Camera module
By introducing damping rubber and ball bearings into the camera module to form an asymmetrical four-corner support plane, the problems of lens carrier shake and poor frequency response consistency are solved, achieving more stable motion and frequency response consistency, which is suitable for camera modules.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- NINGBO SUNNY OPOTECH CO LTD
- Filing Date
- 2026-01-16
- Publication Date
- 2026-05-15
AI Technical Summary
In existing camera modules, the three-ball bearing support structure causes problems such as lens carrier shake, motion trajectory distortion, and poor frequency response consistency.
Damping adhesive is introduced between the lens carrier and the base as an auxiliary support element. The damping adhesive and the ball bearings in a specific layout form an asymmetrical four-corner support plane to suppress carrier shaking and balance deflection torque. At the same time, damping adhesive is set at the bending circuit board to suppress resonance.
It improves the motion stability of the camera module and the consistency of motor frequency response, provides a stable hardware foundation for easy PID debugging, and avoids drive force loss and deflection.
Smart Images
Figure CN121547675B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of cameras, and more specifically, to the field of camera modules. Background Technology
[0002] With the popularization and development of consumer electronics, camera modules have become a core component of devices such as smartphones and tablets. To improve image quality, especially in dynamic shooting or low-light environments, camera modules typically need to integrate functions such as autofocus (AF) and optical image stabilization (OIS). The realization of these functions depends on the ability of the carrier supporting the lens to perform precise and smooth multi-degree-of-freedom movement.
[0003] To ensure smooth motion, a common approach in existing technologies is to use three ball bearings to support a movable lens carrier. These three ball bearings, along with ball bearing grooves slightly larger than the bearing size, allow the bearings to roll freely within these grooves. This method enables the carrier to achieve multiple degrees of freedom of movement. However, the free movement of the ball bearings within the grooves means that the carrier (e.g., the image stabilization frame) does not restrict their movement. The ball bearing trajectories are prone to distortion, causing carrier vibration and resulting in poor consistency in motor frequency response analysis (FRA). Summary of the Invention
[0004] The main advantage of this application is that it provides a camera module in which damping rubber is set at a specific position to effectively suppress the shaking of the lens carrier during the movement process, ensuring the smoothness of its movement trajectory, thereby significantly improving the FRA consistency and drive stability of the motor, and providing a stable hardware foundation for subsequent proportional integral derivative (PID) algorithm debugging.
[0005] According to one aspect of this application, a camera module is provided, comprising:
[0006] The base includes a first side, a second side, a third side, and a fourth side; the first side and the third side are opposite to each other in the Y direction; the second side and the fourth side are opposite to each other in the X direction; the X direction and the Y direction are perpendicular.
[0007] The lens carrier is movably mounted on the base to support the lens;
[0008] A drive assembly for driving the lens carrier to move relative to the base;
[0009] A support assembly is disposed between the base and the lens carrier to support the lens carrier. The support assembly includes a first type of damping adhesive, a first ball bearing, a second ball bearing, and a third ball bearing. The first ball bearing is disposed at a first corner between a first side and a second side of the base. The second ball bearing is disposed at a second corner between the second side and the third side. The third ball bearing is disposed at a third corner between the third side and the fourth side. The first type of damping adhesive is disposed on the first side. The first type of damping adhesive includes a first damping adhesive, and the first damping adhesive and the first ball bearing are respectively located on both sides of the central axis in the Y direction of the first side.
[0010] In some embodiments of this application, the drive assembly includes a bending circuit board; the bending circuit board is disposed around the lens carrier; and a second type of damping adhesive is disposed between the lens carrier and the adjacent area of the bending portion of the bending circuit board.
[0011] In some embodiments of this application, the second type of damping adhesive is disposed at the bend opposite to the first type of damping adhesive.
[0012] In some embodiments of this application, the bent circuit board includes a first circuit board segment, a second circuit board segment that bends horizontally relative to the first circuit board segment, a third circuit board segment that bends horizontally relative to the second circuit board segment, a fourth circuit board segment that bends downward relative to the first circuit board segment, a first bend extending between the first and second circuit board segments, a second bend extending between the second and third circuit board segments, and a third bend extending between the first and fourth circuit board segments; the first and third circuit board segments are opposite each other in the X direction; a second type of damping adhesive is disposed in the adjacent area of the first bend; the elastic coefficient of the first bend in the X direction and the elastic coefficient of the third bend in the Y direction are respectively smaller than the elastic coefficient of the third bend in the X direction and the elastic coefficient of the second bend in the X direction and the elastic coefficient of the third bend in the Y direction; the elastic coefficient of the first bend in the X direction and the elastic coefficient of the second bend in the X direction and the elastic coefficient of the third bend in the Y direction are respectively smaller than the elastic coefficient of the second bend in the X direction and the elastic coefficient of the third bend in the Y direction.
[0013] In some embodiments of this application, the elastic coefficients of the second bending portion in the X direction and the Y direction are respectively smaller than the elastic coefficients of the third bending portion in the X direction and the Y direction; the elastic coefficient of the third bending portion in the X direction is smaller than its elastic coefficient in the Y-axis direction.
[0014] In some embodiments of this application, the elastic coefficient of the third bending portion in the X direction is smaller than its elastic coefficient in the Y-axis direction.
[0015] In some embodiments of this application, the driving component includes a stabilization driving component, which includes a first stabilization coil, a second stabilization coil, and a third stabilization coil; the first stabilization coil, the second stabilization coil, and the third stabilization coil are mounted on the base; and the first stabilization coil and the second stabilization coil are disposed on the second side, and the third stabilization coil is disposed on the third side.
[0016] In some embodiments of this application, the first type of damping adhesive further includes a second damping adhesive, and the first damping adhesive and the second damping adhesive are symmetrical about the central axis in the Y direction of the first side.
[0017] In some embodiments of this application, the distance between the first damping adhesive and the second damping adhesive is greater than or equal to 1 / 3 of the length of the first side, and less than or equal to 80% of the length of the first side.
[0018] In some embodiments of this application, the driving assembly further includes an image stabilization circuit board mounted on the upper surface of the base, wherein the first image stabilization coil, the second image stabilization coil, and the third image stabilization coil are mounted on the image stabilization circuit board; a limiting groove is provided on the image stabilization circuit board and / or the lens carrier, and the first type of damping adhesive is limited to the limiting groove.
[0019] In some embodiments of this application, the base includes three ball grooves for accommodating balls; the drive assembly further includes a stabilization circuit board mounted on the upper surface of the base, wherein the first stabilization coil, the second stabilization coil, and the third stabilization coil are mounted on the stabilization circuit board, and the stabilization circuit board is embedded in the three ball grooves.
[0020] In some embodiments of this application, the loss factor of the second type of damping adhesive is greater than that of the first type of damping adhesive.
[0021] In some embodiments of this application, the storage modulus of the second type of damping adhesive is less than that of the first type of damping adhesive.
[0022] In some embodiments of this application, the viscosity of the first type of damping adhesive is greater than the viscosity of the second type of damping adhesive.
[0023] In some embodiments of this application, the cross-sectional area of a single second-type damping adhesive is smaller than the cross-sectional area of a single first-type damping adhesive.
[0024] In some embodiments of this application, the thickness of the second type of damping adhesive is less than the thickness of the first type of damping adhesive.
[0025] The further objectives and advantages of this application will become fully apparent from the following description and accompanying drawings.
[0026] These and other objects, features and advantages of this application are fully apparent from the following detailed description and accompanying drawings. Attached Figure Description
[0027] Figure 1 The illustration shows a schematic cross-sectional view of a camera module according to an embodiment of this application.
[0028] Figure 2 An exploded view of the camera module according to this application is shown.
[0029] Figure 3 The illustration shows a partial top view of the camera module according to this application.
[0030] Figure 4 The illustration shows a partial perspective view of the camera module according to this application.
[0031] Figure 5 The illustration shows another partial perspective view of the camera module according to this application.
[0032] Figure 6 Another partial top view schematic diagram of the camera module according to this application is shown.
[0033] Figure 7 The illustration shows a partial cross-sectional view of an example of a camera module according to this application. Detailed Implementation
[0034] Hereinafter, exemplary embodiments according to this application will be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are merely some embodiments of this application, and not all embodiments of this application. It should be understood that this application is not limited to the exemplary embodiments described herein.
[0035] In this application, the terms "first," "second," etc., are used to distinguish different objects rather than to describe a specific order. Furthermore, the terms "comprising," "owning," and any variations thereof are intended to cover non-exclusive inclusion.
[0036] While terms such as “front,” “back,” “left,” “right,” “up,” and “down” may be used in this specification to describe various exemplary features and elements, these terms are used herein for convenience, for example, based on the example orientations shown in the figures and / or orientations in typical use. Nothing in this specification should be construed as requiring a specific three-dimensional or spatial orientation of the structure.
[0037] As mentioned above, to ensure smooth motion, a common approach in the prior art is to use three ball bearings to support the movable lens carrier. These three ball bearings, along with ball bearing grooves that are slightly larger than the bearing size, allow the bearings to roll freely within these grooves. This method enables the carrier to achieve multiple degrees of freedom of movement using these ball bearings and grooves. However, the fact that the ball bearings can move freely in multiple directions within the grooves means that the carrier (e.g., the image stabilization frame) does not restrict the movement of the ball bearings. The ball bearing trajectory is easily distorted, causing carrier vibration and resulting in poor consistency in motor frequency response analysis (FRA).
[0038] Based on this, this application proposes a stable drive scheme to solve the problems of lens carrier jitter, motion trajectory distortion, and poor frequency response consistency caused by insufficient constraints in existing three-ball bearing support structures, thereby improving the motion stability and reliability of the module. Specifically, while retaining the three-ball bearing support structure to provide multi-degree-of-freedom motion, damping adhesive is introduced as an auxiliary support element and damping element, providing a ball bearing + damping adhesive support method. Through the viscosity and elasticity of the damping adhesive, the carrier jitter can be suppressed while supporting the carrier, ensuring the consistency of the motor. In addition, the damping adhesive can also suppress the carrier offset relative to the base, ensuring the assembly tolerance of the motor; and by placing damping adhesive between the bent circuit board and the carrier, the deformation of the bent circuit board is prevented from affecting the carrier motion.
[0039] Furthermore, this application does not simply increase damping, but rather employs a specific strategic layout, placing the first type of damping adhesive on a specific side outside the support triangle formed by the three ball bearings. In this way, the three ball bearings and the damping adhesive together form a wider and more stable asymmetric four-corner support plane. This layout not only utilizes the viscoelastic properties of the damping adhesive to absorb and suppress high-frequency vibrations of the carrier during movement, but also specifically balances and suppresses asymmetric torques generated by the drive components in specific directions that could cause carrier deflection, while avoiding drive force loss caused by damping in the direction of the main driving force.
[0040] like Figures 1 to 7As shown, a camera module 1 according to an embodiment of this application is illustrated. Specifically, the camera module 1 includes a lens 50, a motor, and a photosensitive component. The lens 50 is mounted on the motor and held in the light-sensitive path of the photosensitive component. The lens 50 includes at least one optical lens. In some embodiments of this application, the lens 50 further includes a lens barrel. The photosensitive component includes a photosensitive circuit board, a photosensitive chip mounted on the photosensitive circuit board, and electronic components. In some embodiments of this application, the photosensitive component further includes a filter element located on the photosensitive chip.
[0041] In this application, the lens 50 defines an optical axis L, the length of which extends in the same direction as the height and vertical direction of the camera module 1. For ease of description of the camera module 1, this application defines the length of the optical axis L as the Z-direction; any direction perpendicular to the vertical direction as the horizontal direction; the direction from the center of the circle surrounding the optical axis L to the circumference is radial; the direction extending around the circumference of the optical axis L is circumferential; the side radially closer to the optical axis L of the lens 50 is the inner side, and the side radially farther from the optical axis L of the lens 50 is the outer side. The horizontal direction includes the X and Y directions perpendicular to the vertical direction, wherein the X direction is perpendicular to the Y direction. This application also defines the camera module 1 as having a first side, a second side, a third side, and a fourth side in a clockwise direction, wherein the first side and the third side are opposite each other in the Y direction, and the second side and the fourth side are opposite each other in the X direction. The first, second, third, and fourth sides of each component of the camera module 1 are respectively aligned with the first, second, third, and fourth sides of the motor.
[0042] Specifically, the motor includes a base 10, a lens carrier 20, a drive assembly 30, and a support assembly 40. The lens carrier 20 is movably disposed on the base 10 for supporting the lens 50. The drive assembly 30 drives the lens carrier 20 to move relative to the base 10. The support assembly 40 is disposed between the base 10 and the lens carrier 20 for supporting the lens carrier 20.
[0043] In this application, the base 10 includes a first side 11, a second side 12, a third side 13, and a fourth side 14. The first side 11, the second side 12, the third side 13, and the fourth side 14 are respectively located on the first side, the second side, the third side, and the fourth side of the camera module 1. The first side 11 and the third side 13 are opposite each other in the Y direction; the second side 12 and the fourth side 14 are opposite each other in the X direction. In other words, the first side 11 and the third side 13 of the base 10 are opposite sides of each other, and the second side 12 and the fourth side 14 are opposite sides of each other.
[0044] like Figures 1 to 3 As shown, the support assembly 40 includes three balls and a first type of damping adhesive 41. The first type of damping adhesive 41 is disposed outside the triangular support area formed by the three balls, and the first type of damping adhesive 41 and the three balls can form a four-corner support plane. At least one of the damping adhesives 41 (such as the first damping adhesive 411) and the first ball 42 are respectively located on both sides of the central axis in the Y direction of the first side 11.
[0045] In one example of this application, the lower end of the first type of damping adhesive 41 contacts the base 10, and the upper end of the first type of damping adhesive 41 contacts the lens carrier 20. Based on the damping characteristics of the first type of damping adhesive 41, the first type of damping adhesive 41 can effectively suppress the vibration of the lens carrier 20, improve the FRA consistency of the motor, and facilitate subsequent PID tuning. At the same time, the first type of damping adhesive 41 can also effectively suppress the deflection of the lens carrier 20 relative to the base 10.
[0046] Specifically, the three balls are a first ball 42, a second ball 43, and a third ball 44. The first ball 42 is disposed at a first corner 110 between a first side 11 and a second side 12 of the base 10; the second ball 43 is disposed at a second corner 120 between the second side 12 and the third side 13; and the third ball 44 is disposed at a third corner 130 between the third side 13 and the fourth side 14. Accordingly, the base 10 includes three ball grooves 15. The three ball grooves 15 are respectively used to accommodate the first ball 42, the second ball 43, and the third ball 44, respectively located at the first corner 110 between the first side 11 and the second side 12, the second corner 120 between the second side 12 and the third side 13, and the third corner 130 between the third side 13 and the fourth side 14. The first type of damping adhesive 41 is disposed on the first side 11 of the base 10. The position of the first damping adhesive 411 is far away from the position of the three balls, so that the first damping adhesive 411 can better suppress the shaking of the lens carrier 20 caused by the distortion of the ball movement trajectory, and make the first type of damping adhesive 41 and the three balls form a larger support plane. This support plane covers the lens carrier 20 as much as possible, thereby giving the lens carrier 20 better support.
[0047] Furthermore, the driving assembly 30 includes an image stabilization driving assembly 31 and a focus driving assembly 32. The image stabilization driving assembly 31 is used to drive the lens carrier 20 to move relative to the base 10 in the X or Y direction, and the focus driving assembly 32 is used to drive the lens carrier 20 to move relative to the base 10 in the Z direction.
[0048] The focusing drive assembly 32 includes a focusing coil 321 and a focusing magnet 322, which are arranged opposite to each other. Specifically, the focusing drive assembly 32 is located above the fourth side 14 of the base 10, and is opposite to each other in the horizontal direction.
[0049] The image stabilization drive assembly 31 includes an image stabilization coil 311 and an image stabilization magnet 312. The image stabilization coil 311 is disposed on the top surface of the base 10, and the image stabilization magnet 312 is disposed on the lens carrier 20, with the image stabilization magnet 312 and the image stabilization coil 311 arranged opposite each other. More specifically, the image stabilization magnet 312 and the image stabilization coil 311 are opposite each other in the vertical direction. Specifically, the image stabilization coil 311 includes a first image stabilization coil 3111, a second image stabilization coil 3112, and a third image stabilization coil 3113. The first image stabilization coil 3111 and the second image stabilization coil 3112 are arranged along the Y direction (the extension direction of the second side 12) on the second side 12 of the base 10, and the third image stabilization coil 3113 is disposed on the third side 13 of the base 10. In this way, the image stabilization drive component 31 and the three ball bearings are located on the second and third sides of the camera module, the focus drive component 32 is located on the fourth side of the camera module, and the first type of damping adhesive 41 is located on the first side of the camera module, so that the distribution of the drive component 30 and the support component 40 is relatively balanced.
[0050] More specifically, the first stabilization coil 3111 and the second stabilization coil 3112 are located between the first ball 42 and the second ball 43; the third stabilization coil 3113 is located between the second ball 43 and the third ball 44.
[0051] Both the first image stabilization coil 3111 and the second image stabilization coil 3112 can generate a torque in the X direction on the lens carrier 20, and the first image stabilization coil 3111 and the second image stabilization coil 3112 can generate mutually canceling deflection torques, thereby compensating for the deflection torque in the X direction. Furthermore, the first type of damping adhesive 41 is disposed at a position away from the coils of the first image stabilization coil 3111 and the second image stabilization coil 3112, which can suppress vibration without absorbing driving force.
[0052] The third image stabilization coil 3113 can generate a torque in the Y direction on the lens carrier 20. However, due to assembly tolerances and other reasons, the third image stabilization coil 3113 may also generate a deflection torque on the lens carrier 20, causing the lens carrier 20 to deflect relative to the base 10. Therefore, in this application, the first type of damping adhesive 41 and the third image stabilization coil 3113 are arranged opposite each other. The first type of damping adhesive 41 suppresses the deflection torque generated by the third image stabilization coil 3113, thereby enabling the lens carrier 20 to compensate for the deflection torque in both the X and Y directions, preventing the lens carrier 20 from deflecting relative to the base 10. More specifically, the first type of damping adhesive 41 and the third image stabilization coil 3113 are opposite each other in the Y direction.
[0053] Furthermore, to better support the lens carrier 20 and compensate for the deflection torque, at least two first-type damping adhesives 41 (such as first damping adhesive 411 and second damping adhesive 412) can be provided on the top surface of the first side 11 of the base 10. These at least two first-type damping adhesives 41 are distributed along the X direction. The first damping adhesive 411 and the second damping adhesive 412 are distributed on both sides of the Y-direction central axis (the torque generated by the third image stabilization coil 3113) of the first side 11 of the base 10. In this way, the two first-type damping adhesives 41 can suppress the deflection torque in the two directions generated by the third image stabilization coil 3113 respectively, thereby better preventing the lens carrier 20 from deflecting relative to the base 10. In one example of this application, the first-type damping adhesive 41 and the first ball bearing 42 are symmetrical about the Y-direction central axis of the first side 11.
[0054] Furthermore, the distance between the first damping adhesive 411 and the second damping adhesive 412 is greater than or equal to 1 / 3 of the side length of the first side 11, to avoid the two first-type damping adhesives 41 having too small a distance, causing the damping areas to overlap and reducing efficiency. The side length of the first side 11, that is, the length of the first side 11, is the dimension of the first side 11 in the X direction.
[0055] The distance between the first damping adhesive 411 and the second damping adhesive 412 is less than or equal to 80% of the side length of the first side 11, or the distance between the first damping adhesive 411 or the second damping adhesive 412 and the ball is at least twice the diameter of the first ball 42, so as to avoid the first type of damping adhesive 41 getting too close to the ball and affecting the rolling effect of the ball.
[0056] In one embodiment of this application, the drive assembly 30 further includes an image stabilization circuit board 313. The image stabilization circuit board 313 is mounted on the upper surface of the base 10. The first image stabilization coil 3111, the second image stabilization coil 3112, and the third image stabilization coil 3113 are mounted on the image stabilization circuit board 313, thus indirectly mounting the base 10. The image stabilization circuit board 313 covers the first side 11, the second side 12, and the third side 13 of the base 10. The image stabilization circuit board 313 and three ball bearing grooves 15 engage with each other to limit the positioning of the image stabilization circuit board 313. Since no image stabilization coil 311 is provided on the first side 11, the portion of the image stabilization circuit board 313 located on the first side 11 does not need wiring. In one example of this application, the upper end of the first type of damping adhesive 41 abuts against the lens carrier 20, and the lower end abuts against the image stabilization circuit board 313.
[0057] like Figure 7 As shown, a limiting groove 103 may be provided on the image stabilization circuit board 313 and / or the lens carrier 20, and the first type of damping adhesive 41 is limited in the limiting groove 103.
[0058] In a specific implementation, a limiting groove 103 for accommodating the first damping adhesive 411 and the second damping adhesive 412 can be provided on the lower surface of the lens carrier 20 to limit the first type of damping adhesive 41. Similarly, a limiting groove 103 for accommodating the first damping adhesive 411 and the second damping adhesive 412 can be provided on the portion of the image stabilization circuit board 313 located on the first edge 11.
[0059] For example, during the application of the first type of damping adhesive 41, the first type of damping adhesive 41 is applied to the limiting groove 103. Optionally, the length, width, and height of the first type of damping adhesive 41 are 0.4 mm, 0.4 mm, and 0.56 mm, respectively. Alternatively, the first type of damping adhesive 41 is formed by curing black adhesive dots, and its length, width, and height are 0.4 mm, 0.4 mm, and 0.4 mm, respectively.
[0060] In one embodiment of this application, the drive assembly 30 further includes a bent circuit board 323. The bent circuit board 323 is electrically connected to the focusing coil 321 and is used to conduct the focusing coil 321. The bent circuit board 323 is disposed around the lens carrier 20.
[0061] like Figure 2 , Figures 4 to 6As shown, the bent circuit board 323 sequentially includes a first circuit board segment 310, a first bend 320, a second circuit board segment 330, a second bend 340, and a third circuit board segment 350. The second circuit board segment 330 bends horizontally relative to the first circuit board segment 310; the third circuit board segment 350 bends horizontally relative to the second circuit board segment 330; the first bend 320 extends between the first circuit board segment 310 and the second circuit board segment 330; the second bend 340 extends between the second circuit board segment 330 and the third circuit board segment 350.
[0062] Specifically, the lens carrier 20 includes a first sidewall 210, a second sidewall 220, a third sidewall 230, and a fourth sidewall 240 arranged clockwise. The first sidewall 210, the second sidewall 220, the third sidewall 230, and the fourth sidewall 240 are respectively located on the first, second, third, and fourth sides of the camera module 1. The first sidewall 210 and the third sidewall 230 are opposite each other in the Y direction; the second sidewall 220 and the fourth sidewall 240 are opposite each other in the X direction. The first circuit board segment 310 is attached to the second sidewall 220 of the lens carrier 20, located on the second side of the motor; the second circuit board segment 330 is attached to the third sidewall 230 of the lens carrier 20, located on the third side of the motor; and the third circuit board segment 350 is attached to the fourth sidewall 240 of the lens carrier 20, located on the fourth side of the motor. The orthographic projections of the first circuit board segment 310, the second circuit board segment 330, and the third circuit board segment 350 in the Z direction are approximately U-shaped.
[0063] The bent circuit board 323 further includes a fourth circuit board segment 370 and a third bend 360. The fourth circuit board segment 370 bends downward relative to the first circuit board segment 310; the third bend 360 extends between the first circuit board segment 310 and the fourth circuit board segment 370; the first circuit board segment 310 and the third circuit board segment 350 are opposite each other in the X direction. The fourth circuit board segment 370 extends along the Z direction to one corner of the base 10 and leads out a pin from the second side 12 of the base 10. Since the bent circuit board 323 is connected to one side of the lens carrier 20 via one corner of the lens carrier 20, and because the bent circuit board 323 is relatively long and has a low natural frequency, when the lens carrier 20 moves in the X and Y directions, the bent circuit board 323 is easily excited by the driving frequency of the image stabilization drive component 31, which will lead to poor FRA consistency of the motor. Furthermore, the bent circuit board 323 deforms under the influence of the lens carrier 20, and the deformed bent circuit board 323 exhibits a tendency to exert force in the opposite direction to the deformation direction. For ease of description, this reverse force of the bent circuit board 323 is defined as a reset force in this application; under the action of the reset force, the lens carrier 20 is prone to significant deflection, thereby affecting the normal operation of the image stabilization function.
[0064] In this application, such as Figure 2 and Figure 4 As shown, a second type of damping adhesive 70 can be provided between the lens carrier 20 and the bent circuit board 323 to suppress resonance of the bent circuit board 323. The second type of damping adhesive 70 can be provided at the bend of the bent circuit board 323 (such as the first bend 320, the second bend 340, or the third bend), or at a position adjacent to the bend. It is understood that because the bending curvature of the bent circuit board 323 is large, it is prone to local resonance. Therefore, providing the second type of damping adhesive 70 at the bend of the bent circuit board 323 can suppress local resonance of the bent circuit board 323.
[0065] Accordingly, a second type of damping adhesive 70 is provided between the lens carrier 20 and the adjacent area of the bent portion of the bent circuit board 323. The adjacent area of the bent portion refers to the area where the bent portion is located and the area adjacent to the bent portion. In each circuit board segment, the area adjacent to a bent portion refers to the area in the circuit board segment whose distance from the center of the bent portion in its length direction is less than or equal to 1 / 3 of the total length of the circuit board segment.
[0066] For example, the adjacent area of the first bend 320 refers to the area where the first bend 320 is located, the area of the first circuit board segment 310 adjacent to the first bend 320, and the area of the second circuit board segment 330 adjacent to the first bend 320. The area of the first circuit board segment 310 adjacent to the first bend 320 refers to the area whose distance from the center of the first bend 320 is less than or equal to 1 / 3 of the total length of the first circuit board segment 310; the area of the second circuit board segment 330 adjacent to the first bend 320 refers to the area whose distance from the center of the first bend 320 is less than or equal to 1 / 3 of the total length of the second circuit board segment 330. The adjacent area of the second bend 340 refers to the area where the second bend 340 is located, the area of the second circuit board segment 330 adjacent to the second bend 340, and the area of the third circuit board segment 350 adjacent to the second bend 340. The region adjacent to the second bend 340 in the second circuit board segment 330 refers to the region whose distance from the center of the second bend 340 is less than or equal to 1 / 3 of the total length of the second circuit board segment 330; the region adjacent to the second bend 340 in the third circuit board segment 350 refers to the region whose distance from the center of the second bend 340 is less than or equal to 1 / 3 of the total length of the third circuit board segment 350.
[0067] In one embodiment of this application, the second type of damping adhesive 70 can be disposed on the bent portion (such as the first bent portion 320 or the second bent portion 340) of the bent circuit board 323 opposite to the first damping adhesive 411 and the second damping adhesive 412. The second type of damping adhesive 70 and the first damping adhesive 411 and the second damping adhesive 412 are arranged radially opposite each other, that is, the second type of damping adhesive 70 and the first type of damping adhesive are disposed on opposite sides (or diagonally), which enables the lens carrier 20 to have damping adhesive on opposite sides (or corners) to suppress shaking and improve the stability of the lens carrier 20 during movement.
[0068] Furthermore, both the first bending portion 320 and the third bending portion 360 possess a certain degree of elasticity in both the X and Y directions to provide travel for the lens carrier 20 in the X and Y directions. The elastic coefficient of the third bending portion 360 in the X direction is smaller than its elastic coefficient in the Y direction, and the third bending portion 360 primarily provides deformation travel in the X direction. The second bending portion 340 provides deformation travel in both the X and Y directions. The elastic coefficients of the second bending portion 340 in the X and Y directions are respectively smaller than those of the third bending portion 360 in the X and Y directions. Therefore, resonance is more likely to occur at the first bending portion 320. The second type of damping adhesive 70 is disposed in the adjacent area of the first bending portion 320 of the bent circuit board 323. The second type of damping adhesive 70 and the first type of damping adhesive 41 are opposite each other in a direction parallel to a diagonal line of the lens carrier 20, thereby suppressing the resonance of the first bending portion 320 and avoiding the impact of the resonance of the bent circuit board 323 on the image stabilization function and FRA consistency of the camera module 1. The elastic coefficients of the first bending portion 320 in the X direction and the Y direction are respectively smaller than those of the third bending portion 360 in the X direction and the Y direction; the elastic coefficients of the first bending portion 320 in the X direction and the Y direction are respectively smaller than those of the second bending portion 340 in the X direction and the Y direction.
[0069] In addition, such as Figure 6 As shown, the bending angle A corresponding to the third bending portion 360 is greater than the bending angle B corresponding to the first bending portion 320, and the restoring torque generated by the first bending portion 320 is greater than the restoring torque generated by the third bending portion 360. Therefore, by providing the second type of damping adhesive 70 between the first bending portion 320 and the lens carrier 20, the restoring torque generated by the bending circuit board 323 can be better suppressed, preventing the lens carrier 20 from shifting relative to the base 10.
[0070] In one example, the second type of damping adhesive 70 contacts the first bend 320. The second type of damping adhesive 70 uses an insulating material to prevent the bend circuit board 323 from short-circuiting.
[0071] Furthermore, since the frequency of local vibration of the bent circuit board 323 is higher than the vibration frequency of the lens carrier 20 during movement, in this application, the loss factor of the second type of damping adhesive 70 is greater than that of the first damping adhesive 411 and the second damping adhesive 412, so that the second type of damping adhesive 70 can better suppress the high-frequency vibration of the bent circuit board 323. The storage modulus of the second type of damping adhesive 70 (G' ≈ 0.1~0.3 MPa) is lower than that of the first damping adhesive 411 and the second damping adhesive 412 (G' ≈ 0.5~0.8 MPa). The low modulus of the second type of damping adhesive 70 can avoid increasing the stiffness of the bent circuit board 323, while the high modulus of the first damping adhesive 411 and the second damping adhesive 412 can provide support for the lens carrier 20.
[0072] In this embodiment, high-frequency vibration energy is rapidly dissipated at the second type of damping adhesive 70, preventing it from being transmitted to the lens carrier 20 and triggering low-frequency resonance. Low-frequency vibration is suppressed by the first damping adhesive 411 and the second damping adhesive 412, preventing the large displacement movement of the lens carrier 20 from pulling the bent circuit board 323 and causing secondary high-frequency vibration.
[0073] Since the second type of damping adhesive 70 needs to be leveled and filled in the micro-gap between the lens carrier 20 and the bent circuit board 323, and the first damping adhesive 411 and the second damping adhesive 412 need to maintain shape stability, in this application, the viscosity of the first damping adhesive 411 and the second damping adhesive 412 is greater than the viscosity of the second type of damping adhesive 70.
[0074] The second type of damping adhesive 70 needs to adapt to the local strain of the bent circuit board 323; therefore, the second type of damping adhesive 70 can be dot-shaped or line-shaped. The first damping adhesive 411 and the second damping adhesive 412 need to support the lens carrier 20; therefore, the first damping adhesive 411 and the second damping adhesive 412 are planar. Accordingly, in one embodiment of this application, the cross-sectional area of a single second type of damping adhesive 70 is smaller than the cross-sectional area of a single first type of damping adhesive 41.
[0075] Because an excessively thick second-type damping adhesive 70 would restrict the deformation freedom of the bent circuit board 323, and the first damping adhesive 411 and the second damping adhesive 412 need to support the movable carrier, in this application, the thickness of the second-type damping adhesive 70 is less than the thickness of the first damping adhesive 411 and the second damping adhesive 412. In one example of this application, the length, width, and height dimensions of the second-type damping adhesive 70 are 0.4 mm, 0.4 mm, and 0.35 mm, respectively.
[0076] In one embodiment of this application, the lens carrier 20 includes a first carrier 21 and a second carrier 22. The first carrier 21 is movably disposed on the base 10, and the second carrier 22 is movably disposed within the first carrier 21. The first carrier 21 is an image stabilization carrier, and the second carrier 22 is a focusing carrier. Three ball bearings and a first-type damping rubber 41 are disposed between the base 10 and the first carrier 21 to support the first carrier 21. The first-type damping rubber 41 can effectively suppress the shaking of the first carrier 21, improve the FRA consistency of the motor, and facilitate subsequent PID tuning. At the same time, the first-type damping rubber 41 can also effectively suppress the deflection of the first carrier 21 relative to the base 10.
[0077] In one example of this application, the lower end of the first type of damping adhesive 41 contacts the base 10, and the upper end of the first type of damping adhesive 41 contacts the first carrier 21. In another example of this application, the upper end of the first type of damping adhesive 41 abuts against the first carrier 21, and the lower end abuts against the anti-shake circuit board 313.
[0078] The position of the first damping adhesive 411 is far away from the position of the three balls, so that the first damping adhesive 411 can better suppress the shaking of the first carrier 21 caused by the distortion of the ball movement trajectory, and make the first damping adhesive 41 and the three balls form a larger support plane, which covers the first carrier 21 as much as possible, thereby giving the first carrier 21 better support.
[0079] The image stabilization drive assembly 31 is used to drive the first carrier 21 to move relative to the base 10 along the X or Y direction, and the focusing drive assembly 32 is used to drive the second carrier 22 to move relative to the first carrier 21 along the Z direction. The image stabilization coil 311 is disposed on the top surface of the base 10, and the image stabilization magnet 312 is disposed on the first carrier 21. The focusing coil 321 is disposed on the first carrier 21, and the focusing magnet 322 is disposed on the second carrier 22.
[0080] Both the first stabilization coil 3111 and the second stabilization coil 3112 can generate a torque in the X direction on the first carrier 21. The third stabilization coil 3113 can generate a torque in the Y direction on the first carrier 21. However, due to assembly tolerances and other reasons, the third stabilization coil 3113 may also generate a deflection torque on the first carrier 21, causing the first carrier 21 to deflect relative to the base 10. Therefore, in this application, the first type of damping adhesive 41 and the third stabilization coil 3113 are arranged opposite each other. The first type of damping adhesive 41 suppresses the deflection torque generated by the third stabilization coil 3113, thereby enabling the first carrier 21 to compensate for the deflection torque in both the X and Y directions, preventing the first carrier 21 from deflecting relative to the base 10. More specifically, the first type of damping adhesive 41 and the third stabilization coil 3113 are opposite each other in the Y direction.
[0081] In one embodiment of this application, a limiting groove 103 is provided on the anti-shake circuit board 313 and / or the first carrier 21, and the first type of damping adhesive 41 is limited in the limiting groove 103.
[0082] The bent circuit board 323 is disposed around the first carrier 21. The first carrier 21 includes a first sidewall 210, a second sidewall 220, a third sidewall 230, and a fourth sidewall 240 arranged clockwise. The first circuit board segment 310 is attached to the second sidewall 220 of the first carrier 21; the second circuit board segment 330 is attached to the third sidewall 230 of the first carrier 21; and the third circuit board segment 350 is attached to the fourth sidewall 240 of the first carrier 21.
[0083] Because the bent circuit board 323 is connected to one side of the first carrier 21 via one corner, and because the bent circuit board 323 is relatively long and has a low natural frequency, when the first carrier 21 moves in the X and Y directions, the bent circuit board 323 is easily excited by the driving frequency of the anti-shake drive component 31, which will lead to poor FRA consistency of the motor. In addition, the bent circuit board 323 will deform under the action of the first carrier 21, and the deformed bent circuit board 323 has a tendency to exert force in the opposite direction to the deformation direction. For ease of description, this reverse force of the bent circuit board 323 is defined as the reset force in this application; under the action of the reset force, the first carrier 21 is prone to large deflection, thereby affecting the normal operation of the anti-shake function.
[0084] In this application, a second type of damping adhesive 70 can be provided between the first carrier 21 and the bent circuit board 323. The second type of damping adhesive 70 is provided between the adjacent areas of the bent portion of the first carrier 21 and the bent circuit board 323. The second type of damping adhesive 70 is disposed opposite to the first damping adhesive 411 and the second damping adhesive 412, and the first carrier 21 has damping adhesive on opposite sides (or corners) to suppress vibration and improve the stability of the first carrier 21 during movement.
[0085] Both the first bending portion 320 and the third bending portion 360 have a certain degree of elasticity in the X and Y directions to provide travel for the first carrier 21 in the X and Y directions. In one example of this application, the second type of damping adhesive 70 and the first type of damping adhesive 41 are opposite each other in a direction parallel to a diagonal line of the first carrier 21. By providing the second type of damping adhesive 70 between the first bending portion 320 and the first carrier 21, the second type of damping adhesive 70 can better suppress the restoring torque generated by the bent circuit board 323, preventing the first carrier 21 from shifting relative to the base 10.
[0086] In this embodiment, the frequency of local vibration of the bent circuit board 323 is higher than the vibration frequency of the first carrier 21 during movement. High-frequency vibration energy is rapidly dissipated at the second type of damping adhesive 70, preventing it from being transmitted to the first carrier 21 and triggering low-frequency resonance. Low-frequency vibration is suppressed by the first damping adhesive 411 and the second damping adhesive 412, preventing secondary high-frequency vibration caused by the large displacement movement of the first carrier 21 pulling on the bent circuit board 323. The second type of damping adhesive 70 needs to be leveled and filled to fill the micro-gap between the first carrier 21 and the bent circuit board 323.
[0087] In summary, the camera module according to the embodiments of this application has been explained. The camera module effectively suppresses the shaking of the lens carrier during movement by setting damping rubber at specific locations, ensuring the smoothness of its motion trajectory. This significantly improves the FRA consistency and drive stability of the motor, and provides a stable hardware foundation for subsequent proportional-integral-derivative (PID) control algorithm debugging.
[0088] Those skilled in the art should understand that the embodiments of the present invention described above and shown in the accompanying drawings are merely examples and do not limit the present invention. The objectives of the present invention have been fully and effectively achieved. The functions and structural principles of the present invention have been demonstrated and explained in the embodiments, and any variations or modifications may be made to the implementation of the present invention without departing from the stated principles.
Claims
1. A camera module, characterized in that, include: The base includes a first side, a second side, a third side, and a fourth side; the first side and the third side are opposite to each other in the Y direction; the second side and the fourth side are opposite to each other in the X direction; the X direction and the Y direction are perpendicular. The lens carrier is movably mounted on the base to support the lens; A driving assembly for driving the lens carrier to move relative to the base; the driving assembly includes an image stabilization driving assembly, the image stabilization driving assembly including a third image stabilization coil; the third image stabilization coil is disposed on the third side; A support component is disposed between the base and the lens carrier for supporting the lens carrier; The support assembly includes a first type of damping adhesive, a first ball bearing, a second ball bearing, and a third ball bearing. The first ball bearing is disposed at a first corner between a first side and a second side of the base. The second ball bearing is disposed at a second corner between the second side and the third side. The third ball bearing is disposed at a third corner between the third side and the fourth side. The first type of damping adhesive is disposed outside the triangular support area formed by the first ball bearing, the second ball bearing, and the third ball bearing, and is located on the first side. The first type of damping adhesive includes a first damping adhesive, and the first damping adhesive and the first ball bearing are respectively located on both sides of the central axis in the Y direction of the first side.
2. The camera module according to claim 1, wherein, The drive assembly includes a bending circuit board; the bending circuit board is disposed around the lens carrier; a second type of damping adhesive is disposed between the lens carrier and the adjacent area of the bending portion of the bending circuit board.
3. The camera module according to claim 2, wherein, The second type of damping adhesive is applied to the bend opposite to the first type of damping adhesive.
4. The camera module according to claim 3, wherein, The bent circuit board includes a first circuit board segment, a second circuit board segment that bends horizontally relative to the first circuit board segment, a third circuit board segment that bends horizontally relative to the second circuit board segment, a fourth circuit board segment that bends downward relative to the first circuit board segment, a first bend extending between the first and second circuit board segments, a second bend extending between the second and third circuit board segments, and a third bend extending between the first and fourth circuit board segments; the first and third circuit board segments are opposite each other in the X direction; a second type of damping adhesive is disposed in the adjacent area of the first bend; the elastic coefficient of the first bend in the X direction and the elastic coefficient of the third bend in the Y direction are respectively smaller than the elastic coefficient of the third bend in the X direction and the elastic coefficient of the second bend in the X direction and the elastic coefficient of the third bend in the Y direction.
5. The camera module according to claim 4, wherein, The elastic coefficients of the second bending portion in the X direction and the Y direction are respectively smaller than those of the third bending portion in the X direction and the Y direction; the elastic coefficient of the third bending portion in the X direction is smaller than its elastic coefficient in the Y-axis direction.
6. The camera module according to claim 4, wherein, The elastic coefficient of the third bend in the X direction is less than its elastic coefficient in the Y-axis direction.
7. The camera module according to any one of claims 1-4, wherein, The image stabilization drive assembly further includes a first image stabilization coil and a second image stabilization coil; the first image stabilization coil and the second image stabilization coil are mounted on the base; and the first image stabilization coil and the second image stabilization coil are disposed on the second side.
8. The camera module according to claim 7, wherein, The first type of damping adhesive also includes a second damping adhesive, and the first damping adhesive and the second damping adhesive are symmetrical about the central axis in the Y direction of the first side.
9. The camera module according to claim 8, wherein, The distance between the first damping adhesive and the second damping adhesive is greater than or equal to 1 / 3 of the length of the first side, and less than or equal to 80% of the length of the first side.
10. The camera module according to claim 7, wherein, The drive assembly further includes an image stabilization circuit board, which is mounted on the upper surface of the base. The first image stabilization coil, the second image stabilization coil, and the third image stabilization coil are mounted on the image stabilization circuit board. A limiting groove is provided on the image stabilization circuit board and / or the lens carrier, and the first type of damping rubber is limited to the limiting groove.
11. The camera module according to claim 7, wherein, The base includes three ball grooves for accommodating balls; the drive assembly also includes a stabilization circuit board, which is mounted on the upper surface of the base. The first stabilization coil, the second stabilization coil, and the third stabilization coil are mounted on the stabilization circuit board, and the stabilization circuit board is embedded in the three ball grooves.
12. The camera module according to claim 2, wherein, The loss factor of the second type of damping adhesive is greater than that of the first type of damping adhesive.
13. The camera module according to claim 2, wherein, The storage modulus of the second type of damping adhesive is smaller than that of the first type of damping adhesive.
14. The camera module according to claim 2, wherein, The viscosity of the first type of damping adhesive is greater than that of the second type of damping adhesive.
15. The camera module according to claim 2, wherein, The cross-sectional area of a single second-type damping adhesive is smaller than the cross-sectional area of a single first-type damping adhesive.
16. The camera module according to claim 2, wherein, The thickness of the second type of damping adhesive is less than the thickness of the first type of damping adhesive.