An optical module

Abstract

The application relates to the technical field of optical communication, and provides an optical module, which comprises a shell and a PCB plate arranged in the shell, a heat dissipation block is arranged on the PCB plate, the heat dissipation block is arranged in the shell, the heat dissipation block comprises a center block and a diffusion plate connected to the center block, the diffusion plate extends outward from the surface of the center block, and the center block covers a heating area on the PCB plate. The heat absorbed by the center block can be rapidly diffused through the diffusion plate, so that the heat accumulation on the heating area is avoided, and the performance of a chip is not affected; the heat dissipation block in the I-shaped structure can rapidly diffuse heat through the upper and lower diffusion plates, can form a channel for optical fibers to pass through, can not interfere with the optical fibers passing through, can play a bundling role on the optical fibers through the diffusion plates, and can provide rigid support after being pressed on the PCB plate by an upper cover, can effectively constrain the deformation of the PCB plate under high temperature, and can reduce stress concentration caused by thermal expansion difference.

Description

Technical Field

[0001] This invention relates to the field of optical communication technology, specifically to an optical module. Background Technology

[0002] With the development of data centers and high-speed communication networks, 800G multimode optical modules are widely used due to their advantages such as high bandwidth and low power consumption. However, with the increase in transmission rate, the power consumption of internal electronic components (such as driver chips, signal processing chips, and power management chips) increases significantly, leading to a greater temperature rise on the PCBA board. Traditional heat dissipation methods typically use a single metal heat sink or thermally conductive silicone directly bonded to the PCBA board, which has the following problems:

[0003] 1. Uneven heat dissipation: Heat is concentrated in high-power areas, leading to excessively high local temperatures and causing thermal stress concentration;

[0004] 2. Thermal stress risk: Excessive local temperature difference can cause thermal deformation of the PCBA board, which may lead to solder joint cracking, component detachment, and reduced reliability.

[0005] 3. Low heat dissipation efficiency: Traditional structures cannot effectively conduct heat to the module shell, resulting in a long heat dissipation path and high thermal resistance;

[0006] 4. Limited fiber optic cable placement: Existing heat dissipation structures often occupy fiber optic channel space, affecting fiber alignment and cabling. Summary of the Invention

[0007] The purpose of this invention is to provide an optical module that can at least solve some of the defects in the prior art.

[0008] To achieve the above objectives, the present invention provides the following technical solution: an optical module, including a housing and a PCB board disposed in the housing, a heat sink being provided on the PCB board, the heat sink being disposed inside the housing, the heat sink including a central block and a diffuser plate connected to the central block, the diffuser plate extending outward from the surface of the central block, the central block covering the heat-generating area on the PCB board.

[0009] Furthermore, both the upper and lower surfaces of the central block are provided with diffusion plates.

[0010] Furthermore, the diffuser plate extends in the width direction of the housing to form an I-shaped heat dissipation block, and the diffuser plates on the upper and lower surfaces and the side of the central block form a U-shaped channel for optical fibers to pass through.

[0011] Furthermore, the diffuser plate extends to the inner wall of the contact housing.

[0012] Furthermore, the heat sink is connected to the PCB board and the housing via thermally conductive adhesive or a thermally conductive pad.

[0013] Furthermore, the thermal conductivity of the thermally conductive adhesive or thermally conductive pad is not less than 5 W / m·K.

[0014] Furthermore, a driver chip and a signal processing chip are provided in the heat-generating area of ​​the PCB board.

[0015] Furthermore, the heat sink is a metal block.

[0016] Furthermore, the metal block is a copper block, an aluminum block, or a copper-aluminum alloy block.

[0017] Furthermore, the housing includes a base and a top cover, the PCB board is disposed inside the base, and the top cover presses the heat sink onto the PCB board.

[0018] Compared with the prior art, the beneficial effects of the present invention are:

[0019] 1. The diffuser plate can quickly dissipate the heat absorbed by the central block, preventing heat from accumulating in the heat-generating area and affecting chip performance.

[0020] 2. The heat sink adopts an I-shaped structure, which can quickly dissipate heat through the upper and lower diffuser plates, and form a channel for optical fiber to pass through. It will not interfere with the passage of optical fiber and can also act as a bundle for optical fiber through the diffuser plate. Moreover, after the I-shaped heat sink is pressed onto the PCB board by the top cover, it can provide rigid support, which can effectively restrain the deformation of the PCBA board at high temperature and reduce stress concentration caused by thermal expansion difference. Attached Figure Description

[0021] Figure 1 A schematic diagram of an optical module provided for an embodiment of the present invention (top cover and heat sink not shown).

[0022] Figure 2 This is a schematic diagram of the structure of a heat sink for an optical module provided in an embodiment of the present invention;

[0023] Figure 3 A schematic diagram of the structure of an optical module provided in an embodiment of the present invention (top cover not shown);

[0024] In the attached diagram, the labels are: 1-base; 2-PCB board; 3-optical fiber; 4-heat sink; 5-central block; 6-diffuser plate; 7-U-shaped channel. Detailed Implementation

[0025] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0026] Please see Figure 1 , Figure 2 and Figure 3 This invention provides an optical module, including a housing and a PCB board 2 disposed within the housing. A heat sink 4 is provided on the PCB board 2 and is located within the housing. The heat sink 4 includes a central block 5 and a diffuser plate 6 connected to the central block 5. The diffuser plate 6 extends outward from the surface of the central block 5, and the central block 5 covers the heat-generating area on the PCB board 2. In this embodiment, the diffuser plate 6 can rapidly diffuse the heat absorbed by the central block 5, preventing heat accumulation in the heat-generating area and thus avoiding localized overheating that could affect chip performance. Specifically, when heat-generating devices, such as driver chips and signal processing chips, generate heat, the heat is first absorbed by the central block 5 and then diffused to the diffuser plate 6. Compared to existing heat sinks 4, this avoids heat accumulation in the heat-generating area, reduces the temperature of the heat-generating area, and improves the operational stability of the chip in the heat-generating area.

[0027] Please see Figure 1 , Figure 2 and Figure 3 The central block 5 has diffusion plates 6 on both its upper and lower surfaces. In this embodiment, diffusion plates 6 can be provided on both the upper and lower surfaces, which can further improve heat dissipation efficiency. Of course, providing diffusion plates 6 only on the upper surface or only on the lower surface can also diffuse heat, but the effect is not as good as providing diffusion plates 6 on both the upper and lower surfaces.

[0028] Please see Figure 1 , Figure 2 and Figure 3The diffuser plate 6 extends towards the width of the housing to form an I-shaped heat sink. The diffuser plates 6 on the upper and lower surfaces and the side of the central block 5 form a U-shaped channel 7 for the optical fiber 3 to pass through. In this embodiment, the heat sink 4 with an I-shaped structure can quickly diffuse heat through the upper and lower diffuser plates 6, and form a channel for the optical fiber 3 to pass through. It will not interfere with the passage of the optical fiber 3, and the diffuser plate 6 can also act as a bundle for the optical fiber 3. Moreover, after the I-shaped heat sink 4 is pressed onto the PCB board 2 by the top cover, it can provide rigid support, which can effectively constrain the deformation of the PCBA board at high temperatures and reduce stress concentration caused by thermal expansion differences. Specifically, if diffuser plates 6 are provided on both the upper and lower surfaces, the direction of extension of the diffuser plates 6 can be limited to the width direction of the housing. This can obtain a heat dissipation structure similar to an I-shaped structure. This structure can improve the diffusion efficiency and form a U-shaped channel 7 for the optical fiber 3 to be accommodated and guided through, avoiding interference of the heat sink 4 with the optical fiber 3 channel. It does not affect optical alignment and module assembly. The diffuser plate 6 can constrain the optical fiber 3, achieving multiple benefits. Of course, the diffuser plate 6 is best extended along the width of the optical module. Extending it along the length of the optical module is also feasible and can achieve excellent heat dissipation efficiency, but it will not constrain the optical fiber 3. Preferably, the diffuser plate 6 extends to contact the inner wall of the housing, which can transfer the diffused heat to the side wall of the housing for dissipation, thus improving heat dissipation efficiency.

[0029] Please see Figure 1 , Figure 2 and Figure 3 The diffuser plate 6 is integrally formed with the surface of the central block 5. In this embodiment, the diffuser plate 6 can be integrally formed with the upper and lower surfaces of the central block 5, or it can be another large panel covering the upper and lower surfaces of the central block 5. When integrally formed, the diffuser plate 6 can be regarded as a plate structure that extends from the edge of the central block 5 to the side.

[0030] Please see Figure 1 , Figure 2 and Figure 3 The heat sink 4 is connected to the PCB board 2 and the housing via thermally conductive adhesive or a thermally conductive pad. In this embodiment, the heat sink 4 is connected to the PCB board 2 via thermally conductive adhesive or a thermally conductive pad, allowing the heat sink 4 to fit tightly against the PCBA board, achieving efficient heat conduction from the PCBA board to the heat sink 4. The heat sink 4 is also connected to the top cover of the housing via thermally conductive adhesive or a thermally conductive pad, achieving a low thermal resistance connection between the heat sink 4 and the housing, shortening the heat dissipation path. Preferably, the thermal conductivity of the thermally conductive adhesive or thermally conductive pad is not less than 5 W / m·K. Thermally conductive silicone or graphene composite thermally conductive pads are preferred to ensure minimal interfacial thermal resistance.

[0031] Please see Figure 1 , Figure 2 and Figure 3 The PCB board 2 has a driver chip and a signal processing chip located in the heat-generating area. In this embodiment, the heat-generating devices can be the driver chip and the signal processing chip, both of which consume a lot of power and generate a lot of heat during operation.

[0032] Please see Figure 1 , Figure 2 and Figure 3 The heat sink 4 is a metal block. Preferably, the metal block is a copper block, an aluminum block, or a copper-aluminum alloy block. In this embodiment, the heat sink 4 is made of metal, which can improve heat dissipation efficiency and provide rigid support, effectively constraining the deformation of the PCBA board at high temperatures and reducing stress concentration caused by thermal expansion differences.

[0033] Please see Figure 1 , Figure 2 and Figure 3 The housing includes a base 1 and a top cover. The PCB board 2 is disposed inside the base 1, and the top cover presses the heat sink 4 onto the PCB board 2. In this embodiment, the top cover and the base 1 are assembled to form a housing with an inner cavity. The top cover presses onto the heat sink 4, which can quickly dissipate heat to the outside of the housing.

[0034] The assembly process of this optical module is as follows:

[0035] 1. Lay a layer of thermally conductive pad (such as thermally conductive silicone sheet) on the upper surface of PCB board 2, and then press the I-shaped heat sink onto the thermally conductive pad to ensure that the contact surface is flat and free of air bubbles;

[0036] 2. The diffuser plate 6 of the I-shaped heat sink is bonded and fixed to the inner wall of the housing with thermally conductive adhesive to form a stable mechanical connection and heat conduction path;

[0037] 3. Optical fiber 3 enters the module through the U-shaped channels 7 on both sides of the I-shaped heat sink and is aligned and coupled with the optical components;

[0038] 4. After the overall assembly is completed, thermal testing is performed: the circuit is continuously run in an 85℃ constant temperature chamber for 24 hours, and the temperature of each key point on the PCB board is monitored. The results show that the highest temperature point is below 75℃, the temperature difference is less than 5℃, the internal temperature distribution of the module is more uniform, the operating temperature of the key chips drops significantly, the service life is extended, and the long-term stable operation requirements of the 800G optical module are met.

[0039] At this point, this optical module can:

[0040] 1. Significantly improves the heat dissipation uniformity of PCB board 2, reduces the risk of thermal stress, and enhances the long-term reliability of the module;

[0041] 2. Effectively reduces the operating temperature of key components inside the module, improving performance stability under high-temperature environments;

[0042] 3. The aperture design is compatible with 3-channel fiber optics and does not affect the integration of the optical system;

[0043] 4. Simple structure, easy to manufacture and assemble, suitable for large-scale production of 800G multimode optical modules.

[0044] It effectively solves the problems of uneven heat dissipation and thermal stress in 800G multimode optical modules under high power consumption conditions, while also ensuring unimpeded passage of three fiber optic channels. It significantly improves the module's thermal management capabilities and long-term reliability, making it suitable for application scenarios with extremely high stability requirements, such as data centers and high-speed communications.

[0045] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An optical module comprising a housing and a PCB board provided in the housing, characterized in that: The PCB board is provided with a heat sink, which is disposed inside the housing. The heat sink includes a central block and a diffuser plate connected to the central block. The diffuser plate extends outward from the surface of the central block. The central block covers the heat-generating area on the PCB board. Diffuser plates are provided on both the upper and lower surfaces of the central block. The diffuser plates extend in the width direction of the housing to form an I-shaped heat sink. The diffuser plates on the upper and lower surfaces and the side of the central block form a U-shaped channel for optical fiber to pass through. The housing includes a top cover, which presses the heat sink onto the PCB board. The I-shaped heat sink can reduce the thermal stress when the optical module is working, thereby constraining the deformation of the PCBA board at high temperatures.

2. An optical module as described in claim 1, characterized in that: The diffuser plate extends to the inner wall of the contact housing.

3. An optical module as described in claim 1, characterized in that: The heat sink is connected to the PCB board and the housing via thermally conductive adhesive or a thermally conductive pad.

4. An optical module as described in claim 3, characterized in that: The thermal conductivity of the thermally conductive adhesive or thermally conductive pad is not less than 5 W / m·K.

5. An optical module as described in claim 1, characterized in that: The PCB board has a driver chip and a signal processing chip located in the heat-generating area.

6. An optical module as described in claim 1, characterized in that: The heat sink is a metal block.

7. An optical module as described in claim 6, characterized in that: The metal block is a copper block, an aluminum block, or a copper-aluminum alloy block.

8. An optical module as described in claim 1, characterized in that: The housing includes a base, and the PCB board is disposed inside the base.

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