Display device

Abstract

A display device includes: an electronic panel including a folded portion and a non-folded portion arranged in a first direction; a window disposed on the electronic panel; an adhesive layer disposed between the electronic panel and the window; and a first protective layer disposed between the adhesive layer and the electronic panel. The folded portion includes a first side and a second side opposite the first side in a second direction crossing the first direction. The first protective layer is disposed adjacent to the first side of the folded portion.

Description

[0001] Cross-reference to related applications

[0002] This patent application claims priority to Korean Patent Application No. 10-2024-0112772, filed on August 22, 2024, with the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] This disclosure relates to display devices and electronic devices including such display devices. Background Technology

[0004] Electronic devices that provide images to users (such as smartphones, digital cameras, laptops, navigation units, and smart TVs) include display devices for displaying images. The display device generates images and provides them to the user via its display screen.

[0005] In recent years, advancements in display device technology have spurred the development of various types of display devices. For example, flexible display devices, including foldable and rollable designs, are being introduced. These flexible display devices enhance portability and user convenience.

[0006] Foldable display devices consist of folding sections and non-folding sections. The folding sections are the segments of the display that bend when the device is folded or unfolded. These sections are made of flexible material. The non-folding sections are the rigid segments of the display that do not bend. These sections provide structural support for the device and house components such as display drivers and sensors.

[0007] Because the folding portion is flexible, it is easily damaged by external impacts. Therefore, there is a need to develop a display device that includes a folding portion with enhanced resistance. Summary of the Invention

[0008] This disclosure provides a display device including a folding portion with enhanced impact resistance and an electronic device including the display device.

[0009] An embodiment of the present invention provides a display device comprising: an electronic panel including a folded portion and a non-folded portion arranged in a first direction; a window disposed on the electronic panel; an adhesive layer disposed between the electronic panel and the window; and a first protective layer disposed between the adhesive layer and the electronic panel. The folded portion includes a first side and a second side opposite to the first side in a second direction intersecting the first direction. The first protective layer is adjacent to the first side of the folded portion.

[0010] The display device may further include a second protective layer, which is spaced apart from the first protective layer in the second direction and is configured to be adjacent to the second side between the adhesive layer and the electronic panel.

[0011] The first protective layer and the second protective layer may extend in the first direction.

[0012] In an embodiment, when viewed in a plane, the outward-facing edge of the first protective layer is spaced apart from the first side, and the outward-facing edge of the second protective layer is spaced apart from the second side.

[0013] In an embodiment, when viewed in the plane, the outward-facing edges of the first protective layer and the outward-facing edges of the second protective layer overlap with the two side surfaces of the adhesive layer that are opposite to each other in the second direction.

[0014] The first protective layer and the second protective layer may extend to the non-folded portion adjacent to the folded portion.

[0015] In an embodiment, the width of the first protective layer in the second direction and the width of the second protective layer in the second direction are each in the range of approximately 10% to approximately 15% of the width of the electronic panel in the second direction.

[0016] In a third direction perpendicular to the plane defined by the first and second directions, each of the first and second protective layers may have a first thickness smaller than the second thickness of the adhesive layer.

[0017] The first thickness may be in the range of approximately 10% to approximately 15% of the second thickness.

[0018] The first protective layer and the second protective layer can be in direct contact with the adhesive layer and are covered by the adhesive layer.

[0019] According to at least one of the above embodiments, the first protective layer and the second protective layer are respectively disposed on both sides of the folded portion of the electronic panel, and therefore, the thickness on both sides of the folded portion of the electronic panel is increased. Because the thickness on both sides of the folded portion of the electronic panel is increased, the rigidity of the folded portion is enhanced, and thus damage to the folded portion is prevented. Attached Figure Description

[0020] The foregoing features of this disclosure will become apparent when considered in conjunction with the accompanying drawings, and by referring to the following detailed description, in which:

[0021] Figure 1This is a perspective view of an electronic device according to an embodiment of the present disclosure;

[0022] Figure 2 yes Figure 1 A perspective view of the electronic device shown in a folded state;

[0023] Figure 3 This is a perspective view of an electronic device according to an embodiment of the present disclosure;

[0024] Figure 4 yes Figure 3 A perspective view of the electronic device shown in a folded state;

[0025] Figure 5 This is an exploded perspective view of an electronic device according to an embodiment of the present disclosure;

[0026] Figure 6 It is applied to Figure 1 A plan view of the display panel of the electronic device shown;

[0027] Figure 7 yes Figure 5 Block diagram of the electronic device shown;

[0028] Figure 8 It includes Figure 5 A cross-sectional view of the electronic panel of the display panel shown;

[0029] Figure 9 yes Figure 8 A cross-sectional view of the display panel shown;

[0030] Figure 10 Is with Figure 6 A cross-sectional view of the electronic panel corresponding to one pixel shown in the figure;

[0031] Figure 11 It is along Figure 6 The cross-sectional view taken by line I-I' shown in the figure;

[0032] Figure 12A It is along Figure 6 The cross-sectional view taken by line II-II' shown in the figure;

[0033] Figure 12B yes Figure 12A The bending area shown is a cross-sectional view in a folded state;

[0034] Figure 13 yes Figure 11 A perspective view of the support plate shown;

[0035] Figure 14 yes Figure 13 An enlarged plan view of region AA shown in the diagram;

[0036] Figure 15 yes Figure 11 The view shown is of the display device in a folded state;

[0037] Figure 16 yes Figure 11 A plan view of the electronic panel and the protective layer disposed on the electronic panel;

[0038] Figure 17 It is along Figure 16 The cross-sectional view taken by line III-III' shown;

[0039] Figures 18 to 22 This is a plan view of an electronic panel according to an embodiment of the present disclosure; and

[0040] Figure 23 It is an electronic device according to an embodiment of the present disclosure. Detailed Implementation

[0041] In this disclosure, it will be understood that when an element (or region, layer, or portion) is referred to as being "on", "connected to", or "coupled to" another element or layer, the element (or region, layer, or portion) may be directly on, directly connected to, or directly coupled to the other element or layer, or there may be an intermediary element or layer.

[0042] The same reference numerals always refer to the same elements. As used herein, the term "and / or" can include any and all combinations of one or more of the associated listed items.

[0043] It will be understood that although the terms first, second, etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. Thus, without departing from the teachings of this disclosure, the first element discussed below may be referred to as the second element. As used herein, unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “the” are also intended to include the plural forms.

[0044] For ease of description, spatial relative terms such as “below,” “under,” “down,” “above,” and “above” may be used herein to describe the relationship between one element or feature and another element or feature as shown in the accompanying drawings.

[0045] It will be further understood that, when used in this specification, the terms “comprising” and / or “including” indicate the presence of the stated features, integrals, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or groups thereof.

[0046] In the following description, embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0047] Embodiments of this disclosure relate to display devices with folding portions that enhance impact resistance and durability, particularly for foldable electronic devices. The display device includes folding and non-folding portions, and protective layers are strategically positioned to reinforce the structure and prevent damage from repeated folding and external impacts. These protective layers are placed adjacent to both sides of the folding portions and between the adhesive layer and the electronic panel, ensuring both flexibility and mechanical support. By increasing the thickness at the edges of the folding portions, the embodiments help reduce stress concentration, which in turn minimizes the risk of breakage or deformation over time.

[0048] Figure 1 This is a perspective view of an electronic device ED according to an embodiment of the present disclosure. Figure 2 yes Figure 1 The electronic device ED shown is in a folded state.

[0049] refer to Figure 1 The electronic device ED can have a rectangular planar shape defined by a long side extending in a first direction DR1 and a short side extending in a second direction DR2 intersecting the first direction DR1. However, the planar shape of the electronic device ED is not limited to a rectangular shape, and the electronic device ED can have various planar shapes such as circular shapes and other polygonal shapes. The electronic device ED can be a flexible display device.

[0050] In the following text, the direction substantially perpendicular to the plane defined by the first direction DR1 and the second direction DR2 may be referred to as the third direction DR3. In this disclosure, the expression "when viewed in a plane" may mean the state observed in the third direction DR3. Additionally, the term "overlap" may refer to a state in which components are arranged to overlap each other when viewed in a plane.

[0051] The electronic device ED may include a folded portion FA and multiple non-folded portions NFA1 and NFA2. The non-folded portions NFA1 and NFA2 may include a first non-folded portion NFA1 and a second non-folded portion NFA2. The folded portion FA may be disposed between the first non-folded portion NFA1 and the second non-folded portion NFA2. The first non-folded portion NFA1, the folded portion FA, and the second non-folded portion NFA2 may be arranged in a first direction DR1.

[0052] In this embodiment, a folded portion FA and two non-folded portions NFA1 and NFA2 are shown as a representative example; however, the number of folded portions FA and the number of non-folded portions NFA1 and NFA2 are not limited thereto. As an example, the electronic device ED may include more than two non-folded portions and multiple folded portions disposed between the non-folded portions.

[0053] The upper surface of the electronic device ED can be referred to as the display surface DS, and the display surface DS can be a plane defined by a first direction DR1 and a second direction DR2. The image IM generated by the electronic device ED can be provided to the user through the display surface DS.

[0054] The display surface DS may include a display area DA and a non-display area NDA surrounding the display area DA. The display area DA may display an image, while the non-display area NDA may not display an image. The non-display area NDA may surround or be adjacent to the display area DA, and may define an edge of the electronic device ED printed in a predetermined color.

[0055] The electronic device ED may include multiple sensors SN and at least one camera CM. The sensors SN and camera CM may be positioned adjacent to the edge of the electronic device ED. The sensors SN and camera CM may be located in the display area DA adjacent to the non-display area NDA. The sensors SN and camera CM may be located in the first non-folding portion NFA1. However, the positions of the sensors SN and camera CM are not limited to these.

[0056] As an example, each sensor SN can be a proximity sensor or an illumination sensor. However, sensor SNs are not limited to these. The camera CM can capture images of external objects.

[0057] refer to Figure 2 The electronic device ED can be a foldable electronic device ED that can be folded or unfolded. As an example, the folding portion FA can be folded relative to a folding axis FX that is substantially parallel to the second direction DR2, and therefore, the electronic device ED can be folded. The folding axis FX of the electronic device ED can be defined as a short axis that is substantially parallel to the short side of the electronic device ED. The electronic device ED can be folded relative to the folding axis FX that is substantially parallel to the short side.

[0058] When the electronic device ED is folded, it can fold inward (inward folding) such that the first non-folding portion NFA1 and the second non-folding portion NFA2 can face each other and the display surface DS is not exposed to the outside. However, this disclosure is not limited thereto. As an example, the electronic device ED can fold outward (outward folding) relative to the folding axis FX such that the display surface DS can be exposed to the outside.

[0059] Figure 3 This is a perspective view of an electronic device EDA according to an embodiment of the present disclosure, and Figure 4 yes Figure 3 The electronic device EDa shown is in a folded state.

[0060] refer to Figure 3 The electronic device EDa may have a quadrilateral planar shape defined by a short side extending in a first direction DR1 and a long side extending in a second direction DR2 intersecting the first direction DR1.

[0061] The electronic device EDa may include a first non-folding portion NFA1, a folding portion FA, and a second non-folding portion NFA2 arranged in a first direction DR1.

[0062] The upper surface of the electronic device EDa can be referred to as the display surface DS, and the image IM generated by the electronic device EDa can be provided to the user through the display surface DS.

[0063] With electronic devices ED (reference) Figure 1 Similarly, the electronic device EDa may include at least one sensor SN and at least one camera CM.

[0064] refer to Figure 4 The electronic device EDa can be a foldable electronic device EDa that can be folded or unfolded. As an example, the folding portion FA can be folded relative to a folding axis FX' that is substantially parallel to the second direction DR2, and therefore, the electronic device EDa can be folded. Figure 2 The folding axis FX of the electronic device ED shown can be a short axis substantially parallel to the short side of the electronic device ED. However, Figure 4 The folding axis FX' of the electronic device EDa shown can be a long axis that is substantially parallel to the long side of the electronic device EDa.

[0065] The distance between the first non-folding portion NFA1 and the second non-folding portion NFA2 can be less than the diameter of the circle defined by the radius of curvature R of the folding portion FA. Therefore, the folding portion FA can be folded into a dumbbell shape. Thus, the distance between the first non-folding portion NFA1 and the second non-folding portion NFA2 can be reduced. The electronic device ED can also be folded into a dumbbell shape. In the following text, Figure 1 and Figure 2 The electronic device ED shown will be described as a representative example. Furthermore, components of this disclosure will be described based on an electronic device ED folded into a dumbbell shape.

[0066] Figure 5 This is an exploded perspective view of an electronic device ED according to an embodiment of the present disclosure.

[0067] refer to Figure 5 The electronic device ED may include a display device DD, a camera CM, and a sensor SN. The display device DD includes a display module DM and a support plate PLT. The electronic device ED may also include an electronic module EM (e.g., electronic circuitry), a power supply module PSM (e.g., power supply circuitry), and housings EDC1 and EDC2. The electronic device ED may also include mechanical structures (e.g., hinge structures) to control the folding operation of the electronic device ED.

[0068] The electronic device ED may include a display device DD having a first aperture H1, which is defined through the display device DD to transmit optical signals. The first aperture H1 and a second aperture H2 may be defined through the display device DD. A camera CM may be disposed in the first aperture H1, and a sensor SN may be disposed in the second aperture H2.

[0069] The electronic module (EM) and power supply module (PSM) can be located below the display device (DD). The EM and PSM can be connected to each other via a flexible circuit board. The EM controls the operation of the display device (DD). The PSM supplies power to the display device (DD).

[0070] Housings EDC1 and EDC2 can house the display device DD, camera CM, sensor SN, electronic module EM, and power supply module PSM. Housings EDC1 and EDC2 can be divided into two parts, such as a first housing EDC1 and a second housing EDC2, to allow for the folding of the electronic device ED. The structure of the first housing EDC1 and the second housing EDC2 facilitates the folding operation of the electronic device ED. Housings EDC1 and EDC2 protect the display device DD, camera CM, sensor SN, electronic module EM, and power supply module PSM.

[0071] Figure 6 It is applied to Figure 1 The diagram shows a plan view of the display panel DP of the electronic device ED.

[0072] refer to Figure 6 The electronic device ED may include a display panel DP, a scan driver SDV (e.g., a first driver circuit), a data driver DDV (e.g., a second driver circuit), and a transmit driver EDV (e.g., a third driver circuit).

[0073] Display panel DP can be a light-emitting display panel, but is not limited to this. As an example, display panel DP can be an organic light-emitting display panel or an inorganic light-emitting display panel. The light-emitting layer of an organic light-emitting display panel may include organic light-emitting materials. The light-emitting layer of an inorganic light-emitting display panel may include quantum dots or quantum rods. In the following, organic light-emitting display panels will be described as representative examples of display panel DPs.

[0074] The display panel DP can be a flexible display panel. As an example, the display panel DP may include a flexible substrate and a plurality of electronic components disposed on the flexible substrate. The display panel DP may extend longer in a first direction DR1 than in a second direction DR2. The display panel DP may include a plane defined by the first direction DR1 and the second direction DR2.

[0075] The display panel DP may include a first region AA1, a second region AA2, and a bent region BA defined between the first region AA1 and the second region AA2. The bent region BA may extend in a second direction DR2, and the first region AA1, the bent region BA, and the second region AA2 may be arranged in a first direction DR1.

[0076] The first region AA1 may include long sides that extend in the first direction DR1 and are spaced apart from each other in the second direction DR2. In the second direction DR2, the bending region BA and the second region AA2 may have a length smaller than that of the first region AA1.

[0077] The first region AA1 may include a display region DA and a non-display region NDA surrounding the display region DA. The non-display region NDA may surround the display region DA. The display region DA may be the area in which an image is displayed, and the non-display region NDA may be the area in which no image is displayed. The second region AA2 and the bending region BA may be the areas in which no image is displayed. The sensor SN and the camera CM may be located within the display region DA.

[0078] The first region AA1 may include a first non-folding portion NFA1, a second non-folding portion NFA2, and a folding portion FA defined between the first non-folding portion NFA1 and the second non-folding portion NFA2. The first non-folding portion NFA1, the folding portion FA, and the second non-folding portion NFA2 of the display panel DP may respectively be connected to… Figure 1 The first non-folding portion NFA1, the folding portion FA, and the second non-folding portion NFA2 of the electronic device ED shown correspond to each other.

[0079] The display panel DP may include multiple pixels PX, multiple scan lines SL1 to SLm (or gate lines), multiple data lines DL1 to DLn, multiple emitter lines EL1 to ELm, a first control line CSL1 and a second control line CSL2, a first power line PL1, a second power line PL2, multiple connection lines CNL, and multiple pads PD. Each of m and n is a natural number greater than 0. Pixels PX may be arranged in the display area DA and may be connected to scan lines SL1 to SLm, data lines DL1 to DLn, and emitter lines EL1 to ELm.

[0080] The scan driver (SDV) and transmit driver (EDV) can be located in the non-display area (NDA). The scan driver (SDV) and transmit driver (EDV) can be located in the non-display area (NDA) adjacent to both sides of the first area (AA1), respectively. The data driver (DDV) can be located in the second area (AA2). The data driver (DDV) can be manufactured as an integrated circuit chip and can be installed in the second area (AA2).

[0081] Scan lines SL1 to SLm can extend in a direction parallel to the second direction DR2 and can be connected to the scan driver SDV. Data lines DL1 to DLn can extend in the first direction DR1 and can be connected to the data driver DDV via the bend area BA. Transmit lines EL1 to ELm can extend in the second direction DR2 and can be connected to the transmit driver EDV.

[0082] The first power line PL1 can extend along the first direction DR1 and can be located in the non-display area NDA. The first power line PL1 can be located between the display area DA and the transmit driver EDV, but is not limited thereto. That is, the first power line PL1 can be located between the display area DA and the scan driver SDV.

[0083] The first electric field line PL1 can extend to the second region AA2 via the bend region BA. When viewed in a plane, the first electric field line PL1 can extend to the lower end of the second region AA2. The first electric field line PL1 can receive a first voltage.

[0084] The second power line PL2 can be located in the non-display area NDA adjacent to the long side of the first area AA1. The second power line PL2 can be located outside the scan driver SDV and the transmit driver EDV.

[0085] The second power line PL2 can extend towards the second region AA2 via the bending region BA. Multiple portions of the second power line PL2 can extend in the second region AA2 along the first direction DR1, and the data driver DDV is located between these multiple portions of the second power line PL2. When viewed in a plane, the second power line PL2 can extend to the lower end of the second region AA2.

[0086] The second power line PL2 can receive a second voltage having a lower level (or voltage level) than the first voltage. The second power line PL2 can extend toward the display area DA and can be connected to the pixel PX, and the second voltage can be applied to the pixel PX via the second power line PL2.

[0087] The connecting line CNL can extend in the second direction DR2 and can be arranged in the first direction DR1. The connecting line CNL can be connected to the first power line PL1 and the pixel PX. A first voltage can be applied to the pixel PX via the first power line PL1 and the connecting line CNL connected to the first power line PL1.

[0088] The first control line CSL1 can be connected to the scan driver SDV and can extend through the bend area BA towards the lower end of the second area AA2. The second control line CSL2 can be connected to the transmit driver EDV and can extend through the bend area BA towards the lower end of the second area AA2. The data driver DDV can be positioned between the first control line CSL1 and the second control line CSL2.

[0089] When viewed in a plane, pad PD can be positioned adjacent to the lower end of the second region AA2. Data driver DDV, first power line PL1, second power line PL2, first control line CSL1, and second control line CSL2 can be connected to pad PD.

[0090] Data lines DL1 to DLn can be connected to the corresponding pads PD via the data driver DDV. As an example, data lines DL1 to DLn can be connected to the data driver DDV, and the data driver DDV can be connected to the pads PD corresponding to the data lines DL1 to DLn.

[0091] The electronic device ED may include a printed circuit board (PCB) connected to a pad (PD). The pad PCB-PD may be disposed on the printed circuit board (PCB) and may be connected to the pad PD.

[0092] The timing controller can be mounted on a printed circuit board (PCB). It can be connected to pads (PD) via the PCB. The timing controller controls the operation of the scan driver (SDV), data driver (DDV), and transmit driver (EDV). It can generate scan control signals, data control signals, and transmit control signals in response to control signals applied externally.

[0093] The scan control signal can be applied to the scan driver SDV via the first control line CSL1. The transmit control signal can be applied to the transmit driver EDV via the second control line CSL2. The data control signal can be applied to the data driver DDV. The timing controller can receive image signals from the outside, convert the image signal data format into a data format suitable for the interface between the timing controller and the data driver DDV, and provide the converted image signal to the data driver DDV.

[0094] The scan driver SDV can generate multiple scan signals in response to scan control signals. These scan signals can be applied to pixels PX via scan lines SL1 to SLm. The scan signals can be applied to pixels PX sequentially.

[0095] The data driver DDV can generate multiple data voltages corresponding to the image signal in response to the data control signal. These data voltages can be applied to pixel PX via data lines DL1 to DLn. The transmit driver EDV can generate multiple transmit signals in response to the transmit control signal. These transmit signals can be applied to pixel PX via transmit lines EL1 to ELm.

[0096] Pixel PX can receive data voltage in response to a scan signal. Pixel PX can emit light with a brightness corresponding to the data voltage in response to a transmit signal, and therefore, an image can be displayed. The emission time of pixel PX can be controlled by the transmit signal.

[0097] The voltage generator can be mounted on a printed circuit board (PCB). The voltage generator can be connected to pads (PD) via the PCB. The voltage generator can generate a first voltage and a second voltage. The first voltage and the second voltage can be applied to a first power line PL1 and a second power line PL2, respectively.

[0098] Each of the plurality of pixels PX may include a light-emitting element. A first voltage may be applied to the anode of the light-emitting element, and a second voltage may be applied to the cathode of the light-emitting element. The light-emitting element may be driven in response to the first voltage and the second voltage.

[0099] Figure 7 yes Figure 5 The block diagram of the electronic device ED shown is shown.

[0100] refer to Figure 7 The electronic device ED may include an electronic module EM, a power supply module PSM, a display device DD, and an electro-optical module ELM. The electronic module EM may include a control module 10 (e.g., a control circuit), a wireless communication module 20 (e.g., a wireless communication circuit), an image input module 30 (e.g., a first input circuit), an audio input module 40 (e.g., a second input circuit), an audio output module 50 (e.g., an output circuit), a memory 60, and an external interface module 70 (e.g., an interface circuit). The display device DD may include a display module DM and a support board PLT. The control module 10, wireless communication module 20, image input module 30, audio input module 40, audio output module 50, memory 60, and external interface module 70 may be mounted on a circuit board for electrical interconnection, or may be electrically interconnected via a flexible circuit board. The electronic module EM may be electrically connected to the power supply module PSM.

[0101] The control module 10 can control the overall operation of the electronic device ED. For example, the control module 10 can activate or disable the display device DD in response to user input. The control module 10 can also control other modules such as the image input module 30, the audio input module 40, or the audio output module 50 in response to user input. The control module 10 may include at least one microprocessor.

[0102] The wireless communication module 20 can use Bluetooth or Wi-Fi links to send / receive wireless signals to other terminals. The wireless communication module 20 can use a universal communication cable to send / receive voice signals. The wireless communication module 20 may include a transmitting circuit 22 and a receiving circuit 24. The transmitting circuit 22 modulates the signal to be transmitted and transmits the modulated signal, while the receiving circuit 24 demodulates the signal applied to it.

[0103] The image input module 30 can process image signals and convert them into image data that can be displayed on the display device DD. The audio input module 40 can receive external sound signals via a microphone in recording mode or voice recognition mode and convert the external sound signals into electronic voice data. The audio output module 50 can convert sound data provided to it by the wireless communication module 20 or sound data stored in the memory 60 and output the converted sound data.

[0104] The external interface module 70 can be used as an interface between the control module 10 and external devices such as an external charger, a wired / wireless data port, a card (e.g., a memory card and a SIM / UIM card) slot) or the like.

[0105] A power supply module (PSM) provides the power required for the overall operation of an electronic device (ED). A PSM may include conventional battery devices.

[0106] An electro-optic module (ELM) can be an electronic component that transmits or receives optical signals. The ELM can transmit or receive optical signals through a portion of the display device (DD). In this embodiment, the ELM may include a camera module (CAM) and a sensor module (SNM). The camera module (CAM) may include... Figure 5 The camera CA shown is illustrated. The sensor module SNM may include... Figure 5 The sensor SN shown is shown.

[0107] An electro-optical module (ELM) can include a camera module (CAM) and a sensor module (SNM), and as... Figure 5 As shown, the camera CM and sensor SN can be positioned below the display device DD. Therefore, the electro-optical module ELM can be positioned below the display device DD and can be used with, for example... Figure 5 The first hole H1 and the second hole H2 shown in the figure overlap.

[0108] Figure 8 It includes Figure 5 The cross-sectional view of the electronic panel EP of the display panel DP shown is shown, and Figure 9 yes Figure 8 The diagram shows a cross-sectional view of the display panel DP.

[0109] Figure 8 and Figure 9 The cross sections of the electronic panel EP and the display panel DP are shown when viewed in the first direction DR1.

[0110] refer to Figure 8 The electronic panel EP may include a display panel DP, an input sensing component ISP disposed on the display panel DP, and an anti-reflective layer RPL disposed on the input sensing component ISP.

[0111] An input sensing component (ISP) may include multiple sensing electrodes operated using capacitive methods. An input sensing component (ISP) may also include multiple pen sensing electrodes operated using electromagnetic methods. When manufacturing an electronic panel (EP), the input sensing component (ISP) can be directly fabricated on the display panel (DP).

[0112] When manufacturing an electronic panel (EP), the anti-reflective layer (RPL) can be formed directly on the input sensing component (ISP), but is not limited to this. According to an embodiment, the anti-reflective layer (RPL) is attached to the input sensing component (ISP) via an adhesive layer after being manufactured separately.

[0113] An anti-reflective layer (RPL) can be defined as an external light reflection prevention film. The RPL reduces the reflectivity of external light incident on the display panel (DP) from above the electronic device (ED).

[0114] refer to Figure 9 The display panel DP may include a substrate SUB, a circuit element layer DP-CL disposed on the substrate SUB, a display element layer DP-OLED disposed on the circuit element layer DP-CL, and a thin film encapsulation layer TFE disposed on the display element layer DP-OLED.

[0115] The substrate SUB may include a display area DA and a non-display area NDA surrounding or adjacent to the display area DA. The display area DA may be... Figure 1 The electronic device ED shown corresponds to the display area DA, and the non-display area NDA can be associated with... Figure 1 The non-display area NDA corresponds to the electronic device ED shown. The substrate SUB can include glass or a flexible plastic material such as polyimide (PI). The display element layer DP-OLED can be disposed in the display area DA.

[0116] Pixel PX (reference) Figure 6 The components can be disposed in the circuit element layer DP-CL and the display element layer DP-OLED. Each of the multiple pixels PX may include a transistor disposed in the circuit element layer DP-CL and a light-emitting element disposed in the display element layer DP-OLED and connected to the transistor.

[0117] A thin-film encapsulation layer (TFE) can be applied to the circuit element layer (DP-CL) to cover the display element layer (DP-OLED). The TFE protects the pixel (PX) from moisture, oxygen, and foreign substances.

[0118] Figure 10 Is with Figure 6 The image shows a cross-sectional view of the electronic panel EP corresponding to one pixel PX.

[0119] refer to Figure 10 The display panel DP may include pixels PX, and the pixels PX may include transistors TR and light-emitting elements OLED. The light-emitting element OLED may include a first electrode (or anode) AE, a second electrode (or cathode) CE, a hole control layer HCL, an electron control layer ECL, and a light-emitting layer EML.

[0120] Transistor TRs and light-emitting elements (OLEDs) can be mounted on a substrate SUB. As an example, in... Figure 10 The diagram shows a transistor TR; however, a pixel PX may include multiple transistors and at least one capacitor to drive the light-emitting element OLED.

[0121] The display area DA can include a light-emitting area PA corresponding to each pixel PX and a non-light-emitting area NPA surrounding the light-emitting area PA. The light-emitting element OLED can be disposed in the light-emitting area PA.

[0122] The buffer layer (BFL) can be disposed on the substrate (SUB), and the buffer layer (BFL) can be an inorganic layer. A semiconductor pattern can be disposed on the buffer layer (BFL). The semiconductor pattern can include polycrystalline silicon, amorphous silicon, or metal oxide.

[0123] Semiconductor patterns can be doped with N-type or P-type dopants. Semiconductor patterns can include highly doped and lightly doped regions. The highly doped region can have a higher conductivity than the lightly doped region and can essentially serve as the source electrode (or source S) and drain electrode (or drain D) of a transistor TR. The lightly doped region can essentially correspond to the active portion A (or channel) of the transistor TR.

[0124] The source S, active portion A (or active region), and drain D of transistor TR can be formed from a semiconductor pattern. A first insulating layer INS1 can be disposed on the semiconductor pattern. The gate G of transistor TR can be disposed on the first insulating layer INS1. A second insulating layer INS2 can be disposed on the gate G. A third insulating layer INS3 can be disposed on the second insulating layer INS2.

[0125] The connecting electrode CNE may include a first connecting electrode CNE1 and a second connecting electrode CNE2 to connect the transistor TR to the light-emitting element OLED. The first connecting electrode CNE1 may be disposed on the third insulating layer INS3 and may be connected to the drain electrode D via a first contact hole CH1 defined through the first insulating layer INS1, the second insulating layer INS2 and the third insulating layer INS3.

[0126] A fourth insulating layer INS4 may be disposed on the first connecting electrode CNE1. A fifth insulating layer INS5 may be disposed on the fourth insulating layer INS4. A second connecting electrode CNE2 may be disposed on the fifth insulating layer INS5. The second connecting electrode CNE2 may be connected to the first connecting electrode CNE1 via a second contact hole CH2 defined through the fourth insulating layer INS4 and the fifth insulating layer INS5.

[0127] The sixth insulating layer INS6 can be disposed on the second connection electrode CNE2. The entire structure from the buffer layer BFL to the sixth insulating layer INS6 can be defined as the circuit element layer DP-CL. Each of the first insulating layers INS1 to the sixth insulating layer INS6 can be an inorganic layer or an organic layer.

[0128] A first electrode AE ​​can be disposed on a sixth insulating layer INS6. The first electrode AE ​​can be connected to a second connecting electrode CNE2 via a third contact hole CH3 defined through the sixth insulating layer INS6. A pixel defining layer PDL can be disposed on the first electrode AE ​​and the sixth insulating layer INS6. The pixel defining layer PDL can be provided with a pixel opening PX_OP defined therethrough to expose a predetermined portion of the first electrode AE.

[0129] The hole control layer (HCL) can be disposed on the first electrode (AE) and the pixel definition layer (PDL). The hole control layer (HCL) may include a hole transport layer and a hole injection layer.

[0130] The emissive layer (EML) can be disposed on the hole control layer (HCL). The EML can be disposed in the region corresponding to the pixel aperture (PX_OP). The EML can include organic and / or inorganic materials. The EML can produce light of one of the colors red, green, and blue.

[0131] The electron control layer (ECL) can be disposed on the light-emitting layer (EML) and the hole control layer (HCL). The ECL may include an electron transport layer and an electron injection layer. The hole control layer (HCL) and the ECL can be commonly disposed in the light-emitting region (PA) and the non-light-emitting region (NPA).

[0132] The second electrode CE can be disposed on the electronic control layer ECL. The second electrode CE can be disposed in a common area across the pixel PX. The layer in which the light-emitting element OLED is disposed can be called the display element layer DP-OLED.

[0133] A thin-film encapsulation layer (TFE) can be disposed on the second electrode (CE) to cover the pixel (PX). The thin-film encapsulation layer (TFE) may include a first encapsulation layer (EN1) disposed on the second electrode (CE), a second encapsulation layer (EN2) disposed on the first encapsulation layer (EN1), and a third encapsulation layer (EN3) disposed on the second encapsulation layer (EN2).

[0134] The first encapsulation layer EN1 and the third encapsulation layer EN3 may include inorganic insulating layers and can protect the pixel PX from moisture and oxygen. The second encapsulation layer EN2 may include organic insulating layers and can protect the pixel PX from foreign substances such as dust particles.

[0135] A first voltage can be applied to the first electrode AE ​​via transistor TR, and a second voltage having a voltage level lower than the first voltage can be applied to the second electrode CE. Holes and electrons injected into the light-emitting layer EML can recombine to generate excitons, and the light-emitting element OLED can emit light by excitons returning (or transitioning) from the excited state to the ground state.

[0136] The layer from the substrate (SUB) to the thin-film encapsulation layer (TFE) can be defined as the display panel (DP). The input sensing element (ISP) can be disposed on the thin-film encapsulation layer (TFE). The input sensing element (ISP) can be directly fabricated on the upper surface of the thin-film encapsulation layer (TFE).

[0137] The substrate layer BS can be disposed on the thin-film encapsulation layer TFE. The substrate layer BS may include an inorganic insulating layer. At least one inorganic insulating layer can be provided as the substrate layer BS on the thin-film encapsulation layer TFE.

[0138] The input sensing component (ISP) may include a first conductive pattern CTL1 and a second conductive pattern CTL2 disposed on the first conductive pattern CTL1. The first conductive pattern CTL1 may be disposed on a substrate layer BS. An insulating layer TINS ​​may be disposed on the substrate layer BS to cover the first conductive pattern CTL1. The insulating layer TINS ​​may include an inorganic insulating layer or an organic insulating layer. The second conductive pattern CTL2 may be disposed on the insulating layer TINS.

[0139] The first conductive pattern CTL1 and the second conductive pattern CTL2 may overlap with the non-light-emitting region NPA. Although not shown in the figures, the first conductive pattern CTL1 and the second conductive pattern CTL2 may be disposed in the non-light-emitting region NPA between the light-emitting regions PA, and may have a grid shape.

[0140] The first conductive pattern CTL1 and the second conductive pattern CTL2 can form the sensing electrodes and pen sensing electrodes of the input sensing component (ISP). As an example, the first conductive pattern CTL1 and the second conductive pattern CTL2, which have a grid shape, can be separated from each other in a predetermined area to form the sensor and pen sensing electrodes. A portion of the second conductive pattern CTL2 can be connected to the first conductive pattern CTL1.

[0141] An anti-reflective layer RPL can be disposed on a second conductive pattern CTL2. The anti-reflective layer RPL may include a black matrix BM and multiple color filters CF. The black matrix BM may overlap with the non-emitting region NPA, and the color filters CF may overlap with the emitting region PA, respectively.

[0142] A black matrix BM can be disposed on an insulating layer TINS ​​to cover a second conductive pattern CTL2. The black matrix BM can be provided with a black matrix opening B_OP defined therethrough, overlapping with the light-emitting region PA and the pixel opening PX_OP. The black matrix BM can absorb and block light. The width of the black matrix opening B_OP can be greater than the width of the pixel opening PX_OP.

[0143] Color filters (CF) can be placed on the insulating layer (TINS) and the black matrix (BM). Color filters (CF) can also be placed within the openings (B_OP) of the black matrix. Planarized insulating layer (PINS) can be placed on the color filters (CF). Planarized insulating layer (PINS) provides a flat top surface.

[0144] If external light incident on the display panel DP is reflected by the mirror-like display panel DP and then delivered to the user, the user may perceive the external light. To prevent this, the anti-reflective layer RPL may include a color filter CF that displays the same color as the pixel PX. The color filter can filter the external light to have the same color as the pixel PX. In this case, the external light may not be perceived by the user.

[0145] However, this disclosure is not limited thereto, and the antireflective layer RPL may include a polarizing film to reduce the reflectivity of external light. The polarizing film may be attached to the input sensing element ISP via an adhesive layer after being manufactured separately. The polarizing film may include a retarder and / or a polarizer.

[0146] Figure 11 It is along Figure 6 The cross-sectional view shown is taken by line I-I'.

[0147] As an example, Figure 11 Show along Figure 6 The cross section of the display module DM and the cross section of the components set below the display module DM are captured by line I-I'.

[0148] refer to Figure 11 The display device DD may include a display module DM, a support plate PLT, and a cover layer COV. The display module DM may include a hard coating layer HC, a printed layer PIT, a window WIN, a window protective layer WP, an electronic panel EP, a panel protective layer PPL, and a barrier layer BRL. The display device DD may include a first adhesive layer AL1, a second adhesive layer AL2, a third adhesive layer AL3, a fourth adhesive layer AL4, and a fifth adhesive layer AL5 to attach the above components to each other.

[0149] In this embodiment, the display module DM includes a first non-foldable portion NFA1, a foldable portion FA, and a second non-foldable portion NFA2. When the foldable portion FA is relative to the folding axis FX (reference...) Figure 2 When folded, the display module DM can be folded.

[0150] A window (WIN) can be disposed on an electronic panel (EP). The window (WIN) can protect the electronic panel (EP) from objects that could cause scratches. The window (WIN) can be optically transparent. The window (WIN) can include, but is not limited to, glass materials. According to an embodiment, the window (WIN) includes a synthetic resin film.

[0151] A window WIN can have a single-layer or multi-layer structure. As an example, a window WIN may include multiple synthetic resin films or glass substrates attached to each other by an adhesive and a synthetic resin film attached to the glass substrate by an adhesive.

[0152] A window protective layer WP can be applied to the window WIN. The window protective layer WP can include flexible plastic materials such as polyimide (PI) or polyethylene terephthalate (PET). A hard coating layer HC can be applied to the window protective layer WP.

[0153] The printed layer PIT can be disposed on the lower surface of the window protective layer WP. The printed layer PIT can be black, but is not limited to this. The printed layer PIT can be disposed adjacent to the edge of the window protective layer WP.

[0154] A panel protective layer (PPL) can be disposed beneath the electronic panel (EP). The PPL protects the lower portion of the electronic panel (EP). The PPL can comprise a flexible plastic material. As an example, the PPL can comprise polyethylene terephthalate (PET).

[0155] A barrier layer (BRL) can be placed beneath the panel protective layer (PPL). The BRL improves resistance to compressive forces caused by external pressure. Therefore, the BRL prevents deformation of the electronic panel (EP). The BRL can comprise flexible plastic materials such as polyimide or polyethylene terephthalate.

[0156] The barrier layer (BRL) can have a color that absorbs light. As an example, the barrier layer (BRL) can be black. Therefore, when the display module (DM) is viewed from above, the components located under the barrier layer (BRL) can be invisible to the user.

[0157] A first adhesive layer AL1 can be disposed between the window WIN and the electronic panel EP. The window WIN can be attached to the electronic panel EP via the first adhesive layer AL1. The extension length of the first adhesive layer AL1 in the first direction DR1 can be substantially the same as the extension length of the window WIN in the first direction DR1. In an embodiment, the side surface of the first adhesive layer AL1 is aligned with the side surface of the window WIN. For example, when viewed from the side, the edges of both the first adhesive layer AL1 and the window WIN can coincide or be positioned in the same plane. Figure 11The diagram shows a structure in which the first adhesive layer AL1 is aligned with the window WIN when viewed in cross-section. However, in another embodiment, the first adhesive layer AL1 may be further recessed in a direction parallel to the first direction DR1, as long as the first adhesive layer AL1 remains positioned between the window WIN and the electronic panel EP to ensure the attachment of the window WIN. For example, in this configuration, the side surface of the window WIN may extend beyond the side surface of the first adhesive layer AL1 in a direction parallel to the first direction DR1.

[0158] The second adhesive layer AL2 can be disposed between the window WIN and the window protective layer WP. The window WIN can be attached to the window protective layer WP through the second adhesive layer AL2. The second adhesive layer AL2 can cover the printed layer PIT.

[0159] The third adhesive layer AL3 can be disposed between the electronic panel EP and the panel protective layer PPL. The panel protective layer PPL can be attached to the electronic panel EP through the third adhesive layer AL3.

[0160] The fourth adhesive layer AL4 can be disposed beneath the panel protective layer PPL. The fourth adhesive layer AL4 can be disposed between the panel protective layer PPL and the barrier layer BRL. The barrier layer BRL can be attached to the panel protective layer PPL via the fourth adhesive layer AL4.

[0161] A fifth adhesive layer AL5 may be disposed below the barrier layer BRL. The fifth adhesive layer AL5 may be disposed between the barrier layer BRL and the support plate PLT. The support plate PLT can be attached to the barrier layer BRL via the fifth adhesive layer AL5. In an embodiment, the fifth adhesive layer AL5 is disposed in an area that does not overlap with the curved portion CSP. For example, the fifth adhesive layer AL5 may be disposed in an area adjacent to the curved portion CSP while remaining separate from it. The portion of the fifth adhesive layer AL5 that overlaps with the curved portion CSP may be open. For example, the fifth adhesive layer AL5 may include separate segments positioned on both sides of the curved portion CSP, thereby leaving an opening area in the area corresponding to the curved portion CSP.

[0162] The first adhesive layer AL1 to the fifth adhesive layer AL5 may include, but are not limited to, transparent adhesives such as pressure-sensitive adhesive (PSA) or optically transparent adhesive (OCA).

[0163] The support plate (PLT) can be positioned below the display module (DM) and can support the display module DM. The support plate (PLT) can include non-metallic materials. As an example, the support plate (PLT) can include fiber-reinforced composite materials. Fiber-reinforced composite materials can include carbon fiber reinforced plastic (CFRP) or glass fiber reinforced plastic (GFRP).

[0164] Because the support plate PLT comprises fiber-reinforced composite material, it can be lightweight. Since the support plate PLT comprises fiber-reinforced composite material, it can have a lighter weight compared to a metal support plate made of metallic materials, and can have a modulus and strength level similar to that of a metal support plate.

[0165] Furthermore, since the support plate PLT comprises fiber-reinforced composite material, its shape processing can be simpler compared to that of a metal support plate. For example, a support plate PLT comprising fiber-reinforced composite material can be processed using laser technology or micro-blasting technology.

[0166] In this embodiment, multiple openings (POPs) exist in the portion of the support plate PLT that overlaps with the folded portion FA. The openings (POPs) can be formed to extend through this portion of the support plate PLT in a third-direction DR3. The openings (POPs) can be formed using a laser process or a microblasting process. The openings (POPs) can be evenly spaced apart from each other.

[0167] The support plate PLT may include a first support plate PLT1, a second support plate PLT2, and a support folding portion PLT_F. As an example, the boundaries of the first support plate PLT1, the second support plate PLT2, and the support folding portion PLT_F are as follows: Figure 11 The lines shown are depicted as dashed lines.

[0168] The supporting folding portion PLT_F can be disposed between the first supporting plate PLT1 and the second supporting plate PLT2. The first supporting plate PLT1, the supporting folding portion PLT_F, and the second supporting plate PLT2 can be arranged in the first direction DR1. An opening POP can exist in the supporting folding portion PLT_F. The opening POP can be a through hole in the supporting folding portion PLT_F.

[0169] In this disclosure, the term "overlap" can refer to a state in which components of a display device are arranged to overlap each other when viewed in a plane.

[0170] A first support plate PLT1 can be disposed in the first non-folded portion NFA1 and can overlap with the first non-folded portion NFA1. A second support plate PLT2 can be disposed in the second non-folded portion NFA2 and can overlap with the second non-folded portion NFA2. A support plate PLT_F for the folded portion can be disposed in the folded portion FA and can overlap with the folded portion FA.

[0171] In this embodiment, the supporting folding portion PLT_F includes a curved portion CSP, a first extension portion EX1, a second extension portion EX2, a first reverse curvature portion ICV1, and a second reverse curvature portion ICV2. The boundaries between the curved portion CSP, the first extension portion EX1, the second extension portion EX2, the first reverse curvature portion ICV1, and the second reverse curvature portion ICV2 are as follows: Figure 11 The diagram shown is drawn with dashed lines. For clarity, the dashed lines extend upwards to... Figure 11 The reference numerals for these components are depicted on the upper side of the display module DM.

[0172] The curved portion CSP, the first extension portion EX1, the second extension portion EX2, the first reverse curvature portion ICV1, and the second reverse curvature portion ICV2 can be arranged in the first direction DR1. As an example, the curved portion CSP can be located at the center of the supporting folded portion PLT_F. The first reverse curvature portion ICV1 can be defined as the portion of the supporting folded portion PLT_F adjacent to the first support plate PLT1. The second reverse curvature portion ICV2 can be defined as the portion of the supporting folded portion PLT_F adjacent to the second support plate PLT2.

[0173] The curved portion CSP can be disposed between the first extension EX1 and the second extension EX2. An opening POP can be defined to pass through the curved portion CSP. For example, a through hole can exist in the curved portion CSP. When the supporting folding portion PLT_F is folded, the curved portion CSP can be bent to have a predetermined curvature. Because the opening POP is defined to pass through the curved portion CSP, the flexibility of the curved portion CSP can be increased. Therefore, the curved portion CSP can be folded more easily.

[0174] The first extension EX1 can be disposed between the first reverse curvature portion ICV1 and the curved portion CSP. The second extension EX2 can be disposed between the second reverse curvature portion ICV2 and the curved portion CSP.

[0175] The first reverse curvature portion ICV1 can be disposed between the first support plate PLT1 and the bent portion CSP. Specifically, the first reverse curvature portion ICV1 can be disposed between the first support plate PLT1 and the first extension portion EX1. The second reverse curvature portion ICV2 can be disposed between the second support plate PLT2 and the bent portion CSP. Specifically, the second reverse curvature portion ICV2 can be disposed between the second support plate PLT2 and the second extension portion EX2.

[0176] The cover layer COV can be disposed below the support plate PLT. In an embodiment, the cover layer COV covers the opening POP defined by the support plate PLT below the support plate PLT. The cover layer COV can overlap with the curved portion CSP that supports the folded portion PLT_F. The cover layer COV can contact the lower surface of the curved portion CSP through which the opening POP is formed.

[0177] In this embodiment, the cover layer COV has a lower elastic modulus than the support plate PLT. As an example, the cover layer COV may comprise thermoplastic polyurethane or rubber, but is not limited thereto. The cover layer COV may be manufactured in sheet form and may be attached to the support plate PLT.

[0178] Figure 12A It is along Figure 6 The cross-sectional view taken by line II-II' shown, and Figure 12B yes Figure 12A The diagram shows a cross-sectional view of the folded region BA.

[0179] Despite the panel protective layer PPL and the third adhesive layer AL3 in Figure 12A The diagram shows the panel protective layer PPL extending into the bending region BA, but in an alternative embodiment, the panel protective layer PPL and the third adhesive layer AL3 can be shortened so as not to extend into the bending region BA. The panel protective layer PPL and the third adhesive layer AL3 can be disposed under the electronic panel EP in the second region AA2. Data driver DDV (reference) Figure 6 It can be set in the second area AA2 of the electronic panel EP.

[0180] The electronic device ED may also include a bend protection layer BAP. The bend protection layer BAP may be disposed in the bend region BA, the portion of the first region AA1 adjacent to the bend region BA, and the portion of the second region AA2 adjacent to the bend region BA. The bend protection layer BAP may extend from the portion of the first region AA1 adjacent to the bend region BA to the portion of the second region AA2 adjacent to the bend region BA without being interrupted. In an embodiment, the bend protection layer BAP is spaced apart from the first adhesive layer AL1. For example, gaps may exist in the portion of the bend region BA adjacent to the edge of the bend protection layer BAP and the portion of the first region AA1 adjacent to the edge of the first adhesive layer AL1.

[0181] refer to Figure 12BThe bending protective layer BAP and the electronic panel EP, located in the bending region BA, can be bent to have a predetermined curvature. When the bending protective layer BAP and the electronic panel EP in the bending region BA are bent, the electronic panel EP located in the second region AA2 can be positioned below the electronic panel EP located in the first region AA1. Therefore, the data driver DDV (reference) Figure 6 It can be set under the second area AA2.

[0182] In one embodiment, the electronic device ED disposed in the second region AA2 further includes an insulating strip ITP disposed below the second region AA2 to cover the data driver DDV. The insulating strip ITP may be disposed below a portion of the bending protective layer BAP in the second region AA2. For example, the insulating strip ITP may extend from a portion of the electronic panel EP to a portion of the bending protective layer BAP to cover the data driver DDV.

[0183] Figure 13 yes Figure 11 The perspective view of the support plate PLT shown.

[0184] refer to Figure 13 The support plate PLT may include a first non-folded portion NFA1, a folded portion FA, and a second non-folded portion NFA2 arranged in a first direction DR1. Openings (POPs) defined through the folded portion FA may be arranged in a grid pattern. For example, the openings (POPs) in the folded portion FA may be organized in a structured grid pattern rather than randomly placed.

[0185] refer to Figure 5 and Figure 13 The first hole H1 and the second hole H2 can be defined to pass through the first support plate PLT1 in the first non-folded portion NFA1. The first hole H1 and the second hole H2 can be adjacent to the edge of the first support plate PLT1 in the first non-folded portion NFA1. The first hole H1 can correspond to... Figure 5 The first hole H1 is shown, and the camera CM can be set in the first hole H1. The second hole H2 can correspond to... Figure 5 The second hole H2 is shown, and the sensor SN can be set in the second hole H2.

[0186] Figure 14 yes Figure 13 The enlarged plan view of region AA shown.

[0187] refer to Figure 13 and Figure 14The support plate PLT may include a first support plate PLT1, a support folding portion PLT_F, and a second support plate PLT2 arranged in the first direction DR1. The support folding portion PLT_F may include a first reverse curvature portion ICV1, a first extension portion EX1, a bending portion CSP, a second extension portion EX2, and a second reverse curvature portion ICV2 arranged in the first direction DR1.

[0188] A grid pattern can be defined within the curved portion CSP. As an example, the open POPs defined by the curved portion CSP can be arranged according to predetermined rules. The open POPs can be arranged in a grid shape to form the grid pattern of the curved portion CSP.

[0189] In an embodiment, the opening POP extends longer in the second direction DR2 than in the first direction DR1. The opening POP may include a plurality of first sub-openings SOP1 arranged in the second direction DR2 and a plurality of second sub-openings SOP2 adjacent to the first sub-openings SOP1 in the first direction DR1 and arranged in the second direction DR2. The first sub-openings SOP1 may be arranged in an interleaved manner relative to the second sub-openings SOP2. For example, a portion of the support plate PLT may exist in the second direction between a pair of first sub-openings SOP1, such that one of the second sub-openings SOP2 overlaps with and is spaced apart from the pair of first sub-openings SOP1 in the first direction DR1.

[0190] Figure 15 yes Figure 11 The diagram shows the display device DD in a folded state.

[0191] As an example, the display module DM is in Figure 15 The middle section is shown as a single layer. Additionally, for clarity, the display module DM and support plate PLT are shown together, and other components are omitted.

[0192] As an example, the boundaries between the first support plate PLT1 and the second support plate PLT2, the curved portion CSP, the first extension portion EX1 and the second extension portion EX2, and the first reverse curvature portion ICV1 and the second reverse curvature portion ICV2 are as follows: Figure 15 The image shown is depicted with dashed lines.

[0193] refer to Figure 11 and Figure 15 The support plate PLT can be folded relative to the folding axis FX. The support plate PLT can be folded into a dumbbell shape. When the support plate PLT is folded, the display module DM can be folded together with the support plate PLT.

[0194] The supporting folding portion PLT_F can be folded relative to the folding axis FX, and therefore, the supporting plate PLT can be folded. When the supporting folding portion PLT_F is folded, the curved portion CSP can be bent to have a predetermined curvature. As an example, the folding portion FA of the display module DM on the curved portion CSP can be bent to have a radius of curvature R.

[0195] The first reverse curvature portion ICV1 can be curved in the opposite direction to the curve of the curved portion CSP. The second reverse curvature portion ICV2 can be curved in the opposite direction to the curve of the curved portion CSP. The second reverse curvature portion ICV2 can have a shape symmetrical to the first reverse curvature portion ICV1.

[0196] When the supporting folding portion PLT_F is folded, the first support plate PLT1 and the second support plate PLT2 can be kept in a flat state. Therefore, the first non-folding portion NFA1 and the second non-folding portion NFA2 can be kept in a flat state by the first support plate PLT1 and the second support plate PLT2.

[0197] When the supporting folding portion PLT_F is folded, the distance GP between the first supporting plate PLT1 and the second supporting plate PLT2 in the first direction DR1 can be less than the diameter of a circle with a radius of curvature R. Therefore, the supporting plate PLT can be folded into a dumbbell shape.

[0198] The first extension EX1 can remain flat between the curved portion CSP and the first reverse curvature portion ICV1. The first extension EX1 can extend from the first reverse curvature portion ICV1 to the curved portion CSP, and can be flat.

[0199] The second extension EX2 can remain flat between the curved portion CSP and the second reverse curvature portion ICV2. The second extension EX2 can extend from the second reverse curvature portion ICV2 to the curved portion CSP, and can be flat.

[0200] Figure 16 yes Figure 11 The diagram shows the electronic panel EP and the protective layer disposed on the electronic panel EP.

[0201] refer to Figure 16The electronic panel EP may include a folded portion FA and non-folded portions NFA1 and NFA2 arranged in a direction parallel to a first direction DR1. In an embodiment, the folded portion FA includes a first side S1 and a second side S2 opposite to the first side S1 in a second direction DR2 intersecting the first direction DR1. The first side S1 may extend in the first direction DR1 and may be one of the two sides S1 and S2 of the folded portion FA of the electronic panel EP. The second side S2 may extend in the first direction DR1 and may be the other side of the two sides S1 and S2 of the folded portion FA of the electronic panel EP.

[0202] Display device DD (reference) Figure 5 The device may include multiple protective layers EPL1 and EPL2 disposed on the electronic panel EP, and the protective layers EPL1 and EPL2 may extend in a first direction DR1 to overlap with the opposite edges of the first adhesive layer AL1 in a second direction DR2. The protective layers EPL1 and EPL2 may include a first protective layer EPL1 and a second protective layer EPL2.

[0203] A first protective layer EPL1 may be disposed on the electronic panel EP. The first protective layer EPL1 may extend in a first direction DR1. The first protective layer EPL1 may be disposed in the folded portion FA of the electronic panel EP. The first protective layer EPL1 may be adjacent to a first side S1. The first protective layer EPL1 may enhance the rigidity of the side surface of the electronic panel EP extending in the first direction DR1. The first protective layer EPL1 may overlap with the folded portion FA to protect the side surface of the electronic panel EP, and may be further disposed in a first non-folded portion NFA1 and a second non-folded portion NFA2 adjacent to the folded portion FA. That is, the first protective layer EPL1 may extend into the portion of the first non-folded portion NFA1 adjacent to the folded portion FA and into the portion of the second non-folded portion NFA2 adjacent to the folded portion FA.

[0204] When viewed in a plane, the outward-facing edge of the first protective layer EPL1 can be spaced apart from the first side S1. The first protective layer EPL1 can be spaced apart from the first side S1 by a predetermined distance in the second direction DR2. As an example, when viewed in a plane, the outward-facing edge of the first protective layer EPL1 can overlap with one side surface of the first adhesive layer AL1.

[0205] When viewed in a plane, the first protective layer EPL1 may have a rectangular shape having a long side extending in the first direction DR1 and a short side extending in the second direction DR2.

[0206] In the following text, the term “width” may refer to the length measured in the second direction DR2.

[0207] The first protective layer EPL1 may have a first width W11 in the second direction DR2. The folded portion FA may have a second width W2 in the second direction DR2. The first width W11 may be smaller than the second width W2.

[0208] When the first width W11 is less than the second width W2, the first protective layer EPL1 should not affect the folding operation of the electronic panel EP when it is folded in the folding portion FA. For example, the first width W11 can be in the range of approximately 10% to approximately 15% of the second width W2.

[0209] A second protective layer EPL2 can be disposed on the electronic panel EP. The second protective layer EPL2 can be spaced apart from the first protective layer EPL1 in the second direction DR2, and the second protective layer EPL2 can extend in the first direction DR1. The second protective layer EPL2 can be disposed in the folded portion FA of the electronic panel EP. The second protective layer EPL2 can be positioned adjacent to the second side S2. The second protective layer EPL2 can enhance the rigidity of the side surface of the electronic panel EP extending in the first direction DR1. The second protective layer EPL2 can overlap with the folded portion FA to protect the side surface of the electronic panel EP, and can be further disposed in the first non-folded portion NFA1 and the second non-folded portion NFA2 adjacent to the folded portion FA. That is, the second protective layer EPL2 can extend into the portion of the first non-folded portion NFA1 adjacent to the folded portion FA and the portion of the second non-folded portion NFA2 adjacent to the folded portion FA.

[0210] When viewed in a plane, the outward-facing edge of the second protective layer EPL2 can be spaced apart from the second side S2. The second protective layer EPL2 can be spaced apart from the second side S2 by a predetermined distance in the second direction DR2. As an example, when viewed in a plane, the outward-facing edge of the second protective layer EPL2 can overlap with one side surface of the first adhesive layer AL1.

[0211] When viewed in a plane, the second protective layer EPL2 may have a rectangular shape having a long side extending in the first direction DR1 and a short side extending in the second direction DR2.

[0212] The side surfaces of the first adhesive layer AL1 that overlap with the first protective layer EPL1 and the side surfaces of the first adhesive layer AL1 that overlap with the second protective layer EPL2 may be opposite to each other in the second direction DR2. The end of the second protective layer EPL2 may overlap with the end of the first adhesive layer AL1 that is recessed from the second side S2 in the direction opposite to the second direction DR2. A portion of the edge of the second protective layer EPL2 may be parallel to the side surface of the first adhesive layer AL1 in the folded portion FA.

[0213] The second protective layer EPL2 may have a first-second width W12 in the second direction DR2. The first-second width W12 may be smaller than the second width W2. When the first-second width W12 is smaller than the second width W2, the second protective layer EPL2 should not affect the folding operation of the electronic panel EP when it is folded in the folding portion FA. As an example, the first-second width W12 may be in the range of approximately 10% to approximately 15% of the second width W2.

[0214] When the electronic panel EP is repeatedly folded and unfolded, cracks may appear due to the concentration of stress applied to the opposite sides S1 and S2 of the folded portion FA in the second direction DR2. Cracks may appear on both sides S1 and S2 of the folded portion FA, as well as in the portions of the folded portion FA adjacent to both sides S1 and S2, due to stress.

[0215] When the first protective layer EPL1 and the second protective layer EPL2 are disposed on the electronic panel EP to contact the electronic panel EP in the folded portion FA, the thickness of the portions adjacent to the sides S1 and S2 of the folded portion FA of the electronic panel EP in the third direction DR3 can be increased. When the thickness of the portions adjacent to the sides S1 and S2 of the folded portion FA of the electronic panel EP is increased, the rigidity of the sides S1 and S2 of the folded portion FA can be enhanced. Therefore, cracks caused by stress applied to the sides S1 and S2 of the folded portion FA can be prevented.

[0216] Figure 17 It is along Figure 16 The cross-sectional view taken by line III-III' shown.

[0217] For ease of explanation, components located beneath the electronic panel EP are omitted. Among the components of the electronic panel EP, the first adhesive layer AL1, window WIN, window protective layer WP, and printed layer PIT are shown, while other components are omitted. Furthermore, for simplicity, the window protective layer WP and window WIN are depicted as a single layer in the accompanying drawings.

[0218] refer to Figure 17The first adhesive layer AL1 can be disposed on the electronic panel EP, and the window WIN and the window protective layer WP can be disposed on the first adhesive layer AL1. The first adhesive layer AL1 can be disposed between the electronic panel EP and the window WIN.

[0219] The first protective layer EPL1 and the second protective layer EPL2 can be disposed on the electronic panel EP. The first protective layer EPL1 and the second protective layer EPL2 can be in direct contact with the upper surface of the electronic panel EP. The first protective layer EPL1 and the second protective layer EPL2 can be disposed on the electronic panel EP, and the first adhesive layer AL1 can be disposed on the first protective layer EPL1, the second protective layer EPL2, and the electronic panel EP.

[0220] The first protective layer EPL1 and the second protective layer EPL2 can be disposed between the first adhesive layer AL1 and the electronic panel EP. When the first adhesive layer AL1 is disposed on the electronic panel EP, the first protective layer EPL1 and the second protective layer EPL2 can be in direct contact with the first adhesive layer AL1 and can be covered by the first adhesive layer AL1.

[0221] When the first adhesive layer AL1 is directly applied to the first protective layer EPL1 and the second protective layer EPL2, the first protective layer EPL1 and the second protective layer EPL2 can be firmly attached to the electronic panel EP through the first adhesive layer AL1.

[0222] In the following text, the term "thickness" may refer to the length measured on a third-direction DR3.

[0223] Each of the first protective layer EPL1 and the second protective layer EPL2 may have a first thickness D1 on the third-direction DR3. The first adhesive layer AL1 may have a second thickness D2 on the third-direction DR3. In an embodiment, the first thickness D1 is less than the second thickness D2. As an example, the first thickness D1 may be in the range of approximately 10% to approximately 15% of the second thickness D2.

[0224] Figure 17 Protective layers EPL1 and EPL2, facing each other on the second direction DR2, are shown; however, each of protective layers EPL1 and EPL2 may be provided as multiple layers on the third direction DR3. That is, each of protective layers EPL1 and EPL2 may have a single-layer or multi-layer structure. Protective layers EPL1 and EPL2 may comprise various materials (such as metals, acrylic resins, epoxy resins, or silicones). The printed layer PIT may have a third width W3 on the second direction DR2. In an embodiment, the first-first width W11 and the first-second width W12 are smaller than the third width W3. The printed layer PIT may prevent the user from observing portions of the protective layers EPL1 or EPL2.

[0225] A first protective layer EPL1 and a second protective layer EPL2 can be formed on the electronic panel EP. The first protective layer EPL1 and the second protective layer EPL2 can be formed simultaneously or substantially simultaneously using the same process. Then, a first adhesive layer AL1 can be formed on the electronic panel EP, the first protective layer EPL1, and the second protective layer EPL2. A window WIN and a window protective layer WP can be disposed on the first adhesive layer AL1.

[0226] Figures 18 to 22 This is a plan view of an electronic panel EP according to an embodiment of the present disclosure.

[0227] refer to Figure 16 and Figure 18 , ( Figure 16 The first protective layer EPL1 and the second protective layer EPL2 shown can be as follows: Figure 18 The protective layers shown are provided integrally. The protective layer EPLa, obtained by integrally connecting the first protective layer EPL1 and the second protective layer EPL2, can extend along the edge of the electronic panel EP to form a closed loop shape. The protective layer EPLa can be disposed in the folded portion FA, the first non-folded portion NFA1, and the second non-folded portion NFA2.

[0228] The protective layer EPLa can extend along the boundary of the first adhesive layer AL1 to form a closed-loop shape and can be disposed parallel to the edge of the electronic panel EP. Because the protective layer EPLa is disposed on the electronic panel EP along the edge of the electronic panel EP, the thickness of the portion of the electronic panel EP adjacent to the edge can be increased. When the protective layer EPLa is positioned in direct contact with the electronic panel EP, the rigidity of the edges of the electronic panel EP in the folded portion FA, the first non-folded portion NFA1, and the second non-folded portion NFA2 can be enhanced. Therefore, cracks caused by stress concentrated at the edge of the electronic panel EP can be prevented or reduced.

[0229] refer to Figure 19Multiple first protective layers EPL1b and multiple second protective layers EPL2b can be provided. The first protective layers EPL1b can be arranged in the second direction DR2, and the second protective layers EPL2b can also be arranged in the second direction DR2. The first protective layers EPL1b can be spaced apart from each other in the second direction DR2. The second protective layers EPL2b can be spaced apart from each other in the second direction DR2. The first protective layer EPL1b can extend in the first direction DR1 and can be adjacent to the first side S1. The second protective layer EPL2b can extend in the first direction DR1 and can be adjacent to the second side S2. The first protective layer EPL1b and the second protective layer EPL2b can be disposed in the folded portion FA and can extend in the first direction DR1 to be disposed in the first non-folded portion NFA1 and the second non-folded portion NFA2. When each of the first protective layers EPL1b and the second protective layer EPL2b is provided in multiples, the thickness of the two sides S1 and S2 of the folded portion FA and the thickness of the center of the folded portion FA can be increased. The rigidity of the two sides S1 and S2 of the folded portion FA and the center of the folded portion FA can be enhanced. Therefore, cracks caused by stresses concentrated on the two sides S1 and S2 of the folded portion FA and the center of the folded portion FA can be prevented or reduced.

[0230] refer to Figure 16 and Figure 20 First protective layer EPL1 (reference) Figure 16 ) and second protective layer EPL2 (reference) Figure 16 They can be provided as a single unit. This is achieved by using the first protective layer EPL1 (reference...). Figure 16 ) and second protective layer EPL2 (reference) Figure 16The protective layer EPLc, integrally connected and provided as a single integral form, may extend along the edge of the folded portion FA. The protective layer EPLc may include portions extending in the folded portion FA in a first direction DR1 and portions extending in the folded portion FA in a second direction DR2. The protective layer EPLc may further extend to a first non-folded portion NFA1 and a second non-folded portion NFA2 adjacent to the folded portion FA. The portions of the protective layer EPLc extending in the first direction DR1 may be respectively disposed in the first non-folded portion NFA1 and the second non-folded portion NFA2. In an embodiment, the protective layer EPLc has a shape including a first rectangular portion adjacent to a first edge of the first adhesive layer AL1, a second rectangular portion adjacent to a second edge of the first adhesive layer AL1 opposite to the first edge, a third rectangular portion connected to the first and second rectangular portions, and a fourth rectangular portion connected to the first and second rectangular portions and spaced apart from the third rectangular portion. This shape may have a hollow interior or an opening, which may also be rectangular. All of the above portions may overlap with the folded portion FA, but the first and second rectangular portions may slightly overlap with the non-folded portions NFA1 and NFA2. Because of the protective layer EPLc, the thickness of the folded portion FA can be increased. Therefore, the rigidity of the folded portion FA can be enhanced. Consequently, cracks caused by stress concentrated at the folded portion FA can be prevented or reduced.

[0231] refer to Figure 21 The first protective layer EPL1d and the second protective layer EPL2d can be provided in the form of dots (or circles or ellipses) and can be arranged on the electronic panel EP. Each of the first protective layer EPL1d and the second protective layer EPL2d can be arranged in a first direction DR1. Since the first protective layer EPL1d and the second protective layer EPL2d are arranged in the form of dots, the repulsive force of the first protective layer EPL1d and the second protective layer EPL2d on the electronic panel EP when folded can be reduced. The first protective layer EPL1d and the second protective layer EPL2d should not affect the folding operation of the electronic panel EP, and the thickness of the portion of the electronic panel EP corresponding to the first protective layer EPL1d and the second protective layer EPL2d can be increased. Therefore, cracks caused by stress concentrated at the folding portion FA can be prevented or reduced. For example, the dot-patterned protective layers can make the electronic panel EP bend more smoothly with less resistance, thereby preventing excessive stress accumulation and reducing the risk of damage during repeated folding and unfolding. Figure 21 As shown, the points can be spaced apart from each other in a column, or slightly offset from each other.

[0232] refer to Figure 22When viewed in a plane, the outward-facing edge of the first protective layer EPL1e can extend to the first side S1 to overlap with it. Similarly, when viewed in a plane, the outward-facing edge of the second protective layer EPL2e can extend to the second side S2 to overlap with it. For example, protective layers EPL1e and EPL2e can extend beyond the edge of the first adhesive layer AL1. Figure 16 Compared to the first protective layer EPL1 and the second protective layer EPL2 shown, the first protective layer EPL1e and the second protective layer EPL2e extend further in the second direction DR2 and in the direction opposite to the second direction DR2, and can be adjacent to the two sides S1 and S2 of the folded portion FA of the electronic panel EP. When the first protective layer EPL1e and the second protective layer EPL2e extend in the second direction DR2 and in the direction opposite to the second direction DR2, the area on the electronic panel EP where the first protective layer EPL1e and the second protective layer EPL2e are provided can be increased.

[0233] When the thickness of the portions adjacent to the two sides S1 and S2 of the folded portion of the electronic panel EP is increased, the rigidity of the two sides S1 and S2 of the folded portion FA can be enhanced. Therefore, cracks caused by stress concentrated on the two sides S1 and S2 of the folded portion FA can be prevented or reduced.

[0234] Figure 23 This is a diagram illustrating an electronic device according to an embodiment of the present invention. (Reference) Figure 23 According to an embodiment of the present invention, the electronic device 1000 can be connected to a display module 1140 (for example, the display module 1140 can be connected to...). Figures 1 to 4 The display device shown outputs various information (e.g., images, text, music, etc.). When the processor 1110 executes an application stored in the memory 1120, the display module 1140 can provide application information to the user through the display panel 1141.

[0235] In some embodiments, the electronic device 1000 may be configured as a smartphone, camera, smart TV, monitor, smartwatch, tablet computer, automotive display, or augmented reality / virtual reality (AR / VR) headset. For example, the electronic device 1000 may be a smartphone that includes a touch-sensitive display area DA for interaction (e.g., Figure 1 The display area DA) and the non-display area NDA, which includes sensors and circuitry for enhanced functionality, are also included. Figure 1The electronic device 1000 may include a large display area DA for high-resolution video playback and a non-display area NDA integrating drive circuitry or connection modules for external input. For example, the electronic device 1000 may be a smartwatch, including a display area DA optimized for compact and high-definition vision and a non-display area NDA integrating biometric sensors for health monitoring. In some cases, the electronic device 1000 may be an AR / VR headset.

[0236] In some embodiments, memory 1120 may store information such as software code for operating application 1123. Application 1123 may include software designed to perform specific tasks or provide functionality to a user. Application 1123 may operate under the control of processor 1110 and utilize data stored in memory 1120 to deliver a wide variety of features (such as productivity tools, multimedia streaming and playback, file or mail delivery, or communication services). Application 1123 interacts seamlessly with user interface 1161 or touch screen 1142 to allow users to launch, navigate, and utilize the program via user input such as touch, tap, gestures, or voice interaction.

[0237] When a user selects an application via touchscreen 1142 or user interface 1161, processor 1110 can execute application program 1123 corresponding to the selected application retrieved from memory 1120 to perform the application's functions. For example, when a user selects a camera application by tapping an icon (or camera application icon) displayed on display panel 1141, processor 1110 activates the camera module or camera device. Processor 1110 can then send image data corresponding to a captured image obtained by the camera module to display module 1140. Display module 1140 can then display the image corresponding to the captured image via display panel 1141.

[0238] For example, the camera device may be configured to capture an image of an alignment inspection area of ​​an electronic device, wherein the alignment inspection area includes alignment bumps (e.g., ABP), alignment pads (e.g., APD) engaged with the alignment bumps, and alignment polymer patterns (e.g., APP) spaced apart from the alignment pads; and the processor 1110 may be configured to: process the captured image to detect the center positions of the alignment bumps, alignment pads, and alignment polymer patterns; compare the detected center positions of the alignment bumps and alignment pads with the center position of the alignment polymer patterns; and determine the presence or absence of misalignment based on the comparison result.

[0239] As another example, when a user wishes to make a phone call, the user taps a phone icon displayed in display module 1140, and processor 1110 can execute a phone application stored in memory 1120. A phone keypad can be displayed on display panel 1141 for the user to enter the phone number to call.

[0240] The memory 1120 may store instructions that, when executed by the processor 1110, cause it to perform the aforementioned processing, comparison, and misalignment determination steps.

[0241] As another example, the display module 1140 can be integrated into an electronic device 1000 such as a laptop computer, smart TV, or tablet computer. Users wishing to access multimedia streaming applications (e.g., watching music videos or movies) can do so by tapping the corresponding icon. This action activates the application, allowing the user to watch the streaming content.

[0242] Processor 1110 may include a main processor 1111 and an auxiliary processor or coprocessor 1112. Main processor 1111 may include a central processing unit (CPU). Main processor 1111 may also include one or more of a graphics processing unit (GPU), a communication processor (CP), and an image signal processor (ISP).

[0243] The coprocessor 1112 may include a controller 1112-1. The controller 1112-1 may include interface conversion circuitry and timing control circuitry. The controller 1112-1 can receive image signals from the main processor 1111, convert the data format of the image signals to match the interface specifications of the display module 1140, and output the image data. The controller 1112-1 can output various control signals to drive the display module 1140. For example, the controller 1112-1 can drive the display module 1140 to display icons on a display screen suitable for user selection, thereby enabling the execution of application program 1123.

[0244] Memory 1120 may store one or more applications 1123 and various data used by at least one component of electronic device 1000 (e.g., processor 1110 or user interface 1161), as well as input or output data for associated commands. For example, camera applications, GPS applications, augmented reality and virtual reality applications, and other applications may be executed by processor 1110 when a user selects a corresponding icon presented on a display screen (or display panel 1141) via touch screen 1142 or user interface 1161. Additionally, various setting data corresponding to user settings may be stored in memory 1120. Memory 1120 may include volatile memory 1121 and non-volatile memory 1122.

[0245] The processor 1110 can provide an output signal to the user interface 1161 based on the determination of misalignment, wherein the output signal can be used to alert the operator or activate further inspection or correction processing.

[0246] Display module 1140 can output visual information (images) to a user. Display module 1140 may include a display panel 1141, a gate driver, a source driver, a voltage generation circuit, and a touch screen 1142. Display module 1140 may also include a window, a chassis, and a bracket to protect the display panel 1141. Display module 1140 may include... Figures 1 to 4 At least a portion of the configuration of the display device shown.

[0247] User interface 1161 serves as an interaction medium between the user and electronic device 1000. User interface 1161 can detect input from a part of the user's body (e.g., a finger) or from a pen or mouse, and generate electrical signals or data values ​​corresponding to the input. User interface 1161 includes a fingerprint sensor 1162, an input sensor 1163, and a digitizer 1164.

[0248] The fingerprint sensor 1162 can sense a fingerprint used for biometric identification of a user, and can also measure one or more biometric signals (such as blood pressure, water content, or weight).

[0249] Input sensor 1163 can sense user interactions, including touch, tap, gestures, motion, verbal commands, and eye movements. Input sensor 1163 includes optical sensors for image capture, eye tracking, or motion and gesture detection. The optical sensors can be infrared or semiconductor photodetectors. Input sensor 1163 includes audio and acoustic sensors, which can be microelectromechanical systems (MEMS) microphones for speech recognition or voice-based interaction. The audio and acoustic sensors can be mounted as part of user interface 1161 or embedded in display panel 1141.

[0250] The digitizer 1164 can generate data values ​​corresponding to coordinate information input via a pen or mouse to control cursor movement on the screen. The digitizer 1164 can also generate electromagnetic changes caused by input as data values. The digitizer can detect input from a passive pen or send and receive data using an active pen or remote control.

[0251] At least one of the fingerprint sensor 1162, the input sensor 1163, and the digitizer 1164 can be implemented as a sensor layer formed on the top layer of the display panel 1141 by a process that is continuous with the process of forming elements (e.g., light-emitting elements and transistors) included in the display panel 1141.

[0252] Additionally, the user interface 1161 may also include, for example, a gesture sensor, a gyroscope sensor for sensing rotational motion, an accelerometer for tracking translational motion, a grip sensor, a pressure sensor, a proximity sensor, a color sensor, an infrared (IR) emitter and camera sensor for tracking gaze direction and eye movement, a temperature sensor, or a light sensor. For example, the gyroscope sensor, accelerometer, and infrared emitter and camera may be particularly suitable for AR / VR headset functionality.

[0253] The touch screen 1142 includes a touch sensor embedded in a semiconductor layer of the display panel 1141 to sense pressure applied to the top layer (screen) of the display panel 1141. The touch sensor can be capacitive or resistive. The touch screen 1142 can serve as a primary interface for users to select and browse applications, control the electronic device 1000, and interact with the electronic device 1000.

[0254] The display panel 1141 (or display) may include a liquid crystal display panel, an organic light-emitting display panel, or an inorganic light-emitting display panel, and the type of display panel 1141 is not particularly limited. The display panel 1141 may be rigid or flexible, capable of being rolled or folded. The display module 1140 may also include supports, brackets, and heat dissipation components for supporting the display panel 1141. The display panel 1141 may include... Figures 1 to 4 The display unit shown is shown in the figure.

[0255] Power module 1150 can supply power to the components of electronic device 1000. Power module 1150 may include a battery that is charged by a power supply voltage. The battery may include a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. Power module 1150 may include a power management integrated circuit (PMIC). The PMIC can supply optimized power to each of the aforementioned components, including display module 1140.

[0256] Although various embodiments of this disclosure have been described, it should be understood that this disclosure is not limited to these embodiments because various changes and modifications can be made by those skilled in the art within the spirit and scope of this disclosure as claimed in the appended claims. Therefore, the subject matter disclosed should not be limited to any single embodiment described herein.

Claims

1. A display device, wherein, The display device includes: An electronic panel includes a folded portion and a non-folded portion arranged in a first direction, the folded portion including a first side and a second side opposite to the first side in a second direction intersecting the first direction; The window is located on the electronic panel; An adhesive layer is disposed between the electronic panel and the window; and A first protective layer is disposed between the adhesive layer and the electronic panel, wherein the first protective layer is adjacent to the first side of the folded portion.

2. The display device according to claim 1, wherein, The display device further includes a second protective layer, which is spaced apart from the first protective layer in the second direction, and is configured to be adjacent to the second side between the adhesive layer and the electronic panel.

3. The display device according to claim 2, wherein, The first protective layer and the second protective layer extend in the first direction.

4. The display device according to claim 2, wherein, When viewed in a plane, the outward-facing edge of the first protective layer is spaced apart from the first side, and the outward-facing edge of the second protective layer is spaced apart from the second side.

5. The display device according to claim 4, wherein, When viewed in the plane, the outward-facing edges of the first protective layer and the outward-facing edges of the second protective layer overlap with the two side surfaces of the adhesive layer that are opposite to each other in the second direction.

6. The display device according to claim 2, wherein, The first protective layer and the second protective layer extend to the non-folded portion adjacent to the folded portion.

7. The display device according to claim 2, wherein, The width of the first protective layer in the second direction and the width of the second protective layer in the second direction are each within 10% to 15% of the width of the electronic panel in the second direction.

8. The display device according to claim 2, wherein, In a third direction perpendicular to the plane defined by the first and second directions, each of the first and second protective layers has a first thickness smaller than the second thickness of the adhesive layer.

9. The display device according to claim 8, wherein, The first thickness is in the range of 10% to 15% of the second thickness.

10. The display device according to claim 2, wherein, The first protective layer and the second protective layer are in direct contact with and covered by the adhesive layer.

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