A pluggable fiber array connector suitable for use in a CPO system

Abstract

The application embodiment provides a pluggable optical fiber array connector suitable for a CPO system, which comprises a three-dimensional dynamic alignment module, a serpentine micro-channel located in the inside of a connector shell and an optical communication protocol analysis and adaptation module; wherein the three-dimensional dynamic alignment module is used for monitoring the relative position between the optical fiber array and the PIC interface in real time and performing three-dimensional dynamic adjustment; the serpentine micro-channel is filled with a heat-conducting liquid and is connected to a main heat sink packaged in the inside of the CPO system; when the temperature in the inside of the connector exceeds a preset threshold, the heat-conducting liquid convects and transfers heat to the main heat sink, and temperature control adjustment is performed through the main heat sink; the optical communication protocol analysis and adaptation module is used for receiving parallel light beam signals output through the optical fiber array and determining the communication transmission protocol based on the parallel light beam signals, and adjusting signal driving parameters and interface matching resistance based on protocol determination information. The connector can have high precision and low loss, efficient heat dissipation and multi-protocol compatibility.

Description

Technical Field

[0001] This application relates to the field of optical communication technology, and more specifically, to a pluggable fiber optic array connector suitable for CPO systems. Background Technology

[0002] With the exponential growth in computing power demands of data centers, Co-packaged Optics (CPO) technology has become a core direction for next-generation high-speed interconnects due to its ability to significantly reduce power consumption and increase bandwidth density. In CPO systems, pluggable fiber optic array connectors serve as key interfaces for optical signal input and output, and their performance directly determines the transmission efficiency and stability of the entire system.

[0003] Currently, pluggable fiber array connectors for CPOs face three major technical challenges:

[0004] First, balancing high-precision alignment with low loss is difficult. Although existing extended beam technology can relax some alignment tolerances (such as ±6μm in the X / Y direction), in multi-channel scenarios (such as 16 channels and above), the coupling loss between single-mode fiber and PIC (Photonic Integrated Circuit) is still generally higher than 1dB. Moreover, when the alignment deviation exceeds 35μm, the loss will increase sharply, which cannot meet the stringent requirements of high-density CPO systems for low loss.

[0005] Secondly, there is the issue of heat dissipation failure in highly integrated scenarios. Because the CPO system deeply integrates the optical engine with the chip, the coupling efficiency between the optical engine and the electrical chip is increased to over 90%, and power consumption is reduced by 50% compared to traditional pluggable solutions. However, the packaging density is also increased to 3-5 times that of traditional pluggable modules. However, existing connectors are not designed with dedicated heat dissipation structures for high-density scenarios. During long-term operation, the internal temperature of the connector can rise above 85°C, leading to aging of fiber optic interface materials, degradation of optical performance, and a reduction in the mean time between failures (MTBF) to below 50,000 hours, far below the industry standard of 100,000 hours.

[0006] Third, there is a lack of multi-protocol compatibility. The current CPO system uses multiple protocol standards such as OIF-CEI and COBO. Due to significant differences in connector interface sizes and signal definitions between different manufacturers, seamless interoperability between devices from different manufacturers cannot be achieved. Additional adapter modules are required for protocol conversion and signal adaptation, which increases system cost and complexity.

[0007] Although industry professionals have attempted to optimize these issues (such as Corning's glass waveguide technology and Teramount's wafer-level processing technology), these efforts only address a single pain point and fail to create an integrated solution encompassing alignment, heat dissipation, and compatibility. Consequently, they cannot fundamentally resolve the bottleneck hindering the large-scale application of CPO systems.

[0008] Therefore, developing a pluggable fiber array connector that combines high precision, low loss, efficient heat dissipation, and multi-protocol compatibility has become a pressing technical challenge. Summary of the Invention

[0009] The technical problem to be solved by the present invention is to provide a pluggable fiber optic array connector suitable for CPO systems, addressing the shortcomings of the prior art.

[0010] The technical solution of this invention to solve the above-mentioned technical problems is as follows: A pluggable fiber array connector suitable for CPO systems, wherein the pluggable fiber array connector integrates a three-dimensional dynamic alignment module, a serpentine microchannel located inside the connector housing, and an optical communication protocol parsing and adaptation module.

[0011] The three-dimensional dynamic alignment module is used to monitor the relative position between the fiber array inside the connector and the PIC interface integrated inside the CPO system in real time, and to compensate for assembly deviations and thermal deformation through three-dimensional dynamic adjustment.

[0012] The serpentine microchannel is filled with a thermally conductive liquid and connected to the main heat sink encapsulated inside the CPO system. When the internal temperature of the connector exceeds a preset threshold, the thermally conductive liquid is heated and convection transfers heat to the main heat sink, which then controls the temperature.

[0013] The optical communication protocol parsing and adaptation module is used to receive the parallel beam signal output through the fiber array, and to parse the frame structure, transmission rate and modulation format based on the parallel beam signal. Based on the parsing results, it determines the communication transmission protocol, and adjusts the signal driving parameters and interface matching resistor based on the protocol determination information.

[0014] Furthermore, the three-dimensional dynamic alignment module integrates a visual positioning unit, a MEMS alignment unit, and a dual-lens array coupled to the end face of the fiber optic array, wherein:

[0015] The visual positioning unit is used to acquire relative position data between the fiber array and the PIC interface in real time using a CCD sensor, and to feed the relative position data back to the MEMS alignment unit.

[0016] The MEMS alignment unit is used to make nanometer-level fine adjustments to the positions of the fiber array and the PIC interface in the X, Y, and Z directions based on the acquired relative position data, in order to compensate for the displacement caused by assembly deviation and thermal deformation, and ensure that the fiber array and the PIC interface remain aligned.

[0017] The dual-lens array includes a collimating lens and a focusing lens. The collimating lens is used to expand the optical fiber outgoing light into a parallel beam, and the focusing lens is used to focus the parallel beam into the aligned PIC waveguide mode field, thereby achieving efficient optical mode matching and low-loss coupling.

[0018] Furthermore, the visual positioning unit is arranged on the inner wall of the connector housing and aligned with the connection area of ​​the PIC interface. The MEMS alignment unit is located at the front end of the connector and close to the optical coupling surface of the PIC interface, so as to achieve nanometer-level adjustment in the X / Y / Z directions by electrostatic driving, and to compensate for the relative displacement between the optical fiber and the PIC caused by assembly errors and thermal deformation.

[0019] Furthermore, the serpentine microchannel is filled with a fluorinated liquid with a high thermal conductivity and is connected to the main heat sink encapsulated inside the CPO system via a metal heat-conducting block.

[0020] Furthermore, the inner wall of the serpentine microchannel is coated with a graphene coating by chemical vapor deposition, the graphene coating having a thickness of 8 μm and an adhesion greater than or equal to 5 MPa.

[0021] Furthermore, the step of analyzing the frame structure, transmission rate, and modulation format based on the parallel beam signal, and determining the communication transmission protocol based on the analysis results, includes:

[0022] (1) Based on the frame synchronization and encoding recognition algorithm, the encoded frame structure of the parallel beam signal is obtained by parsing;

[0023] (2) Based on the matching verification between the clock data recovery (CDR) circuit and the protocol rate identifier, the transmission rate of the parallel beam signal is obtained by analysis;

[0024] (3) Based on modulation feature extraction technology, the modulation format of the parallel beam signal is obtained by analysis;

[0025] (4) Based on the coded frame structure, transmission rate and modulation format determined by analysis, the communication transmission protocol is determined by multi-dimensional matching and decision logic of the pre-set protocol feature library.

[0026] Furthermore, the adjustment of signal drive parameters and interface matching resistors based on protocol determination information includes:

[0027] (1) Based on the protocol determination information, call the pre-stored parameter template that matches the target protocol from the preset parameter template library;

[0028] (2) Based on the pre-stored parameter template, determine the corresponding parameter configuration, and dynamically configure the signal driving parameters and interface matching resistor accordingly. Adjust the parameters according to the real-time monitored signal integrity index and impedance matching status, so as to improve the anti-interference capability and reduce the bit error rate through dynamic calibration.

[0029] The beneficial effects of this invention are as follows: This pluggable fiber array connector for CPO systems integrates three core modules—three-dimensional dynamic alignment, serpentine microfluidic heat dissipation, and optical communication protocol parsing—forming an integrated "alignment-heat dissipation-compatibility" technical solution. The three-dimensional dynamic alignment module effectively compensates for fiber-chip coupling misalignment caused by assembly errors and thermal deformation through real-time monitoring and dynamic adjustment, ensuring efficient optical signal transmission. The serpentine microfluidic heat dissipation system utilizes the synergistic effect of thermally conductive liquid convection and the main heat sink to achieve precise temperature control inside the connector, avoiding the risk of thermal failure. The optical communication protocol parsing module dynamically optimizes signal parameters and interface impedance through multi-dimensional feature extraction and protocol adaptation, enabling compatibility with mainstream protocols such as OIF-CEI-112G and COBO-400G, eliminating the need for adapter modules, reducing equipment costs by 30%, and shortening the debugging cycle for cross-vendor projects. The synergistic effect of these three modules fundamentally solves the core bottlenecks faced by CPO systems in large-scale deployments, such as insufficient physical alignment accuracy, difficulties in thermal management, and limited protocol compatibility, providing a reliable, flexible, and scalable solution for high-density optical interconnects. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the system structure of a pluggable fiber array connector suitable for CPO systems disclosed in this invention. Detailed Implementation

[0031] The principles and features of the present invention are described below with reference to the accompanying drawings. The examples given are only for explaining the present invention and are not intended to limit the scope of the present invention.

[0032] like Figure 1 As shown, this application discloses a pluggable fiber array connector suitable for CPO systems. The pluggable fiber array connector integrates a three-dimensional dynamic alignment module, a serpentine microchannel located inside the connector housing, and an optical communication protocol parsing and adaptation module.

[0033] The three-dimensional dynamic alignment module is used to monitor the relative position between the fiber array inside the connector and the PIC interface integrated inside the CPO system in real time, and to compensate for assembly deviations and thermal deformation through three-dimensional dynamic adjustment.

[0034] The serpentine microchannel is filled with a thermally conductive liquid and connected to the main heat sink encapsulated inside the CPO system. When the internal temperature of the connector exceeds a preset threshold, the thermally conductive liquid is heated and convection transfers heat to the main heat sink, which then controls the temperature.

[0035] The optical communication protocol parsing and adaptation module is used to receive the parallel beam signal output through the fiber array, and to parse the frame structure, transmission rate and modulation format based on the parallel beam signal. Based on the parsing results, it determines the communication transmission protocol, and adjusts the signal driving parameters and interface matching resistor based on the protocol determination information.

[0036] As can be seen from the above, the pluggable fiber array connector for CPO systems disclosed in this application integrates three core modules: three-dimensional dynamic alignment, serpentine microfluidic heat dissipation, and optical communication protocol parsing. This forms an integrated "alignment-heat dissipation-compatibility" technical solution. The three-dimensional dynamic alignment module effectively compensates for fiber-chip coupling misalignment caused by assembly errors and thermal deformation through real-time monitoring and dynamic adjustment, ensuring efficient optical signal transmission. The serpentine microfluidic heat dissipation system utilizes the synergistic effect of thermally conductive liquid convection and the main heat sink to achieve precise temperature control inside the connector, avoiding the risk of thermal failure. The optical communication protocol parsing module dynamically optimizes signal parameters and interface impedance through multi-dimensional feature extraction and protocol adaptation, enabling compatibility with mainstream protocols such as OIF-CEI-112G and COBO-400G. This eliminates the need for adapter modules, reducing equipment costs by 30% and shortening the debugging cycle for cross-vendor projects. The synergistic effect of these three modules fundamentally solves the core bottlenecks faced by CPO systems in large-scale deployments, such as insufficient physical alignment accuracy, difficulties in thermal management, and limited protocol compatibility, providing a reliable, flexible, and scalable solution for high-density optical interconnects.

[0037] In one embodiment, the three-dimensional dynamic alignment module integrates a visual positioning unit, a MEMS alignment unit, and a dual-lens array coupled to the end face of the fiber optic array, wherein:

[0038] The visual positioning unit is used to acquire relative position data between the fiber array and the PIC interface in real time using a CCD sensor, and to feed back the relative position data to the MEMS alignment unit.

[0039] Specifically, this application uses a CCD sensor to capture the position images of the fiber array end face and the PIC interface in real time, and extracts the relative position data of the two (such as lateral offset and angular deviation) to provide a dynamic adjustment basis for the MEMS alignment unit.

[0040] In one embodiment, this application arranges a CCD sensor (1280*960 resolution) and an LED light source (to provide highly uniform backlighting and eliminate glare interference from the fiber optic array surface) on the inner wall of the connector housing. The CCD sensor lens is focused at 8mm and fixed by a bracket to ensure clear capture of the positional images of the fiber optic array end face and the PIC interface. Furthermore, to match the dynamic adjustment response speed of the MEMS alignment unit, this application sets the image acquisition frame rate to 30fps to ensure that each frame reflects the real-time positional state after adjustment, avoiding compensation errors caused by data lag.

[0041] The MEMS alignment unit is used to perform nanometer-level fine-tuning of the positions of the fiber array and the PIC interface in the X, Y, and Z directions based on the acquired relative position data, in order to compensate for the displacement caused by assembly deviation and thermal deformation, and ensure that the fiber array and the PIC interface remain aligned.

[0042] Specifically, the MEMS alignment unit uses a single-crystal silicon wafer as a substrate, forms a movable frame through deep reactive ion etching, and achieves X / Y / Z direction movement using an electrostatic drive method. Furthermore, to balance low power consumption and high dynamic response speed, this application sets the driving voltage to 5V-10V and the displacement resolution to 0.05μm.

[0043] The dual-lens array includes a collimating lens and a focusing lens. The collimating lens is used to expand the optical fiber outgoing light into a parallel beam, and the focusing lens is used to focus the parallel beam into the aligned PIC waveguide mode field, thereby achieving efficient optical mode matching and low-loss coupling.

[0044] Specifically, the dual-lens array is made of quartz glass, with the collimating lens attached to the output end of the fiber array and the focusing lens facing the PIC waveguide.

[0045] In one embodiment, the present application fabricates a collimating lens (focal length 1.5 mm, numerical aperture 0.15) and a focusing lens (focal length 1.2 mm, numerical aperture 0.2) using a photoresist hot melt method, and the spacing of the dual lens array matches the spacing of the fiber array, and is fixed using UV-curable adhesive.

[0046] In one embodiment, the visual positioning unit is arranged on the inner wall of the connector housing and aligned with the connection area of ​​the PIC interface. The MEMS alignment unit is located at the front end of the connector and close to the optical coupling surface of the PIC interface, so as to achieve nanoscale adjustment in the X / Y / Z directions by electrostatic driving, and compensate for the relative displacement between the optical fiber and the PIC caused by assembly errors and thermal deformation.

[0047] In one embodiment, the serpentine microchannel is filled with a fluorinated liquid with a high thermal conductivity and is connected to the main heat sink encapsulated inside the CPO system via a metal heat-conducting block.

[0048] Specifically, the connector housing is made of aluminum alloy and is formed into a serpentine microchannel internally through CNC milling. To optimize the balance between thermal resistance and fluid pressure drop and ensure efficient convective heat transfer of the heat-conducting liquid within a limited space, this application sets the total length of the serpentine microchannel to 150 mm, the diameter of the inlet and outlet of the channel to 1 mm, and the roughness Ra of the inner wall of the channel to ≤ 0.8 μm.

[0049] Specifically, this application uses oxygen-free copper material and processes the metal heat-conducting block into a cube with dimensions of 10mm×10mm×5mm. The metal heat-conducting block is connected to the outer shell by laser welding, and the contact area between the heat-conducting block and the CPO main heat sink is ≥80mm².

[0050] In one embodiment, the inner wall of the serpentine microchannel is coated with a graphene coating by chemical vapor deposition, the graphene coating having a thickness of 8 μm and an adhesion greater than or equal to 5 MPa.

[0051] Specifically, the graphene coating exhibits excellent chemical stability, maintaining stable performance over long periods in complex fluid environments. Furthermore, considering that the fluid transport efficiency in the serpentine microchannel is affected by factors such as the surface roughness of the inner wall and the friction between the fluid and the inner wall, excessively thick or thin coatings, as well as insufficient adhesion, can alter these characteristics of the inner wall. Therefore, this application sets the graphene coating thickness to 8 μm and the adhesion to be greater than or equal to 5 MPa. This ensures that the coating effectively reduces the surface roughness of the inner wall and decreases fluid friction while avoiding adverse effects on fluid transport due to coating-related issues, thereby optimizing the fluid transport performance of the serpentine microchannel.

[0052] In one embodiment, the step of analyzing the frame structure, transmission rate, and modulation format based on the parallel beam signal, and determining the communication transmission protocol based on the analysis results, includes:

[0053] (1) Based on the frame synchronization and encoding recognition algorithm, the encoded frame structure of the parallel beam signal is obtained by parsing.

[0054] Specifically, after converting the parallel beam into an electrical signal, this application performs the following processing on the digitized signal:

[0055] ① Detect whether there is a synchronization header identifier for a specific protocol in the signal (such as the 64B / 66B frame synchronization code of the OIF-CEI-112G protocol, or the 256B / 257B frame start flag of the COBO-400G protocol), that is, quickly narrow down the protocol range by using the synchronization header.

[0056] ② After the synchronization header is successfully detected, the signal is block-coded and verified based on the coding specifications of the corresponding specific protocol in order to identify the frame structure type.

[0057] (2) Based on the matching verification of the clock data recovery CDR circuit and the protocol rate identifier, the transmission rate of the parallel beam signal is obtained by analysis.

[0058] Specifically, this application first extracts the symbol-level clock frequency based on the CDR circuit and converts it into a line rate based on the modulation format (e.g., determining the number of bits carried by each symbol according to the modulation format, and calculating the actual transmission rate using the formula line rate = symbol clock frequency × number of bits per symbol). Then, it parses the rate identifier field in the protocol frame structure to obtain the standard rate declared by the protocol. Finally, it verifies the transmission rate of the parallel beam signal by matching the line rate with the standard rate. Specifically, if the line rate calculated by the CDR matches the standard rate declared by the protocol identifier, the transmission rate is confirmed to be the standard rate. If they do not match, a protocol anomaly marking mechanism is triggered to improve the overall module's anti-interference capability.

[0059] (3) Based on modulation feature extraction technology, the modulation format of the parallel beam signal is obtained by analysis.

[0060] Specifically, this application analyzes the spectral energy distribution and the hierarchical structure of the symbol constellation diagram to determine the modulation format of the parallel beam signal. Considering that PAM4 has a wider spectrum and more significant high-frequency components, this application calculates the proportion of high-frequency energy by analyzing the spectral energy distribution and compares it with a preset threshold. If the high-frequency energy is significant, it is determined to be PAM4 modulation. Furthermore, since NRZ is two-level and PAM4 is four-level, this application analyzes the hierarchical structure of the symbol constellation diagram by counting the number of levels or observing the distribution hierarchy of symbol points. If a four-level hierarchical feature is detected, it is determined to be PAM4 modulation.

[0061] (4) Based on the coded frame structure, transmission rate and modulation format determined by analysis, the communication transmission protocol is determined by multi-dimensional matching and decision logic of the pre-set protocol feature library.

[0062] For example, when a 112Gbps rate + NRZ modulation + 64B / 66B frame structure is detected, it is automatically identified as the OIF-CEI-112G protocol; when a 400Gbps rate + PAM4 modulation + 256B / 257B frame structure is detected, it is automatically identified as the COBO-400G protocol. Then, based on the current protocol information type identification information, the signal drive parameters (such as amplitude and timing) and interface matching resistors are dynamically adjusted. For details, please refer to subsequent content; further explanation is not provided here.

[0063] In one embodiment, adjusting the signal drive parameters and interface matching resistor based on protocol determination information includes:

[0064] (1) Based on the protocol determination information, call the pre-stored parameter template that matches the target protocol from the preset parameter template library.

[0065] Specifically, this application will retrieve and load the corresponding standardized parameter set (including matching resistor value, drive current range, timing parameters, etc.) from the preset parameter template library based on the protocol parsing results (such as the judgment identifier of OIF-CEI-112G or COBO-400G) to ensure that the parameters are fully aligned with the physical layer specifications of the target protocol.

[0066] For example, the parameter template for the OIF-CEI-112G protocol includes:

[0067] Matching resistor: 85Ω±1%, drive current: 12mA±0.1mA, signal amplitude: 1.0V±5mV, timing parameters: setup time is 50ps and hold time is 50ps.

[0068] The parameter templates for the COBO-400G protocol include:

[0069] Matching resistor: 100Ω±1%, drive current: 15mA±0.1mA, signal amplitude: 1.2V±5mV, timing parameters: setup time is 40ps, hold time is 40ps.

[0070] (2) Based on the pre-stored parameter template, determine the corresponding parameter configuration, and dynamically configure the signal driving parameters and interface matching resistor accordingly. Adjust the parameters according to the real-time monitored signal integrity index and impedance matching status, so as to improve the anti-interference capability and reduce the bit error rate through dynamic calibration.

[0071] Specifically, this application will make precise adjustments within the range of 8mA-20mA based on the signal integrity assessment results, and adopt a PID closed-loop control algorithm to ensure that the current stability reaches ±0.1mA.

[0072] In addition, for impedance matching optimization, this application uses a digital potentiometer to achieve continuous adjustment from 40Ω to 120Ω and sets the step accuracy to 1Ω. By monitoring the voltage standing wave ratio in real time, the impedance matching state is automatically optimized.

[0073] It should be further noted that this application uses a CDR circuit to dynamically adjust the sampling clock phase and monitor the eye diagram in real time to ensure that the data is sampled at the point of maximum eye opening.

[0074] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A pluggable fiber optic array connector suitable for CPO systems, characterized in that, The connector includes a connector housing, which is a modular, pluggable structure. The pluggable fiber array connector integrates a three-dimensional dynamic alignment module, a serpentine microchannel located inside the connector housing, and an optical communication protocol parsing and adaptation module. The three-dimensional dynamic alignment module is used to monitor the relative position between the fiber array inside the connector and the PIC interface integrated inside the CPO system in real time, and to compensate for fiber-chip coupling offset caused by assembly deviation and thermal deformation through three-dimensional dynamic adjustment. The serpentine microchannel is filled with a thermally conductive liquid and connected to the main heat sink encapsulated inside the CPO system. When the internal temperature of the connector exceeds a preset threshold, the thermally conductive liquid is heated and convection transfers heat to the main heat sink, which then controls the temperature. The optical communication protocol parsing and adaptation module is used to receive the parallel beam signal output through the fiber array, and to parse the frame structure, transmission rate and modulation format based on the parallel beam signal. Based on the parsing results, it determines the communication transmission protocol and adjusts the signal driving parameters and interface matching resistor based on the protocol determination information. The three-dimensional dynamic alignment module integrates a visual positioning unit, a MEMS alignment unit, and a dual-lens array coupled to the end face of the fiber optic array, wherein: The visual positioning unit is used to acquire relative position data between the fiber array and the PIC interface in real time using a CCD sensor, and to feed the relative position data back to the MEMS alignment unit. The MEMS alignment unit is used to make nanometer-level fine adjustments to the positions of the fiber array and the PIC interface in the X, Y, and Z directions based on the acquired relative position data, in order to compensate for the displacement caused by assembly deviation and thermal deformation, and ensure that the fiber array and the PIC interface remain aligned. The dual-lens array includes a collimating lens and a focusing lens. The collimating lens is used to expand the optical fiber outgoing light into a parallel beam, and the focusing lens is used to focus the parallel beam into the aligned PIC waveguide mode field, thereby achieving efficient optical mode matching and low-loss coupling.

2. The pluggable fiber optic array connector according to claim 1, characterized in that, The visual positioning unit is arranged on the inner wall of the connector housing and aligned with the connection area of ​​the PIC interface. The MEMS alignment unit is located at the front end of the connector and close to the optical coupling surface of the PIC interface, so as to achieve nanometer-level adjustment in the X / Y / Z directions by electrostatic driving, and compensate for the relative displacement between the optical fiber and the PIC caused by assembly errors and thermal deformation.

3. The pluggable fiber optic array connector according to claim 1, characterized in that, The serpentine microchannel is filled with a fluorinated liquid with a high thermal conductivity and is connected to the main heat sink encapsulated inside the CPO system via a metal heat-conducting block.

4. The pluggable fiber optic array connector according to claim 1, characterized in that, The inner wall of the serpentine microchannel is coated with a graphene coating by chemical vapor deposition. The graphene coating has a thickness of 8 μm and an adhesion of greater than or equal to 5 MPa.

5. The pluggable fiber optic array connector according to claim 1, characterized in that, The step of analyzing the frame structure, transmission rate, and modulation format based on the parallel beam signal, and determining the communication transmission protocol based on the analysis results, includes: (1) Based on the frame synchronization and encoding recognition algorithm, the encoded frame structure of the parallel beam signal is obtained by parsing; (2) Based on the matching verification between the clock data recovery (CDR) circuit and the protocol rate identifier, the transmission rate of the parallel beam signal is obtained by analysis; (3) Based on modulation feature extraction technology, the modulation format of the parallel beam signal is obtained by analysis; (4) Based on the coded frame structure, transmission rate and modulation format determined by analysis, the communication transmission protocol is determined by multi-dimensional matching and decision logic of the pre-set protocol feature library.

6. The pluggable fiber optic array connector according to claim 1, characterized in that, The adjustment of signal drive parameters and interface matching resistors based on protocol determination information includes: (1) Based on the protocol determination information, call the pre-stored parameter template that matches the target protocol from the preset parameter template library; (2) Based on the pre-stored parameter template, determine the corresponding parameter configuration, and dynamically configure the signal driving parameters and interface matching resistor accordingly. Adjust the parameters according to the real-time monitored signal integrity index and impedance matching status, so as to improve the anti-interference capability and reduce the bit error rate through dynamic calibration.

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