diode of the lighting device can be obtained in the above way. Then, the housing temperature information of the lighting device can be obtained in the following way: use an infrared temperature sensor to measure the measurement point on the housing of the lighting device to obtain the housing temperature information of the lighting device.

[0055] In step 102, the cumulative aging characteristics of each LED chip in the lighting device and the historical time-series characteristics of the thermal load temperature in the historical junction temperature information are extracted. The thermal load temperature threshold of the lighting device under the current working state is determined by the historical time-series characteristics and each cumulative aging characteristic.

[0056] In some embodiments, extracting the cumulative aging characteristics of each LED chip in the lighting device and the historical time-series characteristics of the thermal load temperature from the historical junction temperature information can be achieved using the following steps:

[0057] Obtain historical junction temperature information and operating data of lighting equipment;

[0058] For each LED chip in the lighting equipment, the cumulative aging value of the LED chip in each lighting operation is calculated based on the working data, and the moving average temperature, temperature change rate and out-of-bounds time of the heat load temperature in the LED chip are calculated based on the historical junction temperature information.

[0059] The cumulative aging characteristics of the LED chip are determined by all the cumulative aging values, and the timing characteristics of the LED chip are determined by the moving average temperature, the temperature change rate, and the time of exceeding the limit, thereby obtaining the cumulative aging characteristics and timing characteristics of each LED chip in the lighting device.

[0060] Based on all the temporal characteristics, determine the historical temporal characteristics of the thermal load temperature in the lighting equipment.

[0061] It should be noted that, in this application, historical time-series characteristics are global characteristics describing the historical patterns of the thermal load of lighting equipment; cumulative aging characteristics are comprehensive indicators of the overall aging state of LED chips; historical junction temperature information refers to the sequential data of the junction temperature of each LED chip recorded in chronological order; operating data refers to the operating parameters of LED chips within the same time period; cumulative aging value is a numerical value that quantifies the degree of performance degradation of LED chips caused by electro-thermal stress; moving average temperature is used to eliminate short-term temperature fluctuations and smoothly reflect the average thermal load level over a recent period; temperature change rate reflects the severity of thermal cycling of LED chips and the speed of temperature rise and fall; out-of-bounds time is the duration of high-temperature stress on LED chips; and time-series characteristics refer to the characteristic values ​​of the thermal load variation pattern of LED chips over time.

[0062] In specific implementation, firstly, obtaining the historical junction temperature information and operating data of the lighting equipment can be achieved in the following way: the non-volatile memory built into the control system of the lighting equipment continuously records the junction temperature sampling value of each LED chip and the corresponding operating current and voltage data at fixed time intervals. Thus, the set of all junction temperature sampling values ​​is taken as the historical junction temperature information of the lighting equipment, and the set of all operating current and voltage data is taken as the operating data of the lighting equipment. Secondly, for each LED chip in the lighting equipment, the cumulative aging value of the LED chip in each lighting operation is calculated based on the operating data. The moving average temperature, temperature change rate, and out-of-range time of the thermal load temperature in the LED chip are calculated based on the historical junction temperature information in the following way: for each LED chip in the lighting equipment, the total effective operating time and the proportion of operating time at different current levels are extracted from the LED chip's operating data and input into a preset aging mathematical model. This aging mathematical model comprehensively considers the cumulative effects of electrical stress and thermal stress, and calculates the cumulative aging value characterizing the degree of chip lifespan consumption, thus obtaining the cumulative aging value of the LED chip in each lighting operation. Simultaneously, the historical junction temperature sequence of the LED chip is read from the historical junction temperature information. The system calculates the arithmetic mean of temperatures within a continuously sliding recent time window to obtain a smoothed moving average temperature. The temperature change rate of the LED chip is obtained by dividing the absolute value of the temperature difference between adjacent time points by the time interval. The system iterates through all or part of the historical temperature data, accumulating the time intervals corresponding to all sampling points exceeding a preset temperature threshold, ultimately obtaining the total out-of-bounds time as the out-of-bounds time of the LED chip. Then, the cumulative aging characteristics of the LED chip are determined through all accumulated aging values, and the timing of the LED chip is determined using the moving average temperature, the temperature change rate, and the out-of-bounds time. The cumulative aging characteristics and timing characteristics of each LED chip in the lighting equipment can be obtained by the following method: the set of all cumulative aging values ​​is taken as the cumulative aging characteristics of the LED chip; the set of moving average temperature, temperature change rate and over-limit time is taken as the timing characteristics of the LED chip. The cumulative aging characteristics and timing characteristics of each LED chip in the lighting equipment can be obtained by the above method. Finally, the historical timing characteristics of the heat load temperature in the lighting equipment can be determined based on all timing characteristics by the following method: the set of all timing characteristics is taken as the historical timing characteristics of the heat load temperature in the lighting equipment.

[0063] In some embodiments, determining the heat load temperature threshold of the lighting device under its current operating state using the historical time-series characteristics and various cumulative aging characteristics can be achieved through the following steps:

[0064] For each LED chip in the lighting equipment, obtain the initial threshold of the LED chip thermal load temperature;

[0065] By fine-tuning the initial threshold based on the cumulative aging characteristics and timing characteristics of the LED chip, the safe threshold for the thermal load temperature of the LED chip is obtained, and then the safe threshold for the thermal load temperature of each LED chip is obtained.

[0066] The thermal load temperature threshold for the lighting equipment under its current operating condition is determined based on all safety thresholds.

[0067] It should be noted that in this application, the thermal load temperature threshold is a global temperature threshold used to control the cooling system of the lighting equipment; the initial threshold is a theoretically safe and conservative upper limit of temperature; and the safety threshold is a temperature threshold value that takes into account the aging state and recent operating history of each LED chip.

[0068] In specific implementation, firstly, for each LED chip in the lighting equipment, the initial threshold for the LED chip's thermal load temperature can be obtained as follows: For each LED chip in the lighting equipment, the absolute maximum junction temperature value specified by the manufacturer is read from a preset chip parameter database. This absolute maximum junction temperature value is multiplied by a fixed safety factor less than 1. This fixed safety factor is to provide a safety margin for measurement errors, control delays, and unforeseen transient thermal shocks. Through this simple calculation, a fixed initial temperature threshold applicable to all chips of the same model is obtained, and this initial temperature threshold is used as the initial threshold for the LED chip's thermal load temperature. Then, the initial threshold is fine-tuned based on the cumulative aging characteristics and timing characteristics of the LED chip to obtain the safe threshold for the LED chip's thermal load temperature. Furthermore, the safe threshold for the thermal load temperature of each LED chip can be obtained as follows: In summary: the larger the cumulative aging characteristic value, the more severe the lifespan loss of the LED chip and the lower its ability to withstand high temperatures. Therefore, an offset proportional to the degree of aging will be subtracted from its initial threshold. At the same time, if the time-series characteristics show that the recent average temperature is too high, the temperature fluctuation is drastic, or the over-temperature time is too long, it indicates that the LED chip is in a harsh working mode and thermal fatigue is accelerated. Therefore, an additional offset proportional to the severity of the recent thermal load temperature will be subtracted. Thus, the adjustment result of the initial threshold is used as the safe threshold for the thermal load temperature of the LED chip. The safe threshold for the thermal load temperature of each LED chip can be obtained through the above method. Finally, the thermal load temperature threshold of the lighting equipment under the current working state can be determined by using all the safe thresholds as the range of values ​​for the thermal load temperature threshold.

[0069] In step 103, when the real-time junction temperature of the lighting device is greater than the heat load temperature threshold, the cumulative effect value of the thermal fatigue temperature in each LED chip of the lighting device is calculated based on the junction temperature information. The heat accumulation characteristics of the thermal fatigue temperature in the lighting device are determined by all the cumulative effect values. The thermal fatigue state value of the lighting device after a specified time period is predicted based on the heat accumulation characteristics and the temperature gradient of the casing temperature information.

[0070] In some embodiments, the cumulative effect value of thermal fatigue temperature in each LED chip of the lighting device is calculated based on the junction temperature information, with reference to... Figure 2 The diagram is a flowchart illustrating the determination of the cumulative effect value in some embodiments of this application. In this embodiment, the determination of the cumulative effect value can be achieved using the following steps:

[0071] In step 1031, for each LED chip in the lighting device, the junction temperature curve of the LED chip is extracted from the junction temperature information;

[0072] In step 1032, the junction temperature curve is divided into multiple thermal cycling stages, and the average temperature and temperature change range of each thermal cycling stage are calculated to determine the thermal fatigue damage of each thermal cycling stage in the LED chip.

[0073] In step 1033, the cumulative effect value of thermal fatigue temperature in the LED chip is determined by all thermal fatigue damage, and then the cumulative effect value of thermal fatigue temperature in each LED chip in the lighting device is determined.

[0074] It should be noted that, in this application, the cumulative effect value represents the total lifespan loss caused by thermal fatigue; the junction temperature curve refers to the continuous trajectory graph of the junction temperature of a single LED chip changing over time; the thermal cycling stage refers to a complete, closed temperature fluctuation cycle in the curve of the LED chip junction temperature changing over time; the average temperature refers to the arithmetic mean of the highest and lowest temperatures within a thermal cycling stage; the temperature change range is a parameter that quantifies the severity of thermal changes during the thermal cycling stage; and thermal fatigue damage is the lifespan loss quantified by the severity of a single stress event on the LED chip. This thermal fatigue damage is a dimensionless value that represents the proportion of the chip's overall lifespan loss due to this cycle.

[0075] In specific implementation, firstly, for each LED chip in the lighting equipment, the junction temperature curve of the LED chip can be extracted from the junction temperature information in the following way: For each LED chip in the lighting equipment, obtain all real-time junction temperature values ​​of the LED chip from the junction temperature information, and arrange all real-time junction temperature values ​​in chronological order as the junction temperature curve of the LED chip; then, divide the junction temperature curve into multiple thermal cycle stages, calculate the average temperature and temperature change range of each thermal cycle stage, and thus determine the thermal fatigue damage of each thermal cycle stage in the LED chip in the following way: Identify the complete temperature fluctuation in the junction temperature curve from a temperature trough to a peak and then back to a trough, or from a peak to a trough and then back to a peak, and divide it into an independent thermal cycle stage, thus obtaining multiple thermal cycle stages; for each thermal cycle stage, obtain the highest and lowest temperatures from the stage curve of the junction temperature curve of the thermal cycle stage, and calculate the temperature from the lowest temperature to the highest temperature. The temperature range is used as the temperature variation range for this thermal cycle stage, and the arithmetic mean of the highest and lowest temperatures is taken as the average temperature for this thermal cycle stage. The temperature variation range and the average temperature are substituted into a preset thermal fatigue life model, which describes the maximum number of cycles that the LED chip can withstand under a specified average temperature and variation range. Dividing 1 by this maximum number of cycles yields the thermal fatigue damage value caused by this thermal cycle stage. The thermal fatigue damage of each LED chip in each thermal cycle stage can be obtained in the above way. Finally, the cumulative effect value of thermal fatigue temperature in the LED chip is determined by all thermal fatigue damage. The cumulative effect value of thermal fatigue temperature in each LED chip in the lighting equipment can be achieved by the following method: the sum of all thermal fatigue damage is taken as the cumulative effect value of thermal fatigue temperature in the LED chip. The cumulative effect value of thermal fatigue temperature in each LED chip in the lighting equipment can be obtained in the above way.

[0076] In some embodiments, determining the cumulative thermal characteristics of thermal fatigue temperature in a lighting device using all cumulative effect values ​​can be achieved through the following steps:

[0077] Extract the maximum value and statistical characteristics of thermal fatigue temperature in lighting equipment from all cumulative effect values;

[0078] The cumulative heat characteristics of thermal fatigue temperature in lighting equipment are determined by the maximum value characteristics and the statistical characteristics.

[0079] It should be noted that in this application, the heat accumulation characteristic represents the overall lifespan consumption state of the lighting equipment due to thermal fatigue; the maximum value characteristic represents the state of the most severely aged and most vulnerable LED chip in the lighting equipment; and the statistical characteristic represents the central tendency of the aging state of all LED chips in the lighting equipment.

[0080] In specific implementation, firstly, extracting the maximum value feature and statistical feature of the thermal fatigue temperature in the lighting equipment from all cumulative effect values ​​can be achieved in the following way: the maximum value among all cumulative effect values ​​is taken as the maximum value feature of the thermal fatigue temperature in the lighting equipment, and the standard deviation of all cumulative effect values ​​is taken as the statistical feature of the thermal fatigue temperature in the lighting equipment; then, determining the heat accumulation feature of the thermal fatigue temperature in the lighting equipment through the maximum value feature and the statistical feature can be achieved in the following way: the set of the maximum value feature and the statistical feature is taken as the heat accumulation feature of the thermal fatigue temperature in the lighting equipment.

[0081] In some embodiments, predicting the thermal fatigue state of the lighting device after a specified time period based on the temperature gradient of the accumulated heat characteristics and the housing temperature information can be achieved by the following steps:

[0082] Initialize a fatigue accumulation model based on temperature field mapping;

[0083] The temperature gradient of the shell temperature information is used as the thermal resistance characterization parameter in the fatigue accumulation model.

[0084] The heat accumulation feature is used as the initial damage state in the fatigue accumulation model;

[0085] The thermal fatigue state of the lighting equipment is predicted using a fatigue accumulation model that inputs the thermal resistance characterization parameters and the initial damage state, and the thermal fatigue state value of the lighting equipment is obtained after a specified time period.

[0086] It should be noted that, in this application, the thermal fatigue state value is an indicator used to represent the cumulative performance degradation or lifespan depletion of rare-earth LED lighting devices due to the continuous thermal cycling of the internal LED chips. The fatigue accumulation model is a prediction algorithm based on physical laws and mathematical methods. This fatigue accumulation model predicts the degree of fatigue accumulation in the future based on the current thermal state and historical damage of the device. The fatigue accumulation model is based on thermodynamics and fatigue theory: First, a mathematical relationship between the chip junction temperature and the shell temperature gradient is established through temperature field mapping. This gradient, as a thermal resistance characterization parameter, reflects the efficiency of the heat dissipation path. Second, the fatigue accumulation model uses the system-level heat accumulation characteristics as the initial damage state, i.e., the starting benchmark for prediction. Finally, based on the temperature rise rate determined by the current thermal resistance parameter, the fatigue accumulation model extrapolates the thermal cycling situation within a specified time period in the future, and uses an algorithm similar to Miner's linear cumulative damage law to calculate the superposition value of new damage and initial damage, thereby outputting a quantified thermal fatigue state value. If the fatigue accumulation model is close to 1, it indicates that the lighting device may be nearing the end of its lifespan, thus achieving forward-looking fault prediction.

[0087] In step 104, the rare-earth light-emitting diodes in the lighting equipment are preventively cooled by the temperature difference between the thermal fatigue state value and the real-time junction temperature.

[0088] In some embodiments, preventative active cooling of rare-earth light-emitting diodes in lighting devices based on the temperature difference between the thermal fatigue state value and the real-time junction temperature can be achieved through the following steps:

[0089] Determine the temperature difference between the thermal fatigue state value and the real-time junction temperature;

[0090] The intensity of cooling demand for the lighting equipment after a specified time period is determined by the temperature difference value.

[0091] The cooling control signal for the rare-earth light-emitting diodes in the lighting equipment is generated based on the intensity of the cooling demand.

[0092] It should be noted that, in this application, the cooling control signal refers to a specific, executable physical signal or digital instruction sent to the cooling system actuator; the temperature difference value is a composite index that integrates long-term fatigue trends and short-term overheating risks; and the cooling demand intensity refers to the amount of control required to apply cooling force.

[0093] In practice, firstly, the difference between the real-time junction temperature collected in real time and the currently dynamically adjusted heat load temperature threshold is used as the instantaneous deviation representing the short-term overheating risk. Long-term risk has a higher weight to ensure equipment lifespan, while short-term risk has a lower weight to handle emergencies. Pre-assigned weights are obtained from the lighting equipment control panel, and the weighted sum of the thermal fatigue state value and the normalized instantaneous deviation is calculated as the temperature difference value to measure the current and future thermal risks of the equipment. Then, the temperature difference value is input into a preset control algorithm. The core rule of this algorithm is that the larger the difference value, the higher the required cooling intensity. To achieve stable control, the algorithm considers not only the current magnitude of the difference value but also its cumulative trend and rate of change over a period of time, thereby determining whether strong cooling is needed or only fine-tuning is required. The intensity level value output by the control algorithm is then used as the cooling intensity of the lighting equipment after a specified time period. The cooling demand intensity characterizes the immediate effort required by the cooling system to control temperature and fatigue risks within the target range. Finally, the calculated percentage of cooling demand intensity is converted into a corresponding physical control signal. If the cooling system is a DC fan, a pulse-width modulation (PWM) signal is generated as the cooling control signal, with its high level occupying a proportion of the entire cycle exactly equal to the demand intensity value, directly controlling the fan motor speed. If the cooling method involves adjusting the LED's own drive current, an analog voltage is generated as the cooling control signal and sent to the driver, commanding it to limit the output current to a ratio equal to the rated value multiplied by the demand intensity, achieving self-cooling by reducing heat generation. This provides the cooling control signal for the rare-earth LED in the lighting equipment, which is then sent to the actuator in real time, completing a closed-loop control from intelligent prediction to physical action.

[0094] In another aspect, in some embodiments, this application provides a rare-earth light-emitting diode (LED) lighting device, which includes a cooling control unit, referenced... Figure 3 The figure is a schematic diagram of the structure of a cooling control unit according to some embodiments of this application. The cooling control unit includes: a data acquisition module 201, a processing module 202, and an execution module 203, which are described below:

[0095] The acquisition module 201 in this application is mainly used to acquire the junction temperature information of each LED chip in the rare earth light-emitting diode of the lighting equipment and to obtain the shell temperature information of the lighting equipment when the lighting equipment is working.

[0096] Processing module 202, in this application, is used to extract the cumulative aging characteristics of each LED chip in the lighting device and the historical time-series characteristics of the heat load temperature in the historical junction temperature information, and to determine the heat load temperature threshold of the lighting device in the current working state through the historical time-series characteristics and each cumulative aging characteristics.

[0097] It should be noted that the processing module 202 is also used to calculate the cumulative effect value of thermal fatigue temperature in each LED chip of the lighting device based on the junction temperature information when the real-time junction temperature of the lighting device is greater than the heat load temperature threshold, determine the heat accumulation characteristics of thermal fatigue temperature in the lighting device through all the cumulative effect values, and predict the thermal fatigue state value of the lighting device after a specified time period based on the heat accumulation characteristics and the temperature gradient of the shell temperature information.

[0098] The execution module 203 in this application is mainly used to perform preventive active cooling of rare earth light-emitting diodes in lighting equipment based on the temperature difference between the thermal fatigue state value and the real-time junction temperature.

[0099] The foregoing has detailed examples of rare-earth LED lighting devices and cooling control methods provided in the embodiments of this application. It is understood that, in order to achieve the aforementioned functions, the corresponding apparatus includes hardware structures and / or software modules corresponding to the execution of each function. Those skilled in the art should readily recognize that, based on the units and algorithm steps of the examples described in conjunction with the embodiments disclosed herein, this application can be implemented in hardware or a combination of hardware and computer software. Whether a function is executed by hardware or by computer software driving hardware depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0100] In some embodiments, this application also provides a computer device, the computer device including a memory and a processor, the memory for storing a computer program, and the processor for calling and running the computer program from the memory, causing the computer device to perform the cooling control method described above.

[0101] In some embodiments, reference Figure 4 The dashed lines in the figure indicate that the unit or module is optional. This figure is a schematic diagram of the structure of a computer device implementing a cooling control method according to an embodiment of this application. The cooling control method described in the above embodiments can... Figure 4 The computer device shown is used to implement this, and the computer device includes at least one processor 301, a memory 302 and at least one communication unit 305. The computer device may be a terminal device, a server or a chip.

[0102] Processor 301 can be a general-purpose processor or a special-purpose processor. For example, processor 301 can be a central processing unit (CPU), which can be used to control computer devices, execute software programs, and process data from software programs. The computer device may also include a communication unit 305 for inputting (receiving) and outputting (transmitting) signals.

[0103] For example, the computer device may be a chip, and the communication unit 305 may be the input and / or output circuit of the chip, or the communication unit 305 may be the communication interface of the chip, which may be a component of a terminal device, network device or other device.

[0104] For example, the computer device may be a terminal device or a server, and the communication unit 305 may be a transceiver of the terminal device or the server, or the communication unit 305 may be a transceiver circuit of the terminal device or the server.

[0105] The computer device may include one or more memories 302 storing a program 304. The program 304 can be executed by a processor 301 to generate instructions 303, causing the processor 301 to execute the method described in the above method embodiments according to the instructions 303. Optionally, the memory 302 may also store data (such as a target audit model). Optionally, the processor 301 may also read data stored in the memory 302, which may be stored at the same storage address as the program 304, or it may be stored at a different storage address than the program 304.

[0106] The processor 301 and memory 302 can be configured separately or integrated together, for example, integrated on the system on chip (SOC) of the terminal device.

[0107] It should be understood that each step of the above method embodiment can be completed by hardware logic circuits or software instructions in the processor 301. The processor 301 can be a CPU, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), or other programmable logic devices, such as discrete gate, transistor logic devices, or discrete hardware components.

[0108] Those skilled in the art will understand that embodiments of this application can be provided as methods, systems, or computer program products. Therefore, this application can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, this application can take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0109] For example, in some embodiments, this application also provides a computer-readable storage medium storing instructions or code that, when executed on a computer, cause the computer to implement the cooling control method described above.

[0110] Although preferred embodiments of this application have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of this application.

[0111] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. A cooling control method for cooling rare-earth LED lighting devices, characterized in that, Includes the following steps: When the lighting equipment is working, the junction temperature information of each LED chip in the rare earth light-emitting diode of the lighting equipment is collected, and the shell temperature information of the lighting equipment is obtained. Extract the cumulative aging characteristics of each LED chip in the lighting equipment and the historical time-series characteristics of the heat load temperature in the historical junction temperature information. Determine the heat load temperature threshold of the lighting equipment under the current working state through the historical time-series characteristics and each cumulative aging characteristic. When the real-time junction temperature of the lighting device is greater than the heat load temperature threshold, the cumulative effect value of the thermal fatigue temperature in each LED chip of the lighting device is calculated based on the junction temperature information. The heat accumulation characteristics of the thermal fatigue temperature in the lighting device are determined by all the cumulative effect values. The thermal fatigue state value of the lighting device after a specified time period is predicted based on the heat accumulation characteristics and the temperature gradient of the shell temperature information. Preventive active cooling of rare-earth light-emitting diodes in lighting equipment is achieved by using the temperature difference between the thermal fatigue state value and the real-time junction temperature. Specifically, extracting the cumulative aging characteristics and historical time-series characteristics of thermal load temperature from the historical junction temperature information of each LED chip in the lighting equipment includes: Obtain historical junction temperature information and operating data of lighting equipment; For each LED chip in the lighting equipment, the cumulative aging value of the LED chip in each lighting operation is calculated based on the working data, and the moving average temperature, temperature change rate and out-of-bounds time of the heat load temperature in the LED chip are calculated based on the historical junction temperature information. The cumulative aging characteristics of the LED chip are determined by all the cumulative aging values, and the timing characteristics of the LED chip are determined by the moving average temperature, the temperature change rate, and the time of exceeding the limit, thereby obtaining the cumulative aging characteristics and timing characteristics of each LED chip in the lighting device. Determine the historical temporal characteristics of the heat load temperature in the lighting equipment based on all temporal characteristics; Specifically, determining the heat load temperature threshold of the lighting equipment under its current operating state through the historical time series characteristics and various cumulative aging characteristics includes: For each LED chip in the lighting equipment, obtain the initial threshold of the LED chip thermal load temperature; By fine-tuning the initial threshold based on the cumulative aging characteristics and timing characteristics of the LED chip, the safe threshold for the thermal load temperature of the LED chip is obtained, and then the safe threshold for the thermal load temperature of each LED chip is obtained. The thermal load temperature threshold for the lighting equipment under its current operating condition is determined based on all safety thresholds.

2. The method as described in claim 1, characterized in that, The calculation of the cumulative effect value of thermal fatigue temperature in each LED chip of the lighting device based on the junction temperature information specifically includes: For each LED chip in the lighting equipment, the junction temperature curve of the LED chip is extracted from the junction temperature information; The junction temperature curve is divided into multiple thermal cycling stages, and the average temperature and temperature change range of each thermal cycling stage are calculated to determine the thermal fatigue damage of each thermal cycling stage in the LED chip. The cumulative effect of thermal fatigue temperature in LED chips is determined by identifying all thermal fatigue damage, and then the cumulative effect of thermal fatigue temperature in each LED chip in the lighting equipment is determined.

3. The method as described in claim 1, characterized in that, The cumulative heat characteristics of thermal fatigue temperature in lighting equipment are determined by all cumulative effect values, specifically including: Extract the maximum value and statistical characteristics of thermal fatigue temperature in lighting equipment from all cumulative effect values; The cumulative heat characteristics of thermal fatigue temperature in lighting equipment are determined by the maximum value characteristics and the statistical characteristics.

4. The method as described in claim 1, characterized in that, Predicting the thermal fatigue state of the lighting device after a specified time period based on the temperature gradient of the accumulated heat characteristics and the shell temperature information specifically includes: Initialize a fatigue accumulation model based on temperature field mapping; The temperature gradient of the shell temperature information is used as the thermal resistance characterization parameter in the fatigue accumulation model. The heat accumulation feature is used as the initial damage state in the fatigue accumulation model; The thermal fatigue state of the lighting equipment is predicted using a fatigue accumulation model that inputs the thermal resistance characterization parameters and the initial damage state, and the thermal fatigue state value of the lighting equipment is obtained after a specified time period.

5. The method as described in claim 1, characterized in that, Preventive active cooling of rare-earth LEDs in lighting equipment based on the temperature difference between the thermal fatigue state value and the real-time junction temperature specifically includes: Determine the temperature difference between the thermal fatigue state value and the real-time junction temperature; The intensity of cooling demand for the lighting equipment after a specified time period is determined by the temperature difference value. The cooling control signal for the rare-earth light-emitting diodes in the lighting equipment is generated based on the intensity of the cooling demand.

6. A rare-earth light-emitting diode (LED) lighting device, comprising a cooling control unit, wherein the cooling control of the rare-earth LED lighting device is performed using the method described in any one of claims 1 to 5, characterized in that... The cooling control unit includes: The data acquisition module is used to acquire the junction temperature information of each LED chip in the rare earth light-emitting diode of the lighting equipment and to obtain the shell temperature information of the lighting equipment when the lighting equipment is working. The processing module is used to extract the cumulative aging characteristics of each LED chip in the lighting equipment and the historical time-series characteristics of the heat load temperature in the historical junction temperature information, and to determine the heat load temperature threshold of the lighting equipment in the current working state through the historical time-series characteristics and each cumulative aging characteristic. The processing module is also used to calculate the cumulative effect value of thermal fatigue temperature in each LED chip of the lighting device based on the junction temperature information when the real-time junction temperature of the lighting device is greater than the heat load temperature threshold, determine the heat accumulation characteristics of thermal fatigue temperature in the lighting device through all the cumulative effect values, and predict the thermal fatigue state value of the lighting device after a specified time period based on the heat accumulation characteristics and the temperature gradient of the shell temperature information. An execution module is used to perform preventative active cooling of rare-earth light-emitting diodes in lighting equipment based on the temperature difference between the thermal fatigue state value and the real-time junction temperature.

7. A computer device, characterized in that, The computer device includes a memory and a processor, the memory being used to store a computer program, and the processor being used to retrieve and run the computer program from the memory, causing the computer device to perform the cooling control method according to any one of claims 1 to 5.

8. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores instructions or code that, when executed on a computer, cause the computer to implement the cooling control method as described in any one of claims 1 to 5.

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