Integrated LED mainboard, LED display screen module and LED display screen

Abstract

The invention relates to the technical field of LEDs, in particular to an integrated LED main board, an LED display screen module and an LED display screen. An LED display module and a driving chip; the integrated control module is arranged on the substrate and electrically connected with the driving chip, and the integrated control module comprises a signal processing unit and a detection unit; the signal processing unit is used for receiving and processing an external video source signal and generating a display data signal according to the external video source signal; the power supply module is arranged on the substrate and is used for supplying power to the LED display module, the integrated control module and the driving chip; and the detection unit is used for monitoring the working states of the LED display module, the driving chip and the power supply module, and outputting a fault indication signal when abnormity is monitored. A plurality of functional modules can be integrated on one mainboard, so that the system structure is simplified, and the thickness and the weight of the box body are reduced. And the working state of each core module is monitored in real time through the detection unit, so that the operation and maintenance cost and time are reduced.

Description

Technical Field

[0001] This invention relates to the field of LED technology, specifically to an integrated LED motherboard, an LED display module, and an LED display screen. Background Technology

[0002] Currently, LED displays are widely used in advertising media, stage performances, command and control monitoring, and other fields. Traditional LED display systems typically employ a distributed, modular architecture, consisting of multiple functionally discrete components: including a transmitting card and a receiving card responsible for signal processing, a HUB board responsible for signal distribution, an independent power supply module, and LED modules composed of lamp beads and driver chips. These components are interconnected through a large number of cables and connectors, working together to complete the image display.

[0003] However, this traditional technical solution has many inherent drawbacks. Multiple discrete components lead to a complex system structure, low integration, and a large, thick, and heavy display cabinet, causing significant inconvenience for transportation, installation, and maintenance. Long signal transmission paths and numerous connection nodes introduce high signal delay and attenuation risks, affecting display performance such as refresh rate, reducing overall system reliability, and resulting in a high failure rate. Furthermore, when a display malfunctions, such as damaged LEDs, driver chip failure, or power supply abnormalities, maintenance personnel must rely on specialized tools and extensive experience to troubleshoot each component in the distributed system one by one, making fault location difficult, repair inefficient, and operation and maintenance costs high.

[0004] Therefore, those skilled in the art urgently need to develop a new solution to address the aforementioned problems. Summary of the Invention

[0005] To overcome the problems existing in related technologies, this invention discloses an integrated LED motherboard, an LED display module, and an LED display screen, which solves the problems of dispersed structure, large thickness, and difficult maintenance of existing LED large screen display systems.

[0006] According to a first aspect of the disclosed embodiments of the present invention, an integrated LED motherboard is provided, the integrated LED motherboard comprising:

[0007] substrate;

[0008] The LED display module, connected to the LED motherboard, includes multiple LED beads;

[0009] A driver chip is disposed on the edge of the substrate and electrically connected to the LED display module. It is used to receive display data signals from the integrated control module and drive the LED beads to emit light.

[0010] An integrated control module is disposed on the substrate and electrically connected to the driver chip. The integrated control module includes a signal processing unit and a detection unit.

[0011] The signal processing unit is used to receive and process external video source signals, and generate display data signals based on the external video source signals;

[0012] A power supply module, disposed on the substrate, is used to supply power to the LED display module, the integrated control module, and the driver chip;

[0013] The detection unit is used to monitor the working status of the LED display module, the driver chip and the power module, and outputs a fault indication signal when an abnormality is detected.

[0014] Optionally, the signal processing unit is used for:

[0015] Receive external video source signals, decode, convert formats, and perform color correction on the video source signals to generate processed video signals;

[0016] The processed video signal is subjected to grayscale control and refresh rate adjustment to generate a display data signal;

[0017] The display data signal is distributed to one or more driver chips.

[0018] Optionally, the detection unit includes:

[0019] The LED lamp bead fault detection element is set in the output stage of the driver chip and connected in series in the LED lamp bead circuit;

[0020] A driver chip communication detection element is disposed on the data line between the integrated control module and the driver chip;

[0021] A power module fault detection element is installed at the output terminal of the power module.

[0022] Optionally, the LED lamp bead fault detection element is provided with a first fault indicator light;

[0023] The LED lamp bead fault detection element is used for:

[0024] Monitor the loop current of the LED beads in the LED display module to determine whether there is a short circuit or open circuit fault in the beads;

[0025] If a short circuit or open circuit fault is present, the first fault indicator light will illuminate a red fault warning signal.

[0026] If a short circuit or open circuit fault exists, the first fault indicator light will illuminate a green normal signal.

[0027] Optionally, a second fault indicator light is provided on the communication detection element of the driver chip;

[0028] The driver chip communication detection element is used for:

[0029] By performing a communication handshake with the driver chip, it is determined whether the driver chip is working properly or whether the communication has timed out.

[0030] If a communication timeout occurs, the second fault indicator light will illuminate a red fault warning signal.

[0031] If the driver chip is working properly, the second fault indicator light will illuminate a green normal signal.

[0032] Optionally, a third fault indicator light is provided on the power module fault detection element;

[0033] The power module fault detection element is used for:

[0034] Monitor the output voltage and current of the power module to determine whether the power supply is over-voltage, under-voltage, or over-current.

[0035] If overvoltage, undervoltage, or overcurrent occurs, the third fault indicator light will illuminate a red fault warning signal;

[0036] If there is no overvoltage, undervoltage, or overcurrent, the third fault indicator light will illuminate a green normal signal.

[0037] Optionally, the driving chip is disposed on both sides of the substrate edge.

[0038] Optionally, the edge of the substrate is provided with a metal cladding or heat dissipation fins to enhance heat dissipation.

[0039] According to a second aspect of the embodiments disclosed in this invention, an LED display module is provided, including the integrated LED motherboard described in the first aspect of the embodiments disclosed in this invention.

[0040] According to a third aspect of the embodiments disclosed in this invention, an LED display screen is provided, comprising a plurality of LED display screen modules as described in the second aspect of the embodiments disclosed in this invention.

[0041] In summary, the technical solutions disclosed in the embodiments of the present invention can bring the following beneficial effects:

[0042] (1) By integrating the functions of receiver cards, HUB cards, power supplies, etc., which are scattered in traditional LED display systems, onto a single motherboard, the system structure is greatly simplified, and the cabinet thickness and overall weight are effectively reduced. The modular integrated design simplifies the assembly process of the display screen, reduces external wiring and connectors, and improves production efficiency and product consistency.

[0043] (2) By placing the driver chip on the edge of the motherboard, the signal transmission path is shortened, the signal delay and refresh rate delay are reduced, and the heat dissipation conditions are improved, thereby enhancing the system stability and reliability.

[0044] (3) The detection unit monitors the working status of each core module in real time and provides intuitive fault alarms through indicator lights, realizing rapid fault location and diagnosis, enabling non-professionals to perform replacement and maintenance, and greatly reducing operation and maintenance costs and time.

[0045] Other features and advantages disclosed in this invention will be described in detail in the following detailed description section. Attached Figure Description

[0046] The accompanying drawings are provided to further illustrate the present disclosure and form part of the specification. They are used together with the following detailed description to explain the present disclosure, but do not constitute a limitation thereof. In the drawings:

[0047] Figure 1 This is a schematic diagram of an integrated LED motherboard according to an exemplary embodiment;

[0048] Figure 2 It is based on Figure 1 A schematic diagram of another integrated LED motherboard is shown. Detailed Implementation

[0049] The specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit the scope of the present disclosure.

[0050] like Figures 1-2 As shown, an integrated LED motherboard includes: a substrate 110; an LED display module 120 connected to the LED motherboard, including multiple LED beads; a driver chip 130 disposed on the edge of the substrate 110 and electrically connected to the LED display module 120, used to receive display data signals from an integrated control module 140 and drive the LED beads to emit light; the integrated control module 140 disposed on the substrate 110 and electrically connected to the driver chip 130, the integrated control module 140 including: a signal processing unit 141 and a detection unit 142; the signal processing unit 141 is used to receive and process external video source signals and generate display data signals based on the external video source signals; a power supply module 150 disposed on the substrate 110, used to supply power to the LED display module 120, the integrated control module 140 and the driver chip 130; the detection unit 142 is used to monitor the working status of the LED display module 120, the driver chip 130 and the power supply module 150, and output a fault indication signal when an abnormality is detected.

[0051] For example, in the embodiments disclosed in this invention, the functions of the receiving card, HUB board, and power supply are integrated onto a single motherboard, which can reduce the overall thickness of the LED cabinet and improve its lightweight design. This integrated LED motherboard includes a substrate 110, an LED display module 120, a driver chip 130, an integrated control module 140, and a power module 150. The LED display module 120 is connected to the LED motherboard and includes multiple LED beads arranged in an array. These LED beads constitute the pixels of the display screen and are used to display images according to display data signals. The driver chip 130 is disposed on the edge region of the substrate 110 and is used to receive display data signals from the integrated control module 140 and convert the display signals into specific current outputs to drive the corresponding LED beads to emit light (i.e., display the corresponding image). In the embodiments disclosed in this invention, the driver chip 130 is positioned on the edge of the substrate 110 (preferably on both sides of the substrate), effectively shortening the signal transmission path and reducing signal delay and attenuation. Furthermore, since the driver chip 130 is a heat-generating component, placing the heat-generating component in a more favorable heat dissipation area helps improve the overall heat dissipation performance of the LED cabinet. The power module 150 is disposed on the substrate 110 and is used to convert external input electrical energy and provide stable power supply for the LED display module 120, the integrated control module 140 and the driver chip 130. The power module 150 is used to convert the mains power (220V / 110V) into the low-voltage DC power (such as 5V / 4.2A) required by the LED display screen.

[0052] An integrated control module 140 is disposed on the substrate and includes a signal processing unit 141 and a detection unit 142.

[0053] The signal processing unit 141 is configured to: receive external video source signals, decode, convert formats, and perform color correction on the video source signals to generate processed video signals; perform grayscale control and refresh rate adjustment on the processed video signals to generate display data signals; and distribute the display data signals to one or more driver chips.

[0054] As can be seen, the signal processing unit 141 integrates the functions of a transmitting card, a receiving card, and a HUB board. The transmitting card receives video source signals (such as HDMI, DVI, network signals) from a computer or external source, performs decoding, format conversion, and color correction on the video source signals, generating a digital signal suitable for LED display (i.e., the processed video signal). The receiving card receives the digital signal transmitted by the transmitting card, further processes the processed video signal (such as grayscale control and refresh rate adjustment), generates a display signal, and distributes the display signal to the corresponding LED modules. The HUB board acts as a distribution hub for the display signal, distributing the display signal output from the receiving card to multiple LED modules through multiple output interfaces (such as ribbon cables and network cables), ensuring synchronous signal transmission to the display unit corresponding to each LED module. The signal processing unit 141 in this embodiment integrates the above functions, directly receiving and processing external video sources (such as HDMI, DVI, network signals), completing a series of processes including decoding, format conversion, color correction, grayscale control, and refresh rate adjustment, ultimately generating a display data signal suitable for the LED display modules.

[0055] The detection unit includes 142: an LED lamp bead fault detection element 410, which is located at the output stage of the driver chip and connected in series in the LED lamp bead circuit; a driver chip communication detection element 420, which is located on the data line between the integrated control module and the driver chip; and a power module fault detection element 430, which is located at the output end of the power module.

[0056] For example, the detection unit 142 is used to monitor parameters such as the loop current of the LED beads in the LED display module, the communication status with the driver chip, and the output voltage / current of the power supply module in real time, to determine whether there are faults such as short circuit / open circuit of the LED beads, communication timeout of the driver chip, overvoltage / undervoltage / overcurrent of the power supply, and to immediately output a fault indication signal when an abnormality is detected. In the embodiments of the present invention, the fault indication signal can control a status indicator light to change color (such as normal green light, fault red light) or flashing mode, so that maintenance personnel can intuitively and quickly locate the faulty motherboard, and even accurately locate the faulty module (such as power supply problem or LED bead problem), which greatly reduces the maintenance threshold and time cost. Through the detection unit 142, detection elements and corresponding fault indicator lights are set at different locations such as the LED bead circuit, the data line between the integrated control module and the driver chip, and the output terminal of the power supply module, so as to detect whether each functional module in the integrated motherboard has a fault, and when a functional module is detected to have a fault, the indicator light at the corresponding location is lit, so that maintenance personnel can quickly locate the fault location and faulty component, which solves the problem that integrated LED motherboards are inconvenient to repair and reduces the difficulty of subsequent maintenance.

[0057] Optionally, the LED lamp bead fault detection element 410 is provided with a first fault indicator light; the LED lamp bead fault detection element is used to: monitor the loop current of the LED lamp beads in the LED display module and determine whether there is a short circuit or open circuit fault in the lamp beads; if there is a short circuit or open circuit fault, the first fault indicator light will light up a red fault warning signal; if there is a short circuit and open circuit fault, the first fault indicator light will light up a green normal signal.

[0058] For example, the LED lamp bead fault detection element can be a current monitoring chip or a current sampling circuit. The input terminal of the LED lamp bead fault detection element is electrically connected to the drive circuit of the LED display module through the sampling circuit to monitor the loop current value of the LED lamp bead in real time. If the monitored loop current value is lower than the preset lower limit threshold of the normal range (or close to zero), it is determined that there is an open circuit fault in the loop of the LED lamp bead; if the monitored loop current value is higher than the preset upper limit threshold of the normal range, it is determined that there is a short circuit fault in the loop of the LED lamp bead; if the monitored loop current value is within the preset normal range, it is determined that the loop of the LED lamp bead is working normally. If a short circuit fault or an open circuit fault is determined, the first fault indicator light illuminates red, issuing a red fault warning signal. If no fault is detected (i.e., the loop current is normal), the first fault indicator light illuminates green.

[0059] Optionally, a second fault indicator light is provided on the driver chip communication detection element 420; the driver chip communication detection element is used to: determine whether the driver chip is working normally or whether the communication has timed out by performing a communication handshake with the driver chip; if a communication timeout occurs, the second fault indicator light will illuminate a red fault warning signal; if the driver chip is working normally, the second fault indicator light will illuminate a green normal signal.

[0060] For example, the driver chip communication detection element 420 can be a functional module implemented by the main control chip and its peripheral circuits through built-in program logic, used to perform handshake and monitoring at the communication protocol level. This driver chip communication detection element establishes a data connection with one or more driver chips through a specific communication bus (such as SPI, I2C, or a custom serial bus). Every preset time interval, a query command or heartbeat packet is sent to the target driver chip, and a timer is started to wait for the target driver chip to return a response signal within the time specified in the protocol. If no correct response is received from the driver chip within the set timeout period, it is determined that the driver chip has timed out. If a correct response signal is received from the driver chip in a timely manner, it is determined that the driver chip is working normally. When a communication timeout fault is detected, the second fault indicator light illuminates red, issuing a clear red fault warning signal. When the communication handshake is normal, the second fault indicator light illuminates green, indicating that the driver chip communication link is in good condition.

[0061] Optionally, a third fault indicator light is provided on the power module fault detection element 430; the power module fault detection element is used to: monitor the output voltage and current of the power module, and determine whether the power supply is over-voltage, under-voltage or over-current; if over-voltage, under-voltage or over-current exists, the third fault indicator light will illuminate a red fault warning signal; if there is no over-voltage, under-voltage or over-current, the third fault indicator light will illuminate a green normal signal.

[0062] For example, the power module fault detection element 430 typically consists of a voltage sampling circuit, a current sampling circuit, and an analog-to-digital converter. The input of the voltage sampling circuit is electrically connected to the positive DC voltage output terminal (VCC) of the power module to acquire the voltage value in real time. The input of the current sampling circuit is connected to a sampling resistor connected in series in the output circuit of the power module, and an operational amplifier acquires the differential voltage value across the resistor to calculate the real-time output current value. If the real-time monitored voltage value is higher than V_max, it is determined to be an overvoltage fault; if the real-time monitored voltage value is lower than V_min, it is determined to be an undervoltage fault; if the real-time monitored current value is higher than I_max, it is determined to be an overcurrent fault; if all parameters are within the normal range, the power module is determined to be operating normally. Here, V_max is the upper limit voltage value when the power module is operating normally, V_min is the lower limit voltage value when the power module is operating normally, and I_max is the upper limit current value when the power module is operating normally. V_max, V_min, and I_max are all preset values ​​obtained through experiments. When any of the overvoltage, undervoltage, or overcurrent faults is detected, the third fault indicator light illuminates red, issuing a red fault warning signal. When all electrical parameters are normal, the third fault indicator light illuminates green.

[0063] The substrate edge is provided with a metal cladding or heat dissipation fins to enhance heat dissipation.

[0064] For example, a metal cover or fin-shaped heat sink is provided at the edge of the substrate. Through the thermal conductivity of the metal, the heat generated by the main heat-generating components (such as driver chips) located in this area is quickly conducted out and dissipated into the air, which can effectively reduce the operating temperature of the substrate and improve stability and lifespan.

[0065] The present invention also discloses an LED display module, including an integrated LED motherboard.

[0066] The present invention also discloses an LED display screen, including multiple LED display screen modules.

[0067] In summary, this invention relates to the field of LED technology, specifically including an integrated LED motherboard, an LED display module, and an LED display screen. The integrated LED motherboard includes: a substrate; an LED display module and a driver chip; and an integrated control module disposed on the substrate and electrically connected to the driver chip. The integrated control module includes: a signal processing unit and a detection unit. The signal processing unit receives and processes external video source signals and generates display data signals based on these signals. A power supply module, disposed on the substrate, supplies power to the LED display module, the integrated control module, and the driver chip. The detection unit monitors the operating status of the LED display module, the driver chip, and the power supply module, and outputs a fault indication signal when an abnormality is detected. By integrating multiple functional modules onto a single motherboard, the system structure is simplified, and the thickness and weight of the enclosure are reduced. Real-time monitoring of the operating status of each core module by the detection unit reduces maintenance costs and time.

[0068] The preferred embodiments of this disclosure have been described in detail above with reference to the accompanying drawings. However, this disclosure is not limited to the specific details of the above embodiments. Within the scope of the technical concept of this disclosure, various simple modifications can be made to the technical solutions of this disclosure, and these simple modifications all fall within the protection scope of this disclosure.

[0069] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, this disclosure will not describe the various possible combinations separately.

[0070] Furthermore, various different embodiments of this disclosure can be combined in any way, as long as they do not violate the spirit of this disclosure, they should also be regarded as the content disclosed in this disclosure.

Claims

1. An integrated LED motherboard, characterized in that, The integrated LED motherboard includes: substrate; The LED display module, connected to the LED motherboard, includes multiple LED beads; A driver chip is disposed on the edge of the substrate and electrically connected to the LED display module. It is used to receive display data signals from the integrated control module and drive the LED beads to emit light. An integrated control module is disposed on the substrate and electrically connected to the driver chip. The integrated control module includes a signal processing unit and a detection unit. The signal processing unit is used to receive and process external video source signals, and generate display data signals based on the external video source signals; A power supply module, disposed on the substrate, is used to supply power to the LED display module, the integrated control module, and the driver chip; The detection unit is used to monitor the working status of the LED display module, the driver chip and the power module, and outputs a fault indication signal when an abnormality is detected.

2. The integrated LED motherboard according to claim 1, characterized in that, The signal processing unit is used for: Receive external video source signals, decode, convert formats, and perform color correction on the video source signals to generate processed video signals; The processed video signal is subjected to grayscale control and refresh rate adjustment to generate a display data signal; The display data signal is distributed to one or more driver chips.

3. The integrated LED motherboard according to claim 1, characterized in that, The detection unit includes: The LED lamp bead fault detection element is set in the output stage of the driver chip and connected in series in the LED lamp bead circuit; A driver chip communication detection element is disposed on the data line between the integrated control module and the driver chip; A power module fault detection element is installed at the output terminal of the power module.

4. The integrated LED motherboard according to claim 3, characterized in that, The LED lamp bead fault detection element is equipped with a first fault indicator light; The LED lamp bead fault detection element is used for: Monitor the loop current of the LED beads in the LED display module to determine whether there is a short circuit or open circuit fault in the beads; If a short circuit or open circuit fault is present, the first fault indicator light will illuminate a red fault warning signal. If a short circuit or open circuit fault exists, the first fault indicator light will illuminate a green normal signal.

5. The integrated LED motherboard according to claim 3, characterized in that, A second fault indicator light is provided on the communication detection element of the driver chip; The driver chip communication detection element is used for: By performing a communication handshake with the driver chip, it is determined whether the driver chip is working properly or whether the communication has timed out. If a communication timeout occurs, the second fault indicator light will illuminate a red fault warning signal. If the driver chip is working properly, the second fault indicator light will illuminate a green normal signal.

6. The integrated LED motherboard according to claim 3, characterized in that, The power module fault detection element is equipped with a third fault indicator light. The power module fault detection element is used for: Monitor the output voltage and current of the power module to determine whether the power supply is over-voltage, under-voltage, or over-current. If overvoltage, undervoltage, or overcurrent occurs, the third fault indicator light will illuminate a red fault warning signal; If there is no overvoltage, undervoltage, or overcurrent, the third fault indicator light will illuminate a green normal signal.

7. The integrated LED motherboard according to claim 1, characterized in that, The driving chip is disposed on both sides of the substrate edge.

8. The integrated LED motherboard according to claim 1, characterized in that, The substrate edge is provided with a metal cladding or heat dissipation fins to enhance heat dissipation.

9. An LED display module, characterized in that, Including the integrated LED motherboard as described in any one of claims 1 to 8.

10. An LED display screen, characterized in that, It includes multiple LED display modules as described in claim 9.

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