Fault positioning method and device, optical module and electronic equipment

Abstract

The invention provides a fault positioning method and device, an optical module and electronic equipment, and relates to the technical field of communication, and the method comprises the steps: firstly closing the service flow of a target channel under the condition that the target channel breaks down. For each optical module through which the target channel passes, disconnecting a link between a driver and an optical transmitter corresponding to the target channel in the optical module; and communicating the TIA and the driver corresponding to the target channel in the optical module to form a corresponding electric loopback channel. And then based on the electric loopback channel, a first signal is sent to the driver, second signals returned by the TIA are received, and a fault position is determined according to the second signals. According to the technical scheme provided by the invention, the fault of the optical module can be positioned.

Description

[0001] This application is a divisional application. The original application has the application number 202510228507.0 and the original application date is February 27, 2025. The entire contents of the original application are incorporated herein by reference. Technical Field

[0002] This application relates to the field of communication technology, and in particular to a fault location method, apparatus, optical module and electronic device. Background Technology

[0003] With the development of artificial intelligence, data centers are rapidly evolving into intelligent computing centers. Intelligent computing scenarios typically use more optical modules to improve efficiency.

[0004] Due to high-load operation, environmental dust, high temperature, and dirt, optical modules may experience various malfunctions such as intermittent power outages. Therefore, how to locate the faults in optical modules is a problem that urgently needs to be solved by those in the field. Summary of the Invention

[0005] In view of this, this application provides a fault location method, apparatus, optical module, and electronic device for locating faults in an optical module.

[0006] To achieve the above objectives, in a first aspect, embodiments of this application provide a fault location method, including: In the event of a failure in the target channel, the service flow of the target channel shall be shut down; For each optical module through which the target channel passes, disconnect the link between the driver and the optical transmitter corresponding to the target channel in the optical module, and connect the TIA and the driver corresponding to the target channel in the optical module to form the corresponding electrical loopback channel; Based on the electrical loopback channel, a first signal is sent to the driver, and a second signal is received from the TIA. The location of the fault is determined based on each of the second signals.

[0007] The fault location method provided in this application, when a target channel fails, first shuts down the service flow of the target channel to avoid interference with subsequent fault location. Then, it disconnects the link between the driver and optical transmitter corresponding to the target channel in the optical module, and connects the TIA and driver corresponding to the target channel in the optical module, thereby forming an electrical loopback channel between the TIA and driver corresponding to the target channel. Next, based on the electrical loopback channel, a first signal is sent to the driver, and a second signal returned from the TIA via the electrical loopback channel is received. The fault location is determined based on the second signal. In this way, when a target channel fails, the location of the fault can be located through this electrical loopback channel.

[0008] In one possible implementation of the first aspect, determining the fault location based on each second signal includes: If the signal index of the target second signal in each second signal is abnormal, then the fault is determined to be located on the electrical link corresponding to the target second signal. If the signal indicators of each second signal are normal, then the fault is located on the optical link of the target channel.

[0009] Through the above implementation method, it is possible to determine whether the fault is located on the electrical link corresponding to the second signal or on the optical link of the target channel based on the index of the second signal.

[0010] In one possible implementation of the first aspect, if a failure occurs in the transmission channel of the target channel, and the signal indicators of the target second signal among the second signals are abnormal, then the failure is determined to be located on the electrical link corresponding to the target second signal in the transmission channel; if the signal indicators of the second signals are all normal, then the failure is determined to be located on the optical link of the transmission channel. If a fault occurs in the receiving channel of the target channel, and the signal indicators of the target second signal among the second signals are abnormal, then the fault is determined to be located on the electrical link corresponding to the target second signal in the receiving channel; if the signal indicators of the second signals are all normal, then the fault is determined to be located on the optical link of the receiving channel.

[0011] The above implementation method can further determine the location of the fault in the transmission or reception channel of the target channel.

[0012] In one possible implementation of the first aspect, the method further includes disconnecting the link between the TIA and the optical receiver in the optical module before sending the first signal to the driver via the target channel.

[0013] Secondly, embodiments of this application provide a fault location device, comprising: The control module is used to shut down the service flow of the target channel in the event of a failure in the target channel; for each optical module through which the target channel passes, it disconnects the link between the driver and optical transmitter corresponding to the target channel in the optical module, and connects the TIA and driver corresponding to the target channel in the optical module to form the corresponding electrical loopback channel; The transmitting module is used to send a first signal to the driver based on the electrical loopback channel; The receiving module is used to receive the second signal returned by TIA based on the electrical loopback channel; The determination module is used to determine the fault location based on each second signal.

[0014] In one possible implementation of the second aspect, the determining module is specifically used for: If the signal index of the target second signal in each second signal is abnormal, then the fault is determined to be located on the electrical link corresponding to the target second signal. If the signal indicators of each second signal are normal, then the fault is located on the optical link of the target channel.

[0015] In one possible implementation of the second aspect, the determining module is specifically used for: If a fault occurs in the transmission channel of the target channel, and the signal indicators of the target second signal among the second signals are abnormal, then the fault is determined to be located on the electrical link corresponding to the target second signal in the transmission channel; if the signal indicators of the second signals are all normal, then the fault is determined to be located on the optical link of the transmission channel. If a fault occurs in the receiving channel of the target channel, and the signal indicators of the target second signal among the second signals are abnormal, then the fault is determined to be located on the electrical link corresponding to the target second signal in the receiving channel; if the signal indicators of the second signals are all normal, then the fault is determined to be located on the optical link of the receiving channel.

[0016] In one possible implementation of the second aspect, the control module is further configured to: disconnect the link between the TIA and the optical receiver in the optical module before sending the first signal to the driver through the target channel.

[0017] Thirdly, embodiments of this application provide an optical module, including: a TIA, a driver, an optical transmitter connected to the driver, and an optical receiver connected to the TIA; The TIA is connected to the driver, and a first switch is provided between the TIA and the driver. The first switch is used to: turn off when the target channel is normal and turn on when the target channel fails, so as to form a corresponding electrical loopback channel between the TIA and the driver; the electrical loopback channel is used to locate the location of the fault, and the target channel is the transmission channel where the TIA, driver and optical transmitter are located; A second switch is provided between the driver and the optical transmitter. The second switch is used to: turn on when the target channel is normal and turn off when the target channel malfunctions.

[0018] In one possible implementation of the third aspect, a third switch is provided between the optical receiver and the TIA, the third switch being used to: turn on when the target channel is normal; and turn off when the target channel malfunctions.

[0019] In one possible implementation of the third aspect, the TIA and the driver are connected via any of the following: PCB, including interposer, external traces on the substrate, and internal traces on the substrate.

[0020] Fourthly, embodiments of this application provide an electronic device, including: a memory, a processor, and an optical module as described in the third aspect or any embodiment of the third aspect above. The memory is used to store a computer program; the processor is used to execute the method described in the first aspect or any embodiment of the first aspect above when the computer program is invoked.

[0021] Fifthly, embodiments of this application provide a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the method described in the first aspect or any embodiment of the first aspect.

[0022] Sixthly, embodiments of this application provide a computer program product that, when run on an electronic device, causes the electronic device to perform the method described in the first aspect or any embodiment of the first aspect.

[0023] In a seventh aspect, embodiments of this application provide a chip system including a processor coupled to a memory. The processor executes a computer program stored in the memory to implement the method described in the first aspect or any embodiment thereof. The chip system may be a single chip or a chip module composed of multiple chips.

[0024] It is understood that the beneficial effects of the second to seventh aspects mentioned above can be found in the relevant descriptions in the first aspect mentioned above, and will not be repeated here. Attached Figure Description

[0025] Figure 1 A schematic diagram of an optical module loopback channel provided in an embodiment of this application; Figure 2 This is a schematic diagram showing the absence of the optical module loopback channel in an embodiment of this application. Figure 3 This is a schematic diagram of the structure of an optical module provided in an embodiment of this application; Figure 4 This is a schematic diagram illustrating the relationship between the driver and the TIA provided in an embodiment of this application; Figure 5 A schematic diagram of the optical module provided in the embodiments of this application; Figure 6 A schematic diagram of NPO and CPO provided for embodiments of this application; Figure 7 A schematic diagram of a CPO switch system provided in an embodiment of this application; Figure 8 This is a schematic diagram of another optical module provided in an embodiment of this application; Figure 9 A flowchart illustrating the fault location method for an optical module provided in an embodiment of this application; Figure 10 This is a schematic diagram of another optical module loopback channel provided in an embodiment of this application; Figure 11 A schematic diagram showing that the entire link corresponding to the channel provided in the embodiments of this application forms multiple loopback channels; Figure 12 This is a schematic diagram of the structure of the fault location device provided in the embodiments of this application; Figure 13 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. Detailed Implementation

[0026] The embodiments of this application are described below with reference to the accompanying drawings. The terminology used in the implementation section of this application is only for explaining specific embodiments and is not intended to limit the application. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments.

[0027] With the development of artificial intelligence, data centers are rapidly evolving into intelligent computing centers. Intelligent computing scenarios typically use more optical modules to improve efficiency.

[0028] Due to high-load operation, environmental dust, high temperature, and dirt, optical modules may experience various faults such as intermittent disconnections. When a link failure occurs, it is necessary to pinpoint whether the fault originates from the electrical layer equipment, the optical module, or the optical link so that service and maintenance personnel can handle and replace it in a timely manner.

[0029] Loopback technology is commonly used when locating optical module faults. One approach involves setting up loopback nodes within the optical digital signal processing (ODSP) chip to fold the signal back, thereby enabling segmented verification of the optical and electrical links and pinpointing the fault location.

[0030] Specifically, such as Figure 1 As shown, relying on the loopback nodes within the ODSP chips of the optical modules at the transmitting and receiving ends, the entire link can be divided into three loopbacks: electrical link loopbacks ① and ③ at both ends, and optical link loopback ② in the middle.

[0031] Among them, the electrical link loopback ① starts from the serializer / deserializer (Serdes) at the transmitting end, passes through the host receive (HRX) of the ODSP1 chip of optical module 1, the host transmit (HTX) of the ODSP1 chip, and returns to the Serdes at the transmitting end.

[0032] The electrical link loopback ③ starts from the Serdes at the receiving end, passes through the HRX and HTX of the ODSP2 chip in optical module 2, and returns to the Serdes at the receiving end.

[0033] Optical link loopback ② starts from the line transmit (LTX) end of the ODSP1 chip of optical module 1, passes through the driver of optical module 1, the laser (light amplification by stimulated emission of radiation) of optical module 1, the photodiode (PD) of optical module 2, the trans-impedance amplifier (TIA) of optical module 2, the line receive (LRX) end of the ODSP2 chip, the LTX of the ODSP2 chip, the driver of optical module 2, the laser of optical module 2, the PD of optical module 1, the TIA of optical module 1, and returns to the LRX of the ODSP1 chip.

[0034] In some embodiments, the optical link loopback ② can also start from the LTX of the ODSP2 chip of optical module 2, through the driver of optical module 2, the LASER of optical module 2, the PD of optical module 1, the TIA of optical module 1, the LRX of ODSP1 chip, the LTX of ODSP1 chip, the driver of optical module 1, the LASER of optical module 1, the PD of optical module 2, the TIA of optical module 2, and return to the LRX of ODSP2 chip.

[0035] Both SerDes and ODSP chips typically feature a pseudo-random binary sequence generator (PRBS generator). The SerDes transmitter can send a PRBS signal through either electrical link loopback ① or ③ and return it to the SerDes receiver. By detecting the quality of the signal returning to the SerDes receiver, it's possible to determine if there are any faults in electrical link loopback ① or ③. Similarly, the ODSP chip can send a PRBS signal via LTX, through optical link loopback ②, and return it to the ODSP chip's LRX. By detecting the quality of the returned signal, it's possible to determine if there are any faults in optical link loopback ②.

[0036] The aforementioned loopback method relies on ODSP chips, which account for the largest proportion of power consumption in optical modules. With the rapid growth in the scale of artificial intelligence (AI) parameters and data, the demand for computing power continues to increase, leading to higher requirements for interconnects. These include higher interconnect bandwidth density, higher reliability, and lower interconnect power consumption. Therefore, some optical modules or optical engines omit the ODSP chip, such as linear pluggable optics (LPOs). For example, such as... Figure 2 As shown, the LPO optical module eliminates the ODSP chip in both the receiver and transmitter ends, which is found in traditional pluggable optical modules. This results in the loss of the self-loop function within the optical module, making it difficult to locate faults in the optical module.

[0037] To address this, this application provides an optical module including a TIA, a driver, an optical transmitter, and an optical receiver. The optical receiver is connected to the TIA, the TIA is connected to the driver, and the driver is connected to the optical transmitter. A first switch is provided between the TIA and the driver, which is used to turn off when the target channel containing the TIA, driver, and optical transmitter is functioning normally, and to turn on when the target channel fails. A second switch is provided between the driver and the optical transmitter, which is used to turn on when the target channel is functioning normally and to turn off when the target channel fails, thus forming a corresponding electrical loopback channel between the TIA and the driver. This allows for the location of the fault to be located via this electrical loopback channel when the target channel fails.

[0038] Figure 3 This is a schematic diagram of the structure of an optical module provided in an embodiment of this application, such as... Figure 3 As shown, the optical module provided in this application embodiment may include a TIA, a driver, an optical transmitter, an optical receiver, a first switch, and a second switch.

[0039] The driver can connect to an optical transmitter to amplify the electrical signal emitted by the Serdes transmitter and send the amplified electrical signal back to the optical transmitter. The Serdes can be responsible for initiating and controlling the entire optical module fault location loopback process.

[0040] An optical transmitter receives the amplified electrical signal from the driver, converts it into a corresponding optical signal, and then transmits the optical signal. The optical transmitter may include devices such as a laser, a multiplexer (Mux), and a coupling lens. In some embodiments, the optical transmitter may also include devices such as a thermoelectric cooler (TEC) and an isolator.

[0041] The optical receiver connects to the TIA and is used to convert the received optical signal into a corresponding electrical signal and transmit it to the TIA. The optical receiver may include a PD, a demultiplexer (DeMux), coupling components, etc.

[0042] TIA is used to receive electrical signals sent by optical receivers, convert the electrical signals into voltage signals of a certain amplitude, and send the voltage signals to the receiver of Serdes.

[0043] The first switch is connected between the TIA and the driver. This first switch is used to turn off the target channel (where the TIA, driver, and optical transmitter are located) when it is functioning normally, and to turn on when the target channel fails, thus forming a corresponding electrical loopback channel (i.e., electrical link loopback) between the TIA and the driver. In this way, when the target channel fails, the diagnostic signal sent by the SerDes transmitter can return to the SerDes receiver through this electrical loopback channel. By diagnosing the signal returned to the SerDes receiver, it can be determined whether the fault occurred on this electrical loopback channel.

[0044] Diagnostic signals can be decoupled from service signals and generated only during fault location, such as low-speed bitstreams and non-return-to-zero (NRZ) line code bitstreams.

[0045] The driver and TIA can be located on two separate chips, or they can be located on the same chip. For example... Figure 4 As shown in (a), the driver is located on chip 1, and the TIA is located on chip 2. The driver and the TIA can be connected via a printed circuit board (PCB), an interposer, or external traces on the substrate. Figure 4 As shown in (b), both the driver and the TIA are located on chip 3, and the driver and the TIA can be connected by metal traces inside the chip.

[0046] The second switch is connected between the driver and the optical transmitter. This second switch is used to turn on the target channel when it is functioning normally and turn off when the target channel malfunctions. Thus, in the event of a target channel malfunction, the diagnostic signal emitted by the SerDes transmitter can only return to the SerDes receiver through the aforementioned electrical loopback channel, and will not be transmitted through the optical transmitter, thereby improving the accuracy of fault location results.

[0047] Optical modules may also include microcontroller units (MCUs) and optical interfaces.

[0048] The MCU is used for internal management and control of the optical module. The MCU can interact with surrounding components via an inter-integrated circuit (IIC) or a serial peripheral interface (SPI) to control the selection of the loopback path and form an electrical loopback. The MCU can also monitor and report key parameters of the optical module in real time, such as temperature, voltage, current, receive power, and transmit power, ensuring the stable operation of the optical module.

[0049] Optical interfaces can include fiber optic receiver interfaces and fiber optic transmitter interfaces. Based on the different wavelengths of light they can transmit, optical fibers can be divided into single-mode fiber (transmitting long-wavelength lasers) and multimode fiber (transmitting short-wavelength lasers). Single-mode fiber has a longer connection distance, while multimode fiber has a shorter connection distance.

[0050] Optical modules can come in various models depending on the transmission rate and transmission distance. For example, such as... Figure 5 As shown, xxxGBASE represents the transmission rate, m represents the transmission distance, and Rn represents the number of transmission channels. For example, the model of the optical module is 800GBASE-SR8. SR stands for short reach, meaning the transmission distance is 100m. This optical module uses 8 transmission channels in each direction (8 transmit channels and 8 receive channels), includes 8 drivers and 8 TIAs, and each transmission channel supports independent switching. Each transmission channel uses a data transmission rate of 100Gbps, meaning this optical module can transmit 800Gbps over 100m. This optical module is generally compatible with multimode fiber.

[0051] Another type of optical module can be adapted to single-mode fiber, such as 800GBASE-FR8, where FR stands for far reach, meaning a transmission distance of 2km. This optical module supports a transmission rate of 800Gbps, a transmission distance of 2km, and 8 transmission channels, each with a data transmission rate of 100Gbps.

[0052] Optical modules can be categorized by form into hot-pluggable optical modules (such as LPOs) and optical modules with encapsulated optical engines. For example... Figure 6 The near-packaged optic (NPO) optical module shown in (a) encapsulates the network switching chip and optical engine on a PCB substrate. For example... Figure 6 The optical module shown in (b) is a co-packaged optic (CPO) module, in which the network switching chip and the optical engine are assembled together in the same socket, forming a co-package of chip and module.

[0053] The packaging design shortens the distance between the switching chip and the optical engine, enabling high-speed electrical signals to be transmitted between them with high quality, thus meeting bit error rate requirements. Furthermore, the packaging design allows for a higher density of high-speed ports, thereby increasing the overall bandwidth density of the device. In addition, the packaging design allows for more concentrated components, which is also beneficial for cold plate liquid cooling technology.

[0054] NPOs and CPOs typically opt for external light sources, while encapsulating other optoelectronic devices and functional circuits within the light engine. For example, the location of the laser source is defined on the front panel to improve system reliability and allow for efficient "hot-swappable" field replacement when necessary.

[0055] Compared to LPO, NPO and CPO both have higher optoelectronic device integration density. For example... Figure 7 The CPO switch system shown contains 16 6.4T optical engines. Each optical engine contains a 64-channel photonic integrated circuit (PIC) chip, on which Mux / DeMux can be integrated. The single-channel signal rate is 100Gbps. Each channel includes a set of drivers and TIAs, which are independent of each other and form their own electrical loopbacks. To achieve a high-density layout, the CPO's drivers and TIAs are typically placed at both ends of the PIC, and each loopback trace needs to bypass the PIC.

[0056] Figure 8 This is a schematic diagram of another optical module structure provided in an embodiment of this application, as shown below. Figure 8 As shown, the optical module may also include a third switch connected between the optical receiver and the TIA.

[0057] The third switch is used to turn on when the target channel is normal and turn off when the target channel fails. This way, in the event of a target channel failure, the SerDes receiver can only receive the diagnostic signals sent by the SerDes transmitter and returned to the SerDes receiver via the aforementioned electrical loopback channel, and will not receive other service signals, thereby improving the accuracy of fault location results.

[0058] Figure 9 This is a flowchart illustrating a fault location method for an optical module provided in an embodiment of this application. The fault location method provided in this application can be applied to optical modules. Optical modules can be installed on electronic devices such as base stations, routing devices, switching devices, and servers, for high-speed data transmission between these electronic devices or between these electronic devices and other devices. Figure 9 As shown, the fault location method for an optical module provided in this application embodiment may include the following steps: S110. In the event of a failure in the target channel, shut down the service flow of the target channel.

[0059] When a target channel fails, the optical module's MCU can first report channel fault information such as loss of signal (LOS) and bit error rate (BER) anomalies to the SerDes. After receiving the fault information, the SerDes can shut down the service flow of the target channel that failed to prevent the service flow from interfering with subsequent fault location.

[0060] S120. For each optical module through which the target channel passes, disconnect the link between the driver and the optical transmitter corresponding to the target channel in the optical module, and connect the TIA and the driver corresponding to the target channel in the optical module to form the corresponding electrical loopback channel.

[0061] For example, such as Figure 10 As shown, in the optical module of the electronic device, a second switch can be provided between the driver and the optical transmitter corresponding to the target channel (the second switch is in the on state when the target channel is normal). The Serdes can disconnect the second switch by sending a corresponding control signal to break the link between the driver and the optical transmitter. A first switch can be provided between the TIA and the driver (the first switch is in the off state when the target channel is normal). The Serdes can turn on the first switch by sending a corresponding control signal to connect the TIA and the driver, forming a corresponding electrical loopback channel between the Serdes, the TIA, and the driver.

[0062] S130. Disconnect the link between the TIA and the optical receiver in the optical module.

[0063] like Figure 10 As shown, a third switch can be installed between the TIA and the optical receiver. Serdes can disconnect the link between the TIA and the optical receiver by sending a corresponding control signal to turn off the third switch.

[0064] S140: Based on the electrical loopback channel, send a first signal to the driver and receive a second signal returned by TIA.

[0065] The first signal can be a diagnostic signal used to locate the fault, such as a low-speed bitstream or an NRZ bitstream. For example... Figure 10 As shown, the Serdes transmitter can send a first signal to the driver. After receiving the first signal, the driver can transmit the first signal to the TIA through the electrical loopback channel. Finally, the TIA returns a feedback signal (i.e., the second signal) to the Serdes receiver.

[0066] S150. Determine the fault location based on each second signal.

[0067] Specifically, SerDes can determine the quality of the second signal by analyzing information such as the signal-to-noise ratio (SNR), bit error rate, and height of the electro-eye diagram. If the quality of the second signal is good, it indicates that the corresponding electrical loopback channel is normal; if the quality of the second signal is poor, or if SerDes does not receive the second signal, it indicates that the fault occurs in the corresponding electrical loopback channel.

[0068] To pinpoint the exact location of the fault, multiple electrical loopback channels can be created along the entire link corresponding to the faulty target channel for fault segmentation and identification. For example, such as... Figure 11 As shown, the entire link is divided into three segments: electrical link loopback 1 (i.e., electrical loopback channel 1), the intermediate optical link, and electrical link loopback 2 (i.e., electrical loopback channel 2).

[0069] If the signal indicators of the second signal in electrical link loopback 1 are abnormal, the fault can be determined to be located on electrical link loopback 1; if the signal indicators of the second signal in electrical link loopback 2 are abnormal, the fault can be determined to be located on electrical link loopback 2; if the signal indicators of the second signals in both electrical link loopback 1 and electrical link loopback 2 are normal, the fault can be determined to be located on the intermediate optical link.

[0070] In some embodiments, SerDes can also combine fault information reported by the optical module to further determine the location of the fault. For example, as... Figure 11 As shown, if the fault occurs in the transmission channel of the target channel, and the signal indicators in the second signal of the electrical link loopback 1 are abnormal, it can be determined that the fault is located on the electrical link between the transmitter of Serdes1 and the driver of optical module 1; if the signal indicators in the second signal of the electrical link loopback 2 are abnormal, it can be determined that the fault is located on the electrical link between the TIA of optical module 2 and the receiver of Serdes2; if the signal indicators of the second signal in both electrical link loopback 1 and electrical link loopback 2 are normal, it can be determined that the fault is located on the optical link between the driver of optical module 1 and the TIA of optical module 2.

[0071] If the fault occurs in the receiving channel of the target channel, and the signal indicators in the second signal of the electrical link loopback 1 are abnormal, it can be determined that the fault is located on the electrical link between the TIA of optical module 1 and the receiver of Serdes1; if the signal indicators in the second signal of the electrical link loopback 2 are abnormal, it can be determined that the fault is located on the electrical link between the transmitter of Serdes2 and the driver of optical module 2; if the signal indicators of the second signals in both electrical link loopback 1 and electrical link loopback 2 are normal, it can be determined that the fault is located on the optical link between the driver of optical module 2 and the TIA of optical module 1.

[0072] The fault location method provided in this application, when a target channel fails, first shuts down the service flow of the target channel to avoid interference with subsequent fault location. Then, it disconnects the link between the driver and optical transmitter corresponding to the target channel in the optical module, and connects the TIA and driver corresponding to the target channel in the optical module, thereby forming an electrical loopback channel between the TIA and driver corresponding to the target channel. Next, based on the electrical loopback channel, a first signal is sent to the driver, and a second signal returned from the TIA via the electrical loopback channel is received. The fault location is determined based on the second signal. In this way, when a target channel fails, the location of the fault can be located through this electrical loopback channel.

[0073] Those skilled in the art will understand that the above embodiments are exemplary and not intended to limit this application. Where possible, the execution order of one or more of the above steps can be adjusted. For example, in some embodiments, steps S120 and S130 can be executed before step S110, and in some embodiments, step S130 can be executed before step S120. Selective combinations can also be made to obtain one or more other embodiments; for example, in some embodiments, step S130 may not be executed. Those skilled in the art can arbitrarily select and combine the above steps as needed, and all combinations that do not depart from the essence of this application fall within the protection scope of this application.

[0074] Based on the same concept, as an implementation of the above method, this application provides a fault location device. This device embodiment corresponds to the aforementioned method embodiment. For ease of reading, this device embodiment will not repeat the details of the aforementioned method embodiment one by one, but it should be clear that the device in this embodiment can correspondingly implement all the contents of the aforementioned method embodiment.

[0075] Figure 12 This is a schematic diagram of the fault location device provided in the embodiments of this application, as shown below. Figure 12 As shown, the apparatus provided in this embodiment may include: Control module 210 is used to shut down the service flow of the target channel in the event of a failure in the target channel; for each optical module through which the target channel passes, disconnect the link between the driver and optical transmitter in the optical module corresponding to the target channel, and connect the TIA and driver in the optical module corresponding to the target channel to form a corresponding electrical loopback channel; The transmitting module 220 is used to send a first signal to the driver based on the electrical loopback channel; Receiver module 230 is used to receive the second signal returned by TIA based on the electrical loopback channel; The determination module 240 is used to determine the fault location based on each second signal.

[0076] In one possible implementation of the second aspect, the determining module 240 is specifically used for: If the signal index of the target second signal in each second signal is abnormal, then the fault is determined to be located on the electrical link corresponding to the target second signal. If the signal indicators of each second signal are normal, then the fault is located on the optical link of the target channel.

[0077] In one possible implementation of the second aspect, the determining module 240 is specifically used for: If a fault occurs in the transmission channel of the target channel, and the signal indicators of the target second signal among the second signals are abnormal, then the fault is determined to be located on the electrical link corresponding to the target second signal in the transmission channel; if the signal indicators of the second signals are all normal, then the fault is determined to be located on the optical link of the transmission channel. If a fault occurs in the receiving channel of the target channel, and the signal indicators of the target second signal among the second signals are abnormal, then the fault is determined to be located on the electrical link corresponding to the target second signal in the receiving channel; if the signal indicators of the second signals are all normal, then the fault is determined to be located on the optical link of the receiving channel.

[0078] In one possible implementation of the second aspect, the control module 210 is further configured to: disconnect the link between the TIA and the optical receiver in the optical module before sending the first signal to the driver through the target channel.

[0079] The device provided in this embodiment can execute the above method embodiment, and its implementation principle and technical effect are similar, so it will not be described again here.

[0080] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional units and modules is merely an example. In practical applications, the above functions can be assigned to different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiments can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit. Furthermore, the specific names of the functional units and modules are only for easy differentiation and are not intended to limit the scope of protection of this application. The specific working process of the units and modules in the above system can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.

[0081] Based on the same concept, embodiments of this application also provide an electronic device. Figure 13 This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application, such as... Figure 13 As shown, the electronic device provided in this application embodiment may include: a memory 310, a processor 320, and an optical module 330 as described in the above embodiment. The memory 310 is used to store a computer program; the processor 320 is used to implement the method described in the above method embodiment when the computer program is invoked.

[0082] The electronic device provided in this embodiment can execute the above method embodiment, and its implementation principle and technical effect are similar, so they will not be described again here.

[0083] This application also provides a computer-readable storage medium storing a computer program thereon, which, when executed by a processor, implements the methods described in the above-described method embodiments.

[0084] This application also provides a computer program product that, when run on an electronic device, causes the electronic device to implement the method described in the above-described method embodiments.

[0085] This application also provides a chip system including a processor coupled to a memory. The processor executes a computer program stored in the memory to implement the method described in the above-described method embodiments. The chip system may be a single chip or a chip module composed of multiple chips.

[0086] In the above embodiments, implementation can be achieved entirely or partially through software, hardware, firmware, or any combination thereof. When implemented using software, it can be implemented entirely or partially in the form of a computer program product. The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, all or part of the processes or functions described in the embodiments of this application are generated. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium or transmitted through the computer-readable storage medium. The computer instructions can be transmitted from one website, computer, server, or data center to another website, computer, server, or data center via wired (e.g., coaxial cable, fiber optic, digital subscriber line) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium can be any available medium that a computer can access or a data storage device such as a server or data center that integrates one or more available media. The available medium can be a magnetic medium (e.g., floppy disk, hard disk, or magnetic tape), an optical medium (e.g., DVD), or a semiconductor medium (e.g., solid-state disk (SSD)).

[0087] Those skilled in the art will understand that implementing all or part of the processes in the above embodiments can be accomplished by a computer program instructing related hardware. This program can be stored in a computer-readable storage medium, and when executed, it can include the processes described in the above method embodiments. The aforementioned storage medium can include various media capable of storing program code, such as ROM or random access memory (RAM), magnetic disks, or optical disks.

[0088] The naming or numbering of steps in this application does not mean that the steps in the method flow must be executed in the time / logical order indicated by the naming or numbering. The execution order of the named or numbered process steps can be changed according to the technical purpose to be achieved, as long as the same or similar technical effect can be achieved.

[0089] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail or recorded in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0090] In the embodiments provided in this application, it should be understood that the disclosed apparatus / devices and methods can be implemented in other ways. For example, the apparatus / device embodiments described above are merely illustrative. For instance, the division of modules or units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between apparatuses or units may be electrical, mechanical, or other forms.

[0091] It should be understood that in the description of this application and the appended claims, the terms "comprising," "including," "having," and any variations thereof are intended to cover a non-exclusive inclusion and mean "including but not limited to," unless otherwise specifically emphasized. For example, a process, method, system, product, or apparatus that includes a series of steps or modules is not necessarily limited to those steps or modules that are explicitly listed, but may include other steps or modules that are not explicitly listed or that are inherent to such process, method, product, or apparatus.

[0092] In the description of this application, unless otherwise stated, " / " indicates that the objects before and after are in an "or" relationship. For example, A / B can mean A or B. "And / or" in this application is used to describe the relationship between the related objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. A and B can be singular or plural.

[0093] Furthermore, in the description of this application, unless otherwise stated, "multiple" means two or more. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one of a, b, or c can mean: a, b, c, ab, ac, bc, or abc, where a, b, and c can be single or multiple.

[0094] As used in this application specification and the appended claims, the term "if" may be interpreted, depending on the context, as "when," "once," "in response to determination," or "in response to detection." Similarly, the phrase "if determined" or "if detected [the described condition or event]" may be interpreted, depending on the context, as meaning "once determined," "in response to determination," "once detected [the described condition or event]," or "in response to detection [the described condition or event]."

[0095] Furthermore, in the description of this application and the appended claims, the terms "first," "second," etc., are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence, nor should they be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. It should be understood that such data can be interchanged where appropriate so that the embodiments described herein can be implemented in a sequence other than that illustrated or described herein; features defined as "first" or "second" may explicitly or implicitly include at least one of those features.

[0096] In the embodiments described in this application specification, the words "exemplarily" or "for example" are used to indicate examples, illustrations, or explanations. Any embodiment or design described as "exemplarily" or "for example" in the embodiments of this application specification should not be construed as being more preferred or advantageous than other embodiments or design solutions. Specifically, the use of the words "exemplarily" or "for example" is intended to present the relevant concepts in a specific manner.

[0097] References to "one embodiment" or "some embodiments" in this specification mean that one or more embodiments of this specification include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, phrases such as "in one embodiment," "in some embodiments," "in other embodiments," and "in still other embodiments" appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized.

[0098] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A fault location method, characterized in that, include: In the event of a failure in the target channel, the service flow of the target channel shall be shut down; For each optical module through which the target channel passes, disconnect the link between the driver and the optical transmitter corresponding to the target channel in the optical module, and connect the transimpedance amplifier (TIA) and the driver corresponding to the target channel in the optical module to form a corresponding electrical loopback channel; Based on the electrical loopback channel, a first signal is sent to the driver, and a second signal is received from the TIA. The location of the fault is determined based on each of the second signals.

2. The method according to claim 1, characterized in that, Determining the fault location based on each of the second signals includes: If the signal index of the target second signal in each of the second signals is abnormal, then the fault is determined to be located on the electrical link corresponding to the target second signal; If the signal indicators of each of the second signals are normal, then the fault is determined to be located on the optical link of the target channel.

3. The method according to claim 1 or 2, characterized in that, In the event of a failure in the transmission channel of the target channel, if the signal indicators of the target second signal among the second signals are abnormal, the failure is determined to be located on the electrical link corresponding to the target second signal in the transmission channel; if the signal indicators of the second signals are all normal, the failure is determined to be located on the optical link of the transmission channel. In the event of a fault in the receiving channel of the target channel, if the signal indicators of the target second signal among the second signals are abnormal, the fault is determined to be located on the electrical link corresponding to the target second signal in the receiving channel; if the signal indicators of the second signals are all normal, the fault is determined to be located on the optical link of the receiving channel.

4. The method according to any one of claims 1-3, characterized in that, Before sending the first signal to the driver through the target channel, the method further includes disconnecting the link between the TIA and the optical receiver in the optical module.

5. A fault location device, characterized in that, include: The control module is used to shut down the service flow of the target channel in the event of a failure in the target channel; For each optical module through which the target channel passes, disconnect the link between the driver and the optical transmitter corresponding to the target channel in the optical module, and connect the TIA and the driver corresponding to the target channel in the optical module to form a corresponding electrical loopback channel; The transmitting module is used to send a first signal to the driver based on the electrical loopback channel; The receiving module is configured to receive the second signal returned by the TIA based on the electrical loopback channel; The determination module is used to determine the fault location based on each of the second signals.

6. An optical module, characterized in that, include: TIA, driver, optical transmitter connected to the driver, and optical receiver connected to the TIA; The TIA and the driver are connected, and a first switch is provided between the TIA and the driver; The first switch is used to: turn off when the target channel is normal and turn on when the target channel fails, so as to form a corresponding electrical loopback channel between the TIA and the driver; The electrical loopback channel is used to locate the location of the fault, and the target channel is the transmission channel where the TIA, the driver, and the optical transmitter are located; A second switch is provided between the driver and the optical transmitter. The second switch is used to: turn on when the target channel is normal and turn off when the target channel malfunctions.

7. The optical module according to claim 6, characterized in that, A third switch is provided between the optical receiver and the TIA. The third switch is used to: turn on when the target channel is normal; and turn off when the target channel malfunctions.

8. The optical module according to claim 6 or 7, characterized in that, The TIA and the driver are connected via any of the following: PCB, including interposer, external traces on the substrate, and internal traces on the substrate.

9. An electronic device, characterized in that, include: The memory, the processor, and the optical module as described in any one of claims 6-8, wherein the memory is used to store a computer program; and the processor is used to execute the method as described in any one of claims 1-4 when the computer program is invoked.

10. A computer program product, characterized in that, When the computer program product is run on an electronic device, it causes the electronic device to perform the method as described in any one of claims 1-4.

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