A non-equal pitch multi-layer microchannel heat exchanger
By combining non-equidistant multi-layer microchannel design with spindle-shaped fins, the problems of thermal boundary layer thickening and bubble removal in microchannel radiators are solved, achieving efficient heat transfer and flow uniformity, and improving the overall performance of the heat exchanger.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- HANGZHOU INTERNATIONAL INNOVATION INSTITUTE OF BEIHANG UNIVERSITY
- Filing Date
- 2025-11-25
- Publication Date
- 2026-06-23
AI Technical Summary
Existing microchannel radiators are prone to thermal boundary layer thickening due to insufficient disturbance during flow, resulting in increased condensate temperature, reduced heat exchange efficiency, uneven flow leading to localized high-temperature hot spots, and large bubbles generated by the phase change of the condensate are difficult to remove.
Design a non-equidistant multilayer microchannel heat exchanger, including an outer layer, a middle layer and an inner layer of microchannels. Each layer is equipped with spindle-shaped fins to enhance flow through lateral and longitudinal disturbances. A group of interconnecting holes is used to divide bubbles, promote uniform flow, and quickly dissipate heat.
Maintaining a large temperature difference on the wall surface enhances turbulence, improves heat transfer efficiency, reduces flow resistance, inhibits bubble formation, and enhances heat transfer performance at low Reynolds numbers.
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Figure CN121297539B_ABST